APT30M30B2LL APT30M30LLL 300V 100A 0.030Ω POWER MOS 7 R MOSFET B2LL T-MAX™ ® Power MOS 7 is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS. Both conduction and switching ® losses are addressed with Power MOS 7 by significantly lowering RDS(ON) ® and Qg. Power MOS 7 combines lower conduction and switching losses along with exceptionally fast switching speeds inherent with APT's patented metal gate structure. • Lower Input Capacitance • Lower Miller Capacitance • Lower Gate Charge, Qg VDSS LLL D • Increased Power Dissipation • Easier To Drive • Popular T-MAX™ or TO-264 Package MAXIMUM RATINGS Symbol TO-264 G S All Ratings: TC = 25°C unless otherwise specified. Parameter APT30M30B2LL_LLL UNIT 300 Volts Drain-Source Voltage ID Continuous Drain Current IDM Pulsed Drain Current VGS Gate-Source Voltage Continuous ±30 VGSM Gate-Source Voltage Transient ±40 Total Power Dissipation @ TC = 25°C 694 Watts Linear Derating Factor 5.56 W/°C PD TJ,TSTG 5 1 Operating and Storage Junction Temperature Range Lead Temperature: 0.063" from Case for 10 Sec. IAR Avalanche Current EAR Repetitive Avalanche Energy 1 Amps 400 TL EAS 100 @ TC = 25°C -55 to 150 °C 300 Amps 100 (Repetitive and Non-Repetitive) 1 Single Pulse Avalanche Energy Volts 50 4 mJ 3000 STATIC ELECTRICAL CHARACTERISTICS MIN BVDSS Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA) 300 RDS(on) Drain-Source On-State Resistance IDSS IGSS VGS(th) 2 (VGS = 10V, ID = 50A) TYP MAX Volts 0.030 Zero Gate Voltage Drain Current (VDS = 300V, VGS = 0V) 100 Zero Gate Voltage Drain Current (VDS = 240V, VGS = 0V, TC = 125°C) 500 Gate-Source Leakage Current (VGS = ±30V, VDS = 0V) Gate Threshold Voltage (VDS = VGS, ID = 2.5mA) 3 Ohms µA ±100 nA 5 Volts CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. APT Website - http://www.advancedpower.com UNIT 7-2004 Characteristic / Test Conditions 050-7153 Rev B Symbol DYNAMIC CHARACTERISTICS APT30M30B2LL_LLL Test Conditions Characteristic Symbol MIN TYP Ciss Input Capacitance Coss Output Capacitance VDS = 25V 1895 Crss Reverse Transfer Capacitance f = 1 MHz 110 VGS = 10V 140 VDD = 150V 41 Qg Total Gate Charge Qgs Gate-Source Charge Qgd Gate-Drain ("Miller") Charge td(on) Turn-on Delay Time tr ID = 100A @ 25°C td(off) tf 22 VDD = 150V RG = 0.6Ω Eon Turn-on Switching Energy Eoff Turn-off Switching Energy 7 Eon Turn-on Switching Energy Eoff Turn-off Switching Energy 7 ns 35 ID = 100A @ 25°C Fall Time nC 15 VGS = 15V Turn-off Delay Time pF 70 RESISTIVE SWITCHING Rise Time UNIT 7030 VGS = 0V 3 MAX 8 INDUCTIVE SWITCHING @ 25°C 925 VDD = 200V, VGS = 15V ID = 100A, RG = 5Ω 1345 INDUCTIVE SWITCHING @ 125°C 1055 VDD = 200V, VGS = 15V ID = 100A, RG = 5Ω µJ 1485 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS Symbol MIN Characteristic / Test Conditions TYP MAX 100 UNIT IS Continuous Source Current (Body Diode) ISM Pulsed Source Current 1 VSD Diode Forward Voltage 2 t rr Reverse Recovery Time (IS = -ID100A, dl S /dt = 100A/µs) 450 ns Q rr Reverse Recovery Charge (IS = -ID100A, dl S/dt = 100A/µs) 10.0 µC dv/ Peak Diode Recovery dt dv/ 400 (Body Diode) 1.3 (VGS = 0V, IS = -ID100A) dt 6 Amps Volts 5 V/ns MAX UNIT THERMAL CHARACTERISTICS Symbol Characteristic MIN RθJC Junction to Case RθJA Junction to Ambient TYP 0.18 40 1 Repetitive Rating: Pulse width limited by maximum junction temperature 2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2% 3 See MIL-STD-750 Method 3471 4 Starting Tj = +25°C, L = 0.60mH, RG = 25Ω, Peak IL = 100A 5 The maximum current is limited by lead temperature 6 dv/dt numbers reflect the limitations of the test circuit rather than the device itself. IS ≤ -ID100A di/dt ≤ 700A/µs VR ≤ 300V TJ ≤ 150°C 7 Eon includes diode reverse recovery. See figures 18, 20. APT Reserves the right to change, without notice, the specifications and inforation contained herein. 0.18 0.9 0.14 0.7 0.12 0.10 0.5 Note: 0.08 PDM Z JC, THERMAL IMPEDANCE (°C/W) θ 050-7153 Rev B 7-2004 0.20 0.16 0.3 0.06 t2 0.1 0.02 0 Peak TJ = PDM x ZθJC + TC 0.05 10-5 t1 Duty Factor D = t1/t2 0.04 SINGLE PULSE 10-4 °C/W 10-3 10-2 10-1 RECTANGULAR PULSE DURATION (SECONDS) FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION 1.0 Typical Performance Curves APT30M30B2LL_LLL 250 VGS =15 &10V 0.0271 Power (Watts) 0.0656 0.0859 0.00899F 0.0202F 0.293F ID, DRAIN CURRENT (AMPERES) RC MODEL Junction temp. ( ”C) 8V 200 7.5V 150 7V 100 6.5 6V 50 5.5V Case temperature 0 VDS> ID (ON) x RDS(ON) MAX. 250 µSEC. PULSE TEST @ <0.5 % DUTY CYCLE 150 100 TJ = +25°C 50 TJ = +125°C 0 TJ = -55°C 0 2 4 6 8 10 VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) FIGURE 4, TRANSFER CHARACTERISTICS BVDSS, DRAIN-TO-SOURCE BREAKDOWN VOLTAGE (NORMALIZED) ID, DRAIN CURRENT (AMPERES) 100 80 60 40 20 0 25 1.10 VGS=10V 1.00 VGS=20V 0.90 0.80 0 20 40 60 80 100 120 140 160 180 ID, DRAIN CURRENT (AMPERES) FIGURE 5, RDS(ON) vs DRAIN CURRENT 1.10 1.05 1.00 0.95 0.90 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE 2.5 1.2 I V D = 50A GS = 10V 2.0 1.5 1.0 0.5 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) FIGURE 8, RDS(ON) vs. TEMPERATURE VGS(TH), THRESHOLD VOLTAGE (NORMALIZED) RDS(ON), DRAIN-TO-SOURCE ON RESISTANCE (NORMALIZED) 50 75 100 125 150 TC, CASE TEMPERATURE (°C) FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE D 1.20 1.15 120 0.0 -50 1.30 NORMALIZED TO = 10V @ I = 50A GS 1.1 1.0 0.9 0.8 0.7 0.6 -50 -25 0 25 50 75 100 125 150 TC, CASE TEMPERATURE (°C) FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE 7-2004 200 V 050-7153 Rev B ID, DRAIN CURRENT (AMPERES) 250 RDS(ON), DRAIN-TO-SOURCE ON RESISTANCE FIGURE 2, TRANSIENT THERMAL IMPEDANCE MODEL 0 5 10 15 20 25 30 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) FIGURE 3, LOW VOLTAGE OUTPUT CHARACTERISTICS 1.40 10,000 100 100µS 10 1mS D = 100A VDS=60V 12 VDS=150V VDS=240V 8 4 0 50 100 150 200 250 Qg, TOTAL GATE CHARGE (nC) FIGURE 12, GATE CHARGE vs GATE-TO-SOURCE VOLTAGE 0 0 10 20 30 40 50 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) FIGURE 11, CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE 300 100 TJ =+150°C TJ =+25°C 10 1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS) FIGURE 13, SOURCE-DRAIN DIODE FORWARD VOLTAGE 200 120 V 180 td(off) 100 80 V DD R G G = 300V T = 125°C J 60 L = 100µH 40 = 5Ω T = 125°C J L = 100µH 140 = 5Ω = 200V DD R 160 tr and tf (ns) td(on) and td(off) (ns) Crss 100 IDR, REVERSE DRAIN CURRENT (AMPERES) VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) I Coss 1,000 10 1 10 100 300 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) FIGURE 10, MAXIMUM SAFE OPERATING AREA 16 Ciss 10mS TC =+25°C TJ =+150°C SINGLE PULSE 1 APT30M30B2LL_LLL 20,000 OPERATION HERE LIMITED BY RDS (ON) C, CAPACITANCE (pF) ID, DRAIN CURRENT (AMPERES) 400 tf 120 100 80 tr 60 td(on) 40 20 20 0 40 60 0 40 80 100 120 140 160 ID (A) FIGURE 14, DELAY TIMES vs CURRENT 100 120 140 160 ID (A) FIGURE 15, RISE AND FALL TIMES vs CURRENT 5000 3500 V R G D T = 125°C SWITCHING ENERGY (µJ) 7-2004 050-7153 Rev B L = 100µH E ON includes diode reverse recovery. 2000 Eoff 1500 1000 Eon 500 0 40 60 DD I = 5Ω J 2500 V = 200V 80 100 120 140 160 ID (A) FIGURE 16, SWITCHING ENERGY vs CURRENT SWITCHING ENERGY (µJ) 3000 DD 60 80 = 200V = 100A T = 125°C 4000 J L = 100µH EON includes Eoff diode reverse recovery. 300 2000 Eon 1000 0 0 5 10 15 20 25 30 35 40 45 50 RG, GATE RESISTANCE (Ohms) FIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCE Typical Performance Curves APT30M30B2LL_LLL 90% Gate Voltage 10% Gate Voltage T 125°C J td(off) td(on) tr 5% Drain Voltage tf Drain Current 90% 5% 10% TJ125°C 90% 10% Drain Voltage Drain Current Switching Energy Switching Energy Figure 18, Turn-on Switching Waveforms and Definitions 0 Figure 19, Turn-off Switching Waveforms and Definitions APT60DS30 V DS ID V DD G D.U.T. Figure 20, Inductive Switching Test Circuit T-MAXTM (B2) Package Outline 4.69 (.185) 5.31 (.209) 1.49 (.059) 2.49 (.098) TO-264 (L) Package Outline 4.60 (.181) 5.21 (.205) 1.80 (.071) 2.01 (.079) 15.49 (.610) 16.26 (.640) 19.51 (.768) 20.50 (.807) 3.10 (.122) 3.48 (.137) 5.38 (.212) 6.20 (.244) 5.79 (.228) 6.20 (.244) Drain 0.40 (.016) 0.79 (.031) 2.21 (.087) 2.59 (.102) 19.81 (.780) 20.32 (.800) 2.87 (.113) 3.12 (.123) 2.29 (.090) 2.69 (.106) 1.65 (.065) 2.13 (.084) 1.01 (.040) 1.40 (.055) 19.81 (.780) 21.39 (.842) Gate Drain Source 0.48 (.019) 0.84 (.033) 2.59 (.102) 3.00 (.118) 5.45 (.215) BSC 2-Plcs. 5.45 (.215) BSC 2-Plcs. These dimensions are equal to the TO-247 without the mounting hole. Dimensions in Millimeters and (Inches) 0.76 (.030) 1.30 (.051) 2.79 (.110) 3.18 (.125) Dimensions in Millimeters and (Inches) APT’s products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. US and Foreign patents pending. All Rights Reserved. 2.29 (.090) 2.69 (.106) Gate Drain Source 7-2004 4.50 (.177) Max. 25.48 (1.003) 26.49 (1.043) 050-7153 Rev B Drain 20.80 (.819) 21.46 (.845)