ON NSR023D Schottky barrier diode Datasheet

NSR0230M2T5G
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
•
•
•
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Extremely Fast Switching Speed
Extremely Low Forward Voltage 0.325 V (max) @ IF = 10 mA
Low Reverse Current
This is a Pb−Free Device
30 V SCHOTTKY
BARRIER DIODE
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Reverse Voltage
VR
30
Vdc
Forward Current DC
IF
200
mA
IFSM
1.0
A
Forward Current Surge Peak
(60 Hz, 1 cycle)
1
CATHODE
MARKING
DIAGRAM
2
ESD Rating: Class 3B per Human Body Model
ESD Rating: Class C per Machine Model
1
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage
Temperature Range
Symbol
Max
Unit
PD
200
mW
2.0
mW/°C
RqJA
600
°C/W
TJ, Tstg
−55 to
+125
°C
1. FR−5 Minimum Pad.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Reverse Leakage
(VR = 10 V)
IR
−
−
10
mA
Forward Voltage
(IF = 10 mA)
(IF = 200 mA)
VF
−
−
−
−
0.325
0.500
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 0
2
ANODE
SOD−723
CASE 509AA
PLASTIC
1
7C MG
G
2
7C = Specific Device Code
M = Month Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NSR0230M2T5G
SOD−723
2 mm Pitch
8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Vdc
1
Publication Order Number:
NSR0230/D
NSR0230M2T5G
IF, FORWARD CURRENT (A)
1
10m
TA = 125°C
IR, REVERSE CURRENT (A)
100m
TA = 75°C
10m
1m
100m
TA = 25°C
10m
1m
TA = 125°C
100m
TA = 75°C
10m
TA = 25°C
1m
100n
TA = −25°C
10n
TA = −25°C
1m
1n
0.1
0.2
0.3
0.4
0.5
0
0.6
5
10
15
Figure 1. Forward Characteristics
25
Figure 2. Reverse Characteristics
20
18
16
14
12
10
8
6
4
2
0
0
20
VR, REVERSE VOLTAGE (VOLTS)
VF, FORWARD VOLTAGE (V)
CT, TOATAL CAPACITANCE (pF)
0
5
10
15
20
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Total Capacitance
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2
25
30
30
NSR0230M2T5G
PACKAGE DIMENSIONS
SOD−723
CASE 509AA−01
ISSUE O
D
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
−Y−
E
b
2X
0.08 (0.0032) X Y
DIM
A
b
c
D
E
HE
L
A
c
L
MILLIMETERS
INCHES
MIN
NOM MAX MIN
NOM MAX
0.49
0.52
0.55
0.019 0.020 0.022
0.25
0.28
0.32 0.0098 0.011 0.013
0.08
0.12
0.15 0.0032 0.0047 0.0059
0.95
1.00
1.05
0.037 0.039 0.041
0.55
0.60
0.65
0.022 0.024 0.026
1.35
1.40
1.45
0.053 0.055 0.057
0.15
0.20
0.25
0.006 0.0079 0.010
HE
SOLDERING FOOTPRINT*
1.1
0.043
0.45
0.0177
0.50
0.0197
SCALE 10:1
mm Ǔ
ǒinches
SOD−723
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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3
NSR0230M2T5G
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NSR0230/D
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