Infineon MA001301104 Material content data sheet Datasheet

Material Content Data Sheet
Sales Product Name
BSC0500NSI
Issued
MA#
MA001301104
Package
PG-TDSON-8-6
14. August 2015
Weight*
107.12 mg
Construction Element
Material Group
Substances
CAS#
if applicable
Weight
[mg]
Average
Mass
[%]
chip
leadframe
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
silicon
iron
phosphorus
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
iron
phosphorus
copper
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-50-8
1333-86-4
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
0.629
0.59
0.038
0.04
wire
encapsulation
leadfinish
plating
solder
heat sink CLIP
*deviation
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.59
5873
5873
353
0.011
0.01
37.762
35.25
35.30
352518
106
352977
0.021
0.02
0.02
194
194
0.088
0.08
817
6.215
5.80
37.464
34.97
40.85
349740
408575
1.470
1.37
1.37
13721
13721
0.166
0.15
0.15
1545
1545
0.023
0.02
0.019
0.02
0.895
0.84
0.022
0.02
0.007
0.01
22.292
20.81
58018
219
175
0.88
8351
63
20.84
208099
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Infineon Technologies AG
Address
81726 München
Internet
www.infineon.com
8745
208
208370
1000000
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