Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LMT90 SNIS177B – MARCH 2013 – REVISED SEPTEMBER 2015 LMT90 SOT-23 Single-Supply Centigrade Temperature Sensor 1 Features 3 Description • • • • • • • • • • The LMT90 device is a precision integrated-circuit temperature sensor that can sense a −40°C to +125°C temperature range using a single positive supply. The output voltage of LMT90 is linearly proportional to Celsius (Centigrade) temperature (10 mV/°C) and has a DC offset of 500 mV. The offset allows reading negative temperatures without the need for a negative supply. The ideal output voltage of the LMT90 ranges from 100 mV to 1.75 V for a −40°C to 125°C temperature range. The LMT90 does not require any external calibration or trimming to provide accuracies of ±3°C at room temperature and ±4°C over the full −40°C to +125°C temperature range. Trimming and calibration of the LMT90 at the wafer level assure low cost and high accuracy. The linear output, 500-mV offset, and factory calibration of LMT90 simplify circuitry required in a single-supply environment where reading negative temperatures is required. The LMT90's quiescent current is less than 130 μA, thus self-heating is limited to a very low 0.2°C in still air. 1 Cost-Effective Alternative to Thermistors Calibrated Directly in Degree Celsius (Centigrade) Linear + 10.0 mV/°C Scale Factor ±3°C Accuracy Guaranteed at 25°C Specified for Full −40° to 125°C range Suitable for Remote Applications Operates from 4.5 V to 10 V Less than 130-μA Current Drain Low Self-heating, Less Than 0.2°C in Still Air Non-linearity Less Than 0.8°C Over Temp 2 Applications • • • • • • • • • • Industrial HVAC Disk Drives Automotive Portable Medical Instruments Computers Battery Management Printers Power Supply Modules FAX Machines The LMT90 is a cost-competitive alternative to thermistors. Device Information(1) PART NUMBER LMT90 PACKAGE BODY SIZE (NOM) SOT-23 (3) 2.92 mm × 1.30 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic +VS (4.5 V to 10 V) Full-Range Centigrade Temperature Sensor (–40°C to +125°C) 2.00 LMT90 Output Output Voltage (V) 1.75 1.50 1.750 1.25 0.750 1.00 0.75 0.50 0.100 VO = (+10 mV/°C × T °C) + 500 mV 0.25 0.00 ±50 ±25 0 25 50 75 DUT Temperature (C) 100 125 150 C001 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LMT90 SNIS177B – MARCH 2013 – REVISED SEPTEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 6.6 3 3 3 4 4 5 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 7 7.1 Overview ................................................................... 7 7.2 Functional Block Diagram ......................................... 7 7.3 Feature Description................................................... 7 7.4 Device Functional Modes.......................................... 7 8 Application and Implementation .......................... 8 8.1 Application Information.............................................. 8 8.2 Typical Application .................................................... 9 8.3 System Examples ................................................... 10 9 Power Supply Recommendations...................... 10 10 Layout................................................................... 10 10.1 Layout Guidelines ................................................. 10 10.2 Layout Examples................................................... 11 11 Device and Documentation Support ................. 12 11.1 11.2 11.3 11.4 Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 12 12 12 12 12 Mechanical, Packaging, and Orderable Information ........................................................... 12 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (March 2013) to Revision B • 2 Page Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ............................... 1 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: LMT90 LMT90 www.ti.com SNIS177B – MARCH 2013 – REVISED SEPTEMBER 2015 5 Pin Configuration and Functions DBZ Package 3-Pin SOT-23 Top View +VS 1 3 VO GND 2 Pin Functions PIN NO. NAME 1 TYPE DESCRIPTION +VS POWER Positive power supply pin 2 VO OUTPUT Temperature sensor analog output 3 GND GND Device ground pin, connected to power supply negative terminal 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply Voltage –0.2 12 V Output Voltage −1 (+VS + 0.6) V Output Current 10 mA Maximum Junction Temperature, TJMAX 150 °C 150 °C −65 Storage temperature, Tstg (1) Stresses beyond those listed under Absolute Maximum Ratingsmay cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE V(ESD) (1) Electrostatic discharge Human body model (HBM) (1) 2000 Machine Model (1) 250 UNIT V The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. Machine model is a 200-pF capacitor discharged directly into each pin. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT LMT90 (TMIN ≤ TA ≤ TMAX) −40 125 °C Operating Temperature Range (Device is functional but performance is not specified) −40 150 °C 4.5 10 V Supply Voltage Range (+VS) (1) Soldering process must comply with the Reflow Temperature Profile specifications. Reflow temperature profiles are different for leadfree and non-lead-free packages. Refer to www.ti.com/packaging. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: LMT90 3 LMT90 SNIS177B – MARCH 2013 – REVISED SEPTEMBER 2015 www.ti.com 6.4 Thermal Information LMT90 THERMAL METRIC (1) DBZ (SOT-23) UNIT 3 PINS RθJA (1) Junction-to-ambient thermal resistance 450 °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.5 Electrical Characteristics Unless otherwise noted, these specifications apply for VS = 5 VDC and ILOAD = 0.5 μA, in the circuit of Figure 14. All limits TA = TJ = 25°C, unless otherwise noted. PARAMETER Accuracy (2) TEST CONDITIONS MIN TYP –3 3 °C –4 4 °C TA = TMIN –4 4 °C 0.8 °C 10.3 mV/°C TA = TJ = TMIN to TMAX –0.8 Sensor Gain (Average Slope) TA = TJ = TMIN to TMAX 9.7 Output Resistance 2000 TA = TJ = TMIN to TMAX Line Regulation (4) Quiescent Current (5) (5) –0.8 0.8 mV/V –1.2 1.2 mV/V 4.5 V ≤ VS ≤ 10 V 130 μA 4.5 V ≤ VS ≤ 10 V TA = TJ = TMIN to TMAX 180 μA 4.5 V ≤ VS ≤ 10 V TA = TJ = TMIN to TMAX 2 μA TA = TJ = TMIN to TMAX TJ = 125°C, for 1000 hours (4) (5) (6) 4 Ω TA = TJ = TMIN to TMAX Long Term Stability (6) (3) 4000 4.5 V ≤ VS ≤ 10 V Temperature Coefficient of Quiescent Current (1) (2) UNIT TA = TMAX Non-linearity (3) Change of Quiescent Current MAX (1) 2 ±0.08 μA/°C °C Limits are specific to TI's AOQL (Average Outgoing Quality Level). Accuracy is defined as the error between the output voltage and 10 mv/°C times the device's case temperature plus 500 mV, at specified conditions of voltage, current, and temperature (expressed in °C). Non-linearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's rated temperature range. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. Quiescent current is defined in the circuit of Figure 14. For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: LMT90 LMT90 www.ti.com SNIS177B – MARCH 2013 – REVISED SEPTEMBER 2015 6.6 Typical Characteristics To generate these curves the LMT90 was mounted to a printed circuit board as shown in Figure 19. Figure 1. Thermal Resistance Junction to Air Figure 2. Thermal Time Constant Figure 3. Thermal Response in Still Air With Heat Sink (Figure 19) Figure 4. Thermal Response in Stirred Oil Bath With Heat Sink Figure 5. Startup Voltage vs Temperature Figure 6. Thermal Response in Still Air Without a Heat Sink Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: LMT90 5 LMT90 SNIS177B – MARCH 2013 – REVISED SEPTEMBER 2015 www.ti.com Typical Characteristics (continued) To generate these curves the LMT90 was mounted to a printed circuit board as shown in Figure 19. Figure 7. Quiescent Current vs Temperature (Figure 14) Figure 8. Accuracy vs Temperature Figure 9. Noise Voltage Figure 10. Supply Voltage vs Supply Current Figure 11. Start-Up Response 6 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: LMT90 LMT90 www.ti.com SNIS177B – MARCH 2013 – REVISED SEPTEMBER 2015 7 Detailed Description 7.1 Overview The LMT90 is a precision integrated-circuit temperature sensor that can sense a −40°C to 125°C temperature range using a single positive supply. The output voltage of the LMT90 has a positive temperature slope of 10 mV/°C. A 500-mV offset is included enabling negative temperature sensing when biased by a single supply. The temperature-sensing element is comprised of a delta-VBE architecture. The temperature-sensing element is then buffered by an amplifier and provided to the VO pin. The amplifier has a simple class A output stage with typical 2-kΩ output impedance as shown in the Functional Block Diagram. The output impedance has a temperature coefficient of approximately 1300 ppm/°C. Over temperature the output impedance will max out at 4 kΩ. 7.2 Functional Block Diagram *R2 ≈ 2k With a typical 1300 ppm/°C Drift. 7.3 Feature Description 7.3.1 LMT90 Transfer Function The LM60 follows a simple linear transfer function in order to achieve the accuracy as listed in Electrical Characteristics: VOUT = 10 mV/°C × T °C + 500 mV where • • T is the temperature in °C VOUT is the LMT90 output voltage (1) 7.4 Device Functional Modes The LMT90's only functional mode is that it has an analog output directly proportional to temperature. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: LMT90 7 LMT90 SNIS177B – MARCH 2013 – REVISED SEPTEMBER 2015 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LMT90 has a wide supply range and a 10 mV/°C output slope with a 500-mV DC offset at 25 °C. Therefore, it can easily be applied in many temperature-sensing applications where a single supply is required for positive and negative temperatures. 8.1.1 Capacitive Loads The LMT90 handles capacitive loading very well. Without any special precautions, the LMT90 can drive any capacitive load. The LMT90 has a nominal 2-kΩ output impedance (as can be seen in the Functional Block Diagram). The temperature coefficient of the output resistors is around 1300 ppm/°C. Taking into account this temperature coefficient and the initial tolerance of the resistors the output impedance of the LMT90 will not exceed 4 kΩ. In an extremely noisy environment it may be necessary to add some filtering to minimize noise pickup. TI recommends that 0.1 μF be added from VIN to GND to bypass the power supply voltage, as shown in Figure 13. In a noisy environment, it may be necessary to add a capacitor from the output to ground. A 1-μF output capacitor with the 4-kΩ output impedance will form a 40-Hz lowpass filter. Because the thermal time constant of the LMT90 is much slower than the 25-ms time constant formed by the RC, the overall response time of the LMT90 will not be significantly affected. For much larger capacitors this additional time lag will increase the overall response time of the LMT90. + LMT90 Heavy Capacitive Load, Wiring, Etc. To A High-Impedance Load OUT d Figure 12. LMT90 No Decoupling Required for Capacitive Load + LMT90 0.1 µF Bypass Optional d Heavy Capacitive Load, Wiring, Etc. OUT 1 µF Figure 13. LMT90 With Filter for Noisy Environment 8 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: LMT90 LMT90 www.ti.com SNIS177B – MARCH 2013 – REVISED SEPTEMBER 2015 8.2 Typical Application +VS (4.5 V to 10 V) LMT90 Output Figure 14. Full-Range Centigrade Temperature Sensor (−40°C to 125°C) 8.2.1 Design Requirements For this design example, use the following design parameters in Table 1. Table 1. Design Parameters VALUE UNIT Accuracy at 25°C PARAMETER ±3.0 (maximum) °C Accuracy Over –40°C to 125°C ±4.0 (maximum) °C 10 mV/°C Temperature slope Power Supply Voltage Range Output Impedance 4.5 to 10 V 4 (maximum) kΩ 8.2.2 Detailed Design Procedure The LMT90 is a simple temperature sensor that provides an analog output. Therefore design requirements related to layout out weigh other requirements in importance, refer to Layout for a detailed description. 8.2.3 Application Curve 2.00 Output Voltage (V) 1.75 1.50 1.750 1.25 0.750 1.00 0.75 0.50 0.100 VO = (+10 mV/°C × T °C) + 500 mV 0.25 0.00 ±50 ±25 0 25 50 75 100 125 150 DUT Temperature (C) C001 Figure 15. Plot of Output Transfer Function Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: LMT90 9 LMT90 SNIS177B – MARCH 2013 – REVISED SEPTEMBER 2015 www.ti.com 8.3 System Examples Figure 16. Centigrade Thermostat / Fan Controller Figure 17. Temperature to Digital Converter (Serial Output) (125°C Full Scale) Figure 18. LMT90 With Voltage-To-Frequency Converter and Isolated Output (−40°C to 125°C; 100 Hz to 1750 Hz) 9 Power Supply Recommendations In an extremely noisy environment, it may be necessary to add some filtering to minimize noise pickup. TI recommends that 0.1 μF be added from VIN to GND to bypass the power supply voltage, as shown in Figure 13. 10 Layout 10.1 Layout Guidelines The LMT90 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface and its temperature will be within about 0.2°C of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature of the LMT90 die would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity the backside of the LMT90 die is directly attached to the GND pin. The lands and traces to the LMT90 will, of course, be part of the printed-circuit-board, which is the object whose temperature is being measured. These printed-circuit-board lands and traces will not cause the LMT90 temperature to deviate from the desired temperature. 10 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: LMT90 LMT90 www.ti.com SNIS177B – MARCH 2013 – REVISED SEPTEMBER 2015 Layout Guidelines (continued) Alternatively, the LMT90 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LMT90 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as a conformal coating and epoxy paints or dips are often used to ensure that moisture cannot corrode the LMT90 or its connections. Table 2. Temperature Rise of LMT90 Due to Self-Heating (Thermal Resistance, RΘJA) Still air Moving air (1) (2) SOT-23 no heat sink (1) SOT-23 small heat fin (2) 450°C/W 260°C/W — 180°C/W Part soldered to 30 gauge wire. Heat sink used is 1/2-inch square printed circuit board with 2-oz. foil with part attached as shown in Figure 19. 10.2 Layout Examples +VS 1 3 VO GND 2 Via to ground plane Via to power plane 1/2-inch square printed-circuit-board with 2-oz. foil or similar Figure 19. PCB Layout Figure 20. PCB Used for Heat Sink to Generate Thermal Response Curves Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: LMT90 11 LMT90 SNIS177B – MARCH 2013 – REVISED SEPTEMBER 2015 www.ti.com 11 Device and Documentation Support 11.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.2 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 12 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: LMT90 PACKAGE OPTION ADDENDUM www.ti.com 2-Oct-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMT90DBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T8C LMT90DBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T8C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 2-Oct-2014 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 3-Oct-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LMT90DBZR SOT-23 DBZ 3 3000 178.0 8.4 LMT90DBZT SOT-23 DBZ 3 250 178.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.3 2.9 1.22 4.0 8.0 Q3 3.3 2.9 1.22 4.0 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 3-Oct-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMT90DBZR SOT-23 DBZ 3 3000 210.0 185.0 35.0 LMT90DBZT SOT-23 DBZ 3 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated