TI CDCU877GQL 1.8-v phase lock loop clock driver Datasheet

CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
FEATURES
•
•
•
•
•
•
•
•
1.8-V Phase Lock Loop Clock Driver for
Double Data Rate (DDR II) Applications
Spread Spectrum Clock Compatible
Operating Frequency: 10 MHz to 400 MHz
Low Current Consumption: <135 mA
Low Jitter (Cycle-Cycle): ±30 ps
Low Output Skew: 35 ps
Low Period Jitter: ±20 ps
Low Dynamic Phase Offset: ±15 ps
•
•
Low Static Phase Offset: ±50 ps
Distributes One Differential Clock Input to Ten
Differential Outputs
52-Ball μBGA (MicroStar™ Junior BGA,
0,65-mm pitch) and 40-Pin MLF
External Feedback Pins (FBIN, FBIN) are Used
to Synchronize the Outputs to the Input
Clocks
Meets or Exceeds JESD82-8 PLL Standard for
PC2-3200/4300
Fail-Safe Inputs
•
•
•
•
DESCRIPTION
The CDCU877 is a high-performance, low-jitter, low-skew, zero-delay buffer that distributes a differential clock
input pair (CK, CK) to ten differential pairs of clock outputs (Yn, Yn) and to one differential pair of feedback clock
outputs (FBOUT, FBOUT). The clock outputs are controlled by the input clocks (CK, CK), the feedback clocks
(FBIN, FBIN), the LVCMOS control pins (OE, OS), and the analog power input (AVDD). When OE is low, the
clock outputs, except FBOUT/FBOUT, are disabled while the internal PLL continues to maintain its locked-in
frequency. OS (output select) is a program pin that must be tied to GND or VDD. When OS is high, OE functions
as previously described. When OS and OE are both low, OE has no affect on Y7/Y7, they are free running.
When AVDD is grounded, the PLL is turned off and bypassed for test purposes.
When both clock inputs (CK, CK) are logic low, the device enters in a low power mode. An input logic detection
circuit on the differential inputs, independent from input buffers, detects the logic low level and performs in a low
power state where all outputs, the feedback, and the PLL are off. When the clock inputs transition from being
logic low to being differential signals, the PLL turns back on, the inputs and the outputs are enabled, and the
PLL obtains phase lock between the feedback clock pair (FBIN, FBIN) and the clock input pair (CK, CK) within
the specified stabilization time.
The CDCU877 is able to track spread spectrum clocking (SSC) for reduced EMI. This device operates from
—40°C to 85°C.
ORDERING INFORMATION
TA
-40°C to 85°C
(1)
52-BALL BGA
(1)
40-Pin MLF
CDCU877ZQL
CDCU877RHA
CDCU877AZQL
CDCU877ARHA
CDCU877GQL
CDCU877RTB
CDCU877AGQL
CDCU877ARTB
For the most current package and ordering information, see the
Package Option Addendum at the end of this document, or see the
TI website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroStar is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2007, Texas Instruments Incorporated
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
3
Y6
Y5
Y5
Y0
2
GND
GND
Y0
Y1
MicroStar Junior (ZQL) Package
(TOP VIEW)
4
5
6
A
Y1
GND
B
Y6
GND
C
NB
NB
Y7
GND
Y2
GND
Y2
VDDQ
VDDQ
CK
D
Y7
OS
VDDQ
E
NB
NB
F
NB
NB
FBIN
VDDQ
VDDQ
FBIN
OE
CK
VDDQ
AGND
VDDQ
VDDQ
AVDD
GND
Y3
GND
G
FBOUT
VDDQ
VDDQ
NB
H
NB
FBOUT
GND
J
Y8
GND
A.
NC = No Connection
B.
NB = No Ball
Y8
Y9
GND
Y9
GND
Y4
Y4
Y3
K
Y1
Y1
Y0
Y0
VDDQ
Y5
Y5
Y6
Y6
VDDQ
RHA/RTB Package (MLF PAckage
(TOP VIEW)
40 39 38 37 36 35 34 33 32 31
VDDQ
Y2
Y2
CK
CK
VDDQ
AGND
AVDD
VDDQ
GND
1
30
2
29
28
3
27
4
5
GND
26
6
25
7
24
8
23
22
9
21
10
VDDQ
Y9
Y9
Y8
Y8
VDDQ
Y3
Y3
Y4
Y4
11 12 13 14 15 16 17 18 19 20
40-pin HP-VFQFP-N (6,0 x 6,0 mm Body Size,
0,5 mm Pitch, M0#220, Variation VJJD-2,
E2 = D2 = 2,9 mm ± 0,15 mm) Package Pinouts
2
Submit Documentation Feedback
Y7
Y7
VDDQ
FBIN
FBIN
FBOUT
FBOUT
VDDQ
OE
OS
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
GQL/ZQL
RHA/RTB
AGND
G1
7
AVDD
H1
8
CK
E1
4
I
Clock input with a (10 kΩ to 100 kΩ) pulldown resistor
CK
F1
5
I
Complementary clock input with a (10 kΩ to 100 kΩ) pulldown
resistor
FBIN
E6
27
I
Feedback clock input
FBIN
F6
26
I
Complementary feedback clock input
FBOUT
H6
24
O
Feedback clock output
FBOUT
G6
25
O
Complementary feedback clock output
OE
F5
22
I
Output enable (asynchronous)
I
Output select (tied to GND or VDD)
OS
Analog ground
Analog power
D5
21
GND
B2, B3, B4, B5,
C2, C5, H2, H5,
J2, J3, J4, J5
10
VDDQ
D2, D3, D4, E2,
E5, F2, G2, G3,
G4, G5
1, 6, 9, 15, 20, 23,
28, 31, 36
Y[0:9]
A2, A1, D1, J1, K3,
A5, A6, D6, J6, K4
3, 11, 14, 16, 19,
29, 33, 34, 38, 39
O
Clock outputs
Y[0:9]
A3, B1, C1, K1,
K2, A4, B6, C6,
K6, K5
2, 12, 13, 18, 17,
30, 32, 35, 37, 40
O
Complementary clock outputs
Ground
Logic and output power
FUNCTION TABLE
INPUTS
AVDD
OE
OS
GND
H
GND
H
GND
OUTPUTS
CK
CK
Y
Y
FBOUT
FBOUT
PLL
X
L
X
H
H
L
L
H
H
L
H
Bypassed/Off
L
H
L
L
H
L
H
Bypassed/Off
LZ
LZ
L
H
Bypassed/Off
GND
L
L
H
L
LZ
Y7 Active
LZ
Y7 Active
H
L
Bypassed/Off
1.8 V Nominal
L
H
L
H
LZ
LZ
L
H
On
H
L
LZ
Y7 Active
LZ
Y7 Active
H
L
On
1.8 V Nominal
L
L
1.8 V Nominal
H
X
L
H
L
H
L
H
On
1.8 V Nominal
H
X
H
L
H
L
H
L
On
1.8 V Nominal
X
X
L
L
LZ
LZ
LZ
LZ
Off
X
X
X
H
H
Submit Documentation Feedback
Reserved
3
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
SCAS688D – JUNE 2005 – REVISED JULY 2007
Figure 1. LOGIC DIAGRAM (POSITIVE LOGIC)
4
Submit Documentation Feedback
www.ti.com
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage range
VDDQ or AVDD
VI
Input voltage range (2) (3)
(2) (3)
MIN
MAX
–0.5
2.5
UNIT
V
–0.5
VDDQ + 0.5
V
–0.5
VDDQ + 0.5
VO
Output voltage range
IIK
Input clamp current
VI < 0 or VI > VDDQ
±50
mA
IOK
Output clamp current
VO < 0 or VO > VDDQ
±50
mA
IO
Continuous output current
VO = 0 to VDDQ
Continuous current through each VDDQ or GND
Tstg
(1)
(2)
(3)
Storage temperature range
–65
V
±50
mA
±100
mA
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
This value is limited to 2.5 V maximum.
Recommended Operating Conditions
VCC
Output supply voltage, VDDQ
Supply Voltage, AVDD
MIN
NOM
MAX
1.7
1.8
1.9
(1)
VDDQ
UNIT
V
V
VIL
Low-level input voltage (2)
OE, OS
VIH
High-level input voltage (2)
CK, CK
IOH
High-level output current (see Figure 2)
-9
mA
IOL
Low-level output current (see Figure 2)
9
mA
VIX
Input differential-pair cross voltage
VI
Input voltage level
(2)
VID
Input differential voltage
(see Figure 9 )
TA
Operating free-air temperature
(1)
(2)
0.35 x VDDQ
0.65 x VDDQ
V
V
(VDDQ/2) - 0.15
(VDDQ/2) + 0.15
V
-0.3
VDDQ + 0.3
V
DC
0.3
VDDQ + 0.4
V
AC
0.6
VDDQ + 0.4
V
-40
85
°C
The PLL is turned off and bypassed for test purposes when AVDD is grounded. During this test mode, VDDQ remains within the
recommended operating conditions and no timing parameters are specified.
VID is the magnitude of the difference between the input level on CK and the input level on CK, see Figure 9 for definition. The CK and
CK, VIH and VIL limits define the dc low and high levels for the logic detect state.
Submit Documentation Feedback
5
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
Input
VOH
High-level output voltage
VOL
Low-level output voltage
IO(DL)
Low-level output current, dissabled
VOD
Differential output voltage (1)
II = 18 mA
(1)
(2)
UNIT
-1.2
V
VDDQ – 0.2
V
1.1
0.1
IOL = 9 mA
1.7
VO(DL) = 100 mV, OE = L
1.7
100
1.7
0.5
μA
V
±250
OE, OS,
FBIN, FBIN
1.9
±10
CK and CK = L
1.9
500
CK and CK = 270 MHz. All
outputs are open (not connected
to a PCB)
1.9
135
All outputs are loaded with 2 pF
and 120-Ω termination resistor
1.9
CK, CK
FBIN, FBIN
CK, CK
FBIN, FBIN
VI = VDD or GND
VI = VDD or GND
V
0.6
1.9
Supply current, dynamic (IDDQ + IADD)
(see Note (2) for CPD calculation)
Change in input current
MAX
CK, CK
Supply current, static (IDDQ + IADD)
CI(Δ)
1.7
IOL = 100 μA
IDD(LD)
Input capacitance
1.7 to 1.9
IOH = –9 mA
Input current
CI
MIN TYP (1)
1.7
IOH = –100 μA
II
IDD
AVDD ,
VDDQ
μA
μA
mA
235
1.8
2
3
1.8
2
3
1.8
0.25
1.8
0.25
pF
VOD is the magnitude of the difference between the true and complimentary outputs. See Figure 9 for a definition.
Total IDD = IDDQ + IADD = fCK × CPD × VDDQ, solving for CPD = (IDDQ + IADD)/(fCK × VDDQ) where fCK is the input frequency, VDDQ is the
power supply, and CPD is the power dissipation capacitance.
Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted) (1)
PARAMETER
fCK
Duty cycle, input clock
tL
Stabiliztion time
(3)
(4)
6
Clock frequency (application) (1) (3)
tDC
(1)
(2)
TEST CONDITIONS
Clock frequency (operating) (1) (2)
AVDD, VDD = 1.8 V ±0.1 V
(4)
MIN
MAX
UNIT
10
400
MHz
160
340
MHz
40%
60%
12
μs
The PLL must be able to handle spread spectrum induced skew.
Operating clock frequency indicates a range over which the PLL must be able to lock, but in which it is not required to meet the other
timing parameters (used for low speed system debug).
Application clock frequency indicates a range over which the PLL must meet all timing parameters.
Stabilization time is the time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal after
power up. During normal operation, the stabilization time is also the time required for the integrated PLL circuit to obtain phase lock of
its feedback signal to its reference signal when CK and CK go to a logic low state, enter the power-down mode and later return to active
operation. CK and CK may be left floating after they have been driven low for one complete clock cycle.
Submit Documentation Feedback
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see
PARAMETER
TEST CONDITIONS
(1)
) AVDD, VDD = 1.8 V ± 0.1 V
MIN
TYP
MAX
UNIT
ten
Enable time, OE to any Y/Y
See Figure 11
8
ns
tdis
Disable time, OE to any Y/Y
See Figure 11
8
ns
Cycle-to-cycle period jitter (2)
160 MHz to 190 MHz, see Figure 4
Cycle-to-cycle period jitter (2)
160 MHz to 340 MHz, see Figure 4
t(ω)
Static phase offset time (3)
t(ω)dyn
Dynamic phase offset time
tsk(o)
Output clock skew
See Figure 6
tjit(cc+)
tjit(cc-)
tjit(cc+)
tjit(cc-)
tjit(per)
VOX
40
0
-40
0
30
0
-30
See Figure 5
-50
50
ps
See Figure 10
-15
15
ps
35
ps
160 MHz to 190 MHz, see Figure 7
-30
30
190 MHz to 340 MHz, see Figure 7
-20
20
160 MHz to 190 MHz, see Figure 8
-115
115
190 MHz to 250 MHz, see Figure 8
-70
70
250 MHz to 300 MHz, see Figure 8
-40
40
300 MHz to 340 MHz, see Figure 8
-60
60
Slew rate, OE
See Figure 3 and Figure 9
0.5
Input clock slew rate
See Figure 3 and Figure 9
1
2.5
4
Output clock slew rate (5) (6) (no load)
See Figure 3 and Figure 9
1.5
2.5
3
Period jitter
(4) (2)
tjit(hper) Half-period jitter (4) (2)
SR
0
Output differential-pair cross voltage
CDCU877, See Figure 2
(VDDQ/2) 0.1
(VDDQ/2) +
0.1
CDCU877A (8), See Figure 2
(0 - 85°C)
(VDDQ/2) 0.1
(VDDQ/2) +
0.1
(7)
SSC modulation frequency
SSC clock input frequency deviation
PLL loop bandwidth
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
30
33
0%
-0.5%
2
ps
ps
ps
ps
V/ns
V
kHz
MHz
There are two different terminations that are used with the following tests. The load/board in Figure 2 is used to measure the input and
output differential-pair cross voltage only. The load/board in Figure 3 is used to measure all other tests. For consistency, equal length
cables must be used.
This parameter is specifieded by design and characterization.
Phase static offset time does not include jitter.
Period jitter, half-period jitter specifications are separate specifications that must be met independently of each other.
The output slew rate is determined from the IBIS model with a 120-Ω load only.
To eliminate the impact of input slew rates on static phase offset, the input skew rates of reference clock input CK and CK and feedback
clock inputs FBIN and FBIN are recommended to be nearly equal. The 2.5-V/ns skew rates are shown as a recommended target.
Compliance with these typical values is not mandatory if it can adequately shown that alternative characteristics meet the requirements
of the registered DDR2 DIMM application.
Output differential-pair cross voltage specified at the DRAM clock input or the test load.
VOX of CDCU877A is on average 30 mV lower than that of CDCU877 for the same application.
Submit Documentation Feedback
7
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
PARAMETER MEASUREMENT INFORMATION
VDD
CU877
SCOPE
GND
C = 10 pF
Z = 60 W
L = 2.97”
C = 1 pF
Z = 120 W
R = 1 MW
VTT
Z = 60 W
L = 2.97”
C = 1 pF
R = 1 MW
C = 10 pF
VTT
GND
Note: VTT = GND
Figure 2. Output Load Test Circuit 1
VDD/2
CU877
SCOPE
−VDD/2
C = 10 pF
Z = 60 W
Z = 50 W
L = 2.97”
R = 10 W
Z = 60 W
R = 50 W
VTT
Z = 50 W
L = 2.97”
R = 10 W
R = 50 W
C = 10 pF
−VDD/2
VTT
Note: VTT = GND
−VDD/2
Figure 3. Output Load Test Circuit 2
Yx, FBOUT
Yx, FBOUT
tcycle n
tcycle n+1
tjit(cc) = tcycle n − tcycle n+1
Figure 4. Cycle-To-Cycle Period Jitter
8
Submit Documentation Feedback
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
tjn
tjn+1
Figure 5. Static Phase Offset
n=N
å1
tj =
tjn
N
(N is the large number of samples)
(N > 1000 samples)
(1)
Figure 6. Output Skew
Figure 7. Period Jitter
t jit(per) = tcycle n -
1
fO
(fO average input frequency measured at CK/CK
Submit Documentation Feedback
(2)
9
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 8. Half-Period Jitter
t jit(hper) = thalf period n -
1
2 x fO
n = any half cycle
(fO average input frequency measured at CK/CK
(3)
80%
80%
VID, VOD
Clock Inputs
and Outputs, OE
20%
20%
tr(i), tr(o)
tf(i), tf(o)
Figure 9. Input and Output Slew Rates
slrr(i/o) =
V80% - V20%
tr(i/o)
slrf(i/o) =
V80% - V20%
t f(i/o)
(4)
tj
tj
tjdyn
tjdyn
tjdyn
Figure 10. Dynamic Phase Offset
10
Submit Documentation Feedback
tjdyn
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 11. Time Delay Between OE and Clock Output (Y, Y)
RECOMMENDED AVDD FILTERING
Bead
0603
CARD
VIA
AV DD
V DDQ
1W
4.7 mF
1206
0.1 mF
0603
2200 pF
0603
PLL
GND
AGND
CARD
VIA
A.
Place the 2200-pF capacitor close to the PLL.
B.
Use a wide trace for the PLL analog power and ground. Connect PLL and capacitors to AGND trace and connect
trace to one GND via (farthest from the PLL).
C.
Recommended bead: Fair-Rite PN 2506036017Y0 or equilvalent (0.8 Ω dc maximum, 600 Ω at 100 MHz).
Figure 12. Recommended AVDD Filtering
Submit Documentation Feedback
11
PACKAGE OPTION ADDENDUM
www.ti.com
5-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
CDCU877AGQLT
NRND
BGA
MICROSTAR
JUNIOR
GQL
52
250
TBD
SNPB
Level-2-235C-1 YEAR
-40 to 85
CDCU877A
CDCU877ARHAR
NRND
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877A
CDCU877ARHARG4
NRND
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877A
CDCU877ARHAT
NRND
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877A
CDCU877ARHATG4
NRND
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877A
CDCU877ARTBR
OBSOLETE
VQFN
RTB
40
TBD
Call TI
Call TI
-40 to 85
CDCU877A
CDCU877AZQLR
NRND
BGA
MICROSTAR
JUNIOR
ZQL
52
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-2-260C-1 YEAR
-40 to 85
CDCU877A
CDCU877AZQLT
NRND
BGA
MICROSTAR
JUNIOR
ZQL
52
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-2-260C-1 YEAR
-40 to 85
CDCU877A
CDCU877GQLR
NRND
BGA
MICROSTAR
JUNIOR
GQL
52
1000
TBD
SNPB
Level-2-235C-1 YEAR
-40 to 85
CDCU877
CDCU877GQLT
NRND
BGA
MICROSTAR
JUNIOR
GQL
52
250
TBD
SNPB
Level-2-235C-1 YEAR
-40 to 85
CDCU877
CDCU877RHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877
CDCU877RHARG4
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877
CDCU877RHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877
CDCU877RHATG4
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877
CDCU877RTBR
OBSOLETE
VQFN
RHA
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877
CDCU877RTBT
OBSOLETE
VQFN
RTB
40
TBD
Call TI
Call TI
-40 to 85
CDCU877
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
5-Apr-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
CDCU877ZQLR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQL
52
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-2-260C-1 YEAR
-40 to 85
CDCU877
CDCU877ZQLT
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQL
52
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-2-260C-1 YEAR
-40 to 85
CDCU877
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CDCU877AGQLT
CDCU877ARHAR
CDCU877ARHAT
Package Package Pins
Type Drawing
BGA MI
CROSTA
R JUNI
OR
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
GQL
52
250
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
VQFN
RHA
40
2500
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
VQFN
RHA
40
250
180.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
CDCU877AZQLR
BGA MI
CROSTA
R JUNI
OR
ZQL
52
1000
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
CDCU877AZQLT
BGA MI
CROSTA
R JUNI
OR
ZQL
52
250
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
CDCU877GQLR
BGA MI
CROSTA
R JUNI
OR
GQL
52
1000
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
CDCU877GQLT
BGA MI
CROSTA
R JUNI
OR
GQL
52
250
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CDCU877RHAR
VQFN
RHA
40
2500
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
CDCU877RHAT
VQFN
RHA
40
250
180.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
CDCU877ZQLR
BGA MI
CROSTA
R JUNI
OR
ZQL
52
1000
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
CDCU877ZQLT
BGA MI
CROSTA
R JUNI
OR
ZQL
52
250
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CDCU877AGQLT
BGA MICROSTAR
JUNIOR
GQL
52
250
336.6
336.6
28.6
CDCU877ARHAR
VQFN
RHA
40
2500
367.0
367.0
38.0
CDCU877ARHAT
VQFN
RHA
40
250
210.0
185.0
35.0
CDCU877AZQLR
BGA MICROSTAR
JUNIOR
ZQL
52
1000
336.6
336.6
28.6
CDCU877AZQLT
BGA MICROSTAR
JUNIOR
ZQL
52
250
336.6
336.6
28.6
CDCU877GQLR
BGA MICROSTAR
JUNIOR
GQL
52
1000
336.6
336.6
28.6
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CDCU877GQLT
BGA MICROSTAR
JUNIOR
GQL
52
250
336.6
336.6
28.6
CDCU877RHAR
VQFN
RHA
40
2500
367.0
367.0
38.0
CDCU877RHAT
VQFN
RHA
40
250
210.0
185.0
35.0
CDCU877ZQLR
BGA MICROSTAR
JUNIOR
ZQL
52
1000
336.6
336.6
28.6
CDCU877ZQLT
BGA MICROSTAR
JUNIOR
ZQL
52
250
336.6
336.6
28.6
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated