Renesas M37512FCH-XXXHP Single-chip 8-bit cmos microcomputer Datasheet

7512 Group
REJ03B0122-0101
Rev.1.01
Feb 18, 2005
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
DESCRIPTION
●Current integrator ......................................................... 1 channel
●Over current detector ................................................... 1 channel
●Easy thermal sensor .................................................... 1 channel
●Watchdog timer ............................................................ 16-bit ✕ 1
●Clock generating circuit ..................................... Built-in 4 circuits
(high-speed RC oscillator and 32kHz RC oscillator, or connect to
external ceramic resonator or quartz-crystal oscillator)
●Power source voltage ............................................ 2.45 to 2.55 V
●Power dissipation
In high-speed mode ...................................................... 3.75 mW
(at 4 MHz oscillation frequency, at 2.5 V power source voltage)
In low-speed mode ........................................................ 1.05 mW
(at 32 kHz oscillation frequency, at 2.5 V power source voltage)
●Operating temperature range .................................... –20 to 85°C
The 7512 Group is the 8-bit microcomputer based on the 740 family core technology.
The 7512 Group is designed for battery-pack and includes serial
interface functions, 8-bit timer, A/D converter, current integrator
and I2C-BUS interface.
FEATURES
●Basic machine-language instructions ...................................... 71
●Minimum instruction execution time .................................. 1.0 µs
(at 4 MHz oscillation frequency)
●Memory size
Flash memory .................................................. 36 K to 52 Kbytes
RAM ............................................................... 1.0 K to 1.5 Kbytes
●Programmable input/output ports ............................................ 36
●Interrupts ................................................. 19 sources, 16 vectors
●Timers ............................................................................. 8-bit ✕ 4
●Serial interface
Serial I/O1 .......... 8-bit ✕ 1 (UART or Clock-synchronized)
Serial I/O2 .......................... 8-bit ✕ 1(Clock-synchronized)
●Multi-master I2C-BUS interface (option) ...................... 1 channel
●PWM ............................................................................... 8-bit ✕ 1
●A/D converter ............................................. 10-bit ✕ 10 channels
APPLICATION
P05/AN9
P06/CFETCNT/AN10
P07/PWM1/AN11
P10/(LED0)
P11/(LED1)
29
28
27
26
25
Battery-Pack, etc.
P02/SCLK2
P03/SRDY2
P04/AN8
30
P01/SOUT2
31
P00/SIN2
34
33
32
P34/AN4
P35/AN5
36
35
PIN CONFIGURATION (TOP VIEW)
P33/AN3
37
24
P32/AN2
38
23
P13/(LED3)
P31/AN1
39
22
P14/(LED4)
P15/(LED5)
P12/(LED2)
P30/AN0
40
21
ADVSS
41
20
P16/(LED6)
ADVRED
42
19
P17/(LED7)
VCC
43
AVCC
M37512FCHP
10
11
12
CNVSS
P24/SDA2/RXD
P23/SCL1
9
P25/SCL2/TXD
P22/SDA1
7
P21/XCIN
8
P20/XCOUT
13
P26/SCLK
14
48
6
47
P27/CNTR0/SRDY1
ISENS1
DFETCNT/P45
5
RESET
P41/INT0
15
P40/CNTR1
XIN
46
3
16
ISENS0
4
45
P42/INT1
AVSS
P43/INT2/SCMP2
XOUT
1
17
2
VSS
44
P44/INT3/PWM0
18
Package type : 48P6Q-A
Fig. 1 M37512FCHP pin configuration
Feb 18, 2005 page 1 of 85
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Fig. 2 Functional block diagram
Feb 18, 2005 page 2 of 85
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Current
integrator
AVcc
ISENS0 AVss
PWM (8)
Reset
XCOUT
sub-clock output
ADVSS ADVREF
41 42
10bit
A/D
converter
Watchdog timer
XCIN
sub-clock input
47 46 45 44
ISENS1
Over current
detector
Easy thermal
sensor
17
Main-clock
output
X OUT
Clock generating circuit
16
Main-clock
input
X IN
P4(6)
INT0 - INT3
RAM
I/O port P 4
48 1 2 3 4 5
FUNCTIONAL BLOCK DIAGRAM
ROM
PC H
I/O port P 3
35 36 37 38 39 40
P3(6)
0
C 43
18
PS
PC L
S
Y
X
A
SI/O1(8)
C P U
VC
VSS
I2 C
(8)
XCIN XCOUT
CNTR1
I/O port P 2
P1(8)
I/O port P 1
I/O port P 0
27 28 29 30 31 32 33 34
P0(8)
Timer Y ( 8 )
Timer Y ( 8 )
Timer 2 (8)
Timer 2 (8)
19 20 21 22 23 24 25 26
Prescaler Y (8)
Prescaler X (8)
Prescaler 12 (8)
12
CNVSS
6 7 8 9 10 11 13 14
P2(8)
CNTR0
15
Reset input
RESET
SI/O2(8)
7512 Group
FUNCTIONAL BLOCK
7512 Group
PIN DESCRIPTION
Table 1 Pin description
Pin
Functions
Name
VCC, VSS
Power source
•Apply voltage of 2.5V to Vcc, and 0 V to Vss.
AVCC
AVSS
ADVSS
Analog power
source
•Apply voltage of 2.5V to AVcc, and 0 V to AVss, ADVss.
ADVREF
Analog reference
voltage
•Reference voltage input pin for A/D converters.
CNVSS
CNVSS input
•This pin controls the operation mode of the chip.
RESET
XIN
Reset input
•Reset input pin for active “L”.
Clock input
•Input and output pins for the clock generating circuit.
XOUT
Clock output
Function except a port function
•Normally connected to VSS.
P00/SIN2
P01/SOUT2
P02/SCLK2
P03/SRDY2
I/O port P0
•Connect a ceramic resonator or quartz-crystal oscillator between the XIN and XOUT pins to set
the oscillation frequency.
•When a high-speed RC oscillator is used, leave the XIN pin and XOUT pin open.
•When an external clock is used, connect the clock source to the XIN pin and leave the XOUT
pin open.
• Serial I/O2 function pin
•8-bit CMOS I/O port.
•I/O direction register allows each pin to be individually
programmed as either input or output.
•CMOS compatible input level.
P04/AN8
P05/AN9
•P0 0 to P0 7 are CMOS 3-state output structure,
and P10 to P17 are N-channel open-drain structure.
•P10 to P17 (8 bits) are enabled to output large current
for LED drive.
P06/CFETCNT/
AN10
P07/AN11/
PWM1
P10–P17
I/O port P1
P20/XCOUT
P21/XCIN
I/O port P2
•8-bit CMOS I/O port.
•I/O direction register allows each pin to be individually
programmed as either input or output.
P22/SDA1
P23/SCL1
•CMOS compatible input level, but P2 2 to P25 can be
switched between CMOS compatible input level or
SMBUS input level in the I2C-BUS interface function.
P24/SDA2/RxD
P25/SCL2/TxD
•P20, P21, P26, P27: CMOS3-state output structure.
•P22 to P25: N-channel open-drain structure.
P26/SCLK
P27/CNTR0/
SRDY1
P30/AN0–
P35/AN5
I/O port P3
•6-bit CMOS I/O port with the same function as port P0.
• A/D converter input pin
• A/D converter input pin /
Over current detector function pin
• A/D converter input pin /
PWM output pin
• Sub-clock generating circuit I/O
pins (connect a resonat or registor
and capacitor)
• I2C-BUS interface function pins
• I2C-BUS interface function pins/
Serial I/O1 function pins
• Serial I/O1 function pin
• Serial I/O1 function pin/
Timer X function pin
• A/D converter input pin
•CMOS compatible input level.
•CMOS 3-state output structure.
P40/CNTR1
P41/INT0
P42/INT1
I/O port P4
•6-bit CMOS I/O port with the same function as port P0.
•CMOS compatible input level.
•P40 to P4 2, P45 are CMOS 3-state output structure,
and P43 and P44 are N-channel open-drain structure.
P43/INT2/SCMP2
P44/INT3/PWM0
P45/DFETCNT
ISENS0
Analog input pin
ISENS1
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• Timer Y function pin
• Interrupt input pins
• Interrupt input pin/SCMP2 output pin
• Interrupt input pin/PWM output pin
• Over current detector function pin
•Current integrator and over current detector input pins.
•Connect the sense resistor. Normally connect the ISENS0 to GND.
7512 Group
GROUP EXPANSION
Memory Size
Renesas plans to expand the 7512 group as follows.
ROM size ........................................................... 36 K to 52 K bytes
RAM size .......................................................... 1024 to 1536 bytes
Memory Type
Packages
Support for flash memory version.
48P6Q-A ............................................... 48-pin plastic molded QFP
Memory Expansion Plan
ROM size (bytes)
60K
Mass production
M37512FC
48K
Under development
M37512FCH
Mass production
M37512F8
32K
Under development
M37512F8H
768
1024
1280
1536
3072
RAM size (bytes)
Fig. 3 Memory expansion plan
Currently planning products are listed below.
Table 2 Support products
Product name
ROM size (bytes)
RAM size (bytes)
Package
Remarks
M37512F8HP
M37512F8-XXXHP
32K + 4K
1024
M37512F8HHP
(Note 1)
M37512F8H-XXXHP (Note 1)
48P6Q-A
M37512FCHP
M37512FC-XXXHP
48K + 4K
1536
M37512FCHHP
(Note 1)
M37512FCH-XXXHP (Note 1)
Note 1. The products of which erase/write cycles onto the blocks A and B are maximum 10k are under development.
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7512 Group
[Stack Pointer (S)]
FUNCTIONAL DESCRIPTION
CENTRAL PROCESSING UNIT (CPU)
The 7512 Group uses the standard 740 Family instruction set. Refer to the table of 740 Family addressing modes and machine
instructions or the 740 Family Software Manual for details on the
instruction set.
Machine-resident 740 Family instructions are as follows:
The FST and SLW instructions cannot be used.
The STP, WIT, MUL, and DIV instructions can be used.
[Accumulator (A)]
The accumulator is an 8-bit register. Data operations such as data
transfer, etc. are executed mainly through the accumulator.
[Index Register X (X)]
The index register X is an 8-bit register. In the index addressing
modes, the value of the OPERAND is added to the contents of
register X and specifies the real address.
[Index Register Y (Y)]
The stack pointer is an 8-bit register used during subroutine calls
and interrupts. This register indicates start address of stored area
(stack) for storing registers during subroutine calls and interrupts.
The low-order 8 bits of the stack address are determined by the
contents of the stack pointer. The high-order 8 bits of the stack address are determined by the stack page selection bit. If the stack
page selection bit is “0” , the high-order 8 bits becomes “0016”. If
the stack page selection bit is “1”, the high-order 8 bits becomes
“0116”.
The operations of pushing register contents onto the stack and
popping them from the stack are shown in Figure 5.
Store registers other than those described in Figure 4 with program when the user needs them during interrupts or subroutine
calls (see Table 3).
[Program Counter (PC)]
The program counter is a 16-bit counter consisting of two 8-bit
registers PCH and PCL. It is used to indicate the address of the
next instruction to be executed.
The index register Y is an 8-bit register. In partial instruction, the
value of the OPERAND is added to the contents of register Y and
specifies the real address.
b0
b7
A
Accumulator
b0
b7
X
Index register X
b0
b7
Y
b7
Index register Y
b0
S
b15
b7
PCH
Stack pointer
b0
Program counter
PCL
b7
b0
N V T B D I Z C
Processor status register (PS)
Carry flag
Zero flag
Interrupt disable flag
Decimal mode flag
Break flag
Index X mode flag
Overflow flag
Negative flag
Fig.4 740 Family CPU register structure
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7512 Group
On-going Routine
Interrupt request
(Note)
M (S)
Execute JSR
Push return address
on stack
M (S)
(PCH)
(S)
(S) – 1
M (S)
(PCL)
(S)
(S)– 1
(S)
M (S)
(S)
M (S)
(S)
Subroutine
POP return
address from stack
(S) + 1
(PCL)
M (S)
(S)
(S) + 1
(PCH)
M (S)
(S) – 1
(PCL)
Push return address
on stack
(S) – 1
(PS)
Push contents of processor
status register on stack
(S) – 1
Interrupt
Service Routine
Execute RTS
(S)
(PCH)
I Flag is set from “0” to “1”
Fetch the jump vector
Execute RTI
Note: Condition for acceptance of an interrupt
(S)
(S) + 1
(PS)
M (S)
(S)
(S) + 1
(PCL)
M (S)
(S)
(S) + 1
(PCH)
M (S)
POP contents of
processor status
register from stack
POP return
address
from stack
Interrupt enable flag is “1”
Interrupt disable flag is “0”
Fig. 5 Register push and pop at interrupt generation and subroutine call
Table 3 Push and pop instructions of accumulator or processor status register
Push instruction to stack
Pop instruction from stack
Accumulator
PHA
PLA
Processor status register
PHP
PLP
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7512 Group
[Processor status register (PS)]
The processor status register is an 8-bit register consisting of 5
flags which indicate the status of the processor after an arithmetic
operation and 3 flags which decide MCU operation. Branch operations can be performed by testing the Carry (C) flag , Zero (Z) flag,
Overflow (V) flag, or the Negative (N) flag. In decimal mode, the Z,
V, N flags are not valid.
•Bit 0: Carry flag (C)
The C flag contains a carry or borrow generated by the arithmetic
logic unit (ALU) immediately after an arithmetic operation. It can
also be changed by a shift or rotate instruction.
•Bit 1: Zero flag (Z)
The Z flag is set if the result of an immediate arithmetic operation
or a data transfer is “0”, and cleared if the result is anything other
than “0”.
•Bit 2: Interrupt disable flag (I)
The I flag disables all interrupts except for the interrupt
generated by the BRK instruction.
Interrupts are disabled when the I flag is “1”.
•Bit 3: Decimal mode flag (D)
The D flag determines whether additions and subtractions are
executed in binary or decimal. Binary arithmetic is executed when
this flag is “0”; decimal arithmetic is executed when it is “1”.
Decimal correction is automatic in decimal mode. Only the ADC
and SBC instructions can execute decimal arithmetic.
•Bit 4: Break flag (B)
The B flag is used to indicate that the current interrupt was
generated by the BRK instruction. The BRK flag in the processor
status register is always “0”. When the BRK instruction is used to
generate an interrupt, the processor status register is pushed
onto the stack with the break flag set to “1”.
•Bit 5: Index X mode flag (T)
When the T flag is “0”, arithmetic operations are performed
between accumulator and memory. When the T flag is “1”, direct
arithmetic operations and direct data transfers are enabled
between memory locations.
•Bit 6: Overflow flag (V)
The V flag is used during the addition or subtraction of one byte
of signed data. It is set if the result exceeds +127 to -128. When
the BIT instruction is executed, bit 6 of the memory location
operated on by the BIT instruction is stored in the overflow flag.
•Bit 7: Negative flag (N)
The N flag is set if the result of an arithmetic operation or data
transfer is negative. When the BIT instruction is executed, bit 7 of
the memory location operated on by the BIT instruction is stored
in the negative flag.
Table 4 Set and clear instructions of each bit of processor status register
C flag
Z flag
I flag
D flag
B flag
T flag
V flag
N flag
Set instruction
SEC
–
SEI
SED
–
SET
–
–
Clear instruction
CLC
–
CLI
CLD
–
CLT
CLV
–
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7512 Group
[CPU Mode Register (CPUM)] 003B16
The CPU mode register contains the stack page selection bit, etc.
The CPU mode register is allocated at address 003B16.
b7
b0
CPU mode register
(CPUM : address 003B16)
Processor mode bits
b1 b0
0 0 : Single-chip mode
0 1 :
1 0 :
Not available
1 1 :
Stack page selection bit
0 : 0 page
1 : 1 page
Clock source switch bit
0 : Built-in high speed oscillating function
1 : XCIN–XCOUT oscillation function
Port XC switch bit
0 : I/O port function (stop oscillation)
1 : XCIN–XCOUT oscillation function
Main clock (XIN–XOUT) stop bit
0 : Oscillation
1 : Stopped
Main clock division ratio selection bits
b7 b6
0 0 : φ = f(XIN)/2 (high-speed mode)
0 1 : φ = f(XIN)/8 (middle-speed mode)
1 0 : φ = f(XIN)/2 (low-speed mode)
1 1 : Not available
Note : All bits in this register are protected by protect mode.
Fig. 6 Structure of CPU mode register
Feb 18, 2005 page 8 of 85
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7512 Group
MEMORY
Special Function Register (SFR) Area
Interrupt Vector Area
The interrupt vector area contains reset and interrupt vectors.
The Special Function Register area in the zero page contains control registers such as I/O ports and timers.
Zero Page
RAM
Access to this area with only 2 bytes is possible in the zero page
addressing mode.
RAM is used for data storage and for stack area of subroutine
calls and interrupts.
Special Page
Flash Memory
Access to this area with only 2 bytes is possible in the special
page addressing mode.
The last 2 bytes of flash memory are reserved for device testing
and the rest is user area for storing programs.
RAM size and area
Product name
M37512F8HP
M37512F8-XXXHP
M37512F8HHP
M37512F8H-XXXHP
M37512FCHP
M37512FC-XXXHP
M37512FCHHP
M37512FCH-XXXHP
RAM size
(bytes)
Address
XXXX16
1024
043F16
1536
063F16
ROM size and area (Except Data block)
ROM size
Product name
(bytes)
M37512F8HP
M37512F8-XXXHP
32768
M37512F8HHP
M37512F8H-XXXHP
M37512FCHP
M37512FC-XXXHP
49152
M37512FCHHP
M37512FCH-XXXHP
Address
YYYY16
800016
400016
User ROM area
000016
SFR area
Zero page
004016
010016
RAM
XXXX16
0FE016
0FFF16
100016
Not used
SFR area
ROM
1FFF16
Not used
ROM
Boot ROM area
YYYY16
F00016
FF0016
FF0016
FFD416
FFD416
Flash memory ID code
FFDC16
Interrupt vector area
FFFE16
Reserved memory area
FFFF16
Fig. 7 Memory map diagram
Feb 18, 2005 page 9 of 85
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Special
page
FFDC16
FFFE16
FFFF16 Reserved memory area
Special
page
7512 Group
000016
Port P0 (P0)
002016
Prescaler 12 (PRE12)
000116
Port P0 direction register (P0D)
002116
Timer 1 (T1)
000216
Port P1 (P1)
002216
Timer 2 (T2)
000316
Port P1 direction register (P1D)
002316
Timer XY mode register (TM)
000416
Port P2 (P2)
002416
Prescaler X (PREX)
000516
Port P2 direction register (P2D)
002516
Timer X (TX)
000616
Port P3 (P3)
002616
Prescaler Y (PREY)
000716
Port P3 direction register (P3D)
002716
Timer Y (TY)
000816
Port P4 (P4)
002816
Timer count source selection register (TCSS)
000916
Port P4 direction register (P4D)
002916
SFR protect control register (PRREG)
000A16
Discharge counter latch low-order register (DCHARGEL)
002A16
000B16
Discharge counter latch high-order register (DCHARGEH)
002B16
I2C data shift register (S0)
000C16
Charge counter latch low-order register (CHARGEL)
002C16
I2C address register (S0D)
000D16
Charge counter latch high-order register (CHARGEH)
002D16
I2C status register (S1)
000E16
Current integrator control register (CINFCON)
002E16
I2C control register (S1D)
000F16
Short current detector control register (SCDCON)
002F16
I2C clock control register (S2)
001016
Over current detector control register (OCDCON)
003016
I2C start/stop condition control register (S2D)
001116
Current detect time set up register 1 (OCDTIME1)
003116
I2C additional register (S3)
001216
Wake up current detector control register1 (WUDCON1)
003216
32kHz RC oscillation control register0 (32KOSCC0)
001316
Current detect status register (OCDSTS)
003316
32kHz RC oscillation control register1 (32KOSCC1)
001416
Wake up current detector control register2 (WUDCON2)
003416
AD control register (ADCON)
001516
Serial I/O2 control register 1 (SIO2CON1)
003516
AD conversion low-order register (ADL)
001616
Serial I/O2 control register 2 (SIO2CON2)
003616
AD conversion high-order register (ADH)
001716
Serial I/O2 register (SIO2)
003716
MISRG2
001816
Transmit/Receive buffer register (TB/RB)
003816
MISRG
001916
Serial I/O1 status register (SIOSTS)
003916
Watchdog timer control register (WDTCON)
001A16
Serial I/O1 control register (SIOCON)
003A16
Interrupt edge selection register 1 (INTEDGE1)
001B16
UART control register (UARTCON)
003B16
CPU mode register (CPUM)
001C16
Baud rate generator (BRG)
003C16
Interrupt request register 1 (IREQ1)
001D16
PWM control register (PWMCON)
003D16
Interrupt request register 2 (IREQ2)
001E16
PWM prescaler (PREPWM)
003E16
Interrupt control register 1 (ICON1)
001F16
PWM register (PWM)
003F16
Interrupt control register 2 (ICON2)
0FE016
Flash memory control register 0 (FMCR0)
0FF016
Charge over current detector control register (COCDCON)
0FE116
Flash memory control register 1 (FMCR1)
0FF116
Current detect time set up register 2 (OCDTIME2)
0FE216
Flash memory control register 2 (FMCR2)
0FF216
High-speed RC oscillator frequency set up register (O4RCFRG)
0FE316
Reserved *
0FF316
High-speed RC oscillator frequency counter (O4RCFCNT)
0FE416
Reserved *
0FF416
High-speed RC oscillator control register (O4RCCOT)
0FE516
Reserved *
0FF516
Interrupt edge selection register 2 (INTEDG2)
0FE616
Reserved *
0FE716
Reserved *
0FE816
Reserved *
0FE916
Reserved *
0FEA16
Reserved *
0FEB16
Reserved *
0FEC16
Reserved *
0FED16
Reserved *
0FEE16
Reserved *
0FEF16
Reserved *
Fig. 8 Memory map of special function register (SFR)
Feb 18, 2005 page 10 of 85
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* Reserved : Do not write any data to the reserved area.
7512 Group
I/O PORTS
The I/O ports have direction registers which determine the input/
output direction of each individual pin. Each bit in a direction register corresponds to one pin, and each pin can be set to be input
port or output port.
When “0” is written to the bit corresponding to a pin, that pin becomes an input pin. When “1” is written to that bit, that pin
becomes an output pin.
If data is read from a pin which is set to output, the value of the
port output latch is read, not the value of the pin itself. Pins set to
input are floating. If a pin set to input is written to, only the port
output latch is written to and the pin remains floating.
Table 5 I/O port function
Pin
Name
Port P0
P00/SIN2
P01/SOUT2
P02/SCLK2
__________
P03/SRDY2
P04/AN8
P05/AN9
P06/CFETCNT/AN10
Input/Output
I/O Structure
Non-Port Function
Related SFRs
Input/output, CMOS compatible input level Serial I/O2 function I/O Serial I/O2 control register
individual bits CMOS 3-state output
A/D conversion input
A/D conversion input
Over current detector
output
A/D conversion input
PWM output
P07/AN11/PWM1
P10–P17
Port P1
P20/XCOUT
P21/XCIN
P22/SDA1
P23/SCL1
P24/SDA2/RxD
P25/SCL2/TxD
Port P2
P26/SCLK
P27/CNTR0/
__________
SRDY1
P30/AN0–
P35/AN5
P40/CNTR1
P41/INT0
P42/INT1
P43/INT2/SCMP2
Port P3
Port P4
P44/INT3/PWM0
P45/DFETCNT
Feb 18, 2005 page 11 of 85
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CMOS compatible input level
N-channel open-drain output
CMOS compatible input level
CMOS 3-state output
CMOS compatible input level
CMOS/SMBUS input level
(when selecting I2C-BUS
interface function)
N-channel open-drain output
AD control register
MISRG2
AD control register, MISRG2
Charge over current detect
control register
AD control register, MISRG2
PWM control register
Ref.No.
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
Sub-clock generating
circuit
I2C-BUS interface
function I/O
I2C-BUS interface
function I/O
Serial I/O1 function I/O
CMOS compatible input level Serial I/O1 function I/O
CMOS 3-state output
Serial I/O1 function I/O
Timer X function I/O
A/D conversion input
CPU mode register
MISRG2
I2C control register
I2C control register
Serial I/O1 control register
Serial I/O1 control register
Serial I/O1 control register
Timer XY mode register
AD control register
MISRG2
Timer Y function I/O
Timer XY mode register
External interrupt input Interrupt edge selection
register 1
CMOS compatible input level External interrupt input Interrupt edge selection
N-channel open-drain output SCMP2 output
register 2
Serial I/O2 control register
External interrupt input Interrupt edge selection
PWM output
register 2
PWM control register
CMOS compatible input level Over current detector
Short current detect control
CMOS 3-state output
output
register
Over current detect control
register
Wake up current detect
control register
(10)
(11)
(12)
(13)
(14)
(15)
(16)
(17)
(6)
(18)
(19)
(20)
(21)
(22)
7512 Group
(1) Port P00
(2) Port P01
P01/SOUT2 P-channel output
disable bit
Direction
register
Serial I/O2 transmit completion signal
Serial I/O2 port selection bit
Data bus
Direction
register
Port latch
Data bus
Port latch
Serial I/O2 input
Serial I/O2 output
(3) Port P02
(4) Port P03
P02/SCLK2 P-channel output disable bit
Serial I/O2 synchronous clock
selection bit
Serial I/O2 port selection bit
SRDY2 output enable bit
Direction
register
Direction
register
Data bus
Data bus
Port latch
Port latch
Serial I/O2 ready output
Serial I/O2 clock output
Serial I/O2 external clock input
(6) Ports P05, P30–P35
(5) Port P04
Direction
register
Data bus
Direction
register
Data bus
Port latch
Port latch
A/D converter input
A/D converter input
Analog input pin
selection bit
(7)Port P06
Analog input pin
selection bit
(8)Port P07
Charge over current detector enable bit
PWM output pin selection bit
PWM enable bit
Direction
register
Data bus
Direction
register
Port latch
Data bus
1
CFETCNToutput
INT3 input
CFETCNT-INT3
OR output valid bit
Fig. 9 Port block diagram (1)
Feb 18, 2005 page 12 of 85
REJ03B0122-0101
A/D
converter
input
Analog input pin
selection bit
0
Charge FET control polarity switch bit
Port latch
PWM output
A/D converter input
Analog input pin
selection bit
7512 Group
(9) Port P1
(10) Port P20
Port XC switch bit
Direction
register
Direction
register
Data bus
Port latch
Port latch
Data bus
Port P21
32kHz RC Oscillation enable bit
Port Xc switch bit
32kHz RC Oscillation enable bit
Reference
voltage
–
+
(12) Port P22
(11) Port P21
I2C-BUS interface enable bit
SDA/SCL pin selection bit
Port XC switch bit
Direction
register
Direction
register
Data bus
Data bus
Port latch
Port latch
SDA output
Sub-clock generating circuit input
SDA input
(13) Port P23
(14) Port P24
I2C-BUS interface enable bit
SDA/SCL pin selection bit
I2C-BUS interface enable bit
SDA/SCL pin selection bit
Serial I/O1 enable bit
Receive enable bit
Direction
register
Data bus
Direction
register
Port latch
Data bus
Port latch
SDA output
SCL output
(16) Port P26
(15) Port P25
Serial I/O1 synchronous clock
selection bit
Serial I/O1 enable bit
Serial I/O1 enable bit
Transmit enable bit
I2C-BUS interface enable bit
SDA/SCL pin selection bit
Serial I/O1 mode selection bit
Serial I/O1 enable bit
Direction
register
Data bus
SDA input
Serial I/O1 input
SCL input
Direction
register
Port latch
Serial I/O1 output
SCL output
Fig. 10 Port block diagram (2)
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REJ03B0122-0101
Data bus
SCL input
Port latch
Serial I/O1 clock output
Serial I/O1 external
clock input
7512 Group
(17) Port P27
(18) Port P40
Pulse output mode
Serial I/O1 mode selection bit
Serial I/O1 enable bit
SRDY1 output enable bit
Direction
register
Direction
register
Port latch
Data bus
Port latch
Data bus
Pulse output mode
Timer output
Pulse output mode
Serial I/O1 ready output
Timer output
(19) Ports P41, P42
CNTR1 interrupt input
CNTR0 interrupt
input
(20) Port P43
Serial I/O2 input/output
comparison signal control bit
Direction
register
Data bus
Direction
register
Port latch
Data bus
Port latch
Interrupt input
Serial I/O2 input/output
comparison signal output
INT2 interrupt input
(21) Port P44
PWM output pin selection bit
PWM function enable bit
Direction
register
Data bus
Port latch
(22) Port P45
Charge over current detect enable bit
Short current detect enable bit
Over current detect enable bit
Wake up current detect enable bit
Direction
register
Data bus
1
PWM output
DFETCNT output
INT3 interrupt input
INT2 input
DFETCNT-INT2
OR output enable bit
Fig. 11 Port block diagram (3)
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Port latch
0
Discharge FET control polarity
switch bit
7512 Group
INTERRUPTS
■Notes
Interrupts occur by 16 sources among 20 sources: seven external,
twelve internal, and one software.
When setting the followings, the interrupt request bit may be set to
“1”.
•When switching external interrupt active edge
Related register: Interrupt edge selection register 1 (address 003A16)
I2C START/STOP condition control register
(address 003016)
Timer XY mode register (address 002316)
•When switching interrupt sources of an interrupt vector address
where two or more interrupt sources are allocated
Related register: Interrupt edge selection register 1
(address 003A16)
When not requiring for the interrupt occurrence synchronized with
these setting, take the following sequence.
(1) Set the corresponding interrupt enable bit to “0” (disabled).
(2) Set the interrupt edge select bit or the interrupt source select
bit.
(3) Set the corresponding interrupt request bit to “0” after 1 or
more instructions have been executed.
(4) Set the corresponding interrupt enable bit to “1” (enabled).
Interrupt Control
Each interrupt is controlled by an interrupt request bit, an interrupt
enable bit, and the interrupt disable flag except for the software interrupt set by the BRK instruction. An interrupt occurs if the
corresponding interrupt request and enable bits are “1” and the interrupt disable flag is “0”.
Interrupt enable bits can be set or cleared by software.
Interrupt request bits can be cleared by software, but cannot be
set by software.
The reset and the BRK instruction cannot be disabled with any
flag or bit. The I (interrupt disable) flag disables all interrupts except the reset and the BRK instruction interrupt.
When several interrupts occur at the same time, the interrupts are
received according to priority.
Interrupt Operation
By acceptance of an interrupt, the following operations are automatically performed:
1. The contents of the program counter and the processor status
register are automatically pushed onto the stack.
2. The interrupt disable flag is set and the corresponding interrupt
request bit is cleared.
3. The interrupt jump destination address is read from the vector
table into the program counter.
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REJ03B0122-0101
7512 Group
Table 6 Interrupt vector addresses and priority
Interrupt Source
Reset (Note 2)
Priority
1
Vector Addresses (Note 1)
High
Low
FFFD16
FFFC16
Interrupt Request
Generating Conditions
Remarks
At reset
Non-maskable
External interrupt
(active edge selectable)
INT0
2
FFFB16
FFFA16
At detection of either rising or
falling edge of INT0 input
SCL, SDA
3
FFF916
FFF816
At detection of either rising or
falling edge of SCL or SDA input
External interrupt
(active edge selectable)
INT1
4
FFF716
FFF616
At detection of either rising or
falling edge of INT1 input
External interrupt
(active edge selectable)
INT2
5
FFF516
FFF416
At detection of either rising or
falling edge of INT2 input
External interrupt
(active edge selectable)
At detection of either rising or
falling edge of INT3 input
External interrupt
(active edge selectable)
At completion of serial I/O2 data
reception / transmission
Valid when serial I/O2 is selected
INT3
6
FFF316
FFF216
Serial I/O2
I 2C
Timer X
Timer Y
Timer 1
7
FFF116
FFF016
At completion of data transfer
8
FFEF16
At timer X underflow
9
FFED16
10
FFEB16
FFEE16
FFEC16
FFEA16
Timer 2
11
FFE916
FFE816
At timer 2 underflow
Serial I/O1
reception
12
FFE716
FFE616
At completion of serial I/O1 data
reception
Valid when serial I/O1 is selected
At completion of serial I/O1
transfer shift or when transmission buffer is empty
Valid when serial I/O1 is selected
At discharge short current is detected, at discharge over current
is detected, at wake up current
is detected, or at charge over
current is detected.
Valid when discharge short current
detector or discharge current
detector, or wake up current
detector, or charge over current
detector is selected.
Serial I/O1
Transmission
At timer Y underflow
At timer 1 underflow
STP release timer underflow
13
FFE516
FFE416
CNTR0
14
FFE316
FFE216
At detection of either rising or
falling edge of CNTR0 input
External interrupt
(active edge selectable)
CNTR1
15
FFE116
FFE016
At detection of either rising or
falling edge of CNTR1 input
External interrupt
(active edge selectable)
16
FFDF16
FFDE16
At end of current integration
period, or at end of calibration
17
FFDD16
FFDC16
At BRK instruction execution
Over current
detection
At completion of A/D conversion
A/D converter
Current integration
BRK instruction
Notes 1: Vector addresses contain interrupt jump destination addresses.
2: Reset function in the same way as an interrupt with the highest priority.
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REJ03B0122-0101
Valid when current integrator is
selected
Non-maskable software interrupt
7512 Group
Interrupt request bit
Interrupt enable bit
Interrupt disable flag (I)
BRK instruction
Reset
Interrupt request
Fig. 12 Interrupt control
b7
b0 Interrupt edge selection register 1
(INTEDGE1 : address 003A16)
b7
b0 Interrupt edge selection register 2
(INTEDGE2 : address 0FF516)
INT0 active edge selection bit
0 : Falling edge active
1 : Rising edge active
INT1 active edge selection bit
0 : Falling edge active
1 : Rising edge active
Not used (returns “0” when read)
Serial I/O2 / INT3 interrupt source bit
0 : INT3 interrupt selected
1 : Serial I/O2 interrupt selected
Current integrate/A/D converter interrupt source bit
0 : AD converter interrupt selected
1 : Current integrate interrupt selected
Over current detect / Serial I/O1 transmit interrupt source bit
0 : Serial I/O1 transmit interrupt selected
1 : Over current detect interrupt selected
Not used (returns “0” when read)
b7
b7
b0
b0
Interrupt request register 1
(IREQ1 : address 003C16)
b7
b0
INT2 falling edge active bit
0 : No operation
1 : Falling edge active
INT2 rising edge active bit
0 : No operation
1 : Rising edge active
INT3 falling edge active bit
0 : No operation
1 : Falling edge active
INT3 rising edge active bit
0 : No operation
1 : Rising edge active
Not used (returns “0” when read)
Interrupt request register 2
(IREQ2 : address 003D16)
INT0 interrupt request bit
SCL/SDA interrupt request bit
INT1 interrupt request bit
INT2 interrupt request bit
INT3 / Serial I/O2 interrupt request bit
I2C interrupt request bit
Timer X interrupt request bit
Timer Y interrupt request bit
Timer 1 interrupt request bit
Timer 2 interrupt request bit
Serial I/O1 reception interrupt request bit
Serial I/O1 transmit / Over current detect interrupt request bit
CNTR0 interrupt request bit
CNTR1 interrupt request bit
AD converter /current integrate interrupt request bit
Not used (returns “0” when read)
0 : No interrupt request issued
1 : Interrupt request issued
0 : No interrupt request issued
1 : Interrupt request issued
Interrupt control register 1
(ICON1 : address 003E16)
INT0 interrupt enable bit
SCL/SDA interrupt enable bit
INT1 interrupt enable bit
INT2 interrupt enable bit
INT3 / Serial I/O2 interrupt enable bit
I2C interrupt enable bit
Timer X interrupt enable bit
Timer Y interrupt enable bit
0 : Interrupts disabled
1 : Interrupts enabled
Fig. 13 Structure of interrupt-related registers
Feb 18, 2005 page 17 of 85
REJ03B0122-0101
b7
b0
Interrupt control register 2
(ICON2 : address 003F16)
Timer 1 interrupt enable bit
Timer 2 interrupt enable bit
Serial I/O1 reception interrupt enable bit
Serial I/O1 transmit / Over current detect interrupt enable bit
CNTR0 interrupt enable bit
CNTR1 interrupt enable bit
AD converter / current integrate interrupt enable bit
Not used (returns “0” when read)
(Do not write “1” to this bit)
0 : Interrupts disabled
1 : Interrupts enabled
7512 Group
TIMERS
Timer 1 and Timer 2
The 7512 Group has four timers: timer X, timer Y, timer 1, and
timer 2.
The division ratio of each timer or prescaler is given by 1/(n + 1),
where n is the value in the corresponding timer or prescaler latch.
All timers are count down. When the timer reaches “0016”, an underflow occurs at the next count pulse and the corresponding
timer latch is reloaded into the timer and the count is continued.
When a timer underflows, the interrupt request bit corresponding
to that timer is set to “1”.
The count source of prescaler 12 is the oscillation frequency
which is selected by timer 12 count source selection bit. The output of prescaler 12 is counted by timer 1 and timer 2, and a timer
underflow sets the interrupt request bit.
Timer X and Timer Y
Timer X and Timer Y can each select in one of four operating
modes by setting the timer XY mode register.
(1) Timer Mode
The timer counts the count source selected by Timer count source
selection bit.
b0
b7
Timer XY mode register
(TM : address 002316)
Timer X operating mode bit
b1b0
0 0: Timer mode
0 1: Pulse output mode
1 0: Event counter mode
1 1: Pulse width measurement mode
CNTR0 active edge selection bit
0: Interrupt at falling edge
Count at rising edge in event
counter mode
1: Interrupt at rising edge
Count at falling edge in event
counter mode
Timer X count stop bit
0: Count start
1: Count stop
Timer Y operating mode bit
b5b4
0 0: Timer mode
0 1: Pulse output mode
1 0: Event counter mode
1 1: Pulse width measurement mode
CNTR1 active edge selection bit
0: Interrupt at falling edge
Count at rising edge in event
counter mode
1: Interrupt at rising edge
Count at falling edge in event
counter mode
Timer Y count stop bit
0: Count start
1: Count stop
Fig. 14 Structure of timer XY mode register
b7
b0
Timer count source selection register
(TCSS : address 002816)
Timer X count source selection bit
0 : f(XIN)/16 (f(XCIN)/16 at low-speed mode)
1 : f(XIN)/2 (f(XCIN)/2 at low-speed mode)
Timer Y count source selection bit
0 : f(XIN)/16 (f(XCIN)/16 at low-speed mode)
1 : f(XIN)/2 (f(XCIN)/2 at low-speed mode)
Timer 12 count source selection bit
0 : f(XIN)/16 (f(XCIN)/16 at low-speed mode)
1 : f(XCIN)
Not used (returns “0” when read)
Fig. 15 Structure of timer count source selection register
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(2) Pulse Output Mode
The timer counts the count source selected by Timer count source
selection bit. Whenever the contents of the timer reach “0016”, the
signal output from the CNTR0 (or CNTR1) pin is inverted. If the
CNTR0 (or CNTR1) active edge selection bit is “0”, output begins
at “ H”.
If it is “1”, output starts at “L”. When using a timer in this mode, set
the corresponding port P27 ( or port P40) direction register to output mode.
(3) Event Counter Mode
Operation in event counter mode is the same as in timer mode,
except that the timer counts signals input through the CNTR0 or
CNTR1 pin.
When the CNTR0 (or CNTR1) active edge selection bit is “0”, the
rising edge of the CNTR0 (or CNTR1) pin is counted.
When the CNTR0 (or CNTR1) active edge selection bit is “1”, the
falling edge of the CNTR0 (or CNTR1) pin is counted.
(4) Pulse Width Measurement Mode
If the CNTR0 (or CNTR1) active edge selection bit is “0”, the timer
counts the selected signals by the count source selection bit while
the CNTR0 (or CNTR1) pin is at “H”. If the CNTR0 (or CNTR1) active edge selection bit is “1”, the timer counts it while the CNTR0
(or CNTR1) pin is at “L”.
The count can be stopped by setting “1” to the timer X (or timer Y)
count stop bit in any mode. The corresponding interrupt request
bit is set each time a timer underflows.
■Note
When switching the count source by the timer 12, X and Y count
source bit, the value of timer count is altered in inconsiderable
amount owing to generating of a thin pulses in the count input
signals.
Therefore, select the timer count source before set the value to
the prescaler and the timer.
7512 Group
Data bus
f(XIN)/16 (f(XCIN)/16 at low-speed mode)
f(XIN)/2 (f(XCIN)/2 at low-speed mode)
Prescaler X latch (8)
Pulse width
Timer X count source selection bit measurement Timer mode
Pulse output mode
mode
Prescaler X (8)
CNTR0 active
edge selection
“0”
bit
P27/CNTR0
Event
counter
mode
“1”
Timer X (8)
To timer X interrupt
request bit
Timer X count stop bit
To CNTR0 interrupt
request bit
CNTR0 active
edge selection “1”
bit
“0”
Q
Toggle flip-flop T
Q
R
Timer X latch write pulse
Pulse output mode
Port P27
latch
Port P27
direction register
Timer X latch
(8)
Pulse output mode
Data bus
Prescaler Y latch (8)
f(XIN)/16 (f(XCIN)/16 at low-speed mode)
f(XIN)/2 (f(XCIN)/2 at low-speed mode)
Timer Y count source selection bit
Pulse width
measurement mode
Timer mode
Pulse output mode
Prescaler Y (8)
CNTR1 active
edge selection
“0”
bit
P40/CNTR1
Event
counter
mode
“1”
Timer Y (8)
To timer Y interrupt
request bit
Timer Y count stop bit
To CNTR1 interrupt
request bit
CNTR1 active
edge selection “1”
bit
Q
Toggle flip-flop T
Q
Port P40
latch
Timer Y latch (8)
“0”
R
Timer Y latch write pulse
Pulse output mode
Port P40
direction register
Pulse output mode
Data bus
Prescaler 12 latch (8)
f(XIN)/16 (f(XCIN)/16 at low-speed mode)
f(XCIN)
Prescaler 12 (8)
Timer 1 latch (8)
Timer 2 latch (8)
Timer 1 (8)
Timer 2 (8)
To timer 2 interrupt
request bit
Timer 12 count source selection bit
To timer 1 interrupt
request bit
Fig. 16 Block diagram of timer X, timer Y, timer 1, and timer 2
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7512 Group
SERIAL I/O1
(1) Clock Synchronous Serial I/O Mode
Serial I/O1 can be used as either clock synchronous or asynchronous (UART) serial I/O1. A dedicated timer is also provided for
baud rate generation.
Clock synchronous serial I/O mode can be selected by setting the
serial I/O mode selection bit of the serial I/O1 control register (bit
6 of address 001A16) to “1”.
For clock synchronous serial I/O, the transmitter and the receiver
must use the same clock. If an internal clock is used, transfer is
started by a write signal to the TB/RB.
Data bus
Serial I/O1 control register
Address 001816
Receive buffer register
Receive buffer full flag (RBF)
Receive interrupt request (RI)
Receive shift register
P24/RXD
Address 001A16
Shift clock
Clock control circuit
P26/SCLK
XIN
Serial I/O1 synchronous
clock selection bit
Frequency division ratio 1/(n+1)
Baud rate generator
1/4
Address 001C16
BRG count source selection bit
1/4
P27/SRDY1
F/F
Clock control circuit
Falling-edge detector
Shift clock
P25/TXD
Transmit shift register
Transmit shift completion flag (TSC)
Transmit interrupt source selection bit
Transmit interrupt request (TI)
Transmit buffer register
Transmit buffer empty flag (TBE)
Serial I/O1 status register
Address 001916
Address 001816
Data bus
Fig. 17 Block diagram of clock synchronous serial I/O1
Transfer shift clock
(1/2 to 1/2048 of the internal
clock, or an external clock)
Serial output TxD
D0
D1
D2
D3
D4
D5
D6
D7
Serial input RxD
D0
D1
D2
D3
D4
D5
D6
D7
Receive enable signal SRDY1
Write pulse to receive/transmit
buffer register (address 001816)
TBE = 0
TBE = 1
TSC = 0
RBF = 1
TSC = 1
Overrun error (OE)
detection
Notes 1: As the transmit interrupt (TI), either when the transmit buffer has emptied (TBE=1) or after the transmit shift operation has
ended (TSC=1), by setting the transmit interrupt source selection bit (TIC) of the serial I/O1 control register.
2: If data is written to the transmit buffer register when TSC=0, the transmit clock is generated continuously and serial data
is output continuously from the TxD pin.
3: The receive interrupt (RI) is set when the receive buffer full flag (RBF) becomes “1” .
Fig. 18 Operation of clock synchronous serial I/O1 function
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7512 Group
(2) Asynchronous Serial I/O (UART) Mode
two buffers have the same address in memory. Since the shift register cannot be written to or read from directly, transmit data is
written to the transmit buffer register, and receive data is read
from the receive buffer register.
The transmit buffer register can also hold the next data to be
transmitted, and the receive buffer register can hold a character
while the next character is being received.
Clock asynchronous serial I/O mode (UART) can be selected by
clearing the serial I/O1 mode selection bit (b6) of the serial I/O1
control register to “0”.
Eight serial data transfer formats can be selected, and the transfer
formats used by a transmitter and receiver must be identical.
The transmit and receive shift registers each have a buffer, but the
Data bus
Address 001816
OE
P24/RXD
Serial I/O1 control register Address 001A16
Receive buffer full flag (RBF)
Receive interrupt request (RI)
Receive buffer register
Character length selection bit
ST detector
7 bits
Receive shift register
1/16
8 bits
PE FE
SP detector
Clock control circuit
UART control register
Address 001B16
Serial I/O1 synchronous clock selection bit
P26/SCLK1
XIN
BRG count source selection bit Frequency division ratio 1/(n+1)
Baud rate generator
Address 001C16
1/4
ST/SP/PA generator
1/16
P25/TXD
Transmit shift register
Transmit interrupt source selection bit
Transmit interrupt request (TI)
Transmit buffer register
Transmit buffer empty flag (TBE)
Serial I/O1 status register Address 001916
Character length selection bit
Address 001816
Data bus
Fig. 19 Block diagram of UART serial I/O1
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REJ03B0122-0101
Transmit shift completion flag (TSC)
7512 Group
Transmit or receive clock
Transmit buffer write
signal
TBE=0
TSC=0
TBE=1
Serial output TXD
TBE=0
TBE=1
ST
D0
D1
SP
TSC=1
ST
D0
Receive buffer read
signal
SP
D1
1 start bit
7 or 8 data bit
1 or 0 parity bit
1 or 2 stop bit (s)
Generated at 2nd bit in 2-stop-bit mode
RBF=0
RBF=1
Serial input RXD
ST
D0
D1
SP
RBF=1
ST
D0
D1
SP
Notes 1: Error flag detection occurs at the same time that the RBF flag becomes “1” (at 1st stop bit, during reception).
2: As the transmit interrupt (TI), when either the TBE or TSC flag becomes “1”, can be selected to occur depending on the setting of the transmit
interrupt source selection bit (TIC) of the serial I/O1 control register.
3: The receive interrupt (RI) is set when the RBF flag becomes “1”.
4: After data is written to the transmit buffer when TSC=1, 0.5 to 1.5 cycles of the data shift cycle is necessary until changing to TSC=0.
Fig. 20 Operation of UART serial I/O1 function
[Transmit Buffer Register/Receive Buffer
Register (TB/RB)] 001816
The transmit buffer register and the receive buffer register are located at the same address. The transmit buffer is write-only and
the receive buffer is read-only. If a character bit length is 7 bits, the
MSB of data stored in the receive buffer is “0”.
[Serial I/O1 Status Register (SIOSTS)] 001916
The read-only serial I/O1 status register consists of seven flags
(bits 0 to 6) which indicate the operating status of the serial I/O1
function and various errors.
Three of the flags (bits 4 to 6) are valid only in UART mode.
The receive buffer full flag (bit 1) is cleared to “0” when the receive
buffer register is read.
If there is an error, it is detected at the same time that data is
transferred from the receive shift register to the receive buffer register, and the receive buffer full flag is set. A write to the serial I/O1
status register clears all the error flags OE, PE, FE, and SE (bit 3
to bit 6, respectively). Writing “0” to the serial I/O1 enable bit SIOE
(bit 7 of the serial I/O1 control register) also clears all the status
flags, including the error flags.
Bits 0 to 6 of the serial I/O1 status register are initialized to “0” at
reset, but if the transmit enable bit (bit 4) of the serial I/O1 control
register has been set to “1”, the transmit shift completion flag (bit
2) and the transmit buffer empty flag (bit 0) become “1”.
Feb 18, 2005 page 22 of 85
REJ03B0122-0101
Serial I/O1 Control Register (SIOCON)] 001A16
The serial I/O1 control register consists of eight control bits for the
serial I/O1 function.
[UART Control Register (UARTCON)] 001B16
The UART control register consists of four control bits (bits 0 to 3)
which are valid when asynchronous serial I/O is selected and set
the data format of an data transfer and one bit (bit 4) which is always valid and sets the output structure of the P25/TXD pin.
[Baud Rate Generator (BRG)] 001C16
The baud rate generator determines the baud rate for serial transfer.
The baud rate generator divides the frequency of the count source
by 1/(n + 1), where n is the value written to the baud rate generator.
■Note
When using the serial I/O1, clear the I2C-BUS interface enable bit
to “0” or the SCL/SDA pin selection bit to “0”.
7512 Group
b7
b0
Serial I/O1 status register
(SIOSTS : address 001916)
Transmit buffer empty flag (TBE)
0: Buffer full
1: Buffer empty
Receive buffer full flag (RBF)
0: Buffer empty
1: Buffer full
Transmit shift completion flag (TSC)
0: Transmit shift in progress
1: Transmit shift completed
Overrun error flag (OE)
0: No error
1: Overrun error
Parity error flag (PE)
0: No error
1: Parity error
Framing error flag (FE)
0: No error
1: Framing error
Summing error flag (SE)
0: (OE) U (PE) U (FE)=0
1: (OE) U (PE) U (FE)=1
Not used (returns “1” when read)
b7
b0
UART control register
(UARTCON : address 001B16)
Character length selection bit (CHAS)
0: 8 bits
1: 7 bits
b7
b0
Serial I/O1 control register
(SIOCON : address 001A16)
BRG count source selection bit (CSS)
0: f(XIN)
1: f(XIN)/4
Serial I/O1 synchronous clock selection bit (SCS)
0: BRG output divided by 4 when clock synchronous
serial I/O1 is selected, BRG output divided by 16
when UART is selected.
1: External clock input when clock synchronous serial
I/O1 is selected, external clock input divided by 16
when UART is selected.
SRDY1 output enable bit (SRDY)
0: P27 pin operates as ordinary I/O pin
1: P27 pin operates as SRDY1 output pin
Transmit interrupt source selection bit (TIC)
0: Interrupt when transmit buffer has emptied
1: Interrupt when transmit shift operation is completed
Transmit enable bit (TE)
0: Transmit disabled
1: Transmit enabled
Receive enable bit (RE)
0: Receive disabled
1: Receive enabled
Serial I/O1 mode selection bit (SIOM)
0: Clock asynchronous (UART) serial I/O
1: Clock synchronous serial I/O
Serial I/O1 enable bit (SIOE)
0: Serial I/O1 disabled
(pins P24 to P27 operate as ordinary I/O pins)
1: Serial I/O1 enabled
(pins P24 to P27 operate as serial I/O1 pins)
Parity enable bit (PARE)
0: Parity checking disabled
1: Parity checking enabled
Parity selection bit (PARS)
0: Even parity
1: Odd parity
Stop bit length selection bit (STPS)
0: 1 stop bit
1: 2 stop bits
P25/TXD P-channel output disable bit (POFF)
0: CMOS output (in output mode)
1: N-channel open drain output (in output mode)
Not used (return “1” when read)
Fig. 21 Structure of serial I/O1 control registers
■Notes
When setting the transmit enable bit to "1", the serial I/O1 transmit
interrupt request bit is automatically set to "1". When not requiring
the interrupt occurrence synchronized with the transmission enabled, take the following sequence.
(1) Set the serial I/O1 transmit interrupt enable bit to “0” (disabled).
(2) Set the transmit enable bit to "1".
Feb 18, 2005 page 23 of 85
REJ03B0122-0101
(3) Set the serial I/O1 transmit interrupt request bit to “0” after 1 or
more instructions have been executed.
(4) Set the serial I/O1 transmit interrupt enable bit to “1” (enabled).
7512 Group
●Serial I/O2
The serial I/O2 can be operated only as the clock synchronous
type. As a synchronous clock for serial transfer, either internal clock
or external clock can be selected by the serial I/O2 synchronous
clock selection bit (b6) of serial I/O2 control register 1.
The internal clock incorporates a dedicated divider and permits
selecting 6 types of clock by the internal synchronous clock selection bits (b2, b1, b0) of serial I/O2 control register 1.
Regarding SOUT2 and SCLK2 being output pins, either CMOS output
format or N-channel open-drain output format can be selected by
the P01/S OUT2, P02/S CLK2 P-channel output disable bit (b7) of
serial I/O2 control register 1.
When the internal clock has been selected, a transfer starts by a
write signal to the serial I/O2 register (address 001716). After completion of data transfer, the level of the SOUT2 pin goes to high impedance automatically but bit 7 of the serial I/O2 control register 2 is
not set to "1" automatically.
When the external clock has been selected, the contents of the
serial I/O2 register is continuously sifted while transfer clocks are
input. Accordingly, control the clock externally. Note that the SOUT2
pin does not go to high impedance after completion of data transfer.
To cause the SOUT2 pin to go to high impedance in the case where
the external clock is selected, set bit 7 of the serial I/O2 control
register 2 to "1" when SCLK2 is "H" after completion of data transfer.
After the next data transfer is started (the transfer clock falls), bit 7
of the serial I/O2 control register 2 is set to "0" and the SOUT2 pin is
put into the active state.
When the number of bits (1 to 8 bits) selected by the optional transfer bit is transferred regardless of the internal clock to external clock,
the serial I/O2 transmission/reception completion flag (Note) is set
to "1" and the interrupt request bit is set to "1". The serial I/O2
transmission/reception completion flag is not automatically set to
"0", even if the next transmission starts. In case of a fractional number of bits less than 8 bits as the last data, the received data to be
stored in the serial I/O2 register becomes a fractional number of
bits close to MSB if the transfer direction selection bit of serial I/O2
control register 1 is LSB first, or a fractional number of bits close to
LSB if the said bit is MSB first. For the remaining bits, the previously received data is shifted.
At transmit operation using the clock synchronous serial I/O, the
SCMP2 signal can be output by comparing the state of the transmit
pin SOUT2 with the state of the receive pin SIN2 in synchronization
with a rise of the transfer clock. If the output level of the SOUT2 pin is
equal to the input level to the SIN2 pin, "L" is output from the SCMP2
pin. If not, "H" is output. At this time, an INT2 interrupt request can
also be generated. Select a valid edge by bit 2 of the interrupt edge
selection register (address 003A16).
Note: After reset is released, the serial I/O2 transmission/reception
completion flag is undefined. After the initial setting of serial I/O2 is
completed, set this flag to "0".
[Serial I/O2 Control Registers 1, 2] SIO2CON1 / SIO2CON2
The serial I/O2 control registers 1 and 2 are containing various selection bits for serial I/O2 control as shown in Figure 22.
Feb 18, 2005 page 24 of 85
REJ03B0122-0101
b7
b0
Serial I/O2 control register 1
(SIO2CON1 : address 001516)
Internal synchronous clock selection bits
b2 b1 b0
0
0
0
0
1
1
0
0
1
1
1
1
0: f(XIN)/8 (f(XCIN)/8 in low-speed mode)
1: f(XIN)/16 (f(XCIN)/16 in low-speed mode)
0: f(XIN)/32 (f(XCIN)/32 in low-speed mode)
1: f(XIN)/64 (f(XCIN)/64 in low-speed mode)
0: f(XIN)/128 f(XCIN)/128 in low-speed mode)
1: f(XIN)/256 (f(XCIN)/256 in low-speed mode)
Serial I/O2 port selection bit
0: I/O port
1: SOUT2,SCLK2 output pin
SRDY2 output enable bit
0: P03 pin is normal I/O pin
1: P03 pin is SRDY2 output pin
Transfer direction selection bit
0: LSB first
1: MSB first
Serial I/O2 synchronous clock selection bit
0: External clock
1: Internal clock
P01/SOUT2 ,P02/SCLK2 P-channel output disable bit
0: CMOS output (in output mode)
1: N-channel open-drain output (in output mode )
b7
b0
Serial I/O2 control register 2
(SIO2CON2 : address 001616)
Optional transfer bits
b2 b1 b0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0: 1 bit
1: 2 bit
0: 3 bit
1: 4 bit
0: 5 bit
1: 6 bit
0: 7 bit
1: 8 bit
Not used ( returns "0" when read)
Serial I/O2 transmission reception completion flag
0: Transmission/reception not completed
1: Transmission/reception completed
Serial I/O2 I/O comparison signal control bit
0: P43 I/O
1: SCMP2 output
SOUT2 pin control bit (P01)
0: Output active
1: Output high-impedance
Fig. 22 Structure of Serial I/O2 control registers 1, 2
7512 Group
Internal synchronous
clock selection bit
1/8
XCIN
1/16
"10"
Divider
Main clock division ratio
selection bits (Note)
"00"
"01"
XIN
Data bus
1/32
1/64
1/128
1/256
P03 latch
Serial I/O2 synchronous
clock selection bit
"0"
SRDY2
"1"
SRDY2 output enable bit
"1"
Synchronous circuit
SCLK2
P03/SRDY2
"0"
External clock
P02 latch
Optional transfer bits (3)
"0"
P02/SCLK2
Serial I/O2
interrupt request
Serial I/O counter 2 (3)
"1"
Serial I/O2 port selection bit
P01 latch
"0"
P01/SOUT2
"1"
Serial I/O2 port selection bit
Serial I/O2 register (8)
P00/SIN2
P43 latch
"0"
D
P43/SCMP2/INT2
Q
"1"
Serial I/O2 I/O comparison
signal control bit
Note: Either high-speed, middle-speed or low-speed mode is selected by bits 6 and 7 of CPU mode register.
Fig. 23 Block diagram of Serial I/O2
Transfer clock (Note 1)
Write-in signal to
serial I/O2 register
(Note 2)
Serial I/O2 output SOUT2
D0
D1
.
D2
D3
D4
D5
D6
D7
Serial I/O2 input SIN2
Receive enable signal SRDY2
Serial I/O2 interrupt request bit set
Notes 1: When the internal clock is selected as a transfer clock, the f(XIN) clock division (f(XCIN) in low-speed mode) can be selected
by setting bits 0 to 2 of serial I/O2 control register 1.
2: When the internal clock is selected as a transfer clock, the SCOUT2 pin has high impedance after transfer completion.
Fig. 24 Timing chart of Serial I/O2
Feb 18, 2005 page 25 of 85
REJ03B0122-0101
7512 Group
SCMP2
SCLK2
SOUT2
SIN2
Judgement of I/O data comparison
Fig. 25 SCMP2 output operation
Feb 18, 2005 page 26 of 85
REJ03B0122-0101
7512 Group
MULTI-MASTER I2C-BUS INTERFACE
Table 7 Multi-master I2C-BUS interface functions
The multi-master I2C-BUS interface is a serial communications circuit, conforming to the Philips I2C-BUS data transfer format. This
interface, offering both arbitration lost detection and a synchronous
functions, is useful for the multi-master serial communications.
Figure 26 shows a block diagram of the multi-master I2C-BUS interface and Table 7 lists the multi-master I 2 C-BUS interface
functions.
This multi-master I2C-BUS interface consists of the I2C address
register, the I 2C data shift register, the I2C clock control register,
the I2C control register, the I2C status register, the I2C start/stop
condition control register and other control circuits.
When using the multi-master I 2 C-BUS interface, set 1 MHz or
more to φ .
Note: Renesas Technology Corporation assumes no responsibility for infringement of any third-party’s rights or originating in the use of the
connection control function between the I2C-BUS interface and the
ports SCL1, SCL2, SDA1 and SDA2 with the bit 6 of I2C control register (002E16).
b7
Item
Format
Communication mode
SCL clock frequency
Function
In conformity with Philips I2C-BUS
standard:
10-bit addressing format
7-bit addressing format
High-speed clock mode
Standard clock mode
In conformity with Philips I2C-BUS
standard:
Master transmission
Master reception
Slave transmission
Slave reception
16.1 kHz to 400 kHz (at φ = 4 MHz)
System clock φ = f(XIN)/2 (high-speed mode)
φ = f(XIN)/8 (middle-speed mode)
I2C address register
b0
Interrupt
generating
circuit
SAD6 SAD5 SAD4 SAD3 SAD2 SAD1 SAD0 RWB
S0D
Interrupt request signal
(IICIRQ)
Address comparator
Noise
elimination
circuit
Serial data
(SDA)
Data
control
circuit
b0
b7
I2C data shift register
b7
b0
S0
AL AAS AD0 LRB
MST TRX BB PIN
SIS SIP SSC4 SSC3 SSC2 SSC1 SSC0
S2D
AA
AA
A
AAAA
A
I2C status register
S1
I2C start/stop condition
control register
Internal data bus
b7
b0
ACS SCF WEB TOF TOM
S3
AL
circuit
BB
circuit
I2C additional register
Serial
clock
(SCL)
Noise
elimination
circuit
Clock
control
circuit
b7
ACK
b0
ACK FAST CCR4 CCR3 CCR2 CCR1 CCR0
BIT MODE
S2
I2C clock control register
Clock
division
b7
b0
TISS TSEL 10BIT
SAD
ALS
ES0 BC2 BC1 BC0
S1D I 2 C control register
Operation status
selection
System
clock (φ)
Bit counter
Fig. 26 Block diagram of multi-master I2C-BUS interface
✽ : Purchase of Renesas Technology Corporation's I2C components conveys a license under the Philips I2C Patent Rights to use these components
an I2C system , provided that the system conforms to the I2C Standard Specification as defined by Philips.
Feb 18, 2005 page 27 of 85
REJ03B0122-0101
7512 Group
[I2C Data Shift Register (S0)] 002B16
The I2C data shift register (S0 : address 002B16) is an 8-bit shift
register to store receive data and write transmit data.
When transmit data is written into this register, it is transferred to
the outside from bit 7 in synchronization with the SCL clock, and
each time one-bit data is output, the data of this register are
shifted by one bit to the left. When data is received, it is input to
this register from bit 0 in synchronization with the SCL clock, and
each time one-bit data is input, the data of this register are shifted
by one bit to the left. The minimum 2 machine cycles are required
from the rising of the SCL clock until input to this register.
The I2C data shift register is in a write enable status only when the
I2C-BUS interface enable bit (ES0 bit : bit 3 of address 002E16) of
the I2C control register is “1”. The bit counter is reset by a write instruction to the I2C data shift register. When both the ES0 bit and
the MST bit of the I2C status register (address 002D16) are “1”, the
SCL is output by a write instruction to the I2C data shift register.
Reading data from the I2C data shift register is always enabled regardless of the ES0 bit value.
[I2C Address Register (S0D)] 002C16
The I 2C address register (address 002C 16) consists of a 7-bit
slave address and a read/write bit. In the addressing mode, the
slave address written in this register is compared with the address
data to be received immediately after the START condition is detected.
•Bit 0: Read/write bit (RWB)
This is not used in the 7-bit addressing mode. In the 10-bit addressing mode, the first address data to be received is compared
with the contents (SAD6 to SAD0 + RWB) of the I2C address register.
The RWB bit is cleared to “0” automatically when the stop condition is detected.
•Bits 1 to 7: Slave address (SAD0–SAD6)
These bits store slave addresses. Regardless of the 7-bit addressing mode or the 10-bit addressing mode, the address data
transmitted from the master is compared with these bit's contents.
Feb 18, 2005 page 28 of 85
REJ03B0122-0101
b7
b0
SAD6 SAD5 SAD4 SAD3 SAD2 SAD1 SAD0 RWB
I2C address register
(S0D: address 002C 16)
Read/write bit
Slave address
Fig. 27 Structure of I2C address register
7512 Group
I2 C
Note: Do not write data into the
clock control register during transfer. If
data is written during transfer, the I 2C clock generator is reset, so
that data cannot be transferred normally.
Feb 18, 2005 page 29 of 85
REJ03B0122-0101
I2C clock control register
(S2 : address 002F16)
SCL frequency control bits
Refer to Table 8.
SCL mode specification bit
0 : Standard clock mode
1 : High-speed clock mode
ACK bit
0 : ACK is returned.
1 : ACK is not returned.
ACK clock bit
0 : No ACK clock
1 : ACK clock
Fig. 28 Structure of I2C clock control register
Table 8 Set values of I 2 C clock control register and SCL
frequency
Setting value of
CCR4–CCR0
CCR4 CCR3 CCR2 CCR1 CCR0
SCL frequency
(at φ = 4 MHz, unit : kHz)
Standard clock High-speed clock
mode
mode
0
0
0
0
Setting disabled
Setting disabled
0
0
0
0
1
Setting disabled
Setting disabled
0
0
0
1
0
Setting disabled
Setting disabled
0
0
0
1
1
– (Note 2)
333
0
0
1
0
0
– (Note 2)
250
0
0
1
0
1
100
400 (Note 3)
0
0
1
1
0
83.3
166
…
0
…
•Bit 7: ACK clock bit (ACK)
This bit specifies the mode of acknowledgment which is an acknowledgment response of data transfer. When this bit is set to
“0”, the no ACK clock mode is selected. In this case, no ACK clock
occurs after data transmission. When the bit is set to “1”, the ACK
clock mode is selected and the master generates an ACK clock
each completion of each 1-byte data transfer. The device for
transmitting address data and control data releases the SDA at
the occurrence of an ACK clock (makes SDA “H”) and receives the
ACK bit generated by the data receiving device.
b0
ACK FAST CCR4 CCR3 CCR2 CCR1 CCR0
BIT MODE
…
✽ACK clock: Clock for acknowledgment
b7
ACK
…
The I2C clock control register (address 002F16) is used to set ACK
control, SCL mode and SCL frequency.
•Bits 0 to 4: SCL frequency control bits (CCR0–CCR4)
These bits control the SCL frequency. Refer to Table 8.
•Bit 5: SCL mode specification bit (FAST MODE)
This bit specifies the SCL mode. When this bit is set to “0”, the
standard clock mode is selected. When the bit is set to “1”, the
high-speed clock mode is selected.
When connecting the bus of the high-speed mode I2C bus standard (maximum 400 kbits/s), use 8 MHz or more oscillation
frequency f(XIN) and 2 division clock.
•Bit 6: ACK bit (ACK BIT)
This bit sets the SDA status when an ACK clock✽ is generated.
When this bit is set to “0”, the ACK return mode is selected and
SDA goes to “L” at the occurrence of an ACK clock. When the bit
is set to “1”, the ACK non-return mode is selected. The SDA is
held in the “H” status at the occurrence of an ACK clock.
However, when the slave address agree with the address data in
the reception of address data at ACK BIT = “0”, the SDA is automatically made “L” (ACK is returned). If there is a disagreement
between the slave address and the address data, the SDA is automatically made “H” (ACK is not returned).
…
[I2C Clock Control Register (S2)] 002F16
500/CCR value
(Note 3)
1
1
1
0
1
17.2
1000/CCR value
(Note 3)
34.5
1
1
1
1
0
16.6
33.3
1
1
1
1
1
16.1
32.3
Notes 1: Duty of SCL clock output is 50 %. The duty becomes 35 to 45 %
only when the high-speed clock mode is selected and CCR value
= 5 (400 kHz, at φ = 4 MHz). “H” duration of the clock fluctuates
from –4 to +2 machine cycles in the standard clock mode, and
fluctuates from –2 to +2 machine cycles in the high-speed clock
mode. In the case of negative fluctuation, the frequency does not
increase because “L” duration is extended instead of “H” duration
reduction.
These are value when SCL clock synchronization by the synchronous function is not performed. CCR value is the decimal
notation value of the SCL frequency control bits CCR4 to CCR0.
2: Each value of SCL frequency exceeds the limit at φ = 4 MHz or
more. When using these setting value, use φ of 4 MHz or less.
3: The data formula of SCL frequency is described below:
φ/(8 ✕ CCR value) Standard clock mode
φ/(4 ✕ CCR value) High-speed clock mode (CCR value ≠ 5)
φ/(2 ✕ CCR value) High-speed clock mode (CCR value = 5)
Do not set 0 to 2 as CCR value regardless of φ frequency.
Set 100 kHz (max.) in the standard clock mode and 400 kHz
(max.) in the high-speed clock mode to the SCL frequency by
setting the SCL frequency control bits CCR4 to CCR0.
7512 Group
[I2C Control Register (S1D)] 002E16
The I2C control register (address 002E16) controls data communication format.
•Bits 0 to 2: Bit counter (BC0–BC2)
These bits decide the number of bits for the next 1-byte data to be
transmitted. The I2C interrupt request signal occurs immediately
after the number of count specified with these bits (ACK clock is
added to the number of count when ACK clock is selected by ACK
clock bit (bit 7 of address 002F 16)) have been transferred, and
BC0 to BC2 are returned to “0002”.
Also when a START condition is received, these bits become
“0002” and the address data is always transmitted and received in
8 bits.
•Bit 3: I2C interface enable bit (ES0)
This bit enables to use the multi-master I2C-BUS interface. When
this bit is set to “0”, the use disable status is provided, so that the
SDA and the SCL become high-impedance. When the bit is set to
“1”, use of the interface is enabled.
When ES0 = “0”, the following is performed.
• PIN = “1”, BB = “0” and AL = “0” are set (which are bits of the I2C
status register at address 002D16 ).
• Writing data to the I2C data shift register (address 002B16) is disabled.
•Bit 4: Data format selection bit (ALS)
This bit decides whether or not to recognize slave addresses.
When this bit is set to “0”, the addressing format is selected, so
that address data is recognized. When a match is found between
a slave address and address data as a result of comparison or
when a general call (refer to “I 2C Status Register”, bit 1) is received, transfer processing can be performed. When this bit is set
to “1”, the free data format is selected, so that slave addresses are
not recognized.
•Bit 5: Addressing format selection bit (10BIT SAD)
This bit selects a slave address specification format. When this bit
is set to “0”, the 7-bit addressing format is selected. In this case,
only the high-order 7 bits (slave address) of the I2C address register (address 002C16) are compared with address data. When this
bit is set to “1”, the 10-bit addressing format is selected, and all
the bits of the I 2C address register are compared with address
data.
•Bit 6: SDA/SCL pin selection bit
This bit selects the input/output pins of SCL and SDA of the multimaster I2C-BUS interface.
•Bit 7: I2C-BUS interface pin input level selection bit
This bit selects the input level of the SCL and SDA pins of the
multi-master I2C-BUS interface.
TSEL
SCL1/P23
SCL
SCL2/TxD/P25
Multi-master
I2C-BUS interface
TSEL
TSEL
SDA1/P22
SDA
SDA2/RxD/P24
TSEL
Fig. 29 SDA/SCL pin selection bit
b7
TISS TSEL
b0
10 BIT
SAD
ALS ES0 BC2 BC1 BC0
I2C control register
(S1D : address 002E16)
Bit counter (Number of
transmit/receive bits)
b2 b1 b0
0 0 0 : 8
0 0 1 : 7
0 1 0 : 6
0 1 1 : 5
1 0 0 : 4
1 0 1 : 3
1 1 0 : 2
1 1 1 : 1
I2C-BUS interface
enable bit
0 : Disabled
1 : Enabled
Data format selection bit
0 : Addressing format
1 : Free data format
Addressing format
selection bit
0 : 7-bit addressing
format
1 : 10-bit addressing
format
SDA/SCL pin selection bit
0 : Connect to ports P22, P23
1 : Connect to ports P24, P25
I2C-BUS interface pin input
level selection bit
0 : CMOS input
1 : SMBUS input
Fig. 30 Structure of I2C control register
Feb 18, 2005 page 30 of 85
REJ03B0122-0101
7512 Group
[I2C Status Register (S1)] 002D16
The I2C status register (address 002D16) controls the I2C-BUS interface status. The low-order 4 bits are read-only bits and the
high-order 4 bits can be read out and written to.
Set “00002” to the low-order 4 bits, because these bits become the
reserved bits at writing.
•Bit 0: Last receive bit (LRB)
This bit stores the last bit value of received data and can also be
used for ACK receive confirmation. If ACK is returned when an
ACK clock occurs, the LRB bit is set to “0”. If ACK is not returned,
this bit is set to “1”. Except in the ACK mode, the last bit value of
received data is input. The state of this bit is changed from “1” to
“0” by executing a write instruction to the I2C data shift register
(address 002B16).
•Bit 1: General call detecting flag (AD0)
When the ALS bit is “0”, this bit is set to “1” when a general call✽
whose address data is all “0” is received in the slave mode. By a
general call of the master device, every slave device receives control data after the general call. The AD0 bit is set to “0” by
detecting the STOP condition or START condition, or reset.
✽General call: The master transmits the general call address “0016 ” to all
slaves.
•Bit 2: Slave address comparison flag (AAS)
This flag indicates a comparison result of address data when the
ALS bit is “0”.
(1)In the slave receive mode, when the 7-bit addressing format is
selected, this bit is set to “1” in one of the following conditions:
• The address data immediately after occurrence of a START
condition agrees with the slave address stored in the high-order 7 bits of the I2C address register (address 002C16).
• A general call is received.
(2)In the slave receive mode, when the 10-bit addressing format is
selected, this bit is set to “1” with the following condition:
• When the address data is compared with the I2C address register (8 bits consisting of slave address and RWB bit), the first
bytes agree.
(3)This bit is set to “0” by executing a write instruction to the I 2C
data shift register (address 002B16) when ES0 is set to “1” or
reset.
•Bit 3: Arbitration lost✽ detecting flag (AL)
In the master transmission mode, when the SDA is made “L” by
any other device, arbitration is judged to have been lost, so that
this bit is set to “1”. At the same time, the TRX bit is set to “0”, so
that immediately after transmission of the byte whose arbitration
was lost is completed, the MST bit is set to “0”. The arbitration lost
can be detected only in the master transmission mode. When arbitration is lost during slave address transmission, the TRX bit is
set to “0” and the reception mode is set. Consequently, it becomes
possible to detect the agreement of its own slave address and address data transmitted by another master device.
✽Arbitration lost :The status in which communication as a master is disabled.
Feb 18, 2005 page 31 of 85
REJ03B0122-0101
•Bit 4: SCL pin low hold bit (PIN)
This bit generates an interrupt request signal. Each time 1-byte
data is transmitted, the PIN bit changes from “1” to “0”. At the
same time, an interrupt request signal occurs to the CPU. The PIN
bit is set to “0” in synchronization with a falling of the last clock (including the ACK clock) of an internal clock and an interrupt
request signal occurs in synchronization with a falling of the PIN
bit. When the PIN bit is “0”, the SCL is kept in the “0” state and
clock generation is disabled. Figure 32 shows an interrupt request
signal generating timing chart.
The PIN bit is set to “1” in one of the following conditions:
• Executing a write instruction to the I2 C data shift register (address 002B16). (This is the only condition which the prohibition of
the internal clock is released and data can be communicated except for the start condition detection.)
• When the ES0 bit is “0”
• At reset
• When writing “1” to the PIN bit by software
The conditions in which the PIN bit is set to “0” are shown below:
• Immediately after completion of 1-byte data transmission (including when arbitration lost is detected)
• Immediately after completion of 1-byte data reception
• In the slave reception mode, with ALS = “0” and immediately after completion of slave address agreement or general call
address reception
• In the slave reception mode, with ALS = “1” and immediately after completion of address data reception
•Bit 5: Bus busy flag (BB)
This bit indicates the status of use of the bus system. When this
bit is set to “0”, this bus system is not busy and a START condition
can be generated. The BB flag is set/reset by the SCL, SDA pins
input signal regardless of master/slave. This flag is set to “1” by
detecting the start condition, and is set to “0” by detecting the stop
condition. The condition of these detecting is set by the start/stop
condition setting bits (SSC4–SSC0) of the I2C start/stop condition
control register (address 003016). When the ES0 bit of the I 2C
control register (address 002E16) is “0” or reset, the BB flag is set
to “0”.
For the writing function to the BB flag, refer to the sections
“START Condition Generating Method” and “STOP Condition Generating Method” described later.
7512 Group
•Bit 6: Communication mode specification bit (transfer direction specification bit: TRX)
This bit decides a direction of transfer for data communication.
When this bit is “0”, the reception mode is selected and the data of
a transmitting device is received. When the bit is “1”, the transmission mode is selected and address data and control data are
output onto the SDA in synchronization with the clock generated
on the SCL.
This bit is set/reset by software and hardware. About set/reset by
hardware is described below. This bit is set to “1” by hardware
when all the following conditions are satisfied:
• When ALS is “0”
• In the slave reception mode or the slave transmission mode
• When the R/W bit reception is “1”
This bit is set to “0” in one of the following conditions:
• When arbitration lost is detected.
• When a STOP condition is detected.
• When writing “1” to this bit by software is invalid by the START
condition duplication preventing function (Note).
• With MST = “0” and when a START condition is detected.
• With MST = “0” and when ACK non-return is detected.
• At reset
•Bit 7: Communication mode specification bit (master/slave
specification bit: MST)
This bit is used for master/slave specification for data communication. When this bit is “0”, the slave is specified, so that a START
condition and a STOP condition generated by the master are received, and data communication is performed in synchronization
with the clock generated by the master. When this bit is “1”, the
master is specified and a START condition and a STOP condition
are generated. Additionally, the clocks required for data communication are generated on the SCL.
This bit is set to “0” in one of the following conditions.
• Immediately after completion of 1-byte data transfer when arbitration lost is detected
• When a STOP condition is detected.
• Writing “1” to this bit by software is invalid by the START condition duplication preventing function (Note).
• At reset
Note: START condition duplication preventing function
The MST, TRX, and BB bits is set to “1” at the same time after confirming that the BB flag is “0” in the procedure of a START condition
occurrence. However, when a START condition by another master
device occurs and the BB flag is set to “1” immediately after the contents of the BB flag is confirmed, the START condition duplication
preventing function makes the writing to the MST and TRX bits invalid. The duplication preventing function becomes valid from the
rising of the BB flag to reception completion of slave address.
b7
b0
MST TRX BB PIN AL AAS AD0 LRB
I2C status register
(S1 : address 002D 16)
Last receive bit (Note)
0 : Last bit = “0”
1 : Last bit = “1”
General call detecting flag
(Note)
0 : No general call detected
1 : General call detected
Slave address comparison flag
(Note)
0 : Address disagreement
1 : Address agreement
Arbitration lost detecting flag
(Note)
0 : Not detected
1 : Detected
SCL pin low hold bit
0 : SCL pin low hold
1 : SCL pin low release
Bus busy flag
0 : Bus free
1 : Bus busy
Communication mode
specification bits
00 : Slave receive mode
01 : Slave transmit mode
10 : Master receive mode
11 : Master transmit mode
Note: These bits and flags can be read out, but cannot
be written.
Write “0” to these bits at writing.
Fig. 31 Structure of I2C status register
SCL
PIN
IICIRQ
Fig. 32 Interrupt request signal generating timing
Feb 18, 2005 page 32 of 85
REJ03B0122-0101
7512 Group
START Condition Generating Method
START/STOP Condition Detecting Operation
When writing “1” to the MST, TRX, and BB bits of the I2C status
register (address 002D16) at the same time after writing the slave
address to the I2 C data shift register (address 002B16) with the
condition in which the ES0 bit of the I2C control register (address
002E16) is “1” and the BB flag is “0”, a START condition occurs.
After that, the bit counter becomes “0002” and an SCL for 1 byte is
output. The START condition generating timing is different in the
standard clock mode and the high-speed clock mode. Refer to
Figure 33, the START condition generating timing diagram, and
Table 9, the START condition generating timing table.
The START/STOP condition detection operations are shown in
Figures 35, 36, and Table 11. The START/STOP condition is set
by the START/STOP condition set bit.
The START/STOP condition can be detected only when the input
signal of the SCL and SDA pins satisfy three conditions: SCL release time, setup time, and hold time (see Table 11).
The BB flag is set to “1” by detecting the START condition and is
reset to “0” by detecting the STOP condition.
The BB flag set/reset timing is different in the standard clock mode
and the high-speed clock mode. Refer to Table 11, the BB flag set/
reset time.
Note: When a STOP condition is detected in the slave mode (MST = 0), an
interrupt request signal “IICIRQ” occurs to the CPU.
I2C status register
write signal
SCL
AAA
Setup
time
SDA
Fig. 33 START condition generating timing diagram
Table 9 START condition generating timing table
Standard clock mode High-speed clock mode
Item
5.0 µs (20 cycles)
2.5 µs (10 cycles)
Setup time
5.0 µs (20 cycles)
2.5 µs (10 cycles)
Hold time
Note: Absolute time at φ = 4 MHz. The value in parentheses denotes the
number of φ cycles.
STOP Condition Generating Method
When the ES0 bit of the I2C control register (address 002E16) is
“1”, write “1” to the MST and TRX bits, and write “0” to the BB bit
of the I2C status register (address 002D16) simultaneously. Then a
STOP condition occurs. The STOP condition generating timing is
different in the standard clock mode and the high-speed clock
mode. Refer to Figure 34, the STOP condition generating timing
diagram, and Table 10, the STOP condition generating timing
table.
I2C status register
write signal
SCL
SDA
Setup
time
AAA
AAA
Hold time
Fig. 34 STOP condition generating timing diagram
Table 10 STOP condition generating timing table
Standard clock mode
High-speed clock mode
Item
5.0 µs (20 cycles)
3.0 µs (12 cycles)
Setup time
4.5 µs (18 cycles)
2.5 µs (10 cycles)
Hold time
Note: Absolute time at φ = 4 MHz. The value in parentheses denotes the
number of φ cycles.
Feb 18, 2005 page 33 of 85
REJ03B0122-0101
AAAA
AAA
SCL release time
Hold time
SCL
SDA
Setup
time
Hold time
BB flag
set
time
BB flag
Fig. 35 START condition detecting timing diagram
AAA
AAA
SCL release time
SCL
SDA
BB flag
Setup
time
Hold time
BB flag
reset
time
Fig. 36 STOP condition detecting timing diagram
Table 11 START condition/STOP condition detecting conditions
Standard clock mode
High-speed clock mode
SCL release time
Setup time
Hold time
BB flag set/
reset time
SSC value + 1 cycle (6.25 µs)
4 cycles (1.0 µs)
SSC value + 1 cycle < 4.0 µs (3.125 µs)
2 cycles (1.0 µs)
2
SSC value + 1 cycle < 4.0 µs (3.125 µs) 2 cycles (0.5 µs)
2
SSC value –1 + 2 cycles (3.375 µs) 3.5 cycles (0.875 µs)
2
Note: Unit : Cycle number of system clock φ
SSC value is the decimal notation value of the START/STOP condition set bits SSC4 to SSC0. Do not set “0” or an odd number to SSC
value. The value in parentheses is an example when the I2C START/
STOP condition control register is set to “1816” at φ = 4 MHz.
7512 Group
[I2C START/STOP Condition Control Register
(S2D)] 003016
The I2C START/STOP condition control register (address 003016)
controls START/STOP condition detection.
•Bits 0 to 4: START/STOP condition set bits (SSC4–SSC0)
SCL release time, setup time, and hold time change the detection
condition by value of the main clock divide ratio selection bit and
the oscillation frequency f(XIN) because these time are measured
by the internal system clock. Accordingly, set the proper value to
the START/STOP condition set bits (SSC4 to SSC0) in considered
of the system clock frequency. Refer to Table 11.
Do not set “000002” or an odd number to the START/STOP condition set bit (SSC4 to SSC0).
Refer to Table 12, the recommended set value to START/STOP
condition set bits (SSC4–SSC0) for each oscillation frequency.
b7
b0
ARE SIS SIP SSC4 SSC3 SSC2 SSC1 SSC0
I2C START/STOP condition
control register
(S2D : address 003016)
START/STOP condition set bits
SCL/SDA interrupt pin polarity
selection bit
0 : Falling edge active
1 : Rising edge active
SCL/SDA interrupt pin selection bit
0 : SDA valid
1 : SCL valid
STP/Low speed mode data receive
enable bit
0 : Disable
1 : Enable
•Bit 5: SCL/SDA interrupt pin polarity selection bit (SIP)
An interrupt can occur when detecting the falling or rising edge of
the SCL or SDA pin. This bit selects the polarity of the SCL or
SDA pin interrupt pin.
•Bit 6: SCL/SDA interrupt pin selection bit (SIS)
This bit selects the pin of which interrupt becomes valid between
the SCL pin and the SDA pin.
•Bit 7: STP/Low speed mode data receive enable bit
Selecting this bit “1” enables I2C to receive the start condition address data even if the CPU is stopping or running at the low speed
mode. The detecting the falling edge of the SDA pin, built-in RC
oscillator begins oscillation, and receive the start condition address data. After receiving the last bit of address data ( in case of
ACK clock bit =“1”, after receiving ACK bit), SCL/SDA interrupt
and I2C interrupt are requested at the same time. And then SCL
pin becomes low hold state as a result of becoming SCL pin low
hold bit “0”. During this state, it is possible to start the Xin oscillation. And after oscillation becomes stable, normal I2C operation
begins. If the start condition which is not satisfied the hold time of
start condition is input, SCL/SDA interrupt is requested.
In the low-speed mode, when this bit is set to "1", SCL/SDA interrupt which occur by the rising or falling edge of SCL or SDA is
disabled.
Note: When changing the setting of the SCL/SDA interrupt pin polarity selection bit, the SCL/SDA interrupt pin selection bit, or the I 2C-BUS
interface enable bit ES0, the SCL/SDA interrupt request bit may be
set. When selecting the SCL/SDA interrupt source, disable the interrupt before the SCL/SDA interrupt pin polarity selection bit, the SCL/
SDA interrupt pin selection bit, or the I 2C-BUS interface enable bit
ES0 is set. Reset the request bit to “0” after setting these bits, and
enable the interrupt.
Fig. 37 Structure of I2C START/STOP condition control register
Table 12 Recommended set value to START/STOP condition set bits (SSC4–SSC0) for each oscillation frequency
Oscillation
START/STOP
Main clock System
SCL release time
Setup time
frequency
condition
divide ratio clock φ
(µs)
(µs)
f(XIN) (MHz)
control register
(MHz)
8
2
4
8
8
1
4
2
2
2
2
1
XXX11010
XXX11000
XXX00100
XXX01100
XXX01010
XXX00100
6.75 µs (27 cycles)
6.25 µs (25 cycles)
5.0 µs (5 cycles)
6.5 µs (13 cycles)
5.5 µs (11 cycles)
5.0 µs (5 cycles)
3.375 µs (13.5 cycles)
3.125 µs (12.5 cycles)
2.5 µs (2.5 cycles)
3.25 µs (6.5 cycles)
2.75 µs (5.5 cycles)
2.5 µs (2.5 cycles)
Note: Do not set “000002” or an odd number to the START/STOP condition set bits (SSC4 to SSC0).
Feb 18, 2005 page 34 of 85
REJ03B0122-0101
Hold time
(µs)
3.375 µs (13.5 cycles)
3.125 µs (12.5 cycles)
2.5 µs (2.5 cycles)
3.25 µs (6.5 cycles)
2.75 µs (5.5 cycles)
2.5 µs (2.5 cycles)
7512 Group
I2C additional register
(1) bit 0: Time-out mode bit (TOM)
Setting the time-out mode bit “1” , continuity of I2C-Bus busy
state for about 16ms (f(XIN)=4MHz, high-speed mode) makes
time-out flag “1” and time-out interrupt occurs. Check the timeout flag to know which interrupt source of the SCL/SDA
interrupt is occurred. When restart condition occurs in the
middle of communication, the time-out timer is cleared.
(2) bit 1: Time-out flag (TOF)
Time-out flag becomes “1” when the time-out state occurs.
Writing “1” to this bit, time-out timer is reset, and this bit is
cleared “0” also.
(3) I2C operation enable bit at WIT mode (WEB)
This bit determines multi-master I2C-BUS interface operation
at WIT mode. Setting this bit "0", multi-master I 2C interface
source clock is not supplied at WIT mode. Setting this bit "1",
multi-master I2C interface source clock is supplied even at WIT
mode, and it makes possible multi-master I2C interface operation at WIT mode. Do not execute STP instruction at I 2 C
operation enable bit at WIT mode is "1".
(4) Stop condition flag (SCF)
This flag turns to “1”, when the stop condition is generated or
detected. This bit is cleared “0” at reset, or when I2C-Bus interface enable bit is “0” or writing this bit “1”. This bit is available
only when I2C-Bus interface enable bit is “1”.
(5) ACK clock selection mode bit (ACS)
Setting this bit "1" clears the ACK bit (bit 6 of 002F16) "0" and
sets the ACK clock bit (bit 7 of 002F16) "1" automatically, when
the stop condition is detected.
b7
b0
ACS
SCF WEB TOF TOM
I2C additional register
(S3 : address 003116)
Time-out mode bit
0 : Disable
1 : Enable
Time-out flag
0 : Not generated
1 : Generated
*Writing this bit "1", this flag is cleared
I2C operation enable bit at WIT mode
0 : Disable
1 : Enable
Stop condition flag
0 : Not detect stop condition
1 : Detect stop condition
*Writing this bit "1", this flag is cleared
ACK clock selection mode bit
0 : Disable
1 : Enable
Not used (returns "0" when read)
Fig. 38 I2C additional register
Feb 18, 2005 page 35 of 85
REJ03B0122-0101
7512 Group
Address Data Communication
comparison, an address comparison between the RWB bit of
the I 2C address register (address 002C 16) and the R/W bit
which is the last bit of the address data transmitted from the
master is made. In the 10-bit addressing mode, the RWB bit
which is the last bit of the address data not only specifies the
direction of communication for control data, but also is processed as an address data bit.
When the first-byte address data agree with the slave address,
the AAS bit of the I2C status register (address 002D16) is set to
“1”. After the second-byte address data is stored into the I 2C
data shift register (address 002B16), perform an address comparison between the second-byte data and the slave address
by software. When the address data of the 2 bytes agree with
the slave address, set the RWB bit of the I2C address register
(address 002C16) to “1” by software. This processing can make
the 7-bit slave address and R/W data agree, which are received after a RESTART condition is detected, with the value of
the I2C address register (address 002C16). For the data transmission format when the 10-bit addressing format is selected,
refer to Figure 39, (3) and (4).
There are two address data communication formats, namely, 7-bit
addressing format and 10-bit addressing format. The respective
address communication formats are described below.
(1)7-bit addressing format
To adapt the 7-bit addressing format, set the 10BIT SAD bit of
the I2C control register (address 002E16) to “0”. The first 7-bit
address data transmitted from the master is compared with the
high-order 7-bit slave address stored in the I2C address register
(address 002C16). At the time of this comparison, address comparison of the RWB bit of the I 2C address register (address
002C 16) is not performed. For the data transmission format
when the 7-bit addressing format is selected, refer to Figure 39,
(1) and (2).
(2)10-bit addressing format
To adapt the 10-bit addressing format, set the 10BIT SAD bit of
the I 2 C control register (address 002E16 ) to “1”. An address
comparison is performed between the first-byte address data
transmitted from the master and the 8-bit slave address stored
in the I2C address register (address 002C16). At the time of this
S
Slave address R/W
7 bits
A
“0”
Data
A
1 to 8 bits
Data
A/A
P
A
P
1 to 8 bits
(1) A master-transmitter transnmits data to a slave-receiver
S
Slave address R/W
7 bits
A
“1”
Data
A
1 to 8 bits
Data
1 to 8 bits
(2) A master-receiver receives data from a slave-transmitter
S
Slave address
R/W
1st 7 bits
7 bits
A
“0”
Slave address
2nd bytes
A
Data
1 to 8 bits
8 bits
A
Slave address
R/W
1st 7 bits
A
Slave address
2nd bytes
A
AA
AA
Slave address
R/W
1st 7 bits
Sr
“1”
7 bits
“0”
8 bits
7 bits
(4) A master-receiver receives data from a slave-transmitter with a 10-bit address
S : START condition
A : ACK bit
Sr : Restart condition
P : STOP condition
R/W : Read/Write bit
Fig. 39 Address data communication format
Feb 18, 2005 page 36 of 85
REJ03B0122-0101
AA
P
1 to 8 bits
(3) A master-transmitter transmits data to a slave-receiver with a 10-bit address
S
A/A
Data
: Master to slave
: Slave to master
A
Data
1 to 8 bits
A
Data
1 to 8 bits
A
P
7512 Group
Example of Master Transmission
Example of Slave Reception
An example of master transmission in the standard clock mode, at
the SCL frequency of 100 kHz and in the ACK return mode is
shown below.
(1) Set a slave address in the high-order 7 bits of the I2C address
register (address 002C16) and “0” into the RWB bit.
(2) Set the ACK return mode and SCL = 100 kHz by setting “8516”
in the I2C clock control register (address 002F16).
(3) Set “0016” in the I2C status register (address 002D16) so that
transmission/reception mode can become initializing condition.
(4) Set a communication enable status by setting “0816” in the I2C
control register (address 002E16).
(5) Confirm the bus free condition by the BB flag of the I2C status
register (address 002D16).
(6) Set the address data of the destination of transmission in the
high-order 7 bits of the I2C data shift register (address 002B16)
and set “0” in the least significant bit.
(7) Set “F016” in the I2C status register (address 002D16) to generate a START condition. At this time, a SCL for 1 byte and an
ACK clock automatically occur.
(8) Set transmit data in the I 2 C data shift register (address
002B16). At this time, a SCL and an ACK clock automatically occur.
(9) When transmitting control data of more than 1 byte, repeat
step (8).
(10) Set “D016” in the I2C status register (address 002D16) to generate a STOP condition if ACK is not returned from slave
reception side or transmission ends.
An example of slave reception in the high-speed clock mode, at
the SCL frequency of 400 kHz, in the ACK non-return mode and
using the addressing format is shown below.
(1) Set a slave address in the high-order 7 bits of the I2C address
register (address 002C16) and “0” in the RWB bit.
(2) Set the ACK non-return mode and SCL = 400 kHz by setting
“2516” in the I2C clock control register (address 002F16).
(3) Set “0016” in the I2C status register (address 002D16) so that
transmission/reception mode can become initializing condition.
(4) Set a communication enable status by setting “0816” in the I2C
control register (address 002E16).
(5) When a START condition is received, an address comparison
is performed.
(6) •When all transmitted addresses are “0” (general call):
AD0 of the I2C status register (address 002D16) is set to “1”
and an interrupt request signal occurs.
•When the transmitted addresses agree with the address set in (1):
ASS of the I2C status register (address 002D16) is set to “1”
and an interrupt request signal occurs.
• In the cases other than the above AD0 and AAS of the I2C
status register (address 002D16) are set to “0” and no inter
rupt request signal occurs.
(7) Set dummy data in the I2C data shift register (address 002B16).
(8) When receiving control data of more than 1 byte, repeat step (7).
(9) When a STOP condition is detected, the communication ends.
Feb 18, 2005 page 37 of 85
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7512 Group
■Precautions when using multi-master I2C-BUS
interface
(1) Read-modify-write instruction
The precautions when the read-modify-write instruction such as
SEB, CLB etc. is executed for each register of the multi-master
I2C-BUS interface are described below.
• I2C data shift register (S0: address 002B16)
When executing the read-modify-write instruction for this register during transfer, data may become a value not intended.
• I2C address register (S0D: address 002C16)
When the read-modify-write instruction is executed for this register at detecting the STOP condition, data may become a value
not intended. It is because H/W changes the read/write bit
(RWB) at the above timing.
• I2C status register (S1: address 002D16)
Do not execute the read-modify-write instruction for this register
because all bits of this register are changed by H/W.
• I2C control register (S1D: address 002E16)
When the read-modify-write instruction is executed for this register at detecting the START condition or at completing the byte
transfer, data may become a value not intended. Because H/W
changes the bit counter (BC0-BC2) at the above timing.
• I2C clock control register (S2: address 002F16)
The read-modify-write instruction can be executed for this register.
• I 2 C START/STOP condition control register (S2D: address
003016)
The read-modify-write instruction can be executed for this register.
(2) START condition generating procedure using multi-master
1. Procedure example (The necessary conditions of the generating procedure are described as the following 2 to 5.
::
LDA —
(Taking out of slave address value)
SEI
(Interrupt disabled)
BBS 5, S1, BUSBUSY (BB flag confirming and branch process)
BUSFREE:
STA S0
(Writing of slave address value)
LDM #$F0, S1
(Trigger of START condition generating)
CLI
(Interrupt enabled)
::
BUSBUSY:
CLI
(Interrupt enabled)
::
2. Use “Branch on Bit Set” of “BBS 5, $002D, –” for the BB flag
confirming and branch process.
3. Use “STA $2B, STX $2B” or “STY $2B” of the zero page addressing instruction for writing the slave address value to the
I2C data shift register.
4. Execute the branch instruction of above 2 and the store instruction of above 3 continuously shown the above procedure
example.
5. Disable interrupts during the following three process steps:
Feb 18, 2005 page 38 of 85
REJ03B0122-0101
• BB flag confirming
• Writing of slave address value
• Trigger of START condition generating
When the condition of the BB flag is bus busy, enable interrupts
immediately.
(3) RESTART condition generating procedure
1. Procedure example (The necessary conditions of the generating procedure are described as the following 2 to 4.)
Execute the following procedure when the PIN bit is “0”.
::
LDM #$00, S1
(Select slave receive mode)
LDA —
(Taking out of slave address value)
SEI
(Interrupt disabled)
STA S0
(Writing of slave address value)
LDM #$F0, S1
(Trigger of RESTART condition generating)
CLI
(Interrupt enabled)
::
2. Select the slave receive mode when the PIN bit is “0”. Do not
write “1” to the PIN bit. Neither “0” nor “1” is specified for the
writing to the BB bit.
The TRX bit becomes “0” and the SDA pin is released.
3. The SCL pin is released by writing the slave address value to
the I2C data shift register.
4. Disable interrupts during the following two process steps:
• Writing of slave address value
• Trigger of RESTART condition generating
(4) Writing to I2C status register
Do not execute an instruction to set the PIN bit to “1” from “0” and
an instruction to set the MST and TRX bits to “0” from “1” simultaneously. It is because it may enter the state that the SCL pin is
released and the SDA pin is released after about one machine
cycle. Do not execute an instruction to set the MST and TRX bits
to “0” from “1” simultaneously when the PIN bit is “1”. It is because
it may become the same as above.
(5) Process of after STOP condition generating
Do not write data in the I2C data shift register S0 and the I2C status register S1 until the bus busy flag BB becomes “0” after
generating the STOP condition in the master mode. It is because
the STOP condition waveform might not be normally generated.
Reading to the above registers do not have the problem.
7512 Group
PULSE WIDTH MODULATION (PWM)
PWM Operation
The 7512 Group has a PWM function with an 8-bit resolution,
based on a signal that is the clock input XIN or that clock input divided by 2.
When bit 0 (PWM enable bit) of the PWM control register is set to
“1”, operation starts by initializing the PWM output circuit, and
pulses are output starting at an “H”.
If the PWM register or PWM prescaler is updated during PWM
output, the pulses will change in the cycle after the one in which
the change was made.
Data Setting
The PWM output pin also functions as port P4 4 or port P0 7. The
PWM output pin can be selected to either port P44/PWM0 or port
P0 7/PWM 1 by bit 2 (PWM output pin selectoin bit) of the PWM
control register. Set the PWM period by the PWM prescaler, and
set the “H” term of output pulse by the PWM register.
If the value in the PWM prescaler is n and the value in the PWM
register is m (where n = 0 to 255 and m = 0 to 255) :
PWM period = 255 ✕ (n+1) / f(XIN)
= 63.75 ✕ (n+1) µs
(when f(XIN) = 4 MHz)
Output pulse “H” term = PWM period ✕ m / 255
= 0.25 ✕ (n+1) ✕ m µs
(when f(XIN) = 4 MHz)
63.75 ✕ m ✕ (n+1)
255
µs
PWM output
T = [63.75 ✕ (n+1)]
µs
m: Contents of PWM register
n : Contents of PWM prescaler
T : PWM period (when f(XIN) = 4 MHz
Fig. 40 Timing of PWM period
Data bus
PWM
prescaler pre-latch
PWM
register pre-latch
Transfer control circuit
XIN
"0"
1/2
PWM
prescaler latch
PWM register latch
PWM prescaler
PWM register
Count source
selection bit
PortP44/PWM0
"1"
Port P44 latch
PortP07/PWM1
Port P07 latch
PWM enable bit
PWM output pin selection bit
Fig. 41 Block diagram of PWM function
Feb 18, 2005 page 39 of 85
REJ03B0122-0101
7512 Group
b7
b0
PWM control register
(PWMCON : address 001D16)
PWM function enable bit
0: PWM disabled
1: PWM enabled
Count source selection bit
0: f(XIN)
1: f(XIN)/2
PWM output pin selection bit
0: P44
1: P07
Not used (return “0” when read)
Fig. 42 Structure of PWM control register
A
B
B = C
T2
T
C
PWM output
T
PWM register
write signal
T
T2
(Changes “H” term from “A” to “B”.)
PWM prescaler
write signal
(Changes PWM period from “T” to “T2”.)
When the contents of the PWM register or PWM prescaler have changed, the PWM
output will change from the next period after the change.
Fig. 43 PWM output timing when PWM register or PWM prescaler is changed
■Note
The PWM starts after the PWM enable bit is set to enable and "L" level is output from the PWM pin.
The length of this "L" level output is as follows:
n+1
2 • f(XIN)
sec
(Count source selection bit = 0, where n is the value set in the prescaler)
n+1
f(XIN)
sec
(Count source selection bit = 1, where n is the value set in the prescaler)
Feb 18, 2005 page 40 of 85
REJ03B0122-0101
7512 Group
A/D CONVERTER
[AD Conversion Registers (ADL, ADH)]
003516, 003616
b0
b7
AD control register
(ADCON : address 003416)
Analog input pin
selection additional bit*
0
0
0
0
0
0
0
1
1
1
1
The AD conversion registers are read-only registers that store the
result of an A/D conversion. Do not read these registers during an
A/D conversion
[AD Control Register (ADCON)] 003416
The AD control register controls the A/D conversion process. Bits
0 to 2 select a specific analog input pin. Bit 4 indicates the
completion of an A/D conversion. The value of this bit remains at
“0” during an A/D conversion and changes to “1” when an A/D conversion ends. Writing “0” to this bit starts the A/D conversion.
Not used (returns “0” when read)
Comparison Voltage Generator
A/D conversion completion bit
0: Conversion in progress
1: Conversion completed
The comparison voltage generator divides the voltage between
AVSS and VREF into 1024 and outputs the divided voltages.
Not used (returns “0” when read)
Channel Selector
*Bit 0 of MISRG2 (003716)
The channel selector selects one of ports P0 4/AN8 to P07 /AN11
and ports P30/AN0 to P35/AN5 and inputs the voltage to the comparator.
Fig. 44 Structure of AD control register
Comparator and Control Circuit
10-bit reading
(Read address 003616 before 003516)
The comparator and control circuit compare an analog input voltage with the comparison voltage, and the result is stored in the AD
conversion registers. When an A/D conversion is completed, the
control circuit sets the A/D conversion completion bit and the A/D
interrupt request bit to “1”.
Note that because the comparator consists of a capacitor coupling, set f(XIN) to 500 kHz or more during an A/D conversion.
When the A/D converter is operated at low-speed mode, f(XIN)
and f(XCIN) do not have the lower limit of frequency, because of
the A/D converter has a built-in self-oscillation circuit.
Easy thermal sensor
b7
b0
b9 b8
b7
b0
(Address 003616)
(Address 003516)
b7 b6 b5 b4 b3 b2 b1 b0
Note : The high-order 6 bits of address 003616 become “0”
at reading.
8-bit reading (Read only address 003516)
b7
(Address 003516)
b0
b9 b8 b7 b6 b5 b4 b3 b2
Fig. 45 Structure of AD conversion registers
Easy thermal sensor detects voltage change of P-N diordes by
thermal difference using A/D converter. Setting the Analog input
pin selection additional bit "0" and Analog input pin selection bits
"111" starts A/D conversion of thermal sensor.
Data bus
AD control register
(Address 003416)
AAAAAA
b7
b0
Analog input pin selection
additional bit
4
A/D interrupt request
A/D control circuit
Channel selector
P30/AN0
P31/AN1
P32/AN2
P33/AN3
P34/AN4
P35/AN5
P04/AN8
P05/AN9
P06/AN10
P07/AN11
Comparator
AD conversion high-order register (Address 003616)
AD conversion low-order register (Address 003516)
10
Resistor ladder
VREF AVSS
Thermal sensor select signal
Fig. 46 Block diagram of A/D converter
Feb 18, 2005 page 41 of 85
REJ03B0122-0101
Analog input pin
selection bits
0 0 0: P30/AN0
0 0 1: P31/AN1
0 1 0: P32/AN2
0 1 1: P33/AN3
1 0 0: P34/AN4
1 0 1: P35/AN5
1 1 1: Thermal sensor
0 0 0: P04/AN8
0 0 1: P05/AN9
0 1 0: P06/AN10
0 1 1: P07/AN11
7512 Group
CURRENT INTEGRATOR
Current integrator integrates the current which flows through
sense resistor connected between ISENS0 pin and ISENS1 pin.
The current between sense resistor makes electrical potential difference between ISENS0 pin and ISENS1 pin, and it is integrated
by the built-in integrator. The output of integrator is connected to
comparator, and the integrator and comparator measures about
1mA current in case of using 10 mΩ sense register. And charge/
discharge counter counts how many times the integrator overflows.
Setting the current integrate enable bit "1", the current integrator
starts the operation.
Current Integrate Mode
Setting the current integrate mode bit "0", input of the V-I converter is connected to the ISENS1 pin and ISENS0 pin, and the
current integrator measures the electrical potential difference between ISENS1 pin and ISENS0 pin. The input voltage between
ISENS1 and ISENS0 is converted to current by V-I converter, and
input to the integrator.
The output of the integrator is connected to the comparator. The
integrator integrates input voltage between ISENS1 pin and
ISENS0 pin. And when output of the integrator amounts to compared voltage, output of the comparator rises "H", and
charge(discharge) counter is increased 1 count. And at the same
time, electric charge of the integrator's capacitor is discharged,
then the integrator starts next integration. Charge(Dischrage)
counter is counting the number of the times "H" output of the comparator during integration period(125msec), and at the end of the
period, charge (discharge)counter is latched onto
charge(discharge) counter latch. Then charge(discharge) counter
is cleared "0", and starts new count. At the end of the period, current integrate interrupt occurs also.
The current integrator has 2 set of comparator and counter for discharge and charge, and only discharge counter counts up in
discharge state, and only charge counter counts up in charge
state. The integrator and comparator are designed to sense approximate 1mA current, then 1 count of counter means
approximate 1mA. Therefore reading the value of counter latch
means measuring the total current which flows the sense resistor
during integrate period(125msec).
Current integrate /AD converter
interrupt source bit
AD conversion
complete signal
Edge detect
Current integrate
interrupt
Calibration control signal
XCIN
125ms Timer
ISENS0
XX0
001
ISENS1
125ms over flow
Integrator
V-I convertor
011
101
Charge counter
XX0
001
011
101
Charge counter latch
Current integrate control register
b2 b1 b0
XX0 : Current integrate mode
001 : Zero calibration
011 : Full calibration for discharge
101 : Full calibration for charge
1.75V
Discharge counter
1.50V
1.00V
Discharge
counter latch
Integrator coefficient selection bit
0.75V
Calibration current selection bit
0.10V
0.05V
Data Bus
Fig. 47 Block diagram of Current integrator
Feb 18, 2005 page 42 of 85
REJ03B0122-0101
7512 Group
Integrate period
Integrate period
125ms
125ms
ISENS1 input
V-I converter input
0V
1.75V
Integrator output
1.25V
0.75V
Discharge comparator
Charge comparator
n-6
Discharge counter
n-5
n-4
n-2
n-3
n
n-1
Count value of last integrate period
Discharge counter latch
Charge counter
m
Charge counter latch
0
n
1
0
Count value of last integrate period
m
ISENS1 input
V-I converter input
0V
1.75V
Integrator output
1.25V
0.75V
Discharge comparator
Discharge signal for the integrator
Discharge counter
n-3
Fig. 48 Current integrator timing diagram
Feb 18, 2005 page 43 of 85
REJ03B0122-0101
3
2
1
n-2
n-1
2
3
7512 Group
Calibration Mode
0.1V reference voltage, and minus input of V-I converter is connected to internal AVSS, and then full calibration for discharge
state is operated. When the calibration selection bit is “10”, plus
input of V-I converter is connected to internal AVSS, and minus
input of V-I converter is connected to 0.05V or 0.1V reference
voltage, and the full calibration for charge state is operated.
Setting the current integrate mode bit “1”, the input of V-I converter
is connected to internal AVSS or 0.05V or 0.1V for reference voltage. When the calibration selection bit is “00”, both of plus and
minus input of V-I converter are connected to internal AVSS, and
zero calibration is operated. When the calibration selection bit is
“01”, plus input of V-I converter is connected to internal 0.05V or
Integrate period 125ms
Integrate period 125ms
Integrate period 125ms
Calibration mode
Calibration mode
(Zero Calibration)
(Calibration for discharge state)
Integrate period 125ms
VINF input
Set the current integrate mode bit "1"
and Calibration selection bit "00"
Set the calibration selection bit "01"
XX0
Current integrate mode bit
and Calibration selection bit
Set the current integrate mode bit "0"
001
011
XX0
Counter latch content flag
V-I converter input
0V
Integrator output
Discharge comparator
Discharge counter
0
Discharge counter latch
1
2
3
4
Counter value of previous integrate period
Integrate period 125ms
The result of calibration (Zero)
The result of calibration (Discharge state)
Integrate period 125ms
Integrate period 125ms
Full calibration for discharge
Zero Calibration
1.75V
Integrator output 1.25V
0.75V
V-I converter input
0V
Discharge comparator
Discharge signal for integrator
Discharge counter
n-1
Fig. 49 Calibration timing
Feb 18, 2005 page 44 of 85
REJ03B0122-0101
n
0
3
4
0
1
2
3
4
5
6
7512 Group
The calibration starts current integration for 125 ms, after discharging electric charge which remain in integrator's capacitor.
After finished calibration period, value of the discharge(charge)
counter is latched to discharge(charge) counter latch. At this time
the current integrate interrupt occurs. Which interrupt has occurred current integrate interrupt for current integrate mode or for
calibration mode can be judged by reading the counter latch content flag. The counter latch content flag shows the contents of
counter latch, value for current integrate mode or value for calibration mode. Note that the contents of the counter latch is updated
automatically at the end of next current integration or calibration.
The calibration mode is continued until setting the current integrate mode bit "0".
b7
b7 b6 b5 b4 b3 b2
b7
b7 b6 b5 b4 b3 b2
b7
Discharge counter latch low-order register (000A16)
b0
Discharge counter latch high-order register (000B16)
b0
b1 b0
Charge counter latch low-order register (000C16)
b0
b15 b14 b13 b12 b11 b10 b9 b8
b7
Just after setting the current integrate mode bit "1", discharge or
charge counter may count up one in surplus, in the first integrate
period, because of internal analog circuit still doesn't become
stable in the first integrate period. This cause increase of one
count on counting up counter or stopping counter in the first integrate period.
b0
b1 b0
b15 b14 b13 b12 b11 b10 b9 b8
b7
■Note on using current integrate circuit
Charge counter latch high-order register (000D16)
b0
Current integrate control register (000E16)
Current integrate mode bit
0 : Current integrate mode
1 : Calibration mode
Calibration selection bit
00 : Zero calibration
01 : Full calibration for discharge
10 : Full calibration for charge
11 : Not used
Calibration current selection bit (Note)
0 : 10A calibration
1 : 5A calibration
Integrate coefficient selection bit
0 : 10mΩ sense register
1 : 5mΩ sense register
Not used (Returns "0" when read)
Counter latch contents flag
0 : Current integrate data
1 : Calibration data
Current integrate enable bit
0 : Disable
1 : Enable
Note: This bit is protected.
Fig. 50 Current integrator registers
Feb 18, 2005 page 45 of 85
REJ03B0122-0101
7512 Group
OVER CURRENT DETECTOR
Wake Up Current Detector
Over current detector detects the over current which flows through
the sense resistor connected between ISENS1 pin and ISENS0
pin, and turn off the discharge control FET to stop battery from discharging or charging. In the low power state, and when current
integrator disables, wake up current detector which detects approximate 1mA current and generates the interrupt is also built-in.
Wake up current detector detects approximate 1A current with
10mΩ sense resistor. Setting wake up current detect enable bit of
the wake up current detect control register 1(001216) “1”, wake up
current detector starts the operation. The sensing voltage is 10
times amplified and compared by the comparator. The comparator
is comparing every 3.9msec, and more than 1A current is keeping
for about 62msec, wake up current detect flag(bit 0 of 001316) becomes “1”, and the wake up current detect interrupt occurs. The
enabling interrupt for wake up current detect is determined by
wake up current detect interrupt enable bit(bit6 of 001216). Setting
the wake up current detect restart bit “1” makes the wake up current detect state clear.
The offset calibration of the amplifier and comparator is able to be
adjusted by setting the wake up current compare voltage select
bit. Setting the wake up current detect calibration enable bit(bit5 of
001416) “1”, calibration mode starts. In the calibration mode, input
of level shift circuit is connected to internal GND, and it is possible
to measure the comparator threshold voltage at 0V input state,
with setting wake up current detect compare voltage select bit.
Then set the wake up current detect compare voltage select bit
the value which is added comparator threshold voltage at 0V state
and 0.1V(1A worth voltage).
Discharge Short Current Detector
Discharge short current detector detects the discharge short
current(10A-47.5A) with 10mΩ sense resistor. Setting discharge
short current detect enable bit of the discharge short current detect control register(000F16) “1”, discharge short current detector
starts the operation. The compare voltage is determined by setting
the discharge short current detect voltage select bit of the discharge short current detect control register, and the detect time is
determined by setting the discharge short current detect time set
up bit of the current detect time set up register 1(001116).
The potential difference between sense resistor exceeds the compare voltage and continue more than detect time, then discharge
short current detect flag(bit 2 of 001316 ) becomes “1”, and discharge short current detect interrupt occurs.
Enabling interrupt for discharge short current detect is determined
by discharge short current interrupt enable bit(bit 4 of 000F16 ).
And in case of the FET control enable bit is “1”, The FET control
signal is generated from DFETCNT pin with discharge short current interrupt. The polarity of the FET control signal is determined
by setting the discharge FET control polarity switch bit(bit 5 of
000F16).
Setting the discharge short current detect restart bit(bit 6 of
001316) “1” makes the discharge short current detect state clear.
Discharge Over Current Detector
Discharge over current detector detects the discharge over
current(5A-20.5A) with 10mΩ sense resistor. Setting discharge
over current detect enable bit of the discharge over current detect
control register(001016) “1”, discharge over current detector starts
the operation. The compare voltage is determined by setting the
discharge over current detect voltage select bit of the discharge
over current detect control register(001016), and the detect time is
determined by setting the discharge over current detect time set
up bit of the current detect time set up register 1(001116).
The potential difference between sense resistor exceeds the compare voltage and continue more than detect time, then discharge
over current detect flag(bit 1 of 001316 ) becomes “1”, and discharge over current detect interrupt occurs.
Enabling interrupt for discharge over current detect is determined
by discharge over current interrupt enable bit. And in case of the
discharge FET control enable bit is “1”, the FET control signal is
generated from DFETCNT pin with discharge over current interrupt.
Setting the discharge overt current detect restart bit(bit5 of
001316) “1” makes the discharge over current detect state clear.
Feb 18, 2005 page 46 of 85
REJ03B0122-0101
Charge Over Current Detector
Charge over current detector detects the charge over current
(10A-25A) with 10mΩ sense resister. Setting charge over current
detect enable bit of the charge over current detect control register
(0FF016 ) "1", charge over current detector starts the operation.
The compare voltage is determined by setting the charge over
current detect voltage select bit of the charge over current detect
control register (0FF016), and the detect time is determined by setting the charge over current detect time set up bit of the current
detect time set up register 2 (0FF116).
The potential difference between sense resister exceeds the compare voltage and continue more than detect time, then charge
over current detect flag (bit 3 of 001316) becomes "1", and charge
over current detect interrupt occurs.
Enabling interrupt for charge over current detect is determined by
charge over current interrupt enable bit. And in case of the charge
FET control enable bit is "1", the charge FET control signal is generated from CFETCNT pin with charge over current interrupt. The
polarity of the FET control signal is determined by setting the
charge FET control polarity switch bit (bit 5 of 0FF016).
Setting the charge over current detect restart bit (bit 7 of 001316)
"1" makes the charge over current detect state clear.
SFR Protect Control Register
SFR protect control register(002916), bit of MISRG2 (003716) and
bit4,5 of MISRG (003816) protect SFR from changing the contents
easily cause of like microcomputer runs away.
When the bit of SFR protect control register bit of MISRG2, bit 4,5
of MISRG is “0”, corresponded bit register is protected. Writing to
the protected register, write “1” to the corresponded bit of protect
register, then write the protected register in succession. If other
register is written, the contents of SFR protect register is cleared
“00”.
7512 Group
AVCC
Discharge short current detect
voltage select bit
Discharge over current detect
voltage select bit
Wake up current detect
voltage select bit
Charge over current detect
voltage select bit
Over current detect status register
Current detect time
set up resister 1
FET control enable bit
(when short current
detect enable)
ISENS1
Level shift
circuit
Discharge short
current detect
time counter
Discharge over
current detect
time counter
X10
Wake up calibration
enable bit
0
Level shift
circuit
S
S
Discharge
FET
Q
R
FET control enable bit
(when over current
detect enable)
FET control
polarity switch bit
Q
R
XCIN/128
Wake up current
detect time
counter
S
Q
R
1
Current detect
time set up
resister 2
Charge
FET
Charge FET
control enable bit
Charge over
current detect
time counter
S
R
Q
Discharge FET control
polarity switch bit
Over current detect interrupt
Fig. 51 Block diagram of Over current detector
Feb 18, 2005 page 47 of 85
REJ03B0122-0101
7512 Group
b7
b0
b7
b0
SFR protect control register (002916)
PRCR
Discharge short current detect control register protect bit (000F16)
Short current detect voltage select bit
0000 : 0.100V
1000 : 0.300V
0001 : 0.125V
1001 : 0.325V
0010 : 0.150V
1010 : 0.350V
0011 : 0.175V
1011 : 0.375V
0100 : 0.200V
1100 : 0.400V
0101 : 0.225V
1101 : 0.425V
0110 : 0.250V
1110 : 0.450V
0111 : 0.275V
1111 : 0.475V
Short current detect control register protect bit (000F16)
0 : Write disable
1 : Write enable
Over current detect control register protect bit (001016)
0 : Write disable
1 : Write enable
Current detect time set up register protect bit (001116)
0 : Write disable
1 : Write enable
Discharge short current detect interrupt enable bit
0 : Disable
1 : Enable
Wake up current detect control register 1 protect bit (001216)
0 : Write disable
1 : Write enable
Discharge FETcontrol polarity switch bit
0 : active "L" output
1 : active "H" output
Over current detect status register protect bit (001316)
0 : Write disable
1 : Write enable
Discharge FETcontrol enable bit (When short current detect
enable)
0 : FET control disable
1 : FET control enable
Wake up current detect control register 2 protect bit (001416)
0 : Write disable
1 : Write enable
Discharge short current detect enable bit
0 : Disable
1 : Enable
MISRG2 protect bit (003716)
0 : Write disable
1 : Write enable
CPU mode register protect bit (003B16)
0 : Write disable
1 : Write enable
Note : All bits are protected.
Note : Same bits in this register are not able to protect.
b7
b0
b7
b0
Discharge over current detect control register (001016)
Current detect time set up register 1 (001116)
Discharge short current detect voltage select bit
00000 : 0.050V
10000 : 0.130V
00001 : 0.055V
10001 : 0.135V
00010 : 0.060V
10010 : 0.140V
00011 : 0.065V
10011 : 0.145V
00100 : 0.070V
10100 : 0.150V
00101 : 0.075V
10101 : 0.155V
00110 : 0.080V
10110 : 0.160V
00111 : 0.085V
10111 : 0.165V
01000 : 0.090V
11000 : 0.170V
01001 : 0.095V
11001 : 0.175V
01010 : 0.100V
11010 : 0.180V
01011 : 0.105V
11011 : 0.185V
01100 : 0.110V
11100 : 0.190V
01101 : 0.115V
11101 : 0.195V
01110 : 0.120V
11110 : 0.200V
01111 : 0.125V
11111 : 0.205V
Discharge short current detect time set up bit
0000 :
0µs
1000 : 488µs
0001 :
61µs
1001 : 549µs
0010 : 122µs
1010 : 610µs
0011 : 183µs
1011 : 671µs
0100 : 244µs
1100 : 732µs
0101 : 305µs
1101 : 793µs
0110 : 366µs
1110 : 854µs
0111 : 427µs
1111 : 915µs
Discharge over current detect interrupt enable bit
0 : Disable
1 : Enable
Discharge FET control enable bit (When over current detect enable)
0 : FET control disable
1 : FET control enable
Discharge over current detect enable bit
0 : Disable
1 : Enable
Note : All bits are protected.
Fig. 52 Over current detector registers (1)
Feb 18, 2005 page 48 of 85
REJ03B0122-0101
Discharge over current detect time set up bit
0000 : 1.0ms
1000 : 17.0ms
0001 : 3.0ms
1001 : 19.0ms
0010 : 5.0ms
1010 : 21.0ms
0011 : 7.0ms
1011 : 23.0ms
0100 : 9.0ms
1100 : 25.0ms
0101 : 11.0ms
1101 : 27.0ms
0110 : 13.0ms
1110 : 29.0ms
0111 : 15.0ms
1111 : 31.0ms
Note : All bits are protected.
7512 Group
b7
b7
b0
b0
Wake up current detect control register 1 (001216)
Over current detect status register(001316)
Wake up current detect compare voltage select bit
Wake up current detect flag
0 : Not detected
1 : Detected
Wake up current detect
compare voltage select bit n
compare voltage
(V)
b5
b4
b3
b2
b1
b0
0
0
0
0
0
0
1
1
1
1
X
0
0
0
0
X
0
0
0
0
X
0
0
1
1
X
0
1
0
1
Discharge over current detect flag
0 : Not detected
1 : Detected
Setting disabled
1.04
1.05
1.06
1.07
Discharge over current detect flag
0 : Not detected
1 : Detected
Charge over current detect flag
0 : Not detected
1 : Detected
0.01n+0.88
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
Wake up current detect restart bit
0 : Invalid
1 : Restart
1.48
1.49
1.50
1.51
Discharge over current detect restart bit
0 : Invalid
1 : Restart
Wake up current detect interrupt enable bit
0 : Disable
1 : Enable
Discharge short current detect restart bit
0 : Invalid
1 : Restart
Wake up current detect enable bit
0 : Disable
1 : Enable
Charge over current detect restart bit
0 : Invalid
1 : Restart
Note : All bits are protected.
b7
Note : All bits are protected.
b7
b0
b0
Wake up current detect control register 2 (001416)
Charge over current detect control register (0FF016)
Reserved (Do not write "1"to this bit)
Charge over current detect voltage select bit
0000 : 0.025V
1000 : 0.065V
0001 : 0.030V
1001 : 0.070V
0010 : 0.035V
1010 : 0.075V
0011 : 0.040V
1011 : 0.080V
0100 : 0.045V
1100 : 0.085V
0101 : 0.050V
1101 : 0.090V
0110 : 0.055V
1110 : 0.095V
0111 : 0.060V
1111 : 0.100V
Not used (returns "0" when read)
Wake up calibration enable bit
0 : Disable
1 : Enable
Reserved (Do not write "1"to this bit)
Not used (returns "0" when read)
Note : All bits are protected.
Charge over current detect interrupt enable bit
0 : Disable
1 : Enable
Charge FET control polarity switch bit
0 : Active "L" output
1 : Active "H" output
b7
b0
Current detect time set up register 2 (0FF116)
Charge over current detect time set up bit
0000 : 1.0ms
1000 : 17.0ms
0001 : 3.0ms
1001 : 19.0ms
0010 : 5.0ms
1010 : 21.0ms
0011 : 7.0ms
1011 : 23.0ms
0100 : 9.0ms
1100 : 25.0ms
0101 : 11.0ms
1101 : 27.0ms
0110 : 13.0ms
1110 : 29.0ms
0111 : 15.0ms
1111 : 31.0ms
DFETCNT-INT2 OR output enable bit
0 : Disable
1 : Enable
INT2 polarity switch bit
0 : invert
1 : not invert
CFETCNT-INT3 OR output enable bit
0 : Disable
1 : Enable
INT3 polarity switch bit
0 : invert
1 : not invert
Note : All bits are protected.
The SFR protect bit control bit is in MISRG register
(address 003816).
Fig. 53 Over current detector registers (2)
Feb 18, 2005 page 49 of 85
REJ03B0122-0101
Charge FET control enable bit
0 : FET control disable
1 : FET control enable
Charge over current detect enable bit
0 : Disable
1 : Enable
Note : All bits are protected.
The SFR protect bit control bit is in MISRG register
(address 003816).
7512 Group
WATCHDOG TIMER
●Watchdog timer H count source selection bit operation
Bit 7 of the watchdog timer control register (address 003916) permits selecting a watchdog timer H count source. When this bit is
set to “0”, the count source becomes the underflow signal of
watchdog timer L. The detection time is set to 262.144 ms at f(XIN)
= 4 MHz frequency and 32.768 s at f(XCIN) = 32 kHz frequency.
When this bit is set to “1”, the count source becomes the signal
divided by 16 for f(XIN) (or f(XCIN)). The detection time in this case
is set to 1024 µs at f(X IN) = 4 MHz frequency and 128 ms at
f(XCIN) = 32 kHz frequency. This bit is cleared to “0” after resetting.
The watchdog timer gives a mean of returning to the reset status
when a program cannot run on a normal loop (for example, because of a software run-away). The watchdog timer consists of an
8-bit watchdog timer L and an 8-bit watchdog timer H.
Standard Operation of Watchdog Timer
When any data is not written into the watchdog timer control register (address 003916) after resetting, the watchdog timer is in the
stop state. The watchdog timer starts to count down by writing an
optional value into the watchdog timer control register (address
003916) and an internal reset occurs at an underflow of the watchdog timer H.
Accordingly, programming is usually performed so that writing to
the watchdog timer control register (address 0039 16) may be
started before an underflow. When the watchdog timer control register (address 003916) is read, the values of the high-order 6 bits
of the watchdog timer H, STP instruction disable bit, and watchdog timer H count source selection bit are read.
●Operation of STP instruction disable bit
Bit 6 of the watchdog timer control register (address 003916) permits disabling the STP instruction when the watchdog timer is in
operation.
When this bit is “0”, the STP instruction is enabled.
When this bit is “1”, the STP instruction is disabled, once the STP
instruction is executed, an internal reset occurs. When this bit is
set to “1”, it cannot be rewritten to “0” by program. This bit is
cleared to “0” after resetting.
●Initial value of watchdog timer
At reset or writing to the watchdog timer control register (address
003916), each watchdog timer H and L is set to “FF16”.
XCIN
“10”
Main clock division
ratio selection bits
(Note)
XIN
“FF16” is set when
watchdog timer
control register is
written to.
Data bus
“0”
Watchdog timer L (8)
1/16
“1”
“00”
“01”
Watchdog timer H (8)
“FF16” is set when
watchdog timer
control register is
written to.
Watchdog timer H count
source selection bit
STP instruction disable bit
STP instruction
Reset
circuit
RESET
Note: Any one of high-speed, middle-speed or low-speed mode is selected by bits 7 and 6 of the CPU mode register.
Fig. 54 Block diagram of Watchdog timer
b7
b0
Watchdog timer control register
(WDTCON : address 003916)
Watchdog timer H (for read-out of high-order 6 bit)
STP instruction disable bit
0: STP instruction enabled
1: STP instruction disabled
Watchdog timer H count source selection bit
0: Watchdog timer L underflow
1: f(XIN)/16 or f(XCIN)/16
Fig. 55 Structure of Watchdog timer control register
Feb 18, 2005 page 50 of 85
REJ03B0122-0101
Internal reset
7512 Group
RESET CIRCUIT
To reset the microcomputer, RESET pin must be held at an "L"
level for 20 XIN cycles or more. Then the RESET pin is returned to
an "H" level (the power source voltage must be between 2.45 V
and 2.55 V, and the oscillation must be stable), reset is released.
After the reset is completed, the program starts from the address
contained in address FFFD 16 (high-order byte) and address
FFFC16 (low-order byte). Make sure that the reset input voltage is
less than 0.49 V for VCC of 2.45 V.
Poweron
RESET
Power source
voltage
0V
VCC
Reset input
voltage
0V
(Note)
0.2VCC
Note : Reset release voltage ; Vcc=2.45 V
RESET
VCC
Power source
voltage detection
circuit
Fig. 56 Reset circuit example
XIN
φ
RESET
Internal
reset
Address
?
?
?
?
FFFC
FFFD
ADH,L
Reset address from the vector table.
?
Data
?
?
?
ADL
ADH
SYNC
XIN: 10.5 to 18.5 clock cycles
Notes 1: The frequency relation of f(XIN) and f(φ) is f(XIN)=8 • f(φ).
2: The question marks (?) indicate an undefined state that depends on the previous state.
Fig. 57 Reset sequence
Feb 18, 2005 page 51 of 85
REJ03B0122-0101
7512 Group
Address Register contents
Address Register contents
(1)
Port P0 direction register (P0D)
000116
0016
(32) SFR protect control register (PRREG)
002916
0016
(2)
Port P1 direction register (P1D)
000316
0016
(33) I2C address register (S0D)
002C16
0016
(3)
Port P2 direction register (P2D)
000516
0016
(34) I2C status register (S1)
002D16 0 0 0 1 0 0 0 X
(4)
Port P3 direction register (P3D)
000716
0016
(35) I2C control register (S1D)
002E16
0016
(5)
Port P4 direction register (P4D)
000916
0016
(36) I2C clock control register (S2)
002F16
0016
(6)
Discharge counter latch low-order register (DCHARGEL)
000A16
0016
(37) I2C start/stop condition control register (S2D)
003016 0 0 0 X X X X X
(7)
Discharge counter latch high-order register (DCHARGEH)
000B16
0016
(38) I2C additional register (S3)
003116
0016
(8)
Charge counter latch low-order register (CHARGEL)
000C16
0016
(39) 32kHz oscillation circuit control register 0 (32KOSCC0) 003216
0016
(9)
Charge counter latch high-order register (CHARGEH)
000D16
0016
(40) 32kHz oscillation circuit control register 1 (32KOSCC1) 003316
0016
000E16
0016
(41) AD control register (ADCON)
003416
0 0 0 1 0 0 0 0
(11) Discharge short current detector control register (DSCDCON) 000F16
0016
(42) MISRG2
003716
0016
(12) Discharge over current detector control register (DOCDCON) 001016
0016
(43) MISRG
003816
0016
(10) Current integrator control register (CINFCON)
(13) Current detect time set up register 1 (OCDTIME1)
001116
0016
(44) Watchdog timer control register (WDTCON)
003916
0 0 1 1 1 1 1 1
(14) Wake up current detector control register 1 (WDDCON1)
001216
0016
(45) Interrupt edge selection register 1 (INTEDGE1)
003A16
0016
(15) Over current detect status register (OCDSTS)
001316
0016
(46) CPU mode register (CPUM)
003B16 0 1 1 0 0 0 0 0
(16) Wake up current detector control register 2 (WDDCON2)
001416
0016
(47) Interrupt request register 1 (IREQ1)
003C16
0016
(17) Serial I/O2 control register 1 (SI02CON1)
001516
0016
(48) Interrupt request register 2 (IREQ2)
003D16
0016
(18) Serial I/O2 control register 2 (SI02CON2)
001616 0 0 X 0 0 1 1 1
(49) Interrupt control register 1 (ICON1)
003E16
0016
(50) Interrupt control register 2 (ICON2)
003F16
0016
(51) Flash memory control register 0 (FMCR0)
0FE016 0 0 0 0 0 0 0 1
(19) Serial I/O status register (SIOSTS)
001916
1 0 0 0 0 0 0 0
(20) Serial I/O control register (SIOCON)
001A16
0016
(21) UART control register (UARTCON)
001B16 1 1 1 0 0 0 0 0
(52) Flash memory control register 1 (FMCR1)
0FE116 0 1 0 0 0 0 0 0
(22) PWM control register (PWMCON)
001D16
0016
(53) Flash memory control register 2 (FMCR2)
0FE216
0016
(23) Prescaler 12 (PRE12)
002016
FF16
(54) Charge over current detect control register (COCDCON) 0FF016
0016
(24) Timer 1 (T1)
002116
0116
(55) Current detect time set up register 2 (OCDTIME2)
0FF116
0016
0016
(56) High-speed RC oscillator frequency set up register
0FF216
AB16
0FF416 0 0 0 0 0 0 0 X
(25) Timer 2 (T2)
002216
(O4RCFRG)
(26) Timer XY mode register (TM)
002316
0016
(57) High-speed RC oscillator control register (O4RCCOT)
(27) Prescaler X (PREX)
002416
FF16
(58) Interrupt edge selection register 2 (INTEDGE2)
0FF516
(28) Timer X (TX)
002516
FF16
(59) Processor status register
(PS)
(29) Prescaler Y (PREY)
002616
FF16
(60) Program counter
(PCH)
FFFD16 contents
(30) Timer Y (TY)
002716
FF16
(PCL)
FFFC16 contents
(31) Timer count source select register (TCSS)
002816
0016
Note : X indicates Not fixed .
Fig. 58 Internal status at reset
Feb 18, 2005 page 52 of 85
REJ03B0122-0101
0016
XX X X X 1 X X
7512 Group
CLOCK GENERATING CIRCUIT
(4) Low power dissipation mode
The 7512Group has four built-in oscillation circuits. Built-in oscillation circuit about 4MHz oscillation, or an oscillation circuit can be
formed by connecting a resonator between XIN and XOUT for high
speed oscillation, and an oscillation circuit can be formed by connecting capacitor and resistor, or resonator between X CIN and
XCOUT for low speed oscillation. The oscillation source (built-in oscillation or XIN-XOUT oscillation) can be controlled by setting clock
source switch bit (CPU mode register) and high-speed RC oscillation stop bit (MISRG2) and XIN switching inhibit bit(MISREG2).
Immediately after power on, only the built-in oscillation circuit
starts oscillation. In case of using X IN-X OUT oscillation circuit,
change the clock source bit after start the XIN-XOUT oscillation setting the main clock (XIN -XOUT) stop bit (CPU mode register).
In case of not using XIN -XOUT oscillation circuit, XIN pin and XOUT
pin must be open.
Setting the X IN switching inhibit bit "1" (disable switch to X IN ),
clock source switch bit become invalid, and XIN-XOUT oscillation
circuit becomes disabled since. When this bit is set to "1", it cannot be rewritten to "0" by program.
Setting the port Xc switch bit (CPU mode register) "1", 32kHz RC
oscillation circuit or XCIN-XCOUT oscillation circuit starts oscillation. The selection of 32kHz RC oscillation circuit or Xc IN-XCOUT
oscillation circuit is selected by 32kHz RC oscillation enable bit
(MISRG2).
In case of using external resonator, connect resonator to XIN pin
and XOUT pin (XCIN pin and XCOUT pin). Use the circuit constants
in accordance with the resonator manufacturer’s recommended
values. No external resistor is needed between X IN and X OUT
since a feed-back resistor exists on-chip.(An external feed-back
resistor may be needed depending on conditions.) However, an
external feed-back resistor is needed between XCIN and XCOUT.
After reset, XCIN and XCOUT pins function as I/O ports.
The low power consumption operation can be realized by stopping
the main clock XIN in low-speed mode. To stop the main clock, set
bit 5 of the CPU mode register to “1”. When the main clock XIN is
restarted (by setting the main clock stop bit to “0”), set sufficient
time for oscillation to stabilize.
The sub-clock XCIN-XCOUT oscillating circuit can not directly input
clocks that are generated externally. Accordingly, make sure to
cause an external resonator to oscillate.
Frequency Control
(1) Middle-speed mode
The internal clock φ is the frequency of high-speed RC oscillation
clock or XIN divided by 8. After reset, this mode is selected.
(2) High-speed mode
The internal clock φ is half the frequency of XIN.
(3) Low-speed mode
The internal clock φ is half the frequency of high-speed RC oscillation clock or XCIN.
■Note
If you switch the mode between middle/high-speed and lowspeed, stabilize both XIN and XCIN oscillations. The sufficient time
is required for the sub-clock to stabilize, especially immediately after power on and at returning from the stop mode. When switching
the mode between middle/high-speed and low-speed, set the frequency on condition that f(XIN) > 3•f(XCIN).
Feb 18, 2005 page 53 of 85
REJ03B0122-0101
32kHz RC oscillation circuit
Setting the port Xc switch bit "1" after setting the 32kHz RC oscillation enable bit "1", the built-in 32kHz RC oscillation circuit starts
oscillation. In case of using 32kHz RC oscillation circuit, connect
91kΩ resistor between XCIN-XCOUT, and connect 100pF capacitor between XCIN and GND.
Setting appropriate value to the 32kHz oscillation circuit control
register0,1 it is possible to adjust the frequency error cause by
evenness of resistor and capacitor value .
The resistor ladder divided by 512 adjusts the frequency, and it
makes possible about 50Hz step adjustment.
The theoretical frequency is calculated as follow.
1
f32KRC =
2RCln(1+2R1/R2)
Calibration for High-speed RC oscillation
circuit
Setting the high-speed RC oscillation circuit calibration enable bit
"1", built-in counter starts count the clock which is divided the frequency of the high-speed RC oscillation output by 1/2 for four
cycles period of 32kHz RC oscillation clock, and high-speed RC
oscillation frequency can be measured.
The built-in counter is 9bit counter and lower 8bit count value is
stored in the high-speed RC oscillation circuit frequency counter
(0FF316) and higher 1bit is stored in bit 0 of high-speed RC oscillation circuit control register (0FF416).
Renewing the high-speed RC oscillation frequency set up register
(0FF216), oscillation frequency is altered. High-speed RC oscillation circuit frequency may change cause of change of V CC or
operating, temperature, but adjusting the high-speed oscillation
frequency set up register by software, oscillating frequency can be
kept fixed.
After power on, built-in high-speed RC oscillation starts the oscillation at about 4MHZ.
7512 Group
100pF
91kΩ
C
R
XCIN
XCOUT
comparator
1/2
clock control circuit
32kHz oscillation circuit
control register 0,1
Vcc
2
(1.25V)
71.68kΩ
35.84Ω
70Ω✕512
resistor ladder
R2
R1
Fig. 59 Block diagram of 32kHz RC oscillation circuit
b7
b0
AA
AA
A
AA
A
AA
AA
AAAA
AAA
AA
AAA
b7 b6 b5 b4 b3 b2 b1 b0
b7
32kHz oscillation control register 0 (003216)
b0
b8
32kHz oscillation control register 1 (003316)
Fig. 60 32kHz oscillation control register
b7
b0
b7 b6 b5 b4 b3 b2 b1 b0
b7
b0
AA
AA
A
AA
A
AA
AA
AAAAAA
AAA
AAA
b7 b6 b5 b4 b3 b2 b1 b0
b7
High-speed RC oscillation
frequency set up register (0FF216)
High-speed RC oscillation
frequency counter (0FF316) (Note 1,2)
b0
b8
High-speed RC oscillation
control register (0FF416) (Note 1,2)
Bit8 of high-speed RC oscillation counter
Not used (Returns "0" when read)
High-speed RC oscillation
calibration enable bit (Note 3)
0 : disable
1 : enable
Note 1 The first reading of high-speed RC oscillation frequency counter after enable high-speed RC
oscillation calibration must be read after nine clock cycle of 32kHZ oscillation clock.
Note 2 Read first 0FF316 and second 0FF416.
Note 3 When high-speed RC oscillation calibration enable bit is "1", set up the clock source high-speed
RC oscillation, and set up the main clock division ratio selection bits high-speed mode.
Fig. 61 High-speed RC oscillation register
Feb 18, 2005 page 54 of 85
REJ03B0122-0101
7512 Group
Oscillation Control
(1) Stop mode
If the STP instruction is executed, the internal clock φ stops at an
“H” level, and high-speed RC oscillation or XIN and XCIN oscillation
stops. When the oscillation stabilizing time set after STP instruction released bit is “0”, the prescaler 12 is set to “FF16” and timer
1 is set to “0116”. When the oscillation stabilizing time set after
STP instruction released bit is “1”, set the sufficient time for oscillation of used oscillator to stabilize since nothing is set to the
prescaler 12 and timer 1.
Either high-speed RC oscillation, XIN or XCIN divided by 16 is input
to the prescaler 12 as count source. Oscillator restarts when an
external interrupt is received, but the internal clock φ is not supplied to the CPU (remains at “H”) until timer 1 underflows. The
internal clock φ is supplied for the first time, when timer 1
underflows. This ensures time for the clock oscillation using the
ceramic resonators to be stabilized. When the oscillator is re____________
started by reset, apply “L” level to the RESET pin until the
oscillation is stable since a wait time will not be generated.
In case of using high-speed RC oscillation circuit as main clock,
the oscillation stabilizing time does not almost need.
XCIN
XCOUT
XIN
XOUT
Rd (Note)
Rf
Rd
CCOUT
CCIN
CI N
COUT
Notes : Insert a damping resistor if required.
The resistance will vary depending on the oscillator
and the oscillation drive capacity setting.
Use the value recommended by the maker of the
oscillator.
Also, if the oscillator manufacturer's data sheet
specifies that a feedback resistor be added external to
the chip though a feedback resistor exists on-chip,
insert a feedback resistor between XIN and XOUT
following the instruction.
Fig. 62 Ceramic resonator circuit
(2) Wait mode
If the WIT instruction is executed, the internal clock φ stops at an
“H” level, but the oscillator does not stop. The internal clock φ restarts at reset or when an interrupt is received. Since the oscillator
does not stop, normal operation can be started immediately after
the clock is restarted.
To ensure that the interrupts will be received to release the STP or
WIT state, their interrupt enable bits must be set to “1” before executing of the STP or WIT instruction.
When releasing the STP state, the prescaler 12 and timer 1 will
start counting the clock high-speed RC oscillation, XIN divided by
16. Accordingly, set the timer 1 interrupt enable bit to “0” before
executing the STP instruction.
XCIN
XCOUT
Rf
CCIN
XIN
Open
Rd
CCOUT
XOUT
External oscillation
circuit
Vcc
Vss
Fig. 63 External clock input circuit
■Note
When using the oscillation stabilizing time set after STP instruction
released bit set to “1”, evaluate time to stabilize oscillation of the
used oscillator and set the value to the timer 1 and prescaler 12.
XCIN
XCOUT
XIN
Open
XOUT
Open
91kΩ
100pF
Fig. 64 High-speed RC oscillation circuit and 32kHz RC oscillation circuit
Feb 18, 2005 page 55 of 85
REJ03B0122-0101
7512 Group
XCIN
XCOUT
Data bus
“1”
“0”
Port XC switch bit
32kHZ RC oscillation enable bit
Port XC switch bit
32kHZ RC oscillation enable bit
32kHZ oscillation circuit
control register 0, 1
XCIN-XOUT
oscillation
Port XC switch bit
XIN
(Note 3)
32kHZ RC oscillation
XOUT
Clock source
switch bit
XIN-XOUT oscillation
1/2
Main clock division ratio
selection bit (Note 1)
Low-speed mode
1/2
1/4
1/2
High-speed
RC oscillation High-speed or
middle-speed
mode
High-speed RC oscillation stop bit
Timer 1
FF16
0116
Reset or
STP instruction
(Note 2)
Main clock division ratio
selection bits (Note 1)
Middle-speed mode
XIN changing inhibit bit
High-speed RC
oscillation circuit
Prescaler 12
Timing φ
(Internal clock)
High-speed or
low-speed mode
Main clock stop bit
(XIN-XOUT)
S Q
Q S
R
STP instruction
WIT instruction
R
Q S
R
STP instruction
Reset
Interrupt disable flag l
Interrupt request
Note 1: Any one of high-speed mode, middle-speed mode or low-speed mode is selected by bits 7 and 6 of the CPU mode register.
When low-speed mode is selected, set port Xc switch bit (b1) to “1”.
2: When the oscillation stabilizing time set after STP instruction release bit is “0”.
3: Although a feed-back resistor exists on-chip, an external feed-back resistor may be needed depending on conditions.
Fig. 65 System clock generating circuit block diagram (Single-chip mode)
Feb 18, 2005 page 56 of 85
REJ03B0122-0101
7512 Group
■Notes on middle-speed mode switch set bit
When the middle-speed mode automatic switch set bit is set to “1”
during operation in the low-speed mode, XIN oscillation starts automatically by detecting the rising edge or the falling edge of the
SCL pin or the SDA pin and the microcomputer switch to the
middle-speed mode. Select the timing which switches from the
low-speed mode to the middle-speed mode by the middle-speed
mode automatic switch wait time set bit. The timing is selectable
from 4.5 to 5.5 cycles or 6.5 to 7.5 cycles in the low-speed mode.
Select according to the oscillation start characteristic of the oscillator of XIN to be used. By writing “1” in the middle-speed mode
automatic switch start bit during operation in the low-speed mode,
X IN oscillation starts automatically and the microcomputer
changes to the middle-speed mode.
AA
AAAA
AA
b7
b7
b0
MISRG(003816)
Oscillation stabilizing time set after STP instruction
released bit
0: Automatically set “0116” to Timer 1,
FF16” to Prescaler 12
1: Automatically set nothing
Middle-speed mode automatic switch set bit
0: Not set automatically
1: Automatic switching enable (Note1, 2)
Middle-speed mode automatic switch wait time set bit
0: 4.5 to 5.5 machine cycles
1: 6.5 to 7.5 machine cycles
Middle-speed mode automatic switch start bit
(Depending on program)
0: Invalid
1: Automatic switch start (Note2)
Charge over current detect control register (0FF016) protect.bit
0:Write disable
1:Write enable
Over current detect time set up register 2 (001416) protect bit
0:Write disable
1:Write enable
Not used (returns “0” when read)
b0
MISRG2(003716)
Analog in additional bit
bit0 ADCON
bit2 bit1 bit0
(003416)
0
X X X
1
0 0 0
1
0 0 1
1
0 1 0
1
0 1 1
1
1 X X
P35/AN5 - P30/AN0
P04/AN8
P05/AN9
P06/AN10
P07/AN11
Inhibit
32kHz RC oscillation calibration enable bit (Note 4)
0: Oscillating
1: Enable
High-speed RC oscillation stop bit (Note4)
0: Oscillating
1: Stopping
XIN switching inhibit bit (Note3, 4)
0: Enable switch to XIN
1: Disable switch to XIN
32kHz RC oscillation enable bit (Note4)
0: XCIN-XCOUT oscillation
1: 32kHz RC oscillation
Serial I/O2 clock source selection bit (When low-speed mode)
0: XCIN
1: Built-in oscillator for SI/O2
Integrate coefficient selection bit of current integrate control
register (000E16) protect bit
0: Write disable
1: Write enable
Reserved (do not write "1")
Note 1: The microcomputer can be switched to the middle-speed mode automatically by the
SCL/SDA interrupt during operation in the low-speed mode.
Note 2: When switching from the low-speed mode to the middle-speed mode, the value of the
CPU mode register also changes.
Fig. 66 Structure of MISRG1, MISRG2
Feb 18, 2005 page 57 of 85
REJ03B0122-0101
Note 3: When this bit is set to "1", it cannot be rewritten to "0" by program.
Note 4: This bit is protected.
"
"0"
high-speed mode(f(φ)=2MHz)
CM7=0
CM6=0
CM5=0(4MHz oscillating)
CM4=0(32kHz stopped)
CM3=1
MISRG2(bit2)=1(High-speed RC
oscillating stopped)
XIN oscillation
high-speed mode(f(φ)=2MHz)
CM7=0
CM6=0
CM5=0(4MHz oscillating)
CM4=0(32kHz stopped)
CM3=1
MISRG2(bit2)=0(High-speed RC oscillating)
XIN oscillation
"1
"
6
"0
"
CM
"0 7
CM "
"1
"
Low-speed mode(f(φ)=16kHz)
CM7=1
CM6=0
CM5=0(4MHz oscillating)
CM4=1(32kHz oscillating)
CM3=1
MISRG2(bit2)=1(High-speed RC
oscillating stopped)
Low-speed mode(f(φ)=16MHz)
CM7=1
CM6=0
CM5=1(4MHz oscillating stopped)
CM4=1(32kHz oscillating)
CM3=1
MISRG2(bit2)=1(High-speed RC
oscillating stopped)
CM3
"1"
CM3
"1"
CM5
"0"
RC oscillation high-speed mode(f(φ)=
approximately 2MHz)
CM7=0
CM5
CM6=0
"0" CM5=0(4MHz oscillating)
"0"
CM4=0(32kHz stopped)
CM3=0
MISRG2(bit2)=0(High-speed RC oscillating)
"1"
"1"
RC oscillation high-speed mode(f(φ)=
approximately 2MHz)
CM7=0
CM6=0
CM5=1(4MHz oscillating stopped)
CM4=0(32kHz stopped)
CM3=0
MISRG2(bit2)=0(High-speed RC
oscillating)
"0"
middle-speed mode(f(φ)=500kHz)
CM3
CM7=0
"1"
CM6=1
CM5=0(4MHz oscillating)
CM4=1(32kHz oscillating)
CM3=1
MISRG2(bit2)=0(High-speed RC oscillating)
XIN oscillation
RC oscillation high-speed mode(f(φ)=
approximately 2MHz)
CM7=0
CM6=0
"0" CM5=0(4MHz oscillating)
CM4=1(32kHz oscillating )
CM3=0
MISRG2(bit2)=0(High-speed RC
oscillating)
"0"
mode(f(φ)=approximately 2MHz)
CM7=0
CM6=0
CM5=1(4MHz oscillating stopped)
CM4=1(32kHz oscillating )
CM3=0
MISRG2(bit2)=0(High-speed RC
oscillating)
RC oscillation high-speed
Low-speed mode(f(φ)=16kHz)
CM7=1
CM6=0
CM5=1(4MHz oscillating stopped)
CM4=1(32kHz oscillating)
CM3=0
MISRG2(bit2)=0(High-speed RC
oscillating)
Low-speed mode(f(φ)=16kHz)
CM7=1
CM6=0
CM5=1(4MHz oscillating stopped)
CM4=1(32kHz oscillating)
CM3=0
MISRG2(bit2)=1(High-speed RC
oscillating stopped)
Switch the mode by the allows shown between the mode blocks. (Do not switch between the modes directly without an allow.)
The all modes can be switched to the stop mode or the wait mode and return to the source mode when the stop mode or the wait mode is ended.
Timer operates in the wait mode.
When the stop mode is ended, a delay of approximately 2 ms occurs by connecting Timer 1 in middle/high-speed mode.
When the stop mode is ended, the following is performed.
(1) After the clock is restarted, a delay of approximately 32ms occurs in low-speed mode if Timer 12 count source selection bit is "0".
(2) After the clock is restarted, a delay of approximately 250ms occurs in low-speed mode if Timer 12 count source selection bit is "1".
6 : Wait until oscillation stabilizes after oscillating the main clock XIN before the switching from the low-speed mode to middle/high-speed mode.
7 : The example assumes that 4 MHz is being applied to the XIN pin and 32 kHz to the XCIN pin. φ indicates the internal clock.
8 : Use the 32 kHz RC oscillation enable bit (bit 4 in address 003716) to select XCIN-XCOUT oscillation or 32 kHz RC oscillation.
Notes1 :
2:
3:
4:
5:
MISRG2 (bit 2)
"1"
"0"
high-speed mode(f(φ)=2MHz)
CM7=0
CM6=0
CM5=0(4MHz oscillating)
CM4=1(32kHz oscillating )
CM3=1
MISRG2(bit2)=0(High-speed RC
oscillating)
high-speed mode(f(φ)=2MHz)
CM7=0
MISRG2 (bit 2)
CM6=0
"1"
"0"
CM5=0(4MHz oscillating)
CM4=1(32kHz oscillating)
CM3=1
MISRG2(bit2)=1(High-speed RC
oscillating stopped)
middle-speed mode(f(φ)=500kHz)
CM7=0
CM6=1
CM5=0(4MHz oscillating)
CM4=1(32kHz oscillating)
CM3=1
MISRG2(bit2)=1(High-speed RC
oscillatin stopped)
"0"
XIN oscillation
XIN oscillation
"0"
MISRG2 (bit 2)
"1"
XIN oscillation
middle-speed mode(f(φ)=500kHz)
CM7=0
CM6=1
CM3
CM5=0(4MHz oscillating)
"1"
CM4=0(32kHz stopped)
CM3=1
MISRG2(bit2)=0(High-speed RC oscillating)
"0"
CM4
"1"
"
C
" 1 M4
C "
" 1 M6
"0
"
"0"
"0"
CM4
"1"
XIN oscillation
CM6
"1"
"0
"0"
CM4
"1"
"0"
CM4
"1"
"0"
CM7
"1"
"1"
"0"
CM4
"1"
CM6
"1"
"
"0"
CM6
"1"
"
XIN oscillation
"0
CM5
"1"
"
C
" 1 M4
C "
" 0 M6
"0
"
middle-speed mode(f(φ)=500 kHz)
CM7=0
CM6=1
CM5=0(4MHz oscillating)
CM4=0(32kHz stopped)
CM3=1
MISRG2(bit2)=1(High-speed RC
oscillating stopped)
"
"0"
"1
CM7
"1"
CM "
"0 6
CM "
"1
MISGR2
(bit2)
"1"
"0"
4
RESET
4
"1
"
High-speed RC oscillation
stop bit
0 : Oscillating
1 : Stopped
MISRG2
(003716)
b7
CM5
"1"
CM5
"1"
RC oscillating middle-speed mode(f(φ)
=approximately 500kHz)
CM7=0
CM6=1
CM5=1(4MHz oscillating stopped)
CM4=1(32kHz oscillating)
CM3=0
MISRG2(bit2)=0(High-speed RC
oscillating)
"
M
b2
"1
C
RC oscillating middle-speed mode(f(φ)=
approximately 500kHz)
CM7=0
CM6=1
CM5=1(4MHz oscillating stopped)
CM4=0(32kHz stopped)
CM3=0
MISRG2(bit2)=0(High-speed RC
oscillating)
"0
C "
" 0 M6
"
"0"
"0"
"
"0
7
CM "
"
"1
"1 6
CM "
"0
CM6
"1"
"1
"0"
CM4
"1"
Feb 18, 2005 page 58 of 85
REJ03B0122-0101
b3
"0"
"0"
RC oscillating middle-speed mode(f(φ)=
approximately 500kHz)
CM7=0
CM6=1
CM5=0(4MHz oscillating)
CM4=0(32kHz stopped)
CM3=0
MISRG2(bit2)=0(High-speed RC
oscillating)
"0"
Fig. 67 State transitions of system clock
CPUM
Clock source switch bit
0 : Built-in high-speed oscillating function
1 : XIN-XOUT oscillation function
CM4 : Port Xc switch bit
0 : I/O port function (stop oscillating)
1 : XCIN-XCOUT oscillating function
CM5 : Main clock(XIN- XOUT) stop bit
0 : oscillating
1 : stopped
CM7,CM6: Main clock division ratio selection bits
b7 b6
0 0 : f= f(XIN)/2 (high-speed mode)
0 1 : f= f(XIN)/8 (middle-speed mode)
1 0 : f= f(XCIN)/2 (low-speed mode)
1 1 : Not available
CPU mode register
(003B16)
RC oscillating middle-speed mode(f(φ)=
approximately 500kHz)
CM7=0
CM6=1
CM5=0(4MHz oscillating)
CM4=1(32kHz oscillating)
CM3=0
MISRG2(bit2)=0(High-speed RC
oscillating)
CM4
"1"
MISRG2 (bit 2)
7512 Group
7512 Group
FLASH MEMORY MODE
Summary
The 7512 Group (flash memory version) has flash memory that
can be rewritten with a single power source.
For this flash memory, two flash memory modes are available in
which to read, program, and erase: the parallel I/O mode in which
the flash memory can be manipulated using a programmer and
the CPU rewrite mode in which the flash memory can be manipulated by the Central Processing Unit (CPU).
Table 13 lists the summary of the 7512 Group (flash memory version).
The flash memory of the 7512 Group is divided into 4 blocks of
User ROM area and Boot ROM area as shown in Figure 68.
In addition to the ordinary User ROM area to store the MCU operation control program, the flash memory has a Boot ROM area
that is used to store a control program in a Boot mode. The user
can write a rewrite control program in this Boot ROM area that
suits the user’s application system. This Boot ROM area can be
rewritten in only parallel I/O mode.
Table 13 Summary of the 7512 Group (flash memory version)
Item
Specifications
Power source voltage
Vcc = 2.5V±2%
Program / Erase voltage
Vcc = 2.5V±2%
Flash memory mode
2 modes (Parallel I/O mode, CPU rewrite mode)
Erase block division User ROM area
Boot ROM area
Refer to the Figure 68
1 block (4K bytes) (Note 1)
Program method
Byte program
Erase method
Batch erasing
Program/Erase control method
Program/Erase control by software command
Number of commands
5 commands
Number of program/ Block 0 to Block 3
100 times
Erase times
1K times
Block A, Block B
ROM code protection
Available in parallel I/O mode
Note 1: This Boot ROM area can be rewritten in only parallel I/O mode.
Feb 18, 2005 page 59 of 85
REJ03B0122-0101
7512 Group
(1) CPU Rewrite Mode
Microcomputer Mode and Boot Mode
In CPU rewrite mode, the internal flash memory can be operated
on (read, program, or erase) under control of the Central Processing Unit (CPU).
In CPU rewrite mode, only the User ROM area shown in Figure 68
can be rewritten; the Boot ROM area cannot be rewritten. Make
sure the program and block erase commands are issued for only
the User ROM area and each block area.
The control program for CPU rewrite mode can be stored in either
User ROM or Boot ROM area. In the CPU rewrite mode, because
the flash memory cannot be read from the CPU, the rewrite control program must be transferred to internal RAM area to be
executed before it can be executed.
The control program for CPU rewrite mode must be written into
the User ROM or Boot ROM area in parallel I/O mode beforehand.
See Figure 68 for details about the Boot ROM area.
Normal microcomputer mode is entered when the microcomputer
is reset with pulling CNVSS pin low. In this case, the CPU starts
operating using the control program in the User ROM area.
When the microcomputer is reset by pulling the P24/SDA2/RXD pin
high, the CNVss pin high, the CPU starts operating using the control program in the Boot ROM area (program start address is
FFFC16, FFFD16 fixation). This mode is called the “Boot” mode.
Block Address
Block addresses refer to the maximum address of each block.
These addresses are used in the block erase command.
000016
User ROM area
SFR area
100016
Data block B : 2K Byte
004016
Internal RAM area
(1.5K Byte)
RAM
180016
Data block A : 2K Byte
200016
Not used
063F16
3FFF16
400016
Block 3 : 16K Byte
0FE016
SFR area
800016
0FFF16
100016
Block 2 : 16K Byte
Notes 1: The Boot ROM area can be rewritten in only parallel
input/output mode. (Access to any other areas is inhibited.)
2: To specify a block, use the maximum address in the block.
C00016
Internal flash memory area
(52K Byte)
Block 1 : 8K Byte
F00016
E00016
Boot ROM area
4K Byte
Block 0 : 8K Byte
FFFF16
FFFF16
Fig. 68 Block diagram of built-in flash memory (M37512FCHP)
Feb 18, 2005 page 60 of 85
REJ03B0122-0101
FFFF16
7512 Group
Table 14 The difference between EW0 mode and EW1 mode
Items
EW0 mode
Processor mode
Single-chip mode
Program area for rewrite control program User ROM area
Operating area for rewrite control program Rewrite program in the flash memory area
must be transfered from another area than
flash memory area (ex. RAM area) and executed.
Rewritable area
User ROM area
Restriction of software command
Nothing
The mode after program or erase
CPU status at program and erase state
Read status register mode
Executing
How to detect the flash memory status
•Read the RY/BY status flag, program status
flag, erase status flag of the flash memory
control register 0 on program.
•Read the SR7, SR5, SR4 of the status register
after execute the read status command
Write "1" to the erase suspend enable bit and
erase suspend requirement bit of the flash
memory control register on program.
_____
The condition for shift to erase suspend
status (Note 2)
EW1 mode
Single-chip mode
User ROM area
Rewrite program can be executed in the User
ROM area. (Note 3)
User ROM area except rewrite program existing
block and interrupt vector area (Note 1)
•Program, Block erase command
Command execution for block existing rewrite
program is prohibited.
• Read status register command execution is
prohibited
Read array mode
Hold state (I/O port is kept the execution previous
state.)
_____
•Read the RY/BY status flag, program status
flag, erase status flag of the flash memory
control register 0 on program.
Write "1" to the erase suspend enable bit of
the flash memory control register 1 on program and then interrupt request which is
enabled occurred.
Note 1 Write "1" to the 8KB userblock E/W prohibit bit of the flash memory control register 1, rewrite operation on block 0, block 1 is enabled.
Note 2 The enable time for reading flash memory after shifting to erase suspend status is max td(SR-ES).
Note 3 Do not execute rewrite program on RAM area. (Do not execute program on RAM area whether rewrite control program or application
program.)
●EW0 mode
Setting "1" to CPU rewrite mode selection bit of flash memory control register 0, CPU rewrite mode starts, and software command
becomes available. At this time, EW1 mode selection bit of the
flash memory control register 1 becomes "0" (EW0 mode). For
CPU rewrite mode select bit to be set to "1", it is necessary to
write "0" and then "1" in succession.
Program or erase operation is controlled by software command.
The state of program or erase end can be checked by reading the
flash memory control register or status register.
In case of changing to the erase suspend mode during the erase
operation, set the erase suspend enable bit to "1", and set the
erase suspend request bit "1". And wait td(SR-ES). The user ROM
area can be accessed after checking the erase suspend flag becomes "1". Setting the erase suspend request bit "0"(Erase
restart), erase operation restarts.
Feb 18, 2005 page 61 of 85
REJ03B0122-0101
●EW1 mode
Setting the EW1 mode selection bit "1" (write "0" and then "1" in
succession) after setting the CPU rewrite mode selection bit "1"
(write "0" and then "1" in succession), the EW1 mode starts.
The state of the program or erase end can be checked by reading
the flash memory control register 0. Do not execute the software
command of the read status register in the EW1 mode.
Changing the erase suspend function to effective state, execute
the block erase command after setting erase suspend enable bit
"1". And the interrupt which triggers off shifting to erase suspend
state must be enabled. td(SR-ES) later after interrupt request,
erase sequence shift to erase suspend state, and interrupt is accepted.
When the interrupt request occurs, erase suspend request bit becomes "1" automatically, and erase operation is suspended. In
case of the erase operation is not completed (RY/BY status flag is
"0") after interrupt routine ends, setting the erase suspend request
bit "0", and execute the block erase command again.
7512 Group
Outline Performance (CPU Rewrite Mode)
CPU rewrite mode is usable in the single-chip or Boot mode. The
only User ROM area can be rewritten in CPU rewrite mode.
In CPU rewrite mode, the CPU erases, programs and reads the internal flash memory by executing software commands. This
rewrite control program must be transferred to the RAM before it
can be executed.
The MCU enters CPU rewrite mode by setting “1” to the CPU Rewrite
Mode Select Bit (bit 1 of address 0FE016). Software commands are
accepted once the mode is entered.
Use software commands to control program and erase operations.
Whether a program or erase operation has terminated normally or
in error can be verified by reading the status register.
Figure 69 shows the flash memory control register 0.
Bit 0 is the RY/BY status flag used exclusively to read the operating status of the flash memory. During programming and erase
operations, it is “0” (busy). Otherwise, it is “1” (ready).
Bit 1 is the CPU Rewrite Mode Select Bit. When this bit is set to
“1”, the MCU enters CPU rewrite mode. Software commands are
accepted once the mode is entered. In CPU rewrite mode, the
CPU becomes unable to access the internal flash memory directly.
b7
Therefore, use the control program in the RAM for write to bit 1. To
set this bit to “1”, it is necessary to write “0” and then write “1” in
succession. The bit can be set to “0” by only writing “0”.
Bit 2 is 8KB user block E/W enable bit. Setting this bit and bit 4 (All
user block E/W enable bit) of the flash memory control register 2
(0FE216) according to the table T-3, E/W protect is done at CPU
Rewrite mode for User block
Bit 3 is the flash memory reset bit used to reset the control circuit of
internal flash memory. This bit is used when exiting CPU rewrite
mode and when flash memory access has failed. When the CPU
Rewrite Mode Select Bit is “1”, setting “1” for this bit resets the control circuit. To release the reset, it is necessary to set this bit to “0”.
Bit 5 is User ROM area selection bit, and this bit is only available
in Boot mode. Setting this bit “1”, User ROM area can be accessed, and CPU rewrite is available.
Bit 6 is the program status flag, and this flag changes “1” when
flash memory write operation ends at abnormal state. If program
error occurs, corresponding block is not available.
Bit 7 is the erase status flag, and this flag changes “1” when flash
memory erase operation ends at abnormal state. If erase error occurs, corresponding block is not available.
b0
Flash memory control register 0 (address 0FE016)
FMCR0
RY/BY status flag
0: Busy (being programmed or erased)
1: Ready
CPU rewrite mode select bit (Note 1)
0: Normal mode
1: CPU rewrite mode
8 KB user block E/W enable bit (UBEWEN) (Note 1, 2)
0: E/W disable
1: E/W enable
Flash memory reset bit (Note 3,4)
0: Normal operation
1: Reset
Not used (“0” at write)
User ROM area selection bit (Note 5)
0: Boot ROM area accessed
1: User ROM area accessed
Program status flag
0: Passed
1: Error
Erase status flag
0: Passed
1: Error
Notes 1: For this bit to be set to “1”, the user needs to write “0” and then “1” to it in succession.
To reset this bit “0”, only write “0”.
2: This bit is valid when the CPU rewrite mode select bit is “1”.
3: This bit is valid when the CPU rewrite mode select bit is “1”. Fix this bit “0” when the CPU
rewrite mode select bit is “0”.
4: Setting this bit “1” (Resetting the flash memory control circuit), access to the flash memory
is disabled for 10 µsec.
5: Writing this bit must be executed in the RAM.
Fig. 69 Structure of flash memory control register
Feb 18, 2005 page 62 of 85
REJ03B0122-0101
7512 Group
Figure 70 shows the flash memory control register 1.
Bit 0 is erase suspend enable bit, and setting this bit “1” erase
suspend mode which makes erase operation interrupt briefly during erase operation. To set this bit to “1”, it is necessary to write “0”
and then write “1” in succession. This bit can be set to “0” by only
writing “0”.
Bit 1 is erase suspend request bit. Writing this bit “1” when the
b7
erase suspend enable bit is “1”, erase operation is interrupted.
Bit 6 is erase suspend flag, and becomes “0” during erase operation.
Figure 71 shows flash memory control register 2.
Bit 1 is EW1 mode select bit. Setting this bit “1”, EW1 mode becomes available.
Bit 4 is All user block E/W enable bit.
b0
Flash memory control register 1
(0FE116, Initial 4016)
FMCR1
Erase suspend enable bit (Note 1)
0 : Erase suspend invalid
1 : Erase suspend valid
Erase suspend request bit (Note 2)
0 : Resume erase operation (No request)
1 : Interrupt erase operation (Requested)
Not used (“0” at write)
Erase suspend flag
0 : Executing erase operation
1 : Suspending erase operation (Erase suspend mode)
Not used (“0” at write)
Note 1 To set this bit “1”, write “0” and then write “1” in succession. To reset
this bit “0”, only write “0”.
2 This bit is valid only when erase suspend enable bit is “1”.
Fig. 70 Structure of flash memory control register 1
b7
b0
Flash memory control register 2
(0FE216, Initial 4516)
FMCR2
Reserved (returns unknown when read)
EW1 mode select bit (Note 1, 3)
0 : E/W0 mode
1 : E/W1 mode
Reserved (returns unknown when read)
All user block E/W enable bit (Note 1, 2)
0 : E/W prohibit
1 : E/W enable
Reserved (“0” at write, returns “0” at read)
Not used (Indefinite at read)
Not used (returns “0” at read)
Note 1 To set this bit “1”, it is necessary to write “0” and then write “1” in
succession. This bit can be set to “0” by only writing “0”.
Note 2 This bit can be written only CPU rewrite mode selection bit “1”.
Note 3 Setting this bit “1” must be done at CPU rewrite mode select bit is “1”.
Fig. 71 Structure of flash memory control register 2
Table. 15 Specification of E/W protect
All user block
E/W enable bit
8KB user block
E/W enable bit
0
0
Protect
Protect
Enable
0
1
Protect
Protect
Enable
1
0
Protect
Enable
Enable
1
1
Enable
Enable
Enable
Feb 18, 2005 page 63 of 85
REJ03B0122-0101
8 KBX2 block
16 KBX2 block
Data block
Addresses C00016 to FFFF16 Addresses 400016 to BFFF16 Addresses 100016 to 1FFF16
7512 Group
Figure 72 shows a flowchart for setting/releasing CPU rewrite
mode.
E/W0 mode
E/W1 mode
Start
Start
Single-chip mode or Boot mode
Single-chip mode or Boot mode
Set CPU mode register (Note 1)
Set CPU mode register (Note 1)
Transfer CPU rewrite mode control program
to RAM
Jump to control program transferred in RAM
(Subsequent operations are executed by control
program in this RAM)
Set CPU rewrite mode select bit to “1”
(by writing “0” and then “1” in succession)
Set All user block E/W enable bit “1”
(by writing “0” and then “1” in succession)
Set 8KB user block E/W enable bit
(writing “0” in case of E/W prohibit, writing “0” and
then “1” in succession, in case of E/W enable)
Set CPU rewrite mode select bit to “1”
(by writing “0” and then “1” in succession)
Set E/W1 mode select bit = “1”
(by writing “0” and then “1” in succession)
Set All user block E/W enable bit “1”
(by writing “0” and then “1” in succession)
Set 8KB user block E/W enable bit
(writing “0” in case of E/W prohibit, writing “0” and
then “1” in succession, in case of E/W enable)
Check CPU rewrite mode entry flag
Using software command execute erase
program, or other operation
Check CPU rewrite mode entry flag
Execute read array command (Note 2)
Using software command execute erase,
program, or other operation
Set All user block E/W enable bit = “0”
Set 8KB user block E/W enable bit = “0”
Execute read array command (Note 2)
Write “0” to CPU rewrite mode select bit
Set All user block E/W enable bit = “0”
Set 8KB user block E/W enable bit = “0”
End
Write “0” to CPU rewrite mode select bit
End
Notes 1: Set bits 6, 7 (main clock division ratio selection bits) at CPU mode register (003B16).
2: Before exiting the CPU rewrite mode after completing erase or program operation,
always be sure to execute the read array command.
Fig. 72 CPU rewrite mode set/release flowchart
Feb 18, 2005 page 64 of 85
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7512 Group
Precautions on CPU Rewrite Mode
Described below are the precautions to be observed when rewriting
the flash memory in CPU rewrite mode.
(1) Operation speed
During CPU rewrite mode, set the internal clock frequency 4.0
MHz or less using the main clock division ratio selection bits (bit
6, 7 at 003B16).
(2) Instructions inhibited against use
The instructions which refer to the internal data of the flash
memory cannot be used during EW0 mode .
(3) Interrupts inhibited against use
The interrupts cannot be used during EW0 mode because they
refer to the internal data of the flash memory.
In the EW1 mode, the interrupts cannot be used during program
operation or erase operation which is disabled erase suspend
function.
(4) Watchdog timer
In case of the watchdog timer has been running already, the internal reset generated by watchdog timer underflow does not
happen, because of watchdog timer is always clearing during
program or erase operation.
(5) Reset
Reset is always valid. In case of CNVSS = H when reset is released, boot mode is active. So the program starts from the address contained in address FFFC16 and FFFD16 in boot ROM
area.
Feb 18, 2005 page 65 of 85
REJ03B0122-0101
7512 Group
Software Commands (CPU Rewrite Mode)
Table 16 lists the software commands.
After setting the CPU Rewrite Mode Select Bit of the flash memory
control register to “1”, execute a software command to specify an
erase or program operation.
Each software command is explained below.
●Read Array Command (FF16)
The read array mode is entered by writing the command code
“FF16” in the first bus cycle. When an address to be read is input in
one of the bus cycles that follow, the contents of the specified address are read out at the data bus (D0 to D7).
The read array mode is retained intact until another command is
written.
Do not execute this command for rewrite control program address
in the EW1 mode.
In the E/W0 mode, when the program starts, the read status register mode is entered automatically and the contents of the status
register is read at the data bus (D0 to D7). The status register bit 7
(SR7) is set to “0” at the same time the write operation starts and
is returned to “1” upon completion of the write operation. In this
case, the read status register mode remains active until the read
array command (FF16) is written.
Start
●Read Status Register Command (7016)
The read status register mode is entered by writing the command
code “7016” in the first bus cycle. The contents of the status register are read out at the data bus (D0 to D7) by a read in the second
bus cycle.
The status register is explained in the next section.
In the EW1 mode, do not execute this command.
Write 4016
Write Write address
Write data
Status register
read
●Clear Status Register Command (5016)
This command is used to clear the bits SR4 and SR5 of the status
register after they have been set. These bits indicate that operation has ended in an error. To use this command, write the
command code “5016” in the first bus cycle.
RY/BY status flag = “1 ”?
NO
YES
●Program Command (4016)
Program operation starts when the command code “4016” is written in the first bus cycle. Then, if the address and data to program
are written in the 2nd bus cycle, program operation (data programming and verification will start.
Whether the write operation is completed can be confirmed by
_____
reading the status register or the RY/BY Status Flag.
____
The RY/BY Status Flag is “0” (busy) during write operation and “1”
(ready) when the write operation is completed as is the status register bit 7.
NO
Program status flag = “0 ”?
Program
error
YES
Program completed
Fig. 73 Program flowchart
Table 16 List of software commands (CPU rewrite mode)
Command
Cycle number
Mode
Read array
1
Write
Read status register
2
Clear status register
First bus cycle
Data
Address
(D0 to D7)
X
Second bus cycle
Data
Mode
Address
(D0 to D7)
(Note 1)
FF16
Write
X
7016
1
Write
X
5016
Program
2
Write
X
4016
Write
WA (Note 3)
Block erase
2
Write
X
2016
Write
BA
Notes 1: X denotes a given address in the User ROM area .
2: SRD = Status Register Data
3: WA = Write Address, WD = Write Data
4: BA = Block Address to be erased (Input the maximum address of each block.)
Feb 18, 2005 page 66 of 85
REJ03B0122-0101
Read
X
(Note 4)
SRD
(Note 2)
WD (Note 3)
D016
7512 Group
●Block Erase Command (2016/D016)
By writing the command code “2016” in the first bus cycle and the
confirmation command code “D016” and the block address in the
second bus cycle that follows, the block erase (erase and erase
verify) operation starts for the block address of the flash memory
to be specified.
Whether the block erase operation is completed can be confirmed
____
by reading the status register or the RY/BY Status Flag of flash
memory control register.
____
The RY/BY Status Flag is “0” during block erase operation and “1”
when the block erase operation is completed as is the status register bit 7.
In case of using erase suspend function in the EW0 mode, check
that the erase sequence is shifted to erase suspend mode with
erase suspend flag. Reading the erase status flag after block
erase, the result of the block erase is gotten.
Do not execute this command for rewrite control program address
in the EW1 mode.
In the EW0 mode, at the same time the block erase operation
starts, the read status register mode is automatically entered, so
that the contents of the status register can be read out. The status
register bit 7 (SR7) is set to “0” at the same time the block erase
operation starts and is returned to “1” upon completion of the
block erase operation. In this case, the read status register mode
remains active until the read array command (FF16) is written.
Start
Write 2016
Write
D016
Block address
Status register
read
RY/BY status flag = “1 ”?
NO
YES
NO
Erase status flag = “0 ”?
Erase error
YES
Erase completed
Fig. 74 Erase flowchart in no erase suspend
Feb 18, 2005 page 67 of 85
REJ03B0122-0101
7512 Group
Status Register (SRD)
The status register shows the operating status of the flash
memory and whether erase operations and programs ended successfully or in error. It can be read in the following ways: in the
EW0 mode.
(1) By reading an arbitrary address from the User ROM area after
writing the read status register command (7016)
(2) By reading an arbitrary address from the User ROM area in the
period from when the program starts or erase operation starts
to when the read array command (FF16) is input.
•Erase status (SR5)
The erase status indicates the operating status of erase operation.
If an erase error occurs, it is set to “1”. When the erase status is
cleared, it is set to “0”.
Also, the status register can be cleared by writing the clear status
register command (5016).
After reset, the status register is set to “8016”.
Table 17 shows the status register. Each bit in this register is explained below.
If “1” is written for any of the SR5 and SR4 bits, the program,
erase all blocks, and block erase commands are not accepted.
Before executing these commands, execute the clear status register command (5016) and clear the status register.
Also, if any commands are not correct, both SR5 and SR4 are set
to “1”.
•Program status (SR4)
The program status indicates the operating status of write operation. When a write error occurs, it is set to “1”.
The program status is set to “0” when it is cleared.
•Sequencer status (SR7)
The sequencer status indicates the operating status of the flash
memory. This bit is set to “0” (busy) during write or erase operation
and is set to “1” when these operations ends.
After power-on, the sequencer status is set to “1” (ready).
Table 17 Definition of each bit in status register (SRD)
Symbol
Status name
SR7 (bit7)
Sequencer status
SR6 (bit6)
SR5 (bit5)
Reserved
Erase status
SR4 (bit4)
SR3 (bit3)
Program status
Reserved
SR2 (bit2)
SR1 (bit1)
Reserved
Reserved
SR0 (bit0)
Reserved
Feb 18, 2005 page 68 of 85
REJ03B0122-0101
Definition
“1”
“0”
Ready
-
Busy
-
Terminated in error
Terminated in error
Terminated normally
Terminated normally
-
-
-
-
7512 Group
Full Status Check
By performing full status check, it is possible to know the execution results of erase and program operations. Figure 75 shows a
full status check flowchart and the action to be taken when each
error occurs.
Read status register
Program status flag = “1 ”?
Erase status flag = “1 ”?
YES
Command
sequence error
Execute the clear status register command (5016)
to clear the status register. Try performing the
operation one more time after confirming that the
command is entered correctly.
NO
Erase status flag = “0 ”?
NO
Erase error
Should an erase error occur, the block in error
cannot be used.
Program error
Should a program error occur, the block in error
cannot be used.
YES
Program status flag = “0 ”?
NO
YES
End (erase, program)
Note: When one of erase status flag and program status flag is set to “1”, none of
the read array, the program, erase all blocks, and block erase commands is
accepted. Execute the clear status register command (5016) before executing
these commands.
Fig. 75 Full status check flowchart and remedial procedure for errors
Feb 18, 2005 page 69 of 85
REJ03B0122-0101
7512 Group
Functions To Inhibit Rewriting Flash Memory
Version
To prevent the contents of internal flash memory from being read
out or rewritten easily, this MCU incorporates a ROM code protect
function for use in parallel I/O mode.
●ROM Code Protect Function (in Parallel I/O Mode)
The ROM code protect function is the function to inhibit reading
out or modifying the contents of internal flash memory by using
the ROM code protect control (address FFDB 16 ) in parallel I/O
mode. Figure 76 shows the ROM code protect control (address
FFDB16). (This address exists in the User ROM area.)
If one or both of the pair of ROM Code Protect Bits is set to “0”,
the ROM code protect is turned on, so that the contents of internal
flash memory are protected against readout and modification. The
b7
ROM code protect is implemented in two levels. If level 2 is selected, the flash memory is protected even against readout by a
shipment inspection LSI tester, etc. When an attempt is made to
select both level 1 and level 2, level 2 is selected by default.
If both of the two ROM Code Protect Reset Bits are set to “00”, the
ROM code protect is turned off, so that the contents of internal
flash memory can be read out or modified. Once the ROM code
protect is turned on, the contents of the ROM Code Protect Reset
Bits cannot be modified in parallel I/O mode. Use the CPU rewrite
mode to rewrite the contents of the ROM Code Protect Reset Bits.
Rewriting of only the ROM code protect control address (address
FFDB16) cannot be performed. When rewriting the ROM code protect reset bit, rewrite the whole user ROM area (block 0)
containing the ROM code protect control address.
b0
1 1 ROM code protect control register (address FFDB16) (Note 1)
ROMCP
Reserved bits (“1” at read/write)
ROM code protect level 2 set bits (ROMCP2) (Notes 1, 2)
b3b2
0 0: Protect enabled
0 1: Protect enabled
1 0: Protect enabled
1 1: Protect disabled
ROM code protect reset bits (ROMCR) (Note 3)
b5b4
0 0: Protect removed
0 1: Protect set bits effective
1 0: Protect set bits effective
1 1: Protect set bits effective
ROM code protect level 1 set bits (ROMCP1) (Note 2)
b7b6
0 0: Protect enabled
0 1: Protect enabled
1 0: Protect enabled
1 1: Protect disabled
Notes 1: When ROM code protect is turned on, the internal flash memory is protected against
readout or modification in parallel I/O mode.
2: When ROM code protect level 2 is turned on, ROM code readout by a shipment inspection
LSI tester, etc. also is inhibited.
3: The ROM code protect reset bits can be used to turn off ROM code protect level 1 and ROM
code protect level 2. However, since these bits cannot be modified in parallel I/O mode, they
need to be rewritten in CPU rewrite mode.
Fig. 76 Structure of ROM code protect control
Feb 18, 2005 page 70 of 85
REJ03B0122-0101
7512 Group
(2) Parallel I/O Mode
Parallel I/O mode is the mode which parallel output and input software command, address, and data required for the operations
(read, program, erase, etc.) to a built-in flash memory. Use the exclusive external equipment flash programmer which supports the
7512 Group (flash memory version). Refer to each programmer
maker’s handling manual for the details of the usage.
User ROM and Boot ROM Areas
In parallel I/O mode, the user ROM and boot ROM areas shown in
Figure 13 can be rewritten. Both areas of flash memory can be operated on in the same way.
The boot ROM area is 4K bytes in size. It is located at addresses
F00016 through FFFF16. Make sure program and block erase operations are always performed within this address range. (Access to any
location outside this address range is prohibited.)
In the Boot ROM area, an erase block operation is applied to only
one 4K byte block.
Feb 18, 2005 page 71 of 85
REJ03B0122-0101
7512 Group
Electrical characteristics for Flash ROM E/W Cycles
Table 18 Characteristics (Note 1) for 100 E/W cycle products
(VCC = 2.5V±2%, Ta = 0 to 60 oC, unless otherwise noted)
Symbol
—
—
—
td(SR–ES)
—
Parameter
Condition
Erase/Write cycle (Note 3)
Byte write time
VCC=2.5V, Ta=25°C
Block erase time
2Kbyte block
VCC=2.5V, Ta=25°C
8Kbyte block
16Kbyte block
Time delay from Suspend Request until Erase Suspend
Data retention time (Note 5)
Min.
Limits
Typ.
(Note 2)
Max.
100 (Note 4)
75
0.2
0.4
0.7
600
9
9
9
8
20
Unit
cycle
µs
s
s
s
ms
year
Table 19 Characteristics (Note 6) for 1000 E/W cycle products [Block A and Block B (Note 7)]
(VCC = 2.5V±2%, Ta = –20 to 85 oC, unless otherwise noted)
Symbol
—
—
—
td(SR–ES)
Parameter
Condition
Min.
Erase/Write cycle (Note 3, 8, 9)
1000 (Note 4)
Byte write time
VCC=2.5V, Ta=25°C
Block erase time (2Kbyte block)
VCC=2.5V, Ta=25°C
Time delay from Suspend Request until Erase Suspend
Limits
Typ.
(Note 2)
Max.
100
0.3
8
Unit
cycle
µs
s
ms
Notes 1: Specified for all blocks.
2: VCC=2.5V; Ta=25°C.
3: Definition of E/W cycle: Each block may be written to a variable number of times - up to a maximum of the total number of distinct byte addresses for every block erase. Performing multiple writes to the same address before an erase operation is prohibited.
4: Maximum number of E/W cycles for which operation is guaranteed.
5: At Ta=55°C condition
6: Specified for Block A and Block B E/W cycles > 100
7: To reduce the number of E/W cycles, a block erase should ideally be performed after writing as many different byte addresses (only one time each)
as possible. It is important to track the total number of block erases.
8: Should erase error occur during block erase, attempt to execute clear status register command, then block erase command at least three times until erase error disappears.
9: Customers desiring E/W failure rate information should contact their Renesas technical support representative.
Erase suspend request bit
(Interrupt request)
Erase suspend flag
td(SR-ES)
Fig. 77 The transition of the timing of the erase / erase suspend
Feb 18, 2005 page 72 of 85
REJ03B0122-0101
7512 Group
NOTES ON PROGRAMMING
Processor Status Register
The contents of the processor status register (PS) after a reset are
undefined, except for the interrupt disable flag (I) which is “1.” After a reset, initialize flags which affect program execution. In
particular, it is essential to initialize the index X mode (T) and the
decimal mode (D) flags because of their effect on calculations.
Interrupts
The contents of the interrupt request bits do not change immediately after they have been written. After writing to an interrupt
request register, execute at least one instruction before performing a BBC or BBS instruction.
Decimal Calculations
• To calculate in decimal notation, set the decimal mode flag (D)
to “1”, then execute an ADC or SBC instruction. After executing
an ADC or SBC instruction, execute at least one instruction before executing a SEC, CLC, or CLD instruction.
• In decimal mode, the values of the negative (N), overflow (V),
and zero (Z) flags are invalid.
Timers
If a value n (between 0 and 255) is written to a timer latch, the frequency division ratio is 1/(n+1).
Multiplication and Division Instructions
• The index X mode (T) and the decimal mode (D) flags do not affect the MUL and DIV instruction.
• The execution of these instructions does not change the contents of the processor status register.
Serial interface
In clock synchronous serial I/O, if the receive side is using an external clock and it is to output the S RDY signal, set the transmit
enable bit, the receive enable bit, and the SRDY output enable bit
to “1.”
Serial I/O continues to output the final bit from the TXD pin after
transmission is completed. SOUT2 pin for serial I/O2 goes to high
impedance after transfer is completed.
When in serial I/Os 1 and 3 (clock-synchronous mode) or in serial
I/O2, an external clock is used as synchronous clock, write transmission data to the transmit buffer register or serial I/O2 register,
during transfer clock is “H.”
A/D Converter
The comparator uses capacitive coupling amplifier whose charge
will be lost if the clock frequency is too low.
Therefore, make sure that f(XIN) is at least on 500 kHz during an
A/D conversion.
Do not execute the STP instruction during an A/D conversion.
Instruction Execution Time
The instruction execution time is obtained by multiplying the period of the internal clock φ by the number of cycles needed to
execute an instruction.
The number of cycles required to execute an instruction is shown
in the list of machine instructions.
The period of the internal clock φ is double of the X IN period in
high-speed mode.
NOTES ON USAGE
Handling of Power Source Pins
Ports
The contents of the port direction registers cannot be read. The
following cannot be used:
• The data transfer instruction (LDA, etc.)
• The operation instruction when the index X mode flag (T) is “1”
• The instruction with the addressing mode which uses the value
of a direction register as an index
• The bit-test instruction (BBC or BBS, etc.) to a direction register
• The read-modify-write instructions (ROR, CLB, or SEB, etc.) to
a direction register.
Use instructions such as LDM and STA, etc., to set the port direction registers.
Feb 18, 2005 page 73 of 85
REJ03B0122-0101
In order to avoid a latch-up occurrence, connect a capacitor suitable for high frequencies as bypass capacitor between power
source pin (VCC pin) and GND pin (VSS pin), and between power
source pin (VCC pin) and analog power source input pin (AVSS
pin). Besides, connect the capacitor to as close as possible. For
bypass capacitor which should not be located too far from the pins
to be connected, a ceramic capacitor of 0.01 µF–0.1 µF is recommended.
Power Source Voltage
When the power source voltage value of a microcomputer is less
than the value which is indicated as the recommended operating
conditions, the microcomputer does not operate normally and may
perform unstable operation. In a system where the power source
voltage drops slowly when the power source voltage drops or the
power supply is turned off, reset a microcomputer when the power
source voltage is less than the recommended operating conditions
and design a system not to cause errors to the system by this unstable operation.
7512 Group
ELECTRICAL CHARACTERISTICS
Table 20 Absolute maximum ratings (Executing flash memory mode, flash memory electrical characteristics is applied.)
Symbol
VCC
VI
VI
VI
VI
VO
VO
Pd
Topr
Tstg
Parameter
Conditions
Power source voltage
Input voltage P00–P07, P20, P21, P26, P27,
P30–P35, P40–P42, P45, ADVREF,
AVCC, ISENS1
Input voltage P10–P17, P22–P25, P43, P44
All voltages are based on VSS.
Input voltage RESET, XIN
Output transistors are cut off.
Input voltage CNVSS
Output voltage P00–P07, P20, P21, P26, P27,
P30–P35, P40–P42, P45, XOUT
Output voltage P10–P17, P22–P25, P43, P44
Power dissipation
Ta = 25 °C
Operating temperature
Storage temperature
Ratings
–0.3 to 3.2
Unit
V
–0.3 to VCC +0.3
V
–0.3 to 5.8
–0.3 to VCC +0.3
–0.3 to VCC +0.3
V
V
V
–0.3 to VCC +0.3
V
–0.3 to 5.8
300
–20 to 85
–40 to 125
V
mW
°C
°C
Table 21 Recommended operating conditions (1)
(VCC = 2.5V±2%, Ta = –20 to 85 °C, unless otherwise noted)
Symbol
VCC
VSS
ADVREF
ADVSS
VIA
AVCC
AVSS
ISENS0
ISENS1
VIH
VIH
VIH
VIH
VIH
VIL
VIL
VIL
VIL
VIL
Parameter
Power source voltage (At 4 MHz)
Power source voltage
A/D convert reference voltage
A/D convert power source voltage
Analog input voltage AN0–AN5, AN8–AN11
Analog power source voltage
Analog power source voltage
Analog input voltage
Analog input voltage
“H” input voltage
P00–P07, P20, P21, P26, P27, P30–P35, P40–P42, P45
“H” input voltage
P10–P17, P22–P25, P43, P44
“H” input voltage (when I2C-BUS input level is selected) SDA1, SDA2, SCL1, SCL2
“H” input voltage (when SMBUS input level is selected) SDA1, SDA2, SCL1, SCL2
____________
“H” input voltage
RESET, XIN, CNVSS
“L” input voltage
P00–P07, P10–P17, P20–P27, P30–P35, P40–P45
“L” input voltage (when I2C-BUS input level is selected) SDA1, SDA2, SCL1, SCL2
“L” input voltage (when SMBUS input level is selected) SDA1, SDA2, SCL1, SCL2
____________
“L” input voltage
RESET, CNVSS
“L” input voltage
XIN
Feb 18, 2005 page 74 of 85
REJ03B0122-0101
Min.
2.45
Limits
Typ.
2.5
0
2.0
Max.
2.55
VCC
0
ADVSS
2.45
-0.2
0.8VCC
0.8VCC
0.7VCC
1.4
0.8VCC
0
0
0
0
0
2.5
0
0
VCC
2.55
0.2
VCC
5.8
5.8
5.8
VCC
0.2VCC
0.3VCC
0.6
0.2VCC
0.16VCC
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
7512 Group
Table 22 Recommended operating conditions (2)
(VCC = 2.5V±2%, Ta = –20 to 85 °C, unless otherwise noted)
Symbol
ΣIOH(peak)
ΣIOH(peak)
ΣIOL(peak)
ΣIOL(peak)
ΣIOL(peak)
ΣIOH(avg)
ΣIOH(avg)
ΣIOL(avg)
ΣIOL(avg)
ΣIOL(avg)
IOH(peak)
IOL(peak)
IOL(peak)
IOH(avg)
IOL(avg)
IOL(avg)
f(XIN)
f(XIN)
Parameter
P00–P07, P30–P35 (Note 1)
P20, P21, P26–P27, P40–P42, P45 (Note1)
P00–P07, P30–P35 (Note 1)
P10–P17 (Note1)
P20–P27,P40–P45 (Note1)
P00–P07, P30–P35 (Note1)
P20, P21, P26, P27,P40–P42, P45 (Note1)
P00–P07, P30–P35 (Note1)
P10–P17 (Note 1)
P20–P27,P40–P45 (Note1)
P00–P07, P20, P21, P26, P27, P30–P35, P40–P42,
P45 (Note 2)
“L” peak output current
P00–P07, P20–P27, P30–P35, P40–P45 (Note 2)
“L” peak output current
P10–P17 (Note 2)
“H” average output current
P00–P07, P20, P21, P26, P27, P30–P35, P40–P42,
P45 (Note 3)
“L” average output current
P00–P07, P20–P27, P30–P35, P40–P45 (Note 3)
“L” peak output current
P10–P17 (Note 3)
Main clock input oscillation frequency (VCC = 2.5V ± 2%) (Note 4)
Sub-clock input oscillation frequency (VCC = 2.5V ± 2%) (Note 4,5)
Min.
Limits
Typ.
“H” total peak output current
“H” total peak output current
“L” total peak output current
“L” total peak output current
“L” total peak output current
“H” total average output current
“H” total average output current
“L” total average output current
“L” total average output current
“L” total average output current
“H” peak output current
4
32.768
Max.
–80
–80
80
80
80
–40
–40
40
40
40
–10
Unit
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
10
20
–5
mA
mA
mA
5
15
5
50
mA
mA
MHZ
KHZ
Notes 1: The total output current is the sum of all the currents flowing through all the applicable ports. The total average current is an average value measured
over 100 ms. The total peak current is the peak value of all the currents.
2: The peak output current is the peak current flowing in each port.
3: The average output current IOL(avg), IOH(avg) are average value measured over 100 ms.
4: When the oscillation frequency has a duty cycle of 50%.
5: When using the microcomputer in low-speed mode, set the sub-clock input oscillation frequency on condition that f(XCIN) < f(XIN)/3.
Feb 18, 2005 page 75 of 85
REJ03B0122-0101
7512 Group
Table 23 Electrical characteristics (1)
(VCC = 2.5V±2%, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted)
Limits
Symbol
VOH
VOL
VOL
VT+–VT–
VT+–VT–
VT+–VT–
IIH
IIH
IIH
IIH
IIL
IIL
IIL
IIL
VRAM
Parameter
“H” output voltage
P00–P07, P20, P21, P26, P27,
P30–P35, P40–P42, P45
(Note)
“L” output voltage
P00–P07, P20–P27, P30–P35,
P40–P45
“L” output voltage
P10–P17
Hysteresis
CNTR0, CNTR1, INT0–INT3
Hysteresis
RxD, SCLK1, SIN2, SCLK2
____________
Hysteresis RESET
“H” input current
P00–P07, P20, P21, P26, P27,
P30–P35, P40–P42, P45
“H” input current ISENS0, ISENS1
____________
“H” input current RESET, CNVSS
“H” input current XIN
“L” input current
P00–P07, P10–P17, P20–P27
P30–P35, P40–P45
“L” input current ISENS0, ISENS1
____________
“L” input current
RESET,CNVSS
“L” input current
XIN
RAM hold voltage
Feb 18, 2005 page 76 of 85
REJ03B0122-0101
Test conditions
IOH =–1.0 mA
Min.
Typ.
Max.
VCC –0.8
Unit
V
VCC =2.5V±2%
IOL =1.0 mA
VCC =2.5V±2%
0.8
V
IOL =10 mA
VCC =2.5V±2%
0.8
V
0.4
V
0.4
V
0.4
VI = VCC
5.0
VI = VCC
VI = VCC
VI = VCC
VI = VSS
1.0
5.0
VI = VSS
VI = VSS
VI = VSS
When clock stopped
4
–5.0
–1.0
–5.0
–4
2.0
2.55
V
µA
µA
µA
µA
µA
µA
µA
µA
V
7512 Group
Table 24 Electrical characteristics (2)
(VCC = 2.5V±2%, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted)
Limits
Symbol
ICC
Parameter
Test conditions
Power source current
High-speed mode
f(XIN) = 4 MHz or high-speed RC oscillating (4MHZ)
f(XCIN) = 32.768 kHz or RC oscillating
Output transistors “off”
Current integrator and current detector stopped
High-speed mode
f(XIN) = 4 MHz or high-speed RC oscillating (4MHZ)
(in WIT state)
f(XCIN) = 32.768 kHz
Output transistors “off”
Current integrator and current detector stopped
Low-speed mode
f(XIN) = stopped
f(XCIN) = 32.768 kHz or 32kHz RC oscillating
Output transistors “off”
Current integrator and current detector stopped
Low-speed mode
f(XIN) = stopped
cristal
f(XCIN) = 32.768 kHz (cristal)
or 32kHz RC oscillating (in WIT state)
Output transistors “off”
RC
Current integrator and current detector stopped
Middle-speed mode
f(XIN) = 4 MHz or high-speed RC oscillating (4MHZ)
f(XCIN) = stopped
Output transistors “off”
Current integrator and current detector stopped
Middle-speed mode
f(XIN) = 4 MHz or high-speed RC oscillating (4MHZ)
(in WIT state)
f(XCIN) = stopped
Output transistors “off”
Current integrator and current detector stopped
Increment when A/D conversion is executed
f(XIN) = 4 MHz or high-speed RC oscillating (4MHZ)
Flash memory write
f(XIN) = 4MHZ
VCC = 2.5V
Flash memory erase
f(XIN) = 4MHZ
VCC = 2.5V
Feb 18, 2005 page 77 of 85
REJ03B0122-0101
Min.
Typ.
Max.
1.5
2.5
Unit
mA
0.8
mA
420
µA
6.4
µA
30
µA
1.0
mA
0.8
mA
200
µA
12
mA
22
mA
7512 Group
Table 25 Electrical characteristics (3)
(VCC = 2.5V±2%, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted)
Symbol
ICC
Limits
Parameter
Test conditions
Power source current
Increment when current integrator is executed
Increment when
Short current detector
over current detector Over current detector
is executed.
Charge over current
detector
Wake up current detector
Two detectors used other
than Wake up current detector
Three detectors used other
than Wake up current detector
Wake up current detector
and another use
Wake up current detector
and other two used
Wake up current detector
and other three used
All oscillation stopped Ta = 25 °C (Note)
(in STP state) Output
Ta = 85 °C
transistors "off"
Min.
Typ.
Max.
Unit
800
20
20
20
µA
µA
µA
µA
25
30
µA
µA
40
µA
35
µA
45
µA
55
µA
0.1
1.0
µA
10
µA
Note : When using the 32kHz RC oscillation circuit or the XCIN-XCOUT oscillation, before STP instruction execution select the modes other than the low-speed
mode with the main clock division ratio selection bit (CM7, CM6) and then set ports P21 and P20 to output port ("L" output).
Feb 18, 2005 page 78 of 85
REJ03B0122-0101
7512 Group
Table 26 High-speed RC oscillation circuit electrical characteristics
(VCC = AVCC = 2.5V±2%, VSS =AVSS = 0V, Ta = –20 to 85 °C, unless otherwise noted)
Symbol
Parameter
Test conditions
f4MRC
Oscillating frequency ajustment width (Note)
f4MRCS
Oscillating frequency shift by temperature
Limits
Min.
Typ.
Max.
f(XIN)=4 to 5 MHZ
0.2
Unit
±3.0
%
0.5
%/°C
Notes : The bigger setting value of the high-speed RC oscillator frequency set up register (address 0FF216) makes the oscillating frequency of the highspeed RC oscillation circuit lower. However, since the oscillating frequency is set higher when setting the values from 7F16 to 8016 or from BF16 to
C016, be careful of frequency adjustment by software.
Table 27 32kHz RC oscillation circuit electrical characteristics
(VCC = AVCC = 2.5V±2%, VSS =AVSS = 0V, Ta = –20 to 85 °C, unless otherwise noted)
Symbol
–
Parameter
Test conditions
Limits
Min.
Typ.
External registor, and capacitor tolerance Total tolerance of the resistor and capacitor
when External registor=91kΩ
Max.
Unit
10
%
0.07
kHz
%
%
2
%
when External capacitor=100pF
–
–
–
–
Oscillating frequency adjustment resolution
Oscillating frequency shift by VCC voltage
Ta=25 °C
Oscillating frequency shift by temperature
VCC=AVCC=2.5V, –20 to 85 °C
Oscillating frequency shift by VCC voltage
and temperature
0.5
0.5
Oscillation frequency
8016
C016
High-speed RC oscillator frequency set up register
Fig. 78 High-speed RC oscillation circuit
Feb 18, 2005 page 79 of 85
REJ03B0122-0101
register value - Oscillating frequency characteristics
7512 Group
Table 28 A/D converter characteristics
(VCC = 2.5 ± 2%, VSS = AVSS = 0 V, Ta = –20 to 85 °C, f(XIN) = 4MHz, f(XCIN) = 32.768KHz, unless otherwise noted)
Symbol
Parameter
Test conditions
–
–
tCONV
Resolution
Absolute accuracy (excluding quantization error)
Conversion time
RLADDER
IVREF
Ladder resistor
Reference power source input current
II(AD)
A/D port input current
Min.
High-speed mode,
middle-speed mode
Low-speed mode
VREF “on” VREF = 2.5 V
VREF “off”
40
Limits
Typ.
40
35
100
0.5
Max.
Unit
10
±4
61
bit
LSB
tc(φ)
140
5.0
5.0
µs
kΩ
µA
µA
µA
Table 29 Easy thermal sensor electrical characteristics
(VCC = 2.5V±2%, VSS =AVSS = 0V, Ta = –20 to 85 °C, f(XIN) = 4MHz, f(XCIN) = 32.768KHz)
Parameter
Symbol
–
–
Limits
Test conditions
Unit
Min.
Easy thermal sensor output voltage at room
temperature
The rate of the easy thermal sensor output voltage
by temperature
Typ.
Max.
Ta=27°C
1.38
V
VCC = VREF = 2.5 V
3.4
mV/ °C
Table 30 Current integrator electrical characteristics
(VCC = AVCC = 2.5V±2%, VSS =AVSS = 0V, Ta = –20 to 85 °C, f(XIN) = 4MHz, f(XCIN) = 32.768KHz)
Parameter
Symbol
t INF
V ISENS1
AD
AC
t RD
t RC
b'
V REFD
V REFC
–
Limits
Test conditions
Min.
Integrate period
ISENS1 input range
Integrate coefficient of integrator for discharge
Integrate coefficient of integrator for charge
Reset time of integrator for discharge
Reset time of integrator for charge
Count value at 0V input
Internal reference voltage for discharge integrator
Internal reference voltage for charge integrator
linearity error after reset time caribration
VCC=2.5V±2%, Ta=0 to 60 °C
VCC=2.5V±2%, Ta=–20 to 85 °C
Typ.
Max.
125
–0.15
0.68
0.68
–2400
0.09
–0.11
1.00
1.00
300
300
0.1
–0.1
0.2
1.35
1.35
2400
0.11
–0.09
1
3
tINF
tCAL
tINF
1.25V
0.75V
tRD, tRC
tRD,
tRC
tRD, tRC
tRD, tRC
Discharge signal for
the integrator
Note : All signals are internals.
Fig. 79 Current integrator timing diagram
Feb 18, 2005 page 80 of 85
REJ03B0122-0101
ms
V
µV•sec
µV•sec
ns
ns
–
V
V
%
%
tINF
1.75V
Integrator output
Unit
tRD, tRC
7512 Group
Count value
Discharge
nD – b = TINF A• VDISENS1
nREFD
n’D – b ’=
TINF • VISENS1
AD + tRD • VISENS1
b’
VREFC
c
-c)
n’C = ACT+INFtRC• (V• (ISENS1
VISENS1-c)
nC =
TINF • (VISENS1-c)
AC
VISENS1
ISENS1
input voltage
VREFD
b=
TINF • b’
TINF-tRD • b’
c=
vREFD • b
nREFD-b
Charge
Fig. 80 VISENS1-Count value characteristics of current integrator
Table 31 Over current detector electrical characteristics
(VCC = AVCC = 2.5V±2%, VSS =AVSS = 0V, Ta = –20 to 85 °C, f(XIN) = 4MHz, f(XCIN) = 32.768MHz)
Symbol
Parameter
Conditions
Limits
Min.
Typ.
Max.
Unit
–
Discharge short current detect voltage error
±15
mV
–
Discharge over current detect voltage error
±15
mV
–
Charge over current detect voltage error
±15
mV
–
Wake up detect voltage
12
mV
–
Discharge short current detect time error
30.5
µs
–
Discharge over current detect time error
T.B.D.
–
Discharge over current detect time error
T.B.D.
–
Wake up detect time
Feb 18, 2005 page 81 of 85
REJ03B0122-0101
8
58.6
10
µs
62.5
ms
7512 Group
TIMING REQUIREMENTS
Table 32 Timing requirements
(VCC = 2.5V±2%, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted)
Symbol
tW(RESET)
tC(XIN)
tWH(XIN)
tWL(XIN)
tC(CNTR)
tWH(CNTR)
tWL(CNTR)
tWH(INT)
tWL(INT)
tC(SCLK1)
tWH(SCLK1)
tWL(SCLK1)
tsu(RxD-SCLK1)
th(SCLK1-RxD)
tC(SCLK2)
tWH(SCLK2)
tWL(SCLK2)
tsu(SIN2-SCLK2)
th(SCLK2-SIN2)
Limits
Parameter
Min.
20
250
100
100
500
230
230
230
230
2000
950
950
400
200
2000
950
950
400
300
Reset input “L” pulse width
External clock input cycle time
External clock input “H” pulse width
External clock input “L” pulse width
CNTR0, CNTR1 input cycle time
CNTR0, CNTR1 input “H” pulse width
CNTR0, CNTR1 input “L” pulse width
INT0 to INT3 input “H” pulse width
INT0 to INT3 input “L” pulse width
Serial I/O1 clock input cycle time (Note)
Serial I/O1 clock input “H” pulse width (Note)
Serial I/O1 clock input “L” pulse width (Note)
Serial I/O1 clock input set up time
Serial I/O1 clock input hold time
Serial I/O2 clock input cycle time
Serial I/O2 clock input “H” pulse width
Serial I/O2 clock input “L” pulse width
Serial I/O2 clock input set up time
Serial I/O2 clock input hold time
Unit
Max.
Typ.
XIN cycles
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Note : When f(XIN) = 4 MHz and bit 6 of address 001A16 is “1” (clock synchronous).
Divide this value by four when f(XIN) = 8 MHz and bit 6 of address 001A16 is “0” (UART).
Table 33 Switching characteristics
(VCC = 2.5V±2%, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted)
Parameter
Symbol
tWH (SCLK1)
tWL (SCLK1)
td (SCLK1-TXD)
tv (SCLK1-TXD)
tr (SCLK1)
tf (SCLK1)
tWH (SCLK2)
tWL (SCLK2)
td (SCLK2-SOUT2)
tv (SCLK2-SOUT2)
tf (SCLK2)
tr (CMOS)
tf (CMOS)
Serial I/O1 clock output “H” pulse width
Serial I/O1 clock output “L” pulse width
Serial I/O1 output delay time (Note 1)
Serial I/O1 output valid time (Note 1)
Serial I/O1 clock output rising time
Serial I/O1 clock output falling time
Serial I/O2 clock output “H” pulse width
Serial I/O2 clock output “L” pulse width
Serial I/O2 output delay time (Note 2)
Serial I/O2 output valid time (Note 2)
Serial I/O2 clock output falling time
CMOS output rising time (Note 3)
CMOS output falling time (Note 3)
Test conditions
Limits
Min.
Typ.
tC(SCLK1)/2–50
tC(SCLK1)/2–50
Max.
350
–30
50
50
Fig. 82
tC(SCLK2)/2–240
tC(SCLK2)/2–240
400
0
20
20
50
50
50
Notes 1: For tWH(SCLK1), tWL(SCLK1), when the P25/TXD P-channel output disable bit of the UART control register (bit 4 of address 001B16) is “0”.
2: When the P01/SOUT2 and P02/SCLK2 P-channel output disable bit of the Serial I/O2 control register (bit 7 of address 001516) is “0”.
3: The XOUT pin is excluded.
Feb 18, 2005 page 82 of 85
REJ03B0122-0101
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
7512 Group
MULTI-MASTER I2C-BUS BUS LINE CHARACTERISTICS
Table 34 Multi-master I2C-BUS bus line characteristics
Standard clock mode High-speed clock mode
Symbol
Parameter
Min.
Max.
Max.
Unit
tBUF
Bus free time
4.7
Min.
1.3
tHD;STA
Hold time for START condition
4.0
0.6
µs
tLOW
Hold time for SCL clock = “0”
4.7
1.3
µs
tR
Rising time of both SCL and SDA signals
20+0.1Cb
1000
µs
300
ns
0.9
µs
(Note)
tHD;DAT
Data hold time
tHIGH
Hold time for SCL clock = “1”
tF
Falling time of both SCL and SDA signals
0
0
4.0
0.6
µs
20+0.1Cb
300
300
ns
(Note)
tSU;DAT
Data setup time
100
ns
4.7
0.6
µs
4.0
0.6
µs
250
tSU;STA
Setup time for repeated START condition
tSU;STO
Setup time for STOP condition
Note: Cb = total capacitance of 1 bus line
SDA
tHD:STA
tBUF
tLOW
SCL
P
tR
tF
S
tHD:STA
tsu:STO
P
Sr
tHD:DAT
tHIGH
tsu:DAT
tsu:STA
S : START condition
Sr: RESTART condition
P : STOP condition
Fig. 81 Timing diagram of multi-master I2C-BUS
1kΩ
Measurement output pin
Measurement output pin
100pF
CMOS output
Fig. 82 Circuit for measuring output switching characteristics (1)
Feb 18, 2005 page 83 of 85
REJ03B0122-0101
100pF
N-channel open-drain output
Fig. 83 Circuit for measuring output switching characteristics (2)
7512 Group
tC(CNTR)
tWH(CNTR)
CNTR0
CNTR1
tWL(CNTR)
0.8VCC
0.2VCC
tWL(INT)
tWH(INT)
0.8VCC
INT0 to INT3
0.2VCC
tW(RESET)
RESET
0.8VCC
0.2VCC
tC(XIN)
tWL(XIN)
tWH(XIN)
0.8VCC
XIN
SCLK1
SCLK2
tf
0.2VCC
tC(SCLK1), tC(SCLK2)
tWL(SCLK1), tWL(SCLK2)
tWH(SCLK1), tWH(SCLK2)
tr
0.8VCC
0.2VCC
tsu(RxD-SCLK1),
tsu(SIN2-SCLK2)
RXD
SIN2
0.8VCC
0.2VCC
td(SCLK1-TXD),
td(SCLK2-SOUT2)
TXD
SOUT2
Fig. 84 Timing diagram
Feb 18, 2005 page 84 of 85
REJ03B0122-0101
th(SCLK1-RxD),
th(SCLK2-SIN2)
tv(SCLK1-TXD),
tv(SCLK2-SOUT2)
7512 Group
PACKAGE OUTLINE
Recommended
48P6Q-A
EIAJ Package Code
LQFP48-P-77-0.50
Plastic 48pin 7✕7mm body LQFP
Weight(g)
–
Lead Material
Cu Alloy
MD
ME
e
JEDEC Code
–
b2
HD
D
48
37
1
I2
Recommended Mount Pad
36
E
HE
Symbol
25
12
13
24
A
F
L1
A3
A2
e
A
A1
A2
b
c
D
E
e
HD
HE
L
L1
Lp
b
x
M
Feb 18, 2005 page 85 of 85
REJ03B0122-0101
L
Detail F
Lp
c
y
A1
A3
x
y
b2
I2
MD
ME
Dimension in Millimeters
Min
Nom
Max
–
–
1.7
0.1
0.2
0
1.4
–
–
0.17
0.22
0.27
0.105
0.125
0.175
6.9
7.0
7.1
6.9
7.0
7.1
0.5
–
–
8.8
9.0
9.2
8.8
9.0
9.2
0.35
0.5
0.65
1.0
–
–
0.45
0.6
0.75
–
0.25
–
–
–
0.08
0.1
–
–
0°
8°
–
0.225
–
–
1.0
–
–
7.4
–
–
–
–
7.4
7512 Group Data Sheet
REVISION HISTORY
Rev.
Date
Description
Summary
Page
1.00 Nov.10, 2004
–
First edition issued
1.01 Feb.18, 2005
14
Fig.11 Ports P44 and P45 are partly revised.
(1/1)
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
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