LTC3530 Wide Input Voltage Synchronous Buck-Boost DC/DC Converter DESCRIPTION FEATURES n n n n n n n n n n n n Regulated Output with Input Voltages Above, Below or Equal to the Output 1.8V to 5.5V Input and 1.8V to 5.25V Output Range 250mA Continuous Output Current from 1.8V VIN 600mA Continuous/1A Peak Output Current from Li-Ion Single Inductor Synchronous Rectification: Up to 96% Efficiency Programmable Automatic Burst Mode® Operation Output Disconnect in Shutdown Pin Compatible with the LTC3440 Programmable Frequency from 300kHz to 2MHz <1μA Shutdown Current Small Thermally Enhanced 10-Lead (3mm × 3mm) DFN and 10-Lead MS Packages APPLICATIONS n n n n n n The LTC®3530 is a wide VIN range, highly efficient, fixed frequency, buck-boost DC/DC converter that operates from input voltages above, below or equal to the output voltage. The topology incorporated in the IC provides a continuous transfer function through all operating modes, making the product ideal for single lithium-ion, two-cell alkaline or NiMH applications where the output voltage is within the battery voltage range. The LTC3530 is pin compatible with the LTC3440 buckboost DC/DC converter but adds programmable automatic Burst Mode operation and extends the VIN/VOUT range to 1.8V. Switching frequencies up to 2MHz are programmed with an external resistor. Automatic Burst Mode operation allows the user to program the load current threshold for Burst Mode operation using a single resistor from the BURST pin to GND. Other features include 1μA shutdown, short circuit protection, programmable soft-start control, current limit and thermal shutdown. The LTC3530 is available in a thermally enhanced 10-lead (3mm × 3mm) DFN or MSOP package. MP3 Players Handheld Instruments Digital Cameras Smart Phones Portable GPS Units Miniature Hard Disk Drive Power L, LT, LTC, LTM and Burst Mode are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. Patents Pending. TYPICAL APPLICATION Efficiency 4.7μH 100 Burst Mode VIN = 3.6V 90 SW2 VOUT 3.3V AT 250mA VOUT 1.8V TO 5.5V 33pF VIN LTC3530 1M 15k SHDN/SS OFF ON RT 10μF FB VC 22μF 10k VIN = 3.6V 70 60 50 40 30 576k 20 560pF 33.2k 80 EFFICIENCY (%) SW1 VIN = 4.2V VIN = 2.0V 10 BURST GND 0.01μF 0 0.1 100k 3530 TA01a 1 10 100 LOAD CURRENT (mA) 1000 3350 TA01b 3530fb 1 LTC3530 ABSOLUTE MAXIMUM RATINGS (Note 1) VIN, VOUT Voltage ......................................... –0.3V to 6V SW1, SW2 Voltage DC............................................................ –0.3V to 6V Pulsed < 100ns ........................................ –0.3V to 7V VC, RT, FB, SHDN/SS, BURST Voltage .......... –0.3V to 6V Operating Temperature (Note 2)............... –40°C to 85°C Maximum Junction Temperature (Note 4)............. 125°C Storage Temperature Range................... –65°C to 150°C PIN CONFIGURATION TOP VIEW RT 1 10 VC BURST 2 9 FB SW1 3 SW2 4 7 VIN GND 5 6 VOUT 11 TOP VIEW RT BURST SW1 SW2 GND 8 SHDN/SS 10 9 8 7 6 1 2 3 4 5 VC FB SHDN/SS VIN VOUT MS PACKAGE 10-LEAD PLASTIC MSOP TJMAX = 125°C, θJA = 120°C/W, θJC = 45°C/W DD PACKAGE 10-LEAD (3mm s 3mm) PLASTIC DFN TJMAX = 125°C, θJA = 43°C/W, θJC = 4.3°C/W EXPOSED PAD IS GND (PIN 11) MUST BE SOLDERED TO PCB ORDER INFORMATION LEAD FREE FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE LTC3530EDD#PBF LTC3530EDD#TRPBF LCBH 10-Lead (3mm × 3mm) Plastic DFN –40°C to 85°C LTC3530EMS#PBF LTC3530EMS#TRPBF LTCBJ 10-Lead Plastic MSOP –40°C to 85°C Consult LTC Marketing for parts specified with wider operating temperature ranges. Consult LTC Marketing for information on non-standard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VIN = VOUT = 3.6V, RT = 33.2k, unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS Input Operating Range l 1.8 5.5 V Output Voltage Adjust Range l 1.8 5.25 V Feedback Voltage l 1.191 1.215 1.239 V Feedback Input Current VFB = 1.215V 1 50 nA Quiescent Current, Burst Mode Operation VFB = 1.215V, BURST = 0V (Note 3) 40 60 μA Quiescent Current, Shutdown SHDN = 0V, Not Including Switch Leakage 0.1 1 μA Quiescent Current, Active VC = 0V, BURST = 3V (Note 3) 700 1200 μA Input Current Limit l 1 2 A 3530fb 2 LTC3530 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VIN = VOUT = 3.6V, RT = 33.2k, unless otherwise noted. PARAMETER CONDITIONS NMOS Switch Leakage MIN TYP MAX Switches B and C 0.1 5 μA PMOS Switch Leakage Switches A and D 0.1 10 μA NMOS Switch On Resistance Switches B and C 0.21 Ω PMOS Switch On Resistance Switches A and D 0.24 Ω Maximum Duty Cycle Boost (% Switch C On) Buck (% Switch A On) 80 100 90 % % 0.7 1 l l Minimum Duty Cycle l Frequency l UNITS 0 % 1.3 MHz Error Amp AVOL 90 dB Error Amp Source Current 300 μA Error Amp Sink Current 300 μA Burst Threshold 1 Burst Input Current VBURST = 5.5V SHDN/SS Threshold When IC is Enabled When EA is at Maximum Boost Duty Cycle SHDN/SS Input Current VSHDN = 5.5V Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTC3530E is guaranteed to meet performance specifications from 0°C to 85°C. Specifications over the –40°C to 85°C operating temperature range are assured by design, characterization and correlations with statistical process controls. l Burst Mode Quiescent Current 3.0 1.5 MHz 2.5 1.0 MHz 2.0 1.5 0.5 MHz 1.0 NO SWITCHING 0.5 0.0 2.5 4.0 VIN (V) 4.5 5.0 5.5 3530 G01 1 μA 3.0 35 30 25 20 15 2.5 2.0 1.5 1.0 10 0.5 0 3.5 0.01 40 5 3.0 V V Peak Current Clamp vs VIN INPUT CURRENT (A) VIN QUIESCENT CURRENT (μA) VIN QUIESCENT CURRENT (mA) 2.0 MHz 1.4 3.5 45 3.5 0.85 1.6 TA = 25°C, unless otherwise specified. 50 4.0 μA Note 3: Current measurements are performed when the outputs are not switching. Note 4: This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed 125°C when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature may result in device degradation or failure. TYPICAL PERFORMANCE CHARACTERISTICS Quiescent Current vs VIN (Fixed Frequency Mode) 0.4 V 2 2.5 3.0 3.5 4.0 VIN (V) 4.5 5.0 5.5 3530 G02 0.0 2.5 3.0 3.5 4.0 VIN (V) 4.5 5.0 5.5 3530 G03 3530fb 3 LTC3530 TYPICAL PERFORMANCE CHARACTERISTICS Automatic Burst Mode Threshold vs RBURST 1.84 80 1.82 LEAVE Burst Mode OPERATION 60 50 40 30 ENTER Burst Mode OPERATION 20 Average Input Current Limit vs Temperature 5% 4% 1.78 1.76 1.74 125 175 225 275 325 375 425 475 500 RBURST (kΩ) 1% 0% –1% –2% –4% 1.70 –45 –25 –5 0 2% –3% 1.72 10 VIN = VOUT = 3.3V 3% 1.80 CHANGE FROM 25°C MINIMUM START VOLTAGE (V) LOAD CURRENT (mA) Minimum Start Voltage vs Temperature 90 70 TA = 25°C, unless otherwise specified. 15 35 55 75 TEMPERATURE (°C) 95 115 –5% –55 –35 –15 5 25 45 65 85 105 125 TEMPERATURE (°C) 3530 G05 3530 G04 Frequency Change vs Temperature 3530 G06 Switch Pins Before Entering Boost Mode Feedback Voltage vs Temperature 1.25 1.225 1.23 1.220 FEEDBACK VOLTAGE (V) FREQUENCY (MHz) 1.21 1.19 1.17 1.15 1.13 1.11 1.09 SW1 2V/DIV 1.215 1.210 SW2 2V/DIV 1.205 1.07 1.05 –45 –25 –5 15 35 55 75 TEMPERATURE (°C) 95 115 1.200 –45 –25 –5 15 35 55 75 TEMPERATURE (°C) 3530 G07 95 115 3530 G08 Switch Pins Entering Buck-Boost Mode Switch Pins in Buck-Boost Mode VIN = 2.7V SW2 2V/DIV SW2 2V/DIV 3530 G09 LTC3530 Output Ripple 500mA Load SW1 2V/DIV SW1 2V/DIV 50ns/DIV VIN = 2.9V VOUT = 3.3V AT 500mA VIN = 3.3V VIN = 4.2V 50ns/DIV VIN = 3.3V VOUT = 3.3V AT 500mA 3530 G10 50ns/DIV VIN = 4.2V VOUT = 3.3V AT 500mA 3530 G11 1μs/DIV VOUT = 3.3V 20mV/DIV AC COUPLED COUT = 22μF, X5R CERAMIC 3530 G12 3530fb 4 LTC3530 TYPICAL PERFORMANCE CHARACTERISTICS Load Transient Response in Auto Burst Mode Operation, No Load to 500mA Load Transient Response in Fixed Frequency Mode, No Load to 300mA VOUT 100mV/DIV VOUT 100mV/DIV LOAD 0.25A/DIV LOAD 0.25A/DIV 100μs/DIV VIN = 3.6V VOUT = 3.3V COUT = 22μF, X5R CERAMIC TA = 25°C, unless otherwise specified. 3530 G13 Typical Burst Mode Waveforms VOUT 50mV/DIV INDUCTOR CURRENT 0.25A/DIV 3530 G14 100μs/DIV VIN = 3.6V VOUT = 3.3V COUT = 47μF, X5R CERAMIC + 100μF LOW ESR TANTALUM Transition from Burst Mode Operation to Fixed Frequency Mode 22μs/DIV COUT = 22μF, X5R CERAMIC 3530 G15 Maximum Output Current vs VIN 2000 VOUT 200mV/DIV 1800 1600 CURRENT (mA) BURST 2V/DIV INDUCTOR CURRENT 0.5A/DIV 200μs/DIV COUT = 22μF, X5R CERAMIC 3530 G16 1400 1200 IOUT 1000 800 600 400 250mA AT 1.8V 200 1.5 2.5 3.5 VIN (V) 4.5 5.5 3530 G17 PIN FUNCTIONS RT (Pin 1): Programs the Frequency of the Internal Oscillator. Connect a resister from RT to ground. f(kHz) = 33,170/RT (kΩ) BURST (Pin 2): Used to Set the Automatic Burst Mode Threshold. Connect a resistor and capacitor in parallel from this pin to ground. See the Applications Information section for component value selection. For manual control, ground the pin to force Burst Mode operation, connect to VIN to force fixed frequency PWM mode. SW1 (Pin 3): Switch Pin Where the Internal Switches A and B are Connected. Connect inductor from SW1 to SW2. An optional Schottky diode can be connnected from SW1 to ground for a moderate efficiency improvement. Minimize trace length to keep EMI down. SW2 (Pin 4): Switch Pin Where the Internal Switches C and D are Connected. For applications with output voltages over 4.3V, a Schottky diode is required from SW2 to VOUT to ensure the SW pin does not exhibit excessive voltage. 3530fb 5 LTC3530 PIN FUNCTIONS FB (Pin 9): Feedback Pin. Connect resistor divider tap here. The output voltage can be adjusted from 1.8V to 5.25V. The feedback reference is typically 1.215V. GND (Pin 5): Ground for the IC. VOUT (Pin 6): Output of the Synchronous Rectifier. A filter capacitor is placed from VOUT to GND. A ceramic bypass capacitor is recommended as close to the VOUT and GND pins as possible. R1 VOUT = 1.215V • 1+ R2 VIN (Pin 7): Input Supply Voltage. Internal VCC for the IC. A 10μF ceramic capacitor is recommended as close to the VIN and GND pins as possible. VC (Pin10): Error Amp Output. An R-C network is connected from this pin to FB for loop compensation. Refer to “Closing the Feedback Loop” section for component selection guidelines. During Burst Mode operation, VC is internally clamped. SHDN/SS (Pin 8): Combined Soft-Start and Shutdown. Applied voltage <0.4V shuts down the IC. Tie to >1.4V to enable the IC and >1.6V to ensure the error amp is not clamped from soft-start. An R-C from the shutdown command signal to this pin will provide a soft-start function by limiting the rise time of VC. BLOCK DIAGRAM Exposed Pad (Pin 11, DD Package Only): Ground. This pin must be soldered to the PCB and electrically connected to ground. L1 SW2 SW1 3 4 ANTI-RING VIN VOUT SW D SW A 6 SW B GATE DRIVERS AND ANTICROSS CONDUCTION COUT SW C – CIN + 7 REVERSE AMP RSS R1 + Gm = 1/60k SHUTDOWN SOFT-START + SHUTDOWN – SHDN/SS 8 – 2A CSS ERROR AMP 1.215V FB – 9 + PWM LOGIC CP1 VC PWM COMPARATORS R2 10 – + AUTOMATIC BURST MODE CONTROL SLEEP RT 1 OSC BURST RT 2 VREF 1.215V VREF RBURST CBURST THERMAL SHUTDOWN GND 5 3530 BD 3530fb 6 LTC3530 OPERATION The LTC3530 provides high efficiency, low noise power for a wide variety of handheld electronic devices. The LTC proprietary topology allows input voltages above, below or equal to the output voltage by properly phasing the output switches. The error amp output voltage on VC determines the output duty cycle of the switches. Since VC is a filtered signal, it provides rejection of frequencies from well below the switching frequency. The low RDS(ON), low gate charge synchronous switches provide high frequency pulse width modulation control at high efficiency. High efficiency is achieved at light loads when Burst Mode operation is entered and the LTC3530’s quiescent current drops to a low 40μA. LOW NOISE FIXED FREQUENCY OPERATION Oscillator The frequency of operation is programmed by an external resistor from RT to ground, according to the following equation: f (kHz) 33,170 = R T(k) Error Amp The error amplifier is a voltage mode amplifier. The loop compensation components are configured around the amplifier (from FB to VC) to obtain stability of the converter. For improved bandwidth, an additional R-C feed-forward network can be placed across the upper feedback divider resistor. The voltage on SHDN/SS clamps the error amp output, VC, to provide a soft-start function. Internal Current Limit There are two different current limit circuits in the LTC3530. Each has internally fixed thresholds which vary inversely with VIN. The first circuit is a high speed peak current limit comparator that will shut off switch A once the current exceeds 2.5A typical. The delay to output of this comparator is typically 50ns. A second amplifier will source current out of FB to drop the output voltage once the peak input current exceeds 2A typical. This method provides a closed loop means of clamping the input current. During conditions where VOUT is near ground, such as during a short-circuit or during startup, this threshold is cut to 670mA (typ), providing a foldback feature. For this current limit feature to be most effective, the Thevenin resistance from FB to ground should be greater than 100kΩ. Reverse Current Limit During fixed frequency operation, the LTC3530 operates in forced continuous conduction mode. The reverse current limit amplifier monitors the inductor current from the output through switch D. Once the negative inductor current exceeds 640mA typical, the LTC3530 will shut off switch D. Four-Switch Control Figure 1 shows a simplified diagram of how the four internal switches are connected to the inductor, VIN, VOUT and GND. Figure 2 shows the regions of operation for the LTC3530 as a function of the internal control voltage, VCI. 85% DMAX BOOST V4 (≈1.5V) A ON, B OFF BOOST REGION PWM CD SWITCHES VIN VOUT 7 6 PMOS A PMOS D SW1 SW2 3 4 NMOS B DMIN BOOST DMAX BUCK V3 (≈1.15V) FOUR SWITCH PWM BUCK/BOOST REGION V2 (≈1V) D ON, C OFF PWM AB SWITCHES BUCK REGION V1 (≈0.7V) 0% NMOS C 3530 F01 Figure 1. Simplified Diagram of Output Switches DUTY CYCLE 3530 F02 INTERNAL CONTROL VOLTAGE, VCI Figure 2. Switch Control vs Internal Control Voltage, VCI 3530fb 7 LTC3530 OPERATION Depending on the control voltage, the IC will operate in either buck, buck/boost or boost mode. The VCI voltage is a level shifted voltage from the output of the error amp (VC). The four power switches are properly phased so the transfer between operating modes is continuous, smooth and transparent to the user. When VIN approaches VOUT the buck/boost region is reached where the conduction time of the four switch region is typically 150ns. Referring to Figures 1 and 2, the various regions of operation will now be described. Buck Region (VIN > VOUT) Switch D is always on and switch C is always off during this mode. When the internal control voltage, VCI, is above voltage V1, output A begins to switch. During the off-time of switch A, synchronous switch B turns on for the remainder of the time. Switches A and B will alternate similar to a typical synchronous buck regulator. As the control voltage increases, the duty cycle of switch A increases until the maximum duty cycle of the converter in buck mode reaches DMAX_BUCK, given by: DMAX_BUCK = 100 – D4SW % where D4SW = duty cycle % of the four switch range. D4SW = (150ns • f) • 100 % where f = operating frequency, Hz. Beyond this point the “four switch,” or buck/boost region is reached. Buck/Boost or Four Switch (VIN ≈ VOUT) When the internal control voltage, VCI, is above voltage V2, switch pair AD remain on for duty cycle DMAX_BUCK, and the switch pair AC begins to phase in. As switch pair AC phases in, switch pair BD phases out accordingly. When the VCI voltage reaches the edge of the buck/boost range, at voltage V3, the AC switch pair completely phase out the BD pair, and the boost phase begins at duty cycle D4SW. The input voltage, VIN, where the four switch region begins is given by: VOUT VIN = 1– (150ns • f) The point at which the four switch region ends is given by: VIN = VOUT(1 – D) = VOUT(1 – 150ns • f) V Boost Region (VIN < VOUT) Switch A is always on and switch B is always off during this mode. When the internal control voltage, VCI, is above voltage V3, switch pair CD will alternately switch to provide a boosted output voltage. This operation is typical of a synchronous boost regulator. The maximum duty cycle of the converter is limited to 90% typical and is reached when VCI is above V4. BURST MODE OPERATION Burst mode reduces the LTC3530’s quiescent current consumption at light loads and improves overall conversion efficiency, increasing battery life. During Burst Mode operation the LTC3530 delivers energy to the output until it is regulated and then goes into sleep mode where the outputs are off and quiescent current drops to 40μA (typ). In this mode the output ripple has a variable frequency component that depends upon load current, and will typically be about 2% peak-to-peak. Burst Mode operation ripple can be reduced slightly by using more output capacitance (47μF or greater). Another method of reducing Burst Mode operation ripple is to place a small feed-forward capacitor across the upper resistor in the VOUT feedback divider network (as in Type III compensation). During the period where the device is delivering energy to the output, the peak switch current will be equal to 450mA typical and the inductor current will terminate at zero current for each cycle. In this mode the typical maximum average output current is given by: 450mA ;VOUT < VIN 2 450mA VIN ;VOUT > VIN IMAX(BURST)BOOST • 2 V IMAX(BURST)BUCK OUT I MAX(BURST) Buck-Boost ≈ 350mA; V OUT ≈ V IN. Since the input and output are connected together for most of the cycle. 3530fb 8 LTC3530 OPERATION The efficiency below 1mA becomes dominated primarily by the quiescent current. The Burst Mode operation efficiency is given by: EFFICIENCY •ILOAD 40μA +ILOAD where η is typically 90% during Burst Mode operation. Automatic Burst Mode Operation Control Burst Mode operation can be automatic or manually controlled with a single pin. In automatic mode, the IC will enter Burst Mode operation at light load and return to fixed frequency operation at heavier loads. The load current at which the mode transition occurs is programmed using a single external resistor from BURST to ground, according to the following equations: Enter Burst Mode: IBURST = 8.8 RBURST Leave Burst Mode: IBURST = 11.2 RBURST where RBURST is in kΩ and IBURST is the load transition current in Amps. Do not use values of RBURST greater than 500kΩ. For automatic operation, a filter capacitor must also be connected from BURST to ground. The equation for the minimum capacitor value is: CBURST(MIN) COUT • VOUT 60,000 where CBURST(MIN) and COUT are in μF In the event that a load transient causes FB to drop by more than 4% from the regulation value while in Burst Mode operation, the IC will immediately switch to fixed frequency mode and an internal pull-up will be momentarily applied to BURST, rapidly charging CBURST. This prevents the IC from immediately re-entering Burst Mode operation once the output achieves regulation. Manual Burst Mode Operation For manual control of Burst Mode operation, the RC network connected to BURST can be eliminated. To force fixed frequency mode, BURST should be connected to VIN. To force Burst Mode operation, BURST should be grounded. When commanding Burst Mode operation manually, the circuit connected to BURST should be able to sink up to 2mA. For optimum transient response with large dynamic loads, the operating mode should be controlled manually by the host. By commanding fixed frequency operation prior to a sudden increase in load, output voltage droop can be minimized. Note that if the load current applied during forced Burst Mode operation (BURST pin is grounded) exceeds the current that can be supplied, the output voltage will start to droop and the IC will automatically come out of Burst Mode operation and enter fixed frequency mode, raising VOUT. Once regulation is achieved, the IC will then enter Burst Mode operation once again, and the cycle will repeat, resulting in about 4% output ripple. Burst Mode Operation to Fixed Frequency Transient Response In Burst Mode operation, the compensation network is not used and VC is disconnected from the error amplifier. During long periods of Burst Mode operation, leakage currents in the external components or on the PC board could cause the compensation capacitor to charge (or discharge), which could result in a large output transient when returning to fixed frequency mode of operation, even at the same load current. To prevent this, the LTC3530 incorporates an active clamp circuit that holds the voltage on VC at an optimal voltage during Burst Mode operation. This minimizes any output transient when returning to fixed frequency mode operation. For optimum transient response, Type 3 compensation is also recommended to broad band the control loop and roll off past the two pole response of the output LC filter. See Closing the Feedback Loop under Applications Information. 3530fb 9 LTC3530 OPERATION where f = operating frequency, Hz VIN SHDN/SS ΔIL = maximum allowable inductor ripple current, A VCI VIN(MIN) = minimum input voltage, V VC VIN(MAX) = maximum input voltage, V VOUT = output voltage, V 3530 F05 IOUT(MAX) = maximum output load current Figure 3. Soft-Start The soft-start function is combined with shutdown. When the SHDN/SS pin is brought above 1V typical, the IC is enabled but the EA duty cycle is clamped from VC. A detailed diagram of this function is shown in Figure 3. The components RSS and CSS provide a slow ramping voltage on SHDN/SS to provide a soft-start function. To ensure that VC is not being clamped, SHDN/SS must be raised above 1.6V. For high efficiency, choose a ferrite inductor with a high frequency core material to reduce core loses. The inductor should have low ESR (equivalent series resistance) to reduce the I2R losses, and must be able to handle the peak inductor current without saturating. Molded chokes or chip inductors usually do not have enough core to support the peak inductor currents in the 1A to 2A region. To minimize radiated noise, use a shielded inductor. See Table 1 for a suggested list of inductor suppliers. Output Capacitor Selection The bulk value of the output filter capacitor is set to reduce the ripple due to charge into the capacitor each cycle. The steady state ripple due to charge is given by: COMPONENT SELECTION Inductor Selection The high frequency operation of the LTC3530 allows the use of small surface mount inductors. The inductor ripple current is typically set to 20% to 40% of the maximum inductor current. For a given ripple the inductance terms are given as follows: LBOOST > LBUCK > VIN(MIN) • (VOUT – VIN(MIN) ) f • IL • VOUT VOUT • (VIN(MAX) – VOUT ) f • IL • VIN(MAX) % Ripple_Boost = IOUT(MAX) • (VOUT – VIN(MIN) ) • 100 COUT • VOUT 2 • f % % Ripple_Buck = H H 1 (VIN(MAX) – VOUT ) • 100 8LCf 2 VIN(MAX) % where COUT = output filter capacitor in Farads and f = switching frequency in Hz. Table 1. Inductor Vendor Information SUPPLIER PHONE FAX WEB SITE Coilcraft (847) 639-6400 (847) 639-1469 www.coilcraft.com CoEv Magnetics (800) 227-7040 (650) 361-2508 www.circuitprotection.com/magnetics.asp Murata (814) 237-1431 (800) 831-9172 (814) 238-0409 www.murata.com Sumida USA: (847) 956-0666 Japan: 81(3) 3607-5111 USA: (847) 956-0702 Japan: 81(3) 3607-5144 www.sumida.com TDK (847) 803-6100 (847) 803-6296 www.component.tdk.com TOKO (847) 297-0070 (847) 699-7864 www.tokoam.com 3530fb 10 LTC3530 APPLICATIONS INFORMATION The output capacitance is usually many times larger than the minimum value in order to handle the transient response requirements of the converter. For a rule of thumb, the ratio of the operating frequency to the unity-gain bandwidth of the converter is the amount the output capacitance will have to increase from the above calculations in order to maintain the desired transient response. The other component of ripple is due to the ESR (equivalent series resistance) of the output capacitor. Low ESR capacitors should be used to minimize output voltage ripple. For surface mount applications, Taiyo Yuden or TDK ceramic capacitors, AVX TPS series tantalum capacitors or Sanyo POSCAP are recommended. See Table 2 for contact information. Input Capacitor Selection Since VIN is the supply voltage for the IC, as well as the input to the power stage of the converter, it is recommended to place at least a 10μF, low ESR ceramic bypass capacitor close to the VIN and GND pins. It is also important to minimize any stray resistance from the converter to the battery or other power source. Optional Schottky Diodes Schottky diodes across the synchronous switches B and D are not required (VOUT < 4.3V), but provide a lower drop during the break-before-make time (typically 15ns) improving efficiency. Use a surface mount Schottky diode such as an MBRM120T3 or equivalent. Do not use ordinary rectifier diodes, since the slow recovery times will compromise efficiency. For applications with an output voltage above 4.3V, a Schottky diode is required from SW2 to VOUT. Output Voltage < 1.8V The LTC3530 can operate as a buck converter with output voltages as low as 0.4V. Synchronous switch D is powered from VOUT and the RDS(ON) will increase at low output voltages, therefore a Schottky diode is required from SW2 to VOUT to provide the conduction path to the output. Note that Burst Mode operation is inhibited at output voltages below 1V typical. Note also that if VOUT is less than 1V, the current limit will be 670mA (typ). Output Voltage > 4.3V A Schottky diode from SW2 to VOUT is required for output voltages over 4.3V. The diode must be located as close to the pins as possible in order to reduce the peak voltage on SW2 due to the parasitic lead and trace inductance. Input Voltage > 4.5V For applications with input voltages above 4.5V which could exhibit an overload or short-circuit condition, a 2Ω/1nF series snubber is required between SW1 and GND. A Schottky diode from SW1 to VIN should also be added as close to the pins as possible. For the higher input voltages, VIN bypassing becomes more critical; therefore, a ceramic bypass capacitor as close to the VIN and GND pins as possible is also required. Operating Frequency Selection Higher operating frequencies allow the use of a smaller inductor and smaller input and output filter capacitors, thus reducing board area and component height. However, higher operating frequencies also increase the IC’s total quiescent current due to the gate charge of the four switches, as given by: Buck: Iq = (0.6 • VIN • f) mA Boost: Iq = [0.8 • (VIN + VOUT) • f] mA Buck/Boost: Iq = [f • (1.4 • VIN + 0.4 • VOUT)] mA Table 2. Capacitor Vendor Information SUPPLIER PHONE FAX WEB SITE AVX (803) 448-9411 (803) 448-1943 www.avxcorp.com Murata (814) 237-1431, (800) 831-9172 (814) 238-0409 www.murata.com Sanyo (619) 661-6322 (619) 661-1055 www.sanyovideo.com Taiyo Yuden (408) 573-4150 (408) 573-4159 www.t-yuden.com TDK (847) 803-6100 (847) 803-6296 www.component.tdk.com 3530fb 11 LTC3530 APPLICATIONS INFORMATION where f = switching frequency in MHz. Therefore frequency selection is a compromise between the optimal efficiency and the smallest solution size. Closing the Feedback Loop The LTC3530 incorporates voltage mode PWM control. The control to output gain varies with operation region (buck, boost, buck/boost), but is usually no greater than 15. The output filter exhibits a double pole response, as given by: (in buck mode) VIN 2 • VOUT • • L • COUT Hz (in boost mode) The output filter zero is given by: 1 2 • • RESR • COUT 1 Hz (referring to Figure 4). 2 • • R1• CP1 Most applications demand an improved transient response to allow a smaller output filter capacitor. To achieve a higher bandwidth, Type III compensation is required, providing two zeros to compensate for the double-pole response of the output filter. Referring to Figure 5, the location of the poles and zeros are given by: 1 Hz 2 • • 32,000 • R1• CP1 (which is extremely close to DC) 1 Hz fZERO1 = 2 • • R Z • CP1 1 fZERO2 = Hz 2 • • R1• CZ1 1 fPOLE2 = Hz 2 • • R Z • CP2 fPOLE1 where L is in henries and COUT is in farads. f FILTER — ZERO = A simple Type I compensation network can be incorporated to stabilize the loop, but at a cost of reduced bandwidth and slower transient response. To ensure proper phase margin using Type I compensation, the loop must be crossed over a decade before the LC double pole. The unity-gain frequency of the error amplifier with the Type I compensation is given by: fUG = 1 f FILTER —POLE = Hz 2 • • L • COUT f FILTER —POLE = The loop gain is typically rolled off before the RHP zero frequency. Hz where RESR is the equivalent series resistance of the output capacitor. A troublesome feature in boost mode is the right-half plane zero (RHP), given by: VIN2 f RHPZ = Hz 2 • •IOUT • L • VOUT where resistance is in ohms and capacitance is in farads. VOUT + VOUT + ERROR AMP – 1.215V R1 FB 11 – 1.215V R1 CZ1 FB 12 VC 12 VC ERROR AMP CP1 RZ R2 11 CP1 R2 CP2 3530 F04 3530 F03 Figure 4. Error Amplifier with Type I Compensation Figure 5. Error Amplifier with Type III Compensation 3530fb 12 LTC3530 TYPICAL APPLICATIONS 1MHz Li-Ion to 3.3V at 500mA Converter with Manual Mode Control L1 3.3μH 2.7V TO 4.2V SW1 VIN LTC3530 RSS 1M CIN 10μF RT CSS RT 0.01μF 33.2k VOUT 3.3V 500mA VOUT R1 1M FB SHDN/SS Li-Ion SW2 VC BURST RZ 10k GND BURST FIXED FREQ CP1 560pF RFF 15k CZ1 33pF COUT 22μF R2 576k CIN: TAIYO YUDEN JMK212BJ106MG COUT: TAIYO YUDEN JMK325BJ226MM L1: TDK RLF7030T-3R3M4R 3530 TA02 1MHz Li-Ion to 3.3V/600mA Converter with USB Power Input Option, Li Battery Charger and Power Path Management. L1 4.7μH 5V (NOM) FROM USB CABLE VBUS SW1 1Ω IN1 OUT IN2 BAT VNTC 10μF VIN + 10μF Li-Ion CELL RSS 1M CHRG LTC4055 ACPR SHDN SUSPEND USB POWER SUSP 500mA/100mA SELECT HPWR TIMER PROG 0.1μF CLPROG 97.6k GND SW2 VOUT R1 1M FB SHDN/SS NTC WALL LTC3530 RT CSS 0.01μF VC RZ 10k BURST GND RT 33.2k RBURST 200k CP1 560pF RFF 15k CZ1 33pF R2 576k VOUT 3.3V 500mA COUT 22μF CBURST 0.01μF CIN: TAIYO YUDEN JMK212BJ106MG COUT: TAIYO YUDEN JMK325BJ226MM L1: TDK RLF7030T-4R7M3R4 3530 TA03 97.6k 3530fb 13 LTC3530 TYPICAL APPLICATIONS High Efficiency Li-Ion Powered Constant Current Lumiled Driver L1 3.3μH SW1 SW2 VIN VOUT SD/SS OFF ON CIN 10μF FB VC CP1 1nF LHXL-PW01 R2 100k GND RT 44.2k R3 95.3k 12,810 (R1+R2+R3+R4) ILED = R1 • R3 COUT 4.7μF R4 100k BURST RT R2 = R1/1.5 ILED = 500mA D1 LTC3530 CBURST 470pF R1 301k 3530 TA04a VIN 2.2V TO 4.2V CIN = TAIYO YUDEN JMK212BJ106MG COUT = TAIYO YUDEN JMK325BJ475MM D1 = BAT54 Lumiled Driver Efficiency vs LED Current 100 98 VIN = 3.6V 1MHz EFFICIENCY (%) 96 94 92 90 88 86 84 82 80 0.5 0.1 LED CURRENT (A) 3530 TA04b 3530fb 14 LTC3530 PACKAGE DESCRIPTION DD Package 10-Lead Plastic DFN (3mm × 3mm) (Reference LTC DWG # 05-08-1695) R = 0.115 TYP 6 0.38 ± 0.10 10 0.675 ±0.05 3.50 ±0.05 2.15 ±0.05 1.65 ±0.05 (2 SIDES) 1.65 ± 0.10 (2 SIDES) 3.00 ±0.10 (4 SIDES) PIN 1 TOP MARK (SEE NOTE 6) (DD10) DFN 1103 5 0.25 ± 0.05 0.50 BSC 2.38 ± 0.05 (2 SIDES) 0.25 ± 0.05 0.50 BSC 0.75 ±0.05 0.200 REF PACKAGE OUTLINE 1 2.38 ± 0.10 (2 SIDES) 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS NOTE: 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2). MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT 5. EXPOSED PAD SHALL BE SOLDER PLATED 2. DRAWING NOT TO SCALE 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE 3. ALL DIMENSIONS ARE IN MILLIMETERS TOP AND BOTTOM OF PACKAGE MS Package 10-Lead Plastic MSOP (Reference LTC DWG # 05-08-1661) 3.00 ± 0.102 (.118 ± .004) (NOTE 3) 0.889 ± 0.127 (.035 ± .005) 5.23 (.206) MIN 3.20 – 3.45 (.126 – .136) 0.254 (.010) 10 9 8 7 6 3.00 ± 0.102 (.118 ± .004) (NOTE 4) 4.90 ± 0.152 (.193 ± .006) DETAIL “A” 0° – 6° TYP GAUGE PLANE 0.50 0.305 ± 0.038 (.0197) (.0120 ± .0015) BSC TYP RECOMMENDED SOLDER PAD LAYOUT 0.497 ± 0.076 (.0196 ± .003) REF 1 2 3 4 5 0.53 ± 0.152 (.021 ± .006) DETAIL “A” 0.18 (.007) NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX SEATING PLANE 0.86 (.034) REF 1.10 (.043) MAX 0.17 – 0.27 (.007 – .011) TYP 0.50 (.0197) BSC 0.1016 ± 0.0508 (.004 ± .002) MSOP (MS) 0307 REV E 3530fb Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 15 LTC3530 TYPICAL APPLICATION USB to 5V Converter with Output Disconnect L1 10μH 1nF 2Ω D2** USB 4.35V TO 5.25V R4 1M 4 SW1 SW2 LTC3530 6 7 VIN VOUT 2 C3 * 0.1μF 1 SHDN/SS FB BURST VC RT GND *0 = Burst Mode OPERATION 1 = FIXED FREQUENCY ** LOCATE COMPONENTS AS CLOSE TO IC AS POSSIBLE 33pF R1 1M 15k 9 10 5 RT = 1MHz f 33.2k OSC SD VOUT 5VIN – 435mA MAX 4.35VIN – 350mA MAX 3 8 C1 10μF D1** C2** 22μF 10k C4 560pF R2 324k 3530 TA05 C1: TAIYO YUDEN JMK212BJ106MG C2: TAIYO YUDEN JMK325BJ226MM D1, D2: ON SEMICONDUCTOR MBRM120T3 L1: SUMIDA CDRH4D28-100 RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LTC3400/LTC3400B 600mA (ISW), 1.2MHz Synchronous Step-Up DC/DC Converter LTC3401/LTC3402 1A/2A (ISW), 3MHz Synchronous Step-Up DC/DC Converter LTC3406/LTC3406B 600mA (IOUT), 1.5MHz Synchronous Step-Up DC/DC Converter VIN: 0.85V to 5V, VOUT(MAX) = 5V, IQ = 19μA/300μA, ISD < 1μA, ThinSOT Package VIN: 0.5V to 5V, VOUT(MAX) = 5V, IQ = 38mA, ISD < 1μA, MS Package VIN: 2.5V to 5.5V, VOUT(MIN) = 0.6V, IQ = 20μA, ISD ≤ 1μA, ThinSOT Package LTC3407 600mA (IOUT), 1.5MHz Dual Synchronous Step-Up DC/DC Converter VIN: 2.5V to 5.5V, VOUT(MIN) = 0.6V, IQ = 40μA, ISD ≤ 1μA, MS Package LTC3411 1.25A (IOUT), 4MHz Synchronous Step-Up DC/DC Converter VIN: 2.5V to 5.5V, VOUT(MIN) = 0.8V, IQ = 60μA, ISD ≤ 1μA, MS Package LTC3412 2.5A (IOUT), 4MHz Synchronous Step-Up DC/DC Converter VIN: 2.5V to 5.5V, VOUT(MIN) = 0.8V, IQ = 60μA, ISD ≤ 1μA, TSSOP16E Package LTC3421 3A (ISW), 3MHz Synchronous Step-Up DC/DC Converter VIN: 0.5V to 4.5V, VOUT(MAX) = 5.25V, IQ = 12μA, ISD < 1μA, QFN Package LTC3425 5A (ISW), 8MHz Multiphase Synchronous Step-Up DC/DC Converter VIN: 0.5V to 4.5V, VOUT(MAX) = 5.25V, IQ = 12μA, ISD < 1μA, QFN Package LTC3429 600mA (ISW), 500kHz Synchronous Step-Up DC/DC Converter VIN: 0.5V to 4.4V, VOUT(MAX) = 5V, IQ = 20μA, ISD < 1μA, QFN Package LTC3440 600mA (IOUT), 2MHz Synchronous Buck-Boost DC/DC Converter VIN: 2.5V to 5.5V, VOUT(MAX) = 5.5V, IQ = 25μA, ISD < 1μA, MS, DFN Package LTC3441 600mA (IOUT), 2MHz Synchronous Buck-Boost DC/DC Converter VIN: 2.5V to 5.5V, VOUT(MAX) = 5.5V, IQ = 25μA, ISD < 1μA, DFN Package LTC3442/LTC3443 1.2A (IOUT), Synchronous Buck-Boost DC/DC Converters, LTC3442 (1MHz), LTC3443 (600kHz) VIN: 2.4V to 5.5V, VOUT(MAX) = 5.25V, IQ = 28μA, ISD < 1μA, MS Package LTC3444 500mA (IOUT), 1.5MHz Synchronous Buck-Boost DC/DC Converter with VIN: 2.7V to 5.5V, VOUT = 0.5V to 5.25V, 3mm x 3mm Wide VOUT Range DFN Package, Ideal for WCDMA PA Bias LTC3532 500mA (IOUT), 2MHz Synchronous Buck-Boost DC/DC Converter VIN: 2.4V to 5.5V, VOUT(MAX) = 5.25V, IQ = ISD < 1μA, DFN Package ThinSOT is a trademark of Linear Technology Corporation. 3530fb 16 Linear Technology Corporation LT 0807 REV B • PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com © LINEAR TECHNOLOGY CORPORATION 2006