Inolux IN-S121DBSRYG Smd led 3210 pcb type Datasheet

IN-S121DBSRYG
Side View SMD LED 3210 PCB Type
Features
Description
•
3210 2.1mm SMD LED
•
High Brightness
•
AlInGaP / InGaN Technology
•
Small package
•
High reliability
•
Clear Lens
The IN-S121DBSRYG is a dual-color 3210 package
with versatile design capabilities. It is a PCB type
molding style LED which can be used in various
applications.
Recommended Solder Pattern
Applications
•
Consumer Electronics
•
Wearables
•
Automobile After Market
•
Industrial Equipment
Figure 1. IN-S121DBSRYG Solder Pattern
Package Dimensions in mm
Figure 2. IN-S121DBSRYG Package Dimensions
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IN-S121DBSRYG
Side View SMD LED 3210 PCB Type
Absolute Maximum Rating at 25oC (Note 1)
Emission Color Pd (mW)
Product
IF (mA)
IFP* (mA)
Red
VR (V)
TOP (oC)
TST (oC)
5
-30 C~+85 C
70
IN-S121DBSRYG
75
25
o
o
o
o
-40 C~+90 C
70
Yellow Green
Notes
1. Condition for IFP is pulse of 1/10 duty and 0.1msec width
ESD Precaution
ATTENTION: Electrostatic Discharge (ESD) protection
The symbol above denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based chips is necessary even
though they are relatively safe in the presence of low static-electric discharge. Parts built with AlInGaP, GaN, or/and InGaN based
chips are STATIC SENSITIVE devices. ESD precaution must be taken during design and assembly.
If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process.
Please be advised that normal static precautions should be taken in the handling and assembly of this device to prevent damage or degradation
which may be induced by electrostatic discharge (ESD).
Electrical Characteristics T
A
= 25°C (Note 1)
VF(V)
Product
Emission
Color
IF(mA)
Red
Yellow Green
Viewing
λ(nm)
Angel
I*V(mcd)
typ.
max
λD
λP
△λ
2θ1/2
typ.
20
2.2
2.6
622
630
20
130
110
20
2.2
2.6
573
576
15
130
30
IN-S121DBSRYG
Notes
1. Performance guaranteed only under conditions listed in above tables.
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IN-S121DBSRYG
Side View SMD LED 3210 PCB Type
Typical Characteristic Curves – YG, Y, A, R
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IN-S121DBSRYG
Side View SMD LED 3210 PCB Type
Typical Characteristic Curves – B, G, W
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IN-S121DBSRYG
Side View SMD LED 3210 PCB Type
Typical Characteristic Curves – Radiation Pattern
Ordering Information
Product
Emission Color
Test Current
IF (mA)
Luminous Intensity
IV (mcd)
(Typ.)
Forward
Voltage
VF (V)
(Typ.)
Red
20
110
2.2
Yellow Green
20
30
2.2
IN-S121DBSRYG
Inolux Corporation
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Orderable
Part Number
IN-S121DBSRYG
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IN-S121DBSRYG
Side View SMD LED 3210 PCB Type
Label Specifications
Inolux P/N:
I
N
-
S
1
Material
Inolux
SMD
S = PCB
Type
2
Package
1
D
B
Variation
121DB = 3.0 x 1.0 x 2.1mm
S
R
YG
-
X
X
X
X
Customized
Stamp-off
Orientation
Current
Lens
Color
Chip Type
S= Side
Mount
(Blank)
= 20mA
(Blank)
= Clear
R=630nm
YG=576nm
(blank) =
Standard
01
24
001
Month
Date
Serial
Lot No.:
Z
Internal
Tracker
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2
0
1
7
Year (2017, 2018, …..)
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IN-S121DBSRYG
Side View SMD LED 3210 PCB Type
Packaging Information: 2000pcs Per Reel
Tape Dimension
Reel Dimension
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IN-S121DBSRYG
Side View SMD LED 3210 PCB Type
Packing Dimension
5 boxes per carton are available depending on shipment quantity.
Specification
Material
Quantity
Carrier tape
Per EIA 481-1A specs
Conductive black tape
2000pcs per reel
Reel
Per EIA 481-1A specs
Conductive black
Label
IN standard
Paper
Packing bag
220x240mm
Aluminum laminated bag/ no-zipper
One reel per bag
Carton
IN standard
Paper
Non-specified
Others:
Each immediate box consists of 5 reels. The 5 reels may not necessarily have the same lot number or the same
bin combinations of Iv, λD and Vf. Each reel has a label identifying its specification; the immediate box consists
of a product label as well.
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IN-S121DBSRYG
Side View SMD LED 3210 PCB Type
Dry Pack
All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times during
transportation or storage. Every reel is packaged in a moisture protected anti-static bag. Each bag is properly
sealed prior to shipment.
Upon request, a humidity indicator will be included in the moisture protected anti-static bag prior to shipment.
The packaging sequence is as follows:
Reflow Soldering
• Recommended tin glue specifications: melting temperature in the range of 178~192 OC
• The recommended reflow soldering profile is as follows (temperatures indicated are as measured on
the surface of the LED resin):
Lead-free Solder Profile
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IN-S121DBSRYG
Side View SMD LED 3210 PCB Type
Precautions
•
•
•
•
•
•
Avoid exposure to moisture at all times during transportation or storage.
Anti-Static precaution must be taken when handling GaN, InGaN, and AlInGaP products.
It is suggested to connect the unit with a current limiting resistor of the proper size. Avoid applying a
reverse voltage.
Avoid operation beyond the limits as specified by the absolute maximum ratings.
Avoid direct contact with the surface through which the LED emits light.
If possible, assemble the unit in a clean room or dust-free environment.
Reworking
•
•
•
Rework should be completed within 5 seconds under 260 OC.
The iron tip must not come in contact with the copper foil.
Twin-head type is preferred.
Cleaning
Following are cleaning procedures after soldering:
• An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended.
• Temperature x Time should be 50oC x 30sec. or <30oC x 3min
• Ultra sonic cleaning: < 15W/ bath; bath volume ≤ 1liter
• Curing: 100 OC max, <3min
Cautions of Pick and Place
•
•
•
Avoid stress on the resin at elevated temperature.
Avoid rubbing or scraping the resin by any object.
Electro-static may cause damage to the component. Please ensure that the equipment is properly
grounded. Use of an ionizer fan is recommended.
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Side View SMD LED 3210 PCB Type
Reliability
Item
Precondition
Frequency/ lots/ samples/
failures
For all reliability
monitoring tests according
to JEDEC Level 2
1Q/ 1/ 22/ 0
Solderability
Standards
Reference
J-STD-020
CNS-554
1.) Baking at 85°C for 24hrs
2.) Moisture storage at 85°C/ 60% R.H. for
168hrs
Accelerated aging 155°C/ 24hrs
Tinning speed: 2.5+0.5cm/s
Tinning: A: 215°C/ 3+1s or B: 260°C/ 10+1s
Dipping soldering terminal only
Soldering bath temperature
A: 260+/-5°C; 10+/-1s
B: 350+/-10°C; 3+/-0.5s
1.) Precondition: 85°C bakin g for 24hrs
85°C/ 60%R.H. for 168hrs
2.) Tamb25°C; IF=20mA; duration 1000hrs
Tamb: 85°C
Humidity: 85% R.H., IF=5mA
Duration: 1000hrs
Tamb: 55°C
IF=20mA
Duration: 1000hrs
Tamb25°C, If=20mA,, Ip=100mA, Duty
cycle=0.125 (tp=125μs,T=1sec)
Duration 500hrs)
A cycle: -40 degree C 15min; +85 degree C
15min
Thermal steady within 5 min..
300 cycles
2 chamber/ Air-to-air type
60+3°C
90+5/-10% R.H. for 500hrs
100+10°C for 500hrs
CNS-6118
-40+5°C for 500hrs
JESD22-B102-B
And CNS-5068
CNS-5067
Resistance to
soldering heat
1Q/ 1/ 40/ 0
CNS-11829
Operating life test
High humidity,
1Q/ 1/ 45/ 0
high temperature
bias
1Q/ 1/ 20
High temperature
bias
JESD-A101-B
IN specs.
1Q/ 1/ 40/ 0
Pulse life test
1Q/ 1/ 76/ 0
Temperature
cycle
High humidity
1Q/ 1/ 40/ 0
storage test
High temperature 1Q/ 1/ 40/ 0
storage test
Low temperature 1Q/ 1/ 40/ 0
storage test
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Conditions
JESD-A104-A
IEC 68-2-14, Nb
CNS-6117
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IN-S121DBSRYG
Side View SMD LED 3210 PCB Type
Revision History
Changes since last revision
Initial Release
Page
Version No.
V1.0
Revision Date
05-12-2017
DISCLAIMER
INOLUX reserves the right to make changes without further notice to any products herein to improve reliability, function or design. INOLUX does not
assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent
rights, nor the rights of others.
LIFE SUPPORT POLICY
INOLUX’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the
President of INOLUX or INOLUX CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or system, or to affect its safety or effectiveness.
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