ON NB4L52MNR2G 2.5 v/3.3 v/5.0 v differential data/clock d flip-flop with reset multi-level inputs to lvpecl translator w/ internal termination Datasheet

NB4L52
2.5 V/3.3 V/5.0 V Differential
Data/Clock D Flip−Flop
with Reset
Multi−Level Inputs to LVPECL Translator
w/ Internal Termination
The NB4L52 is a differential Data and Clock D flip−flop with a
differential asynchronous Reset. The differential inputs incorporate
internal 50 W termination resistors and will accept PECL, LVPECL,
LVCMOS, LVTTL, CML, or LVDS logic levels. When Clock
transitions from Low to High, Data will be transferred to the
differential LVPECL outputs. The differential Clock inputs allow the
NB4L52 to also be used as a negative edge triggered device. The
device is housed in a small 3x3 mm 16 pin QFN package.
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MARKING DIAGRAM*
16
1
•
•
Maximum Input Clock Frequency > 4 GHz Typical
330 ps Typical Propagation Delay
145 ps Typical Rise and Fall Times
Differential LVPECL Outputs, 750 mV Peak−to−Peak, Typical
Operating Range: VCC = 2.375 V to 5.5 V with VEE = 0 V
Internal Input Termination Resistors, 50 W
Functionally Compatible with Existing 2.5 V/3.3 V/5.0 V LVEL,
LVEP, EP, and SG Devices
−40°C to +85°C Ambient Operating Temperature
These are Pb−Free Devices*
NB4L
52
ALYWG
G
QFN−16
MN SUFFIX
CASE 485G
Features
•
•
•
•
•
•
•
1
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
VTD
D
Data
D
Q
VTD
Q
VTCLK
CLK
Clock
CLK
Reset
VTCLK
VTR R
R VTR
Figure 1. Logic Diagram
Table 1. TRUTH TABLE
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
R
D
CLK
Q
H
x
x
L
L
L
Z
L
L
H
Z
H
Z = LOW to HIGH Transition
x = Don’t Care
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
© Semiconductor Components Industries, LLC, 2007
January, 2007 − Rev. 2
1
Publication Order Number:
NB4L52/D
NB4L52
VTR
R
R
VTR
16
15
14
13
12
VCC
11
Q
3
10
Q
4
9
VEE
VTD
1
D
2
D
VTD
NB4L52
5
6
7
VTCLK CLK
8
CLK VTCLK
Exposed Pad (EP)
Figure 2. Pinout (Top View)
Table 2. PIN DESCRIPTION
Pin
Name
I/O
Description
1
VTD
−
2
D
ECL, CML, LVCMOS,
LVDS, LVTTL Input
Noninverted Differential Input. (Note 1)
3
D
ECL, CML, LVCMOS,
LVDS, LVTTL Input
Inverted Differential Input. (Note 1)
4
VTD
−
Internal 50 W Termination Pin. (See Table 4)
5
VTCLK
−
Internal 50 W Termination Pin. (See Table 4)
6
CLK
ECL, CML, LVCMOS,
LVDS, LVTTL Input
Noninverted Differential Input. (Note 1)
7
CLK
ECL, CML, LVCMOS,
LVDS, LVTTL Input
Inverted Differential Input. (Note 1)
8
VTCLK
−
Internal 50 W Termination Pin. (See Table 4)
9
VEE
−
Negative Supply Voltage
10
Q
ECL Output
Inverted Differential Output. Typically terminated with 50 W resistor to VCC − 2.0 V.
11
Q
ECL Output
Noninverted Differential Output. Typically terminated with 50 W resistor to VCC − 2.0 V.
12
VCC
−
Positive Supply Voltage
13
VTR
−
Internal 50 W Termination Pin. (See Table 4)
14
R
LVECL, LVCMOS,
LVTTL Input
Noninverted Differential Reset Input. (Note 1)
15
R
LVECL, LVCMOS,
LVTTL Input
Inverted Differential Reset Input. (Note 1)
16
VTR
−
Internal 50 W Termination Pin. (See Table 4)
−
EP
−
The Exposed Pad (EP) on the QFN−16 package bottom is thermally connected to the die
for improved heat transfer out of package. The pad is not electrically connected to the die,
but is recommended to be electrically and thermally connected to VEE on the PC board.
Internal 50 W Termination Pin. (See Table 4)
1. In the differential configuration when the input termination pin (VTD, VTD, VTR, VTR, VTCLK, VTCLK) are connected to a common
termination voltage or left open, and if no signal is applied on D/D,CLK/CLK,R/R input then the device will be susceptible to self−oscillation.
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2
NB4L52
Table 3. ATTRIBUTES
Characteristic
ESD Protection
Value
Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 200 V
> 1 kV
Moisture Sensitivity (Note 2)
QFN−16
Pb Pkg
Pb−Free Pkg
Level 1
Level 1
Flammability Rating Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
164
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
2. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
6.0
V
−6.0
V
6.0
−6.0
V
V
Static
Surge
45
80
mA
mA
Continuous
Surge
25
50
mA
mA
−40 to +85
°C
VCC
Positive Power Supply
VEE = 0 V
VEE
Negative Power Supply
VCC = 0 V
VIO
Positive Input/Output
Negative Input/Output
VEE = 0 V
VCC = 0 V
IIN
Input Current Through RT (50 W Resistor)
Iout
Output Current
TA
Operating Temperature Range
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 LFPM
500 LFPM
16 QFN
16 QFN
42
35
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
2S2P (Note 3)
16 QFN
4.0
°C/W
Tsol
Wave Solder
265
°C
Pb−Free
VI v VCC
VI w VEE
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.
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3
NB4L52
Table 5. DC CHARACTERISTICS, CLOCK INPUTS, LVPECL OUTPUTS
(VCC = 2.375 V to 5.5 V, VEE = 0 V or VCC = 0 V, VEE = −2.375 to −5.5 V, TA = −40°C to +85°C)
Symbol
Characteristic
Min
Typ
Max
Unit
16
25
mA
IEE
Power Supply Current (Inputs and Outputs Open)
VOH
Output HIGH Voltage (Note 4, 5)
VCC = 5.0 V
VCC = 3.3 V
VCC = 2.5 V
VCC − 1145
3855
2155
1355
VCC − 1020
3980
2280
1480
VCC − 895
4105
2405
1605
mV
VOL
Output LOW Voltage (Note 4, 5)
VCC = 5.0V
VCC = 3.3V
VCC = 2.5V
VCC − 1945
3055
1355
555
VCC − 1770
3230
1530
730
VCC − 1600
3400
1700
900
mV
1050
VCC − 150
mV
DIFFERENTIAL INPUT DRIVEN SINGLE−ENDED (Figures 4 & 7)
Vth
Input Threshold Reference Voltage Range (Note 6)
VIH
Single−ended Input HIGH Voltage
Vth + 150
VCC
mV
VIL
Single−ended Input LOW Voltage
VEE
Vth − 150
mV
DIFFERENTIAL INPUT DRIVEN DIFFERENTIALLY (Figures 5, 6 & 8 )
VIHD
Differential Input HIGH Voltage
1200
VCC
mV
VILD
Differential Input LOW Voltage
VEE
VCC − 150
mV
VCMR
Input Common Mode Range (Differential Configuration) (Note 7)
1125
VCC – 75
mV
VID
Differential Input Voltage (VIHD − VILD)
150
VCC
mV
IIH
Input HIGH Current
D / D, CLK / CLK, R /R
(VTx/VTx Open)
−150
150
mA
IIL
Input LOW Current
D / D, CLK / CLK, R /R
(VTx/VTx Open)
−150
150
mA
RTIN
Internal Input Termination Resistor
60
W
40
50
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. LVPECL outputs loaded with 50 W to VCC – 2.0 V for proper operation.
5. Input and output parameters vary 1:1 with VCC.
6. Vth is applied to the complementary input when operating in single−ended mode.
7. VCMRMIN varies 1:1 with VEE, VCMRMAX varies 1:1 with VCC. The VCMR range is referenced to the most positive side of the differential input
signal.
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NB4L52
Table 6. AC CHARACTERISTICS VCC = 2.375 V to 5.5 V; VEE = 0 V or VCC = 0 V, VEE = −2.375 to −5.5 V (Note 8)
−40°C
Characteristic
VOUTPP
Output Voltage Amplitude (@ VINPPmin)
(Note 10) (See Figure 4)
fin v 2.0 GHz
fin v 3.0 GHz
fin v 4.0 GHz
530
490
380
770
720
580
tPLH,
tPHL
Propagation Delay to
Output Differential
300
400
ts
Setup Time
100
100
100
ps
th
Hold Time
50
50
50
ps
tRR
Reset Recovery
400
400
400
ps
tPW
Minimum Pulse Width
250
250
250
ps
tJITTER
RMS Random Clock Jitter (Note 9)
VINPP
Input Voltage Swing/Sensitivity
(Differential Configuration) (Note 10)
150
tr
tf
Output Rise/Fall Times @ 0.5 GHz
(20% − 80%)
80
R/R
fin v 2.0 GHz
fin v 3.0 GHz
fin v 4.0 GHz
Max
500
Min
Typ
530
490
380
780
730
580
300
400
85°C
Symbol
CLK to Q, R to Q
Typ
25°C
Min
1
1
1
135
Max
500
Min
Typ
530
490
380
760
680
530
300
400
1
1
1
2800
150
190
80
Max
mV
500
150
190
80
145
155
ps
ps
1
1
1
2800
Unit
2800
mV
190
ps
VOUTPP, OUTPUT VOLTAGE AMPLITUDE (mV)
(TYPICAL)
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
8. Measured by forcing VINPP (MIN) from a 50% duty cycle clock source. All loading with an external RL = 50 W to VCC – 2.0 V. Input edge
rates 40 ps (20% − 80%).
9. Additive RMS jitter with 50% duty cycle clock signal.
10. Input and output voltage swing is a single−ended measurement operating in differential mode.
800
700
600
500
400
300
200
100
0
0
1
2
3
fin, CLOCK INPUT FREQUENCY (GHz)
Figure 3. Output Voltage Amplitude (VOUTPP) vs.
Clock Input Frequency at Ambient Temperature (Typical).
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4
NB4L52
CLK/D/R
VIH
Vth
VIL
Vth
CLK/D/R
CLK/D/R
CLK/D/R
Figure 4. Differential Input Driven Single−Ended
Figure 5. Differential Inputs Driven Differentially
VID = |VIHD − VILD|
CLK/D/R
VIHD
CLK/D/R
VILD
Figure 6. Differential Inputs Driven Differentially
VCC
Vthmax
VCC
VCMmax
VIHmax
CLK
VILmax
VIHDmax
VILDmax
VCMR
Vth
Vthmin
VEE
VIHmin
CLK
VIHDmin
VILDmin
VCMmin
VILmin
VEE
Figure 7. Vth Diagram
Figure 8. VCMR Diagram
CLK/D/R
VINPP = VIH − VIL
CLK/D/R
Q
VOUTPP = VOH(Q) − VOL(Q)
Q
tPHL
tPLH
Figure 9. AC Reference Measurement
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NB4L52
NB6L239
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 10. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
ORDERING INFORMATION
Package
Shipping †
NB4L52MNG
QFN−16, 3 x 3 mm
(Pb−Free)
123 Units / Rail
NB4L52MNR2G
QFN−16, 3 x 3 mm
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPS I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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NB4L52
PACKAGE DIMENSIONS
16 PIN QFN
CASE 485G−01
ISSUE C
D
PIN 1
LOCATION
ÇÇÇ
ÇÇÇ
ÇÇÇ
0.15 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. Lmax CONDITION CAN NOT VIOLATE 0.2 MM
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
A
B
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
TOP VIEW
0.15 C
(A3)
0.10 C
A
16 X
0.08 C
SIDE VIEW
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
1.65
1.85
3.00 BSC
1.65
1.85
0.50 BSC
0.18 TYP
0.30
0.50
SEATING
PLANE
A1
C
D2
16X
L
5
NOTE 5
e
4
16X
9
E2
K
12
1
16
16X
e
13
b
0.10 C A B
0.05 C
EXPOSED PAD
8
BOTTOM VIEW
NOTE 3
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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For additional information, please contact your local
Sales Representative
NB4L52/D
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