ON NOIL2SM1300A-GWC Lupa1300-2: high speed cmos image sensor Datasheet

NOIL2SM1300A
LUPA1300-2: High Speed
CMOS Image Sensor
Features
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1280 x 1024 Active Pixels
14 mm X 14 mm Square Pixels
1.4” Optical Format
Monochrome or Color Digital Output
500 fps Frame Rate
On-Chip 10-Bit ADCs
12 LVDS Serial Outputs
Random Programmable ROI Readout
Pipelined and Triggered Global Shutter
On-Chip Column FPN Correction
Serial Peripheral Interface (SPI)
Limited Supplies: Nominal 2.5 V and 3.3 V
−50°C to +85°C Operational Temperature Range
168-Pin mPGA Package
Power Dissipation: 1350 mW
These Devices are Pb−Free and are RoHS Compliant
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Applications
• High Speed Machine Vision
• Motion Analysis
• Intelligent Traffic System
Figure 1. LUPA1300−2 Die Photo
• Medical Imaging
• Industrial Imaging
Description
The LUPA1300-2 is an integrated SXGA high speed, high
sensitivity CMOS image sensor. This sensor targets high
speed machine vision and industrial monitoring
applications. The LUPA1300-2 sensor runs at 500 fps and
has triggered and pipelined shutter modes. It packs 24
parallel 10-bit A/D converters with an aggregate conversion
rate of 740 MSPS. On-chip digital column FPN correction
enables the sensor to output ready to use image data for most
applications. To enable simple and reliable system
integration, the 12 channels, 1 sync channel, 8 Gbps, and
LVDS serial link protocol supports skew correction and
serial link integrity monitoring.
The peak responsivity of the 14 mm x 14 mm 6T pixel is
63 DN/nJ/cm2. Dynamic range is measured at 57 dB. In full
frame video mode, the sensor consumes 1350 mW from the
2.5 V and 3.3 V power supplies. The sensors integrate A/D
© Semiconductor Components Industries, LLC, 2014
June, 2014 − Rev. 10
conversion, on-chip timing for a wide range of operating
modes, and has an LVDS interface for easy system
integration.
By removing the visually disturbing column patterned
noise, this sensor enables building a camera without any
offline correction or the need for memory. In addition, the
on-chip column FPN correction is more reliable than an
offline correction, because it compensates for supply and
temperature variations. The sensor requires one master
clock for operations up to 500 fps.
The LUPA1300-2 is housed in a 168 pin mPGA package
and is available in a monochrome version and Bayer (RGB)
patterned color filter array. The monochrome version is also
available
without
glass.
Contact
your
local
ON Semiconductor office.
1
Publication Order Number:
NOIL2SM1300A/D
NOIL2SM1300A
ORDERING INFORMATION
Marketing Part Number
Description
NOIL2SM1300A-GDC
Mono with Glass
NOIL2SM1300A-GWC
Mono without Glass
NOIL2SC1300A-GDC
Color with Glass
Package
168 pin mPGA
ORDERING CODE DEFINITION
N O I L2 S M 1300 A − G D C
ON Semiconductor
Opto
Image Sensors
Temperature Range
D = D263 Glass, W = Windowless
L2: LUPA Family
Package G = cPGA
Additional Functionality
S: Standard Process
1300: 1.3 MegaPixel Resolution
M = Mono
C = Color
PRODUCT PACKAGE MARK
XXXXX
A
WL
YY
WW
NNNN
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Serial Number
Figure 2. Marking Diagram
Line 1: NOIL2Sx1300A−GyC where x denotes M = mono and C = color; y denotes D = D263 glass and W = windowless.
Line 2: AWLYYWW where AWL is PRODUCTION lot traceability, YYWW is the 4−digit date code
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NOIL2SM1300A
SPECIFICATIONS
Key Specifications
Table 1. GENERAL SPECIFICATIONS
Parameter
Table 2. ELECTRO−OPTICAL SPECIFICATIONS
Specifications
Parameter
Value
Active Pixels
1280 (H) x 1024 (V)
Conversion gain
0.0325 LSB10/e-
Pixel Size
14 mm x 14 mm
Full well charge
30 ke-
Pixel Type
6T pixel architecture
Responsivity
63 LSB10/nJ/cm2 at 550 nm
Pixel Rate
630 Mbps per channel (12 serial
LVDS outputs)
Fill factor
40%
Shutter Type
Pipelined and Triggered Global
Shutter
Parasitic light sensitivity
< 1/10,000
Dark noise
1.2025 LSB10
Frame Rate
500 fps at 1.3 Mpixel (boosted by
subsampling and windowing)
QE x FF
35% at 550 nm
FPN
2% RMS of the output swing
Master Clock
315 MHz for 500 fps
PRNU
< 1% RMS of the output signal
Windowing (ROI)
Randomly programmable ROI read
out up to four multiple windows
Dark signal
162 LSB10/s, 5000 e-/s
Read Out
Windowed, flipped, mirrored, and
subsampled readout possible
Power dissipation
1350 mW
ADC Resolution
10−bit, on−chip
Extended Dynamic
Range
Multiple slope
(up to 90 dB optical dynamic range)
Absolute Maximum Ratings
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Table 3. ABSOLUTE MAXIMUM RATINGS (Note 1)
Symbol
Description
Min
Max
Units
ABS (2.5 V supply group)
ABS rating for 2.5 V supply group
−0.5
3.0
V
ABS (3.3 V supply group)
ABS rating for 3.3 V supply group
−0.5
4.3
V
ABS (3.5 V supply group)
ABS rating for 3.5 V supply group
−0.5
4.3
V
ESD (Note 3)
HBM
2000
V
CDM
500
V
LU
Latchup
200
mA
TS (Notes 4 and 5)
ABS Storage temperature range
−40
ABS Storage humidity range at 85°C
+150
°C
85
%RH
+85
°C
RECOMMENDED OPERATING RATINGS
TJ (Notes 2 and 5)
Operating temperature range
−50
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Absolute maximum ratings are limits beyond which damage may occur.
2. Operating ratings are conditions at which operation of the device is intended to be functional.
3. ON Semiconductor recommends that our customers become familiar with, and follow the procedures in JEDEC Standard JESD625−A.
Refer to Application Note AN52561. Long term exposure toward the maximum storage temperature will accelerate color filter degradation.
4. Caution needs to be taken to avoid dried stains on the underside of the glass due to condensation. The glass lid glue is permeable and can
absorb moisture if the sensor is placed in a high % RH environment.
5. HTS − High Temperature Storage was successfully completed on LUPA 1300-2 color devices at +150°C for 500 hours. Temperature Cycling
was successfully completed from −40°C to +125°C up to 1000 cycles. No reliability stress has been performed at −50°C.
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NOIL2SM1300A
Electrical Specifications
Table 4. POWER SUPPLY RATINGS (Notes 1, 2 and 3)
Boldface limits apply for TJ = TMIN to TMAX, all other limits TJ = +30°C. Clock = 315 MHz
Symbol
VANA, GNDANA
VDIG, GNDDIG
VPIX, GNDPIX
VLVDS,
GNDLVDS
VADC, GNDADC
VBUF, GNDBUF
VSAMPLE,
GNDSAMPLE
VRES
Power Supply
Analog Supply
Digital Supply
Pixel Supply
LVDS Supply
ADC Supply
Buffer Supply
Sampling
Circuitry Supply
Reset Supply
Parameter
Condition
Operating Voltage
Min
Typ
Max
Units
-5%
2.5
+5%
V
20
mA
Dynamic Current
Clock enabled, lux = 0
7
Peak Current
Clock enabled, lux = 0
16
mA
Standby Current
Shutdown mode, lux = 0
1
mA
Operating Voltage
-5%
2.5
+5%
V
120
mA
Dynamic Current
Clock enabled, lux = 0
80
Peak Current
Clock enabled, lux = 0
130
Standby Current
Shutdown mode, lux = 0
52
Operating Voltage
-5%
mA
2.5
+5%
V
6
50
mA
Dynamic Current
Clock enabled, lux = 0
Peak Current during FOT
Clock enabled, lux = 0,
transient duration = 9 ms
1.4
A
Peak Current during ROT
Clock enabled, lux = 0,
transient duration = 2.5 ms
35
mA
Standby Current
Shutdown mode, lux = 0
1
mA
Operating Voltage
-5%
2.5
+5%
V
275
mA
Dynamic Current
Clock enabled, lux = 0
220
Peak Current
Clock enabled, lux = 0
280
mA
Standby Current
Shutdown mode, lux = 0
100
mA
Operating Voltage
-5%
2.5
+5%
V
275
mA
Dynamic Current
Clock enabled, lux = 0
210
Peak Current
Clock enabled, lux = 0
260
Standby Current
Shutdown mode, lux = 0
Operating Voltage
mA
3
-5%
mA
2.5
+5%
V
50
mA
Dynamic Current
Clock enabled, lux = 0
30
Peak Current
Clock enabled, lux = 0
85
mA
Standby Current
shutdown mode, lux = 0
0.1
mA
Operating Voltage
-5%
2.5
+5%
V
Dynamic Current
Clock enabled, lux = 0
2
mA
Peak Current
Clock enabled, lux = 0
42
mA
Standby Current
Shutdown mode, lux = 0
1
mA
Operating Voltage
-5%
3.5
+5%
V
15
mA
Dynamic Current
Clock enabled, lux = 0
2
Peak Current
Clock enabled, lux = 0
65
mA
Standby Current
Shutdown mode, lux = 0
2
mA
1. All parameters are characterized for DC conditions after thermal equilibrium is established.
2. The peak currents were measured without the load capacitor from the LDO (Low Dropout Regulator). The 100 nF capacitor bank was
connected to the pin in question.
3. This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields. However, it is
recommended that normal precautions be taken to avoid application of any voltages higher than the maximum rated voltages to this
high−impedance circuit.
4. The VRES_AB and VPRECH power supply should be designed to have a sourcing and sinking current capability for frame rates of
the order of 20k frames /sec.
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NOIL2SM1300A
Table 4. POWER SUPPLY RATINGS (Notes 1, 2 and 3)
Boldface limits apply for TJ = TMIN to TMAX, all other limits TJ = +30°C. Clock = 315 MHz
Symbol
VRES_AB
(Note 4)
VRES_DS
VRES_TS
VMEM_L
VMEM_H
VPRECH
(Note 4)
Power Supply
Antiblooming
Supply
Reset Dual
Slope Supply
Reset Triple
Slope Supply
Memory Element
low level supply
Memory Element
high level supply
Pre_charge
Driver Supply
Parameter
Condition
Operating Voltage
Min
Typ
Max
Units
-10%
0.7
+10%
V
Dynamic Current
Clock enabled, lux = 0
1
mA
Peak Current following
edge reset
Clock enabled, lux = 0
50
mA
Standby Current
Shutdown mode, lux = 0
1
mA
Operating Voltage
1.8
2.5
3.675
V
3
mA
Dynamic Current
Clock enabled, lux = 0
0.4
Peak Current
Clock enabled, lux = 0
36
Operating Voltage
mA
2.2
3.675
V
Dynamic Current
Clock enabled, lux = 0
0.3
2
mA
Peak Current
Clock enabled, lux = 0
14
1.8
Operating Voltage
-5%
2.5
+5%
V
1
mA
Dynamic Current
Clock enabled, lux = 0
0.2
Peak Current during FOT
Clock enabled, lux = 0
62
Peak Current during FOT
Clock enabled, bright
Operating Voltage
mA
mA
30
-5%
mA
3.3
+5%
V
Dynamic Current
Clock enabled, lux = 0
1
mA
Peak Current during FOT
Clock enabled, lux = 0
45
mA
Operating Voltage
-10%
0.7
+10%
V
3
mA
Dynamic Current
Clock enabled, lux = 0
0.3
Peak Current during FOT
Clock enabled, lux = 0
32
mA
Peak Current during FOT
Clock enabled, lux = bright
25
mA
1. All parameters are characterized for DC conditions after thermal equilibrium is established.
2. The peak currents were measured without the load capacitor from the LDO (Low Dropout Regulator). The 100 nF capacitor bank was
connected to the pin in question.
3. This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields. However, it is
recommended that normal precautions be taken to avoid application of any voltages higher than the maximum rated voltages to this
high−impedance circuit.
4. The VRES_AB and VPRECH power supply should be designed to have a sourcing and sinking current capability for frame rates of
the order of 20k frames /sec.
than the maximum rated voltages in this high impedance
circuit. Unused inputs must always be tied to an appropriate
logic level, for example, VDD or GND. All cap_xxx pins
must be connected to ground through a 100 nF capacitor.
The recommended combinations of supplies are:
• Analog group of +2.5 V supply: VSAMPLE, VRES_DS,
VMEM_L, VADC, Vpix, VANA, VBUF
• Digital Group of +2.5 V supply: VDIG, VLVDS
• Combine VPRECH and VRES_AB to one supply (Note 4)
Every module in the image sensor has its own power
supply and ground. The grounds can be combined
externally, but not all power supply inputs may be combined.
Some power supplies must be isolated to reduce electrical
crosstalk and improve shielding, dynamic range, and output
swing. Internal to the image sensor, the ground lines of each
module are kept separate to improve shielding and electrical
crosstalk between them.
The LUPA1300-2 contains circuitry to protect the inputs
against damage due to high static voltages or electric fields.
However, take normal precautions to avoid voltages higher
Table 5. POWER DISSIPATION (Note 1)
Power supply specifications according to Table 4.
Symbol
Parameter
Condition
Typ
Units
PowerSTDBY
Standby Power
Blocks in standby with SPI upload
400
mW
Power
Average Power Dissipation
lux = 0, clock = 315 MHz, 500 fps
1350
mW
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NOIL2SM1300A
Table 6. AC ELECTRICAL CHARACTERISTICS (Note 1)
The following specifications apply for VDD = 2.5 V, Clock = 315 MHz, 500 fps.
Parameter
Symbol
Condition
FCLK
Input Clock Frequency
fps = 500
DCCLK
Clock Duty Cycle
At maximum clock
DCD
Duty Cycle Distortion
At maximum clock
Jitter
peak-to-peak
Frame Rate
Maximum clock speed
fps
Typ
Max
Units
315
MHz
50
%
250
50
ps
ps
500
fps
NOTE: Duty Cycle Distortion and Jitter is passed directly from input to output. Therefore, DCD and Jitter tolerance depends on the
customer’s system clock generation circuitry.
OVERVIEW
receive high speed and wide bandwidth data signals and
maintain low noise and distortion. A special training mode
enables the receiving system to synchronize the incoming
data stream when switching to master, slave, or triggered
mode. The image sensor also integrates a programmable
offset and gain amplifier for each channel.
A 10-bit ADC converts the analog signal to a 10-bit digital
word stream. The sensor uses a 3-wire Serial Peripheral
Interface (SPI). It requires only one master clock for
operation up to 500 fps.
The sensor is available in a monochrome version or Bayer
(RGB) patterned color filter array. It is placed in a 168-pin
ceramic mPGA package.
Figure 2 depicts the photovoltaic response of the
LUPA1300−2. Figure 3 shows the spectral response for the
mono and color versions of LUPA1300-2.
This data sheet describes the interface of the LUPA1300-2
image sensor. The SXGA resolution CMOS active pixel
sensor features synchronous shutter and a maximal frame
rate of 500 fps in full resolution. The readout speed is
boosted by sub sampling and the windowed region of
interest (ROI) readout. FPN correction cannot be used in
conjunction with sub-sampling and windowed region of
interest readout for windows starting with non zero kernel
address. High dynamic range scenes can be captured using
the double and multiple slope functionality. User
programmable row and column start and stop positions
enables windowing. Sub sampling reduces resolution while
maintaining the constant field of view and an increased
frame rate.
The LUPA1300-2 sensor has 12 LVDS high speed outputs
that transfer image data over longer distances. This
simplifies the surrounding system. The LVDS interface can
Photovoltaic Response Curve
Figure 3. Photovoltaic Response of LUPA1300−2
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NOIL2SM1300A
Spectral Response Curve
0.35
Spectral Response A/W
0.3
0.25
R
0.2
G1
G2
0.15
B
M
0.1
0.05
0
400
500
600
700
800
900
1000
Wavel ength (nm )
Figure 4. Spectral Response of LUPA1300−2 Mono and Color
y_readout direction
Color Filter Array
The color version of LUPA1300-2 is available in Bayer (RGB) patterned color filter array. The orientation of RGB is shown
in Figure 4.
G
R
(0,1) (1,1)
Top View
LUPA 1300−2
Pixel Array
x_readout direction
G
B
(0,0) (1,0)
Figure 5. RGB Bayer
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NOIL2SM1300A
SENSOR ARCHITECTURE
Image Sensor Core
This architecture enables programmable addressing in the
x-direction in steps of 24 pixels, and in the y-direction in
steps of one pixel. The starting point of the address can be
uploaded by the SPI.
The AFE prepares the signal for the digital data block
when the data is multiplexed and prepared for the LVDS
interface.
Pixel Array
(1280x1024)
Clk X & Clk Y
SPI
Sequencer & Logic
The floor plan of the architecture is shown in Figure 5. The
sensor consists of a pixel array, analog front end, data block,
and LVDS transmitters and receivers. Separate modules for
the SPI, clock division, and sequencer are also integrated.
The image sensor of 1280 x 1024 active pixels is read out in
progressive scan.
28 Analog Channels, 31.5 Msps
Analog Front End (AFE)
31.5 Mhz
24 x 10−bit Digital Channels, 31.5 Msps
Clock
Divider
Local registers
Data Formatting
63 Mhz
12 x 10−bit Digital Channels, 63 Msps
Clk_out
Clk_in
315 Mhz
LVDS Interface Tx and Rx
12 x LVDS Outputs at 630 Msps
Figure 6. Floor Plan of the Sensor
The 6T Pixel
To obtain the global shutter feature combined with a high
sensitivity and good parasitic light sensitivity (PLS),
implement the pixel architecture shown in Figure 6. This
pixel architecture is designed with a 14 mm x 14 mm pixel
pitch to meet the specifications listed in Table 1 and Table 2
on page 3. This architecture also enables pipelined or
triggered mode.
Vpix
Vmem
Sample
Reset
Figure 7. 6T Pixel Architecture
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Select
NOIL2SM1300A
Analog Front End
Analog to Digital Converter
The sensor has 24 10-bit pipelined ADCs on board. The
ADCs nominally operate at 31.5 Msamples/s.
Programmable Gain Amplifiers
The PGAs amplify the signal before sending it to the
ADCs.
The amplification inside the PGA is controlled by one SPI
setting: afemode [5:3].
Six gain steps can be selected by the afemode<5:3>
register.
Table 7 lists the six gain settings. The unity gain selection
of the PGA is done by the default afemode<5:3> setting.
Table 8. ADC PARAMETERS
Parameter
Table 7. GAIN SETTINGS
afemode<5:3>
Gain
000
1
001
1.5
010
2
011
2.25
100
3
101
4
Specification
Data rate
31.5 Msamples/s
Quantization
10 bit
DNL
Typ. < 1 DN
INL
Typ. < 1 DN
Data Block
The data block is positioned in between the analog front
end (output stage + ADCs) and the LVDS interface. It muxes
the outputs of two ADCs to one LVDS block and performs
some minor data handling:
• CRC calculation and insertion
• Training and test pattern generation
It also contains a huge part of the functionality for black
level calibration and FPN correction.
A number of data blocks are placed in parallel to serve all
data output channels. One additional channel generates the
synchronization protocol. A high level overview is
illustrated in the following figure.
Figure 8. Data Block
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NOIL2SM1300A
LVDS Block
A number of LVDS transmitter blocks are placed in
parallel to serve all data, clock, and synchronization output
channels. A high level overview is illustrated in the
following figure.
Serializer
LVDS
Transmitter
clock
Se rialize r<0 >
LVDS
Transmitter
<0>
…Serializer <11>
Serializer <1>
LVDS
Transmitter
<1>
cloc kge nerato r
LVDS
Transmitter
<11>
Se rializer
LVDS
Transmitter
Synch
LVDS
Receiver
LVDS
The LVDS block is positioned below the data block. It
receives a differential clock signal, transmits differential
data over the 12 data channels, and transmits a LVDS clock
signal and a synchronization signal over the clock and
synchronization channel.
Figure 9. LVDS Block − High Level Overview
The function of this block is to take 10 bits of the protocol
block, serialize these bits, and converts them to an LVDS
standard (TIA/EIA 644A) compatible differential output
signal. The block must also provide a clock to the host, to
allow data recovery. This clock is an on-chip version of the
clock coming from the host.
Sequencer and Logic
The sequencer generates the complete internal timing of
the pixel array and the readout. The timing can be controlled
by the user through the SPI register settings. The sequencer
operates on the same clock as the data block. This is a
division by 10 of the input clock (internally divided).
Table 9 lists the internal registers. These registers are
discussed in detail in Detailed Description of Internal
Registers on page 15.
Table 9. INTERNAL REGISTERS
Block
MBS
(reserved)
LVDS clk
divider
AFE
Register Name
Address [6..0]
Field
Reset Value
Description
Fix1
0
[7:0]
0x00
Reserved, fixed value
Fix2
1
[7:0]
0xFF
Reserved, fixed value
Fix3
2
[7:0]
0x00
Reserved, fixed value
Fix4
3
[7:0]
0x00
Reserved, fixed value
Fix5
4
[7:0]
0x08
Reserved, fixed value
lvdsmain
5
[3:0]
‘0110’
lvds trim
[7:4]
0
clkadc phase
lvdspwd1
6
[7:0]
0x00
Power down channel 7:0
lvdspwd2
7
[5:0]
0
Power down channel 13:8
[6]
0
Power down all channels
[7]
0
lvds test mode
Fix6
8
[7:0]
0x00
Reserved, fixed value
afebias
9
[3:0]
‘1000’
afe current biasing
afemode
10
[2:0]
‘111’
vrefp, vrefm settings
[5:3]
‘000’
Pga settings
0
Power down AFE
0x00
Power down adc_channel_2x 7 to 0
[6]
afepwd1
11
[7:0]
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NOIL2SM1300A
Table 9. INTERNAL REGISTERS
Address [6..0]
Field
Reset Value
AFE
Block
afepwd2
Register Name
12
[3:0]
0x00
Power down adc_channel_2x 11 to 8
Bias block
bandgap
13
[0]
‘0’
Power down bandgap and currents
[1]
‘1’
External resistor
[2]
‘0’
External voltage reference
‘000’
Bandgap trimming
[0]
0
Power down
[1]
‘1’
Enable vrefcol regulator
[2]
‘1’
Enable precharge regulator
[3]
0
Disable internal bias for vprech
[4]
‘1’
Disable column load
[5]
‘0’
clkmain invert
[5:3]
Image
Core
imcmodes
Fix7
15
[7:0]
0x00
Reserved, fixed value
Fix8
16
[7:0]
0x00
Reserved, fixed value
imcbias1
17
[3:0]
‘1000’
Bias colfpn DAC buffer
[7:4]
‘1000’
Bias precharge regulator
[3:0]
‘1000’
Bias pixel precharge level
[7:4]
‘1000’
Bias column ota
[3:0]
‘1000’
Bias column unip fast
[7:4]
‘1000’
Bias column unip slow
[3:0]
‘1000’
Bias column load
[7:4]
‘1000’
Bias column precharge
imcbias2
Data Block
14
Description
18
imcbias3
19
Imcbias4
20
Fix9
21
[7:0]
0x20
Reserved, fixed value
Fix10
22
[7:0]
0xC0
Reserved, fixed value
dataconfig1
23
[1:0]
0x00
Reserved, fixed value
[2]
1
‘1’: Enables user upload of dacvrefadc register value
‘0’: Keeps default value
[3]
0
Enable PRBS generation
[4]
0
Reserved, fixed value
[5]
0
Reserved, fixed value
[7:6]
0x03
Training pattern inserted to sync LVDS receivers
dataconfig2
24
[7:0]
0x2A
Training pattern inserted to sync LVDS receivers
Fix11
25
[7:0]
0
Reserved, fixed value
dacvrefadc
26
[7:0]
0x84
Input to DAC to set the offset at the input of the ADC
Fix12
27
[7:0]
0x80
Reserved, fixed value
Fix13
28
[7:0]
Reserved, fixed value
Fix14
29
[7:0]
Reserved, fixed value
datachannel0_1
30
[0]
0
Bypass the data block
[1]
0
Enables the FPN correction
[2]
0
Overwrite incoming ADC data by the data in the testpat
register
[3]
0
Reserved, fixed value
0x00
Pattern inserted to generate a test image
[5:4]
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Table 9. INTERNAL REGISTERS
Block
Register Name
Address [6..0]
Field
Reset Value
Data Block
datachannel0_2
31
[7:0]
0x00
Pattern inserted to generate a test image
datachannel1_1
32
[0]
0
Bypass the data block
[1]
0
Enables the FPN correction
[2]
0
Overwrite incoming ADC data by the data in the testpat
register
[3]
0
Reserved, fixed value
[5:4]
0x00
Pattern inserted to generate a test image
0x00
Pattern inserted to generate a test image
Sequencer
Description
datachannel1_2
33
[7:0]
datachannel12_1
54
[0]
0
Bypass the data block
[1]
0
Enables the FPN correction
[2]
0
Overwrite incoming ADC data by the data in the testpat
register
[3]
0
Reserved, fixed value
[5:4]
0x00
Pattern inserted to generate a test image
0x00
Pattern inserted to generate a test image
datachannel12_2
55
[7:0]
seqmode1
56
[0]
1
Enables sequencer for image capture
[1]
1
‘1’: Master mode, integration timing is generated on-chip
‘0’: Slave mode, integration timing is controlled off-chip
through INT_TIME1, INT_TIME2 and INT_TIME3 pins
[2]
0
‘0’: Pipelined mode
‘1’: Triggered mode
[3]
0
Enables(‘1’)/disables(‘0’) subsampling
[4]
0
‘1’: Color subsampling scheme: 1:1:0:0:1:1:0:0
‘0’: B&W subsampling scheme: 1:0:1:0:1
[5]
0
Enable dual slope
[6]
0
Enable triple slope
[7]
0
Enables continued row select (that is, assert row select
during pixel read out)
[4:0]
‘10000’
Must be overwritten with ‘10001’ to this register after
startup, before readout.
[6:5]
‘00’
Number of active windows:
“00”: 1 window
“01”: 2 windows
“10”: 3 windows
“11”: 4 windows
[0]
‘1’
Enables the generation of the CRC10 on the data and sync
channels
[1]
‘0’
Enable readout black/grey columns
[2]
‘0’
Enable column fpn calibration/enable readout dummy line
“001”
Number of frames in nondestructive read out:
“000”: invalid
“001”: one reset, one sample (default mode)
“010”: one reset, two samples
…
seqmode2
seqmode3
57
58
[5:3]
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Table 9. INTERNAL REGISTERS
Block
Register Name
Address [6..0]
Sequencer
seqmode4
59
Field
Reset Value
Description
[6]
0
Controls the granularity of the timer settings (only for those
that have ‘granularity selectable’ in the description):
‘0’: Expressed in number of lines
‘1’: Expressed in clock cycles (multiplied by
2**seqmode4[3:0])
[7]
0
Allows delaying the syncing of events that happen outside
of ROT to the next ROT. This avoids image artefacts.
[3:0]
0x00
Multiplier factor (=2**seqmode4[3:0]) for the timers when
working in clock cycle mode
[5:4]
0x0
Selects the source signals to put on the digital test pins
(monitor pins):
“00”: integration time settings
“01”: EOS signals
“10”: frame sync signals
“11”: functional test mode
[6]
‘0’
Reverse read out in X direction
[7]
‘0’
Reverse read out in Y direction
window1_1
60
[7:0]
0x00
Y start address for window 1
window1_2
61
[1:0]
0x00
Y start address for window 1
[7:2]
0x00
X start address for window 1
window1_3
62
[7:0]
0xFF
Y end address for window 1
window1_4
63
[1:0]
0x3
Y end address for window 1
[7:2]
0x36
X width for window 1
window2_1
64
[7:0]
0x00
Y start address for window 2
window2_2
65
[1:0]
0x00
Y start address for window 2
[7:2]
0x00
X start address for window 2
window2_3
66
[7:0]
0xFF
Y end address for window 2
window2_4
67
[1:0]
0x3
Y end address for window 2
[7:2]
0x36
X width for window 2
window3_1
68
[7:0]
0x00
Y start address for window 3
window3_2
69
[1:0]
0x00
Y start address for window 3
[7:2]
0x00
X start address for window 3
window3_3
70
[7:0]
0xFF
Y end address for window 3
window3_4
71
[1:0]
0x3
Y end address for window 3
[7:2]
0x36
X width for window 3
window4_1
72
[7:0]
0x00
Y start address for window 4
window4_2
73
[1:0]
0x00
Y start address for window 4
[7:2]
0x00
X start address for window 4
window4_3
74
[7:0]
0xFF
Y end address for window 4
window4_4
75
[1:0]
0x3
Y end address for window 4
[7:2]
0x36
X width for window 4
res_length1
76
[7:0]
0x02
Length of pix_rst (granularity selectable)
res_length2
77
[7:0]
0x00
Length of pix_rst (granularity selectable)
res_dsts_length
78
[7:0]
0x01
Length of resetds and resetts (granularity selectable)
tint_timer1
79
[7:0]
0xFF
Length of integration time (granularity selectable)
tint_timer2
80
[7:0]
0x03
Length of integration time (granularity selectable)
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Table 9. INTERNAL REGISTERS
Block
Address [6..0]
Field
Reset Value
tint_ds_timer1
Register Name
81
[7:0]
0x40
Length of DS integration time (granularity selectable)
Description
tint_ds_timer2
82
[1:0]
0x00
Length of DS integration time (granularity selectable)
tint_ts_timer1
83
[7:0]
0x0C
Length of TS integration time (granularity selectable)
tint_ts_timer2
84
[1:0]
0x00
Length of TS integration time (granularity selectable)
tint_black_timer
85
[7:0]
0x06
Reserved, fixed value
rot_timer
86
[7:0]
0x09
Length of ROT (granularity clock cycles)
fot_timer
87
[7:0]
0x3B
Length of FOT (granularity clock cycles)
fot_timer
88
[1:0]
0x01
Length of FOT (granularity clock cycles)
prechpix_timer
89
[7:0]
0x7C
Length of pixel precharge (granularity clock cycles)
prechpix_timer
90
[1:0]
0x00
Length of pixel precharge (granularity clock cycles)
prechcol_timer
91
[7:0]
0x03
Length of column precharge (granularity clock cycles)
rowselect_timer
92
[7:0]
0x06
Length of rowselect (granularity clock cycles)
sample_timer
93
[7:0]
0xF8
Length of pixel_sample (granularity clock cycles)
sample_timer
94
[1:0]
0x00
Length of pixel_sample (granularity clock cycles)
vmem_timer
95
[7:0]
0x10
Length of pixel_vmem (granularity clock cycles)
vmem_timer
96
[1:0]
0x01
Length of pixel_vmem (granularity clock cycles)
delayed_rdt_timer
97
[7:0]
0
Readout delay for testing purposes (granularity selectable)
delayed_rdt_timer
98
[7:0]
0
Readout delay for testing purposes (granularity selectable)
Fix29
99
[0]
0
Reserved, fixed value
Fix30
100
[0]
0
Reserved, fixed value
Fix31
101
[0]
0
Reserved, fixed value
Fix32
102
[0]
0
Reserved, fixed value
Fix33
103
[0]
0
Reserved, fixed value
Fix34
104
[0]
0
Reserved, fixed value
Detailed Description of Internal Registers
The registers must be changed only during idle mode, that
is, when seqmode1[0] is ‘0’. Uploaded registers have an
immediate effect on how the frame is read out. Parameters
uploaded during readout may have an undesired effect on the
data coming out of the images.
AFE Block
MBS Block
Biasing Block
This register block contains registers to shut down ADC
channels or the complete AFE block. This block also
contains the register for setting the PGA gain:
AFE_mode[5:3]. Refer to Absolute Maximum Ratings on
page 3 for more details on the PGA settings.
The register block contains registers for sensor testing and
debugging. All registers in this block must remain
unchanged after startup.
This block contains several registers for setting biasing
currents for the sensor. Default values after startup must
remain unchanged for normal operation of the sensor.
LVDS Clock Divider Block
Image Core Block
The registers in this block have an impact on the pixel
array itself. Default settings after startup must remain
unchanged for normal operation of the image sensor.
This block controls division of the input clock for the
LVDS transmitters or receivers. This block also enables
shutting down one or all LVDS channels. For normal
operation, this register block must remain untouched after
startup.
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Data Block
Seqmode2[4:0]: Default value after startup is ’10000’, but
this must be overwritten with the new value ’10001’
immediately after startup.
Seqmode3[6:5]: These two bits set the number of active
windows:
‘00’: 1 window
‘01’: 2 windows
‘10’: 3 windows
‘11’: 4 windows (max)
Seqmode3. The seqmode3 register consists of the
following subregisters:
Seqmode3[0]: This bit enables or disables the CRC10
generation on the data and sync channels
Seqmode3[1]: Not applicable
Seqmode3[2]: Enables or disables column FPN
correction
Seqmode3[5:3]: Enables or disables, and sets the number
of frames grabbed in nondestructive readout mode.
‘000’: Invalid
‘001’: Default, 1 reset, 1 sample
‘010’: 1reset, 2 samples
‘011’: 1 reset, 3 samples
Seqmode3[6]: Controls the granularity of the timer
settings (only for those that have ‘granularity selectable’ in
the description). As a result, all timer settings are set either
in number of applied clock cycles, or in the number of
‘readout lines’.
‘0’: expressed in number of lines
‘1’: expressed in clock cycles (multiplied by
2**seqmode4 [3:0])
Seqmode3[7]: Allows syncing of events that happen
outside of ROT to be delayed to the next ROT to avoid image
artifacts.
Seqmode4. This register consists of four subregisters:
Seqmode4[3:0]: Multiplier factor (2**seqmode4[3:0])
for the timers when working in clock cycle mode.
Seqmode4[5:4]: Selects the source signals to be put on the
digital test pins (monitor1, monitor2, and monitor3 pins)
“00”: integration time settings
“01”: EOS signals
“10”: frame sync signals
“11”: functional test mode
Seqmode4[6]: Enables (1) and disables (0) reverse X read
out.
Seqmode4[7]: Enables (1) and disables (0) reverse Y read
out.
Y1_start (60 and 61, 10 bit). These registers set the Y
start address for window 1 (default window).
X1_start (61, 6bit). This register sets the X start address
for window 1 (default window).
Y1_end (62 and 63, 10 bit). These registers set the Y end
address for window 1 (default window).
X1_kernels (63, 6 bit). This register sets the number of
kernels or X width to be read out for window 1 (default
window).
The data block is positioned in between the analog front
end (output stage + ADCs) and the LVDS interface. It muxes
the outputs of 2 ADCs to one LVDS block and performs
some minor data handling:
• CRC calculation and insertion.
All data can be protected by a 10-bit checksum. The
CRC10 is calculated over all pixels between a Line
Start and a Line End. It is inserted in the data stream
after the line is completed, if input seq_data_crc is
enabled.The polynomial used is
(x^10+x^9+x^6+x^3+x^2+x+1) and 10 bits are
calculated in parallel. When a new line is started, the
seed is the first pixel value of a line. No CRC is
calculated for that value. From then on, every incoming
pixel is updated through the regular CRC.
• Training and test pattern generation
The most important registers in this block are:
Dataconfig. The dataconfig1[7:6] and dataconfig2[7:0]
registers insert a training pattern in the LVDS channels to
sync the LVDS receivers.
Datachannels. DatachannelX_1 and DatachannelX_2
(with X=0 to 12) are registers that allow you to enable or
disable the FPN correction (DatachannelX_1[1]), and
generate a test pattern if necessary (datachannelX_1[5:4]
and datachannelX_2[7:0]).
Sequencer Block
The sequencer block group registers allow enabling or
disabling image sensor features that are driven by the
onboard sequencer. This block consists of the following
registers:
Seqmode1. The seqmode1 registers have the following
subregisters:
Seqmode1[0]: Enables sequencer for image capture, must
be ‘1’ during image acquisition.
Seqmode1[1]: This subregister has two modes:
‘1’: In this default mode the integration timing is
generated on-chip.
‘0’: In this slave mode, the integration timing must be
generated through the int_time1, int_time2, and int_time3
pins.
Seqmode1[2]: This bit enables pipelined (0) or triggered
(1) mode.
Seqmode1[3]: Enable (1) or disable (0) subsampling.
Seqmode1[4]: This bit sets the type of subsampling
scheme used when subsampling is enabled.
‘1’: Color (1:1:0:0:1:1:0:0:1…)
‘0’: Black and White (1:0:1:0:1)
Seqmode1[5]: This bit enables or disables the dual slope
integration.
Seqmode1[6]: This bit enables or disables the triple slope
integration.
Seqmode2. The seqmode2 register consists of only two
subregisters:
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Tint_ts_timer (83 and 84). This register sets the length
of the triple slope integration time. This value is expressed
in ’number of lines’ or in clock cycles (depends on
seqmode3[6]).
Y2_start (64 and 65, 10 bit). These registers set the Y
start address for window 2 (if enabled).
X2_start (65, 6bit). This register sets the X start address
for window 2 (if enabled).
Y2_end (66 and 67, 10 bit). These registers set the Y end
address for window 2 (if enabled).
X2_kernels (67, 6 bit). This register sets the number of
kernels or X width to be read out for window 2 (if enabled).
Y3_start (68 and 69, 10 bit). These registers set the Y
start address for window 3 (if enabled).
X3_start (69, 6bit). This register sets the X start address
for window 3 (if enabled).
Y3_end (70 and 71, 10 bit). These registers set the Y end
address for window 3 (if enabled).
X3_kernels (71, 6 bit). This register sets the number of
kernels or X width to be read out for window 3 (if enabled).
Y4_start (72 and 73, 10 bit). These registers set the Y
start address for window 4 (if enabled).
X4_start (73, 6bit). This register sets the X start address
for window 4 (if enabled).
Y4_end (74 and 75, 10 bit). These registers set the Y end
address for window 4 (if enabled).
X4_kernels (75, 6 bit). This register sets the number of
kernels or X width to be read out for window 4 (if enabled).
Res_length (76 and 77). This register sets the length of
the internal pixel array reset (how long are all pixel reset
simultaneously). This value is expressed in ’number of
lines’ or in clock cycles (depends on seqmode3[6]).
Res_dsts_length. This register sets the length of the
internal dual and triple slope reset pulses when enabled. This
value is expressed in ’number of lines’ or in clock cycles
(depends on seqmode3[6]).
Tint_timer (79 and 80). This register sets the length of
the integration time. This value is expressed in ’number of
lines’ or in clock cycles (depends on seqmode3[6]).
Tint_ds_timer (81 and 82). This register sets the length
of the dual slope integration time. This value is expressed in
’number of lines’ or in clock cycles (depends on
seqmode3[6]).
Serial Peripheral Interface (SPI)
The serial 4-wire interface (or SPI) uses a serial input or
output to shift the data in or out the register buffer. The chip’s
configuration registers are accessed from the outside world
through the SPI protocol. A 4-wire bus runs over the chip
and connects the SPI I/Os with the internal register blocks.
To upload the sensor, follow this sequence:
Disable Sequencer ® Upload Sensor for new setting ®
Enable Sequencer
When sequencer is disabled, the training pattern appears
on all the channels, including the sync. The interface
consists of:
• cs_n: chip select, when LOW the chip is selected
• clk: the spi clock
• in: Master out, Slave in, the serial input of the register
• out: Master in, Slave out, the serial output of the
register
SPI Protocol
The information on the data ‘in’ line is:
• A command bit C, indicating a write (‘1’) or a read
(‘0’) access
• 7-bit address
• 8-bit data word (in case of a write access)
The data ’out’ line is generally in High Z mode, except
when a read request is performed.
Data is always written on the bus on the falling edge of the
clock, and sampled on the rising edge, as seen in Figure 9 and
Figure 10. This is valid for both the ’in’ and ’out’ bus. The
system clock must be active to keep the SPI uploads stored
on the chip. The SPI clock speed must be slower by a factor
of 30 when compared to the system clock (315 MHz nominal
speed).
Figure 10. Write Access (C = ‘1’)
The ‘out’ line is held to High Z. The data for the address
A is transferred from the shift register to the active register
bank (that is, sampled) on a rising edge of cs_n. Only the
register block with address A can write its data on the ‘out’
bus. The data on ‘in’ is ignored.
Figure 11. Read Access (C = ‘0’)
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IMAGE SENSOR TIMING AND READOUT
Frame Rate and Windowing
Frame Rate
The frame rate depends on the input clock, the frame overhead time (FOT), and the row overhead time (ROT). The frame
period is calculated as follows:
1 kernel = 24 Pixels = 2 Timeslots = 2 Granularity clock cycles
Table 10. FRAME RATE PARAMETERS
Parameter
Comment
Clarification
FOT
Frame Overhead Time
Programmable: Default 315 granularity clock cycles (5 ms at 63 MHz)
ROT
Row Overhead Time
Programmable: Default 9 granularity clock cycles (143.1 ns at 63 MHz)
Nr. Lines
Number of lines read out each frame
Number of lines in ROI
Nr. Pixels
Number of pixels read out each line
Number of pixels in ROI
Clock Period
1/63 MHz = 15.9 ns
Every channel works at 63 MHz ³12 channels result in 756 MHz data rate
NOTE: For more information on FPS calculation, refer the ON Semiconductor application note AN57864.
In global shutter mode, the whole pixel array is integrated simultaneously including the dummy line for FPN correction.
Figure 12. Timing Diagram
Windowing
Windowing is easily achieved by SPI. The starting point
of the x and y address and the window size can be uploaded.
The minimum step size in the x-direction is 24 pixels
(choose only multiples of 24 as start or stop addresses). The
minimum step size in the y-direction is one line (every line
can be addressed) in normal mode, and two lines in sub
sampling mode.
The section Sequencer and Logic on page 11 discusses the
use of registers to achieve the desired ROI.
Table 11. TYPICAL FRAME RATES AT 315 MHz
Image
Resolution (X*Y)
Frame Read
Out Time (ms)
Frame Rate (fps)
1296 x 1024
1.9760
506
1008 x 1000
1.5807
633
816 x 600
0.7997
1250
648 x 480
0.5370
1862
528 x 512
0.4887
2046
264 x 256
0.1596
6266
144 x 128
0.0640
15625
24 x 2
0.0098
102249
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Operation and Signaling
Digital Signals
Depending on the operation mode (Master or Slave), the pixel array of the image sensor requires different digital control
signals. The function of each signal is listed in this table.
Table 12. OVERVIEW OF DIGITAL SIGNALS
Signal Name
I/O
Comments
MONITOR_1
Output
Output pin for integration timing, high during integration
MONITOR_2
Output
Output pin for dual slope integration timing, high during integration
MONITOR_3
Output
Output pin for triple slope integration timing, high during integration
INT_TIME_3
Input
Integration pin triple slope
INT_TIME_2
Input
Integration pin dual slope
INT_TIME_1
Input
Integration pin first slope
RESET_N
Input
Sequencer reset, active LOW
CLK
Input
System clock (315 MHz)
SPI_CS
Input
SPI chip select
SPI_CLK
Input
Clock of the SPI (< Sensor clock/30)
SPI_IN
Input
Data line of the SPI, serial input
SPI_OUT
Output
Data line of the SPI, serial output
Global Shutter
and after the integration time, all pixel values are sampled
together on the storage node inside each pixel. The pixel
core is read out line by line after integration. Note that the
integration and readout cycle can occur in parallel (refer to
Pipelined Shutter on page 20) or in sequential (refer to
Triggered Shutter on page 22) mode.
In a global shutter, light integration occurs on all pixels in
parallel, although subsequent readout is sequential.
Figure 12 shows the integration and readout sequence for
the global shutter. All pixels are light sensitive at the same
period of time. The whole pixel core is reset simultaneously,
COMMON SA MP LE &HOLD
Flash could occur here
CO MMON RESE T
Line number
Time axis
Integration Time
B urs t Re ad out
Figure 13. Global Shutter Operation
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the pixels are selected in groups of 24 (12 on rising edge, and
12 on the falling edge of the internal clock). So in total, 54
kernels of 24 pixels are read out every line. The internal
timing is generated by the sequencer. The sequencer can
operate in two modes: master mode and slave mode. In
master mode, all internal timing is controlled by the
sequencer, based on the SPI settings. In slave mode, the
integration timing is directly controlled by over three pins,
and the readout timing is still controlled by the sequencer.
The seqmode1[1] register of the SPI selects between the
master and slave modes.
The timing of the sensor consists of two parts. The first
part is related to the exposure time and the control of the
pixel. The second part is related to the read out of the image
sensor. Integration and readout are in parallel or triggered.
In the first case, the integration time of frame I is ongoing
during the readout of frame I-1. Figure 13 shows this parallel
timing structure.
The readout of every frame starts with a FOT, during
which the analog value on the pixel diode is transferred to
the pixel memory element. After this FOT, the sensor is read
out line by line. The read out of every line starts with a ROT,
during which the pixel value is put on the column lines. Then
Integration Time
Handling
Readout
Handling
Reset
N
FOT
ROT
Ex p os u re Time N
FO T
Readout Frame N−1
FO T
Reset
N+1
Exposure Time N+1
Readout Frame N
FOT
FOT
ÉÉÉ
ÉÉÉ
ÉÉÉÉÉ
ÉÉÉÉ
ÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉ
ÉÉÉÉÉ
ÉÉÉÉ
ÉÉÉ
ÉÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉÉÉ
ÉÉÉÉ
ÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉ
ÉÉÉÉÉ
ÉÉÉÉ
ÉÉÉ
ÉÉÉÉ
Line Readout
Figure 14. Global Readout Timing (Parallel)
Pipelined Shutter
with a ROT, during which the pixel value is put on the
column lines. Then the pixels are mixed in the correct ADCs,
processed, and then sent to the LVDS output block.
You have two options in the pipelined shutter mode. The
first option is to program the reset and integration through
the configuration interface and let the sequencer handle
integration time automatically. This mode is called master
mode. The second option is to drive the integration time
through an external pin. This mode is called slave mode.
Integration and readout occur in parallel and are
continuous. You only need to start and stop the batch of
image captures.
Integration of frame N is always ongoing during readout
of frame N-1. The readout of every frame starts with a FOT,
during which the analog value on the pixel diode is
transferred to the pixel memory element. After this FOT, the
sensor is read out line by line. The readout of every line starts
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NOIL2SM1300A
Table 13 lists the user programmable timer settings and
how they are interpreted by the hardware.
Programming the Exposure Time
In master mode, the exposure time is configured in two
distinct methods (controlled by register seqmode3[6]):
• # lines: Obvious, changing signals that control
integration time. They are always changed during ROT
to avoid any image artefacts.
• # clock cycles: Must be multiplied by
(2**seqmode4[3:0]). When the counter expires,
changes are put into effect immediately. Asserting the
configuration signal (seqmode3[7]) forces delaying
signal updates until the next ROT.
Table 13. USER PROGRAMMABLE TIMER SETTINGS
Setting
Granularity
reg_res_length
Lines/cycles
reg_tint_timer
Lines/cycles
reg_tint_ds_timer
Lines/cycles
reg_tint_ts_timer
Lines/cycles
res_dsts_length
Lines/cycles
reg_rot_timer
clock cycles
reg_fot_timer
clock cycles
reg_sel_pre_timer
clock cycles
reg_precharge_timer
clock cycles
reg_sample_timer
clock cycles
reg_vmem_timer
clock cycles
reg_delayed_rdt_timer
Lines/cycles
Note that the seqmode3[7] can also be used to sync the user signals in slave mode. The behavior is exactly the same.
Master Mode
In master mode the reset and exposure time is written in registers.
Figure 15. Integration and Image Readout in Master Mode
Ensure that the added value of the registers res_length and
tint_timer always exceeds the number of lines that are read
out. This is because the sequencer samples a new image after
integration is complete, without checking if image readout
is finished. Enlarging res_length to accommodate for this
has no impact on image capture.
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NOIL2SM1300A
Slave Mode
In slave mode, the register values of res_length and
tint_timer are ignored. The integration time is controlled by
the int_time pin. The relationship between the input pin and
the integration time is shown in Figure 15. When the input
pin int_time is asserted, the pixel array goes out of reset and
exposure can begin. When int_time goes low again and the
desired exposure time is reached, the image is sampled and
read out can begin.
Figure 16. Integration and Image Readout in Slave Mode
Changing pixel’s reset level during line readout might
result in image artefacts during a small transient period. As
a result, it is advised to only change the value of int_time
during ROT.
Triggered Shutter
The two main differences in the pipelined shutter mode
are:
• One single image is read upon every user action.
• Integration (and read out) is under control of the user
through pin int_time.
This means that for every frame, you need to manually
intervene. The pixel array is kept in reset state until you
assert the int_time input. Similar to the pipelined shutter
mode, there is a master mode in which the sequencer can
control the integration time, or a slave mode in which you
can define the integration time.
int_time1
Reset Exposure Time N FOT
Readout
Handling
FOT
Reset
Exposure Time
FOT Reset
N+1
Readout N
FOT Readout
N+1
N+1
ROT
Line
Readout
Figure 17. Integration and Readout for Triggered Shutter
The possible applications for this triggered shutter mode
are:
• Synchronize external flash with exposure
• Apply extremely long integration times (only in slave mode)
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Slave Mode
Integration time control is identical to the pipelined
shutter slave mode. The int_time1 pin controls the start of
integration. When int_time is deasserted, the FOT starts
(analog value on the pixel diode is transferred to the pixel
memory element). Only at that time, image read out can start
(similar to the pipelined read out). During read out, the
image array is kept in reset. A request for a new frame is
started when int_time goes high again.
Master Mode
In this mode, a rising edge on int_time1 pin is used to
trigger the start of integration and read out. The tint_timer
defines the integration time independent of the assertion of
the input pin int_time1. After the integration time counter
runs out, the FOT automatically starts and the image readout
is done. During readout, the image array is kept in reset. A
request for a new frame is started again when a new rising
edge on int_time is detected. The time of the falling edge is
not important in this mode.
Non Destructive Readout (NDR)
time
Figure 18. Principle of Non Destructive Readout
must be used. Essentially, an active pixel array is read
multiple times, and reset only once. The external system
intelligence interprets the data. Table 14 on page 23
summarizes the advantages and disadvantages of
nondestructive readout.
The sensor can also be read out in a nondestructive
method. After a pixel is initially reset, it can be read multiple
times, without being reset. You can record the initial reset
level and all intermediate signals. High light levels saturate
the pixels quickly, but a useful signal is obtained from the
early samples. For low light levels, the later or latest samples
Table 14. ADVANTAGES AND DISADVANTAGES OF NON DESTRUCTIVE READOUT
Advantages
Disadvantages
Low noise, because it is true CDS
System memory required to record the reset level and the
intermediate samples
High sensitivity. The conversion capacitance is kept low.
Requires multiples readings of each pixel, so there is higher data
throughput
High dynamic range. The results include signals for short and long
integration times.
Requires system level digital calculations
When nr_of_ndr_steps is two, there is one reset and two
samples, and so on. In the slave mode, nothing changes on
the protocol of the signals int_time_*. The sequencer
suppresses the internal reset signal to the pixel array.
Note that the amount of samples taken with one initial
reset is programmable in the nr_of_ndr_steps register. If
nr_of_ndr_steps is one, the sensor operates in the default
method, that is one reset and one sample. This is called the
disable nondestructive read out mode.
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Image Format and Read Out Protocol
Pixels are always read in multiples of 24 (one value to
every channel in the AFE). The last time slot contains not
only valid pixels, but also two dummy columns, six grey
columns, and eight black columns.
The active area read out by the sequencer in full frame
mode is shown in Figure 18. Before the actual pixels are read
out, one dummy line is read to enable column FPN
correction. A reference voltage is applied to the columns and
the entire line is read as if real pixel values are placed on the
columns.
Figure 19. Sensor Read Out Format
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The following sections discuss the appearance of the
output (data and synchronization codes) in several relevant
configurations. Twelve output channels are connected to the
24 ADCs and handle the data. One additional channel
contains all the synchronization codes for the receiver. This
indicates, for example, the start of a frame, the end of a
frame, whether the data channels contain data, CRC, a
training pattern, and so on. The sequencer provides the
synchronization channel with the correct synchronization or
protocol signals, as shown in Figure 7. The synchronization
codes are listed in Table 15. Note that a FS also serves as LS,
and vice versa.
Table 15. SYNCHRONIZATION CODES
Abbreviation
10-Bit Code
Frame Start
Sync code
FS
0x059
Line Start
LS
0x056
Frame End
FE
0x05A
Line End
LE
0x055
Grey/Black Cols
GBC
0x0A9
CRC
CRC
0x0A6
FPN stored values
FPN
0x13C
Normal Data
D
0x193
Training Pattern
T
T
This table provides a detailed overview of remapping one full row read out.
Table 16. REMAPPING SCHEME FOR ONE ROW
timeslot
ch0
ch1
ch2
ch3
ch4
ch5
ch6
ch7
ch8
ch9
ch10
ch11
1a
0
2
4
6
8
10
12
14
16
18
20
22
1b
1
3
5
7
9
11
13
15
17
19
21
23
2a
47
45
43
41
39
37
35
33
31
29
27
25
2b
46
44
42
40
38
36
34
32
30
28
26
24
3a
48
50
52
54
56
58
60
62
64
66
68
70
3b
49
51
53
55
57
59
61
63
65
67
69
71
4a
95
93
91
89
87
85
83
81
79
77
75
73
4b
94
92
90
88
86
84
82
80
78
76
74
72
5a
96
98
100
102
104
106
108
110
112
114
116
118
5b
97
99
101
103
105
107
109
111
113
115
117
119
6a
143
141
139
137
135
133
131
129
127
125
123
121
6b
142
140
138
136
134
132
130
128
126
124
122
120
7a
144
146
148
150
152
154
156
158
160
162
164
166
7b
145
147
149
151
153
155
157
159
161
163
165
167
8a
191
189
187
185
183
181
179
177
175
173
171
169
8b
190
188
186
184
182
180
178
176
174
172
170
168
9a
192
194
196
198
200
202
204
206
208
210
212
214
9b
193
195
197
199
201
203
205
207
209
211
213
215
10a
239
237
235
233
231
229
227
225
223
221
219
217
10b
238
236
234
232
230
228
226
224
222
220
218
216
11a
240
242
244
246
248
250
252
254
256
258
260
262
11b
241
243
245
247
249
251
253
255
257
259
261
263
12a
287
285
283
281
279
277
275
273
271
269
267
265
12b
286
284
282
280
278
276
274
272
270
268
266
264
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
53a
1248
1250
1252
1254
1256
1258
1260
1262
1264
1266
1268
1270
53b
1249
1251
1253
1255
1257
1259
1261
1263
1265
1267
1269
1271
54a
1295
1293
1291
1289
1287
1285
1283
1281
1279
1277
1275
1273
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Table 16. REMAPPING SCHEME FOR ONE ROW
timeslot
ch0
ch1
ch2
ch3
ch4
ch5
ch6
ch7
ch8
ch9
ch10
ch11
54b
1294
1292
1290
1288
1286
1284
1282
1280
1278
1276
1274
1272
CRC
Table 17. REMAPPING SCHEME FOR ONE ROW IN REVERSE X/Y READOUT MODE
Timeslot
ch0
ch1
ch2
ch3
ch4
ch5
ch6
ch7
ch8
ch9
ch10
ch11
54a
1295
1293
1291
1289
1287
1285
1283
1281
1279
1277
1275
1273
54b
1294
1292
1290
1288
1286
1284
1282
1280
1278
1276
1274
1272
53a
1248
1250
1252
1254
1256
1258
1260
1262
1264
1266
1268
1270
53b
1249
1251
1253
1255
1257
1259
1261
1263
1265
1267
1269
1271
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
2a
47
45
43
41
39
37
35
33
31
29
27
25
2b
46
44
42
40
38
36
34
32
30
28
26
24
1a
0
2
4
6
8
10
12
14
16
18
20
22
1b
1
3
5
7
9
11
13
15
17
19
21
23
CRC
Table 18. REMAPPING SCHEME FOR ONE ROW IN COLOR SUBSAMPLING MODE
Timeslot
ch0
ch1
ch2
ch3
ch4
ch5
ch6
ch7
ch8
ch9
ch10
ch11
1a
0
45
4
41
8
37
12
33
16
29
20
25
1b
1
44
5
40
9
36
13
32
17
28
21
24
2a
48
93
52
89
56
85
60
81
64
77
68
73
2b
49
92
53
88
57
84
61
80
65
76
69
72
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
27a
1248
1293
1252
1289
1256
1285
1260
1281
1264
1277
1268
1273
27b
1249
1292
1253
1288
1257
1284
1261
1280
1265
1276
1269
1272
CRC
Table 19. REMAPPING SCHEME FOR ONE ROW IN MONOCHROME SUBSAMPLING MODE
Timeslot
ch0
ch1
ch2
ch3
ch4
ch5
ch6
ch7
ch8
ch9
ch10
ch11
1a
0
2
4
6
8
10
12
14
16
18
20
22
1b
46
44
42
40
38
36
34
32
30
28
26
24
2a
48
50
52
54
56
58
60
62
64
66
68
70
2b
94
92
90
88
86
84
82
80
78
76
74
72
3a
96
98
100
102
104
106
108
110
112
114
116
118
3b
142
140
138
136
134
132
130
128
126
124
122
120
4a
144
146
148
150
152
154
156
158
160
162
164
166
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
27a
1248
1250
1252
1254
1256
1258
1260
1262
1264
1266
1268
1270
27b
1294
1292
1290
1288
1286
1284
1282
1280
1278
1276
1274
1272
CRC
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NOIL2SM1300A
Single Window Mode Containing Timeslot 54
In this operation mode, only part of the sensor is read out,
as shown by the shaded area in Figure 19. A clear distinction
is made with the single window mode that does not contain
the timeslot 54, because the output synchronization protocol
is slightly different.
Figure 20. Single Window Containing Timeslot 54
Figure 20 shows the internal state of the sequencer, and the
behavior of the data and sync channels (overview and detail
of one line) for this window mode.
FOT ROT
black
Sequencer internal state
ROT line Ys
ROT Line
Ys+1
ROTline
Ye
Data Channel
Sync Channel
Data Channel
Sync Channel
T
T
T
L D
S
D
D
timeslot timeslot
X
X+1
D D GB LE CR
C
timeslot timeslot CRC
53
54 timeslot
Figure 21. Waveform for Single Window Containing Timeslot 54
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NOIL2SM1300A
Single Window Mode Not Containing Timeslot 54
In this operation mode, only part of the sensor is read out,
as shown in Figure 21. Although the window is defined as
not containing any data from timeslot 54, it is read out to
provide information on grey and black columns to the user.
Figure 22. Single Window Not Containing Timeslot 54
Figure 22 shows the internal state of the sequencer, and the
behavior of the data and sync channels (overview and detail
of one line) for this window mode.
Sequencer
internal state
black
FOT ROT
ROT line Ys
ROT
ROTline
line
Ye
Ys+1
Data Channel
Sync Channel
T
T
T
L
S
D D
D
timeslot timeslot
Xstart
D D
D
L GB GB CR
E
C
T
timeslot timeslot timeslot CRC
Xend-1 Xend
54
timeslot
Figure 23. Waveform for Single Window NOT Containing Timeslot 54
Note that the dummy black line is read completely.
black line again spans the entire width of the sensor and is
processed only once, before all configured windows are
read. The dummy black line is independent of the window
sizes.
Reading out multiple windows does not differ from
combining the windowed modes in sections Single Window
Mode Containing Timeslot 54 on page 27 and Single
Window Mode Not Containing Timeslot 54. The dummy
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ADDITIONAL FEATURES
Windowing
A fully configurable window can be selected for readout.
y start
1024 pixels
y end
xkernel
x start
1280 pixels
Figure 24. Window Selected for Readout
y_end. The end line of the readout window, granularity of
1. In all cases (even in reverse scan), y_end are larger than
y_start. Note that in subsample mode, the correct y_end
position must be uploaded (exact value depends on color or
B/W subsampling mode). This value must be written to the
windowX_3 and windowX_4 register.
In case of windowing, the effective readout time is smaller
than in full frame mode, because only the relevant part of the
image array is accessed. As a result, it is possible to achieve
higher frame rates.
The parameters to configure this window are:
x_start. The sensor reads out 24 pixels in one single clock
cycle. The granularity of configuring the X start position is
also 24. Every value written to the windowX_2 register must
be multiplied by 24 to find the corresponding column in the
pixel array.
x_kernels. The number of columns that is read out
(x_kernels*24 in full frame mode) in subsampling mode
x_kernels*48 represents the number of columns over which
subsampling is done. The x_kernels value must be written
to the windowX_4 register.
y_start. The starting line of the readout window,
granularity of 1. Note that in subsample mode, the correct
y_start position must be uploaded (exact value depends on
color or B/W subsampling mode). This value must be
written to the windowX_1 and windowx_2 register.
Subsampling
Subsampling reduces resolution while maintaining the
constant field of view and an increased frame rate.
LUPA1300-2 supports monochrome and color subsampling
modes of operation. The pixel order for one complete row is
shown in Table 18 and Table 19 on page 26.
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NOIL2SM1300A
Reverse Scan
When reverse scanning in X, the operation is analogous. To
enable reverse readout in X and Y, set the seqmode4[6:7]
bits. In addition, the Y_start and X_start addresses must be
changed to the new starting address.
Reverse scanning is supported in the X and Y direction.
Line 0 (first line on the output) is the top line in normal mode
and the bottom line in reverse scanning, as shown in
Figure 24. As a result, the line numbers always increment.
Figure 25. Normal and Reverse Scanning in Y
Multiple Windows
windows should be less than or equal to the sum of reset time
and integration time. (RTw1+RTw2+RTw3+RTw4) < (Reset
time + Integration time). You can configure the number of
windows used in the application (one to four). Figure 25
shows how to configure two windows spread over the image
array.
The sequencer supports the readout of four different
windows, randomly positioned over the pixel array. The
images are read out sequentially. That is, window 1 is read
out before window 2, even if both windows show some
overlap. Next, windows 3 and 4 are read out. Each window
is treated as a frame and images are read out as shown in
Figure 26. Also, the sum of readout times of all four
Figure 26. Multiple Windows Read from the Same Pixel Array
FOT FS Window1 FE ROT FS Window 2 FE FOTFS Window 1FEROT FS Window 2FE
Frame 2
Frame 1
Figure 27. Readout from Windows
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NOIL2SM1300A
y_widths of the two windows). Read out starts with a FOT
that is similar to single window mode. After the FOT, all
lines of window 1 are read, followed by the lines of
window 2.
Figure 27 shows the sequence of integration and read out
for multiple windows. The handling of integration time is
identical to the single window mode (except that in this case,
the maximum integration time is equal to the sum of the
Handling
FOT
Readout
Handling
FOT
FOT
Reset N Exposure Time N
Readout N-1
Window 1
Readout
FOT
N-1
2
Window 2
Reset N+1 Exposure Time N + 1
Readout N
Window 1
Readout N
Window 2
ROT
Line Readout Window 1
Line Readout Window 2
Figure 28. Exposure and Read Out of Multiple Windows
exposure. Without the multiple slope capabilities, the pixels
p3 and p4 are saturated before the end of the exposure time,
and no signal is received. However, when using multiple
slopes, the analog signal is reset to a second or third reset
level (lower than the original) before the integration time
ends. The analog signal starts decreasing with the same
slope as before, and pixels that were saturated before could
be nonsaturated at read out time. For pixels that never reach
any of the reset levels (for example, p1 and p2) there is no
difference between single and multiple slope operation.
By choosing the time stamps of the double and triple slope
resets (typical at 90% and 99% of the integration,
configurable by the user), it is possible to have a
nonsaturated pixel value even for pixels that receive a huge
amount of light.
If the X size of the windows are not identical, the
integration time in function of the number of lines read
presents multiple slopes (proportional to the X size of these
windows). Because this can cause confusion when
programming the integration time, it is easier to configure all
timer registers using the clock cycle configuration instead of
the ’line’ configuration.
Multiple Slopes
Dynamic range can be extended by the multiple slope
capabilities of the sensor. The four colored lines in Figure 28
represent analog signals of the photodiode of four pixels,
which decrease as a result of exposure. The slope is
determined by the amount of light at each pixel (the more
light, the steeper the slope). When the pixels reach the
saturation level, the analog does not change despite further
Figure 29. Dynamic Range Extended by Multiple Slope Capability
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NOIL2SM1300A
through the registers seqmode1[5] and seqmode1[6], and
their values are expressed in line or clock cycles in the
registers reg_tint_ds_timer and reg_tint_ts_timer.
The reset levels are configured through external (power)
pins. In master mode, the time stamps of the double and
triple slope resets are configured in a method similar to
configuring the exposure time. The time stamps are enabled
Figure 30. Triple Slope Timing in Master Mode
In slave mode, the values of res_length, tint_timer,
tint_DS_timer, and tint_TS_timer in the configuration
registers are ignored. You have full control through the pins
int_time, int_time_ds, and int_time_ts. You must configure
the multiple slope parameters for the application and
interpret the pixel data accordingly.
Figure 31. Triple Slope Timing in Slave Mode
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• datachannelX_1 with X from 0 to 11. The field [1] of
Column FPN Correction
The column FPN of the sensor is improved by the offset
correction of the columns. At the start of every frame, before
read out of the actual lines is done, a fixed voltage is applied
at the columns and these values are read out like a real data
line. Inside the data block, the ’pixel’ data for that line is
stored in an on-chip FPN memory. When the correction is
enabled, the corresponding FPN value is subtracted from the
incoming pixel data.
This FPN correction must be enabled for every output
separately. The registers used to configure the correction
are:
these registers enables the offset corrections of the
specific output channel.
NOTE: Do not change the settings of datachannel12_1.
This channel contains synchronization data, not
pixel data. If fpn correction is enabled on this
channel, the synchronization data becomes
corrupt.
• seqmode3. The field[2] must be ‘1’. It enables the
generation of the line of reference voltages at the
columns.
Figure 31 and Figure 32 show the effect of enabling the
column FPN correction. These images are magnified up to
five times.
Figure 32. Dark Image Without FPN Correction (5x Amplified)
Figure 33. Dark Image With FPN Correction Enabled (5x Amplified)
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Full Frame Mode
In this operation mode, the entire sensor shown in
Figure 18 on page 24 is read out. Figure 33 shows the
Sequencer
internal state
black
FOT ROT
internal state of the sequencer, and the behavior of the data
and sync channels (overview and detail of one line).
ROT line 0
ROT
line
line 1
ROT
1022
line
1023
Data channel
Sync Channel
Data Channel
T
Sync Channel
T
T
D
FS
D
D
D
D
D
D
GB LE CR
T
C
timeslot
timeslot
timeslot
1
2
3
timeslot timeslot CRC
53
54
timeslot
Figure 34. Full Frame Mode Readout
Sequencer
internal state
black
FOT ROT
ROT line 0
ROT
line
line 1
ROT
1022
line
1023
Data channel
Sync Channel
Data Channel
T
Sync Channel
T
T
D
FS
D
D
D
D
D
D
D
LE CR
T
C
timeslot
timeslot
timeslot
1
2
3
timeslot
53
timeslot
54
CRC
timeslot
Figure 35. Full Frame Mode Readout with On Chip Black Level Calibration Disabled
Off Chip Automatic Black Level Calibration
2. Set the sensor to safe settings; DACVREFADC
must be on a value that never clips the grey (or
black) columns.
♦ Make sure that the grey (or black) columns can be
read out without clipping.
♦ Make sure that this is the case for every sensor
including dc-shifts due to Vt and temperature
differences.
3. Read-out the grey (or black) columns.
4. Calculate the average value of this grey (or black)
data; also average it out over the different grey
columns.
5. Adapt the DACVREFADC if the calculated value
deviate from the desired black level value and
return to step (2).
6. Repeat the procedure for temperature changes.
The last time slot not only contains valid pixels but also
two dummy columns, six grey columns, and eight black
columns. The grey column values are used to perform off
chip black level calibration to maintain a constant black
level against any type of drift. These values gauge the
response of normal pixels in the dark conditions.
Grey columns are generated by applying a minimal
integration time (black timer register) to the columns. Black
columns share the same minimal integration time;
additionally, the pixels in that column are shielded. Grey
columns can be used if the integration time is large
compared to the minimal integration time. Black columns
are used if the integration time is in the same order of
magnitude as the minimal integration time.
The procedure is as follows:
1. Decide what digital code should be the desired
black level. 0x00 cannot be chosen to avoid
underflow in FPN correction.
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33
NOIL2SM1300A
PACKAGE
Pin List
Table 20. PIN PLACEMENT LAYOUT (Top View)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
A
134
130
127
124
121
118
115
112
109
106
103
100
99
96
93
90
87
84
81
78
75
72
69
65
B
*
131
128
125
122
119
116
113
110
107
104
101
98
95
92
89
86
83
80
77
74
71
68
*
132
129
126
123
120
117
114
111
108
105
102
97
94
91
88
85
82
79
76
73
70
67
66
C 133
D
E
F
G
H
J
K
TOP VIEW
L
M
N
P
Q
R
S
T
135
139
140
137
145
*
5
7
*
17
19
*
*
31
29
*
43
41
*
54
62
60
59
64
U 136
144
141
138
146
*
8
6
*
20
18
*
*
30
32
*
42
44
*
53
61
55
58
63
V
149
147
142
*
1
3
9
11
13
15
21
23
25
27
33
35
37
39
45
47
*
52
57
50
W 150
148
143
*
2
4
10
12
14
16
22
24
26
28
34
36
38
40
46
48
*
51
56
49
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34
NOIL2SM1300A
Table 21. PIN LIST
Pin No.
Type
Direction
1
clkoutp
Pin Name
LVDS
O
p clk output channel
Description
V5
2
clkoutn
LVDS
O
n clk output channel
W5
3
chp[0]
LVDS
O
p output channel [0]
V6
4
chn[0]
LVDS
O
n output channel [0]
W6
5
gndlvds
Supply
I/O
LVDS ground
T7
6
gndadc
Supply
I/O
ADC ground
U8
7
vddadc
Supply
I/O
ADC power
T8
8
vddlvds
Supply
I/O
LVDS power
U7
9
chp[1]
LVDS
O
p output channel [1]
V7
10
chn[1]
LVDS
O
n output channel [1]
W7
11
chp[2]
LVDS
O
p output channel [2]
V8
12
chn[2]
LVDS
O
n output channel [2]
W8
13
chp[3]
LVDS
O
p output channel [3]
V9
14
chn[3]
LVDS
O
n output channel [3]
W9
15
chp[4]
LVDS
O
p output channel [4]
V10
16
chn[4]
LVDS
O
n output channel [4]
W10
17
gndlvds
Supply
I/O
LVDS ground
T10
18
gndadc
Supply
I/O
ADC ground
U11
19
vddadc
Supply
I/O
ADC power
T11
20
vddlvds
Supply
I/O
LVDS power
U10
21
chp[5]
LVDS
O
p output channel [5]
V11
22
chn[5]
LVDS
O
n output channel [5]
W11
23
chp[6]
LVDS
O
p output channel [6]
V12
24
chn[6]
LVDS
O
n output channel [6]
W12
25
chp[7]
LVDS
O
p output channel [7]
V13
26
chn[7]
LVDS
O
n output channel [7]
W13
27
chp[8]
LVDS
O
p output channel [8]
V14
28
chn[8]
LVDS
O
n output channel [8]
W14
29
gndlvds
Supply
I/O
LVDS ground
T15
30
gndadc
Supply
I/O
ADC ground
U14
31
vddadc
Supply
I/O
ADC power
T14
32
vddlvds
Supply
I/O
LVDS power
U15
33
chp[9]
LVDS
O
p output channel [9]
V15
34
chn[9]
LVDS
O
n output channel [9]
W15
35
chp[10]
LVDS
O
p output channel [10]
V16
36
chn[10]
LVDS
O
n output channel [10]
W16
37
chp[11]
LVDS
O
p output channel [11]
V17
38
chn[11]
LVDS
O
n output channel [11]
W17
39
n/a
not assigned
V18
40
n/a
not assigned
W18
41
gndlvds
Supply
I/O
LVDS ground
T18
42
gndadc
Supply
I/O
ADC ground
U17
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35
Position
NOIL2SM1300A
Table 21. PIN LIST
Pin No.
Type
Direction
43
vddadc
Pin Name
Supply
I/O
ADC power
Description
T17
44
vddlvds
Supply
I/O
LVDS power
U18
45
clkinp
LVDS
I
LVDS input clock 315 MHz p-node
V19
46
clkinn
LVDS
I
LVDS input clock 315 MHz n-node
W19
47
syncp
LVDS
O
LVDS sync and output
V20
48
syncn
LVDS
O
LVDS sync and output
W20
49
gnddig
Supply
I/O
digital ground
W24
50
vdddig
Supply
I/O
digital power supply
V24
51
cap_vrefm
Analog
O
lower limit ADC range decoupling
W22
52
cap_vrefp
Analog
O
higher limit ADC range decoupling
V22
53
gndadc
Supply
I/O
ADC ground
U20
54
vddadc
Supply
I/O
ADC power supply
T20
55
gnddig
Supply
I/O
digital ground
U22
56
gndbuf
Supply
I/O
column buffers ground
W23
57
vddbuf
Supply
I/O
column buffers supply
V23
58
gndana
Supply
I/O
column buffers ground
U23
59
vddana
Supply
I/O
column buffers supply
T23
60
vpix
Supply
I/O
pixel core supply
T22
61
gndpix
Supply
I/O
pixel core ground
U21
62
vsamp
Supply
I/O
image core select and sample supply
T21
63
gndadc
Supply
I/O
ADC ground
U24
64
vdddig
Supply
I/O
digital power supply
T24
65
nbias_colload
Analog
O
column bias decouple
A24
66
test_ena
CMOS
I
scan pin for sequencer; Customer: connect to ground
C24
67
int_time1
CMOS
I
integration pin first slope
C23
68
int_time2
CMOS
I
integration pin dual slope
B23
69
int_time3
CMOS
I
integration pin triple slope
A23
70
monitor1
CMOS
O
output pin for integration timing, high during integration
C22
71
monitor2
CMOS
O
output pin for dual slope integration timing, high during
integration
B22
72
monitor3
CMOS
O
output pin for triple slope integration timing, high during
integration
A22
73
cap_vrefadc
Analog
O
ADC black reference decoupling
C21
74
vpix
Supply
I/O
pixel core supply
B21
75
cap_vrefcm
Analog
O
ADC common mode decoupling
A21
76
reset_n
CMOS
I/O
chip reset (active low)
C20
77
scan_en
CMOS
I
DFT scan enable; Customer: connect to ground
B20
78
scan_clk
CMOS
I
DFT clock; Customer: connect to ground
A20
79
scan_clk_en
CMOS
I
DFT clock enable; Customer: connect to ground
C19
80
gndpix
Supply
I/O
pixel core ground
B19
81
gnddig
Supply
I/O
digital ground
A19
82
vdddig
Supply
I/O
digital power supply
C18
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Position
NOIL2SM1300A
Table 21. PIN LIST
Pin No.
Type
Direction
83
vpix
Pin Name
Supply
I/O
pixel core supply
Description
B18
84
pixdiode
Analog
O
pixel diode current pin; Customer: keep it floating
A18
85
gndpix
Supply
I/O
pixel core ground
C17
86
vsamp
Supply
I/O
image core select and sample supply
B17
87
vresetab
Supply
I/O
anti blooming lower reset level
A17
88
vprech
Supply
I/O
pixel precharge level/decoupling pin
C16
89
vmemh
Supply
I/O
pixel memory reference high
B16
90
vmeml
Supply
I/O
pixel memory reference low
A16
91
vreset
Supply
I/O
pixel reset level
C15
92
vresetds
Supply
I/O
pixel dual slope reset level/decoupling pin
B15
93
vresetts
Supply
I/O
pixel triple slope reset level/decoupling pin
A15
94
vresetab
Supply
I/O
anti blooming lower reset level
C14
95
gndpix
Supply
I/O
pixel core ground
B14
96
vresetts
Supply
I/O
pixel triple slope reset level/decoupling pin
A14
97
vresetds
Supply
I/O
pixel dual slope reset level/decoupling pin
C13
98
vreset
Supply
I/O
pixel reset level
B13
99
vsamp
Supply
I/O
image core select and sample supply
A13
100
vmeml
Supply
I/O
pixel memory reference low
A12
101
vmemh
Supply
I/O
pixel memory reference high
B12
102
vprech
Supply
I/O
pixel precharge level/decoupling pin
C12
103
n/a
not assigned
A11
104
gndpix
Supply
I/O
pixel core ground
B11
105
vresetab
Supply
I/O
anti blooming lower reset level
C11
106
vresetts
Supply
I/O
pixel triple slope reset level/decoupling pin
A10
107
vresetds
Supply
I/O
pixel dual slope reset level/decoupling pin
B10
108
vreset
Supply
I/O
pixel reset level
C10
109
vmeml
Supply
I/O
pixel memory reference low
A9
110
vmemh
Supply
I/O
pixel memory reference high
B9
111
vprech
Supply
I/O
pixel precharge level/decoupling pin
C9
112
vresetab
Supply
I/O
anti blooming lower reset level
A8
113
vsamp
Supply
I/O
image core select and sample supply
B8
114
gndpix
Supply
I/O
pixel core ground
C8
115
ibiaspre
Analog
I
external current bias for vprech (not connected by
default); Customer: connect with 0.1 mf to ground
A7
116
vpix
Supply
I/O
pixel core supply
B7
117
vdddig
Supply
I/O
digital power supply
C7
118
gnddig
Supply
I/O
digital ground
A6
119
gndpix
Supply
I/O
pixel core ground
B6
120
n/a
not assigned
C6
121
n/a
not assigned
A5
122
n/a
not assigned
B5
123
n/a
not assigned
C5
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Position
NOIL2SM1300A
Table 21. PIN LIST
Pin No.
Type
Direction
124
cap_vrefcm
Pin Name
Analog
O
ADC common mode decoupling
Description
A4
125
vpix
Supply
I/O
pixel core supply
B4
126
cap_vrefadc
Analog
O
ADC black reference decoupling
C4
127
spics
CMOS
I
SPI chip select
A3
128
spiclk
CMOS
I
SPI clock
B3
129
spiin
CMOS
I
SPI serial input
C3
130
spiout
CMOS
O
SPI serial output
A2
131
mbsbus[0]
Analog
I/O
first mixed boundary scan bus; Customer: keep it floating
B2
132
mbsbus[1]
Analog
I/O
second mixed boundary scan bus; Customer: keep it
floating
C2
133
refbg
Analog
I/O
external bias resistor; Customer: connect with 47 kW to
ground
C1
134
cmdmbs
Analog
I
bias current for mbs buffers; Customer: connect with 0.1
f to ground
A1
135
vdddig
Supply
I/O
digital power supply
T1
136
gndadc
Supply
I/O
ADC ground
U1
137
vsamp
Supply
I/O
image core select and sample supply
T4
138
gndpix
Supply
I/O
pixel core ground
U4
139
vpix
Supply
I/O
pixel core supply
T2
140
vddana
Supply
I/O
analog power supply
T3
141
gndana
Supply
I/O
analog ground
U3
142
vddbuf
Supply
I/O
column buffers supply
V3
143
gndbuf
Supply
I/O
column buffers ground
W3
144
gnddig
Supply
I/O
digital ground
U2
145
vddadc
Supply
I/O
ADC power supply
T5
146
gndadc
Supply
I/O
ADC ground
U5
147
cap_vrefp
Analog
I/O
higher limit ADC range decoupling
V2
148
cap_vrefm
Analog
I/O
lower limit ADC range decoupling
W2
149
vdddig
Supply
I/O
digital power supply
V1
150
gnddig
Supply
I/O
digital ground
W1
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Position
NOIL2SM1300A
Table 22. MECHANICAL SPECIFICATIONS
Parameter
Min
Typ
Max
Units
Die thickness
NA
750
NA
mm
Die position, X offset to the package center
NA
-42
NA
mm
Die position, Y offset to the package center
NA
-150
NA
mm
Die position, X tilt
-1
0
1
deg
Die position, Y tilt
-1
0
1
deg
Die placement accuracy in package
-50
0
50
mm
Die rotation accuracy
-1
0
1
deg
Optical center referenced from the die center (X-dir)
NA
-121
NA
mm
Optical center referenced from the die center (Y-dir)
NA
+2280
NA
mm
Distance from PCB plane to top of the die surface
NA
1.75
NA
mm
Distance from top of the die surface to top of the glass lid
NA
1.15
NA
mm
XY size
NA
27.4 x 27.4
NA
mm
Thickness
NA
0.9
NA
mm
Spectral range for optical coating of window
400
-
1100
nm
Reflection coefficient for window (refer to Figure 36)
NA
<0.8
NA
%
Mechanical Shock
JESD22-B104C; Condition G
NA
2000
NA
G
Vibration
JESD22-B103B; Condition 1
20
-
2000
Hz
Mounting Profile
Pb-free wave soldering profile for pin grid array package if no socket is used
Recommended Socket
Manufacturer
Andon Electronics (www.andonelectronics.com)
Die
(Pin 1 is located
bottom left)
Glass Lid
Description
BGA Socket: 10-24-05-168-319T-P27-L14
Thru Hole: 10-24-05-168-347T-P27-L14
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NOIL2SM1300A
PACKAGE DRAWING
CPGA168, 35.50x30.50
CASE 107DH−01
ISSUE O
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NOIL2SM1300A
Glass Lid
The LUPA1300-2 monochrome and color image sensor
uses a glass lid without any coatings. Figure 36 shows the
transmission characteristics of the glass lid.
As shown in Figure 36, no infrared attenuating color filter
glass is used. A filter must be provided in the optical path
when
color
devices
are
used
(source:
http://www.pgo−online.com).
Figure 36. Transmission Characteristics of the Glass Lid
HANDLING PRECAUTIONS
For proper handling and storage conditions, refer to the ON Semiconductor application note AN52561.
LIMITED WARRANTY
Return Material Authorization (RMA)
ON Semiconductor’s Image Sensor Business Unit
warrants that the image sensor products to be delivered
hereunder, if properly used and serviced, will conform to
Seller’s published specifications and will be free from
defects in material and workmanship for two (2) years
following the date of shipment. If a defect were to manifest
itself within two (2) years period from the sale date,
ON Semiconductor will either replace the product or give
credit for the product.
ON Semiconductor packages all of its image sensor
products in a clean room environment under strict handling
procedures and ships all image sensor products in ESD-safe,
clean-room-approved shipping containers. Products
returned to ON Semiconductor for failure analysis should be
handled under these same conditions and packed in its
original packing materials, or the customer may be liable for
the product.
ACCEPTANCE CRITERIA SPECIFICATION
The Product Acceptance Criteria is available on request. This document contains the criteria to which the LUPA1300−2 is
tested before being shipped.
APPLICATION NOTE REFERENCES
• AN54468: Interfacing the LUPA1300-2 with FPGA
• AN54598: Pixel Remapping Implementation in
This application note describes the interface between the
LUPA1300-2 and the FPGA, as implemented in the
LUPA1300-2 demonstration kit. It also provides an
overview of the architecture of the demonstration kit and the
method used to synchronize channels.
• AN54214: High Speed Layout Guidelines for the
LUPA1300-2 Image Sensor
LUPA1300-2 Demonstration Kit
This application note explains the remapping technique
implemented in LUPA1300-2 demonstration system to align
non consecutive pixels readout to consecutive pixels for
creating proper images. It also describes the remapping
method during Reverse-X/Y readout and subsampling
modes of operation.
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NOIL2SM1300A
ACRONYMS
Acronym
Description
Acronym
Description
ADC
Analog-to-Digital Converter
IP
Intellectual Property
AFE
Analog Front End
LE
Line End
BL
Black pixel data
LS
Line Start
CDM
Charged Device Model
LSB
Least Significant Bit
CDS
Correlated Double Sampling
LVDS
Low-Voltage Differential Signaling
CMOS
Complementary Metal Oxide Semiconductor
MSB
Most Significant Bit
CRC
Cyclic Redundancy Check
PGA
Programmable Gain Amplifier
DAC
Digital-to-Analog Converter
PLS
Parasitic Light Sensitivity
DDR
Double Data Rate
PRBS
Pseudo-Random Binary Sequence
DNL
Differential Non−Linearity
PRNU
Pixel Random Non−Uniformity
DS
Double Sampling
QE
Quantum Efficiency
DSNU
Dark Signal Non−Uniformity
RGB
Red−Green−Blue
EIA
Electronic Industries Alliance
RMA
Return Material Authorization
ESD
Electrostatic Discharge
RMS
Root Mean Square
FE
Frame End
ROI
Region of Interest
FF
Fill Factor
ROT
Row Overhead Time
FOT
Frame Overhead Time
S/H
Sample and Hold
FPGA
Field Programmable Gate Array
SNR
Signal-to-Noise Ratio
FPN
Fixed Pattern Noise
SPI
Serial Peripheral Interface
FPS
Frames per Second
TIA
Telecommunications Industry Association
FS
Frame Start
TJ
Junction Temperature
HBM
Human Body Model
TR
Training Pattern
IMG
Image data (regular pixel data)
% RH
Percent Relative Humidity
INL
Integral Non−Linearity
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NOIL2SM1300A
GLOSSARY
conversion gain
A constant that converts the number of electrons collected by a pixel into the voltage swing of the pixel. Conversion gain = q/C where q is the charge of an electron (1.602E 19 Coulomb) and C is the capacitance of the
photodiode or sense node.
CDS
Correlated double sampling. This is a method for sampling a pixel where the pixel voltage after reset is
sampled and subtracted from the voltage after exposure to light.
CFA
Color filter array. The materials deposited on top of pixels that selectively transmit color.
DNL
Differential nonlinearity (for ADCs)
DSNU
Dark signal nonuniformity. This parameter characterizes the degree of nonuniformity in dark leakage currents,
which can be a major source of fixed pattern noise.
fill-factor
A parameter that characterizes the optically active percentage of a pixel. In theory, it is the ratio of the actual
QE of a pixel divided by the QE of a photodiode of equal area. In practice, it is never measured.
INL
Integral nonlinearity (for ADCs)
IR
Infrared. IR light has wavelengths in the approximate range 750 nm to 1 mm.
Lux
Photometric unit of luminance (at 550 nm, 1lux = 1 lumen/m2 = 1/683 W/m2)
pixel noise
Variation of pixel signals within a region of interest (ROI). The ROI typically is a rectangular portion of the pixel
array and may be limited to a single color plane.
photometric units
Units for light measurement that take into account human physiology.
PLS
Parasitic light sensitivity. Parasitic discharge of sampled information in pixels that have storage nodes.
PRNU
Photo-response nonuniformity. This parameter characterizes the spread in response of pixels, which is a
source of FPN under illumination.
QE
Quantum efficiency. This parameter characterizes the effectiveness of a pixel in capturing photons and converting them into electrons. It is photon wavelength and pixel color dependent.
read noise
Noise associated with all circuitry that measures and converts the voltage on a sense node or photodiode into
an output signal.
reset
The process by which a pixel photodiode or sense node is cleared of electrons. ”Soft” reset occurs when the
reset transistor is operated below the threshold. ”Hard” reset occurs when the reset transistor is operated
above threshold.
reset noise
Noise due to variation in the reset level of a pixel. In 3T pixel designs, this noise has a component (in units of
volts) proportionality constant depending on how the pixel is reset (such as hard and soft). In 4T pixel
designs, reset noise can be removed with CDS.
responsivity
The standard measure of photodiode performance (regardless of whether it is in an imager or not). Units are
typically A/W and are dependent on the incident light wavelength. Note that responsivity and sensitivity are
used interchangeably in image sensor characterization literature so it is best to check the units.
ROI
Region of interest. The area within a pixel array chosen to characterize noise, signal, crosstalk, and so on.
The ROI can be the entire array or a small subsection; it can be confined to a single color plane.
sense node
In 4T pixel designs, a capacitor used to convert charge into voltage. In 3T pixel designs it is the photodiode
itself.
sensitivity
A measure of pixel performance that characterizes the rise of the photodiode or sense node signal in Volts
upon illumination with light. Units are typically V/(W/m2)/sec and are dependent on the incident light
wavelength. Sensitivity measurements are often taken with 550 nm incident light. At this wavelength, 1 683
lux is equal to 1 W/m2; the units of sensitivity are quoted in V/lux/sec. Note that responsivity and sensitivity
are used interchangeably in image sensor characterization literature so it is best to check the units.
spectral response
The photon wavelength dependence of sensitivity or responsivity.
SNR
Signal-to-noise ratio. This number characterizes the ratio of the fundamental signal to the noise spectrum up
to half the Nyquist frequency.
temporal noise
Noise that varies from frame to frame. In a video stream, temporal noise is visible as twinkling pixels.
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