MPS MP6212DN 3.3v/5v, single-channel 1a current-limited power distribution switch Datasheet

MP6211/MP6212
3.3V/5V, Single-Channel 1A
Current-Limited Power Distribution Switches
The Future of Analog IC Technology
DESCRIPTION
FEATURES
The
MP6211/MP6212
single-channel
Power
Distribution Switch features internal current limiting
to prevent damage to host devices due to faulty load
conditions. The MP6211/MP6212 Analog switch has
90mΩ on-resistance and operates from 2.7V to 5.5V
input. It is available with guaranteed current limits,
making it ideal for load switching applications. The
MP6211/MP6212 has built-in protection for both
over current and increased thermal stress. For over
current, the device will limit the current by changing
to a constant current mode.
•
•
•
•
•
•
•
•
•
•
•
•
•
As the temperature increases as a result of short
circuit, the device will shut off. The device will
recover once the device temperature reduces to
approx 120°C.
1A Continuous Current
Accurate Current Limit
2.7V to 5.5V Supply Range
90uA Quiescent Current
90mΩ MOSFET
Thermal-Shutdown Protection
Under-Voltage Lockout
8ms FLAG Deglitch Time
No FLAG Glitch During Power Up
Reverse Current Blocking
Active High & Active Low Options
MSOP8E and SOIC8E package
UL Recognized: E322138
APPLICATIONS
•
•
•
•
•
•
The MP6211/MP6212 is available in an 8-PIN
MSOP and SOIC package with exposed pad.
Smartphone and PDA
Portable GPS Device
Notebook PC
Set-top-box
Telecom and Network Systems
USB Power Distribution
“MPS” and “The Future of Analog IC Technology” are Trademarks of Monolithic
Power Systems, Inc.
TYPICAL APPLICATION
+5V
1 GND
MP6212
2, 3 IN
4
EN
OUT
6, 7
To VBUS
USB Ports
FLAG 5
SINGLE-CHANNEL
UL Recognized Component
MP6211_MP6212 Rev. 1.1
9/18/2009
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© 2009 MPS. All Rights Reserved.
1
MP6211/MP6212 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
ORDERING INFORMATION
Part Number*
MP6211DN
MP6211DH
MP6212DN
MP6212DH
Enable
Active
High
Active
High
Active
Low
Active
Low
Switch
Single
Maximum
Typical ShortContinuous Circuit Current
Load Current
@ TA=25C
1.0A
1.5A
Package
Top
Marking
Temperature
SOIC8E
6211D
Single
1.0A
1.5A
MSOP8E
Single
1.0A
1.5A
SOIC8E
–40°C to +85°C
6212D
Single
1.0A
1.5A
MSOP8E
* For Tape & Reel, add suffix –Z (eg. MP6211_MP6212DN–Z). For RoHS Compliant Packaging, add suffix –LF.
(eg. MP6211_MP6212DN–LF–Z)
PACKAGE REFERENCE
TOP VIEW
GND
1
8
NC
IN
2
7
OUT
IN
3
6
OUT
EN*
4
5
FLAG
EXPOSED PAD
ON BACKSIDE
MP6211_MP6212
Single-Channel
(* EN is active high for MP6211)
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance
IN .................................................-0.3V to +6.0V
EN, FLAG, OUT to GND ..............-0.3V to +6.0V
Continuous Power Dissipation. (TA = +25°C) (2)
SOIC8E...................................................... 2.5W
MSOP8E .................................................... 2.3W
Junction Temperature ...............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... –65°C to +150°C
Operating Temperature.............. –40°C to +85°C
SOIC8E .................................. 50 ...... 10... °C/W
MSOP8E................................. 55 ...... 12... °C/W
MP6211_MP6212 Rev. 1.1
9/18/2009
(3)
θJA
θJC
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-toambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) Measured on JESD51-7 4-layer PCB.
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2
MP6211/MP6212 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
ELECTRICAL CHARACTERISTICS (4)
VIN=5V, TA=+25°C, unless otherwise noted.
Parameter
Condition
IN Voltage Range
Supply Current
Shutdown Current
Off Switch Leakage
Min
Typ
Max
Units
5.5
120
V
μA
μA
μA
1.5
2.2
A
1.7
2.4
A
2.65
0.8
0.4
V
mV
mΩ
V
V
V
1
μA
0.5
0.5
3
°C
°C
ms
ms
ms
ms
ms
10
ms
15
ms
μA
μA
2.7
Single Channel
Device Disable, VOUT=float, VIN=5.5V
Device Disable, VIN=5.5V
Current Limit
90
1
1
1.1
Trip Current
Under-voltage Lockout
Under-voltage Hysteresis
FET On Resistance
EN Input Logic High Voltage
EN Input Logic Low Voltage
FLAG Output Logic Low Voltage
FLAG Output High Leakage
Current
Thermal Shutdown
Thermal Shutdown Hysteresis
Current Ramp (slew rate≤100A/s) on
Output
Rising Edge
ISINK=5mA
VIN=VFLAG=5.5V
Turn Off Time, Toff (8)
CL=100μF, RL=5.5Ω
FLAG Deglitch Time
ENx Input Leakage
Reverse Leakage Current
130
2
Turn On Time, Ton (7)
VOUT Falling Time, Tf (6)
250
90
IOUT=100mA (-40°C≤TA≤85°C)
VIN=5.5V, CL=1uF, RL=5.5Ω
VIN=2.7V, CL=1uF, RL=5.5Ω
VIN=5.5V, CL=1uF, RL=5.5Ω
VIN=2.7V, CL=1uF, RL=5.5Ω
CL=100μF, RL=5.5Ω
VOUT Rising Time, Tr (5)
1.95
140
20
0.9
1.7
4
OUT=5.5V, IN=GND
8
1
0.2
NOTES:
4) Production test at +25°C. Specifications over the temperature range are guaranteed by design and characterization.
5) Measured from 10% to 90%.
6) Measured from 90% to 10%
7) Measured from (50%) EN signal to (90%) output signal.
8) Measured from (50%) EN signal to (10%) output signal.
MP6211_MP6212 Rev. 1.1
9/18/2009
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3
MP6211/MP6212 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
PIN FUNCTIONS
SOIC8
MSOP8E
Name
1
GND
Expose
Pad
2, 3
IN
Input Voltage. Accepts 2.7V to 5.5V input.
4
EN
Enable Input, Active Low: (MP6212), Active High: (MP6211)
5
FLAG
IN-to-OUT Over-current, active-low output flag. Open-Drain.
6, 7
OUT
Power-Distribution Switch Output.
8
N/C
No Connect. Not internally connected.
Description
Ground. Connect exposed pad to GND plane for optimal thermal performance.
TYPICAL PERFORMANCE CHARACTERISTICS
TA = +25ºC, unless otherwise noted.
OUTX
RL
tf
tr
CL
VO(OUTX)
90%
10%
90%
10%
TEST CIRCUIT
50%
50%
50%
VI(ENX)
50%
VI(ENX)
toff
ton
VO(OUTX)
90%
ton
VO(OUTX)
10%
toff
90%
10%
VOLTAGE WAVEFORMS
Figure 1—Test Circuit and Voltage Waveforms
MP6211_MP6212 Rev. 1.1
9/18/2009
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MP6211/MP6212 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
TYPICAL PERFORMANCE CHARACTERISTICS
VIN=5.5V, CL=2.2uF, TA = +25ºC, unless otherwise noted.
Supply Current, Output
Enabled vs. Input Voltage
VEN=5V
2.5
3.5
4.5
5.5
INPUT VOTAGE (V)
0.7
0.6
0.5
0.4
2.5
6.5
30
25
20
15
10
5
0
-5
-10
-15
-20
-25
-30
-45 -30 -15 0
15 30 45 60 75 90
STATIC DRAIN-SOURCE ON-STATE
Static Drain-Source On-State
Resistance Variation vs.
Ambient Temperature
VIN=5V, IO=0.1A
SUPPLY CURRENT (uA)
1.5
0.8
3
3.5 4 4.5 5
INPUT VOTAGE (V)
5.5
95
90
85
80
75
70
6
2.5
3
3.5 4 4.5 5 5.5
INPUT VOTAGE (V)
6
Static Drain-Source On-State
Resistance vs. Input Voltage
Input to Output Voltage
vs. Load Current
VEN=5V, IOUT=1A
VEN=5V
INPUT TO OUTPUT VOLTAGE (mV)
TURN OFF DELAY (ms)
120
110
100
90
80
70
2.5
3 3.5 4 4.5 5 5.5
INPUT VOLTAGE (V)
6
140
Vin=5.5V
120
Vin=5V
Vin=4V
100
Vin=3.3V
80
Vin=2.7V
60
40
20
0
0
0.2 0.4 0.6 0.8
1
OUTPUT CURRENT (A)
1.2
Short Circuit Output Current
vs. Input Voltage
Threshold Trip Current
vs. Input Voltage
Current Limit Response
Time vs. Peak Current
VEN=5V, VIN=5V
VEN=5V
VEN=5V
2
1.75
TRIP CURRENT (A)
1.7
1.65
1.6
1.55
1.5
CURRENT LIMIT RESPONSE (us)
TURN ON DELAY (ms)
2
1
SHORT CIRCUIT OUTPUT CURRENT (A)
100
0.9
2.5
1.9
1.8
1.7
1.6
1.45
1.4
2.5
3
3.5
4
4.5
5
INPUT VOLTAGE (V)
MP6211_MP6212 Rev. 1.1
9/18/2009
5.5
6
1.5
2.5
3
3.5
4
4.5
5
5.5
6
50
45
40
35
30
25
20
15
10
5
0
0
2
INPUT VOLTAGE (V)
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4
6
8
10
12
PEAK CURRENT (A)
5
MP6211/MP6212 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN=5.5V, TA = +25ºC, unless otherwise noted.
VOUT
2V/div
VOUT
2V/div
EN
2V/div
EN
2V/div
1s/div
Inrush Current with
Different Load Capacitance
1ms/div
2ms/div
Threshold Trip Current with
Ramped Load on Enabled Device
Ramped Load on
Enabled Device
Short Circuit Current, Device
Enabled into Short
IO
500mA/div
4ms/div
MP6211_MP6212 Rev. 1.1
9/18/2009
2ms/div
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2ms/div
6
MP6211/MP6212 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
FUNCTION BLOCK DIAGRAM
+
UVLO
Vref
--
--
--
Current
Sense
-- -- --
--
OUT
--
IN
Charge
Pump
-Logic
-- -
-- FLAG
--
EN
AMP
+
Deglitch
--
--
Thermal
Sense
GND
Figure 2—Functional Block Diagram
MP6211_MP6212 Rev. 1.1
9/18/2009
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MP6211/MP6212 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
DETAILED DESCRIPTION
Over Current
When the load exceeds trip current (minimum
threshold current triggering constant-current
mode) or a short is present, MP6211/MP6212
switches into to a constant-current mode (current
limit value). MP6211/MP6212 will be shutdown
only if the overcurrent condition stays long
enough to trigger thermal protection.
Trigger overcurrent protection for different
overload conditions occurring in applications:
1) The output has been shorted or overloaded
before the device is enabled or input applied.
MP MP6211/MP6212 detects the short or
overload and immediately switches into a
constant-current mode.
2) A short or an overload occurs after the device
is enabled. After the current-limit circuit has
been tripped (reached the trip current
threshold), the device switches into constantcurrent mode. However, high current may
flow for a short period of time before the
current-limit circuit can react.
Thermal Protection
The purpose of thermal protection is to prevent
damage in the IC by allowing exceptive current to
flow and heating the junction. The die temp. is
internally monitored until the thermal limit is
reached. Once this temp. is reached, the switch
will turn off and allow the chip to cool. The switch
has a built-in hysteresis.
Under-voltage Lockout (UVLO)
This circuit is used to monitor the input voltage to
ensure that the MP6211/6212 is operating
correctly. This UVLO circuit also ensures that
there is no operation until the input voltage
reaches the minimum spec.
Enable
The logic pin disables the chip to reduce the
supply current. The device will operate once the
enable signal reaches the appropriate level. The
input is compatible with both COMS and TTL.
3) Output current has been gradually increased
beyond the recommended operating current.
The load current rises until the trip current
threshold is reached or until the thermal limit
of the device is exceeded. The MP6211/
MP6212 is capable of delivering current up to
the trip current threshold without damaging
the device. Once the trip threshold has been
reached, the device switches into its
constant-current mode.
Flag Response
The FLAG pin is an open drain configuration.
This FAULT will report a fail mode after an 8ms
deglitch timeout. This is used to ensure that no
false fault signals are reported. This internal
deglitch circuit eliminates the need for extend
components. The FLAG pin is not deglitched
during an over temp. or a voltage lockout.
MP6211_MP6212 Rev. 1.1
9/18/2009
www.MonolithicPower.com
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© 2009 MPS. All Rights Reserved.
8
MP6211/MP6212 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
APPLICATION INFORMATION
In order to achieve smaller output load transient
ripple, placing a high-value electrolytic capacitor
on the output pin(s) is recommended when the
load is heavy.
Power-Supply Considerations
Over 10μF capacitor between IN and GND is
recommended. This precaution reduces powersupply transients that may cause ringing on the
input and improves the immunity of the device to
short-circuit transients.
+5V
1 GND
MP6212
2, 3 IN
4
EN
OUT
6, 7
To VBUS
USB Ports
FLAG 5
SINGLE-CHANNEL
Figure 3—Application Circuit
MP6211_MP6212 Rev. 1.1
9/18/2009
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MP6211/MP6212 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
PACKAGE INFORMATION
MSOP8E (EXPOSED PAD)
0.087(2.20)
0.099(2.50)
0.114(2.90)
0.122(3.10)
5
8
0.114(2.90)
0.122(3.10)
PIN 1 ID
(NOTE 5)
0.187(4.75)
0.199(5.05)
0.062(1.58)
0.074(1.88)
Exposed Pad
0.010(0.25)
0.014(0.35)
4
1
0.0256(0.65)BSC
BOTTOM VIEW
TOP VIEW
GAUGE PLANE
0.010(0.25)
0.030(0.75)
0.037(0.95)
0.043(1.10)MAX
SEATING PLANE
0.002(0.05)
0.006(0.15)
FRONT VIEW
NOTE:
0.181(4.60)
0.040(1.00)
0.016(0.40)
0.004(0.10)
0.008(0.20)
SIDE VIEW
0.100(2.54)
0.075(1.90)
0o-6o
0.016(0.40)
0.026(0.65)
1) CONTROL DIMENSION IS IN INCHES. DIMENSION IN BRACKET IS
IN MILLIMETERS.
2) PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH,
PROTRUSION OR GATE BURR.
3) PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION.
4) LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)
SHALL BE 0.004" INCHES MAX.
5) PIN 1 IDENTIFICATION HAS HALF OR FULL CIRCLE OPTION.
6) DRAWING MEETS JEDEC MO-187, VARIATION AA-T.
7) DRAWING IS NOT TO SCALE.
0.0256(0.65)BSC
RECOMMENDED LAND PATTERN
MP6211_MP6212 Rev. 1.1
9/18/2009
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MP6211/MP6212 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
SOIC8E (EXPOSED PAD)
0.189(4.80)
0.197(5.00)
0.124(3.15)
0.136(3.45)
8
5
0.150(3.80)
0.157(4.00)
PIN 1 ID
1
0.228(5.80)
0.244(6.20)
0.089(2.26)
0.101(2.56)
4
TOP VIEW
BOTTOM VIEW
SEE DETAIL "A"
0.051(1.30)
0.067(1.70)
SEATING PLANE
0.000(0.00)
0.006(0.15)
0.013(0.33)
0.020(0.51)
0.0075(0.19)
0.0098(0.25)
SIDE VIEW
0.050(1.27)
BSC
FRONT VIEW
0.010(0.25)
x 45o
0.020(0.50)
GAUGE PLANE
0.010(0.25) BSC
0.050(1.27)
0.024(0.61)
0o-8o
0.016(0.41)
0.050(1.27)
0.063(1.60)
DETAIL "A"
0.103(2.62)
0.213(5.40)
NOTE:
0.138(3.51)
RECOMMENDED LAND PATTERN
1) CONTROL DIMENSION IS IN INCHES. DIMENSION IN
BRACKET IS IN MILLIMETERS.
2) PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS.
3) PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH
OR PROTRUSIONS.
4) LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)
SHALL BE 0.004" INCHES MAX.
5) DRAWING CONFORMS TO JEDEC MS-012, VARIATION BA.
6) DRAWING IS NOT TO SCALE.
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
MP6211_MP6212 Rev. 1.1
9/18/2009
www.MonolithicPower.com
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2009 MPS. All Rights Reserved.
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