Not Recommended For New Designs bq20z70 www.ti.com SLUS686B – NOVEMBER 2005 – REVISED JULY 2007 SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK™ TECHNOLOGY FOR USE WITH THE bq29330 FEATURES APPLICATIONS • • • • • • • • • • • • • • • • • Next Generation Patented Impedance Track™ Technology accurately Measures Available Charge in Li-Ion and Li-Polymer Batteries Better than 1% Error Over Lifetime of the Battery Instant Accuracy – No Learning Cycle Required Supports the Smart Battery Specification SBS V1.1 Powerful 8-Bit RISC CPU With Ultra-Low Power Modes Works With the TI bq29330 Analog Front-End (AFE) Protection IC to Provide Complete Pack Electronics Solution Full Array of Programmable Protection Features – Voltage, Current and Temperature Fully Integrated High Accurate Clock Flexible Configuration for 2 to 4 Series Li-Ion and Li-Polymer Cells Integrated Field Programmable FLASH Memory Eliminates the Need for External Configuration Memory Smart Battery Charger Control Feature Two 16-Bit Delta-Sigma Converter – Accurate Voltage and Temperature Measurements – Integrating Coloumb Counter for Charge Flow – Better Than 0.65 nVh of Resolution – Self-Calibrating Supports SHA-1 Authentication 20-Pin TSSOP (PW) Notebook PCs Medical and Test Equipment Portable Instrumentation DESCRIPTION The bq20z70 SBS-compliant gas gauge IC, incorporating patented Impedance Track™ technology, is designed for battery-pack or in-system installation. The bq20z70 measures and maintains an accurate record of available charge in Li-ion or Li-polymer batteries using its integrated high-performance analog peripherals. The bq20z70 monitors capacity change, battery impedance, open-circuit voltage, and other critical parameters of the battery pack, and reports the information to the system host controller over a serial-communication bus. It is designed to work with the bq29330 analog front-end (AFE) protection IC to maximize functionality and safety, and minimize component count and cost in smart battery circuits. The Impedance Track technology continuously analyzes the battery impedance, resulting in superior gas-gauging accuracy. This enables remaining capacity to be calculated with discharge rate, temperature, and cell aging all accounted for during each stage of every cycle. AVAILABLE OPTIONS PACKAGE (1) TA 20-PIN TSSOP (PW) Tube 20-PIN TSSOP (PW) Tape and Reel –40°C to 85°C bq20z70PW (2) bq20z70PWR (3) (1) (2) (3) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. A single tube quantity is 50 units. A single reel quantity is 2000 units Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. IMPEDANCE TRACK is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2007, Texas Instruments Incorporated Not Recommended For New Designs bq20z70 www.ti.com SLUS686B – NOVEMBER 2005 – REVISED JULY 2007 SYSTEM PARTITIONING DIAGRAM Pack + Fuse Supply Voltage 32kHz Clock Generator Reset 32KHz bq29330 Validation & Control SBS v1.1 Data N-CH FET Drive Watchdog & Protection Timing Charge Pumps Registers Alert System Interface System Interface I2C SHA-1 Authentication Overvoltage & Undervoltage Protection Cell & Pack Voltage Measurement Voltage Level Translator Cell Balancing Algorithm & Control Overrcurrent Protection Impedance Track™ Gas Gauging Overcurrent & Short Circuit Protection bq20z70 bq29330 Pack RSNS 5mΩ – 20mΩ typ. TSSOP (PW) (TOP VIEW) XALERT TS2 TS1 CLKOUT PRES PFIN SAFE SMBD NC SMBC 2 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCELLVCELL+ VCC VSS MRST SRN SRP VSS SCLK SDATA Submit Documentation Feedback 2nd Level Voltage Protection SMBus LDO & Therm. Drive & Reset Cell Selection Multiplexer Charging Algorithm Therm Temperature Measurement & Protection Cell Balancing Drive Fail Safe Protection bq294xy Not Recommended For New Designs bq20z70 www.ti.com SLUS686B – NOVEMBER 2005 – REVISED JULY 2007 TERMINAL FUNCTIONS TERMINAL I/O (1) DESCRIPTION NO. NAME 1 XALERT I Alert interrupt input from bq29330. Connect directly to bq29330 XALERT pin 2 TS2 I 2nd thermistor voltage input connection to monitor temperature 3 TS1 I 1st thermistor voltage input connection to monitor temperature 4 CLKOUT O 32.768kHz output for bq29330 watchdog. Connect directly to bq29330 WDI pin 5 PRES I Active low input to sense system insertion 6 PFIN I Active low input to sense secondary protector output status (1) 7 SAFE O 8 SMBD I/OD Active high output to enforce additional level of safety, e.g. fuse blow 9 NC – 10 SMBC I/OD SMBus clock open drain bidirectional pin used for communication with bq20z70 11 SDATA I/OD Data transfer line from and to bq29330. Connect directly to SDATA pin of bq29330 12 SCLK I/OD Data clock line to bq29330. Connect directly to SCLK pin of bq29330 13 VSS I/OD VSS 14 SRP IA Connection for a small-value resistor to monitor the battery charge and discharge current flow 15 SRN IA Connection for a small-value resistor to monitor the battery charge and discharge current flow 16 MRST I Master reset input that forces the device into reset when held low. Connect directly to XRST pin of bq29330 17 VSS P Negative supply. Both VSS needs to be connected together 18 VCC P Positive supply 19 VCELL+ I Positive differential cell input. Connect directly to CELL+ pin of bq29330 20 VCELL- I Negative differential cell input. Connect directly to CELL- pin of bq29330 SMBus data open drain bidirectional pin used for communication with bq20z70 Not used - leave floating I = Input, IA = Analog input, I/O = Input/output, I/OD = Input/Open-drain output, O = Output, OA = Analog output, P = Power ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) RANGE VCC relative to VSS (2) Supply voltage range on VCC pin V(IOD) relative to VSS (2) XALERT, PFIN, SAFE, SMBD, SMBC, SDATA, SCLK, VI relative to VSS (2) TS2, TS1, CLKOUT, PRES, SRP, SRN, MRST, VCELL+,VCELL- –0.3 V to 2.75 V –0.3 V to 6.0 V –0.3 V to VCC + 0.3 V TA Operating free-air temperature range –40°C to 85°C Tstg Storage temperature range –65°C to 150°C (1) (2) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. VSS refers to Voltage at VSS pin. Submit Documentation Feedback 3 Not Recommended For New Designs bq20z70 www.ti.com SLUS686B – NOVEMBER 2005 – REVISED JULY 2007 ELECTRICAL CHARACTERISTICS VCC = 2.4 V to 2.6 V, TA = -40°C - 85°C (unless otherwise noted) PARAMETER VDD TEST CONDITIONS Supply voltage IDD VDDA and VDDD MIN TYP MAX 2.4 2.5 2.6 400 (1) No flash programming Operating mode current I(SLP) Low-power storage mode current bq20z70 + bq29330 475 Sleep mode 8 (1) bq20z70 + bq29330 VOL Output voltage low CLKOUT, SAFE, SMBD, SMBC, SDATA, SCLK IOL = 7 mA VOH Output high voltage CLKOUT, SAFE, SMBD,SMBC, SDATA, SCLK IOH = –0.5 mA VIL Input voltage low PRES, PFIN, SMBD, SMBC, SDATA, MRST VIH Input voltage high PRES, PFIN, SMBD, SMBC, SDATA, MRST CIN Input capacitance μA 0.1 (1) bq20z70 + bq29330 V μA 48 Shutdown Mode I(SLP) Shutdown Current UNIT μA 0.2 0.4 VCC – 0.5 V V 0.8 2.0 V V 5 pF V(AI1) Input voltage range TS1, TS2, VCELL+, VCELL- – 0.2 0.8 x VCC V(AI2) Input voltage range SRP, SRN – 0.2 0.2 V Z(AI1) Input impedance TS1, TS2, VCELL+, VCELL - 0V–1V 8 MΩ Z(AI2) Input impedance SRP, SRN 0V–1V 2.5 MΩ (1) This value does not include the bq29330 POWER-ON RESET VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS TYP MAX UNIT VIT– Negative-going voltage input 1.7 1.8 1.9 V VHYS Power-on reset hysteresis 50 125 200 mV Power-On Reset Negative-Going Voltage - V 1.81 1.8 1.79 1.78 1.77 1.76 -40 -20 0 20 40 60 TA - Free-Air Temperature - °C 4 MIN Submit Documentation Feedback 80 Not Recommended For New Designs bq20z70 www.ti.com SLUS686B – NOVEMBER 2005 – REVISED JULY 2007 INTEGRATING ADC (Coulomb Counter) CHARACTERISTICS VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted) TEST CONDITIONS MIN V(SR) Input voltage range, V(SRN) and V(SRP) PARAMETER V(SR) = V(SRP) – V(SRN) –0.20 V(SROS) Input offset TA =25°C to 85°C INL Integral nonlinearity error TYP MAX 0.20 V μV 10 ±0.007% UNIT ±0.037% OSCILLATOR VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT HIGH FREQUENCY OSCILLATOR f (OSC) Operating frequency f (EIO) Frequency error f (sxo) Start-up time 4.194 (1) (2) T A = 20°C to 70°C MHz -3% 0.25% 3% -2% 0.25% 2% 2.5 5 (3) ms LOW FREQUENCY OSCILLATOR f (LOSC) Operating frequency f (LEIO) Frequency error f (Lsxo) (5) (1) (2) (3) (4) (5) The The The The The Start-up time 32.768 (2) (4) T A = 20°C to 70°C kHz -2.5% 0.25% 2.5% -1.5% 0.25% 1.5% 500 μs frequency error is measured from 4.194 MHz. frequency drift is included and measured f rom the trimmed frequency at V CC = 2.5 V, T A = 25°C. start-up time is defined as the time it takes for the oscillator output frequency to be within 1% of the specified frequency. frequency error is measured from 32.768 kHz. start-up time is defined as the time it takes for the oscillator output frequency to be ±3%. DATA FLASH MEMORY CHARACTERISTICS VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Data retention See (1) 10 Years Flash programming write-cycles See (1) 20,000 Cycles t(WORDPROG) Word programming time See (1) I(DDPROG) See (1) tDR (1) Flash-write and erase supply current 5 2 ms 10 mA Specified by design. Not production tested Submit Documentation Feedback 5 Not Recommended For New Designs bq20z70 www.ti.com SLUS686B – NOVEMBER 2005 – REVISED JULY 2007 SMBus TIMING SPECIFICATIONS VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS fSMB SMBus operating frequency Slave mode, SMBC 50% duty cycle fMAS SMBus master clock frequency Master mode, no clock low slave extend tBUF Bus free time between start and stop tHD:STA Hold time after (repeated) start tSU:STA Repeated start setup time tSU:STO Stop setup time TYP 10 MAX 100 51.2 UNIT kHz 4.7 4 μs 4.7 4 Receive mode 0 Transmit mode 300 tHD:DAT Data hold time tSU:DAT Data setup time tTIMEOUT Error signal/detect tLOW Clock low period tHIGH Clock high period See (2) tLOW:SEXT Cumulative clock low slave extend time See (3) 25 tLOW:MEXT Cumulative clock low master extend time See (4) 10 tF Clock/data fall time (VILMAX – 0.15 V) to (VIHMIN + 0.15 V) tR Clock/data rise time 0.9 VCC to (VILMAX – 0.15 V) (1) (2) (3) (4) ns 250 See (1) 25 35 4.7 4 50 300 1000 ms μs ms ns The bq20z70 times out when any clock low exceeds tTIMEOUT. tHIGH:MAX. is minimum bus idle time. SMBC = 1 for t > 50 μs causes reset of any transaction involving the bq20z70 that is in progress. tLOW:SEXT is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop. tLOW:MEXT is the cumulative time a master device is allowed to extend the clock cycles in one message from initial start to the stop. SMBus TIMING DIAGRAM 6 MIN Submit Documentation Feedback Not Recommended For New Designs bq20z70 www.ti.com SLUS686B – NOVEMBER 2005 – REVISED JULY 2007 FEATURE SET Primary (1st Level) Safety Features The bq20z70 supports a wide range of battery and system protection features that can easily be configured. The primary safety features include: • • • • • Cell over/under voltage protection Charge and Discharge overcurrent Short Circut Charge and Discharge Overtemperature AFE Watchdog Secondary (2nd Level) Safety Features The secondary safety features of the bq20z70 can be used to indicate more serious faults via the SAFE (pin 7). This pin can be used to blow an in-line fuse to permanently disable the battery pack from charging or discharging. The secondary safety protection features include: • • • • • • Safety overvoltage Safety overcurrent in Charge and Discharge Safety overtemperature in Charge and Discharge Charge FET and 0 Volt Charge FET fault Discharge FET fault AFE communication fault Charge Control Features The bq20z70 charge control features include: • • • • • • Reports the appropriate charging current needed for constant current charging and the appropriate charging voltage needed for constant voltage charging to a smart charger using SMBus broadcasts. Determines the chemical state of charge of each battery cell using Impedance Track™ and can reduce the charge difference of the battery cells in fully charged state of the battery pack gradually using cell balancing algorithm during charging. This prevents fully charged cells from overcharging and causing excessive degradation and also increases the usable pack energy by preventing premature charge termination Supports pre-charging/zero-volt charging Support fast charging Supports charge inhibit and charge suspend if battery pack temperature is out of temperature range Reports charging fault and also indicate charge status via charge and discharge alarms. Gas Gauging The bq20z70 uses the Impedance Track™ Technology to measure and calculate the available charge in battery cells. The achievable accuracy is better than 1% error over the lifetime of the battery and there is no full charge discharge learning cycle required. See Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm application note (SLUA364) for further details. Authentication The bq20z70 supports authentication by the host using SHA-1. Submit Documentation Feedback 7 bq20z70 Not Recommended For New Designs www.ti.com SLUS686B – NOVEMBER 2005 – REVISED JULY 2007 FEATURE SET (continued) Power Modes The bq20z70 supports 3 different power modes to reduce power consumption: • • • In Normal Mode, the bq20z70 performs measurements, calculations, protection decisions and data updates in 1 second intervals. Between these intervals, the bq20z70 is in a reduced power stage. In Sleep Mode, the bq20z70 performs measurements, calculations, protection decisions and data update in adjustable time intervals. Between these intervals, the bq20z70 is in a reduced power stage. The bq20z70 has a wake function that enables exit from Sleep mode, when current flow or failure is detected. In Shutdown Mode the bq20z70 is completely disabled. CONFIGURATION Oscillator Function The bq20z70 fully integrates the system oscillators. Therefore, the bq20z70 requires no external components for this feature. System Present Operation The bq20z70 pulls the PU pin high periodically (1 s). Connect this pin to the PRES pin of the bq20z70 via a resistor of approximately 5 kΩ. The bq20z70 measures the PRES input during the PU-active period to determine its state. If PRES input is pulled to ground by external system, the bq20z70 detects this as system present. BATTERY PARAMETER MEASUREMENTS The bq20z70 uses an integrating delta-sigma analog-to-digital converter (ADC) for current measurement, and a second delta-sigma ADC for individual cell and battery voltage, and temperature measurement. Charge and Discharge Counting The integrating delta-sigma ADC measures the charge/discharge flow of the battery by measuring the voltage drop across a small-value sense resistor between the SR1 and SR2 pins. The integrating ADC measures bipolar signals from -0.25 V to 0.25 V. The bq20z70 detects charge activity when VSR = V(SR1)-V(SR2)is positive and discharge activity when VSR = V(SR1)-V(SR2) is negative. The bq20z70 continuously integrates the signal over time, using an internal counter. The fundamental rate of the counter is 0.65 nVh. Voltage The bq20z70 updates the individual series cell voltages through the bq29330 at one second intervals. The bq20z70 configures the bq29330 to connect the selected cell, cell offset, or bq29330 VREF to the CELL pin of the bq29330, which is required to be connected to VIN of the bq20z70. The internal ADC of the bq20z70 measures the voltage, scales and calibrates it appropriately. This data is also used to calculate the impedance of the cell for the Impedance Track™ gas-gauging. Current The bq20z70 uses the SRP and SRN inputs to measure and calculate the battery charge and discharge current using a 5 mΩ to 20 mΩ typ. sense resistor. Auto Calibration The bq20z70 provides an auto-calibration feature to cancel the voltage offset error across SRN and SRP for maximum charge measurement accuracy. The bq20z70 performs auto-calibration when the SMBus lines stay low continuously for a minimum of 5 s. Temperature The bq20z70 has an internal temperature sensor and 2 external temperature sensor inputs TS1 and TS2 used in conjunction with two identical NTC thermistors (default are Semitec 103AT) to sense the battery enviromental temperature. The bq20z70 can be configured to use internal or external temperature sensors. 8 Submit Documentation Feedback Not Recommended For New Designs bq20z70 www.ti.com SLUS686B – NOVEMBER 2005 – REVISED JULY 2007 FEATURE SET (continued) COMMUNICATIONS The bq20z70 uses SMBus v1.1 with Master Mode and package error checking (PEC) options per the SBS specification. SMBus On and Off State The bq20z70 detects an SMBus off state when SMBC and SMBD are logic-low for ≥ 2 seconds. Clearing this state requires either SMBC or SMBD to transition high. Within 1 ms, the communication bus is available. Submit Documentation Feedback 9 Not Recommended For New Designs bq20z70 www.ti.com SLUS686B – NOVEMBER 2005 – REVISED JULY 2007 FEATURE SET (continued) SBS Commands Table 1. SBS COMMANDS SBS Cmd Mode Name Format Size in Bytes Min Value Max Value 0x00 R/W ManufacturerAccess hex 0x01 R/W RemainingCapacityAlarm unsigned int 0x02 R/W RemainingTimeAlarm unsigned int 2 0x03 R/W BatteryMode hex 2 0x04 R/W AtRate signed int 2 0x05 R AtRateTimeToFull unsigned int 0x06 R AtRateTimeToEmpty unsigned int 0x07 R AtRateOK unsigned int 0x08 R Temperature 0x09 R 0x0a R 0x0b Default Value Unit 2 0x0000 0xffff — 2 0 65535 — mAh or 10mWh 0 65535 — min 0x0000 0xffff — -32768 32767 — mA or 10mW 2 0 65535 — min 2 0 65535 — min 2 0 65535 — unsigned int 2 0 65535 — 0.1°K Voltage unsigned int 2 0 20000 — mV Current signed int 2 -32768 32767 — mA R AverageCurrent signed int 2 -32768 32767 — mA 0x0c R MaxError unsigned int 1 0 100 — % 0x0d R RelativeStateOfCharge unsigned int 1 0 100 — % 0x0e R AbsoluteStateOfCharge unsigned int 1 0 100 — % 0x0f R/W RemainingCapacity unsigned int 2 0 65535 — mAh or 10mWh 0x10 R FullChargeCapacity unsigned int 2 0 65535 — mAh or 10mWh 0x11 R RunTimeToEmpty unsigned int 2 0 65535 — min 0x12 R AverageTimeToEmpty unsigned int 2 0 65535 — min 0x13 R AverageTimeToFull unsigned int 2 0 65535 — min 0x14 R ChargingCurrent unsigned int 2 0 65535 — mA 0x15 R ChargingVoltage unsigned int 2 0 65535 — mV 0x16 R BatteryStatus unsigned int 2 0x0000 0xffff — 0x17 R/W CycleCount unsigned int 2 0 65535 — 0x18 R/W DesignCapacity unsigned int 2 0 65535 — mAh or 10mWh 0x19 R/W DesignVoltage unsigned int 2 7000 16000 14400 mV 0x1a R/W SpecificationInfo unsigned int 2 0x0000 0xffff 0x0031 0x1b R/W ManufactureDate unsigned int 2 0 65535 0 0x1c R/W SerialNumber hex 2 0x0000 0xffff 0x0001 0x20 R/W ManufacturerName String 11+1 — — Texas Instruments ASCII 0x21 R/W DeviceName String 7+1 — — bq20z70 ASCII 0x22 R/W DeviceChemistry String 4+1 — — LION ASCII 0x23 R ManufacturerData String 14+1 — — — ASCII 0x2f R/W Authenticate String 20+1 — — — ASCII 0x3c R CellVoltage4 unsigned int 2 0 65535 — mV 0x3d R CellVoltage3 unsigned int 2 0 65535 — mV 0x3e R CellVoltage2 unsigned int 2 0 65535 — mV 0x3f R CellVoltage1 unsigned int 2 0 65535 — mV 10 Submit Documentation Feedback Not Recommended For New Designs bq20z70 www.ti.com SLUS686B – NOVEMBER 2005 – REVISED JULY 2007 Table 2. EXTENDED SBS COMMANDS SBS Cmd Mode Name Format Size in Bytes Min Value Max Value Default Value Unit 0x45 R AFEData String 11+1 — 0x46 R/W FETControl hex 1 0x00 — — ASCII 0xff — 0x4f R StateOfHealth unsigned int 1 0 100 — 0x51 R SafetyStatus hex 0x53 R PFStatus hex 2 0x0000 0xffff — 2 0x0000 0xffff 0x54 R OperationStatus — hex 2 0x0000 0xffff — 0x55 R 0x57 R ChargingStatus hex 2 0x0000 0xffff — ResetData hex 2 0x0000 0xffff 0x5a — R PackVoltage unsigned int 2 0 65535 — mV 0x5d R AverageVoltage unsigned int 2 0 65535 — mV 0x60 R/W UnSealKey hex 4 0x00000000 0xffffffff — 0x61 R/W FullAccessKey hex 4 0x00000000 0xffffffff — 0x62 R/W PFKey hex 4 0x00000000 0xffffffff — 0x63 R/W AuthenKey3 hex 4 0x00000000 0xffffffff — 0x64 R/W AuthenKey2 hex 4 0x00000000 0xffffffff — 0x65 R/W AuthenKey1 hex 4 0x00000000 0xffffffff — 0x66 R/W AuthenKey0 hex 4 0x00000000 0xffffffff — 0x70 R/W ManufacturerInfo String 8+1 — — — 0x71 R/W SenseResistor unsigned int 2 0 65535 — 0x77 R/W DataFlashSubClassID hex 2 0x0000 0xffff — 0x78 R/W DataFlashSubClassPage1 hex 32 — — — 0x79 R/W DataFlashSubClassPage2 hex 32 — — — 0x7a R/W DataFlashSubClassPage3 hex 32 — — — 0x7b R/W DataFlashSubClassPage4 hex 32 — — — 0x7c R/W DataFlashSubClassPage5 hex 32 — — — 0x7d R/W DataFlashSubClassPage6 hex 32 — — — 0x7e R/W DataFlashSubClassPage7 hex 32 — — — 0x7f R/W DataFlashSubClassPage8 hex 32 — — — % μΩ Application Schematic The application schematic is on the following page. Submit Documentation Feedback 11 Not Recommended For New Designs PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) BQ20Z70PW-V150 NRND TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 20Z70 BQ20Z70PW-V160 NRND TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 20Z70 BQ20Z70PWR-V150 NRND TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 20Z70 BQ20Z70PWR-V160 NRND TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 20Z70 HPA00729PWR NRND TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 20Z70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. 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