Chip Ferrite Bead For High Speed Monolithic inorganic material construction Closed magnetic circuit avoids crosstalk SMD Type & suitable for reflow and wave soldering Available in various sizes Excellent solder ability and heat resistance High reliability With a sharp and frequency frequency impedance characteristics which can effectively filter high frequency noise without attenuating high frequency signal Filtering between analog and digital circuitry,clock generation circuitry,I/O interconnects,isolation between RF noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted RF energy from corrupting the power generation circuitry.Sharp impedance characteristics can effectively minimize attenuation,high frequency EMI prevention of LCD monitor,PDA,Computers, Computer Operating temperature range : - 55℃ ~ +125℃ Storage Condition : Less than 40℃ and 70% RH Storage Time: 6 months(Size:1005) 12 months(Size:1608 above) Soldering method: Reflow or Wave Soldering peripherals, Cellular Equipment, Digital TV, Digital Cameras, Audio/Visual Equipment, DVD, Wireless Communication Devices, MP3. Unit：mm Revision December 18, 2015 Type 1005 (EIA 0402) 1608 (EIA 0603) 2012 (EIA 0805) L 1.00±0.10 1.60±0.15 2.00±0.20 W 0.50±0.10 0.80±0.15 1.25±0.20 T 0.50±0.10 0.80±0.15 0.90±0.20 E 0.25±0.10 0.30±0.20 0.50±0.30 1/5 @ UN Semiconductor Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information. Chip Ferrite Bead For High Speed MCB 1608 H 12 1 E B 1 2 3 4 5 6 7 P 8 Impedance(Ω) +/-25% Test Freq.(MHz) DCR(Ω) (Max.) Rated Current (mA) 75 100 0.40 300 MCB1608H200HBP 20 100 0.25 500 MCB1608H750HBP 75 100 0.35 500 MCB1608H800HBP 80 100 0.35 500 MCB1608H121EBP 120 100 0.45 200 MCB1608H301EBP 300 100 0.45 200 MCB1608H601EBP 600 100 0.50 200 MCB1608H102EBP 1000 100 0.60 200 Part No. MCB1005-H Series MCB1005H750FBP MCB1608-H Series Revision December 18, 2015 2/5 @ UN Semiconductor Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information. Chip Ferrite Bead For High Speed Impedance(Ω) +/-25% Part No. Test Freq.(MHz) DCR(Ω) (Max.) Rated Current (mA) MCB2012-H Series MCB2012H121EBP 120 100 0.25 200 MCB2012H221EBP 220 100 0.25 200 MCB2012H301EBP 300 100 0.25 200 MCB2012H601EBP 600 100 0.35 200 Test Instruments： Test Level：250 mV HP4291B RF IMPEDANCE / MATERIAL ANALYZER HP4338A/B MILLIOHMMETER Agilent 8720ES S-PARAMETER NETWORK ANALYZER HP6632B SYSTEM DC POWER SUPPLY PART SIZE (EIA SIZE) 7” REEL Revision December 18, 2015 Qty. (pcs) 1005 (0402) 1608 (0603) 2012 (0805) 10000 4000 4000 3/5 @ UN Semiconductor Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information. Chip Ferrite Bead For High Speed Revision December 18, 2015 4/5 @ UN Semiconductor Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information. Chip Ferrite Bead For High Speed Test item Test condition A. Temperature : -40 ~ +85℃ B. Cycle : 100 cycles C. Dwell time : 30minutes Temperature Cycle Measurement : at ambient temperature 24 hrs after test completion Criteria A. No mechanical damage B.Impedance value should be within ± 20 % of the initial value A. Temperature : 125℃ ± 5℃ A. No mechanical damage B.Impedance value should be within ± 20 % of the initial value Operational Life Biased Humidity Resistance to Solder Heat Steam Aging Test Revision December 18, 2015 B. Test time : 1000 hrs C. Apply current : full rated current Measurement : at ambient temperature 24 hrs after test completion A. Temperature : 40 ± 2℃ B. Humidity : 90 ~ 95 % RH C. Test time : 1000 hrs D. Apply current : full rated current Measurement : at ambient temperature 24 hrs after test completion A. No mechanical damage B. Impedance value should be within ± 20 % of the initial value A. Solder temperature : 260 ± 5℃ B. Flux : Rosin C. DIP time : 10 ± 1 sec A. More than 95 % of terminal electrode should be covered with new solder B. No mechanical damage C.Impedance value should be within ± 20 % of the initial value A. Temperature : 93 ± 2℃ B. Test time : 4 hrs More than 95 % of terminal electrode should be covered with new solder C. Solder temperature : 235 ± 5℃ D. Flux : Rosin E. DIP time : 5 ± 1 sec 5/5 @ UN Semiconductor Co., Ltd. 2015 Specifications are subject to change without notice. Please refer to www.unsemi.com.tw for current information.