AD ADSP-BF561SBB500 Blackfin embedded symmetric multiprocessor Datasheet

Blackfin Embedded
Symmetric Multiprocessor
ADSP-BF561
FEATURES
Dual symmetric 600 MHz high performance Blackfin cores
328K bytes of on-chip memory
(see Memory Architecture on Page 4)
Each Blackfin core includes
Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs,
40-bit shifter
RISC-like register and instruction model for ease of pro­
gramming and compiler-friendly support
Advanced debug, trace, and performance monitoring
Wide range of operating voltages, (see Operating Conditions
on Page 20)
256-ball CSP_BGA (2 sizes) and 297-ball PBGA
package options
PERIPHERALS
2 internal memory-to-memory DMAs and 1 internal memory
DMA controller
12 general-purpose 32-bit timers/counters with PWM
capability
SPI-compatible port
UART with support for IrDA
Dual watchdog timers
Dual 32-bit core timers
48 programmable flags (GPIO)
On-chip phase-locked loop capable of 0.5× to 64× frequency
multiplication
2 parallel input/output peripheral interface units supporting
ITU-R 656 video and glueless interface to analog front end
ADCs
2 dual channel, full duplex synchronous serial ports support­
ing eight stereo I2S channels
Dual 12-channel DMA controllers
(supporting 24 peripheral DMAs)
2 memory-to-memory DMAs
VOLTAGE
REGULATOR
IRQ CONTROL/
WATCHDOG
TIMER
B
L1
INSTRUCTION
MEMORY
JTAG TEST
EMULATION
IRQ CONTROL/
WATCHDOG
TIMER
B
L1
DATA
MEMORY
L1
INSTRUCTION
MEMORY
UART
IrDA
L1
DATA
MEMORY
SPI
L2 SRAM
128K BYTES
SPORT0
IMDMA
CONTROLLER
CORE SYSTEM/BUS INTERFACE
SPORT1
GPIO
EAB
DMA
CONTROLLER1
32
TIMERS
DMA
CONTROLLER2
DEB
DAB
BOOT ROM
32
PAB
16
16
DAB
EXTERNAL PORT
FLASH/SDRAM CONTROL
PPI0
PPI1
Figure 1. Functional Block Diagram
Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.
Rev. E
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However, no responsibility is assumed by Analog Devices for its use, nor for any
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Specifications subject to change without notice. No license is granted by implication
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Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2009 Analog Devices, Inc. All rights reserved.
ADSP-BF561
TABLE OF CONTENTS
Features ................................................................. 1
Designing an Emulator-Compatible Processor Board ... 16
Peripherals ............................................................. 1
Related Documents .............................................. 16
Table of Contents ..................................................... 2
Pin Descriptions .................................................... 17
Revision History ...................................................... 2
Specifications ........................................................ 20
General Description ................................................. 3
Operating Conditions ........................................... 20
Portable Low Power Architecture ............................. 3
Electrical Characteristics ....................................... 21
Blackfin Processor Core .......................................... 3
Absolute Maximum Ratings ................................... 22
Memory Architecture ............................................ 4
Package Information ............................................ 22
DMA Controllers .................................................. 8
ESD Sensitivity ................................................... 22
Watchdog Timer .................................................. 8
Timing Specifications ........................................... 23
Timers ............................................................... 9
Output Drive Currents ......................................... 41
Serial Ports (SPORTs) ............................................ 9
Power Dissipation ............................................... 42
Serial Peripheral Interface (SPI) Port ......................... 9
Test Conditions .................................................. 42
UART Port .......................................................... 9
Environmental Conditions .................................... 44
Programmable Flags (PFx) .................................... 10
256-Ball CSP_BGA (17 mm) Ball Assignment ............... 46
Parallel Peripheral Interface ................................... 10
256-Ball CSP_BGA (12 mm) Ball Assignment ............... 51
Dynamic Power Management ................................ 11
297-Ball PBGA Ball Assignment ................................. 56
Voltage Regulation .............................................. 12
Outline Dimensions ................................................ 61
Clock Signals ..................................................... 13
Surface-Mount Design .......................................... 63
Booting Modes ................................................... 14
Automotive Products .............................................. 63
Instruction Set Description ................................... 14
Ordering Guide ..................................................... 63
Development Tools ............................................. 15
REVISION HISTORY
9/09—Rev. D to Rev. E
Correct all outstanding document errata.
Revised Figure 5 ..................................................................... 13
Added 533 MHz operation Table 10 .................................. 20
Removed reference to 1.8 V operation Table 12 ............... 21
Added Table 17 and Figure 9 Power-Up Reset Timing .... 23
Removed references to TJ from tSCLK parameter
Table 20 ................................................................................... 26
Added new SPORT timing parameters and diagram
Table 23 ................................................................................... 32
Figure 21 ................................................................................. 33
Rev. E |
Page 2 of 64 |
September 2009
ADSP-BF561
GENERAL DESCRIPTION
The ADSP-BF561 processor is a high performance member of
the Blackfin® family of products targeting a variety of multime­
dia, industrial, and telecommunications applications. At the
heart of this device are two independent Analog Devices
Blackfin processors. These Blackfin processors combine a dualMAC state-of-the-art signal processing engine, the advantage of
a clean, orthogonal RISC-like microprocessor instruction set,
and single instruction, multiple data (SIMD) multimedia capa­
bilities in a single instruction set architecture.
The ADSP-BF561 processor has 328K bytes of on-chip memory.
Each Blackfin core includes:
The powerful 40-bit shifter has extensive capabilities for per­
forming shifting, rotating, normalization, extraction, and
depositing of data. The data for the computational units is
found in a multiported register file of sixteen 16-bit entries or
eight 32-bit entries.
A powerful program sequencer controls the flow of instruction
execution, including instruction alignment and decoding. The
sequencer supports conditional jumps and subroutine calls, as
well as zero overhead looping. A loop buffer stores instructions
locally, eliminating instruction memory accesses for tight
looped code.
Two data address generators (DAGs) provide addresses for
simultaneous dual operand fetches from memory. The DAGs
share a register file containing four sets of 32-bit Index, Modify,
Length, and Base registers. Eight additional 32-bit registers
provide pointers for general indexing of variables and stack
locations.
• 16K bytes of instruction SRAM/cache
• 16K bytes of instruction SRAM
• 32K bytes of data SRAM/cache
• 32K bytes of data SRAM
• 4K bytes of scratchpad SRAM
Additional on-chip memory peripherals include:
• 128K bytes of low latency on-chip L2 SRAM
• Four-channel internal memory DMA controller
• External memory controller with glueless support for
SDRAM, mobile SDRAM, SRAM, and flash.
PORTABLE LOW POWER ARCHITECTURE
Blackfin processors provide world-class power management
and performance. Blackfin processors are designed in a low
power and low voltage design methodology and feature
dynamic power management, the ability to vary both the voltage
and frequency of operation to significantly lower overall power
consumption. Varying the voltage and frequency can result in a
substantial reduction in power consumption, compared with
just varying the frequency of operation. This translates into
longer battery life for portable appliances.
BLACKFIN PROCESSOR CORE
As shown in Figure 2, each Blackfin core contains two multi­
plier/accumulators (MACs), two 40-bit ALUs, four video ALUs,
and a single shifter. The computational units process 8-bit,
16-bit, or 32-bit data from the register file.
Each MAC performs a 16-bit by 16-bit multiply in every cycle,
with accumulation to a 40-bit result, providing eight bits of
extended precision. The ALUs perform a standard set of arith­
metic and logical operations. With two ALUs capable of
operating on 16-bit or 32-bit data, the flexibility of the computa­
tion units covers the signal processing requirements of a varied
set of application needs.
Each of the two 32-bit input registers can be regarded as two
16-bit halves, so each ALU can accomplish very flexible single
16-bit arithmetic operations. By viewing the registers as pairs of
16-bit operands, dual 16-bit or single 32-bit operations can be
accomplished in a single cycle. By further taking advantage of
the second ALU, quad 16-bit operations can be accomplished
simply, accelerating the per cycle throughput.
Rev. E |
Page 3 of 64 |
Blackfin processors support a modified Harvard architecture in
combination with a hierarchical memory structure. Level 1 (L1)
memories are those that typically operate at the full processor
speed with little or no latency. Level 2 (L2) memories are other
memories, on-chip or off-chip, that may take multiple processor
cycles to access. At the L1 level, the instruction memory holds
instructions only. The two data memories hold data, and a dedi­
cated scratchpad data memory stores stack and local variable
information. At the L2 level, there is a single unified memory
space, holding both instructions and data.
In addition, half of L1 instruction memory and half of L1 data
memory may be configured as either Static RAMs (SRAMs) or
caches. The Memory Management Unit (MMU) provides mem­
ory protection for individual tasks that may be operating on the
core and may protect system registers from unintended access.
The architecture provides three modes of operation: user mode,
supervisor mode, and emulation mode. User mode has
restricted access to certain system resources, thus providing a
protected software environment, while supervisor mode has
unrestricted access to the system and core resources.
The Blackfin instruction set has been optimized so that 16-bit
op-codes represent the most frequently used instructions,
resulting in excellent compiled code density. Complex DSP
instructions are encoded into 32-bit op-codes, representing fully
featured multifunction instructions. Blackfin processors sup­
port a limited multi-issue capability, where a 32-bit instruction
can be issued in parallel with two 16-bit instructions, allowing
the programmer to use many of the core resources in a single
instruction cycle.
The Blackfin assembly language uses an algebraic syntax for
ease of coding and readability. The architecture has been opti­
mized for use in conjunction with the VisualDSP C/C++
compiler, resulting in fast and efficient software
implementations.
September 2009
ADSP-BF561
ADDRESS ARITHMETIC UNIT
L3
B3
M3
I2
L2
B2
M2
I1
L1
B1
M1
I0
L0
B0
M0
SP
FP
P5
DAG1
P4
P3
DAG0
P2
32
32
P1
P0
TO MEMORY
DA1
DA0
I3
32
PREG
32
RAB
SD
LD1
LD0
32
32
32
ASTAT
32
32
SEQUENCER
R7.H
R6.H
R7.L
R6.L
R5.H
R5.L
R4.H
R4.L
R3.H
R3.L
R2.H
R2.L
R1.H
R1.L
R0.H
R0.L
16
ALIGN
16
8
8
8
8
DECODE
BARREL
SHIFTER
40
40
A0
32
40
40
A1
LOOP BUFFER
CONTROL
UNIT
32
DATA ARITHMETIC UNIT
Figure 2. Blackfin Processor Core
MEMORY ARCHITECTURE
Internal (On-Chip) Memory
The ADSP-BF561 views memory as a single unified 4G byte
address space, using 32-bit addresses. All resources including
internal memory, external memory, and I/O control registers
occupy separate sections of this common address space. The
memory portions of this address space are arranged in a hierar­
chical structure to provide a good cost/performance balance of
some very fast, low latency memory as cache or SRAM very
close to the processor, and larger, lower cost and performance
memory systems farther away from the processor. The
ADSP-BF561 memory map is shown in Figure 3.
The ADSP-BF561 has four blocks of on-chip memory providing
high bandwidth access to the core.
The L1 memory system in each core is the highest performance
memory available to each Blackfin core. The L2 memory pro­
vides additional capacity with lower performance. Lastly, the
off-chip memory system, accessed through the External Bus
Interface Unit (EBIU), provides expansion with SDRAM, flash
memory, and SRAM, optionally accessing more than
768M bytes of physical memory. The memory DMA controllers
provide high bandwidth data movement capability. They can
perform block transfers of code or data between the internal
L1/L2 memories and the external memory spaces.
Rev. E |
Page 4 of 64 |
The first is the L1 instruction memory of each Blackfin core
consisting of 16K bytes of four-way set-associative cache mem­
ory and 16K bytes of SRAM. The cache memory may also be
configured as an SRAM. This memory is accessed at full proces­
sor speed. When configured as SRAM, each of the two 16K
banks of memory is broken into 4K sub-banks which can be
independently accessed by the processor and DMA.
The second on-chip memory block is the L1 data memory of
each Blackfin core which consists of four banks of 16K bytes
each. Two of the L1 data memory banks can be configured as
one way of a two-way set-associative cache or as an SRAM. The
other two banks are configured as SRAM. All banks are accessed
at full processor speed. When configured as SRAM, each of the
four 16K banks of memory is broken into 4K sub-banks which
can be independently accessed by the processor and DMA.
The third memory block associated with each core is a 4K byte
scratchpad SRAM which runs at the same speed as the L1 mem­
ories, but is only accessible as data SRAM (it cannot be
configured as cache memory and is not accessible via DMA).
September 2009
ADSP-BF561
CORE A MEMORY MAP
CORE B MEMORY MAP
0xFFFF FFFF
0xFFE0 0000
CORE MMR REGISTERS
0xFFC0 0000
0xFFB0 1000
0xFFB0 0000
0xFFA1 4000
0xFFA1 0000
0xFFA0 4000
0xFFA0 0000
0xFF90 8000
0xFF90 4000
0xFF90 0000
0xFF80 8000
0xFF80 4000
0xFF80 0000
CORE MMR REGISTERS
SYSTEM MMR REGISTERS
RESERVED
L1 SCRATCHPAD SRAM (4K)
RESERVED
L1 INSTRUCTION SRAM/CACHE (16K)
RESERVED
L1 INSTRUCTION SRAM (16K)
RESERVED
RESERVED
L1 DATA BANK B SRAM/CACHE (16K)
L1 DATA BANK B SRAM (16K)
RESERVED
L1 DATA BANK A SRAM/CACHE (16K)
L1 DATA BANK A SRAM (16K)
0xFF80 0000
RESERVED
0xFF70 1000
L1 SCRATCHPAD SRAM (4K)
RESERVED
L1 INSTRUCTION SRAM/CACHE (16K)
RESERVED
RESERVED
L1 DATA BANK B SRAM/CACHE (16K)
L1 DATA BANK B SRAM (16K)
RESERVED
L1 DATA BANK A SRAM (16K)
0x2000 0000
0xFF40 0000
BOOT ROM
RESERVED
0x3000 0000
Top of last SDRAM page
0xFF40 4000
RESERVED
0xEF00 0000
0x2400 0000
0xFF50 0000
L2 SRAM (128K)
0xEF00 4000
0x2800 0000
0xFF50 4000
RESERVED
0xFEB2 0000
0x2C00 0000
0xFF60 0000
0xFF50 8000
0xFF40 8000
L1 DATA BANK A SRAM/CACHE (16K)
0xFEB0 0000
0xFF61 0000
0xFF60 4000
L1 INSTRUCTION SRAM (16K)
RESERVED
INTERNAL MEMORY
0xFF70 0000
0xFF61 4000
ASYNC MEMORY BANK 3
ASYNC MEMORY BANK 2
ASYNC MEMORY BANK 1
ASYNC MEMORY BANK 0
RESERVED
EXTERNAL MEMORY
SDRAM BANK 3
SDRAM BANK 2
SDRAM BANK 1
0x0000 0000
SDRAM BANK 0
Figure 3. Memory Map
The fourth on-chip memory system is the L2 SRAM memory
array which provides 128K bytes of high speed SRAM operating
at one half the frequency of the core, and slightly longer latency
than the L1 memory banks. The L2 memory is a unified instruc­
tion and data memory and can hold any mixture of code and
data required by the system design. The Blackfin cores share a
dedicated low latency 64-bit wide data path port into the L2
SRAM memory.
Each Blackfin core processor has its own set of core Memory
Mapped Registers (MMRs) but share the same system MMR
registers and 128K bytes L2 SRAM memory.
Rev. E |
Page 5 of 64 |
External (Off-Chip) Memory
The ADSP-BF561 external memory is accessed via the External
Bus Interface Unit (EBIU). This interface provides a glueless
connection to up to four banks of synchronous DRAM
(SDRAM) as well as up to four banks of asynchronous memory
devices, including flash, EPROM, ROM, SRAM, and memory
mapped I/O devices.
The PC133-compliant SDRAM controller can be programmed
to interface to up to four banks of SDRAM, with each bank con­
taining between 16M bytes and 128M bytes providing access to
up to 512M bytes of SDRAM. Each bank is independently pro­
grammable and is contiguous with adjacent banks regardless of
the sizes of the different banks or their placement. This allows
September 2009
ADSP-BF561
flexible configuration and upgradability of system memory
while allowing the core to view all SDRAM as a single, contigu­
ous, physical address space.
• Interrupts – Events that occur asynchronously to program
flow. They are caused by timers, peripherals, input pins,
and an explicit software instruction.
The asynchronous memory controller can also be programmed
to control up to four banks of devices with very flexible timing
parameters for a wide variety of devices. Each bank occupies a
64M byte segment regardless of the size of the devices used so
that these banks will only be contiguous if fully populated with
64M bytes of memory.
Each event has an associated register to hold the return address
and an associated “return from event” instruction. When an
event is triggered, the state of the processor is saved on the
supervisor stack.
I/O Memory Space
Blackfin processors do not define a separate I/O space. All
resources are mapped through the flat 32-bit address space. Onchip I/O devices have their control registers mapped into mem­
ory mapped registers (MMRs) at addresses near the top of the
4G byte address space. These are separated into two smaller
blocks, one which contains the control MMRs for all core func­
tions, and the other which contains the registers needed for
setup and control of the on-chip peripherals outside of the core.
The core MMRs are accessible only by the core and only in
supervisor mode and appear as reserved space by on-chip
peripherals. The system MMRs are accessible by the core in
supervisor mode and can be mapped as either visible or reserved
to other devices, depending on the system protection
model desired.
The ADSP-BF561 event controller consists of two stages: the
Core Event Controller (CEC) and the System Interrupt Control­
ler (SIC). The Core Event Controller works with the System
Interrupt Controller to prioritize and control all system events.
Conceptually, interrupts from the peripherals enter into the
SIC, and are then routed directly into the general-purpose
interrupts of the CEC.
Core Event Controller (CEC)
The CEC supports nine general-purpose interrupts (IVG15–7),
in addition to the dedicated interrupt and exception events. Of
these general-purpose interrupts, the two lowest priority inter­
rupts (IVG15–14) are recommended to be reserved for software
interrupt handlers, leaving seven prioritized interrupt inputs to
support the peripherals of the ADSP-BF561. Table 1 describes
the inputs to the CEC, identifies their names in the Event Vector
Table (EVT), and lists their priorities.
Booting
Table 1. Core Event Controller (CEC)
The ADSP-BF561 contains a small boot kernel, which config­
ures the appropriate peripheral for booting. If the ADSP-BF561
is configured to boot from boot ROM memory space, the pro­
cessor starts executing from the on-chip boot ROM.
Priority
(0 is Highest)
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Event Handling
The event controller on the ADSP-BF561 handles all asynchro­
nous and synchronous events to the processor. The
ADSP-BF561 provides event handling that supports both nest­
ing and prioritization. Nesting allows multiple event service
routines to be active simultaneously. Prioritization ensures that
servicing of a higher priority event takes precedence over servic­
ing of a lower priority event. The controller provides support for
five different types of events:
• Emulation – An emulation event causes the processor to
enter emulation mode, allowing command and control of
the processor via the JTAG interface.
• Reset – This event resets the processor.
• Nonmaskable Interrupt (NMI) – The NMI event can be
generated by the software watchdog timer or by the NMI
input signal to the processor. The NMI event is frequently
used as a power-down indicator to initiate an orderly shut­
down of the system.
• Exceptions – Events that occur synchronously to program
flow, i.e., the exception will be taken before the instruction
is allowed to complete. Conditions such as data alignment
violations or undefined instructions cause exceptions.
Rev. E |
Page 6 of 64 |
Event Class
Emulation/Test Control
Reset
Nonmaskable Interrupt
Exceptions
Global Enable
Hardware Error
Core Timer
General Interrupt 7
General Interrupt 8
General Interrupt 9
General Interrupt 10
General Interrupt 11
General Interrupt 12
General Interrupt 13
General Interrupt 14
General Interrupt 15
EVT Entry
EMU
RST
NMI
EVX
IVHW
IVTMR
IVG7
IVG8
IVG9
IVG10
IVG11
IVG12
IVG13
IVG14
IVG15
System Interrupt Controller (SIC)
The System Interrupt Controller provides the mapping and
routing of events from the many peripheral interrupt sources to
the prioritized general-purpose interrupt inputs of the CEC.
Although the ADSP-BF561 provides a default mapping, the user
can alter the mappings and priorities of interrupt events by
September 2009
ADSP-BF561
writing the appropriate values into the Interrupt Assignment
Registers (SIC_IAR7–0). Table 2 describes the inputs into the
SIC and the default mappings into the CEC.
Table 2. System Interrupt Controller (SIC)
Peripheral Interrupt Event
PLL Wakeup
DMA1 Error (Generic)
DMA2 Error (Generic)
IMDMA Error
PPI0 Error
PPI1 Error
SPORT0 Error
SPORT1 Error
SPI Error
UART Error
Reserved
DMA1 Channel 0 Interrupt (PPI0)
DMA1 Channel 1 Interrupt (PPI1)
DMA1 Channel 2 Interrupt
DMA1 Channel 3 Interrupt
DMA1 Channel 4 Interrupt
DMA1 Channel 5 Interrupt
DMA1 Channel 6 Interrupt
DMA1 Channel 7 Interrupt
DMA1 Channel 8 Interrupt
DMA1 Channel 9 Interrupt
DMA1 Channel 10 Interrupt
DMA1 Channel 11 Interrupt
DMA2 Channel 0 Interrupt (SPORT0 Rx)
DMA2 Channel 1 Interrupt (SPORT0 Tx)
DMA2 Channel 2 Interrupt (SPORT1 Rx)
DMA2 Channel 3 Interrupt (SPORT1 Tx)
DMA2 Channel 4 Interrupt (SPI)
DMA2 Channel 5 Interrupt (UART Rx)
DMA2 Channel 6 Interrupt (UART Tx)
DMA2 Channel 7 Interrupt
DMA2 Channel 8 Interrupt
DMA2 Channel 9 Interrupt
DMA2 Channel 10 Interrupt
DMA2 Channel 11 Interrupt
Timer0 Interrupt
Timer1 Interrupt
Timer2 Interrupt
Timer3 Interrupt
Timer4 Interrupt
Timer5 Interrupt
Timer6 Interrupt
Default
Mapping
IVG7
IVG7
IVG7
IVG7
IVG7
IVG7
IVG7
IVG7
IVG7
IVG7
IVG7
IVG8
IVG8
IVG8
IVG8
IVG8
IVG8
IVG8
IVG8
IVG8
IVG8
IVG8
IVG8
IVG9
IVG9
IVG9
IVG9
IVG9
IVG9
IVG9
IVG9
IVG9
IVG9
IVG9
IVG9
IVG10
IVG10
IVG10
IVG10
IVG10
IVG10
IVG10
Rev. E |
Page 7 of 64 |
Table 2. System Interrupt Controller (SIC) (Continued)
Peripheral Interrupt Event
Timer7 Interrupt
Timer8 Interrupt
Timer9 Interrupt
Timer10 Interrupt
Timer11 Interrupt
Programmable Flags 15–0 Interrupt A
Programmable Flags 15–0 Interrupt B
Programmable Flags 31–16 Interrupt A
Programmable Flags 31–16 Interrupt B
Programmable Flags 47–32 Interrupt A
Programmable Flags 47–32 Interrupt B
DMA1 Channel 12/13 Interrupt
(Memory DMA/Stream 0)
DMA1 Channel 14/15 Interrupt
(Memory DMA/Stream 1)
DMA2 Channel 12/13 Interrupt
(Memory DMA/Stream 0)
DMA2 Channel 14/15 Interrupt
(Memory DMA/Stream 1)
IMDMA Stream 0 Interrupt
IMDMA Stream 1 Interrupt
Watchdog Timer Interrupt
Reserved
Reserved
Supplemental Interrupt 0
Supplemental Interrupt 1
Default
Mapping
IVG10
IVG10
IVG10
IVG10
IVG10
IVG11
IVG11
IVG11
IVG11
IVG11
IVG11
IVG8
IVG8
IVG9
IVG9
IVG12
IVG12
IVG13
IVG7
IVG7
IVG7
IVG7
Event Control
The ADSP-BF561 provides the user with a very flexible mecha­
nism to control the processing of events. In the CEC, three
registers are used to coordinate and control events. Each of the
registers is 16 bits wide, while each bit represents a particular
event class.
• CEC Interrupt Latch Register (ILAT) – The ILAT register
indicates when events have been latched. The appropriate
bit is set when the processor has latched the event and
cleared when the event has been accepted into the system.
This register is updated automatically by the controller, but
may also be written to clear (cancel) latched events. This
register may be read while in supervisor mode and may
only be written while in supervisor mode when the corre­
sponding IMASK bit is cleared.
• CEC Interrupt Mask Register (IMASK) – The IMASK reg­
ister controls the masking and unmasking of individual
events. When a bit is set in the IMASK register, that event is
unmasked and will be processed by the CEC when asserted.
A cleared bit in the IMASK register masks the event,
thereby preventing the processor from servicing the event
September 2009
ADSP-BF561
even though the event may be latched in the ILAT register.
This register may be read from or written to while in
supervisor mode.
Note that general-purpose interrupts can be globally
enabled and disabled with the STI and CLI instructions,
respectively.
• CEC Interrupt Pending Register (IPEND) – The IPEND
register keeps track of all nested events. A set bit in the
IPEND register indicates the event is currently active or
nested at some level. This register is updated automatically
by the controller but may be read while in supervisor mode.
The SIC allows further control of event processing by providing
six 32-bit interrupt control and status registers. Each register
contains a bit corresponding to each of the peripheral interrupt
events shown in Table 2.
• SIC Interrupt Mask Registers (SIC_IMASKx) – These reg­
isters control the masking and unmasking of each
peripheral interrupt event. When a bit is set in these regis­
ters, that peripheral event is unmasked and will be
processed by the system when asserted. A cleared bit in
these registers masks the peripheral event, thereby prevent­
ing the processor from servicing the event.
• SIC Interrupt Status Registers (SIC_ISRx) – As multiple
peripherals can be mapped to a single event, these registers
allow the software to determine which peripheral event
source triggered the interrupt. A set bit indicates the
peripheral is asserting the interrupt; a cleared bit indicates
the peripheral is not asserting the event.
• SIC Interrupt Wakeup Enable Registers (SIC_IWRx) – By
enabling the corresponding bit in these registers, each
peripheral can be configured to wake up the processor,
should the processor be in a powered-down mode when
the event is generated.
Because multiple interrupt sources can map to a single generalpurpose interrupt, multiple pulse assertions can occur simulta­
neously, before or during interrupt processing for an interrupt
event already detected on this interrupt input. The IPEND reg­
ister contents are monitored by the SIC as the interrupt
acknowledgement.
The appropriate ILAT register bit is set when an interrupt rising
edge is detected (detection requires two core clock cycles). The
bit is cleared when the respective IPEND register bit is set. The
IPEND bit indicates that the event has entered into the proces­
sor pipeline. At this point the CEC will recognize and queue the
next rising edge event on the corresponding event input. The
minimum latency from the rising edge transition of the generalpurpose interrupt to the IPEND output asserted is three core
clock cycles; however, the latency can be much higher, depend­
ing on the activity within and the mode of the processor.
DMA CONTROLLERS
The ADSP-BF561 has two independent DMA controllers that
support automated data transfers with minimal overhead for
the DSP cores. DMA transfers can occur between the
ADSP-BF561 internal memories and any of its DMA-capable
Rev. E |
Page 8 of 64 |
peripherals. Additionally, DMA transfers can be accomplished
between any of the DMA-capable peripherals and external
devices connected to the external memory interfaces, including
the SDRAM controller and the asynchronous memory
controller. DMA-capable peripherals include the SPORTs, SPI
port, UART, and PPIs. Each individual DMA-capable periph­
eral has at least one dedicated DMA channel.
The ADSP-BF561 DMA controllers support both 1-dimen­
sional (1-D) and 2-dimensional (2-D) DMA transfers. DMA
transfer initialization can be implemented from registers or
from sets of parameters called descriptor blocks.
The 2-D DMA capability supports arbitrary row and column
sizes up to 64K elements by 64K elements, and arbitrary row
and column step sizes up to ± 32K elements. Furthermore, the
column step size can be less than the row step size, allowing
implementation of interleaved data streams. This feature is
especially useful in video applications where data can be deinterleaved on the fly.
Examples of DMA types supported by the ADSP-BF561 DMA
controllers include:
• A single linear buffer that stops upon completion.
• A circular autorefreshing buffer that interrupts on each full
or fractionally full buffer.
• 1-D or 2-D DMA using a linked list of descriptors.
• 2-D DMA using an array of descriptors, specifying only the
base DMA address within a common page.
In addition to the dedicated peripheral DMA channels, each
DMA Controller has four memory DMA channels provided for
transfers between the various memories of the ADSP-BF561
system. These enable transfers of blocks of data between any of
the memories—including external SDRAM, ROM, SRAM, and
flash memory—with minimal processor intervention. Memory
DMA transfers can be controlled by a very flexible descriptorbased methodology or by a standard register-based autobuffer
mechanism.
Further, the ADSP-BF561 has a four channel Internal Memory
DMA (IMDMA) Controller. The IMDMA Controller allows
data transfers between any of the internal L1 and L2 memories.
WATCHDOG TIMER
Each ADSP-BF561 core includes a 32-bit timer, which can be
used to implement a software watchdog function. A software
watchdog can improve system availability by forcing the proces­
sor to a known state, via generation of a hardware reset,
nonmaskable interrupt (NMI), or general-purpose interrupt, if
the timer expires before being reset by software. The program­
mer initializes the count value of the timer, enables the
appropriate interrupt, then enables the timer. Thereafter, the
software must reload the counter before it counts to zero from
the programmed value. This protects the system from remain­
ing in an unknown state where software, which would normally
reset the timer, has stopped running due to an external noise
condition or software error.
September 2009
ADSP-BF561
After a reset, software can determine if the watchdog was the
source of the hardware reset by interrogating a status bit in the
timer control register, which is set only upon a watchdog gener­
ated reset.
• DMA operations with single-cycle overhead – Each SPORT
can automatically receive and transmit multiple buffers of
memory data. The DSP can link or chain sequences of
DMA transfers between a SPORT and memory.
The timer is clocked by the system clock (SCLK) at a maximum
frequency of fSCLK.
• Interrupts – Each transmit and receive port generates an
interrupt upon completing the transfer of a data word or
after transferring an entire data buffer or buffers through
DMA.
TIMERS
There are 14 programmable timer units in the ADSP-BF561.
Each of the 12 general-purpose timer units can be indepen­
dently programmed as a Pulse Width Modulator (PWM),
internally or externally clocked timer, or pulse width counter.
The general-purpose timer units can be used in conjunction
with the UART to measure the width of the pulses in the data
stream to provide an autobaud detect function for a serial chan­
nel. The general-purpose timers can generate interrupts to the
processor core providing periodic events for synchronization,
either to the processor clock or to a count of external signals.
In addition to the 12 general-purpose programmable timers,
another timer is also provided for each core. These extra timers
are clocked by the internal processor clock (CCLK) and are typ­
ically used as a system tick clock for generation of operating
system periodic interrupts.
SERIAL PORTS (SPORTs)
The ADSP-BF561 incorporates two dual-channel synchronous
serial ports (SPORT0 and SPORT1) for serial and multiproces­
sor communications. The SPORTs support the following
features:
• I2S capable operation.
• Bidirectional operation – Each SPORT has two sets of inde­
pendent transmit and receive pins, enabling eight channels
of I2S stereo audio.
• Buffered (8-deep) transmit and receive ports – Each port
has a data register for transferring data words to and from
other DSP components and shift registers for shifting data
in and out of the data registers.
• Clocking – Each transmit and receive port can either use an
external serial clock or generate its own, in frequencies
ranging from (fSCLK/131,070) Hz to (fSCLK/2) Hz.
• Word length – Each SPORT supports serial data words
from 3 bits to 32 bits in length, transferred most significant
bit first or least significant bit first.
• Framing – Each transmit and receive port can run with or
without frame sync signals for each data word. Frame sync
signals can be generated internally or externally, active high
or low, and with either of two pulse widths and early or late
frame sync.
• Companding in hardware – Each SPORT can perform
A-law or μ-law companding according to ITU recommen­
dation G.711. Companding can be selected on the transmit
and/or receive channel of the SPORT without additional
latencies.
Rev. E |
Page 9 of 64 |
• Multichannel capability – Each SPORT supports 128 chan­
nels out of a 1,024-channel window and is compatible with
the H.100, H.110, MVIP-90, and HMVIP standards.
An additional 250 mV of SPORT input hysteresis can be
enabled by setting Bit 15 of the PLL_CTL register. When this bit
is set, all SPORT input pins have the increased hysteresis.
SERIAL PERIPHERAL INTERFACE (SPI) PORT
The ADSP-BF561 processor has an SPI-compatible port that
enables the processor to communicate with multiple SPI-com­
patible devices.
The SPI interface uses three pins for transferring data: two data
pins (master output-slave input, MOSI, and master input-slave
output, MISO) and a clock pin (serial clock, SCK). An SPI chip
select input pin (SPISS) lets other SPI devices select the proces­
sor, and seven SPI chip select output pins (SPISEL7–1) let the
processor select other SPI devices. The SPI select pins are recon­
figured programmable flag pins. Using these pins, the SPI port
provides a full-duplex, synchronous serial interface which sup­
ports both master/slave modes and multimaster environments.
The baud rate and clock phase/polarities for the SPI port are
programmable, and it has an integrated DMA controller, con­
figurable to support transmit or receive data streams. The SPI
DMA controller can only service unidirectional accesses at any
given time.
The SPI port clock rate is calculated as:
f SCLK
SPI Clock Rate = ----------------------------------2 × SPI_BAUD
Where the 16-bit SPI_BAUD register contains a value of 2 to
65,535.
During transfers, the SPI port simultaneously transmits and
receives by serially shifting data in and out on its two serial data
lines. The serial clock line synchronizes the shifting and sam­
pling of data on the two serial data lines.
UART PORT
The ADSP-BF561 processor provides a full-duplex universal
asynchronous receiver/transmitter (UART) port, which is fully
compatible with PC-standard UARTs. The UART port provides
a simplified UART interface to other peripherals or hosts, sup­
porting full-duplex, DMA-supported, asynchronous transfers of
serial data. The UART port includes support for 5 data bits to
8 data bits, 1 stop bit or 2 stop bits, and none, even, or odd par­
ity. The UART port supports two modes of operation:
September 2009
ADSP-BF561
• PIO (programmed I/O) – The processor sends or receives
data by writing or reading I/O-mapped UART registers.
The data is double-buffered on both transmit and receive.
• DMA (direct memory access) – The DMA controller trans­
fers both transmit and receive data. This reduces the
number and frequency of interrupts required to transfer
data to and from memory. The UART has two dedicated
DMA channels, one for transmit and one for receive. These
DMA channels have lower default priority than most DMA
channels because of their relatively low service rates.
The baud rate, serial data format, error code generation and
status, and interrupts for the UART port are programmable.
The UART programmable features include:
• Supporting bit rates ranging from (fSCLK/1,048,576) bits per
second to (fSCLK/16) bits per second.
• Supporting data formats from seven bits to 12 bits per
frame.
• Flag interrupt sensitivity registers – These registers specify
whether individual PFx pins are level- or edge-sensitive
and specify, if edge-sensitive, whether just the rising edge
or both the rising and falling edges of the signal are signifi­
cant. One register selects the type of sensitivity, and one
register selects which edges are significant for edge
sensitivity.
PARALLEL PERIPHERAL INTERFACE
• Both transmit and receive operations can be configured to
generate maskable interrupts to the processor.
The UART port’s clock rate is calculated as:
f SCLK
UART Clock Rate = ---------------------------------------------16 × UART_Divisor
Where the 16-bit UART_Divisor comes from the UART_DLH
register (most significant 8 bits) and UART_DLL register (least
significant 8 bits).
In conjunction with the general-purpose timer functions,
autobaud detection is supported.
The capabilities of the UART are further extended with support
for the Infrared Data Association (IrDA®) serial infrared physi­
cal layer link specification (SIR) protocol.
PROGRAMMABLE FLAGS (PFx)
The ADSP-BF561 has 48 bidirectional, general-purpose I/O,
programmable flag (PF47–0) pins. Some programmable flag
pins are used by peripherals (see Pin Descriptions on Page 17).
When not used as a peripheral pin, each programmable flag can
be individually controlled by manipulation of the flag control,
status, and interrupt registers as follows:
• Flag direction control register – Specifies the direction of
each individual PFx pin as input or output.
• Flag control and status registers – Rather than forcing the
software to use a read-modify-write process to control the
setting of individual flags, the ADSP-BF561 employs a
“write one to set” and “write one to clear” mechanism that
allows any combination of individual flags to be set or
cleared in a single instruction, without affecting the level of
any other flags. Two control registers are provided, one
register is written-to in order to set flag values, while
another register is written-to in order to clear flag values.
Reading the flag status register allows software to interro­
gate the sense of the flags.
Rev. E |
• Flag interrupt mask registers – These registers allow each
individual PFx pin to function as an interrupt to the pro­
cessor. Similar to the flag control registers that are used to
set and clear individual flag values, one flag interrupt mask
register sets bits to enable an interrupt function, and the
other flag interrupt mask register clears bits to disable an
interrupt function. PFx pins defined as inputs can be con­
figured to generate hardware interrupts, while output PFx
pins can be configured to generate software interrupts.
Page 10 of 64 |
The ADSP-BF561 processor provides two parallel peripheral
interfaces (PPI0, PPI1) that can connect directly to parallel A/D
and D/A converters, video encoders and decoders, and other
general-purpose peripherals. The PPI consists of a dedicated
input clock pin, up to 3 frame synchronization pins, and up to
16 data pins. The input clock supports parallel data rates at up to
fSCLK/2 MHz, and the synchronization signals can be configured
as either inputs or outputs.
The PPI supports a variety of general-purpose and ITU-R 656
modes of operation. In general-purpose mode, the PPI provides
half-duplex, bi-directional data transfer with up to 16 bits of
data. Up to 3 frame synchronization signals are also provided.
In ITU-R 656 mode, the PPI provides half-duplex, bi-direc­
tional transfer of 8- or 10-bit video data. Additionally, on-chip
decode of embedded start-of-line (SOL) and start-of-field (SOF)
preamble packets is supported.
General-Purpose Mode Descriptions
The general-purpose modes of the PPI are intended to suit a
wide variety of data capture and transmission applications.
Three distinct submodes are supported:
• Input mode – frame syncs and data are inputs into the PPI.
• Frame capture mode – frame syncs are outputs from the
PPI, but data are inputs.
• Output mode – frame syncs and data are outputs from the
PPI.
Input Mode
Input mode is intended for ADC applications, as well as video
communication with hardware signaling. In its simplest form,
PPI_FS1 is an external frame sync input that controls when to
read data. The PPI_DELAY MMR allows for a delay (in
PPI_CLK cycles) between reception of this frame sync and the
initiation of data reads. The number of input data samples is
user programmable and defined by the contents of the
PPI_COUNT register. The PPI supports 8-bit, and 10-bit
through 16-bit data, and are programmable in the
PPI_CONTROL register.
September 2009
ADSP-BF561
Frame Capture Mode
Table 3. Power Settings
Frame capture mode allows the video source(s) to act as a slave
(e.g., for frame capture). The ADSP-BF561 processors control
when to read from the video source(s). PPI_FS1 is an HSYNC
output and PPI_FS2 is a VSYNC output.
Output Mode
Output mode is used for transmitting video or other data with
up to three output frame syncs. Typically, a single frame sync is
appropriate for data converter applications, whereas two or
three frame syncs could be used for sending video with hard­
ware signaling.
PLL
Mode/State PLL
Bypassed
Full-On
Enabled No
Active
Enabled/ Yes
Disabled
Sleep
Enabled –
Deep Sleep Disabled –
Hibernate
Disabled –
Core
Clock
(CCLK)
Enabled
Enabled
System
Clock
(SCLK)
Enabled
Enabled
Core
Power
On
On
Disabled Enabled On
Disabled Disabled On
Disabled Disabled Off
Full-On Operating Mode—Maximum Performance
ITU-R 656 Mode Descriptions
The ITU-R 656 modes of the PPI are intended to suit a wide
variety of video capture, processing, and transmission applica­
tions. Three distinct submodes are supported:
• Active video only mode
• Vertical blanking only mode
In the full-on mode, the PLL is enabled and is not bypassed,
providing capability for maximum operational frequency. This
is the default execution state in which maximum performance
can be achieved. The processor cores and all enabled peripherals
run at full speed.
Active Operating Mode—Moderate Power Savings
• Entire field mode
Active Video Only Mode
Active video only mode is used when only the active video por­
tion of a field is of interest and not any of the blanking intervals.
The PPI does not read in any data between the end of active
video (EAV) and start of active video (SAV) preamble symbols,
or any data present during the vertical blanking intervals. In this
mode, the control byte sequences are not stored to memory;
they are filtered by the PPI. After synchronizing to the start of
Field 1, the PPI ignores incoming samples until it sees an SAV
code. The user specifies the number of active video lines per
frame (in the PPI_COUNT register).
Vertical Blanking Interval Mode
In this mode, the PPI only transfers vertical blanking interval
(VBI) data.
Entire Field Mode
In the active mode, the PLL is enabled but bypassed. Because the
PLL is bypassed, the processor’s core clock (CCLK) and system
clock (SCLK) run at the input clock (CLKIN) frequency. In this
mode, the CLKIN to CCLK multiplier ratio can be changed,
although the changes are not realized until the full-on mode is
entered. DMA access is available to appropriately configured L1
and L2 memories.
In the active mode, it is possible to disable the PLL through the
PLL control register (PLL_CTL). If disabled, the PLL must be
re-enabled before transitioning to the full-on or sleep modes.
Sleep Operating Mode—High Dynamic Power Savings
The sleep mode reduces power dissipation by disabling the
clock to the processor core (CCLK). The PLL and system clock
(SCLK), however, continue to operate in this mode. Typically an
external event will wake up the processor. When in the sleep
mode, assertion of wakeup will cause the processor to sense the
value of the BYPASS bit in the PLL control register (PLL_CTL).
In this mode, the entire incoming bit stream is read in through
the PPI. This includes active video, control preamble sequences,
and ancillary data that may be embedded in horizontal and ver­
tical blanking intervals. Data transfer starts immediately after
synchronization to Field 1.
When in the sleep mode, system DMA access is only available to
external memory, not to L1 or on-chip L2 memory.
DYNAMIC POWER MANAGEMENT
The deep sleep mode maximizes power savings by disabling the
clocks to the processor cores (CCLK) and to all synchronous
peripherals (SCLK). Asynchronous peripherals will not be able
to access internal resources or external memory. This powereddown mode can only be exited by assertion of the reset pin
(RESET). If BYPASS is disabled, the processor will transition to
the full-on mode. If BYPASS is enabled, the processor will tran­
sition to the active mode.
The ADSP-BF561 provides four power management modes and
one power management state, each with a different perfor­
mance/power profile. In addition, dynamic power management
provides the control functions to dynamically alter the proces­
sor core supply voltage, further reducing power dissipation.
Control of clocking to each of the ADSP-BF561 peripherals also
reduces power consumption. See Table 3 for a summary of the
power settings for each mode.
Deep Sleep Operating Mode—Maximum Dynamic Power
Savings
Hibernate State—Maximum Static Power Savings
The hibernate state maximizes static power savings by disabling
the voltage and clocks to the processor core (CCLK) and to all
the synchronous peripherals (SCLK). The internal voltage
Rev. E |
Page 11 of 64 |
September 2009
ADSP-BF561
regulator for the processor can be shut off by writing b#00 to the
FREQ bits of the VR_CTL register. This disables both CCLK
and SCLK. Furthermore, it sets the internal power supply volt­
age (VDDINT) to 0 V to provide the lowest static power dissipation.
Any critical information stored internally (memory contents,
register contents, etc.) must be written to a nonvolatile storage
device prior to removing power if the processor state is to be
preserved. Since VDDEXT is still supplied in this mode, all of the
external pins three-state, unless otherwise specified. This allows
other devices that may be connected to the processor to have
power still applied without drawing unwanted current. The
internal supply regulator can be woken up by asserting the
RESET pin.
Power Savings
As shown in Table 4, the ADSP-BF561 supports two different
power domains. The use of multiple power domains maximizes
flexibility, while maintaining compliance with industry stan­
dards and conventions. By isolating the internal logic of the
ADSP-BF561 into its own power domain, separate from the I/O,
the processor can take advantage of Dynamic Power Manage­
ment, without affecting the I/O devices. There are no
sequencing requirements for the various power domains.
Table 4. ADSP-BF561 Power Domains
Power Domain
All internal logic
I/O
VDD Range
VDDINT
VDDEXT
The power dissipated by a processor is largely a function of the
clock frequency of the processor and the square of the operating
voltage. For example, reducing the clock frequency by 25%
results in a 25% reduction in dynamic power dissipation, while
reducing the voltage by 25% reduces dynamic power dissipation
by more than 40%. Further, these power savings are additive, in
that if the clock frequency and supply voltage are both reduced,
the power savings can be dramatic.
The dynamic power management feature of the ADSP-BF561
allows both the processor’s input voltage (VDDINT) and clock frequency (fCCLK) to be dynamically controlled.
tNOM is the duration running at fCCLKNOM
tRED is the duration running at fCCLKRED
The percent power savings is calculated as:
% power savings = (1 – power savings factor) × 100%
VOLTAGE REGULATION
The ADSP-BF561 processor provides an on-chip voltage regula­
tor that can generate appropriate VDDINT voltage levels from the
VDDEXT supply. See Operating Conditions on Page 20 for regula­
tor tolerances and acceptable VDDEXT ranges for specific models.
Figure 4 shows the typical external components required to
complete the power management system. The regulator con­
trols the internal logic voltage levels and is programmable with
the voltage regulator control register (VR_CTL) in increments
of 50 mV. To reduce standby power consumption, the internal
voltage regulator can be programmed to remove power to the
processor core while keeping I/O power (VDDEXT) supplied. While
in the hibernate state, VDDEXT can still be applied, thus eliminating
the need for external buffers. The voltage regulator can be acti­
vated from this power-down state by asserting RESET, which
will then initiate a boot sequence. The regulator can also be dis­
abled and bypassed at the user’s discretion.
The internal voltage regulation feature is not available on any of
the 600 MHz speed grade models or automotive grade models.
External voltage regulation is required to ensure correct opera­
tion of these parts at 600 MHz.
VDDEXT
(LOW-INDUCTANCE)
+
10μH
100nF
+
+
VDDINT
100μF
FDS9431A
10μF
LOW ESR
100μF
ZHCS1000
VROUT
SHORT AND LOWINDUCTANCE WIRE
NOTE: DESIGNER SHOULD MINIMIZE
TRACE LENGTH TO FDS9431A.
power savings factor
VDDEXT
100μF
The savings in power dissipation can be modeled using the
power savings factor and % power savings calculations.
The power savings factor is calculated as:
SET OF DECOUPLING
CAPACITORS
f CCLKRED  V DDINTRED  2  t RED 
- × -------------------------- × ----------= -------------------f CCLKNOM  V DDINTNOM  t NOM 
VROUT
GND
Figure 4. Voltage Regulator Circuit
where the variables in the equations are:
Voltage Regulator Layout Guidelines
fCCLKNOM is the nominal core clock frequency
Regulator external component placement, board routing, and
bypass capacitors all have a significant effect on noise injected
into the other analog circuits on-chip. The VROUT1–0 traces
and voltage regulator external components should be consid­
ered as noise sources when doing board layout and should not
be routed or placed near sensitive circuits or components on the
fCCLKRED is the reduced core clock frequency
VDDINTNOM is the nominal internal supply voltage
VDDINTRED is the reduced internal supply voltage
Rev. E |
Page 12 of 64 |
September 2009
ADSP-BF561
board. All internal and I/O power supplies should be well
bypassed with bypass capacitors placed as close to the
ADSP-BF561 processors as possible.
Blackfin
CLKOUT
TO PLL CIRCUITRY
For further details on the on-chip voltage regulator and related
board design guidelines, see the Switching Regulator Design
Considerations for ADSP-BF533 Blackfin Processors (EE-228)
applications note on the Analog Devices web site (www.ana­
log.com)—use site search on “EE-228”.
EN
700O
VDDEXT
CLOCK SIGNALS
XTAL
CLKIN
The ADSP-BF561 processor can be clocked by an external crys­
tal, a sine wave input, or a buffered, shaped clock derived from
an external clock oscillator.
18pF*
If an external clock is used, it should be a TTL compatible signal
and must not be halted, changed, or operated below the speci­
fied frequency during normal operation. This signal is
connected to the processor’s CLKIN pin. When an external
clock is used, the XTAL pin must be left unconnected.
Alternatively, because the ADSP-BF561 processor includes an
on-chip oscillator circuit, an external crystal may be used. For
fundamental frequency operation, use the circuit shown in
Figure 5. A parallel-resonant, fundamental frequency, micro­
processor-grade crystal is connected across the CLKIN and
XTAL pins. The on-chip resistance between CLKIN and the
XTAL pin is in the 500 kΩ range. Further parallel resistors are
typically not recommended. The two capacitors and the series
resistor shown in Figure 5 fine tune the phase and amplitude of
the sine frequency. The capacitor and resistor values shown in
Figure 5 are typical values only. The capacitor values are depen­
dent upon the crystal manufacturer’s load capacitance
recommendations and the physical PCB layout. The resistor
value depends on the drive level specified by the crystal manu­
facturer. System designs should verify the customized values
based on careful investigation on multiple devices over the
allowed temperature range.
A third-overtone crystal can be used at frequencies above
25 MHz. The circuit is then modified to ensure crystal operation
only at the third overtone, by adding a tuned inductor circuit as
shown in Figure 5.
As shown in Figure 6, the core clock (CCLK) and system
peripheral clock (SCLK) are derived from the input clock
(CLKIN) signal. An on-chip PLL is capable of multiplying the
CLKIN signal by a user-programmable 0.5× to 64× multiplica­
tion factor. The default multiplier is 10×, but it can be modified
by a software instruction sequence. On the fly frequency
changes can be effected by simply writing to the PLL_DIV
register.
All on-chip peripherals are clocked by the system clock (SCLK).
The system clock frequency is programmable by means of the
SSEL3–0 bits of the PLL_DIV register. The values programmed
Rev. E |
Page 13 of 64 |
1MO
0O*
18pF*
FOR OVERTONE
OPERATION ONLY
NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED
DEPENDING ON THE CRYSTAL AND LAYOUT. PLEASE
ANALYZE CAREFULLY.
Figure 5. External Crystal Connections
“FINE” ADJUSTMENT
REQUIRES PLL SEQUENCING
CLKIN
PLL
0.5u to 64u
“COARSE” ADJUSTMENT
ON-THE-FLY
÷ 1, 2, 4, 8
CCLK
÷ 1 to 15
SCLK
VCO
SCLK d CCLK
SCLK d 133 MHz
Figure 6. Frequency Modification Methods
into the SSEL fields define a divide ratio between the PLL output
(VCO) and the system clock. SCLK divider values are 1 through
15. Table 5 illustrates typical system clock ratios.
Table 5. Example System Clock Ratios
Signal Name
SSEL3–0
0001
0110
1010
Divider Ratio
VCO/SCLK
1:1
6:1
10:1
Example Frequency
Ratios (MHz)
VCO
SCLK
100
100
300
50
500
50
The maximum frequency of the system clock is fSCLK. Note that
the divisor ratio must be chosen to limit the system clock fre­
quency to its maximum of fSCLK. The SSEL value can be changed
dynamically without any PLL lock latencies by writing the
appropriate values to the PLL divisor register (PLL_DIV).
September 2009
ADSP-BF561
The core clock (CCLK) frequency can also be dynamically
changed by means of the CSEL1–0 bits of the PLL_DIV register.
Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in
Table 6. This programmable core clock capability is useful for
fast core frequency modifications.
Table 6. Core Clock Ratios
Signal Name
CSEL1–0
00
01
10
11
Divider Ratio
VCO/CCLK
1:1
2:1
4:1
8:1
Example Frequency
Ratios (MHz)
VCO
CCLK
500
500
500
250
200
50
200
25
The maximum PLL clock time when a change is programmed
via the PLL_CTL register is 40 μs. The maximum time to change
the internal voltage via the internal voltage regulator is also
40 μs. The reset value for the PLL_LOCKCNT register is 0x200.
This value should be programmed to ensure a 40 μs wakeup
time when either the voltage is changed or a new MSEL value is
programmed. The value should be programmed to ensure an
80 μs wakeup time when both voltage and the MSEL value are
changed. The time base for the PLL_LOCKCNT register is the
period of CLKIN.
BOOTING MODES
The ADSP-BF561 has three mechanisms (listed in Table 7) for
automatically loading internal L1 instruction memory, L2, or
external memory after a reset. A fourth mode is provided to exe­
cute from external memory, bypassing the boot sequence.
Table 7. Booting Modes
BMODE1 –0 Description
00
Execute from 16-bit external memory
(Bypass Boot ROM)
01
Boot from 8-bit/16-bit flash
10
Boot from SPI host slave mode
11
Boot from SPI serial EEPROM
(16-, 24-bit address range)
The BMODE pins of the reset configuration register, sampled
during power-on resets and software initiated resets, implement
the following modes:
• Execute from 16-bit external memory – Execution starts
from address 0x2000 0000 with 16-bit packing. The boot
ROM is bypassed in this mode. All configuration settings
are set for the slowest device possible (3-cycle hold time,
15-cycle R/W access times, 4-cycle setup). Note that, in
bypass mode, only Core A can execute instructions from
external memory.
• Boot from 8-bit/16-bit external flash memory – The
8-bit/16-bit flash boot routine located in boot ROM mem­
ory space is set up using Asynchronous Memory Bank 0.
Rev. E |
Page 14 of 64 |
All configuration settings are set for the slowest device pos­
sible (3-cycle hold time; 15-cycle R/W access times; 4-cycle
setup).
• Boot from SPI host device – The Blackfin processor oper­
ates in SPI slave mode and is configured to receive the bytes
of the .LDR file from an SPI host (master) agent. To hold
off the host device from transmitting while the boot ROM
is busy, the Blackfin processor asserts a GPIO pin, called
host wait (HWAIT), to signal the host device not to send
any more bytes until the flag is deasserted. The flag is cho­
sen by the user and this information is transferred to the
Blackfin processor via bits 10:5 of the FLAG header.
• Boot from SPI serial EEPROM (16-, 24-bit addressable) –
The SPI uses the PF2 output pin to select a single SPI
EPROM device, submits a read command at address
0x0000, and begins clocking data into the beginning of L1
instruction memory. A 16-, 24-bit addressable SPI-compat­
ible EPROM must be used.
For each of the boot modes, a boot loading protocol is used to
transfer program and data blocks from an external memory
device to their specified memory locations. Multiple memory
blocks may be loaded by any boot sequence. Once all blocks are
loaded, Core A program execution commences from the start of
L1 instruction SRAM (0xFFA0 0000). Core B remains in a heldoff state until Bit 5 of SICA_SYSCR is cleared by Core A. After
that, Core B will start execution at address 0xFF60 0000.
In addition, Bit 4 of the reset configuration register can be set by
application code to bypass the normal boot sequence during a
software reset. For this case, the processor jumps directly to the
beginning of L1 instruction memory.
INSTRUCTION SET DESCRIPTION
The Blackfin processor family assembly language instruction set
employs an algebraic syntax that was designed for ease of coding
and readability. The instructions have been specifically tuned to
provide a flexible, densely encoded instruction set that compiles
to a very small final memory size. The instruction set also pro­
vides fully featured multifunction instructions that allow the
programmer to use many of the processor core resources in a
single instruction. Coupled with many features more often seen
on microcontrollers, this instruction set is very efficient when
compiling C and C++ source code. In addition, the architecture
supports both a user (algorithm/application code) and a super­
visor (O/S kernel, device drivers, debuggers, ISRs) mode of
operation—allowing multiple levels of access to core processor
resources.
The assembly language, which takes advantage of the proces­
sor’s unique architecture, offers the following advantages:
• Seamlessly integrated DSP/CPU features are optimized for
both 8-bit and 16-bit operations.
• A multi-issue load/store modified Harvard architecture,
which supports two 16-bit MAC or four 8-bit ALU plus
two load/store plus two pointer updates per cycle.
September 2009
ADSP-BF561
• All registers, I/O, and memory are mapped into a unified
4G byte memory space providing a simplified program­
ming model.
• Set conditional breakpoints on registers, memory, and
stacks.
• Microcontroller features, such as arbitrary bit and bit-field
manipulation, insertion, and extraction; integer operations
on 8-, 16-, and 32-bit data types; and separate user and ker­
nel stack pointers.
• Perform linear or statistical profiling of program execution.
• Code density enhancements, which include intermixing of
16-bit and 32-bit instructions (no mode switching, no code
segregation). Frequently used instructions are encoded as
16-bits.
• Create custom debugger windows.
DEVELOPMENT TOOLS
The ADSP-BF561 is supported with a complete set of
CROSSCORE®† software and hardware development tools,
including Analog Devices emulators and the VisualDSP++®‡
development environment. The same emulator hardware that
supports other Analog Devices processors also fully emulates
the ADSP-BF561.
The VisualDSP++ project management environment lets pro­
grammers develop and debug an application. This environment
includes an easy to use assembler that is based on an algebraic
syntax, an archiver (librarian/library builder), a linker, a loader,
a cycle-accurate instruction-level simulator, a C/C++ compiler,
and a C/C++ runtime library that includes DSP and mathemati­
cal functions. A key point for these tools is C/C++ code
efficiency. The compiler has been developed for efficient trans­
lation of C/C++ code to Blackfin assembly. The Blackfin
processor has architectural features that improve the efficiency
of compiled C/C++ code.
The VisualDSP++ debugger has a number of important fea­
tures. Data visualization is enhanced by a plotting package that
offers a significant level of flexibility. This graphical representa­
tion of user data enables the programmer to quickly determine
the performance of an algorithm. As algorithms grow in com­
plexity, this capability can have increasing significance on the
designer’s development schedule, increasing productivity. Sta­
tistical profiling enables the programmer to nonintrusively poll
the processor as it is running the program. This feature, unique
to VisualDSP++, enables the software developer to passively
gather important code execution metrics without interrupting
the real-time characteristics of the program. Essentially, the
developer can identify bottlenecks in software quickly and effi­
ciently. By using the profiler, the programmer can focus on
those areas in the program that impact performance and take
corrective action.
Debugging both C/C++ and assembly programs with the
VisualDSP++ debugger, programmers can:
• View mixed C/C++ and assembly code (interleaved source
and object information).
• Insert breakpoints.
†
‡
CROSSCORE is a registered trademark of Analog Devices, Inc.
VisualDSP++ is a registered trademark of Analog Devices, Inc.
Rev. E |
Page 15 of 64 |
• Trace instruction execution.
• Fill, dump, and graphically plot the contents of memory.
• Perform source level debugging.
The VisualDSP++ IDE lets programmers define and manage
software development. Its dialog boxes and property pages let
programmers configure and manage all development tools,
including color syntax highlighting in the VisualDSP++ editor.
These capabilities permit programmers to:
• Control how the development tools process inputs and
generate outputs.
• Maintain a one-to-one correspondence with the tool’s
command line switches.
The VisualDSP++ Kernel (VDK) incorporates scheduling and
resource management tailored specifically to address the mem­
ory and timing constraints of embedded, real-time
programming. These capabilities enable engineers to develop
code more effectively, eliminating the need to start from the
very beginning when developing new application code. The
VDK features include threads, critical and unscheduled regions,
semaphores, events, and device flags. The VDK also supports
priority-based, pre-emptive, cooperative, and time-sliced
scheduling approaches. In addition, the VDK was designed to
be scalable. If the application does not use a specific feature, the
support code for that feature is excluded from the target system.
Because the VDK is a library, a developer can decide whether to
use it or not. The VDK is integrated into the VisualDSP++
development environment, but can also be used with standard
command line tools. When the VDK is used, the development
environment assists the developer with many error prone tasks
and assists in managing system resources, automating the
generation of various VDK-based objects, and visualizing the
system state when debugging an application that uses the VDK.
The Expert Linker can be used to visually manipulate the place­
ment of code and data in the embedded system. Memory
utilization can be viewed in a color-coded graphical form. Code
and data can be easily moved to different areas of the processor
or external memory with the drag of the mouse. Runtime stack
and heap usage can be examined. The Expert Linker is fully
compatible with existing Linker Definition File (LDF), allowing
the developer to move between the graphical and textual
environments.
Analog Devices emulators use the IEEE 1149.1 JTAG test access
port of the ADSP-BF561 to monitor and control the target
board processor during emulation. The emulator provides fullspeed emulation, allowing inspection and modification of mem­
ory, registers, and processor stacks. Nonintrusive in-circuit
emulation is assured by the use of the processor’s JTAG interface—the emulator does not affect the loading or timing of the
target system.
September 2009
ADSP-BF561
In addition to the software and hardware development tools
available from Analog Devices, third parties provide a wide
range of tools supporting the Blackfin processor family. Third
party software tools include DSP libraries, real-time operating
systems, and block diagram design tools.
RELATED DOCUMENTS
The following publications that describe the ADSP-BF561 pro­
cessors (and related processors) can be ordered from any
Analog Devices sales office or accessed electronically on our
website:
EZ-KIT Lite Evaluation Board
• Getting Started With Blackfin Processors
For evaluation of ADSP-BF561 processors, use the
ADSP-BF561 EZ-KIT Lite® board available from Analog
Devices. Order part number ADDS-BF561-EZLITE. The board
comes with on-chip emulation capabilities and is equipped to
enable software development. Multiple daughter cards are
available.
• ADSP-BF561 Blackfin Processor Hardware Reference
• ADSP-BF53x/BF56x Blackfin Processor Programming
Reference
• ADSP-BF561 Blackfin Processor Anomaly List
DESIGNING AN EMULATOR-COMPATIBLE
PROCESSOR BOARD
The Analog Devices family of emulators are tools that every sys­
tem developer needs to test and debug hardware and software
systems. Analog Devices has supplied an IEEE 1149.1 JTAG
Test Access Port (TAP) on the ADSP-BF561. The emulator uses
the TAP to access the internal features of the processor, allow­
ing the developer to load code, set breakpoints, observe
variables, observe memory, and examine registers. The proces­
sor must be halted to send data and commands, but once an
operation has been completed by the emulator, the processor is
set running at full speed with no impact on system timing.
To use these emulators, the target board must include a header
that connects the processor’s JTAG port to the emulator.
For details on target board design issues, including mechanical
layout, single processor connections, multiprocessor scan
chains, signal buffering, signal termination, and emulator pod
logic, see Analog Devices JTAG Emulation Technical Reference
(EE-68) on the Analog Devices website (www.analog.com)—use
site search on “EE-68.” This document is updated regularly to
keep pace with improvements to emulator support.
Rev. E |
Page 16 of 64 |
September 2009
ADSP-BF561
PIN DESCRIPTIONS
ADSP-BF561 pin definitions are listed in Table 8. In order to
maintain maximum function and reduce package size and pin
count, some pins have multiple functions. In cases where pin
function is reconfigurable, the default state is shown in plain
text, while alternate functionality is shown in italics.
All pins are three-stated during and immediately after reset,
except the external memory interface, asynchronous memory
control, and synchronous memory control pins. These pins are
all driven high, with the exception of CLKOUT, which toggles at
the system clock rate. However if BR is active, the memory pins
are also three-stated.
All I/O pins have their input buffers disabled, with the exception
of the pins that need pull-ups or pull-downs if unused, as noted
in Table 8.
Table 8. Pin Descriptions
Pin Name
EBIU
ADDR25–2
DATA31–0
ABE3–0/SDQM3–0
BR
BG
BGH
EBIU (ASYNC)
AMS3–0
ARDY
AOE
AWE
ARE
EBIU (SDRAM)
SRAS
SCAS
SWE
SCKE
SCLK0/CLKOUT
SCLK1
SA10
SMS3–0
Driver
Type1
Type Function
O
I/O
O
I
O
O
Address Bus for Async/Sync Access
Data Bus for Async/Sync Access
Byte Enables/Data Masks for Async/Sync Access
Bus Request (This pin should be pulled HIGH if not used.)
Bus Grant
Bus Grant Hang
O
I
O
O
O
Bank Select
Hardware Ready Control (This pin should be pulled HIGH if not used.)
Output Enable
Write Enable
Read Enable
A
A
A
O
O
O
O
O
O
O
O
Row Address Strobe
Column Address Strobe
Write Enable
Clock Enable
Clock Output Pin 0
Clock Output Pin 1
SDRAM A10 Pin
Bank Select
A
A
A
A
B
B
A
A
Rev. E |
Page 17 of 64 |
September 2009
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A
A
A
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ADSP-BF561
Table 8. Pin Descriptions (Continued)
Pin Name
PF/SPI/TIMER
PF0/SPISS/TMR0
PF1/SPISEL1/TMR1
PF2/SPISEL2/TMR2
PF3/SPISEL3/TMR3
PF4/SPISEL4/TMR4
PF5/SPISEL5/TMR5
PF6/SPISEL6/TMR6
PF7/SPISEL7/TMR7
PF8
PF9
PF10
PF11
PF12
PF13
PF14
PF15/EXT CLK
PPI0
PPI0D15–8/PF47–40
PPI0D7–0
PPI0CLK
PPI0SYNC1/TMR8
PPI0SYNC2/TMR9
PPI0SYNC3
PPI1
PPI1D15–8/PF39–32
PPI1D7–0
PPI1CLK
PPI1SYNC1/TMR10
PPI1SYNC2/TMR11
PPI1SYNC3
SPORT0
RSCLK0/PF28
RFS0/PF19
DR0PRI
DR0SEC/PF20
TSCLK0/PF29
TFS0/PF16
DT0PRI/PF18
DT0SEC/PF17
Type Function
Driver
Type1
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Programmable Flag/Slave SPI Select/Timer
Programmable Flag/SPI Select/Timer
Programmable Flag/SPI Select/Timer
Programmable Flag/SPI Select/Timer
Programmable Flag/SPI Select/Timer
Programmable Flag/SPI Select/Timer
Programmable Flag/SPI Select/Timer
Programmable Flag/SPI Select/Timer
Programmable Flag
Programmable Flag
Programmable Flag
Programmable Flag
Programmable Flag
Programmable Flag
Programmable Flag
Programmable Flag/External Timer Clock Input
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
I/O
I/O
I
I/O
I/O
I/O
PPI Data/Programmable Flag Pins
PPI Data Pins
PPI Clock
PPI Sync/Timer
PPI Sync/Timer
PPI Sync
C
C
I/O
I/O
I
I/O
I/O
I/O
PPI Data/Programmable Flag Pins
PPI Data Pins
PPI Clock
PPI Sync/Timer
PPI Sync/Timer
PPI Sync
C
C
I/O
I/O
I
I/O
I/O
I/O
I/O
I/O
Sport0 Receive Serial Clock/Programmable Flag
Sport0 Receive Frame Sync/Programmable Flag
Sport0 Receive Data Primary
Sport0 Receive Data Secondary/Programmable Flag
Sport0 Transmit Serial Clock/Programmable Flag
Sport0 Transmit Frame Sync/Programmable Flag
Sport0 Transmit Data Primary/Programmable Flag
Sport0 Transmit Data Secondary/Programmable Flag
Rev. E |
Page 18 of 64 |
C
C
C
C
C
C
September 2009
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D
C
C
C
ADSP-BF561
Table 8. Pin Descriptions (Continued)
Pin Name
SPORT1
RSCLK1/PF30
RFS1/PF24
DR1PRI
DR1SEC/PF25
TSCLK1/PF31
TFS1/PF21
DT1PRI/PF23
DT1SEC/PF22
SPI
MOSI
MISO
SCK
UART
RX/PF27
TX/PF26
JTAG
EMU
TCK
TDO
TDI
TMS
TRST
Clock
CLKIN
XTAL
Mode Controls
RESET
NMI0
NMI1
BMODE1–0
SLEEP
BYPASS
Voltage Regulator
VROUT1–0
Supplies
VDDEXT
VDDINT
GND
No Connection
1
Driver
Type1
Type Function
I/O
I/O
I
I/O
I/O
I/O
I/O
I/O
Sport1 Receive Serial Clock/Programmable Flag
Sport1 Receive Frame Sync/Programmable Flag
Sport1 Receive Data Primary
Sport1 Receive Data Secondary/Programmable Flag
Sport1 Transmit Serial Clock/Programmable Flag
Sport1 Transmit Frame Sync/Programmable Flag
Sport1 Transmit Data Primary/Programmable Flag
Sport1 Transmit Data Secondary/Programmable Flag
I/O
I/O
I/O
Master Out Slave In
Master In Slave Out (This pin should be pulled HIGH through a 4.7 kΩ resistor if booting via the SPI
port.)
SPI Clock
D
I/O
I/O
UART Receive/Programmable Flag
UART Transmit/Programmable Flag
C
C
O
I
O
I
I
I
Emulation Output
JTAG Clock
JTAG Serial Data Out
JTAG Serial Data In
JTAG Mode Select
JTAG Reset (This pin should be pulled LOW if JTAG is not used.)
C
I
O
Clock/Crystal Input (This pin needs to be at a level or clocking.)
Crystal Connection
I
I
I
I
O
I
Reset (This pin is always active during core power-on.)
Nonmaskable Interrupt Core A (This pin should be pulled LOW when not used.)
Nonmaskable Interrupt Core B (This pin should be pulled LOW when not used.)
Boot Mode Strap (These pins must be pulled to the state required for the desired boot mode.)
Sleep
PLL BYPASS Control (Pull-up or pull-down Required.)
O
External FET Drive
P
P
G
NC
Power Supply
Power Supply
Power Supply Return
NC
Refer to Figure 30 on Page 41 to Figure 34 on Page 42.
Rev. E |
Page 19 of 64 |
September 2009
D
C
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D
C
C
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ADSP-BF561
SPECIFICATIONS
Component specifications are subject to change without notice.
OPERATING CONDITIONS
Parameter
VDDINT
Internal Supply Voltage1
VDDINT
Internal Supply Voltage3
VDDINT
Internal Supply Voltage3
VDDEXT
External Supply Voltage
VDDEXT
External Supply Voltage
VIH
High Level Input Voltage4, 5
VIL
Low Level Input Voltage5
TJ
Junction Temperature
TJ
Junction Temperature
TJ
Junction Temperature
TJ
Junction Temperature
TJ
Junction Temperature
Conditions
Non automotive 500 MHz and 533 MHz speed grade models2
600 MHz speed grade models2
Automotive grade models2
Non automotive grade models2
Automotive grade models2
Min
0.8
0.8
0.95
2.25
2.7
2.0
–0.3
256-Ball CSP_BGA (12 mm × 12 mm) @ TAMBIENT = 0°C to +70°C
0
256-Ball CSP_BGA (17 mm × 17 mm) @ TAMBIENT = 0°C to +70°C
0
256-Ball CSP_BGA (17 mm × 17 mm) @ TAMBIENT =–40°C to +85°C –40
297-Ball PBGA @ TAMBIENT = 0°C to +70°C
0
297-Ball PBGA @ TAMBIENT = –40°C to +85°C
–40
Nominal
1.25
1.35
1.25
2.5, or 3.3
3.3
Max
1.375
1.4185
1.375
3.6
3.6
3.6
+0.6
+105
+95
+115
+95
+115
Unit
V
V
V
V
V
V
V
°C
°C
°C
°C
°C
1
Internal voltage (VDDINT) regulator tolerance is –5% to +10% for all models.
See Ordering Guide on Page 63.
3
The internal voltage regulation feature is not available. External voltage regulation is required to ensure correct operation.
4
The ADSP-BF561 is 3.3 V tolerant (always accepts up to 3.6 V maximum VIH), but voltage compliance (on outputs, VOH) depends on the input VDDEXT, because VOH (maximum)
approximately equals VDDEXT (maximum). This 3.3 V tolerance applies to bidirectional and input only pins.
5
Applies to all signal pins.
2
Table 9 and Table 10 describe the timing requirements for the
ADSP-BF561 clocks (tCCLK = 1/fCCLK). Take care in selecting
MSEL, SSEL, and CSEL ratios so as not to exceed the maximum
core clock, system clock, and Voltage Controlled Oscillator
(VCO) operating frequencies, as described in Absolute Maxi­
mum Ratings on Page 22. Table 11 describes phase-locked loop
operating conditions.
Table 9. Core Clock (CCLK) Requirements—500 MHz and 533 MHz Speed Grade Models1
Parameter
fCCLK
CCLK Frequency (VDDINT = 1.235 Vminimum)2
CCLK Frequency (VDDINT = 1.1875 Vminimum)
fCCLK
fCCLK
CCLK Frequency (VDDINT = 1.045 Vminimum)
CCLK Frequency (VDDINT = 0.95 Vminimum)
fCCLK
fCCLK
CCLK Frequency (VDDINT = 0.855 Vminimum)3
fCCLK
CCLK Frequency (VDDINT = 0.8 V minimum)3
Max
533
500
444
350
300
250
Unit
MHz
MHz
MHz
MHz
MHz
MHz
Max
600
533
500
444
350
300
250
Unit
MHz
MHz
MHz
MHz
MHz
MHz
MHz
1
See Ordering Guide on Page 63.
External Voltage regulation is required on automotive grade models (see Ordering Guide on Page 63) to ensure correct operation.
3
Not applicable to automotive grade models. See Ordering Guide on Page 63.
2
Table 10. Core Clock (CCLK) Requirements—600 MHz Speed Grade Models1
Parameter
CCLK Frequency (VDDINT = 1.2825 V minimum)2
fCCLK
fCCLK
CCLK Frequency (VDDINT = 1.235 V minimum)
fCCLK
CCLK Frequency (VDDINT = 1.1875 V minimum)
fCCLK
CCLK Frequency (VDDINT = 1.045 V minimum)
CCLK Frequency (VDDINT = 0.95 V minimum)
fCCLK
fCCLK
CCLK Frequency (VDDINT = 0.855 V minimum)
CCLK Frequency (VDDINT = 0.8 V minimum)
fCCLK
1
2
See Ordering Guide on Page 63.
External voltage regulator required to ensure proper operation at 600 MHz.
Rev. E |
Page 20 of 64 |
September 2009
ADSP-BF561
Table 11. Phase-Locked Loop Operating Conditions
Parameter
Voltage Controlled Oscillator (VCO) Frequency
Min
50
Max
Maximum fCCLK
Unit
MHz
Table 12. System Clock (SCLK) Requirements
Parameter1
fSCLK
fSCLK
1
2
Max VDDEXT = 2.5V/3.3V
1332
100
CLKOUT/SCLK Frequency (VDDINT ≥ 1.14 V)
CLKOUT/SCLK Frequency (VDDINT < 1.14 V)
Unit
MHz
MHz
tSCLK (= 1/fSCLK) must be greater than or equal to tCCLK.
Rounded number. Guaranteed to tSCLK = 7.5 ns. See Table 20 on Page 26.
ELECTRICAL CHARACTERISTICS
Parameter
VOH
VOL
IIH
IIHP
IIL4
IOZH
IOZL4
CIN
IDDHIBERNATE8
High Level Output Voltage1
Low Level Output Voltage1
High Level Input Current2
High Level Input Current JTAG3
Low Level Input Current2
Three-State Leakage Current5
Three-State Leakage Current5
Input Capacitance6
VDDEXT Current in Hibernate Mode
IDDDEEPSLEEP9
IDD_TYP9, 10
IDD_TYP9, 10
IDD_TYP9, 10
VDDINT Current in Deep Sleep Mode
VDDINT Current
VDDINT Current
VDDINT Current
Test Conditions
Min
VDDEXT = 3.0 V, IOH = –0.5 mA
2.4
VDDEXT = 3.0 V, IOL = 2.0 mA
VDDEXT = Maximum, VIN = VDD Maximum
VDDEXT = Maximum, VIN = VDD Maximum
VDDEXT = Maximum, VIN = 0 V
VDDEXT = Maximum, VIN = VDD Maximum
VDDEXT = Maximum, VIN = 0 V
fIN = 1 MHz, TAMBIENT = 25°C, VIN = 2.5 V
CLKIN=0 MHz, VDDEXT = 3.65 V with Voltage Regulator Off
(VDDINT = 0 V)
VDDINT = 0.8 V, TJUNCTION = 25°C
VDDINT = 0.8 V, fCCLK = 50 MHz, TJUNCTION = 25°C
VDDINT = 1.25 V, fCCLK = 500 MHz, TJUNCTION = 25°C
VDDINT = 1.35 V, fCCLK = 600 MHz, TJUNCTION = 25°C
1
Typical
4
50
70
127
660
818
Max
0.4
10.0
50.0
10.0
10.0
10.0
87
Unit
V
V
μA
μA
μA
μA
μA
pF
μA
mA
mA
mA
mA
Applies to output and bidirectional pins.
Applies to input pins except JTAG inputs.
3
Applies to JTAG input pins (TCK, TDI, TMS, TRST).
4
Absolute value.
5
Applies to three-statable pins.
6
Applies to all signal pins.
7
Guaranteed, but not tested.
8
CLKIN must be tied to VDDEXT or GND during hibernate.
9
Maximum current drawn. See Estimating Power for ADSP-BF561 Blackfin Processors (EE-293) on the Analog Devices website (www.analog.com)—use site search on “EE-293”.
10
Both cores executing 75% dual MAC, 25% ADD instructions with moderate data bus activity.
2
System designers should refer to Estimating Power for the
ADSP-BF561 (EE-293), which provides detailed information for
optimizing designs for lowest power. All topics discussed in this
section are described in detail in EE-293. Total power dissipa­
tion has two components:
1. Static, including leakage current
2. Dynamic, due to transistor switching characteristics
Many operating conditions can also affect power dissipation,
including temperature, voltage, operating frequency, and pro­
cessor activity. Electrical Characteristics on Page 21 shows the
current dissipation for internal circuitry (VDDINT).
Rev. E |
Page 21 of 64 |
September 2009
ADSP-BF561
ABSOLUTE MAXIMUM RATINGS
PACKAGE INFORMATION
Stresses greater than those listed in Table 13 may cause perma­
nent damage to the device. These are stress ratings only.
Functional operation of the device at these or any other condi­
tions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
The information presented in Figure 7 and Table 15 provides
details about the package branding for the Blackfin processors.
For a complete listing of product availability, see the Ordering
Guide on Page 63.
a
Table 13. Absolute Maximum Ratings
Parameter
Internal (Core) Supply Voltage (VDDINT)
External (I/O) Supply Voltage (VDDEXT)
Input Voltage1
Output Voltage Swing
Load Capacitance2
Storage Temperature Range
Junction Temperature Under Bias
Value
–0.3 V to +1.42 V
–0.5 V to +3.8 V
–0.5 V to +3.8 V
–0.5 V to VDDEXT + 0.5 V
200 pF
–65°C to +150°C
125°C
1
Applies to 100% transient duty cycle. For other duty cycles see Table 14.
2
For proper SDRAM controller operation, the maximum load capacitance is 50 pF
(at 3.3 V) or 30 pF (at 2.5 V) for ADDR19–1, DATA15–0, ABE1–0/SDQM1–0,
CLKOUT, SCKE, SA10, SRAS, SCAS, SWE, and SMS.
Table 14. Maximum Duty Cycle for Input Transient Voltage1
VIN Min (V)
–0.50
–0.70
–0.80
–0.90
–1.00
VIN Max (V)2
3.80
4.00
4.10
4.20
4.30
Maximum Duty Cycle
100%
40%
25%
15%
10%
ADSP-BF561
tppZccc
vvvvvv.x n.n
yyww country_of_origin
B
Figure 7. Product Information on Package
Table 15. Package Brand Information
Brand Key
t
pp
Z
ccc
vvvvvv.x
n.n
yyww
Field Description
Temperature Range
Package Type
RoHS Compliant Part
See Ordering Guide
Assembly Lot Code
Silicon Revision
Date Code
ESD SENSITIVITY
1
Applies to all signal pins with the exception of CLKIN, XTAL, VROUT1–0.
2
Only one of the listed options can apply to a particular design.
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can discharge
without detection. Although this product features
patented or proprietary protection circuitry, damage
may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to
avoid performance degradation or loss of functionality.
Rev. E |
Page 22 of 64 |
September 2009
ADSP-BF561
TIMING SPECIFICATIONS
Clock and Reset Timing
Table 16 and Figure 8 describe clock and reset operations. Per
Absolute Maximum Ratings on Page 22, combinations of
CLKIN and clock multipliers must not result in core/system
clocks exceeding the maximum limits allowed for the processor,
including system clock restrictions related to supply voltage.
Table 16. Clock and Normal Reset Timing
Parameter
Timing Requirements
tCKIN
CLKIN (to PLL) Period1, 2, 3
tCKINL
CLKIN Low Pulse
tCKINH
CLKIN High Pulse
tWRST
RESET Asserted Pulse Width Low4
Min
Max
Unit
25.0
10.0
10.0
11 × tCKIN
100.0
ns
ns
ns
ns
1
If DF bit in PLL_CTL register is set tCLKIN is divided by two before going to PLL, then the tCLKIN maximum period is 50 ns and the tCLKIN minimum period is 12.5 ns.
Applies to PLL bypass mode and PLL nonbypass mode.
3
Combinations of the CLKIN frequency and the PLL clock multiplier must not exceed the allowed fVCO, fCCLK, and fSCLK settings discussed in Table 9 on Page 20 through Table 12
on Page 21.
4
Applies after power-up sequence is complete. See Table 17 and Figure 9 for power-up reset timing.
2
tCKIN
CLKIN
tCKINL
tCKINH
tWRST
RESET
Figure 8. Clock and Normal Reset Timing
Table 17. Power-Up Reset Timing
Parameter
Timing Requirements
tRST_IN_PWR
RESET Deasserted after the VDDINT, VDDEXT, and CLKIN Pins are Stable and Within
Specification
tRST_IN_PWR
RESET
CLKIN,
VDDINT, VDDEXT
Figure 9. Power-Up Reset Timing
Rev. E |
Page 23 of 64 |
September 2009
Min
3500 × tCKIN
Max
Unit
μs
ADSP-BF561
Asynchronous Memory Read Cycle Timing
Table 18. Asynchronous Memory Read Cycle Timing
Parameter
Timing Requirements
tSDAT
DATA31 –0 Setup Before CLKOUT
tHDAT
DATA31–0 Hold After CLKOUT
tSARDY
ARDY Setup Before CLKOUT
tHARDY
ARDY Hold After CLKOUT
Switching Characteristics
tDO
Output Delay After CLKOUT1
tHO
Output Hold After CLKOUT 1
1
Min
Max
Unit
ns
ns
ns
ns
2.1
0.8
4.0
0.0
ns
ns
6.0
0.8
Output pins include AMS3–0, ABE3–0, ADDR25–2, AOE, ARE.
SETUP
2 CYCLES
1 CYCLE
ACCESS EXTENDED
3 CYCLES
PROGRAMMED READ ACCESS
4 CYCLES
CLKOUT
tDO
tHO
AMSx
ABE1–0
ABE, ADDRESS
ADDR19–1
AOE
tDO
tHO
ARE
tSARDY
tHARDY
tHARDY
ARDY
tSARDY
tSDAT
tHDAT
DATA15–0
READ
Figure 10. Asynchronous Memory Read Cycle Timing
Rev. E |
Page 24 of 64 |
September 2009
ADSP-BF561
Asynchronous Memory Write Cycle Timing
Table 19. Asynchronous Memory Write Cycle Timing
Parameter
Timing Requirements
tSARDY
ARDY Setup Before CLKOUT
tHARDY
ARDY Hold After CLKOUT
Switching Characteristics
tDDAT
DATA31–0 Disable After CLKOUT
DATA31–0 Enable After CLKOUT
tENDAT
tDO
Output Delay After CLKOUT1
tHO
Output Hold After CLKOUT 1
1
Min
4.0
0.0
6.0
6.0
0.8
PROGRAMMED WRITE
ACCESS 2 CYCLES
ACCESS
EXTENDED
1 CYCLE
HOLD
1 CYCLE
CLKOUT
t DO
t HO
AMSx
ABE1–0
ABE, ADDRESS
ADDR19–1
tDO
tHO
AWE
t HARDY
t SARDY
ARDY
tSARDY
t ENDAT
DATA15–0
t DDAT
WRITE DATA
Figure 11. Asynchronous Memory Write Cycle Timing
Rev. E |
Page 25 of 64 |
September 2009
Unit
ns
ns
1.0
Output pins include AMS3–0, ABE3–0, ADDR25–2, DATA31–0, AOE, AWE.
SETUP
2 CYCLES
Max
ns
ns
ns
ns
ADSP-BF561
SDRAM Interface Timing
Table 20. SDRAM Interface Timing
Parameter
Timing Requirements
tSSDAT
DATA Setup Before CLKOUT
tHSDAT
DATA Hold After CLKOUT
Switching Characteristics
tDCAD
Command, ADDR, Data Delay After CLKOUT1
Command, ADDR, Data Hold After CLKOUT1
tHCAD
tDSDAT
Data Disable After CLKOUT
tENSDAT
Data Enable After CLKOUT
tSCLK
CLKOUT Period
tSCLKH
CLKOUT Width High
tSCLKL
CLKOUT Width Low
1
Min
4.0
0.8
4.0
1.0
7.5
2.5
2.5
tSDCLKH
tSDCLK
SDCLK
tSSDAT
tSDCLKL
tHSDAT
DATA (IN)
tDCAD
tENSDAT
tHCAD
DATA (OUT)
tDCAD
CMND ADDR
(OUT)
tHCAD
Figure 12. SDRAM Interface Timing
Page 26 of 64 |
tDSDAT
September 2009
Unit
ns
ns
1.5
0.8
Command pins include: SRAS, SCAS, SWE, SDQM, SMS3–0, SA10, SCKE.
Rev. E |
Max
ns
ns
ns
ns
ns
ns
ns
ADSP-BF561
External Port Bus Request and Grant Cycle Timing
Table 21 and Figure 13 describe external port bus request and
bus grant operations.
Table 21. External Port Bus Request and Grant Cycle Timing
Parameter1, 2
Timing Requirements
tBS
BR Asserted to CLKOUT High Setup
tBH
CLKOUT High to BR Deasserted Hold Time
Switching Characteristics
tSD
CLKOUT Low to AMSx, Address and ARE/AWE Disable
tSE
CLKOUT Low to AMSx, Address and ARE/AWE Enable
tDBG
CLKOUT High to BG Asserted Setup
tEBG
CLKOUT High to BG Deasserted Hold Time
tDBH
CLKOUT High to BGH Asserted Setup
CLKOUT High to BGH Deasserted Hold Time
tEBH
1
2
Min
Max
Unit
ns
ns
4.6
0.0
ns
ns
ns
ns
ns
ns
4.5
4.5
3.6
3.6
3.6
3.6
These are preliminary timing parameters that are based on worst-case operating conditions.
The pad loads for these timing parameters are 20 pF.
CLKOUT
tBS
tBH
BR
tSD
tSE
AMSx
tSD
tSE
ADDR19-1
ABE1-0
tSD
tSE
AWE
ARE
tDBG
tEBG
BG
tDBH
BGH
Figure 13. External Port Bus Request and Grant Cycle Timing
Rev. E |
Page 27 of 64 |
September 2009
tEBH
ADSP-BF561
Parallel Peripheral Interface Timing
Table 22, and Figure 14 through Figure 17 on Page 30, describe
default Parallel Peripheral Interface operations.
If bit 4 of the PLL_CTL register is set, then Figure 18 on Page 30
and Figure 19 on Page 31 apply.
Table 22. Parallel Peripheral Interface Timing
Parameter
Timing Requirements
tPCLKW
PPIxCLK Width1
tPCLK
PPIxCLK Period1
External Frame Sync Setup Before PPIxCLK
tSFSPE
tHFSPE
External Frame Sync Hold After PPIxCLK
tSDRPE
Receive Data Setup Before PPIxCLK
tHDRPE
Receive Data Hold After PPIxCLK
Switching Characteristics
tDFSPE
Internal Frame Sync Delay After PPIxCLK
Internal Frame Sync Hold After PPIxCLK
tHOFSPE
tDDTPE
Transmit Data Delay After PPIxCLK
tHDTPE
Transmit Data Hold After PPIxCLK
1
Min
Max
ns
ns
ns
ns
ns
ns
5.0
13.3
4.0
1.0
3.5
2.0
8.0
1.7
8.0
2.0
Unit
ns
ns
ns
ns
For PPI modes that use an internally generated frame sync, the PPIxCLK frequency cannot exceed fSCLK/2. For modes with no frame syncs or external frame syncs, PPIxCLK
cannot exceed 75 MHz and fSCLK should be equal to or greater than PPIxCLK.
FRAME
SYNC IS
DRIVEN
OUT
DATA0
IS
SAMPLED
POLC = 0
PPIxCLK
PPIxCLK
POLC = 1
tDFSPE
tHOFSPE
POLS = 1
PPIxSYNC1
POLS = 0
POLS = 1
PPIxSYNC2
POLS = 0
tSDRPE
tHDRPE
PPIx_DATA
Figure 14. PPI GP Rx Mode with Internal Frame Sync Timing (Default)
Rev. E |
Page 28 of 64 |
September 2009
ADSP-BF561
DATA0 IS
SAMPLED
FRAME
SYNC IS
SAMPLED
FOR
DATA0
DATA1 IS
SAMPLED
PPIxCLK
POLC = 0
PPIxCLK
POLC = 1
t
HFSPE
tSFSPE
POLS = 1
PPIxSYNC1
POLS = 0
POLS = 1
PPIxSYNC2
POLS = 0
t
SDRPE
t
HDRPE
PPIx_DATA
Figure 15. PPI GP Rx Mode with External Frame Sync Timing (Default)
FRAME
SYNC IS
DRIVEN
OUT
DATA0 IS
DRIVEN
OUT
PPIxCLK
POLC = 0
PPIxCLK
POLC = 1
t
DFSPE
tHOFSPE
POLS = 1
PPIxSYNC1
POLS = 0
POLS = 1
PPIxSYNC2
POLS = 0
tDDTPE
tHDTPE
PPIx_DATA
DATA0
Figure 16. PPI GP Tx Mode with Internal Frame Sync Timing (Default)
Rev. E |
Page 29 of 64 |
September 2009
ADSP-BF561
FRAME
SYNC IS
SAMPLED
DATA0 IS
DRIVEN
OUT
PPIxCLK
POLC = 0
PPIxCLK
POLC = 1
tHFSPE
t
SFSPE
POLS = 1
PPxSYNC1
POLS = 0
POLS = 1
PPIxSYNC2
POLS = 0
t
HDTPE
PPIx_DATA
DATA0
tDDTPE
Figure 17. PPI GP Tx Mode with External Frame Sync Timing (Default)
DATA
SAMPLING/
FRAME
SYNC
SAMPLING
EDGE
DATA
SAMPLING/
FRAME
SYNC
SAMPLING
EDGE
PPIxCLK
POLC = 0
PPIxCLK
POLC = 1
tSFSPE
t
HFSPE
POLS = 1
PPIxSYNC1
POLS = 0
POLS = 1
PPIxSYNC2
POLS = 0
tSDRPE
tHDRPE
PPIx_DATA
Figure 18. PPI GP Rx Mode with External Frame Sync Timing (Bit 4 of PLL_CTL Set)
Rev. E |
Page 30 of 64 |
September 2009
ADSP-BF561
DATA
DRIVING/
FRAME
SYNC
SAMPLING
EDGE
DATA
DRIVING/
FRAME
SYNC
SAMPLING
EDGE
PPIxCLK
POLC = 0
PPIxCLK
POLC = 1
t
HFSPE
t
SFSPE
POLS = 1
PPIxSYNC1
POLS = 0
POLS = 1
PPIxSYNC2
POLS = 0
tDDTPE
t
HDTPE
PPIx_DATA
Figure 19. PPI GP Tx Mode with External Frame Sync Timing (Bit 4 of PLL_CTL Set)
Rev. E |
Page 31 of 64 |
September 2009
ADSP-BF561
Serial Ports
Table 23 through Table 26 on Page 34 and Figure 20 on Page 33
through Figure 22 on Page 34 describe Serial Port operations.
Table 23. Serial Ports—External Clock
Parameter
Timing Requirements
tSFSE
TFSx/RFSx Setup Before TSCLKx/RSCLKx1
tHFSE TFSx/RFSx Hold After TSCLKx/RSCLKx1
tSDRE Receive Data Setup Before RSCLKx1
tHDRE Receive Data Hold After RSCLKx1
tSCLKW TSCLKx/RSCLKx Width
tSCLK
TSCLKx/RSCLKx Period
tSUDTE Start-Up Delay From SPORT Enable To First External TFSx
tSUDRE Start-Up Delay From SPORT Enable To First External RFSx
Switching Characteristics
tDFSE TFSx/RFSx Delay After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2
tHOFSE TFSx/RFSx Hold After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2
tDDTE Transmit Data Delay After TSCLKx2
tHDTE Transmit Data Hold After TSCLKx2
1
2
Min
Max
3.0
3.0
3.0
3.0
4.5
15.0
4.0
4.0
Unit
ns
ns
ns
ns
ns
ns
TSCLKx
RSCLKx
10.0
0.0
10.0
0.0
ns
ns
ns
ns
Referenced to sample edge.
Referenced to drive edge.
Table 24. Serial Ports—Internal Clock
Parameter
Timing Requirements
tSFSI
TFSx/RFSx Setup Before TSCLKx/RSCLKx1
tHFSI
TFSx/RFSx Hold After TSCLKx/RSCLKx1
tSDRI
Receive Data Setup Before RSCLKx1
tHDRI
Receive Data Hold After RSCLKx1
tSCLKW TSCLKx/RSCLKx Width
tSCLK
TSCLKx/RSCLKx Period
Switching Characteristics
tDFSI
TFSx/RFSx Delay After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2
tHOFSI TFSx/RFSx Hold After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2
tDDTI
Transmit Data Delay After TSCLKx2
tHDTI
Transmit Data Hold After TSCLKx2
tSCLKIW TSCLKx/RSCLKx Width
1
2
Referenced to sample edge.
Referenced to drive edge.
Rev. E |
Page 32 of 64 |
September 2009
Min
Max
8.0
–2.0
6.0
0.0
4.5
15.0
ns
ns
ns
ns
ns
ns
3.0
–1.0
3.0
–2.0
4.5
Unit
ns
ns
ns
ns
ns
ADSP-BF561
DATA RECEIVE—INTERNAL CLOCK
DRIVE EDGE
tSCLKIW
DATA RECEIVE—EXTERNAL CLOCK
SAMPLE EDGE
DRIVE EDGE
SAMPLE EDGE
tSCLKW
RSCLKx
RSCLKx
tDFSIR
tDFSE
tHOFSIR
tSFSI
tHFSI
tHOFSE
tSFSE
tHFSE
tSDRE
tHDRE
RFSx
RFSx
tSDRI
tHDRI
DRx
DRx
NOTES
1. EITHER THE RISING EDGE OR THE FALLING EDGE OF SCLK (EXTERNAL OR INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DATA TRANSMIT—INTERNAL CLOCK
DRIVE EDGE
tSCLKIW
DATA TRANSMIT—EXTERNAL CLOCK
SAMPLE EDGE
DRIVE EDGE
tSCLKW
SAMPLE EDGE
TSCLKx
TSCLKx
tDFSI
tDFSE
tHOFSI
tSFSI
tHFSI
tSFSE
tHOFSE
TFSx
TFSx
tDDTI
tHDTI
tHDTE
DTx
DTx
Figure 20. Serial Ports
TSCLKx
(INPUT)
tSUDTE
TFSx
(INPUT)
RSCLKx
(INPUT)
tSUDRE
RFSx
(INPUT)
SPORT
ENABLED
Figure 21. Serial Port Start Up with External Clock and Frame Sync
Rev. E |
Page 33 of 64 |
September 2009
tDDTE
tHFSE
ADSP-BF561
Table 25. Serial Ports—Enable and Three-State
Parameter
Switching Characteristics
Data Enable Delay from External TSCLKx1
tDTENE
tDDTTE
Data Disable Delay from External TSCLKx1
tDTENI
Data Enable Delay from Internal TSCLKx1
tDDTTI
Data Disable Delay from Internal TSCLKx1
1
Min
Max
0
10.0
–2.0
3.0
Unit
ns
ns
ns
ns
Referenced to drive edge.
Table 26. External Late Frame Sync
Parameter
Switching Characteristics
tDDTLFSE Data Delay from Late External TFSx or External RFSx with MCMEN = 1, MFD = 01, 2
tDTENLFS Data Enable from Late FS or MCMEN = 1, MFD = 01, 2
1
2
Min
0
MCMEN = 1, TFSx enable and TFSx valid follow tDTENLFS and tDDTLFSE.
If external RFSx/TFSx setup to RSCLKx/TSCLKx > tSCLKE/2, then tDDTTE/I and tDTENE/I apply; otherwise tDDTLFSE and tDTENLFS apply.
EXTERNAL RECEIVE FS WITH MCMEN = 1, MFD = 0
DRIVE
SAMPLE
DRIVE
RSCLKx
tSFSE/I
tHFSE/I
RFSx
tDDTE/I
tDDTENFS
tHDTE/I
DTx
1ST BIT
2ND BIT
tDDTLFSE
LATE EXTERNAL TRANSMIT FS
DRIVE
SAMPLE
DRIVE
TSCLKx
tSFSE/I
tHFSE/I
TFSx
tDDTE/I
tDDTENFS
tHDTE/I
1ST BIT
DTx
2ND BIT
tDDTLFSE
Figure 22. External Late Frame Sync
Rev. E |
Page 34 of 64 |
September 2009
Max
Unit
10.0
ns
ns
ADSP-BF561
Serial Peripheral Interface (SPI) Port—
Master Timing
Table 27 and Figure 23 describe SPI port master operations.
Table 27. Serial Peripheral Interface (SPI) Port—Master Timing
Parameter
Timing Requirements
Data Input Valid to SCK Edge (Data Input Setup)
tSSPIDM
tHSPIDM
SCK Sampling Edge to Data Input Invalid
Switching Characteristics
tSDSCIM
SPISELx Low to First SCK Edge
tSPICHM
Serial Clock High Period
tSPICLM
Serial Clock Low Period
Serial Clock Period
tSPICLK
tHDSM
Last SCK Edge to SPISELx High
tSPITDM
Sequential Transfer Delay
tDDSPIDM
SCK Edge to Data Out Valid (Data Out Delay)
tHDSPIDM
SCK Edge to Data Out Invalid (Data Out Hold)
Min
Max
7.5
–1.5
ns
ns
2 × tSCLK – 1.5
2 × tSCLK – 1.5
2 × tSCLK – 1.5
4 × tSCLK – 1.5
2 × tSCLK – 1.5
2 × tSCLK – 1.5
0
–1.0
ns
ns
ns
ns
ns
ns
ns
ns
6
+4.0
FLAG3–0
(OUTPUT)
tSDSCIM
tSPICHM
tSPICLM
tSPICLM
tSPICHM
tSPICLKM
tSPITDM
tHDSM
SPICLK
(CP = 0)
(OUTPUT)
SPICLK
(CP = 1)
(OUTPUT)
tDDSPIDM
MOSI
(OUTPUT)
tHDSPIDM
LSB
MSB
tSSPIDM
tSSPIDM
tHSPIDM
CPHASE = 1
MISO
(INPUT)
tHSPIDM
MSB
VALID
LSB VALID
tHDSPIDM
tDDSPIDM
MOSI
(OUTPUT)
CPHASE = 0
MISO
(INPUT)
MSB
tSSPIDM
LSB
tHSPIDM
MSB VALID
LSB VALID
Figure 23. Serial Peripheral Interface (SPI) Port—Master Timing
Rev. E |
Page 35 of 64 |
September 2009
Unit
ADSP-BF561
Serial Peripheral Interface (SPI) Port—
Slave Timing
Table 28 and Figure 24 describe SPI port slave operations.
Table 28. Serial Peripheral Interface (SPI) Port—Slave Timing
Parameter
Timing Requirements
Serial Clock High Period
tSPICHS
tSPICLS
Serial Clock Low Period
tSPICLK
Serial Clock Period
tHDS
Last SCK Edge to SPISS Not Asserted
tSPITDS
Sequential Transfer Delay
tSDSCI
SPISS Assertion to First SCK Edge
Data Input Valid to SCK Edge (Data Input Setup)
tSSPID
tHSPID
SCK Sampling Edge to Data Input Invalid
Switching Characteristics
tDSOE
SPISS Assertion to Data Out Active
tDSDHI
SPISS Deassertion to Data High Impedance
tDDSPID
SCK Edge to Data Out Valid (Data Out Delay)
SCK Edge to Data Out Invalid (Data Out Hold)
tHDSPID
Min
2×
2×
4×
2×
2×
2×
1.6
1.6
Max
tSCLK – 1.5
tSCLK – 1.5
tSCLK
tSCLK – 1.5
tSCLK – 1.5
tSCLK – 1.5
ns
ns
ns
ns
ns
ns
ns
ns
0
0
0
0
8
8
10
10
SPIDS
(INPUT)
tSPICHS
tSPICLS
tSPICLKS
tHDS
tSDPPW
SPICLK
(CP = 0)
(INPUT)
tSPICLS
tSDSCO
SPICLK
(CP = 1)
(INPUT)
tSPICHS
tDSDHI
tDDSPIDS
tDSOE
tDDSPIDS
MISO
(OUTPUT)
LSB
tSSPIDS tHSPIDS
tSSPIDS
CPHASE = 1
MOSI
(INPUT)
MSB VALID
LSB VALID
tHDSPIDS
tDDSPIDS
MISO
(OUTPUT)
MSB
LSB
tDSOV
CPHASE = 0
MOSI
(INPUT)
tHDSPIDS
MSB
tHSPIDS
tSSPIDS
MSB VALID
LSB VALID
Figure 24. Serial Peripheral Interface (SPI) Port—Slave Timing
Rev. E |
Page 36 of 64 |
September 2009
Unit
tDSDHI
ns
ns
ns
ns
ADSP-BF561
Universal Asynchronous Receiver Transmitter (UART)
Port—Receive and Transmit Timing
Figure 25 describes UART port receive and transmit operations.
The maximum baud rate is SCLK/16. As shown in Figure 25,
there is some latency between the generation internal UART
interrupts and the external data operations. These latencies are
negligible at the data transmission rates for the UART.
DPI_P14–1
[RxD]
DATA (5–8)
STOP
tRXD
RECEIVE
INTERNAL
UART RECEIVE
INTERRUPT
UART RECEIVE BIT SET BY DATA STOP;
CLEARED BY FIFO READ
START
DPI_P14–1
[TxD]
DATA (5–8)
STOP (1–2)
tTXD
TRANSMIT
INTERNAL
UART TRANSMIT
INTERRUPT
UART TRANSMIT BIT SET BY PROGRAM;
CLEARED BY WRITE TO TRANSMIT
Figure 25. UART Port—Receive and Transmit Timing
Rev. E |
Page 37 of 64 |
September 2009
ADSP-BF561
Programmable Flags Cycle Timing
Table 29 and Figure 26 describe programmable flag operations.
Table 29. Programmable Flags Cycle Timing
Parameter
Timing Requirement
tWFI
Flag Input Pulse Width
Switching Characteristic
tDFO
Flag Output Delay from CLKOUT Low
Min
Max
tSCLK + 1
ns
6
CLKOUT
tDFO
PFx (OUTPUT)
FLAG OUTPUT
tWFI
PFx (INPUT)
FLAG INPUT
Figure 26. Programmable Flags Cycle Timing
Rev. E |
Page 38 of 64 |
September 2009
Unit
ns
ADSP-BF561
Timer Cycle Timing
Table 30 and Figure 27 describe timer expired operations. The
input signal is asynchronous in width capture mode and exter­
nal clock mode and has an absolute maximum input frequency
of fSCLK/2 MHz.
Table 30. Timer Cycle Timing
Parameter
Timing Characteristics
Timer Pulse Width Input Low1 (Measured in SCLK Cycles)
tWL
tWH
Timer Pulse Width Input High1 (Measured in SCLK Cycles)
Switching Characteristic
tHTO Timer Pulse Width Output2 (Measured in SCLK Cycles)
1
2
Min
Max
1
1
1
Unit
SCLK
SCLK
(232–1)
SCLK
The minimum pulse widths apply for TMRx input pins in width capture and external clock modes. They also apply to the PF1 or PPIxCLK input pins in PWM output mode.
The minimum time for tHTO is one cycle, and the maximum time for tHTO equals (232–1) cycles.
CLKOUT
tHTO
TMRx
(PWM OUTPUT MODE)
TMRx
(WIDTH CAPTURE AND
EXTERNAL CLOCK MODES)
tWL
tWH
Figure 27. Timer PWM_OUT Cycle Timing
Rev. E |
Page 39 of 64 |
September 2009
ADSP-BF561
JTAG Test and Emulation Port Timing
Table 31 and Figure 28 describe JTAG port operations.
Table 31. JTAG Port Timing
Parameter
Timing Parameters
tTCK
TCK Period
tSTAP
TDI, TMS Setup Before TCK High
tHTAP
TDI, TMS Hold After TCK High
tSSYS
System Inputs Setup Before TCK High1
tHSYS
System Inputs Hold After TCK High1
tTRSTW
TRST Pulse Width2 (Measured in TCK Cycles)
Switching Characteristics
tDTDO
TDO Delay from TCK Low
tDSYS
System Outputs Delay After TCK Low3
Min
Max
ns
ns
ns
ns
ns
TCK
20
4
4
4
5
4
0
1
Unit
10
12
ns
ns
System Inputs= DATA31–0, ARDY, PF47–0, PPI0CLK, PPI1CLK, RSCLK0–1, RFS0–1, DR0PRI, DR0SEC, TSCLK0–1, TFS0–1, DR1PRI, DR1SEC, MOSI, MISO, SCK, RX,
RESET, NMI0, NMI1, BMODE1–0, BR, and PPIxD7–0.
2
50 MHz maximum
3
System Outputs = DATA31–0, ADDR25–2, ABE3–0, AOE, ARE, AWE, AMS3–0, SRAS, SCAS, SWE, SCKE, CLKOUT, SA10, SMS3–0, PF47–0, RSCLK0–1, RFS0–1,
TSCLK0–1, TFS0–1, DT0PRI, DT0SEC, DT1PRI, DT1SEC, MOSI, MISO, SCK, TX, BG, BGH, and PPIxD7–0.
tTCK
TCK
tSTAP
tHTAP
TMS
TDI
tDTDO
TDO
tSSYS
tHSYS
SYSTEM
INPUTS
tDSYS
SYSTEM
OUTPUTS
Figure 28. JTAG Port Timing
Rev. E |
Page 40 of 64 |
September 2009
ADSP-BF561
OUTPUT DRIVE CURRENTS
150
150
VDDEXT = 2.75V
VDDEXT = 2.50V
VDDEXT = 2.25V
SOURCE CURRENT (mA)
100
VDDEXT = 2.75V
VDDEXT = 2.50V
VDDEXT = 2.25V
100
SOURCE CURRENT (mA)
Figure 29 through Figure 36 on Page 42 show typical current
voltage characteristics for the output drivers of the
ADSP-BF561 processor. The curves represent the current drive
capability of the output drivers as a function of output voltage.
Refer to Table 8 on Page 17 to identify the driver type for a pin.
50
0
VOH
–50
–100
VOL
50
–150
0
0
0.5
1.0
VOH
1.5
2.0
2.5
3.0
SOURCE VOLTAGE (V)
–50
Figure 31. Drive Current B (Low VDDEXT)
VOL
–100
150
–150
0
0.5
1.0
1.5
2.0
2.5
3.0
VDDEXT = 3.65V
VDDEXT = 2.95V
VDDEXT = 3.30V
100
Figure 29. Drive Current A (Low VDDEXT)
150
VDDEXT = 3.65V
VDDEXT = 3.30V
VDDEXT = 2.95V
100
SOURCE CURRENT (mA)
SOURCE VOLTAGE (V)
50
0
VOH
–50
VOL
–150
0
0
0.5
1.0
VOH
1.5
2.0
SOURCE VOLTAGE (V)
2.5
3.0
3.5
–50
Figure 32. Drive Current B (High VDDEXT)
–100
VOL
60
VDDEXT = 2.75V
VDDEXT = 2.50V
VDDEXT = 2.25V
–150
0
0.5
1.0
1.5
2.0
2.5
3.0
40
3.5
SOURCE VOLTAGE (V)
20
Figure 30. Drive Current A (High VDDEXT)
SOURCE CURRENT (mA)
SOURCE CURRENT (mA)
–100
50
0
VOH
–20
–40
VOL
–60
0
0.5
1.0
1.5
2.0
SOURCE VOLTAGE (V)
Figure 33. Drive Current C (Low VDDEXT)
Rev. E |
Page 41 of 64 |
September 2009
2.5
3.0
ADSP-BF561
POWER DISSIPATION
100
60
SOURCE CURRENT (mA)
Many operating conditions can affect power dissipation. System
designers should refer to Estimating Power for ADSP-BF561
Blackfin Processors (EE-293) on the Analog Devices website
(www.analog.com)—use site search on “EE-293.” This docu­
ment provides detailed information for optimizing your design
for lowest power.
VDDEXT = 3.65V
VDDEXT = 3.30V
VDDEXT = 2.95V
80
40
20
0
See the ADSP-BF561 Blackfin Processor Hardware Reference
Manual for definitions of the various operating modes and for
instructions on how to minimize system power.
VOH
–20
–40
VOL
–60
TEST CONDITIONS
–80
–100
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
SOURCE VOLTAGE (V)
Figure 34. Drive Current C (High VDDEXT)
All timing parameters appearing in this data sheet were mea­
sured under the conditions described in this section. Figure 37
shows the measurement point for ac measurements (except output enable/disable). The measurement point VMEAS is 1.5 V for
VDDEXT (nominal) = 2.5 V/3.3 V.
100
VDDEXT = 2.75V
VDDEXT = 2.50V
VDDEXT = 2.25V
80
SOURCE CURRENT (mA)
60
VMEAS
VMEAS
40
20
0
Figure 37. Voltage Reference Levels for AC
Measurements (Except Output Enable/Disable)
VOH
–20
–40
Output Enable Time Measurement
–60
VOL
–80
–100
0
0.5
1.0
1.5
2.0
2.5
3.0
Figure 35. Drive Current D (Low VDDEXT)
150
VDDEXT = 3.65V
VDDEXT = 3.30V
VDDEXT = 2.95V
100
Output pins are considered to be enabled when they have made
a transition from a high impedance state to the point when they
start driving.
The output enable time tENA is the interval from the point when a
reference signal reaches a high or low voltage level to the point
when the output starts driving as shown on the right side of
Figure 38 on Page 43.
SOURCE VOLTAGE (V)
SOURCE CURRENT (mA)
INPUT
OR
OUTPUT
50
The time tENA_MEASURED is the interval, from when the reference sig­
nal switches, to when the output voltage reaches VTRIP(high) or
VTRIP(low). VTRIP(high) is 2.0 V and VTRIP(low) is 1.0 V for VDDEXT
(nominal) = 2.5 V/3.3 V. Time tTRIP is the interval from when the
output starts driving to when the output reaches the VTRIP(high)
or VTRIP(low) trip voltage.
Time tENA is calculated as shown in the equation:
0
VOH
t ENA = t ENA_MEASURED – t TRIP
If multiple pins (such as the data bus) are enabled, the measure­
ment value is that of the first pin to start driving.
–50
VOL
–100
Output Disable Time Measurement
–150
0
0.5
1.0
1.5
2.0
SOURCE VOLTAGE (V)
2.5
3.0
3.5
Figure 36. Drive Current D (High VDDEXT)
Output pins are considered to be disabled when they stop driv­
ing, go into a high impedance state, and start to decay from their
output high or low voltage. The output disable time tDIS is the
difference between tDIS_MEASURED and tDECAY as shown on the left side
of Figure 38 on Page 43.
t DIS = t DIS_MEASURED – t DECAY
Rev. E |
Page 42 of 64 |
September 2009
ADSP-BF561
t DECAY = (C L ΔV) ⁄ I L
The time tDECAY is calculated with test loads CL and IL, and with
ΔV equal to 0.5 V for VDDEXT (nominal) = 2.5 V/3.3 V.
The time tDIS_MEASURED is the interval from when the reference sig­
nal switches, to when the output voltage decays ΔV from the
measured output high or output low voltage.
14
RISE AND FALL TIME ns (10% to 90%)
The time for the voltage on the bus to decay by ΔV is dependent
on the capacitive load CL and the load current IL. This decay time
can be approximated by the equation:
12
RISE TIME
10
6
4
Example System Hold Time Calculation
2
To determine the data output hold time in a particular system,
first calculate tDECAY using the equation given above. Choose ΔV
to be the difference between the ADSP-BF561 processor’s out­
put voltage and the input threshold for the device requiring the
hold time. CL is the total bus capacitance (per data line), and IL is
the total leakage or three-state current (per data line). The hold
time will be tDECAY plus the various output disable times as speci­
fied in the Timing Specifications on Page 23 (for example tDSDAT
for an SDRAM write cycle as shown in SDRAM Interface Tim­
ing on Page 26).
0
tDIS_MEASURED
tDIS
tENA_MEASURED
tENA
VOH
(MEASURED)
VOL
(MEASURED)
50
100
150
LOAD CAPACITANCE (pF)
200
250
12
10
RISE TIME
8
FALL TIME
6
4
2
VOH (MEASURED)
V
VOL (MEASURED) +
V
VOH(MEASURED)
VTRIP(HIGH)
VTRIP(LOW)
VOL (MEASURED)
tDECAY
0
0
50
100
150
LOAD CAPACITANCE (pF)
200
250
Figure 41. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver A at VDDEXT (max)
tTRIP
OUTPUT STOPS DRIVING
0
Figure 40. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver A at VDDEXT (min)
RISE AND FALL TIME ns (10% to 90%)
REFERENCE
SIGNAL
FALL TIME
8
OUTPUT STARTS DRIVING
Figure 38. Output Enable/Disable
Capacitive Loading
Output delays and holds are based on standard capacitive loads:
30 pF on all pins (see Figure 39). VLOAD is 1.5 V for VDDEXT (nomi­
nal) = 2.5 V/3.3 V. Figure 40 through Figure 47 on Page 44 show
how output rise time varies with capacitance. The delay and
hold specifications given should be derated by a factor derived
from these figures. The graphs in these figures may not be linear
outside the ranges shown.
RISE AND FALL TIME ns (10% to 90%)
12
HIGH IMPEDANCE STATE
10
RISE TIME
8
4
2
0
50 O
TO
OUTPUT
PIN
FALL TIME
6
0
VLOAD
50
100
150
LOAD CAPACITANCE (pF)
200
250
Figure 42. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver B at VDDEXT (min)
30pF
Figure 39. Equivalent Device Loading for AC Measurements
(Includes All Fixtures)
Rev. E |
Page 43 of 64 |
September 2009
ADSP-BF561
DDEXT
18
RISE AND FALL TIME ns (10% to 90%)
RISE AND FALL TIME ns (10% to 90%)
10
9
8
RISE TIME
7
6
FALL TIME
5
4
3
2
0
50
100
150
LOAD CAPACITANCE (pF)
200
10
FALL TIME
8
6
4
50
100
150
LOAD CAPACITANCE (pF)
200
RISE AND FALL TIME ns (10% to 90%)
RISE TIME
20
15
FALL TIME
10
5
12
RISE TIME
10
8
FALL TIME
6
4
2
50
100
150
LOAD CAPACITANCE (pF)
200
250
Figure 44. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver C at VDDEXT (min)
0
0
50
100
150
LOAD CAPACITANCE (pF)
200
ENVIRONMENTAL CONDITIONS
18
To determine the junction temperature on the application
printed circuit board use:
T J = T CASE + (Ψ JT × P D )
16
RISE TIME
14
250
Figure 47. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver D at VDDEXT (max)
20
where:
TJ = junction temperature (°C).
12
FALL TIME
10
TCASE = case temperature (°C) measured by customer at top
center of package.
8
6
ΨJT = from Table 32 on Page 45 through Table 34 on Page 45.
4
PD = power dissipation (see Power Dissipation on Page 42 for
the method to calculate PD).
2
0
250
14
25
0
0
0
Figure 46. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver D at VDDEXT (min)
30
RISE AND FALL TIME ns (10% to 90%)
RISE TIME
12
0
250
Figure 43. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver B at VDDEXT (max)
RISE AND FALL TIME ns (10% to 90%)
14
2
1
0
16
0
50
100
150
LOAD CAPACITANCE (pF)
200
250
Figure 45. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver C at VDDEXT (max)
Values of θJA are provided for package comparison and printed
circuit board design considerations. θJA can be used for a first
order approximation of TJ by the equation:
T J = T A + (θ JA × P D )
where:
TA = ambient temperature (°C).
Rev. E |
Page 44 of 64 |
September 2009
ADSP-BF561
In Table 32 through Table 34, airflow measurements comply
with JEDEC standards JESD51–2 and JESD51–6, and the junc­
tion-to-board measurement complies with JESD51–8. The
junction-to-case measurement complies with MIL-STD-883
(Method 1012.1). All measurements use a 2S2P JEDEC test
board.
Thermal resistance θJA in Table 32 through Table 34 is the figure
of merit relating to performance of the package and board in a
convective environment. θJMA represents the thermal resistance
under two conditions of airflow. θJB represents the heat
extracted from the periphery of the board. ΨJT represents the
correlation between TJ and TCASE. Values of θJB are provided for
package comparison and printed circuit board design
considerations.
Table 32. Thermal Characteristics for BC-256-4
(17 mm × 17 mm) Package
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJT
ΨJT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
18.1
15.9
15.1
3.72
0.11
0.18
0.18
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Table 33. Thermal Characteristics for BC-256-1
(12 mm × 12 mm) Package
Parameter
θJA
θJMA
θJMA
θJB
θJC
ΨJT
ΨJT
ΨJT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
25.6
22.4
21.6
18.9
4.85
0.15
n/a
n/a
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Table 34. Thermal Characteristics for B-297 Package
Parameter
θJA
θJMA
θJMA
θJB
θJC
ΨJT
ΨJT
ΨJT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
20.6
17.8
17.4
16.3
7.15
0.37
n/a
n/a
Rev. E |
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Page 45 of 64 |
September 2009
ADSP-BF561
256-BALL CSP_BGA (17 mm) BALL ASSIGNMENT
Table 35 lists the 256-Ball CSP_BGA (17 mm × 17 mm) ball
assignment by ball number. Table 36 on Page 48 lists the ball
assignment alphabetically by signal.
Table 35. 256-Ball CSP_BGA (17 mm × 17 mm) Ball Assignment (Numerically by Ball Number)
Ball No.
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
C1
C2
C3
C4
C5
C6
C7
C8
Signal
VDDEXT
ADDR22
ADDR18
ADDR14
ADDR11
AMS3
AMS0
ARDY
SMS2
SCLK0
SCLK1
ABE2
ABE3
ADDR06
ADDR03
VDDEXT
ADDR24
ADDR23
ADDR19
ADDR17
ADDR12
ADDR10
AMS1
AOE
SMS1
SCKE
BR
BG
ADDR08
ADDR05
ADDR02
DATA04
PPI0SYNC1
ADDR25
PPI0CLK
ADDR20
ADDR16
ADDR13
AMS2
ARE
Ball No.
C9
C10
C11
C12
C13
C14
C15
C16
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
D16
E1
E2
E3
E4
E5
E6
E7
E8
E9
E10
E11
E12
E13
E14
E15
E16
Signal
SMS3
SWE
SA10
ABE0
ADDR07
ADDR04
DATA0
DATA05
PPI0D15
PPI0SYNC3
PPI0SYNC2
ADDR21
ADDR15
ADDR09
AWE
SMS0
SRAS
SCAS
BGH
ABE1
DATA02
DATA01
DATA03
DATA07
PPI0D11
PPI0D13
PPI0D12
PPI0D14
PPI1CLK
VDDINT
GND
VDDINT
GND
VDDINT
GND
VDDINT
DATA06
DATA13
DATA09
DATA12
Ball No.
F1
F2
F3
F4
F5
F6
F7
F8
F9
F10
F11
F12
F13
F14
F15
F16
G1
G2
G3
G4
G5
G6
G7
G8
G9
G10
G11
G12
G13
G14
G15
G16
H1
H2
H3
H4
H5
H6
H7
H8
Rev. E |
Signal
CLKIN
PPI0D10
RESET
BYPASS
VDDEXT
VDDEXT
VDDEXT
GND
GND
VDDEXT
VDDEXT
VDDEXT
DATA11
DATA08
DATA10
DATA16
XTAL
VDDEXT
VDDEXT
GND
GND
VDDEXT
GND
GND
GND
GND
VDDEXT
VDDEXT
DATA17
DATA14
DATA15
DATA18
VROUT0
GND
GND
VDDINT
VDDINT
GND
GND
GND
Page 46 of 64 |
Ball No.
H9
H10
H11
H12
H13
H14
H15
H16
J1
J2
J3
J4
J5
J6
J7
J8
J9
J10
J11
J12
J13
J14
J15
J16
K1
K2
K3
K4
K5
K6
K7
K8
K9
K10
K11
K12
K13
K14
K15
K16
September 2009
Signal
GND
GND
GND
GND
GND
DATA21
DATA19
DATA23
VROUT1
PPI0D8
PPI0D7
PPI0D9
GND
GND
GND
GND
GND
GND
GND
VDDINT
VDDINT
DATA20
DATA22
DATA24
PPI0D6
PPI0D5
PPI0D4
PPI1SYNC3
VDDEXT
VDDEXT
GND
GND
GND
GND
VDDEXT
GND
GND
DATA26
DATA25
DATA27
Ball No.
L1
L2
L3
L4
L5
L6
L7
L8
L9
L10
L11
L12
L13
L14
L15
L16
M1
M2
M3
M4
M5
M6
M7
M8
M9
M10
M11
M12
M13
M14
M15
M16
N1
N2
N3
N4
N5
N6
N7
N8
Signal
PPI0D3
PPI0D2
PPI0D1
PPI0D0
VDDEXT
VDDEXT
VDDEXT
VDDEXT
GND
VDDEXT
VDDEXT
VDDEXT
NC
DT0PRI
DATA31
DATA28
PPI1SYNC2
PPI1D15
PPI1D14
PPI1D9
VDDINT
VDDINT
GND
VDDINT
GND
VDDINT
GND
VDDINT
RSCLK0
DR0PRI
TSCLK0
DATA29
PPI1SYNC1
PPI1D10
PPI1D7
PPI1D5
PF0
PF04
PF09
PF12
ADSP-BF561
Table 35. 256-Ball CSP_BGA (17 mm × 17 mm) Ball Assignment (Numerically by Ball Number) (Continued)
Ball No.
N9
N10
N11
N12
N13
N14
N15
N16
P1
P2
P3
P4
Signal
GND
BMODE1
BMODE0
RX
DR1SEC
DT1SEC
RFS0
DATA30
PPI1D13
PPI1D8
PPI1D6
PPI1D0
Ball No.
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
Signal
PF01
PF06
PF08
PF15
NMI1
TMS
NMI0
SCK
RFS1
TFS1
DR0SEC
DT0SEC
Ball No.
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
R11
R12
Rev. E |
Signal
PPI1D12
PPI1D11
PPI1D4
PPI1D1
PF02
PF07
PF11
PF14
TCK
TRST
SLEEP
MOSI
Page 47 of 64 |
Ball No.
R13
R14
R15
R16
T1
T2
T3
T4
T5
T6
T7
T8
September 2009
Signal
RSCLK1
TSCLK1
NC
TFS0
VDDEXT
NC
PPI1D3
PPI1D2
PF03
PF05
PF10
PF13
Ball No.
T9
T10
T11
T12
T13
T14
T15
T16
Signal
TDO
TDI
EMU
MISO
TX
DR1PRI
DT1PRI
VDDEXT
ADSP-BF561
Table 36. 256-Ball CSP_BGA (17 mm × 17 mm) Ball Assignment (Alphabetically by Signal)
Signal
ABE0
ABE1
ABE2
ABE3
ADDR02
ADDR03
ADDR04
ADDR05
ADDR06
ADDR07
ADDR08
ADDR09
ADDR10
ADDR11
ADDR12
ADDR13
ADDR14
ADDR15
ADDR16
ADDR17
ADDR18
ADDR19
ADDR20
ADDR21
ADDR22
ADDR23
ADDR24
ADDR25
AMS0
AMS1
AMS2
AMS3
AOE
ARDY
ARE
AWE
BG
BGH
BMODE0
BMODE1
Ball No.
C12
D12
A12
A13
B15
A15
C14
B14
A14
C13
B13
D6
B6
A5
B5
C6
A4
D5
C5
B4
A3
B3
C4
D4
A2
B2
B1
C2
A7
B7
C7
A6
B8
A8
C8
D7
B12
D11
N11
N10
Signal
BR
BYPASS
CLKIN
DATA0
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
DATA16
DATA17
DATA18
DATA19
DATA20
DATA21
DATA22
DATA23
DATA24
DATA25
DATA26
DATA27
DATA28
DATA29
DATA30
DATA31
DR0PRI
DR0SEC
DR1PRI
DR1SEC
DT0PRI
Ball No.
B11
F4
F1
C15
D14
D13
D15
B16
C16
E13
D16
F14
E15
F15
F13
E16
E14
G14
G15
F16
G13
G16
H15
J14
H14
J15
H16
J16
K15
K14
K16
L16
M16
N16
L15
M14
P15
T14
N13
L14
Signal
DT0SEC
DT1PRI
DT1SEC
EMU
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Rev. E |
Ball No.
P16
T15
N14
T11
E7
E9
E11
F8
F9
G4
G5
G7
G8
G9
G10
H2
H3
H6
H7
H8
H9
H10
H11
H12
H13
J5
J6
J7
J8
J9
J10
J11
K7
K8
K9
K10
K12
K13
L9
M7
Page 48 of 64 |
Signal
GND
GND
GND
MISO
MOSI
NC
NC
NC
NMI0
NMI1
PF0
PF01
PF02
PF03
PF04
PF05
PF06
PF07
PF08
PF09
PF10
PF11
PF12
PF13
PF14
PF15
PPI0CLK
PPI0D0
PPI0D1
PPI0D2
PPI0D3
PPI0D4
PPI0D5
PPI0D6
PPI0D7
PPI0D8
PPI0D9
PPI0D10
PPI0D11
PPI0D12
September 2009
Ball No.
M9
M11
N9
T12
R12
L13
R15
T2
P11
P9
N5
P5
R5
T5
N6
T6
P6
R6
P7
N7
T7
R7
N8
T8
R8
P8
C3
L4
L3
L2
L1
K3
K2
K1
J3
J2
J4
F2
E1
E3
Signal
PPI0D13
PPI0D14
PPI0D15
PPI0SYNC1
PPI0SYNC2
PPI0SYNC3
PPI1CLK
PPI1D0
PPI1D1
PPI1D2
PPI1D3
PPI1D4
PPI1D5
PPI1D6
PPI1D7
PPI1D8
PPI1D9
PPI1D10
PPI1D11
PPI1D12
PPI1D13
PPI1D14
PPI1D15
PPI1SYNC1
PPI1SYNC2
PPI1SYNC3
RESET
RFS0
RFS1
RSCLK0
RSCLK1
RX
SA10
SCAS
SCK
SCKE
SCLK0
SCLK1
SLEEP
SMS0
Ball No.
E2
E4
D1
C1
D3
D2
E5
P4
R4
T4
T3
R3
N4
P3
N3
P2
M4
N2
R2
R1
P1
M3
M2
N1
M1
K4
F3
N15
P13
M13
R13
N12
C11
D10
P12
B10
A10
A11
R11
D8
ADSP-BF561
Table 36. 256-Ball CSP_BGA (17 mm × 17 mm) Ball Assignment (Alphabetically by Signal) (Continued)
Signal
SMS1
SMS2
SMS3
SRAS
SWE
TCK
TDI
TDO
TFS0
TFS1
TMS
TRST
Ball No.
B9
A9
C9
D9
C10
R9
T10
T9
R16
P14
P10
R10
Signal
TSCLK0
TSCLK1
TX
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
Ball No.
M15
R14
T13
A1
A16
F5
F6
F7
F10
F11
F12
G2
Signal
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
Rev. E |
Ball No.
G3
G6
G11
G12
K5
K6
K11
L5
L6
L7
L8
L10
Page 49 of 64 |
Signal
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
September 2009
Ball No.
L11
L12
T1
T16
E6
E8
E10
E12
H4
H5
J12
J13
Signal
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VROUT0
VROUT1
XTAL
Ball No.
M5
M6
M8
M10
M12
H1
J1
G1
ADSP-BF561
Figure 48 lists the top view of the 256-Ball CSP_BGA
(17 mm × 17 mm) ball configuration. Figure 49 lists the bottom
view.
A1 BALL
PAD CORNER
A
KEY:
B
C
D
VDDINT
GND
NC
VDDEXT
I/O
VROUT
E
F
G
H
J
K
L
M
N
P
R
T
1
2
3
4
5
6
7
8
TOP VIEW
9
10
11
12
13
14
15
16
Figure 48. 256-Ball CSP_BGA Ball Configuration (Top View)
A1 BALL
PAD CORNER
A
KEY:
B
C
VDDINT
GND
NC
I/O
D
VDDEXT
VROUT
E
F
G
H
J
K
L
M
N
P
R
T
16
15
14
13
12
11
10 9
8
7
BOTTOM VIEW
6
5
4
3
2
1
Figure 49. 256-Ball CSP_BGA Ball Configuration (Bottom View)
Rev. E |
Page 50 of 64 |
September 2009
ADSP-BF561
256-BALL CSP_BGA (12 mm) BALL ASSIGNMENT
Table 37 lists the 256-Ball CSP_BGA (12 mm × 12 mm) ball
assignment by ball number. Table 38 on Page 53 lists the ball
assignment alphabetically by signal.
Table 37. 256-Ball CSP_BGA (12 mm × 12 mm) Ball Assignment (Numerically by Ball Number)
Ball No.
A01
A02
A03
A04
A05
A06
A07
A08
A09
A10
A11
A12
A13
A14
A15
A16
B01
B02
B03
B04
B05
B06
B07
B08
B09
B10
B11
B12
B13
B14
B15
B16
C01
C02
C03
C04
C05
C06
C07
C08
Signal
VDDEXT
ADDR24
ADDR20
VDDEXT
ADDR14
ADDR10
AMS3
AWE
VDDEXT
SMS3
SCLK0
SCLK1
BG
ABE2
ABE3
VDDEXT
PPI1CLK
ADDR22
ADDR18
ADDR16
ADDR12
VDDEXT
AMS1
ARE
SMS1
SCKE
VDDEXT
BR
ABE1
ADDR06
ADDR04
DATA0
PPI0SYNC2
PPI0CLK
ADDR25
ADDR19
GND
ADDR11
AOE
AMS0
Ball No.
C09
C10
C11
C12
C13
C14
C15
C16
D01
D02
D03
D04
D05
D06
D07
D08
D09
D10
D11
D12
D13
D14
D15
D16
E01
E02
E03
E04
E05
E06
E07
E08
E09
E10
E11
E12
E13
E14
E15
E16
Signal
SMS2
SRAS
GND
BGH
GND
ADDR07
DATA1
DATA3
PPI0D13
PPI0D15
PPI0SYNC3
ADDR23
GND
GND
ADDR09
GND
ARDY
SCAS
SA10
VDDEXT
ADDR02
GND
DATA5
DATA6
GND
PPI0D11
PPI0D12
PPI0SYNC1
ADDR15
ADDR13
AMS2
VDDINT
SMS0
SWE
ABE0
DATA2
GND
DATA4
DATA7
VDDEXT
Rev. E |
Ball No.
F01
F02
F03
F04
F05
F06
F07
F08
F09
F10
F11
F12
F13
F14
F15
F16
G01
G02
G03
G04
G05
G06
G07
G08
G09
G10
G11
G12
G13
G14
G15
G16
H01
H02
H03
H04
H05
H06
H07
H08
Signal
CLKIN
VDDEXT
RESET
PPI0D10
ADDR21
ADDR17
VDDINT
GND
VDDINT
GND
ADDR08
DATA10
DATA8
DATA12
DATA9
DATA11
XTAL
GND
VDDEXT
BYPASS
PPI0D14
GND
GND
GND
VDDINT
ADDR05
ADDR03
DATA15
DATA14
GND
DATA13
VDDEXT
GND
GND
PPI0D9
PPI0D7
PPI0D5
VDDINT
VDDINT
GND
Page 51 of 64 |
Ball No.
H09
H10
H11
H12
H13
H14
H15
H16
J01
J02
J03
J04
J05
J06
J07
J08
J09
J10
J11
J12
J13
J14
J15
J16
K01
K02
K03
K04
K05
K06
K07
K08
K09
K10
K11
K12
K13
K14
K15
K16
September 2009
Signal
GND
GND
VDDINT
DATA16
DATA18
DATA20
DATA17
DATA19
VROUT0
VROUT1
PPI0D2
PPI0D3
PPI0D1
VDDEXT
GND
VDDINT
VDDINT
VDDINT
GND
DATA30
DATA22
GND
DATA21
DATA23
PPI0D6
PPI0D4
PPI0D8
PPI1SYNC1
PPI1D14
VDDEXT
GND
VDDINT
GND
GND
VDDINT
DATA28
DATA26
DATA24
DATA25
VDDEXT
Ball No.
L01
L02
L03
L04
L05
L06
L07
L08
L09
L10
L11
L12
L13
L14
L15
L16
M01
M02
M03
M04
M05
M06
M07
M08
M09
M10
M11
M12
M13
M14
M15
M16
N01
N02
N03
N04
N05
N06
N07
N08
Signal
PPI0D0
PPI1SYNC2
GND
PPI1SYNC3
VDDEXT
PPI1D11
GND
VDDINT
GND
VDDEXT
GND
DR0PRI
TFS0
GND
DATA27
DATA29
PPI1D15
PPI1D13
PPI1D9
GND
NC
PF3
PF7
VDDINT
GND
BMODE0
SCK
DR1PRI
NC
VDDEXT
DATA31
DT0PRI
PPI1D12
PPI1D10
PPI1D3
PPI1D1
PF1
PF9
GND
PF13
ADSP-BF561
Table 37. 256-Ball CSP_BGA (12 mm × 12 mm) Ball Assignment (Numerically by Ball Number) (Continued)
Ball No.
N09
N10
N11
N12
N13
N14
N15
N16
P01
P02
P03
P04
Signal
TDO
BMODE1
MOSI
GND
RFS1
GND
DT0SEC
TSCLK0
PPI1D8
GND
PPI1D5
PF0
Ball No.
P05
P06
P07
P08
P09
P10
P11
P12
P13
P14
P15
P16
Signal
GND
PF5
PF11
PF15
GND
TRST
NMI0
GND
RSCLK1
TFS1
RSCLK0
DR0SEC
Ball No.
R01
R02
R03
R04
R05
R06
R07
R08
R09
R10
R11
R12
Rev. E |
Signal
PPI1D7
PPI1D6
PPI1D2
PPI1D0
PF4
PF8
PF10
PF14
NMI1
TDI
EMU
MISO
Page 52 of 64 |
Ball No.
R13
R14
R15
R16
T01
T02
T03
T04
T05
T06
T07
T08
September 2009
Signal
TX/PF26
TSCLK1
DT1PRI
RFS0
VDDEXT
PPI1D4
VDDEXT
PF2
PF6
VDDEXT
PF12
VDDEXT
Ball No.
T09
T10
T11
T12
T13
T14
T15
T16
Signal
TCK
TMS
SLEEP
VDDEXT
RX/PF27
DR1SEC
DT1SEC
VDDEXT
ADSP-BF561
Table 38. 256-Ball CSP_BGA (12 mm × 12 mm) Ball Assignment (Alphabetically by Signal)
Signal
ABE0
ABE1
ABE2
ABE3
ADDR02
ADDR03
ADDR04
ADDR05
ADDR06
ADDR07
ADDR08
ADDR09
ADDR10
ADDR11
ADDR12
ADDR13
ADDR14
ADDR15
ADDR16
ADDR17
ADDR18
ADDR19
ADDR20
ADDR21
ADDR22
ADDR23
ADDR24
ADDR25
AMS0
AMS1
AMS2
AMS3
AOE
ARDY
ARE
AWE
BG
BGH
BMODE0
BMODE1
Ball No.
E11
B13
A14
A15
D13
G11
B15
G10
B14
C14
F11
D07
A06
C06
B05
E06
A05
E05
B04
F06
B03
C04
A03
F05
B02
D04
A02
C03
C08
B07
E07
A07
C07
D09
B08
A08
A13
C12
M10
N10
Signal
BR
BYPASS
CLKIN
DATA0
DATA1
DATA2
DATA3
DATA4
DATA5
DATA6
DATA7
DATA8
DATA9
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
DATA16
DATA17
DATA18
DATA19
DATA20
DATA21
DATA22
DATA23
DATA24
DATA25
DATA26
DATA27
DATA28
DATA29
DATA30
DATA31
DR0PRI
DR0SEC
DR1PRI
DR1SEC
DT0PRI
Rev. E |
Ball No.
B12
G04
F01
B16
C15
E12
C16
E14
D15
D16
E15
F13
F15
F12
F16
F14
G15
G13
G12
H12
H15
H13
H16
H14
J15
J13
J16
K14
K15
K13
L15
K12
L16
J12
M15
L12
P16
M12
T14
M16
Signal
DT0SEC
DT1PRI
DT1SEC
EMU
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Page 53 of 64 |
September 2009
Ball No.
N15
R15
T15
R11
C05
C11
C13
D05
D06
D08
D14
E01
E13
F08
F10
G02
G06
G07
G08
G14
H01
H02
H08
H09
H10
J07
J11
J14
K07
K09
K10
L03
L07
L09
L11
L14
M04
M09
N07
N12
Signal
GND
GND
GND
GND
GND
MISO
MOSI
NC
NC
NMI0
NMI1
PF0
PF1
PF2
PF3
PF4
PF5
PF6
PF7
PF8
PF9
PF10
PF11
PF12
PF13
PF14
PF15
PPI0CLK
PPI0D0
PPI0D1
PPI0D2
PPI0D3
PPI0D4
PPI0D5
PPI0D6
PPI0D7
PPI0D8
PPI0D9
PPI0D10
PPI0D11
Ball No.
N14
P02
P05
P09
P12
R12
N11
M05
M13
P11
R09
P04
N05
T04
M06
R05
P06
T05
M07
R06
N06
R07
P07
T07
N08
R08
P08
C02
L01
J05
J03
J04
K02
H05
K01
H04
K03
H03
F04
E02
ADSP-BF561
Table 38. 256-Ball CSP_BGA (12 mm × 12 mm) Ball Assignment (Alphabetically by Signal) (Continued)
Signal
PPI0D12
PPI0D13
PPI0D14
PPI0D15
PPI0SYNC1
PPI0SYNC2
PPI0SYNC3
PPI1CLK
PPI1D0
PPI1D1
PPI1D2
PPI1D3
PPI1D4
PPI1D5
PPI1D6
PPI1D7
PPI1D8
PPI1D9
PPI1D10
PPI1D11
PPI1D12
PPI1D13
PPI1D14
PPI1D15
Ball No.
E03
D01
G05
D02
E04
C01
D03
B01
R04
N04
R03
N03
T02
P03
R02
R01
P01
M03
N02
L06
N01
M02
K05
M01
Signal
PPI1SYNC1
PPI1SYNC2
PPI1SYNC3
RESET
RFS0
RFS1
RSCLK0
RSCLK1
RX
SA10
SCAS
SCK
SCKE
SCLK0
SCLK1
SLEEP
SMS0
SMS1
SMS2
SMS3
SRAS
SWE
TCK
TDI
Rev. E |
Ball No.
K04
L02
L04
F03
R16
N13
P15
P13
T13
D11
D10
M11
B10
A11
A12
T11
E09
B09
C09
A10
C10
E10
T09
R10
Signal
TDO
TFS0
TFS1
TMS
TRST
TSCLK0
TSCLK1
TX/PF26
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
Page 54 of 64 |
September 2009
Ball No.
N09
L13
P14
T10
P10
N16
R14
R13
A01
A04
A09
A16
B06
B11
D12
E16
F02
G03
G16
J06
K06
K16
L05
L10
Signal
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VROUT0
VROUT1
XTAL
Ball No.
M14
T01
T03
T06
T08
T12
T16
E08
F07
F09
G09
H06
H07
H11
J08
J09
J10
K08
K11
L08
M08
J01
J02
G01
ADSP-BF561
Figure 50 lists the top view of the 256-Ball CSP_BGA (12 mm ×
12 mm) ball configuration. Figure 51 lists the bottom view.
A1 BALL
PAD CORNER
A
KEY:
B
C
D
VDDINT
GND
NC
VDDEXT
I/O
VROUT
E
F
G
H
J
K
L
M
N
P
R
T
1
2
3
4
5
6
7
8
TOP VIEW
9
10
11
12
13
14
15
16
Figure 50. 256-Ball CSP_BGA Ball Configuration (Top View)
A1 BALL
PAD CORNER
A
KEY:
B
C
VDDINT
GND
NC
I/O
D
VDDEXT
VROUT
E
F
G
H
J
K
L
M
N
P
R
T
16
15
14
13
12
11
10 9
8
7
BOTTOM VIEW
6
5
4
3
2
1
Figure 51. 256-Ball CSP_BGA Ball Configuration (Bottom View)
Rev. E |
Page 55 of 64 |
September 2009
ADSP-BF561
297-BALL PBGA BALL ASSIGNMENT
Table 39 lists the 297-Ball PBGA ball assignment numerically by
ball number. Table 40 on Page 58 lists the ball assignment
alphabetically by signal.
Table 39. 297-Ball PBGA Ball Assignment (Numerically by Ball Number)
Ball No.
A01
A02
A03
A04
A05
A06
A07
A08
A09
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A26
B01
B02
B03
B04
B05
B06
B07
B08
B09
B10
B11
B12
B13
B14
Signal
GND
ADDR25
ADDR23
ADDR21
ADDR19
ADDR17
ADDR15
ADDR13
ADDR11
ADDR09
AMS3
AMS1
AWE
ARE
SMS0
SMS2
SRAS
SCAS
SCLK0
SCLK1
BGH
ABE0
ABE2
ADDR08
ADDR06
GND
PPI1CLK
GND
ADDR24
ADDR22
ADDR20
ADDR18
ADDR16
ADDR14
ADDR12
ADDR10
AMS2
AMS0
AOE
ARDY
Ball No.
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
B25
B26
C01
C02
C03
C04
C05
C22
C23
C24
C25
C26
D01
D02
D03
D04
D23
D24
D25
D26
E01
E02
E03
E24
E25
E26
F01
F02
F25
F26
Signal
SMS1
SMS3
SCKE
SWE
SA10
BR
BG
ABE1
ABE3
ADDR07
GND
ADDR05
PPI0SYNC3
PPI0CLK
GND
GND
GND
GND
GND
GND
ADDR04
ADDR03
PPI0SYNC1
PPI0SYNC2
GND
GND
GND
GND
ADDR02
DATA1
PPI0D15
PPI0D14
GND
GND
DATA0
DATA3
PPI0D13
PPI0D12
DATA2
DATA5
Rev. E |
Ball No.
G01
G02
G25
G26
H01
H02
H25
H26
J01
J02
J10
J11
J12
J13
J14
J15
J16
J17
J18
J25
J26
K01
K02
K10
K11
K12
K13
K14
K15
K16
K17
K18
K25
K26
L01
L02
L10
L11
L12
L13
Page 56 of 64 |
Signal
PPI0D11
PPI0D10
DATA4
DATA7
BYPASS
RESET
DATA6
DATA9
CLKIN
GND
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDINT
VDDINT
VDDINT
DATA8
DATA11
XTAL
NC
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDINT
VDDINT
VDDINT
DATA10
DATA13
NC
NC
VDDEXT
GND
GND
GND
September 2009
Ball No.
L14
L15
L16
L17
L18
L25
L26
M01
M02
M10
M11
M12
M13
M14
M15
M16
M17
M18
M25
M26
N01
N02
N10
N11
N12
N13
N14
N15
N16
N17
N18
N25
N26
P01
P02
P10
P11
P12
P13
P14
Signal
GND
GND
GND
GND
VDDINT
DATA12
DATA15
VROUT0
GND
VDDEXT
GND
GND
GND
GND
GND
GND
GND
VDDINT
DATA14
DATA17
VROUT1
PPI0D9
VDDEXT
GND
GND
GND
GND
GND
GND
GND
VDDINT
DATA16
DATA19
PPI0D7
PPI0D8
VDDEXT
GND
GND
GND
GND
ADSP-BF561
Table 39. 297-Ball PBGA Ball Assignment (Numerically by Ball Number) (Continued)
Ball No.
P15
P16
P17
P18
P25
P26
R01
R02
R10
R11
R12
R13
R14
R15
R16
R17
R18
R25
R26
T01
T02
T10
T11
T12
T13
T14
T15
T16
T17
T18
T25
T26
U01
U02
U10
Signal
GND
GND
GND
VDDINT
DATA18
DATA21
PPI0D5
PPI0D6
VDDEXT
GND
GND
GND
GND
GND
GND
GND
VDDINT
DATA20
DATA23
PPI0D3
PPI0D4
VDDEXT
GND
GND
GND
GND
GND
GND
GND
VDDINT
DATA22
DATA25
PPI0D1
PPI0D2
VDDEXT
Ball No.
U11
U12
U13
U14
U15
U16
U17
U18
U25
U26
V01
V02
V25
V26
W01
W02
W25
W26
Y01
Y02
Y25
Y26
AA01
AA02
AA25
AA26
AB01
AB02
AB03
AB24
AB25
AB26
AC01
AC02
AC03
Signal
VDDEXT
VDDEXT
VDDEXT
GND
VDDINT
VDDINT
VDDINT
VDDINT
DATA24
DATA27
PPI1SYNC3
PPI0D0
DATA26
DATA29
PPI1SYNC1
PPI1SYNC2
DATA28
DATA31
PPI1D15
PPI1D14
DATA30
DT0PRI
PPI1D13
PPI1D12
DT0SEC
TSCLK0
PPI1D11
PPI1D10
GND
GND
TFS0
DR0PRI
PPI1D9
PPI1D8
GND
Rev. E |
Ball No.
AC04
AC23
AC24
AC25
AC26
AD01
AD02
AD03
AD04
AD05
AD22
AD23
AD24
AD25
AD26
AE01
AE02
AE03
AE04
AE05
AE06
AE07
AE08
AE09
AE10
AE11
AE12
AE13
AE14
AE15
AE16
AE17
AE18
AE19
AE20
Page 57 of 64 |
Signal
GND
GND
GND
DR0SEC
RFS0
PPI1D7
PPI1D6
GND
GND
GND
GND
GND
GND
NC
RSCLK0
PPI1D5
GND
PPI1D3
PPI1D1
PF0
PF2
PF4
PF6
PF8
PF10
PF12
PF14
NC
TDO
TRST
EMU
BMODE1
BMODE0
MISO
MOSI
September 2009
Ball No.
AE21
AE22
AE23
AE24
AE25
AE26
AF01
AF02
AF03
AF04
AF05
AF06
AF07
AF08
AF09
AF10
AF11
AF12
AF13
AF14
AF15
AF16
AF17
AF18
AF19
AF20
AF21
AF22
AF23
AF24
AF25
AF26
Signal
RX
RFS1
DR1SEC
TFS1
GND
NC
GND
PPI1D4
PPI1D2
PPI1D0
PF1
PF3
PF5
PF7
PF9
PF11
PF13
PF15
NMI1
TCK
TDI
TMS
SLEEP
NMI0
SCK
TX
RSCLK1
DR1PRI
TSCLK1
DT1SEC
DT1PRI
GND
ADSP-BF561
Table 40. 297-Ball PBGA Ball Assignment (Alphabetically by Signal)
Signal
ABE0
ABE1
ABE2
ABE3
ADDR02
ADDR03
ADDR04
ADDR05
ADDR06
ADDR07
ADDR08
ADDR09
ADDR10
ADDR11
ADDR12
ADDR13
ADDR14
ADDR15
ADDR16
ADDR17
ADDR18
ADDR19
ADDR20
ADDR21
ADDR22
ADDR23
ADDR24
ADDR25
AMS0
AMS1
AMS2
AMS3
AOE
ARDY
ARE
AWE
BG
BGH
BMODE0
BMODE1
Ball No.
A22
B22
A23
B23
D25
C26
C25
B26
A25
B24
A24
A10
B10
A09
B09
A08
B08
A07
B07
A06
B06
A05
B05
A04
B04
A03
B03
A02
B12
A12
B11
A11
B13
B14
A14
A13
B21
A21
AE18
AE17
Signal
BR
BYPASS
CLKIN
DATA0
DATA1
DATA2
DATA3
DATA4
DATA5
DATA6
DATA7
DATA8
DATA9
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
DATA16
DATA17
DATA18
DATA19
DATA20
DATA21
DATA22
DATA23
DATA24
DATA25
DATA26
DATA27
DATA28
DATA29
DATA30
DATA31
DR0PRI
DR0SEC
DR1PRI
DR1SEC
DT0PRI
Ball No.
B20
H01
J01
E25
D26
F25
E26
G25
F26
H25
G26
J25
H26
K25
J26
L25
K26
M25
L26
N25
M26
P25
N26
R25
P26
T25
R26
U25
T26
V25
U26
W25
V26
Y25
W26
AB26
AC25
AF22
AE23
Y26
Rev. E |
Page 58 of 64 |
Signal
DT0SEC
DT1PRI
DT1SEC
EMU
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
September 2009
Ball No.
AA25
AF25
AF24
AE16
A01
A26
B02
B25
C03
C04
C05
C22
C23
C24
D03
D04
D23
D24
E03
E24
J02
L11
L12
L13
L14
L15
L16
L17
M02
M11
M12
M13
M14
M15
M16
M17
N11
N12
N13
N14
Signal
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Ball No.
N15
N16
N17
P11
P12
P13
P14
P15
P16
P17
R11
R12
R13
R14
R15
R16
R17
T11
T12
T13
T14
T15
T16
T17
U14
AB03
AB24
AC03
AC04
AC23
AC24
AD03
AD04
AD05
AD22
AD23
AD24
AE02
AE25
AF01
ADSP-BF561
Table 40. 297-Ball PBGA Ball Assignment (Alphabetically by Signal) (Continued)
Signal
GND
MISO
MOSI
NC
NC
NC
NC
NC
NC
NMI0
NMI1
PF0
PF1
PF2
PF3
PF4
PF5
PF6
PF7
PF8
PF9
PF10
PF11
PF12
PF13
PF14
PF15
PPI0CLK
PPI0D0
PPI0D1
PPI0D2
PPI0D3
PPI0D4
PPI0D5
PPI0D6
Ball No.
AF26
AE19
AE20
K02
L01
L02
AD25
AE13
AE26
AF18
AF13
AE05
AF05
AE06
AF06
AE07
AF07
AE08
AF08
AE09
AF09
AE10
AF10
AE11
AF11
AE12
AF12
C02
V02
U01
U02
T01
T02
R01
R02
Signal
PPI0D7
PPI0D8
PPI0D9
PPI0D10
PPI0D11
PPI0D12
PPI0D13
PPI0D14
PPI0D15
PPI0SYNC1
PPI0SYNC2
PPI0SYNC3
PPI1CLK
PPI1D0
PPI1D1
PPI1D2
PPI1D3
PPI1D4
PPI1D5
PPI1D6
PPI1D7
PPI1D8
PPI1D9
PPI1D10
PPI1D11
PPI1D12
PPI1D13
PPI1D14
PPI1D15
PPI1SYNC1
PPI1SYNC2
PPI1SYNC3
RESET
RFS0
RFS1
Ball No.
P01
P02
N02
G02
G01
F02
F01
E02
E01
D01
D02
C01
B01
AF04
AE04
AF03
AE03
AF02
AE01
AD02
AD01
AC02
AC01
AB02
AB01
AA02
AA01
Y02
Y01
W01
W02
V01
H02
AC26
AE22
Rev. E |
Page 59 of 64 |
Signal
RSCLK0
RSCLK1
RX
SA10
SCAS
SCK
SCKE
SCLK0
SCLK1
SLEEP
SMS0
SMS1
SMS2
SMS3
SRAS
SWE
TCK
TDI
TDO
TFS0
TFS1
TMS
TRST
TSCLK0
TSCLK1
TX/PF26
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
September 2009
Ball No.
AD26
AF21
AE21
B19
A18
AF19
B17
A19
A20
AF17
A15
B15
A16
B16
A17
B18
AF14
AF15
AE14
AB25
AE24
AF16
AE15
AA26
AF23
AF20
J10
J11
J12
J13
J14
J15
K10
K11
K12
Signal
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDEXT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VDDINT
VROUT0
VROUT1
XTAL
Ball No.
K13
K14
K15
L10
M10
N10
P10
R10
T10
U10
U11
U12
U13
J16
J17
J18
K16
K17
K18
L18
M18
N18
P18
R18
T18
U15
U16
U17
U18
M01
N01
K01
ADSP-BF561
Figure 52 lists the top view of the 297-Ball PBGA ball configura­
tion. Figure 53 lists the bottom view.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
KEY:
VDDINT
GND
NC
VDDEXT
I/O
VROUT
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
TOP VIEW
Figure 52. 297-Ball PBGA Ball Configuration (Top View)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
KEY:
V
DDINT
VDDEXT
GND
NC
I/O
VROUT
26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
BOTTOM VIEW
Figure 53. 297-Ball PBGA Ball Configuration (Bottom View)
Rev. E |
Page 60 of 64 |
September 2009
ADSP-BF561
OUTLINE DIMENSIONS
Dimensions in the outline dimension figures are shown in
millimeters.
15.00 BSC SQ
17.00 BSC SQ
A1 BALL
PAD CORNER
1.00 BSC
BALL PITCH
A1 BALL
PAD CORNER
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
TOP VIEW
16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
BOTTOM VIEW
1.90*
1.76
1.61
SIDE VIEW
DETAIL A
0.20 MAX
COPLANARITY
*NOTES
1. COMPLIES WITH JEDEC REGISTERED OUTLINE
MO-192-AAF-1, WITH EXCEPTION TO PACKAGE HEIGHT.
2. MINIMUM BALL HEIGHT 0.45
0.45 MIN
0.70
0.60
0.50
BALL
DIAMETER
DETAIL A
Figure 54. 256-Ball Chip Scale Package Ball Grid Array (CSP_BGA) (BC-256-4)
Rev. E |
Page 61 of 64 |
September 2009
SEATING PLANE
ADSP-BF561
12.10
12.00 SQ
11.90
16
15
14
13
12
11
10
9
8
A1 CORNER
INDEX AREA
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
BALL A1
INDICATOR
9.75
BSC SQ
TOP VIEW
0.65
BSC
BOTTOM VIEW
DETAIL A
*1.70
1.51
1.36
DETAIL A
*1.31
1.21
1.10
*0.30 NOM
0.25 MIN
0.45
COPLANARITY
0.40
0.10 MAX
0.35
BALL DIAMETER
SEATING
PLANE
*COMPLIANT TO JEDEC STANDARDS MO-225 WITH EXCEPTION
TO DIMENSIONS INDICATED BY AN ASTERISK.
Figure 55. 256-Ball Chip Scale Package Ball Grid Array (CSP_BGA) (BC-256-1)
27.20
27.00 SQ
26.80
A1 CORNER
INDEX AREA
26 24 22 20 18 16 14 12 10 8
6
4
2
3
9
5
25 23 21 19 17 15 13 11
1
7
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
A1 BALL
PAD CORNER
BOTTOM VIEW
24.20
24.00 SQ
23.80
25.00
BSC SQ
TOP VIEW
1.00
BSC
2.43
2.23
2.03
8.00
BSC SQ
DETAIL A
1.22
1.17
1.12
DETAIL A
0.61
0.56
0.51
0.50 NOM
0.40 MIN
0.70
0.60
0.50
BALL DIAMETER
COMPLIANT TO JEDEC STANDARDS MS-034-AAL-1
Figure 56. 297-Ball Plastic Ball Grid Array (PBGA) (B-297)
Rev. E |
Page 62 of 64 |
September 2009
COPLANARITY
0.20 MAX
SEATING
PLANE
ADSP-BF561
SURFACE-MOUNT DESIGN
Table 41 is provided as an aid to PCB design. For industrystandard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 41. BGA Data for Use with Surface-Mount Design
Package
256-Ball CSP_BGA (BC-256-1)
256-Ball CSP_BGA (BC-256-4)
297-Ball PBGA (B-297)
Ball Attach Type
Solder Mask Defined
Solder Mask Defined
Solder Mask Defined
Solder Mask Opening
0.30 mm diameter
0.43 mm diameter
0.43 mm diameter
Ball Pad Size
0.43 mm diameter
0.55 mm diameter
0.58 mm diameter
AUTOMOTIVE PRODUCTS
Some ADSP-BF561 models are available for automotive appli­
cations with controlled manufacturing. Note that these special
models may have specifications that differ from the general
release models.
The automotive grade products shown in Table 42 are available
for use in automotive applications. Contact your local ADI
account representative or authorized ADI product distributor
for specific product ordering information. Note that all automo­
tive products are RoHS compliant.
Table 42. Automotive Products
Product Family1
ADBF561WBBZ5xx
ADBF561WBBCZ5xx
Temperature
Range2
–40°C to +85°C
–40°C to +85°C
Speed Grade
(Max)3
533 MHz
533 MHz
Package Description
297-Ball PBGA
256-Ball CSP_BGA
Package
Option
B-297
BC-256-4
1
xx denotes silicon revision.
Referenced temperature is ambient temperature.
3
The internal voltage regulation feature is not available. External voltage regulation is required to ensure correct operation.
2
ORDERING GUIDE
Model
ADSP-BF561SKBCZ-6V2
ADSP-BF561SKBCZ-5V2
ADSP-BF561SKBCZ5002
ADSP-BF561SKB500
ADSP-BF561SKB600
ADSP-BF561SKBZ5002
ADSP-BF561SKBZ6002
ADSP-BF561SBB600
ADSP-BF561SBB500
ADSP-BF561SBBZ6002
ADSP-BF561SBBZ5002
ADSP-BF561SKBCZ-6A2
ADSP-BF561SKBCZ-5A2
ADSP-BF561SBBCZ-5A2
1
2
Temperature
Range1
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
Speed Grade (Max)
600 MHz
533 MHz
500 MHz
500 MHz
600 MHz
500 MHz
600 MHz
600 MHz
500 MHz
600 MHz
500 MHz
600 MHz
500 MHz
500 MHz
Package Description
256-Ball CSP_BGA
256-Ball CSP_BGA
256-Ball CSP_BGA
297-Ball PBGA
297-Ball PBGA
297-Ball PBGA
297-Ball PBGA
297-Ball PBGA
297-Ball PBGA
297-Ball PBGA
297-Ball PBGA
256-Ball CSP_BGA
256-Ball CSP_BGA
256-Ball CSP_BGA
Referenced temperature is ambient temperature.
Z = RoHS compliant part.
Rev. E |
Page 63 of 64 |
September 2009
Package
Option
BC-256-1
BC-256-1
BC-256-1
B-297
B-297
B-297
B-297
B-297
B-297
B-297
B-297
BC-256-4
BC-256-4
BC-256-4
ADSP-BF561
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04696-0-9/09(E)
Rev. E |
Page 64 of 64 |
September 2009