To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
1.
2.
3.
4.
5.
6.
7.
All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
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of Renesas Electronics or others.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
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When exporting the products or technology described in this document, you should comply with the applicable export control
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“Standard”:
8.
9.
10.
11.
12.
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
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User’s Manual
8
The revision list can be viewed directly by
clicking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
H8/3644 Group, H8/3644R Group
H8/3644 F-ZTATTM, H8/3643 F-ZTATTM,
H8/3642A F-ZTATTM
Hardware Manual
Renesas 8-Bit Single-Chip Microcomputer
H8 Family/H8/300L Series
H8/3644
H8/3643
H8/3642
H8/3641
H8/3640
HD6473644
H8/3644R
HD6433644
HD64F3644
HD6433643
H8/3643R
HD64F3643
HD6433642
H8/3642R
HD64F3642A
HD6433641
H8/3641R
HD6433640
H8/3640R
HD6473644R
HD6433644R
HD6433643R
HD6433642R
HD6433641R
HD6433640R
Rev.6.00 2006.09
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any thirdparty's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
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Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or
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6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must
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Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
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contained therein.
Rev. 6.00 Sep 12, 2006 page ii of xx
General Precautions on Handling of Product
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a passthrough current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product’s state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI immediately
after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these addresses. Do not access these registers; the system’s
operation is not guaranteed if they are accessed.
Rev. 6.00 Sep 12, 2006 page iii of xx
Rev. 6.00 Sep 12, 2006 page iv of xx
Preface
The H8/300L Series of single-chip microcomputers has the high-speed H8/300L CPU at its core,
with many necessary peripheral functions on-chip. The H8/300L CPU instruction set is compatible
with the H8/300 CPU.
The H8/3644 Group has a system-on-a-chip architecture that includes such peripheral functions as
a D/A converter, five timers, a 14-bit PWM, a two-channel serial communication interface, and an
A/D converter. This makes it ideal for use in advanced control systems.
This manual describes the hardware of the H8/3644 Group. For details on the H8/3644 Group
instruction set, refer to the H8/300L Series Programming Manual.
Rev. 6.00 Sep 12, 2006 page v of xx
Rev. 6.00 Sep 12, 2006 page vi of xx
Main Revisions in This Edition
Item
Page
Revision (See Manual for Details)
All
—
• Notification of change in company name amended
(Before) Hitachi, Ltd. → (After) Renesas Technology Corp.
• Product naming convention amended
(Before) H8/3644 Series → (After) H8/3644 Group
(Before) H8/3644R Series → (After) H8/3644R Group
3.3.2 Interrupt Control 64
Registers
Interrupt Edge Select
Register 2 (IEGR2)
6.2.2
Memory Map
Description amended
IEGR2 is an 8-bit read/write register, used to designate whether pins INT7 to INT0, and TMIB are
set to rising edge sensing or falling edge sensing. Upon reset, IEGR2 is initialized to H'00.
Bit 7INT7 Edge Select (INTEG7): Bit 7 selects the input sensing of the INT7 pin.
Bit 7: INTEG7
Description
0
Falling edge of INT7 pin input is detected
1
Rising edge of INT7 pin input is detected
(initial value)
102, 103 Description of socket adapter deleted
Table 6.2 Socket
Adapter
Figure 6.2 Socket
Adapter Pin
Correspondence
(ZTAT)
6.8.2
Memory Map
149, 151 Description of socket adapter deleted
Table 6.14 Socket
Adapter Product
Codes
Figure 6.19 Socket
Adapter Pin
Correspondence
(F-ZTAT)
6.9 Flash Memory
Programming and
Erasing Precautions
165
Table amended
Item
4
Flash memory read setup time*
Symbol
Min
Typ
Max
Unit
Test Conditions
tFRS
50
µs
VCC ≥ 4.5 V
100
Table 6.18 Flash
Memory AC
Characteristics
8.4.2 Register
Configuration and
Description
Port Mode Register 7
(PMR7)
182
VCC < 4.5 V
Bit table amended
Bit
7
6
5
4
3
2
1
TXD
0
POF1
Initial value
1
1
1
1
1
0
0
0
Read/Write
R/W
R/W
Rev. 6.00 Sep 12, 2006 page vii of xx
Item
Page
Revision (See Manual for Details)
10.2.2 Register
Descriptions
281
Description amended
SCSR1 is an 8-bit register indicating operation status and
error status.
Serial Control/Status
Register 1 (SCSR1)
10.3.1 Overview
291
Figure 10.6 SCI3
Block Diagram
Figure amended
External
clock
SCK3
Internal clock (φ/64, φ/16, φ/4, φ)
Baud rate generator
BRC
BRR
SMR
Transmit/receive
control circuit
SCR3
SSR
TXD
TSR
TDR
RXD
RSR
RDR
Internal data bus
Clock
Interrupt request
(TEI, TXI, RXI, ERI)
10.3.7 Interrupts
336
Table amended
Table 10.16 SCI3
Interrupt Requests
Vector Address
H'002A
Rev. 6.00 Sep 12, 2006 page viii of xx
Item
Page
Revision (See Manual for Details)
13.2.4 DC
Characteristics
(HD6433644,
HD6433643,
HD6433642,
HD6433641,
HD6433640)
374
Table amended
Item
Applicable
Symbol Pins
Active
IOPE1
mode
current
dissipation
Table 13.6 DC
Characteristics
IOPE2
Sleep
ISLEEP1
mode
current
dissipation
ISLEEP2
13.2.5 AC
Characteristics
(HD6433644,
HD6433643,
HD6433642,
HD6433641,
HD6433640)
380
VCC
VCC
VCC
VCC
Values
Min
Typ
Max
Unit
Test Condition Notes
10
15
mA
Active (highspeed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
5
VCC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
2
3
1
5
7
2
2
3
1
mA
mA
mA
Active (medium- 1, 2
speed) mode
VCC = 5 V,
fOSC = 10 MHz
VCC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep (highspeed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
VCC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep (medium- 1, 2
speed) mode
VCC = 5 V,
fOSC = 10 MHz
VCC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
Table amended
VCC = 2.5 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta =
–20°C to +75°C, unless otherwise specified.
Table 13.9 Serial
Interface (SCI3)
Timing
13.3.5 AC
Characteristics
(HD6433644R,
HD6433643R,
HD6433642R,
HD6433641R,
HD6433640R)
404
Table amended
VCC = 2.5 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta =
–20°C to +75°C, unless otherwise specified.
Table 13.18 Serial
Interface (SCI3)
Timing
Rev. 6.00 Sep 12, 2006 page ix of xx
427
Table amended
Table A.1 Instruction
Set
B.2 Functions
485
PUSH Rs
W SP–2 → SP
Rs16 → @SP
ADD.B #xx:8, Rd
B Rd8+#xx:8 → Rd8
2
2
Bit table amended
IEGR2—Interrupt edge
select register 2
Rev. 6.00 Sep 12, 2006 page x of xx
INT7 edge select
0 Falling edge of INT7 pin input is detected
1 Rising edge of INT7 pin input is detected
@@aa
Implied
@(d:16, Rn)
@–Rn/@Rn+
@aa: 8/16
@(d:8, PC)
Operation
#xx: 8/16
Rn
@Rn
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
Condition Code
I
H N Z V C
— —
—
No. of States
A.1 Instructions
↔
↔
Revision (See Manual for Details)
0 — 6
↔
↔
↔
↔
Page
↔
Item
2
Contents
Section 1 Overview .............................................................................................................
1.1
1.2
1.3
1
Overview........................................................................................................................... 1
Internal Block Diagram..................................................................................................... 6
Pin Arrangement and Functions ........................................................................................ 7
1.3.1 Pin Arrangement .................................................................................................. 7
1.3.2 Pin Functions ....................................................................................................... 10
Section 2 CPU ...................................................................................................................... 15
2.1
2.2
2.3
2.4
2.5
2.6
2.7
Overview...........................................................................................................................
2.1.1 Features................................................................................................................
2.1.2 Address Space......................................................................................................
2.1.3 Register Configuration .........................................................................................
Register Descriptions ........................................................................................................
2.2.1 General Registers .................................................................................................
2.2.2 Control Registers..................................................................................................
2.2.3 Initial Register Values..........................................................................................
Data Formats .....................................................................................................................
2.3.1 Data Formats in General Registers.......................................................................
2.3.2 Memory Data Formats .........................................................................................
Addressing Modes.............................................................................................................
2.4.1 Addressing Modes................................................................................................
2.4.2 Effective Address Calculation..............................................................................
Instruction Set ...................................................................................................................
2.5.1 Data Transfer Instructions....................................................................................
2.5.2 Arithmetic Operations..........................................................................................
2.5.3 Logic Operations..................................................................................................
2.5.4 Shift Operations ...................................................................................................
2.5.5 Bit Manipulations.................................................................................................
2.5.6 Branching Instructions .........................................................................................
2.5.7 System Control Instructions .................................................................................
2.5.8 Block Data Transfer Instruction...........................................................................
Basic Operational Timing .................................................................................................
2.6.1 Access to On-Chip Memory (RAM, ROM) .........................................................
2.6.2 Access to On-Chip Peripheral Modules ...............................................................
CPU States ........................................................................................................................
2.7.1 Overview..............................................................................................................
2.7.2 Program Execution State......................................................................................
2.7.3 Program Halt State ...............................................................................................
15
15
16
16
18
18
18
20
20
21
22
23
23
25
29
31
33
34
34
36
40
42
43
44
44
45
46
46
48
48
Rev. 6.00 Sep 12, 2006 page xi of xx
2.8
2.9
2.7.4 Exception-Handling State ....................................................................................
Memory Map.....................................................................................................................
Application Notes .............................................................................................................
2.9.1 Notes on Data Access ..........................................................................................
2.9.2 Notes on Bit Manipulation ...................................................................................
2.9.3 Notes on Use of the EEPMOV Instruction ..........................................................
48
49
50
50
52
58
Section 3 Exception Handling ......................................................................................... 59
3.1
3.2
3.3
3.4
Overview...........................................................................................................................
Reset 59
3.2.1 Overview..............................................................................................................
3.2.2 Reset Sequence ....................................................................................................
3.2.3 Interrupt Immediately after Reset.........................................................................
Interrupts ...........................................................................................................................
3.3.1 Overview..............................................................................................................
3.3.2 Interrupt Control Registers...................................................................................
3.3.3 External Interrupts................................................................................................
3.3.4 Internal Interrupts.................................................................................................
3.3.5 Interrupt Operations .............................................................................................
3.3.6 Interrupt Response Time ......................................................................................
Application Notes .............................................................................................................
3.4.1 Notes on Stack Area Use......................................................................................
3.4.2 Notes on Rewriting Port Mode Registers.............................................................
59
59
59
61
61
61
63
71
72
72
77
78
78
79
Section 4 Clock Pulse Generators ................................................................................... 81
4.1
4.2
4.3
4.4
4.5
Overview...........................................................................................................................
4.1.1 Block Diagram .....................................................................................................
4.1.2 System Clock and Subclock .................................................................................
System Clock Generator....................................................................................................
Subclock Generator...........................................................................................................
Prescalers ..........................................................................................................................
Note on Oscillators............................................................................................................
81
81
81
82
84
85
86
Section 5 Power-Down Modes ........................................................................................ 87
5.1
5.2
5.3
Overview...........................................................................................................................
5.1.1 System Control Registers .....................................................................................
Sleep Mode .......................................................................................................................
5.2.1 Transition to Sleep Mode.....................................................................................
5.2.2 Clearing Sleep Mode............................................................................................
5.2.3 Clock Frequency in Sleep (Medium-Speed) Mode ..............................................
Standby Mode ...................................................................................................................
Rev. 6.00 Sep 12, 2006 page xii of xx
87
90
94
94
94
95
95
5.4
5.5
5.6
5.7
5.8
5.3.1 Transition to Standby Mode.................................................................................
5.3.2 Clearing Standby Mode........................................................................................
5.3.3 Oscillator Settling Time after Standby Mode Is Cleared .....................................
Watch Mode......................................................................................................................
5.4.1 Transition to Watch Mode ...................................................................................
5.4.2 Clearing Watch Mode ..........................................................................................
5.4.3 Oscillator Settling Time after Watch Mode Is Cleared ........................................
Subsleep Mode..................................................................................................................
5.5.1 Transition to Subsleep Mode ...............................................................................
5.5.2 Clearing Subsleep Mode ......................................................................................
Subactive Mode.................................................................................................................
5.6.1 Transition to Subactive Mode ..............................................................................
5.6.2 Clearing Subactive Mode.....................................................................................
5.6.3 Operating Frequency in Subactive Mode .............................................................
Active (Medium-Speed) Mode..........................................................................................
5.7.1 Transition to Active (Medium-Speed) Mode .......................................................
5.7.2 Clearing Active (Medium-Speed) Mode ..............................................................
5.7.3 Operating Frequency in Active (Medium-Speed) Mode ......................................
Direct Transfer ..................................................................................................................
95
95
96
96
96
97
97
97
97
98
98
98
98
99
99
99
99
99
100
Section 6 ROM ..................................................................................................................... 103
6.1
6.2
6.3
6.4
6.5
Overview...........................................................................................................................
6.1.1 Block Diagram .....................................................................................................
PROM Mode.....................................................................................................................
6.2.1 Setting to PROM Mode........................................................................................
6.2.2 Memory Map .......................................................................................................
Programming.....................................................................................................................
6.3.1 Writing and Verifying ..........................................................................................
6.3.2 Programming Precautions ....................................................................................
6.3.3 Reliability of Programmed Data...........................................................................
Flash Memory Overview...................................................................................................
6.4.1 Principle of Flash Memory Operation..................................................................
6.4.2 Mode Pin Settings and ROM Space.....................................................................
6.4.3 Features................................................................................................................
6.4.4 Block Diagram .....................................................................................................
6.4.5 Pin Configuration.................................................................................................
6.4.6 Register Configuration .........................................................................................
Flash Memory Register Descriptions ................................................................................
6.5.1 Flash Memory Control Register (FLMCR) ..........................................................
6.5.2 Erase Block Register 1 (EBR1) ...........................................................................
6.5.3 Erase Block Register 2 (EBR2) ...........................................................................
103
103
104
104
104
105
106
109
110
111
111
112
112
113
114
114
115
115
117
118
Rev. 6.00 Sep 12, 2006 page xiii of xx
6.6
6.7
6.8
6.9
On-Board Programming Modes ........................................................................................
6.6.1 Boot Mode ...........................................................................................................
6.6.2 User Program Mode.............................................................................................
Programming and Erasing Flash Memory.........................................................................
6.7.1 Program Mode .....................................................................................................
6.7.2 Program-Verify Mode..........................................................................................
6.7.3 Programming Flowchart and Sample Program.....................................................
6.7.4 Erase Mode ..........................................................................................................
6.7.5 Erase-Verify Mode...............................................................................................
6.7.6 Erase Flowcharts and Sample Programs ..............................................................
6.7.7 Prewrite-Verify Mode ..........................................................................................
6.7.8 Protect Modes ......................................................................................................
6.7.9 Interrupt Handling during Flash Memory Programming/Erasing.........................
Flash Memory PROM Mode (H8/3644F, H8/3643F, and H8/3642AF) ...........................
6.8.1 PROM Mode Setting............................................................................................
6.8.2 Memory Map .......................................................................................................
6.8.3 Operation in PROM Mode...................................................................................
Flash Memory Programming and Erasing Precautions .....................................................
120
120
125
127
127
128
129
132
132
133
147
148
149
150
150
150
151
160
Section 7 RAM ..................................................................................................................... 167
7.1
Overview........................................................................................................................... 167
7.1.1 Block Diagram ..................................................................................................... 167
Section 8 I/O Ports .............................................................................................................. 169
8.1
8.2
8.3
8.4
Overview...........................................................................................................................
Port 1.................................................................................................................................
8.2.1 Overview..............................................................................................................
8.2.2 Register Configuration and Description...............................................................
8.2.3 Pin Functions .......................................................................................................
8.2.4 Pin States..............................................................................................................
8.2.5 MOS Input Pull-Up..............................................................................................
Port 2.................................................................................................................................
8.3.1 Overview..............................................................................................................
8.3.2 Register Configuration and Description...............................................................
8.3.3 Pin Functions .......................................................................................................
8.3.4 Pin States..............................................................................................................
Port 3.................................................................................................................................
8.4.1 Overview..............................................................................................................
8.4.2 Register Configuration and Description...............................................................
8.4.3 Pin Functions .......................................................................................................
8.4.4 Pin States..............................................................................................................
Rev. 6.00 Sep 12, 2006 page xiv of xx
169
171
171
171
175
176
176
177
177
177
179
179
180
180
180
184
185
8.4.5 MOS Input Pull-Up..............................................................................................
Port 5.................................................................................................................................
8.5.1 Overview..............................................................................................................
8.5.2 Register Configuration and Description...............................................................
8.5.3 Pin Functions .......................................................................................................
8.5.4 Pin States..............................................................................................................
8.5.5 MOS Input Pull-Up..............................................................................................
8.6 Port 6.................................................................................................................................
8.6.1 Overview..............................................................................................................
8.6.2 Register Configuration and Description...............................................................
8.6.3 Pin Functions .......................................................................................................
8.6.4 Pin States..............................................................................................................
8.7 Port 7.................................................................................................................................
8.7.1 Overview..............................................................................................................
8.7.2 Register Configuration and Description...............................................................
8.7.3 Pin Functions .......................................................................................................
8.7.4 Pin States..............................................................................................................
8.8 Port 8.................................................................................................................................
8.8.1 Overview..............................................................................................................
8.8.2 Register Configuration and Description...............................................................
8.8.3 Pin Functions .......................................................................................................
8.8.4 Pin States..............................................................................................................
8.9 Port 9.................................................................................................................................
8.9.1 Overview..............................................................................................................
8.9.2 Register Configuration and Description...............................................................
8.9.3 Pin Functions .......................................................................................................
8.9.4 Pin States..............................................................................................................
8.10 Port B ................................................................................................................................
8.10.1 Overview..............................................................................................................
8.10.2 Register Configuration and Description...............................................................
8.10.3 Pin Functions .......................................................................................................
8.10.4 Pin States..............................................................................................................
8.5
185
186
186
186
188
189
189
190
190
190
191
192
192
192
192
194
195
195
195
196
197
198
199
199
199
200
201
201
201
201
202
202
Section 9 Timers .................................................................................................................. 203
9.1
9.2
9.3
Overview...........................................................................................................................
Timer A.............................................................................................................................
9.2.1 Overview..............................................................................................................
9.2.2 Register Descriptions ...........................................................................................
9.2.3 Timer Operation...................................................................................................
9.2.4 Timer A Operation States.....................................................................................
Timer B1 ...........................................................................................................................
203
204
204
206
208
209
209
Rev. 6.00 Sep 12, 2006 page xv of xx
9.4
9.5
9.6
9.3.1 Overview..............................................................................................................
9.3.2 Register Descriptions ...........................................................................................
9.3.3 Timer Operation...................................................................................................
9.3.4 Timer B1 Operation States...................................................................................
Timer V.............................................................................................................................
9.4.1 Overview..............................................................................................................
9.4.2 Register Descriptions ...........................................................................................
9.4.3 Timer Operation...................................................................................................
9.4.4 Timer V Operation Modes ...................................................................................
9.4.5 Interrupt Sources..................................................................................................
9.4.6 Application Examples ..........................................................................................
9.4.7 Application Notes ................................................................................................
Timer X.............................................................................................................................
9.5.1 Overview..............................................................................................................
9.5.2 Register Descriptions ...........................................................................................
9.5.3 CPU Interface.......................................................................................................
9.5.4 Timer Operation...................................................................................................
9.5.5 Timer X Operation Modes ...................................................................................
9.5.6 Interrupt Sources..................................................................................................
9.5.7 Timer X Application Example .............................................................................
9.5.8 Application Notes ................................................................................................
Watchdog Timer ...............................................................................................................
9.6.1 Overview..............................................................................................................
9.6.2 Register Descriptions ...........................................................................................
9.6.3 Timer Operation...................................................................................................
9.6.4 Watchdog Timer Operation States .......................................................................
209
211
213
214
215
215
218
224
229
229
229
232
238
238
242
253
256
263
263
264
265
270
270
271
274
275
Section 10 Serial Communication Interface ................................................................ 277
10.1 Overview........................................................................................................................... 277
10.2 SCI1 ................................................................................................................................. 277
10.2.1 Overview.............................................................................................................. 277
10.2.2 Register Descriptions ........................................................................................... 279
10.2.3 Operation in Synchronous Mode.......................................................................... 284
10.2.4 Operation in SSB Mode ....................................................................................... 287
10.2.5 Interrupts.............................................................................................................. 289
10.3 SCI3 ................................................................................................................................. 289
10.3.1 Overview.............................................................................................................. 289
10.3.2 Register Descriptions ........................................................................................... 292
10.3.3 Operation ............................................................................................................. 309
10.3.4 Operation in Asynchronous Mode ....................................................................... 313
10.3.5 Operation in Synchronous Mode.......................................................................... 322
Rev. 6.00 Sep 12, 2006 page xvi of xx
10.3.6 Multiprocessor Communication Function ............................................................ 329
10.3.7 Interrupts.............................................................................................................. 336
10.3.8 Application Notes ................................................................................................ 337
Section 11 14-Bit PWM..................................................................................................... 341
11.1 Overview...........................................................................................................................
11.1.1 Features................................................................................................................
11.1.2 Block Diagram .....................................................................................................
11.1.3 Pin Configuration.................................................................................................
11.1.4 Register Configuration .........................................................................................
11.2 Register Descriptions ........................................................................................................
11.2.1 PWM Control Register (PWCR)..........................................................................
11.2.2 PWM Data Registers U and L (PWDRU, PWDRL)............................................
11.3 Operation...........................................................................................................................
341
341
341
342
342
342
342
343
344
Section 12 A/D Converter ................................................................................................. 345
12.1 Overview...........................................................................................................................
12.1.1 Features................................................................................................................
12.1.2 Block Diagram .....................................................................................................
12.1.3 Pin Configuration.................................................................................................
12.1.4 Register Configuration .........................................................................................
12.2 Register Descriptions ........................................................................................................
12.2.1 A/D Result Register (ADRR)...............................................................................
12.2.2 A/D Mode Register (AMR) .................................................................................
12.2.3 A/D Start Register (ADSR)..................................................................................
12.3 Operation...........................................................................................................................
12.3.1 A/D Conversion Operation ..................................................................................
12.3.2 Start of A/D Conversion by External Trigger Input .............................................
12.4 Interrupts ...........................................................................................................................
12.5 Typical Use .......................................................................................................................
12.6 Application Notes .............................................................................................................
345
345
346
347
347
348
348
348
350
351
351
351
352
352
355
Section 13 Electrical Characteristics.............................................................................. 357
13.1 Absolute Maximum Ratings..............................................................................................
13.2 Electrical Characteristics (ZTAT™, Mask ROM Version)...............................................
13.2.1 Power Supply Voltage and Operating Range .......................................................
13.2.2 DC Characteristics (HD6473644) ........................................................................
13.2.3 AC Characteristics (HD6473644) ........................................................................
13.2.4 DC Characteristics (HD6433644, HD6433643, HD6433642, HD6433641,
HD6433640) ........................................................................................................
357
358
358
361
367
371
Rev. 6.00 Sep 12, 2006 page xvii of xx
13.3
13.4
13.5
13.6
13.2.5 AC Characteristics (HD6433644, HD6433643, HD6433642, HD6433641,
HD6433640) ........................................................................................................ 376
13.2.6 A/D Converter Characteristics ............................................................................. 381
Electrical Characteristics (ZTAT and R of the Mask ROM Version) ............................... 382
13.3.1 Power Supply Voltage and Operating Range ....................................................... 382
13.3.2 DC Characteristics (HD6473644R) ..................................................................... 385
13.3.3 AC Characteristics (HD6473644R) ..................................................................... 391
13.3.4 DC Characteristics (HD6433644R, HD6433643R, HD6433642R, HD6433641R,
HD6433640R)...................................................................................................... 395
13.3.5 AC Characteristics (HD6433644R, HD6433643R, HD6433642R,
HD6433641R, HD6433640R) ............................................................................. 400
13.3.6 A/D Converter Characteristics ............................................................................. 405
Electrical Characteristics (F-ZTAT version) ................................................................. 406
13.4.1 Power Supply Voltage and Operating Range ....................................................... 406
13.4.2 DC Characteristics (HD64F3644, HD64F3643, HD64F3642A) ......................... 409
13.4.3 AC Characteristics (HD64F3644, HD64F3643, HD64F3642A) ......................... 415
13.4.4 A/D Converter Characteristics ............................................................................. 419
Operation Timing .............................................................................................................. 420
Output Load Circuit .......................................................................................................... 423
Appendix A CPU Instruction Set .................................................................................... 425
A.1
A.2
A.3
Instructions........................................................................................................................ 425
Operation Code Map......................................................................................................... 433
Number of Execution States.............................................................................................. 435
Appendix B Internal I/O Registers ................................................................................. 442
B.1
B.2
Addresses .......................................................................................................................... 442
Functions........................................................................................................................... 446
Appendix C I/O Port Block Diagrams ........................................................................... 493
C.1
C.2
C.3
C.4
C.5
C.6
C.7
C.8
C.9
Block Diagrams of Port 1..................................................................................................
Block Diagrams of Port 2..................................................................................................
Block Diagrams of Port 3..................................................................................................
Block Diagrams of Port 5..................................................................................................
Block Diagram of Port 6 ...................................................................................................
Block Diagrams of Port 7..................................................................................................
Block Diagrams of Port 8..................................................................................................
Block Diagram of Port 9 ...................................................................................................
Block Diagram of Port B...................................................................................................
493
497
500
503
506
507
511
519
520
Appendix D Port States in the Different Processing States ..................................... 521
Rev. 6.00 Sep 12, 2006 page xviii of xx
Appendix E Product Code Lineup .................................................................................. 522
Appendix F Package Dimensions ................................................................................... 524
Rev. 6.00 Sep 12, 2006 page xix of xx
Rev. 6.00 Sep 12, 2006 page xx of xx
Section 1 Overview
Section 1 Overview
1.1
Overview
The H8/300L Series is a series of single-chip microcomputers (MCU: microcomputer unit), built
around the high-speed H8/300L CPU and equipped with peripheral system functions on-chip.
Within the H8/300L Series, the H8/3644 Group of microcomputers are equipped with a UART
(Universal Asynchronous Receiver/Transmitter). Other on-chip peripheral functions include five
timers, a 14-bit pulse width modulator (PWM), two serial communication interface channels, and
an A/D converter, providing an ideal configuration as a microcomputer for embedding in highlevel control systems. In addition to the mask ROM version, the H8/3644 is also available in a
ZTAT™*1 version with on-chip user-programmable PROM, and an F-ZTAT™*2 version with onchip flash memory that can be programmed on-board. Table 1 summarizes the features of the
H8/3644 Group.
Notes: 1. ZTAT is a trademark of Renesas Technology Corp.
2. F-ZTAT is a trademark of Renesas Technology Corp.
Rev. 6.00 Sep 12, 2006 page 1 of 526
REJ09B0326-0600
Section 1 Overview
Table 1.1
Features
Item
Description
CPU
High-speed H8/300L CPU
• General-register architecture
•
General registers: Sixteen 8-bit registers (can be used as eight 16-bit
registers)
Operating speed
Max. operation speed: 5 MHz (mask ROM and ZTAT versions)
8 MHz (Applies only to F-ZTAT, R of the ZTAT,
and R of the mask ROM version)
Add/subtract: 0.4 µs (operating at φ = 5 MHz)
1
0.25 µs (operating at φ = 8 MHz)*
Multiply/divide: 2.8 µs (operating at φ = 5 MHz)
1
1.75 µs (operating at φ = 8 MHz)*
Can run on 32.768 kHz subclock
•
Instruction set compatible with H8/300 CPU
Instruction length of 2 bytes or 4 bytes
Basic arithmetic operations between registers
MOV instruction for data transfer between memory and registers
•
Typical instructions
Multiply (8 bits × 8 bits)
Divide (16 bits ÷ 8 bits)
Bit accumulator
Register-indirect designation of bit position
Interrupts
Clock pulse
generators
33 interrupt sources
•
12 external interrupt sources (IRQ3 to IRQ0, INT7 to INT0)
•
21 internal interrupt sources
Two on-chip clock pulse generators
1 to 10 MHz (1 to 16 MHz* )
1
Crystal or ceramic resonator: 2 to 10 MHz (2 to 16 MHz* )
1
External clock input:
1 to 10 MHz (1 to 16 MHz* )
•
System clock pulse generator:
•
Subclock pulse generator:
Rev. 6.00 Sep 12, 2006 page 2 of 526
REJ09B0326-0600
1
32.768 kHz
Section 1 Overview
Item
Description
Power-down
modes
Seven power-down modes
Memory
I/O ports
Timers
•
Sleep (high-speed) mode
•
Sleep (medium-speed) mode
•
Standby mode
•
Watch mode
•
Subsleep mode
•
Subactive mode
•
Active (medium-speed) mode
Large on-chip memory
•
H8/3644: 32-kbyte ROM, 1-kbyte RAM
•
H8/3643: 24-kbyte ROM, 1-kbyte RAM
•
H8/3642: 16-kbyte ROM, 512 byte RAM (1-kbyte RAM F-ZTAT version)
•
H8/3641: 12-kbyte ROM, 512 byte RAM
•
H8/3640: 8-kbyte ROM, 512 byte RAM
53 pins
•
45 I/O pins
•
8 input pins
Five on-chip timers
•
Timer A: 8-bit timer
Count-up timer with selection of eight internal clock signals divided from the
2
system clock (φ)* and four clock signals divided from the watch clock
2
(φ w)*
•
Timer B1: 8-bit timer
Count-up timer with selection of seven internal clock signals or event
input from external pin
Auto-reloading
•
Timer V: 8-bit timer
Count-up timer with selection of six internal clock signals or event input
from external pin
Compare-match waveform output
Externally triggerable
Rev. 6.00 Sep 12, 2006 page 3 of 526
REJ09B0326-0600
Section 1 Overview
Item
Description
Timers
•
Timer X: 16-bit timer
Count-up timer with selection of three internal clock signals or event input
from external pin
Output compare (2 output pins)
Input capture (4 input pins)
•
Watchdog timer
Reset signal generated by 8-bit counter overflow
Serial
Two on-chip serial communication interface channels
communication
• SCI1: synchronous serial interface
interface
Choice of 8-bit or 16-bit data transfer
•
SCI3: 8-bit synchronous/asynchronous serial interface
Incorporates multiprocessor communication function
14-bit PWM
Pulse-division PWM output for reduced ripple
•
A/D converter
Can be used as a 14-bit D/A converter by connecting to an external low-pass
filter.
Successive approximations using a resistance ladder
•
8-channel analog input pins
•
Conversion time: 31/ φ or 62/ φ per channel
Rev. 6.00 Sep 12, 2006 page 4 of 526
REJ09B0326-0600
Section 1 Overview
Item
Description
Product lineup
Product Code
Mask ROM
Version
ZTAT™
Version
F-ZTAT™
Version
HD6433644H
HD6433644RH
HD6473644H
HD6473644RH
HD6433644P
HD6433644RP
HD6473644P
HD6473644RP
HD6433644W
HD6433644RW
HD6473644W
HD64F3644W
HD6473644RW
80-pin TQFP
(TFP-80C)
HD6433643H
HD6433643RH
HD64F3643H
64-pin QFP
(FP-64A)
HD6433643P
HD6433643RP
HD64F3643P
64-pin SDIP
(DP-64S)
HD6433643W
HD6433643RW
HD64F3643W
80-pin TQFP
(TFP-80C)
HD6433642H
HD6433642RH
HD64F3642AH
64-pin QFP
(FP-64A)
ROM: 16 kbytes
RAM: 512 kbytes
HD6433642P
HD6433642RP
HD64F3642AP
64-pin SDIP
(DP-64S)
RAM: 1 kbyte
(F-ZTAT version)
HD6433642W
HD6433642RW
HD64F3642AW 80-pin TQFP
(TFP-80C)
HD6433641H
HD6433641RH
64-pin QFP
(FP-64A)
HD6433641P
HD6433641RP
64-pin SDIP
(DP-64S)
HD6433641W
HD6433641RW
80-pin TQFP
(TFP-80C)
HD6433640H
HD6433640RH
64-pin QFP
(FP-64A)
HD6433640P
HD6433640RP
64-pin SDIP
(DP-64S)
HD6433640W
HD6433640RW
80-pin TQFP
(TFP-80C)
Package
ROM/RAM Size
HD64F3644H
64-pin QFP
(FP-64A)
ROM: 32 kbytes
RAM: 1 kbyte
HD64F3644P
64-pin SDIP
(DP-64S)
ROM: 24 kbytes
RAM: 1 kbyte
ROM: 12 kbytes
RAM: 512 bytes
ROM: 8 kbytes
RAM: 512 bytes
Notes: 1. Applies only to F-ZTAT, R of the ZTAT, and R of the mask ROM version.
2. As for the definition of φ and φ W , see section 4, Clock Pulse Generators.
Rev. 6.00 Sep 12, 2006 page 5 of 526
REJ09B0326-0600
Section 1 Overview
1.2
Internal Block Diagram
Timer B1
SCI3
Port 8
SCI1
Port 7
Timer A
P77
P76/TMOV
P75/TMCIV
P74/TMRIV
P73
Port 6
P30/SCK1
P31/SI1
P32/SO1
RAM
P67
P66
P65
P64
P63
P62
P61
P60
Port 5
Port 1
P20/SCK3
P21/RXD
P22/TXD
ROM
P87
P86/FTID
P85/FTIC
P84/FTIB
P83/FTIA
P82/FTOB
P81/FTOA
P80/FTCI
P57/INT7
P56/INT6/TMIB
P55/INT5/ADTRG
P54/INT4
P53/INT3
P52/INT2
P51/INT1
P50/INT0
Port 3
P10/TMOW
P14/PWM
P15/IRQ1
P16/IRQ2
P17/IRQ3/TRGV
Port 2
Data bus (lower)
Data bus (upper)
CPU
H8/300L
Address bus
VSS
VCC
RES
IRQ0
TEST
X1
X2
Subclock
generator
System clock
generator
OSC1
OSC2
Figure 1.1 shows a block diagram of the H8/3644 Group.
Timer X
P90/FVPP*
P91
P92
P93
P94
Port 9
Timer V
Watchdog
timer
14-bit PWM
A/D converter
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
AVCC
AVSS
Port B
Note: * There is no P90 function in the flash memory version.
Figure 1.1 Block Diagram
Rev. 6.00 Sep 12, 2006 page 6 of 526
REJ09B0326-0600
CMOS largecurrent port
IOL= 10 mA
@VOL= 1V
Section 1 Overview
1.3
Pin Arrangement and Functions
1.3.1
Pin Arrangement
P21/RXD
P20/SCK3
P87
P86/FTID
P85/FTIC
P84/FTIB
P83/FTIA
P82/FTOB
P81/FTOA
P80/FTCI
P77
P76/TMOV
P75/TMCIV
P74/TMRIV
P73
VCC
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
The H8/3644 Group pin arrangement is shown in figures 1.2 (FP-64A), 1.3 (DP-64S), and 1.4
(TFP-80C).
P22/TXD
49
32
P57/INT7
P32/SO1
50
31
P56/INT6/TMIB
P31/SI1
51
30
P55/INT5/ADTRG
P30/SCK1
52
29
P54/INT4
P10/TMOW
53
28
P53/INT3
P14/PWM
54
27
P52/INT2
P15/IRQ1
55
26
P51/INT1
15
16
P94
IRQ0
PB1/AN1
14
P60
13
17
P93
64
P92
PB2/AN2
12
P61
P91
P62
18
11
19
63
10
62
PB3/AN3
RES
PB4/AN4
P90/FVPP*
P63
9
20
OSC2
61
8
PB5/AN5
7
P64
VSS
P65
21
OSC1
22
60
6
59
PB6/AN6
X1
PB7/AN7
5
P66
4
23
X2
58
TEST
AVCC
3
P67
AVSS
P50/INT0
24
2
25
57
1
56
PB0/AN0
P16/IRQ2
P17/IRQ3/TRGV
Note: * There is no P90 function in the flash memory version.
Figure 1.2 Pin Arrangement (FP-64A: Top View)
Rev. 6.00 Sep 12, 2006 page 7 of 526
REJ09B0326-0600
Section 1 Overview
P17/IRQ3/TRGV
1
64
P16/IRQ2
AVCC
2
63
P15/IRQ1
PB7/AN7
3
62
P14/PWM
PB6/AN6
4
61
P10/TMOW
PB5/AN5
5
60
P30/SCK1
PB4/AN4
6
59
P31/SI1
PB3/AN3
7
58
P32/SO1
PB2/AN2
8
57
P22/TXD
PB1/AN1
9
56
P21/RXD
PB0/AN0
10
55
P20/SCK3
AVSS
11
54
P87
TEST
12
53
P86/FTID
X2
13
52
P85/FTIC
X1
14
51
P84/FTIB
VSS
15
50
P83/FTIA
OSC1
16
49
P82/FTOB
OSC2
17
48
P81/FTOA
RES
18
47
P80/FTCI
P90/FVPP*
19
46
P77
P91
20
45
P76/TMOV
P92
21
44
P75/TMCIV
P93
22
43
P74/TMRIV
P94
23
42
P73
IRQ0
24
41
VCC
P60
25
40
P57/INT7
P61
26
39
P56/INT6/TMIB
P62
27
38
P55/INT5/ADTRG
P63
28
37
P54/INT4
P64
29
36
P53/INT3
P65
30
35
P52/INT2
P66
31
34
P51/INT1
P67
32
33
P50/INT0
Note: * There is no P90 function in the flash memory version.
Figure 1.3 Pin Arrangement (DP-64S: Top View)
Rev. 6.00 Sep 12, 2006 page 8 of 526
REJ09B0326-0600
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
NC
NC
P57/INT7
P56/INT6/TMIB
P55/INT5/ADTRG
P54/INT4
P53/INT3
P52/INT2
P51/INT1
P50/INT0
NC
P67
P66
P65
P64
P63
P62
P61
P60
NC
NC
PB1/AN1
PB0/AN0
AVSS
TEST
X2
X1
VSS1
OSC1
OSC2
VSS2
RES
P90/FVPP*
P91
P92
NC
P93
P94
IRQ0
NC
NC
NC
P22/TXD
P32/SO1
P31/SI1
P30/SCK1
P10/TMOW
P14/PWM
P15/IRQ1
P16/IRQ2
P17/IRQ3/TRGV
AVCC
PB7/AN7
PB6/AN6
PB5/AN5
PB4/AN4
PB3/AN3
PB2/AN2
NC
NC
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
NC
P21/RXD
P20/SCK3
P87
P86/FTID
P85/FTIC
P84/FTIB
NC
P83/FTIA
P82/FTOB
P81/FTOA
P80/FTCI
NC
P77
P76/TMOV
P75/TMCIV
P74/TMRIV
P73
VCC
NC
Section 1 Overview
Note: * There is no P90 function in the flash memory version.
Figure 1.4 Pin Arrangement (TFP-80C: Top View)
Rev. 6.00 Sep 12, 2006 page 9 of 526
REJ09B0326-0600
Section 1 Overview
1.3.2
Pin Functions
Table 1.2 outlines the pin functions of the H8/3644 Group.
Table 1.2
Pin Functions
Pin No.
Type
Symbol
FP-64A
DP-64S
TFP-80C I/O
Name and Functions
33
41
42
Input
Power supply: All VCC pins
should be connected to the user
system VCC.
VSS
7
15
8, 11
Input
Ground: All VSS pins should be
connected to the user system
GND.
AVCC
58
2
72
Input
Analog power supply: This is
the power supply pin for the A/D
converter. When the A/D
converter is not used, connect
this pin to the user system VCC.
AVSS
3
11
4
Input
Analog ground: This is the A/D
converter ground pin. It should be
connected to the user system
GND.
OSC1
8
16
9
Input
OSC2
9
17
10
Output
System clock: These pins
connect to a crystal or ceramic
resonator, or can be used to input
an external clock.
See section 4, Clock Pulse
Generators, for a typical
connection diagram.
X1
6
14
7
Input
X2
5
13
6
Output
RES
10
18
12
Input
Reset: When this pin is driven
low, the chip is reset
TEST
4
12
5
Input
Test: This is a test pin, not for
use in application systems. It
should be connected to VSS.
Power
VCC
source pins
Clock pins
System
control
Rev. 6.00 Sep 12, 2006 page 10 of 526
REJ09B0326-0600
Subclock: These pins connect to
a 32.768-kHz crystal resonator.
See section 4, Clock Pulse
Generators, for a typical
connection diagram.
Section 1 Overview
Pin No.
Type
Symbol
FP-64A
DP-64S
TFP-80C I/O
Interrupt
pins
IRQ0
IRQ1
IRQ2
IRQ3
16
55
56
57
24
63
64
1
19
69
70
71
Input
IRQ interrupt request 0 to 3:
These are input pins for edgesensitive external interrupts, with
a selection of rising or falling
edge
INT7 to
INT0
32 to 25
40 to 33
38 to 31
Input
INT interrupt request 0 to 7:
These are input pins for edgesensitive external interrupts, with
a selection of rising or falling
edge
TMOW
53
61
67
Output
Clock output: This is an output
pin for waveforms generated by
the timer A output circuit
TMIB
31
39
37
Input
Timer B1 event counter input:
This is an event input pin for input
to the timer B1 counter
TMOV
37
45
46
Output
Timer V output: This is an
output pin for waveforms
generated by the timer V output
compare function
TMCIV
36
44
45
Input
Timer V event input: This is an
event input pin for input to the
timer V counter
TMRIV
35
43
44
Input
Timer V counter reset: This is a
counter reset input pin for timer V
TRGV
57
1
71
Input
Timer V counter trigger input:
This is a trigger input pin for the
timer V counter and realtime
output port
FTCI
39
47
49
Input
Timer X clock input: This is an
external clock input pin for input
to the timer X counter
FTOA
40
48
50
Output
Timer X output compare A
output: This is an output pin for
timer X output compare A
FTOB
41
49
51
Output
Timer X output compare B
output: This is an output pin for
timer X output compare B
Timer pins
Name and Functions
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Section 1 Overview
Pin No.
Type
Symbol
FP-64A
DP-64S
TFP-80C I/O
Name and Functions
Timer pins
FTIA
42
50
52
Input
Timer X input capture A input:
This is an input pin for timer X
input capture A
FTIB
43
51
54
Input
Timer X input capture B input:
This is an input pin for timer X
input capture B
FTIC
44
52
55
Input
Timer X input capture C input:
This is an input pin for timer X
input capture C
FTID
45
53
56
Input
Timer X input capture D input:
This is an input pin for timer X
input capture D
14-bit
PWM pin
PWM
54
62
68
Output
14-bit PWM output: This is an
output pin for waveforms
generated by the 14-bit PWM
I/O ports
PB7 to
PB0
59 to 64, 3 to 10
1, 2
73 to 78
2, 3
Input
Port B: This is an 8-bit input port
P17 to
P14,
P10
57 to 53
1,
64 to 61
71 to 67
I/O
Port 1: This is a 5-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 1 (PCR1)
P22 to
P20
49 to 47
57 to 55
63, 59
58
I/O
Port 2: This is a 3-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 2 (PCR2)
P32 to
P30
50 to 52
58 to 60
64 to 66
I/O
Port 3: This is a 3-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 3 (PCR3)
P57 to
P50
32 to 25
40 to 33
38 to 31
I/O
Port 5: This is an 8-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 5 (PCR5)
P67 to
P60
24 to 17
32 to 25
29 to 22
I/O
Port 6: This is an 8-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 6 (PCR6)
Rev. 6.00 Sep 12, 2006 page 12 of 526
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Section 1 Overview
Pin No.
Type
Symbol
FP-64A
DP-64S
TFP-80C I/O
Name and Functions
I/O ports
P77 to
P73
38 to 34
46 to 42
47 to 43
I/O
Port 7: This is a 5-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 7 (PCR7)
P87 to
P80
46 to 39
54 to 47
57 to 54, I/O
52 to 49
Port 8: This is an 8-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 8 (PCR8)
P94 to
P90
15 to 11
23 to 19
18, 17
15 to 13
Port 9: This is a 5-bit I/O port.
Input or output can be designated
for each bit by means of port
control register 9 (PCR9)
I/O
Note: There is no P90 function
in the flash memory
version since P90 is used
as the FVPP pin.
Serial com- SI1
munication
interface
SO1
(SCI)
A/D
converter
51
59
65
Input
SCI1 receive data input:
This is the SCI1 data input pin
50
58
64
Output
SCI1 transmit data output:
This is the SCI1 data output pin
SCK1
52
60
66
I/O
SCI1 clock I/O:
This is the SCI1 clock I/O pin
RXD
48
56
59
Input
SCI3 receive data input:
This is the SCI3 data input pin
TXD
49
57
63
Output
SCI3 transmit data output:
This is the SCI3 data output pin
SCK3
47
55
58
I/O
SCI3 clock I/O:
This is the SCI3 clock I/O pin
AN7 to
AN0
59 to 64, 3 to 10
1, 2
73 to 78
2, 3
Input
Analog input channels 11 to 0:
These are analog data input
channels to the A/D converter
ADTRG
30
36
Input
A/D converter trigger input:
This is the external trigger input
pin to the A/D converter
38
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Section 1 Overview
Pin No.
Type
Symbol
FP-64A
DP-64S
TFP-80C I/O
Name and Functions
Flash
memory
FVPP
11
19
13
On-board-programmable flash
memory power supply:
Connected to the flash memory
programming power supply
(+12 V). When the flash memory
is not being programmed,
connect to the user system VCC.
In versions other than the on-chip
flash memory version, this pin is
P90
Other
NC
1, 16,
20, 21,
30, 39,
40, 41,
48, 53,
60 to 62,
79, 80
Rev. 6.00 Sep 12, 2006 page 14 of 526
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Input
Non-connected pins: These
pins must be left unconnected
Section 2 CPU
Section 2 CPU
2.1
Overview
The H8/300L CPU has sixteen 8-bit general registers, which can also be paired as eight 16-bit
registers. Its concise instruction set is designed for high-speed operation.
2.1.1
Features
Features of the H8/300L CPU are listed below.
• General-register architecture
Sixteen 8-bit general registers, also usable as eight 16-bit general registers
• Instruction set with 55 basic instructions, including:
Multiply and divide instructions
Powerful bit-manipulation instructions
• Eight addressing modes
Register direct
Register indirect
Register indirect with displacement
Register indirect with post-increment or pre-decrement
Absolute address
Immediate
Program-counter relative
Memory indirect
• 64-kbyte address space
• High-speed operation
All frequently used instructions are executed in two to four states
High-speed arithmetic and logic operations
8- or 16-bit register-register add or subtract: 0.4 µs (operating at φ = 5 MHz)
0.25 µs (operating at φ = 8 MHz)*
8 × 8-bit multiply:
2.8 µs (operating at φ = 5 MHz)
1.75 µs (operating at φ = 8 MHz)*
16 ÷ 8-bit divide:
2.8 µs (operating at φ = 5 MHz)
1.75 µs (operating at φ = 8 MHz)*
Note: * Applies only to F-ZTAT, R of the ZTAT, and R of the mask ROM version.
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Section 2 CPU
• Low-power operation modes
SLEEP instruction for transfer to low-power operation
2.1.2
Address Space
The H8/300L CPU supports an address space of up to 64 kbytes for storing program code and
data.
See section 2.8, Memory Map, for details of the memory map.
2.1.3
Register Configuration
Figure 2.1 shows the register structure of the H8/300L CPU. There are two groups of registers: the
general registers and control registers.
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Section 2 CPU
General registers (Rn)
7
0 7
0
R0H
R0L
R1H
R1L
R2H
R2L
R3H
R3L
R4H
R4L
R5H
R5L
R6H
R7H
R6L
(SP)
SP: Stack pointer
R7L
Control registers (CR)
15
0
PC
CCR
7 6 5 4 3 2 1 0
I UHUNZ VC
PC: Program counter
CCR: Condition code register
Carry flag
Overflow flag
Zero flag
Negative flag
Half-carry flag
Interrupt mask bit
User bit
User bit
Figure 2.1 CPU Registers
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Section 2 CPU
2.2
Register Descriptions
2.2.1
General Registers
All the general registers can be used as both data registers and address registers.
When used as data registers, they can be accessed as 16-bit registers (R0 to R7), or the high bytes
(R0H to R7H) and low bytes (R0L to R7L) can be accessed separately as 8-bit registers.
When used as address registers, the general registers are accessed as 16-bit registers (R0 to R7).
R7 also functions as the stack pointer (SP), used implicitly by hardware in exception processing
and subroutine calls. When it functions as the stack pointer, as indicated in figure 2.2, SP (R7)
points to the top of the stack.
Lower address side [H'0000]
Unused area
SP (R7)
Stack area
Upper address side [H'FFFF]
Figure 2.2 Stack Pointer
2.2.2
Control Registers
The CPU control registers include a 16-bit program counter (PC) and an 8-bit condition code
register (CCR).
Program Counter (PC): This 16-bit register indicates the address of the next instruction the CPU
will execute. All instructions are fetched 16 bits (1 word) at a time, so the least significant bit of
the PC is ignored (always regarded as 0).
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Section 2 CPU
Condition Code Register (CCR): This 8-bit register contains internal status information,
including the interrupt mask bit (I) and half-carry (H), negative (N), zero (Z), overflow (V), and
carry (C) flags. These bits can be read and written by software (using the LDC, STC, ANDC,
ORC, and XORC instructions). The N, Z, V, and C flags are used as branching conditions for
conditional branching (Bcc) instructions.
Bit 7Interrupt Mask Bit (I): When this bit is set to 1, interrupts are masked. This bit is set to 1
automatically at the start of exception handling. The interrupt mask bit may be read and written by
software. For further details, see section 3.3, Interrupts.
Bit 6User Bit (U): Can be used freely by the user.
Bit 5Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B
instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and is cleared to 0
otherwise.
The H flag is used implicitly by the DAA and DAS instructions.
When the ADD.W, SUB.W, or CMP.W instruction is executed, the H flag is set to 1 if there is a
carry or borrow at bit 11, and is cleared to 0 otherwise.
Bit 4User Bit (U): Can be used freely by the user.
Bit 3VNegative Flag (N): Indicates the most significant bit (sign bit) of the result of an
instruction.
Bit 2Zero Flag (Z): Set to 1 to indicate a zero result, and cleared to 0 to indicate a non-zero
result.
Bit 1Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other
times.
Bit 0Carry Flag (C): Set to 1 when a carry occurs, and cleared to 0 otherwise. Used by:
• Add instructions, to indicate a carry
• Subtract instructions, to indicate a borrow
• Shift/rotate carry
The carry flag is also used as a bit accumulator by bit manipulation instructions.
Some instructions leave some or all of the flag bits unchanged.
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Section 2 CPU
Refer to the H8/300L Series Programming Manual for the action of each instruction on the flag
bits.
2.2.3
Initial Register Values
In reset exception handling, the program counter (PC) is initialized by a vector address (H'0000)
load, and the I bit in the CCR is set to 1. The other CCR bits and the general registers are not
initialized. In particular, the stack pointer (R7) is not initialized. The stack pointer should be
initialized by software, by the first instruction executed after a reset.
2.3
Data Formats
The H8/300L CPU can process 1-bit data, 4-bit (BCD) data, 8-bit (byte) data, and 16-bit (word)
data.
The H8/300L CPU can process 1-bit, 4-bit BCD, 8-bit (byte), and 16-bit (word) data. 1-bit data is
handled by bit manipulation instructions, and is accessed by being specified as bit n (n = 0, 1, 2, ...
7) in the operand data (byte).
Byte data is handled by all arithmetic and logic instructions except ADDS and SUBS. Word data
is handled by the MOV.W, ADD.W, SUB.W, CMP.W, ADDS, SUBS, MULXU (b bits × 8 bits),
and DIVXU (16 bits ÷ 8 bits) instructions.
With the DAA and DAS decimal adjustment instructions, byte data is handled as two 4-bit BCD
data units.
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Section 2 CPU
2.3.1
Data Formats in General Registers
Data of all the sizes above can be stored in general registers as shown in figure 2.3.
Data Type
Register No.
Data Format
7
1-bit data
RnH
7
0
6
5
4
3
2
1
0
don’t care
7
1-bit data
Byte data
Byte data
Word data
RnL
RnH
don’t care
7
0
MSB
LSB
RnL
Rn
don’t care
RnH
6
5
3
2
1
0
don’t care
7
0
MSB
LSB
0
MSB
LSB
4
3
Upper digit
0
Lower digit
don’t care
7
4-bit BCD data
4
15
7
4-bit BCD data
7
0
RnL
don’t care
4
Upper digit
0
3
Lower digit
Legend:
RnH: Upper byte of general register
RnL: Lower byte of general register
MSB: Most significant bit
LSB: Least significant bit
Figure 2.3 General Register Data Formats
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Section 2 CPU
2.3.2
Memory Data Formats
Figure 2.4 indicates the data formats in memory. For access by the H8/300L CPU, word data
stored in memory must always begin at an even address. When word data beginning at an odd
address is accessed, the least significant bit is regarded as 0, and the word data beginning at the
preceding address is accessed. The same applies to instruction codes.
Data Type
Address
Data Format
7
1-bit data
Address n
7
Byte data
Address n
MSB
Even address
MSB
Word data
Odd address
Byte data (CCR) on stack
Word data on stack
0
6
5
4
3
2
1
0
LSB
Upper 8 bits
Lower 8 bits
LSB
Even address
MSB
CCR
LSB
Odd address
MSB
CCR*
LSB
Even address
MSB
Odd address
LSB
Legend:
CCR:
Condition code register
Note: * Ignored on return
Figure 2.4 Memory Data Formats
When the stack is accessed using R7 as an address register, word access should always be
performed. The CCR is stored as word data with the same value in the upper 8 bits and the lower 8
bits. On return, the lower 8 bits are ignored.
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Section 2 CPU
2.4
Addressing Modes
2.4.1
Addressing Modes
The H8/300L CPU supports the eight addressing modes listed in table 2.1. Each instruction uses a
subset of these addressing modes.
Table 2.1
Addressing Modes
No.
Address Modes
Symbol
1
Register direct
Rn
2
Register indirect
@Rn
3
Register indirect with displacement
@(d:16, Rn)
4
Register indirect with post-increment
Register indirect with pre-decrement
@Rn+
@–Rn
5
Absolute address
@aa:8 or @aa:16
6
Immediate
#xx:8 or #xx:16
7
Program-counter relative
@(d:8, PC)
8
Memory indirect
@@aa:8
1. Register DirectRn: The register field of the instruction specifies an 8- or 16-bit general
register containing the operand.
Only the MOV.W, ADD.W, SUB.W, CMP.W, ADDS, SUBS, MULXU (8 bits × 8 bits), and
DIVXU (16 bits ÷ 8 bits) instructions have 16-bit operands.
2. Register Indirect@Rn: The register field of the instruction specifies a 16-bit general
register containing the address of the operand in memory.
3. Register Indirect with Displacement@(d:16, Rn): The instruction has a second word
(bytes 3 and 4) containing a displacement which is added to the contents of the specified
general register to obtain the operand address in memory.
This mode is used only in MOV instructions. For the MOV.W instruction, the resulting
address must be even.
4. Register Indirect with Post-Increment or Pre-Decrement@Rn+ or @–Rn:
Register indirect with post-increment@Rn+
The @Rn+ mode is used with MOV instructions that load registers from memory.
The register field of the instruction specifies a 16-bit general register containing the address
of the operand. After the operand is accessed, the register is incremented by 1 for MOV.B
or 2 for MOV.W, and the result of the addition is stored in the register. For MOV.W, the
original contents of the 16-bit general register must be even.
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Section 2 CPU
Register indirect with pre-decrement@–Rn
The @–Rn mode is used with MOV instructions that store register contents to memory.
The register field of the instruction specifies a 16-bit general register which is decremented
by 1 or 2 to obtain the address of the operand in memory. The register retains the
decremented value. The size of the decrement is 1 for MOV.B or 2 for MOV.W. For
MOV.W, the original contents of the register must be even.
5. Absolute Address@aa:8 or @aa:16: The instruction specifies the absolute address of the
operand in memory.
The absolute address may be 8 bits long (@aa:8) or 16 bits long (@aa:16). The MOV.B and bit
manipulation instructions can use 8-bit absolute addresses. The MOV.B, MOV.W, JMP, and
JSR instructions can use 16-bit absolute addresses.
For an 8-bit absolute address, the upper 8 bits are assumed to be 1 (H'FF). The address range is
H'FF00 to H'FFFF (65280 to 65535).
6. Immediate#xx:8 or #xx:16: The second byte (#xx:8) or the third and fourth bytes (#xx:16)
of the instruction code are used directly as the operand. Only MOV.W instructions can be used
with #xx:16.
The ADDS and SUBS instructions implicitly contain the value 1 or 2 as immediate data. Some
bit manipulation instructions contain 3-bit immediate data in the second or fourth byte of the
instruction, specifying a bit number.
7. Program-Counter Relative@(d:8, PC): This mode is used in the Bcc and BSR
instructions. An 8-bit displacement in byte 2 of the instruction code is sign-extended to 16 bits
and added to the program counter contents to generate a branch destination address, and the PC
contents to be added are the start address of the next instruction, so that the possible branching
range is –126 to +128 bytes (–63 to +64 words) from the branch instruction. The displacement
should be an even number.
8. Memory Indirect@@aa:8: This mode can be used by the JMP and JSR instructions. The
second byte of the instruction code specifies an 8-bit absolute address. This specifies an
operand in memory, and a branch is performed with the contents of this operand as the branch
address.
The upper 8 bits of the absolute address are assumed to be 0 (H'00), so the address range is
from H'0000 to H'00FF (0 to 255). Note that with the H8/300L Series, the lower end of the
address area is also used as a vector area. See section 3.3, Interrupts, for details on the vector
area.
If an odd address is specified as a branch destination or as the operand address of a MOV.W
instruction, the least significant bit is regarded as 0, causing word access to be performed at the
address preceding the specified address. See section 2.3.2, Memory Data Formats, for further
information.
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Section 2 CPU
2.4.2
Effective Address Calculation
Table 2.2 shows how effective addresses are calculated in each of the addressing modes.
Arithmetic and logic instructions use register direct addressing (1). The ADD.B, ADDX, SUBX,
CMP.B, AND, OR, and XOR instructions can also use immediate addressing (6).
Data transfer instructions can use all addressing modes except program-counter relative (7) and
memory indirect (8).
Bit manipulation instructions use register direct (1), register indirect (2), or 8-bit absolute
addressing (5) to specify a byte operand, and 3-bit immediate addressing (6) to specify a bit
position in that byte. The BSET, BCLR, BNOT, and BTST instructions can also use register direct
addressing (1) to specify the bit position.
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Section 2 CPU
Table 2.2
Effective Address Calculation
No.
Addressing Mode and
Instruction Format
1
Register indirect, Rn
Effective Address
Calculation Method
Effective Address (EA)
3
0
rm
15
87
op
2
43
rm
rn
3
76 43
15
0
15
0
15
0
15
0
15
0
0
rm
Register indirect with
displacement, @(d:16, Rn)
15
rn
Operand is contents of
registers indicated by rm/rn
Contents (16 bits) of
register indicated by rm
op
0
0
Register indirect, @Rn
15
3
76
op
43
15
0
Contents (16 bits) of
register indicated by rm
0
rm
disp
disp
4
Register indirect with
post-increment, @Rn+
15
76
op
43
15
0
Contents (16 bits) of
register indicated by rm
0
rm
1 or 2
Register indirect with
pre-decrement, @–Rn
15
76
op
43
rm
15
0
Contents (16 bits) of
register indicated by rm
0
Incremented or
decremented by 1 if
operand is byte size, 1 or 2
and by 2 if word size
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Section 2 CPU
No.
5
Addressing Mode and
Instruction Format
Effective Address
Calculation Method
Effective Address (EA)
Absolute address
@aa:8
15
87
op
15
87
0
H'FF
0
abs
@aa:16
15
15
0
0
op
abs
6
Immediate
#xx:8
15
Operand is 1- or 2-byte
immediate data
87
op
0
IMM
#xx:16
15
0
op
IMM
7
Program-counter relative
@(d:8, PC)
87
15
op
0
15
0
PC contents
15
Sign
extension
0
disp
disp
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Section 2 CPU
No.
Addressing Mode and
Instruction Format
8
Memory indirect, @@aa:8
15
87
op
Effective Address
Calculation Method
Effective Address (EA)
0
abs
15
87
H'00
0
abs
15
Memory contents
(16 bits)
Legend:
rm, rn: Register field
op:
Operation field
disp: Displacement
IMM: Immediate data
abs: Absolute address
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0
Section 2 CPU
2.5
Instruction Set
The H8/300L Series can use a total of 55 instructions, which are grouped by function in table 2.3.
Table 2.3
Instruction Set
Function
Instructions
*1
Number
*1
Data transfer
MOV, PUSH , POP
1
Arithmetic operations
ADD, SUB, ADDX, SUBX, INC, DEC, ADDS,
SUBS, DAA, DAS, MULXU, DIVXU, CMP, NEG
14
Logic operations
AND, OR, XOR, NOT
4
Shift
SHAL, SHAR, SHLL, SHLR, ROTL, ROTR,
ROTXL, ROTXR
8
Bit manipulation
14
Branch
BSET, BCLR, BNOT, BTST, BAND, BIAND, BOR,
BIOR, BXOR, BIXOR, BLD, BILD, BST, BIST
2
Bcc* , JMP, BSR, JSR, RTS
System control
RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP
8
Block data transfer
EEPMOV
1
5
Total: 55
Notes: 1. PUSH Rn is equivalent to MOV.W Rn, @–SP.
POP Rn is equivalent to MOV.W @SP+, Rn.
2. Bcc is a conditional branch instruction. The same applies to machine language.
Tables 2.4 to 2.11 show the function of each instruction. The notation used is defined next.
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Section 2 CPU
Notation
Rd
General register (destination)
Rs
General register (source)
Rn
General register
(EAd), <Ead>
Destination operand
(EAs), <Eas>
Source operand
CCR
Condition code register
N
N (negative) flag of CCR
Z
Z (zero) flag of CCR
V
V (overflow) flag of CCR
C
C (carry) flag of CCR
PC
Program counter
SP
Stack pointer
#IMM
Immediate data
disp
Displacement
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
AND logical
∨
OR logical
⊕
Exclusive OR logical
→
Move
~
Logical negation (logical complement)
:3
3-bit length
:8
8-bit length
:16
16-bit length
( ), < >
Contents of operand indicated by effective address
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Section 2 CPU
2.5.1
Data Transfer Instructions
Table 2.4 describes the data transfer instructions. Figure 2.5 shows their object code formats.
Table 2.4
Data Transfer Instructions
Instruction
Size*
Function
MOV
B/W
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general
register and memory, or moves immediate data to a general register.
The Rn, @Rn, @(d:16, Rn), @aa:16, #xx:16, @–Rn, and @Rn+
addressing modes are available for word data. The @aa:8 addressing
mode is available for byte data only.
The @–R7 and @R7+ modes require a word-size specification.
POP
W
@SP+ → Rn
Pops a general register from the stack. Equivalent to MOV.W @SP+,
Rn.
PUSH
W
Rn → @–SP
Pushes general register onto the stack. Equivalent to MOV.W Rn,
@–SP.
Notes: * Size: Operand size
B: Byte
W: Word
Certain precautions are required in data access. See section 2.9.1, Notes on Data Access, for
details.
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15
8
7
0
op
rm
15
8
8
Rm→Rn
7
0
op
15
rn
MOV
rm
rn
rm
rn
@Rm←→Rn
7
0
op
@(d:16, Rm)←→Rn
disp
15
8
7
0
op
rm
15
8
op
7
0
rn
15
@Rm+→Rn, or
Rn →@–Rm
rn
abs
8
@aa:8←→Rn
7
0
op
rn
@aa:16←→Rn
abs
15
8
op
7
0
rn
15
IMM
8
#xx:8→Rn
7
0
op
rn
#xx:16→Rn
IMM
15
8
7
op
0
1
1
1
rn
Legend:
op:
Operation field
rm, rn: Register field
disp: Displacement
abs:
Absolute address
IMM: Immediate data
Figure 2.5 Data Transfer Instruction Codes
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PUSH, POP
@SP+ → Rn, or
Rn → @–SP
Section 2 CPU
2.5.2
Arithmetic Operations
Table 2.5 describes the arithmetic instructions.
Table 2.5
Arithmetic Instructions
Instruction
Size*
Function
ADD
B/W
Rd ± Rs → Rd, Rd + #IMM → Rd
SUB
ADDX
Performs addition or subtraction on data in two general registers, or
addition on immediate data and data in a general register. Immediate
data cannot be subtracted from data in a general register. Word data
can be added or subtracted only when both words are in general
registers.
B
SUBX
INC
Performs addition or subtraction with carry on data in two general
registers, or addition or subtraction with carry on immediate data and
data in a general register.
B
DEC
ADDS
Rd ± 1 → Rd, Rd ± 2 → Rd
Adds or subtracts 1 or 2 to or from a general register
B
DAS
MULXU
Rd ± 1 → Rd
Increments or decrements a general register
W
SUBS
DAA
Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Rd decimal adjust → Rd
Decimal-adjusts (adjusts to packed BCD) an addition or subtraction
result in a general register by referring to the CCR
B
Rd × Rs → Rd
Performs 8-bit × 8-bit unsigned multiplication on data in two general
registers, providing a 16-bit result
DIVXU
B
Rd ÷ Rs → Rd
Performs 16-bit ÷ 8-bit unsigned division on data in two general
registers, providing an 8-bit quotient and 8-bit remainder
CMP
B/W
Rd – Rs, Rd – #IMM
Compares data in a general register with data in another general
register or with immediate data, and indicates the result in the CCR.
Word data can be compared only between two general registers.
NEG
B
0 – Rd → Rd
Obtains the two’s complement (arithmetic complement) of data in a
general register
Notes: * Size: Operand size
B: Byte
W: Word
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Section 2 CPU
2.5.3
Logic Operations
Table 2.6 describes the four instructions that perform logic operations.
Table 2.6
Logic Operation Instructions
Instruction
Size*
Function
AND
B
Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register and another
general register or immediate data
OR
B
Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register and another
general register or immediate data
XOR
B
Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general register and
another general register or immediate data
NOT
B
~ Rd → Rd
Obtains the one’s complement (logical complement) of general
register contents
Notes: * Size: Operand size
B: Byte
2.5.4
Shift Operations
Table 2.7 describes the eight shift instructions.
Table 2.7
Shift Instructions
Instruction
Size*
Function
SHAL
B
Rd shift → Rd
SHAR
SHLL
Performs an arithmetic shift operation on general register contents
B
SHLR
ROTL
B
ROTR
ROTXL
ROTXR
Rd shift → Rd
Performs a logical shift operation on general register contents
Rd rotate → Rd
Rotates general register contents
B
Rd rotate → Rd
Rotates general register contents through the C (carry) bit
Notes: * Size: Operand size
B: Byte
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Section 2 CPU
Figure 2.6 shows the instruction code format of arithmetic, logic, and shift instructions.
15
8
7
op
0
rm
15
8
7
0
op
15
8
7
0
rm
8
op
rn
7
7
op
0
rm
8
op
AND, OR, XOR (Rm)
0
IMM
8
op
rn
7
rn
15
ADD, ADDX, SUBX,
CMP (#XX:8)
IMM
8
15
MULXU, DIVXU
0
rn
15
ADDS, SUBS, INC, DEC,
DAA, DAS, NEG, NOT
rn
op
15
ADD, SUB, CMP,
ADDX, SUBX (Rm)
rn
AND, OR, XOR (#xx:8)
7
0
rn
SHAL, SHAR, SHLL, SHLR,
ROTL, ROTR, ROTXL, ROTXR
Legend:
op:
Operation field
rm, rn: Register field
IMM: Immediate data
Figure 2.6 Arithmetic, Logic, and Shift Instruction Codes
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Section 2 CPU
2.5.5
Bit Manipulations
Table 2.8 describes the bit-manipulation instructions. Figure 2.7 shows their object code formats.
Table 2.8
Bit-Manipulation Instructions
Instruction
Size*
Function
BSET
B
1 → (<bit-No.> of <EAd>)
Sets a specified bit in a general register or memory to 1. The bit
number is specified by 3-bit immediate data or the lower three bits of
a general register.
BCLR
B
0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory to 0. The bit
number is specified by 3-bit immediate data or the lower three bits of
a general register.
BNOT
B
~ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory. The bit number
is specified by 3-bit immediate data or the lower three bits of a
general register.
BTST
B
~ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory and sets or
clears the Z flag accordingly. The bit number is specified by 3-bit
immediate data or the lower three bits of a general register.
BAND
B
C ∧ (<bit-No.> of <EAd>) → C
ANDs the C flag with a specified bit in a general register or memory,
and stores the result in the C flag.
BIAND
B
C ∧ [~ (<bit-No.> of <EAd>)] → C
ANDs the C flag with the inverse of a specified bit in a general
register or memory, and stores the result in the C flag.
The bit number is specified by 3-bit immediate data.
BOR
B
C ∨ (<bit-No.> of <EAd>) → C
ORs the C flag with a specified bit in a general register or memory,
and stores the result in the C flag.
BIOR
B
C ∨ [~ (<bit-No.> of <EAd>)] → C
ORs the C flag with the inverse of a specified bit in a general register
or memory, and stores the result in the C flag.
The bit number is specified by 3-bit immediate data.
Notes: * Size: Operand size
B: Byte
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Section 2 CPU
Instruction
Size*
Function
BXOR
B
C ⊕ (<bit-No.> of <EAd>) → C
XORs the C flag with a specified bit in a general register or memory,
and stores the result in the C flag.
BIXOR
B
C ⊕ [~(<bit-No.> of <EAd>)] → C
XORs the C flag with the inverse of a specified bit in a general
register or memory, and stores the result in the C flag.
The bit number is specified by 3-bit immediate data.
BLD
B
(<bit-No.> of <EAd>) → C
Copies a specified bit in a general register or memory to the C flag.
BILD
B
~ (<bit-No.> of <EAd>) → C
Copies the inverse of a specified bit in a general register or memory
to the C flag.
The bit number is specified by 3-bit immediate data.
BST
B
BIST
B
C → (<bit-No.> of <EAd>)
Copies the C flag to a specified bit in a general register or memory.
~ C → (<bit-No.> of <EAd>)
Copies the inverse of the C flag to a specified bit in a general register
or memory.
The bit number is specified by 3-bit immediate data.
Notes: * Size: Operand size
B: Byte
Certain precautions are required in bit manipulation. See section 2.9.2, Notes on Bit Manipulation,
for details.
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Section 2 CPU
BSET, BCLR, BNOT, BTST
15
8
7
0
op
IMM
15
8
7
op
0
rm
15
8
0
rn
0
0
0
0 Operand: register indirect (@Rn)
IMM
0
0
0
0 Bit No.:
op
8
Operand: register direct (Rn)
Bit No.: register direct (Rm)
rn
7
op
15
Operand: register direct (Rn)
Bit No.: immediate (#xx:3)
rn
7
immediate (#xx:3)
0
op
rn
0
0
0
0 Operand: register indirect (@Rn)
op
rm
0
0
0
0 Bit No.:
15
8
7
0
op
abs
op
IMM
15
8
0
Operand: absolute (@aa:8)
0
0
7
0 Bit No.:
immediate (#xx:3)
0
op
abs
op
register direct (Rm)
rm
0
Operand: absolute (@aa:8)
0
0
0 Bit No.:
register direct (Rm)
BAND, BOR, BXOR, BLD, BST
15
8
7
0
op
IMM
15
8
7
op
0
rn
0
0
0
0 Operand: register indirect (@Rn)
IMM
0
0
0
0 Bit No.:
op
15
8
Operand: register direct (Rn)
Bit No.: immediate (#xx:3)
rn
7
0
op
abs
op
immediate (#xx:3)
IMM
0
Operand: absolute (@aa:8)
0
0
0 Bit No.:
immediate (#xx:3)
Legend:
op:
Operation field
rm, rn: Register field
abs:
Absolute address
IMM: Immediate data
Figure 2.7 Bit Manipulation Instruction Codes
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Section 2 CPU
BIAND, BIOR, BIXOR, BILD, BIST
15
8
7
op
0
IMM
15
8
7
op
op
15
8
Operand: register direct (Rn)
Bit No.: immediate (#xx:3)
rn
0
rn
0
0
0
0 Operand: register indirect (@Rn)
IMM
0
0
0
0 Bit No.:
7
0
op
abs
op
immediate (#xx:3)
IMM
0
Operand: absolute (@aa:8)
0
0
0 Bit No.:
immediate (#xx:3)
Legend:
op:
Operation field
rm, rn: Register field
abs:
Absolute address
IMM: Immediate data
Figure 2.7 Bit Manipulation Instruction Codes (cont)
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Section 2 CPU
2.5.6
Branching Instructions
Table 2.9 describes the branching instructions. Figure 2.8 shows their object code formats.
Table 2.9
Branching Instructions
Instruction
Size*
Function
Bcc
Branches to the designated address if condition cc is true. The
branching conditions are given below.
Mnemonic
Description
Condition
BRA (BT)
Always (true)
Always
BRN (BF)
Never (false)
Never
BHI
High
C∨Z=0
BLS
Low or same
C∨Z=1
BCC (BHS)
Carry clear (high or same)
C=0
BCS (BLO)
Carry set (low)
C=1
BNE
Not equal
Z=0
BEQ
Equal
Z=1
BVC
Overflow clear
V=0
BVS
Overflow set
V=1
BPL
Plus
N=0
BMI
Minus
N=1
BGE
Greater or equal
N⊕V=0
BLT
Less than
N⊕V=1
BGT
Greater than
Z ∨ (N ⊕ V) = 0
BLE
Less or equal
Z ∨ (N ⊕ V) = 1
JMP
Branches unconditionally to a specified address
BSR
Branches to a subroutine at a specified address
JSR
Branches to a subroutine at a specified address
RTS
Returns from a subroutine
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Section 2 CPU
15
8
op
7
0
cc
15
disp
8
7
op
0
rm
15
Bcc
8
0
0
0
7
0
JMP (@Rm)
0
op
JMP (@aa:16)
abs
15
8
7
0
op
abs
15
8
JMP (@@aa:8)
7
0
op
disp
15
8
7
op
0
rm
15
BSR
8
0
0
0
7
0
JSR (@Rm)
0
op
JSR (@aa:16)
abs
15
8
7
op
0
abs
15
8
7
JSR (@@aa:8)
0
op
RTS
Legend:
op: Operation field
cc: Condition field
rm: Register field
disp: Displacement
abs: Absolute address
Figure 2.8 Branching Instruction Codes
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Section 2 CPU
2.5.7
System Control Instructions
Table 2.10 describes the system control instructions. Figure 2.9 shows their object code formats.
Table 2.10 System Control Instructions
Instruction
Size*
Function
RTE
Returns from an exception-handling routine
SLEEP
Causes a transition from active mode to a power-down mode. See
section 5, Power-Down Modes, for details.
LDC
B
Rs → CCR, #IMM → CCR
Moves immediate data or general register contents to the condition
code register
STC
B
CCR → Rd
ANDC
B
CCR ∧ #IMM → CCR
Copies the condition code register to a specified general register
Logically ANDs the condition code register with immediate data
ORC
B
CCR ∨ #IMM → CCR
Logically ORs the condition code register with immediate data
XORC
B
CCR ⊕ #IMM → CCR
Logically exclusive-ORs the condition code register with immediate
data
NOP
PC + 2 → PC
Only increments the program counter
Notes: * Size: Operand size
B: Byte
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15
8
7
0
op
15
8
RTE, SLEEP, NOP
7
0
op
15
rn
8
7
op
LDC, STC (Rn)
0
ANDC, ORC,
XORC, LDC (#xx:8)
IMM
Legend:
op: Operation field
rn: Register field
IMM: Immediate data
Figure 2.9 System Control Instruction Codes
2.5.8
Block Data Transfer Instruction
Table 2.11 describes the block data transfer instruction. Figure 2.10 shows its object code format.
Table 2.11 Block Data Transfer Instruction
Instruction
Size
Function
EEPMOV
If R4L ≠ 0 then
repeat @R5+ → @R6+
R4L – 1 → R4L
until
R4L = 0
else next;
Block transfer instruction. Transfers the number of data bytes
specified by R4L from locations starting at the address indicated by
R5 to locations starting at the address indicated by R6. After the
transfer, the next instruction is executed.
Certain precautions are required in using the EEPMOV instruction. See section 2.9.3, Notes on
Use of the EEPMOV Instruction, for details.
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Section 2 CPU
15
8
7
0
op
op
Legend:
op: Operation field
Figure 2.10 Block Data Transfer Instruction Code
2.6
Basic Operational Timing
CPU operation is synchronized by a system clock (φ) or a subclock (φSUB). For details on these
clock signals see section 4, Clock Pulse Generators. The period from a rising edge of φ or φSUB to
the next rising edge is called one state. A bus cycle consists of two states or three states. The cycle
differs depending on whether access is to on-chip memory or to on-chip peripheral modules.
2.6.1
Access to On-Chip Memory (RAM, ROM)
Access to on-chip memory takes place in two states. The data bus width is 16 bits, allowing access
in byte or word size. Figure 2.11 shows the on-chip memory access cycle.
Bus cycle
T1 state
T2 state
φ or φ SUB
Internal address bus
Address
Internal read signal
Internal data bus
(read access)
Read data
Internal write signal
Internal data bus
(write access)
Write data
Figure 2.11 On-Chip Memory Access Cycle
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Section 2 CPU
2.6.2
Access to On-Chip Peripheral Modules
On-chip peripheral modules are accessed in two states or three states. The data bus width is 8 bits,
so access is by byte size only. This means that for accessing word data, two instructions must be
used.
Two-State Access to On-Chip Peripheral Modules: Figure 2.12 shows the operation timing in
the case of two-state access to an on-chip peripheral module.
Bus cycle
T2 state
T1 state
φ or φ SUB
Internal address bus
Address
Internal read signal
Internal data bus
(read access)
Read data
Internal write signal
Internal data bus
(write access)
Write data
Figure 2.12 On-Chip Peripheral Module Access Cycle (2-State Access)
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Section 2 CPU
Three-State Access to On-Chip Peripheral Modules: Figure 2.13 shows the operation timing in
the case of three-state access to an on-chip peripheral module.
Bus cycle
T1 state
T2 state
T3 state
φ or φ SUB
Internal
address bus
Address
Internal
read signal
Internal
data bus
(read access)
Read data
Internal
write signal
Internal
data bus
(write access)
Write data
Figure 2.13 On-Chip Peripheral Module Access Cycle (3-State Access)
2.7
CPU States
2.7.1
Overview
There are four CPU states: the reset state, program execution state, program halt state, and
exception-handling state. The program execution state includes active (high-speed or mediumspeed) mode and subactive mode. In the program halt state there are a sleep (high-speed or
medium-speed) mode, standby mode, watch mode, and sub-sleep mode. These states are shown in
figure 2.14. Figure 2.15 shows the state transitions.
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Section 2 CPU
CPU state
Reset state
The CPU is initialized
Program
execution state
Active
(high speed) mode
The CPU executes successive program
instructions at high speed,
synchronized by the system clock
Active
(medium speed) mode
The CPU executes successive
program instructions at
reduced speed, synchronized
by the system clock
Subactive mode
The CPU executes
successive program
instructions at reduced
speed, synchronized
by the subclock
Program halt state
A state in which some
or all of the chip
functions are stopped
to conserve power
Low-power
modes
Sleep (high-speed)
mode
Sleep (medium-speed)
mode
Standby mode
Watch mode
Subsleep mode
Exceptionhandling state
A transient state in which the CPU changes
the processing flow due to a reset or an interrupt
Note: See section 5, Power-Down Modes, for details on the modes and their transitions.
Figure 2.14 CPU Operation States
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Section 2 CPU
Reset cleared
Reset state
Exception-handling state
Reset occurs
Reset
occurs
Reset
occurs
Interrupt
source
Program halt state
Exception- Exceptionhandling
handling
request
complete
Program execution state
SLEEP instruction executed
Figure 2.15 State Transitions
2.7.2
Program Execution State
In the program execution state the CPU executes program instructions in sequence.
There are three modes in this state, two active modes (high speed and medium speed) and one
subactive mode. Operation is synchronized with the system clock in active mode (high speed and
medium speed), and with the subclock in subactive mode. See section 5, Power-Down Modes for
details on these modes.
2.7.3
Program Halt State
In the program halt state there are five modes: two sleep modes (high speed and medium speed),
standby mode, watch mode, and subsleep mode. See section 5, Power-Down Modes for details on
these modes.
2.7.4
Exception-Handling State
The exception-handling state is a transient state occurring when exception handling is started by a
reset or interrupt and the CPU changes its normal processing flow. In exception handling caused
by an interrupt, SP (R7) is referenced and the PC and CCR values are saved on the stack.
For details on interrupt handling, see section 3.3, Interrupts.
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Section 2 CPU
2.8
Memory Map
Figure 2.16 shows a memory map of the H8/3644 Group.
H'0000
H'002F
H'0030
H'1FFF
H8/3640
Interrupt vectors
H8/3641
H8/3642
12 kbytes
12 kbytes
H8/3643
H8/3644
8 kbytes
H'2FFF
24 kbytes
H'3FFF
32 kbytes
On-chip ROM
H'5FFF
H'7FFF
Reserved
H'F770
H'F77F
Internal I/O registers
(16 bytes)
Reserved
H'FB80
H'FF7F
H'FF80
H'FF7F
H'FF80
On-chip RAM
512 bytes
512 bytes
512 bytes
1 kbyte
1 kbyte
Reserved
H'FF9F
H'FFA0
H'FFFF
Internal I/O registers
(128 bytes)
Figure 2.16 H8/3644 Group Memory Map
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Section 2 CPU
2.9
Application Notes
2.9.1
Notes on Data Access
1. Access to empty areas
The address space of the H8/300L CPU includes empty areas in addition to the RAM,
registers, and ROM areas available to the user. If these empty areas are mistakenly accessed by
an application program, the following results will occur.
Data transfer from CPU to empty area:
The transferred data will be lost. This action may also cause the CPU to misoperate.
Data transfer from empty area to CPU:
Unpredictable data is transferred.
2. Access to internal I/O registers
Internal data transfer to or from on-chip modules other than the ROM and RAM areas makes
use of an 8-bit data width. If word access is attempted to these areas, the following results will
occur.
Word access from CPU to I/O register area:
Upper byte: Will be written to I/O register.
Lower byte: Transferred data will be lost.
Word access from I/O register to CPU:
Upper byte: Will be written to upper part of CPU register.
Lower byte: Unpredictable data will be written to lower part of CPU register.
Byte size instructions should therefore be used when transferring data to or from I/O registers
other than the on-chip ROM and RAM areas. Figure 2.17 shows the data size and number of states
in which on-chip peripheral modules can be accessed.
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Section 2 CPU
Access
Word Byte States
H'0000
H'002F
H'0030
Interrupt vector area
(48 bytes)
2
On-chip ROM
H'7FFF
Reserved
—
Internal I/O registers
(16 bytes)
×
Reserved
—
—
—
H'F770
3*
H'F77F
—
—
H'FB80
On-chip RAM
1,024 bytes
2
H'FF7F
H'FF80
H'FF9F
Reserved
—
Internal I/O registers
(96 bytes)
×
—
—
H'FFA0
2 or 3*
H'FFFF
Notes: The H8/3644 is shown as an example.
* Internal I/O registers in areas assigned to timer X (H'F770 to H'F77F),
SCI3 (H'FFA8 to H'FFAD), and timer V (H'FFB8 to H'FFBD) are accessed in three
states.
Figure 2.17 Data Size and Number of States for Access to and from
On-Chip Peripheral Modules
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Section 2 CPU
2.9.2
Notes on Bit Manipulation
The BSET, BCLR, BNOT, BST, and BIST instructions read one byte of data, modify the data,
then write the data byte again. Special care is required when using these instructions in cases
where two registers are assigned to the same address, in the case of registers that include writeonly bits, and when the instruction accesses an I/O port.
Order of Operation
Operation
1
Read
Read byte data at the designated address
2
Modify
Modify a designated bit in the read data
3
Write
Write the altered byte data to the designated address
Bit Manipulation in Two Registers Assigned to the Same Address
Example 1: timer load register and timer counter
Figure 2.18 shows an example in which two timer registers share the same address. When a bit
manipulation instruction accesses the timer load register and timer counter of a reloadable timer,
since these two registers share the same address, the following operations take place.
Order of Operation
Operation
1
Timer counter data is read (one byte)
Read
2
Modify
The CPU modifies (sets or resets) the bit designated in the instruction
3
Write
The altered byte data is written to the timer load register
The timer counter is counting, so the value read is not necessarily the same as the value in the
timer load register. As a result, bits other than the intended bit in the timer load register may be
modified to the timer counter value.
R
Count clock
Timer counter
R: Read
W: Write
Reload
W
Timer load register
Internal bus
Figure 2.18 Timer Configuration Example
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Section 2 CPU
Example 2: BSET instruction executed designating port 3
P37 and P36 are designated as input pins, with a low-level signal input at P37 and a high-level
signal at P36. The remaining pins, P35 to P30, are output pins and output low-level signals. In this
example, the BSET instruction is used to change pin P30 to high-level output.
[A: Prior to executing BSET]
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
0
[B: BSET instruction executed]
BSET
#0
,
@PDR3
The BSET instruction is executed designating port 3.
[C: After executing BSET]
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR3
0
0
1
1
1
1
1
1
PDR3
0
1
0
0
0
0
0
1
[D: Explanation of how BSET operates]
When the BSET instruction is executed, first the CPU reads port 3.
Since P37 and P36 are input pins, the CPU reads the pin states (low-level and high-level input).
P35 to P30 are output pins, so the CPU reads the value in PDR3. In this example PDR3 has a value
of H'80, but the value read by the CPU is H'40.
Next, the CPU sets bit 0 of the read data to 1, changing the PDR3 data to H'41. Finally, the CPU
writes this value (H'41) to PDR3, completing execution of BSET.
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Section 2 CPU
As a result of this operation, bit 0 in PDR3 becomes 1, and P30 outputs a high-level signal.
However, bits 7 and 6 of PDR3 end up with different values.
To avoid this problem, store a copy of the PDR3 data in a work area in memory. Perform the bit
manipulation on the data in the work area, then write this data to PDR3.
[A: Prior to executing BSET]
MOV. B
MOV. B
MOV. B
#80,
R0L,
R0L,
R0L
@RAM0
@PDR3
The PDR3 value (H'80) is written to a work area in
memory (RAM0) as well as to PDR3.
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
0
RAM0
1
0
0
0
0
0
0
0
[B: BSET instruction executed]
BSET
#0
,
@RAM0
The BSET instruction is executed designating the PDR3
work area (RAM0).
[C: After executing BSET]
MOV. B
MOV. B
@RAM0, R0L
R0L, @PDR3
The work area (RAM0) value is written to PDR3.
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
1
RAM0
1
0
0
0
0
0
0
1
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Section 2 CPU
Bit Manipulation in a Register Containing a Write-Only Bit
Example 3: BCLR instruction executed designating port 3 control register PCR3
As in the examples above, P37 and P36 are input pins, with a low-level signal input at P37 and a
high-level signal at P36. The remaining pins, P35 to P30, are output pins that output low-level
signals. In this example, the BCLR instruction is used to change pin P30 to an input port. It is
assumed that a high-level signal will be input to this input pin.
[A: Prior to executing BCLR]
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
0
[B: BCLR instruction executed]
BCLR
#0
,
@PCR3
The BCLR instruction is executed designating PCR3.
[C: After executing BCLR]
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Output
Output
Output
Output
Output
Output
Output
Input
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR3
1
1
1
1
1
1
1
0
PDR3
1
0
0
0
0
0
0
0
[D: Explanation of how BCLR operates]
When the BCLR instruction is executed, first the CPU reads PCR3. Since PCR3 is a write-only
register, the CPU reads a value of H'FF, even though the PCR3 value is actually H'3F.
Next, the CPU clears bit 0 in the read data to 0, changing the data to H'FE. Finally, this value
(H'FE) is written to PCR3 and BCLR instruction execution ends.
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Section 2 CPU
As a result of this operation, bit 0 in PCR3 becomes 0, making P30 an input port. However, bits 7
and 6 in PCR3 change to 1, so that P37 and P36 change from input pins to output pins.
To avoid this problem, store a copy of the PCR3 data in a work area in memory. Perform the bit
manipulation on the data in the work area, then write this data to PCR3.
[A: Prior to executing BCLR]
MOV. B
MOV. B
MOV. B
#3F,
R0L,
R0L,
R0L
@RAM0
@PCR3
The PCR3 value (H'3F) is written to a work area in
memory (RAM0) as well as to PCR3.
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
0
RAM0
0
0
1
1
1
1
1
1
[B: BCLR instruction executed]
BCLR
#0
,
@RAM0
The BCLR instruction is executed designating the PCR3
work area (RAM0).
[C: After executing BCLR]
MOV. B
MOV. B
@RAM0, R0L
R0L, @PCR3
The work area (RAM0) value is written to PCR3.
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR3
0
0
1
1
1
1
1
0
PDR3
1
0
0
0
0
0
0
0
RAM0
0
0
1
1
1
1
1
0
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Section 2 CPU
Table 2.12 lists the pairs of registers that share identical addresses. Table 2.13 lists the registers
that contain write-only bits.
Table 2.12 Registers with Shared Addresses
Register Name
Abbreviation
Address
Output compare register AH and output compare register BH (timer X) OCRAH/OCRBH H'F774
Output compare register AL and output compare register BL (timer X) OCRAL/OCRBL H'F775
Timer counter B1 and timer load register B1 (timer B1)
TCB1/TLB1
H'FFB3
Port data register 1*
PDR1
H'FFD4
Port data register 2*
PDR2
H'FFD5
Port data register 3*
PDR3
H'FFD6
Port data register 5*
PDR5
H'FFD8
Port data register 6*
PDR6
H'FFD9
Port data register 7*
PDR7
H'FFDA
Port data register 8*
PDR8
H'FFDB
Port data register 9*
PDR9
H'FFDC
Note:
*
Port data registers have the same addresses as input pins.
Table 2.13 Registers with Write-Only Bits
Register Name
Abbreviation
Address
Port control register 1
PCR1
H'FFE4
Port control register 2
PCR2
H'FFE5
Port control register 3
PCR3
H'FFE6
Port control register 5
PCR5
H'FFE8
Port control register 6
PCR6
H'FFE9
Port control register 7
PCR7
H'FFEA
Port control register 8
PCR8
H'FFEB
Port control register 9
PCR9
H'FFEC
PWM control register
PWCR
H'FFD0
PWM data register U
PWDRU
H'FFD1
PWM data register L
PWDRL
H'FFD2
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Section 2 CPU
2.9.3
Notes on Use of the EEPMOV Instruction
• The EEPMOV instruction is a block data transfer instruction. It moves the number of bytes
specified by R4L from the address specified by R5 to the address specified by R6.
R5 →
← R6
R5 + R4L →
← R6 + R4L
• When setting R4L and R6, make sure that the final destination address (R6 + R4L) does not
exceed H'FFFF. The value in R6 must not change from H'FFFF to H'0000 during execution of
the instruction.
R5 →
R5 + R4L →
← R6
H'FFFF
Not allowed
Rev. 6.00 Sep 12, 2006 page 58 of 526
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← R6 + R4L
Section 3 Exception Handling
Section 3 Exception Handling
3.1
Overview
Exception handling is performed in the H8/3644 Group when a reset or interrupt occurs. Table 3.1
shows the priorities of these two types of exception handling.
Table 3.1
Exception Handling Types and Priorities
Priority
Exception Source
Time of Start of Exception Handling
High
Reset
Exception handling starts as soon as the reset state is cleared
Interrupt
When an interrupt is requested, exception handling starts after
execution of the present instruction or the exception handling
in progress is completed
Low
3.2
Reset
3.2.1
Overview
A reset is the highest-priority exception. The internal state of the CPU and the registers of the onchip peripheral modules are initialized.
3.2.2
Reset Sequence
Reset by RES Pin: As soon as the RES pin goes low, all processing is stopped and the chip enters
the reset state.
To make sure the chip is reset properly, observe the following precautions.
• At power on: Hold the RES pin low until the clock pulse generator output stabilizes.
• Resetting during operation: Hold the RES pin low for at least 10 system clock cycles.
Reset exception handling begins when the RES pin is held low for a given period, then returned to
the high level.
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Section 3 Exception Handling
Reset exception handling takes place as follows.
• The CPU internal state and the registers of on-chip peripheral modules are initialized, with the
I bit of the condition code register (CCR) set to 1.
• The PC is loaded from the reset exception handling vector address (H'0000 to H'0001), after
which the program starts executing from the address indicated in PC.
When system power is turned on or off, the RES pin should be held low.
Figure 3.1 shows the reset sequence starting from RES input.
Reset cleared
Program initial
instruction prefetch
Vector fetch Internal
processing
RES
φ
Internal
address bus
(1)
(2)
Internal read
signal
Internal write
signal
Internal data
bus (16-bit)
(2)
(1) Reset exception handling vector address (H'0000)
(2) Program start address
(3) First instruction of program
Figure 3.1 Reset Sequence
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(3)
Section 3 Exception Handling
Reset by Watchdog Timer: The watchdog timer counter (TCW) starts counting up when the
WDON bit is set to 1 in the watchdog timer control/status register (TCSRW). If TCW overflows,
the WRST bit is set to 1 in TCSRW and the chip enters the reset state. While the WRST bit is set
to 1 in TCSRW, when TCW overflows the reset state is cleared and reset exception handling
begins. The same reset exception handling is carried out as for input at the RES pin. For details on
the watchdog timer, see section 9.6, Watchdog Timer.
3.2.3
Interrupt Immediately after Reset
After a reset, if an interrupt were to be accepted before the stack pointer (SP: R7) was initialized,
PC and CCR would not be pushed onto the stack correctly, resulting in program runaway. To
prevent this, immediately after reset exception handling all interrupts are masked. For this reason,
the initial program instruction is always executed immediately after a reset. This instruction should
initialize the stack pointer (e.g. MOV.W #xx: 16, SP).
3.3
Interrupts
3.3.1
Overview
The interrupt sources include 12 external interrupts (IRQ3 to IRQ0, INT7 to INT0) and 21 internal
interrupts from on-chip peripheral modules. Table 3.2 shows the interrupt sources, their priorities,
and their vector addresses. When more than one interrupt is requested, the interrupt with the
highest priority is processed.
The interrupts have the following features:
• Internal and external interrupts can be masked by the I bit in CCR. When the I bit is set to 1,
interrupt request flags can be set but the interrupts are not accepted.
• IRQ3 to IRQ0 and INT7 to INT0 can be set independently to either rising edge sensing or falling
edge sensing.
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Section 3 Exception Handling
Table 3.2
Interrupt Sources and Their Priorities
Interrupt Source
Interrupt
Vector Number
Vector Address
RES
Reset
0
H'0000 to H'0001 High
IRQ0
IRQ0
4
H'0008 to H'0009
IRQ1
IRQ1
5
H'000A to H'000B
IRQ2
IRQ2
6
H'000C to H'000D
IRQ3
IRQ3
7
H'000E to H'000F
INT0
INT0
8
H'0010 to H'0011
INT1
INT2
INT1
INT2
INT3
INT4
INT3
INT4
INT5
INT6
INT5
INT6
INT7
INT7
Timer A
Timer A overflow
10
H'0014 to H'0015
Timer B1
Timer B1 overflow
11
H'0016 to H'0017
Timer X
Timer X input capture A
Timer X input capture B
16
H'0020 to H'0021
17
H'0022 to H'0023
Priority
Timer X input capture C
Timer X input capture D
Timer X compare match A
Timer X compare match B
Timer X overflow
Timer V
Timer V compare match A
Timer V compare match B
Timer V overflow
SCI1
SCI1 transfer complete
19
H'0026 to H'0027
SCI3
SCI3 transmit end
21
H'002A to H'002B
SCI3 transmit data empty
SCI3 receive data full
SCI3 overrun error
SCI3 framing error
SCI3 parity error
A/D
A/D conversion end
22
H'002C to H'002D
(SLEEP instruction
executed)
Direct transfer
23
H'002E to H'002F Low
Note: Vector addresses H'0002 to H'0007, H'0012 to H'0013, H'0018 to H'001F, H'0024 to
H'0025, H'0028 to H'0029 are reserved and cannot be used.
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Section 3 Exception Handling
3.3.2
Interrupt Control Registers
Table 3.3 lists the registers that control interrupts.
Table 3.3
Interrupt Control Registers
Name
Abbreviation
R/W
Initial Value
Address
Interrupt edge select register 1
IEGR1
R/W
H'70
H'FFF2
Interrupt edge select register 2
IEGR2
R/W
H'00
H'FFF3
Interrupt enable register 1
IENR1
R/W
H'10
H'FFF4
Interrupt enable register 2
IENR2
R/W
H'00
H'FFF5
Interrupt enable register 3
IENR3
R/W
H'00
H'FFF6
Interrupt request register 1
IRR1
H'10
H'FFF7
Interrupt request register 2
IRR2
R/W *
R/W *
H'00
H'FFF8
IRR3
R/W *
H'00
H'FFF9
Interrupt request register 3
Note:
*
Write is enabled only for writing of 0 to clear a flag.
Interrupt Edge Select Register 1 (IEGR1)
Bit
7
6
5
4
3
2
1
0
IEG3
IEG2
IEG1
IEG0
Initial value
0
1
1
1
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
IEGR1 is an 8-bit read/write register used to designate whether pins IRQ3 to IRQ0 are set to rising
edge sensing or falling edge sensing. Upon reset, IEGR1 is initialized to H'70.
Bit 7
Reserved Bit: Bit 7 is reserved: it is always read as 0 and cannot be modified.
Bits 6 to 4
Reserved Bits: Bits 6 to 4 are reserved; they are always read as 1, and cannot be
modified.
Bit 3
IRQ3 Edge Select (IEG3): Bit 3 selects the input sensing of pin IRQ3.
Bit 3: IEG3
Description
0
Falling edge of IRQ3 pin input is detected
1
Rising edge of IRQ3 pin input is detected
(initial value)
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Section 3 Exception Handling
Bit 2IRQ2 Edge Select (IEG2): Bit 2 selects the input sensing of pin IRQ2.
Bit 2: IEG2
Description
0
Falling edge of IRQ2 pin input is detected
1
Rising edge of IRQ2 pin input is detected
(initial value)
Bit 1
IRQ1 Edge Select (IEG1): Bit 1 selects the input sensing of pin IRQ1.
Bit 1: IEG1
Description
0
Falling edge of IRQ1 pin input is detected
1
Rising edge of IRQ1 pin input is detected
(initial value)
Bit 0
IRQ0 Edge Select (IEG0): Bit 0 selects the input sensing of pin IRQ0.
Bit 0: IEG0
Description
0
Falling edge of IRQ0 pin input is detected
1
Rising edge of IRQ0 pin input is detected
(initial value)
Interrupt Edge Select Register 2 (IEGR2)
Bit
7
6
5
4
3
2
1
0
INTEG7 INTEG6 INTEG5 INTEG4 INTEG3 INTEG2 INTEG1 INTEG0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
IEGR2 is an 8-bit read/write register, used to designate whether pins INT7 to INT0, and TMIB are
set to rising edge sensing or falling edge sensing. Upon reset, IEGR2 is initialized to H'00.
Bit 7
INT7 Edge Select (INTEG7): Bit 7 selects the input sensing of the INT7 pin.
Bit 7: INTEG7
Description
0
Falling edge of INT7 pin input is detected
1
Rising edge of INT7 pin input is detected
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(initial value)
Section 3 Exception Handling
Bit 6
INT6 Edge Select (INTEG6): Bit 6 selects the input sensing of the INT6 pin and TMIB
pin.
Bit 6: INTEG6
Description
0
Falling edge of INT6 and TMIB pin input is detected
1
Rising edge of INT6 and TMIB pin input is detected
(initial value)
Bit 5
INT5 Edge Select (INTEG5): Bit 5 selects the input sensing of the INT5 pin and ADTRG
pin.
Bit 5: INTEG5
Description
0
Falling edge of INT5 and ADTRG pin input is detected
1
Rising edge of INT5 and ADTRG pin input is detected
(initial value)
Bits 4 to 0
INT4 to INT0 Edge Select (INTEG4 to INTEG0): Bits 4 to 0 select the input
sensing of pins INT4 to INT0.
Bit n: INTEGn
Description
0
Falling edge of INTn pin input is detected
1
Rising edge of INTn pin input is detected
(initial value)
(n = 4 to 0)
Interrupt Enable Register 1 (IENR1)
Bit
7
6
5
4
3
2
1
0
IENTB1
IENTA
IEN3
IEN2
IEN1
IEN0
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
IENR1 is an 8-bit read/write register that enables or disables interrupt requests. Upon reset, IENR1
is initialized to H'10.
Bit 7
Timer B1 Interrupt Enable (IENTB1): Bit 7 enables or disables timer B1 overflow
interrupt requests.
Bit 7: IENTB1
Description
0
Disables timer B1 interrupt requests
1
Enables timer B1 interrupt requests
(initial value)
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Section 3 Exception Handling
Bit 6
Timer A Interrupt Enable (IENTA): Bit 6 enables or disables timer A overflow interrupt
requests.
Bit 6: IENTA
Description
0
Disables timer A interrupt requests
1
Enables timer A interrupt requests
(initial value)
Bit 5
Reserved Bit: Bit 5 is reserved: it is always read as 0 and cannot be modified.
Bit 4
Reserved Bit: Bit 4 is reserved; it is always read as 1, and cannot be modified.
Bits 3 to 0
IRQ3 to IRQ0 Interrupt Enable (IEN3 to IEN0): Bits 3 to 0 enable or disable IRQ3
to IRQ0 interrupt requests.
Bit n: IENn
Description
0
Disables interrupt requests from pin IRQn
1
Enables interrupt requests from pin IRQn
(initial value)
(n = 3 to 0)
Interrupt Enable Register 2 (IENR2)
Bit
7
6
5
4
3
2
1
0
IENDT
IENAD
IENS1
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
IENR2 is an 8-bit read/write register that enables or disables interrupt requests. Upon reset, IENR2
is initialized to H'00.
Bit 7
Direct Transfer Interrupt Enable (IENDT): Bit 7 enables or disables direct transfer
interrupt requests.
Bit 7: IENDT
Description
0
Disables direct transfer interrupt requests
1
Enables direct transfer interrupt requests
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(initial value)
Section 3 Exception Handling
Bit 6
A/D Converter Interrupt Enable (IENAD): Bit 6 enables or disables A/D converter
interrupt requests.
Bit 6: IENAD
Description
0
Disables A/D converter interrupt requests
1
Enables A/D converter interrupt requests
(initial value)
Bit 5
Reserved Bit: Bit 5 is reserved: it is always read as 0 and cannot be modified.
Bit 4
SCI1 Interrupt Enable (IENS1): Bit 4 enables or disables SCI1 transfer complete
interrupt requests.
Bit 4: IENS1
Description
0
Disables SCI1 interrupt requests
1
Enables SCI1 interrupt requests
(initial value)
Bits 3 to 0
Reserved Bits: Bits 3 to 0 are reserved: they are always read as 0 and cannot be
modified.
Interrupt Enable Register 3 (IENR3)
Bit
7
6
INTEN7 INTEN6
5
4
3
2
INTEN5
INTEN4
INTEN3
INTEN2
1
0
INTEN1 INTEN0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
IENR3 is an 8-bit read/write register that enables or disables INT7 to INT0 interrupt requests.
Upon reset, IENR3 is initialized to H'00.
Bits 7 to 0
INT7 to INT0 Interrupt Enable (INTEN7 to INTEN0): Bits 7 to 0 enable or
disable INT7 to INT0 interrupt requests.
Bit n: INTENn
Description
0
Disables interrupt requests from pin INTn
1
Enables interrupt requests from pin INTn
(initial value)
(n = 7 to 0)
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Section 3 Exception Handling
Interrupt Request Register 1 (IRR1)
Bit
7
6
5
4
3
2
1
0
IRRTB1
IRRTA
IRRI3
IRRI2
IRRI1
IRRI0
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/W *
R/W *
R/W *
R/W *
R/W *
R/W *
Note:
*
Only a write of 0 for flag clearing is possible.
IRR1 is an 8-bit read/write register, in which a corresponding flag is set to 1 when a timer B1,
timer A, or IRQ3 to IRQ0 interrupt is requested. The flags are not cleared automatically when an
interrupt is accepted. It is necessary to write 0 to clear each flag. Upon reset, IRR1 is initialized to
H'10.
Bit 7
Timer B1 Interrupt Request Flag (IRRTB1)
Bit 7: IRRTB1
Description
0
Clearing condition:
When IRRTB1 = 1, it is cleared by writing 0
1
Setting condition:
When the timer B1 counter value overflows from H'FF to H'00
(initial value)
Bit 6
Timer A Interrupt Request Flag (IRRTA)
Bit 6: IRRTA
Description
0
Clearing condition:
When IRRTA = 1, it is cleared by writing 0
1
Setting condition:
When the timer A counter value overflows from H'FF to H'00
(initial value)
Bit 5
Reserved Bit: Bit 5 is reserved: it is always read as 0 and cannot be modified.
Bit 4
Reserved Bit: Bit 4 is reserved; it is always read as 1, and cannot be modified.
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Section 3 Exception Handling
Bits 3 to 0
IRQ3 to IRQ0 Interrupt Request Flags (IRRI3 to IRRI0)
Bit n: IRRIn
Description
0
Clearing condition:
When IRRIn = 1, it is cleared by writing 0
1
Setting condition:
When pin IRQn is designated for interrupt input and the designated signal edge
is input
(initial value)
(n = 3 to 0)
Interrupt Request Register 2 (IRR2)
Bit
7
6
5
4
3
2
1
0
IRRDT
IRRAD
IRRS1
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W *
R/W *
R/W *
Note:
*
Only a write of 0 for flag clearing is possible.
IRR2 is an 8-bit read/write register, in which a corresponding flag is set to 1 when a direct
transfer, A/D converter, or SCI1 interrupt is requested. The flags are not cleared automatically
when an interrupt is accepted. It is necessary to write 0 to clear each flag. Upon reset, IRR2 is
initialized to H'00.
Bit 7Direct Transfer Interrupt Request Flag (IRRDT)
Bit 7: IRRDT
Description
0
Clearing condition:
When IRRDT = 1, it is cleared by writing 0
1
Setting condition:
When a direct transfer is made by executing a SLEEP instruction while DTON
= 1 in SYSCR2
(initial value)
Bit 6A/D Converter Interrupt Request Flag (IRRAD)
Bit 6: IRRAD
Description
0
Clearing condition:
When IRRAD = 1, it is cleared by writing 0
1
Setting condition:
When A/D conversion is completed and ADSF is cleared to 0 in ADSR
(initial value)
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Section 3 Exception Handling
Bit 5Reserved bit: Bit 5 is reserved: it is always read as 0 and cannot be modified.
Bit 4SCI1 Interrupt Request Flag (IRRS1)
Bit 4: IRRS1
Description
0
Clearing condition:
When IRRS1 = 1, it is cleared by writing 0
1
Setting condition:
When an SCI1 transfer is completed
(initial value)
Bits 3 to 0Reserved Bits: Bits 3 to 0 are reserved: they are always read as 0 and cannot be
modified.
Interrupt Request Register 3 (IRR3)
Bit
7
6
5
4
3
2
1
0
INTF7
INTF6
INTF5
INTF4
INTF3
INTF2
INTF1
INTF0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W *
R/W *
R/W *
R/W *
R/W *
R/W *
R/W *
R/W *
Note:
*
Only a write of 0 for flag clearing is possible.
IRR3 is an 8-bit read/write register, in which a corresponding flag is set to 1 by a transition at pin
INT7 to INT0. The flags are not cleared automatically when an interrupt is accepted. It is necessary
to write 0 to clear each flag. Upon reset, IRR3 is initialized to H'00.
Bits 7 to 0INT7 to INT0 Interrupt Request Flags (INTF7 to INTF0)
Bit n: INTFn
Description
0
Clearing condition:
When INTFn = 1, it is cleared by writing 0
1
Setting condition:
When the designated signal edge is input at pin INTn
(initial value)
(n = 7 to 0)
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Section 3 Exception Handling
3.3.3
External Interrupts
There are 12 external interrupts: IRQ3 to IRQ0 and INT7 to INT0.
Interrupts IRQ3 to IRQ0: Interrupts IRQ3 to IRQ0 are requested by input signals to pins IRQ3 to
IRQ0. These interrupts are detected by either rising edge sensing or falling edge sensing,
depending on the settings of bits IEG3 to IEG0 in IEGR1.
When these pins are designated as pins IRQ3 to IRQ0 in port mode register 1 and the designated
edge is input, the corresponding bit in IRR1 is set to 1, requesting an interrupt. Recognition of
these interrupt requests can be disabled individually by clearing bits IEN3 to IEN0 to 0 in IENR1.
These interrupts can all be masked by setting the I bit to 1 in CCR.
When IRQ3 to IRQ0 interrupt exception handling is initiated, the I bit is set to 1 in CCR. Vector
numbers 7 to 4 are assigned to interrupts IRQ3 to IRQ0. The order of priority is from IRQ0 (high)
to IRQ3 (low). Table 3.2 gives details.
INT Interrupts: INT interrupts are requested by input signals to pins INT7 to INT0. These
interrupts are detected by either rising edge sensing or falling edge sensing, depending on the
settings of bits INTEG7 to INTEG0 in IEGR2.
When the designated edge is input at pins INT7 to INT0, the corresponding bit in IRR3 is set to 1,
requesting an interrupt. Recognition of these interrupt requests can be disabled individually by
clearing bits INTEN7 to INTEN0 to 0 in IENR3. These interrupts can all be masked by setting the
I bit to 1 in CCR.
When INT interrupt exception handling is initiated, the I bit is set to 1 in CCR. Vector number 8 is
assigned to the INT interrupts. All eight interrupts have the same vector number, so the interrupthandling routine must discriminate the interrupt source.
Note: Pins INT7 to INT0 are multiplexed with port 5. Even in port usage of these pins, whenever
the designated edge is input or output, the corresponding bit INTFn is set to 1.
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Section 3 Exception Handling
3.3.4
Internal Interrupts
There are 21 internal interrupts that can be requested by the on-chip peripheral modules. When a
peripheral module requests an interrupt, the corresponding bit in IRR1 or IRR2 is set to 1.
Recognition of individual interrupt requests can be disabled by clearing the corresponding bit in
IENR1 or IENR2 to 0. All these interrupts can be masked by setting the I bit to 1 in CCR. When
internal interrupt handling is initiated, the I bit is set to 1 in CCR. Vector numbers from 23 to 9 are
assigned to these interrupts. Table 3.2 shows the order of priority of interrupts from on-chip
peripheral modules.
3.3.5
Interrupt Operations
Interrupts are controlled by an interrupt controller. Figure 3.2 shows a block diagram of the
interrupt controller. Figure 3.3 shows the flow up to interrupt acceptance.
Priority decision logic
Interrupt controller
External or
internal
interrupts
Interrupt
request
External
interrupts or
internal
interrupt
enable
signals
I
CCR (CPU)
Figure 3.2 Block Diagram of Interrupt Controller
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Section 3 Exception Handling
Interrupt operation is described as follows.
• If an interrupt occurs while the interrupt enable register bit is set to 1, an interrupt request
signal is sent to the interrupt controller.
• When the interrupt controller receives an interrupt request, it sets the interrupt request flag.
• From among the interrupts with interrupt request flags set to 1, the interrupt controller selects
the interrupt request with the highest priority and holds the others pending. (Refer to
table 3.2 for a list of interrupt priorities.)
• The interrupt controller checks the I bit of CCR. If the I bit is 0, the selected interrupt request
is accepted; if the I bit is 1, the interrupt request is held pending.
• If the interrupt is accepted, after processing of the current instruction is completed, both PC
and CCR are pushed onto the stack. The state of the stack at this time is shown in figure 3.4.
The PC value pushed onto the stack is the address of the first instruction to be executed upon
return from interrupt handling.
• The I bit of CCR is set to 1, masking further interrupts.
• The vector address corresponding to the accepted interrupt is generated, and the interrupt
handling routine located at the address indicated by the contents of the vector address is
executed.
Notes: 1. When disabling interrupts by clearing bits in an interrupt enable register, or when
clearing bits in an interrupt request register, always do so while interrupts are masked
(I = 1).
2. If the above clear operations are performed while I = 0, and as a result a conflict arises
between the clear instruction and an interrupt request, exception processing for the
interrupt will be executed after the clear instruction has been executed.
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Section 3 Exception Handling
Program execution state
IRRI0 = 1
No
Yes
IEN0 = 1
No
Yes
IRRI1 = 1
No
Yes
IEN1 = 1
Yes
No
IRRI2 = 1
No
Yes
IEN2 = 1
No
Yes
IRRDT = 1
No
Yes
IENDT = 1
Yes
No
I=0
Yes
PC contents saved
CCR contents saved
I←1
Branch to interrupt
handling routine
Legend:
PC: Program counter
CCR: Condition code register
I bit of CCR
I:
Figure 3.3 Flow up to Interrupt Acceptance
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No
Section 3 Exception Handling
SP – 4
SP (R7)
CCR
SP – 3
SP + 1
CCR
SP – 2
SP + 2
PCH
SP – 1
SP + 3
PCL
SP (R7)
SP + 4
Even address
Stack area
Prior to start of interrupt
exception handling
PC and CCR
saved to stack
After completion of interrupt
exception handling
Legend:
PCH: Upper 8 bits of program counter (PC)
PCL: Lower 8 bits of program counter (PC)
CCR: Condition code register
SP: Stack pointer
Notes: 1. PC shows the address of the first instruction to be executed upon return from the interrupt
handling routine.
2. Register contents must always be saved and restored by word access, starting from
an even-numbered address.
Figure 3.4 Stack State after Completion of Interrupt Exception Handling
Figure 3.5 shows a typical interrupt sequence where the program area is in the on-chip ROM and
the stack area is in the on-chip RAM.
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Figure 3.5 Interrupt Sequence
(2)
(1)
(4)
Instruction
prefetch
(3)
Internal
processing
(5)
(1)
Stack access
(6)
(7)
(9)
Vector fetch
(8)
(1) Instruction prefetch address (Instruction is not executed. Address is saved as PC contents, becoming return address.)
(2)(4) Instruction code (not executed)
(3) Instruction prefetch address (Instruction is not executed.)
(5) SP – 2
(6) SP – 4
(7) CCR
(8) Vector address
(9) Starting address of interrupt-handling routine (contents of vector)
(10) First instruction of interrupt-handling routine
Internal data bus
(16 bits)
Internal write
signal
Internal read
signal
Internal
address bus
φ
Interrupt
request signal
Interrupt level
decision and wait for
end of instruction
Interrupt is
accepted
(10)
(9)
Prefetch instruction of
Internal
interrupt-handling routine
processing
Section 3 Exception Handling
Section 3 Exception Handling
3.3.6
Interrupt Response Time
Table 3.4 shows the number of wait states after an interrupt request flag is set until the first
instruction of the interrupt handler is executed.
Table 3.4
Interrupt Wait States
Item
States
Waiting time for completion of executing instruction*
1 to 13
Saving of PC and CCR to stack
4
Vector fetch
2
Instruction fetch
4
Internal processing
4
Total
15 to 27
Note:
*
Not including EEPMOV instruction.
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Section 3 Exception Handling
3.4
Application Notes
3.4.1
Notes on Stack Area Use
When word data is accessed in the H8/3644 Group, the least significant bit of the address is
regarded as 0. Access to the stack always takes place in word size, so the stack pointer (SP: R7)
should never indicate an odd address. Use PUSH Rn (MOV.W Rn, @–SP) or POP Rn (MOV.W
@SP+, Rn) to save or restore register values.
Setting an odd address in SP may cause a program to crash. An example is shown in figure 3.6.
SP →
SP →
PCH
PC L
R1L
PC L
SP →
H'FEFC
H'FEFD
H'FEFF
BSR instruction
SP set to H'FEFF
MOV. B R1L, @–R7
Stack accessed beyond SP
Contents of PCH are lost
Legend:
PCH: Upper byte of program counter
PCL: Lower byte of program counter
R1L: General register R1L
SP: Stack pointer
Figure 3.6 Operation when Odd Address Is Set in SP
When CCR contents are saved to the stack during interrupt exception handling or restored when
RTE is executed, this also takes place in word size. Both the upper and lower bytes of word data
are saved to the stack; on return, the even address contents are restored to CCR while the odd
address contents are ignored.
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Section 3 Exception Handling
3.4.2
Notes on Rewriting Port Mode Registers
When a port mode register is rewritten to switch the functions of external interrupt pins, the
following points should be observed.
When an external interrupt pin function is switched by rewriting the port mode register that
controls pins IRQ3 to IRQ1, the interrupt request flag may be set to 1 at the time the pin function is
switched, even if no valid interrupt is input at the pin. Table 3.5 shows the conditions under which
interrupt request flags are set to 1 in this way.
Table 3.5
Conditions under which Interrupt Request Flag Is Set to 1
Interrupt Request
Flags Set to 1
IRR1
IRRI3
Conditions
When PMR1 bit IRQ3 is changed from 0 to 1 while pin IRQ3 is low and
IEGR bit IEG3 = 0.
When PMR1 bit IRQ3 is changed from 1 to 0 while pin IRQ3 is low and
IEGR bit IEG3 = 1.
IRRI2
When PMR1 bit IRQ2 is changed from 0 to 1 while pin IRQ2 is low and
IEGR bit IEG2 = 0.
When PMR1 bit IRQ2 is changed from 1 to 0 while pin IRQ2 is low and
IEGR bit IEG2 = 1.
IRRI1
When PMR1 bit IRQ1 is changed from 0 to 1 while pin IRQ1 is low and
IEGR bit IEG1 = 0.
When PMR1 bit IRQ1 is changed from 1 to 0 while pin IRQ1 is low and
IEGR bit IEG1 = 1.
Figure 3.7 shows the procedure for setting a bit in a port mode register and clearing the interrupt
request flag.
When switching a pin function, mask the interrupt before setting the bit in the port mode register.
After accessing the port mode register, execute at least one instruction (e.g., NOP), then clear the
interrupt request flag from 1 to 0. If the instruction to clear the flag is executed immediately after
the port mode register access without executing an intervening instruction, the flag will not be
cleared.
An alternative method is to avoid the setting of interrupt request flags when pin functions are
switched by keeping the pins at the high level so that the conditions in table 3.5 do not occur.
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Section 3 Exception Handling
CCR I bit ← 1
Interrupts masked. (Another possibility
is to disable the relevant interrupt in
interrupt enable register 1.)
Set port mode register bit
Execute NOP instruction
After setting the port mode register bit,
first execute at least one instruction
(e.g., NOP), then clear the interrupt
request flag to 0
Clear interrupt request flag to 0
CCR I bit ← 0
Interrupt mask cleared
Figure 3.7 Port Mode Register Setting and Interrupt Request Flag
Clearing Procedure
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Section 4 Clock Pulse Generators
Section 4 Clock Pulse Generators
4.1
Overview
Clock oscillator circuitry (CPG: clock pulse generator) is provided on-chip, including both a
system clock pulse generator and a subclock pulse generator. The system clock pulse generator
consists of a system clock oscillator and system clock dividers. The subclock pulse generator
consists of a subclock oscillator circuit and a subclock divider.
4.1.1
Block Diagram
Figure 4.1 shows a block diagram of the clock pulse generators.
OSC 1
OSC 2
System clock
oscillator
φOSC
(f OSC)
φOSC/2
System clock
divider (1/2)
φOSC/128
System clock φ
OSC/64
divider
φ
(1/64, 1/32, OSC/32
1/16, 1/8) φOSC/16
φ
Prescaler S
(13 bits)
System clock pulse generator
X1
X2
Subclock
oscillator
φW
(f W )
Subclock
divider
(1/2, 1/4, 1/8)
Subclock pulse generator
φ W/2
φ W/4
φ W/8
φ/2
to
φ/8192
φ SUB
Prescaler W
(5 bits)
φW /2
φW /4
φW /8
to
φW /128
Figure 4.1 Block Diagram of Clock Pulse Generators
4.1.2
System Clock and Subclock
The basic clock signals that drive the CPU and on-chip peripheral modules are φ and φSUB. Four of
the clock signals have names: φ is the system clock, φSUB is the subclock, φOSC is the oscillator
clock, and φW is the watch clock.
The clock signals available for use by peripheral modules are φ/2, φ/4, φ/8, φ/16, φ/32, φ/64,
φ/128, φ/256, φ/512, φ/1024, φ/2048, φ/4096, φ/8192, φW/2, φW/4, φW/8, φW/16, φW/32, φW/64, and
φW/128. The clock requirements differ from one module to another.
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Section 4 Clock Pulse Generators
4.2
System Clock Generator
Clock pulses can be supplied to the system clock divider either by connecting a crystal or ceramic
resonator, or by providing external clock input.
Connecting a Crystal Resonator: Figure 4.2 shows a typical method of connecting a crystal
resonator.
C1
OSC 1
Rf
R f = 1 MΩ ±20%
C1 = C 2 = 12 pF ±20%
OSC 2
C2
Figure 4.2 Typical Connection to Crystal Resonator
Figure 4.3 shows the equivalent circuit of a crystal resonator. An oscillator having the
characteristics given in table 4.1 should be used.
CS
LS
RS
OSC 1
OSC 2
C0
Figure 4.3 Equivalent Circuit of Crystal Resonator
Table 4.1
Crystal Resonator Parameters
Frequency
2 MHz
4 MHz
8 MHz
10 MHz
RS (max)
500 Ω
100 Ω
50 Ω
30 Ω
C0 (max)
7 pF
7 pF
7 pF
7 pF
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Section 4 Clock Pulse Generators
Connecting a Ceramic Resonator: Figure 4.4 shows a typical method of connecting a ceramic
resonator.
C1
OSC 1
Rf
OSC 2
C2
R f = 1 MΩ ±20%
C1 = 30 pF ±10%
C2 = 30 pF ±10%
Ceramic resonator: Murata
Figure 4.4 Typical Connection to Ceramic Resonator
Notes on Board Design: When generating clock pulses by connecting a crystal or ceramic
resonator, pay careful attention to the following points.
Avoid running signal lines close to the oscillator circuit, since the oscillator may be adversely
affected by induction currents. (See figure 4.5.)
The board should be designed so that the oscillator and load capacitors are located as close as
possible to pins OSC1 and OSC2.
To be avoided
Signal A Signal B
C2
OSC 1
OSC 2
C1
Figure 4.5 Board Design of Oscillator Circuit
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Section 4 Clock Pulse Generators
External Clock Input Method: Connect an external clock signal to pin OSC1, and leave pin
OSC2 open. Figure 4.6 shows a typical connection.
OSC 1
External clock input
OSC 2
Open
Figure 4.6 External Clock Input (Example)
Frequency
Oscillator Clock (φ
φOSC)
Duty cycle
45% to 55%
4.3
Subclock Generator
Connecting a 32.768-kHz Crystal Resonator: Clock pulses can be supplied to the subclock
divider by connecting a 32.768-kHz crystal resonator, as shown in figure 4.7. Follow the same
precautions as noted under section 4.2, Notes on Board Design.
C1
X1
X2
C2
C1 = C 2 = 15 pF (typ.)
Figure 4.7 Typical Connection to 32.768-kHz Crystal Resonator
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Section 4 Clock Pulse Generators
Figure 4.8 shows the equivalent circuit of the 32.768-kHz crystal resonator.
CS
LS
RS
X1
X2
C0
C0 = 1.5 pF (typ.)
RS = 14 k Ω (typ.)
f W = 32.768 kHz
Crystal resonator:MX38T
(Nihon Denpa Kogyo)
Figure 4.8 Equivalent Circuit of 32.768-kHz Crystal Resonator
Pin Connection when Not Using Subclock: When the subclock is not used, connect pin X1 to
VCC and leave pin X2 open, as shown in figure 4.9.
VCC
X1
X2
Open
Figure 4.9 Pin Connection when not Using Subclock
4.4
Prescalers
The H8/3644 Group is equipped with two on-chip prescalers having different input clocks
(prescaler S and prescaler W). Prescaler S is a 13-bit counter using the system clock (φ) as its
input clock. Its prescaled outputs provide internal clock signals for on-chip peripheral modules.
Prescaler W is a 5-bit counter using a 32.768-kHz signal divided by 4 (φW/4) as its input clock. Its
prescaled outputs are used by timer A as a time base for timekeeping.
Prescaler S (PSS): Prescaler S is a 13-bit counter using the system clock (φ) as its input clock. It
is incremented once per clock period.
Prescaler S is initialized to H'0000 by a reset, and starts counting on exit from the reset state.
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Section 4 Clock Pulse Generators
In standby mode, watch mode, subactive mode, and subsleep mode, the system clock pulse
generator stops. Prescaler S also stops and is initialized to H'0000.
The CPU cannot read or write prescaler S.
The output from prescaler S is shared by the on-chip peripheral modules. The divider ratio can be
set separately for each on-chip peripheral function.
In active (medium-speed) mode the clock input to prescaler S is determined by the division factor
designated by MA1 and MA0 in SYSCR1.
Prescaler W (PSW): Prescaler W is a 5-bit counter using a 32.768 kHz signal divided by 4 (φW/4)
as its input clock.
Prescaler W is initialized to H'00 by a reset, and starts counting on exit from the reset state.
Even in standby mode, watch mode, subactive mode, or subsleep mode, prescaler W continues
functioning so long as clock signals are supplied to pins X1 and X2.
Prescaler W can be reset by setting 1s in bits TMA3 and TMA2 of timer mode register A (TMA).
Output from prescaler W can be used to drive timer A, in which case timer A functions as a time
base for timekeeping.
4.5
Note on Oscillators
Oscillator characteristics are closely related to board design and should be carefully evaluated by
the user, referring to the examples shown in this section. Oscillator circuit constants will differ
depending on the oscillator element, stray capacitance in its interconnecting circuit, and other
factors. Suitable constants should be determined in consultation with the oscillator element
manufacturer. Design the circuit so that the oscillator element never receives voltages exceeding
its maximum rating.
Rev. 6.00 Sep 12, 2006 page 86 of 526
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Section 5 Power-Down Modes
Section 5 Power-Down Modes
5.1
Overview
The H8/3644 Group has eight modes of operation after a reset. These include seven power-down
modes, in which power dissipation is significantly reduced. Table 5.1 gives a summary of the eight
operating modes.
Table 5.1
Operating Modes
Operating Mode
Description
Active (high-speed) mode
The CPU and all on-chip peripheral functions are operable on
the system clock
Active (medium-speed) mode
The CPU and all on-chip peripheral functions are operable on
the system clock, but at 1/64, 1/32, 1/6, or 1/8* the speed in
active (high-speed) mode
Subactive mode
The CPU, and the time-base function of timer A are operable
on the subclock
Sleep (high-speed) mode
The CPU halts. On-chip peripheral functions except PWM are
operable on the system clock
Sleep (medium-speed) mode
The CPU halts. On-chip peripheral functions except PWM are
operable on the system clock, but at 1/64, 1/32, 1/6, or 1/8* the
speed in active (high-speed) mode
Subsleep mode
The CPU halts. The time-base function of timer A are operable
on the subclock
Watch mode
The CPU halts. The time-base function of timer A is operable
on the subclock
Standby mode
The CPU and all on-chip peripheral functions halt
Note:
*
Determined by the value set in bits MA1 and MA0 of system control register 1
(SYSCR1).
Of these eight operating modes, all but the active (high-speed) mode are power-down modes. In
this section the two active modes (high-speed and medium speed) will be referred to collectively
as active mode, and the two sleep modes (high-speed and medium speed) will be referred to
collectively as sleep mode.
Figure 5.1 shows the transitions among these operation modes. Table 5.2 indicates the internal
states in each mode.
Rev. 6.00 Sep 12, 2006 page 87 of 526
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Section 5 Power-Down Modes
Program
execution state
Reset state
*1
SLEEP
instruction*e
Watch
mode
Subactive
mode
*1
P *
EE tion
L
c
S ru
st
inin SL
st E
ru EP
ct
io
n *b
SLEEP
instruction*b
*3
Sleep
(medium-speed)
mode
ins SLEE
tru P
cti
on *j
S
ins LE
tru EP
ctio
n *i
*e
EP on
E
i
t
SL ruc
st
in
SLEEP
instruction*i
Active
(medium-speed)
mode
SLEEP
instruction*h
ins SLEE
tru
ctio P
n *e
*4
SLEEP
instruction*g
SL
instr EEP
uctio *d
n
*1
Sleep
(high-speed)
mode
*3
a
SLEEP
instruction*f
Standby
mode
SLEEP
instruction*a
Active
(high-speed)
mode
P *d
EE n
SL uctio
tr
ins *4
Program
halt state
Program
halt state
SLEEP
instruction*c
Subsleep
mode
*2
Power-down modes
Mode Transition Conditions (2)
Mode Transition Conditions (1)
LSON MSON SSBY TMA3 DTON
a
b
0
0
0
c
d
e
1
0
*
*
*
*
f
g
0
0
0
1
h
i
J
0
1
0
1
1
*
0
0
0
0
1
1
0
0
1
1
1
*
*
1
0
1
*
*
1
1
1
0
0
0
0
0
Interrupt Sources
1
Timer A interrupt, IRQ0 interrupt
2
Timer a interrupt, IRQ3 to IRQ0 interrupts,
INT interrupt
3
All interrupts
4
IRQ1 or IRQ0 interrupt
1
1
1
1
1
* Don’t care
Notes: 1. A transition between different modes cannot be made to occur simply because an interrupt
request is generated. Make sure that interrupt handling is performed after the interrupt is
accepted.
2. Details on the mode transition conditions are given in the explanations of each mode,
in sections 5.2 through 5.8.
Figure 5.1 Mode Transition Diagram
Rev. 6.00 Sep 12, 2006 page 88 of 526
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Section 5 Power-Down Modes
Table 5.2
Internal State in Each Operating Mode
Active Mode
HighSpeed
Function
MediumSpeed
Sleep Mode
HighSpeed
MediumSpeed
Watch
Mode
Subactive Subsleep
Mode
Mode
Standby
Mode
System clock oscillator
Functions
Functions
Functions
Functions
Halted
Halted
Halted
Halted
Subclock oscillator
Functions
Functions
Functions
Functions
Functions
Functions
Functions
Functions
CPU
operations
Functions
Functions
Halted
Halted
Halted
Functions
Halted
Halted
Retained
Retained
Retained
Retained
Retained
Instructions
Registers
RAM
1
Retained*
I/O ports
External
interrupts
IRQ0
Functions
Functions
Functions
Functions
Functions
Functions
Functions
Functions
2
Retained*
IRQ1
Retained*2
IRQ2
IRQ3
INT0
Functions
Functions
Functions
Functions
Retained*2 Functions
Functions
Functions
Functions
Functions
Functions*3 Functions*3 Functions*3 Retained
Functions
Retained*2
INT1
INT2
INT3
INT4
INT5
INT6
INT7
Peripheral
functions
Timer A
Timer B1
Retained
Retained
Retained
Timer V
Reset
Reset
Reset
Reset
Retained
Retained
Retained
Retained
Reset
Reset
Reset
Reset
Retained
Retained
Retained
Retained
Timer X
Watchdog
timer
SCI1
SCI3
PWM
Retained
Retained
A/D
converter
Functions
Functions
Notes: 1. Register contents are retained, but output is high-impedance state.
2. External interrupt requests are ignored. Interrupt request register contents are not
altered.
3. Functions if timekeeping time-base function is selected.
Rev. 6.00 Sep 12, 2006 page 89 of 526
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Section 5 Power-Down Modes
5.1.1
System Control Registers
The operation mode is selected using the system control registers described in table 5.3.
Table 5.3
System Control Registers
Name
Abbreviation
R/W
Initial Value
Address
System control register 1
SYSCR1
R/W
H'07
H'FFF0
System control register 2
SYSCR2
R/W
H'E0
H'FFF1
System Control Register 1 (SYSCR1)
Bit
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
LSON
MA1
MA0
Initial value
0
0
0
0
0
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SYSCR1 is an 8-bit read/write register for control of the power-down modes.
Upon reset, SYSCR1 is initialized to H'07.
Bit 7
Software Standby (SSBY): This bit designates transition to standby mode or watch mode.
Bit 7: SSBY
Description
0
•
When a SLEEP instruction is executed in active mode, a transition is made
to sleep mode
•
When a SLEEP instruction is executed in subactive mode, a transition is
made to subsleep mode
(initial value)
•
When a SLEEP instruction is executed in active mode, a transition is made
to standby mode or watch mode
•
When a SLEEP instruction is executed in subactive mode, a transition is
made to watch mode
1
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Section 5 Power-Down Modes
Bits 6 to 4
Standby Timer Select 2 to 0 (STS2 to STS0): These bits designate the time the
CPU and peripheral modules wait for stable clock operation after exiting from standby mode or
watch mode to active mode due to an interrupt. The designation should be made according to the
clock frequency so that the waiting time is at least 10 ms.
Bit 6: STS2
Bit 5: STS1
Bit 4: STS0
Description
0
0
0
Wait time = 8,192 states
1
Wait time = 16,384 states
0
Wait time = 32,768 states
1
Wait time = 65,536 states
*
Wait time = 131,072 states
1
1
*
(initial value)
Legend: * Don’t care
Bit 3
Low Speed on Flag (LSON): This bit chooses the system clock (φ) or subclock (φSUB) as
the CPU operating clock when watch mode is cleared. The resulting operation mode depends on
the combination of other control bits and interrupt input.
Bit 3: LSON
Description
0
The CPU operates on the system clock (φ)
1
The CPU operates on the subclock (φSUB)
(initial value)
Bits 2
Reserved Bits: Bit 2 is reserved: it is always read as 1 and cannot be modified.
Bits 1 and 0
Active (Medium-Speed) Mode Clock Select (MA1, MA0): Bits 1 and 0 choose
φosc/128, φosc/64, φosc/32, or φosc/16 as the operating clock in active (medium-speed) mode and
sleep (medium-speed) mode. MA1 and MA0 should be written in active (high-speed) mode or
subactive mode.
Bit 1: MA1
Bit 0: MA0
Description
0
0
φosc/16
1
φosc/32
0
φosc/64
1
φosc/128
1
(initial value)
Rev. 6.00 Sep 12, 2006 page 91 of 526
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Section 5 Power-Down Modes
System Control Register 2 (SYSCR2)
Bit
7
6
5
4
3
2
1
0
NESEL
DTON
MSON
SA1
SA0
Initial value
1
1
1
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
SYSCR2 is an 8-bit read/write register for power-down mode control.
Upon reset, SYSCR2 is initialized to H'E0.
Bits 7 to 5
Reserved Bits: These bits are reserved; they are always read as 1, and cannot be
modified.
Bit 4
Noise Elimination Sampling Frequency Select (NESEL): This bit selects the frequency
at which the watch clock signal (φW) generated by the subclock pulse generator is sampled, in
relation to the oscillator clock (φOSC) generated by the system clock pulse generator. When φOSC =
2 to 10 MHz, clear NESEL to 0.
Bit 4: NESEL
Description
0
Sampling rate is φOSC/16
1
Sampling rate is φOSC/4
Rev. 6.00 Sep 12, 2006 page 92 of 526
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(initial value)
Section 5 Power-Down Modes
Bit 3
Direct Transfer on Flag (DTON): This bit designates whether or not to make direct
transitions among active (high-speed), active (medium-speed) and subactive mode when a SLEEP
instruction is executed. The mode to which the transition is made after the SLEEP instruction is
executed depends on a combination of this and other control bits.
Bit 3: DTON
Description
0
•
When a SLEEP instruction is executed in active mode, a transition is made
to standby mode, watch mode, or sleep mode
•
When a SLEEP instruction is executed in subactive mode, a transition is
made to watch mode or subsleep mode
(initial value)
•
When a SLEEP instruction is executed in active (high-speed) mode, a
direct transition is made to active (medium-speed) mode if SSBY = 0,
MSON = 1, and LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1,
and LSON = 1
•
When a SLEEP instruction is executed in active (medium-speed) mode, a
direct transition is made to active (high-speed) mode if SSBY = 0, MSON =
0, and LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1, and LSON
=1
•
When a SLEEP instruction is executed in subactive mode, a direct
transition is made to active (high-speed) mode if SSBY = 1, TMA3 = 1,
LSON = 0, and MSON = 0, or to active (medium-speed) mode if SSBY = 1,
TMA3 = 1, LSON = 0, and MSON = 1
1
Bit 2
Medium Speed on Flag (MSON): After standby, watch, or sleep mode is cleared, this bit
selects active (high-speed), active (medium-speed), or sleep (medium-speed) mode.
Bit 2: MSON
Description
0
•
After standby, watch, or sleep mode is cleared, operation is in active (highspeed) mode
•
When a SLEEP instruction is executed in active mode, a transition is made
to sleep (high-speed) mode
(initial value)
•
After standby, watch, or sleep mode is cleared, operation is in active
(medium-speed) mode
•
When a SLEEP instruction is executed in active mode, a transition is made
to sleep (medium-speed) mode
1
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Section 5 Power-Down Modes
Bits 1 and 0
Subactive Mode Clock Select (SA1 and SA0): These bits select the CPU clock
rate (φW/2, φW/4, or φW/8) in subactive mode. SA1 and SA0 cannot be modified in subactive mode.
Bit 1: SA1
Bit 0: SA0
Description
0
0
φW /8
1
φW /4
*
φW /2
1
(initial value)
Legend: * Don’t care
5.2
Sleep Mode
5.2.1
Transition to Sleep Mode
Transition to Sleep (High-Speed) Mode: The system goes from active mode to sleep (highspeed) mode when a SLEEP instruction is executed while the SSBY and LSON bits in SYSCR1
and the MSON and DTON bits in SYSCR2 are all cleared to 0. In sleep (high-speed) mode CPU
operation is halted but the on-chip peripheral functions other than PWM are operational. CPU
register contents are retained.
Transition to Sleep (Medium-Speed) Mode: The system goes from active mode to sleep
(medium-speed) mode when a SLEEP instruction is executed while the SSBY and LSON bits in
SYSCR1 are cleared to 0, the MSON bit in SYSCR2 is set to 1, and the DTON bit in SYSCR2 is
cleared to 0. In sleep (medium-speed) mode, as in sleep (high-speed) mode, CPU operation is
halted but the on-chip peripheral functions other than PWM are operational. The clock frequency
in sleep (medium-speed) mode is determined by the MA1 and MA0 bits in SYSCR1. CPU register
contents are retained.
5.2.2
Clearing Sleep Mode
Sleep mode is cleared by any interrupt (timer A, timer B1, timer X, timer V, IRQ3 to IRQ0, INT7
to INT0, SCI3, SCI1, or A/D converter), or by input at the RES pin.
• Clearing by interrupt
When an interrupt is requested, sleep mode is cleared and interrupt exception handling starts.
A transition is made from sleep (high-speed) mode to active (high-speed) mode, or from sleep
(medium-speed) mode to active (medium-speed) mode. Sleep mode is not cleared if the I bit of
the condition code register (CCR) is set to 1 or the particular interrupt is disabled in the
interrupt enable register.
Rev. 6.00 Sep 12, 2006 page 94 of 526
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Section 5 Power-Down Modes
• Clearing by RES input
When the RES pin goes low, the CPU goes into the reset state and sleep mode is cleared.
5.2.3
Clock Frequency in Sleep (Medium-Speed) Mode
Operation in sleep (medium-speed) mode is clocked at the frequency designated by the MA1 and
MA0 bits in SYSCR1.
5.3
Standby Mode
5.3.1
Transition to Standby Mode
The system goes from active mode to standby mode when a SLEEP instruction is executed while
the SSBY bit in SYSCR1 is set to 1, the LSON bit in SYSCR1 is cleared to 0, and bit TMA3 in
TMA is cleared to 0. In standby mode the clock pulse generator stops, so the CPU and on-chip
peripheral modules stop functioning, but as long as the rated voltage is supplied, the contents of
CPU registers, on-chip RAM, and some on-chip peripheral module registers are retained. On-chip
RAM contents will be further retained down to a minimum RAM data retention voltage. The I/O
ports go to the high-impedance state.
5.3.2
Clearing Standby Mode
Standby mode is cleared by an interrupt (IRQ1 or IRQ0) or by input at the RES pin.
• Clearing by interrupt
When an interrupt is requested, the system clock pulse generator starts. After the time set in
bits STS2–STS0 in SYSCR1 has elapsed, a stable system clock signal is supplied to the entire
chip, standby mode is cleared, and interrupt exception handling starts. Operation resumes in
active (high-speed) mode if MSON = 0 in SYSCR2, or active (medium-speed) mode if MSON
= 1. Standby mode is not cleared if the I bit of CCR is set to 1 or the particular interrupt is
disabled in the interrupt enable register.
• Clearing by RES input
When the RES pin goes low, the system clock pulse generator starts. After the pulse generator
output has stabilized, if the RES pin is driven high, the CPU starts reset exception handling.
Since system clock signals are supplied to the entire chip as soon as the system clock pulse
generator starts functioning, the RES pin should be kept at the low level until the pulse
generator output stabilizes.
Rev. 6.00 Sep 12, 2006 page 95 of 526
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Section 5 Power-Down Modes
5.3.3
Oscillator Settling Time after Standby Mode Is Cleared
Bits STS2 to STS0 in SYSCR1 should be set as follows.
• When a crystal oscillator is used
The table 5.4 gives settings for various operating frequencies. Set bits STS2 to STS0 for a
waiting time of at least 10 ms.
Table 5.4
Clock Frequency and Settling Time (times are in ms)
STS2
STS1
STS0
Waiting Time
5 MHz
4 MHz
2 MHz
1 MHz
0.5 MHz
0
0
0
8,192 states
1.6
2.0
4.1
8.2
16.4
0
0
1
16,384 states
3.2
4.1
8.2
16.4
32.8
0
1
0
32,768 states
6.6
8.2
16.4
32.8
65.5
0
1
1
65,536 states
13.1
16.4
32.8
65.5
131.1
1
*
*
131,072 states
26.2
32.8
65.5
131.1
262.1
Legend: * Don’t care
• When an external clock is used
Any values may be set. Normally the minimum time (STS2 = STS1 = STS0 = 0) should be set.
5.4
Watch Mode
5.4.1
Transition to Watch Mode
The system goes from active or subactive mode to watch mode when a SLEEP instruction is
executed while the SSBY bit in SYSCR1 is set to 1 and bit TMA3 in TMA is set to 1.
In watch mode, operation of on-chip peripheral modules other than timer A is halted. As long as a
minimum required voltage is applied, the contents of CPU registers, the on-chip RAM and some
registers of the on-chip peripheral modules, are retained. I/O ports keep the same states as before
the transition.
Rev. 6.00 Sep 12, 2006 page 96 of 526
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Section 5 Power-Down Modes
5.4.2
Clearing Watch Mode
Watch mode is cleared by an interrupt (timer A or IRQ0) or by input at the RES pin.
• Clearing by interrupt
When watch mode is cleared by a timer A interrupt or IRQ0 interrupt, the mode to which a
transition is made depends on the settings of LSON in SYSCR1 and MSON in SYSCR2. If
both LSON and MSON are cleared to 0, transition is to active (high-speed) mode; if LSON = 0
and MSON = 1, transition is to active (medium-speed) mode; if LSON = 1, transition is to
subactive mode. When the transition is to active mode, after the time set in SYSCR1 bits STS2
to STS0 has elapsed, a stable clock signal is supplied to the entire chip, watch mode is cleared,
and interrupt exception handling starts. Watch mode is not cleared if the I bit of CCR is set to 1
or the particular interrupt is disabled in the interrupt enable register.
• Clearing by RES input
Clearing by RES pin is the same as for standby mode; see section 5.3.2, Clearing Standby
Mode.
5.4.3
Oscillator Settling Time after Watch Mode Is Cleared
The waiting time is the same as for standby mode; see section 5.3.3, Oscillator Settling Time after
Standby Mode Is Cleared.
5.5
Subsleep Mode
5.5.1
Transition to Subsleep Mode
The system goes from subactive mode to subsleep mode when a SLEEP instruction is executed
while the SSBY bit in SYSCR1 is cleared to 0, LSON bit in SYSCR1 is set to 1, and TMA3 bit in
TMA is set to 1. In subsleep mode, operation of on-chip peripheral modules other than timer A is
halted. As long as a minimum required voltage is applied, the contents of CPU registers, the onchip RAM and some registers of the on-chip peripheral modules are retained. I/O ports keep the
same states as before the transition.
Rev. 6.00 Sep 12, 2006 page 97 of 526
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Section 5 Power-Down Modes
5.5.2
Clearing Subsleep Mode
Subsleep mode is cleared by an interrupt (timer A, IRQ3 to IRQ0, INT7 to INT0) or by input at the
RES pin.
• Clearing by interrupt
When an interrupt is requested, subsleep mode is cleared and interrupt exception handling
starts. Subsleep mode is not cleared if the I bit of CCR is set to 1 or the particular interrupt is
disabled in the interrupt enable register.
• Clearing by RES input
Clearing by RES pin is the same as for standby mode; see section 5.3.2, Clearing Standby
Mode.
5.6
Subactive Mode
5.6.1
Transition to Subactive Mode
Subactive mode is entered from watch mode if a timer A or IRQ0 interrupt is requested while the
LSON bit in SYSCR1 is set to 1. From subsleep mode, subactive mode is entered if a timer A,
IRQ3 to IRQ0, or INT7 to INT0 interrupt is requested. A transition to subactive mode does not take
place if the I bit of CCR is set to 1 or the particular interrupt is disabled in the interrupt enable
register.
5.6.2
Clearing Subactive Mode
Subactive mode is cleared by a SLEEP instruction or by input at the RES pin.
• Clearing by SLEEP instruction
If a SLEEP instruction is executed while the SSBY bit in SYSCR1 is set to 1 and TMA3 bit in
TMA is set to 1, subactive mode is cleared and watch mode is entered. If a SLEEP instruction
is executed while SSBY = 0 and LSON = 1 in SYSCR1 and TMA3 = 1 in TMA, subsleep
mode is entered. Direct transfer to active mode is also possible; see section 5.8, Direct
Transfer, below.
• Clearing by RES pin
Clearing by RES pin is the same as for standby mode; see section 5.3.2, Clearing Standby
Mode.
Rev. 6.00 Sep 12, 2006 page 98 of 526
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Section 5 Power-Down Modes
5.6.3
Operating Frequency in Subactive Mode
The operating frequency in subactive mode is set in bits SA1 and SA0 in SYSCR2. The choices
are φW/2, φW/4, and φW/8.
5.7
Active (Medium-Speed) Mode
5.7.1
Transition to Active (Medium-Speed) Mode
If the MSON bit in SYSCR2 is set to 1 while the LSON bit in SYSCR1 is cleared to 0, a transition
to active (medium-speed) mode results from IRQ0 or IRQ1 interrupts in standby mode, timer A or
IRQ0 interrupts in watch mode, or any interrupt in sleep (medium-speed) mode. A transition to
active (medium-speed) mode does not take place if the I bit of CCR is set to 1 or the particular
interrupt is disabled in the interrupt enable register.
5.7.2
Clearing Active (Medium-Speed) Mode
Active (medium-speed) mode is cleared by a SLEEP instruction or by input at the RES pin.
• Clearing by SLEEP instruction
A transition to standby mode takes place if the SLEEP instruction is executed while the SSBY
bit in SYSCR1 is set to 1, the LSON bit in SYSCR1 is cleared to 0, and the TMA3 bit in TMA
is cleared to 0. The system goes to watch mode if the SSBY bit in SYSCR1 is set to 1 and bit
TMA3 in TMA is set to 1 when a SLEEP instruction is executed.
When both SSBY and LSON are cleared to 0 in SYSCR1 and a SLEEP instruction is executed,
sleep (high-speed) mode is entered if MSON is cleared to 0 in SYSCR2, and sleep (mediumspeed) mode is entered if MSON is set to 1. Direct transfer to active (high-speed) mode or to
subactive mode is also possible. See section 5.8, Direct Transfer, below for details.
• Clearing by RES pin
When the RES pin goes low, the CPU enters the reset state and active (medium-speed) mode is
cleared.
5.7.3
Operating Frequency in Active (Medium-Speed) Mode
Operation in active (medium-speed) mode is clocked at the frequency designated by the MA1 and
MA0 bits in SYSCR1.
Rev. 6.00 Sep 12, 2006 page 99 of 526
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Section 5 Power-Down Modes
5.8
Direct Transfer
The CPU can execute programs in three modes: active (high-speed) mode, active (medium-speed)
mode, and subactive mode. A direct transfer is a transition among these three modes without the
stopping of program execution. A direct transfer can be made by executing a SLEEP instruction
while the DTON bit in SYSCR2 is set to 1. After the mode transition, direct transfer interrupt
exception handling starts.
If the direct transfer interrupt is disabled in interrupt enable register 2, a transition is made instead
to sleep mode or watch mode. Note that if a direct transition is attempted while the I bit in CCR is
set to 1, sleep mode or watch mode will be entered, and it will be impossible to clear the resulting
mode by means of an interrupt.
• Direct transfer from active (high-speed) mode to active (medium-speed) mode
When a SLEEP instruction is executed in active (high-speed) mode while the SSBY and
LSON bits in SYSCR1 are cleared to 0, the MSON bit in SYSCR2 is set to 1, and the DTON
bit in SYSCR2 is set to 1, a transition is made to active (medium-speed) mode via sleep mode.
• Direct transfer from active (medium-speed) mode to active (high-speed) mode
When a SLEEP instruction is executed in active (medium-speed) mode while the SSBY and
LSON bits in SYSCR1 are cleared to 0, the MSON bit in SYSCR2 is cleared to 0, and the
DTON bit in SYSCR2 is set to 1, a transition is made to active (high-speed) mode via sleep
mode.
• Direct transfer from active (high-speed) mode to subactive mode
When a SLEEP instruction is executed in active (high-speed) mode while the SSBY and
LSON bits in SYSCR1 are set to 1, the DTON bit in SYSCR2 is set to 1, and the TMA3 bit in
TMA is set to 1, a transition is made to subactive mode via watch mode.
• Direct transfer from subactive mode to active (high-speed) mode
When a SLEEP instruction is executed in subactive mode while the SSBY bit in SYSCR1 is
set to 1, the LSON bit in SYSCR1 is cleared to 0, the MSON bit in SYSCR2 is cleared to 0,
the DTON bit in SYSCR2 is set to 1, and the TMA3 bit in TMA is set to 1, a transition is made
directly to active (high-speed) mode via watch mode after the waiting time set in SYSCR1 bits
STS2 to STS0 has elapsed.
• Direct transfer from active (medium-speed) mode to subactive mode
When a SLEEP instruction is executed in active (medium-speed) while the SSBY and LSON
bits in SYSCR1 are set to 1, the DTON bit in SYSCR2 is set to 1, and the TMA3 bit in TMA
is set to 1, a transition is made to subactive mode via watch mode.
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Section 5 Power-Down Modes
• Direct transfer from subactive mode to active (medium-speed) mode
When a SLEEP instruction is executed in subactive mode while the SSBY bit in SYSCR1 is
set to 1, the LSON bit in SYSCR1 is cleared to 0, the MSON bit in SYSCR2 is set to 1, the
DTON bit in SYSCR2 is set to 1, and the TMA3 bit in TMA is set to 1, a transition is made
directly to active (medium-speed) mode via watch mode after the waiting time set in SYSCR1
bits STS2 to STS0 has elapsed.
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Section 5 Power-Down Modes
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Section 6 ROM
Section 6 ROM
6.1
Overview
The H8/3644 has 32 kbytes of on-chip mask ROM, PROM or flash memory. The H8/3643 has 24
kbytes of mask ROM or flash memory. The H8/3642 has 16 kbytes of mask ROM or flash
memory. The H8/3641 has 12 kbytes of on-chip ROM. H8/3640 has 8 kbytes of ROM. The ROM
is connected to the CPU by a 16-bit data bus, allowing high-speed two-state access for both byte
data and word data.
In the PROM version (H8/3644 ZTAT) and flash memory versions (H8/3644 F-ZTAT, H8/3643
F-ZTAT, H8/3642 AF-ZTAT), programs can be written and erased with a general-purpose PROM
programmer. In the on-chip flash memory versions, programs can be written and erased on-board.
6.1.1
Block Diagram
Figure 6.1 shows a block diagram of the on-chip ROM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'0000
H'0000
H'0001
H'0002
H'0002
H'0003
On-chip ROM
H'7FFE
H'7FFE
H'7FFF
Even-numbered
address
Odd-numbered
address
Figure 6.1 ROM Block Diagram (H8/3644)
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Section 6 ROM
6.2
PROM Mode
6.2.1
Setting to PROM Mode
If the on-chip ROM is PROM, setting the chip to PROM mode stops operation as a
microcontroller and allows the PROM to be programmed in the same way as the standard
HN27C256 EPROM. Table 6.1 shows how to set the chip to PROM mode.
Table 6.1
Setting to PROM Mode
Pin Name
Setting
TEST
High level
PB4/AN4
Low level
PB5/AN5
PB6/AN6
6.2.2
High level
Memory Map
Figure 6.2 shows a memory map.
Address in
MCU mode
Address in
PROM mode
H'0000
H'0000
On-chip PROM
H'7FFF
H'7FFF
Figure 6.2 H8/3644 Memory Map in PROM Mode
When programming with a PROM programmer, be sure to specify addresses from H'0000 to
H'7FFF.
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Section 6 ROM
6.3
Programming
The H8/3644 write, verify, and other modes are selected as shown in table 6.2 in PROM mode.
Table 6.2
Mode Selection in PROM Mode (H8/3644)
Pin
Mode
CE
OE
VPP
VCC
EO7 to EO0
EA14 to EA0
Write
L
H
VPP
VCC
Data input
Address input
Verify
H
L
VPP
VCC
Data output
Address input
Programming
disabled
H
H
VPP
VCC
High impedance
Address input
Legend:
L: Low level
H: High level
VPP: VPP level
VCC: VCC level
The specifications for writing and reading are identical to those for the standard HN27C256
EPROM.
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Section 6 ROM
6.3.1
Writing and Verifying
An efficient, high-speed, high-reliability method is available for writing and verifying the PROM
data. This method achieves high speed without voltage stress on the device and without lowering
the reliability of written data. Data in unused address areas has a value of H'FF. The basic flow of
this high-speed, high-reliability programming method is shown in figure 6.3.
Start
Set write/verify mode
VCC = 6.0 V ±0.25 V, VPP = 12.5 V ±0.3 V
Address = 0
n=0
n+1 →n
No
Yes
n < 25
Write time tPW = 0.2 ms ±5%
NG
Address + 1 → address
Verify
OK
Write time tOPW = 3n ms
Last address?
No
Yes
Set read mode
VCC = 5.0 V ±0.5 V, VPP = VCC
Error
NG
Read all
addresses?
Yes
End
Figure 6.3 High-Speed, High-Reliability Programming Flow Chart
Rev. 6.00 Sep 12, 2006 page 106 of 526
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Section 6 ROM
Table 6.3 and table 6.4 give the electrical characteristics in programming mode.
Table 6.3
DC Characteristics
(Conditions: VCC = 6.0 V ±0.25 V, VPP = 12.5 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C)
Item
Symbol
Min
Typ
Max
Unit
Test
Condition
Input highlevel voltage
EO7 to EO0, EA14 to EA0 VIH
OE, CE
2.4
VCC +0.3
V
Input lowlevel voltage
EO7 to EO0, EA14 to EA0 VIL
OE, CE
–0.3
0.8
V
Output highlevel voltage
EO7 to EO0
VOH
2.4
V
IOH = –200 µA
Output lowlevel voltage
EO7 to EO0
VOL
0.45
V
IOL = 0.8 mA
Input leakage EO7 to EO0, EA14 to EA0 |ILI|
current
OE, CE
2
µA
Vin = 5.25 V/
0.5 V
VCC current
ICC
40
mA
VPP current
IPP
40
mA
Rev. 6.00 Sep 12, 2006 page 107 of 526
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Section 6 ROM
Table 6.4
AC Characteristics
(Conditions: VCC = 6.0 V ±0.25 V, VPP = 12.5 V ±0.3 V, Ta = 25°C ±5°C)
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Address setup time
tAS
2
µs
Figure 6.4*
OE setup time
tOES
2
µs
Data setup time
tDS
2
µs
Address hold time
tAH
0
µs
Data hold time
2
µs
Data output disable time
tDH
2
tDF*
0
130
ns
VPP setup time
tVPS
2
µs
Programming pulse width
tPW
0.95
1.0
1.05
ms
CE pulse width for overwrite
programming
tOPW *
2.85
78.7
ms
VCC setup time
tVCS
2
µs
Data output delay time
tOE
0
500
ns
3
1
Notes: 1. Input pulse level: 0.8 V to 2.2 V
Input rise time/fall time ≤ 20 ns
Timing reference levels: Input: 1.0 V, 2.0 V
Output: 0.8 V, 2.0 V
2. tDF is defined at the point at which the output is floating and the output level cannot be
read.
3. tOPW is defined by the value given in figure 6.3, High-Speed, High-Reliability
Programming Flow Chart.
Rev. 6.00 Sep 12, 2006 page 108 of 526
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Section 6 ROM
Figure 6.4 shows a PROM write/verify timing diagram.
Write
Verify
Address
tAH
tAS
Data
Input data
tDS
VPP
VCC
Output data
tDH
tDF
VPP
VCC
tVPS
VCC+1
VCC
tVCS
CE
tPW
OE
tOES
tOE
tOPW*
Note: * tOPW is defined by the value given in figure 6.3, High-Speed, High-Reliability Programming
Flow Chart.
Figure 6.4 PROM Write/Verify Timing
6.3.2
Programming Precautions
• Use the specified programming voltage and timing.
The programming voltage in PROM mode (VPP) is 12.5 V. Use of a higher voltage can
permanently damage the chip. Be especially careful with respect to PROM programmer
overshoot.
Setting the PROM programmer to Renesas Technology specifications for the HN27C256 will
result in correct VPP of 12.5 V.
• Make sure the index marks on the PROM programmer socket, socket adapter, and chip are
properly aligned. If they are not, the chip may be destroyed by excessive current flow. Before
programming, be sure that the chip is properly mounted in the PROM programmer.
Rev. 6.00 Sep 12, 2006 page 109 of 526
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Section 6 ROM
• Avoid touching the socket adapter or chip while programming, since this may cause contact
faults and write errors.
6.3.3
Reliability of Programmed Data
A highly effective way to improve data retention characteristics is to bake the programmed chips
at 150°C, then screen them for data errors. This procedure quickly eliminates chips with PROM
memory cells prone to early failure.
Figure 6.5 shows the recommended screening procedure.
Program chip and
verify programmed data
Bake chip for 24 to 48 hours
at 125 C to 150 C
with power off
Read and check program
Install
Figure 6.5 Recommended Screening Procedure
If a group of programming errors occurs while the same PROM programmer is in use, stop
programming and check the PROM programmer and socket adapter for defects, using a
microcomputer with on-chip EPROM in a windowed package, etc. Please inform Renesas
Technology of any abnormal conditions noted during or after programming or in screening of
program data after high-temperature baking.
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Section 6 ROM
6.4
Flash Memory Overview
6.4.1
Principle of Flash Memory Operation
Table 6.5 illustrates the principle of operation of the on-chip flash memory in the H8/3644F,
H8/3643F, and H8/3642AF.
Like EPROM, flash memory is programmed by applying a high gate-to-drain voltage that draws
hot electrons generated in the vicinity of the drain into a floating gate. The threshold voltage of a
programmed memory cell is therefore higher than that of an erased cell. Cells are erased by
grounding the gate and applying a high voltage to the source, causing the electrons stored in the
floating gate to tunnel out. After erasure, the threshold voltage drops. A memory cell is read like
an EPROM cell, by driving the gate to a high level and detecting the drain current, which depends
on the threshold voltage. Erasing must be done carefully, because if a memory cell is overerased,
its threshold voltage may become negative, causing the cell to operate incorrectly.
Section 6.7.6, Erase Flowcharts and Sample Programs, shows optimal erase control flowcharts and
sample programs.
Table 6.5
Principle of Memory Cell Operation
Program
Memory
cell
Erase
Vg = VPP
Read
Vs = VPP
Vg = VCC
Open
Vd
Memory
array
Vd
Vd
Open
0V
Open
Vd
0V
VPP
0V
VCC
0V
VPP
0V
0V
0V
0V
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Section 6 ROM
6.4.2
Mode Pin Settings and ROM Space
The H8/3644F has 32 kbytes of on-chip flash memory, the H8/3643F has 24 kbytes, and the
H8/3642AF has 16 kbytes. The ROM is connected to the CPU by a 16-bit data bus. The CPU
accesses flash memory in two states for both byte-size and word-size instructions.
The flash memory is allocated to addresses H'0000 to H'7FFF in the H8/3644F, to addresses
H'0000 to H'5FFF in the H8/3643F, and to addresses H'0000 to H'3FFF in the H8/3642AF.
6.4.3
Features
The features of the flash memory are summarized below.
• Five flash memory operating modes
There are five flash memory operating modes: program mode, program-verify mode, erase
mode, erase-verify mode, and prewrite-verify mode.
• Erase block specification
Blocks to be erased in the flash memory space can be specified by setting the corresponding
register bits. The address space includes a large block area (four blocks with sizes from 4
kbytes to 8 kbytes) and a small block area (eight blocks with sizes from 128 bytes to 1 kbyte).
• Programming/erase times
The flash memory programming time is 50 µs (typ.) per byte, and the erase time is 1 s (typ.).
• Erase-program cycles
Flash memory contents can be erased and reprogrammed up to 100 times.
• On-board programming modes
There are two modes in which flash memory can be programmed, erased, and verified onboard: boot mode and user program mode.
• Automatic bit rate adjustment
For data transfer in boot mode, the chip’s bit rate can be automatically adjusted to match the
transfer bit rate of the host (max. 9600 bps).
• PROM mode
Flash memory can be programmed and erased in PROM mode, using a general-purpose PROM
programmer, as well as in on-board programming mode. The specifications for programming,
erasing, verifying, etc., are the same as for standard HN28F101 flash memory.
Rev. 6.00 Sep 12, 2006 page 112 of 526
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Section 6 ROM
6.4.4
Block Diagram
Figure 6.6 shows a block diagram of the flash memory.
8
Internal data bus (upper)
8
Internal data bus (lower)
FLMCR
Bus interface/control section
Operating
mode
TEST
EBR1
EBR2
H'0000
H'0001
H'0002
H'0003
H'0004
H'0005
On-chip flash memory (32 kbytes)
H'7FFC
H'7FFD
H'7FFE
H'7FFF
Upper byte
(even address)
Lower byte
(odd address)
Legend:
FLMCR: Flash memory control register
EBR1: Erase block register 1
EBR2: Erase block register 2
Figure 6.6 Block Diagram of Flash Memory (Example of the H8/3644F)
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Section 6 ROM
6.4.5
Pin Configuration
The flash memory is controlled by means of the pins shown in table 6.6.
Table 6.6
Flash Memory Pins
Pin Name
Abbreviation
Input/Output
Function
Programming power
FVPP
Power supply
Apply 12.0 V
Mode pin
TEST
Input
Sets H8/3644F operating mode
Transmit data
TXD
Output
SCI3 transmit data output
Receive data
RXD
Input
SCI3 receive data input
The transmit data pin and receive data pin are used in boot mode.
6.4.6
Register Configuration
The registers used to control the on-chip flash memory are shown in table 6.7.
Table 6.7
Flash Memory Registers
Register Name
Abbreviation
R/W
Initial Value
Address
Flash memory control register
FLMCR
R/W
H'00
H'FF80
Erase block register 1
EBR1
R/W
H'F0
H'FF82
Erase block register 2
EBR2
R/W
H'00
H'FF83
The FLMCR, EBR1, and EBR2 registers are valid only when programming and erasing flash
memory, and can only be accessed when 12 V is applied to the FVPP pin. When 12 V is not
applied to the FVPP pin, addresses H'FF80 to H'FF83 cannot be modified and are always read as
H'FF.
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Section 6 ROM
6.5
Flash Memory Register Descriptions
6.5.1
Flash Memory Control Register (FLMCR)
FLMCR is an 8-bit register used for flash memory operating mode control. Transitions to program
mode, erase mode, program-verify mode, and erase-verify mode are made by setting bits in this
register. FLMCR is initialized to H'00 upon reset, in sleep mode, subsleep mode, watch mode, and
standby mode, and when 12 V is not applied to FVPP. When 12 V is applied to FVPP, a reset
initializes FLMCR to H'80.
Bit
7
6
5
4
3
2
1
0
VPP
EV
PV
E
P
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R/W *
R/W *
R/W *
R/W *
Note:
*
For information on access to this register, see note 11 in section 6.9, Flash Memory
Programming and Erasing Precautions.
Bit 7
Programming Power (VPP): Bit 7 is a status flag that indicates that 12 V is applied to the
FVPP pin. For further information, see note 5 in section 6.9, Flash Memory Programming and
Erasing Precautions.
Bit 7: VPP
Description
0
Clearing condition:
When 12 V is not applied to the FVPP pin
1
Setting condition:
When 12 V is applied to the FVPP pin
(initial value)
Bit 3
Erase-Verify Mode (EV)*: Bit 3 selects transition to or exit from erase-verify mode.
Bit 3: EV
Description
0
Exit from erase-verify mode
1
Transition to erase-verify mode
Note:
*
(initial value)
Do not set multiple bits simultaneously.
Do not release or cut the VCC or VPP power supply while a bit is set.
Rev. 6.00 Sep 12, 2006 page 115 of 526
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Section 6 ROM
Bit 2
Program-Verify Mode (PV)*: Bit 2 selects transition to or exit from program-verify
mode.
Bit 2: PV
Description
0
Exit from program-verify mode
1
Note:
(initial value)
Transition to program-verify mode
*
Do not set multiple bits simultaneously.
Do not release or cut the VCC or VPP power supply while a bit is set.
Bit 1
Erase Mode (E)*1*2: Bit 1 selects transition to or exit from erase mode.
Bit 1: E
Description
0
Exit from erase mode
1
Transition to erase mode
(initial value)
Notes: 1. Do not set multiple bits simultaneously.
Do not release or cut the VCC or VPP power supply while a bit is set.
2. P bit and E bit setting should be carried out in accordance with the program/erase
algorithms shown in section 6.7, Programming and Erasing Flash Memory.
A watchdog timer setting should be made beforehand to prevent the P or E bit from
being set for longer than the specified time.
See section 6.9, Flash Memory Programming and Erasing Precautions, for more
information on the use of these bits.
Bit 0
Program Mode (P)*1*2: Bit 0 selects transition to or exit from program mode.
Bit 0: P
Description
0
Exit from program mode
1
Transition to program mode
(initial value)
Notes: 1. Do not set multiple bits simultaneously.
Do not release or cut the VCC or VPP power supply while a bit is set.
2. P bit and E bit setting should be carried out in accordance with the program/erase
algorithms shown in section 6.7, Programming and Erasing Flash Memory.
A watchdog timer setting should be made beforehand to prevent the P or E bit from
being set for longer than the specified time.
See section 6.9, Flash Memory Programming and Erasing Precautions, for more
information on the use of these bits.
Rev. 6.00 Sep 12, 2006 page 116 of 526
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Section 6 ROM
6.5.2
Erase Block Register 1 (EBR1)
EBR1 is an 8-bit register that specifies large flash-memory blocks for programming or erasure.
EBR1 is initialized to H'F0 upon reset, in sleep mode, subsleep mode, watch mode, and standby
mode, and when 12 V is not applied to FVPP. When a bit in EBR1 is set to 1, the corresponding
block is selected and can be programmed and erased. The erase block map is shown in figure 6.7,
and the correspondence between bits and erase blocks is shown in table 6.8.
Bit
7
6
5
4
3
2
1
0
LB3
LB2
LB1
LB0
Initial value
1
1
1
1
0
0
0
0
Read/Write
R/W *
R/W *
R/W *
R/W *
Note:
*
Word access cannot be used on this register; byte access must be used. For
information on access to this register, see note 11 in section 6.9, Flash Memory
Programming and Erasing Precautions. LB3 is invalid in the H8/3643F, and LB3 and
LB2 are invalid in the H8/3642AF.
Bits 7 to 4
Reserved: Bits 7 to 4 are reserved; they are always read as 1, and cannot be
modified.
Bits 3 to 0
Large Block 3 to 0 (LB3 to LB0): These bits select large blocks (LB3 to LB0) to be
programmed and erased.
Bits 3 to 0:
LB3 to LB0
Description
0
Block LB3 to LB0 is not selected
1
Block LB3 to LB0 is selected
(initial value)
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Section 6 ROM
6.5.3
Erase Block Register 2 (EBR2)
EBR2 is an 8-bit register that specifies small flash-memory blocks for programming or erasure.
EBR2 is initialized to H'00 upon reset, in sleep mode, subsleep mode, watch mode, and standby
mode, and when 12 V is not applied to FVPP. When a bit in EBR2 is set to 1, the corresponding
block is selected and can be programmed and erased. The erase block map is shown in figure 6.7,
and the correspondence between bits and erase blocks is shown in table 6.8.
Bit
7
6
5
4
3
2
1
0
SB7
SB6
SB5
SB4
SB3
SB2
SB1
SB0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W *
R/W *
R/W *
R/W *
R/W *
R/W *
R/W *
R/W *
Note:
*
Word access cannot be used on this register; byte access must be used. For
information on access to this register, see note 11 in section 6.9, Flash Memory
Programming and Erasing Precautions. LB3 is invalid in the H8/3643F, and LB3 and
LB2 are invalid in the H8/3642AF.
Bits 7 to 0
Small Block 7 to 0 (SB7 to SB0): These bits select small blocks (SB7 to SB0) to be
programmed and erased.
Bits 7 to 0:
SB7 to SB0
Description
0
Block SB7 to SB0 is not selected
1
Block SB7 to SB0 is selected
Rev. 6.00 Sep 12, 2006 page 118 of 526
REJ09B0326-0600
(initial value)
Section 6 ROM
H'0000
Small block
area
(4 kbytes)
H'0000
SB7 to SB0
(4 kbytes)
H'0FFF
H'1000
Large block
area
(H8/3644F:
28 kbytes)
SB0
SB1
SB2
H'01FF SB3
H'0200
LB0
(4 kbytes)
H'1FFF
H'2000
(H8/3642AF:
12 kbytes)
SB4
(512 bytes)
H'03FF
H'0400
LB1
(8 kbytes)
H'3FFF
H'4000
(H8/3643F:
20 kbytes)
(128 bytes)
(128 bytes)
(128 bytes)
(128 bytes)
SB5
(1 kbyte)
H'07FF
H'0800
LB2
(8 kbytes)
H'5FFF
H'6000
SB6
(1 kbyte)
H'0BFF
H'0C00
LB3
(8 kbytes)
H'7FFF
SB7
(1 kbyte)
H'0FFF
Figure 6.7 Erase Block Map
Table 6.8
Correspondence between Erase Blocks and EBR1/EBR2 Bits
Register
Bit
Block
Addresses
Size
EBR1
0
LB0
H'1000 to H'1FFF
4 kbytes
1
LB1
H'2000 to H'3FFF
8 kbytes
2
LB2
H'4000 to H'5FFF
8 kbytes
3
LB3
H'6000 to H'7FFF
8 kbytes
Register
Bit
Block
Addresses
Size
EBR2
0
SB0
H'0000 to H'007F
128 bytes
1
SB1
H'0080 to H'00FF
128 bytes
2
SB2
H'0100 to H'017F
128 bytes
3
SB3
H'0180 to H'01FF
128 bytes
4
SB4
H'0200 to H'03FF
512 bytes
5
SB5
H'0400 to H'07FF
1 kbyte
6
SB6
H'0800 to H'0BFF
1 kbyte
7
SB7
H'0C00 to H'0FFF
1 kbyte
Rev. 6.00 Sep 12, 2006 page 119 of 526
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Section 6 ROM
6.6
On-Board Programming Modes
When an on-board programming mode is selected, on-chip flash memory programming, erasing,
and verifying can be carried out. There are two on-board programming modesboot mode and
user program modeset by the mode pin (TEST) and the FVPP pin. Table 6.9 shows how to select
the on-board programming modes. For information on turning VPP on and off, see note 5 in section
6.9, Flash Memory Programming and Erasing Precautions.
Table 6.9
On-Board Programming Mode Selection
Mode Setting
FVPP
TEST
Boot mode
12 V*
12 V*
User program mode
Note:
6.6.1
*
Notes
VSS
See notes 6 to 8 in section 6.6.1, Notes on Use of Boot Mode, for the timing of 12 V
application.
Boot Mode
When boot mode is used, a user program for flash memory programming and erasing must be
prepared beforehand in the host machine (which may be a personal computer). SCI3 is used in
asynchronous mode (see figure 6.8). When the H8/3644F, H8/3643F, or H8/3642AF is set to boot
mode, after reset release a built-in boot program is activated, the low period of the data sent from
the host is first measured, and the bit rate register (BRR) value determined. The chip’s on-chip
serial communication interface (SCI3) can then be used to download the user program from the
host machine. The downloaded user program is written into RAM.
After the program has been stored, execution branches to the start address (H'FBE0) of the on-chip
RAM, the program stored in RAM is executed, and flash memory programming/erasing can be
carried out. Figure 6.9 shows the boot mode execution procedure.
Reception of programming data
HOST
Transmission of verify data
Figure 6.8 Boot Mode System Configuration
Rev. 6.00 Sep 12, 2006 page 120 of 526
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H8/3644F,
H8/3643F, or
H8/3642AF
RXD
SCI3
TXD
Section 6 ROM
Boot Mode Execution Procedure: The boot mode execution procedure is shown below.
Start
1. Set the chip to boot mode and execute a reset-start.
2. Set the host to the prescribed bit rate (2400/4800/9600)
and have it transmit H'00 data continuously using a
transfer data format of 8-bit data plus 1 stop bit.
1
Set pins to boot mode for chip
and execute reset-start
2
Host transmits H'00 data continuously
at prescribed bit rate
Chip measures low period of H'00 data
transmitted by host
3
Chip calculates bit rate and sets value
in bit rate register
3. The chip repeatedly measures the low period at the
RXD pin and calculates the asynchronous
communication bit rate used by the host.
4. After SCI3 bit rate adjustment is completed, the chip
transmits one H'00 data byte to indicate the end of
adjustment.
4
After bit rate adjustment, chip transmits
one H'00 data byte to host to indicate
end of adjustment
5. On receiving the one-byte data indicating completion of
bit rate adjustment, the host should confirm normal
reception of this indication and transmit one H'55 data
byte.
5
Host confirms normal reception of bit rate
adjustment end indication, and transmits
one H'55 data byte
6. After receiving H'55, the chip transfers part of the boot
program to RAM areas H'FB80 to H'FBDF and H'FC00
to H'FF2F.
6
After receiving H'55, chip transfers part
of boot program to RAM
Chip branches to RAM boot area
(H'FC00 to H'FF2F), then checks flash
memory user area data
7
All data = H'FF?
YES
No
Erase all flash
memory blocks*3
8. The chip transmits one H'AA byte. The host then
transmits the number of user program bytes to be
transferred to the chip. The number of bytes should be
sent as two bytes, upper byte followed by lower byte.
The host should then transmit sequentially the program
set by the user.
The chip transmits the received byte count and user
program sequentially to the host, one byte at a time, as
verify data (echo-back).
After confirming that all flash memory
data is H'FF, chip transmits
one H'AA byte to host
9. The chip writes the received user program sequentially
to on-chip RAM area H'FBE0 to H'FF6D (910 bytes).
Chip receives, as 2 bytes, number
of program bytes (N) to be transferred
to on-chip RAM*1
10. The chip transmits one H'AA byte, then branches to onchip RAM address H'FBE0 and executes the user
program written in area H'FBE0 to H'FF6D.
8
Chip transfers user program to RAM*2
9
7. The chip branches to the RAM boot program area
(H'FC00–H'FF2F) and checks for the presence of data
written in the flash memory. If data has been written in
the flash memory, the chip erases all blocks.
Chip calculates remaining
bytes to be transferred (N = N – 1)*2
Transfer
No
end byte count
N = 0?
Yes
Chip transfers user program to RAM,
then transmits one H'AA byte to host
10
Chip branches to RAM area
address H'FBE0 and executes user
program transferred to RAM
Notes: 1. The size of the RAM area available to the user is
910 bytes. The number of bytes to be
transferred must not exceed 910 bytes. The
transfer byte count must be sent as two bytes,
upper byte followed by lower byte.
Example of transfer byte count: for 256 bytes
(H'0100), upper byte = H'01, lower byte = H'00
2. The part of the user program that controls the
flash memory should be set in the program in
accordance with the flash memory program/
erase algorithms described later in this section.
3. If a memory cell does not operate normally and
cannot be erased, the chip transmits one H'FF
byte as an erase error indication and halts the
erase operation and subsequent operations.
Figure 6.9 Boot Mode Operation Flowchart
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Section 6 ROM
Automatic SCI Bit Rate Adjustment: When boot mode is initiated, the H8/3644F, H8/3643F, or
H8/3642AF measures the low period of the asynchronous SCI communication data transmitted
continuously from the host (figure 6.10). The data format should be set as 8-bit data, 1 stop bit, no
parity. The chip calculates the bit rate of the transmission from the host from the measured low
period (9 bits), and transmits one H'00 byte to the host to indicate the end of bit rate adjustment.
The host should confirm that this adjustment end indication has been received normally, and
transmit one H'55 byte to the chip. If reception cannot be performed normally, initiate boot mode
again (reset), and repeat the above operations. Depending on the host’s transmission bit rate and
the chip’s system clock oscillation frequency (fOSC), there will be a discrepancy between the bit
rates of the host and the chip. To insure correct SCI operation, the host’s transfer bit rate should be
set to 2400, 4800, or 9600 bps*1. Table 6.10 shows typical host transfer bit rates and system clock
oscillation frequency for which automatic adjustment of the chip’s bit rate is possible. Boot mode
should be used within this system clock oscillation frequency range*2.
Notes: 1. Only use a host bit rate setting of 2400, 4800, or 9600 bps. No other bit rate setting
should be used.
2. Although the chip may also perform automatic bit rate adjustment with bit rate and
system clock oscillation frequency combinations other than those shown in table 6.10,
a degree of error will arise between the bit rates of the host and the chip, and
subsequent transfer will not be performed normally. Therefore, only a combination of
bit rate and system clock oscillation frequency within one of the ranges shown in table
6.10 can be used for boot mode execution.
Start
bit
D0
D1
D2
D3
D4
D5
D6
D7
Stop
bit
Low period (9 bits) measured (H'00 data)
High period
(1 or more
bits)
Figure 6.10 Measurement of Low Period in Transmit Data from Host
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Section 6 ROM
Table 6.10 System Clock Oscillation Frequencies Permitting Automatic Adjustment of
Chip (H8/3644F, H8/3643F, H8/3642AF) Bit Rate
Host Bit Rate*
System Clock Oscillation Frequencies (fOSC) Permitting Automatic
Adjustment of Chip (H8/3644F, H8/3643F, H8/3642AF) Bit Rate
9600 bps
8 MHz to 16 MHz
4800 bps
4 MHz to 16 MHz
2400 bps
Note:
*
2 MHz to 16 MHz
Use a host bit rate setting of 2400, 4800, or 9600 bps only. No other setting should be
used.
RAM Area Allocation in Boot Mode: In boot mode, the 96-byte area from H'FB80 to H'FBDF
and the 18-byte area from H'FF6E to H'FF7F are reserved for boot program use, as shown in
figure 6.11. The area to which the user program is transferred is H'FBE0 to H'FF6D (910 bytes).
The boot program area becomes available when a transition is made to the execution state for the
user program transferred to RAM. A stack area should be set within the user program as required.
H'FB80
Boot program
area*
(96 bytes)
H'FBE0
User program
transfer area
(910 bytes)
H'FF6E
H'FF7F
Boot program
area*
(18 bytes)
Note: * These areas cannot be used until a transition is made to the execution state for the user
program transferred to RAM (i.e. a branch is made to RAM address H'FBE0). Note also
that the boot program remains in the boot program area in RAM (H'FB80 to H'FBDF,
H'FF6E to H'FF7F) even after control branches to the user program. When an interrupt
handling routine is executed in the boot program, the 16 bytes from H'FB80 to H'FB8F in
this area cannot be used. For details see section 6.7.9, Interrupt Handling during Flash
Memory Programming/Erasing.
Figure 6.11 RAM Areas in Boot Mode
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Section 6 ROM
Notes on Use of Boot Mode:
1. When the chip (H8/3644F, H8/3643F, or H8/3642AF) comes out of reset in boot mode, it
measures the low period of the input at the SCI3’s RXD pin. The reset should end with RXD
high. After the reset ends, it takes about 100 states for the chip to get ready to measure the low
period of the RXD input.
2. In boot mode, if any data has been programmed into the flash memory (if all data is not H'FF),
all flash memory blocks are erased. Boot mode is for use when user program mode is
unavailable, such as the first time on-board programming is performed, or if the program
activated in user program mode is accidentally erased.
3. Interrupts cannot be used while the flash memory is being programmed or erased.
4. The RXD and TXD lines should be pulled up on the board.
5. Before branching to the user program (RAM address H'FBE0), the chip terminates transmit
and receive operations by its on-chip SCI3 (by clearing the RE and TE bits to 0 in the serial
control register (SCR)), but the adjusted bit rate value remains set in the bit rate register
(BRR). The transmit data output pin, TXD, goes to the high-level output state (PCR22 = 1 in
the port 2 control register, P22 = 1 in the port 2 data register).
The contents of the CPU’s internal general registers are undefined at this time, so these
registers must be initialized immediately after branching to the user program. In particular,
since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be
specified for use by the user program.
The initial values of other on-chip registers are not changed.
6. Boot mode can be entered by applying 12 V to the TEST pin and FVPP pin in accordance with
the mode setting conditions shown in table 6.9, and then executing a reset-start. Care must be
taken with turn-on of the VPP power supply at this time.
On reset release (a low-to-high transition), the chip determines whether 12 V is being applied
to the TEST pin and FVPP pin, and on detecting that boot mode has been set, retains that state
internally. As the applied voltage criterion level (threshold level) at this time is the range of
approximately VCC +2 V to 11.4 V, a transition will be made to boot mode even if a voltage
sufficient for executing programming and erasing (11.4 V to 12.6 V) is not being applied.
Therefore, when executing the boot program, the VPP power supply must be stabilized within
the range of 11.4 V to 12.6 V before a branch is made to the RAM area, as shown in figure
6.22.
Insure that the program voltage VPP does not exceed 12.6 V when a transition is made to boot
mode (when reset is released), and does not exceed the range 12 V ±0.6 V during boot mode
operation. If these values are exceeded, boot mode execution will not be performed correctly.
Also, do not release or cut VPP during boot mode execution or when programming or erasing
flash memory*.
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Section 6 ROM
Boot mode can be exited by driving the reset pin low, then releasing 12 V application to the
TEST pin and FVPP pin at least 10 system clock cycles later, and setting the TEST pin to VSS to
release the reset.
However, external pin settings must not be changed during boot mode execution.
Note that the boot mode state is not maintained if 12 V application to the TEST pin is released
while in boot mode.
Also, if a watchdog timer reset occurs in this boot mode state, the built-in boot program will be
restarted without clearing the MCU’s internal mode state.
7. If the TEST pin input level is changed (e.g. from 0 V to 5 V to 12 V) during a reset (while a
low level is being input at the RES pin), port states will change as a result of the change of
MCU operating mode. Therefore, care must be taken to make pin settings to prevent these pins
from becoming output signal pins during a reset, and to prevent collision with signals outside
the MCU.
8. Regarding 12 V application to the FVPP and TEST pins, insure that peak overshoot does not
exceed the maximum rating of 13 V.
Also, be sure to connect bypass capacitors to the FVPP and TEST pins.
Note: * For further information on VPP application, release, and cut-off, see note 5 in section
6.9, Flash Memory Programming and Erasing Precautions.
6.6.2
User Program Mode
When set to user program mode, the H8/3644F, H8/3643F, or H8/3642AF can program and erase
its flash memory by executing a user program. Therefore, on-board reprogramming of the on-chip
flash memory can be carried out by providing on-board means of supplying VPP and programming
data, and storing an on-board reprogramming program in part of the program area.
User program mode is selected by applying 12 V to the FVPP pin when flash memory is not being
accessed, during a reset or after confirming that a reset has been performed properly (after the
reset is released).
The flash memory cannot be read while being programmed or erased, so the on-board
reprogramming program or flash memory reprogramming routine should be transferred to the
RAM area, and on-board reprogramming executed in that area.
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Section 6 ROM
User Program Mode Execution Procedure*1: The procedure for user program execution in
RAM is shown below.
1
Reset-start (TEST = VSS)
2
Branch to flash memory on-board
reprogramming program
3
Transfer flash memory
reprogramming routine to RAM
4
Branch to flash memory
reprogramming routine in RAM area
Procedure:
An on-board reprogramming program must be written into
flash memory by the user beforehand.
1. Set the TEST pin to VSS and execute a reset-start.
2. Branch to the on-board reprogramming program written to
flash memory.
3. Transfer the flash memory reprogramming routine to the
RAM area.
4. Branch to the flash memory reprogramming routine
transferred to the RAM area.
5. Apply 12 V to the FVPP pin. (Transition to user program
mode)
5
FVPP = 12 V
(user program mode)
6
Execute flash memory
reprogramming routine in RAM area
(flash memory reprogramming)
7
Release FVPP
(exit user program mode)
8
Branch to flash memory application
program*2
6. Execute the flash memory reprogramming routine in the
RAM area, an perform on-board reprogramming of the
flash memory.
7. Switch the FVPP pin from 12 V to VCC, and exit user
program mode.
8. After on-board reprogramming of the flash memory ends,
branch to the flash memory application program.
Notes: 1. Do not apply 12 V to the FVPP pin during normal operation. To prevent inadvertent programming or
erasing due to program runaway, etc., apply 12 V to the FVPP pin only when the flash memory is
being programmed or erased . Memory cells may not operate normally if overprogrammed or
overerased due to program runaway, etc. Also, while 12 V is applied to the FVPP pin, the watchdog
timer should be activated to prevent overprogramming or overerasing due to program runaway, etc.
For further information on FVPP application, release, and cut-off, see note 5 in section 6.9, Flash
Memory Programming and Erasing Precautions.
2. When the application of 12 V to the FVPP pin is released after programming is completed, the flash
memory read setup time (tFRS) must elapse before executing a program in flash memory. This
specifies the setup time from the point at which the FVPP voltage reaches the VCC + 2 V level after
12 V application is released until the flash memory is read.
Figure 6.12 Example of User Program Mode Operation
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Section 6 ROM
6.7
Programming and Erasing Flash Memory
The on-chip flash memory of the H8/3644F, H8/3643F, and H8/3642AF is programmed and
erased by software, using the CPU. There are five flash memory operating modes: program mode,
erase mode, program-verify mode, erase-verify mode, and prewrite-verify mode. Transitions to
these modes can be made by setting the P, E, PV, and EV bits in the flash memory control register
(FLMCR).
The flash memory cannot be read while being programmed or erased. Therefore, the program that
controls flash memory programming and erasing should be located and executed in on-chip RAM
or external memory. A description of each mode is given below, with recommended flowcharts
and sample programs for programming and erasing.
See section 6.9, Flash Memory Programming and Erasing Precautions, for additional notes on
programming and erasing.
6.7.1
Program Mode
To write data into the flash memory, follow the programming algorithm shown in figure 6.13. This
programming algorithm enables data to be written without subjecting the device to voltage stress
or impairing the reliability of the programmed data.
To write data, first set the blocks to be programmed with erase block registers 1 and 2 (EBR1,
EBR2), and write the data to the address to be programmed, as in writing to RAM. The flash
memory latches the programming address and programming data in an address latch and data
latch. Next set the P bit in FLMCR, selecting program mode. The programming time is the time
during which the P bit is set. Make a setting so that the total programming time does not exceed 1
ms. Programming for too long a time, due to program runaway for example, can damage the
device. Before selecting program mode, set up the watchdog timer so as to prevent
overprogramming.
For details of the programming procedure, see section 6.7.3, Programming Flowchart and Sample
Program.
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Section 6 ROM
6.7.2
Program-Verify Mode
In program-verify mode, the data written in program mode is read to check whether it has been
correctly written in the flash memory.
After the elapse of the programming time, exit programming mode (clear the P bit to 0) and select
program-verify mode (set the PV bit to 1). In program-verify mode, a program-verify voltage is
applied to the memory cells at the latched address. If the flash memory is read in this state, the
data at the latched address will be read. After selecting program-verify mode, wait at least 4 µs
before reading, then compare the programmed data with the verify data. If they agree, exit
program-verify mode and program the next address. If they do not agree, select program mode
again and repeat the same program and program-verify sequence. Do not repeat the program and
program-verify sequence more than six times* for the same bit.
Note: * When a bit is programmed repeatedly, set a loop counter so that the total programming
time will not exceed 1 ms.
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Section 6 ROM
6.7.3
Programming Flowchart and Sample Program
Flowchart for Programming One Byte
Start
Set erase block register
(set bit for block to be programmed to 1)
Write data to flash memory
(flash memory latches write address
and data) *1
n=1
Enable watchdog timer *2
Select program mode
(P bit = 1 in FLMCR)
Wait (x) µs *4
Clear P bit
End of programming
Disable watchdog timer
Select program-verify mode
(PV bit = 1 in FLMCR)
Notes: 1. Write the data to be programmed using a byte
transfer instruction.
2. For the timer overflow interval, set the timer
counter value (TCW) to H'FE.
3. Read the memory data to be verified using a
byte transfer instruction.
4. Programming time x is successively
incremented to initial set value × 2n–1 (n = 1 to
6). The initial value should therefore be set to
15.8 µs or less to make the total
programming time 1 ms or less.
5. tvs1: 4 µs or more
N: 6 (set N so that total programming time
does not exceed 1 ms)
Wait (tvs1) µs *5
Verify *3
(read memory)
NG
OK
Clear PV bit
Clear PV bit
Clear erase block register
(clear bit for programmed block to 0)
n ≥ N? *5
End (1-byte data programmed)
End of verify
No
n+1→n
Yes
Programming error
Double the programming time
(x × 2 → x)
Figure 6.13 Programming Flowchart
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Section 6 ROM
Sample Program for Programming One Byte
This program uses the following registers:
R0H: Used for erase block specification.
R1H: Stores programming data.
R1L: Stores read data.
R3:
Stores the programming address. Valid address specifications are H'0000 to H'EF7F.
R4:
Used for program and program-verify loop counter value setting. Also stores register set
values.
R5:
Used for program loop counter value setting.
R6L: Used for the program-verify fail count.
Arbitrary data can be programmed at an arbitrary address by setting the R3 (programming address)
and R1H (programming data) values.
The values of #a and #b depend on the operating frequency. They should be set as indicated in
table 6.11.
FLMCR: .EQU
H'FF80
EBR1:
.EQU
H'FF82
EBR2:
.EQU
H'FF83
TCSRW: .EQU
H'FFBE
TCW:
H'FFBF
.EQU
.ALIGN 2
PRGM:
MOV.B
#H'**, R0H
;
MOV.B
R0H,
;Set EBR*
MOV.B
#H'00, R6L
; Program-verify fail count
MOV.W
#H'a,
R5
; Set program loop counter
MOV.B
R1H,
@R3
; Dummy write
@EBR*:8
; Program-verify fail counter + 1 → R6L
PRGMS: INC R6L
MOV.W
#H'FE5A, R4
;
MOV.B
R4L,
@TCSRW:8 ;
MOV.B
R4H,
@TCW:8
MOV.B
#H'36, R4L
;
;
MOV.B
R4L,
@TCSRW:8 ; Start watchdog timer
MOV.W
R5,
R4
Rev. 6.00 Sep 12, 2006 page 130 of 526
REJ09B0326-0600
; Set program loop counter
Section 6 ROM
BSET
LOOP1: SUBS
#1,
R4
;
MOV.W
R4,
R4
;
BNE
LOOP1
BCLR
#0,
@FLMCR:8 ; Clear P bit
MOV.B
#H'50,
R4L
MOV.B
R4L,
@TCSRW:8 ; Stop watchdog timer
MOV.B
#H'b,
BSET
#2,
LOOP2: DEC
PVOK:
@FLMCR:8 ; Set P bit
#0,
; Wait loop
;
;Set program-verify fail counter
R4H
@FLMCR:8 ; Set PV bit
R4H
;
BNE
LOOP2
; Wait loop
MOV.B
@R3,
R1L
R1L
; Read programmed data
; Compare programmed data with read data
CMP.B
R1H,
BEQ
PVOK
BCLR
#2,
CMP.B
#H'06,
BEQ
NGEND
ADD.W
R5,
BRA
PRGMS
BCLR
#2,
MOV.B
#H'00,
R6L
MOV.B
R6L,
@EBR*:8 ; Clear EBR*
; Program-verify decision
@FLMCR:8
R6L
; Clear PV bit
; Program-verify executed 6 times?
; If program-verify executed 6 times, branch to NGEND
; Double programming time
R5
; Program again
@FLMCR:8
; Clear PV bit
;
One byte programmed
NGEND: Programming error
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Section 6 ROM
6.7.4
Erase Mode
To erase the flash memory, follow the erasing algorithm shown in figure 6.14. This erasing
algorithm enables data to be erased without subjecting the device to voltage stress or impairing the
reliability of the programmed data.
To erase flash memory, before starting to erase, first place all memory data in all blocks to be
erased in the programmed state (program all memory data to H'00). If all memory data is not in the
programmed state, follow the sequence described later to program the memory data to zero. Select
the flash memory areas to be programmed with erase block registers 1 and 2 (EBR1, EBR2). Next
set the E bit in FLMCR, selecting erase mode. The erase time is the time during which the E bit is
set. To prevent overerasing, use a software timer to divide the time for one erasure, and insure that
the total time does not exceed 30 s. See section 6.7.6, Erase Flowcharts and Sample Programs, for
the time for one erasure. Overerasing, due to program runaway for example, can give memory
cells a negative threshold voltage and cause them to operate incorrectly. Before selecting erase
mode, set up the watchdog timer so as to prevent overerasing.
6.7.5
Erase-Verify Mode
In erase-verify mode, after data has been erased, it is read to check that it has been erased
correctly. After the erase time has elapsed, exit erase mode (clear the E bit to 0), and select eraseverify mode (set the EV bit to 1). Before reading data in erase-verify mode, write H'FF dummy
data to the address to be read. This dummy write applies an erase-verify voltage to the memory
cells at the latched address. If the flash memory is read in this state, the data at the latched address
will be read. After the dummy write, wait at least 2 µs before reading. Also, wait at least 4 µs
before performing the first dummy write after selecting erase-verify mode. If the read data has
been successfully erased, perform the erase-verify sequence (dummy write, wait of at least 2 µs,
read) on the next address. If the read data has not been erased, select erase mode again and repeat
the same erase and erase-verify sequence through the last address, until all memory data has been
erased to 1. Do not repeat the erase and erase-verify sequence more than 602 times, however.
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Section 6 ROM
6.7.6
Erase Flowcharts and Sample Programs
Flowchart for Erasing One Block
Start
Set erase block register
(set bit for block to be erased to 1)
Write 0 data in all addresses to be erased
(prewrite)*1
n=1
Enable watchdog timer *2
Select erase mode
(E bit = 1 in FLMCR)
Wait (x) ms *5
Clear E bit
Erasing halts
Disable watchdog timer
Set block start address as
verify address
Select erase-verify mode
(EV bit = 1)
Wait (tvs1) µs *6
Dummy write to verify address *3
(flash memory latches
address)
Notes: 1. Program all addresses to be erased by
following the prewrite flowchart.
2. Set the watchdog timer overflow interval to
the initial value shown in table 6.12.
3. For the erase-verify dummy write, write H'FF
using a byte transfer instruction.
4. For the erase-verify operation, read the data
using a byte transfer instruction. When
erasing multiple blocks, clear the erase block
register bits for erased blocks and perform
additional erasing only for unerased blocks.
5. Erase time x is successively incremented to
initial set value x 2n-1 (n = 1 to 4), and is
fixed from the 4th time onward. An initial
value of 6.25 ms or less should be set, and
the time for one erasure should be 50 ms or
less.
6. tvs1: 4 µs or more
tvs2: 2 µs or more
N:
602 (set N so that the total erase time
does not exceed 30 s)
Wait (tvs2) µs *6
Verify *4
(read data H'FF?)
NG
OK
No
Last address?
Yes
Clear EV bit
Address + 1 → address
Clear EV bit
n ≥ N? *6
Clear erase block register
(clear bit for erased block to 0)
End of erase
End of erase-verify
No
Yes
Erase error
n+1→n
n > 4?
Yes
No
Double the erase time
(x × 2 → x)
Figure 6.14 Erase Flowchart
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Section 6 ROM
Prewrite Flowchart
Start
Set erase block register
(set bit for block to be programmed to 1)
Set start address *6
n=1
Write H'00 to flash memory
(flash memory latches programmed address
and data) *1
Notes: 1. Write using a byte transfer instruction.
2. For the timer overflow interval, set the
timer counter value (TCW) to H'FE.
3. In prewrite-verify mode, P, E, PV, and EV
are all cleared to 0, and 12 V is applied to
the VPP pin. Read using a byte transfer
4. Programming time x is successively
incremented to initial set value × 2n–1
(n = 1 to 6). The initial value should
therefore be set to 15.8 µs or less to make
the total programming time 1 ms or less.
5. tvs1: 4 µs or more
N: 6 (set N so that the total programming
time does not exceed 1 ms)
End of programming
6. The start address and last address are the
start address and last address of the block
to be erased.
Enable watchdog timer *2
Select program mode
(P bit = 1 in FLMCR)
Wait (x) µs *4
Clear P bit
Disable watchdog timer
Wait (tvs1) µs *5
Double the programming time
(x × 2 → x)
NG
*3
Prewrite verify
(read data H'00?)
n+1→n
n ≥ N? *5
OK
No
Yes
*6
Last address?
Programming error
No
Yes
Clear erase block register
(clear bit for programmed block to 0)
End of prewrite
Figure 6.15 Prewrite Flowchart
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Address + 1 → address
Section 6 ROM
Sample Program for Erasing One Block
This program uses the following registers:
R0:
Used for erase block specification. Also stores address used in prewrite and erase-verify.
R1H: Stores read data. Also used in dummy write.
R2:
Stores last address of block to be erased.
R3:
Stores address used in prewrite and erase-verify.
R4:
Used for prewrite, prewrite-verify, erase, and erase-verify loop counter value setting. Also
stores register set values.
R5:
Used for prewrite and erase loop counter value setting.
R6L: Used for prewrite-verify and erase-verify fail count.
The values of #a, #b, #c, #d, and #e in the program depend on the operating frequency. They
should be set as indicated in tables 6.11 and 6.12. Erase block register (EBR1, EBR2) settings
should be made as indicated in sections 6.5.2 and 6.5.3 in section 6.5, Flash Memory Register
Descriptions. For #BLKSTR and #BLKEND, the start address and end address corresponding to
the set erase block register should be set as indicated in table 6.7.
FLMCR:
.EQU
H'FF80
EBR1:
.EQU
H'FF82
EBR2:
.EQU
H'FF83
TCSRW:
.EQU
H'FFBE
TCW:
.EQU
H'FFBF
.ALIGN 2
MOV.B
#H'**,
R0H
;
MOV.B
R0H,
@EBR*:8
;Set EBR*
; #BLKSTR is start address of block to be erased
; #BLKEND is last address of block to be erased
MOV.W
#BLKSTR, R0
;Start address of block to be erased
MOV.W
#BLKEND, R2
;Last address of block to be erased
ADDS
#1,
R2
;Last address of block to be erased + 1 → R2
R0,
R3
;Start address of block to be erased
; Execute prewrite
MOV.W
Rev. 6.00 Sep 12, 2006 page 135 of 526
REJ09B0326-0600
Section 6 ROM
PREWRT: MOV.B
MOV.W
PREWRS: INC
#H'00,
R6L
#H'a,
R5
;Prewrite verify fail counter
;Set prewrite loop counter
;Prewrite-vector fail counter + 1 → R6L
R6L
MOV.B
#H'00,
R1H
;
MOV.B
R1H,
@R3
;Write H'00
MOV.W
#H'FE5A, R4
;
MOV.B
R4L,
@TCSRW:8
;
MOV.B
R4H,
@TCW:8
;
MOV.B
#H'36,
R4L
;
MOV.B
R4L,
@TCSRW:8
;Start watchdog timer
MOV.W
R5,
R4
;Set prewrite loop counter
BSET
#0,
@FLMCR:8
;Set P bit
LOOPR1: SUBS
#1,
R4
;
MOV.W
R4,
R4
BNE
LOOPR1
BCLR
#0,
@FLMCR:8
;Clear P bit
MOV.B
#H'50,
R4L
;
;
;Wait loop
MOV.B
R4L,
@TCSRW:8
;Stop watchdog timer
MOV.B
#H'c,
R4H
;Set prewrite-verify loop counter
LOOPR2: DEC
BNE
R4H
;
LOOPR2
;Wait loop
MOV.B
@R3,
BEQ
PWVFOK
CMP.B
#H'06,
BEQ
ABEND1
ADD.W
R5,
BRA
PREWRS
R1H
;Read data = H'00?
;If read data = H'00, branch to PWVFOK
R6L
;Prewrite-verify executed 6 times?
;If prewrite-verify executed 6 times, branch to ABEND1
R5
;Double the programming time
;Prewrite again
ABEND1: Write error
#1,
R3
;Address + 1 → R3
CMP.W
R2,
R3
;Last address?
BNE
PREWRT
PWVFOK: ADDS
; Execute erase
Rev. 6.00 Sep 12, 2006 page 136 of 526
REJ09B0326-0600
;If not last address, prewrite next address
Section 6 ROM
ERASES: MOV.W
ERASE:
LOOPE:
#H'0000, R6
;Erase-verify fail counter
MOV.W
#H'd,
R5
;Set erase loop counter
ADDS
#1,
R6
;Erase-verify fail counter + 1 → R6
MOV.W
#H'e5A, R4
;
MOV.B
R4L,
@TCSRW:8
;
MOV.B
R4H,
@TCW:8
;
MOV.B
#H'36,
R4L
;
MOV.B
R4L,
@TCSRW:8
;Start watchdog timer
MOV.W
R5,
R4
;Set erase loop counter
BSET
#1,
@FLMCR:8
;Set E bit
SUBS
#1,
R4
;
MOV.W
R4,
R4
;
BNE
LOOPE
BCLR
#1,
@FLMCR:8
;Clear E bit
MOV.B
#H'50,
R4L
;
MOV.B
R4L,
@TCSRW:8
;Stop watchdog timer
NOP
NOP
NOP
NOP
;Wait loop
; Execute erase-verify
MOV.W
R0,
R3
;Start address of block to be erased
MOV.B
#H'b,
R4H
;Set erase-verify loop counter
BSET
#3,
@FLMCR:8
;Set EV bit
LOOPEV: DEC
EVR2:
R4H
;
BNE
LOOPEV
;Wait loop
MOV.B
#H'FF,
R1H
;
MOV.B
R1H,
@R3
;Dummy write
#H'c,
R4H
MOV.B
LOOPDW: DEC
;Set erase-verify loop counter
R4H
;
BNE
LOOPDW
;Wait loop
MOV.B
@R3+,
R1H
;Read
CMP.B
#H'FF,
R1H
;Read data = H'FF?
BNE
RERASE
;If read data ≠ H'FF, branch to RERASE
Rev. 6.00 Sep 12, 2006 page 137 of 526
REJ09B0326-0600
Section 6 ROM
R2,
BNE
EVR2
;
BRA
OKEND
;
RERASE: BCLR
BRER:
OKEND:
R3
;Last address in block?
CMP.W
#3,
@FLMCR:8
R3
;Clear EV bit
;Erase-verify address – 1 → R3
SUBS
#1,
MOV.W
#H'0004, R4
;
CMP.W
R4,
;Erase-verify fail count = 4?
BPL
BRER
ADD.W
R5,
MOV.W
#H'025A, R4
;
CMP.W
R4,
;Erase-verify executed 602 times?
R6
;If R6 ≥ 4. branch to BRER (branch until R6 = 4 – 602)
R5
R6
;If R6 < 4, double erase time (executed only for R6 = 1, 2, 3)
BNE
ERASE
;If erase-verify not executed 602 times, erase again
BRA
ABEND2
;If erase-verify executed 602 times, branch to ABEND2
BCLR
#3,
@FLMCR:8
MOV.B
#H'00,
R6L
;
MOV.B
R6L,
@EBR*:8
;Clear EBR*
One block erased
ABEND2: Erase error
Rev. 6.00 Sep 12, 2006 page 138 of 526
REJ09B0326-0600
;Clear EV bit
Section 6 ROM
Flowchart for Erasing Multiple Blocks
Start
Set erase block register
(set bit for block to be erased to 1)
Write 0 data in all addresses to be
erased (prewrite)*1
n=1
Enable watchdog timer *2
Select erase mode
(E bit = 1 in FLMCR)
Wait (x) ms *5
Clear E bit
Erasing halts
Disable watchdog timer
Select erase-verify mode
(EV bit = 1 in FLMCR)
Wait (tvs1) µs *6
Erase-verify
next block
Set block start address as
verify address
Dummy write to verify address *3
(flash memory latches
address)
Notes: 1. Program all addresses to be erased by
following the prewrite flowchart.
2. Set the timer overflow interval to the initial
value shown in table 6.13.
3. For the erase-verify dummy write, write
H'FF using a byte transfer instruction.
4. For the erase-verify operation, read the
data using a byte transfer instruction.
When erasing multiple blocks, clear the
erase block register bits for erased blocks
and perform additional erasing only for
unerased blocks.
5. Erase time x is successively incremented
to initial set value × 2n–1 (n = 1 to 4), and
is fixed from the 4th time onward. An initial
value of 6.25 ms or less should be set,
and the time for one erasure should be 50
ms or less.
6. tvs1: 4 µs or more
tvs2: 2 µs or more
N: 602 (set N so that the total erase
time does not exceed 30 s)
Wait (tvs2) µs *6
Verify *4
(read data H'FF?)
Address + 1 → address
No
Erase-verify next block
NG
Erase-verify
completed for all erase
blocks?
OK
Last address
of block?
No
Yes
Yes
Clear EBR bit for erase
block
n+1→n
No
Erase-verify
completed for all erase
blocks?
n ≥ 4?
Yes
Yes
No
Clear EV bit
All erase
blocks erased?
(EBR1 = EBR2 = 0?)
Yes
End of erase
Double the erase time
(x × 2 → x)
No
n ≥ N? *6
No
Yes
Erase error
Figure 6.16 Multiple-Block Erase Flowchart
Rev. 6.00 Sep 12, 2006 page 139 of 526
REJ09B0326-0600
Section 6 ROM
Sample Program for Erasing Multiple Blocks
This program uses the following registers:
R0:
Used for erase block specification (set as explained below). Also stores address used in
prewrite and erase-verify.
R1H: Used to test bits 8 to 11 of R0. Stores read data; used in dummy write.
R1L: Used to test bits 0 to 11 of R0.
R2:
Specifies address where address used in prewrite and erase-verify is stored.
R3:
Stores address used in prewrite and erase-verify.
R4:
Stores last address of block to be erased.
R5:
Used for prewrite and erase loop counter value setting.
R6L: Used for prewrite-verify and erase-verify fail count.
Arbitrary blocks can be erased by setting bits in R0. R0 settings should be made by writing with a
word transfer instruction.
A bit map of R0 and a sample setting for erasing specific blocks are shown below.
Bit:
15
14
13
12
R0
LB3 LB2 LB1 LB0 SB7 SB6 SB5 SB4 SB3 SB2 SB1 SB0
11
10
9
8
7
6
Corresponds to EBR1
5
4
3
2
1
0
Corresponds to EBR2
Note: Bits 15 to 12 should be cleared to 0.
Example: To erase blocks LB2, SB7, and SB0
Bit:
15
14
R0
13
12
11
10
9
8
7
6
LB3 LB2 LB1 LB0 SB7 SB6 SB5 SB4 SB3 SB2 SB1 SB0
Corresponds to EBR1
0
0
0
0
0
1
5
4
3
2
1
Corresponds to EBR2
0
0
1
0
0
0
0
0
0
R0 is set as follows:
MOV.W
#H'0481, R0
MOV.B
R0H,
@EBR1
MOV.B
R0L,
@EBR2
The values of #a, #b, #c, #d, and #e in the program depend on the operating frequency. They
should be set as indicated in tables 6.11 and 6.12.
Rev. 6.00 Sep 12, 2006 page 140 of 526
REJ09B0326-0600
0
1
Section 6 ROM
Notes: 1. In this sample program, the stack pointer (SP) is set to address H'FF80. On-chip RAM
addresses H'FF7E and H'FF7F are used as a stack area. Therefore addresses H'FF7E
and H'FF7F should not be used when this program is executed, and on-chip RAM
should not be disabled.
2. It is assumed that this program, written in the ROM area, is transferred to the RAM
area and executed there. For #RAMSTR in the program, substitute the start address of
the RAM area to which the program is transferred. The value set for #RAMSTR must
be an even number.
FLMCR:
EBR1:
EBR2:
TCSRW:
TCW:
STACK:
.EQU
.EQU
.EQU
.EQU
.EQU
.EQU
H'FF80
H'FF82
H'FF83
H'FFBE
H'FFBF
H'FF80
START:
.ALIGN 2
MOV.W #STACK,
SP
; Set stack pointer
; Set R0 value as explained on previous page. This sample program erases
; all blocks.
MOV.W #H'0FFF, R0
; Select blocks to be erased (R0: EBR1/EBR2)
MOV.B R0H,
@EBR1
; Set EBR1
MOV.B R0L,
@EBR2
; Set EBR2
; #RAMSTR is start address of RAM area to which program is transferred
; Set #RAMSTR to even number
MOV.W #RAMSTR, R2
; Transfer destination start address (RAM)
MOV.W #ERVADR, R3
;
ADD.W R3,
R2
; #RAMSTR + #ERVADR → R2
MOV.W #START,
R3
;
SUB.W R3,
R2
; Address of data area used in RAM
MOV.B
PRETST: CMP.B
BEQ
CMP.B
BMI
MOV.B
SUBX
BTST
BNE
BRA
EBR2PW: BTST
BNE
PWADD1: INC
#H'00,
#H'0C,
ERASES
#H'08,
EBR2PW
R1L,
#H'08,
R1H,
PREWRT
R1L,
PREWRT
R1L
R1L
R1L
R1L
R1H
R1H
R0H
PWADD1
R0L
;
;
;
;
;
;
;
;
;
;
;
;
;
Used to test bit R1L in R0
R1L = H'0C?
If finished checking all R0 bits, branch to ERASES
If R1L ≥ 8, EBR1 test; if R1L < 8, EBR2 test
R1L – 8 → R1H
Test bit R1H in EBR1 (R0H)
If bit R1H in EBR1 (R0H) is 1, branch to PREWRT
If bit R1H in EBR1 (R0H) is 0, branch to PWADD1
Test bit R1L in EBR2 (R0L)
If bit R1L in EBR2 (R0L) is 1, branch to PREWRT
R1L + 1 → R1L
Rev. 6.00 Sep 12, 2006 page 141 of 526
REJ09B0326-0600
Section 6 ROM
MOV.W @R2+,
BRA
PRETST
; Execute prewrite
PREWRT: MOV.W @R2+,
PREW:
MOV.B #H'00,
MOV.W #H'a,
PREWRS: INC
R6L
MOV.B #H'00
MOV.B R1H,
MOV.W #H'FE5A,
MOV.B R4L,
MOV.B R4H,
MOV.B #H'36,
MOV.B R4L,
MOV.W R5,
BSET
#0,
R3
; Dummy-increment R2
;
R3
R6L
R5
;
;
;
;
R1H
;
@R3
;
R4
;
@TCSRW:8 ;
@TCW:8 ;
R4L
;
@TCSRW:8 ;
R4
;
@FLMCR:8 ;
Prewrite start address
Prewrite-verify fail counter
Set prewrite loop counter
Prewrite-verify fail counter + 1 → R6H
Write H'00
Start watchdog timer
Set prewrite loop counter
Set P bit
LOOPR1: SUBS
MOV.W
BNE
BCLR
MOV.B
MOV.B
MOV.B
#1,
R4,
LOOPR1
#0,
#H'50,
R4L,
#H'b,
R4
R4
;
;
;
@FLMCR:8 ;
R4L
;
@TCSRW:8 ;
R4H
;
LOOPR2: DEC
BNE
MOV.B
BEQ
CMP.B
BEQ
ADD.W
BRA
R4H
LOOPR2
@R3,
PWVFOK
#H'06,
ABEND1
R5,
PREWRS
;
;
;
;
;
;
;
;
Wait loop
Read data = H'00?
If read data = H'00, branch to PWVFOK
Prewrite-verify executed 6 times?
If prewrite-verify executed 6 times, branch to ABEND1
Double the programming time
Prewrite again
R3
R4
R3
;
;
;
;
;
;
Address + 1 → R3
Start address of next block
Last address?
If not last address, prewrite next address
Used to test bit R1L +1 in R0
Branch to PRETST
R6
R5
R6
; Erase-verify fail counter
; Set erase loop counter
; Erase-verify fail counter + 1 → R6
R1H
R6L
R5
Wait loop
Clear P bit
Stop watchdog timer
Set prewrite-verify loop counter
ABEND1: Write error
PWVFOK: ADDS
#1,
MOV.W @R2,
CMP.W R4,
BNE
PREW
PWADD2: INC
R1L
BRA
PRETST
; Execute erase
ERASES: MOV.W #H'0000,
MOV.W #H'd,
ERASE: ADDS
#1,
Rev. 6.00 Sep 12, 2006 page 142 of 526
REJ09B0326-0600
Section 6 ROM
LOOPE:
MOV.W
MOV.B
MOV.B
MOV.B
MOV.B
MOV.W
BSET
NOP
NOP
NOP
NOP
SUBS
MOV.W
BNE
BCLR
MOV.B
MOV.B
#H'e5A,
R4L,
R4H,
#H'36,
R4L,
R5,
#1,
R4
;
@TCSRW:8 ;
@TCW:8 ;
R4L
;
@TCSRW:8 ; Start watchdog timer
R4
; Set erase loop counter
@FLMCR:8 ; Set E bit
#1,
R4,
LOOPE
#1,
#H'50,
R4L,
R4
R4
;
;
; Wait loop
@FLMCR:8 ; Clear E bit
R4L
;
@TCSRW:8 ; Stop watchdog timer
; Execute erase-verify
EVR:
MOV.W #RAMSTR, R2
MOV.W #ERVADR, R3
ADD.W R3,
R2
MOV.W #START,
R3
SUB.W R3,
R2
MOV.B
MOV.B
BSET
LOOPEV: DEC
BNE
EBRTST: CMP.B
BEQ
CMP.B
BMI
MOV.B
SUBX
BTST
BNE
BRA
EBR2EV: BTST
BNE
ADD01: INC
MOV.W
BRA
#H'00,
#H'b,
#3,
R4H
LOOPEV
#H'0C,
HANTEI
#H'08,
EBR2EV
R1L,
#H'08,
R1H,
ERSEVF
ADD01
R1L,
ERSEVF
R1L
@R2+,
EBRTST
ERASE1: BRA
ERASE
ERSEVF: MOV.W
@R2+,
; Transfer destination start address (RAM)
;
; #RAMSTR + #ERVADR → R2
;
; Address of data area used in RAM
R1L
;
R4H
;
@FLMCR:8 ;
;
;
R1L
;
;
R1L
;
;
R1H
;
R1H
;
R0H
;
;
;
R0L
;
;
;
R3
;
;
Used to test bit R1L in R0
Set erase-verify loop counter
Set EV bit
Wait loop
R1L = H'0C?
If finished checking all R0 bits, branch to HANTEI
If R1L ≥ 8, EBR1 test; if R1L < 8, EBR2 test
R1L – 8 → R1H
Test bit R1H in EBR1 (R0H)
If bit R1H in EBR1 (R0H) is 1, branch to ERSEVF
If bit R1H in EBR1 (R0H) is 0, branch to ADD01
Test bit R1L in EBR2 (R0L)
If bit R1L in EBR2 (R0L) is 1, branch to ERSEVF
R1L + 1 → R1L
Dummy-increment R2
; Branch to ERASE via ERASE1
R3
; Start address of block to be erase-verified
Rev. 6.00 Sep 12, 2006 page 143 of 526
REJ09B0326-0600
Section 6 ROM
EVR2:
MOV.B
MOV.B
MOV.B
LOOPEP: DEC
BNE
MOV.B
CMP.B
BNE
MOV.W
CMP.W
BNE
SBCLR:
BLKAD:
#H'FF,
R1H,
#H'c,
R4H
LOOPEP
@R3+,
#H'FF,
BLKAD
@R2,
R4,
EVR2
CMP.B #H'08,
BMI
SBCLR
MOV.B R1L,
SUBX
#H'08,
BCLR
R1H,
BRA
BLKAD
BCLR
R1L,
INC
R1L
BRA
EBRTST
R1H
@R3
R4H
R1H
R1H
R4
R3
R1L
R1H
R1H
R0H
R0L
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
HANTEI: BCLR
#3,
MOV.B R0H,
MOV.B R0L,
MOV.W R0,
BEQ
EOWARI
MOV.W #H'0004,
CMP.W R4,
BPL
BRER
ADD.W R5,
@FLMCR:8 ;
@EBR1:8 ;
@EBR2:8 ;
R4
;
;
R4
;
R6
;
;
R5
;
BRER:
R4
R6
MOV.W #H'025A,
CMP.W R4,
BNE
ERASE1
BRA
ABEND2
Dummy write
Set erase-verify loop counter
Wait loop
Read
Read data = H'FF?
If read data ≠ H'FF, branch to BLKAD
Start address of next block
Last address in block?
If R1L ≥ 8, EBR1 test; if R1L < 8, EBR2 test
R1L – 8 → R1H
Clear bit R1H in EBR1 (R0H)
Clear bit R1L in EBR2 (R0L)
R1L + 1 → R1L
Clear EV bit
If EBR1/EBR2 = all 0s, normal end of erase
Erase-verify fail count = 4?
If R6 ≥ 4. branch to BRER (branch until R6 = 4 – 602)
If R6 < 4, double erase time (executed only for R6 = 1, 2, 3)
;
; Erase-verify executed 602 times?
; If erase-verify not executed 602 times, erase again
; If erase-verify executed 602 times, branch to ABEND2
;**** < Block address table used in erase-verify > ****
.ALIGN
2
ERVADR: .DATA.W
H'0000 ; SB0
.DATA.W
H'0080 ; SB1
.DATA.W
H'0100 ; SB2
.DATA.W
H'0180 ; SB3
.DATA.W
H'0200 ; SB4
.DATA.W
H'0400 ; SB5
.DATA.W
H'0800 ; SB6
.DATA.W
H'0C00 ; SB7
.DATA.W
H'1000 ; LB0
Rev. 6.00 Sep 12, 2006 page 144 of 526
REJ09B0326-0600
Section 6 ROM
.DATA.W
.DATA.W
.DATA.W
.DATA.W
EOWARI:
ABEND2:
H'2000
H'4000
H'6000
H'8000
;
;
;
;
LB1
LB2
LB3
FLASH END
; End of erase
; Erase error
Loop Counter and Watchdog Timer Overflow Interval Settings in Programs: The settings of
#a, #b, #c, #d, and #e in the program examples depend on the clock frequency. Sample loop
counter settings for typical operating frequencies are shown in table 6.11. The value of #e should
be set as indicated in table 6.12.
As software loops are used, there is intrinsic error, and the calculated value and actual time may
not be the same. Therefore, initial values should be set so that the total write time does not exceed
1 ms, and the total erase time does not exceed 30 s.
The maximum number of writes in the program examples is set as N = 6.
Write and erase operations as shown in the flowcharts are achieved by setting the values of #a, #b,
#c, and #d in the program examples as indicated in table 6.11. Use the settings shown in table 6.12
for the value of #e.
In these sample programs, wait state insertion is disabled. If wait states are used, the setting should
be made after the end of the program.
The set value for the watchdog timer (WDT) overflow time is calculated on the basis of the
number of instructions including the write time and erase time from the time the watchdog timer is
started until it stops. Therefore, no other instructions should be added between starting and
stopping of the watchdog timer in these programs.
Rev. 6.00 Sep 12, 2006 page 145 of 526
REJ09B0326-0600
Section 6 ROM
Table 6.11 Set Values of #a, #b, #c, and #d for Typical Operating Frequencies when
Sample Program Is Executed in On-Chip Memory (RAM)
Oscillation Frequency
fOSC = 16 MHz fOSC = 10 MHz fOSC = 8 MHz fOSC = 2 MHz
Operating Frequency
φ = 8 MHz
Meaning of Variable
φ = 5 MHz
Counter Set
Set Time Value
φ = 4 MHz
φ = 1 MHz
Counter Set Counter Set Counter Set
Value
Value
Value
a (φ)
Programming time 15.8 µs
(initial set value)
H'000F
H'0009
H'0007
H'0001
b (φ)
tvs1
4 µs
H'06
H'04
H'03
H'01
c (φ)
tvs2
2 µs
H'03
H'02
H'01
H'01
d (φ)
Erase time (initial 6.25 ms
set value)
H'0C34
H'07A1
H'061A
H'0186
Formula:
If an operating frequency other than those shown in table 6.11 is used, the values can be calculated
using the formula shown below. The calculation is based on an operating frequency (φ) of 5 MHz.
For a (φ) and d (φ), after decimal calculation, round down the first decimal place and convert to
hexadecimal so that a (φ) and d (φ) are 15.8 µs or less and 6.25 ms or less, respectively.
For b (φ) and c (φ), after decimal calculation, round up the first decimal place and convert to
hexadecimal so that b (φ) and c (φ) are 4 µs or more and 2 µs or more, respectively.
a (φ) to d (φ) =
Operating frequency φ [MHz]
5
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× a (φ = 5) to d (φ = 5)
Section 6 ROM
Examples:
Sample calculations when executing a program in on-chip memory (RAM) at an operating
frequency of 6 MHz
a (φ) =
6
5
×
9 = 10.8 ≈ 10 = H'000A
b (φ) =
6
5
×
4
=
4.8
≈
5
= H'05
c (φ) =
6
5
×
2
=
2.4
≈
3
= H'03
d (φ) =
6
5
× 1953 = 2343.6 ≈ 2343 = H'0927
Table 6.12 Watchdog Timer Overflow Interval Settings (Set Value of #e for Operating
Frequencies)
Oscillation Frequency
fOSC = 16 MHz
fOSC = 10 MHz
fOSC = 8 MHz
fOSC = 2 MHz
Operating Frequency
Variable
φ = 8 MHz
φ = 5 MHz
φ = 4 MHz
φ = 1 MHz
e (φ)
H'9B
H'DF
H'E5
H'F7
6.7.7
Prewrite-Verify Mode
Prewrite-verify mode is a verify mode used to all bits to equalize their threshold voltages before
erasure.
To program all bits, write H'00 in accordance with the prewrite algorithm shown in figure 6.15.
Use this procedure to set all data in the flash memory to H'00 after programming. After the
necessary programming time has elapsed, exit program mode (by clearing the P bit to 0) and select
prewrite-verify mode (leave the P, E, PV, and EV bits all cleared to 0). In prewrite-verify mode, a
prewrite-verify voltage is applied to the memory cells at the read address. If the flash memory is
read in this state, the data at the read address will be read. After selecting prewrite-verify mode,
wait at least 4 µs before reading.
Note: For a sample prewriting program, see the prewrite subroutine in the sample erasing
program.
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Section 6 ROM
6.7.8
Protect Modes
There are two modes for flash memory program/erase protection: hardware protection and
software protection. These two protection modes are described below.
Software Protection: With software protection, setting the P or E bit in the flash memory control
register (FLMCR) does not cause a transition to program mode or erase mode.
Details of software protection are given below.
Functions
Item
Description
Program
Erase
Verify*
Block
protect
Programming and erase protection can be
set for individual blocks by settings in the
erase block registers (EBR1 and EBR2).
Disabled
Disabled
Enabled
Setting EBR1 to H'F0 and EBR2 to H'00
places all blocks in the program/eraseprotected state.
Note:
*
Three modes: program-verify, erase-verify, and prewrite-verify.
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Section 6 ROM
Hardware Protection: Hardware protection refers to a state in which programming/erasing of
flash memory is forcibly suspended or disabled. At this time, the flash memory control register
(FLMCR) and erase block register (EBR1 and EBR2) settings are cleared.
Details of the hardware protection states are given below.
Functions
Description
Programming
voltage (FVPP)
protect
When 12 V is not being applied to the Disabled
FVPP pin, FLMCR, EBR1, and EBR2
are initialized, and the program/eraseprotected state is entered. To obtain
this protection, the VPP voltage should
not exceed the VCC power supply
3
voltage.*
Disabled*
Disabled
Reset/standby
protect
In a reset, (including a watchdog timer Disabled
reset), and in sleep, subsleep, watch,
and standby mode, FLMCR, EBR1,
and EBR2 are initialized, and the
program/erase-protected state is
entered. In a reset via the RES pin, the
reset state is not reliably entered
unless the RES pin is held low for at
4
least 20 ms (oscillation settling time)*
after powering on. In the case of a
reset during operation, the RES pin
must be held low for a minimum of 10
system clock cycles (10φ).
Disabled*
Disabled
Notes: 1.
2.
3.
4.
6.7.9
Program
1
Verify*
Item
Erase
2
2
Three modes: program-verify, erase-verify, and prewrite-verify.
All blocks are erase-disabled, and individual block specification is not possible.
For details, see section 6.9, Flash Memory Programming and Erasing Precautions.
For details, see AC Characteristics in section 13, Electrical Characteristics.
Interrupt Handling during Flash Memory Programming/Erasing
If an interrupt is generated while the flash memory is being programmed or erased (while the P or
E bit is set in FLMCR), an operating state may be entered in which the vector will not be read
correctly in the exception handling sequence, resulting in program runaway. All interrupt sources
should therefore be masked to prevent interrupt generation while programming or erasing the flash
memory.
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Section 6 ROM
6.8
Flash Memory PROM Mode (H8/3644F, H8/3643F, and H8/3642AF)
6.8.1
PROM Mode Setting
The H8/3644F, H8/3643F, and H8/3642AF, in which the on-chip ROM is flash memory, have a
PROM mode as well as the on-board programming modes for programming and erasing flash
memory. In PROM mode, the on-chip ROM can be freely programmed using a general-purpose
PROM programmer.
6.8.2
Memory Map
Figure 6.17 shows the memory map in PROM mode.
MPU mode
H8/3644F
H'0000
PROM mode
H'0000
On-chip ROM area
H'7FFF*
H'7FFF*
“1” output
H'1FFFF
Note: * This example applies to the H8/3644F. This address
is H'5FFF in the H8/3643F, and H'3FFF in the H8/3642AF.
Figure 6.17 Memory Map in PROM Mode
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Section 6 ROM
6.8.3
Operation in PROM Mode
The program/erase/verify specifications in PROM mode are the same as for the standard
HN28F101 flash memory. The H8/3644F, H8/3643F, and H8/3642AF do not have a device
recognition code, so the programmer cannot read the device name automatically. Table 6.13 shows
how the different operating modes are selected when using PROM mode.
Table 6.13 Operating Mode Selection in PROM Mode
Pins
Mode
FVPP
VCC
CE
OE
WE
D7 to D0
A16 to A0
Read
Read
VCC*
VCC
L
L
H
Data output
Address input
Output disable
VCC*
VCC
L
H
H
High impedance
Standby
VCC*
VCC
H
X
X
High impedance
Read
VPP
VCC
L
L
H
Data output
Output disable
VPP
VCC
L
H
H
High impedance
Standby
VPP
VCC
H
X
X
High impedance
Write
VPP
VCC
L
H
L
Data input
Command
write
Legend:
L: Low level
H: High level
VPP: VPP level
VCC: VCC level
X: Don’t care
Note: * In these states, the FVPP pin must be set to VCC.
VH: 11.5 V ≤ VH ≤ 12.5 V
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Section 6 ROM
Table 6.14 PROM Mode Commands
1st Cycle
2nd Cycle
Command
Cycles
Mode
Address
Data
Mode
Address
Data
Memory read
1
Write
X
H'00
Read
RA
Dout
Erase setup/erase
2
Write
X
H'20
Write
X
H'20
Erase-verify
2
Write
EA
H'A0
Read
X
EVD
Auto-erase setup/
auto-erase
2
Write
X
H'30
Write
X
H'30
Program setup/
program
2
Write
X
H'40
Write
PA
PD
Program-verify
2
Write
X
H'C0
Read
X
PVD
Reset
2
Write
X
H'FF
Write
X
H'FF
Legend:
PA:
Program address
EA:
Erase-verify address
RA:
Read address
PD:
Program data
PVD: Program-verify output data
EVD: Erase-verify output data
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Section 6 ROM
High-Speed, High-Reliability Programming: Unused areas of the flash memory in the
H8/3644F, H8/3643F, or H8/3642AF contain H'FF data (initial value). The flash memory uses a
high-speed, high-reliability programming procedure. This procedure provides higher programming
speed without subjecting the device to voltage stress and without sacrificing the reliability of the
programmed data.
Figure 6.18 shows the basic high-speed, high-reliability programming flowchart. Tables 6.15 and
6.16 list the electrical characteristics during programming.
Start
Set VPP = 12.0 V ±0.6 V
Address = 0
n=0
n+1→n
Program setup command
Program command
Wait (25 µs)
Program-verify command
Wait (6 µs)
Address + 1 → address
Verify?
OK
No
Last address?
NG
n = 20?
No
Yes
Yes
Set VPP = VCC
End
Error
Figure 6.18 High-Speed, High-Reliability Programming
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Section 6 ROM
High-Speed, High-Reliability Erasing: The flash memory in the H8/3644F, H8/3643F, and
H8/3642AF uses a high-speed, high-reliability erasing procedure. This procedure provides higher
erasing speed without subjecting the device to voltage stress and without sacrificing the reliability
of data reliability.
Figure 6.19 shows the basic high-speed, high-reliability erasing flowchart. Tables 6.15 and 6.16
list the electrical characteristics during erasing.
Start
Program all bits to 0*
Address = 0
n=0
n+1→n
Erase setup/erase command
Wait (10 ms)
Erase-verify command
Wait (6 µs)
Address + 1 → address
Verify?
OK
No
NG
n = 3000?
No
Yes
Last address?
Yes
End
Error
Note: * Follow the high-speed, high-reliability programming flowchart in programming all bits.
If 0 has already been written, perform programming for unprogrammed bits.
Figure 6.19 High-Speed, High-Reliability Erasing
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Section 6 ROM
Table 6.15 DC Characteristics in PROM Mode
(Conditions: VCC = 5.0 V ±10%, VPP = 12.0 V ±0.6 V, VSS = 0 V, Ta = 25°C ±5°C)
Item
Symbol Min
Typ
Max
Unit Test Conditions
Input high
voltage
FO7 to FO0, FA16 to FA0, VIH
OE, CE, WE
2.2
VCC + 0.3 V
Input low
voltage
FO7 to FO0, FA16 to FA0, VIL
OE, CE, WE
–0.3
0.8
V
Output high FO7 to FO0
voltage
VOH
2.4
V
IOH = –200 µA
Output low
voltage
FO7 to FO0
VOL
0.45
V
IOL = 1.6 mA
Input
leakage
current
FO7 to FO0, FA16 to FA0, | ILI |
OE, CE, WE
2
µA
Vin = 0 to VCC
VCC
current
FVPP
current
Read
ICC
40
80
mA
Program
ICC
40
80
mA
Erase
ICC
40
80
mA
Read
IPP
10
µA
VPP = 2.7 to 5.5 V
10
20
mA
VPP = 12.6 V
Program
IPP
20
40
mA
VPP = 12.6 V
Erase
IPP
20
40
mA
VPP = 12.6 V
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Section 6 ROM
Table 6.16 AC Characteristics in PROM Mode
(Conditions: VCC = 5.0 V ±10%, VPP = 12.0 V ±0.6 V, VSS = 0 V, Ta = 25°C ±5°C)
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
Command write cycle
tCWC
120
ns
Figure 6.20
Address setup time
tAS
0
ns
Figure 6.21*
Address hold time
tAH
60
ns
Figure 6.22
Data setup time
tDS
50
ns
Data hold time
tDH
10
ns
CE setup time
tCES
0
ns
CE hold time
tCEH
0
ns
VPP setup time
tVPS
100
ns
VPP hold time
tVPH
100
ns
WE programming pulse width
tWEP
70
ns
WE programming pulse high time
tWEH
40
ns
OE setup time before command write
tOEWS
0
ns
OE setup time before verify
tOERS
6
µs
Verify access time
tVA
500
ns
OE setup time before status polling
tOEPS
120
ns
Status polling access time
tSPA
120
ns
Program wait time
tPPW
25
µs
Erase wait time
tET
9
11
ms
Output disable time
tDF
0
40
ns
Total auto-erase time
tAET
0.5
30
s
Notes: The CE, OE, and WE pins should be driven high during transitions of VPP from 5 V to 12 V
and from 12 V to 5 V.
* Input pulse level: 0.45 V to 2.4 V
Input rise time and fall time ≤ 10 ns
Timing reference levels: 0.8 V and 2.0 V for input; 0.8 V and 2.0 V for output
Rev. 6.00 Sep 12, 2006 page 156 of 526
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Section 6 ROM
Auto-erase
and status polling
Auto-erase setup
VCC
VPP
5.0 V
12 V
5.0 V
tVPS
tVPH
Address
CE
tCEH
tCES
OE
tCWC
tWEP
tOEWS
tCEH
tOEPS
tWEP
tAET
tWEH
WE
tDS
I/O7
tCES
tCES
tDH
Command
input
tDF
tDS
tDH
tSPA
Command
input
Status polling
I/O0 to I/O6
Command
input
Command
input
Figure 6.20 Auto-Erase Timing
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Section 6 ROM
Program setup
VCC
VPP
Program
Program-verify
5.0 V
12 V
5.0 V
tVPS
tVPH
Address
Valid address
tAH
tAS
CE
tCEH
tCES
OE
tWEP
tOEWS
tCWC
tCES
tPPW
tCEH tCES tWEP
WE
tCEH
tWEP
tOERS
tWEH
tDH
tDS
tVA
tDH
tDS
I/O7
Command
input
Command
input
I/O0 to I/O6
Command
input
Command
input
tDH
tDS
tDF
Command
input
Valid data
output
Command
input
Valid data
output
Note: Program-verify data output values maybe intermediate between 1 and 0 if programming is
insufficient.
Figure 6.21 High-Speed, High-Reliability Programming Timing
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Section 6 ROM
Erase setup
VCC
VPP
Erase
Erase -verify
5.0 V
12 V
5.0 V
tVPS
tVPH
Valid address
tAS
tAH
Address
CE
OE
tOEWS
tCES
tCWC
tWEP
WE
I/O0 to I/O7
tCES
tCEH
tDS
tCEH
tDH
Command
input
tCES
tWEP
tET
tCEH
tOERS
tWEP
tWEH
tVA
tDS
tDH
Command
input
tDS
tDH
Command
input
tDF
Valid data
output
Note: Erase -verify data output values maybe intermediate between 1 and 0 if erasing is insufficient.
Figure 6.22 Erase Timing
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Section 6 ROM
6.9
Flash Memory Programming and Erasing Precautions
Precautions concerning the use of on-board programming modes and PROM mode are
summarized below.
1. Program with the specified voltages and timing.
The rated programming voltage (VPP) of the flash memory is 12.0 V.
If the PROM programmer is set to Renesas HN28F101 specifications, VPP will be 12.0 V.
Applied voltages in excess of the rating can permanently damage the device. In particular,
insure that the peak overshoot of the PROM programmer does not exceed the maximum rating
of 13 V.
2. Before programming, check that the chip is correctly mounted in the PROM programmer.
Overcurrent damage to the device can result if the index marks on the PROM programmer
socket, socket adapter, and chip are not correctly aligned.
3. Do not touch the socket adapter or chip while programming. Touching either of these can
cause contact faults and write errors.
4. Set H'FF as the PROM programmer buffer data for the following addresses:
H8/3644F: H'8000 to H'1FFFF
H8/3643F: H'6000 to H'1FFFF
H8/3642AF: H'4000 to H'1FFFF
The size of the PROM area is 32 kbytes in the H8/3644F, 24 kbytes in the H8/3643F, and 16
kbytes in the H8/3642AF. The addresses shown above always read H'FF, so if H'FF is not
specified as programmer data, a block error will occur.
5. Precautions in applying, releasing, and cutting*1 the programming voltage (VPP)
a. Apply the programming voltage (VPP) after VCC has stabilized, and release VPP before
cutting VCC.
To avoid programming or erasing flash memory by mistake, VPP should only be applied,
released, and cut when the MCU is in a “stable operating condition” as described below.
MCU stable operating condition
• The VCC voltage must be within the rated voltage range (VCC = 2.7 V to 5.5 V).
If the VPP voltage is applied, released, or cut while VCC is not within its rated voltage
range (VCC = 2.7 V to 5.5 V), since the MCU is unstable, the flash memory may be
programmed or erased by mistake. This can occur even if VCC = 0 V. Adequate power
supply measures should be taken, such as the insertion of a bypass capacitor, to prevent
fluctuation of the VCC power supply when VPP is applied.
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Section 6 ROM
• Oscillation must have stabilized (following the elapse of the oscillation settling time) or
be stopped.
When the VCC power is turned on, hold the RES pin low for the duration of the
oscillation settling time*2 (trc = 20 ms) before applying VPP.
• The MCU must be in the reset state, or in a state in which reset has ended normally
(reset has been released) and flash memory is not being accessed.
Apply or release VPP either in the reset state, or when the CPU is not accessing flash
memory (when a program in on-chip RAM or external memory is executing). Flash
memory data cannot be read normally at the instant when VPP is applied or released, so
do not read flash memory while VPP is being applied or released.
For a reset during operation, apply or release VPP only after the RES pin has been held
low for at least 10 system clock cycles (10φ).
• The P and E bits must be cleared in the flash memory control register (FLMCR).
When applying or releasing VPP, make sure that the P or E bit is not set by mistake.
• There must be no program runaway.
When VPP is applied, program execution must be supervised, e.g. by the watchdog
timer.
These power-on and power-off timing requirements for VCC and VPP should also be
satisfied in the event of a power failure and in recovery from a power failure. If these
requirements are not satisfied, overprogramming or overerasing may occur due to program
runaway, etc., which could cause memory cells to malfunction.
b. The VPP flag is set and cleared by a threshold decision on the voltage applied to the FVPP
pin. The threshold level is approximately in the range from VCC +2 V to 11.4 V.
When this flag is set, it becomes possible to write to the flash memory control register
(FLMCR) and the erase block registers (EBR1 and EBR2), even though the VPP voltage
may not yet have reached the programming voltage range of 12.0 V ±0.6 V.
Do not actually program or erase the flash memory until VPP has reached the programming
voltage range.
The programming voltage range for programming and erasing flash memory is 12.0 V ±0.6
V (11.4 V to 12.6 V). Programming and erasing cannot be performed correctly outside this
range. When not programming or erasing the flash memory, insure that the VPP voltage
does not exceed the VCC voltage. This will prevent unintentional programming and erasing.
Notes: 1. Definitions of VPP application, release, and cut-off are as follows:
Application:
Raising the voltage from VCC to 12.0 V ±0.6 V
Release:
Dropping the voltage from 12.0 V ±0.6 V to VCC
Cut-off:
Halting voltage application (floating state)
2. The time depends on the resonator used; refer to the electrical characteristics.
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Section 6 ROM
tOSC1
φ
3.0 to 5.5 V
VCC
0 µs min.
0 µs min.
12 ±0.6 V
VCC + 2 V to 11.4 V
0 µs min.
Timing of boot
program branch
to RAM space
VCCV
VPP
(boot mode)
0 to VCCV
12 ±0.6 V
VCCV
VPP
(user program
mode)
0 to VCCV
RES
Period during which flash memory access
is prohibited and VPP flag set/clear period
Min. 10 φ cycles
(When RES is low)
Figure 6.23 VPP Power-On and Cut-Off Timing
6. Do not apply 12 V to the FVPP pin during normal operation.
To prevent erroneous programming or erasing due to program runaway, etc., apply 12 V to the
FVPP pin only when programming or erasing flash memory. If overprogramming or
overerasing occurs due to program runaway, etc., the memory cells may not operate normally.
A system configuration in which a high level is constantly applied to the FVPP pin should be
avoided. Also, while a high level is applied to the FVPP pin, the watchdog timer should be
activated to prevent overprogramming or overerasing due to program runaway, etc.
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Section 6 ROM
7. Design a current margin into the programming voltage (VPP) power supply.
Insure that VPP remains within the range 12.0 V ±0.6 V (11.4 V to 12.6 V) during
programming and erasing. Programming and erasing may become impossible outside this
range.
8. Insure that peak overshoot at the FVPP and TEST pins does not exceed the maximum rating.
Connect bypass capacitors as close as possible to the FVPP and TEST pins.
In boot mode start-up, also, bypass capacitors should be connected to the TEST pin in the same
way.
12 V
FVPP
H8/3644F
1.0 µF
0.01 µF
Figure 6.24 Example of VPP Power Supply Circuit Design
9. Use the recommended algorithms when programming and erasing flash memory.
The recommended algorithms enable programming and erasing to be carried out without
subjecting the device to voltage stress or sacrificing program data reliability. When setting the
program (P) or erase (E) bit in the flash memory control register (FLMCR), the watchdog
timer should be set beforehand to prevent the specified time from being exceeded.
10. For comments on interrupt handling while flash memory is being programmed or erased, see
section 6.7.9, Interrupt Handling during Flash Memory Programming/Erasing.
11. Notes on accessing flash memory control registers
a. Flash memory control register access state in each operating mode
The H8/3644F, H8/3643F, and H8/3642AF have flash memory control registers located at
addresses H'FF80 (FLMCR), H'FF82 (EBR1), and H'FF83 (EBR2). These registers can
only be accessed when 12 V is applied to the flash memory programming power supply
pin, FVPP.
b. To check for 12 V application/non-application in user mode
When address H'FF80 is accessed in user mode, if 12 V is being applied to FVPP, FLMCR
is read/written to, and its initial value after reset is H'80. When 12 V is not being applied to
FVPP, FLMCR is a reserved area that cannot be modified and always reads H'FF. Since bit
7 (corresponding to the VPP bit) is set to 1 at this time regardless of whether or not 12 V is
applied to FVPP, application or release of 12 V to FVPP cannot be determined simply from
Rev. 6.00 Sep 12, 2006 page 163 of 526
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Section 6 ROM
the 0 or 1 status of this bit. A byte data comparison is necessary to check whether 12V is
being applied. The relevant coding is shown below.
LABEL1:
.
.
MOV.B
CMP.B
BEQ
.
.
.
@H'FF80, R1L
#H'FF, R1L
LABEL1
Sample program for detection of 12 V application to FVPP (user
mode)
Table 6.17 Flash Memory DC Characteristics
VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, AVREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
VPP = 12.0 V ±0.6 V
Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Item
Symbol
Min
VCC + 2
High voltage (12 V)
application criterion
level*
FVPP, TEST
VH
FVPP current
Read
IPP
Note:
*
Typ
Max
Unit
11.4
V
Test Conditions
10
µA
VPP = 2.7 to 5.5 V
10
20
mA
VPP = 12.6 V
Program
20
40
mA
Erase
20
40
mA
The high voltage application criterion level is as shown in the table above, but a setting
of 12.0 V ±0.6 V should be made in boot mode and when programming and erasing
flash memory.
Rev. 6.00 Sep 12, 2006 page 164 of 526
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Section 6 ROM
Table 6.18 Flash Memory AC Characteristics
VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, AVREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
VPP = 12.0 V ±0.6 V
Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Item
Symbol
Min
Typ
Max
Unit
1 2
Programming time* *
1 3
Erase time* *
tP
50
1000
µs
tE
1
30
s
Reprogramming capability
1
Verify setup time 1*
NWEC
100
Times
tVS1
4
µs
1
Verify setup time 2*
tVS2
2
µs
4
Flash memory read setup time*
tFRS
50
µs
100
Test Conditions
VCC ≥ 4.5 V
VCC < 4.5 V
Notes: 1. Follow the program/erase algorithms shown in section 6 when making the settings.
2. Indicates the programming time per byte (the time during which the P bit is set in the
flash memory control register (FLMCR)). Does not include the program-verify time.
3. Indicates the time to erase all blocks (32 kB) (the time during which the E bit is set in
FLMCR). Does not include the prewrite time before erasing of the erase-verify time.
4. After powering on when using an external clock, when the programming voltage (VPP) is
switched from 12 V to VCC, an interval at least equal to the read setup time must be
allowed to elapse before reading the flash memory.
When VPP is released, this specifies the setup time from the point at which the VPP
voltage reaches the VCC + 2 V level until the flash memory is read.
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Section 6 ROM
Rev. 6.00 Sep 12, 2006 page 166 of 526
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Section 7 RAM
Section 7 RAM
7.1
Overview
The H8/3644 Group has 1 kbyte and 512 byte of high-speed static RAM on-chip. The RAM is
connected to the CPU by a 16-bit data bus, allowing high-speed 2-state access for both byte data
and word data.
7.1.1
Block Diagram
Figure 7.1 shows a block diagram of the on-chip RAM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'FB80
H'FB80
H'FB81
H'FB82
H'FB82
H'FB83
On-chip RAM
H'FF7E
H'FF7E
H'FF7F
Even-numbered
address
Odd-numbered
address
Figure 7.1 RAM Block Diagram
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Section 7 RAM
Rev. 6.00 Sep 12, 2006 page 168 of 526
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Section 8 I/O Ports
Section 8 I/O Ports
8.1
Overview
The H8/3644 Group is provided with three 8-bit I/O ports, three 5-bit I/O ports, two 3-bit I/O
ports, and one 8-bit input-only port. Table 8.1 indicates the functions of each port.
Each port has of a port control register (PCR) that controls input and output, and a port data
register (PDR) for storing output data. Input or output can be assigned to individual bits.
See section 2.9.2, Notes on Bit Manipulation, for information on executing bit-manipulation
instructions to write data in PCR or PDR.
Block diagrams of each port are given in appendix C, I/O Port Block Diagrams.
Table 8.1
Port Functions
Port
Description
Pins
Other Functions
Port 1
•
5-bit I/O port
P17/IRQ3/TRGV
•
Input pull-up
MOS selectable
P16 to P15/
IRQ2 to IRQ1
External interrupt 3, timer
V trigger input
Port 2
Port 3
Port 5
•
3-bit I/O port
Function Switching
Register
PMR1
External interrupts 2 and 1
P14/PWM
14-bit PWM output
PMR1
P10/TMOW
Timer A clock output
PMR1
P22/TxD
SCI3 data output
PMR7
P21/RxD
SCI3 data input
SCR3
P20/SCK1
SCI3 clock input/output
SCR3, SMR
•
3-bit I/O port
P32/SO1
PMR3
•
Input pull-up
MOS selectable
P31/SI1
SCI1 data output (SO1),
data input (SI1), clock
input/output (SCK1)
8-bit I/O port
P57 /INT7
INT interrupt 7
Input pull-up
MOS
P56 /INT6/
TMIB
INT interrupt 6
P55/INT5/
ADTRG
INT interrupt 5
P54 to P50/
INT4 to INT0
INT interrupts 4 to 0
•
•
P30/SCK1
Timer B1 event input
A/D converter external
trigger input
Rev. 6.00 Sep 12, 2006 page 169 of 526
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Section 8 I/O Ports
Port
Description
Pins
Port 6
•
8-bit I/O port
P67 to P60
•
High-current
port
•
5-bit I/O port
Port 7
Other Functions
Function Switching
Register
P77
P76/TMOV
Timer V compare-match
output
P75/TMCIV
Timer V clock input
P74/TMRIV
Timer V reset input
TCSRV
P73
Port 8
•
8-bit I/O port
P87
P86/FTID
Timer X input capture D
input
P85/FTIC
Timer X input capture C
input
P84/FTIB
Timer X input capture B
input
P83/FTIA
Timer X input capture A
input
P82/FTOB
Timer X output compare B TOCR
output
P81/FTOA
Timer X output compare A TOCR
output
P80/FTCI
Timer X clock input
Port 9
•
5-bit I/O port
P90* to P94
Port B
•
8-bit input port
PB7 to PB0/
AN7 to AN0
Note:
*
A/D converter analog input
(AN7 to AN0)
There is no P90 function in the flash memory version since P90 is used as the FVPP pin.
Rev. 6.00 Sep 12, 2006 page 170 of 526
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Section 8 I/O Ports
8.2
Port 1
8.2.1
Overview
Port 1 is a 5-bit I/O port. Figure 8.1 shows its pin configuration.
P1 7 /IRQ 3 /TRGV
P1 6 /IRQ 2
P1 5 /IRQ 1
Port 1
P1 4 /PWM
P1 0 /TMOW
Figure 8.1 Port 1 Pin Configuration
8.2.2
Register Configuration and Description
Table 8.2 shows the port 1 register configuration.
Table 8.2
Port 1 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 1
PDR1
R/W
H'00
H'FFD4
Port control register 1
PCR1
W
H'00
H'FFE4
Port pull-up control register 1
PUCR1
R/W
H'00
H'FFED
Port mode register 1
PMR1
R/W
H'04
H'FFFC
Port Data Register 1 (PDR1)
Bit
7
6
5
4
3
2
1
0
P17
P16
P15
P14
0*
0*
P10
R/W
Initial value
0
0
0
0
0*
Read/Write
R/W
R/W
R/W
R/W
Note:
*
0
Bits 3 to 1 are reserved; they are always read as 0 and cannot be modified.
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Section 8 I/O Ports
PDR1 is an 8-bit register that stores data for port 1 pins P17 through P14 and P10. If port 1 is read
while PCR1 bits are set to 1, the values stored in PDR1 are read, regardless of the actual pin states.
If port 1 is read while PCR1 bits are cleared to 0, the pin states are read.
Upon reset, PDR1 is initialized to H'00.
Port Control Register 1 (PCR1)
Bit
7
6
5
4
3
2
1
0
PCR17
PCR16
PCR15
PCR14
PCR10
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
PCR1 is an 8-bit register for controlling whether each of the port 1 pins P17 through P14 and P10
functions as an input pin or output pin. Setting a PCR1 bit to 1 makes the corresponding pin an
output pin, while clearing the bit to 0 makes the pin an input pin. The settings in PCR1 and in
PDR1 are valid only when the corresponding pin is designated in PMR1 as a general I/O pin.
Upon reset, PCR1 is initialized to H'00.
PCR1 is a write-only register, which is always read as all 1s.
Port Pull-Up Control Register 1 (PUCR1)
Bit
7
6
5
4
3
2
1
0
0*
0*
PUCR10
R/W
Initial value
0
0
0
0
0*
Read/Write
R/W
R/W
R/W
R/W
PUCR17 PUCR16 PUCR15 PUCR14
Note:
*
0
Bits 3 to 1 are reserved; they are always read as 0 and cannot be modified.
PUCR1 controls whether the MOS pull-up of each of the port 1 pins P17 through P14 and P10 is on
or off. When a PCR1 bit is cleared to 0, setting the corresponding PUCR1 bit to 1 turns on the
MOS pull-up for the corresponding pin, while clearing the bit to 0 turns off the MOS pull-up.
Upon reset, PUCR1 is initialized to H'00.
Rev. 6.00 Sep 12, 2006 page 172 of 526
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Section 8 I/O Ports
Port Mode Register 1 (PMR1)
Bit
7
6
5
4
3
2
1
0
IRQ3
IRQ2
IRQ1
PWM
TMOW
Initial value
0
0
0
0
0
1
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
PMR1 is an 8-bit read/write register, controlling the selection of pin functions for port 1 pins.
Upon reset, PMR1 is initialized to H'04.
Bit 7
P17/IRQ
IRQ3/TRGV Pin Function Switch (IRQ3): This bit selects whether pin
P17/IRQ3/TRGV is used as P17 or as IRQ3/TRGV.
Bit 7: IRQ3
Description
0
Functions as P17 I/O pin
1
Functions as IRQ3/TRGV input pin
(initial value)
Note: Rising or falling edge sensing can be designated for IRQ3. Rising, falling, or both edge
sensing can be designated for TRGV. For details on TRGV settings, see section 9.4.2,
Register Descriptions.
Bit 6
P16/IRQ
IRQ2 Pin Function Switch (IRQ2): This bit selects whether pin P16/IRQ2 is used as
P16 or as IRQ2.
Bit 6: IRQ2
Description
0
Functions as P16 I/O pin
1
Functions as IRQ2 input pin
(initial value)
Note: Rising or falling edge sensing can be designated for IRQ2.
Bit 5
P15/IRQ
IRQ1 Pin Function Switch (IRQ1): This bit selects whether pin P15/IRQ1 is used as
P15 or as IRQ1.
Bit 5: IRQ1
Description
0
Functions as P15 I/O pin
1
Functions as IRQ1 input pin
(initial value)
Note: Rising or falling edge sensing can be designated for IRQ1.
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Section 8 I/O Ports
Bit 4
P14/PWM Pin Function Switch (PWM): This bit selects whether pin P14/PWM is used
as P14 or as PWM.
Bit 4: PWM
Description
0
Functions as P14 I/O pin
1
Functions as PWM output pin
(initial value)
Bit 3
Reserved Bit: Bit 3 is reserved: it is always read as 0 and cannot be modified.
Bit 2
Reserved Bit: Bit 2 is reserved: it is always read as 1 and cannot be modified.
Bit 1
Reserved Bit: Bit 1 is reserved: it is always read as 0 and cannot be modified.
Bit 0
P10/TMOW Pin Function Switch (TMOW): This bit selects whether pin P10/TMOW is
used as P10 or as TMOW.
Bit 0: TMOW
Description
0
Functions as P10 I/O pin
1
Functions as TMOW output pin
Rev. 6.00 Sep 12, 2006 page 174 of 526
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(initial value)
Section 8 I/O Ports
8.2.3
Pin Functions
Table 8.3 shows the port 1 pin functions.
Table 8.3
Pin
Port 1 Pin Functions
Pin Functions and Selection Method
P17/IRQ3/TRGV The pin function depends on bit IRQ3 in PMR1 and bit PCR17 in PCR1.
IRQ3
PCR17
Pin function
P16/IRQ2
P15/IRQ1
0
0
1
1
P17 input pin P17 output pin
*
IRQ3/TRGV input pin
The pin function depends on bits IRQ2 and IRQ1 in PMR1 and bit PCR1n in
PCR1.
(m = n – 4, n = 6, 5)
IRQm
PCR1n
Pin function
P14/PWM
0
0
P1n input pin P1n output pin
*
IRQm input pin
The pin function depends on bit PWM in PMR1 and bit PCR14 in PCR1.
PWM
PCR14
Pin function
P10/TMOW
1
1
0
0
1
1
P14 input pin P14 output pin
*
PWM output pin
The pin function depends on bit TMOW in PMR1 and bit PCR10 in PCR1.
TMOW
PCR10
Pin function
0
0
1
1
P10 input pin P10 output pin
*
TMOW output pin
Legend: * Don’t care
Rev. 6.00 Sep 12, 2006 page 175 of 526
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Section 8 I/O Ports
8.2.4
Pin States
Table 8.4 shows the port 1 pin states in each operating mode.
Table 8.4
Port 1 Pin States
Pins
Reset
Sleep
Subsleep Standby
Retains Retains
P17/IRQ3/TRGV Highimpedance
previous previous
P16/IRQ2
state
state
P15/IRQ1
Watch
Subactive Active
Retains Functional Functional
Highimpedance* previous
state
P14/PWM
P10/TMOW
Note:
*
8.2.5
A high-level signal is output when the MOS pull-up is in the on state.
MOS Input Pull-Up
Port 1 has a built-in MOS input pull-up function that can be controlled by software. When a PCR1
bit is cleared to 0, setting the corresponding PUCR1 bit to 1 turns on the MOS input pull-up for
that pin. The MOS input pull-up function is in the off state after a reset.
PCR1n
PUCR1n
MOS input pull-up
0
1
0
1
*
Off
On
Off
Legend: * Don’t care
Note: n = 7 to 4, 0
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Section 8 I/O Ports
8.3
Port 2
8.3.1
Overview
Port 2 is a 3-bit I/O port, configured as shown in figure 8.2.
P2 2 /TXD
P2 1 /RXD
Port 2
P2 0 /SCK3
Figure 8.2 Port 2 Pin Configuration
8.3.2
Register Configuration and Description
Table 8.5 shows the port 2 register configuration.
Table 8.5
Port 2 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 2
PDR2
R/W
H'00
H'FFD5
Port control register 2
PCR2
W
H'00
H'FFE5
Port Data Register 2 (PDR2)
Bit
Initial value
Read/Write
Note:
*
7
6
5
4
3
2
1
0
0*
0*
0*
0*
0*
P22
P21
P20
0
0
0
R/W
R/W
R/W
Bits 7 to 3 are reserved; they are always read as 0 and cannot be modified.
PDR2 is an 8-bit register that stores data for port 2 pins P22 to P20. If port 2 is read while PCR2
bits are set to 1, the values stored in PDR2 are read, regardless of the actual pin states. If port 2 is
read while PCR2 bits are cleared to 0, the pin states are read.
Upon reset, PDR2 is initialized to H'00.
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Section 8 I/O Ports
Port Control Register 2 (PCR2)
Bit
7
6
5
4
3
2
1
0
PCR22
PCR21
PCR20
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
PCR2 is an 8-bit register for controlling whether each of the port 1 pins P22 to P20 functions as an
input pin or output pin. Setting a PCR2 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCR2 and PDR2 are valid only
when the corresponding pin is designated in SCR3 as a general I/O pin.
Upon reset, PCR2 is initialized to H'00.
PCR2 is a write-only register, which is always read as all 1s.
Rev. 6.00 Sep 12, 2006 page 178 of 526
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Section 8 I/O Ports
8.3.3
Pin Functions
Table 8.6 shows the port 2 pin functions.
Table 8.6
Port 2 Pin Functions
Pin
Pin Functions and Selection Method
P22/TXD
The pin function depends on bit TXD in PMR7 and bit PCR22 in PCR2.
TXD
0
PCR22
0
Pin function
P21/RXD
1
*
P22 input pin P22 output pin
TXD output pin
The pin function depends on bit RE in SCR3 and bit PCR21 in PCR2.
RE
0
PCR21
1
0
Pin function
P20/SCK3
1
1
*
P21 input pin P21 output pin
RXD input pin
The pin function depends on bits CKE1 and CKE0 in SCR3, bit COM in SMR,
and bit PCR20 in PCR2.
CKE1
0
CKE0
1
0
COM
1
0
PCR20
0
Pin function
1
1
*
*
P20 input pin P20 output pin
*
*
*
SCK3 output SCK3 input pin
pin
Legend: * Don’t care
8.3.4
Pin States
Table 8.7 shows the port 2 pin states in each operating mode.
Table 8.7
Port 2 Pin States
Pins
Reset
Sleep
Subsleep
Standby
Watch
P22/TXD
Highimpedance
Retains
previous
state
Retains
previous
state
Highimpedance
Retains Functional Functional
previous
state
P21/RXD
P20/SCK3
Subactive Active
Rev. 6.00 Sep 12, 2006 page 179 of 526
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Section 8 I/O Ports
8.4
Port 3
8.4.1
Overview
Port 3 is a 8-bit I/O port, configured as shown in figure 8.3.
P3 2 /SO 1
P3 1 /SI1
Port 3
P3 0 /SCK1
Figure 8.3 Port 3 Pin Configuration
8.4.2
Register Configuration and Description
Table 8.8 shows the port 3 register configuration.
Table 8.8
Port 3 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 3
PDR3
R/W
H'00
H'FFD6
Port control register 3
PCR3
W
H'00
H'FFE6
Port pull-up control register 3
PUCR3
R/W
H'00
H'FFEE
Port mode register 3
PMR3
R/W
H'00
H'FFFD
Port mode register 7
PMR7
R/W
H'F8
H'FFFF
Port Data Register 3 (PDR3)
Bit
7
6
5
4
3
2
1
0
0*
0*
0*
0*
P32
P31
P30
Initial value
0*
0
0
0
Read/Write
R/W
R/W
R/W
Note:
*
Bits 7 to 3 are reserved; they are always read as 0 and cannot be modified.
PDR3 is an 8-bit register that stores data for port 3 pins P32 to P30. If port 3 is read while PCR3
bits are set to 1, the values stored in PDR3 are read, regardless of the actual pin states. If port 3 is
read while PCR3 bits are cleared to 0, the pin states are read.
Rev. 6.00 Sep 12, 2006 page 180 of 526
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Section 8 I/O Ports
Upon reset, PDR3 is initialized to H'00.
Port Control Register 3 (PCR3)
Bit
7
6
5
4
3
2
1
0
PCR32
PCR31
PCR30
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
PCR3 is an 8-bit register for controlling whether each of the port 3 pins P32 to P30 functions as an
input pin or output pin. Setting a PCR3 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCR3 and in PDR3 are valid only
when the corresponding pin is designated in PMR3 as a general I/O pin.
Upon reset, PCR3 is initialized to H'00.
PCR3 is a write-only register, which is always read as all 1s.
Port Pull-Up Control Register 3 (PUCR3)
Bit
7
6
5
4
3
Initial value
0*
0*
0*
0*
0*
Read/Write
Note:
*
2
1
0
PUCR32 PUCR31 PUCR30
0
0
0
R/W
R/W
R/W
Bits 7 to 3 are reserved; they are always read as 0 and cannot be modified.
PUCR3 controls whether the MOS pull-up of each of the port 3 pins P32 to P30 is on or off. When
a PCR3 bit is cleared to 0, setting the corresponding PUCR3 bit to 1 turns on the MOS pull-up for
the corresponding pin, while clearing the bit to 0 turns off the MOS pull-up.
Upon reset, PUCR3 is initialized to H'00.
Port Mode Register 3 (PMR3)
Bit
7
6
5
4
3
2
1
0
SO1
SI1
SCK1
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
Rev. 6.00 Sep 12, 2006 page 181 of 526
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Section 8 I/O Ports
PMR3 is an 8-bit read/write register, controlling the selection of pin functions for port 3 pins.
Upon reset, PMR3 is initialized to H'00.
Bits 7 to 3
Reserved Bits: Bits 7 to 3 are reserved: they are always read as 0 and cannot be
modified.
Bit 2
P32/SO1 Pin Function Switch (SO1): This bit selects whether pin P32/SO1 is used as P32
or as SO1.
Bit 2: SO1
Description
0
Functions as P32 I/O pin
1
Functions as SO1 output pin
(initial value)
Bit 1
P31/SI1 Pin Function Switch (SI1): This bit selects whether pin P31/SI1 is used as P31 or
as SI1.
Bit 1: SI1
Description
0
Functions as P31 I/O pin
1
Functions as SI1 input pin
(initial value)
Bit 0
P30/SCK1 Pin Function Switch (SCK1): This bit selects whether pin P30/SCK1 is used
as P30 or as SCK1.
Bit 0: SCK1
Description
0
Functions as P30 I/O pin
1
Functions as SCK1 I/O pin
(initial value)
Port Mode Register 7 (PMR7)
Bit
7
6
5
4
3
2
1
0
TXD
POF1
Initial value
1
1
1
1
1
0
0
0
Read/Write
R/W
R/W
PMR7 is an 8-bit read/write register that turns the PMOS transistors of pins and P32/SO1 on and
off.
Upon reset, PMR7 is initialized to H'F8.
Rev. 6.00 Sep 12, 2006 page 182 of 526
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Section 8 I/O Ports
Bits 7 to 3
Reserved Bits: Bits 7 to 3 are reserved; they are always read as 1, and cannot be
modified.
Bit 2
P22/TXD Pin Function Switch (TXD): Bit 2 selects whether pin P22/TXD is used as P22
or as TXD.
Bit 2: TXD
Description
0
Functions as P22 I/O pin
1
Functions as TXD output pin
(initial value)
Bit 1
Reserved Bit: Bit 1 is reserved: it is always read as 0 and cannot be modified.
Bit 0
P32/SO1 Pin PMOS Control (POF1): This bit controls the PMOS transistor in the
P32/SO1 pin output buffer.
Bit 0: POF1
Description
0
CMOS output
1
NMOS open-drain output
(initial value)
Rev. 6.00 Sep 12, 2006 page 183 of 526
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Section 8 I/O Ports
8.4.3
Pin Functions
Table 8.9 shows the port 3 pin functions.
Table 8.9
Port 3 Pin Functions
Pin
Pin Functions and Selection Method
P32/SO1
The pin function depends on bit SO1 in PMR3 and bit PCR32 in PCR3.
SO1
0
PCR32
Pin function
P31/SI1
0
1
P32 input pin P32 output pin
*
SO1 output pin
The pin function depends on bit SI1 in PMR3 and bit PCR31 in PCR3.
SI1
0
PCR31
Pin function
P30/SCK1
1
0
1
1
*
P31 input pin P31 output pin
SI1 input pin
The pin function depends on bit SCK1 in PMR3, bit CKS3 in SCR1, and bit
PCR30 in PCR3.
SCK1
0
CKS3
*
PCR30
Pin function
0
1
1
P30 input pin P30 output pin
Legend: * Don’t care
Rev. 6.00 Sep 12, 2006 page 184 of 526
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0
1
*
*
SCK1 output SCK1 input pin
pin
Section 8 I/O Ports
8.4.4
Pin States
Table 8.10 shows the port 3 pin states in each operating mode.
Table 8.10 Port 3 Pin States
Pins
Reset
Sleep
Subsleep
Standby
P32/SO1
Highimpedance
Retains
previous
state
Retains
previous
state
Retains Functional Functional
Highimpedance* previous
state
P31/SI1
P30/SCK1
Note:
*
8.4.5
Watch
Subactive Active
A high-level signal is output when the MOS pull-up is in the on state.
MOS Input Pull-Up
Port 3 has a built-in MOS input pull-up function that can be controlled by software. When a PCR3
bit is cleared to 0, setting the corresponding PUCR3 bit to 1 turns on the MOS pull-up for that pin.
The MOS pull-up function is in the off state after a reset.
PCR3n
PUCR3n
MOS input pull-up
0
1
0
1
*
Off
On
Off
Legend: * Don’t care
Note: n = 2 to 0
Rev. 6.00 Sep 12, 2006 page 185 of 526
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Section 8 I/O Ports
8.5
Port 5
8.5.1
Overview
Port 5 is an 8-bit I/O port, configured as shown in figure 8.4.
P57/INT7
P56/INT6/TMIB
P55/INT5/ADTRG
P54/INT4
Port 5
P53/INT3
P52/INT2
P51/INT1
P50/INT0
Figure 8.4 Port 5 Pin Configuration
8.5.2
Register Configuration and Description
Table 8.11 shows the port 5 register configuration.
Table 8.11 Port 5 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 5
PDR5
R/W
H'00
H'FFD8
Port control register 5
PCR5
W
H'00
H'FFE8
Port pull-up control register 5
PUCR5
R/W
H'00
H'FFEF
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Section 8 I/O Ports
Port Data Register 5 (PDR5)
Bit
7
6
5
4
3
2
1
0
P57
P56
P55
P54
P53
P52
P51
P50
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR5 is an 8-bit register that stores data for port 5 pins P57 to P50. If port 5 is read while PCR5
bits are set to 1, the values stored in PDR5 are read, regardless of the actual pin states. If port 5 is
read while PCR5 bits are cleared to 0, the pin states are read.
Upon reset, PDR5 is initialized to H'00.
Port Control Register 5 (PCR5)
Bit
7
6
5
4
3
2
1
0
PCR57
PCR56
PCR55
PCR54
PCR53
PCR52
PCR51
PCR50
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR5 is an 8-bit register for controlling whether each of the port 5 pins P57 to P50 functions as an
input pin or output pin. Setting a PCR5 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin.
Upon reset, PCR5 is initialized to H'00.
PCR5 is a write-only register, which is always read as all 1s.
Port Pull-Up Control Register 5 (PUCR5)
Bit
7
6
5
4
3
2
1
0
PUCR57 PUCR56 PUCR55 PUCR54 PUCR53 PUCR52 PUCR51 PUCR50
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PUCR5 controls whether the MOS pull-up of each port 5 pin is on or off. When a PCR5 bit is
cleared to 0, setting the corresponding PUCR5 bit to 1 turns on the MOS pull-up for the
corresponding pin, while clearing the bit to 0 turns off the MOS pull-up.
Upon reset, PUCR5 is initialized to H'00.
Rev. 6.00 Sep 12, 2006 page 187 of 526
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Section 8 I/O Ports
8.5.3
Pin Functions
Table 8.12 shows the port 5 pin functions.
Table 8.12 Port 5 Pin Functions
Pin
Pin Functions and Selection Method
P57/INT7
The pin function depends on bit PCR57 in PCR5.
PCR57
Pin function
0
1
P57 input pin
P57 output pin
INT7 input pin
P56/INT6/TMIB
The pin function depends on bit PCR56 in PCR5.
PCR56
Pin function
0
1
P56 input pin
P56 output pin
INT6 input pin and TMIB input pin
P55/INT5/
The pin function depends on bit PCR55 in PCR5.
ADTRG
PCR55
Pin function
0
1
P55 input pin
P55 output pin
INT5 input pin and ADTRG input pin
P54/INT4 to
P50/INT0
The pin function depends on bit PCR5n in PCR5.
(n = 4 to 0)
PCR5n
Pin function
0
1
P5n input pin
P5n output pin
INTn input pin
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Section 8 I/O Ports
8.5.4
Pin States
Table 8.13 shows the port 5 pin states in each operating mode.
Table 8.13 Port 5 Pin States
Pins
Reset
P57/INT7 to
P50/INT0
HighRetains
impedance previous
state
Note:
*
8.5.5
Sleep
Subsleep
Standby
Watch
Subactive Active
Retains
previous
state
Retains Functional Functional
Highimpedance* previous
state
A high-level signal is output when the MOS pull-up is in the on state.
MOS Input Pull-Up
Port 5 has a built-in MOS input pull-up function that can be controlled by software. When a PCR5
bit is cleared to 0, setting the corresponding PUCR5 bit to 1 turns on the MOS pull-up for that pin.
The MOS pull-up function is in the off state after a reset.
PCR5n
PUCR5n
MOS input pull-up
0
1
0
1
*
Off
On
Off
Legend: * Don’t care
Note: n = 7 to 0
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Section 8 I/O Ports
8.6
Port 6
8.6.1
Overview
Port 6 is an 8-bit large-current I/O port, with a maximum sink current of 10 mA. The port 6 pin
configuration is shown in figure 8.5.
P67
P66
P65
P64
Port 6
P63
P62
P61
P60
Figure 8.5 Port 6 Pin Configuration
8.6.2
Register Configuration and Description
Table 8.14 shows the port 6 register configuration.
Table 8.14 Port 6 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 6
PDR6
R/W
H'00
H'FFD9
Port control register 6
PCR6
W
H'00
H'FFE9
Port Data Register 6 (PDR6)
Bit
7
6
5
4
3
2
1
0
P67
P66
P65
P64
P63
P62
P61
P60
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Rev. 6.00 Sep 12, 2006 page 190 of 526
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Section 8 I/O Ports
PDR6 is an 8-bit register that stores data for port 6 pins P67 to P60.
When a bit in PCR6 is set to 1, if port 6 is read the value of the corresponding PDR6 bit is
returned directly regardless of the pin state. When a bit in PCR6 is cleared to 0, if port 6 is read the
corresponding pin state is read.
Upon reset, PDR6 is initialized to H'00.
Port Control Register 6 (PCR6)
Bit
7
6
5
4
3
2
1
0
PCR67
PCR66
PCR65
PCR64
PCR63
PCR62
PCR61
PCR60
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR6 is an 8-bit register for controlling whether each of the port 6 pins P67 to P60 functions as an
input pin or output pin.
When a bit in PCR6 is set to 1, the corresponding pin of P67 to P60 becomes an output pin.
Upon reset, PCR6 is initialized to H'00.
PCR6 is a write-only register, which always reads all 1s.
8.6.3
Pin Functions
Table 8.15 shows the port 6 pin functions.
Table 8.15 Port 6 Pin Functions
Pin
Pin Functions and Selection Method
P67 to P60
The pin function depends on bit PCR6n in PCR6
(n = 7 to 0)
PCR6n
Pin function
0
1
P6n input pin
P6n output pin
Rev. 6.00 Sep 12, 2006 page 191 of 526
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Section 8 I/O Ports
8.6.4
Pin States
Table 8.16 shows the port 6 pin states in each operating mode.
Table 8.16 Port 6 Pin States
Pins
Reset
P67 toP60
HighRetains Retains
impedance previous previous
state
state
Note:
*
Sleep
Subsleep Standby
Watch
Subactive Active
Retains Functional Functional
Highimpedance* previous
state
A high-level signal is output when the MOS pull-up is in the on state.
8.7
Port 7
8.7.1
Overview
Port 7 is a 8-bit I/O port, configured as shown in figure 8.6.
P77
P76/TMOV
Port 7
P75/TMCIV
P74/TMRIV
P73
Figure 8.6 Port 7 Pin Configuration
8.7.2
Register Configuration and Description
Table 8.17 shows the port 7 register configuration.
Table 8.17 Port 7 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 7
PDR7
R/W
H'00
H'FFDA
Port control register 7
PCR7
W
H'00
H'FFEA
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Section 8 I/O Ports
Port Data Register 7 (PDR7)
Bit
7
6
5
4
3
2
1
0
P77
P76
P75
P74
P73
Initial value
0
0
0
0
0
0*
0*
0*
Read/Write
R/W
R/W
R/W
R/W
R/W
Note:
*
Bits 2 to 0 are reserved; they are always read as 0 and cannot be modified.
PDR7 is an 8-bit register that stores data for port 7 pins P77 to P73. If port 7 is read while PCR7
bits are set to 1, the values stored in PDR7 are read, regardless of the actual pin states. If port 7 is
read while PCR7 bits are cleared to 0, the pin states are read.
Upon reset, PDR7 is initialized to H'00.
Port Control Register 7 (PCR7)
Bit
7
6
5
4
3
2
1
0
PCR77
PCR76
PCR75
PCR74
PCR73
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
PCR7 is an 8-bit register for controlling whether each of the port 7 pins P77 to P73 functions as an
input pin or output pin. Setting a PCR7 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin.
Upon reset, PCR7 is initialized to H'00.
PCR7 is a write-only register, which always reads as all 1s.
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Section 8 I/O Ports
8.7.3
Pin Functions
Table 8.18 shows the port 7 pin functions.
Table 8.18 Port 7 Pin Functions
Pin
Pin Functions and Selection Method
P77, P73
The pin function depends on bit PCR7n in PCR7.
(n = 7 or 3)
PCR7n
Pin function
P76/TMOV
1
P7n input pin
P7n output pin
The pin function depends on bit PCR76 in PCR7 and bits OS3 to OS0 in
TCSRV.
OS3 to OS0
0000
PCR76
Pin function
P75/TMCIV
0
0
Not 0000
1
P76 input pin P76 output pin
*
TMOV output pin
The pin function depends on bit PCR75 in PCR7.
PCR75
Pin function
0
1
P75 input pin
P75 output pin
TMCIV input pin
P74/TMRIV
The pin function depends on bit PCR74 in PCR7.
PCR74
Pin function
0
1
P74 input pin
P74 output pin
TMRIV input pin
Legend: * Don’t care
Rev. 6.00 Sep 12, 2006 page 194 of 526
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Section 8 I/O Ports
8.7.4
Pin States
Table 8.19 shows the port 7 pin states in each operating mode.
Table 8.19 Port 7 Pin States
Pins
Reset
P77 to P73
HighRetains Retains
impedance previous previous
state
state
8.8
Port 8
8.8.1
Overview
Sleep
Subsleep Standby
Highimpedance
Watch
Subactive Active
Retains Functional Functional
previous
state
Port 8 is an 8-bit I/O port configured as shown in figure 8.7.
P87
P86/FTID
P85/FTIC
Port 8
P84/FTIB
P83//FTIA
P82/FTOB
P81/FTOA
P80/FTCI
Figure 8.7 Port 8 Pin Configuration
Rev. 6.00 Sep 12, 2006 page 195 of 526
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Section 8 I/O Ports
8.8.2
Register Configuration and Description
Table 8.20 shows the port 8 register configuration.
Table 8.20 Port 8 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 8
PDR8
R/W
H'00
H'FFDB
Port control register 8
PCR8
W
H'00
H'FFEB
Port Data Register 8 (PDR8)
Bit
7
6
5
4
3
2
1
0
P87
P86
P85
P84
P83
P82
P81
P80
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR8 is an 8-bit register that stores data for port 8 pins P87 to P80. If port 8 is read while PCR8
bits are set to 1, the values stored in PDR8 are read, regardless of the actual pin states. If port 8 is
read while PCR8 bits are cleared to 0, the pin states are read.
Upon reset, PDR8 is initialized to H'00.
Port Control Register 8 (PCR8)
Bit
7
6
5
4
3
2
1
0
PCR87
PCR86
PCR85
PCR84
PCR83
PCR82
PCR81
PCR80
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR8 is an 8-bit register for controlling whether each of the port 8 pins P87 to P80 functions as an
input or output pin. Setting a PCR8 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin.
Upon reset, PCR8 is initialized to H'00.
PCR8 is a write-only register, which is always read as all 1s.
Rev. 6.00 Sep 12, 2006 page 196 of 526
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Section 8 I/O Ports
8.8.3
Pin Functions
Table 8.21 shows the port 8 pin functions.
Table 8.21 Port 8 Pin Functions
Pin
Pin Functions and Selection Method
P87
The pin function depends on bit PCR87 in PCR8.
PCR87
Pin function
P86/FTID
0
1
P87 input pin
P87 output pin
The pin function depends on bit PCR86 in PCR8.
PCR86
Pin function
0
1
P86 input pin
P86 output pin
FTID input pin
P85/FTIC
The pin function depends on bit PCR85 in PCR8.
PCR85
Pin function
0
1
P85 input pin
P85 output pin
FTIC input pin
P84/FTIB
The pin function depends on bit PCR84 in PCR8.
PCR84
Pin function
0
1
P84 input pin
P84 output pin
FTIB input pin
P83/FTIA
The pin function depends on bit PCR83 in PCR8.
PCR83
0
Pin function
1
P83 input pin
P83 output pin
FTIA input pin
P82/FTOB
The pin function depends on bit PCR82 in PCR8 and bit OEB in TOCR.
OEB
PCR82
Pin function
0
0
1
1
P82 input pin P82 output pin
*
FTOB output pin
Rev. 6.00 Sep 12, 2006 page 197 of 526
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Section 8 I/O Ports
Pin
Pin Functions and Selection Method
P81/FTOA
The pin function depends on bit PCR81 in PCR8 and bit OEA in TOCR.
OEA
0
PCR81
0
Pin function
P80/FTCI
1
1
*
P81 input pin P81 output pin
FTOA output pin
The pin function depends on bit PCR80 in PCR8.
PCR80
0
Pin function
1
P80 input pin
P80 output pin
FTCI input pin
Legend: * Don’t care
8.8.4
Pin States
Table 8.22 shows the port 8 pin states in each operating mode.
Table 8.22
Pins
Port 8 Pin States
Reset
Sleep
Subsleep Standby
Retains Retains
P87 to P80/FTCI Highimpedance previous previous
state
state
Rev. 6.00 Sep 12, 2006 page 198 of 526
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Highimpedance
Watch
Subactive Active
Retains Functional Functional
previous
state
Section 8 I/O Ports
8.9
Port 9
8.9.1
Overview
Port 9 is a 5-bit I/O port, configured as shown in figure 8.8.
P9 4
P9 3
P9 2
Port 9
P9 1
P9 0 *
Note: * There is no P90 function in the flash memory version since P90 is used as the FVPP pin.
Figure 8.8 Port 9 Pin Configuration
8.9.2
Register Configuration and Description
Table 8.23 shows the port 9 register configuration.
Table 8.23 Port 9 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 9
PDR9
R/W
H'C0
H'FFDC
Port control register 9
PCR9
W
H'C0
H'FFEC
Port Data Register 9 (PDR9)
Bit
7
6
5
4
3
2
1
0
1
1*
2
0*
P94
P93
P92
P91
P90*
Initial value
1
1*
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
3
Notes: 1. Bits 7 to 6 are reserved; they are always read as 1 and cannot be modified.
2. Bit 5 is reserved; it is always read as 0 and cannot be modified.
3. In the on-chip flash memory version, this bit is always read as 0 and cannot be
modified.
Rev. 6.00 Sep 12, 2006 page 199 of 526
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Section 8 I/O Ports
PDR9 is an 8-bit register that stores data for port 9 pins P94 to P90. If port 9 is read while PCR9
bits are set to 1, the values stored in PDR9 are read, regardless of the actual pin states. If port 9 is
read while PCR9 bits are cleared to 0, the pin states are read.
Upon reset, PDR9 is initialized to H'C0.
Port Control Register 9 (PCR9)
Bit
7
6
5
4
3
2
1
0
PCR94
PCR93
PCR92
PCR91
PCR90
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
PCR9 controls whether each of the port 9 pins P94 to P90 functions as an input pin or output pin.
Setting a PCR9 bit to 1 makes the corresponding pin an output pin, while clearing the bit to 0
makes the pin an input pin.
Upon reset, PCR9 is initialized to H'C0.
PCR9 is a write-only register, which is always reads as all 1.
8.9.3
Pin Functions
Table 8.24 shows the port 9 pin functions.
Table 8.24 Port 9 Pin Functions
Pin
Pin Functions and Selection Method
P9n
The pin function depends on bit PCR9n in PCR9.
(n = 4 to 0)
PCR9n
Pin function
Rev. 6.00 Sep 12, 2006 page 200 of 526
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0
1
P9n input pin
P9n output pin
Section 8 I/O Ports
8.9.4
Pin States
Table 8.25 shows the port 9 pin states in each operating mode.
Table 8.25 Port 9 Pin States
Pins
Reset
P94 to P90
HighRetains Retains
impedance previous previous
state
state
8.10
Port B
8.10.1
Overview
Sleep
Subsleep Standby
Watch
Highimpedance
Subactive Active
Retains Functional Functional
previous
state
Port B is an 8-bit input-only port, configured as shown in figure 8.9.
PB7 /AN 7
PB6 /AN 6
PB5 /AN 5
PB4 /AN 4
Port B
PB3 /AN 3
PB2 /AN 2
PB1 /AN 1
PB0 /AN 0
Figure 8.9 Port B Pin Configuration
8.10.2
Register Configuration and Description
Table 8.26 shows the port B register configuration.
Table 8.26 Port B Register
Name
Abbr.
R/W
Address
Port data register B
PDRB
R
H'FFDD
Rev. 6.00 Sep 12, 2006 page 201 of 526
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Section 8 I/O Ports
Port Data Register B (PDRB)
Bit
7
6
5
4
3
2
1
0
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
R
R
R
R
R
R
R
R
Read/Write
Reading PDRB always gives the pin states. However, if a port B pin is selected as an analog input
channel for the A/D converter by AMR bits CH3 to CH0, that pin reads 0 regardless of the input
voltage.
8.10.3
Pin Functions
Table 8.27 shows the port B pin functions.
Table 8.27 Port B Pin Functions
Pin
Pin Functions and Selection Method
PBn/ANn
Always as below.
(n = 7 to 0)
Pin function
8.10.4
PBn input pin or ANn input pin
Pin States
Table 8.28 shows the port B pin states in each operating mode.
Table 8.28 Port B Pin States
Pins
Reset
Sleep
Subsleep
Standby
Watch
Subactive Active
PBn/ANn
HighHighHighHighHighHighHighimpedance impedance impedance impedance impedance impedance impedance
(n = 7 to 0)
Rev. 6.00 Sep 12, 2006 page 202 of 526
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Section 9 Timers
Section 9 Timers
9.1
Overview
The H8/3644 Group provides five timers: timers A, B1, V, X, and a watchdog timer. The
functions of these timers are outlined in table 9.1.
Table 9.1
Timer Functions
Name
Functions
Timer A
8-bit timer
Timer B1
Timer V
•
•
•
•
•
•
•
•
Timer X
•
•
•
•
•
Watchdog •
timer
Internal Clock
Event
Input Pin
Waveform
Output Pin Remarks
•
Interval function
φ/8 to φ/8192
(8 choices)
•
Time base
φW /128
(choice of 4
overflow periods)
•
Clock output
φ/4 to φ/32
φW /4 to φW /32
(8 choices)
TMOW
φ/4 to φ/8192
(7 choices)
TMIB
φ/4 to φ/128
(6 choices)
TMCIV
TMOV
φ/2 to φ/32
(3 choices)
FTCI
FTIA
FTIB
FTIC
FTID
FTOA
FTOB
φ/8192
8-bit timer
Interval timer
Event counter
8-bit timer
Event counter
Output control by dual
compare match
Counter clearing option
Count-up start by
external trigger input can
be specified
16-bit free-running timer
2 output compare
channels
4 input capture channels
Counter clearing option
Event counter
Reset signal generated
when 8-bit counter
overflows
Rev. 6.00 Sep 12, 2006 page 203 of 526
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Section 9 Timers
9.2
Timer A
9.2.1
Overview
Timer A is an 8-bit timer with interval timing and real-time clock time-base functions. The clock
time-base function is available when a 32.768-kHz crystal resonator is connected. A clock signal
divided from 32.768 kHz or from the system clock can be output at the TMOW pin.
Features
Features of timer A are given below.
• Choice of eight internal clock sources (φ/8192, φ/4096, φ/2048, φ/512, φ/256, φ/128, φ/32,
φ/8).
• Choice of four overflow periods (1 s, 0.5 s, 0.25 s, 31.25 ms) when timer A is used as a clock
time base (using a 32.768 kHz crystal resonator).
• An interrupt is requested when the counter overflows.
• Any of eight clock signals can be output from pin TMOW: 32.768 kHz divided by 32, 16, 8, or
4 (1 kHz, 2 kHz, 4 kHz, 8 kHz), or the system clock divided by 32, 16, 8, or 4.
Rev. 6.00 Sep 12, 2006 page 204 of 526
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Section 9 Timers
Block Diagram
Figure 9.1 shows a block diagram of timer A.
1/4
TMA
PSW
φW /4
φ W/32
φ W/16
φ W/8
φ W/4
φ W/128
TMOW
φ
÷256*
÷128*
÷64*
φ/8192, φ/4096, φ/2048,
φ/512, φ/256, φ/128,
φ/32, φ/8
÷8*
TCA
φ/32
φ/16
φ/8
φ/4
Internal data bus
φW
PSS
IRRTA
Legend:
TMA:
TCA:
IRRTA:
PSW:
PSS:
Timer mode register A
Timer counter A
Timer A overflow interrupt request flag
Prescaler W
Prescaler S
Note: * Can be selected only when the prescaler W output (φW/128) is used as the TCA input clock.
Figure 9.1 Block Diagram of Timer A
Pin Configuration
Table 9.2 shows the timer A pin configuration.
Table 9.2
Pin Configuration
Name
Abbr.
I/O
Function
Clock output
TMOW
Output
Output of waveform generated by timer A output
circuit
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Section 9 Timers
Register Configuration
Table 9.3 shows the register configuration of timer A.
Table 9.3
Timer A Registers
Name
Abbr.
R/W
Initial Value
Address
Timer mode register A
TMA
R/W
H'10
H'FFB0
Timer counter A
TCA
R
H'00
H'FFB1
9.2.2
Register Descriptions
Timer Mode Register A (TMA)
Bit
7
6
5
4
3
2
1
0
TMA7
TMA6
TMA5
TMA3
TMA2
TMA1
TMA0
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TMA is an 8-bit read/write register for selecting the prescaler, input clock, and output clock.
Upon reset, TMA is initialized to H'10.
Bits 7 to 5
Clock Output Select (TMA7 to TMA5): Bits 7 to 5 choose which of eight clock
signals is output at the TMOW pin. The system clock divided by 32, 16, 8, or 4 can be output in
active mode and sleep mode. A 32.768 kHz signal divided by 32, 16, 8, or 4 can be output in
active mode, sleep mode, and subactive mode.
Bit 7: TMA7
Bit 6: TMA6
Bit 5: TMA5
Clock Output
0
0
0
φ/32
1
φ/16
0
φ/8
1
φ/4
0
0
φW /32
1
φW /16
1
0
φW /8
1
φW /4
1
1
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(initial value)
Section 9 Timers
Bit 4
Reserved Bit: Bit 4 is reserved; it is always read as 1, and cannot be modified.
Bits 3 to 0
Internal Clock Select (TMA3 to TMA0): Bits 3 to 0 select the clock input to TCA.
The selection is made as follows.
Description
Bit 3:
TMA3
Bit 2:
TMA2
Bit 1:
TMA1
Bit 0:
TMA0
Prescaler and Divider Ratio
or Overflow Period
Function
0
0
0
0
PSS, φ/8192
Interval timer
1
PSS, φ/4096
0
PSS, φ/2048
1
PSS, φ/512
0
PSS, φ/256
1
PSS, φ/128
0
PSS, φ/32
1
PSS, φ/8
0
PSW, 1 s
1
PSW, 0.5 s
0
PSW, 0.25 s
1
PSW, 0.03125 s
0
PSW and TCA are reset
1
1
0
1
1
0
0
1
1
0
(initial value)
Clock time base
1
1
0
1
Timer Counter A (TCA)
Bit
7
6
5
4
3
2
1
0
TCA7
TCA6
TCA5
TCA4
TCA3
TCA2
TCA1
TCA0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
TCA is an 8-bit read-only up-counter, which is incremented by internal clock input. The clock
source for input to this counter is selected by bits TMA3 to TMA0 in timer mode register A
(TMA). TCA values can be read by the CPU in active mode, but cannot be read in subactive
mode. When TCA overflows, the IRRTA bit in interrupt request register 1 (IRR1) is set to 1.
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Section 9 Timers
TCA is cleared by setting bits TMA3 and TMA2 of TMA to 11.
Upon reset, TCA is initialized to H'00.
9.2.3
Timer Operation
Interval Timer Operation: When bit TMA3 in timer mode register A (TMA) is cleared to 0,
timer A functions as an 8-bit interval timer.
Upon reset, TCA is cleared to H'00 and bit TMA3 is cleared to 0, so up-counting and interval
timing resume immediately. The clock input to timer A is selected by bits TMA2 to TMA0 in
TMA; any of eight internal clock signals output by prescaler S can be selected.
After the count value in TCA reaches H'FF, the next clock signal input causes timer A to
overflow, setting bit IRRTA to 1 in interrupt request register 1 (IRR1). If IENTA = 1 in interrupt
enable register 1 (IENR1), a CPU interrupt is requested.*
At overflow, TCA returns to H'00 and starts counting up again. In this mode timer A functions as
an interval timer that generates an overflow output at intervals of 256 input clock pulses.
Note: * For details on interrupts, see section 3.3, Interrupts.
Real-Time Clock Time Base Operation: When bit TMA3 in TMA is set to 1, timer A functions
as a real-time clock time base by counting clock signals output by prescaler W. The overflow
period of timer A is set by bits TMA1 and TMA0 in TMA. A choice of four periods is available.
In time base operation (TMA3 = 1), setting bit TMA2 to 1 clears both TCA and prescaler W to
their initial values of H'00.
Clock Output: Setting bit TMOW in port mode register 1 (PMR1) to 1 causes a clock signal to be
output at pin TMOW. Eight different clock output signals can be selected by means of bits TMA7
to TMA5 in TMA. The system clock divided by 32, 16, 8, or 4 can be output in active mode and
sleep mode. A 32.768 kHz signal divided by 32, 16, 8, or 4 can be output in active mode, sleep
mode, and subactive mode.
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Section 9 Timers
9.2.4
Timer A Operation States
Table 9.4 summarizes the timer A operation states.
Table 9.4
Timer A Operation States
Watch
Subactive
Subsleep
Standby
Reset
Functions Functions Halted
Halted
Halted
Halted
Reset
Functions Functions Functions Functions Functions Halted
Reset
Functions Retained Retained Functions Retained Retained
Operation Mode
Reset Active
TCA Interval
Clock time base
TMA
Sleep
Note: When the real-time clock time base function is selected as the internal clock of TCA in
active mode or sleep mode, the internal clock is not synchronous with the system clock, so
it is synchronized by a synchronizing circuit. This may result in a maximum error of 1/φ (s) in
the count cycle.
9.3
Timer B1
9.3.1
Overview
Timer B1 is an 8-bit timer that increments each time a clock pulse is input. This timer has two
operation modes, interval and auto reload.
Features
Features of timer B1 are given below.
• Choice of seven internal clock sources (φ/8192, φ/2048, φ/512, φ/256, φ/64, φ/16, φ/4) or an
external clock (can be used to count external events).
• An interrupt is requested when the counter overflows.
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Section 9 Timers
Block Diagram
Figure 9.2 shows a block diagram of timer B1.
φ
PSS
TCB1
TLB1
TMIB
IRRTB1
Legend:
TMB1: Timer mode register B1
TCB1: Timer counter B1
TLB1: Timer load register B1
IRRTB1: Timer B1 interrupt request flag
PSS:
Prescaler S
Figure 9.2 Block Diagram of Timer B1
Pin Configuration
Table 9.5 shows the timer B1 pin configuration.
Table 9.5
Internal data bus
TMB1
Pin Configuration
Name
Abbr.
I/O
Function
Timer B1 event input
TMIB
Input
Event input to TCB1
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Section 9 Timers
Register Configuration
Table 9.6 shows the register configuration of timer B1.
Table 9.6
Timer B1 Registers
Name
Abbr.
R/W
Initial Value
Address
Timer mode register B1
TMB1
R/W
H'78
H'FFB2
Timer counter B1
TCB1
R
H'00
H'FFB3
Timer load register B1
TLB1
W
H'00
H'FFB3
9.3.2
Register Descriptions
Timer Mode Register B1 (TMB1)
Bit
7
6
5
4
3
2
1
0
TMB17
TMB12
TMB11
TMB10
Initial value
0
1
1
1
1
0
0
0
Read/Write
R/W
R/W
R/W
R/W
TMB1 is an 8-bit read/write register for selecting the auto-reload function and input clock.
Upon reset, TMB1 is initialized to H'78.
Bit 7
Auto-Reload Function Select (TMB17): Bit 7 selects whether timer B1 is used as an
interval timer or auto-reload timer.
Bit 7: TMB17
Description
0
Interval timer function selected
1
Auto-reload function selected
(initial value)
Bits 6 to 3
Reserved Bits: Bits 6 to 3 are reserved; they are always read as 1, and cannot be
modified.
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Section 9 Timers
Bits 2 to 0
Clock Select (TMB12 to TMB10): Bits 2 to 0 select the clock input to TCB1. For
external event counting, either the rising or falling edge can be selected.
Bit 2: TMB12
Bit 1: TMB11
Bit 0: TMB10
Description
0
0
0
Internal clock: φ/8192
1
Internal clock: φ/2048
0
Internal clock: φ/512
1
Internal clock: φ/256
0
Internal clock: φ/64
1
Internal clock: φ/16
0
Internal clock: φ/4
1
External event (TMIB): rising or falling edge*
1
1
0
1
Note:
*
(initial value)
The edge of the external event signal is selected by bit INTEG6 in interrupt edge select
register 2 (IEGR2). See section 3.3.2, Interrupt Control Registers, for details.
Timer Counter B1 (TCB1)
Bit
7
6
5
4
3
2
1
0
TCB17
TCB16
TCB15
TCB14
TCB13
TCB12
TCB11
TCB10
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
TCB1 is an 8-bit read-only up-counter, which is incremented by internal clock or external event
input. The clock source for input to this counter is selected by bits TMB12 to TMB10 in timer
mode register B1 (TMB1). TCB1 values can be read by the CPU at any time.
When TCB1 overflows from H'FF to H'00 or to the value set in TLB1, the IRRTB1 bit in IRR1 is
set to 1.
TCB1 is allocated to the same address as TLB1.
Upon reset, TCB1 is initialized to H'00.
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Section 9 Timers
Timer Load Register B1 (TLB1)
Bit
7
6
5
4
3
2
1
0
TLB17
TLB16
TLB15
TLB14
TLB13
TLB12
TLB11
TLB10
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
TLB1 is an 8-bit write-only register for setting the reload value of timer counter B1 (TCB1).
When a reload value is set in TLB1, the same value is loaded into timer counter B1 (TCB1) as
well, and TCB1 starts counting up from that value. When TCB1 overflows during operation in
auto-reload mode, the TLB1 value is loaded into TCB1. Accordingly, overflow periods can be set
within the range of 1 to 256 input clocks.
The same address is allocated to TLB1 as to TCB1.
Upon reset, TLB1 is initialized to H'00.
9.3.3
Timer Operation
Interval Timer Operation: When bit TMB17 in timer mode register B1 (TMB1) is cleared to 0,
timer B1 functions as an 8-bit interval timer.
Upon reset, TCB1 is cleared to H'00 and bit TMB17 is cleared to 0, so up-counting and interval
timing resume immediately. The clock input to timer B1 is selected from seven internal clock
signals output by prescaler S, or an external clock input at pin TMIB. The selection is made by bits
TMB12 to TMB10 of TMB1.
After the count value in TCB1 reaches H'FF, the next clock signal input causes timer B1 to
overflow, setting bit IRRTB1 to 1 in interrupt request register 1 (IRR1). If IENTB1 = 1 in
interrupt enable register 1 (IENR1), a CPU interrupt is requested.*
At overflow, TCB1 returns to H'00 and starts counting up again.
During interval timer operation (TMB17 = 0), when a value is set in timer load register B1
(TLB1), the same value is set in TCB1.
Note: * For details on interrupts, see section 3.3, Interrupts.
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Section 9 Timers
Auto-Reload Timer Operation: Setting bit TMB17 in TMB1 to 1 causes timer B1 to function as
an 8-bit auto-reload timer. When a reload value is set in TLB1, the same value is loaded into
TCB1, becoming the value from which TCB1 starts its count.
After the count value in TCB1 reaches H'FF, the next clock signal input causes timer B1 to
overflow. The TLB1 value is then loaded into TCB1, and the count continues from that value. The
overflow period can be set within a range from 1 to 256 input clocks, depending on the TLB1
value.
The clock sources and interrupts in auto-reload mode are the same as in interval mode.
In auto-reload mode (TMB17 = 1), when a new value is set in TLB1, the TLB1 value is also set in
TCB1.
Event Counter Operation: Timer B1 can operate as an event counter, counting rising or falling
edges of an external event signal input at pin TMIB. External event counting is selected by setting
bits TMB12 to TMB10 in timer mode register B1 (TMB1) to all 1s (111).
When timer B1 is used to count external event input, bit INTEN6 in IENR3 should be cleared to 0
to disable INT6 interrupt requests.
9.3.4
Timer B1 Operation States
Table 9.7 summarizes the timer B1 operation states.
Table 9.7
Timer B1 Operation States
Operation Mode
Reset
Active
Sleep
Watch
Subactive
Subsleep
Standby
TCB1 Interval
Reset
Functions
Functions
Halted
Halted
Halted
Halted
Reset
Functions
Functions
Halted
Halted
Halted
Halted
Reset
Functions
Retained
Retained
Retained Retained Retained
Auto reload
TMB1
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Section 9 Timers
9.4
Timer V
9.4.1
Overview
Timer V is an 8-bit timer based on an 8-bit counter. Timer V counts external events. Also compare
match signals can be used to reset the counter, request an interrupt, or output a pulse signal with an
arbitrary duty cycle. Counting can be initiated by a trigger input at the TRGV pin, enabling pulse
output control to be synchronized to the trigger, with an arbitrary delay from the trigger input.
Features
Features of timer V are given below.
• Choice of six internal clock sources (φ/128, φ/64, φ/32, φ/16, φ/8, φ/4) or an external clock (can
be used as an external event counter).
• Counter can be cleared by compare match A or B, or by an external reset signal. If the count
stop function is selected, the counter can be halted when cleared.
• Timer output is controlled by two independent compare match signals, enabling pulse output
with an arbitrary duty cycle, PWM output, and other applications.
• Three interrupt sources: two compare match, one overflow
• Counting can be initiated by trigger input at the TRGV pin. The rising edge, falling edge, or
both edges of the TRGV input can be selected.
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Section 9 Timers
Block Diagram
Figure 9.3 shows a block diagram of timer V.
TCRV1
TCORB
Trigger
control
TRGV
Comparator
Clock select
TCNTV
Internal data bus
TMCIV
Comparator
φ
PSS
TCORA
TMRIV
Clear control
TCRV0
Interrupt
request
control
TMOV
Output
control
TCSRV
Legend:
TCORA:
TCORB:
TCNTV:
TCSRV:
TCRV0:
TCRV1:
PSS:
CMIA:
CMIB:
OVI:
Time constant register A
Time constant register B
Timer counter V
Timer control/status register V
Timer control register V0
Timer control register V1
Prescaler S
Compare-match interrupt A
Compare-match interrupt B
Overflow interrupt
Figure 9.3 Block Diagram of Timer V
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CMIA
CMIB
OVI
Section 9 Timers
Pin Configuration
Table 9.8 shows the timer V pin configuration.
Table 9.8
Pin Configuration
Name
Abbr.
I/O
Function
Timer V output
TMOV
Output
Timer V waveform output
Timer V clock input
TMCIV
Input
Clock input to TCNTV
Timer V reset input
TMRIV
Input
External input to reset TCNTV
Trigger input
TRGV
Input
Trigger input to initiate counting
Register Configuration
Table 9.9 shows the register configuration of timer V.
Table 9.9
Timer V Registers
Name
Abbr.
R/W
Initial Value
Address
Timer control register V0
TCRV0
R/W
H'00
H'FFB8
Timer control/status register V
TCSRV
R/(W)*
H'10
H'FFB9
Time constant register A
TCORA
R/W
H'FF
H'FFBA
Time constant register B
TCORB
R/W
H'FF
H'FFBB
Timer counter V
TCNTV
R/W
H'00
H'FFBC
Timer control register V1
TCRV1
R/W
H'E2
H'FFBD
Note:
*
Bits 7 to 5 can only be written with 0, for flag clearing.
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Section 9 Timers
9.4.2
Register Descriptions
Timer Counter V (TCNTV)
Bit
7
6
5
4
3
2
1
0
TCNTV7 TCNTV6 TCNTV5 TCNTV4 TCNTV3 TCNTV2 TCNTV1 TCNTV0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCNTV is an 8-bit read/write up-counter which is incremented by internal or external clock input.
The clock source is selected by bits CKS2 to CKS0 in TCRV0. The TCNTV value can be read and
written by the CPU at any time. TCNTV can be cleared by an external reset signal, or by compare
match A or B. The clearing signal is selected by bits CCLR1 and CCLR0 in TCRV0.
When TCNTV overflows from H'FF to H'00, OVF is set to 1 in TCSRV.
TCNTV is initialized to H'00 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
Time Constant Registers A and B (TCORA, TCORB)
Bit
7
6
5
4
3
2
1
0
TCORn7 TCORn6 TCORn5 TCORn4 TCORn3 TCORn2 TCORn1 TCORn0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
n = A or B
TCORA and TCORB are 8-bit read/write registers.
TCORA and TCNTV are compared at all times, except during the T3 state of a TCORA write
cycle. When the TCORA and TCNTV contents match, CMFA is set to 1 in TCSRV. If CMIEA is
also set to 1 in TCRV0, a CPU interrupt is requested.
Timer output from the TMOV pin can be controlled by a signal resulting from compare match,
according to the settings of bits OS3 to OS0 in TCSRV.
TCORA is initialized to H'FF upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
TCORB is similar to TCORA.
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Section 9 Timers
Timer Control Register V0 (TCRV0)
Bit
7
6
5
4
3
2
1
0
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCRV0 is an 8-bit read/write register that selects the TCNTV input clock, controls the clearing of
TCNTV, and enables interrupts.
TCRV0 is initialized to H'00 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
Bit 7
Compare Match Interrupt Enable B (CMIEB): Bit 7 enables or disables the interrupt
request (CMIB) generated from CMFB when CMFB is set to 1 in TCSRV.
Bit 7: CMIEB
Description
0
Interrupt request (CMIB) from CMFB disabled
1
Interrupt request (CMIB) from CMFB enabled
(initial value)
Bit 6
Compare Match Interrupt Enable A (CMIEA): Bit 6 enables or disables the interrupt
request (CMIA) generated from CMFA when CMFA is set to 1 in TCSRV.
Bit 6: CMIEA
Description
0
Interrupt request (CMIA) from CMFA disabled
1
Interrupt request (CMIA) from CMFA enabled
(initial value)
Bit 5
Timer Overflow Interrupt Enable (OVIE): Bit 5 enables or disables the interrupt
request (OVI) generated from OVF when OVF is set to 1 in TCSRV.
Bit 5: OVIE
Description
0
Interrupt request (OVI) from OVF disabled
1
Interrupt request (OVI) from OVF enabled
(initial value)
Bits 4 and 3
Counter Clear 1 and 0 (CCLR1, CCLR0): Bits 4 and 3 specify whether or not to
clear TCNTV, and select compare match A or B or an external reset input.
When clearing is specified, if TRGE is set to 1 in TCRV1, then when TCNTV is cleared it is also
halted. Counting resumes when a trigger edge is input at the TRGV pin.
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Section 9 Timers
If TRGE is cleared to 0, after TCNTV is cleared it continues counting up.
Bit 4: CCLR1
Bit 3: CCLR0
Description
0
0
Clearing is disabled
1
Cleared by compare match A
0
Cleared by compare match B
1
Cleared by rising edge of external reset input
1
(initial value)
Bits 2 to 0
Clock Select 2 to 0 (CKS2 to CKS0): Bits 2 to 0 and bit ICKS0 in TCRV1 select
the clock input to TCNTV.
Six internal clock sources divided from the system clock (φ) can be selected. The counter
increments on the falling edge.
If the external clock is selected, there is a further selection of incrementing on the rising edge,
falling edge, or both edges.
If TRGE is cleared to 0, after TCNTV is cleared it continues counting up.
TCRV0
TCRV1
Bit 2:
CKS2
Bit 1:
CKS1
Bit 0:
CKS0
Bit 0:
ICKS0
Description
0
0
0
Clock input disabled
1
0
Internal clock: φ/4, falling edge
1
Internal clock: φ/8, falling edge
0
Internal clock: φ/16, falling edge
1
Internal clock: φ/32, falling edge
0
Internal clock: φ/64, falling edge
1
Internal clock: φ/128, falling edge
0
Clock input disabled
1
External clock: rising edge
0
External clock: falling edge
1
External clock: rising and falling edges
1
0
1
1
0
1
Rev. 6.00 Sep 12, 2006 page 220 of 526
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(initial value)
Section 9 Timers
Timer Control/Status Register V (TCSRV)
Bit
7
6
5
4
3
2
1
0
CMFB
CMFA
OVF
OS3
OS2
OS1
OS0
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/W
R/W
R/W
R/W
Note:
*
Bits 7 to 5 can be only written with 0, for flag clearing.
TCSRV is an 8-bit register that sets compare match flags and the timer overflow flag, and controls
compare match output.
TCSRV is initialized to H'10 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
Bit 7
Compare Match Flag B (CMFB): Bit 7 is a status flag indicating that TCNTV has
matched TCORB. This flag is set by hardware and cleared by software. It cannot be set by
software.
Bit 7: CMFB
Description
0
Clearing condition:
After reading CMFB = 1, cleared by writing 0 to CMFB
1
(initial value)
Setting condition:
Set when the TCNTV value matches the TCORB value
Bit 6
Compare Match Flag A (CMFA): Bit 6 is a status flag indicating that TCNTV has
matched TCORA. This flag is set by hardware and cleared by software. It cannot be set by
software.
Bit 6: CMFA
Description
0
Clearing condition:
After reading CMFA = 1, cleared by writing 0 to CMFA
1
(initial value)
Setting condition:
Set when the TCNTV value matches the TCORA value
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Section 9 Timers
Bit 5
Timer Overflow Flag (OVF): Bit 5 is a status flag indicating that TCNTV has overflowed
from H'FF to H'00. This flag is set by hardware and cleared by software. It cannot be set by
software.
Bit 5: OVF
Description
0
Clearing condition:
After reading OVF = 1, cleared by writing 0 to OVF
1
(initial value)
Setting condition:
Set when TCNTV overflows from H'FF to H'00
Bit 4
Reserved Bit: Bit 4 is reserved; it is always read as 1, and cannot be modified.
Bits 3 to 0
Output Select 3 to 0 (OS3 to OS0): Bits 3 to 0 select the way in which the output
level at the TMOV pin changes in response to compare match between TCNTV and TCORA or
TCORB.
OS3 and OS2 select the output level for compare match B. OS1 and OS0 select the output level
for compare match A. The two levels can be controlled independently.
If two compare matches occur simultaneously, any conflict between the settings is resolved
according to the following priority order: toggle output > 1 output > 0 output.
When OS3 to OS0 are all cleared to 0, timer output is disabled.
After a reset, the timer output is 0 until the first compare match.
Bit 3: OS3
Bit 2: OS2
Description
0
0
No change at compare match B
1
0 output at compare match B
0
1 output at compare match B
1
Output toggles at compare match B
Bit 1: OS1
Bit 0: OS0
Description
0
0
No change at compare match A
1
0 output at compare match A
1
0
1 output at compare match A
1
Output toggles at compare match A
1
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(initial value)
(initial value)
Section 9 Timers
Timer Control Register V1 (TCRV1)
Bit
7
6
5
4
3
2
1
0
TVEG1
TVEG0
TRGE
ICKS0
Initial value
1
1
1
0
0
0
1
0
Read/Write
R/W
R/W
R/W
R/W
TCRV1 is an 8-bit read/write register that selects the valid edge at the TRGV pin, enables TRGV
input, and selects the clock input to TCNTV.
TCRV1 is initialized to H'E2 upon reset and in watch mode, subsleep mode, and subactive mode.
Bits 7 to 5
Reserved Bits: Bit 7 to 5 are reserved; they are always read as 1, and cannot be
modified.
Bits 4 and 3
TRGV Input Edge Select (TVEG1, TVEG0): Bits 4 and 3 select the TRGV input
edge.
Bit 4: TVEG1
Bit 3: TVEG0
Description
0
0
TRGV trigger input is disabled
1
Rising edge is selected
0
Falling edge is selected
1
Rising and falling edges are both selected
1
(initial value)
Bit 2
TRGV Input Enable (TRGE): Bit 2 enables TCNTV counting to be triggered by input at
the TRGV pin, and enables TCNTV counting to be halted when TCNTV is cleared by compare
match. TCNTV stops counting when TRGE is set to 1, then starts counting when the edge selected
by bits TVEG1 and TVEG0 is input at the TRGV pin.
Bit 2: TRGE
Description
0
TCNTV counting is not triggered by input at the TRGV pin, and does not stop
when TCNTV is cleared by compare match
(initial value)
1
TCNTV counting is triggered by input at the TRGV pin, and stops when TCNTV
is cleared by compare match
Bit 1
Reserved Bit: Bit 1 is reserved; it is always read as 1, and cannot be modified.
Bit 0
Internal Clock Select 0 (ICKS0): Bit 0 and bits CKS2 to CKS0 in TCRV0 select the
TCNTV clock source. For details see section 9.4.2, Register Descriptions.
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Section 9 Timers
9.4.3
Timer Operation
Timer V Operation: A reset initializes TCNTV to H'00, TCORA and TCORB to H'FF, TCRV0
to H'00, TCSRV to H'10, and TCRV1 to H'E2.
Timer V can be clocked by one of six internal clocks output from prescaler S, or an external clock,
as selected by bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1. The valid edge or edges
of the external clock can also be selected by CKS2 to CKS0. When the clock source is selected,
TCNTV starts counting the selected clock input.
The TCNTV contents are always compared with TCORA and TCORB. When a match occurs, the
CMFA or CMFB bit is set to 1 in TCSRV. If CMIEA or CMIEB is set to 1 in TCRV0, a CPU
interrupt is requested. At the same time, the output level selected by bits OS3 to OS0 in TCSRV is
output from the TMOV pin.
When TCNT overflows from H'FF to H'00, if OVIE is 1 in TCRV0, a CPU interrupt is requested.
If bits CCLR1 and CCLR0 in TCRV0 are set to 01 (clear by compare match A) or 10 (clear by
compare match B), TCNTV is cleared by the corresponding compare match. If these bits are set to
11, TCNTV is cleared by input of a rising edge at the TMRIV pin.
When the counter clear event selected by bits CCLR1 and CCLR0 in TCRV0 occurs, TCNTV is
cleared and the count-up is halted. TCNTV starts counting when the signal edge selected by bits
TVEG1 and TVEG0 in TCRV1 is input at the TRGV pin.
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Section 9 Timers
TCNTV Increment Timing: TCNTV is incremented by an input (internal or external) clock.
• Internal clock
One of six clocks (φ/128, φ/64, φ/32, φ/16, φ/8, φ/4) divided from the system clock (φ) can be
selected by bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1. Figure 9.4 shows the
timing.
φ
Internal
clock
FRC
input
TCNTV
input
TCNTV
N–1
N
N–1
Figure 9.4 Increment Timing with Internal Clock
• External clock
Incrementation on the rising edge, falling edge, or both edges of the external clock can be
selected by bits CKS2 to CKS0 in TCRV0.
The external clock pulse width should be at least 1.5 system clocks (φ) when a single edge is
counted, and at least 2.5 system clocks when both edges are counted. Shorter pulses will not be
counted correctly.
Figure 9.5 shows the timing when both the rising and falling edges of the external clock are
selected.
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Section 9 Timers
φ
TMCIV
(external clock
input pin)
TCNTV
input clock
N–1
TCNTV
N
N–1
Figure 9.5 Increment Timing with External Clock
Overflow flag Set Timing: The overflow flag (OVF) is set to 1 when TCNTV overflows from
H'FF to H'00. Figure 9.6 shows the timing.
φ
TCNTV
H'FF
H'00
Overflow
signal
Figure 9.6 OVF Set Timing
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Section 9 Timers
Compare Match Flag set Timing: Compare match flag A or B (CMFA or CMFB) is set to 1
when TCNTV matches TCORA or TCORB. The internal compare-match signal is generated in the
last state in which the values match (when TCNTV changes from the matching value to a new
value). Accordingly, when TCNTV matches TCORA or TCORB, the compare match signal is not
generated until the next clock input to TCNTV. Figure 9.7 shows the timing.
φ
TCNTV
N
TCORA or
TCORB
N
N+1
Compare
match signal
CMFA or
CMFB
Figure 9.7 CMFA and CMFB Set Timing
TMOV Output Timing: The TMOV output responds to compare match A or B by remaining
unchanged, changing to 0, changing to 1, or toggling, as selected by bits OS3 to OS0 in TCSRV.
Figure 9.8 shows the timing when the output is toggled by compare match A.
φ
Compare
match A
signal
Timer V
output pin
Figure 9.8 TMOV Output Timing
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Section 9 Timers
TCNTV Clear Timing by Compare Match: TCNTV can be cleared by compare match A or B,
as selected by bits CCLR1 and CCLR0 in TCRV0. Figure 9.9 shows the timing.
φ
Compare
match A signal
TCNTV
N
H'00
Figure 9.9 Clear Timing by Compare Match
TCNTV Clear Timing by TMRIV: TCNTV can be cleared by a rising edge at the TMRIV pin,
as selected by bits CCLR1 and CCLR0 in TCRV0. A TMRIV input pulse width of at least 1.5
system clocks is necessary. Figure 9.10 shows the timing.
φ
Compare
match A signal
Timer V
output pin
TCNTV
N–1
N
H'00
Figure 9.10 Clear Timing by TMRIV Input
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Section 9 Timers
9.4.4
Timer V Operation Modes
Table 9.10 summarizes the timer V operation states.
Table 9.10 Timer V Operation States
Operation Mode
Reset
Active
Sleep
Watch
Subactive
Subsleep
Standby
TCNTV
Reset
Functions
Functions
Reset
Reset
Reset
Reset
TCRV0, TCRV1
Reset
Functions
Functions
Reset
Reset
Reset
Reset
TCORA, TCORB
Reset
Functions
Functions
Reset
Reset
Reset
Reset
TCSRV
Reset
Functions
Functions
Reset
Reset
Reset
Reset
9.4.5
Interrupt Sources
Timer V has three interrupt sources: CMIA, CMIB, and OVI. Table 9.11 lists the interrupt sources
and their vector address. Each interrupt source can be enabled or disabled by an interrupt enable
bit in TCRV0. Although all three interrupts share the same vector, they have individual interrupt
flags, so software can discriminate the interrupt source.
Table 9.11 Timer V Interrupt Sources
Interrupt
Description
Vector Address
CMIA
Generated from CMFA
H'0022
CMIB
Generated from CMFB
OVI
Generated from OVF
9.4.6
Application Examples
Pulse Output with Arbitrary Duty Cycle: Figure 9.11 shows an example of output of pulses
with an arbitrary duty cycle. To set up this output:
• Clear bit CCLR1 to 0 and set bit CCLR0 to 1 in TCRV0 so that TCNTV will be cleared by
compare match with TCORA.
• Set bits OS3 to OS0 to 0110 in TCSRV so that the output will go to 1 at compare match with
TCORA and to 0 at compare match with TCORB.
• Set bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1 to select the desired clock source.
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Section 9 Timers
With these settings, a waveform is output without further software intervention, with a period
determined by TCORA and a pulse width determined by TCORB.
TCNTV
H'FF
Counter cleared
TCORA
TCORB
H'00
TMOV
Figure 9.11 Pulse Output Example
Single-Shot Output with Arbitrary Pulse Width and Delay from TRGV Input: The trigger
function can be used to output a pulse with an arbitrary pulse width at an arbitrary delay from the
TRGV input, as shown in figure 9.12. To set up this output:
• Set bit CCLR1 to 1 and clear bit CCLR0 to 0 in TCRV0 so that TCNTV will be cleared by
compare match with TCORB.
• Set bits OS3 to OS0 to 0110 in TCSRV so that the output will go to 1 at compare match with
TCORA and to 0 at compare match with TCORB.
• Set bits TVEG1 and TVEG0 to 10 in TCRV1 and set TRGE to 1 to select the falling edge of
the TRGV input.
• Set bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1 to select the desired clock source.
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Section 9 Timers
After these settings, a pulse waveform will be output without further software intervention, with a
delay determined by TCORA from the TRGV input, and a pulse width determined by (TCORB –
TCORA).
H'FF
TCNTV
Counter cleared
TCORB
TCORA
H'00
TRGV
TMOV
Compare match A
Compare match B
clears TCNTV and
halts count-up
Compare match A
Compare match B
clears TCNTV and
halts count-up
Figure 9.12 Pulse Output Synchronized to TRGV Input
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Section 9 Timers
9.4.7
Application Notes
The following types of contention can occur in timer V operation.
Contention between TCNTV Write and Counter Clear: If a TCNTV clear signal is generated
in the T3 state of a TCNTV write cycle, clearing takes precedence and the write to the counter is
not carried out. Figure 9.13 shows the timing.
TCNTV write cycle by CPU
T1
T2
T3
φ
Address
TCNTV address
Internal write
signal
Counter clear
signal
TCNTV
N
H'00
Figure 9.13 Contention between TCNTV Write and Clear
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Section 9 Timers
Contention between TCNTV Write and Increment: If a TCNTV increment clock signal is
generated in the T3 state of a TCNTV write cycle, the write takes precedence and the counter is
not incremented. Figure 9.14 shows the timing.
TCNTV write cycle by CPU
T1
T2
T3
φ
Address
TCNTV address
Internal write
signal
TCNTV clock
TCNTV
N
M
TCNTV write data
Figure 9.14 Contention between TCNTV Write and Increment
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Section 9 Timers
Contention between TCOR Write and Compare Match: If a compare match is generated in the
T3 state of a TCORA or TCORB write cycle, the write to TCORA or TCORB takes precedence
and the compare match signal is inhibited. Figure 9.15 shows the timing.
TCORA write cycle by CPU
T1
T2
T3
φ
Address
TCORA address
Internal write
signal
TCNTV
N
N+1
TCORA
N
M
TCORA write data
Compare match
signal
Inhibited
Figure 9.15 Contention between TCORA Write and Compare Match
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Section 9 Timers
Contention between Compare Match A and B: If compare match A and B occur
simultaneously, any conflict between the output selections for compare match A and compare
match B is resolved by following the priority order in table 9.12.
Table 9.12 Timer Output Priority Order
Output Setting
Priority
Toggle output
High
1 output
0 output
No change
Low
Internal Clock Switching and Counter Operation: Depending on the timing, TCNTV may be
incremented by a switch between different internal clock sources. Table 9.13 shows the relation
between internal clock switchover timing (by writing to bits CKS1 and CKS0) and TCNTV
operation.
When TCNTV is internally clocked, an increment pulse is generated from the falling edge of an
internal clock signal, which is divided from the system clock (φ). For this reason, in a case like
No. 3 in table 9.13 where the switch is from a high clock signal to a low clock signal, the
switchover is seen as a falling edge, causing TCNTV to increment.
TCNTV can also be incremented by a switch between internal and external clocks.
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Section 9 Timers
Table 9.13 Internal Clock Switching and TCNTV Operation
No.
1
Clock Levels Before
and After Modifying
Bits CKS1 and CKS0
TCNTV Operation
Goes from low level
1
to low level*
Clock before
switching
Clock after
switching
Count clock
TCNTV
N+1
N
Write to CKS1 and CKS0
2
Goes from low
2
to high*
Clock before
switching
Clock after
switching
Count clock
TCNTV
N
N+1
N+2
Write to CKS1 and CKS0
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Section 9 Timers
No.
3
Clock Levels Before
and After Modifying
Bits CKS1 and CKS0
TCNTV Operation
Goes from high level
3
to low level*
Clock before
switching
Clock after
switching
*4
Count clock
TCNTV
N
N+1
N+2
Write to CKS1 and CKS0
4
Goes from high
to high
Clock before
switching
Clock after
switching
Count clock
TCNTV
N
N+1
N+2
Write to CKS1 and CKS0
Notes: 1. Including a transition from the low level to the stopped state, or from the stopped state
to the low level.
2. Including a transition from the stopped state to the high level.
3. Including a transition from the high level to the stopped state.
4. The switchover is seen as a falling edge, and TCNTV is incremented.
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Section 9 Timers
9.5
Timer X
9.5.1
Overview
Timer X is based on a 16-bit free-running counter (FRC). It can output two independent
waveforms, or measure input pulse widths and external clock periods.
Features
Features of timer X are given below.
• Choice of three internal clock sources (φ/2, φ/8, φ/32) or an external clock (can be used as an
external event counter).
• Two independent output compare waveforms.
• Four independent input capture channels, with selection of rising or falling edge and buffering
option.
• Counter can be cleared by compare match A.
• Seven independent interrupt sources: two compare match, four input capture, one overflow
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Section 9 Timers
Block Diagram
Figure 9.16 shows a block diagram of timer X.
ICRA
FTIA
FTIB
FTIC
FTID
Input
capture
control
ICRC
ICRB
ICRD
TCRX
Comparator
FRC
FTCI
Comparator
φ
Internal data bus
OCRB
OCRA
PSS
FTOA
FTOB
TOCR
TCSRX
TIER
Legend:
TIER:
TCSRX:
FRC:
OCRA:
OCRB:
TCRX:
TOCR:
ICRA:
ICRB:
ICRC:
ICRD:
PSS:
Interrupt
request
Timer interrupt enable register
Timer control/status register X
Free-running counter
Output compare register A
Output compare register B
Timer control register X
Timer output compare control register
Input capture register A
Input capture register B
Input capture register C
Input capture register D
Prescaler S
Figure 9.16 Block Diagram of Timer X
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Section 9 Timers
Pin Configuration
Table 9.14 shows the timer X pin configuration.
Table 9.14 Pin Configuration
Name
Abbr.
I/O
Function
Counter clock input
FTCI
Input
Clock input to FRC
Output compare A
FTOA
Output
Output pin for output compare A
Output compare B
FTOB
Output
Output pin for output compare B
Input capture A
FTIA
Input
Input pin for input capture A
Input capture B
FTIB
Input
Input pin for input capture B
Input capture C
FTIC
Input
Input pin for input capture C
Input capture D
FTID
Input
Input pin for input capture D
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Section 9 Timers
Register Configuration
Table 9.15 shows the register configuration of timer X.
Table 9.15 Timer X Registers
Name
Abbr.
R/W
Initial Value
Address
Timer interrupt enable register
TIER
R/W
H'01
H'F770
Timer control/status register X
TCSRX
1
R/(W)*
H'00
H'F771
Free-running counter H
FRCH
R/W
H'00
H'F772
Free-running counter L
FRCL
R/W
H'00
H'F773
Output compare register AH
OCRAH
R/W
H'FF
Output compare register AL
OCRAL
R/W
H'FF
H'F774*
2
H'F775*
Output compare register BH
OCRBH
R/W
H'FF
Output compare register BL
OCRBL
R/W
H'FF
H'F774*
2
H'F775*
Timer control register X
TCRX
R/W
H'00
H'F776
Timer output compare control
register
TOCR
R/W
H'E0
H'F777
2
2
Input capture register AH
ICRAH
R
H'00
H'F778
Input capture register AL
ICRAL
R
H'00
H'F779
Input capture register BH
ICRBH
R
H'00
H'F77A
Input capture register BL
ICRBL
R
H'00
H'F77B
Input capture register CH
ICRCH
R
H'00
H'F77C
Input capture register CL
ICRCL
R
H'00
H'F77D
Input capture register DH
ICRDH
R
H'00
H'F77E
Input capture register DL
ICRDL
R
H'00
H'F77F
Notes: 1. Bits 7 to 1 can only be written with 0 for flag clearing. Bit 0 is a read/write bit.
2. OCRA and OCRB share the same address. They are selected by the OCRS bit in
TOCR.
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Section 9 Timers
9.5.2
Register Descriptions
Free-Running Counter (FRC)
Free-Running Counter H (FRCH)
Free-Running Counter L (FRCL)
FRC
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
FRCL
FRCH
FRC is a 16-bit read/write up-counter, which is incremented by internal or external clock input.
The clock source is selected by bits CKS1 and CKS0 in TCRX.
FRC can be cleared by compare match A, depending on the setting of CCLRA in TCSRX.
When FRC overflows from H'FFFF to H'0000, OVF is set to 1 in TCSRX. If OVIE = 1 in TIER, a
CPU interrupt is requested.
FRC can be written and read by the CPU. Since FRC has 16 bits, data is transferred between the
CPU and FRC via a temporary register (TEMP). For details see section 9.5.3, CPU Interface.
FRC is initialized to H'0000 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
Output Compare Registers A and B (OCRA, OCRB)
Output Compare Registers AH and BH (OCRAH, OCRBH)
Output Compare Registers AL and BL (OCRAL, OCRBL)
OCRA, OCRB
Bit
Initial value
Read/Write
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
OCRAH, OCRBH
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OCRAL, OCRBL
Section 9 Timers
There are two 16-bit read/write output compare registers, OCRA and OCRB, the contents of
which are always compared with FRC. When the values match, OCFA or OCFB is set to 1 in
TCSRX. If OCIAE = 1 or OCIBE = 1 in TIER, a CPU interrupt is requested.
When a compare match with OCRA or OCRB occurs, if OEA = 1 or OEB = 1 in TOCR, the value
selected by OLVLA or OLVLB in TOCR is output at the FTOA or FTOB pin. After a reset, the
output from the FTOA or FTOB pin is 0 until the first compare match occurs.
OCRA and OCRB can be written and read by the CPU. Since they are 16-bit registers, data is
transferred between them and the CPU via a temporary register (TEMP). For details see section
9.5.3, CPU Interface.
OCRA and OCRB are initialized to H'FFFF upon reset and in standby mode, watch mode,
subsleep mode, and subactive mode.
Input Capture Registers A to D (ICRA to ICRD)
Input Capture Registers AH to DH (ICRAH to ICRDH)
Input Capture Registers AL to DL (ICRAL to ICRDL)
ICRA, ICRB, ICRC, ICRD
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
ICRAH, ICRBH, ICRCH, ICRDH
ICRAL, ICRBL, ICRCL, ICRDL
There are four 16-bit read only input capture registers, ICRA to ICRD.
When the falling edge of an input capture signal is input, the FRC value is transferred to the
corresponding input capture register, and the corresponding input capture flag (ICFA to ICFD) is
set to 1 in TCSRX. If the corresponding input capture interrupt enable bit (ICIAE to ICIDE) is 1 in
TCRX, a CPU interrupt is requested. The valid edge of the input signal can be selected by bits
IEDGA to IEDGD in TCRX.
ICRC and ICRD can also be used as buffer registers for ICRA and ICRB. Buffering is enabled by
bits BUFEA and BUFEB in TCRX.
Figure 9.17 shows the interconnections when ICRC operates as a buffer register of ICRA (when
BUFEA = 1). When ICRC is used as the ICRA buffer, both the rising and falling edges of the
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Section 9 Timers
external input signal can be selected simultaneously, by setting IEDGA ≠ IEDGC. If IEDGA =
IEDGC, then only one edge is selected (either the rising edge or falling edge). See table 9.16.
Note: The FRC value is transferred to the input capture register (ICR) regardless of the value of
the input capture flag (ICF).
IEOGA BUFEA IEDGC
Edge detector
and internal
capture signal
generator
FTIA
ICRC
ICRA
FRC
Figure 9.17 Buffer Operation (Example)
Table 9.16 Input Edge Selection during Buffer Operation
IEDGA
IEDGC
Input Edge Selection
0
0
Falling edge of input capture A input signal is captured
1
Rising and falling edge of input capture A input signal are both captured
1
(initial value)
0
1
Rising edge of input capture A input signal is captured
ICRA to ICRD can be written and read by the CPU. Since they are 16-bit registers, data is
transferred from them to the CPU via a temporary register (TEMP). For details see section 9.5.3,
CPU Interface.
To assure input capture, the pulse width of the input capture input signal must be at least 1.5
system clocks (φ) when a single edge is selected, or at least 2.5 system clocks (φ) when both edges
are selected.
ICRA to ICRD are initialized to H'0000 upon reset and in standby mode, watch mode, subsleep
mode, and subactive mode.
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Section 9 Timers
Timer Interrupt Enable Register (TIER)
Bit
7
6
5
4
3
2
1
0
ICIAE
ICIBE
ICICE
ICIDE
OCIAE
OCIBE
OVIE
Initial value
0
0
0
0
0
0
0
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TIER is an 8-bit read/write register that enables or disables interrupt requests.
TIER is initialized to H'01 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
Bit 7
Input Capture Interrupt A Enable (ICIAE): Bit 7 enables or disables the ICIA interrupt
requested when ICFA is set to 1 in TCSRX.
Bit 7: ICIAE
Description
0
Interrupt request by ICFA (ICIA) is disabled
1
Interrupt request by ICFA (ICIA) is enabled
(initial value)
Bit 6
Input Capture Interrupt B Enable (ICIBE): Bit 6 enables or disables the ICIB interrupt
requested when ICFB is set to 1 in TCSRX.
Bit 6: ICIBE
Description
0
Interrupt request by ICFB (ICIB) is disabled
1
Interrupt request by ICFB (ICIB) is enabled
(initial value)
Bit 5
Input Capture Interrupt C Enable (ICICE): Bit 5 enables or disables the ICIC interrupt
requested when ICFC is set to 1 in TCSRX.
Bit 5: ICICE
Description
0
Interrupt request by ICFC (ICIC) is disabled
1
Interrupt request by ICFC (ICIC) is enabled
(initial value)
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Section 9 Timers
Bit 4
Input Capture Interrupt D Enable (ICIDE): Bit 4 enables or disables the ICID interrupt
requested when ICFD is set to 1 in TCSRX.
Bit 4: ICIDE
Description
0
Interrupt request by ICFD (ICID) is disabled
1
Interrupt request by ICFD (ICID) is enabled
(initial value)
Bit 3
Output Compare Interrupt A Enable (OCIAE): Bit 3 enables or disables the OCIA
interrupt requested when OCFA is set to 1 in TCSRX.
Bit 3: OCIAE
Description
0
Interrupt request by OCFA (OCIA) is disabled
1
Interrupt request by OCFA (OCIA) is enabled
(initial value)
Bit 2
Output Compare Interrupt B Enable (OCIBE): Bit 2 enables or disables the OCIB
interrupt requested when OCFB is set to 1 in TCSRX.
Bit 2: OCIBE
Description
0
Interrupt request by OCFB (OCIB) is disabled
1
Interrupt request by OCFB (OCIB) is enabled
(initial value)
Bit 1
Timer Overflow Interrupt Enable (OVIE): Bit 1 enables or disables the FOVI interrupt
requested when OVF is set to 1 in TCSRX.
Bit 1: OVIE
Description
0
Interrupt request by OVF (FOVI) is disabled
1
Interrupt request by OVF (FOVI) is enabled
(initial value)
Bit 0
Reserved Bit: Bit 0 is reserved; it is always read as 1, and cannot be modified.
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Section 9 Timers
Timer Control/Status Register X (TCSRX)
Bit
7
6
5
4
3
2
1
0
ICFA
ICFB
ICFC
ICFD
OCFA
OCFB
OVF
CCLRA
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/W
Note:
*
Bits 7 to 1 can only be written with 0 for flag clearing.
TCSRX is an 8-bit register that selects clearing of the counter and controls interrupt request
signals.
TCSRX is initialized to H'00 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode. Other timing is described in section 9.6.3, Timer Operation.
Bit 7
Input Capture Flag A (ICFA): Bit 7 is a status flag that indicates that the FRC value has
been transferred to ICRA by an input capture signal. If BUFEA is set to 1 in TCRX, ICFA
indicates that the FRC value has been transferred to ICRA by an input capture signal and that the
ICRA value before this update has been transferred to ICRC.
This flag is set by hardware and cleared by software. It cannot be set by software.
Bit 7: ICFA
Description
0
Clearing condition:
After reading ICFA = 1, cleared by writing 0 to ICFA
1
(initial value)
Setting condition:
Set when the FRC value is transferred to ICRA by an input capture signal
Bit 6
Input Capture Flag B (ICFB): Bit 6 is a status flag that indicates that the FRC value has
been transferred to ICRB by an input capture signal. If BUFEB is set to 1 in TCRX, ICFB
indicates that the FRC value has been transferred to ICRB by an input capture signal and that the
ICRB value before this update has been transferred to ICRC.
This flag is set by hardware and cleared by software. It cannot be set by software.
Bit 6: ICFB
Description
0
Clearing condition:
After reading ICFB = 1, cleared by writing 0 to ICFB
1
(initial value)
Setting condition:
Set when the FRC value is transferred to ICRB by an input capture signal
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Section 9 Timers
Bit 5
Input Capture Flag C (ICFC): Bit 5 is a status flag that indicates that the FRC value has
been transferred to ICRC by an input capture signal. If BUFEA is set to 1 in TCRX, ICFC is set
by the input capture signal even though the FRC value is not transferred to ICRC. In buffered
operation, ICFC can accordingly be used as an external interrupt, by setting the ICICE bit to 1.
This flag is set by hardware and cleared by software. It cannot be set by software.
Bit 5: ICFC
Description
0
Clearing condition:
After reading ICFC = 1, cleared by writing 0 to ICFC
1
(initial value)
Setting condition:
Set by input capture signal
Bit 4
Input Capture Flag D (ICFD): Bit 4 is a status flag that indicates that the FRC value has
been transferred to ICRD by an input capture signal. If BUFEB is set to 1 in TCRX, ICFD is set
by the input capture signal even though the FRC value is not transferred to ICRD. In buffered
operation, ICFD can accordingly be used as an external interrupt, by setting the ICIDE bit to 1.
This flag is set by hardware and cleared by software. It cannot be set by software.
Bit 4: ICFD
Description
0
Clearing condition:
After reading ICFD = 1, cleared by writing 0 to ICFD
1
(initial value)
Setting condition:
Set by input capture signal
Bit 3
Output Compare Flag A (OCFA): Bit 3 is a status flag that indicates that the FRC value
has matched OCRA. This flag is set by hardware and cleared by software. It cannot be set by
software.
Bit 3: OCFA
Description
0
Clearing condition:
After reading OCFA = 1, cleared by writing 0 to OCFA
1
Setting condition:
Set when FRC matches OCRA
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(initial value)
Section 9 Timers
Bit 2
Output Compare Flag B (OCFB): Bit 2 is a status flag that indicates that the FRC value
has matched OCRB. This flag is set by hardware and cleared by software. It cannot be set by
software.
Bit 2: OCFB
Description
0
Clearing condition:
After reading OCFB = 1, cleared by writing 0 to OCFB
1
(initial value)
Setting condition:
Set when FRC matches OCRB
Bit 1
Timer Overflow Flag (OVF): Bit 1 is a status flag that indicates that FRC has overflowed
from H'FFFF to H'0000. This flag is set by hardware and cleared by software. It cannot be set by
software.
Bit 1: OVF
Description
0
Clearing condition:
After reading OVF = 1, cleared by writing 0 to OVF
1
(initial value)
Setting condition:
Set when the FRC value overflows from H'FFFF to H'0000
Bit 0
Counter Clear A (CCLRA): Bit 0 selects whether or not to clear FRC by compare match
A (when FRC matches OCRA).
Bit 0: CCLRA
Description
0
FRC is not cleared by compare match A
1
FRC is cleared by compare match A
(initial value)
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Section 9 Timers
Timer Control Register X (TCRX)
Bit
7
6
5
4
3
2
1
0
IEDGA
IEDGB
IEDGC
IEDGD
BUFEA
BUFEB
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCRX is an 8-bit read/write register that selects the valid edges of the input capture signals,
enables buffering, and selects the FRC clock source.
TCRX is initialized to H'00 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
Bit 7
Input Edge Select A (IEDGA): Bit 7 selects the rising or falling edge of the input capture
A input signal (FTIA).
Bit 7: IEDGA
Description
0
Falling edge of input capture A is captured
1
Rising edge of input capture A is captured
(initial value)
Bit 6
Input Edge Select B (IEDGB): Bit 6 selects the rising or falling edge of the input capture
B input signal (FTIB).
Bit 6: IEDGB
Description
0
Falling edge of input capture B is captured
1
Rising edge of input capture B is captured
(initial value)
Bit 5
Input Edge Select C (IEDGC): Bit 5 selects the rising or falling edge of the input capture
C input signal (FTIC).
Bit 5: IEDGC
Description
0
Falling edge of input capture C is captured
1
Rising edge of input capture C is captured
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(initial value)
Section 9 Timers
Bit 4
Input Edge Select D (IEDGD): Bit 4 selects the rising or falling edge of the input
capture D input signal (FTID).
Bit 4: IEDGD
Description
0
Falling edge of input capture D is captured
1
Rising edge of input capture D is captured
(initial value)
Bit 3
Buffer Enable A (BUFEA): Bit 3 selects whether or not to use ICRC as a buffer register
for ICRA.
Bit 3: BUFEA
Description
0
ICRC is not used as a buffer register for ICRA
1
ICRC is used as a buffer register for ICRA
(initial value)
Bit 2
Buffer Enable B (BUFEB): Bit 2 selects whether or not to use ICRD as a buffer register
for ICRB.
Bit 2: BUFEB
Description
0
ICRD is not used as a buffer register for ICRB
1
ICRD is used as a buffer register for ICRB
(initial value)
Bits 1 and 0
Clock Select (CKS1, CKS0): Bits 1 and 0 select one of three internal clock
sources or an external clock for input to FRC. The external clock is counted on the rising edge.
Bit 1: CKS1
Bit 0: CKS0
Description
0
0
Internal clock: φ/2
1
Internal clock: φ/8
0
Internal clock: φ/32
1
External clock: rising edge
1
(initial value)
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Section 9 Timers
Timer Output Compare Control Register (TOCR)
Bit
7
6
5
4
3
2
1
0
OCRS
OEA
OEB
OLVLA
OLVLB
Initial value
1
1
1
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
TOCR is an 8-bit read/write register that selects the output compare output levels, enables output
compare output, and controls access to OCRA and OCRB.
TOCR is initialized to H'E0 upon reset and in standby mode, watch mode, subsleep mode, and
subactive mode.
Bits 7 to 5
Reserved Bits: Bit 7 to 5 are reserved; they are always read as 1, and cannot be
modified.
Bit 4
Output Compare Register Select (OCRS): OCRA and OCRB share the same address.
OCRS selects which register is accessed when this address is written or read. It does not affect the
operation of OCRA and OCRB.
Bit 4: OCRS
Description
0
OCRA is selected
1
OCRB is selected
(initial value)
Bit 3
Output Enable A (OEA): Bit 3 enables or disables the timer output controlled by output
compare A.
Bit 3: OEA
Description
0
Output compare A output is disabled
1
Output compare A output is enabled
(initial value)
Bit 2
Output Enable B (OEB): Bit 2 enables or disables the timer output controlled by output
compare B.
Bit 2: OEB
Description
0
Output compare B output is disabled
1
Output compare B output is enabled
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(initial value)
Section 9 Timers
Bit 1
Output Level A (OLVLA): Bit 1 selects the output level that is output at pin FTOA by
compare match A (when FRC matches OCRA).
Bit 1: OLVLA
Description
0
Low level
1
High level
(initial value)
Bit 0
Output Level B (OLVLB): Bit 0 selects the output level that is output at pin FTOB by
compare match B (when FRC matches OCRB).
Bit 0: OLVLB
Description
0
Low level
1
High level
9.5.3
(initial value)
CPU Interface
FRC, OCRA, OCRB, and ICRA to ICRD are 16-bit registers, but the CPU is connected to the onchip peripheral modules by an 8-bit data bus. When the CPU accesses these registers, it therefore
uses an 8-bit temporary register (TEMP).
These registers should always be accessed 16 bits at a time. If two consecutive byte-size MOV
instructions are used, the upper byte must be accessed first and the lower byte second. Data will
not be transferred correctly if only the upper byte or only the lower byte is accessed.
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Section 9 Timers
Write Access: Write access to the upper byte results in transfer of the upper-byte write data to
TEMP. Next, write access to the lower byte results in transfer of the data in TEMP to the upper
register byte, and direct transfer of the lower-byte write data to the lower register byte.
Figure 9.18 shows an example of the writing of H'AA55 to FRC.
Write to upper byte
CPU
(H'AA)
Module data bus
Bus
interface
TEMP
(H'AA)
FRCH
(
)
FRCL
(
)
Write to lower byte
CPU
(H'55)
Module data bus
Bus
interface
TEMP
(H'AA)
FRCH
(H'AA)
FRCL
(H'55)
Figure 9.18 Write Access to FRC (CPU → FRC)
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Section 9 Timers
Read Access: In access to FRC and ICRA to ICRD, when the upper byte is read the upper-byte
data is transferred directly to the CPU and the lower-byte data is transferred to TEMP. Next, when
the lower byte is read, the lower-byte data in TEMP is transferred to the CPU.
In access to OCRA or OCRB, when the upper byte is read the upper-byte data is transferred
directly to the CPU, and when the lower byte is read the lower-byte data is transferred directly to
the CPU.
Figure 9.19 shows an example of the reading of FRC when FRC contains H'AAFF.
Read upper byte
CPU
(H'AA)
Module data bus
Bus
interface
TEMP
(H'FF)
FRCH
(H'AA)
FRCL
(H'FF)
Read lower byte
CPU
(H'FF)
Module data bus
Bus
interface
TEMP
(H'FF)
FRCH
( AB )
FRCL
( 00 )
Note: H'AB00 if counter has been updated once.
Figure 9.19 Read Access to FRC (FRC → CPU)
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Section 9 Timers
9.5.4
Timer Operation
Timer X Operation
• Output compare operation
Following a reset, FRC is initialized to H'0000 and starts counting up. Bits CKS1 and CKS0 in
TCRX can select one of three internal clock sources or an external clock for input to FRC. The
FRC contents are compared constantly with OCRA and OCRB. When a match occurs, the
output at pin FTOA or FTOB goes to the level selected by OLVLA or OLVLB in TOCR.
Following a reset, the output at both FTOA and FTOB is 0 until the first compare match. If
CCLRA is set to 1 in TCSRX, compare match A clears FRC to H'0000.
• Input capture operation
Following a reset, FRC is initialized to H'0000 and starts counting up. Bits CKS1 and CKS0 in
TCRX can select one of three internal clock sources or an external clock for input to FRC.
When the edges selected by bits IEDGA to IEDGD in TCRX are input at pins FTIA to FTID,
the FRC value is transferred to ICRA to ICRD, and ICFA to ICFD are set to 1 in TCSRX. If
bits ICIAE to ICIDE are set to 1 in TIER, a CPU interrupt is requested.
If bits BUFEA and BUFEB are set to 1 in TCRX, ICRC and ICRD operate as buffer registers
for ICRA or ICRB. When the edges selected by bits IEDGA to IEDGD in TCRX are input at
pins FTIA and FTIB, the FRC value is transferred to ICRA or ICRB, and the previous value in
ICRA or ICRB is transferred to ICRC or ICRD. Simultaneously, ICFA or ICFB is set to 1. If
bit ICIAE or ICIBE is set to 1 in TIER, a CPU interrupt is requested.
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Section 9 Timers
FRC Count Timing: FRC is incremented by clock input. Bits CKS1 and CKS0 in TCRX can
select one of three internal clock sources (φ/2, φ/8, φ/32) or an external clock.
• Internal clock
Bits CKS1 and CKS0 in TCRX select one of three internal clock sources (φ/2, φ/8, φ/32)
created by dividing the system clock (φ). Figure 9.20 shows the increment timing.
φ
Internal
clock
FRC input
clock
FRC
N–1
N
N+1
Figure 9.20 Increment Timing with Internal Clock
• External clock
External clock input is selected when bits CKS1 and CKS0 are both set to 1 in TCRX. FRC
increments on the rising edge of the external clock. An external pulse width of at least 1.5
system clocks (φ) is necessary. Shorter pulses will not be counted correctly. Figure 9.21 shows
the timing.
φ
FTCI
(external clock
input pin)
FRC input
clock
FRC
N
N–1
Figure 9.21 Increment Timing with External Clock
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Section 9 Timers
Output Compare Timing: When a compare match occurs, the output level selected by the OLVL
bit in TOCR is output at pin FTOA or FTOB. Figure 9.22 shows the output timing for output
compare A.
φ
FRC
OCRA
N
N+1
N
N+1
N
N
Compare
match A
signal
Clear*
OLVLA
FTOA
(output compare
A output pin)
Note: * By execution of a software instruction.
Figure 9.22 Output Compare A Output Timing
FRC Clear Timing: FRC can be cleared by compare match A. Figure 9.23 shows the timing.
φ
Compare
match A signal
FRC
N
H'0000
Figure 9.23 Clear Timing by Compare Match A
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Section 9 Timers
Input Capture Timing
• Input capture timing
The rising or falling edge is selected for input capture by bits IEDGA to IEDGD in TCRX.
Figure 9.24 shows the timing when the rising edge is selected (IEDGA/B/C/D = 1).
φ
Input capture
pin
Input capture
signal
Figure 9.24 Input Capture Signal Timing (Normal Case)
If the input at the input capture pin occurs while the upper byte of the corresponding input
capture register (ICRA to ICRD) is being read, the internal input capture signal is delayed by
one system clock (φ). Figure 9.25 shows the timing.
ICRA to ICRD upper byte read cycle
T1
T2
T3
φ
Input capture
pin
Input capture
signal
Figure 9.25 Input Capture Signal Timing (during ICRA to ICRD Read)
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Section 9 Timers
• Buffered input capture timing
Input capture can be buffered by using ICRC or ICRD as a buffer for ICRA or ICRB.
Figure 9.26 shows the timing when ICRA is buffered by ICRC (BUFEA = 1) and both
the rising and falling edges are selected (IEDGA = 1 and IEDGC = 0, or IEDGA = 0 and
IEDGC = 1).
φ
FTIA
Input capture
signal
n
FRC
n+1
N
N+1
ICRA
M
n
n
ICRC
m
M
M
N
n
Figure 9.26 Buffered Input Capture Timing (Normal Case)
When ICRC or ICRD is used as a buffer register, the input capture flag is still set by the
selected edge of the input capture input signal. For example, if ICRC is used to buffer ICRA,
when the edge transition selected by the IEDGC bit occurs at the input capture pin, ICFC will
be set, and if the ICIEC bit is set, an interrupt will be requested. The FRC value will not be
transferred to ICRC, however.
In buffered operation, if the upper byte of one of the two registers that receives a data transfer
(ICRA and ICRC, or ICRB and ICRD) is being read when an input capture signal would
normally occur, the input capture signal will be delayed by one system clock (φ). Figure 9.27
shows the case when BUFEA = 1.
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Section 9 Timers
ICRA or ICRC upper byte read cycle by CPU
T1
T2
T3
φ
FTIA
Input capture
signal
Figure 9.27 Buffered Input Capture Signal Timing (during ICRA or ICRD Read)
Input Capture Flag (ICFA to ICFD) Set Timing: Figure 9.28 shows the timing when an input
capture flag (ICFA to ICFD) is set to 1 and the FRC value is transferred to the corresponding input
capture register (ICRA to ICRD).
φ
Input capture
signal
ICFA to ICFD
FRC
N
ICRA to ICRD
N
Figure 9.28 ICFA to ICFD Set Timing
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Section 9 Timers
Output Compare Flag (OCFA or OCFB) Set Timing: OCFA and OCFB are set to 1 by internal
compare match signals that are output when FRC matches OCRA or OCRB. The compare match
signal is generated in the last state during which the values match (when FRC is updated from the
matching value to a new value). When FRC matches OCRA or OCRB, the compare match signal
is not generated until the next counter clock. Figure 9.29 shows the OCFA and OCFB set timing.
φ
FRC
N
N+1
N
OCRA, OCRB
Compare match
signal
OCFA, OCFB
Figure 9.29 OCFA and OCFB Set Timing
Overflow Flag (OVF) Set Timing: OVF is set to 1 when FRC overflows from H'FFFF to H'0000.
Figure 9.30 shows the timing.
φ
FRC
H'FFFF
Overflow signal
OVF
Figure 9.30 OVF Set Timing
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H'0000
Section 9 Timers
9.5.5
Timer X Operation Modes
Table 9.17 shows the timer X operation modes.
Table 9.17 Timer X Operation Modes
Operation Mode
Reset
Active
Sleep
Watch
Subactive
Subsleep
Standby
FRC
Reset
Functions
Functions
Reset
Reset
Reset
Reset
OCRA, OCRB
Reset
Functions
Functions
Reset
Reset
Reset
Reset
ICRA to ICRD
Reset
Functions
Functions
Reset
Reset
Reset
Reset
TIER
Reset
Functions
Functions
Reset
Reset
Reset
Reset
TCRX
Reset
Functions
Functions
Reset
Reset
Reset
Reset
TOCR
Reset
Functions
Functions
Reset
Reset
Reset
Reset
TCSRX
Reset
Functions
Functions
Reset
Reset
Reset
Reset
9.5.6
Interrupt Sources
Timer X has three types of interrupts and seven interrupt sources: ICIA to ICID, OCIA, OCIB,
and FOVI. Table 9.18 lists the sources of interrupt requests. Each interrupt source can be enabled
or disabled by an interrupt enable bit in TIER. Although all seven interrupts share the same vector,
they have individual interrupt flags, so software can discriminate the interrupt source.
Table 9.18 Timer X Interrupt Sources
Interrupt
Description
Vector Address
ICIA
Interrupt requested by ICFA
H'0020
ICIB
Interrupt requested by ICFB
ICIC
Interrupt requested by ICFC
ICID
Interrupt requested by ICFD
OCIA
Interrupt requested by OCFA
OCIB
Interrupt requested by OCFB
FOVI
Interrupt requested by OVF
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Section 9 Timers
9.5.7
Timer X Application Example
Figure 9.31 shows an example of the output of pulse signals with a 50% duty cycle and arbitrary
phase offset. To set up this output:
• Set bit CCLRA to 1 in TCSRX.
• Have software invert the OLVLA and OLVLB bits at each corresponding compare match.
FRC
H'FFFF
Counter cleared
OCRA
OCRB
H'0000
FTOA
FTOB
Figure 9.31 Pulse Output Example
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Section 9 Timers
9.5.8
Application Notes
The following types of contention can occur in timer X operation.
1. Contention between FRC write and counter clear
If an FRC clear signal is generated in the T3 state of a write cycle to the lower byte of FRC,
clearing takes precedence and the write to the counter is not carried out. Figure 9.32 shows the
timing.
FRC lower byte write cycle
T1
T2
T3
φ
Address
FRC address
Internal write
signal
Counter clear
signal
FRC
N
H'0000
Figure 9.32 Contention between FRC Write and Clear
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Section 9 Timers
2. Contention between FRC write and increment
If an FRC increment clock signal is generated in the T3 state of a write cycle to the lower byte
of FRC, the write takes precedence and the counter is not incremented. Figure 9.33 shows the
timing.
FRC lower byte write cycle
T1
T2
T3
φ
Address
FRC address
Internal write
signal
FRC input clock
FRC
N
M
FRC write data
Figure 9.33 Contention between FRC Write and Increment
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Section 9 Timers
3. Contention between OCR write and compare match
If a compare match is generated in the T3 state of a write cycle to the lower byte of OCRA or
OCRB, the write to OCRA or OCRB takes precedence and the compare match signal is
inhibited. Figure 9.34 shows the timing.
OCR lower byte write cycle
T1
T2
T3
φ
Address
OCR address
Internal write
signal
FRC
N
N+1
OCR
N
M
Write data
Compare match
signal
Inhibited
Figure 9.34 Contention between OCR Write and Compare Match
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Section 9 Timers
4. Internal clock switching and counter operation
Depending on the timing, FRC may be incremented by a switch between different internal
clock sources. Table 9.19 shows the relation between internal clock switchover timing (by
writing to bits CKS1 and CKS0) and FRC operation.
When FRC is internally clocked, an increment pulse is generated from the falling edge of an
internal clock signal, which is divided from the system clock (φ). For this reason, in a case like
No. 3 in table 9.19 where the switch is from a high clock signal to a low clock signal, the
switchover is seen as a falling edge, causing FRC to increment.
FRC can also be incremented by a switch between internal and external clocks.
Table 9.19 Internal Clock Switching and FRC Operation
No.
1
Clock Levels Before
and After Modifying
Bits CKS1 and CKS0
FRC Operation
Goes from low level
to low level
Clock before
switching
Clock after
switching
Count clock
FRC
N+1
N
Write to CKS1 and CKS0
2
Goes from low
to high
Clock before
switching
Clock after
switching
Count clock
FRC
N
N+1
N+2
Write to CKS1 and CKS0
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Section 9 Timers
No.
3
Clock Levels Before
and After Modifying
Bits CKS1 and CKS0
FRC Operation
Goes from high level
to low level
Clock before
switching
Clock after
switching
*
Count clock
FRC
N
N+1
N+2
Write to CKS1 and CKS0
4
Goes from high to high
Clock before
switching
Clock after
switching
Count clock
FRC
N
N+1
N+2
Write to CKS1 and CKS0
Note:
*
The switchover is seen as a falling edge, and FRC is incremented.
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Section 9 Timers
9.6
Watchdog Timer
9.6.1
Overview
The watchdog timer has an 8-bit counter that is incremented by an input clock. If a system
runaway allows the counter value to overflow before being rewritten, the watchdog timer can reset
the chip internally.
Features
Features of the watchdog timer are given below.
• Incremented by internal clock source (φ/8192).
• A reset signal is generated when the counter overflows. The overflow period can be set from 1
to 256 times 8192/φ (from approximately 2 ms to 500 ms when φ = 4.19 MHz).
Block Diagram
Figure 9.35 shows a block diagram of the watchdog timer.
φ
PSS
φ/8192
TCW
Legend:
TCSRW: Timer control/status register W
TCW:
Timer counter W
PSS:
Prescaler S
Figure 9.35 Block Diagram of Watchdog Timer
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Internal data bus
TCSRW
Internal reset
signal
Section 9 Timers
Register Configuration
Table 9.20 shows the register configuration of the watchdog timer.
Table 9.20
Watchdog Timer Registers
Name
Abbr.
R/W
Initial Value
Address
Timer control/status register W
TCSRW
R/W
H'AA
H'FFBE
Timer counter W
TCW
R/W
H'00
H'FFBF
9.6.2
Register Descriptions
Timer Control/Status Register W (TCSRW)
Bit
Initial value
Read/Write
Note:
*
7
6
5
4
3
2
1
0
B6WI
TCWE
B4WI
TCSRWE
B2WI
WDON
B0WI
WRST
1
0
1
0
1
0
1
0
R
R/(W)*
R
R/(W)*
R
R/(W)*
R
R/(W)*
Write is permitted only under certain conditions, which are given in the descriptions of
the individual bits.
TCSRW is an 8-bit read/write register that controls write access to TCW and TCSRW itself,
controls watchdog timer operations, and indicates operating status.
Bit 7
Bit 6 Write Inhibit (B6WI): Bit 7 controls the writing of data to bit 6 in TCSRW.
This bit is always read as 1. Data written to this bit is not stored.
Bit 7: B6WI
Description
0
Bit 6 is write-enabled
1
Bit 6 is write-protected
(initial value)
Bit 6
Timer Counter W Write Enable (TCWE): Bit 6 controls the writing of data to bit 8 to
TCW.
Bit 6: TCWE
Description
0
Data cannot be written to TCW
1
Data can be written to TCW
(initial value)
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Section 9 Timers
Bit 5
Bit 4 Write Inhibit (B4WI): Bit 5 controls the writing of data to bit 4 in TCSRW.
This bit is always read as 1. Data written to this bit is not stored.
Bit 5: B4WI
Description
0
Bit 4 is write-enabled
1
Bit 4 is write-protected
(initial value)
Bit 4
Timer Control/Status Register W Write Enable (TCSRWE): Bit 4 controls the writing
of data to TCSRW bits 2 and 0.
Bit 4: TCSRWE
Description
0
Data cannot be written to bits 2 and 0
1
Data can be written to bits 2 and 0
(initial value)
Bit 3
Bit 2 Write Inhibit (B2WI): Bit 3 controls the writing of data to bit 2 in TCSRW.
This bit is always read as 1. Data written to this bit is not stored.
Bit 3: B2WI
Description
0
Bit 2 is write-enabled
1
Bit 2 is write-protected
(initial value)
Bit 2
Watchdog Timer On (WDON): Bit 2 enables watchdog timer operation.
Counting starts when this bit is set to 1, and stops when this bit is cleared to 0.
Bit 2: WDON
Description
0
Watchdog timer operation is disabled
(initial value)
Clearing condition:
Reset, or when TCSRWE = 1 and 0 is written in both B2WI and WDON
1
Watchdog timer operation is enabled
Setting condition:
When TCSRWE = 1 and 0 is written in B2WI and 1 is written in WDON
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Section 9 Timers
Bit 1
Bit 0 Write Inhibit (B0WI): Bit 1 controls the writing of data to bit 0 in TCSRW.
This bit is always read as 1. Data written to this bit is not stored.
Bit 1: B0WI
Description
0
Bit 0 is write-enabled
1
Bit 0 is write-protected
(initial value)
Bit 0
Watchdog Timer Reset (WRST): Bit 0 indicates that TCW has overflowed, generating
an internal reset signal. The internal reset signal generated by the overflow resets the entire chip.
WRST is cleared to 0 by a reset from the RES pin, or when software writes 0.
Bit 0: WRST
Description
0
Clearing conditions:
• Reset by RES pin
•
1
(initial value)
When TCSRWE = 1, and 0 is written in both B0WI and WRST
Setting condition:
When TCW overflows and an internal reset signal is generated
Timer Counter W (TCW)
Bit
7
6
5
4
3
2
1
0
TCW7
TCW6
TCW5
TCW4
TCW3
TCW2
TCW1
TCW0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCW is an 8-bit read/write up-counter, which is incremented by internal clock input. The input
clock is φ/8192. The TCW value can always be written or read by the CPU.
When TCW overflows from H'FF to H'00, an internal reset signal is generated and WRST is set to
1 in TCSRW. Upon reset, TCW is initialized to H'00.
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Section 9 Timers
9.6.3
Timer Operation
The watchdog timer has an 8-bit counter (TCW) that is incremented by clock input (φ/8192).
When TCSRWE = 1 in TCSRW, if 0 is written in B2WI and 1 is simultaneously written in
WDON, TCW starts counting up (two write accesses to TCSRW are necessary in order to operate
the watchdog timer). When the TCW count value reaches H'FF, the next clock input causes the
watchdog timer to overflow and generates an internal reset signal. The internal reset signal is
output for 512 clock cycles of the φOSC clock. It is possible to write to TCW, causing TCW to
count up from the written value. The overflow period can be set in the range from 1 to 256 input
clocks, depending on the value written in TCW.
Figure 9.36 shows an example of watchdog timer operations.
Example:
φ = 4 MHz and the desired overflow period is 30 ms.
4 × 106
× 30 × 10–3 = 14.6
8192
The value set in TCW should therefore be 256 – 15 = 241 (H'F1).
TCW overflow
H'FF
H'F1
TCW count
value
H'00
Start
H'F1 written
in TCW
H'F1 written in TCW
Reset
Internal reset
signal
512 φOSC clock cycles
Figure 9.36 Typical Watchdog Timer Operations (Example)
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Section 9 Timers
9.6.4
Watchdog Timer Operation States
Table 9.21 summarizes the watchdog timer operation states.
Table 9.21 Watchdog Timer Operation States
Operation Mode
Reset
Active
Sleep
Watch
Subactive
Subsleep
Standby
TCW
Reset
Functions
Functions
Halted
Halted
Halted
Halted
TCSRW
Reset
Functions
Functions
Retained
Retained Retained Retained
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Section 9 Timers
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Section 10 Serial Communication Interface
Section 10 Serial Communication Interface
10.1
Overview
The H8/3644 Group is provided with a two-channel serial communication interface (SCI). Table
10.1 summarizes the functions and features of the two SCI channels.
Table 10.1 Serial Communication Interface Functions
Channel
Functions
Features
SCI1
Synchronous serial transfer
•
Choice of 8 internal clocks (φ/1024 to φ/2)
or external clock
•
Open drain output possible
•
Interrupt requested at completion of
transfer
Synchronous serial transfer
•
On-chip baud rate generator
•
8-bit data length
•
Receive error detection
•
Send, receive, or simultaneous
send/receive
•
Break detection
•
Interrupt requested at completion of
transfer or error
SCI3
•
Choice of 8-bit or 16-bit data length
•
Continuous clock output
Asynchronous serial transfer
•
Multiprocessor communication
•
Choice of 7-bit or 8-bit data length
•
Choice of 1 or 2 stop bits
•
Parity addition
10.2
SCI1
10.2.1
Overview
Serial communication interface 1 (SCI1) performs synchronous serial transfer of 8-bit or 16-bit
data. SSB (Synchronized Serial Bus) communication is also provided, enabling multiple ICs to be
controlled.
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Section 10 Serial Communication Interface
Features
• Choice of 8-bit or 16-bit data length
• Choice of eight internal clock sources (φ/1024, φ/256, φ/64, φ/32, φ/16, φ/8, φ/4, φ/2) or an
external clock
• Interrupt requested at completion of transfer
• Choice of HOLD mode or LATCH mode in SSB mode.
Block Diagram
Figure 10.1 shows a block diagram of SCI1.
PSS
SCR1
SCK1
Transmit/receive
control circuit
SCSR1
Internal data bus
φ
Transfer bit counter
SDRU
SI1
SDRL
SO1
IRRS1
Legend:
SCR1:
SCSR1:
SDRU:
SDRL:
IRRS1:
PSS:
Serial control register 1
Serial control/status register 1
Serial data register U
Serial data register L
SCI1 interrupt request flag
Prescaler S
Figure 10.1 SCI1 Block Diagram
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Section 10 Serial Communication Interface
Pin Configuration
Table 10.2 shows the SCI1 pin configuration.
Table 10.2 Pin Configuration
Name
Abbr.
I/O
Function
SCI1 clock pin
SCK1
I/O
SCI1 clock input or output
SCI1 data input pin
SI1
Input
SCI1 receive data input
SCI1 data output pin
SO1
Output
SCI1 transmit data output
Register Configuration
Table 10.3 shows the SCI1 register configuration.
Table 10.3 SCI1 Registers
Name
Abbr.
R/W
Initial Value
Address
Serial control register 1
SCR1
R/W
H'00
H'FFA0
Serial control status register 1
SCSR1
R/W
H'9C
H'FFA1
Serial data register U
SDRU
R/W
Undefined
H'FFA2
Serial data register L
SDRL
R/W
Undefined
H'FFA3
10.2.2
Register Descriptions
Serial Control Register 1 (SCR1)
Bit
7
6
5
4
3
2
1
0
SNC1
SNC0
MRKON
LTCH
CKS3
CKS2
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SCR1 is an 8-bit read/write register for selecting the operation mode, the transfer clock source,
and the prescaler division ratio.
Upon reset, SCR1 is initialized to H'00. Writing to this register during a transfer stops the transfer.
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Section 10 Serial Communication Interface
Bits 7 and 6
Operation Mode Select 1, 0 (SNC1, SNC0): Bits 7 and 6 select the operation
mode.
Bit 7: SNC1
Bit 6: SNC0
Description
0
0
8-bit synchronous transfer mode
1
0
16-bit synchronous transfer mode
1
Continuous clock output mode*
1
Reserved*
1
(initial value)
2
Notes: 1. Pins SI1 and SO1 should be used as general input or output ports.
2. Don’t set bits SNC1 and SNC0 to 11.
Bits 5
TAIL MARK Control (MRKON): Bit 5 controls TAIL MARK output after an 8- or 16bit data transfer.
Bit 5: MRKON
Description
0
TAIL MARK is not output (synchronous mode)
1
TAIL MARK is output (SSB mode)
(initial value)
Bits 4
LATCH TAIL Select (LTCH): Bit 4 selects whether LATCH TAIL or HOLD TAIL is
output as TAIL MARK when bit MRKON is set to 1 (SSB mode).
Bit 4: LTCH
Description
0
HOLD TAIL is output
1
LATCH TAIL is output
(initial value)
Bit 3
Clock Source Select (CKS3): Bit 3 selects the clock source and sets pin SCK1 as an input
or output pin.
Bit 3: CKS3
Description
0
Clock source is prescaler S, and pin SCK1 is output pin
1
Clock source is external clock, and pin SCK1 is input pin
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(initial value)
Section 10 Serial Communication Interface
Bits 2 to 0
Clock Select (CKS2 to CKS 0): When CKS3 = 0, bits 2 to 0 select the prescaler
division ratio and the serial clock cycle.
Serial Clock Cycle
Bit 2: CKS2
Bit 1: CKS1
Bit 0: CKS0
Prescaler Division
φ = 5 MHz
φ = 2.5 MHz
0
0
0
φ/1024 (initial value)
204.8 µs
409.6 µs
1
φ/256
51.2 µs
102.4 µs
0
φ/64
12.8 µs
25.6 µs
1
φ/32
6.4 µs
12.8 µs
0
φ/16
3.2 µs
6.4 µs
1
φ/8
1.6 µs
3.2 µs
0
φ/4
0.8 µs
1.6 µs
1
φ/2
0.8 µs
1
1
0
1
Serial Control/Status Register 1 (SCSR1)
Bit
7
6
5
4
3
2
1
0
SOL
ORER
MTRF
STF
0
R/(W)*
1
1
1
0
0
R
R/W
Initial value
1
0
Read/Write
R/W
Note:
*
Only a write of 0 for flag clearing is possible.
SCSR1 is an 8-bit register indicating operation status and error status.
Upon reset, SCSR1 is initialized to H'9C.
Bit 7
Reserved Bit: Bit 7 is reserved; it is always read as 1, and cannot be modified.
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Section 10 Serial Communication Interface
Bit 6
Extended Data Bit (SOL): Bit 6 sets the SO1 output level. When read, SOL returns the
output level at the SO1 pin. After completion of a transmission, SO1 continues to output the value
of the last bit of transmitted data. The SO1 output can be changed by writing to SOL before or
after a transmission. The SOL bit setting remains valid only until the start of the next transmission.
SSB mode settings also become invalid. To control the level of the SO1 pin after transmission
ends, it is necessary to write to the SOL bit at the end of each transmission. Do not write to this
register while transmission is in progress, because that may cause a malfunction.
Bit 6: SOL
Description
0
Read: SO1 pin output level is low
(initial value)
Write: SO1 pin output level changes to low
1
Read: SO1 pin output level is high
Write: SO1 pin output level changes to high
Bit 5
Overrun Error Flag (ORER): When an external clock is used, bit 5 indicates the
occurrence of an overrun error. If noise occurs during a transfer, causing an extraneous pulse to be
superimposed on the normal serial clock, incorrect data may be transferred. If a clock pulse is
input after transfer completion, this bit is set to 1 indicating an overrun.
Bit 5: ORER
Description
0
Clearing condition:
After reading ORER = 1, cleared by writing 0 to ORER
1
(initial value)
Setting condition:
Set if a clock pulse is input after transfer is complete, when an external clock is
used
Bits 4 to 2
Reserved Bits: Bits 4 to 2 are reserved. They are always read as 0, and cannot be
modified.
Bit 1
TAIL MARK Transmit Flag (MTRF): When bit MRKON is set to 1, bit 1 indicates that
TAIL MARK is being sent. Bit 1 is a read-only bit and cannot be modified.
Bit 1: MTRF
Description
0
Idle state, or 8- or 16-bit data is being transferred
1
TAIL MARK is being sent
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(initial value)
Section 10 Serial Communication Interface
Bit 0
Start Flag (STF): Bit 0 controls the start of a transfer. Setting this bit to 1 causes SCI1 to
start transferring data.
During the transfer or while waiting for the first clock pulse, this bit remains set to 1. It is cleared
to 0 upon completion of the transfer. It can therefore be used as a busy flag.
Bit 0: STF
Description
0
Read: Indicates that transfer is stopped
(initial value)
Write: Invalid
1
Read: Indicates transfer in progress
Write: Starts a transfer operation
Serial Data Register U (SDRU)
Bit
Initial value
Read/Write
7
6
5
4
3
2
1
0
SDRU7
SDRU6
SDRU5
SDRU4
SDRU3
SDRU2
SDRU1
SDRU0
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SDRU is an 8-bit read/write register. It is used as the data register for the upper 8 bits in 16-bit
transfer (SDRL is used for the lower 8 bits).
Data written to SDRU is output to SDRL starting from the least significant bit (LSB). This data is
then replaced by LSB-first data input at pin SI1, which is shifted in the direction from the most
significant bit (MSB) toward the LSB.
SDRU must be written or read only after data transmission or reception is complete. If this register
is written or read while a data transfer is in progress, the data contents are not guaranteed.
The SDRU value upon reset is undefined.
Serial Data Register L (SDRL)
Bit
Initial value
Read/Write
7
6
5
4
3
2
1
0
SDRL7
SDRL6
SDRL5
SDRL4
SDRL3
SDRL2
SDRL1
SDRL0
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
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Section 10 Serial Communication Interface
SDRL is an 8-bit read/write register. It is used as the data register in 8-bit transfer, and as the data
register for the lower 8 bits in 16-bit transfer (SDRU is used for the upper 8 bits).
In 8-bit transfer, data written to SDRL is output from pin SO1 starting from the least significant bit
(LSB). This data is then replaced by LSB-first data input at pin SI1, which is shifted in the
direction from the most significant bit (MSB) toward the LSB.
In 16-bit transfer, operation is the same as for 8-bit transfer, except that input data is fed in via
SDRU.
SDRL must be written or read only after data transmission or reception is complete. If this register
is read or written while a data transfer is in progress, the data contents are not guaranteed.
The SDRL value upon reset is undefined.
10.2.3
Operation in Synchronous Mode
Data can be sent and received in an 8-bit or 16-bit format, with an internal or external clock
selected as the clock source. Overrun errors can be detected when an external clock is used.
Clock: The serial clock can be selected from a choice of eight internal clocks and an external
clock. When an internal clock source is selected, pin SCK1 becomes the clock output pin. When
continuous clock output mode is selected (SCR1 bits SNC1 and SNC0 are set to 10), the clock
signal (φ/1024 to φ/2) selected in bits CKS2 to CKS0 is output continuously from pin SCK1. When
an external clock is used, pin SCK1 is the clock input pin.
Data Transfer Format: Figure 10.2 shows the data transfer format. Data is sent and received
starting from the least significant bit, in LSB-first format. Transmit data is output from one falling
edge of the serial clock until the next rising edge. Receive data is latched at the rising edge of the
serial clock.
SCK 1
SO1 /SI 1
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Figure 10.2 Transfer Format
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Bit 6
Bit 7
Section 10 Serial Communication Interface
Data Transfer Operations
Transmitting: A transmit operation is carried out as follows.
1. Set bits SO1 and SCK1 to 1 in PMR3 to select the SO1 and SCK1 pin functions. If necessary,
set bit POF1 in PMR7 for NMOS open-drain output at pin SO1.
2. Clear bit SNC1 in SCR1 to 0, set bit SNC0 to 0 or 1, and clear bit MRKON to 0, designating
8- or 16-bit synchronous transfer mode. Select the serial clock in bits CKS3 to CKS0. Writing
data to SCR1 when bit MRKON in SCR1 is cleared to 0 initializes the internal state of SCI1.
3. Write transmit data in SDRL and SDRU, as follows.
8-bit transfer mode:
SDRL
16-bit transfer mode: Upper byte in SDRU, lower byte in SDRL
4. Set the SCSR1 start flag (STF) to 1. SCI1 starts operating and outputs transmit data at pin SO1.
5.
After data transmission is complete, bit IRRS1 in interrupt request register 2 (IRR2) is
set to 1.
When an internal clock is used, a serial clock is output from pin SCK1 in synchronization with the
transmit data. After data transmission is complete, the serial clock is not output until the next time
the start flag is set to 1. During this time, pin SO1 continues to output the value of the last bit
transmitted.
When an external clock is used, data is transmitted in synchronization with the serial clock input at
pin SCK1. After data transmission is complete, an overrun occurs if the serial clock continues to be
input; no data is transmitted and the SCSR1 overrun error flag (bit ORER) is set to 1.
While transmission is stopped, the output value of pin SO1 can be changed by rewriting bit SOL in
SCSR1.
Receiving: A receive operation is carried out as follows.
1. Set bits SI1 and SCK1 to 1 in PMR3 to select the SI1 and SCK1 pin functions.
2. Clear bit SNC1 in SCR1 to 0, set bit SNC0 to 0 or 1, and clear bit MRKON to 0, designating
8- or 16-bit synchronous transfer mode. Select the serial clock in bits CKS3 to CKS0. Writing
data to SCR1 when bit MRKON in SCR1 is cleared to 0 initializes the internal state of SCI1.
3. Set the SCSR1 start flag (STF) to 1. SCI1 starts operating and receives data at pin SI1.
4. After data reception is complete, bit IRRS1 in interrupt request register 2 (IRR2) is set to 1.
5. Read the received data from SDRL and SDRU, as follows.
8-bit transfer mode:
SDRL
16-bit transfer mode: Upper byte in SDRU, lower byte in SDRL
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Section 10 Serial Communication Interface
6.
After data reception is complete, an overrun occurs if the serial clock continues to be input; no
data is received and the SCSR1 overrun error flag (bit ORER) is set to 1.
Simultaneous Transmit/Receive: A simultaneous transmit/receive operation is carried out as
follows.
1. Set bits SO1, SI1, and SCK1 to 1 in PMR3 to select the SO1, SI1, and SCK1 pin functions. If
necessary, set bit POF1 in PMR7 for NMOS open-drain output at pin SO1.
2. Clear bit SNC1 in SCR1 to 0, set bit SNC0 to 0 or 1, and clear bit MRKON to 0, designating
8- or 16-bit synchronous transfer mode. Select the serial clock in bits CKS3 to CKS0. Writing
data to SCR1 when bit MRKON in SCR1 is cleared to 0 initializes the internal state of SCI1.
3. Write transmit data in SDRL and SDRU, as follows.
8-bit transfer mode:
SDRL
16-bit transfer mode: Upper byte in SDRU, lower byte in SDRL
4. Set the SCSR1 start flag (STF) to 1. SCI1 starts operating. Transmit data is output at pin SO1.
Receive data is input at pin SI1.
5. After data transmission and reception are complete, bit IRRS1 in IRR2 is set to 1.
6. Read the received data from SDRL and SDRU, as follows.
8-bit transfer mode:
SDRL
16-bit transfer mode: Upper byte in SDRU, lower byte in SDRL
When an internal clock is used, a serial clock is output from pin SCK1 in synchronization with the
transmit data. After data transmission is complete, the serial clock is not output until the next time
the start flag is set to 1. During this time, pin SO1 continues to output the value of the last bit
transmitted.
When an external clock is used, data is transmitted and received in synchronization with the serial
clock input at pin SCK1. After data transmission and reception are complete, an overrun occurs if
the serial clock continues to be input; no data is transmitted or received and the SCSR1 overrun
error flag (bit ORER) is set to 1.
While transmission is stopped, the output value of pin SO1 can be changed by rewriting bit SOL in
SCSR1.
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Section 10 Serial Communication Interface
10.2.4
Operation in SSB Mode
SSB communication uses two lines, SCL (Serial Clock) and SDA (Serial Data), and enables
multiple ICs to be connected as shown in figure 10.3.
In SSB mode, TAIL MARK is sent after an 8- or 16-bit data transfer. HOLD TAIL or LATCH
TAIL can be selected as TAIL MARK.
SCL
H8/3644 SCK
1
Group SO1
IC-A
IC-B
SDA
SCL
SDA
SCL
SDA
SCL
SDA
IC-C
Figure 10.3 Example of SSB Connection
Clock: The transfer clock can be selected from eight internal clocks or an external clock, but since
the H8/3644 Group uses clock output, an external clock should not be selected. The transfer rate
can be selected by bits CKS2 to CKS0 in SCR1. Since this is also the TAIL MARK transfer rate,
the setting should be made to give a transfer clock cycle of at least 2 µs.
Data Transfer Format: Figure 10.4 shows the SCI1 transfer format. Data is sent starting from the
least significant bit, in LSB-first format. TAIL MARK is sent after an 8- or 16-bit data transfer.
SCK1
SO 1
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5 Bit 14 Bit 15
TAIL MARK
1 frame
Figure 10.4 Transfer Format (When SNC1 = 0, SNC0 = 1, MRKON = 1)
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Section 10 Serial Communication Interface
TAIL MARK: TAIL MARK can be either HOLD TAIL or LATCH TAIL. The output
waveforms of HOLD TAIL and LATCH TAIL are shown in figure 10.5. Time t in the figure is
determined by the transfer clock cycle set in bits CKS2 to CKS0 in SCR1.
< HOLD TAIL >
< LATCH TAIL >
SCK1
SCK1
t
SO 1
t
t
2t
t
t
t
t
Bit 14 Bit 15
Bit 0
SO 1
t
t
2t
t
t
Bit 14 Bit 15
Figure 10.5 HOLD TAIL and LATCH TAIL Waveforms
Transmitting: A transmit operation is carried out as follows.
1. Set bit SOL in SCSR1 to 1.
2. Set bits SO1 and SCK1 to 1 in PMR3 to select the S01 and SCK1 pin functions. Set bit POF1 in
PMR7 to 1 for NMOS open-drain output at pin SO1.
3. Clear bit SNC1 in SCR1 to 0 and set bit SNC0 to 0 or 1, designating 8-bit mode or 16-bit
mode. Set bit MRKON in SCR1 to 1, selecting SSB mode.
4. Write transmit data in SDRL and SDRU as follows, and select TAIL MARK with bit LTCH in
SCR1.
8-bit mode: SDRL
16-bit mode: Upper byte in SDRU, lower byte in SDRL
5. Set the SCSR1 start flag (STF) to 1. SCI1 starts operating and outputs transmit data at pin S01.
6. After 8- or 16-bit data transmission is complete, bit STF in SCSR1 is cleared to 0 and bit
IRRS1 in interrupt request register 2 (IRRS2) is set to 1. The selected TAIL MARK is output
after the data transmission. During TAIL MARK output, bit MTRF in SCSR1 is set to 1.
Data can be sent continuously by repeating steps 4 to 6. Check that SCI1 is in the idle state before
rewriting bit MRKON in SCR1.
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Section 10 Serial Communication Interface
10.2.5
Interrupts
SCI1 can generate an interrupt at the end of a data transfer.
When an SCI1 transfer is complete, bit IRRS1 in interrupt request register 2 (IRR2) is set to 1.
SCI1 interrupt requests can be enabled or disabled by bit IENS1 of interrupt enable register 2
(IENR2).
For further details, see section 3.3, Interrupts.
10.3
SCI3
10.3.1
Overview
Serial communication interface 3 (SCI3) can carry out serial data communication in either
asynchronous or synchronous mode. It is also provided with a multiprocessor communication
function that enables serial data to be transferred among processors.
Features
Features of SCI3 are listed below.
• Choice of asynchronous or synchronous mode for serial data communication
Asynchronous mode
Serial data communication is performed asynchronously, with synchronization provided
character by character. In this mode, serial data can be exchanged with standard
asynchronous communication LSIs such as a Universal Asynchronous
Receiver/Transmitter (UART) or Asynchronous Communication Interface Adapter
(ACIA). A multiprocessor communication function is also provided, enabling serial data
communication among processors.
There is a choice of 12 data transfer formats.
Data length
7 or 8 bits
Stop bit length
1 or 2 bits
Parity
Even, odd, or none
Multiprocessor bit
“1” or “0”
Receive error detection
Parity, overrun, and framing errors
Break detection
Break detected by reading the RXD pin level directly when
a framing error occurs
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Section 10 Serial Communication Interface
Synchronous mode
Serial data communication is synchronized with a clock. In his mode, serial data can be
exchanged with another LSI that has a synchronous communication function.
Data length
8 bits
Receive error detection
Overrun errors
• Full-duplex communication
Separate transmission and reception units are provided, enabling transmission and reception to
be carried out simultaneously. The transmission and reception units are both double-buffered,
allowing continuous transmission and reception.
• On-chip baud rate generator, allowing any desired bit rate to be selected
• Choice of an internal or external clock as the transmit/receive clock source
• Six interrupt sources: transmit end, transmit data empty, receive data full, overrun error,
framing error, and parity error
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Section 10 Serial Communication Interface
Block Diagram
Figure 10.6 shows a block diagram of SCI3.
External
clock
SCK3
Internal clock (φ/64, φ/16, φ/4, φ)
Baud rate generator
BRC
BRR
SMR
Transmit/receive
control circuit
SCR3
SSR
TXD
TSR
TDR
RXD
RSR
RDR
Internal data bus
Clock
Interrupt request
(TEI, TXI, RXI, ERI)
Legend:
RSR:
RDR:
TSR:
TDR:
SMR:
SCR3:
SSR:
BRR:
BRC:
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register 3
Serial status register
Bit rate register
Bit rate counter
Figure 10.6 SCI3 Block Diagram
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Section 10 Serial Communication Interface
Pin Configuration
Table 10.4 shows the SCI3 pin configuration.
Table 10.4 Pin Configuration
Name
Abbr.
I/O
Function
SCI3 clock
SCK3
I/O
SCI3 clock input/output
SCI3 receive data input
RXD
Input
SCI3 receive data input
SCI3 transmit data output
TXD
Output
SCI3 transmit data output
Register Configuration
Table 10.5 shows the SCI3 register configuration.
Table 10.5 Registers
Name
Abbr.
R/W
Initial Value
Address
Serial mode register
SMR
R/W
H'00
H'FFA8
Bit rate register
BRR
R/W
H'FF
H'FFA9
Serial control register 3
SCR3
R/W
H'00
H'FFAA
Transmit data register
TDR
R/W
H'FF
H'FFAB
Serial status register
SSR
R/W
H'84
H'FFAC
Receive data register
RDR
R
H'00
H'FFAD
Transmit shift register
TSR
Protected
Receive shift register
RSR
Protected
Bit rate counter
BRC
Protected
10.3.2
Register Descriptions
Receive Shift Register (RSR)
Bit
7
6
5
4
3
2
1
0
Read/Write
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Section 10 Serial Communication Interface
RSR is a register used to receive serial data. Serial data input to RSR from the RXD pin is set in
the order in which it is received, starting from the LSB (bit 0), and converted to parallel data.
When one byte of data is received, it is transferred to RDR automatically.
RSR cannot be read or written directly by the CPU.
Receive Data Register (RDR)
Bit
7
6
5
4
3
2
1
0
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
RDR is an 8-bit register that stores received serial data.
When reception of one byte of data is finished, the received data is transferred from RSR to RDR,
and the receive operation is completed. RSR is then enabled for reception. RSR and RDR are
double-buffered, allowing consecutive receive operations.
RDR is a read-only register, and cannot be written by the CPU.
RDR is initialized to H'00 upon reset, and in standby, watch, subactive, or subsleep mode.
Transmit Shift Register (TSR)
Bit
7
6
5
4
3
2
1
0
Read/Write
TSR is a register used to transmit serial data. Transmit data is first transferred from TDR to TSR,
and serial data transmission is carried out by sending the data to the TXD pin in order, starting
from the LSB (bit 0). When one byte of data is transmitted, the next byte of transmit data is
transferred from TDR to TSR, and transmission started, automatically. Data transfer from TDR to
TSR is not performed if no data has been written to TDR (if bit TDRE is set to 1 in the serial
status register (SSR)).
TSR cannot be read or written directly by the CPU.
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Section 10 Serial Communication Interface
Transmit Data Register (TDR)
Bit
7
6
5
4
3
2
1
0
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TDR is an 8-bit register that stores transmit data. When TSR is found to be empty, the transmit
data written in TDR is transferred to TSR, and serial data transmission is started. Continuous
transmission is possible by writing the next transmit data to TDR during TSR serial data
transmission.
TDR can be read or written by the CPU at any time.
TDR is initialized to H'FF upon reset, and in standby, watch, subactive, or subsleep mode.
Serial Mode Register (SMR)
Bit
7
6
5
4
3
2
1
0
COM
CHR
PE
PM
STOP
MP
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SMR is an 8-bit register used to set the serial data transfer format and to select the clock source for
the baud rate generator.
SMR can be read or written by the CPU at any time.
SMR is initialized to H'00 upon reset, and in standby, watch, subactive, or subsleep mode.
Bit 7
Communication Mode (COM): Bit 7 selects whether SCI3 operates in asynchronous
mode or synchronous mode.
Bit 7: COM
Description
0
Asynchronous mode
1
Synchronous mode
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(initial value)
Section 10 Serial Communication Interface
Bit 6
Character Length (CHR): Bit 6 selects either 7 or 8 bits as the data length to be used in
asynchronous mode. In synchronous mode the data length is always 8 bits, irrespective of the bit 6
setting.
Bit 6: CHR
Description
0
8-bit data
1
7-bit data*
Note:
*
(initial value)
When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted.
Bit 5
Parity Enable (PE): Bit 5 selects whether a parity bit is to be added during transmission
and checked during reception in asynchronous mode. In synchronous mode parity bit addition and
checking is not performed, irrespective of the bit 5 setting.
Bit 5: PE
Description
0
Parity bit addition and checking disabled
Parity bit addition and checking enabled*
1
Note:
*
(initial value)
When PE is set to 1, even or odd parity, as designated by bit PM, is added to transmit
data before it is sent, and the received parity bit is checked against the parity
designated by bit PM.
Bit 4
Parity Mode (PM): Bit 4 selects whether even or odd parity is to be used for parity
addition and checking. The PM bit setting is only valid in asynchronous mode when bit PE is set
to 1, enabling parity bit addition and checking. The PM bit setting is invalid in synchronous mode,
and in asynchronous mode if parity bit addition and checking is disabled.
Bit 4: PM
Description
0
1
Even parity*
2
Odd parity*
1
(initial value)
Notes: 1. When even parity is selected, a parity bit is added in transmission so that the total
number of 1 bits in the transmit data plus the parity bit is an even number; in reception,
a check is carried out to confirm that the number of 1 bits in the receive data plus the
parity bit is an even number.
2. When odd parity is selected, a parity bit is added in transmission so that the total
number of 1 bits in the transmit data plus the parity bit is an odd number; in reception, a
check is carried out to confirm that the number of 1 bits in the receive data plus the
parity bit is an odd number.
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Section 10 Serial Communication Interface
Bit 3
Stop Bit Length (STOP): Bit 3 selects 1 bit or 2 bits as the stop bit length is asynchronous
mode. The STOP bit setting is only valid in asynchronous mode. When synchronous mode is
selected the STOP bit setting is invalid since stop bits are not added.
Bit 3: STOP
Description
0
1 stop bit*
1
2
2 stop bits*
1
(initial value)
Notes: 1. In transmission, a single 1 bit (stop bit) is added at the end of a transmit character.
2. In transmission, two 1 bits (stop bits) are added at the end of a transmit character.
In reception, only the first of the received stop bits is checked, irrespective of the STOP bit setting.
If the second stop bit is 1 it is treated as a stop bit, but if 0, it is treated as the start bit of the next
transmit character.
Bit 2
Multiprocessor Mode (MP): Bit 2 enables or disables the multiprocessor communication
function. When the multiprocessor communication function is enabled, the parity settings in the
PE and PM bits are invalid. The MP bit setting is only valid in asynchronous mode. When
synchronous mode is selected the MP bit should be set to 0. For details on the multiprocessor
communication function, see section 10.3.6, Multiprocessor Communication Function.
Bit 2: MP
Description
0
Multiprocessor communication function disabled
1
Multiprocessor communication function enabled
(initial value)
Bits 1 and 0
Clock Select 1, 0 (CKS1, CKS0): Bits 1 and 0 choose φ/64, φ/16, φ/4, or φ as the
clock source for the baud rate generator.
For the relation between the clock source, bit rate register setting, and baud rate, see Bit Rate
Register (BRR).
Bit 1: CKS1
Bit 0: CKS0
Description
0
0
φ clock
1
φ/4 clock
0
φ/16 clock
1
φ/64 clock
1
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(initial value)
Section 10 Serial Communication Interface
Serial Control Register 3 (SCR3)
Bit
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SCR3 is an 8-bit register for selecting transmit or receive operation, the asynchronous mode clock
output, interrupt request enabling or disabling, and the transmit/receive clock source.
SCR3 can be read or written by the CPU at any time.
SCR3 is initialized to H'00 upon reset, and in standby, watch, subactive, or subsleep mode.
Bit 7
Transmit interrupt Enable (TIE): Bit 7 selects enabling or disabling of the transmit data
empty interrupt request (TXI) when transmit data is transferred from the transmit data register
(TDR) to the transmit shift register (TSR), and bit TDRE in the serial status register (SSR) is set to
1.
TXI can be released by clearing bit TDRE or bit TIE to 0.
Bit 7: TIE
Description
0
Transmit data empty interrupt request (TXI) disabled
1
Transmit data empty interrupt request (TXI) enabled
(initial value)
Bit 6
Receive Interrupt Enable (RIE): Bit 6 selects enabling or disabling of the receive data
full interrupt request (RXI) and the receive error interrupt request (ERI) when receive data is
transferred from the receive shift register (RSR) to the receive data register (RDR), and bit RDRF
in the serial status register (SSR) is set to 1. There are three kinds of receive error: overrun,
framing, and parity.
RXI and ERI can be released by clearing bit RDRF or the FER, PER, or OER error flag to 0, or by
clearing bit RIE to 0.
Bit 6: RIE
Description
0
Receive data full interrupt request (RXI) and receive error interrupt request
(ERI) disabled
(initial value)
1
Receive data full interrupt request (RXI) and receive error interrupt request
(ERI) enabled
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Section 10 Serial Communication Interface
Bit 5
Transmit Enable (TE): Bit 5 selects enabling or disabling of the start of transmit
operation.
Bit 5: TE
Description
0
Transmit operation disabled* (TXD pin is transmit data pin)*
2
3
Transmit operation enabled* (TXD pin is transmit data pin)*
1
1
3
(initial value)
Notes: 1. Bit TDRE in SSR is fixed at 1.
2. When transmit data is written to TDR in this state, bit TDR in SSR is cleared to 0 and
serial data transmission is started. Be sure to carry out serial mode register (SMR)
settings to decide the transmission format before setting bit TE to 1.
3. When bit TXD in PMR7 is set to 1. When bit TXD is cleared to 0, the TXD pin functions
as an I/O port regardless of the TE bit setting.
Bit 4
Receive Enable (RE): Bit 4 selects enabling or disabling of the start of receive operation.
Bit 4: RE
Description
0
Receive operation disabled* (RXD pin is I/O port)
2
Receive operation enabled* (RXD pin is receive data pin)
1
1
(initial value)
Notes: 1. Note that the RDRF, FER, PER, and OER flags in SSR are not affected when bit RE is
cleared to 0, and retain their previous state.
2. In this state, serial data reception is started when a start bit is detected in asynchronous
mode or serial clock input is detected in synchronous mode. Be sure to carry out serial
mode register (SMR) settings to decide the reception format before setting bit RE to 1.
Bit 3
Multiprocessor Interrupt Enable (MPIE): Bit 3 selects enabling or disabling of the
multiprocessor interrupt request. The MPIE bit setting is only valid when asynchronous mode is
selected and reception is carried out with bit MP in SMR set to 1. The MPIE bit setting is invalid
when bit COM is set to 1 or bit MP is cleared to 0.
Bit 3: MPIE
Description
0
Multiprocessor interrupt request disabled (normal receive operation)
(initial value)
Clearing condition:
When data is received in which the multiprocessor bit is set to 1
Multiprocessor interrupt request enabled*
1
Note:
*
Receive data transfer from RSR to RDR, receive error detection, and setting of the
RDRF, FER, and OER status flags in SSR is not performed. RXI, ERI, and setting of
the RDRF, FER, and OER flags in SSR, are disabled until data with the multiprocessor
bit set to 1 is received. When a receive character with the multiprocessor bit set to 1 is
received, bit MPBR in SSR is set to 1, bit MPIE is automatically cleared to 0, and RXI
and ERI requests (when bits TIE and RIE in serial control register (SCR) are set to 1)
and setting of the RDRF, FER, and OER flags are enabled.
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Section 10 Serial Communication Interface
Bit 2
Transmit End Interrupt Enable (TEIE): Bit 2 selects enabling or disabling of the
transmit end interrupt request (TEI) if there is no valid transmit data in TDR when MSB data is to
be sent.
Bit 2: TEIE
Description
0
Transmit end interrupt request (TEI) disabled
Transmit end interrupt request (TEI) enabled*
1
Note:
*
(initial value)
TEI can be released by clearing bit TDRE to 0 and clearing bit TEND to 0 in SSR, or by
clearing bit TEIE to 0.
Bits 1 and 0
Clock Enable 1 and 0 (CKE1, CKE0): Bits 1 and 0 select the clock source and
enabling or disabling of clock output from the SCK3 pin. These bits determine whether the SCK3
pin functions as an I/O port, a clock output pin, or a clock input pin.
The CKE0 bit setting is only valid in case of internal clock operation (CKE1 = 0) in asynchronous
mode. In synchronous mode, or when external clock operation is used (CKE1 = 1), bit CKE0
should be cleared to 0.
After setting bits CKE1 and CKE0, set the operating mode in the serial mode register (SMR).
For details on clock source selection, see table 10.10 in 10.3.3, Operation.
Description
Bit 1: CKE1
Bit 0: CKE0
Communication Mode
Clock Source
SCK3 Pin Function
0
0
Asynchronous
Internal clock
I/O port*
Synchronous
Internal clock
Asynchronous
Internal clock
Serial clock output*
2
Clock output*
Synchronous
Reserved
0
Asynchronous
External clock
Clock input*
Synchronous
External clock
Serial clock input
1
Asynchronous
Reserved
Synchronous
Reserved
1
1
1
1
3
Notes: 1. Initial value
2. A clock with the same frequency as the bit rate is output.
3. Input a clock with a frequency 16 times the bit rate.
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Section 10 Serial Communication Interface
Serial Status Register (SSR)
Bit
7
6
5
4
3
2
1
0
TDRE
RDRF
OER
FER
PER
TEND
MPBR
MPBT
Initial value
1
0
0
0
0
1
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R
R
R/W
Note:
*
Only a write of 0 for flag clearing is possible.
SSR is an 8-bit register containing status flags that indicate the operational status of SCI3, and
multiprocessor bits.
SSR can be read or written by the CPU at any time, but only a write of 1 is possible to bits TDRE,
RDRF, OER, PER, and FER. In order to clear these bits by writing 0, 1 must first be read.
Bits TEND and MPBR are read-only bits, and cannot be modified.
SSR is initialized to H'84 upon reset, and in standby, watch, subactive, or subsleep mode.
Bit 7
Transmit Data Register Empty (TDRE): Bit 7 indicates that transmit data has been
transferred from TDR to TSR.
Bit 7: TDRE
Description
0
Transmit data written in TDR has not been transferred to TSR
Clearing conditions:
• After reading TDRE = 1, cleared by writing 0 to TDRE
•
1
When data is written to TDR by an instruction
Transmit data has not been written to TDR, or transmit data written in TDR has
been transferred to TSR
Setting conditions:
• When bit TE in SCR3 is cleared to 0
•
When data is transferred from TDR to TSR
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(initial value)
Section 10 Serial Communication Interface
Bit 6
Receive Data Register Full (RDRF): Bit 6 indicates that received data is stored in RDR.
Bit 6: RDRF
Description
0
There is no receive data in RDR
(initial value)
Clearing conditions:
• After reading RDRF = 1, cleared by writing 0 to RDRF
•
1
When RDR data is read by an instruction
There is receive data in RDR
Setting condition:
When reception ends normally and receive data is transferred from RSR to
RDR
Note: If an error is detected in the receive data, or if the RE bit in SCR3 has been cleared to 0,
RDR and bit RDRF are not affected and retain their previous state.
Note that if data reception is completed while bit RDRF is still set to 1, an overrun error
(OER) will result and the receive data will be lost.
Bit 5
Overrun Error (OER): Bit 5 indicates that an overrun error has occurred during
reception.
Bit 5: OER
Description
0
Reception in progress or completed*
1
Clearing condition:
After reading OER = 1, cleared by writing 0 to OER
2
An overrun error has occurred during reception*
1
(initial value)
Setting condition:
When reception is completed with RDRF set to 1
Notes: 1. When bit RE in SCR3 is cleared to 0, bit OER is not affected and retains its previous
state.
2. RDR retains the receive data it held before the overrun error occurred, and data
received after the error is lost. Reception cannot be continued with bit OER set to 1,
and in synchronous mode, transmission cannot be continued either.
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Section 10 Serial Communication Interface
Bit 4
Framing Error (FER): Bit 4 indicates that a framing error has occurred during reception
in asynchronous mode.
Bit 4: FER
Description
0
Reception in progress or completed*
1
Clearing condition:
After reading FER = 1, cleared by writing 0 to FER
2
A framing error has occurred during reception*
1
(initial value)
Setting condition:
When the stop bit at the end of the receive data is checked for a value of 1 at
2
the end of reception, and the stop bit is 0*
Notes: 1. When bit RE in SCR3 is cleared to 0, bit FER is not affected and retains its previous
state.
2. Note that, in 2-stop-bit mode, only the first stop bit is checked for a value of 1, and the
second stop bit is not checked. When a framing error occurs the receive data is
transferred to RDR but bit RDRF is not set. Reception cannot be continued with bit FER
set to 1. In synchronous mode, neither transmission nor reception is possible when bit
FER is set to 1.
Bit 3
Parity Error (PER): Bit 3 indicates that a parity error has occurred during reception with
parity added in asynchronous mode.
Bit 3: PER
Description
0
Reception in progress or completed*
1
Clearing condition:
After reading PER = 1, cleared by writing 0 to PER
2
A parity error has occurred during reception*
1
(initial value)
Setting condition:
When the number of 1 bits in the receive data plus parity bit does not match the
parity designated by bit PM in the serial mode register (SMR)
Notes: 1. When bit RE in SCR3 is cleared to 0, bit PER is not affected and retains its previous
state.
2. Receive data in which it a parity error has occurred is still transferred to RDR, but bit
RDRF is not set. Reception cannot be continued with bit PER set to 1. In synchronous
mode, neither transmission nor reception is possible when bit PER is set to 1.
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Section 10 Serial Communication Interface
Bit 2
Transmit End (TEND): Bit 2 indicates that bit TDRE is set to 1 when the last bit of a
transmit character is sent.
Bit 2 is a read-only bit and cannot be modified.
Bit 2: TEND
0
Description
Transmission in progress
Clearing conditions:
• After reading TDRE = 1, cleared by writing 0 to TDRE
•
1
When data is written to TDR by an instruction
Transmission ended
(initial value)
Setting conditions:
• When bit TE in SCR3 is cleared to 0
•
When bit TDRE is set to 1 when the last bit of a transmit character is sent
Bit 1
Multiprocessor Bit Receive (MPBR): Bit 1 stores the multiprocessor bit in a receive
character during multiprocessor format reception in asynchronous mode.
Bit 1 is a read-only bit and cannot be modified.
Bit 1: MPBR
Description
0
Data in which the multiprocessor bit is 0 has been received*
1
Note:
(initial value)
Data in which the multiprocessor bit is 1 has been received
*
When bit RE is cleared to 0 in SCR3 with the multiprocessor format, bit MPBR is not
affected and retains its previous state.
Bit 0
Multiprocessor Bit Transfer (MPBT): Bit 0 stores the multiprocessor bit added to
transmit data when transmitting in asynchronous mode. The bit MPBT setting is invalid when
synchronous mode is selected, when the multiprocessor communication function is disabled, and
when not transmitting.
Bit 0: MPBT
Description
0
A 0 multiprocessor bit is transmitted
1
A 1 multiprocessor bit is transmitted
(initial value)
Rev. 6.00 Sep 12, 2006 page 303 of 526
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Section 10 Serial Communication Interface
Bit Rate Register (BRR)
Bit
7
6
5
4
3
2
1
0
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
BRR is an 8-bit register that designates the transmit/receive bit rate in accordance with the baud
rate generator operating clock selected by bits CKS1 and CKS0 of the serial mode register (SMR).
BRR can be read or written by the CPU at any time.
BRR is initialized to H'FF upon reset, and in standby, watch, subactive, or subsleep mode.
Table 10.6 shows examples of BRR settings in asynchronous mode. The values shown are for
active (high-speed) mode.
Table 10.6 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode)
OSC (MHz)
2
2.4576
4
4.194304
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
1
70
+0.03
1
86
+0.31
1
141
+0.03
1
148
–0.04
150
0
207
+0.16
0
255
0
1
103
+0.16
1
108
+0.21
300
0
103
+0.16
0
127
0
0
207
+0.16
0
217
+0.21
600
0
51
+0.16
0
63
0
0
103
+0.16
0
108
+0.21
1200
0
25
+0.16
0
31
0
0
51
+0.16
0
54
–0.70
2400
0
12
+0.16
0
15
0
0
25
+0.16
0
26
+1.14
4800
0
7
0
0
12
+0.16
0
13
–2.48
9600
0
3
0
0
6
–2.48
19200
0
1
0
31250
0
0
0
0
1
0
38400
0
0
0
Rev. 6.00 Sep 12, 2006 page 304 of 526
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Section 10 Serial Communication Interface
OSC (MHz)
4.9152
6
7.3728
8
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
1
174
–0.26
1
212
+0.03
2
64
+0.70
2
70
+0.03
150
1
127
0
1
155
+0.16
1
191
0
1
207
+0.16
300
0
255
0
1
77
+0.16
1
95
0
1
103
+0.16
600
0
127
0
0
155
+0.16
0
191
0
0
207
+0.16
1200
0
63
0
0
77
+0.16
0
95
0
0
103
+0.16
2400
0
31
0
0
38
+0.16
0
47
0
0
51
+0.16
4800
0
15
0
0
19
–2.34
0
23
0
0
25
+0.16
9600
0
7
0
0
9
–2.34
0
11
0
0
12
+0.16
19200
0
3
0
0
4
–2.34
0
5
0
31250
0
2
0
0
3
0
38400
0
1
0
0
2
0
n
N
Error
(%)
OSC (MHz)
9.8304
10
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
110
2
86
+0.31
2
88
–0.25
150
1
255
0
2
64
+0.16
300
1
127
0
1
129
+0.16
600
0
255
0
1
64
+0.16
1200
0
127
0
0
129
+0.16
2400
0
63
0
0
64
+0.16
4800
0
31
0
0
32
–1.36
9600
0
15
0
0
15
+1.73
19200
0
7
0
0
7
+1.73
31250
0
4
–1.70
0
4
0
38400
0
3
0
0
3
+1.73
Rev. 6.00 Sep 12, 2006 page 305 of 526
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Section 10 Serial Communication Interface
Notes: 1. The setting should be made so that the error is not more than 1%.
2. The value set in BRR is given by the following equation:
N=
OSC
× 106 – 1
(64 × 22n × B)
where
B:
N:
OSC:
n:
Bit rate (bit/s)
Baud rate generator BRR setting (0 ≤ N ≤ 255)
Value of φOSC (MHz)
Baud rate generator input clock number (n = 0, 1, 2, or 3)
(The relation between n and the clock is shown in table 10.7.)
Table 10.7 Relation between n and Clock
SMR Setting
n
Clock
CKS1
CKS0
0
φ
0
0
1
φ/4
0
1
2
φ16
1
0
3
φ/64
1
1
3. The error in table 10.6 is the value obtained from the following equation, rounded to
two decimal places.
Error (%) =
B (rate obtained from n, N, OSC) – R (bit rate in left-hand column in table 10.6)
× 100
R (bit rate in left-hand column in table 10.6)
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Section 10 Serial Communication Interface
Table 10.8 shows the maximum bit rate for each frequency. The values shown are for active (highspeed) mode.
Table 10.8 Maximum Bit Rate for Each Frequency (Asynchronous Mode)
Setting
OSC (MHz)
Maximum Bit Rate (bits/s)
n
N
2
31250
0
0
2.4576
38400
0
0
4
62500
0
0
4.194304
65536
0
0
4.9152
76800
0
0
6
93750
0
0
7.3728
115200
0
0
8
125000
0
0
9.8304
153600
0
0
10
156250
0
0
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Section 10 Serial Communication Interface
Table 10.9 shows examples of BRR settings in synchronous mode. The values shown are for
active (high-speed) mode.
Table 10.9 Examples of BRR Settings for Various Bit Rates (Synchronous Mode)
OSC (MHz)
2
4
8
10
Bit Rate
(bits/s)
n
N
n
N
n
N
n
N
110
250
1
249
2
124
2
249
500
1
124
1
249
2
124
1k
0
249
1
124
1
249
2.5 k
0
99
0
199
1
99
1
124
5k
0
49
0
99
0
199
0
249
10 k
0
24
0
49
0
99
0
124
25 k
0
9
0
19
0
39
0
49
50 k
0
4
0
9
0
19
0
24
100 k
0
4
0
9
250 k
0
0*
0
1
0
3
0
4
0
0*
0
1
0
0*
500 k
1M
2.5 M
Legend:
Blank: Cannot be set.
:
A setting can be made, but an error will result.
*:
Continuous transmission/reception is not possible.
Rev. 6.00 Sep 12, 2006 page 308 of 526
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Section 10 Serial Communication Interface
Note: The value set in BRR is given by the following equation:
N=
OSC
× 106 – 1
(8 × 22n × B)
where
B:
N:
OSC:
n:
Bit rate (bit/s)
Baud rate generator BRR setting (0 ≤ N ≤ 255)
Value of φOSC (MHz)
Baud rate generator input clock number (n = 0, 1, 2, or 3)
(The relation between n and the clock is shown in table 10.10.)
Table 10.10 Relation between n and Clock
SMR Setting
n
Clock
CKS1
CKS0
0
φ
0
0
1
φ/4
0
1
2
φ16
1
0
3
φ/64
1
1
10.3.3
Operation
SCI3 can perform serial communication in two modes: asynchronous mode in which
synchronization is provided character by character, and synchronous mode in which
synchronization is provided by clock pulses. The serial mode register (SMR) is used to select
asynchronous or synchronous mode and the data transfer format, as shown in table 10.11.
The clock source for SCI3 is determined by bit COM in SMR and bits CKE1 and CKE0 in SCR3,
as shown in table 10.12.
Asynchronous Mode
• Choice of 7- or 8-bit data length
• Choice of parity addition, multiprocessor bit addition, and addition of 1 or 2 stop bits. (The
combination of these parameters determines the data transfer format and the character length.)
• Framing error (FER), parity error (PER), overrun error (OER), and break detection during
reception
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Section 10 Serial Communication Interface
• Choice of internal or external clock as the clock source
When internal clock is selected: SCI3 operates on the baud rate generator clock, and a clock
with the same frequency as the bit rate can be output.
When external clock is selected: A clock with a frequency 16 times the bit rate must be input.
(The on-chip baud rate generator is not used.)
Synchronous Mode
• Data transfer format: Fixed 8-bit data length
• Overrun error (OER) detection during reception
• Choice of internal or external clock as the clock source
When internal clock is selected: SCI3 operates on the baud rate generator clock, and a serial
clock is output.
When external clock is selected: The on-chip baud rate generator is not used, and SCI3
operates on the input serial clock.
Table 10.11 SMR Settings and Corresponding Data Transfer Formats
SMR Setting
Communication Format
Bit 7: Bit 6: Bit 2: Bit 5: Bit 3:
COM CHR MP PE
STOP Mode
MultiproData Length cessor Bit
Parity Stop Bit
Bit
Length
0
8-bit data
No
0
0
0
0
1
1
Asynchronous
mode
No
2 bits
0
Yes
1
1
0
0
7-bit data
No
1
0
1
1
*
0
*
0
*
1
*
0
*
1
*
*
1 bit
2 bits
Yes
1
0
1 bit
2 bits
1
1
1 bit
1 bit
2 bits
Asynchronous 8-bit data
mode
(multiprocessor
7-bit data
format)
Yes
Synchronous
mode
No
No
1 bit
2 bits
1 bit
2 bits
Legend: * Don’t care
Rev. 6.00 Sep 12, 2006 page 310 of 526
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8-bit data
No
No
Section 10 Serial Communication Interface
Table 10.12 SMR and SCR3 Settings and Clock Source Selection
SMR
SCR3
Bit 7:
COM
Bit 1:
CKE1
Bit 0:
CKE0
0
0
0
1
1
1
0
0
0
Transmit/Receive Clock
Mode
Asynchronous
mode
Clock
Source
SCK3 Pin Function
Internal
I/O port (SCK3 pin not used)
Outputs clock with same frequency as
bit rate
External
Inputs clock with frequency 16 times
bit rate
Internal
Outputs serial clock
External
Inputs serial clock
1
0
Synchronous
mode
0
1
1
Reserved (Do not specify these combinations)
1
0
1
1
1
1
Interrupts and Continuous Transmission/Reception: SCI3 can carry out continuous reception
using RXI and continuous transmission using TXI. These interrupts are shown in table 10.13.
Table 10.13 Transmit/Receive Interrupts
Interrupt
Flags
Interrupt Request Conditions
Notes
RXI
RDRF
When serial reception is performed
normally and receive data is transferred
from RSR to RDR, bit RDRF is set to 1,
and if bit RIE is set to 1 at this time, RXI
is enabled and an interrupt is requested.
(See figure 10.7 (a).)
The RXI interrupt routine reads the
receive data transferred to RDR
and clears bit RDRF to 0.
Continuous reception can be
performed by repeating the above
operations until reception of the
next RSR data is completed.
When TSR is found to be empty (on
completion of the previous transmission)
and the transmit data placed in TDR is
transferred to TSR, bit TDRE is set to 1. If
bit TIE is set to 1 at this time, TXI is
enabled and an interrupt is requested.
(See figure 10.7 (b).)
The TXI interrupt routine writes the
next transmit data to TDR and
clears bit TDRE to 0. Continuous
transmission can be performed by
repeating the above operations until
the data transferred to TSR has
been transmitted.
When the last bit of the character in TSR
is transmitted, if bit TDRE is set to 1, bit
TEND is set to 1. If bit TEIE is set to 1 at
this time, TEI is enabled and an interrupt
is requested. (See figure 10.7 (c).)
TEI indicates that the next transmit
data has not been written to TDR
when the last bit of the transmit
character in TSR is sent.
RIE
TXI
TDRE
TIE
TEI
TEND
TEIE
Rev. 6.00 Sep 12, 2006 page 311 of 526
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Section 10 Serial Communication Interface
RDR
RDR
RSR (reception in progress)
↑
RSR (reception completed, transfer)
RXD pin
RXD pin
RDRF ← 1
(RXI request when RIE = 1)
RDRF = 0
Figure 10.7 (a) RDRF Setting and RXI Interrupt
TDR (next transmit data)
TDR
TSR (transmission in progress)
↓
TSR (transmission completed, transfer)
TXD pin
TXD pin
TDRE ← 1
(TXI request when TIE = 1)
TDRE = 0
Figure 10.7 (b) TDRE Setting and TXI Interrupt
TDR
TDR
TSR (transmission in progress)
TSR (reception completed)
↑
TXD pin
TXD pin
TEND = 0
TEND ← 1
(TEI request when TEIE = 1)
Figure 10.7 (c) TEND Setting and TEI Interrupt
Rev. 6.00 Sep 12, 2006 page 312 of 526
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Section 10 Serial Communication Interface
10.3.4
Operation in Asynchronous Mode
In asynchronous mode, serial communication is performed with synchronization provided
character by character. A start bit indicating the start of communication and one or two stop bits
indicating the end of communication are added to each character before it is sent.
SCI3 has separate transmission and reception units, allowing full-duplex communication. As the
transmission and reception units are both double-buffered, data can be written during transmission
and read during reception, making possible continuous transmission and reception.
Data Transfer Format: The general data transfer format in asynchronous communication is
shown in figure 10.8.
(LSB)
Serial
data
(MSB)
Start
bit
Transmit/receive data
1 bit
7 or 8 bits
1
Parity
bit
1 bit
or none
Stop
bit(s)
Mark
state
1 or 2 bits
One transfer data unit (character or frame)
Figure 10.8 Data Format in Asynchronous Communication
In asynchronous communication, the communication line is normally in the mark state (high
level). SCI3 monitors the communication line and when it detects a space (low level), identifies
this as a start bit and begins serial data communication.
One transfer data character consists of a start bit (low level), followed by transmit/receive data
(LSB-first format, starting from the least significant bit), a parity bit (high or low level), and
finally one or two stop bits (high level).
In asynchronous mode, synchronization is performed by the falling edge of the start bit during
reception. The data is sampled on the 8th pulse of a clock with a frequency 16 times the bit period,
so that the transfer data is latched at the center of each bit.
Rev. 6.00 Sep 12, 2006 page 313 of 526
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Section 10 Serial Communication Interface
Table 10.14 shows the 12 data transfer formats that can be set in asynchronous mode. The format
is selected by the settings in the serial mode register (SMR).
Table 10.14 Data Transfer Formats (Asynchronous Mode)
SMR Settings
Serial Data Transfer Format and Frame Length
CHR
PE
MP
STOP
1
2
0
0
0
0
S
8-bit data
STOP
0
0
0
1
S
8-bit data
STOP STOP
0
1
0
0
S
8-bit data
P
STOP
0
1
0
1
S
8-bit data
P
STOP STOP
1
0
0
0
S
7-bit data
STOP
1
0
0
1
S
7-bit data
STOP STOP
1
1
0
0
S
7-bit data
P
STOP
1
1
0
1
S
7-bit data
P
STOP STOP
0
*
1
0
S
8-bit data
MPB STOP
0
*
1
1
S
8-bit data
MPB STOP STOP
1
*
1
0
S
7-bit data
MPB STOP
1
*
1
1
S
7-bit data
MPB STOP STOP
Legend:
S:
Start bit
STOP: Stop bit
P:
Parity bit
MPB: Multiprocessor bit
*:
Don’t care
Rev. 6.00 Sep 12, 2006 page 314 of 526
REJ09B0326-0600
3
4
5
6
7
8
9
10
11
12
Section 10 Serial Communication Interface
Clock: Either an internal clock generated by the baud rate generator or an external clock input at
the SCK3 pin can be selected as the SCI3 transmit/receive clock. The selection is made by means
of bit COM in SMR and bits CKE1 and CKE0 in SCR3. See table 10.12 for details on clock
source selection.
When an external clock is input at the SCK3 pin, a clock with a frequency of 16 times the bit rate
used should be input.
When SCI3 operates on an internal clock, the clock can be output at the SCK3 pin. In this case the
frequency of the output clock is the same as the bit rate, and the phase is such that the clock rises
at the center of each bit of transmit/receive data, as shown in figure 10.9.
Clock
Serial
data
0
D0
D1
D2
D3
D4
D5
D6
D7
0/1
1
1
1 character (1 frame)
Figure 10.9 Phase Relationship between Output Clock and Transfer Data
(Asynchronous Mode) (8-Bit Data, Parity, 2 Stop Bits)
Data Transfer Operations
SCI3 Initialization: Before data is transferred on SCI3, bits TE and RE in SCR3 must first be
cleared to 0, and then SCI3 must be initialized as follows.
Note: If the operation mode or data transfer format is changed, bits TE and RE must first be
cleared to 0.
When bit TE is cleared to 0, bit TDRE is set to 1.
Note that the RDRF, PER, FER, and OER flags and the contents of RDR are retained
when RE is cleared to 0.
When an external clock is used in asynchronous mode, the clock should not be stopped
during operation, including initialization. When an external clock is used in synchronous
mode, the clock should not be supplied during operation, including initialization.
Rev. 6.00 Sep 12, 2006 page 315 of 526
REJ09B0326-0600
Section 10 Serial Communication Interface
Figure 10.10 shows an example of a flowchart for initializing SCI3.
Start
Clear bits TE and
RE to 0 in SCR3
1
Set bits CKE1
and CKE0
2
Set data transfer
format in SMR
3
Set value in BRR
1. Set clock selection in SCR3. Be sure to
clear the other bits to 0. If clock output
is selected in asynchronous mode, the
clock is output immediately after setting
bits CKE1 and CKE0. If clock output is
selected for reception in synchronous
mode, the clock is output immediately
after bits CKE1, CKE0, and RE are
set to 1.
2. Set the data transfer format in the serial
mode register (SMR).
Wait
Has 1-bit period
elapsed?
No
Yes
4
Set bit TE or RE to
1 in SCR3, set bits
RIE, TIE, TEIE, and
MPIE as necessary,
and when transmitting
(TE = 1), set bit TXD
to 1 in PMR7
End
3. Write the value corresponding to the
transfer rate in BRR. This operation is
not necessary when an external clock
is selected.
4. Wait for at least the interval required to
transmit or receive one bit, then set TE or
RE in the serial control register (SCR3).
Setting RE enables the RxD pin to be
used,
and when transmitting, setting bit TXD in
PMR7 enables the TXD output pin to be
used.
Also set the RIE, TIE, TEIE, and MPIE bits
as necessary to enable interrupts. The
initial states are the mark transmit state
and the idle receive state (waiting for a
start bit).
Figure 10.10 Example of SCI3 Initialization Flowchart
Rev. 6.00 Sep 12, 2006 page 316 of 526
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Section 10 Serial Communication Interface
Transmitting: Figure 10.11 shows an example of a flowchart for data transmission. This
procedure should be followed for data transmission after initializing SCI3.
Start
1
Read bit TDRE
in SSR
No
TDRE = 1?
2. When continuing data transmission,
be sure to read TDRE = 1 to confirm that
a write can be performed before writing
data to TDR. When data is written to
TDR, bit TDRE is cleared to 0
automatically.
Yes
Write transmit
data to TDR
2
Continue data
transmission?
1. Read the serial status register (SSR)
and check that bit TDRE is set to 1,
then write transmit data to the transmit
data register (TDR). When data is
written to TDR, bit TDRE is cleared to 0
automatically.
Yes
No
3. If a break is to be output when data
transmission ends, set the port PCR to 1
and clear the port PDR to 0, then clear bit
TXD in PMR7 and bit TE in SCR3 to 0.
Read bit TEND
in SSR
TEND = 1?
No
Yes
3
Break output?
No
Yes
Set PDR = 0,
PCR = 1
Clear bit TE to 0
in SCR3
End
Figure 10.11 Example of Data Transmission Flowchart (Asynchronous Mode)
Rev. 6.00 Sep 12, 2006 page 317 of 526
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Section 10 Serial Communication Interface
SCI3 operates as follows when transmitting data.
SCI3 monitors bit TDRE in SSR, and when it is cleared to 0, recognizes that data has been written
to TDR and transfers data from TDR to TSR. It then sets bit TDRE to 1 and starts transmitting. If
bit TIE in SCR3 is set to 1 at this time, a TXI request is made.
Serial data is transmitted from the TXD pin using the relevant data transfer format in table 10.14.
When the stop bit is sent, SCI3 checks bit TDRE. If bit TDRE is cleared to 0, SCI3 transfers data
from TDR to TSR, and when the stop bit has been sent, starts transmission of the next frame. If bit
TDRE is set to 1, bit TEND in SSR is set to 1, and the mark state, in which 1s are transmitted, is
established after the stop bit has been sent. If bit TEIE in SCR3 is set to 1 at this time, a TEI
request is made.
Figure 10.12 shows an example of the operation when transmitting in asynchronous mode.
Start
bit
Serial
data
1
0
Transmit
data
D0
D1
Parity Stop Start
bit
bit bit
D7
0/1
1
0
1 frame
Transmit
data
D0
D1
D7
Parity Stop
bit
bit
0/1
1
1 frame
TDRE
TEND
LSI
TXI request
operation
TDRE
cleared to 0
User
processing
Data written
to TDR
TXI request
TEI request
Figure 10.12 Example of Operation when Transmitting in Asynchronous Mode
(8-Bit Data, Parity, 1 Stop Bit)
Rev. 6.00 Sep 12, 2006 page 318 of 526
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Mark
state
1
Section 10 Serial Communication Interface
Receiving: Figure 10.13 shows an example of a flowchart for data reception. This procedure
should be followed for data reception after initializing SCI3.
Start
1
Read bits OER,
PER, FER in SSR
OER + PER
+ FER = 1?
1. Read bits OER, PER, and FER in the
serial status register (SSR) to determine
if there is an error. If a receive error has
occurred, execute receive error
processing.
Yes
2. Read SSR and check that bit RDRF is
set to 1. If it is, read the receive data
in RDR. When the RDR data is read,
bit RDRF is cleared to 0 automatically.
No
2
Read bit RDRF
in SSR
RDRF = 1?
3.
No
Yes
Read receive
data in RDR
4
3
Continue data
reception?
Receive error
processing
When continuing data reception, finish
reading of bit RDRF and RDR before
receiving the stop bit of the current
frame. When the data in RDR is read,
bit RDRF is cleared to 0 automatically.
4. If a receive error has occurred, read bits
OER, PER, and FER in SSR to identify
the error, and after carrying out the
necessary error processing, ensure that
bits OER, PER, and FER are all cleared
to 0. Reception cannot be resumed if
any of these bits is set to 1. In the case
of a framing error, a break can be
detected by reading the value of the RXD
pin.4.
Yes
No
(A)
Clear bit RE to
0 in SCR3
End
Figure 10.13 Example of Data Reception Flowchart (Asynchronous Mode)
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Section 10 Serial Communication Interface
4
Start receive
error processing
Overrun error
processing
OER = 1?
Yes
No
FER = 1?
Break?
Yes
No
No
PER = 1?
Yes
4. If a receive error has
occurred, read bits OER,
PER, and FER in SSR to
identify the error, and after
carrying out the necessary
error processing, ensure
that bits OER, PER, and
FER are all cleared to 0.
Yes
Reception cannot be
resumed if any of these
bits is set to 1. In the case
of a framing error, a break
can be detected by reading
the value of the RXD pin.
Framing error
processing
No
Clear bits OER, PER,
FER to 0 in SSR
Parity error
processing
(A)
End of receive
error processing
Figure 10.13 Example of Data Reception Flowchart (Asynchronous Mode) (cont)
SCI3 operates as follows when receiving data.
SCI3 monitors the communication line, and when it detects a 0 start bit, performs internal
synchronization and begins reception. Reception is carried out in accordance with the relevant data
transfer format in table 10.14. The received data is first placed in RSR in LSB-to-MSB order, and
then the parity bit and stop bit(s) are received. SCI3 then carries out the following checks.
• Parity check
SCI3 checks that the number of 1 bits in the receive data conforms to the parity (odd or even)
set in bit PM in the serial mode register (SMR).
• Stop bit check
SCI3 checks that the stop bit is 1. If two stop bits are used, only the first is checked.
• Status check
SCI3 checks that bit RDRF is set to 1, indicating that the receive data can be transferred from
RSR to RDR.
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Section 10 Serial Communication Interface
If no receive error is found in the above checks, bit RDRF is set to 1, and the receive data is stored
in RDR. If bit RIE is set to 1 in SCR3, an RXI interrupt is requested. If the error checks identify a
receive error, bit OER, PER, or FER is set to 1 depending on the kind of error. Bit RDRF retains
its state prior to receiving the data. If bit RIE is set to 1 in SCR3, an ERI interrupt is requested.
Table 10.15 shows the conditions for detecting a receive error, and receive data processing.
Note: No further receive operations are possible while a receive error flag is set. Bits OER, FER,
PER, and RDRF must therefore be cleared to 0 before resuming reception.
Table 10.15 Receive Error Detection Conditions and Receive Data Processing
Receive Error
Abbreviation
Detection Conditions
Received Data Processing
Overrun error
OER
When the next date receive
operation is completed while bit
RDRF is still set to 1 in SSR
Receive data is not transferred
from RSR to RDR
Framing error
FER
When the stop bit is 0
Receive data is transferred
from RSR to RDR
Parity error
PER
When the parity (odd or even)
set in SMR is different from that
of the received data
Receive data is transferred
from RSR to RDR
Figure 10.14 shows an example of the operation when receiving in asynchronous mode.
Start
bit
Serial
data
1
0
Receive
data
D0
D1
D7
Parity Stop Start
bit
bit bit
0/1
1
0
1 frame
Receive
data
D0
D1
Parity Stop
bit
bit
D7
0/1
0
Mark state
(idle state)
1
1 frame
RDRF
FER
LSI
operation
RXI request
User
processing
RDRF
cleared to 0
RDR data read
0 start bit
detected
ERI request in
response to
framing error
Framing error
processing
Figure 10.14 Example of Operation when Receiving in Asynchronous Mode
(8-Bit Data, Parity, 1 Stop Bit)
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Section 10 Serial Communication Interface
10.3.5
Operation in Synchronous Mode
In synchronous mode, SCI3 transmits and receives data in synchronization with clock pulses. This
mode is suitable for high-speed serial communication.
SCI3 has separate transmission and reception units, allowing full-duplex communication with a
shared clock.
As the transmission and reception units are both double-buffered, data can be written during
transmission and read during reception, making possible continuous transmission and reception.
Data Transfer Format: The general data transfer format in synchronous communication is shown
in figure 10.15.
*
*
Serial
clock
LSB
Serial
data
Bit 0
MSB
Bit 1
Bit 2
Don't
care
Bit 3
Bit 4
Bit 5
Bit 6
8 bits
Bit 7
Don't
care
One transfer data unit (character or frame)
Note: * High level except in continuous transmission/reception
Figure 10.15 Data Format in Synchronous Communication
In synchronous communication, data on the communication line is output from one falling edge of
the serial clock until the next falling edge. Data confirmation is guaranteed at the rising edge of the
serial clock.
One transfer data character begins with the LSB and ends with the MSB. After output of the MSB,
the communication line retains the MSB state.
When receiving in synchronous mode, SCI3 latches receive data at the rising edge of the serial
clock.
The data transfer format uses a fixed 8-bit data length.
Parity and multiprocessor bits cannot be added.
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Section 10 Serial Communication Interface
Clock: Either an internal clock generated by the baud rate generator or an external clock input at
the SCK3 pin can be selected as the SCI3 serial clock. The selection is made by means of bit COM
in SMR and bits CKE1 and CKE0 in SCR3. See table 10.12 for details on clock source selection.
When SCI3 operates on an internal clock, the serial clock is output at the SCK3 pin. Eight pulses
of the serial clock are output in transmission or reception of one character, and when SCI3 is not
transmitting or receiving, the clock is fixed at the high level.
Data Transfer Operations
SCI3 Initialization: Data transfer on SCI3 first of all requires that SCI3 be initialized as described
in 10.3.4, SCI3 Initialization, and shown in figure 10.10.
Transmitting: Figure 10.16 shows an example of a flowchart for data transmission. This
procedure should be followed for data transmission after initializing SCI3.
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Section 10 Serial Communication Interface
Start
1
Read bit TDRE
in SSR
No
TDRE = 1?
2. When continuing data transmission, be
sure to read TDRE = 1 to confirm that
a write can be performed before writing
data to TDR. When data is written to
TDR, bit TDRE is cleared to 0 automatically.
Yes
Write transmit
data to TDR
2
Continue data
transmission?
1. Read the serial status register (SSR) and
check that bit TDRE is set to 1, then write
transmit data to the transmit data register
(TDR). When data is written to TDR, bit
TDRE is cleared to 0 automatically, the
clock is output, and data transmission is
started.
Yes
No
Read bit TEND
in SSR
TEND = 1?
No
Yes
Clear bit TE to 0
in SCR3
End
Figure 10.16 Example of Data Transmission Flowchart (Synchronous Mode)
SCI3 operates as follows when transmitting data.
SCI3 monitors bit TDRE in SSR, and when it is cleared to 0, recognizes that data has been written
to TDR and transfers data from TDR to TSR. It then sets bit TDRE to 1 and starts transmitting. If
bit TIE in SCR3 is set to 1 at this time, a TXI request is made.
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Section 10 Serial Communication Interface
When clock output mode is selected, SCI3 outputs 8 serial clock pulses. When an external clock is
selected, data is output in synchronization with the input clock.
Serial data is transmitted from the TXD pin in order from the LSB (bit 0) to the MSB (bit 7).
When the MSB (bit 7) is sent, checks bit TDRE. If bit TDRE is cleared to 0, SCI3 transfers data
from TDR to TSR, and starts transmission of the next frame. If bit TDRE is set to 1, SCI3 sets bit
TEND to 1 in SSR, and after sending the MSB (bit 7), retains the MSB state. If bit TEIE in SCR3
is set to 1 at this time, a TEI request is made.
After transmission ends, the SCK3 pin is fixed at the high level.
Note: Transmission is not possible if an error flag (OER, FER, or PER) that indicates the data
reception status is set to 1. Check that these error flags (OER, FER, and PER) are all
cleared to 0 before a transmit operation.
Figure 10.17 shows an example of the operation when transmitting in synchronous mode.
Serial
clock
Serial
data
Bit 0
Bit 1
Bit 7
1 frame
Bit 0
Bit 1
Bit 6
Bit 7
1 frame
TDRE
TEND
LSI
TXI request
operation
TDRE cleared
to 0
User
processing
Data written
to TDR
TXI request
TEI request
Figure 10.17 Example of Operation when Transmitting in Synchronous Mode
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Section 10 Serial Communication Interface
Receiving: Figure 10.18 shows an example of a flowchart for data reception. This procedure
should be followed for data reception after initializing SCI3.
Start
1
Read bit OER
in SSR
1. Read bit OER in the serial status register
(SSR) to determine if there is an error.
If an overrun error has occurred, execute
overrun error processing.
Yes
OER = 1?
2. Read SSR and check that bit RDRF is
set to 1. If it is, read the receive data in
RDR. When the RDR data is read, bit
RDRF is cleared to 0 automatically.
No
2
Read bit RDRF
in SSR
RDRF = 1?
3. When continuing data reception, finish
reading of bit RDRF and RDR before
receiving the MSB (bit 7) of the current
frame. When the data in RDR is read,
bit RDRF is cleared to 0 automatically.
No
4. If an overrun error has occurred, read bit
OER in SSR, and after carrying out the
necessary error processing, clear bit OER
to 0. Reception cannot be resumed if bit
OER is set to 1.
Yes
Read receive
data in RDR
4
3
Continue data
reception?
Overrun error
processing
Yes
No
Clear bit RE to
0 in SCR3
End
4
Start overrun
error processing
Overrun error
processing
Clear bit OER to
0 in SSR
End of overrun
error processing
Figure 10.18 Example of Data Reception Flowchart (Synchronous Mode)
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Section 10 Serial Communication Interface
SCI3 operates as follows when receiving data.
SCI3 performs internal synchronization and begins reception in synchronization with the serial
clock input or output.
The received data is placed in RSR in LSB-to-MSB order.
After the data has been received, SCI3 checks that bit RDRF is set to 0, indicating that the receive
data can be transferred from RSR to RDR.
If this check shows that there is no overrun error, bit RDRF is set to 1, and the receive data is
stored in RDR. If bit RIE is set to 1 in SCR3, an RXI interrupt is requested. If the check identifies
an overrun error, bit OER is set to 1.
Bit RDRF remains set to 1. If bit RIE is set to 1 in SCR3, an ERI interrupt is requested.
See table 10.15 for the conditions for detecting an overrun error, and receive data processing.
Note: No further receive operations are possible while a receive error flag is set. Bits OER, FER,
PER, and RDRF must therefore be cleared to 0 before resuming reception.
Figure 10.19 shows an example of the operation when receiving in synchronous mode.
Serial
clock
Serial
data
Bit 7
Bit 0
Bit 7
Bit 0
Bit 1
1 frame
Bit 6
Bit 7
1 frame
RDRF
OER
LSI
operation
User
processing
RXI request
RDRE cleared
to 0
RDR data read
RXI request
ERI request in
response to
overrun error
RDR data has
not been read
(RDRF = 1)
Overrun error
processing
Figure 10.19 Example of Operation when Receiving in Synchronous Mode
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Section 10 Serial Communication Interface
Simultaneous Transmit/Receive: Figure 10.20 shows an example of a flowchart for a
simultaneous transmit/receive operation. This procedure should be followed for simultaneous
transmission/reception after initializing SCI3.
Start
1
Read bit TDRE
in SSR
1. Read the serial status register (SSR) and
check that bit TDRE is set to 1, then write
transmit data to the transmit data register
(TDR). When data is written to TDR, bit
TDRE is cleared to 0 automatically.
No
TDRE = 1?
2. Read SSR and check that bit RDRF is set
to 1. If it is, read the receive data in RDR.
When the RDR data is read, bit RDRF is
cleared to 0 automatically.
Yes
Write transmit
data to TDR
3. When continuing data transmission/reception,
finish reading of bit RDRF and RDR before
receiving the MSB (bit 7) of the current frame.
Before transmitting the MSB (bit 7) of the current
frame, also read TDRE = 1 to confirm that a
write can be performed, then write data to TDR.
When data is written to TDR, bit TDRE is cleared
to 0 automatically, and when the data in RDR is
read, bit RDRF is cleared to 0 automatically.
Read bit OER
in SSR
Yes
OER = 1?
4. If an overrun error has occurred, read bit OER
in SSR, and after carrying out the necessary
error processing, clear bit OER to 0. Transmission
and reception cannot be resumed if bit OER is
set to 1. See figure 10.18 for details on overrun
error processing.
No
2
Read bit RDRF
in SSR
No
RDRF = 1?
Yes
Read receive data
in RDR
4
3
Continue data
transmission/reception?
Overrun error
processing
Yes
No
Clear bits TE and
RE to 0 in SCR
End
Figure 10.20 Example of Simultaneous Data Transmission/Reception Flowchart
(Synchronous Mode)
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Section 10 Serial Communication Interface
Notes: 1. When switching from transmission to simultaneous transmission/reception, check that
SCI3 has finished transmitting and that bits TDRE and TEND are set to 1, clear bit TE
to 0, and then set bits TE and RE to 1 simultaneously with a single instruction.
2. When switching from reception to simultaneous transmission/reception, check that
SCI3 has finished receiving, clear bit RE to 0, then check that bit RDRF and the error
flags (OER, FER, and PER) are cleared to 0, and finally set bits TE and RE to 1
simultaneously with a single instruction.
10.3.6
Multiprocessor Communication Function
The multiprocessor communication function enables data to be exchanged among a number of
processors on a shared communication line. Serial data communication is performed in
asynchronous mode using the multiprocessor format (in which a multiprocessor bit is added to the
transfer data).
In multiprocessor communication, each receiver is assigned its own ID code. The serial
communication cycle consists of two cycles, an ID transmission cycle in which the receiver is
specified, and a data transmission cycle in which the transfer data is sent to the specified receiver.
These two cycles are differentiated by means of the multiprocessor bit, 1 indicating an ID
transmission cycle, and 0, a data transmission cycle.
The sender first sends transfer data with a 1 multiprocessor bit added to the ID code of the receiver
it wants to communicate with, and then sends transfer data with a 0 multiprocessor bit added to the
transmit data. When a receiver receives transfer data with the multiprocessor bit set to 1, it
compares the ID code with its own ID code, and if they are the same, receives the transfer data
sent next. If the ID codes do not match, it skips the transfer data until data with the multiprocessor
bit set to 1 is sent again.
In this way, a number of processors can exchange data among themselves.
Figure 10.21 shows an example of communication between processors using the multiprocessor
format.
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Section 10 Serial Communication Interface
Sender
Communication line
Serial
data
Receiver A
Receiver B
Receiver C
Receiver D
(ID = 01)
(ID = 02)
(ID = 03)
(ID = 04)
H'01
(MPB = 1)
ID transmission cycle
(specifying the receiver)
H'AA
(MPB = 0)
Data transmission cycle
(sending data to the receiver
specified buy the ID)
MPB: Multiprocessor bit
Figure 10.21 Example of Inter-Processor Communication Using Multiprocessor Format
(Sending Data H'AA to Receiver A)
There is a choice of four data transfer formats. If a multiprocessor format is specified, the parity
bit specification is invalid. See table 10.14 for details.
For details on the clock used in multiprocessor communication, see section 10.3.4, Operation in
Asynchronous Mode.
Multiprocessor Transmitting: Figure 10.22 shows an example of a flowchart for multiprocessor
data transmission. This procedure should be followed for multiprocessor data transmission after
initializing SCI3.
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Section 10 Serial Communication Interface
Start
1
Read bit TDRE
in SSR
TDRE = 1?
No
2. When continuing data transmission, be
sure to read TDRE = 1 to confirm that a
write can be performed before writing data
to TDR. When data is written to TDR, bit
TDRE is cleared to 0 automatically.
Yes
Set bit MPBT
in SSR
3. If a break is to be output when data
transmission ends, set the port PCR to 1
and clear the port PDR to 0, then clear bit
TE in SCR3 to 0.
Write transmit
data to TDR
2
Continue data
transmission?
1. Read the serial status register (SSR)
and check that bit TDRE is set to 1,
then set bit MPBT in SSR to 0 or 1 and
write transmit data to the transmit data
register (TDR). When data is written to
TDR, bit TDRE is cleared to 0 automatically.
Yes
No
Read bit TEND
in SSR
TEND = 1?
No
Yes
3
Break output?
No
Yes
Set PDR = 0,
PCR = 1
Clear bit TE to
0 in SCR3
End
Figure 10.22 Example of Multiprocessor Data Transmission Flowchart
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Section 10 Serial Communication Interface
SCI3 operates as follows when transmitting data.
SCI3 monitors bit TDRE in SSR, and when it is cleared to 0, recognizes that data has been written
to TDR and transfers data from TDR to TSR. It then sets bit TDRE to 1 and starts transmitting. If
bit TIE in SCR3 is set to 1 at this time, a TXI request is made.
Serial data is transmitted from the TXD pin using the relevant data transfer format in table 10.14.
When the stop bit is sent, SCI3 checks bit TDRE. If bit TDRE is cleared to 0, SCI3 transfers data
from TDR to TSR, and when the stop bit has been sent, starts transmission of the next frame. If bit
TDRE is set to 1, bit TEND in SSR is set to 1, and the mark state, in which 1s are transmitted, is
established after the stop bit has been sent. If bit TEIE in SCR3 is set to 1 at this time, a TEI
request is made.
Figure 10.23 shows an example of the operation when transmitting using the multiprocessor
format.
Start
bit
Serial
data
1
0
Transmit
data
D0
D1
MPB
D7
0/1
Stop Start
bit bit
1
0
1 frame
Transmit
data
D0
D1
D7
MPB
Stop
bit
Mark
state
0/1
1
1
1 frame
TDRE
TEND
LSI
TXI request
operation
TDRE
cleared to 0
User
processing
Data written
to TDR
TXI request
TEI request
Figure 10.23 Example of Operation when Transmitting using Multiprocessor Format
(8-Bit Data, Multiprocessor Bit, 1 Stop Bit)
Multiprocessor Receiving: Figure 10.24 shows an example of a flowchart for multiprocessor data
reception. This procedure should be followed for multiprocessor data reception after initializing
SCI3.
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Section 10 Serial Communication Interface
Start
1
2
1. Set bit MPIE to 1 in SCR3.
Set bit MPIE to 1
in SCR3
2. Read bits OER and FER in the serial
status register (SSR) to determine if
there is an error. If a receive error has
occurred, execute receive error processing.
Read bits OER
and FER in SSR
OER + FER = 1?
3. Read SSR and check that bit RDRF is
set to 1. If it is, read the receive data in
RDR and compare it with this receiver's
own ID. If the ID is not this receiver's,
set bit MPIE to 1 again. When the RDR
data is read, bit RDRF is cleared to 0
automatically.
Yes
No
3
Read bit RDRF
in SSR
RDRF = 1?
4. Read SSR and check that bit RDRF is
set to 1, then read the data in RDR.
No
5. If a receive error has occurred, read bits
OER and FER in SSR to identify the error,
and after carrying out the necessary error
processing, ensure that bits OER and FER
are both cleared to 0. Reception cannot be
resumed if either of these bits is set to 1.
In the case of a framing error, a break can
be detected by reading the value of the
RXD pin.
Yes
Read receive
data in RDR
Own ID?
No
Yes
Read bits OER
and FER in SSR
OER + FER = 1?
Yes
No
4
Read bit RDRF
in SSR
RDRF = 1?
No
Yes
Read receive
data in RDR4
Continue data
reception?
No
5
Receive error
processing
Yes
(A)
Clear bit RE to
0 in SCR3
End
Figure 10.24 Example of Multiprocessor Data Reception Flowchart
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Section 10 Serial Communication Interface
Start receive
error processing
Overrun error
processing
OER = 1?
Yes
Yes
No
FER = 1?
Break?
Yes
No
No
Framing error
processing
Clear bits OER and
FER to 0 in SSR
End of receive
error processing
(A)
Figure 10.24 Example of Multiprocessor Data Reception Flowchart (cont)
Figure 10.25 shows an example of the operation when receiving using the multiprocessor format.
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Section 10 Serial Communication Interface
Start
bit
Serial
data
1
0
Receive
data (ID1)
D0
D1
D7
MPB
1
Stop Start
bit bit
1
0
Receive data
(Data1)
D0
D1
D7
MPB
Stop
bit
Mark state
(idle state)
0
1
1
1 frame
1 frame
MPIE
RDRF
RDR
value
ID1
LSI
operation
RXI request
MPIE cleared
to 0
RDRF cleared
to 0
User
processing
No RXI request
RDR retains
previous state
RDR data read
When data is not
this receiver's ID,
MPIE is set to 1
again
(a) When data does not match this receiver's ID
Start
bit
Serial
data
1
0
Receive
data (ID2)
D0
D1
D7
MPB
1
Stop Start
bit bit
1
0
Receive data
(Data2)
D0
1 frame
D1
D7
MPB
Stop
bit
Mark state
(idle state)
0
1
1
1 frame
MPIE
RDRF
RDR
value
LSI
operation
User
processing
ID1
ID2
RXI request
MPIE cleared
to 0
RDRF cleared
to 0
RDR data read
Data2
RXI request
When data is
this receiver's
ID, reception
is continued
RDRF cleared
to 0
RDR data read
MPIE set to 1
again
(b) When data matches this receiver's ID
Figure 10.25 Example of Operation when Receiving using Multiprocessor Format
(8-Bit Data, Multiprocessor Bit, 1 Stop Bit)
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Section 10 Serial Communication Interface
10.3.7
Interrupts
SCI3 can generate six kinds of interrupts: transmit end, transmit data empty, receive data full, and
three receive error interrupts (overrun error, framing error, and parity error). These interrupts have
the same vector address.
The various interrupt requests are shown in table 10.16.
Table 10.16 SCI3 Interrupt Requests
Interrupt
Abbreviation
Interrupt Request
Vector Address
RXI
Interrupt request initiated by receive data full flag (RDRF)
H'002A
TXI
Interrupt request initiated by transmit data empty flag (TDRE)
TEI
Interrupt request initiated by transmit end flag (TEND)
ERI
Interrupt request initiated by receive error flag (OER, FER,
PER)
Each interrupt request can be enabled or disabled by means of bits TIE and RIE in SCR3.
When bit TDRE is set to 1 in SSR, a TXI interrupt is requested. When bit TEND is set to 1 in
SSR, a TEI interrupt is requested. These two interrupts are generated during transmission.
The initial value of bit TDRE in SSR is 1. Therefore, if the transmit data empty interrupt request
(TXI) is enabled by setting bit TIE to 1 in SCR3 before transmit data is transferred to TDR, a TXI
interrupt will be requested even if the transmit data is not ready.
Also, the initial value of bit TEND in SSR is 1. Therefore, if the transmit end interrupt request
(TEI) is enabled by setting bit TEIE to 1 in SCR3 before transmit data is transferred to TDR, a TEI
interrupt will be requested even if the transmit data has not been sent.
Effective use of these interrupt requests can be made by having processing that transfers transmit
data to TDR carried out in the interrupt service routine.
To prevent the generation of these interrupt requests (TXI and TEI), on the other hand, the enable
bits for these interrupt requests (bits TIE and TEIE) should be set to 1 after transmit data has been
transferred to TDR.
When bit RDRF is set to 1 in SSR, an RXI interrupt is requested, and if any of bits OER, PER, and
FER is set to 1, an ERI interrupt is requested. These two interrupt requests are generated during
reception.
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Section 10 Serial Communication Interface
For further details, see section 3.3, Interrupts.
10.3.8
Application Notes
The following points should be noted when using SCI3.
1. Relation between writes to TDR and bit TDRE
Bit TDRE in the serial status register (SSR) is a status flag that indicates that data for serial
transmission has not been prepared in TDR. When data is written to TDR, bit TDRE is cleared
to 0 automatically. When SCI3 transfers data from TDR to TSR, bit TDRE is set to 1.
Data can be written to TDR irrespective of the state of bit TDRE, but if new data is written to
TDR while bit TDRE is cleared to 0, the data previously stored in TDR will be lost of it has
not yet been transferred to TSR. Accordingly, to ensure that serial transmission is performed
dependably, you should first check that bit TDRE is set to 1, then write the transmit data to
TDR once only (not two or more times).
2. Operation when a number of receive errors occur simultaneously
If a number of receive errors are detected simultaneously, the status flags in SSR will be set to
the states shown in table 10.17. If an overrun error is detected, data transfer from RSR to RDR
will not be performed, and the receive data will be lost.
Table 10.17 SSR Status Flag States and Receive Data Transfer
SSR Status Flags
RDRF* OER
FER
PER
Receive Data Transfer
(RSR → RDR)
Receive Error Status
1
1
0
0
×
Overrun error
0
0
1
0
O
Framing error
0
0
0
1
O
Parity error
1
1
1
0
×
Overrun error + framing error
1
1
0
1
×
Overrun error + parity error
0
0
1
1
O
Framing error + parity error
1
1
1
1
×
Overrun error + framing error + parity error
Legend:
O: Receive data is transferred from RSR to RDR.
× : Receive data is not transferred from RSR to RDR.
Note: * Bit RDRF retains its state prior to data reception.
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Section 10 Serial Communication Interface
3. Break detection and processing
When a framing error is detected, a break can be detected by reading the value of the RXD pin
directly. In a break, the input from the RXD pin becomes all 0s, with the result that bit FER is
set and bit PER may also be set.
SCI3 continues the receive operation even after receiving a break. Note, therefore, that even
though bit FER is cleared to 0 it will be set to 1 again.
4. Mark state and break detection
When bit TE is cleared to 0, the TXD pin functions as an I/O port whose input/output direction
and level are determined by PDR and PCR. This fact can be used to set the TXD pin to the
mark state, or to detect a break during transmission.
To keep the communication line in the mark state (1 state) until bit TE is set to 1, set PCR = 1
and PDR = 1. Since bit TE is cleared to 0 at this time, the TXD pin functions as an I/O port
and 1 is output.
To detect a break during transmission, clear bit TE to 0 after setting PCR = 1 and PDR = 0.
When bit TE is cleared to 0, the transmission unit is initialized regardless of the current
transmission state, the TXD pin functions as an I/O port, and 0 is output from the TXD pin.
5. Receive error flags and transmit operation (synchronous mode only)
When a receive error flag (OER, PER, or FER) is set to 1, transmission cannot be started even
if bit TDRE is cleared to 0. The receive error flags must be cleared to 0 before starting
transmission.
Note also that receive error flags cannot be cleared to 0 even if bit RE is cleared to 0.
6. Receive data sampling timing and receive margin in asynchronous mode
In asynchronous mode, SCI3 operates on a basic clock with a frequency 16 times the transfer
rate. When receiving, SCI3 performs internal synchronization by sampling the falling edge of
the start bit with the basic clock. Receive data is latched internally at the 8th rising edge of the
basic clock. This is illustrated in figure 10.26.
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Section 10 Serial Communication Interface
16 clock pulses
8 clock pulses
0
7
15 0
7
15 0
Internal
basic clock
Receive data
(RXD)
Start bit
D0
D1
Synchronization
sampling timing
Data sampling
timing
Figure 10.26 Receive Data Sampling Timing in Asynchronous Mode
Consequently, the receive margin in asynchronous mode can be expressed as shown in
equation (1).
1
D – 0.5
M = (0.5 –
)–
– (L – 0.5) F × 100 . . . . . . . . . . . . . . . Equation (1)
2N
N
where
M: Receive margin (%)
N: Ratio of bit rate to clock (N = 16)
D: Clock duty (D = 0.5 to 1.0)
L: Frame length (L = 9 to 12)
F: Absolute value of clock frequency deviation
Substituting 0 for F (absolute value of clock frequency deviation) and 0.5 for D (clock duty) in
equation (1), a receive margin of 46.875% is given by equation (2).
When D = 0.5 and F = 0,
M = {0.5 – 1/(2 × 16)} × 100 [%] = 46.875%
. . . . . . . . . . . . . . . . . . Equation (2)
However, this is only a computed value, and a margin of 20% to 30% should be allowed when
carrying out system design.
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Section 10 Serial Communication Interface
7. Relation between RDR reads and bit RDRF
In a receive operation, SCI3 continually checks the RDRF flag. If bit RDRF is cleared to 0
when reception of one frame ends, normal data reception is completed. If bit RDRF is set to 1,
this indicates that an overrun error has occurred.
When the contents of RDR are read, bit RDRF is cleared to 0 automatically. Therefore, if bit
RDR is read more than once, the second and subsequent read operations will be performed
while bit RDRF is cleared to 0. Note that, when an RDR read is performed while bit RDRF is
cleared to 0, if the read operation coincides with completion of reception of a frame, the next
frame of data may be read. This is illustrated in figure 10.27.
Communication
line
Frame 1
Frame 2
Frame 3
Data 1
Data 2
Data 3
Data 1
Data 3
RDRF
RDR
(A)
RDR read
(B)
RDR read
Data 1 is read at point (A)
Data 2 is read at point (B)
Figure 10.27 Relation between RDR Read Timing and Data
In this case, only a single RDR read operation (not two or more) should be performed after
first checking that bit RDRF is set to 1. If two or more reads are performed, the data read the
first time should be transferred to RAM, etc., and the RAM contents used. Also, ensure that
there is sufficient margin in an RDR read operation before reception of the next frame is
completed. To be precise in terms of timing, the RDR read should be completed before bit 7 is
transferred in synchronous mode, or before the STOP bit is transferred in asynchronous mode.
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Section 11 14-Bit PWM
Section 11 14-Bit PWM
11.1
Overview
The H8/3644 Group is provided with a 14-bit PWM (pulse width modulator) on-chip, which can
be used as a D/A converter by connecting a low-pass filter.
11.1.1
Features
Features of the 14-bit PWM are as follows.
• Choice of two conversion periods
A conversion period of 32,768/φ, with a minimum modulation width of 2/φ or a conversion
period of 16,384/φ, with a minimum modulation width of 1/φ can be chosen.
• Pulse division method for less ripple
11.1.2
Block Diagram
Figure 11.1 shows a block diagram of the 14-bit PWM.
PWDRU
φ/2
φ/4
PWM
waveform
generator
Internal data bus
PWDRL
PWCR
PWM
Legend:
PWDRL: PWM data register L
PWDRU: PWM data register U
PWCR: PWM control register
Figure 11.1 Block Diagram of the 14-Bit PWM
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Section 11 14-Bit PWM
11.1.3
Pin Configuration
Table 11.1 shows the output pin assigned to the 14-bit PWM.
Table 11.1 Pin Configuration
Name
Abbrev.
I/O
Function
PWM output pin
PWM
Output
Pulse-division PWM waveform output
11.1.4
Register Configuration
Table 11.2 shows the register configuration of the 14-bit PWM.
Table 11.2 Register Configuration
Name
Abbrev.
R/W
Initial Value
Address
PWM control register
PWCR
W
H'FE
H'FFD0
PWM data register U
PWDRU
W
H'C0
H'FFD1
PWM data register L
PWDRL
W
H'00
H'FFD2
11.2
Register Descriptions
11.2.1
PWM Control Register (PWCR)
Bit
7
6
5
4
3
2
1
0
PWCR0
Initial value
1
1
1
1
1
1
1
0
Read/Write
W
PWCR is an 8-bit write-only register for input clock selection.
Upon reset, PWCR is initialized to H'FE.
Bits 7 to 1
Reserved Bits: Bits 7 to 1 are reserved; they are always read as 1, and cannot be
modified.
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Section 11 14-Bit PWM
Bit 0
Clock Select 0 (PWCR0): Bit 0 selects the clock supplied to the 14-bit PWM. This bit is a
write-only bit; it is always read as 1.
Bit 0: PWCR0
Description
0
The input clock is φ/2 (tφ* = 2/φ). The conversion period is 16,384/φ, with
a minimum modulation width of 1/φ
(initial value)
*
The input clock is φ/4 (tφ = 4/φ). The conversion period is 32,768/φ, with
a minimum modulation width of 2/φ.
1
Note:
tφ Period of PWM input clock
*
11.2.2
PWM Data Registers U and L (PWDRU, PWDRL)
PWDRU
Bit
7
6
5
4
3
2
1
0
Initial value
1
1
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
7
6
5
4
3
2
1
0
PWDRU5 PWDRU4 PWDRU3 PWDRU2 PWDRU1 PWDRU0
PWDRL
Bit
PWDRL7 PWDRL6 PWDRL5 PWDRL4 PWDRL3 PWDRL2 PWDRL1 PWDRL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PWDRU and PWDRL form a 14-bit write-only register, with the upper 6 bits assigned to PWDRU
and the lower 8 bits to PWDRL. The value written to PWDRU and PWDRL gives the total highlevel width of one PWM waveform cycle.
When 14-bit data is written to PWDRU and PWDRL, the register contents are latched in the PWM
waveform generator, updating the PWM waveform generation data. The 14-bit data should always
be written in the following sequence:
1. Write the lower 8 bits to PWDRL.
2.
Write the upper 6 bits to PWDRU.
PWDRU and PWDRL are write-only registers. If they are read, all bits are read as 1.
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Section 11 14-Bit PWM
Upon reset, PWDRU and PWDRL are initialized to H'C000.
11.3
Operation
When using the 14-bit PWM, set the registers in the following sequence.
1. Set bit PWM in port mode register 1 (PMR1) to 1 so that pin P14/PWM is designated for PWM
output.
2. Set bit PWCR0 in the PWM control register (PWCR) to select a conversion period of either
32,768/φ (PWCR0 = 1) or 16,384/φ (PWCR0 = 0).
3. Set the output waveform data in PWM data registers U and L (PWDRU/L). Be sure to write in
the correct sequence, first PWDRL then PWDRU. When data is written to PWDRU, the data
in these registers will be latched in the PWM waveform generator, updating the PWM
waveform generation in synchronization with internal signals.
One conversion period consists of 64 pulses, as shown in figure 11.2. The total of the highlevel pulse widths during this period (TH) corresponds to the data in PWDRU and PWDRL.
This relation can be represented as follows.
TH = (data value in PWDRU and PWDRL + 64) × tφ/2
where tφ is the PWM input clock period, either 2/φ (bit PWCR0 = 0) or 4/φ (bit PWCR0 = 1).
Example:
Settings in order to obtain a conversion period of 8,192 µs:
When bit PWCR0 = 0, the conversion period is 16,384/φ, so φ must be 2 MHz. In
this case tfn = 128 µs, with 1/φ (resolution) = 0.5 µs.
When bit PWCR0 = 1, the conversion period is 32,768/φ, so φ must be 4 MHz. In
this case tfn = 128 µs, with 2/φ (resolution) = 0.5 µs.
Accordingly, for a conversion period of 8,192 µs, the system clock frequency (φ)
must be 2 MHz or 4 MHz.
1 conversion period
t f1
t H1
t f2
t H2
t f63
t H3
t H63
TH = t H1 + t H2 + t H3 + ..... t H64
t f1 = t f2 = t f3 ..... = t f64
Figure 11.2 PWM Output Waveform
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t f64
t H64
Section 12 A/D Converter
Section 12 A/D Converter
12.1
Overview
The H8/3644 Group includes on-chip a resistance-ladder-based successive-approximation analogto-digital converter, and can convert up to 8 channels of analog input.
12.1.1
Features
The A/D converter has the following features.
• 8-bit resolution
• Eight input channels
• Conversion time: approx. 12.4 µs per channel (at 5-MHz operation)
• Built-in sample-and-hold function
• Interrupt requested on completion of A/D conversion
• A/D conversion can be started by external trigger input
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Section 12 A/D Converter
12.1.2
Block Diagram
Figure 12.1 shows a block diagram of the A/D converter.
ADTRG
AN 0
AN 1
AN 2
AN 3
AN 4
AN 5
AN 6
AN 7
Multiplexer
ADSR
AVCC
+
Comparator
–
AVCC
Reference
voltage
Control logic
Internal data bus
AMR
AVSS
ADRR
AVSS
Legend:
AMR: A/D mode register
ADSR: A/D start register
ADRR: A/D result register
Figure 12.1 Block Diagram of the A/D Converter
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IRRAD
Section 12 A/D Converter
12.1.3
Pin Configuration
Table 12.1 shows the A/D converter pin configuration.
Table 12.1 Pin Configuration
Name
Abbrev.
I/O
Function
Analog power supply
AVCC
Input
Power supply and reference voltage of analog part
Analog ground
AVSS
Input
Ground and reference voltage of analog part
Analog input 0
AN0
Input
Analog input channel 0
Analog input 1
AN1
Input
Analog input channel 1
Analog input 2
AN2
Input
Analog input channel 2
Analog input 3
AN3
Input
Analog input channel 3
Analog input 4
AN4
Input
Analog input channel 4
Analog input 5
AN5
Input
Analog input channel 5
Analog input 6
AN6
Input
Analog input channel 6
Analog input 7
AN7
Input
Analog input channel 7
External trigger input
ADTRG
Input
External trigger input for starting A/D conversion
12.1.4
Register Configuration
Table 12.2 shows the A/D converter register configuration.
Table 12.2 Register Configuration
Name
Abbrev.
R/W
Initial Value
Address
A/D mode register
AMR
R/W
H'30
H'FFC4
A/D start register
ADSR
R/W
H'7F
H'FFC6
A/D result register
ADRR
R
Undefined
H'FFC5
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Section 12 A/D Converter
12.2
Register Descriptions
12.2.1
A/D Result Register (ADRR)
Bit
Initial value
Read/Write
7
6
5
4
3
2
1
0
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
ADR0
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R
R
R
R
R
R
R
R
The A/D result register (ADRR) is an 8-bit read-only register for holding the results of analog-todigital conversion.
ADRR can be read by the CPU at any time, but the ADRR values during A/D conversion are
undefined.
After A/D conversion is complete, the conversion result is stored in ADRR as 8-bit data; this data
is held in ADRR until the next conversion operation starts.
ADRR is not cleared on reset.
12.2.2
A/D Mode Register (AMR)
Bit
7
6
5
4
3
2
1
0
CKS
TRGE
CH3
CH2
CH1
CH0
Initial value
0
0
1
1
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
AMR is an 8-bit read/write register for specifying the A/D conversion speed, external trigger
option, and the analog input pins.
Upon reset, AMR is initialized to H'30.
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Section 12 A/D Converter
Bit 7
Clock Select (CKS): Bit 7 sets the A/D conversion speed.
Conversion Time
Bit 7: CKS
Conversion Period
φ = 2 MHz
φ = 5 MHz
φ = 8 MHz*
0
62/φ (initial value)
31 µs
31/φ
15.5 µs
12.4 µs
2
*
7.75 µs
1
1
Notes: 1. Applies only to F-ZTAT, R of the ZTAT, and R of the mask ROM version.
2. Operation is not guaranteed if the conversion time is less than 12.4 µs. Set bit 7 for a
value of at least 12.4 µs.
Bit 6
External Trigger Select (TRGE): Bit 6 enables or disables the start of A/D conversion by
external trigger input.
Bit 6: TRGE
Description
0
Disables start of A/D conversion by external trigger
1
Enables start of A/D conversion by rising or falling edge of external trigger at
pin ADTRG*
Note:
*
(initial value)
The external trigger (ADTRG) edge is selected by bit INTEG5 of IEGR2. See section
3.3.2, Interrupt Edge Select Register 2 (IEGR2) for details.
Bits 5 and 4
Reserved Bits: Bits 5 and 4 are reserved; they are always read as 1, and cannot be
modified.
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Section 12 A/D Converter
Bits 3 to 0
Channel Select (CH3 to CH0): Bits 3 to 0 select the analog input channel.
The channel selection should be made while bit ADSF is cleared to 0.
Bit 3:
CH3
Bit 2:
CH2
Bit 1:
CH1
Bit 0:
CH0
Analog Input Channel
0
0
*
*
No channel selected
1
0
0
AN0
1
AN1
0
AN2
1
AN3
0
AN4
1
AN5
0
AN6
1
AN7
0
Reserved
1
Reserved
0
Reserved
1
Reserved
1
1
0
0
1
1
0
1
(initial value)
Legend: * Don’t care
12.2.3
A/D Start Register (ADSR)
Bit
7
6
5
4
3
2
1
0
ADSF
Initial value
0
1
1
1
1
1
1
1
Read/Write
R/W
The A/D start register (ADSR) is an 8-bit read/write register for starting and stopping A/D
conversion.
A/D conversion is started by writing 1 to the A/D start flag (ADSF) or by input of the designated
edge of the external trigger signal, which also sets ADSF to 1. When conversion is complete, the
converted data is set in the A/D result register (ADRR), and at the same time ADSF is cleared
to 0.
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Section 12 A/D Converter
Bit 7
A/D Start Flag (ADSF): Bit 7 controls and indicates the start and end of A/D conversion.
Bit 7: ADSF
Description
0
Read: Indicates the completion of A/D conversion
1
Read: Indicates A/D conversion in progress
(initial value)
Write: Stops A/D conversion
Write: Starts A/D conversion
Bits 6 to 0
Reserved Bits: Bits 6 to 0 are reserved; they are always read as 1, and cannot be
modified.
12.3
Operation
12.3.1
A/D Conversion Operation
The A/D converter operates by successive approximations, and yields its conversion result as 8-bit
data.
A/D conversion begins when software sets the A/D start flag (bit ADSF) to 1. Bit ADSF keeps a
value of 1 during A/D conversion, and is cleared to 0 automatically when conversion is complete.
The completion of conversion also sets bit IRRAD in interrupt request register 2 (IRR2) to 1. An
A/D conversion end interrupt is requested if bit IENAD in interrupt enable register 2 (IENR2) is
set to 1.
If the conversion time or input channel needs to be changed in the A/D mode register (AMR)
during A/D conversion, bit ADSF should first be cleared to 0, stopping the conversion operation,
in order to avoid malfunction.
12.3.2
Start of A/D Conversion by External Trigger Input
The A/D converter can be made to start A/D conversion by input of an external trigger signal.
External trigger input is enabled at pin ADTRG when bit TRGE in AMR is set to 1. Then when
the input signal edge designated in bit INTEG5 of interrupt edge select register 2 (IEGR2) is
detected at pin ADTRG, bit ADSF in ADSR will be set to 1, starting A/D conversion.
Figure 12.2 shows the timing.
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Section 12 A/D Converter
φ
Pin ADTRG
(when bit
INTEG5 = 0)
ADSF
A/D conversion
Figure 12.2 External Trigger Input Timing
12.4
Interrupts
When A/D conversion ends (ADSF changes from 1 to 0), bit IRRAD in interrupt request
register 2 (IRR2) is set to 1.
A/D conversion end interrupts can be enabled or disabled by means of bit IENAD in interrupt
enable register 2 (IENR2).
For further details see section 3.3, Interrupts.
12.5
Typical Use
An example of how the A/D converter can be used is given below, using channel 1 (pin AN1) as
the analog input channel. Figure 12.3 shows the operation timing.
1. Bits CH3 to CH0 of the A/D mode register (AMR) are set to 0101, making pin AN1 the analog
input channel. A/D interrupts are enabled by setting bit IENAD to 1, and A/D conversion is
started by setting bit ADSF to 1.
2. When A/D conversion is complete, bit IRRAD is set to 1, and the A/D conversion result is
stored in the A/D result register (ADRR). At the same time ADSF is cleared to 0, and the A/D
converter goes to the idle state.
3. Bit IENAD = 1, so an A/D conversion end interrupt is requested.
4. The A/D interrupt handling routine starts.
5. The A/D conversion result is read and processed.
6. The A/D interrupt handling routine ends.
If ADSF is set to 1 again afterward, A/D conversion starts and steps 2 through 6 take place.
Figures 12.4 and 12.5 show flow charts of procedures for using the A/D converter.
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Idle
A/D conversion starts
A/D conversion (1)
Set *
Set *
Note: * ( ) indicates instruction execution by software.
ADRR
Channel 1 (AN 1)
operation state
ADSF
IENAD
Interrupt
(IRRAD)
A/D conversion (2)
A/D conversion result (1)
A/D conversion result (2)
Read conversion result
Idle
Conversion result is reset when next conversion starts
Read conversion result
Idle
Set *
Section 12 A/D Converter
Figure 12.3 Typical A/D Converter Operation Timing
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Section 12 A/D Converter
Start
Set A/D conversion speed
and input channel
Disable A/D conversion
end interrupt
Start A/D conversion
Read ADSR
No
ADSF = 0?
Yes
Read ADRR data
Yes
Perform A/D
conversion?
No
End
Figure 12.4 Flow Chart of Procedure for Using A/D Converter (1) (Polling by Software)
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Section 12 A/D Converter
Start
Set A/D conversion speed
and input channels
Enable A/D conversion
end interrupt
Start A/D conversion
A/D conversion
end interrupt?
No
Yes
Clear bit IRRAD to
0 in IRR2
Read ADRR data
Yes
Perform A/D
conversion?
No
End
Figure 12.5 Flow Chart of Procedure for Using A/D Converter (2) (Interrupts Used)
12.6
Application Notes
• Data in the A/D result register (ADRR) should be read only when the A/D start flag (ADSF) in
the A/D start register (ADSR) is cleared to 0.
• Changing the digital input signal at an adjacent pin during A/D conversion may adversely
affect conversion accuracy.
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Section 12 A/D Converter
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Section 13 Electrical Characteristics
Section 13 Electrical Characteristics
13.1
Absolute Maximum Ratings
Table 13.1 lists the absolute maximum ratings.
Table 13.1 Absolute Maximum Ratings*1
Item
Symbol
Value
Unit
Power supply voltage
VCC
–0.3 to +7.0
V
Analog power supply voltage
AVCC
–0.3 to +7.0
V
Programming
voltage
VPP
–0.3 to +13.0
V
HD64F3644, HD64F3643, FVPP
HD64F3642A
–0.3 to +13.0
V
Ports other than Port B
–0.3 to VCC +0.3
V
Input voltage
HD6473644
Vin
Port B
–0.3 to AVCC +0.3 V
TEST (HD64F3644,
HD64F3643,HD64F3642A)
–0.3 to +13.0
V
Operating temperature
Topr
–20 to +75
°C
Storage temperature
Tstg
–55 to +125
°C
Note
2
2
Notes: 1. Permanent damage may occur to the chip if maximum ratings are exceeded. Normal
operation should be under the conditions specified in Electrical Characteristics.
Exceeding these values can result in incorrect operation and reduced reliability.
2. The voltage at the FVPP and TEST pins should not exceed 13 V, including peak
overshoot.
Rev. 6.00 Sep 12, 2006 page 357 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
13.2
Electrical Characteristics (ZTAT™, Mask ROM Version)
13.2.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range are indicated by the shaded region in the figures
below.
1. Power supply voltage vs. oscillator frequency range
32.768
fw (kHz)
f OSC (MHz)
10.0
5.0
2.0
2.7*1
4.0
5.5
VCC (V)
• Active mode (high speed)
• Sleep mode (high speed)
Rev. 6.00 Sep 12, 2006 page 358 of 526
REJ09B0326-0600
2.7*1
4.0
• All operating modes
5.5
VCC (V)
Section 13 Electrical Characteristics
2. Power supply voltage vs. clock frequency range
16.384
φSUB (kHz)
2.5
8.192
4.096
0.5
2.7 *1
4.0
2.7 *1
5.5
VCC (V)
• Active (high speed) mode
• Sleep (high speed) mode (except CPU)
4.0
5.5
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
625.00
φ (kHz)
φ (MHz)
5.0
39.0625
7.8125
2.7*1
4.0
5.5
VCC (V)
• Active (medium speed) mode
• Sleep (medium speed) mode (except CPU)
Rev. 6.00 Sep 12, 2006 page 359 of 526
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Section 13 Electrical Characteristics
3. Analog power supply voltage vs. A/D converter guaranteed accuracy range
φ (MHz)
5.0
Do not exceed the maximum
conversion time value.
2.5
0.5
2.7*2
4.0 4.5
5.5
AVCC (V)
• Active (high speed) mode
• Sleep (high speed) mode
• Active (medium speed) mode
• Sleep (medium speed) mode
Notes: 1. 2.5 V for the HD6433644, HD6433643, HD6433642, HD6433641 and HD6433640.
2. The voltage for guaranteed A/D conversion operation is 2.5 (V).
Rev. 6.00 Sep 12, 2006 page 360 of 526
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Section 13 Electrical Characteristics
13.2.2
DC Characteristics (HD6473644)
Table 13.2 lists the DC characteristics of the HD6473644.
Table 13.2 DC Characteristics
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C unless otherwise indicated.
Item
Applicable
Symbol Pins
Input high VIH
voltage
Values
Min
Typ
RES,
0.8 VCC
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV, 0.9 VCC
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
SI1, RXD,
0.7 VCC
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
0.8 VCC
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
PB0 to PB7
OSC1
Max
Unit Test Condition
VCC +0.3
V
VCC +0.3
VCC +0.3
VCC = 2.7 V to
5.5 V
including
subactive mode
V
VCC +0.3
VCC = 2.7 V to
5.5 V
including
subactive mode
0.7 VCC
AVCC +0.3 V
0.8 VCC
AVCC +0.3
VCC –
0.5
VCC +0.3
VCC –
0.3
VCC +0.3
Notes
VCC = 2.7 V to
5.5 V
including
subactive mode
V
VCC = 2.7 V to
5.5 V
including
subactive mode
Note: Connect the TEST pin to VSS.
Rev. 6.00 Sep 12, 2006 page 361 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Item
Input low
voltage
Output
high
voltage
Applicable
Symbol Pins
VIL
VOH
Values
Typ
Max
Unit Test Condition Notes
RES,
–0.3
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV, –0.3
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
0.2 VCC
V
0.1 VCC
–0.3
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57, P60
to P67,
–0.3
P73 to P77,
P80 to P87,
P90 to P94,
PB0 to PB7
0.3 VCC
0.2 VCC
OSC1
–0.3
0.5
–0.3
0.3
VCC –
1.0
VCC –
0.5
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
Min
Rev. 6.00 Sep 12, 2006 page 362 of 526
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VCC = 2.7 V to
5.5 V
including
subactive mode
V
VCC = 2.7 V to
5.5 V
including
subactive mode
V
VCC = 2.7 V to
5.5 V
including
subactive mode
V
–IOH = 1.5 mA
VCC = 2.7 V to
5.5 V
–IOH = 0.1 mA
Section 13 Electrical Characteristics
Item
Output
low
voltage
Applicable
Symbol Pins
VOL
Typ
Max
Unit Test Condition Notes
| IIL |
Min
0.6
V
0.4
1.0
0.4
IOL = 1.6 mA
0.4
VCC = 2.7 V to
5.5 V
IOL = 0.4 mA
OSC1, P10,
P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
1.0
µA
Vin = 0.5 V to
(VCC –0.5 V)
PB0 to PB7
1.0
µA
Vin = 0.5 V to
(AVCC –0.5 V)
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P73 to P77,
P80 to P87,
P90 to P94
P60 to P67
Input/
output
leakage
current
Values
IOL = 1.6 mA
VCC = 2.7 V to
5.5 V
IOL = 0.4 mA
V
IOL = 10.0 mA
Input
leakage
current
| IIL |
RES, IRQ0
20
µA
Vin = 0.5 V to
(VCC –0.5 V)
Pull-up
MOS
current
–Ip
P10, P14 to P17, 50
P30 to P32,
P50 to P57
300
µA
VCC = 5 V,
Vin = 0 V
25
Input
capacitance
Cin
All input pins
except RES
15.0
RES
60.0
IRQ0
30.0
VCC = 2.7 V,
Vin = 0 V
pF
Reference
value
f = 1 MHz,
Vin = 0 V,
Ta = 25°C
Rev. 6.00 Sep 12, 2006 page 363 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Item
Applicable
Symbol Pins
Active
IOPE1
mode
current
dissipation
IOPE2
Sleep
ISLEEP1
mode
current
dissipation
ISLEEP2
Subactive ISUB
mode
current
dissipation
VCC
VCC
VCC
VCC
VCC
Values
Min
Typ
Max
Unit Test Condition Notes
10
15
mA
5
2
3
1
5
7
2
2
3
1
10
20
10
Rev. 6.00 Sep 12, 2006 page 364 of 526
REJ09B0326-0600
mA
mA
mA
µA
Active (highspeed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
VCC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
Active
(mediumspeed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
VCC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep (highspeed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
VCC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep (medium- 1, 2
speed) mode
VCC = 5 V,
fOSC = 10 MHz
VCC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
VCC = 2.7 V
32-kHz crystal
resonator
(φSUB = φW /2)
1, 2
VCC = 2.7 V
32-kHz crystal
resonator
(φSUB = φW /8)
1, 2
Reference
value
Section 13 Electrical Characteristics
Item
Applicable
Symbol Pins
Values
Min
Typ
Max
Unit Test Condition Notes
Subsleep ISUBSP
mode
current
dissipation
VCC
5
10
µA
VCC = 2.7 V
32-kHz crystal
resonator
(φSUB = φW /2)
1, 2
Watch
IWATCH
mode
current
dissipation
VCC
6
µA
VCC = 2.7 V
32-kHz crystal
resonator
1, 2
Standby
ISTBY
mode
current
dissipation
VCC
5
µA
32-kHz crystal
resonator not
used
1, 2
RAM data VRAM
retaining
voltage
VCC
2
V
Notes: 1. Pin states during current measurement are given below.
Mode
Other
Pins
RES Pin Internal State
Active (high-speed) VCC
mode
Operates
VCC
Active (mediumspeed) mode
Operates
(φOSC/128)
Sleep (high-speed) VCC
mode
Only timers operate
Sleep (mediumspeed) mode
Only timers operate
(φOSC/128)
Oscillator Pins
System clock oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
VCC
Subactive mode
VCC
Operates
VCC
System clock oscillator:
ceramic or crystal
Subsleep mode
VCC
Only timers operate,
CPU stops
VCC
Subclock oscillator:
crystal
Watch mode
VCC
Only time base
operates, CPU stops
VCC
Standby mode
VCC
CPU and timers
both stop
VCC
System clock oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
Rev. 6.00 Sep 12, 2006 page 365 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Values
Item
Allowable output low
current (per pin)
Output pins except
port 6
Symbol
Min
Typ
Max
Unit
IOL
2
mA
10
40
80
Port 6
Allowable output low
current (total)
Output pins except
port 6
∑IOL
Port 6
mA
Allowable output high
current (per pin)
All output pins
–IOH
2
mA
Allowable output high
current (total)
All output pins
∑(–IOH)
30
mA
Rev. 6.00 Sep 12, 2006 page 366 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
13.2.3
AC Characteristics (HD6473644)
Table 13.3 lists the control signal timing, and tables 13.4 and 13.5 list the serial interface timing of
the HD6473644.
Table 13.3 Control Signal Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item
Symbol
Applicable
Pins
System clock
oscillation frequency
fOSC
OSC1, OSC2 2
OSC clock (φOSC)
cycle time
tOSC
OSC1, OSC2 100
System clock (φ)
cycle time
tcyc
Subclock oscillation
frequency
fW
Watch clock (φW )
cycle time
tW
Subclock (φSUB)
cycle time
tsubcyc
trc
Oscillation
stabilization time
(ceramic resonator)
trc
Max
Unit
Test Condition
10
MHz
VCC = 2.7 V to 5.5 V
Reference
Figure
1000 ns
VCC = 2.7 V to 5.5 V *1
Figure 13.1
VCC = 2.7 V to 5.5 V *1
2
128
tOSC
25.6
µs
X1, X2
32.768
X1, X2
30.5
2
2
kHz
VCC = 2.7 V to 5.5 V
µs
VCC = 2.7 V to 5.5 V
8
tW
VCC = 2.7 V to 5.5 V *2
tcyc
VCC = 2.7 V to 5.5 V
tsubcyc
OSC1, OSC2
40
ms
60
Instruction cycle
time
Oscillation
stabilization time
(crystal resonator)
Min Typ
OSC1, OSC2
20
40
VCC = 2.7 V to 5.5 V
ms
VCC = 2.7 V to 5.5 V
Oscillation stabilization trc
time
X1, X2
2
s
VCC = 2.7 V to 5.5 V
External clock high
width
tCPH
OSC1
40
ns
VCC = 2.7 V to 5.5 V Figure 13.1
External clock low
width
tCPL
OSC1
40
ns
VCC = 2.7 V to 5.5 V
External clock rise
time
tCPr
15
ns
VCC = 2.7 V to 5.5 V
External clock fall
time
tCPf
15
ns
VCC = 2.7 V to 5.5 V
Pin RES low width
tREL
10
tcyc
VCC = 2.7 V to 5.5 V Figure 13.2
RES
Rev. 6.00 Sep 12, 2006 page 367 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Item
Applicable
Symbol Pins
Input pin high width
tIH
Input pin low width
tIL
Values
Min
Typ Max
Unit
Test Condition
IRQ0 to IRQ3,
INT0 to INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
2
tcyc
tsubcyc
IRQ0 to IRQ3,
INT6, INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
2
tcyc
VCC = 2.7 V to 5.5 V
tsubcyc
Reference
Figure
Figure 13.3
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
Rev. 6.00 Sep 12, 2006 page 368 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Table 13.4 Serial Interface (SCI1) Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Applicable
Symbol Pins
Min
Typ
Max
Reference
Unit Test Condition Figure
Input serial clock
cycle time
tScyc
SCK1
2
tcyc
VCC = 2.7 V to
5.5 V
Input serial clock
high width
tSCKH
SCK1
0.4
tScyc
VCC = 2.7 V to
5.5 V
Input serial clock
low width
tSCKL
SCK1
0.4
tScyc
VCC = 2.7 V to
5.5 V
Input serial clock
rise time
tSCKr
SCK1
60
ns
80
Input serial clock
fall time
tSCKf
60
80
200
350
180
360
180
360
Item
SCK1
Serial output data tSOD
delay time
SO1
Serial input data
setup time
tSIS
SI1
Serial input data
hold time
tSIH
SI1
Figure 13.4
VCC = 2.7 V to
5.5 V
ns
VCC = 2.7 V to
5.5 V
ns
VCC = 2.7 V to
5.5 V
ns
VCC = 2.7 V to
5.5 V
ns
VCC = 2.7 V to
5.5 V
Rev. 6.00 Sep 12, 2006 page 369 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Table 13.5 Serial Interface (SCI3) Timing
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise
specified.
Values
Item
Input clock
cycle
Symbol
Min
Typ
Max
Unit Test Condition
Asynchronous tScyc
4
tcyc
Synchronous
6
Figure
13.5
Input clock pulse width
tSCKW
0.4
0.6
tScyc
Transmit data delay time
(synchronous)
tTXD
1
tcyc
VCC = 4.0 V to
5.5 V
1
ns
VCC = 4.0 V to
5.5 V
ns
VCC = 4.0 V to
5.5 V
Receive data setup time
(synchronous)
tRXS
200.0
400.0
Receive data hold time
(synchronous)
tRXH
200.0
400.0
Rev. 6.00 Sep 12, 2006 page 370 of 526
REJ09B0326-0600
Reference
Figure
Figure
13.6
Section 13 Electrical Characteristics
13.2.4
DC Characteristics (HD6433644, HD6433643, HD6433642, HD6433641,
HD6433640)
Table 13.6 lists the DC characteristics of the HD6433644, the HD6433643, the HD6433642, the
HD6433641 and the HD6433640.
Table 13.6 DC Characteristics
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C unless otherwise indicated.
Item
Applicable
Symbol Pins
Input high VIH
voltage
Values
Typ
Max
Unit Test Condition
RES,
0.8 VCC
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV, 0.9 VCC
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
VCC +0.3
V
VCC +0.3
SI1, RXD,
0.7 VCC
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
0.8 VCC
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
VCC +0.3
VCC +0.3
PB0 to PB7
0.7 VCC
AVCC +0.3 V
0.8 VCC
AVCC +0.3
OSC1
Min
VCC –0.5
VCC +0.3
VCC –0.3
VCC +0.3
Notes
VCC = 2.5 V to
5.5 V
including
subactive mode
V
VCC = 2.5 V to
5.5 V
including
subactive mode
VCC = 2.5 V to
5.5 V
including
subactive mode
V
VCC = 2.5 V to
5.5 V
including
subactive mode
Note: Connect the TEST pin to VSS.
Rev. 6.00 Sep 12, 2006 page 371 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Item
Applicable
Symbol Pins
Input low VIL
voltage
Values
Min
Typ
Max
Unit Test Condition
–0.3
RES,
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV,
FTCI, FTIA,
–0.3
FTIB, FTIC,
FTID,
SCK1, SCK3,
TRGV
0.2 VCC
V
0.1 VCC
–0.3
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
–0.3
P73 to P77,
P80 to P87,
P90 to P94,
PB0 to PB7
0.3 VCC
0.2 VCC
OSC1
–0.3
0.5
–0.3
0.3
Rev. 6.00 Sep 12, 2006 page 372 of 526
REJ09B0326-0600
VCC = 2.5 V to
5.5 V
including
subactive mode
V
VCC = 2.5 V to
5.5 V
including
subactive mode
V
VCC = 2.5 V to
5.5 V
including
subactive mode
Notes
Section 13 Electrical Characteristics
Item
Output
high
voltage
Output
low
voltage
Applicable
Symbol Pins
VOH
VOL
Max
Unit Test Condition Notes
P10, P14 to P17, VCC –1.0
P20 to P22,
P30 to P32,
P50 to P57,
VCC –0.5
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
V
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P73 to P77,
P80 to P87,
P90 to P94
0.6
0.4
1.0
0.4
IOL = 1.6 mA
0.4
VCC = 2.5 V to
5.5 V
IOL = 0.4 mA
OSC1, P10,
P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
1.0
µA
Vin = 0.5 V to
(VCC –0.5 V)
PB0 to PB7
1.0
µA
Vin = 0.5 V to
(AVCC –0.5 V)
P60 to P67
Input/
output
leakage
current
| IIL |
Values
Min
Typ
–IOH = 1.5 mA
VCC = 2.5 V to
5.5 V
–IOH = 0.1 mA
V
IOL = 1.6 mA
VCC = 2.5 V to
5.5 V
IOL = 0.4 mA
V
IOL = 10.0 mA
Input
leakage
current
| IIL |
RES, IRQ0
1
µA
Vin = 0.5 V to
(VCC –0.5 V)
Pull-up
MOS
current
–Ip
P10, P14 to P17, 50
P30 to P32,
P50 to P57
300
µA
VCC = 5 V,
Vin = 0 V
25
VCC = 2.5 V,
Vin = 0 V
Reference
value
Rev. 6.00 Sep 12, 2006 page 373 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Item
Input
capacitance
Values
Applicable
Symbol Pins
Min
Typ
Max
Unit
Test Condition Notes
Cin
All input pins
except RES
15.0
pF
RES
15.0
f = 1 MHz,
Vin = 0 V,
Ta = 25°C
IRQ0
15.0
VCC
10
15
mA
Active (highspeed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
5
VCC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
2
3
1
5
7
2
2
3
1
10
20
10
Active
IOPE1
mode
current
dissipation
IOPE2
Sleep
ISLEEP1
mode
current
dissipation
ISLEEP2
Subactive ISUB
mode
current
dissipation
VCC
VCC
VCC
VCC
Rev. 6.00 Sep 12, 2006 page 374 of 526
REJ09B0326-0600
mA
mA
mA
µA
Active (medium- 1, 2
speed) mode
VCC = 5 V,
fOSC = 10 MHz
VCC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep (highspeed) mode
VCC = 5 V,
fOSC = 10 MHz
1, 2
VCC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep (medium- 1, 2
speed) mode
VCC = 5 V,
fOSC = 10 MHz
VCC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
VCC = 2.5 V
32-kHz crystal
resonator
(φSUB = φW /2)
1, 2
VCC = 2.5 V
32-kHz crystal
resonator
(φSUB = φW /8)
1, 2
Reference
value
Section 13 Electrical Characteristics
Item
Values
Applicable
Symbol Pins
Min
Typ
Max
Unit
Test Condition
Notes
Subsleep ISUBSP
mode
current
dissipation
VCC
5
10
µA
VCC = 2.5 V
32-kHz crystal
resonator
(φSUB = φW /2)
1, 2
Watch
IWATCH
mode
current
dissipation
VCC
6
µA
VCC = 2.5 V
32-kHz crystal
resonator
1, 2
Standby
ISTBY
mode
current
dissipation
VCC
5
µA
32-kHz crystal
resonator not
used
1, 2
RAM data VRAM
retaining
voltage
VCC
2
V
Notes: 1. Pin states during current measurement are given below.
Mode
RES Pin Internal State
Other
Pins
Active (high-speed)
mode
VCC
VCC
Active (mediumspeed) mode
Sleep (high-speed)
mode
Operates
Operates (φOSC/128)
VCC
Sleep (mediumspeed) mode
Only timers operate VCC
Oscillator Pins
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
Only timers operate
(φOSC/128)
Subactive mode
VCC
Operates
VCC
Subsleep mode
VCC
Only timers operate, VCC
CPU stops
Watch mode
VCC
Only time base
VCC
operates, CPU stops
Standby mode
VCC
CPU and timers
both stop
VCC
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
crystal
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
Rev. 6.00 Sep 12, 2006 page 375 of 526
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Section 13 Electrical Characteristics
Values
Item
Allowable output low
current (per pin)
Output pins except
port 6
Symbol
Min
Typ
Max
Unit
IOL
2
mA
10
40
80
Port 6
Allowable output low
current (total)
Output pins except
port 6
∑IOL
Port 6
mA
Allowable output high
current (per pin)
All output pins
–IOH
2
mA
Allowable output high
current (total)
All output pins
∑(–IOH)
30
mA
13.2.5
AC Characteristics (HD6433644, HD6433643, HD6433642, HD6433641,
HD6433640)
Table 13.7 lists the control signal timing, and tables 13.8 and 13.9 list the serial interface timing of
the HD6433644, the HD6433643, the HD6433642, the HD6433641 and the HD6433640.
Rev. 6.00 Sep 12, 2006 page 376 of 526
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Section 13 Electrical Characteristics
Table 13.7 Control Signal Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item
Symbol
Applicable
Pins
System clock
oscillation frequency
fOSC
OSC1, OSC2 2
2
OSC clock (φOSC)
cycle time
tOSC
OSC1, OSC2 100
System clock (φ)
cycle time
tcyc
Subclock oscillation
frequency
fW
Watch clock (φW )
cycle time
tW
Subclock (φSUB)
cycle time
tsubcyc
Min Typ
200
trc
Oscillation
stabilization time
(ceramic resonator)
trc
Unit
10
MHz
5
Test Condition
Reference
Figure
VCC = 2.5 V to 5.5 V
*1
1000 ns
1000
VCC = 2.5 V to 5.5 V Figure 13.1
2
128
tOSC
25.6
µs
X1, X2
32.768
X1, X2
30.5
2
2
VCC = 2.5 V to 5.5 V *1
kHz
VCC = 2.5 V to 5.5 V
µs
VCC = 2.5 V to 5.5 V
8
tW
VCC = 2.5 V to 5.5 V *2
tcyc
VCC = 2.5 V to 5.5 V
tsubcyc
OSC1, OSC2
40
ms
60
OSC1, OSC2
20
40
Instruction cycle
time
Oscillation
stabilization time
(crystal resonator)
Max
VCC = 2.5 V to 5.5 V
ms
VCC = 2.5 V to 5.5 V
Oscillation stabilization trc
time
X1, X2
2
s
External clock high
width
tCPH
OSC1
40
ns
80
External clock low
width
tCPL
OSC1
40
External clock rise
time
tCPr
External clock fall
time
tCPf
Pin RES low width
tREL
RES
80
15
20
15
20
10
VCC = 2.5 V to 5.5 V
Figure 13.1
VCC = 2.5 V to 5.5 V
ns
VCC = 2.5 V to 5.5 V
ns
VCC = 2.5 V to 5.5 V
ns
VCC = 2.5 V to 5.5 V
tcyc
VCC = 2.5 V to 5.5 V Figure 13.2
Rev. 6.00 Sep 12, 2006 page 377 of 526
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Section 13 Electrical Characteristics
Applicable
Pins
Values
Item
Symbol
Min Typ
Input pin high width
tIH
IRQ0 to IRQ3, 2
INT0 to INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
Input pin low width
tIL
IRQ0 to IRQ3, 2
INT6, INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
Test Condition
Reference
Figure
Max
Unit
tcyc
VCC = 2.5 V to 5.5 V Figure 13.3
tsubcyc
tcyc
VCC = 2.5 V to 5.5 V
tsubcyc
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
Rev. 6.00 Sep 12, 2006 page 378 of 526
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Section 13 Electrical Characteristics
Table 13.8 Serial Interface (SCI1) Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Applicable
Symbol Pins
Min
Typ
Max
Unit
Input serial clock
cycle time
tScyc
SCK1
2
tcyc
VCC = 2.5 V to
5.5 V
Input serial clock
high width
tSCKH
SCK1
0.4
tScyc
VCC = 2.5 V to
5.5 V
Input serial clock
low width
tSCKL
SCK1
0.4
tScyc
VCC = 2.5 V to
5.5 V
Input serial clock
rise time
tSCKr
SCK1
60
ns
80
Input serial clock
fall time
tSCKf
60
80
200
350
180
360
180
360
Item
SCK1
Serial output data tSOD
delay time
SO1
Serial input data
setup time
tSIS
SI1
Serial input data
hold time
tSIH
SI1
Referenc
Test Condition e Figure
Figure
13.4
VCC = 2.5 V to
5.5 V
ns
VCC = 2.5 V to
5.5 V
ns
VCC = 2.5 V to
5.5 V
ns
VCC = 2.5 V to
5.5 V
ns
VCC = 2.5 V to
5.5 V
Rev. 6.00 Sep 12, 2006 page 379 of 526
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Section 13 Electrical Characteristics
Table 13.9 Serial Interface (SCI3) Timing
VCC = 2.5 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise
specified.
Values
Item
Input clock
cycle
Symbol Min
Typ
Max
Reference
Unit Test Condition Figure
tcyc
Asynchronous tScyc
4
Synchronous
6
Figure 13.5
Input clock pulse width
tSCKW
0.4
0.6
tScyc
Transmit data delay time
(synchronous)
tTXD
1
tcyc
VCC = 4.0 V to
5.5 V
1
ns
VCC = 4.0 V to
5.5 V
ns
VCC = 4.0 V to
5.5 V
Receive data setup time
(synchronous)
tRXS
200.0
400.0
Receive data hold time
(synchronous)
tRXH
200.0
400.0
Rev. 6.00 Sep 12, 2006 page 380 of 526
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Figure 13.6
Section 13 Electrical Characteristics
13.2.6
A/D Converter Characteristics
Table 13.10 shows the A/D converter characteristics of the HD6473644, the HD6433644, the
HD6433643, the HD6433642, the HD6433641 and the HD6433640.
Table 13.10 A/D Converter Characteristics
VCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Item
Applicable
Symbol Pins
Min
Values
Typ
Max
Unit
Analog power AVCC
supply
voltage
AVCC
2.7
5.5
V
Analog input
voltage
AN0 to AN7
AVSS
–0.3
AVCC
+0.3
V
AVin
Analog power AIOPE
supply
AISTOP1
current
AVCC
1.5
mA
AVCC
150.0
µA
AISTOP2
AVCC
5.0
µA
CAin
AN0 to AN7
30.0
pF
RAin
Allowable
signal source
impedance
5.0
kΩ
Resolution
8
bit
Nonlinearity
error
±2.0
LSB
Quantization
error
±0.5
LSB
Absolute
accuracy
±2.5
LSB
Conversion
time
12.4
124
µs
Analog input
capacitance
Test
Condition
Reference
Figure
*1
AVCC = 5 V
*2
Reference
value
*3
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
Rev. 6.00 Sep 12, 2006 page 381 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
13.3
Electrical Characteristics (ZTAT and R of the Mask ROM Version)
13.3.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range are indicated by the shaded region in the figures
below.
1. Power supply voltage vs. oscillator frequency range
32.768
10.0
fw (kHz)
f OSC (MHz)
16.0
2.0
2.7*1
4.0
5.5
VCC (V)
• Active mode (high speed)
• Sleep mode (high speed)
Rev. 6.00 Sep 12, 2006 page 382 of 526
REJ09B0326-0600
2.7*1
4.0
• All operating modes
5.5
VCC (V)
Section 13 Electrical Characteristics
2.
Power supply voltage vs. clock frequency range
φSUB (kHz)
5.0
16.384
8.192
4.096
0.5
2.7*1
4.0
2.7*1
5.5
VCC (V)
• Active (high speed) mode
• Sleep (high speed) mode (except CPU)
4.0
5.5
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
1000.00
625.00
φ (kHz)
φ (MHz)
8.0
39.0625
7.8125
2.7*1
4.0
5.5
VCC (V)
• Active (medium speed) mode
• Sleep (medium speed) mode (except CPU)
Rev. 6.00 Sep 12, 2006 page 383 of 526
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Section 13 Electrical Characteristics
3. Analog power supply voltage vs. A/D converter operating range
φ (MHz)
8.0
Do not exceed the maximum
conversion time value.
5.0
0.5
2.7*2
4.0
• Active (high speed) mode
• Sleep (high speed) mode
5.5
AVCC (V)
• Active (medium speed) mode
• Sleep (medium speed) mode
Notes: 1. 2.5 V for HD6433644R, HD6433643R, HD6433642R, HD6433641R
and HD6433640R.
2. AD conversion is guaranteed with 2.5 V.
Rev. 6.00 Sep 12, 2006 page 384 of 526
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Section 13 Electrical Characteristics
13.3.2
DC Characteristics (HD6473644R)
Table 13.11 lists the DC characteristics of the HD6473644R.
Table 13.11 DC Characteristics
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C unless otherwise indicated.
Item
Applicable
Symbol Pins
Input high VIH
voltage
Values
Typ
Max
Unit Test Condition
RES,
0.8 VCC
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV, 0.9 VCC
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
VCC +0.3
V
VCC +0.3
SI1, RXD,
0.7 VCC
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
0.8 VCC
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
VCC +0.3
VCC +0.3
PB0 to PB7
0.7 VCC
AVCC +0.3 V
0.8 VCC
AVCC +0.3
OSC1
Min
VCC –0.5
VCC +0.3
VCC –0.3
VCC +0.3
Notes
VCC = 2.7 V to
5.5 V
including
subactive mode
V
VCC = 2.7 V to
5.5 V
including
subactive mode
VCC = 2.7 V to
5.5 V
including
subactive mode
V
VCC = 2.7 V to
5.5 V
including
subactive mode
Note: Connect the TEST pin to VSS.
Rev. 6.00 Sep 12, 2006 page 385 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Item
Applicable
Symbol Pins
Input low VIL
voltage
Values
Typ
Max
Unit Test Condition
–0.3
RES,
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV,
FTCI, FTIA,
–0.3
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
0.2 VCC
V
0.1 VCC
–0.3
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
–0.3
P73 to P77,
P80 to P87,
P90 to P94,
PB0 to PB7
0.3 VCC
0.2 VCC
OSC1
Min
–0.3
0.5
–0.3
0.3
Rev. 6.00 Sep 12, 2006 page 386 of 526
REJ09B0326-0600
VCC = 2.7 V to
5.5 V
including
subactive mode
V
VCC = 2.7 V to
5.5 V
including
subactive mode
V
VCC = 2.7 V to
5.5 V
including
subactive mode
Notes
Section 13 Electrical Characteristics
Item
Output
high
voltage
Output
low
voltage
Applicable
Symbol Pins
VOH
VOL
Max
Unit
Test Condition Notes
P10, P14 to P17, VCC –1.0
P20 to P22,
P30 to P32,
P50 to P57,
VCC –0.5
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
V
–IOH = 1.5 mA
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P73 to P77,
P80 to P87,
P90 to P94
0.6
0.4
1.0
0.4
IOL = 1.6 mA
0.4
VCC = 2.7 V to
5.5 V
IOL = 0.4 mA
OSC1, P10,
P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
1.0
µA
Vin = 0.5 V to
(VCC –0.5 V)
PB0 to PB7
1.0
µA
Vin = 0.5 V to
(AVCC –0.5 V)
P60 to P67
Input/
output
leakage
current
| IIL |
Values
Min
Typ
VCC = 2.7 V to
5.5 V
–IOH = 0.1 mA
V
IOL = 1.6 mA
VCC = 2.7 V to
5.5 V
IOL = 0.4 mA
V
IOL = 10.0 mA
Input
leakage
current
| IIL |
RES, IRQ0
20
µA
Vin = 0.5 V to
(VCC –0.5 V)
Pull-up
MOS
current
–Ip
P10, P14 to P17, 50
P30 to P32,
P50 to P57
300
µA
VCC = 5 V,
Vin = 0 V
25
VCC = 2.7 V,
Vin = 0 V
Reference
value
Rev. 6.00 Sep 12, 2006 page 387 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Values
Item
Symbol Applicable Pins
Min
Typ
Max
Unit
Test Condition Notes
Input
capacitance
Cin
All input pins
except RES
15.0
pF
RES
60.0
f = 1 MHz,
Vin = 0 V,
Ta = 25°C
IRQ0
30.0
VCC
15
20
mA
Active (highspeed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
5
VCC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
3
5
1
6
10
2
2
4
1
10
20
10
Active
IOPE1
mode
current
dissipation
IOPE2
Sleep
ISLEEP1
mode
current
dissipation
ISLEEP2
Subactive ISUB
mode
current
dissipation
VCC
VCC
VCC
VCC
Rev. 6.00 Sep 12, 2006 page 388 of 526
REJ09B0326-0600
mA
mA
mA
µA
Active (medium- 1, 2
speed) mode
VCC = 5 V,
fOSC = 16 MHz
VCC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep (highspeed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
VCC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep (medium- 1, 2
speed) mode
VCC = 5 V,
fOSC = 16 MHz
VCC = 2.7 V,
fOSC = 10 MHz
1, 2
Reference
value
VCC = 2.7 V
32-kHz crystal
resonator
(φSUB = φW /2)
1, 2
VCC = 2.7 V
32-kHz crystal
resonator
(φSUB = φW /8)
1, 2
Reference
value
Section 13 Electrical Characteristics
Values
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Notes
Subsleep
ISUBSP
mode current
dissipation
VCC
5
10
µA
VCC = 2.7 V
32-kHz crystal
resonator
(φSUB = φW /2)
1, 2
Watch mode
current
dissipation
VCC
6
µA
VCC = 2.7 V
32-kHz crystal
resonator
1, 2
ISTBY
Standby
mode current
dissipation
VCC
5
µA
32-kHz crystal
resonator not
used
1, 2
RAM data
retaining
voltage
VCC
2
V
Item
Symbol
IWATCH
VRAM
Notes: 1. Pin states during current measurement are given below.
Mode
RES Pin Internal State
Other Pins Oscillator Pins
Active (high-speed)
mode
VCC
VCC
Active (mediumspeed) mode
Sleep (high-speed)
mode
Operates
Operates
(φOSC/128)
VCC
Sleep (mediumspeed) mode
Only timers
operate
VCC
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
Only timers
operate (φOSC/128)
Subactive mode
VCC
Operates
VCC
Subsleep mode
VCC
Only timers
operate,
CPU stops
VCC
Watch mode
VCC
Only time base
operates, CPU
stops
VCC
Standby mode
VCC
CPU and timers
both stop
VCC
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
crystal
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
Rev. 6.00 Sep 12, 2006 page 389 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Values
Item
Allowable output low
current (per pin)
Output pins except
port 6
Symbol
Min
Typ
Max
Unit
IOL
2
mA
10
40
80
Port 6
Allowable output low
current (total)
Output pins except
port 6
∑IOL
Port 6
mA
Allowable output high
current (per pin)
All output pins
–IOH
2
mA
Allowable output high
current (total)
All output pins
∑(–IOH)
30
mA
Rev. 6.00 Sep 12, 2006 page 390 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
13.3.3
AC Characteristics (HD6473644R)
Table 13.12 lists the control signal timing, and tables 13.13 and 13.14 list the serial interface
timing of the HD6473644R.
Table 13.12 Control Signal Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Item
Symbol
Applicable
Pins
System clock
oscillation frequency
fOSC
OSC clock (φOSC)
cycle time
tOSC
System clock (φ)
cycle time
tcyc
Subclock oscillation
frequency
fW
Watch clock (φW )
cycle time
tW
Subclock (φSUB)
cycle time
tsubcyc
Typ
Max
Unit
OSC1, OSC2 2
16
MHz
2
10
OSC1, OSC2 62.5
1000 ns
100
1000
2
128
tOSC
25.6
µs
X1, X2
32.76
8
trc
Oscillation
stabilization time
(ceramic resonator)
trc
Min
X1, X2
30.5
2
2
Test Condition
Reference
Figure
VCC = 2.7 V to 5.5 V
VCC = 2.7 V to 5.5 V
*1
Figure 13.1
VCC = 2.7 V to 5.5 V *1
kHz
VCC = 2.7 V to 5.5 V
µs
VCC = 2.7 V to 5.5 V
8
tW
VCC = 2.7 V to 5.5 V *2
tcyc
VCC = 2.7 V to 5.5 V
tsubcyc
OSC1, OSC2
40
ms
60
Instruction cycle
time
Oscillation
stabilization time
(crystal resonator)
Values
OSC1, OSC2
20
40
VCC = 2.7 V to 5.5 V
ms
VCC = 2.7 V to 5.5 V
Oscillation stabilization trc
time
X1, X2
2
s
External clock high
width
tCPH
OSC1
20
ns
40
External clock low
width
tCPL
OSC1
20
40
External clock rise
time
tCPr
15
ns
VCC = 2.7 V to 5.5 V
External clock fall
time
tCPf
15
ns
VCC = 2.7 V to 5.5 V
VCC = 2.7 V to 5.5 V
Figure 13.1
VCC = 2.7 V to 5.5 V
ns
VCC = 2.7 V to 5.5 V
Rev. 6.00 Sep 12, 2006 page 391 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Values
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Reference
Figure
Pin RES low width
tREL
RES
10
tcyc
VCC = 2.7 V to 5.5 V Figure 13.2
Input pin high level
width
tIH
IRQ0 to IRQ3, 2
INT0 to INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
tcyc
VCC = 2.7 V to 5.5 V Figure 13.3
tsubcyc
Input pin low level
width
tIL
IRQ0 to IRQ3, 2
INT6, INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
tcyc
VCC = 2.7 V to 5.5 V
tsubcyc
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
Rev. 6.00 Sep 12, 2006 page 392 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Table 13.13 Serial Interface (SCI1) Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Applicable
Symbol Pins
Min
Typ
Max
Unit Test Condition
Reference
Figure
Input serial clock
cycle time
tScyc
SCK1
2
tcyc
VCC = 2.7 V to
5.5 V
Figure 13.4
Input serial clock
high width
tSCKH
SCK1
0.4
tScyc
VCC = 2.7 V to
5.5 V
Input serial clock
low width
tSCKL
SCK1
0.4
tScyc
VCC = 2.7 V to
5.5 V
Input serial clock
rise time
tSCKr
SCK1
60
ns
80
Input serial clock
fall time
tSCKf
60
80
200
350
180
360
180
360
Item
SCK1
Serial output data tSOD
delay time
SO1
Serial input data
setup time
tSIS
SI1
Serial input data
hold time
tSIH
SI1
VCC = 2.7 V to
5.5 V
ns
VCC = 2.7 V to
5.5 V
ns
VCC = 2.7 V to
5.5 V
ns
VCC = 2.7 V to
5.5 V
ns
VCC = 2.7 V to
5.5 V
Rev. 6.00 Sep 12, 2006 page 393 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Table 13.14 Serial Interface (SCI3) Timing
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise
specified.
Values
Item
Input clock
cycle
Symbol
Min
Typ
Max
Unit Test Condition
Asynchronous tScyc
4
tcyc
Synchronous
6
Figure
13.5
Input clock pulse width
tSCKW
0.4
0.6
tScyc
Transmit data delay time
(synchronous)
tTXD
1
tcyc
VCC = 4.0 V to
5.5 V
1
ns
VCC = 4.0 V to
5.5 V
ns
VCC = 4.0 V to
5.5 V
Receive data setup time
(synchronous)
tRXS
200.0
400.0
Receive data hold time
(synchronous)
tRXH
200.0
400.0
Rev. 6.00 Sep 12, 2006 page 394 of 526
REJ09B0326-0600
Reference
Figure
Figure
13.6
Section 13 Electrical Characteristics
13.3.4
DC Characteristics (HD6433644R, HD6433643R, HD6433642R, HD6433641R,
HD6433640R)
Table 13.15 lists the DC characteristics of the HD6433644R, the HD6433643R, the HD6433642R,
the HD6433641R and the HD6433640R.
Table 13.15 DC Characteristics
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C unless otherwise indicated.
Item
Applicable
Symbol Pins
Input high VIH
voltage
Values
Typ
Max
Unit Test Condition
RES,
0.8 VCC
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV, 0.9 VCC
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
VCC +0.3
V
VCC +0.3
SI1, RXD,
0.7 VCC
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
0.8 VCC
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
VCC +0.3
VCC +0.3
PB0 to PB7
0.7 VCC
AVCC +0.3 V
0.8 VCC
AVCC +0.3
OSC1
Min
VCC –0.5
VCC +0.3
VCC –0.3
VCC +0.3
Notes
VCC = 2.5 V to
5.5 V
including
subactive mode
V
VCC = 2.5 V to
5.5 V
including
subactive mode
VCC = 2.5 V to
5.5 V
including
subactive mode
V
VCC = 2.5 V to
5.5 V
including
subactive mode
Note: Connect the TEST pin to VSS.
Rev. 6.00 Sep 12, 2006 page 395 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Item
Applicable
Symbol Pins
Input low VIL
voltage
Values
Min
Typ
Max
Unit Test Condition
–0.3
RES,
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV,
FTCI, FTIA,
–0.3
FTIB, FTIC,
FTID,
SCK1, SCK3,
TRGV
0.2 VCC
V
0.1 VCC
–0.3
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
–0.3
P73 to P77,
P80 to P87,
P90 to P94,
PB0 to PB7
0.3 VCC
0.2 VCC
OSC1
–0.3
0.5
–0.3
0.3
Rev. 6.00 Sep 12, 2006 page 396 of 526
REJ09B0326-0600
VCC = 2.5 V to
5.5 V
including
subactive mode
V
VCC = 2.5 V to
5.5 V
including
subactive mode
V
VCC = 2.5 V to
5.5 V
including
subactive mode
Notes
Section 13 Electrical Characteristics
Item
Output
high
voltage
Output
low
voltage
Applicable
Symbol Pins
VOH
VOL
Max
Unit
Test Condition Notes
P10, P14 to P17, VCC –1.0
P20 to P22,
P30 to P32,
P50 to P57,
VCC –0.5
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
V
–IOH = 1.5 mA
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P73 to P77,
P80 to P87,
P90 to P94
0.6
0.4
1.0
0.4
IOL = 1.6 mA
0.4
VCC = 2.5 V to
5.5 V
IOL = 0.4 mA
OSC1, P10,
P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P90 to P94
1.0
µA
Vin = 0.5 V to
(VCC –0.5 V)
PB0 to PB7
1.0
µA
Vin = 0.5 V to
(AVCC –0.5 V)
P60 to P67
Input/
output
leakage
current
| IIL |
Values
Min
Typ
VCC = 2.5 V to
5.5 V
–IOH = 0.1 mA
V
IOL = 1.6 mA
VCC = 2.5 V to
5.5 V
IOL = 0.4 mA
V
IOL = 10.0 mA
Input
leakage
current
| IIL |
RES, IRQ0
1
µA
Vin = 0.5 V to
(VCC –0.5 V)
Pull-up
MOS
current
–Ip
P10, P14 to P17, 50
P30 to P32,
P50 to P57
300
µA
VCC = 5 V,
Vin = 0 V
25
VCC = 2.5 V,
Vin = 0 V
Reference
value
Rev. 6.00 Sep 12, 2006 page 397 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Item
Input
capacitance
Values
Applicable
Symbol Pins
Min
Typ
Max
Unit
Test Condition
Cin
All input pins
except RES
15.0
pF
RES
15.0
f = 1 MHz,
Vin = 0 V,
Ta = 25°C
IRQ0
15.0
VCC
15
20
mA
Active (highspeed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
5
VCC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
3
5
Active (mediumspeed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
1
VCC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
6
10
Sleep (highspeed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
2
VCC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
2
4
Sleep (mediumspeed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
1
VCC = 2.5 V,
fOSC = 10 MHz
1, 2
Reference
value
10
20
VCC = 2.5 V
32-kHz crystal
resonator
(φSUB = φW /2)
1, 2
10
VCC = 2.5 V
32-kHz crystal
resonator
(φSUB = φW /8)
1, 2
Reference
value
Active
IOPE1
mode
current
dissipation
IOPE2
Sleep
ISLEEP1
mode
current
dissipation
ISLEEP2
Subactive ISUB
mode
current
dissipation
VCC
VCC
VCC
VCC
Rev. 6.00 Sep 12, 2006 page 398 of 526
REJ09B0326-0600
mA
mA
mA
µA
Notes
Section 13 Electrical Characteristics
Item
Applicable
Symbol Pins
Values
Min
Typ
Max
Unit Test Condition
Notes
Subsleep ISUBSP
mode
current
dissipation
VCC
5
10
µA
VCC = 2.5 V
32-kHz crystal
resonator
(φSUB = φW /2)
1, 2
Watch
IWATCH
mode
current
dissipation
VCC
6
µA
VCC = 2.5 V
32-kHz crystal
resonator
1, 2
Standby
ISTBY
mode
current
dissipation
VCC
5
µA
32-kHz crystal
resonator not
used
1, 2
RAM data VRAM
retaining
voltage
VCC
2
V
Notes: 1. Pin states during current measurement are given below.
Mode
RES Pin Internal State
Active (high-speed) VCC
mode
Operates
Active (mediumspeed) mode
Operates
(φOSC/128)
Sleep (high-speed)
mode
VCC
Sleep (mediumspeed) mode
Other Pins Oscillator Pins
VCC
Only timers operate VCC
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
Only timers operate
(φOSC/128)
Subactive mode
VCC
Operates
VCC
Subsleep mode
VCC
Only timers operate, VCC
CPU stops
Watch mode
VCC
Only time base
operates, CPU
stops
VCC
Subclock oscillator:
crystal
Standby mode
VCC
CPU and timers
both stop
VCC
System clock
oscillator:
ceramic or crystal
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
Rev. 6.00 Sep 12, 2006 page 399 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Values
Item
Allowable output low
current (per pin)
Output pins except
port 6
Symbol
Min
Typ
Max
Unit
IOL
2
mA
10
40
80
Port 6
Allowable output low
current (total)
Output pins except
port 6
∑IOL
Port 6
mA
Allowable output high
current (per pin)
All output pins
–IOH
2
mA
Allowable output high
current (total)
All output pins
∑(–IOH)
30
mA
13.3.5
AC Characteristics (HD6433644R, HD6433643R, HD6433642R, HD6433641R,
HD6433640R)
Table 13.16 lists the control signal timing, and tables 13.17 and 13.18 list the serial interface
timing of the HD6433644R, the HD6433643R, the HD6433642R, the HD6433641R and the
HD6433640R.
Rev. 6.00 Sep 12, 2006 page 400 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Table 13.16 Control Signal Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item
Symbol
Applicable
Pins
System clock
oscillation frequency
fOSC
OSC1, OSC2 2
2
OSC clock (φOSC)
cycle time
tOSC
OSC1, OSC2 62.5
System clock (φ)
cycle time
tcyc
Subclock oscillation
frequency
fW
Watch clock (φW )
cycle time
tW
Subclock (φSUB)
cycle time
tsubcyc
Min Typ
100
trc
Oscillation
stabilization time
(ceramic resonator)
trc
Unit
16
MHz
10
Test Condition
Reference
Figure
VCC = 2.5 V to 5.5 V
*1
1000 ns
1000
VCC = 2.5 V to 5.5 V Figure 13.1
2
128
tOSC
25.6
µs
X1, X2
32.768
X1, X2
30.5
2
2
VCC = 2.5 V to 5.5 V *1
kHz
VCC = 2.5 V to 5.5 V
µs
VCC = 2.5 V to 5.5 V
8
tW
VCC = 2.5 V to 5.5 V *2
tcyc
VCC = 2.5 V to 5.5 V
tsubcyc
OSC1, OSC2
40
ms
60
OSC1, OSC2
20
40
Instruction cycle
time
Oscillation
stabilization time
(crystal resonator)
Max
VCC = 2.5 V to 5.5 V
ms
VCC = 2.5 V to 5.5 V
Oscillation stabilization trc
time
X1, X2
2
s
External clock high
width
tCPH
OSC1
20
ns
40
External clock low
width
tCPL
OSC1
20
40
External clock rise
time
tCPr
15
ns
VCC = 2.5 V to 5.5 V
External clock fall
time
tCPf
15
ns
VCC = 2.5 V to 5.5 V
Pin RES low width
tREL
10
tcyc
VCC = 2.5 V to 5.5 V Figure 13.2
RES
VCC = 2.5 V to 5.5 V
Figure 13.1
VCC = 2.5 V to 5.5 V
ns
VCC = 2.5 V to 5.5 V
Rev. 6.00 Sep 12, 2006 page 401 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Applicable
Pins
Values
Item
Symbol
Min Typ
Input pin high width
tIH
IRQ0 to IRQ3, 2
INT0 to INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
Input pin low width
tIL
IRQ0 to IRQ3, 2
INT6, INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
Test Condition
Reference
Figure
Max
Unit
tcyc
VCC = 2.5 V to 5.5 V Figure 13.3
tsubcyc
tcyc
VCC = 2.5 V to 5.5 V
tsubcyc
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
Rev. 6.00 Sep 12, 2006 page 402 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Table 13.17 Serial Interface (SCI1) Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Applicable
Symbol Pins
Min
Typ
Max
Unit Test Condition
Reference
Figure
Input serial clock
cycle time
tScyc
SCK1
2
tcyc
VCC = 2.5 V to
5.5 V
Figure 13.4
Input serial clock
high width
tSCKH
SCK1
0.4
tScyc
VCC = 2.5 V to
5.5 V
Input serial clock
low width
tSCKL
SCK1
0.4
tScyc
VCC = 2.5 V to
5.5 V
Input serial clock
rise time
tSCKr
SCK1
60
ns
80
Input serial clock
fall time
tSCKf
60
80
200
350
180
360
180
360
Item
SCK1
Serial output data tSOD
delay time
SO1
Serial input data
setup time
tSIS
SI1
Serial input data
hold time
tSIH
SI1
VCC = 2.5 V to
5.5 V
ns
VCC = 2.5 V to
5.5 V
ns
VCC = 2.5 V to
5.5 V
ns
VCC = 2.5 V to
5.5 V
ns
VCC = 2.5 V to
5.5 V
Rev. 6.00 Sep 12, 2006 page 403 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Table 13.18 Serial Interface (SCI3) Timing
VCC = 2.5 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise
specified.
Values
Item
Input clock
cycle
Symbol
Min
Typ
Max
Unit Test Condition
Asynchronous tScyc
4
tcyc
Synchronous
6
Figure
13.5
Input clock pulse width
tSCKW
0.4
0.6
tScyc
Transmit data delay time
(synchronous)
tTXD
1
tcyc
VCC = 4.0 V to
5.5 V
1
ns
VCC = 4.0 V to
5.5 V
ns
VCC = 4.0 V to
5.5 V
Receive data setup time
(synchronous)
tRXS
200.0
400.0
Receive data hold time
(synchronous)
tRXH
200.0
400.0
Rev. 6.00 Sep 12, 2006 page 404 of 526
REJ09B0326-0600
Reference
Figure
Figure
13.6
Section 13 Electrical Characteristics
13.3.6
A/D Converter Characteristics
Table 13.19 shows the A/D converter characteristics of the HD6473644R, the HD6433644R, the
HD6433643R, the HD6433642R, the HD6433641R and the HD6433640R.
Table 13.19 A/D Converter Characteristics
VCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Item
Applicable
Symbol Pins
Min
Values
Typ
Max
Test
Unit Condition
Reference
Figure
*1
Analog power
supply voltage
AVCC
AVCC
2.7
5.5
V
Analog input
voltage
AVin
AN0 to AN7
AVSS
–0.3
AVCC
+0.3
V
Analog power
supply current
AIOPE
AVCC
1.5
mA
AISTOP1
AVCC
150.0
µA
AISTOP2
AVCC
5.0
µA
CAin
AN0 to AN7
30.0
pF
Allowable signal RAin
source
impedance
5.0
kΩ
Resolution
8
bit
Nonlinearity
error
±2.0
LSB
Quantization
error
±0.5
LSB
Absolute
accuracy
±2.5
LSB
Conversion time
7.75
124
µs
Analog input
capacitance
AVCC = 5 V
*2
Reference
value
*3
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
Rev. 6.00 Sep 12, 2006 page 405 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
13.4
Electrical Characteristics (F-ZTAT
version)
13.4.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range are indicated by the shaded region in the figures
below.
1. Power supply voltage vs. oscillator frequency range
32.768
10.0
fw (kHz)
f OSC (MHz)
16.0
2.0
3.0
4.0
5.5
VCC (V)
• Active mode (high speed)
• Sleep mode (high speed)
Rev. 6.00 Sep 12, 2006 page 406 of 526
REJ09B0326-0600
3.0
4.0
• All operating modes
5.5
VCC (V)
Section 13 Electrical Characteristics
2. Power supply voltage vs. clock frequency range
φSUB (kHz)
5.0
16.384
8.192
4.096
0.5
3.0
4.0
5.5
VCC (V)
3.0
• Active (high speed) mode
• Sleep (high speed) mode (except CPU)
4.0
5.5
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
1000.00
625.00
φ (kHz)
φ (MHz)
8.0
39.0625
7.8125
3.0
4.0
5.5
VCC (V)
• Active (medium speed) mode
• Sleep (medium speed) mode (except CPU)
Rev. 6.00 Sep 12, 2006 page 407 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
3. Analog power supply voltage vs. A/D converter operating range
φ (MHz)
8.0
Do not exceed the maximum
conversion time value.
5.0
0.5
3.0
4.0
• Active (high speed) mode
• Sleep (high speed) mode
Rev. 6.00 Sep 12, 2006 page 408 of 526
REJ09B0326-0600
5.5
AVCC (V)
• Active (medium speed) mode
• Sleep (medium speed) mode
Section 13 Electrical Characteristics
13.4.2
DC Characteristics (HD64F3644, HD64F3643, HD64F3642A)
Table 13.20 lists the DC characteristics of the HD64F3644, HD64F3643, and HD64F3642A.
Table 13.20 DC Characteristics
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C unless otherwise indicated.
Item
Applicable
Symbol Pins
Input high VIH
voltage
Values
Typ
Max
Unit Test Condition
RES,
0.8 VCC
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV, 0.9 VCC
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
VCC +0.3
V
VCC +0.3
SI1, RXD,
0.7 VCC
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
0.8 VCC
P60 to P67,
P73 to P77,
P80 to P87,
P91 to P94
VCC +0.3
VCC +0.3
PB0 to PB7
0.7 VCC
AVCC +0.3 V
0.8 VCC
AVCC +0.3
OSC1
Min
VCC –0.5
VCC +0.3
VCC –0.3
VCC +0.3
Notes
VCC = 3.0 V to
5.5 V
including
subactive mode
V
VCC = 3.0 V to
5.5 V
including
subactive mode
VCC = 3.0 V to
5.5 V
including
subactive mode
V
VCC = 3.0 V to
5.5 V
including
subactive mode
Note: Except in boot mode, connect the TEST pin to VSS.
Rev. 6.00 Sep 12, 2006 page 409 of 526
REJ09B0326-0600
Section 13 Electrical Characteristics
Item
Applicable
Symbol Pins
Input low VIL
voltage
Values
Min
Typ
Max
Unit Test Condition
RES,
–0.3
INT0 to INT7,
IRQ0 to IRQ3,
ADTRG, TMIB,
TMRIV, TMCIV, –0.3
FTCI, FTIA,
FTIB, FTIC,
FTID, SCK1,
SCK3, TRGV
0.2 VCC
V
0.1 VCC
–0.3
SI1, RXD,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
–0.3
P73 to P77,
P80 to P87,
P91 to P94,
PB0 to PB7
0.3 VCC
0.2 VCC
OSC1
–0.3
0.5
–0.3
0.3
Rev. 6.00 Sep 12, 2006 page 410 of 526
REJ09B0326-0600
VCC = 3.0 V to
5.5 V
including
subactive mode
V
VCC = 3.0 V to
5.5 V
including
subactive mode
V
VCC = 3.0 V to
5.5 V
including
subactive mode
Notes
Section 13 Electrical Characteristics
Item
Output
high
voltage
Output
low
voltage
Applicable
Symbol Pins
VOH
VOL
Max
Unit Test Condition Notes
P10, P14 to P17, VCC –1.0
P20 to P22,
P30 to P32,
P50 to P57,
VCC –0.5
P60 to P67,
P73 to P77,
P80 to P87,
P91 to P94
V
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P73 to P77,
P80 to P87,
P91 to P94
0.6
0.4
1.0
0.4
IOL = 1.6 mA
0.4
VCC = 2.7 V to
5.5 V
IOL = 0.4 mA
OSC1, RES,
P10, P14 to P17,
P20 to P22,
P30 to P32,
P50 to P57,
P60 to P67,
P73 to P77,
P80 to P87,
P91 to P94
1.0
µA
Vin = 0.5 V to
(VCC –0.5 V)
PB0 to PB7
1.0
µA
Vin = 0.5 V to
(AVCC –0.5 V)
P60 to P67
Input/
output
leakage
current
| IIL |
Values
Min
Typ
–IOH = 1.5 mA
VCC = 3.0 V to
5.5 V
–IOH = 0.1 mA
V
IOL = 1.6 mA
VCC = 3.0 V to
5.5 V
IOL = 0.4 mA
V
IOL = 10.0 mA
Input
leakage
current
| IIL |
IRQ0, TEST
20
µA
Vin = 0.5 V to
(VCC –0.5 V)
Pull-up
MOS
current
–Ip
P10, P14 to P17, 50
P30 to P32,
P50 to P57
300
µA
VCC = 5 V,
Vin = 0 V
35
VCC = 3.0 V,
Vin = 0 V
Reference
value
Rev. 6.00 Sep 12, 2006 page 411 of 526
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Section 13 Electrical Characteristics
Item
Input
capacitance
Values
Applicable
Symbol Pins
Min
Typ
Max
Unit
Test Condition Notes
Cin
All input pins
except TEST
15.0
pF
IRQ0, TEST
30.0
f = 1 MHz,
Vin = 0 V,
Ta = 25°C
VCC
15
25
mA
Active (highspeed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
8.5
VCC = 3.0 V,
fOSC = 10 MHz
1, 2
Reference
value
3
5
2
6
10
3.5
2
4
1
1
2
1
Active
IOPE1
mode
current
dissipation
IOPE2
Sleep
ISLEEP1
mode
current
dissipation
ISLEEP2
Subactive ISUB
mode
current
dissipation
VCC
VCC
VCC
VCC
Rev. 6.00 Sep 12, 2006 page 412 of 526
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mA
mA
mA
Active (medium- 1, 2
speed) mode
VCC = 5 V,
fOSC = 16 MHz
VCC = 3.0 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep (highspeed) mode
VCC = 5 V,
fOSC = 16 MHz
1, 2
VCC = 3.0 V,
fOSC = 10 MHz
1, 2
Reference
value
Sleep (medium- 1, 2
speed) mode
VCC = 5 V,
fOSC = 16 MHz
VCC = 3.0 V,
fOSC = 10 MHz
1, 2
Reference
value
mA
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW /2)
1, 2
mA
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW /8)
1, 2
Reference
value
Section 13 Electrical Characteristics
Item
Symbol
Applicable
Pins
Min
Values
Typ
Max
Unit Test Condition
Notes
Subsleep
ISUBSP
mode current
dissipation
VCC
5
10
µA
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW /2)
1, 2
Watch mode
current
dissipation
VCC
8
µA
VCC = 3.0 V
32-kHz crystal
resonator
1, 2
ISTBY
Standby
mode current
dissipation
VCC
5
µA
32-kHz crystal
resonator not
used
1, 2
RAM data
retaining
voltage
VCC
2
V
IWATCH
VRAM
Notes: 1. Pin states during current measurement are given below.
Mode
RES Pin Internal State
Active (high-speed) VCC
mode
Operates
Active (mediumspeed) mode
Operates (φOSC/128)
Sleep (high-speed)
mode
VCC
Sleep (mediumspeed)
mode
Other Pins Oscillator Pins
VCC
Only timers operate VCC
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
Only timers operate
(φOSC/128)
Subactive mode
VCC
Operates
VCC
Subsleep mode
VCC
Only timers operate, VCC
CPU stops
Watch mode
VCC
Only time base
operates, CPU
stops
VCC
Subclock oscillator:
crystal
Standby mode
VCC
CPU and timers
both stop
VCC
System clock
oscillator:
ceramic or crystal
System clock
oscillator:
ceramic or crystal
Subclock oscillator:
Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
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Section 13 Electrical Characteristics
Values
Item
Allowable output low
current (per pin)
Output pins except
port 6
Symbol
Min
Typ
Max
Unit
IOL
2
mA
10
40
80
Port 6
Allowable output low
current (total)
Output pins except
port 6
∑IOL
Port 6
mA
Allowable output high
current (per pin)
All output pins
–IOH
2
mA
Allowable output high
current (total)
All output pins
∑(–IOH)
30
mA
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Section 13 Electrical Characteristics
13.4.3
AC Characteristics (HD64F3644, HD64F3643, HD64F3642A)
Table 13.21 lists the control signal timing, and tables 13.22 and 13.23 list the serial interface
timing of the HD64F3644, HD64F3643, HD64F3642A.
Table 13.21 Control Signal Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Item
Symbol
Applicable
Pins
System clock
oscillation frequency
fOSC
OSC1, OSC2 2
2
OSC clock (φOSC)
cycle time
tOSC
System clock (φ)
cycle time
tcyc
Subclock oscillation
frequency
fW
Watch clock (φW )
cycle time
tW
Subclock (φSUB)
cycle time
tsubcyc
Min Typ
Max
Unit
16
MHz
10
OSC1, OSC2 62.5
100
trc
Oscillation
stabilization time
(ceramic resonator)
trc
Reference
Figure
VCC = 3.0 V to 5.5 V
1000 ns
1000
VCC = 3.0 V to 5.5 V
2
128
tOSC
25.6
µs
X1, X2
32.768
X1, X2
30.5
2
2
*1
Figure 13.1
VCC = 3.0 V to 5.5 V *1
kHz
VCC = 3.0 V to 5.5 V
µs
VCC = 3.0 V to 5.5 V
8
tW
VCC = 3.0 V to 5.5 V *2
tcyc
VCC = 3.0 V to 5.5 V
tsubcyc
OSC1, OSC2
40
ms
60
Instruction cycle
time
Oscillation
stabilization time
(crystal resonator)
Test Condition
OSC1, OSC2
20
40
VCC = 3.0 V to 5.5 V
ms
VCC = 3.0 V to 5.5 V
Oscillation stabilization trc
time
X1, X2
2
s
External clock high
width
tCPH
OSC1
20
ns
40
External clock low
width
tCPL
OSC1
20
40
External clock rise
time
tCPr
15
ns
VCC = 3.0 V to 5.5 V
External clock fall
time
tCPf
15
ns
VCC = 3.0 V to 5.5 V
VCC = 3.0 V to 5.5 V
Figure 13.1
VCC = 3.0 V to 5.5 V
ns
VCC = 3.0 V to 5.5 V
Rev. 6.00 Sep 12, 2006 page 415 of 526
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Section 13 Electrical Characteristics
Values
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Reference
Figure
Pin RES low width
tREL
RES
10
tcyc
VCC = 3.0 V to 5.5 V Figure 13.2
Input pin high level
width
tIH
IRQ0 to IRQ3, 2
INT0 to INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
tcyc
VCC = 3.0 V to 5.5 V Figure 13.3
tsubcyc
Input pin low level
width
tIL
IRQ0 to IRQ3, 2
INT6, INT7,
ADTRG,
TMIB, TMCIV,
TMRIV, FTCI,
FTIA, FTIB,
FTIC, FTID,
TRGV
tcyc
VCC = 3.0 V to 5.5 V
tsubcyc
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
Rev. 6.00 Sep 12, 2006 page 416 of 526
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Section 13 Electrical Characteristics
Table 13.22 Serial Interface (SCI1) Timing
VCC = 4.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Applicable
Symbol Pins
Min
Typ
Max
Unit Test Condition
Reference
Figure
Input serial clock
cycle time
tScyc
SCK1
2
tcyc
VCC = 3.0 V to
5.5 V
Figure 13.4
Input serial clock
high width
tSCKH
SCK1
0.4
tScyc
VCC = 3.0 V to
5.5 V
Input serial clock
low width
tSCKL
SCK1
0.4
tScyc
VCC = 3.0 V to
5.5 V
Input serial clock
rise time
tSCKr
SCK1
60
ns
80
Input serial clock
fall time
tSCKf
60
80
200
350
180
360
180
360
Item
SCK1
Serial output data tSOD
delay time
SO1
Serial input data
setup time
tSIS
SI1
Serial input data
hold time
tSIH
SI1
VCC = 3.0 V to
5.5 V
ns
VCC = 3.0 V to
5.5 V
ns
VCC = 3.0 V to
5.5 V
ns
VCC = 3.0 V to
5.5 V
ns
VCC = 3.0 V to
5.5 V
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Section 13 Electrical Characteristics
Table 13.23 Serial Interface (SCI3) Timing
VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise
specified.
Values
Item
Input clock
cycle
Symbol
Min
Typ
Max
Unit
Asynchronous tScyc
4
tcyc
Synchronous
6
Reference
Test Condition Figure
Figure
13.5
Input clock pulse width
tSCKW
0.4
0.6
tScyc
Transmit data delay time
(synchronous)
tTXD
1
tcyc
VCC = 4.0 V to
5.5 V
1
ns
VCC = 4.0 V to
5.5 V
ns
VCC = 4.0 V to
5.5 V
Receive data setup time
(synchronous)
tRXS
200.0
400.0
Receive data hold time
(synchronous)
tRXH
200.0
400.0
Rev. 6.00 Sep 12, 2006 page 418 of 526
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Figure
13.6
Section 13 Electrical Characteristics
13.4.4
A/D Converter Characteristics
Table 13.24 shows the A/D converter characteristics of the HD64F3644, HD64F3643, and
HD64F3642A.
Table 13.24 A/D Converter Characteristics
VCC = 3.0 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Item
Applicable
Symbol Pins
Min
Typ
Max
Test
Unit Condition
Referenc
e Figure
5.5
V
*1
Analog power AVCC
supply
voltage
AVCC
Analog input
voltage
AN0 to AN7 AVSS –0.3
AVin
3.0
Values
AVSS +0.3 V
Analog power AIOPE
supply
AISTOP1
current
AVCC
AVCC
150.0
µA
AISTOP2
AVCC
5.0
µA
CAin
AN0 to AN7
30.0
pF
RAin
Allowable
signal source
impedance
5.0
kΩ
Resolution
8
bit
Nonlinearity
error
±2.0
LSB
Quantization
error
±0.5
LSB
Absolute
accuracy
±2.5
LSB
Conversion
time
7.75
124
µs
Analog input
capacitance
1.5
mA
AVCC = 5.0 V
*2
Reference
value
*3
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
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Section 13 Electrical Characteristics
13.5
Operation Timing
Figures 13.1 to 13.6 show timing diagrams.
t OSC
VIH
OSC1
VIL
t CPH
t CPL
t CPr
t CPf
Figure 13.1 System Clock Input Timing
RES
VIL
tREL
Figure 13.2 RES Low Width Timing
IRQ0 to IRQ3,
INT0 to INT7,
ADTRG,
TMIB, FTIA,
FTIB,
TMCIV, FTIC,
FTID,
TMRIV,
FTCI, TRGV
VIH
VIL
t IL
t IH
Figure 13.3 Input Timing
Rev. 6.00 Sep 12, 2006 page 420 of 526
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Section 13 Electrical Characteristics
t Scyc
SCK 1
V IH or V OH*
V IL or V OL *
t SCKL
t SCKH
t SCKf
t SCKr
t SOD
SO 1
VOH*
VOL *
t SIS
t SIH
SI 1
Note: * Output timing reference levels
Output high: VOH = 2.0 V
Output low: VOL = 0.8 V
Load conditions are shown in figure 13.7.
Figure 13.4 SCI1 Input/Output Timing
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Section 13 Electrical Characteristics
t SCKW
SCK 3
t Scyc
Figure 13.5 SCK3 Input Clock Timing
t Scyc
SCK 3
VIH or VOH *
VIL or VOL *
t TXD
*
TXD
(transmit data)
VOH
VOL
*
t RXS
t RXH
RXD
(receive data)
Note: * Output timing reference levels
Output high: VOH = 2.0 V
Output low: VOL = 0.8 V
Load conditions are shown in figure 13.7.
Figure 13.6 SCI3 Synchronous Mode Input/Output Timing
Rev. 6.00 Sep 12, 2006 page 422 of 526
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Section 13 Electrical Characteristics
13.6
Output Load Circuit
VCC
2.4 kΩ
Output pin
30 pF
12 k Ω
Figure 13.7 Output Load Condition
Rev. 6.00 Sep 12, 2006 page 423 of 526
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Section 13 Electrical Characteristics
Rev. 6.00 Sep 12, 2006 page 424 of 526
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Appendix A CPU Instruction Set
Appendix A CPU Instruction Set
A.1
Instructions
Operation Notation
Rd8/16
General register (destination) (8 or 16 bits)
Rs8/16
General register (source) (8 or 16 bits)
Rn8/16
General register (8 or 16 bits)
CCR
Condition code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
PC
Program counter
SP
Stack pointer
#xx: 3/8/16
Immediate data (3, 8, or 16 bits)
d: 8/16
Displacement (8 or 16 bits)
@aa: 8/16
Absolute address (8 or 16 bits)
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
Logical AND
∨
Logical OR
⊕
Exclusive logical OR
→
—
Move
Logical complement
Condition Code Notation
Symbol
Modified according to the instruction result
*
Undefined (value not guaranteed)
0
Always cleared to 0
—
Not affected by the instruction execution result
Rev. 6.00 Sep 12, 2006 page 425 of 526
REJ09B0326-0600
Appendix A CPU Instruction Set
Table A.1 lists the H8/300L CPU instruction set.
Instruction Set
B #xx:8 → Rd8
MOV.B Rs, Rd
B Rs8 → Rd8
MOV.B @Rs, Rd
B @Rs16 → Rd8
MOV.B @(d:16, Rs), Rd
B @(d:16, Rs16) → Rd8
MOV.B @Rs+, Rd
B @Rs16 → Rd8
Rs16+1 → Rs16
MOV.B @aa:8, Rd
B @aa:8 → Rd8
2
— —
MOV.B @aa:16, Rd
B @aa:16 → Rd8
4
— —
MOV.B Rs, @Rd
B Rs8 → @Rd16
MOV.B Rs, @(d:16, Rd)
B Rs8 → @(d:16, Rd16)
MOV.B Rs, @–Rd
B Rd16–1 → Rd16
Rs8 → @Rd16
MOV.B Rs, @aa:8
B Rs8 → @aa:8
2
— —
MOV.B Rs, @aa:16
B Rs8 → @aa:16
4
— —
MOV.W #xx:16, Rd
W #xx:16 → Rd
MOV.W Rs, Rd
W Rs16 → Rd16
MOV.W @Rs, Rd
W @Rs16 → Rd16
2
— —
2
— —
2
W @Rs16 → Rd16
Rs16+2 → Rs16
MOV.W @aa:16, Rd
W @aa:16 → Rd16
MOV.W Rs, @Rd
W Rs16 → @Rd16
MOV.W Rs, @(d:16, Rd) W Rs16 → @(d:16, Rd16)
MOV.W Rs, @–Rd
W Rd16–2 → Rd16
Rs16 → @Rd16
MOV.W Rs, @aa:16
W Rs16 → @aa:16
POP Rd
W @SP → Rd16
SP+2 → SP
Rev. 6.00 Sep 12, 2006 page 426 of 526
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— —
2
— —
2
— —
4
— —
2
— —
4
— —
2
— —
2
MOV.W @(d:16, Rs), Rd W @(d:16, Rs16) → Rd16
MOV.W @Rs+, Rd
— —
4
— —
4
— —
2
— —
4
2
— —
— —
4
— —
2
— —
4
2
— —
— —
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
MOV.B #xx:8, Rd
0 — 2
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
H N Z V C
0 — 4
↔ ↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔ ↔ ↔
I
No. of States
Condition Code
0 — 4
↔ ↔ ↔ ↔
↔ ↔ ↔ ↔
Implied
@aa: 8/16
@(d:8, PC)
@@aa
@–Rn/@Rn+
Rn
@Rn
@(d:16, Rn)
Operation
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
0 — 6
↔ ↔
↔ ↔
Table A.1
0 — 6
0 — 2
0 — 4
0 — 6
0 — 6
0 — 6
0 — 4
0 — 6
0 — 6
0 — 6
0 — 4
0 — 2
0 — 4
0 — 6
0 — 6
0 — 4
0 — 6
0 — 6
0 — 6
Appendix A CPU Instruction Set
Condition Code
I
H N Z V C
No. of States
@(d:8, PC)
@@aa
Implied
@(d:16, Rn)
@–Rn/@Rn+
@aa: 8/16
@Rn
Operation
#xx: 8/16
Rn
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
W SP–2 → SP
Rs16 → @SP
ADD.B #xx:8, Rd
B Rd8+#xx:8 → Rd8
ADD.B Rs, Rd
ADD.W Rs, Rd
ADDX.B #xx:8, Rd
B Rd8+#xx:8 +C → Rd8
ADDX.B Rs, Rd
B Rd8+Rs8 +C → Rd8
2
—
ADDS.W #1, Rd
W Rd16+1 → Rd16
2
— — — — — — 2
ADDS.W #2, Rd
W Rd16+2 → Rd16
2
— — — — — — 2
INC.B Rd
B Rd8+1 → Rd8
2
— —
DAA.B Rd
B Rd8 decimal adjust → Rd8
2
— *
SUB.B Rs, Rd
B Rd8–Rs8 → Rd8
2
—
SUB.W Rs, Rd
W Rd16–Rs16 → Rd16
2
— (1)
SUBX.B #xx:8, Rd
B Rd8–#xx:8 –C → Rd8
SUBX.B Rs, Rd
B Rd8–Rs8 –C → Rd8
2
—
SUBS.W #1, Rd
W Rd16–1 → Rd16
2
— — — — — — 2
SUBS.W #2, Rd
W Rd16–2 → Rd16
2
— — — — — — 2
DEC.B Rd
B Rd8–1 → Rd8
2
— —
DAS.B Rd
B Rd8 decimal adjust → Rd8
2
— *
NEG.B Rd
B 0–Rd → Rd
2
—
CMP.B #xx:8, Rd
B Rd8–#xx:8
— (1)
2
—
2
—
(2)
(2)
↔ ↔
↔
↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔
—
(2)
(2)
↔ ↔ ↔
↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔ ↔
2
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
2
↔
W Rd16+Rs16 → Rd16
2
2
2
2
2
— 2
* (3) 2
↔ ↔ ↔ ↔
↔ ↔ ↔ ↔
B Rd8+Rs8 → Rd8
—
↔
—
2
0 — 6
2
2
2
2
— 2
* — 2
↔ ↔ ↔ ↔
↔ ↔ ↔ ↔
2
— —
↔ ↔
↔ ↔
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔
2
↔
↔
PUSH Rs
2
2
CMP.B Rs, Rd
B Rd8–Rs8
2
CMP.W Rs, Rd
W Rd16–Rs16
2
— (1)
MULXU.B Rs, Rd
B Rd8 × Rs8 → Rd16
2
— — — — — — 14
—
2
2
Rev. 6.00 Sep 12, 2006 page 427 of 526
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Appendix A CPU Instruction Set
I H N Z V C
DIVXU.B Rs, Rd
B Rd16÷Rs8 → Rd16 (RdH:
remainder, RdL: quotient)
AND.B #xx:8, Rd
B Rd8∧#xx:8 → Rd8
AND.B Rs, Rd
B Rd8∧Rs8 → Rd8
OR.B #xx:8, Rd
B Rd8∨#xx:8 → Rd8
OR.B Rs, Rd
B Rd8∨Rs8 → Rd8
XOR.B #xx:8, Rd
B Rd8⊕#xx:8 → Rd8
XOR.B Rs, Rd
B Rd8⊕Rs8 → Rd8
2
— —
NOT.B Rd
B Rd → Rd
2
— —
SHAL.B Rd
B
2
— —
2
— —
2
— —
2
— —
2
— —
2
— —
2
— —
2
— —
↔
↔
2
0
↔
2
0
↔
2
0
↔
2
0
↔
2
0
↔
2
0
↔
2
0
↔
2
b0
0
C
b0
C
b0
b0
C
C
b7
ROTR.B Rd
0 — 2
↔
↔
0
B
B
0 — 2
↔
↔
C
b7
ROTL.B Rd
0 — 2
b0
b7
ROTXR.B Rd
0 — 2
↔
↔
B
— —
0 — 2
↔
↔
B
— —
0 — 2
b0
b7
ROTXL.B Rd
2
2
C
b7
SHLR.B Rd
— —
↔
↔
B
— —
0 — 2
↔
↔
SHLL.B Rd
2
B
b7
— —
2
0
— — (5) (6) — — 14
↔
↔
SHAR.B Rd
2
C
b7
2
No. of States
Condition Code
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
Implied
@aa: 8/16
@(d:8, PC)
@@aa
@Rn
@(d:16, Rn)
@–Rn/@Rn+
Rn
Operation
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
b0
B
C
b7
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b0
Appendix A CPU Instruction Set
B (#xx:3 of Rd8) ← 1
BSET #xx:3, @Rd
B (#xx:3 of @Rd16) ← 1
BSET #xx:3, @aa:8
B (#xx:3 of @aa:8) ← 1
BSET Rn, Rd
B (Rn8 of Rd8) ← 1
BSET Rn, @Rd
B (Rn8 of @Rd16) ← 1
BSET Rn, @aa:8
B (Rn8 of @aa:8) ← 1
BCLR #xx:3, Rd
B (#xx:3 of Rd8) ← 0
BCLR #xx:3, @Rd
B (#xx:3 of @Rd16) ← 0
BCLR #xx:3, @aa:8
B (#xx:3 of @aa:8) ← 0
BCLR Rn, Rd
B (Rn8 of Rd8) ← 0
BCLR Rn, @Rd
B (Rn8 of @Rd16) ← 0
BCLR Rn, @aa:8
B (Rn8 of @aa:8) ← 0
BNOT #xx:3, Rd
B (#xx:3 of Rd8) ←
(#xx:3 of Rd8)
BNOT #xx:3, @Rd
B (#xx:3 of @Rd16) ←
(#xx:3 of @Rd16)
BNOT #xx:3, @aa:8
B (#xx:3 of @aa:8) ←
(#xx:3 of @aa:8)
BNOT Rn, Rd
B (Rn8 of Rd8) ←
(Rn8 of Rd8)
BNOT Rn, @Rd
B (Rn8 of @Rd16) ←
(Rn8 of @Rd16)
BNOT Rn, @aa:8
B (Rn8 of @aa:8) ←
(Rn8 of @aa:8)
BTST #xx:3, Rd
B (#xx:3 of Rd8) → Z
BTST #xx:3, @Rd
B (#xx:3 of @Rd16) → Z
BTST #xx:3, @aa:8
B (#xx:3 of @aa:8) → Z
BTST Rn, Rd
B (Rn8 of Rd8) → Z
BTST Rn, @Rd
B (Rn8 of @Rd16) → Z
BTST Rn, @aa:8
B (Rn8 of @aa:8) → Z
I
H N Z V C
No. of States
@(d:8, PC)
@@aa
Implied
@aa: 8/16
2
Condition Code
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — —
4
— — —
4
2
— — —
— — —
4
— — —
4
— — —
↔ ↔ ↔ ↔ ↔ ↔
BSET #xx:3, Rd
@Rn
@(d:16, Rn)
@–Rn/@Rn+
Operation
#xx: 8/16
Rn
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
— — 2
— — 6
— — 6
— — 2
— — 6
— — 6
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Appendix A CPU Instruction Set
BLD #xx:3, @Rd
B (#xx:3 of @Rd16) → C
BLD #xx:3, @aa:8
B (#xx:3 of @aa:8) → C
BILD #xx:3, Rd
B (#xx:3 of Rd8) → C
BILD #xx:3, @Rd
B (#xx:3 of @Rd16) → C
BILD #xx:3, @aa:8
B (#xx:3 of @aa:8) → C
BST #xx:3, Rd
B C → (#xx:3 of Rd8)
BST #xx:3, @Rd
B C → (#xx:3 of @Rd16)
BST #xx:3, @aa:8
B C → (#xx:3 of @aa:8)
BIST #xx:3, Rd
B C → (#xx:3 of Rd8)
BIST #xx:3, @Rd
B C → (#xx:3 of @Rd16)
BIST #xx:3, @aa:8
B C → (#xx:3 of @aa:8)
BAND #xx:3, Rd
B C∧(#xx:3 of Rd8) → C
BAND #xx:3, @Rd
B C∧(#xx:3 of @Rd16) → C
BAND #xx:3, @aa:8
B C∧(#xx:3 of @aa:8) → C
BIAND #xx:3, Rd
B C∧(#xx:3 of Rd8) → C
BIAND #xx:3, @Rd
B C∧(#xx:3 of @Rd16) → C
BIAND #xx:3, @aa:8
B C∧(#xx:3 of @aa:8) → C
BOR #xx:3, Rd
B C∨(#xx:3 of Rd8) → C
BOR #xx:3, @Rd
B C∨(#xx:3 of @Rd16) → C
BOR #xx:3, @aa:8
B C∨(#xx:3 of @aa:8) → C
BIOR #xx:3, Rd
B C∨(#xx:3 of Rd8) → C
BIOR #xx:3, @Rd
B C∨(#xx:3 of @Rd16) → C
BIOR #xx:3, @aa:8
B C∨(#xx:3 of @aa:8) → C
BXOR #xx:3, Rd
B C⊕(#xx:3 of Rd8) → C
BXOR #xx:3, @Rd
B C⊕(#xx:3 of @Rd16) → C
BXOR #xx:3, @aa:8
B C⊕(#xx:3 of @aa:8) → C
BIXOR #xx:3, Rd
B C⊕(#xx:3 of Rd8) → C
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H N Z V C
— — — — —
4
2
— — — — —
— — — — —
4
— — — — —
4
2
— — — — —
No. of States
I
— — — — —
4
2
6
6
2
6
6
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — —
4
— — — — —
4
2
— — — — —
— — — — —
4
— — — — —
4
2
— — — — —
— — — — —
4
— — — — —
4
2
— — — — —
— — — — —
4
— — — — —
4
2
— — — — —
— — — — —
4
— — — — —
4
2
Implied
@aa: 8/16
@(d:8, PC)
@@aa
@Rn
@(d:16, Rn)
@–Rn/@Rn+
2
↔ ↔ ↔ ↔ ↔ ↔
B (#xx:3 of Rd8) → C
Condition Code
— — — — —
— — — — —
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
BLD #xx:3, Rd
Rn
Operation
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
2
6
6
2
6
6
2
6
6
2
6
6
2
6
6
2
Appendix A CPU Instruction Set
B C⊕(#xx:3 of @Rd16) → C
4
I H N Z V C
— — — — —
No. of States
@(d:8, PC)
@@aa
Implied
@(d:16, Rn)
@–Rn/@Rn+
@aa: 8/16
@Rn
Branching
Condition
Condition Code
↔ ↔
BIXOR #xx:3, @Rd
Operation
#xx: 8/16
Rn
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
6
BIXOR #xx:3, @aa:8
B C⊕(#xx:3 of @aa:8) → C
BRA d:8 (BT d:8)
— PC ← PC+d:8
2
— — — — — — 4
BRN d:8 (BF d:8)
— PC ← PC+2
2
— — — — — — 4
BHI d:8
C∨Z=0
2
— — — — — — 4
C∨Z=1
2
— — — — — — 4
C=0
2
— — — — — — 4
C=1
2
— — — — — — 4
Z=0
2
— — — — — — 4
BEQ d:8
— If
condition
—
is true
— then
— PC ←
PC+d:8
— else next;
—
Z=1
2
— — — — — — 4
BVC d:8
—
V=0
2
— — — — — — 4
BVS d:8
—
V=1
2
— — — — — — 4
BPL d:8
—
N=0
2
— — — — — — 4
BMI d:8
—
N=1
2
— — — — — — 4
BGE d:8
—
N⊕V = 0
2
— — — — — — 4
BLT d:8
—
N⊕V = 1
2
— — — — — — 4
BGT d:8
—
Z ∨ (N⊕V) = 0
2
— — — — — — 4
BLE d:8
—
Z ∨ (N⊕V) = 1
2
— — — — — — 4
JMP @Rn
— PC ← Rn16
JMP @aa:16
— PC ← aa:16
JMP @@aa:8
— PC ← @aa:8
BSR d:8
— SP–2 → SP
PC → @SP
PC ← PC+d:8
JSR @Rn
— SP–2 → SP
PC → @SP
PC ← Rn16
JSR @aa:16
— SP–2 → SP
PC → @SP
PC ← aa:16
BLS d:8
BCC d:8 (BHS d:8)
BCS d:8 (BLO d:8)
BNE d:8
4
— — — — —
2
6
— — — — — — 4
4
— — — — — — 6
2
2
2
— — — — — — 8
— — — — — — 6
— — — — — — 6
4
— — — — — — 8
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Appendix A CPU Instruction Set
I
H N Z V C
No. of States
Implied
Condition Code
JSR @@aa:8
— SP–2 → SP
PC → @SP
PC ← @aa:8
RTS
— PC ← @SP
SP+2 → SP
2 — — — — — — 8
RTE
— CCR ← @SP
SP+2 → SP
PC ← @SP
SP+2 → SP
2
SLEEP
— Transit to sleep mode.
LDC #xx:8, CCR
B #xx:8 → CCR
LDC Rs, CCR
B Rs8 → CCR
2
↔ ↔
@aa: 8/16
@(d:8, PC)
@@aa
@Rn
@(d:16, Rn)
@–Rn/@Rn+
Rn
Operation
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
STC CCR, Rd
B CCR → Rd8
2
— — — — — — 2
ANDC #xx:8, CCR
B CCR∧#xx:8 → CCR
2
ORC #xx:8, CCR
B CCR∨#xx:8 → CCR
2
XORC #xx:8, CCR
B CCR⊕#xx:8 → CCR
2
NOP
— PC ← PC+2
2 — — — — — — 2
EEPMOV
— if R4L≠0
Repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4L–1 → R4L
Until R4L=0
else next;
4 — — — — — — 4
↔
↔
↔
↔
↔
— — — — — — 8
↔
2
↔ ↔
↔ ↔
↔ ↔ ↔
↔ ↔ ↔
↔ ↔
↔ ↔
↔ ↔
↔ ↔ ↔
↔ ↔ ↔
↔ ↔ ↔
↔ ↔ ↔
2 — — — — — — 2
2
Notes: (1) Set to 1 when there is a carry or borrow from bit 11; otherwise cleared to 0.
(2) If the result is zero, the previous value of the flag is retained; otherwise the flag is
cleared to 0.
(3) Set to 1 if decimal adjustment produces a carry; otherwise retains value prior to
arithmetic operation.
(4) The number of states required for execution is 4n + 9 (n = value of R4L).
(5) Set to 1 if the divisor is negative; otherwise cleared to 0.
(6) Set to 1 if the divisor is zero; otherwise cleared to 0.
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10
2
2
2
2
2
Appendix A CPU Instruction Set
A.2
Operation Code Map
Table A.2 is an operation code map. It shows the operation codes contained in the first byte of the
instruction code (bits 15 to 8 of the first instruction word).
Instruction when first bit of byte 2 (bit 7 of first instruction word) is 0.
Instruction when first bit of byte 2 (bit 7 of first instruction word) is 1.
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OR
XOR
AND
MOV
C
D
E
F
Note: * The PUSH and POP instructions are identical in machine language to MOV instructions.
8
BVC
SUBX
BILD
BIST
BLD
BST
BEQ
MOV
NEG
NOT
LDC
7
B
BIAND
BAND
RTE
BNE
AND
ANDC
6
CMP
BIXOR
BXOR
BSR
BCS
XOR
XORC
5
A
BIOR
BOR
RTS
BCC
OR
ORC
4
ADDX
BTST
BLS
ROTR
ROTXR
LDC
3
9
BCLR
BHI
ROTL
ROTXL
STC
2
ADD
BNOT
DIVXU
BRN
SHAR
SHLR
SLEEP
1
8
7
BSET
MULXU
5
6
BRA
SHAL
SHLL
NOP
0
4
3
Low
SUB
ADD
MOV
BVS
9
JMP
BPL
DEC
INC
A
C
CMP
MOV
BLT
D
JSR
BGT
SUBX
ADDX
E
Bit-manipulation instructions
BGE
MOV *
EEPMOV
BMI
SUBS
ADDS
B
BLE
DAS
DAA
F
Table A.2
2
1
0
High
Appendix A CPU Instruction Set
Operation Code Map
Appendix A CPU Instruction Set
A.3
Number of Execution States
The tables here can be used to calculate the number of states required for instruction execution.
Table A.3 indicates the number of states required for each cycle (instruction fetch, branch address
read, stack operation, byte data access, word data access, internal operation).
Table A.4 indicates the number of cycles of each type occurring in each instruction. The total
number of states required for execution of an instruction can be calculated from these two tables as
follows:
Execution states = I × SI + J × SJ + K × SK + L × SL + M × SM + N × SN
Examples: When instruction is fetched from on-chip ROM, and an on-chip RAM is accessed.
BSET #0, @FF00
From table A.4:
I = L = 2, J = K = M = N= 0
From table A.3:
SI = 2, SL = 2
Number of states required for execution = 2 × 2 + 2 × 2 = 8
When instruction is fetched from on-chip ROM, branch address is read from on-chip ROM, and
on-chip RAM is used for stack area.
JSR @@ 30
From table A.4:
I = 2, J = K = 1,
L=M=N=0
From table A.3:
SI = SJ = SK = 2
Number of states required for execution = 2 × 2 + 1 × 2+ 1 × 2 = 8
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Appendix A CPU Instruction Set
Table A.3
Number of Cycles in Each Instruction
Access Location
Execution Status
(Instruction Cycle)
On-Chip Memory
On-Chip Peripheral Module
2
—
Instruction fetch
SI
Branch address read
SJ
Stack operation
SK
Byte data access
SL
2 or 3*
Word data access
SM
—
Internal operation
SN
Note:
*
1
Depends on which on-chip module is accessed. See section 2.9.1, Notes on Data
Access for details.
Rev. 6.00 Sep 12, 2006 page 436 of 526
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Appendix A CPU Instruction Set
Table A.4
Number of Cycles in Each Instruction
Instruction Mnemonic
ADD
ADDS
Instruction Branch
Stack
Byte Data
Fetch
Addr. Read Operation Access
I
J
K
L
ADD.B #xx:8, Rd
1
ADD.B Rs, Rd
1
ADD.W Rs, Rd
1
ADDS.W #1, Rd
1
ADDS.W #2, Rd
1
ADDX
ADDX.B #xx:8, Rd
1
ADDX.B Rs, Rd
1
AND
AND.B #xx:8, Rd
1
AND.B Rs, Rd
1
ANDC
ANDC #xx:8, CCR
1
BAND
BAND #xx:3, Rd
1
Bcc
BCLR
BAND #xx:3, @Rd
2
1
BAND #xx:3, @aa:8
2
1
BRA d:8 (BT d:8)
2
BRN d:8 (BF d:8)
2
BHI d:8
2
BLS d:8
2
BCC d:8 (BHS d:8)
2
BCS d:8 (BLO d:8)
2
BNE d:8
2
BEQ d:8
2
BVC d:8
2
BVS d:8
2
BPL d:8
2
BMI d:8
2
BGE d:8
2
BLT d:8
2
BGT d:8
2
BLE d:8
2
BCLR #xx:3, Rd
1
BCLR #xx:3, @Rd
2
2
BCLR #xx:3, @aa:8
2
2
BCLR Rn, Rd
1
Word Data Internal
Access
Operation
M
N
Rev. 6.00 Sep 12, 2006 page 437 of 526
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Appendix A CPU Instruction Set
Instruction Mnemonic
Instruction Branch
Stack
Byte Data
Fetch
Addr. Read Operation Access
I
J
K
L
BCLR
BCLR Rn, @Rd
2
2
BCLR Rn, @aa:8
2
2
BIAND #xx:3, Rd
1
BIAND #xx:3, @Rd
2
1
BIAND #xx:3, @aa:8 2
1
BIAND
BILD
BIOR
BIST
BIXOR
BLD
BNOT
BOR
BSET
BILD #xx:3, Rd
1
BILD #xx:3, @Rd
2
1
BILD #xx:3, @aa:8
2
1
BIOR #xx:3, Rd
1
BIOR #xx:3, @Rd
2
1
BIOR #xx:3, @aa:8
2
1
BIST #xx:3, Rd
1
BIST #xx:3, @Rd
2
2
BIST #xx:3, @aa:8
2
2
BIXOR #xx:3, Rd
1
BIXOR #xx:3, @Rd
2
1
BIXOR #xx:3, @aa:8 2
1
BLD #xx:3, Rd
1
BLD #xx:3, @Rd
2
1
BLD #xx:3, @aa:8
2
1
BNOT #xx:3, Rd
1
BNOT #xx:3, @Rd
2
2
BNOT #xx:3, @aa:8
2
2
BNOT Rn, Rd
1
BNOT Rn, @Rd
2
2
BNOT Rn, @aa:8
2
2
BOR #xx:3, Rd
1
BOR #xx:3, @Rd
2
1
BOR #xx:3, @aa:8
2
1
BSET #xx:3, Rd
1
BSET #xx:3, @Rd
2
2
BSET #xx:3, @aa:8
2
2
BSET Rn, Rd
1
BSET Rn, @Rd
2
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2
Word Data Internal
Access
Operation
M
N
Appendix A CPU Instruction Set
Instruction Mnemonic
Instruction Branch
Stack
Byte Data
Fetch
Addr. Read Operation Access
I
J
K
L
BSET
BSET Rn, @aa:8
2
BSR
BSR d:8
2
BST
BST #xx:3, Rd
1
BST #xx:3, @Rd
2
2
BST #xx:3, @aa:8
2
2
BTST #xx:3, Rd
1
BTST
BXOR
CMP
2
1
2
1
BTST Rn, Rd
1
BTST Rn, @Rd
2
1
1
BTST Rn, @aa:8
2
BXOR #xx:3, Rd
1
BXOR #xx:3, @Rd
2
1
BXOR #xx:3, @aa:8 2
1
CMP. B #xx:8, Rd
1
1
CMP.W Rs, Rd
1
DAA.B Rd
1
DAS
DAS.B Rd
1
DEC
DEC.B Rd
1
DIVXU
DIVXU.B Rs, Rd
1
EEPMOV
EEPMOV
2
INC
INC.B Rd
1
JSR
LDC
MOV
1
BTST #xx:3, @aa:8
DAA
JMP
2
BTST #xx:3, @Rd
CMP. B Rs, Rd
JMP @Rn
2
JMP @aa:16
2
JMP @@aa:8
2
JSR @Rn
2
JSR @aa:16
2
JSR @@aa:8
2
LDC #xx:8, CCR
1
LDC Rs, CCR
1
MOV.B #xx:8, Rd
1
MOV.B Rs, Rd
1
Word Data Internal
Access
Operation
M
N
12
2n+2*
1
2
1
2
1
1
1
2
1
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Appendix A CPU Instruction Set
Instruction Mnemonic
Instruction Branch
Stack
Byte Data
Fetch
Addr. Read Operation Access
I
J
K
L
MOV
1
1
MOV.B @(d:16, Rs), 2
Rd
1
MOV.B @Rs+, Rd
1
MOV.B @Rs, Rd
1
Word Data Internal
Access
Operation
M
N
2
MOV.B @aa:8, Rd
1
1
MOV.B @aa:16, Rd
2
1
MOV.B Rs, @Rd
1
1
MOV.B Rs, @(d:16,
Rd)
2
1
MOV.B Rs, @–Rd
1
1
MOV.B Rs, @aa:8
1
1
MOV.B Rs, @aa:16
2
1
2
MOV.W #xx:16, Rd
2
MOV.W Rs, Rd
1
MOV.W @Rs, Rd
1
1
MOV.W @(d:16, Rs), 2
Rd
1
1
1
MOV.W @aa:16, Rd 2
MOV.W @Rs+, Rd
1
MOV.W Rs, @Rd
1
1
MOV.W Rs, @(d:16d) 2
1
MOV.W Rs, @–Rd
1
1
MOV.W Rs, @aa:16 2
1
MULXU
MULXU.B Rs, Rd
1
NEG
NEG.B Rd
1
NOP
NOP
1
NOT
NOT.B Rd
1
OR
OR.B #xx:8, Rd
1
OR.B Rs, Rd
1
ORC
ORC #xx:8, CCR
1
ROTL
ROTL.B Rd
1
ROTR
ROTR.B Rd
1
ROTXL
ROTXL.B Rd
1
ROTXR
ROTXR.B Rd
1
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2
2
12
Appendix A CPU Instruction Set
Instruction Mnemonic
Instruction Branch
Stack
Byte Data
Fetch
Addr. Read Operation Access
I
J
K
L
RTE
RTE
2
2
2
RTS
RTS
2
1
2
SHAL
SHAL.B Rd
1
SHAR
SHAR.B Rd
1
SHLL
SHLL.B Rd
1
SHLR
SHLR.B Rd
1
SLEEP
SLEEP
1
STC
STC CCR, Rd
1
SUB
SUB.B Rs, Rd
1
SUB.W Rs, Rd
1
SUBS.W #1, Rd
1
SUBS
Word Data Internal
Access
Operation
M
N
SUBS.W #2, Rd
1
POP
POP Rd
1
1
2
PUSH
PUSH Rs
1
1
2
SUBX
SUBX.B #xx:8, Rd
1
SUBX.B Rs, Rd
1
XOR.B #xx:8, Rd
1
XOR.B Rs, Rd
1
XORC #xx:8, CCR
1
XOR
XORC
Note: n: Initial value in R4L. The source and destination operands are accessed n + 1 times each.
Rev. 6.00 Sep 12, 2006 page 441 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
Appendix B Internal I/O Registers
B.1
Addresses
Register
Address Name
Bit 7
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
ICIBE
ICICE
ICIDE
OCIAE
OCIBE
OVIE
—
Timer X
H'F740
H'F741
H'F742
H'F743
H'F744
H'F770
TIER
ICIAE
H'F771
TCSRX
ICFA
ICFB
ICFC
ICFD
OCFA
OCFB
OVF
CCLRA
H'F772
FRCH
FRCH7
FRCH6
FRCH5
FRCH4
FRCH3
FRCH2
FRCH1
FRCH0
H'F773
FRCL
FRCL7
FRCL6
FRCL5
FRCL4
FRCL3
FRCL2
FRCL1
FRCL0
H'F774
OCRAH/
OCRBH
OCRAH7/ OCRAH6/ OCRAH5/ OCRAH4/ OCRAH3/ OCRAH2/ OCRAH1/ OCRAH0/
OCRBH7 OCRBH6 OCRBH5 OCRBH4 OCRBH3 OCRBH2 OCRBH1 OCRBH0
H'F775
OCRAL/
OCRBL
OCRAL7/ OCRAL6/ OCRAL5/ OCRAL4/ OCRAL3/ OCRAL2/ OCRAL1/ OCRAL0/
OCRBL7 OCRBL6 OCRBL5 OCRBL4 OCRBL3 OCRBL2 OCRBL1 OCRBL0
H'F776
TCRX
IEDGA
IEDGB
IEDGC
IEDGD
BUFEA
BUFEB
CKS1
CKS0
H'F777
TOCR
—
—
—
OCRS
OEA
OEB
OLVLA
OLVLB
H'F778
ICRAH
ICRAH7 ICRAH6 ICRAH5 ICRAH4 ICRAH3 ICRAH2 ICRAH1 ICRAH0
H'F779
ICRAL
ICRAL7 ICRAL6 ICRAL5 ICRAL4 ICRAL3 ICRAL2 ICRAL1 ICRAL0
F'F77A
ICRBH
ICRBH7 ICRBH6 ICRBH5 ICRBH4 ICRBH3 ICRBH2 ICRBH1 ICRBH0
F'F77B
ICRBL
ICRBL7 ICRBL6 ICRBL5 ICRBL4 ICRBL3 ICRBL2 ICRBL1 ICRBL0
H'F77C
ICRCH
ICRCH7 ICRCH6 ICRCH5 ICRCH4 ICRCH3 ICRCH2 ICRCH1 ICRCH0
H'F77D
ICRCL
ICRCL7 ICRCL6 ICRCL5 ICRCL4 ICRCL3 ICRCL2 ICRCL1 ICRCL0
H'F77E
ICRDH
ICRDH7 ICRDH6 ICRDH5 ICRDH4 ICRDH3 ICRDH2 ICRDH1 ICRDH0
H'F77F
ICRDL
ICRDL7 ICRDL6 ICRDL5 ICRDL4 ICRDL3 ICRDL2 ICRDL1 ICRDL0
H'FF80
FLMCR
VPP
—
—
—
EV
PV
E
P
H'FF82
EBR1
—
—
—
—
LB3
LB2
LB1
LB0
H'FF83
EBR2
SB7
SB6
SB5
SB4
SB3
SB2
SB1
SB0
H'FF81
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Flash
memory
(flash
memory
version
only)
Appendix B Internal I/O Registers
Bit Names
Register
Address Name
Bit 7
Bit 6
Bit 5
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
H'FFA0
SCR1
SNC1
SNC0
MRKON LTCH
CKS3
CKS2
CKS1
CKS0
SCI1
H'FFA1
SCSR1
—
H'FFA2
SDRU
SDRU7
SOL
ORER
—
—
—
MTRF
STF
SDRU6
SDRU5
SDRU4
SDRU3
SDRU2
SDRU1
SDRU0
H'FFA3
SDRL
SDRL7
SDRL6
SDRL5
SDRL4
SDRL3
SDRL2
SDRL1
SDRL0
Bit 4
H'FFA4
H'FFA5
H'FFA6
H'FFA7
H'FFA8
SMR
COM
CHR
PE
PM
STOP
MP
CKS1
CKS0
H'FFA9
BRR
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
H'FFAA
SCR3
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
H'FFAB
TDR
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
H'FFAC SSR
TDRE
RDRF
OER
FER
PER
TEND
MPBR
MPBT
H'FFAD RDR
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
TMA7
TMA6
TMA5
—
TMA3
TMA2
TMA1
TMA0
SCI3
H'FFAE
H'FFAF
H'FFB0
TMA
H'FFB1
TCA
TCA7
TCA6
TCA5
TCA4
TCA3
TCA2
TCA1
TCA0
H'FFB2
TMB1
TMB17
—
—
—
—
TMB12
TMB11
TMB10
H'FFB3
TCB1/
TLB1
TCB17/
TLB17
TCB16/
TLB16
TCB15/
TLB15
TCB14/
TLB14
TCB13/
TLB13
TCB12/
TLB12
TCB11/
TLB11
TCB10/
TLB10
TCRV0
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
H'FFB9
TCSRV
CMFB
CMFA
OVF
—
OS3
OS2
OS1
OS0
H'FFBA
TCORA
TCORA7 TCORA6 TCORA5 TCORA4 TCORA3 TCORA2 TCORA1 TCORA0
H'FFBB
Timer A
Timer B1
H'FFB4
H'FFB5
H'FFB6
H'FFB7
H'FFB8
TCORB
TCORB7 TCORB6 TCORB5 TCORB4 TCORB3 TCORB2 TCORB1 TCORB0
H'FFBC TCNTV
TCNTV7 TCNTV6 TCNTV5 TCNTV4 TCNTV3 TCNTV2 TCNTV1 TCNTV0
H'FFBD TCRV1
—
—
—
TVEG1
TVEG0
TRGE
—
Timer V
ICKS0
Rev. 6.00 Sep 12, 2006 page 443 of 526
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Appendix B Internal I/O Registers
Bit Names
Register
Address Name
Bit 7
Bit 6
Bit 5
Bit 4
H'FFBE
TCSRW B6WI
TCWE
B4WI
H'FFBF
TCW
TCW7
TCW6
H'FFC4
AMR
CKS
H'FFC5
ADRR
H'FFC6
Bit 3
Bit 2
Bit 1
Bit 0
TCSRWE B2WI
WDON
B0WI
WRST
TCW5
TCW4
TCW3
TCW2
TCW1
TCW0
TRGE
—
—
CH3
CH2
CH1
CH0
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
ADR0
ADSR
ADSF
—
—
—
—
—
—
—
PWCR
—
—
—
—
—
—
—
PWCR0
H'FFD1
PWDRU —
—
PWDRU5 PWDRU4 PWDRU3 PWDRU2 PWDRU1 PWDRU0
H'FFD2
PWDRL PWDRL7 PWDRL6 PWDRL5 PWDRL4 PWDRL3 PWDRL2 PWDRL1 PWDRL0
Module
Name
Watchdog
timer
H'FFC0
H'FFC1
H'FFC2
H'FFC3
A/D
converter
H'FFC7
H'FFC8
H'FFC9
H'FFCA
H'FFCB
H'FFCC
H'FFCD
H'FFCE
H'FFCF
H'FFD0
14-bit
PWM
H'FFD3
H'FFD4
PDR1
P17
P16
P15
P14
—
—
—
P10
H'FFD5
PDR2
—
—
—
—
—
P22
P21
P20
H'FFD6
PDR3
—
—
—
—
—
P32
P31
P30
H'FFD8
PDR5
P57
P56
P55
P54
P53
P52
P51
P50
H'FFD9
PDR6
P67
P66
P65
P64
P63
P62
P61
P60
H'FFDA PDR7
P77
P76
P75
P74
P73
—
—
—
H'FFDB PDR8
P87
P86
P85
P84
P83
P82
P81
P80
H'FFDC PDR9
—
—
—
P94
P93
P92
P91
P90
H'FFDD PDRB
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
H'FFD7
H'FFDE
H'FFDF
Rev. 6.00 Sep 12, 2006 page 444 of 526
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I/O ports
Appendix B Internal I/O Registers
Register
Address Name
Bit 7
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
H'FFE0
Module
Name
I/O ports
H'FFE1
H'FFE2
H'FFE3
H'FFE4
PCR1
PCR17
PCR16
PCR15
PCR14
—
—
—
PCR10
H'FFE5
PCR2
—
—
—
—
—
PCR22
PCR21
PCR20
H'FFE6
PCR3
—
—
—
—
—
PCR32
PCR31
PCR30
H'FFE8
PCR5
PCR57
PCR56
PCR55
PCR54
PCR53
PCR52
PCR51
PCR50
H'FFE9
PCR6
PCR67
PCR66
PCR65
PCR64
PCR63
PCR62
PCR61
PCR60
H'FFEA
PCR7
PCR77
PCR76
PCR75
PCR74
PCR73
—
—
—
H'FFEB
PCR8
PCR87
PCR86
PCR85
PCR84
PCR83
PCR82
PCR81
PCR80
H'FFEC PCR9
—
—
—
PCR94
PCR93
PCR92
PCR91
PCR90
H'FFED PUCR1
PUCR17 PUCR16 PUCR15 PUCR14 —
—
—
PUCR10
H'FFEE
PUCR3
—
PUCR32 PUCR31 PUCR30
H'FFEF
PUCR5
PUCR57 PUCR56 PUCR55 PUCR54 PUCR53 PUCR52 PUCR51 PUCR50
H'FFF0
SYSCR1 SSBY
STS2
STS1
STS0
LSON
—
MA1
MA0
H'FFF1
SYSCR2 —
—
—
NESEL
DTON
MSON
SA1
SA0
H'FFF2
IEGR1
—
—
—
—
IEG3
IEG2
IEG1
IEG0
H'FFF3
IEGR2
INTEG7
INTEG6
INTEG5
INTEG4
INTEG3
INTEG2
INTEG1
INTEG0
H'FFF4
IENR1
IENTB1 IENTA
—
—
IEN3
IEN2
IEN1
IEN0
H'FFF5
IENR2
IENDT
—
IENS1
—
—
—
—
H'FFF6
IENR3
INTEN7 INTEN6 INTEN5 INTEN4 INTEN3 INTEN2 INTEN1 INTEN0
H'FFF7
IRR1
IRRTB1 IRRTA
—
—
IRRI3
IRRI2
IRRI1
H'FFF8
IRR2
IRRDT
IRRAD
—
IRRS1
—
—
—
—
H'FFF9
IRR3
INTF7
INTF6
INTF5
INTF4
INTF3
INTF2
INTF1
INTF0
H'FFE7
—
IENAD
—
—
—
System
control
IRRI0
H'FFFA
H'FFFB
H'FFFC
PMR1
IRQ3
IRQ2
IRQ1
PWM
—
—
—
TMOW
H'FFFD
PMR3
—
—
—
—
—
SO1
SI1
SCK1
PMR7
—
—
—
—
—
TXD
—
POF1
I/O ports
H'FFFE
H'FFFF
I/O ports
Legend:
SCI1: Serial communication interface 1
Rev. 6.00 Sep 12, 2006 page 445 of 526
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Appendix B Internal I/O Registers
B.2
Functions
Register
acronym
Register
name
Address to which the
register is mapped
Name of
on-chip
supporting
module
Timer C
H'B4
TMC—Timer mode register C
Bit
numbers
Bit
Initial bit
values
7
6
5
4
3
2
1
0
TMC7
TMC6
TMC5
—
—
TMC2
TMC1
TMC0
Initial value
0
0
0
1
1
0
0
0
Read/Write
R/W
R/W
R/W
—
—
R/W
R/W
R/W
Clock select
0 0 0 Internal clock: φ/8192
1 Internal clock: φ/2048
1 0 Internal clock: φ/512
1 Internal clock: φ/64
1 0 0 Internal clock: φ/16
1 Internal clock: φ/4
1 0 Internal clock: φ W/4
1 External event (TMIC): Rising or falling edge
Possible types of access
R
Read only
W
Write only
R/W Read and write
Counter up/down control
0 0 TCC is an up-counter
1 TCC is a down-counter
1 * TCC up/down control is determined by input at pin
UD. TCC is a down-counter if the UD input is high,
and an up-counter if the UD input is low.
Auto-reload function select
0 Interval timer function selected
1 Auto-reload function selected
Rev. 6.00 Sep 12, 2006 page 446 of 526
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* Don't care
Names of the
bits. Dashes
(—) indicate
reserved bits.
Full name
of bit
Descriptions
of bit settings
Appendix B Internal I/O Registers
TIER—Timer interrupt enable register
Bit
H'F770
Timer X
7
6
5
4
3
2
1
0
ICIAE
ICIBE
ICICE
ICIDE
OCIAE
OCIBE
OVIE
—
Initial value
0
0
0
0
0
0
0
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
—
Timer overflow interrupt enable
0 Interrupt request (FOVI) by OVF is disabled
1 Interrupt request (FOVI) by OVF is enabled
Output compare interrupt B enable
0 Interrupt request (OCIB) by OCFB is disabled
1 Interrupt request (OCIB) by OCFB is enabled
Output compare interrupt A enable
0 Interrupt request (OCIA) by OCFA is disabled
1 Interrupt request (OCIA) by OCFA is enabled
Input capture interrupt D enable
0 Interrupt request (ICID) by ICFD is disabled
1 Interrupt request (ICID) by ICFD is enabled
Input capture interrupt C enable
0 Interrupt request (ICIC) by ICFC is disabled
1 Interrupt request (ICIC) by ICFC is enabled
Input capture interrupt B enable
0 Interrupt request (ICIB) by ICFB is disabled
1 Interrupt request (ICIB) by ICFB is enabled
Input capture interrupt A enable
0 Interrupt request (ICIA) by ICFA is disabled
1 Interrupt request (ICIA) by ICFA is enabled
Rev. 6.00 Sep 12, 2006 page 447 of 526
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Appendix B Internal I/O Registers
TCSRX—Timer control/status register X
Bit
H'F771
Timer X
7
6
5
4
3
2
1
0
ICFA
ICFB
ICFC
ICFD
OCFA
OCFB
OVF
CCLRA
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/W
Counter clear A
0 FRC is not cleared by compare match A
1 FRC is cleared by compare match A
Timer overflow
0 [Clearing condition]
After reading OVF = 1, cleared by writing 0 to OVF
1 [Setting condition]
Set when the FRC value goes from H'FFFF to H'0000
Output compare flag B
0 [Clearing condition]
After reading OCFB = 1, cleared by writing 0 to OCFB
1 [Setting condition]
Set when FRC matches OCRB
Output compare flag A
0 [Clearing condition]
After reading OCFA = 1, cleared by writing 0 to OCFA
1 [Setting condition]
Set when FRC matches OCRA
Input capture flag D
0 [Clearing condition]
After reading ICFD = 1, cleared by writing 0 to ICFD
1 [Setting condition]
Set by input capture signal
Input capture flag C
0 [Clearing condition]
After reading ICFC = 1, cleared by writing 0 to ICFC
1 [Setting condition]
Set by input capture signal
Input capture flag B
0 [Clearing condition]
After reading ICFB = 1, cleared by writing 0 to ICFB
1 [Setting condition]
When the value of FRC is transferred to ICRB by the input
capture signal
Input capture flag A
0 [Clearing condition]
After reading ICFA = 1, cleared by writing 0 to ICFA
1 [Setting condition]
When the value of FRC is transferred to ICRA by the input
capture signal
Note: * Only a write of 0 for flag clearing is possible.
Rev. 6.00 Sep 12, 2006 page 448 of 526
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Appendix B Internal I/O Registers
FRCH—Free-running counter H
Bit
H'F772
Timer X
7
6
5
4
3
2
1
0
FRCH7
FRCH6
FRCH5
FRCH4
FRCH3
FRCH2
FRCH1
FRCH0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Count value
FRCL—Free-running counter L
Bit
H'F773
Timer X
7
6
5
4
3
2
1
0
FRCL7
FRCL6
FRCL5
FRCL4
FRCL3
FRCL2
FRCL1
FRCL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Count value
OCRAH—Output compare register AH
Bit
7
6
5
H'F774
4
3
2
Timer X
1
0
OCRAH7 OCRAH6 OCRAH5 OCRAH4 OCRAH3 OCRAH2 OCRAH1 OCRAH0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
OCRBH—Output compare register BH
Bit
7
6
5
H'F774
4
3
2
Timer X
1
0
OCRBH7 OCRBH6 OCRBH5 OCRBH4 OCRBH3 OCRBH2 OCRBH1 OCRBH0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Rev. 6.00 Sep 12, 2006 page 449 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
OCRAL—Output compare register AL
Bit
7
6
5
H'F775
4
3
2
Timer X
1
0
OCRAL7 OCRAL6 OCRAL5 OCRAL4 OCRAL3 OCRAL2 OCRAL1 OCRAL0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
OCRBL—Output compare register BL
Bit
7
6
5
H'F775
4
3
2
Timer X
1
0
OCRBL7 OCRBL6 OCRBL5 OCRBL4 OCRBL3 OCRBL2 OCRBL1 OCRBL0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Rev. 6.00 Sep 12, 2006 page 450 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
TCRX—Timer control register X
Bit
H'F776
Timer X
7
6
5
4
3
2
1
0
IEDGA
IEDGB
IEDGC
IEDGD
BUFEA
BUFEB
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Clock select
0 0 Internal clock: φ/2
1 Internal clock: φ/8
1 0 Internal clock: φ/32
1 Internal clock: rising edge
Buffer enable B
0 ICRD is not used as a buffer register for ICRB
1 ICRD is used as a buffer register for OCRB
Buffer enable A
0 ICRC is not used as a buffer register for ICRA
1 ICRC is used as a buffer register for OCRA
Input edge select D
0 Rising edge of input D is captured
1 Falling edge of input D is captured
Input edge select C
0 Rising edge of input C is captured
1 Falling edge of input C is captured
Input edge select B
0 Rising edge of input B is captured
1 Falling edge of input B is captured
Input edge select A
0 Rising edge of input A is captured
1 Falling edge of input A is captured
Rev. 6.00 Sep 12, 2006 page 451 of 526
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Appendix B Internal I/O Registers
TOCR—Timer Output compare control register
Bit
H'F777
Timer X
7
6
5
4
3
2
1
0
—
—
—
OCRS
OEA
OEB
OLVLA
OLVLB
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
Output level B
0 Low level
1 High level
Output level A
0 Low level
1 High level
Output enable B
0 Output compare B output is disabled
1 Output compare B output is enabled
Output enable A
0 Output compare A output is disabled
1 Output compare A output is enabled
Output compare register select
0 OCRA is selected
1 OCRB is selected
Rev. 6.00 Sep 12, 2006 page 452 of 526
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Appendix B Internal I/O Registers
ICRAH—Input capture register AH
Bit
7
6
H'F778
5
4
3
2
Timer X
1
0
ICRAH7 ICRAH6 ICRAH5 ICRAH4 ICRAH3 ICRAH2 ICRAH1 ICRAH0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
ICRAL—Input capture register AL
Bit
7
6
ICRAL7 ICRAL6
H'F779
5
4
3
2
ICRAL5 ICRAL4 ICRAL3 ICRAL2
Timer X
1
0
ICRAL1 ICRAL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
ICRBH—Input capture register BH
Bit
7
6
H'F77A
5
4
3
2
Timer X
1
0
ICRBH7 ICRBH6 ICRBH5 ICRBH4 ICRBH3 ICRBH2 ICRBH1 ICRBH0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
ICRBL—Input capture register BL
Bit
7
6
ICRBL7 ICRBL6
H'F77B
5
4
3
2
ICRBL5 ICRBL4 ICRBL3 ICRBL2
Timer X
1
0
ICRBL1 ICRBL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Rev. 6.00 Sep 12, 2006 page 453 of 526
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Appendix B Internal I/O Registers
FLMCR—Flash memory control register
Bit
H'FF80
Flash memory
(Flash memory version only)
7
6
5
4
3
2
1
0
VPP
—
—
—
EV
PV
E
P
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
—
—
—
R/W
R/W
R/W
R/W
Program mode
0 Exit from program mode
1 Transition to program mode
Erase mode
0 Exit from erase mode
1 Transition to erase mode
Program-verify mode
0 Exit from program-verify mode
1 Transition to program-verify mode
Erase-verify mode
0 Exit from erase-verify mode
1 Transition to erase-verify mode
Programming power
0 12 V is not applied to the FVPP pin
1 12 V is applied to the FVPP pin
Rev. 6.00 Sep 12, 2006 page 454 of 526
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Appendix B Internal I/O Registers
EBR1—Erase block register 1
Bit
H'FF82
Flash memory
(Flash memory version only)
7
6
5
4
3
2
1
0
—
—
—
—
LB3
LB2
LB1
LB0
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
Large block 3 to 0
0 Not selected
1 Selected
EBR2—Erase block register 2
Bit
H'FF83
Flash memory
(Flash memory version only)
7
6
5
4
3
2
1
0
SB7
SB6
SB5
SB4
SB3
SB2
SB1
SB0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Small block 7 to 0
0 Not selected
1 Selected
Rev. 6.00 Sep 12, 2006 page 455 of 526
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Appendix B Internal I/O Registers
ICRCH—Input capture register CH
Bit
7
6
H'F77C
5
4
3
2
Timer X
1
0
ICRCH7 ICRCH6 ICRCH5 ICRCH4 ICRCH3 ICRCH2 ICRCH1 ICRCH0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
ICRCL—Input capture register CL
Bit
7
6
H'F77D
5
4
3
2
Timer X
1
0
ICRCL7 ICRCL6 ICRCL5 ICRCL4 ICRCL3 ICRCL2 ICRCL1 ICRCL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
ICRDH—Input capture register DH
Bit
7
6
H'F77E
5
4
3
2
Timer X
1
0
ICRDH7 ICRDH6 ICRDH5 ICRDH4 ICRDH3 ICRDH2 ICRDH1 ICRDH0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
ICRDL—Input capture register DL
Bit
7
6
H'F77F
5
4
3
2
Timer X
1
0
ICRDL7 ICRDL6 ICRDL5 ICRDL4 ICRDL3 ICRDL2 ICRDL1 ICRDL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Rev. 6.00 Sep 12, 2006 page 456 of 526
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Appendix B Internal I/O Registers
SCR1—Serial control register 1
Bit
H'FFA0
SCI1
7
6
5
4
3
2
1
0
SNC1
SNC0
MRKON
LTCH
CKS3
CKS2
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Clock select (CKS2 to CKS0)
Bit 2 Bit 1 Bit 0
CKS2 CKS1 CKS0
0
0
0
1
1
0
1
1
0
0
1
1
0
1
Serial Clock Cycle
Synchronous
Prescaler
Division
φ = 5 MHz
φ = 2.5 MHz
φ/1024
204.8 µs
409.6 µs
φ/256
51.2 µs
102.4 µs
12.8 µs
25.6 µs
φ/64
6.4 µs
12.8 µs
φ/32
3.2 µs
6.4 µs
φ/16
1.6 µs
3.2 µs
φ/8
0.8 µs
1.6 µs
φ/4
—
0.8 µs
φ/2
Clock source select (CKS3)
0 Clock source is prescaler S, and pin SCK 1 is output pin
1 Clock source is external clock, and pin SCK 1 is input pin
LATCH TAIL select
0 HOLD TAIL is output
1 LATCH TAIL is output
TAIL MARK control
0 TAIL MARK is not output (synchronous mode)
1 TAIL MARK is output (SSB mode)
Operation mode select
0 0 8-bit synchronous transfer mode
1 16-bit synchronous transfer mode
1 0 Continuous clock output mode
1 Reserved
Rev. 6.00 Sep 12, 2006 page 457 of 526
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Appendix B Internal I/O Registers
SCSR1—Serial control/status register
Bit
H'FFA1
SCI1
7
6
5
4
3
2
1
0
—
SOL
ORER
—
—
—
MTRF
STF
Initial value
1
0
0
1
1
1
0
0
Read/Write
—
R/W
R/(W)*
—
—
—
R
R/W
Start flag
0 Read
Write
1 Read
Write
Indicates that transfer is stopped
Invalid
Indicates transfer in progress
Starts a transfer operation
TAIL MARK transmit flag
0 Idle state and 8- or -16-bit data transfer in progress
1 TAIL MARK transmission in progress
Overrun error flag
0 [Clearing condition]
After reading 1, cleared by writing 0
1 [Setting condition]
Set if a clock pulse is input after transfer
is complete, when an external clock is used
Extended data bit
0 Read SO1 pin output level is low
Write SO1 pin output level changes to low
1 Read SO1 pin output level is high
Write SO1 pin output level changes to high
Note: * Only a write of 0 for flag clearing is possible.
Rev. 6.00 Sep 12, 2006 page 458 of 526
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Appendix B Internal I/O Registers
SDRU—Serial data register U
Bit
Initial value
Read/Write
H'FFA2
SCI1
7
6
5
4
3
2
1
0
SDRU7
SDRU6
SDRU5
SDRU4
SDRU3
SDRU2
SDRU1
SDRU0
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Stores transmit and receive data
8-bit transfer mode: Not used
16-bit transfer mode: Upper 8 bits of data
SDRL—Serial data register L
Bit
Initial value
Read/Write
H'FFA3
SCI1
7
6
5
4
3
2
1
0
SDRL7
SDRL6
SDRL5
SDRL4
SDRL3
SDRL2
SDRL1
SDRL0
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Stores transmit and receive data
8-bit transfer mode: 8-bit data
16-bit transfer mode: Lower 8 bits of data
Rev. 6.00 Sep 12, 2006 page 459 of 526
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Appendix B Internal I/O Registers
SMR—Serial mode register
Bit
H'FFA8
SCI3
7
6
5
4
3
2
1
0
COM
CHR
PE
PM
STOP
MP
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Clock select
0 0 φ clock
1 φ/4 clock
1 0 φ/16 clock
1 φ/64 clock
Multiprocessor mode
0 Multiprocessor communication
function disabled
1 Multiprocessor communication
function enabled
Stop bit length
0 1 stop bit
1 2 stop bits
Parity mode
0 Even parity
1 Odd parity
Parity enable
0 Parity bit addition and checking disabled
1 Parity bit addition and checking enabled
Character length
0 8-bit data
1 7-bit data
Communication mode
0 Asynchronous mode
1 Synchronous mode
Rev. 6.00 Sep 12, 2006 page 460 of 526
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Appendix B Internal I/O Registers
BRR—Bit rate register
Bit
H'FFA9
SCI3
7
6
5
4
3
2
1
0
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Rev. 6.00 Sep 12, 2006 page 461 of 526
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Appendix B Internal I/O Registers
SCR3—Serial control register 3
Bit
H'FFAA
SCI3
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Clock enable
Bit 0
Bit 1
CKE1 CKE0
0
0
1
1
0
1
Communication Mode
Asynchronous
Synchronous
Asynchronous
Synchronous
Asynchronous
Synchronous
Asynchronous
Synchronous
Description
Clock Source
SCK 3 Pin Function
I/O port
Internal clock
Serial clock output
Internal clock
Clock output
Internal clock
Reserved (Do not specify this combination)
Clock input
External clock
Serial clock input
External clock
Reserved (Do not specify this combination)
Reserved (Do not specify this combination)
Transmit end interrupt enable
0
1
Transmit end interrupt request (TEI) disabled
Transmit end interrupt request (TEI) enabled
Multiprocessor interrupt enable
0
Multiprocessor interrupt request disabled (normal receive operation)
[Clearing condition]
When data is received in which the multiprocessor bit is set to 1
1
Multiprocessor interrupt request enabled
The receive interrupt request (RXI), receive error interrupt request (ERI), and setting of the
RDRF, FER, and OER flags in the serial status register (SSR), are disabled until data with
the multiprocessor bit set to 1 is received.
Receive enable
0
Receive operation disabled (RXD pin is I/O port)
1
Receive operation enabled (RXD pin is receive data pin)
Transmit enable
0
1
Transmit operation disabled (TXD pin is transmit data pin)*1
Transmit operation enabled (TXD pin is transmit data pin)*1
Note: 1. When bit TXD is set to 1 in PMR7
Receive interrupt enable
0
Receive data full interrupt request (RXI) and receive error interrupt request (ERI) disabled
1
Receive data full interrupt request (RXI) and receive error interrupt request (ERI) enabled
Transmit interrupt enable
0
Transmit data empty interrupt request (TXI) disabled
1
Transmit data empty interrupt request (TXI) enabled
Rev. 6.00 Sep 12, 2006 page 462 of 526
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Appendix B Internal I/O Registers
TDR—Transmit data register
Bit
H'FFAB
SCI3
7
6
5
4
3
2
1
0
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data for transfer to TSR
Rev. 6.00 Sep 12, 2006 page 463 of 526
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Appendix B Internal I/O Registers
SSR—Serial status register
Bit
H'FFAC
SCI3
7
6
5
4
3
2
1
0
TDRE
RDRF
OER
FER
PER
TEND
MPBR
MPBT
Initial value
1
0
0
0
0
1
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R
R
R/W
Multiprocessor bit transfer
0
A 0 multiprocessor bit is transmitted
1
A 1 multiprocessor bit is transmitted
Multiprocessor bit receive
0
Data in which the multiprocessor bit is 0 has been received
1
Data in which the multiprocessor bit is 1 has been received
Transmit end
0
Transmission in progress
[Clearing conditions] • After reading TDRE = 1, cleared by writing 0 to TDRE
• When data is written to TDR by an instruction
1
Transmission ended
[Setting conditions]
• When bit TE in serial control register 3 (SCR3) is cleared to 0
• When bit TDRE is set to 1 when the last bit of a transmit character is sent
Parity error
0
Reception in progress or completed normally
[Clearing condition] After reading PER = 1, cleared by writing 0 to PER
1
A parity error has occurred during reception
[Setting condition] When the number of 1 bits in the receive data plus parity bit does not match the parity
designated by the parity mode bit (PM) in the serial mode register (SMR)
Framing error
0
Reception in progress or completed normally
[Clearing condition] After reading FER = 1, cleared by writing 0 to FER
1
A framing error has occurred during reception
[Setting condition] When the stop bit at the end of the receive data is checked for a value of 1 at completion of
reception, and the stop bit is 0
Overrun error
0
Reception in progress or completed
[Clearing condition] After reading OER = 1, cleared by writing 0 to OER
1
An overrun error has occurred during reception
[Setting condition] When the next serial reception is completed with RDRF set to 1
Receive data register full
0
There is no receive data in RDR
[Clearing conditions] • After reading RDRF = 1, cleared by writing 0 to RDRF
• When RDR data is read by an instruction
1
There is receive data in RDR
[Setting condition] When reception ends normally and receive data is transferred from RSR to RDR
Transmit data register empty
0
Transmit data written in TDR has not been transferred to TSR
[Clearing conditions] • After reading TDRE = 1, cleared by writing 0 to TDRE
• When data is written to TDR by an instruction
1
Transmit data has not been written to TDR, or transmit data written in TDR has been transferred to TSR
[Setting conditions] • When bit TE in serial control register 3 (SCR3) is cleared to 0
• When data is transferred from TDR to TSR
Note: * Only a write of 0 for flag clearing is possible.
Rev. 6.00 Sep 12, 2006 page 464 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
RDR—Receive data register
Bit
H'FFAD
SCI3
7
6
5
4
3
2
1
0
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
TMA—Timer mode register A
Bit
H'FFB0
Timer A
7
6
5
4
3
2
1
0
TMA7
TMA6
TMA5
—
TMA3
TMA2
TMA1
TMA0
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/W
R/W
R/W
—
R/W
R/W
R/W
R/W
Clock output select
0 0 0 φ/32
1 φ/16
1 0 φ/8
1 φ/4
1 0 0 φ W/32
1 φ W/16
1 0 φ W/8
1 φ W/4
Internal clock select
Prescaler and Divider Ratio
TMA3 TMA2 TMA1 TMA0 or Overflow Period
0
0
0
0
PSS
φ/8192
1
PSS
φ/4096
PSS
φ/2048
1
0
PSS
φ/512
1
1
0
0
φ/256
PSS
1
φ/128
PSS
φ/32
1
0
PSS
φ/8
1
PSS
0
0
0
1s
1
PSW
1
0.5 s
PSW
0.25 s
1
0
PSW
0.03125 s
1
PSW
1
0
0
PSW and TCA are reset
1
1
0
1
Function
Interval
timer
Time
base
Rev. 6.00 Sep 12, 2006 page 465 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
TCA—Timer counter A
Bit
H'FFB1
Timer A
7
6
5
4
3
2
1
0
TCA7
TCA6
TCA5
TCA4
TCA3
TCA2
TCA1
TCA0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Count value
TMB1—Timer mode register B1
Bit
H'FFB2
Timer B1
7
6
5
4
3
2
1
0
TMB17
—
—
—
—
TMB12
TMB11
TMB10
Initial value
0
1
1
1
1
0
0
0
Read/Write
R/W
—
—
—
—
R/W
R/W
R/W
Auto-reload function select
0 Interval timer function selected
1 Auto-reload function selected
Clock select
0 0 0 Internal clock: φ/8192
1 Internal clock: φ/2048
1 0 Internal clock: φ/512
1 Internal clock: φ/256
1 0 0 Internal clock: φ/64
1 Internal clock: φ/16
1 0 Internal clock: φ/4
1 External event (TMIB): Rising or falling edge
Rev. 6.00 Sep 12, 2006 page 466 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
TCB1—Timer counter B1
Bit
H'FFB3
Timer B1
7
6
5
4
3
2
1
0
TCB17
TCB16
TCB15
TCB14
TCB13
TCB12
TCB11
TCB10
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Count value
TLB1—Timer load register B1
Bit
H'FFB3
Timer B1
7
6
5
4
3
2
1
0
TLB17
TLB16
TLB15
TLB14
TLB13
TLB12
TLB11
TLB10
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Reload value
Rev. 6.00 Sep 12, 2006 page 467 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
TCRV0—Timer control register V0
Bit
H'FFB8
Timer V
7
6
5
4
3
2
1
0
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Clock select
TCRV0
TCRV1
Bit 2 Bit 1 Bit 0 Bit 0
Description
CKS2 CKS1 CKS0 ICKS0
— Clock input disabled
0
0
0
Internal clock: φ/4, falling edge
0
1
Internal clock: φ/8, falling edge
1
Internal clock: φ/16, falling edge
1
0
0
Internal clock: φ/32, falling edge
1
1
Internal clock: φ/64, falling edge
0
Internal clock: φ/128, falling edge
1
0
1
0
— Clock input disabled
1
— External clock: rising edge
1
0
— External clock: falling edge
1
— External clock: rising and falling edges
Counter clear 1 and 0
0 0 Clearing is disabled
1 Cleared by compare match A
1 0 Cleared by compare match B
1 Cleared by rising edge of external reset input
Timer overflow interrupt enable
0 Interrupt request (OVI) from OVF disabled
1 Interrupt request (OVI) from OVF enabled
Compare match interrupt enable A
0 Interrupt request (CMIA) from CMFA disabled
1 Interrupt request (CMIA) from CMFA enabled
Compare match interrupt enable B
0 Interrupt request (CMIB) from CMFB disabled
1 Interrupt request (CMIB) from CMFB enabled
Rev. 6.00 Sep 12, 2006 page 468 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
TCSRV—Timer control/status register V
Bit
H'FFB9
Timer V
7
6
5
4
3
2
1
0
CMFB
CMFA
OVF
—
OS3
OS2
OS1
OS0
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
—
R/W
R/W
R/W
R/W
Output select
0 0 No change at compare match A
1 0 output at compare match A
1 0 1 output at compare match A
1 Output toggles at compare match A
Output select
0 0 No change at compare match B
1 0 output at compare match B
1 0 1 output at compare match B
1 Output toggles at compare match B
Timer overflow flag
0 [Clearing condition]
After reading OVF = 1, cleared by writing 0 to OVF
1 [Setting condition]
Set when TCNTV overflows from H'FF to H'00
Compare match flag A
0 [Clearing condition]
After reading CMFA = 1, cleared by writing 0 to CMFA
1 [Setting condition]
Set when the TCNTV value matches the TCORA value
Compare match flag B
0 [Clearing condition]
After reading CMFB = 1, cleared by writing 0 to CMFB
1
[Setting condition]
Set when the TCNTV value matches the TCORB value
Note: * Only a write of 0 for flag clearing is possible.
Rev. 6.00 Sep 12, 2006 page 469 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
TCORA—Time constant register A
Bit
7
6
H'FFBA
5
4
3
2
Timer V
1
0
TCORA7 TCORA6 TCORA5 TCORA4 TCORA3 TCORA2 TCORA1 TCORA0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCORB—Time constant register B
Bit
7
6
H'FFBB
5
4
3
2
Timer V
1
0
TCORB7 TCORB6 TCORB5 TCORB4 TCORB3 TCORB2 TCORB1 TCORB0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCNTV—Timer counter V
Bit
7
H'FFBC
6
5
4
3
2
Timer V
1
0
TCNTV7 TCNTV6 TCNTV5 TCNTV4 TCNTV3 TCNTV2 TCNTV1 TCNTV0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Rev. 6.00 Sep 12, 2006 page 470 of 526
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Appendix B Internal I/O Registers
TCRV1—Timer control register V1
Bit
H'FFBD
Timer V
7
6
5
4
3
2
1
0
—
—
—
TVEG1
TVEG0
TRGE
—
ICKS0
Initial value
1
1
1
0
0
0
1
0
Read/Write
—
—
—
R/W
R/W
R/W
—
R/W
Internal clock select
Selects the TCNTV clock source, with bits
CKS2 to CKS0 in TCRV0
TRGV input enable
0 TCNTV counting is not triggered by input at the TRGV pin, and
does not stop when TCNTV is cleared by compare match
1 TCNTV counting is triggered by input at the TRGV pin, and
stops when TCNTV is cleared by compare match
TRGV input edge select
0 0 TRGV trigger input is disabled
1 Rising edge is selected
1 0 Falling edge is selected
1 Rising and falling edges are both selected
Rev. 6.00 Sep 12, 2006 page 471 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
TCSRW—Timer control/status register W
Bit
Initial value
Read/Write
H'FFBE
Watchdog timer
7
6
5
4
3
2
1
0
B6WI
TCWE
B4WI
TCSRWE
B2WI
WDON
B0WI
WRST
1
0
1
0
1
0
1
0
R
R/(W)*
R
R/(W)*
R
R/(W) *
R
R/(W) *
Watchdog timer reset
0 [Clearing conditions]
• Reset by RES pin
• When TCSRWE = 1, and 0 is written in both B0WI and WRST
1 [Setting condition]
When TCW overflows and a reset signal is generated
Bit 0 write inhibit
0 Bit 0 is write-enabled
1 Bit 0 is write-protected
Watchdog timer on
0 Watchdog timer operation is disabled
1 Watchdog timer operation is enabled
Bit 2 write inhibit
0 Bit 2 is write-enabled
1 Bit 2 is write-protected
Timer control/status register W write enable
0 Data cannot be written to TCSRW bits 2 and 0
1 Data can be written to TCSRW bits 2 and 0
Bit 4 write inhibit
0 Bit 4 is write-enabled
1 Bit 4 is write-protected
Timer counter W write enable
0 Data cannot be written to TCW
1 Data can be written to TCW
Bit 6 write inhibit
0 Bit 6 is write-enabled
1 Bit 6 is write-protected
Note: * Write is permitted only under certain conditions.
Rev. 6.00 Sep 12, 2006 page 472 of 526
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Appendix B Internal I/O Registers
TCW—Timer counter W
Bit
H'FFBF
Watchdog timer
7
6
5
4
3
2
1
0
TCW7
TCW6
TCW5
TCW4
TCW3
TCW2
TCW1
TCW0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Count value
Rev. 6.00 Sep 12, 2006 page 473 of 526
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Appendix B Internal I/O Registers
AMR—A/D mode register
Bit
H'FFC4
A/D converter
7
6
5
4
3
2
1
0
CKS
TRGE
—
—
CH3
CH2
CH1
CH0
Initial value
0
0
1
1
0
0
0
0
Read/Write
R/W
R/W
—
—
R/W
R/W
R/W
R/W
Channel select
Bit 3 Bit 2 Bit 1
CH3 CH2 CH1
0
0
*
1
0
0
0
*
0
1
0
1
0
1
0
1
0
1
1
1
0
1
1
1
0
0
1
1
Bit 0
CH0
Analog Input Channel
No channel selected
AN 0
AN 1
AN 2
AN 3
AN 4
AN 5
AN 6
AN 7
Reserved
Reserved
Reserved
Reserved
* Don’t care
External trigger select
0 Disables start of A/D conversion by exter al trigger
1 Enables start of A/D conversion by rising or falling edge
of external trigger at pin ADTRG
Clock select
Bit 7
CKS Conversion Period
0
62/φ
1
31/φ
Note: *
Conversion Time
φ = 2 MHz φ = 5 MHz
31 µs
15.5 µs
12.4 µs
—*
Operation is not guaranteed if the conversion time is less than 12.4 µs.
Set bit 7 for a value of at least 12.4 µs.
Rev. 6.00 Sep 12, 2006 page 474 of 526
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Appendix B Internal I/O Registers
ADRR—A/D result register
Bit
Initial value
Read/Write
H'FFC5
A/D converter
7
6
5
4
3
2
1
0
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
ADR0
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
R
R
R
R
R
R
R
R
A/D conversion result
ADSR—A/D start register
Bit
H'FFC6
A/D converter
7
6
5
4
3
2
1
0
ADSF
—
—
—
—
—
—
—
Initial value
0
1
1
1
1
1
1
1
Read/Write
R/W
—
—
—
—
—
—
—
A/D status flag
0 Read Indicates completion of A/D conversion
Write Stops A/D conversion
1 Read Indicates A/D conversion in progress
Write Starts A/D conversion
Rev. 6.00 Sep 12, 2006 page 475 of 526
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Appendix B Internal I/O Registers
PWCR—PWM control register
Bit
H'FFD0
14-bit PWM
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
PWCR0
Initial value
1
1
1
1
1
1
1
0
Read/Write
—
—
—
—
—
—
—
W
Clock select
0 The input clock is φ/2 (tφ * = 2/φ). The conversion period is 16,384/φ,
with a minimum modulation width of 1/φ.
1 The input clock is φ/4 (tφ * = 4/φ). The conversion period is 32,768/φ,
with a minimum modulation width of 2/φ.
Note: * tφ: Period of PWM input clock
PWDRU—PWM data register U
Bit
H'FFD1
14-bit PWM
7
6
—
—
Initial value
1
1
0
0
0
0
0
0
Read/Write
—
—
W
W
W
W
W
W
5
4
3
2
1
0
PWDRU5 PWDRU4PWDRU3 PWDRU2 PWDRU1 PWDRU0
Upper 6 bits of data for generating PWM waveform
PWDRL—PWM data register L
Bit
7
6
H'FFD2
5
4
3
2
14-bit PWM
1
0
PWDRL7 PWDRL6 PWDRL5 PWDRL4 PWDRL3 PWDRL2 PWDRL1 PWDRL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Lower 8 bits of data for generating PWM waveform
Rev. 6.00 Sep 12, 2006 page 476 of 526
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Appendix B Internal I/O Registers
PDR1—Port data register 1
Bit
H'FFD4
I/O ports
7
6
5
4
3
2
1
0
P17
P16
P15
P14
—
—
—
P10
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
—
—
—
R/W
PDR2—Port data register 2
Bit
H'FFD5
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
—
P22
P21
P20
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
—
R/W
R/W
R/W
PDR3—Port data register 3
Bit
H'FFD6
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
—
P32
P31
P30
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
—
R/W
R/W
R/W
PDR5—Port data register 5
Bit
H'FFD8
I/O ports
7
6
5
4
3
2
1
0
P5 7
P56
P55
P54
P53
P52
P51
P50
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR6—Port data register 6
Bit
H'FFD9
I/O ports
7
6
5
4
3
2
1
0
P6 7
P66
P65
P64
P63
P62
P61
P60
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Rev. 6.00 Sep 12, 2006 page 477 of 526
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Appendix B Internal I/O Registers
PDR7—Port data register 7
Bit
H'FFDA
I/O ports
7
6
5
4
3
2
1
0
P7 7
P76
P75
P74
P73
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
—
—
—
PDR8—Port data register 8
Bit
H'FFDB
I/O ports
7
6
5
4
3
2
1
0
P8 7
P86
P85
P84
P83
P82
P81
P80
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR9—Port data register 9
Bit
H'FFDC
I/O ports
7
6
5
4
3
2
1
0
—
—
—
P94
P93
P92
P91
P90
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
PDRB—Port data register B
Bit
Read/Write
H'FFDD
I/O ports
7
6
5
4
3
2
1
0
PB 7
PB 6
PB 5
PB 4
PB 3
PB 2
PB 1
PB 0
R
R
R
R
R
R
R
R
Rev. 6.00 Sep 12, 2006 page 478 of 526
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Appendix B Internal I/O Registers
PCR1—Port control register 1
Bit
H'FFE4
I/O ports
7
6
5
4
3
2
1
0
PCR17
PCR16
PCR15
PCR14
—
—
—
PCR10
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
—
—
—
W
Port 1 input/output select
0 Input pin
1 Output pin
PCR2—Port control register 2
Bit
H'FFE5
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
—
PCR22
PCR21
PCR20
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
—
W
W
W
Port 2 input/output select
0 Input pin
1 Output pin
PCR3—Port control register 3
Bit
H'FFE6
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
—
PCR32
PCR31
PCR30
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
—
W
W
W
Port 3 input/output select
0 Input pin
1 Output pin
Rev. 6.00 Sep 12, 2006 page 479 of 526
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Appendix B Internal I/O Registers
PCR5—Port control register 5
Bit
H'FFE8
I/O ports
7
6
5
4
3
2
1
0
PCR57
PCR56
PCR55
PCR54
PCR53
PCR52
PCR51
PCR50
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 5 input/output select
0 Input pin
1 Output pin
PCR6—Port control register 6
Bit
H'FFE9
I/O ports
7
6
5
4
3
2
1
0
PCR6 7
PCR6 6
PCR6 5
PCR6 4
PCR6 3
PCR6 2
PCR6 1
PCR6 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 6 input/output select
0 Input pin
1 Output pin
PCR7—Port control register 7
Bit
H'FFEA
I/O ports
7
6
5
4
3
2
1
0
PCR77
PCR76
PCR75
PCR74
PCR73
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
—
—
—
Port 7 input/output select
0 Input pin
1 Output pin
Rev. 6.00 Sep 12, 2006 page 480 of 526
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Appendix B Internal I/O Registers
PCR8—Port control register 8
Bit
H'FFEB
I/O ports
7
6
5
4
3
2
1
0
PCR87
PCR86
PCR85
PCR84
PCR83
PCR82
PCR81
PCR80
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 8 input/output select
0 Input pin
1 Output pin
PCR9—Port control register 9
Bit
H'FFEC
7
6
5
4
—
—
—
PCR9 4
3
2
PCR9 3 PCR92
I/O ports
1
0
PCR91
PCR90
Initial value
1
1
0
0
0
0
0
0
Read/Write
—
—
—
W
W
W
W
W
Port 9 input/output select
0 Input pin
1 Output pin
PUCR1—Port pull-up control register 1
Bit
7
6
5
H'FFED
4
PUCR17 PUCR16 PUCR15 PUCR14
I/O ports
3
2
1
0
—
—
—
PUCR10
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
—
—
—
R/W
PUCR3—Port pull-up control register 3
Bit
H'FFEE
7
6
5
4
3
—
—
—
—
—
2
I/O ports
1
0
PUCR32 PUCR31 PUCR30
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
—
R/W
R/W
R/W
Rev. 6.00 Sep 12, 2006 page 481 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
PUCR5—Port pull-up control register 5
Bit
7
6
5
H'FFEF
4
3
2
I/O ports
0
1
PUCR5 7 PUCR56 PUCR55 PUCR54 PUCR53 PUCR52 PUCR51 PUCR50
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SYSCR1—System control register 1
Bit
H'FFF0
System control
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
LSON
—
MA1
MA0
Initial value
0
0
0
0
0
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
—
R/W
R/W
Active (medium-speed)
mode clock select
0 0 φ osc /16
1 φ osc /32
1 0 φ osc /64
1 φ osc/128
Low speed on flag
0 The CPU operates on the system clock (φ)
1 The CPU operates on the subclock (φ SUB)
Standby timer select 2 to 0
0 0 0 Wait time = 8,192 states
1 Wait time = 16,384 states
1 0 Wait time = 32,768 states
1 Wait time = 65,536 states
1 * * Wait time = 131,072 states
Software standby
* Don’t care
0 • When a SLEEP instruction is executed in active mode, a transition is
made to sleep mode
• When a SLEEP instruction is executed in subactive mode, a transition
is made to subsleep mode
1 • When a SLEEP instruction is executed in active mode, a transition is
made to standby mode or watch mode
• When a SLEEP instruction is executed in subactive mode, a transition
is made to watch mode
Rev. 6.00 Sep 12, 2006 page 482 of 526
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Appendix B Internal I/O Registers
SYSCR2—System control register 2
Bit
H'FFF1
System control
7
6
5
4
3
2
1
0
—
—
—
NESEL
DTON
MSON
SA1
SA0
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
Subactive mode clock select
0 0 φ W/8
1 φ W/4
1 * φ W/2
Medium speed on flag
* Don’t care
0 • Operates in active (high-speed) mode after exit from standby, watch, or sleep
mode
• Operates in sleep (high-speed) mode if a SLEEP instruction is executed in
active mode
1 • Operates in active (medium-speed) mode after exit from standby, watch,
or sleep mode
• Operates in sleep (medium-speed) mode if a SLEEP instruction is executed
in active mode
Direct transfer on flag
0 • When a SLEEP instruction is executed in active mode, a transition is
made to standby mode, watch mode, or sleep mode
• When a SLEEP instruction is executed in subactive mode, a transition is
made to watch mode or subsleep mode
1 • When a SLEEP instruction is executed in active (high-speed) mode, a direct
transition is made to active (medium-speed) mode if SSBY = 0, MSON = 1, and
LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1, and LSON = 1
• When a SLEEP instruction is executed in active (medium-speed) mode, a direct
transition is made to active (high-speed) mode if SSBY = 0, MSON = 0, and
LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1, and LSON = 1
• When a SLEEP instruction is executed in subactive mode, a direct
transition is made to active (high-speed) mode if SSBY = 1, TMA3 = 1, LSON = 0,
and MSON = 0, or to active (medium-speed) mode if SSBY = 1, TMA3 = 1,
LSON = 0, and MSON = 1
Noise elimination sampling frequency select
0 Sampling rate is φ OSC/16
1 Sampling rate is φ OSC/4
Rev. 6.00 Sep 12, 2006 page 483 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
IEGR1—Interrupt edge select register 1
Bit
H'FFF2
System control
7
6
5
4
3
2
1
0
—
—
—
—
IEG3
IEG2
IEG1
IEG0
Initial value
0
1
1
1
0
0
0
0
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
IRQ0 edge select
0 Falling edge of IRQ0 pin input is detected
1 Rising edge of IRQ0 pin input is detected
IRQ1 edge select
0 Falling edge of IRQ1 pin input is detected
1 Rising edge of IRQ1 pin input is detected
IRQ2 edge select
0 Falling edge of IRQ2 pin input is detected
1 Rising edge of IRQ2 pin input is detected
IRQ3 edge select
0 Falling edge of IRQ3 pin input is detected
1 Rising edge of IRQ3 pin input is detected
Rev. 6.00 Sep 12, 2006 page 484 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
IEGR2—Interrupt edge select register 2
Bit
7
6
5
H'FFF3
4
3
2
System control
1
0
INTEG7 INTEG6 INTEG5 INTEG4 INTEG3 INTEG2 INTEG1 INTEG0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
INT4 to INT0 edge select
0 Falling edge of INTn pin input is detected
1 Rising edge of INTn pin input is detected
(n = 4 to 0)
INT5 edge select
0 Falling edge of INT5 and ADTRG pin input is detected
1 Rising edge of INT5 and ADTRG pin input is detected
INT6 edge select
0 Falling edge of INT6 and TMIB pin input is detected
1 Rising edge of INT6 and TMIB pin input is detected
INT7 edge select
0 Falling edge of INT7 pin input is detected
1 Rising edge of INT7 pin input is detected
Rev. 6.00 Sep 12, 2006 page 485 of 526
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Appendix B Internal I/O Registers
IENR1—Interrupt enable register 1
Bit
H'FFF4
System control
7
6
5
4
3
2
1
0
IENTB1
IENTA
—
—
IEN3
IEN2
IEN1
IEN0
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/W
R/W
—
—
R/W
R/W
R/W
R/W
IRQ3 to IRQ0 interrupt enable
0 Disables IRQ3 to IRQ0 interrupt requests
1 Enables IRQ3 to IRQ0 interrupt requests
Timer A interrupt enable
0 Disables timer A interrupt requests
1 Enables timer A interrupt requests
Timer B1 interrupt enable
0 Disables timer B1 interrupt requests
1 Enables timer B1 interrupt requests
Rev. 6.00 Sep 12, 2006 page 486 of 526
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Appendix B Internal I/O Registers
IENR2—Interrupt enable register 2
Bit
H'FFF5
System control
7
6
5
4
3
2
1
0
IENDT
IENAD
—
IENS1
—
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
—
R/W
—
—
—
—
SCI1 interrupt enable
0 Disables SCI1 interrupt requests
1 Enables SCI1 interrupt requests
A/D converter interrupt enable
0 Disables A/D converter interrupt requests
1 Enables A/D converter interrupt requests
Direct transfer interrupt enable
0 Disables direct transfer interrupt requests
1 Enables direct transfer interrupt requests
IENR3—Interrupt enable register 3
Bit
7
6
H'FFF6
5
4
3
2
System control
1
0
INTEN7 INTEN6 INTEN5 INTEN4 INTEN3 INTEN2 INTEN1 INTEN0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
INT7 to INT0 interrupt enable
0 Disables INT7 to INT0 interrupt requests
1 Enables INT7 to INT0 interrupt requests
Rev. 6.00 Sep 12, 2006 page 487 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
IRR1—Interrupt request register 1
Bit
H'FFF7
System control
7
6
5
4
3
2
1
0
IRRTB1
IRRTA
—
—
IRRI3
IRRI2
IRRI1
IRRI0
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/W *
R/W *
—
R/W *
R/W *
R/W *
R/W *
—
IRQ3 to IRQ0 interrupt request flag
0 [Clearing condition]
When IRRIn = 1, it is cleared by writing 0
1 [Setting condition]
When pin IRQn is set for interrupt input and the designated signal
edge is input
(n = 3 to 0)
Timer A interrupt request flag
0 [Clearing condition]
When IRRTA = 1, it is cleared by writing 0
1 [Setting condition]
When timer counter A overflows from H'FF to H'00
Timer B1 interrupt request flag
0 [Clearing condition]
When IRRTB1 = 1, it is cleared by writing 0
1 [Setting condition]
When timer counter B1 overflows from H'FF to H'00
Note: * Only a write of 0 for flag clearing is possible.
Rev. 6.00 Sep 12, 2006 page 488 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
IRR2—Interrupt request register 2
Bit
H'FFF8
System control
7
6
5
4
3
2
1
0
IRRDT
IRRAD
—
IRRS1
—
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W *
R/W *
—
—
—
—
R/W *
—
SCI1 interrupt request flag
0 [Clearing condition]
When IRRS1 = 1, it is cleared by writing 0
1 [Setting condition]
When an SCI1 transfer is completed
A/D converter interrupt request flag
0 [Clearing condition]
When IRRAD = 1, it is cleared by writing 0
1 [Setting condition]
When A/D conversion is completed and ADSF is cleared to 0 in ADSR
Direct transfer interrupt request flag
0 [Clearing condition]
When IRRDT = 1, it is cleared by writing 0
1 [Setting condition]
A SLEEP instruction is executed when DTON = 1 and a direct transfer is made
Note: * Only a write of 0 for flag clearing is possible.
Rev. 6.00 Sep 12, 2006 page 489 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
IRR3—Interrupt request register 3
Bit
H'FFF9
System control
7
6
5
4
3
2
1
0
INTF7
INTF6
INTF5
INTF4
INTF3
INTF2
INTF1
INTF0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W *
R/W *
R/W *
R/W
R/W *
R/W *
R/W *
R/W *
INT7 to INT0 interrupt request flag
0 [Clearing condition]
When INTFn = 1, it is cleared by writing 0
1 [Setting condition]
When the designated signal edge is input at pin INTn
(n = 7 to 0)
Note: * Only a write of 0 for flag clearing is possible.
Rev. 6.00 Sep 12, 2006 page 490 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
PMR1—Port mode register 1
Bit
H'FFFC
I/O ports
7
6
5
4
3
2
1
0
IRQ3
IRQ2
IRQ1
PWM
—
—
—
TMOW
Initial value
0
0
0
0
0
1
0
0
Read/Write
R/W
R/W
R/W
R/W
—
—
—
R/W
P10/TMOW pin function switch
0 Functions as P10 I/O pin
1 Functions as TMOW output pin
P14/PWM pin function switch
0 Functions as P14 I/O pin
1 Functions as PWM output pin
P15/IRQ1 pin function switch
0 Functions as P15 I/O pin
1 Functions as IRQ1 input pin
P16/IRQ2 pin function switch
0 Functions as P16 I/O pin
1 Functions as IRQ2 input pin
P17/IRQ3 pin function switch
0 Functions as P17 I/O pin
1 Functions as IRQ3/TRGV input pin
Rev. 6.00 Sep 12, 2006 page 491 of 526
REJ09B0326-0600
Appendix B Internal I/O Registers
PMR3—Port mode register 3
Bit
H'FFFD
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
—
SO1
SI1
SCK1
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
—
R/W
R/W
R/W
P30/SCK1 pin function switch
0 Functions as P30 I/O pin
1 Functions as SCK1 I/O pin
P31/SI1 pin function switch
0 Functions as P31 I/O pin
1 Functions as SI1 input pin
P32/SO1 pin function switch
0 Functions as P32 I/O pin
1 Functions as SO1 output pin
PMR7—Port mode register 7
Bit
H'FFFF
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
—
TXD
—
POF1
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
—
R/W
—
R/W
P32/SO1 pin PMOS control
0 CMOS output
1 NMOS open-drain output
P22/TXD pin function switch (TXD)
0 Functions as P22 I/O pin
1 Functions as TXD output pin
Rev. 6.00 Sep 12, 2006 page 492 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
Appendix C I/O Port Block Diagrams
C.1
Block Diagrams of Port 1
SBY
RES
(low level
during reset
and in standby
mode)
PUCR1n
VCC
VCC
PMR1n
PDR1n
P1n
VSS
Internal
data bus
PCR1n
IRQn–4
Legend:
PDR1: Port data register 1
PCR1: Port control register 1
PMR1: Port mode register 1
PUCR1: Port pull-up control register 1
Note: n = 7 or 6
Figure C.1 (a) Port 1 Block Diagram (Pins P17 and P16)
Rev. 6.00 Sep 12, 2006 page 493 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
SBY
(low level during
reset and in
standby mode)
RES
PUCR15
VCC
VCC
PMR15
PDR15
P15
Internal
data bus
PCR15
VSS
IRQ1
Legend:
PDR1:
PCR1:
PMR1:
PUCR1:
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
Figure C.1 (b) Port 1 Block Diagram (Pin P15)
Rev. 6.00 Sep 12, 2006 page 494 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
PWM
module
RES
SBY
(low level during
reset and in
standby mode)
PWM
PUCR14
VCC
VCC
PMR14
PDR14
P14
PCR14
VSS
Legend:
PDR1:
PCR1:
PMR1:
PUCR1:
Internal
data bus
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
Figure C.1 (c) Port 1 Block Diagram (Pin P14)
Rev. 6.00 Sep 12, 2006 page 495 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
Timer A
module
RES
SBY
(low level during
reset and in
standby mode)
TMOW
PUCR10
VCC
VCC
PMR10
PDR10
P10
PCR10
VSS
Legend:
PDR1:
PCR1:
PMR1:
PUCR1:
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
Figure C.1 (d) Port 1 Block Diagram (Pin P10)
Rev. 6.00 Sep 12, 2006 page 496 of 526
REJ09B0326-0600
Internal
data bus
Appendix C I/O Port Block Diagrams
C.2
Block Diagrams of Port 2
SBY
PMR72
SCI3
module
VCC
TXD
P22
PDR22
Internal
data bus
PCR22
VSS
Legend:
PDR2: Port data register 2
PCR2: Port control register 2
PMR7: Port mode register 7
Figure C.2 (a) Port 2 Block Diagram (Pin P22)
Rev. 6.00 Sep 12, 2006 page 497 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
SBY
SCI3
module
VCC
RE
RXD
P21
PDR21
PCR21
VSS
Legend:
PDR2: Port data register 2
PCR2: Port control register 2
Figure C.2 (b) Port 2 Block Diagram (Pin P21)
Rev. 6.00 Sep 12, 2006 page 498 of 526
REJ09B0326-0600
Internal
data bus
Appendix C I/O Port Block Diagrams
SBY
SCI3
module
SCKIE
SCKOE
VCC
SCKO
SCKI
P20
PDR20
PCR20
VSS
Internal
data bus
Legend:
PDR2: Port data register 2
PCR2: Port control register 2
Figure C.2 (c) Port 2 Block Diagram (Pin P20)
Rev. 6.00 Sep 12, 2006 page 499 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
C.3
Block Diagrams of Port 3
SCI1
module
RES
SBY
(low level during
reset and in
standby mode)
SO1
PMR70
PUCR32
VCC
VCC
PMR32
PDR32
P32
PCR32
VSS
Legend:
PDR3:
PCR3:
PMR3:
PMR7:
PUCR3:
Port data register 3
Port control register 3
Port mode register 3
Port mode register 7
Port pull-up control register 3
Figure C.3 (a) Port 3 Block Diagram (Pin P32)
Rev. 6.00 Sep 12, 2006 page 500 of 526
REJ09B0326-0600
Internal
data bus
Appendix C I/O Port Block Diagrams
SBY
(low level
during reset
and in standby
mode)
RES
PUCR31
VCC
VCC
PMR31
PDR31
P31
Internal
data bus
PCR31
VSS
SCI1
module
SI1
Legend:
PDR3:
PCR3:
PMR3:
PUCR3:
Port data register 3
Port control register 3
Port mode register 3
Port pull-up control register 3
Figure C.3 (b) Port 3 Block Diagram (Pin P31)
Rev. 6.00 Sep 12, 2006 page 501 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
SCI1
module
RES
SBY
(low level during
reset and in
standby mode)
CKS3
SCK0
SCK1
PUCR30
VCC
VCC
PDR30
P30
PCR30
VSS
Legend:
PDR3:
PCR3:
PMR3:
PUCR3:
Port data register 3
Port control register 3
Port mode register 3
Port pull-up control register 3
Figure C.3 (c) Port 3 Block Diagram (Pin P30)
Rev. 6.00 Sep 12, 2006 page 502 of 526
REJ09B0326-0600
Internal data bus
PMR30
Appendix C I/O Port Block Diagrams
C.4
Block Diagrams of Port 5
SBY
(low level
during reset
and in standby
mode)
RES
PUCR5n
VCC
PDR5n
P5n
VSS
PCR5n
Internal data bus
VCC
INT
module
INTn
Legend:
PDR5: Port data register 5
PCR5: Port control register 5
PUCR5: Port pull-up control register 5
Note: n = 7, 4 to 0
Figure C.4 (a) Port 5 Block Diagram (Pins P57 and P54 to P50)
Rev. 6.00 Sep 12, 2006 page 503 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
SBY
(low level
during reset
and in standby
mode)
Timer B1
module
PUCR56
VCC
TMIB
PDR56
P56
PCR56
VSS
Internal data bus
VCC
INT
module
INT6
Legend:
PDR5: Port data register 5
PCR5: Port control register 5
PUCR5: Port pull-up control register 5
Figure C.4 (b) Port 5 Block Diagram (Pin P56)
Rev. 6.00 Sep 12, 2006 page 504 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
SBY
(low level
during reset
and in standby
mode)
RES
A/D
module
PUCR55
VCC
ADTRG
PDR55
P55
PCR55
VSS
Internal data bus
VCC
INT
module
INT5
Legend:
PDR5: Port data register 5
PCR5: Port control register 5
PUCR5: Port pull-up control register 5
Figure C.4 (c) Port 5 Block Diagram (Pin P55)
Rev. 6.00 Sep 12, 2006 page 505 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
C.5
Block Diagram of Port 6
SBY
(low level during reset
and in standby mode)
VCC
P6n
PDR6n
PCR6n
VSS
Legend:
PDR6: Port data register 6
PCR6: Port control register 6
Note:
n = 7 to 0
Figure C.5 Port 6 Block Diagram (Pins P67 to P60)
Rev. 6.00 Sep 12, 2006 page 506 of 526
REJ09B0326-0600
Internal
data bus
Appendix C I/O Port Block Diagrams
C.6
Block Diagrams of Port 7
SBY
(low level during reset
and in standby mode)
VCC
PDR7n
P7n
VSS
Internal
data bus
PCR7n
Legend:
PDR7: Port data register 7
PCR7: Port control register 7
Note: n = 7 or 3
Figure C.6 (a) Port 7 Block Diagram (Pins P77 and P73)
Rev. 6.00 Sep 12, 2006 page 507 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
SBY
(low level during reset
and in standby mode)
Timer V
module
VCC
0S3
to
0S0
TMOV
PDR76
P76
PCR76
VSS
Legend:
PDR7: Port data register 7
PCR7: Port control register 7
Figure C.6 (b) Port 7 Block Diagram (Pin P76)
Rev. 6.00 Sep 12, 2006 page 508 of 526
REJ09B0326-0600
Internal
data bus
Appendix C I/O Port Block Diagrams
SBY
(low level during reset
and in standby mode)
VCC
PDR75
P75
Internal
data bus
PCR75
VSS
Timer V
module
TMCIV
Legend:
PDR7: Port data register 7
PCR7: Port control register 7
Figure C.6 (c) Port 7 Block Diagram (Pin P75)
Rev. 6.00 Sep 12, 2006 page 509 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
SBY
(low level during reset
and in standby mode)
VCC
PDR74
P74
Internal
data bus
PCR74
VSS
Timer V
module
TMRIV
Legend:
PDR7: Port data register 7
PCR7: Port control register 7
Figure C.6 (d) Port 7 Block Diagram (Pin P74)
Rev. 6.00 Sep 12, 2006 page 510 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
C.7
Block Diagrams of Port 8
SBY
(low level during reset
and in standby mode)
VCC
PDR87
P87
Internal
data bus
PCR87
VSS
Legend:
PDR8: Port data register 8
PCR8: Port control register 8
Figure C.7 (a) Port 8 Block Diagram (Pin P87)
Rev. 6.00 Sep 12, 2006 page 511 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
SBY
(low level during reset
and in standby mode)
VCC
PDR86
P86
Internal
data bus
PCR86
VSS
Timer X
module
FTID
Legend:
PDR8: Port data register 8
PCR8: Port control register 8
Figure C.7 (b) Port 8 Block Diagram (Pin P86)
Rev. 6.00 Sep 12, 2006 page 512 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
SBY
(low level during reset
and in standby mode)
VCC
PDR85
P85
Internal
data bus
PCR85
VSS
Timer X
module
FTIC
Legend:
PDR8: Port data register 8
PCR8: Port control register 8
Figure C.7 (c) Port 8 Block Diagram (Pin P85)
Rev. 6.00 Sep 12, 2006 page 513 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
SBY
(low level during reset
and in standby mode)
VCC
PDR84
P84
Internal
data bus
PCR84
VSS
Timer X
module
FTIB
Legend:
PDR8: Port data register 8
PCR8: Port control register 8
Figure C.7 (d) Port 8 Block Diagram (Pin P84)
Rev. 6.00 Sep 12, 2006 page 514 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
SBY
(low level during reset
and in standby mode)
VCC
PDR83
P83
Internal
data bus
PCR83
VSS
Timer X
module
FTIA
Legend:
PDR8: Port data register 8
PCR8: Port control register 8
Figure C.7 (e) Port 8 Block Diagram (Pin P83)
Rev. 6.00 Sep 12, 2006 page 515 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
SBY
(low level during reset
and in standby mode)
Timer X
module
VCC
OEB
FTOB
PDR82
P82
PCR82
VSS
Legend:
PDR8: Port data register 8
PCR8: Port control register 8
Figure C.7 (f) Port 8 Block Diagram (Pin P82)
Rev. 6.00 Sep 12, 2006 page 516 of 526
REJ09B0326-0600
Internal
data bus
Appendix C I/O Port Block Diagrams
SBY
(low level during reset
and in standby mode)
Timer X
module
VCC
OEA
FTOA
PDR81
P81
PCR81
VSS
Internal
data bus
Legend:
PDR8: Port data register 8
PCR8: Port control register 8
Figure C.7 (g) Port 8 Block Diagram (Pin P81)
Rev. 6.00 Sep 12, 2006 page 517 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
SBY
(low level during reset
and in standby mode)
VCC
PDR80
P80
Internal
data bus
PCR80
VSS
Timer X
module
FTCI
Legend:
PDR8: Port data register 8
PCR8: Port control register 8
Figure C.7 (h) Port 8 Block Diagram (Pin P80)
Rev. 6.00 Sep 12, 2006 page 518 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
C.8
Block Diagram of Port 9
SBY
(low level during reset
and in standby mode)
VCC
PDR9n
P9n
VSS
Internal
data bus
PCR9n
Legend:
PDR9: Port data register 9
PCR9: Port control register 9
Note: n = 4 to 0
Figure C.8 Port 9 Block Diagram (Pins P94 to P90)
Rev. 6.00 Sep 12, 2006 page 519 of 526
REJ09B0326-0600
Appendix C I/O Port Block Diagrams
C.9
Block Diagram of Port B
Internal
data bus
PBn
A/D module
DEC
AMR3 to AMR0
VIN
Note:
n = 7 to 0
Figure C.9 Port B Block Diagram (Pins PB7 to PB0)
Rev. 6.00 Sep 12, 2006 page 520 of 526
REJ09B0326-0600
Appendix D Port States in the Different Processing States
Appendix D Port States in the Different Processing States
Table D.1
Port
Port States Overview
Reset
Sleep
Subsleep Standby
Watch
Subactive Active
Retained
P17 to P14, High
P10
impedance
Retained
Retained
High
impedance*
Functions
Functions
P22 to P20
High
Retained
impedance
Retained
High
Retained
impedance
Functions
Functions
P32 to P30
High
Retained
impedance
Retained
Retained
High
impedance*
Functions
Functions
P57 to P50
High
Retained
impedance
Retained
Retained
High
impedance*
Functions
Functions
P67 to P60
High
Retained
impedance
Retained
High
Retained
impedance
Functions
Functions
P77 to P73
High
Retained
impedance
Retained
High
Retained
impedance
Functions
Functions
P87 to P80
High
Retained
impedance
Retained
High
Retained
impedance
Functions
Functions
P94 to P90
High
Retained
impedance
Retained
High
Retained
impedance
Functions
Functions
PB7 to PB0 High
High
High
High
High
High
High
impedance impedance impedance impedance impedance impedance impedance
Note:
*
High level output when MOS pull-up is in on state.
Rev. 6.00 Sep 12, 2006 page 521 of 526
REJ09B0326-0600
Appendix E Product Code Lineup
Appendix E Product Code Lineup
Table E.1
Product Lineup
Product Type
H8/3644
ZTATTM
version
FLASH
Mask ROM
version
Product Code Mark Code
Standard HD6473644H HD6473644H
products HD6473644RH
Package
(Package Code)
64-pin QFP (FP-64A)
HD6473644P
HD6473644P
HD6473644RP
64-pin SDIP (DP-64S)
HD6473644W HD6473644W
HD6473644RW
80-pin TQFP (TFP-80C)
HD64F3644H
HD64F3644H
64-pin QFP (FP-64A)
HD64F3644P
HD64F3644P
64-pin SDIP (DP-64S)
HD64F3644W
HD64F3644W
80-pin TQFP (TFP-80C)
HD6433644H HD6433644(***)H 64-pin QFP (FP-64A)
HD6433644RH
HD6433644P
HD6433644(***)P 64-pin SDIP (DP-64S)
HD6433644RP
HD6433644W HD6433644(***)W 80-pin TQFP (TFP-80C)
HD6433644RW
H8/3643
FLASH
Mask ROM
version
Standard HD64F3643H
products HD64F3643P
HD64F3643H
64-pin QFP (FP-64A)
HD64F3643P
64-pin SDIP (DP-64S)
HD64F3643W
HD64F3643W
80-pin TQFP (TFP-80C)
HD6433643H HD6433643(***)H 64-pin QFP (FP-64A)
HD6433643RH
HD6433643P
HD6433643(***)P 64-pin SDIP (DP-64S)
HD6433643RP
HD6433643W HD6433643(***)W 80-pin TQFP (TFP-80C)
HD6433643RW
Rev. 6.00 Sep 12, 2006 page 522 of 526
REJ09B0326-0600
Appendix E Product Code Lineup
Product Type
H8/3642
FLASH
Product Code Mark Code
Standard HD64F3642AH HD64F3642AH
products HD64F3642AP HD64F3642AP
HD64F3642AW HD64F3642AW
Mask ROM
version
Package
(Package Code)
64-pin QFP (FP-64A)
64-pin SDIP (DP-64S)
80-pin TQFP (TFP-80C)
HD6433642H HD6433642(***)H 64-pin QFP (FP-64A)
HD6433642RH
HD6433642P
HD6433642(***)P 64-pin SDIP (DP-64S)
HD6433642RP
HD6433642W HD6433642(***)W 80-pin TQFP (TFP-80C)
HD6433642RW
H8/3641
Mask ROM
version
Standard HD6433641H HD6433641(***)H 64-pin QFP (FP-64A)
products HD6433641RH
HD6433641P
HD6433641(***)P 64-pin SDIP (DP-64S)
HD6433641RP
HD6433641W HD6433641(***)W 80-pin TQFP (TFP-80C)
HD6433641RW
H8/3640
Mask ROM
version
Standard HD6433640H HD6433640(***)H 64-pin QFP (FP-64A)
products HD6433640RH
HD6433640P
HD6433640(***)P 64-pin SDIP (DP-64S)
HD6433640RP
HD6433640W HD6433640(***)W 80-pin TQFP (TFP-80C)
HD6433640RW
Note: For mask ROM versions, (***) is the ROM code.
Rev. 6.00 Sep 12, 2006 page 523 of 526
REJ09B0326-0600
Appendix F Package Dimensions
Appendix F Package Dimensions
The package dimension that is shown in the Package Data Book has priority.
JEITA Package Code
P-QFP64-14x14-0.80
RENESAS Code
PRQP0064GB-A
Previous Code
FP-64A/FP-64AV
MASS[Typ.]
1.2g
HD
*1
D
48
33
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
32
49
bp
c
c1
HE
*2
E
b1
Terminal cross section
ZE
Reference
Symbol
17
64
16
c
F
A
ZD
A2
1
θ
A1
L
L1
Detail F
e
*3
y
bp
x
M
Figure F.1 FP-64A Package Dimensions
Rev. 6.00 Sep 12, 2006 page 524 of 526
REJ09B0326-0600
D
E
A2
HD
HE
A
A1
bp
b1
c
c1
θ
e
x
y
ZD
ZE
L
L1
Dimension in Millimeters
Min
Nom Max
14
14
2.70
16.9 17.2 17.5
16.9 17.2 17.5
3.05
0.00 0.10 0.25
0.29 0.37 0.45
0.35
0.12 0.17 0.22
0.15
0˚
8˚
0.8
0.15
0.10
1.0
1.0
0.5 0.8 1.1
1.6
Appendix F Package Dimensions
JEITA Package Code
P-SDIP64-17x57.6-1.78
RENESAS Code
PRDP0064BB-A
Previous Code
DP-64S/DP-64SV
MASS[Typ.]
8.8g
D
33
E
64
1
32
b3
Reference
Symbol
L
A1
A
Z
e
bp
θ
c
e1
e1
D
E
A
A1
bp
b3
c
θ
e
Z
L
Dimension in Millimeters
Min
Nom Max
19.05
57.6 58.5
17.0 18.6
5.08
0.51
0.38 0.48 0.58
1.0
0.20 0.25 0.36
0˚
15˚
1.53 1.78 2.03
1.46
2.54
Figure F.2 DP-64S Package Dimensions
Rev. 6.00 Sep 12, 2006 page 525 of 526
REJ09B0326-0600
Appendix F Package Dimensions
JEITA Package Code
P-TQFP80-12x12-0.50
RENESAS Code
PTQP0080KC-A
Previous Code
TFP-80C/TFP-80CV
MASS[Typ.]
0.4g
HD
*1
D
60
41
61
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
40
bp
c
c1
HE
*2
E
b1
Reference
Symbol
Terminal cross section
21
ZE
80
F
c
A2
Index mark
A
20
1
ZD
θ
A1
L
L1
e
*3
y
bp
Detail F
x
M
D
E
A2
HD
H1
A
A1
bp
b1
c
c1
θ
e
x
y
ZD
ZE
L
L1
Dimension in Millimeters
Nom Max
12
12
1.00
13.8 14.0 14.2
13.8 14.0 14.2
1.20
0.00 0.10 0.20
0.17 0.22 0.27
0.20
0.12 0.17 0.22
0.15
0˚
8˚
0.5
0.10
0.10
1.25
1.25
0.4 0.5 0.6
1.0
Min
Figure F.3 TFP-80C Package Dimensions
Note: In case of inconsistencies arising within figures, dimensional drawings listed in the
Package Data Book take precedence and are considered correct.
Rev. 6.00 Sep 12, 2006 page 526 of 526
REJ09B0326-0600
Renesas 8-Bit Single-Chip Microcomputer
Hardware Manual
H8/3644 Group, H8/3644R Group,
H8/3644 F-ZTAT™, H8/3643 F-ZTAT™, H8/3642A F-ZTAT™
Publication Date: 1st Edition, September 1999
Rev.6.00, September 12, 2006
Published by:
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Edited by:
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©2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
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