Freescale MMA8450QR1 3-axis, 8-bit/12-bit digital accelerometer Datasheet

MMA8450Q
Rev 2, 03/2010
Freescale Semiconductor
Technical Data
An Energy Efficient Solution by Freescale
3-Axis, 8-bit/12-bit
MMA8450Q
Digital Accelerometer
The MMA8450Q is a smart low-power, three-axis, capacitive micromachined
accelerometer featuring 12 bits of resolution. This accelerometer is packed with
embedded functions with flexible user programmable options, configurable to
two interrupt pins. Embedded interrupt functions allow for overall power savings
relieving the host processor from continuously polling data. The MMA8450Q’s
Embedded FIFO buffer can be configured to log up to 32 samples of X,Y and
Z-axis 12-bit (or 8-bit for faster download) data. The FIFO enables a more
efficient analysis of gestures and user programmable algorithms, ensuring no
loss of data on a shared I2C bus, and enables system level power saving (up to
96% of the total power consumption savings) by allowing the applications
processor to sleep while data is logged. There is access to both low pass
filtered data as well as high pass filtered data, which minimizes the data
analysis required for jolt detection and faster transitions. The MMA8450Q has
user selectable full scales of ±2g/±4g/±8g. The device can be configured to
generate inertial wake-up interrupt signals from any combination of the
configurable embedded functions allowing the MMA8450Q to monitor events
and remain in a low power mode during periods of inactivity. The MMA8450Q
is available in a 3 x 3 x 1 mm QFN package.
Top and Bottom View
16 PIN QFN
CASE 2077-01
NC
2
NC
3
SCL
4
GND
5
NC
VDD
16
15
14
MMA8450Q
16 Pin QFN
3mm x 3 mm x 1mm
13
GND
12
GND
11
INT1
10 GND
9
6
7
8
EN
1
SA0
VDD
NC
Top View
SDA
Features
• 1.71 V to 1.89 V supply voltage
• ±2g/±4g/±8g dynamically selectable full-scale
• Output Data Rate (ODR) from 400 Hz to 1.563 Hz
• 375 μg/√Hz noise at normal mode ODR = 400 Hz
• 12-bit digital output
• I2C digital output interface (operates up to 400 kHz Fast Mode)
• Programmable 2 interrupt pins for 8 interrupt sources
• Embedded 4 channels of motion detection
– Freefall or motion detection: 2 channels
– Pulse Detection: 1 channel
– Transient (Jolt) Detection: 1 channel
• Orientation (Portrait/Landscape) detection with hysteresis compensation
• Automatic ODR change for auto-wake and return-to-sleep
• 32 sample FIFO
• Self-Test
• 10,000g high shock survivability
• RoHS compliant
MMA8450Q: XYZ-AXIS
ACCELEROMETER
±2g/±4g/±8g
Typical Applications
Pin Connections
• Static orientation detection (portrait/landscape, up/down, left/right, back/
front position identification)
• Real-time orientation detection (virtual reality and gaming 3D user position feedback)
• Real-time activity analysis (pedometer step counting, freefall drop detection for HDD, dead-reckoning GPS backup)
• Motion detection for portable product power saving (auto-sleep and auto-wake for cell phone, PDA, GPS, gaming)
• Shock and vibration monitoring (mechatronic compensation, shipping and warranty usage logging)
• User interface (menu scrolling by orientation change, tap detection for button replacement
ORDERING INFORMATION
Part Number
Temperature Range
Package Drawing
Package
MMA8450QT
-40°C - +85°C
QFN-16
Tray
MMA8450QR1
-40°C - +85°C
QFN-16
Tape and Reel
This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2010. All rights reserved.
INT2
Contents
Application Notes for Reference ...............................................................................................................................................6
1 Block Diagram and Pin Description ..................................................................................................................................6
1.1 Block Diagram .............................................................................................................................................................6
Figure 1. Block Diagram ..............................................................................................................................................6
1.2 Pin Description ............................................................................................................................................................6
Figure 2. Direction of the Detectable Accelerations ....................................................................................................6
Figure 3. Application Diagram .....................................................................................................................................7
Table 1. Pin Description ..............................................................................................................................................7
1.3 Soldering Information ..................................................................................................................................................7
2 Mechanical and Electrical Specifications .........................................................................................................................8
2.1 Mechanical Characteristics .........................................................................................................................................8
Table 2. Mechanical Characteristics ...........................................................................................................................8
2.2 Electrical Characteristics .............................................................................................................................................9
Table 3. Electrical Characteristics @ VDD = 1.8 V, T = 25°C unless otherwise noted. .............................................9
2.3 I2C Interface Characteristic .......................................................................................................................................10
Table 4. I2C Slave Timing Values .............................................................................................................................10
Figure 4. I2C Slave Timing Diagram ..........................................................................................................................11
2.4 Absolute Maximum Ratings .......................................................................................................................................11
Table 5. Maximum Ratings ........................................................................................................................................11
Table 6. ESD and Latch-Up Protection Characteristics ............................................................................................11
3 Terminology .......................................................................................................................................................................12
3.1 Sensitivity ..................................................................................................................................................................12
3.2 Zero-g Offset .............................................................................................................................................................12
3.3 Self-Test ....................................................................................................................................................................12
4 Modes of Operation ...........................................................................................................................................................12
Figure 5. MMA8450Q Mode Transition Diagram .......................................................................................................12
Table 7. Mode of Operation Description ....................................................................................................................12
5 Functionality ......................................................................................................................................................................13
5.1 Device Calibration .....................................................................................................................................................13
5.2 8-bit or 12-bit Data .....................................................................................................................................................13
5.3 Internal FIFO Data Buffer ..........................................................................................................................................13
5.4 Low Power Mode .......................................................................................................................................................13
5.5 Auto-Wake/Sleep Mode ............................................................................................................................................14
5.6 Freefall and Motion Detection ...................................................................................................................................14
5.6.1
Freefall Detection ...........................................................................................................................................14
5.6.2
Motion Detection ............................................................................................................................................14
5.7 Transient Detection ...................................................................................................................................................14
5.8 Orientation Detection .................................................................................................................................................15
Figure 6. Illustration of Landscape-to-Portrait Transition .........................................................................................15
Figure 7. Illustration of Portrait-to-Landscape Transition ..........................................................................................15
Figure 8. Illustration of Z-Tilt Angle Lockout Transition .............................................................................................15
Figure 9. Landscape/Portrait Orientation ..................................................................................................................16
5.9 Interrupt Register Configurations ..............................................................................................................................16
Figure 10. System Interrupt Generation Block Diagram ............................................................................................16
5.10 Serial I2C Interface ....................................................................................................................................................17
Table 8. Serial Interface Pin Description ...................................................................................................................17
5.10.1 I2C Operation .................................................................................................................................................17
Table 9. I2C Address Selection Table .......................................................................................................................17
Single Byte Read .........................................................................................................................................................17
Multiple Byte Read .......................................................................................................................................................18
Single Byte Write ..........................................................................................................................................................18
Multiple Byte Write .......................................................................................................................................................18
Table 10. I2C device Address Sequence ..................................................................................................................18
Figure 11. I2C Timing Diagram ..................................................................................................................................18
MMA8450Q
Sensors
Freescale Semiconductor
2
6
Register Descriptions .......................................................................................................................................................19
Table 11. Register Address Map ...............................................................................................................................19
6.1 Data Registers ...........................................................................................................................................................21
0x00, 0x04, 0x0B: STATUS Registers .........................................................................................................................21
Alias for DR_Status (0x0B) or F_Status (0x10) ...................................................................................................21
0X00, 0X04, 0X0B STATUS: Data Status Registers (Read Only) ......................................................................21
Table 12. STATUS Description .................................................................................................................................21
0x01, 0x02, 0x03: OUT_MSB 8-Bit XYZ Data Registers .............................................................................................22
0x01 OUT_X_MSB: X_MSB Register (Read Only) .............................................................................................22
0x02 OUT_Y_MSB: Y_MSB Register (Read Only) .............................................................................................22
0x03 OUT_Z_MSB: Z_MSB Register (Read Only) .............................................................................................22
0x05 - 0x0A: OUT_MSB and OUT_LSB 12-Bit XYZ Data Registers ...........................................................................22
0x05 OUT_X_LSB: X_LSB Register (Read Only) ...............................................................................................22
0x06 OUT_X_MSB: X_MSB Register (Read Only) .............................................................................................22
0x07 OUT_Y_LSB: Y_LSB Register (Read Only) ...............................................................................................22
0x08 OUT_Y_MSB: Y_MSB Register (Read Only) .............................................................................................22
0x09 OUT_Z_LSB: Z_LSB Register (Read Only) ...............................................................................................22
0x0A OUT_Z_MSB: Z_MSB Register (Read Only) .............................................................................................22
0x0C - 0x0E: OUT_X_DELTA, OUT_Y_DELTA, OUT_Z_DELTA AC Data Registers ................................................23
0x0C OUT_X_DELTA: AC X 8-Bit Data Register (Read Only) ...........................................................................23
0x0D OUT_Y_DELTA: AC Y 8-Bit Data Register (Read Only) ...........................................................................23
0x0E OUT_Z_DELTA: AC Z 8-Bit Data Register (Read Only) ............................................................................23
0x0F: WHO_AM_I Device ID Register .........................................................................................................................23
0x0F WHO_AM_I: Device ID Register (Read Only) ............................................................................................23
6.2 32 Sample FIFO ........................................................................................................................................................23
0x10: F_STATUS FIFO Status Register ......................................................................................................................23
0x10 F_STATUS: FIFO STATUS Register (Read Only) .....................................................................................23
Table 13. FIFO Flag Event Description .....................................................................................................................23
Table 14. FIFO Sample Count Description ...............................................................................................................24
0x11: F_8DATA 8-Bit FIFO Data .................................................................................................................................24
0x11 F_8DATA: 8-Bit FIFO Data Register Points to Register 0x01 (Read Only) ................................................24
0x12: F_12DATA 12-Bit FIFO Data .............................................................................................................................24
0x12 F_12DATA: 12-Bit FIFO Data Register Points to Register 0x05 (Read Only) ............................................24
0x13: F_SETUP FIFO Setup Register .........................................................................................................................24
0x13 F_SETUP: FIFO Setup Register (Read/Write) ...........................................................................................24
0x14: SYSMOD System Mode Register ......................................................................................................................25
0x14 SYSMOD: System Mode Register (Read Only) .........................................................................................25
Table 15. SYSMOD Description ................................................................................................................................25
Table 16. F_SETUP Description ...............................................................................................................................25
0x15: INT_SOURCE System Interrupt Status Register ...............................................................................................26
0x15 INT_SOURCE: System Interrupt Status Register (Read Only) ..................................................................26
Table 17. INT_SOURCE Description ........................................................................................................................26
0x16: XYZ_DATA_CFG Sensor Data Configuration Register .....................................................................................27
0x16 XYZ_DATA_CFG: Sensor Data Configuration Register (Read/Write) .......................................................27
Table 18. XYZ_DATA_CFG Description ................................................................................................................... 27
0x17: HP_FILTER_CUTOFF High Pass Filter Register ...............................................................................................27
0x17 HP_FILTER_CUTOFF: High Pass Filter Register (Read/Write) .................................................................27
Table 19. HP_FILTER_CUTOFF Setting Options .....................................................................................................27
6.3 Portrait/ Landscape Embedded Function Registers ..................................................................................................27
0x18: PL_STATUS Portrait/Landscape Status Register ..............................................................................................27
0x18 PL_STATUS Register (Read Only) ............................................................................................................27
0x19: PL_PRE_STATUS Portrait/Landscape Previous Data Status Register .............................................................28
0x19 PL_PRE_STATUS Register (Read Only) ...................................................................................................28
0x1A: PL_CFG Portrait/Landscape Configuration Register .........................................................................................28
0x1A PL_CFG Register (Read/Write) ..................................................................................................................28
Table 20. PL_CFG Register Description ...................................................................................................................28
0x1B: PL_COUNT Portrait Landscape Debounce Register .........................................................................................28
0x1B PL_COUNT Register (Read/Write) ............................................................................................................28
Table 21. PL_STATUS Register Description ............................................................................................................28
Table 22. PL_COUNT Relationship with the ODR ....................................................................................................29
MMA8450Q
Sensors
Freescale Semiconductor
3
0x1C: PL_BF_ZCOMP Back/Front and Z Compensation Register ..............................................................................29
0x1C: PL_BF_ZCOMP Register (Read/Write) ....................................................................................................29
Table 23. PL_BF_ZCOMP Description .....................................................................................................................29
Table 24. Back/Front Orientation Definitions .............................................................................................................29
0x1D - 0x1F: PL_P_L_THS_REG1, 2, 3 Portrait-to-Landscape Threshold Registers .................................................29
0x1D PL_P_L_THS_REG1 Register (Read/Write) ..............................................................................................29
Table 25. PL_P_L_THS_REG1 Description ..............................................................................................................29
0x1E PL_P_L_THS_REG2 Register (Read/Write) ..............................................................................................29
Table 26. PL_P_L_THS_REG2 Description ..............................................................................................................29
0x1F PL_P_L_THS_REG3 Register (Read/Write) ..............................................................................................29
0x20 - 0x22 PL_L_P_THS_REG1, 2, 3 Landscape-to-Portrait Threshold Registers ...................................................30
0x20 PL_L_P_THS_REG1 Register (Read/Write) ..............................................................................................30
Table 27. PL_L_P_THS_REG1 Description ..............................................................................................................30
0x21 PL_L_P_THS_REG2 Register (Read/Write) ..............................................................................................30
Table 28. PL_L_P_THS_REG2 Description ..............................................................................................................30
0x22 PL_L_P_THS_REG3 Register (Read/Write) ..............................................................................................30
Table 29. PL_L_P_THS_REG3 Description ..............................................................................................................30
Table 30. Landscape-to-Portrait Trip Angle Thresholds Look-up Table ....................................................................30
Table 31. PL_P_L_THS_REG3 Description ..............................................................................................................30
Table 32. Portrait-to-Landscape Trip Angle Thresholds Look-up Table ....................................................................30
6.4 Freefall & Motion Detection Registers .......................................................................................................................31
0x23: FF_MT_CFG_1 Freefall and Motion Configuration Register 1 ...........................................................................31
0x23 FF_MT_CFG_1 Register (Read/Write) .......................................................................................................31
Table 33. FF_MT_CFG_1 Description ......................................................................................................................31
0x24 FF_MT_SRC_1 Register (Read Only) ................................................................................................................32
0x24: FF_MT_SRC_ Freefall and Motion Source Register (0x24) ......................................................................32
Table 34. FF_MT_SRC_1 Description ......................................................................................................................32
0x25: FF_MT_THS_1 Freefall and Motion Threshold 1 Register ................................................................................32
0x25 FF_MT_THS_1 Register (Read/Write) .......................................................................................................32
Table 35. FF_MT_THS_1 Description .......................................................................................................................32
Figure 12. DBCNTM Bit Function ..............................................................................................................................33
0x26: FF_MT_COUNT_1 Freefall Motion Count 1 Register ........................................................................................33
0x26 FF_MT_COUNT_1 Register (Read/Write) ..................................................................................................33
Table 36. FF_MT_COUNT_1 Description .................................................................................................................33
Table 37. FF_MT_COUNT_1 and FF_MT_COUNT_2 Relationship with the ODR ..................................................33
0x27: FF_MT_CFG_2 Freefall and Motion Configuration 2 Register ...........................................................................34
0x27 FF_MT_CFG_2 Register (Read/Write) .......................................................................................................34
0x28: FF_MT_SRC_2 Freefall and Motion Source 2 Register .....................................................................................34
0x28 FF_MT_SRC_2 Register (Read Only) ........................................................................................................34
0x29: FF_MT_THS_2 Freefall and Motion Threshold 2 Register ................................................................................34
0x29 FF_MT_THS_2 Register (Read/Write) .......................................................................................................34
0x2A: FF_MT_COUNT_2 Freefall and Motion Debounce 2 Register ..........................................................................34
0x2A FF_MT_COUNT_2 Register (Read/Write) .................................................................................................34
6.5 Transient Detection Registers ...................................................................................................................................34
0x2B: TRANSIENT_CFG Transient Configuration Register ........................................................................................34
0x2B TRANSIENT_ CFG Register (Read/Write) .................................................................................................34
Table 38. TRANSIENT_ CFG Description ................................................................................................................34
0x2C: TRANSIENT_SRC Transient Source Register ..................................................................................................34
0x2C TRANSIENT_SRC Register (Read Only) ..................................................................................................34
0x2D: TRANSIENT_THS Transient Threshold Register ..............................................................................................35
0x2D TRANSIENT_THS Register (Read/Write) ..................................................................................................35
Table 39. TRANSIENT_THS Description ..................................................................................................................35
0x2E: TRANSIENT_COUNT Transient Debounce Register ........................................................................................35
0x2E TRANSIENT_COUNT Register (Read/Write) ............................................................................................35
Table 40. TRANSIENT_COUNT Description ............................................................................................................35
Table 41. TRANSIENT_COUNT relationship with the ODR .....................................................................................35
Table 42. TRANSIENT_SRC Description .................................................................................................................35
6.6
Tap Detection Registers ...........................................................................................................................................36
0x2F: PULSE_CFG Pulse Configuration Register .......................................................................................................36
0x2F PULSE_CFG Register (Read/Write) ..........................................................................................................36
Table 43. PULSE_CFG Description ..........................................................................................................................36
MMA8450Q
Sensors
Freescale Semiconductor
4
0x30: PULSE_SRC Pulse Source Register .................................................................................................................36
0x30 PULSE_SRC Register (Read Only) ............................................................................................................36
Table 44. TPULSE_SRC Description ........................................................................................................................36
0x31 - 0x33: PULSE_THSX, Y, Z Pulse Threshold for X, Y & Z Registers ..................................................................37
0x31 PULSE_THSX Register (Read/Write) .........................................................................................................37
Table 45. PULSE_THSX Description ........................................................................................................................37
0x32 PULSE_THSY Register (Read/Write) .........................................................................................................37
Table 46. PULSE_THSY Description ........................................................................................................................37
0x33 PULSE_THSZ Register (Read/Write) .........................................................................................................37
Table 47. PULSE_THSZ Description ........................................................................................................................37
0x34: PULSE_TMLT Pulse Time Window 1 Register ..................................................................................................37
0x34 PULSE_TMLT Register (Read/Write) .........................................................................................................37
Table 48. Time Step for PULSE Time Limit at ODR and Power Mode .....................................................................37
0x35: PULSE_LTCY Pulse Latency Timer Register ....................................................................................................38
0x35 PULSE_LTCY Register (Read/Write) .........................................................................................................38
Table 49. Time Step for PULSE Latency at ODR and Power Mode .........................................................................38
0x36: PULSE_WIND Second Pulse Time Window Register ........................................................................................38
0x36 PULSE_WIND Register (Read/Write) .........................................................................................................38
Table 50. Time Step for PULSE Detection Window at ODR and Power Mode .........................................................38
6.7 Auto-Sleep Registers ................................................................................................................................................38
0x37: ASLP_COUNT Auto-Sleep Inactivity Timer Register .........................................................................................38
0x37 ASLP_COUNT Register (Read/Write) ........................................................................................................38
Table 51. ASLP_COUNT Description .......................................................................................................................38
Table 52. ASLP_COUNT Relationship with ODR .....................................................................................................39
0x38: CTRL_REG1 System Control 1 Register ...........................................................................................................39
0x38 CTRL_REG1 Register (Read/Write) ...........................................................................................................39
Table 53. CTRL_REG1 Description ..........................................................................................................................39
Table 54. Sleep Mode Poll Rate Description .............................................................................................................39
Table 55. System Output Data Rate Selection ..........................................................................................................39
Table 56. Full Scale Selection ...................................................................................................................................40
0x39: CTRL_REG2 System Control 2 Register ...........................................................................................................40
0x39 CTRL_REG2 Register (Read/Write) ...........................................................................................................40
Table 57. CTRL_REG2 Description ..........................................................................................................................40
0x3A: CTRL_REG3 Interrupt Control Register ............................................................................................................40
0x3A CTRL_REG3 Register (Read/Write) ..........................................................................................................40
Table 58. CTRL_REG3 Description ..........................................................................................................................41
0x3C: CTRL_REG5 Register (Read/Write) ..................................................................................................................41
0x3C CTRL_REG5 Register (Read/Write) ..........................................................................................................41
Table 59. interrupt Enable Register Description ........................................................................................................41
0x3C: CTRL_REG5 Interrupt Configuration Register ..................................................................................................42
0x3C CTRL_REG5 Register (Read/Write) ..........................................................................................................42
Table 60. Interrupt Configuration Register Description .............................................................................................42
6.8 User Offset Correction Registers ..............................................................................................................................42
0x3D: OFF_X Offset Correction X Register .................................................................................................................42
0x3D OFF_X Register (Read/Write) ....................................................................................................................42
Table 61. OFF_X Description ....................................................................................................................................42
0x3E: OFF_Y Offset Correction Y Register .................................................................................................................42
0x3E OFF_Y Register (Read/Write) ....................................................................................................................42
Table 62. OFF_Y Description ....................................................................................................................................42
0x3F: OFF_Z Offset Correction Z Register ..................................................................................................................42
0x3F OFF_Z Register (Read/Write) ....................................................................................................................42
Table 63. OFF_Z Description ....................................................................................................................................42
Appendix A ................................................................................................................................................................................43
Table 64. MMA8450Q Register Map .........................................................................................................................43
Table 65. Accelerometer Output Data .......................................................................................................................45
Appendix B ................................................................................................................................................................................46
Figure 13. Distribution of Pre Board Mounted Devices Tested in Sockets (1 count = 3.9 mg) .................................46
Figure 14. Distribution of Post Board Mounted Devices (1 count = 3.9 mg) .............................................................47
Figure 15. 8g Z-axis TCS ..........................................................................................................................................50
Figure 16. 8g X-axis TCO (mg/°C) ............................................................................................................................51
Figure 17. 8g Y-axis TCO (mg/°C) ............................................................................................................................52
Figure 18. 8g Z-axis TCO (mg/°C) ............................................................................................................................53
Package Dimensions ............................................................................................................................................................... 54
MMA8450Q
Sensors
Freescale Semiconductor
5
Application Notes for Reference
The following is a list of Freescale Application Notes written for the MMA8450Q:
• AN3915, Embedded Orientation Detection Using the MMA8450Q
• AN3916, Offset Calibration of the MMA8450Q
• AN3917, Motion and Freefall Detection Using the MMA8450Q
• AN3918, High Pass Filtered Data and Transient Detection Using the MMA8450Q
• AN3919, MMA8450Q Single/Double and Directional Tap Detection
• AN3920, Using the 32 Sample First In First Out (FIFO) in the MMA8450Q
• AN3921, Low Power Modes and Auto-Wake/Sleep Using the MMA8450Q
• AN3922, Data Manipulation and Basic Settings of the MMA8450Q
• AN3923, MMA8450Q Design Checklist and Board Mounting Guidelines
1
Block Diagram and Pin Description
1.1
Block Diagram
Internal
OSC
X-axis
Transducer
VDD
Embedded
DSP
Functions
12-bit
ADC
C to V
Converter
Y-axis
Transducer
VSS
Clock
GEN
I2 C
SDA
SCL
Z-axis
Transducer
32 Data Point
Configurable
FIFO Buffer
with Watermark
Freefall
and Motion
Detection
(2 channels)
Transient
Detection
(i.e., fast motion,
jolt)
Enhanced
Orientation with
Hysteresis
and Z-lockout
Shake Detection
through
Motion
Threshold
Tap and
Double Tap
Detection
Auto-Wake/Auto-Sleep Configurable with debounce counter and multiple motion interrupts for control
Active Mode
Normal
Mode
SLEEP Mode
Auto-Wake
Low Power
Mode
(Reduced
Sampling Rate)
Auto-Sleep
Figure 1. Block Diagram
1.2
Pin Description
Z
X
1
Y
(TOP VIEW)
DIRECTION OF THE
DETECTABLE ACCLERATIONS
13
1
9
5
(BOTTOM VIEW)
Figure 2. Direction of the Detectable Accelerations
MMA8450Q
Sensors
Freescale Semiconductor
6
1.8V
4.7μF
0.1μF
1.8V
4.7kΩ
4.7kΩ
NC
4
SCL
5
GND
VDD
3
NC
NC
MMA8450Q
EN
SCL
2
14
SA0
1.8V
VDD
15
SDA
SDA
1
NC
16
6
7
8
GND 13
GND
12
INT1
11
GND
10
INT2
9
INT1
INT2
EN
SA0
Figure 3. Application Diagram
Table 1. Pin Description
Pin # Pin Name
1
VDD
2
Description
Pin Status
Power Supply (1.8V only)
Input
NC/GND
Connect to Ground or Non Connection
Input
3
NC/GND
Connect to Ground or Non Connection
4
SCL
I
5
GND
Connect to Ground
6
SDA
I2C Serial Data
7
SA0
I2C Least Significant Bit of the Device Address
(0: $1C 0: $1D)
8
EN
2C
Serial Clock
Device Enable
(1: I2C Bus Enabled; 0: Shutdown Mode)
Input
Open Drain
Input
Open Drain
Input
Input
9
INT2
Inertial Interrupt 2
10
GND
Connect to Ground
Output
11
INT1
Inertial Interrupt 1
12
GND
Connect to Ground
Input
13
GND
Connect to Ground
Input
14
VDD
Power Supply (1.8V only)
Input
15
NC
Internally not connected
Input
16
NC
Internally not connected
Input
Input
Output
When using MMA8450Q in applications, it is recommended that pin 1 and pin 14 (the VDD pins) be tied together. Power supply
decoupling capacitors (100 nF ceramic plus 4.7 µF bulk, or a single 4.7 µF ceramic) should be placed as near as possible to the
pins 1 and 5 of the device. The SDA and SCL I2C connections are open drain and therefore require a pull-up resistor as shown
in Figure 3
Note: The above application diagram presents the recommended configuration for the MMA8450Q. For information on future
products of this product family please review Freescale application note, AN3923, Design Checklist and Board Mounting
Guidelines of the MMA8450Q.This application note details the small modifications between the MMA8450Q and the next
generation products.
1.3
Soldering Information
The QFN package is compliant with the RoHS standard. Please refer to AN3923.
MMA8450Q
7
Sensors
Freescale Semiconductor
2
Mechanical and Electrical Specifications
2.1
Mechanical Characteristics
Table 2. Mechanical Characteristics @ VDD = 1.8 V, T = 25°C unless otherwise noted.
Parameter
Test Conditions
Full Scale Measurement Range
FS[1:0] set to 01
Min
Typ
Max
±1.8
±2
±2.2
±3.6
±4
±4.4
FS[1:0] set to 11
±7.2
±8
±8.8
FS[1:0] set to 01
0.878
0.976
1.074
1.758
1.953
2.148
3.515
3.906
4.296
FS[1:0] set to 10
Sensitivity
FS[1:0] set to 10
Symbol
FS
So
FS[1:0] set to 11
Sensitivity Change vs. Temperature(1)
FS[1:0] set to 01
Typical Zero-g Level Offset (2)
FS[1:0] set to 01
FS[1:0] set to 10
Unit
g
mg/digit
TCSo
±0.05
%/°C
0g-Off
±40
mg
0g-OffBM
±50
mg
TCOff
±0.5
mg/°C
FS[1:0] set to 11
Typical Zero-g Offset Post Board Mount (2), (3)
FS[1:0] set to 01
FS[1:0] set to 10
FS[1:0] set to 11
Typical Zero-g Offset Change vs. Temperature
Non Linearity
Best Fit Straight Line
Self-test Output
Change(4)
(2)
FS[1:0] set to 01
FS[1:0] set to 10
±0.25
NL
±0.5
FS[1:0] set to 11
±1
FS[1:0] set to 01, X-axis
-195
FS[1:0] set to 01, Y-axis
Vst
-195
FS[1:0] set to 01, Z-axis
Output Noise
Operating Temperature Range
1.
2.
3.
4.
Normal Mode ODR = 400 Hz
% FS
LSB
+945
Noise
Top
μg/√Hz
375
-40
+85
°C
Before board mount.
See appendix for distribution graphs.
Post board mount offset specification are based on an 8 layer PCB.
Self-test in one direction only. These are approximate values and can change by ±100 counts.
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2.2
Electrical Characteristics
Table 3. Electrical Characteristics @ VDD = 1.8 V, T = 25°C unless otherwise noted.(1)
Parameter
Test Conditions
Supply Voltage
Low Power Mode
$39 CTRL_REG2: MOD[0]=1
Symbol
Min
Typ
Max
Unit
VDD
1.71
1.8
1.89
V
EN = 1, ODR = 1.563 Hz
27
EN = 1, ODR = 12.5 Hz
27
EN = 1, ODR = 50 Hz
EN = 1, ODR = 100 Hz
Normal Mode
$39 CTRL_REG2: MOD[0]=0
27
IddLP
EN = 1, ODR = 200 Hz
72
EN = 1, ODR = 400 Hz
120
EN = 1, ODR = 1.563 Hz
42
EN = 1, ODR = 12.5 Hz
42
EN = 1, ODR = 50 Hz
EN = 1, ODR = 100 Hz
Current Consumption in Shutdown Mode
Supply Current Drain in Standby Mode
μA
42
42
Idd
μA
72
EN = 1, ODR = 200 Hz
132
EN = 1, ODR = 400 Hz
225
EN = 0
IddSdn
<1
μA
EN = 1 and FS[1:0] = 00
IddStby
3
μA
Digital High Level Input Voltage
SCL, SDA, SA0, EN
VIH
Digital Low Level Input Voltage
SCL, SDA, SA0, EN
VIL
0.75*VDD
V
0.3*VDD
V
High Level Output Voltage
INT1, INT2
IO = 500 μA
VOH
Low Level Output Voltage
INT1, INT2
IO = 500 μA
VOL
0.1*VDD
V
Low Level Output Voltage
SDA
IO = 500 μA
VOLS
0.1*VDD
V
1.1*ODR
Hz
0.9*VDD
Output Data Rate
ODR
Signal Bandwidth
BW
ODR/2
Hz
Boot Time from EN = 1 to Boot Complete
BT
1.55
ms
Ton
3/ODR
s
Turn-on
time(1)
0.9*ODR
V
ODR
1. Time to obtain valid data from Standby mode to Active mode.
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2.3
I2C Interface Characteristic
Table 4. I2C Slave Timing Values(1)
Parameter
Symbol
I2C Standard Mode
I2C Fast Mode
Min
Max
Min
Max
100
0
400
Unit
SCL Clock Frequency
fSCL
0
Bus Free Time between STOP and START Condition
tBUF
4.7
1.3
μs
Repeated START Hold Time
tHD;STA
4
0.6
μs
Repeated START Setup Time
tSU;STA
4.7
0.6
μs
STOP Condition Setup Time
tSU;STO
4
tHD;DAT
(3)
(2)
SDA Data Hold Time
SDA Valid Time
(5)
SDA Valid Acknowledge Time
(6)
(4)
μs
tVD;DAT
3.45(4)
0.9(4)
μs
tVD;ACK
3.45(4)
0.9(4)
μs
0
0
(3)
SCL Clock Low Time
tLOW
4.7
1.3
SCL Clock High Time
tHIGH
4
0.6
SDA and SCL Fall Time
(3)(5)(8)(9)
Pulse width of spikes on SDA and SCL that must be
suppressed by input filter
tr
100
(7)
250
SDA and SCL Rise Time
μs
0.6
(4)
tSU;DAT
SDA Setup Time
kHz
1000
tf
300
tSP
50
Ns
μs
μs
20 + 0.1Cb
(8)
300
Ns
20 + 0.1Cb
(8)
300
Ns
50
Ns
1. All values referred to VIH (min) and VIL (max) levels.
2. tHD;DAT is the data hold time that is measured from the falling edge of SCL, applies to data in transmission and the acknowledge.
3. A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH (min) of the SCL signal) to bridge
the undefined region of the falling edge of SCL.
4. The maximum tHD;DAT could be 3.45 μs and 0.9 μs for Standard-mode and Fast-mode, but must be less than the maximum of tVD;DAT or
tVD;ACK by a transition time. This maximum must only be met if the device does not stretch the LOW period (tLOW) of the SCL signal. If the
clock stretches the SCL, the data must be valid by the set-up time before it releases the clock.
5. tVD;DAT = time for data signal from SCL LOW to SDA output (HIGH or LOW, depending on which one is worse).
6. tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA output (HIGH or LOW, depending on which one is worse).
7. A Fast-mode I2C device can be used in a Standard-mode I2C system, but the requirement tSU;DAT 250 ns must then be met. This will
automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of
the SCL signal, it must output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode
I2C specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time.
8. Cb = total capacitance of one bus line in pF.
9. The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at 250 ns.
This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding
the maximum specified tf.
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Figure 4. I2C Slave Timing Diagram
2.4
Absolute Maximum Ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. Exposure to
maximum rating conditions for extended periods may affect device reliability.
Table 5. Maximum Ratings
Rating
Symbol
Value
Unit
Maximum Acceleration (all axes, 100 μs)
gmax
10,000
g
Supply Voltage
VDD
-0.3 to +2
V
Vin
-0.3 to VDD + 0.3
V
Drop Test
Ddrop
1.8
M
Operating Temperature Range
TOP
-40 to +85
°C
Storage Temperature Range
TSTG
-40 to +125
°C
Input voltage on any control pin (SA0, EN, SCL, SDA)
Table 6. ESD and Latch-Up Protection Characteristics
Rating
Symbol
Value
Unit
Human Body Model
HBM
±2000
V
Machine Model
MM
±200
V
CDM
±500
V
—
±100
mA
Charge Device Model
Latch-up Current at T = 85°C
This device is sensitive to mechanical shock. Improper handling can cause permanent damage of the part or
cause the part to otherwise fail.
This is an ESD sensitive, improper handling can cause permanent damage to the part.
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3
Terminology
3.1
Sensitivity
Sensitivity describes the gain of the sensor and can be determined by applying a g acceleration to it, such as the earth's
gravitational field. The sensitivity of the sensor can be determined by subtracting the -1g acceleration value from the +1g
acceleration value and dividing by two.
3.2
Zero-g Offset
Zero-g Offset (TyOff) describes the deviation of an actual output signal from the ideal output signal if no acceleration is present.
A sensor in a steady state on a horizontal surface will measure 0g in X-axis and 0g in Y-axis whereas the Z-axis will measure 1g.
The output is ideally in the middle of the dynamic range of the sensor (content of OUT registers 0x00, data expressed as 2's
complement number). A deviation from ideal value in this case is called Zero-g offset. Offset is to some extent a result of stress
on the MEMS sensor and therefore the offset can slightly change after mounting the sensor onto a printed circuit board or
exposing it to extensive mechanical stress.
3.3
Self-Test
Self-Test checks the transducer functionality without external mechanical stimulus. When Self-Test is activated, an
electrostatic actuation force is applied to the sensor, simulating a small acceleration. In this case the sensor outputs will exhibit
a change in their DC levels which are related to the selected full scale through the device sensitivity. When Self-Test is activated,
the device output level is given by the algebraic sum of the signals produced by the acceleration acting on the sensor and by the
electrostatic test-force.
Modes of Operation
VDD = OFF
STANDBY
Mode (00)
EN = VDD & VDD = ON
=
EN
EN = GND
VDD = ON
VDD = OFF
OFF
Mode
GN
D
=
EN
D
VD
VD
SHUTDOWN
Mode
FS = 0
4
D=
OF
F
SLEEP
Mode (10)
WAKE
Mode (01)
EN = GND
Figure 5. MMA8450Q Mode Transition Diagram
Table 7. Mode of Operation Description
Mode
OFF
SHUTDOWN
I2C Bus State
Powered Down
I2C communication ignored
VDD
<1.5 V
ON
I2C communication possible
ON
STANDBY
ACTIVE
I2C communication possible
ON
EN
Function Description
<VDD+0.3V
The device is powered off.
EN = Low
All analog & digital blocks are shutdown.
EN = VDD
Standby register set
Only POR and digital blocks are enabled.
Analog subsystem is disabled.
Registers accessible for Read/Write.
Device configuration done in this mode.
EN = VDD
Standby register reset
All blocks are enabled (POR, digital, analog).
All register contents are preserved when transitioning from Active to Standby mode. Some registers are reset when
transitioning from Standby to Active. These are all noted in the device memory map register table. For more detail on how to use
the Sleep and Wake modes and how to transition between these modes, please refer to the functionality section of this document.
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5
Functionality
The MMA8450Q is a low-power, digital output 3-axis linear accelerometer packaged in a QFN package. The complete device
includes a sensing element and an IC interface able to take the information from the sensing element and to provide a signal to
the external world through an I2C serial interface. There are many embedded features in this accelerometer with a very flexible
interrupt routing scheme to 2 interrupt pins including:
• 8-bit or 12-bit data, high pass filtered data, 8-bit or 12-bit configurable 32 sample FIFO
• Low power and Auto-Wake/ Sleep for conservation of current consumption
• Single and double pulse detection 1 channel
• Motion detection and Freefall 2 channels
• Transient detection based on a high pass filter and settable threshold for detecting the change in acceleration above a
threshold
• Flexible user configurable portrait landscape detection algorithm addressing many use cases for screen orientation
All functionality is available in 2g, 4g or 8g dynamic ranges. There are many configuration settings for enabling all the different
functions. Separate application notes have been provided to help configure the device for each embedded functionality.
5.1
Device Calibration
The IC interface is factory calibrated for sensitivity and zero-g offset for each axis. The trim values are stored in Non Volatile
Memory (NVM). On power-up, the trim parameters are read from NVM and applied to the circuitry. In normal use, further
calibration in the end application is not necessary. However, the MMA8450Q allows the user to adjust the zero-g offset for each
axis after power-up, changing the default offset values. The user offset adjustments are stored in 6 volatile registers. For more
information on device calibration, refer to Freescale application note, AN3916.
5.2
8-bit or 12-bit Data
The measured acceleration data is stored in the OUTX_MSB, OUTX_LSB, OUTY_MSB, OUTY_LSB, OUTZ_MSB, and
OUTZ_LSB registers as 2’s complement 12-bit numbers. The most significant 8-bits of each axis are stored in OUT_X (Y,
Z)_MSB, so applications needing only 8-bit results can use these 3 registers and ignore OUT_X(Y, Z)_LSB.
When the full-scale is set to 2g, the measurement range is -2g to +1.999g, and each LSB corresponds to 1g/1024 (0.98 mg)
at 12-bits resolution. When the full-scale is set to 8g, the measurement range is -8g to +7.996g, and each LSB corresponds to
1g/256 (3.9 mg) at 12-bits resolution. The resolution is reduced by a factor of 16 if only the 8-bit results are used. For more
information on the data manipulation between data formats and modes, refer to Freescale application note, AN3922. There is a
device driver available that can be used with the Sensor Toolbox demo board (LFSTBEB8450Q) with this application note.
5.3
Internal FIFO Data Buffer
MMA8450Q contains a 32 sample internal FIFO data buffer minimizing traffic across the I2C bus. The FIFO can also provide
power savings of the system by allowing the host processor/MCU to go into a sleep mode while the accelerometer independently
stores the data, up to 32 samples per axis. The FIFO can run at all output data rates. There is the option of accessing the full 12bit data for accessing only the 8-bit data. When access speed is more important than high resolution the 8-bit data flush is a better
option.
The FIFO contains three modes (Fill Buffer Mode, Circular Buffer Mode, and Disabled) described in the F_SETUP Register
0x13. Fill Buffer Mode collects the first 32 samples and asserts the overflow flag when the buffer is full. It does not collect anymore
data until the buffer is read. This benefits data logging applications where all samples must be collected. The Circular Buffer Mode
allows the buffer to be filled and then new data replaces the oldest sample in the buffer. The most recent 32 samples will be stored
in the buffer. This benefits situations where the processor is waiting for an specific interrupt to signal that the data must be flushed
to analyze the event.
The MMA8450Q FIFO Buffer also has a configurable watermark, allowing the processor to be interrupted after a configurable
number of samples has filled in the buffer (1 to 32).
For details on the configurations for the FIFO Buffer as well as more specific examples and application benefits, refer to
Freescale application note, AN3920.
5.4
Low Power Mode
The MMA8450Q can be set to a low power mode option to further reduce the current consumption of the device. When the
Low Power Mode is enabled, the device has access to all the configurable sampling rates and features as is available in the
Normal power mode. To set the device into Low Power Mode, bit 0 in the System Control Register 2 (0x39) should be set (1) (this
bit is cleared (0) for Normal Power Mode). Low Power Mode reduces the current consumption by internally sleeping longer and
averaging the data less. The Low Power Mode is an additional feature that is independent of the sleep feature.The sleep feature
can also be used to reduce the current consumption by automatically changing to a lower sample rate when no activity is
detected.
For more information on how to configure the MMA8450Q in Low Power Mode and the power consumption benefits of Low
Power Mode and Auto-Wake/Sleep with specific application examples, refer to Freescale application note, AN3921.
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5.5
Auto-Wake/Sleep Mode
The MMA8450Q can be configured to transition between sample rates (with their respective current consumption) based on
five of the interrupt functions of the device. The advantage of using the Auto-Wake/Sleep is that the system can automatically
transition to a higher sample rate (higher current consumption) when needed but spends the majority of the time in the Sleep
Mode (lower current) when the device does not require higher sampling rates. Auto-Wake refers to the device being triggered by
one of the interrupt functions to transition to a higher sample rate. This may also interrupt the processor to transition from a sleep
mode to a higher power mode.
Sleep Mode occurs after the accelerometer has not detected an interrupt for longer than the user definable time-out period.
The device will transition to the specified lower sample rate. It may also alert the processor to go into a lower power mode to save
on current during this period of inactivity.
The Interrupts that can wake the device from sleep are the following: Tap Detection, Orientation Detection, Motion/Freefall1,
Motion/Freefall2, and Transient Detection. The FIFO can be configured to hold the data in the buffer until it is flushed if the FIFO
Gate bit is set in Register 0x3A but the FIFO cannot wake the device from sleep.
The interrupts that can keep the device from falling asleep are the same interrupts that can wake the device with the addition
of the FIFO. If the FIFO interrupt is enabled and data is being accessed continually servicing the interrupt then the device will
remain in the wake mode. Refer to AN3921, for more detailed information for configuring the Auto-Wake/Sleep and for application
examples of the power consumption savings.
5.6
Freefall and Motion Detection
MMA8450Q has flexible interrupt architecture for detecting Freefall and Motion with the two Motion/Freefall interrupt functions
available. With two configurable interrupts for Motion and Freefall, one interrupt can be configured to detect a linear freefall while
the other can be configured to detect a spin motion. The combination of these two events can be routed to separate interrupts or
to the same interrupt pin to detect tumble which is the combination of spin with freefall. For details on the advantages of having
the two embedded functions of Freefall and Motion detection with specific application examples with recommended configuration
settings, refer to Freescale application note AN3917.
5.6.1
Freefall Detection
The detection of “Freefall” involves the monitoring of the X, Y, and Z axes for the condition where the acceleration magnitude
is below a user specified threshold for a user definable amount of time. Normally the usable threshold ranges are between
±0 mg and ±500 mg.
5.6.2
Motion Detection
There are two programmable functions for motion (MFF1 and MFF2). Motion is configured using the high-g mechanism.
Motion is often used to simply alert the main processor that the device is currently in use. When the acceleration exceeds a set
threshold the motion interrupt is asserted. A motion can be a fast moving shake or a slow moving tilt. This will depend on the
threshold and timing values configured for the event. The motion detection function can analyze static acceleration changes or
faster jolts. For example, to detect that an object is spinning, all three axes would be enabled with a threshold detection of > 2g.
This condition would need to occur for a minimum of 100 ms to ensure that the event wasn't just noise. The timing value is set
by a configurable debounce counter. The debounce counter acts like a filter to determine whether the condition exists for
configurable set of time (i.e., 100 ms or longer).
5.7
Transient Detection
The MMA8450Q has a built in high pass filter. Acceleration data goes through the high pass filter, eliminating the offset (DC)
and low frequencies. The high pass filter cut-off frequency can be set by the user to four different frequencies which are
dependent on the Output Data Rate (ODR). A higher cut-off frequency ensures the DC data or slower moving data will be filtered
out, allowing only the higher frequencies to pass. The embedded Transient Detection function uses the high pass filtered data
allowing the user to set the threshold and debounce counter.
Many applications use the accelerometer’s static acceleration readings (i.e., tilt) which measure the change in acceleration
due to gravity only. These functions benefit from acceleration data being filtered from a low pass filter where high frequency data
is considered noise. However, there are many functions where the accelerometer must analyze dynamic acceleration. Functions
such as tap, flick, shake and step counting are based on the analysis of the change in the acceleration. It is simpler to interpret
these functions dependent on dynamic acceleration data when the static component has been removed. The Transient Detection
function can be routed to either interrupt pin through bit 5 in CTRL_REG5 Register (0x3C). Registers 0x2B – 0x2E are the
dedicated Transient Detection configuration registers. For details on the benefits of the embedded Transient Detection function
along with specific application examples and recommended configuration settings, please refer to Freescale application note,
AN3918.
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5.8
Orientation Detection
The MMA8450Q incorporates an advanced algorithm for orientation detection (ability to detect all 6 orientations including
portrait/landscape) with a large amount of configuration available to provide extreme flexibility to the system designer. The
configurability also allows for the function to work differently for various modes of the end system. For example, the MMA8450Q
Orientation Detection allows up to 10 selectable trip angles for Portrait-to-Landscape, up to10 selectable trip angles for the
transition for Landscape-to-Portrait, and 4 selectable front/back trip angles. Typically the desired hysteresis angle is ±15° from a
45° trip reference point, resulting in |30°| and |60°| trip points. The algorithm is robust enough to handle typical process variation
and uncompensated board mount offset, however, it may result in slight angle variations.
The MMA8450Q Orientation Detection algorithm confirms the reliability of the function with a configurable Z-lock out angle.
Based on known functionality of linear accelerometers, it is not possible to rotate the device about the Z-axis to detect change in
acceleration at slow angular speeds. The angle at which the image no longer detects the orientation change is referred to as the
“Z-Lock- out angle”. The MMA8450Q Orientation Detection function has eight selectable1g-lockout thresholds; and there are 8
different settings for the Z-Angle lockout.
The Orientation Detection function also considers when a device is experiencing acceleration above a set threshold not typical
of orientation changes (i.e., When a person is jogging or due to acceleration changes from being on a bus or in a car). The screen
orientation should not interpret this as a change and the screen should lock in the last known valid position. This added feature,
called the 1g Lockout Threshold, enhances the Orientation Detection function and confirms the reliability of the algorithm for the
system. The MMA8450Q allows for configuring the 1g Lockout Threshold from 1g up to 1.35g (in increments of 0.05g).
For further information on the highly configurable embedded Orientation Detection Function, including recommendations for
configuring the device to support various application use cases, refer to Freescale application note, AN3915.
Figure 6 and Figure 7 show the definitions of the trip angles going from Landscape-to-Portrait and then also from Portrait-toLandscape.
PORTRAIT
90°
PORTRAIT
90°
Landscape-to-Portrait
Trip Angle = 60°
Portrait-to-Landscape
Trip Angle = 60°
0° Landscape
Figure 6. Illustration of Landscape-to-Portrait Transition
0° Landscape
Figure 7. Illustration of Portrait-to-Landscape Transition
Figure 8 illustrates the Z-angle lockout region. When lifting the device up from the flat position it will be active for orientation
detection as low as 25° from flat. This is user configurable. The default angle is 32° but it can be set as low as 25°.
PORTRAIT
90°
NORMAL
DETECTION
REGION
ZLOCK = 32.142°
LOCKOUT
REGION
0° Landscape
Figure 8. Illustration of Z-Tilt Angle Lockout Transition
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Figure 9 shows the device configuration in the 6 different orientation modes. These orientations are defined as the following:
PU = Portrait UP, LR = Landscape Right, PD = Portrait Down, LL = Landscape Left, Back and Front.
Top View
PU
Pin 1
Earth Gravity
Side View
LL
LR
Xout @ 0g
Yout @ -1g
Zout @ 0g
BACK
Xout @ 0g
Yout @ 0g
Zout @ -1g
PD
Xout @ -1g
Yout @ 0g
Zout @ 0g
Xout @ 1g
Yout @ 0g
Zout @ 0g
FRONT
Xout @ 0g
Yout @ 0g
Zout @ 1g
Xout @ 0g
Yout @ 1g
Zout @ 0g
Figure 9. Landscape/Portrait Orientation
There are several registers to configure the orientation detection and are described in detail in the register setting section.
5.9
Interrupt Register Configurations
There are eight configurable interrupts in the MMA8450Q. These are Auto-Sleep, Data Ready, Motion/Freefall 1, Motion/
Freefall 2, Transient, Orientation Detection, Tap Detection and the FIFO events. These eight interrupt sources can be routed to
one of two interrupt pins. The interrupt source must be enabled and configured. If the event flag is asserted because the event
condition is detected, the corresponding interrupt pin, INT1 or INT2, will assert.
Func_En
Auto-Sleep
Event Flag 0
Func_En
FIFO
Event Flag 1
Func_En
Transient Detect
Event Flag 2
Func_En
Orientation Detect
Event Flag 3
Func_En
Pulse Detect
Event Flag 4
Func_En
Freefall/Motion
Func_En
Data Ready
INT1
INTERRUPT
CONTROLLER
INT2
Event Flag 5
Event Flag 6
Event Flag 7
8
INT_ENABLE
8
INT_CFG
Figure 10. System Interrupt Generation Block Diagram
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5.10
Serial I2C Interface
Acceleration data may be accessed through an I2C interface thus making the device particularly suitable for direct interfacing
with a microcontroller. The MMA8450Q features an interrupt signal which indicates when a new set of measured acceleration
data is available thus simplifying data synchronization in the digital system that uses the device. The MMA8450Q may also be
configured to generate other interrupt signals accordingly to the programmable embedded functions of the device for Motion,
Freefall, Transient, Orientation, and Tap.
The registers embedded inside MMA8450Q are accessed through an I2C serial interface. To enable the I2C interface, the EN
pin (pin 8) must be tied high. When EN is tied low, MMA8450Q is put into low power shutdown mode and communications on the
I2C interface are ignored. The MMA8450Q is always in slave mode. The I2C interface may be used for communications between
other I2C devices when EN is tied low and the MMA8450Q does not clamp the I2C bus.
Table 8. Serial Interface Pin Description
Pin Name
Pin Description
EN
Device enable
(1: I2C mode enabled; 0: Shutdown mode)
SCL
I2C Serial Clock
SDA
I2C Serial Data
SA0
I2C least significant bit of the device address
There are two signals associated with the I2C bus; the Serial Clock Line (SCL) and the Serial Data line (SDA). The latter is a
bidirectional line used for sending and receiving the data to/from the interface. External 4.7 kΩ pull-up resistors connected to
VDD are expected for SDA and SCL. When the bus is free both the lines are high. The I2C interface is compliant with fast mode
(400 kHz), and normal mode (100 kHz) I2C standards (Table 4).
I2C Operation
5.10.1
The transaction on the bus is started through a start condition (START) signal. START condition is defined as a HIGH to LOW
transition on the data line while the SCL line is held HIGH. After START has been transmitted by the Master, the bus is considered
busy. The next byte of data transmitted after START contains the slave address in the first 7 bits, and the eighth bit tells whether
the Master is receiving data from the slave or transmitting data to the slave. When an address is sent, each device in the system
compares the first seven bits after a start condition with its address. If they match, the device considers itself addressed by the
Master. The 9th clock pulse, following the slave address byte (and each subsequent byte) is the acknowledge (ACK). The
transmitter must release the SDA line during the ACK period. The receiver must then pull the data line low so that it remains
stable low during the high period of the acknowledge clock period.
The number of bytes transferred per transfer is unlimited. If a receiver can't receive another complete byte of data until it has
performed some other function, it can hold the clock line, SCL low to force the transmitter into a wait state. Data transfer only
continues when the receiver is ready for another byte and releases the data line. This delay action is called clock stretching.
A LOW to HIGH transition on the SDA line while the SCL line is high is defined as a stop condition (STOP). A data transfer is
always terminated by a STOP. A Master may also issue a repeated START during a data transfer. The MMA8450Q expects
repeated STARTs to be used to randomly read from specific registers.
The MMA8450Q's standard slave address is a choice between the two sequential addresses 0011100 and 0011101. The
selection is made by the high and low logic level of the SA0 (pin 7) input respectively. The slave addresses are factory
programmed and alternate addresses are available at customer request. The format is shown in Table 9.
Table 9. I2C Address Selection Table
Slave Address (SA0 = 0)
Slave Address (SA0 = 1)
Comment
0011100
0011101
Factory Default
Single Byte Read
The MMA8450Q has an internal ADC that can sample, convert and return sensor data on request. The transmission of an 8bit command begins on the falling edge of SCL. After the eight clock cycles are used to send the command, note that the data
returned is sent with the MSB first once the data is received. Figure 11 shows the timing diagram for the accelerometer 8-bit I2C
read operation. The Master (or MCU) transmits a start condition (ST) to the MMA8450Q, slave address ($1D), with the R/W bit
set to “0” for a write, and the MMA8450Q sends an acknowledgement. Then the Master (or MCU) transmits the address of the
register to read and the MMA8450Q sends an acknowledgement. The Master (or MCU) transmits a repeated start condition (SR)
and then addresses the MMA8450Q ($1D) with the R/W bit set to “1” for a read from the previously selected register. The Slave
then acknowledges and transmits the data from the requested register. The Master does not acknowledge (NAK) it received the
transmitted data, but transmits a stop condition to end the data transfer.
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Multiple Byte Read
When performing a multi-byte read or “burst read”, the MMA8450Q automatically increments the received register address
commands after a read command is received. Therefore, after following the steps of a single byte read, multiple bytes of data
can be read from sequential registers after each MMA8450Q acknowledgment (AK) is received until a NACK is received from
the Master followed by a stop condition (SP) signaling an end of transmission.
Single Byte Write
To start a write command, the Master transmits a start condition (ST) to the MMA8450Q, slave address ($1D) with the R/W bit
set to “0” for a write, the MMA8450Q sends an acknowledgement. Then the Master (MCU) transmits the address of the register
to write to, and the MMA8450Q sends an acknowledgement. Then the Master (or MCU) transmits the 8-bit data to write to the
designated register and the MMA8450Q sends an acknowledgement that it has received the data. Since this transmission is
complete, the Master transmits a stop condition (SP) to the data transfer. The data sent to the MMA8450Q is now stored in the
appropriate register.
Multiple Byte Write
The MMA8450Q automatically increments the received register address commands after a write command is received.
Therefore, after following the steps of a single byte write, multiple bytes of data can be written to sequential registers after each
MMA8450Q acknowledgment (ACK) is received.
Table 10. I2C device Address Sequence
[6:1]
Device Address
Command
[0]
SA0
[6:0]
Device Address
R/W
8-bit Final Value
Read
001110
0
0x1C
1
0x39
Write
001110
0
0x1C
0
0x38
Read
001110
1
0x1D
1
0x3B
Write
001110
1
0x1D
0
0x3A
< Single Byte Read >
Master
ST
Device Address [6:0]
W
Register Address [7:0]
AK
Slave
SR Device Address [6:0]
R
AK
NAK SP
AK
Data [7:0]
< Multiple Byte Read >
Master
ST
Device Address [6:0]
W
Register Address [7:0]
AK
Slave
AK
AK
Master
AK
Data [7:0]
Slave
SR Device Address [6:0] R
Data [7:0]
AK
AK
NAK
Data [7:0]
SP
Data [7:0]
< Single Byte Write >
ST
Master
Device Address [6:0]
W
Register Address [7:0]
AK
Slave
Data [7:0]
AK
SP
AK
< Multiple Byte Write >
Master
ST
Device Address [6:0]
Slave
W
Register Address [7:0]
AK
Data [7:0]
AK
Data [7:0]
AK
AK
Legend
ST: Start Condition
SP: Stop Condition
NAK: No Acknowledge
SR: Repeated Start Condition
AK: Acknowledge
R: Read = 1
W: Write = 0
Figure 11. I2C Timing Diagram
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6
Register Descriptions
Table 11 is the memory map of the MMA8450Q.The user has access to all addresses from 0x00 to 0x3F.
Table 11. Register Address Map
Name
Type
Register
Address
Auto-Increment
Address
Default
Comment
STATUS(1)(2)
R
0x00
0x01
00000000
Addresses 0x00, 0x04, 0x0B are aliases to the
same register. Data Ready status information or
FIFO status information.
OUT_X_MSB(1)(2)
R
0x01
OUT_Y_MSB(1)(2)
R
0x02
0x03
output
[7:0] are 8 MSBs of 12-bit real-time sample
(1)(2)
R
0x03
0x00
output
[7:0] are 8 MSBs of 12-bit real-time sample
STATUS(1)(2)
R
0x04
0x05
00000000
Addresses 0x00, 0x04, 0x0B are aliases to the
same register. Data Ready status information or
FIFO status information.
OUT_X_LSB(1)(2)
R
0x05
OUT_X_MSB(1)(2)
R
0x06
(1)(2)
R
(1)(2)
(1)(2)
(1)(2)
OUT_Z_MSB
0x02
0x01
output
[7:0] are 8 MSBs of
12-bit real-time sample.
Root pointer to XYZ
FIFO 8-bit data.
output
[3:0] are 4 LSBs of
12-bit sample.
0x07
output
[7:0] are 8 MSBs of 12-bit real-time sample
0x07
0x08
output
[3:0] are 4 LSBs of 12-bit real-time sample
R
0x08
0x09
output
[7:0] are 8 MSBs of 12-bit real-time sample
R
0x09
0x0A
output
[3:0] are 4 LSBs of 12-bit real-time sample
R
0x0A
0x04
output
[7:0] are 8 MSBs of 12-bit real-time sample
STATUS(1)(2)
R
0x0B
0x0C
00000000
Addresses 0x00, 0x04, 0x0B are aliases to the
same register. Data Ready status information or
FIFO status information.
OUT_X_DELTA(1)(2)
R
0x0C
0x0D
output
8-bit AC X-axis data
OUT_Y_DELTA(1)(2)
R
0x0D
0x0E
output
8-bit AC Y-axis data
OUT_Z_DELTA(1)(2)
R
0x0E
0x0B
output
8-bit AC Z-axis data
WHO_AM_I(1)
R
0x0F
0xC6
11000110
NWM Programmable Fixed Device ID No.
F_STATUS(1)(2)
R
0x10
0x11
00000000
FIFO Status: No FIFO event Detected
F_8DATA(1)(2)
R
0x11
0x11
Output
FIFO status and 8-bit samples
F_12DATA(1)(2)
R
0x12
0x12
Output
FIFO status and 12-bit samples
F_SETUP(1)(3)
R/W
0x13
0x14
00000000
FIFO setup
SYSMOD(1)(2)
R
0x14
0x15
Output
Current System Mode
INT_SOURCE(1)(2)
R
0x15
0x16
Output
Interrupt status
XYZ_DATA_CFG(1)(4)
R/W
0x16
0x17
00000000
Acceleration data event flag configuration
HP_FILTER_CUTOFF1,3
R/W
0x17
0x18
00000000
Cutoff frequency is set to 4Hz @ 400Hz
PL_STATUS(1)(2)
R
0x18
0x19
00000000
Landscape/Portrait orientation status
PL_PRE_STATUS(1)(2)
R
0x19
0x1A
00000000
Landscape/Portrait previous orientation
OUT_Y_LSB
OUT_Y_MSB
OUT_Z_LSB
OUT_Z_MSB
0x06
0x05
Root pointer to XYZ
FIFO 12-bit data.
PL_CFG(1)(4)
R/W
0x1A
0x1B
10000011
Landscape/Portrait configuration.
1g Lockout offset is set to default value of 1.15g.
Debounce counters are clear during invalid
sequence condition.
PL_COUNT(1)(3)
R/W
0x1B
0x1C
00000000
Landscape/Portrait debounce counter
PL_BF_ZCOMP(1)(4)
R/W
0x1C
0x1D
00000010
Back-Front Trip threshold is ±75°.
Z-Lockout angle is 32.14°
PL_P_L_THS_REG1(1)(4)
R/W
0x1D
0x1E
00011010
Portrait-to-Landscape Trip Angle is 30°
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Table 11. Register Address Map
PL_P_L_THS_REG2(1)(4)
R/W
0x1E
0x1F
00100010
Portrait-to-Landscape Trip Angle is 30°
(1)(4)
R/W
0x1F
0x20
11010100
Portrait-to-Landscape Trip Angle is 30°
(1)(4)
R/W
0x20
0x21
00101101
Landscape-to-Portrait Trip Angle is 60°
(1)(4)
R/W
0x21
0x22
01000001
Landscape-to-Portrait Trip Angle is 60°
(1)(4)
PL_P_L_THS_REG3
PL_L_P_THS_REG1
PL_L_P_THS_REG2
R/W
0x22
0x23
10100010
Landscape-to-Portrait Trip Angle is 60°
FF_MT_CFG_1
(1)(4)
R/W
0x23
0x24
00000000
Freefall/Motion1 configuration
FF_MT_SRC_1
(1)(2)
R
0x24
0x25
00000000
Freefall/Motion1 event source register
(1)(3)
R/W
0x25
0x26
00000000
Freefall/Motion1 threshold register
PL_L_P_THS_REG3
FF_MT_THS_1
(1)(3)
R/W
0x26
0x27
00000000
Freefall/Motion1 debounce counter
FF_MT_CFG_2
(1)(4)
R/W
0x27
0x28
00000000
Freefall/Motion2 configuration
FF_MT_SRC_2
(1)(2)
R
0x28
0x29
00000000
Freefall/Motion2 event source register
(1)(3)
FF_MT_COUNT_1
R/W
0x29
0x2A
00000000
Freefall/Motion2 threshold register
(1)(3)
R/W
0x2A
0x2B
00000000
Freefall/Motion2 debounce counter
TRANSIENT_CFG
(1)(4)
R/W
0x2B
0x2C
00000000
Transient configuration
TRANSIENT_SRC
(1)(2)
R
0x2C
0x2D
00000000
Transient event status register
(1)(3)
R/W
0x2D
0x2E
00000000
Transient event threshold
FF_MT_THS_2
FF_MT_COUNT_2
TRANSIENT_THS
R/W
0x2E
0x2F
00000000
Transient debounce counter
PULSE_CFG
(1)(4)
R/W
0x2F
0x30
00000000
ELE, Double_XYZ or Single_XYZ
PULSE_SRC
(1)(2)
TRANSIENT_COUNT
R
0x30
0x31
00000000
EA, Double_XYZ or Single_XYZ
PULSE_THSX
(1)(3)
R/W
0x31
0x32
00000000
X and Y pulse threshold
PULSE_THSY
(1)(3)
R/W
0x32
0x33
00000000
Z pulse threshold
PULSE_THSZ
(1)(3)
R/W
0x33
0x34
00000000
Z pulse threshold
PULSE_TMLT
(1)(4)
R/W
0x34
0x35
00000000
Time limit for pulse
(1)(4)
R/W
0x35
0x36
00000000
Latency time for 2nd pulse
(1)(4)
R/W
0x36
0x37
00000000
Window time for 2nd pulse
(1)(4)
PULSE_LTCY
PULSE_WIND
R/W
0x37
0x38
00000000
Counter setting for auto-sleep
(1)(4)
R/W
0x38
0x39
00000000
ODR = 400Hz, Standby Mode.
CTRL_REG2(1)(4)
R/W
0x39
0x3A
00000000
ST = Disabled, SLPE = Disabled,
MODS = normal mode.
CTRL_REG3(1)(4)
R/W
0x3A
0x3B
00000000
IPOL, PP_OD
CTRL_REG4(1)(4)
R/W
0x3B
0x3C
00000000
Interrupt enable register
CTRL_REG5(1)(4)
R/W
0x3C
0x3D
00000000
Interrupt pin (INT1/INT2) map configuration
OFF_X(1)(4)
R/W
0x3D
0x3E
00000000
X-axis offset adjust
OFF_Y(1)(4)
R/W
0x3E
0x3F
00000000
Y-axis offset adjust
OFF_Z(1)(4)
R/W
0x3F
0x0F
00000000
Z-axis offset adjust
ASLP_COUNT
CTRL_REG1
1.
2.
3.
4.
(1)(3)
Register contents are preserved when transition from “ACTIVE” to “STANDBY” mode occurs.
Register contents are reset when transition from “STANDBY” to “ACTIVE” mode occurs.
Modification of this register’s contents can only occur when device is “STANDBY” mode
Register contents can be modified anytime in “STANDBY” or “ACTIVE” mode. A write to this register will cause a reset of the corresponding
internal system debounce counter.
Note: Auto-increment addresses which are not a simple increment are highlighted in bold. The auto-increment addressing is only enabled when
device registers are read using I2C burst read mode. Therefore the internal storage of the auto-increment address is clear whenever a
stop-bit is detected.
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6.1
Data Registers
The following are the data registers for the MMA8450Q. For more information on data manipulation of the MMA8450Q, refer
to application note, AN3922.
0x00, 0x04, 0x0B: STATUS Registers
.
Alias for DR_Status (0x0B) or F_Status (0x10) (Read Only)
FDE (FIFO Data Enable Bit 7, Reg 0x16) Setting
Alias Status
FDE = 0
0x00 = 0x04 = DR_STATUS (0x0B)
FDE = 1
0x00 = 0x04 = F_STATUS (0x10)
When FDE bit found in register 0x16 (XYZ_DATA_CFG), bit 7 is cleared (the FIFO is not on) register 0x00, 0x04 and 0x0B
should all be the same value and reflect the real-time status information of the X, Y and Z sample data. When FDE is set (the
FIFO is on) Register 0x00, 0x04 and 0x10 will have the same value and 0x0B will reflect the status of the transient data. The
aliases allow the STATUS register to be read easily before reading the current 8-bit, 12-bit, or FIFO sample data using the register
address auto-incrementing mechanism.
0X00, 0X04, 0X0B STATUS: Data Status Registers (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ZYXOW
ZOW
YOW
XOW
ZYXDR
ZDR
YDR
XDR
Table 12. STATUS Description
ZYXOW
X, Y, Z-axis Data Overwrite. Default value: 0
0: No data overwrite has occurred
1: Previous X, Y, or Z data was overwritten by new X, Y, or Z data before it was read
ZOW
Z-axis Data Overwrite. Default value: 0
0: No data overwrite has occurred
1: Previous Z-axis data was overwritten by new Z-axis data before it was read
YOW
Y-axis Data Overwrite. Default value: 0
0: No data overwrite has occurred
1: Previous Y-axis data was overwritten by new Y-axis data before it was read
XOW
X-axis Data Overwrite. Default value: 0
0: No data overwrite has occurred
1: Previous X-axis data was overwritten by new X-axis data before it was read
ZYXDR
X, Y, Z-axis new Data Ready. Default value: 0
0: No new set of data ready
1: A new set of data is ready
ZDR
Z-axis new Data Available. Default value: 0
0: No new Z-axis data is ready
1: A new Z-axis data is ready
YDR
Z-axis new Data Available. Default value: 0
0: No new Y-axis data ready
1: A new Y-axis data is ready
XDR
Z-axis new Data Available. Default value: 0
0: No new X-axis data ready
1: A new X-axis data is ready
ZYXOW is set whenever a new acceleration data is produced before completing the retrieval of the previous set. This event
occurs when the content of at least one acceleration data register (i.e., OUTX, OUTY, OUTZ) has been overwritten. ZYXOW is
cleared when the high-bytes of the acceleration data (OUTX_MSB, OUTY_MSB, OUTZ_MSB) of all the active channels are read.
ZOW is set whenever a new acceleration sample related to the Z-axis is generated before the retrieval of the previous sample.
When this occurs the previous sample is overwritten. ZOW is cleared anytime OUTZ_MSB register is read.
YOW is set whenever a new acceleration sample related to the Y-axis is generated before the retrieval of the previous sample.
When this occurs the previous sample is overwritten. YOW is cleared anytime OUTY_MSB register is read.
XOW is set whenever a new acceleration sample related to the X-axis is generated before the retrieval of the previous sample.
When this occurs the previous sample is overwritten. XOW is cleared anytime OUTX_MSB register is read.
ZYXDR signals that a new sample for any of the enabled channels is available. ZYXDR is cleared when the high-bytes of the
acceleration data (OUTX_MSB, OUTY_MSB, OUTZ_MSB) of all the enabled channels are read.
ZDR is set whenever a new acceleration sample related to the Z-axis is generated. ZDR is cleared anytime OUTZ_MSB register
is read. In order to enable the monitoring and assertion of this bit, the ZDR bit requires the Z-axis event detection flag to be
enabled (bit ZDEFE = 1 inside XYZ_DATA_CFG register).
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YDR is set whenever a new acceleration sample related to the Y-axis is available. YDR is cleared anytime OUTY_MSB register
is read. In order to enable the monitoring and assertion of this bit, the YDR bit requires the Y-axis event detection flag to be
enabled (bit YDEFE = 1 inside XYZ_DATA_CFG register).
XDR is set to 1 whenever a new acceleration sample related to the X-axis is available. XDR is cleared anytime OUTX_MSB
register is read. In order to enable the monitoring and assertion of this bit, the XDR bit requires the X-axis to event detection flag
to be enabled (bit XDEFE = 1 inside XYZ_DATA_CFG register).
The ZDR and ZOW flag generation requires the Z-axis event flag generator to be enabled (ZDEFE = 1) in the XYZ_DATA_CFG
register.
The YDR and YOW flag generation requires the Y-axis event flag generator to be enabled (YDEFE = 1) in the XYZ_DATA_CFG
register.
The XDR and XOW flag generation requires the X-axis event flag generator to be enabled (XDEFE = 1) in the XYZ_DATA_CFG
register.
The ZYXDR and ZYXOW flag generation is requires the Z-axis, Y-axis, X-axis event flag generator to be enabled (ZDEFE = 1,
YDEFE = 1, XDEFE = 1) in the XYZ_DATA_CFG register.
0x01, 0x02, 0x03: OUT_MSB 8-Bit XYZ Data Registers
X, Y and Z-axis data is expressed as 2’s complement numbers. The most significant 8-bits are stored together in
OUT_X_MSB, OUT_Y_MSB, OUT_Z_MSB so applications needing only 8-bit results can use these registers and can ignore the
OUT_X_LSB, OUT_Y_LSB, OUT_Z_LSB. The status Register 0x00, OUT_X_MSB, OUT_Y_MSB, OUT_Z_MSB are duplicated
in the auto-incrementing address range of 0x00 to 0x03 to reduce reading the status followed by 8-bit axis data to a 4 byte
sequence.
0x01 OUT_X_MSB: X_MSB Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
XD11
XD10
XD9
XD8
XD7
XD6
XD5
XD4
0x02 OUT_Y_MSB: Y_MSB Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
YD11
YD10
YD9
YD8
YD7
YD6
YD5
YD4
0x03 OUT_Z_MSB: Z_MSB Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ZD11
ZD10
ZD9
ZD8
ZD7
ZD6
ZD5
ZD4
0x05 - 0x0A: OUT_MSB and OUT_LSB 12-Bit XYZ Data Registers
X, Y and Z-axis data is expressed as 2’s complement numbers. The STATUS (0x04), OUT_X_LSB (0x05), OUT_X_MSB
(0x06), OUT_Y_LSB (0x07), OUT_Y_MSB (0x08), OUT_Z_LSB(0x09), OUT_Z_MSB (0x0A) are stored in auto-incrementing
address range of 0x04 to 0x0A to reduce reading the status followed by 12-bit axis data to 7 bytes.
0x05 OUT_X_LSB: X_LSB Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
XD3
XD2
XD1
XD0
0x06 OUT_X_MSB: X_MSB Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
XD11
XD10
XD9
XD8
XD7
XD6
XD5
XD4
0x07 OUT_Y_LSB: Y_LSB Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
YD3
YD2
YD1
YD0
0x08 OUT_Y_MSB: Y_MSB Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
YD11
YD10
YD9
YD8
YD7
YD6
YD5
YD4
0x09 OUT_Z_LSB: Z_LSB Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
ZD3
ZD2
ZD1
ZD0
0x0A OUT_Z_MSB: Z_MSB Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ZD11
ZD10
ZD9
ZD8
ZD7
ZD6
ZD5
ZD4
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The sample data output registers store the current sample data if the FIFO data output register driver is disabled, but if the
FIFO data output register driver is enabled,12 the sample data output registers point to the head of the FIFO buffer which contains
the previous 32 X, Y, and Z data samples. This applies for the 8-bit data and the 12-bit data.
When the FDE bit is set to logic 1, the F_8DATA (0x11) FIFO root data pointer shares the same address location as the
OUT_X_MSB register (0x01); therefore all 8-bit accesses of the FIFO buffer data must use the I2C address 0x01. The F_12DATA
(0x12) FIFO root data pointer shares the same address location as the OUT_X_LSB register (0x05); therefore all 12-bit accesses
of the FIFO buffer data must use the I2C address 0x05. All reads to register addresses 0x02, 0x03, 0x06, 0x07, 0x08, 0x09, and
0x0A returns a value of 0x00.
0x0C - 0x0E: OUT_X_DELTA, OUT_Y_DELTA, OUT_Z_DELTA AC Data Registers
X, Y, and Z-axis 8-bit high pass filtered output data is expressed as 2's complement numbers. The data is obtained from the
output of the user definable high pass filter. The data cuts out the low frequency data, which is useful in that the offset data is
removed. The value of the high pass filter cut off frequency is set in Register 0x17.
Note: The OUT_X_DELTA, OUT_Y_DELTA, OUT_Z_DELTA registers store the high pass filtered “delta data” information regardless of the state
of the FIFO data output register driver bit. Register 0x0B always reflects the status of the delta data.
0x0C OUT_X_DELTA: AC X 8-Bit Data Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
XD7
XD6
XD5
XD4
XD3
XD2
XD1
XD0
0x0D OUT_Y_DELTA: AC Y 8-Bit Data Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
YD7
YD6
YD5
YD4
YD3
YD2
YD1
YD0
0x0E OUT_Z_DELTA: AC Z 8-Bit Data Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ZD7
ZD6
ZD5
ZD4
ZD3
ZD2
ZD1
ZD0
0x0F: WHO_AM_I Device ID Register
This register contains the device identifier which for MMA8450Q is set to 0xC6 by default. The value is factory programmed
by a byte of NVM. A custom alternate value can be set by customer request.
0x0F WHO_AM_I: Device ID Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
1
1
0
0
0
1
1
0
6.2
32 Sample FIFO
The following registers are used to configure the FIFO. The following are the FIFO registers for the MMA8450Q. For more
information on the FIFO please refer to AN3920.
0x10: F_STATUS FIFO Status Register
The FIFO Status Register is used to retrieve information about the FIFO. This register has a flag for the overflow and
watermark. It also has a counter that can be read to obtain the number of samples stored in the buffer.
0x10 F_STATUS: FIFO STATUS Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
F_OVF
F_WMRK_FLAG
F_CNT5
F_CNT4
F_CNT3
F_CNT2
F_CNT1
F_CNT0
Table 13. FIFO Flag Event Description
F_OVF
F_WMRK_FLAG
Event Description
0
—
No FIFO overflow events detected.
1
—
FIFO event detected; FIFO has overflowed.
—
0
No FIFO watermark events detected.
—
1
FIFO event detected; FIFO sample count is greater than watermark value.
The F_OVF and F_WMRK_FLAG flags remain asserted while the event source is still active, but the user can clear the FIFO
interrupt bit flag in the interrupt source register (INT_SOURCE) by reading the F_STATUS register.
Therefore the F_OVF bit flag will remain asserted while the FIFO has overflowed and the F_WMRK_FLAG bit flag will remain
asserted while the F_CNT value is greater than the F_WMRK value.
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Table 14. FIFO Sample Count Description
F_CNT[5:0]
FIFO sample counter. Default value 00_0000.
(00_0001 to 10_0000 indicates 1 to 32 samples stored in FIFO
F_CNT[5:0] bits indicate the number of acceleration samples currently stored in the FIFO buffer. Count 000000 indicates that the
FIFO is empty.
0x11: F_8DATA 8-Bit FIFO Data
F_8DATA provides access to the previous (up to) 32 samples of X, Y, and Z-axis acceleration data at 8-bit resolution. Use
F_12DATA to access the same FIFO data at 12-bit resolution. The advantage of F_8DATA access is much faster download of
the sample data, since it is represented by only 3 bytes per sample (OUT_X_MSB, OUT_Y_MSB, and OUT_Z_MSB).
All reads to address 0x01 returns the sensor sampled data in the FIFO buffer, 3 bytes per sample (one byte per axis), with the
oldest samples first, in order OUT_X_MSB, OUT_Y_MSB, and OUT_Z_MSB. When all samples indicated by the FIFO_Status
register have been read from the FIFO, subsequent reads will return 0x00. Since the FIFO holds a maximum of 32 samples, a
maximum of 3 x 32 = 96 data bytes of samples can be read.
The FIFO will not accumulate more sample data during an access to F_8DATA until a STOP or repeated START occurs.
0x11 F_8DATA: 8-Bit FIFO Data Register Points to Register 0x01 (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
XD11
XD10
XD9
XD8
XD7
XD6
XD5
XD4
The host application should initially perform a single byte read of the FIFO status byte (address 0x10) to determine the status
of the FIFO and if it is determined that the FIFO contains data sample(s), the FIFO contents can also be read from register
address location 0x01 or 0x05.
0x12: F_12DATA 12-Bit FIFO Data
F_12DATA provides access to the previous (up to) 32 samples of X, Y, and Z-axis acceleration data, at 12-bit resolution. Use
F_8DATA to access the same FIFO data at 8-bit resolution. The advantage of F_8DATA access is much faster download of the
sample data, since it is represented by only 3 bytes per sample (OUT_X_MSB, OUT_Y_MSB, and OUT_Z_MSB).
When the FDE bit is set to logic 1, the F_12DATA FIFO root data pointer shares the same address location as the
OUT_X_MSB register (0x05); therefore all 12-bit accesses of the FIFO buffer data must use the I2C register address 0x05. All
reads to the register address 0x02, 0x03, 0x06, 0x07, 0x08, 0x09, and 0x0A return a value of 0x00.
All reads from address (0x05) return the sample data, oldest samples first, in order OUT_X_LSB OUT_X_MSB, OUT_Y_LSB,
OUT_Y_MSB, OUT_Z_LSB, and OUT_Z_MSB. When all samples indicated by the F_Status byte have been read from the FIFO,
subsequent reads will return 0x00. Since the FIFO holds a maximum of 32 samples, a maximum of 6 x 32 = 192 data bytes can
be read.
The FIFO will not accumulate more sample data during an access to F_12DATA until a STOP or repeated START occurs.
0x12 F_12DATA: 12-Bit FIFO Data Register Points to Register 0x05 (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
XD3
XD2
XD1
XD0
0x13: F_SETUP FIFO Setup Register
This setup register is used to configure the options for the FIFO. The FIFO can operate in 3 states which are defined in the
Mode Bits. The watermark bits are configurable to set the number of samples of data to trigger the watermark event flag. The
maximum number of samples is 32. For more information on the FIFO configuration refer to AN3920.
0x13 F_SETUP: FIFO Setup Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
F_MODE1
F_MODE0
F_WMRK5
F_WMRK4
F_WMRK3
F_WMRK2
F_WMRK1
F_WMRK0
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Table 15. F_SETUP Description
BITS
Description
F_MODE[1:0](1)(2)(3)
FIFO buffer overflow mode. Default value 0.
00: FIFO is disabled.
01: FIFO contains the most recent samples when overflowed (circular buffer). Oldest sample is discarded to
be replaced by new sample.
10: FIFO stops accepting new samples when overflowed.
11: Not Used.
The FIFO is flushed whenever the FIFO is disabled, during an automatic ODR change (Auto-Wake/Sleep), or
transitioning from “STANDBY” mode to “ACTIVE” mode.
Disabling the FIFO (F_MODE = 00) resets the F_OVF, F_WMRK_FLAG, F_CNT to zero.
A FIFO overflow event (i.e., F_CNT = 32) will assert the F_OVF flag and a FIFO sample count equal to the
sample count watermark (i.e., F_WMRK) asserts the F_WMRK_FLAG event flag.
F_WMRK[5:0](2)
FIFO Event Sample Count Watermark. Default value 00_0000.
These bits set the number of FIFO samples required to trigger a watermark interrupt. A FIFO watermark event
flag (F_WMK_FLAG) is raised when FIFO sample count F_CNT[5:0] value is equal to the F_ WMRK[5:0]
watermark.
Setting the F_WMRK[5:0] to 00_0000 will disable the FIFO watermark event flag generation.
1. Bit field can be written in ACTIVE mode.
2. Bit field can be written in STANDBY mode.
3. The FIFO mode (F_MODE) cannot be switched between the two operational modes (01and 10) in Active Mode.
A FIFO sample count exceeding the watermark event does not stop the FIFO from accepting new data. The FIFO update rate
is dictated by the selected system ODR. In active mode the ODR is set by the DR register in the CTRL_REG1 register and when
Auto-Sleep is active the ODR is set by the ASLP_RATE field in the CTRL_REG1 register.
When a byte is read from the FIFO buffer the oldest sample data in the FIFO buffer is returned and also deleted from the front
of the FIFO buffer, while the FIFO sample count is decremented by one. It is assumed that the host application shall use the I2C
multi-read transaction to empty the FIFO.
The FIFO mode can be changed while in the active state. The mode must first be disabled F_MODE = 00 then the Mode can
be changed.
0x14: SYSMOD System Mode Register
The system mode register indicates the current device operating mode. Applications using the Auto-Sleep/Auto-Wake
mechanism should use this register to synchronize the application with the device operating mode transitions. The system mode
register also indicates the status of the NVM parity error and FIFO gate error flags.
0x14 SYSMOD: System Mode Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
PERR
FGERR
0
0
0
0
SYSMOD1
SYSMOD0
Table 16. SYSMOD Description
PERR
NVM Parity Error Flag Bit. Default Value: 0.
0: No NVM parity error was detected.
1: NVM parity error detected.
FGERR
FIFO Gate Error. Default value: 0.
0: No FIFO Gate Error detected.
1: FIFO Gate Error was detected.
SYSMOD
System Mode. Default value: 00.
00: Standby mode
01: Wake mode
10: Sleep mode
The FIFO Gate is set in Register 0x3A for the device configured for Auto-Wake/Sleep mode to allow the buffer to preserve the
data without automatically flushing. If the FIFO buffer is not emptied before the arrival of the next sample, then the FGERR bit in
register 0x14 is asserted. The FGERR remains asserted as long as the FIFO buffer remains un-emptied. Emptying the FIFO
buffer clears the FGERR bit.
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0x15: INT_SOURCE System Interrupt Status Register
In the interrupt source register the status of the various embedded features can be determined.The bits that are set (logic ‘1’)
indicate which function has asserted an interrupt and conversely the bits that are cleared (logic ‘0’) indicate which function has
not asserted or has de-asserted an interrupt. The interrupts are rising edge sensitive. The bits are set by a low to high transition
and are cleared by reading the appropriate interrupt source register.
0x15 INT_SOURCE: System Interrupt Status Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
SRC_ASLP
SRC_FIFO
SRC_TRANS
SRC_LNDPRT
SRC_PULSE
Bit 2
Bit 1
SRC_FF_MT_1 SRC_FF_MT_2
Bit 0
SRC_DRDY
Table 17. INT_SOURCE Description
INT_SOURCE
Description
Auto-Sleep/Wake interrupt status bit
Logic ‘1’ indicates that an interrupt event that can cause a “Wake-to-Sleep” or “Sleep-to-Wake” system mode transition
has occurred.
Logic ‘0’ indicates that no “Wake-to-Sleep” or “Sleep-to-Wake” system mode transition interrupt event has occurred.
SRC_ASLP
“Wake-to-Sleep” transition occurs when no interrupt occurs for a time period that exceeds the user specified limit
(ASLP_COUNT). This causes the system to transition to a user specified low ODR setting.
“Sleep-to-Wake” transition occurs when the user specified interrupt event has woken the system; thus causing the
system to transition to a user specified high ODR setting.
Reading the SYSMOD register clears the SRC_ASLP bit.
FIFO interrupt status bit
SRC_FIFO
Logic ‘1’ indicates that a FIFO interrupt event such as an overflow event or watermark has occurred. Logic ‘0’ indicates
that no FIFO interrupt event has occurred.
FIFO interrupt event generators: FIFO Overflow, or (Watermark: F_CNT = F_WMRK) and the interrupt has been
enabled.
This bit is cleared by reading the F_STATUS register.
Transient interrupt status bit
SRC_TRANS
Logic ‘1’ indicates that an acceleration transient value greater than user specified threshold has occurred. Logic ‘0’
indicates that no transient event has occurred.
This bit is asserted whenever “EA” bit in the TRANS_SRC is asserted and the interrupt has been enabled.
This bit is cleared by reading the TRANS_SRC register.
Landscape/Portrait Orientation interrupt status bit
SRC_LNDPRT
Logic ‘1’ indicates that an interrupt was generated due to a change in the device orientation status. Logic ‘0’ indicates
that no change in orientation status was detected.
This bit is asserted whenever “NEWLP” bit in the PL_STATUS is asserted and the interrupt has been enabled.
This bit is cleared by reading the PL_STATUS register.
Pulse interrupt status bit
SRC_PULSE
Logic ‘1’ indicates that an interrupt was generated due to single and/or double pulse event. Logic ‘0’ indicates that no
pulse event was detected.
This bit is asserted whenever “EA” bit in the PULSE_SRC is asserted and the interrupt has been enabled.
This bit is cleared by reading the PULSE_SRC register.
Freefall/Motion1 interrupt status bit
Logic ‘1’ indicates that the Freefall/Motion1 function interrupt is active.
SRC_FF_MT_1
Logic ‘0’ indicates that no Freefall or Motion event was detected.
This bit is asserted whenever “EA” bit in the FF_MT_SRC_1 register is asserted and the FF_MT interrupt has been
enabled.
This bit is cleared by reading the FF_MT_SRC_1 register.
Freefall/Motion2 interrupt status bit
Logic ‘1’ indicates that the Freefall/Motion2 function interrupt is active.
SRC_FF_MT_2
Logic ‘0’ indicates that no Freefall or Motion event was detected.
This bit is asserted whenever “EA” bit in the FF_MT_SRC_2 register is asserted and the FF_MT interrupt has been
enabled.
This bit is cleared by reading the FF_MT_SRC_2 register.
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Table 17. INT_SOURCE Description
Data Ready interrupt bit status
SRC_DRDY
Logic ‘1’ indicates that the X,Y,Z data ready interrupt is active indicating the presence of new data and/or data overrun.
Otherwise if it is a logic ‘0’ the X,Y,Z interrupt is not active.
This bit is asserted when the ZYXOW and/or ZYXDR is set and the interrupt has been enabled.
This bit is cleared by reading the STATUS and X, Y, or Z register.
0x16: XYZ_DATA_CFG Sensor Data Configuration Register
The XYZ_DATA_CFG register configures the 3-axis acceleration data and event flag generator based on the ODR.
0x16 XYZ_DATA_CFG: Sensor Data Configuration Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
FDE
0
0
0
0
ZDEFE
YDEFE
XDEFE
Table 18. XYZ_DATA_CFG Description
FIFO Data Output Register Driver Enable. Default value: 0.
0: The sample data output registers store the current X, Y, & Z sample data;
1: The sample data output registers point to the previously stored X, Y, & Z samples data in the FIFO buffer.
FDE
ZDEFE
Data Event Flag Enable on new Z-axis data. Default value: 0
0: Event detection disabled; 1: Raise event flag on new Z-axis data
YDEFE
Data Event Flag Enable on new Y-axis data. Default value: 0
0: Event detection disabled; 1: Raise event flag on new Y-axis data
XDEFE
Data Event Flag Enable on new X-axis data. Default value: 0
0: Event detection disabled; 1: Raise event flag on new X-axis data
0x17: HP_FILTER_CUTOFF High Pass Filter Register
This register sets the high-pass filter cut-off frequency for the detection of instantaneous acceleration. The output of this filter
is indicated by the OUT_X_DELTA, OUT_Y_DELTA, and OUT_Z_DELTA registers. The filter cut-off options change based on the
data rate selected as shown in Table 19. For details of implementation on the high pass filter, refer to Freescale application note
AN3918.
0x17 HP_FILTER_CUTOFF: High Pass Filter Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
SEL1
SEL0
Table 19. HP_FILTER_CUTOFF Setting Options
SEL1
SEL0
Fc (Hz) @
ODR = 400 Hz
Fc (Hz) @
ODR = 200 Hz
0
0
4
2
1
0.5
0.125
0.01
0
1
2
1
0.5
0.25
0.063
0.007
1
0
1
0.5
0.25
0.125
0.031
0.004
1
1
0.5
0.25
0.125
0.062
0.016
0.002
6.3
Fc (Hz) @
ODR = 100 Hz
Fc (Hz) @
ODR = 50 Hz
Fc (Hz) @
ODR = 12.5 Hz
Fc (Hz) @
ODR = 1.563 Hz
Portrait/ Landscape Embedded Function Registers
For more details on the meaning of the different user configurable settings and for example code refer to Freescale application
note AN3915.
0x18: PL_STATUS Portrait/Landscape Status Register
This status register can be read to get updated information on any change in orientation by reading Bit 7, or on the specifics
of the orientation by reading Bit0 to Bit 4. For further understanding of Portrait Up, Portrait Down, Landscape Left, Landscape
Right, Back and Front please refer to Figure 9
0x18 PL_STATUS Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
NEWLP
LO
—
LAPO[2]
LAPO[1]
LAPO[0]
BAFRO[1]
BAFRO[0]
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Table 20. PL_STATUS Register Description
NEWLP
LO
Landscape-Portrait status change flag. Default value: 0.
0: No change, 1: BAFRO and/or LAPO and/or Z-tilt lockout value has changed
Z-Tilt Angle Lockout. Default value: 0.
0: Lockout condition has not been detected.
1: Z-Tilt lockout trip angle has been exceeded. Lockout has been detected.
BAFRO[1:0]
Back or Front orientation. Default value: 00
00: Undefined. This is the default power up state.
01: Front: Device is in the front facing orientation.
10: Back: Device is in the back facing orientation.
LAPO[2:0](1)
Landscape/Portrait orientation. Default value: 000
000: Undefined. This is the default power up state.
001: Portrait Up
010: Portrait Down
011: Landscape Right
100: Landscape Left
1. The default power up state is BAFRO (Undefined), LAPO (Undefined), and no Lockout for orientation function.
NEWLP is set to 1 whenever a change in LO, BAFRO, or LAPO occurs. NEWLP bit is cleared anytime PL_STATUS register is
read.
0x19: PL_PRE_STATUS Portrait/Landscape Previous Data Status Register
This register provides the previous orientation data from the previous reading. These register definitions are the same as what
has been described in Register 0x18.
0x19 PL_PRE_STATUS Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
—
LO
-—
LAPO[2]
LAPO[1]
LAPO[0]
BAFRO[1]
BAFRO[0]
0x1A: PL_CFG Portrait/Landscape Configuration Register
This register configures the behavior of the debounce counters and also sets the Landscape/Portrait 1g lockout mechanism
threshold offset.
0x1A PL_CFG Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
DBCNTM
PL_EN
—
—
—
GOFF[2]
GOFF[1]
GOFF[0]
Table 21. PL_CFG Register Description
DBCNTM
PL_EN
GOFF
Debounce counter mode selection. Default value: 1
0: Decrements debounce whenever condition of interest is no longer valid.
1: Clears counter whenever condition of interest is no longer valid.
Portrait-Landscape Detection Enable. Default value: 0
0: Portrait-Landscape Detection is Disabled.
1: Portrait-Landscape Detection is Enabled.
1g lockout threshold offset expressed in steps of 50mg. Default value: 011 = 1.15g.
The offset specified by the GOFF is added or subtracted from 1g to achieve the optimal 1g lockout threshold.
If GOFF = 011, then the resulting 1g lockout threshold is ±(1g + 150mg).
000: No offset.
0x1B: PL_COUNT Portrait Landscape Debounce Register
This register sets the debounce counter for the orientation state transition. The minimum debounce latency is determined by
the data rate set by the selected system ODR and PL_COUNT registers. Any change to the ODR or device mode transitioning
from ACTIVE to STANDBY or vice versa resets the internal landscape/portrait internal debounce counters.
0x1B PL_COUNT Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
DBNCE[7]
DBNCE[6]
DBNCE[5]
DBNCE[4]
DBNCE[3]
DBNCE [2]
DBNCE [1]
DBNCE [0]
The debounce counter scales with the ODR, like many of the debounce counters in the other functional blocks. Table 22 shows
the relationship between the ODR, the step per count and the duration.
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Table 22. PL_COUNT Relationship with the ODR
Output Data Rate (Hz)
Step
Duration Range
400
2.5 ms
2.5 ms – 0.637s
200
5 ms
5 ms – 1.275s
100
10 ms
10 ms – 2.55s
50
20 ms
20 ms – 5.1s
12.5
80 ms
80 ms – 20.4s
1.56
640 ms
640 ms – 163s
0x1C: PL_BF_ZCOMP Back/Front and Z Compensation Register
The Z-Tilt angle compensation bits allow the user to adjust the Z-lockout region from 25° up to 50°. The default Z-lockout angle
is set to the default value of 32° upon power up. The Back to Front trip angle is set by default to ±75° but this angle also can be
adjusted from a range of 65° to 80° with 5° step increments.
0x1C: PL_BF_ZCOMP Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
BKFR[1]
BKFR[0]
—
—
—
ZLOCK[2]
ZLOCK[1]
ZLOCK[0]
Table 23. PL_BF_ZCOMP Description
ZLOCK
BKFR
Z-Lock Angle Threshold. Range is from 25° to 50°. Step size is 3.6°.
Default value: 010 ≥ 32.1°. Maximum value: 111 ≥ 50°.
Back Front Trip Angle Threshold. Default: 10 ≥ ±75°. Step size is 5°.
Range: ±(65° to 80°).
Table 24. Back/Front Orientation Definitions
BKFR
Back → Front Transition
Front → Back Transition
00
Z < 80° or Z > 280°
Z > 100° and Z < 260°
01
Z < 75° or Z > 285°
Z > 105° and Z < 255°
10
Z < 70° or Z > 290°
Z > 110° and Z < 250°
11
Z < 65° or Z > 295°
Z > 115° and Z < 245°
0x1D - 0x1F: PL_P_L_THS_REG1, 2, 3 Portrait-to-Landscape Threshold Registers
The following registers represent the Portrait-to-Landscape trip threshold registers. These registers are used to set the trip
angle for the image transition from the Portrait orientation to the Landscape orientation. The angle can be selected from Table 28
and the corresponding values for that angle should be written into the three PL_P_L_THS Registers.
0x1D PL_P_L_THS_REG1 Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
P_L_THS[7]
P_L_THS[6]
P_L_THS[5]
P_L_THS[4]
P_L_THS[3]
P_L_THS[2]
P_L_THS[1]
P_L_THS[0]
Table 25. PL_P_L_THS_REG1 Description
P_L_THS
Portrait-to-Landscape Threshold Register 1. Default value: 30° → 0001_1010.
0x1E PL_P_L_THS_REG2 Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
P_L_THS[7]
P_L_THS[6]
P_L_THS[5]
P_L_THS[4]
P_L_THS[3]
P_L_THS[2]
P_L_THS[1]
P_L_THS[0]
Table 26. PL_P_L_THS_REG2 Description
P_L_THS
Portrait-to-Landscape Threshold Register 2. Default value: 30° → 0010_0010.
0x1F PL_P_L_THS_REG3 Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
P_L_THS[7]
P_L_THS[6]
P_L_THS[5]
P_L_THS[4]
P_L_THS[3]
P_L_THS[2]
P_L_THS[1]
P_L_THS[0]
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Table 27. PL_P_L_THS_REG3 Description
P_L_THS
Portrait-to-Landscape Threshold Register 3. Default value: 30°→ 1101_0100.
Table 28. Portrait-to-Landscape Trip Angle Thresholds Look-up Table
Portrait-to-Landscape
Trip Angle
PL_P_L_THS_REG1
PL_P_L_THS_REG2
PL_P_L_THS_REG3
15
0x17
0x75
0x77
20
0x18
0x14
0x23
25
0x18
0xF3
0x59
30
0x1A
0xA2
0x77
35
0x1B
0x1A
0x1A
40
0x1D
0x92
0x33
45
0x20
0x00
0x00
50
0x23
0x31
0xD9
55
0x27
0x71
0xBA
60
0x2D
0x41
0xA2
0x20 - 0x22 PL_L_P_THS_REG1, 2, 3 Landscape-to-Portrait Threshold Registers
The following registers represent the Landscape-to-Portrait trip threshold registers. These registers are used to set the trip
angle for the image transition from the Landscape orientation to the Portrait orientation. The angle can be selected from Table 32
and the corresponding values for that angle should be written into the three PL_L_P_THS Registers.
0x20 PL_L_P_THS_REG1 Register (Read/Write)
Bit 7
L_P_THS[7]
Bit 6
L_P_THS[6]
Bit 5
L_P_THS[5]
Bit 4
L_P_THS[4]
Bit 3
L_P_THS[3]
Bit 2
L_P_THS[2]
Bit 1
L_P_THS[1]
Bit 0
L_P_THS[0]
Table 29. PL_L_P_THS_REG1 Description
L_P_THS
Landscape-to-Portrait Threshold Register 1. Default value: 60° → 0010_1101.
0x21 PL_L_P_THS_REG2 Register (Read/Write)
Bit 7
L_P_THS[7]
Bit 6
L_P_THS[6]
Bit 5
L_P_THS[5]
Bit 4
L_P_THS[4]
Bit 3
L_P_THS[3]
Bit 2
L_P_THS[2]
Bit 1
L_P_THS[1]
Bit 0
L_P_THS[0]
Bit 1
L_P_THS[1]
Bit 0
L_P_THS[0]
Table 30. PL_L_P_THS_REG2 Description
L_P_THS
Landscape-to-Portrait Threshold Register 2. Default value: 60° → 0100_0001.
0x22 PL_L_P_THS_REG3 Register (Read/Write)
Bit 7
L_P_THS[7]
Bit 6
L_P_THS[6]
Bit 5
L_P_THS[5]
Bit 4
L_P_THS[4]
Bit 3
L_P_THS[3]
Bit 2
L_P_THS[2]
Table 31. PL_L_P_THS_REG3 Description
L_P_THS
Landscape-to-Portrait Threshold Register 3. Default value: 60° → 1010_0010.
Table 32. Landscape-to-Portrait Trip Angle Thresholds Look-up Table
Landscape-to-Portrait
Trip Angle
PL_L_P_THS_REG1
PL_L_P_THS_REG2
PL_L_P_THS_REG3
30
0x1A
0x22
0xD4
35
0x1B
0xA2
0x77
40
0x1D
0x92
0x33
45
0x20
0x00
0x00
50
0x23
0x31
0xD9
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Table 32. Landscape-to-Portrait Trip Angle Thresholds Look-up Table
6.4
55
0x27
0x71
0xBA
60
0x2D
0x41
0xA2
65
0x35
0x91
0x8F
70
0x42
0x31
0x81
75
0x57
0x71
0x77
Freefall & Motion Detection Registers
For details on how to configure the device for Freefall and/or Motion detection and for sample code, refer to application note
AN3917.
Note: There are two Freefall and Motion Detection Functions. The registers from 0x27 - 0x2A have the same descriptions as
registers 0x23 - 0x26.
0x23: FF_MT_CFG_1 Freefall and Motion Configuration Register 1
0x23 FF_MT_CFG_1 Register (Read/Write)
Bit 7
ELE
Bit 6
OAE
Bit 5
ZHEFE
Bit 4
ZLEFE
Bit 3
YHEFE
Bit 2
YLEFE
Bit 1
XHEFE
Bit 0
XLEFE
Table 33. FF_MT_CFG_1 Description
ELE
Event Latch Enable: Event flag is latched into FF_MT_SRC_1 register. Reading of the FF_MT_SRC_1 register clears the EA
event flag. Default value: 0
0: Event flag latch disabled; 1: Event flag latch enabled
OAE
Logical Or/And combination of events flags. Default value: 0
0: Logical AND combination of events flags; 1: Logical OR combination of events flags
ZHEFE
Event flag enable on Z High event. Default value: 0
0: Event detection disabled; 1: Event detection enabled
ZLEFE
Event flag enable on Z Low event. Default value: 0
0: Event detection disabled; 1: Event detection enabled
YHEFE
Event flag enable on Y High event. Default value: 0
0: Event detection disabled; 1: Event detection enabled
YLEFE
Event flag enable on Y Low event. Default value: 0
0: Event detection disabled; 1: Event detection enabled
XHEFE
Event flag enable on X High event. Default value: 0
0: Event detection disabled; 1: Event detection enabled
XLEFE
Event flag enable on X Low event. Default value: 0
0: Event detection disabled; 1: Event detection enabled
OAE bit allows the selection between Motion (logical OR combination of X, Y, Z-axis event flags) and Freefall (logical AND
combination of X, Y, Z-axis event flags) detection.
ELE denotes whether the enabled event flag will be latched in the FF_MT_SRC_1 register or the event flag status in the
FF_MT_SRC_1 will indicate the real-time status of the event. If ELE bit is set to a logic 1, then the event active “EA” flag is cleared
by reading the FF_MT_SRC_1 source register.
ZHEFE, YHEFE, XHEFE enables the detection of a high g event when the measured acceleration data on X, Y, or Z-axis is
higher than the threshold set in FF_MT_THS_1 register.
ZLEFE, YLEFE, XLEFE enables the detection of a low g event when the measured acceleration data on X, Y, or Z-axis is lower
than the threshold set in FF_MT_THS_1 register.
FF_MT_THS_1 is the threshold register used by the Freefall/Motion function to detect Freefall or Motion events. The unsigned
7-bit FF_MT_THS_1 threshold register holds the threshold for the low g event detection where the magnitude of the X and Y and
Z acceleration values are lower than the threshold value. Conversely the FF_MT_THS_1 also holds the threshold for the high g
event detection where the magnitude of the X, or Y, or Z-axis acceleration values is higher than the threshold value.
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0x24 FF_MT_SRC_1 Register
0x24: FF_MT_SRC_ Freefall and Motion Source Register (0x24) (Read Only)
Bit 7
—
Bit 6
EA
Bit 5
ZHE
Bit 4
ZLE
Bit 3
YHE
Bit 2
YLE
Bit 1
XHE
Bit 0
XLE
Table 34. FF_MT_SRC_1 Description
EA
Event Active Flag. Default value: 0
0: No event flag has been asserted; 1: one or more event flags have been asserted.
ZHE
Z High Event Flag. Default value: 0
0: No Z High event detected, 1: Z High event has been detected
ZLE
Z Low Event Flag. Default value: 0
0: No Z Low event detected, 1: Z Low event has been detected
YHE
Y High Event Flag. Default value: 0
0: No Y High event detected, 1: Y High event has been detected
YLE
Y Low Event Flag. Default value: 0
0: No Y Low event detected, 1: Y Low event has been detected
XHE
X High Event Flag. Default value: 0
0: No X High event detected, 1: X High event has been detected
XLE
X Low Event Flag. Default value: 0
0: No X Low event detected, 1: X Low event has been detected
This register keeps track of the acceleration event which is triggering (or has triggered, in case of ELE bit in FF_MT_CFG_1
register being set to 1) the event flag. In particular EA is set to a logic 1 when the logical combination of acceleration events flags
specified in FF_MT_CFG_1 register is true. This bit is used in combination with the values in INT_EN_FF_MT_1 and
INT_CFG_FF_MT_1 register to generate the Freefall/Motion interrupts.
An X,Y, or Z high or an X,Y, and Z high event is true when the acceleration value of the X or Y or Z axes is higher than the
preset threshold value defined in the FF_MT_THS_1 register.
Conversely X,Y, or Z high or an X,Y, and Z low event is true when the acceleration value of the X and Y and Z axes are lower
than the preset threshold value defined in the FF_MT_THS_1 register.
When the ELE bit is set, only the EA bit is latched. The other bits are not latched. To see the events that have been detected,
the register must be read immediately. The EA bit will remain high until the source register is read.
0x25: FF_MT_THS_1 Freefall and Motion Threshold 1 Register
0x25 FF_MT_THS_1 Register (Read/Write)
Bit 7
DBCNTM
Bit 6
THS6
Bit 5
THS5
Bit 4
THS4
Bit 3
THS3
Bit 2
THS2
Bit 1
THS1
Bit 0
THS0
Table 35. FF_MT_THS_1 Description
DBCNTM
Debounce counter mode selection. Default value: 0.
0: increments or decrements debounce, 1: increments or clears counter.
THS[6:0]
Freefall /Motion Threshold: default value: 000 0000
The minimum threshold resolution is dependent on the selected acceleration g range and the threshold register has a range
of 0 to 127.
Therefore:
• If the selected acceleration g range is 8g mode (FS = 11), the minimum threshold resolution is 0.063g/LSB. The maximum
value is 8g.
• If the selected acceleration g range is 4g mode (FS = 10), the minimum threshold resolution is 0.0315g/LSB. The
maximum value is 4g.
• If the selected acceleration g range is 2g mode (FS = 01), the minimum threshold resolution is 0.01575g/LSB. The
maximum value is 2g.
When DBCNTM bit is a logic ‘1’, the debounce counter is cleared to 0 whenever the event of interest is no longer true (Figure
12 part b) while if the DBCNTM bit is set a logic ‘0’ the debounce counter is decremented by 1 whenever the event of interest is
no longer true (Figure 12 part c) until the debounce counter reaches 0 or the event of interest becomes active.
Decrementing of the debounce counter acts as a median filter enabling the system to filter out irregular spurious events which
might impede the detection of the event.
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32
Low g Event on
all 3-axis
(Freefall)
Count Threshold
(a)
FF_MT
Counter
Value
EA FF
Low g Event on
all 3-axis
(Freefall)
DBCNTM = 1
Count Threshold
FF_MT
Counter
Value
(b)
EA FF
Low g Event on
all 3-axis
(Freefall)
DBCNTM = 0
Count Threshold
FF_MT
Counter
Value
(c)
EA FF
Figure 12. DBCNTM Bit Function
0x26: FF_MT_COUNT_1 Freefall Motion Count 1 Register
This register sets the number of debounce sample counts for the event trigger.
0x26 FF_MT_COUNT_1 Register (Read/Write)
Bit 7
D7
Bit 6
D6
Bit 5
D5
Bit 4
D4
Bit 3
D3
Bit 2
D2
Bit 1
D1
Bit 0
D0
Table 36. FF_MT_COUNT_1 Description
D[7-0]
Count value. Default value: 0000_0000
D7 - D0 define the number of debounce sample counts for the event trigger. When the debounce counter exceeds the
FF_MT_COUNT_1 value, a Freefall/Motion event flag is set. The time step used for the debounce sample count depends on the
ODR chosen (Table 37).
Table 37. FF_MT_COUNT_1 and FF_MT_COUNT_2 Relationship with the ODR
Output Data Rate (Hz)
Step
Duration Range
400
2.5 ms
2.5 ms – 0.63s
200
5 ms
5 ms – 1.275s
100
10 ms
10 ms – 2.55s
50
20 ms
20 ms – 5.1s
12.5
80 ms
80 ms – 20.4s
1.56
640 ms
640 ms – 163s
An ODR of 100 Hz and a FF_MT_COUNT_1 value of 15 would result in a debounce response time of 150 ms.
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0x27: FF_MT_CFG_2 Freefall and Motion Configuration 2 Register
These registers all have the same descriptions as above for Registers 0x23 - 0x26.
0x27 FF_MT_CFG_2 Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ELE
OAE
ZHEFE
ZLEFE
YHEFE
YLEFE
XHEFE
XLEFE
0x28: FF_MT_SRC_2 Freefall and Motion Source 2 Register
0x28 FF_MT_SRC_2 Register (Read Only)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
—
EA
ZHE
ZLE
YHE
YLE
XHE
XLE
0x29: FF_MT_THS_2 Freefall and Motion Threshold 2 Register
0x29 FF_MT_THS_2 Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
DBCNTM
THS6
THS5
THS4
THS3
THS2
THS1
THS0
0x2A: FF_MT_COUNT_2 Freefall and Motion Debounce 2 Register
0x2A FF_MT_COUNT_2 Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
D7
D6
D5
D4
D3
D2
D1
D0
6.5
Transient Detection Registers
For more information on the uses of the transient function and sample code, refer to application note AN3918.
0x2B: TRANSIENT_CFG Transient Configuration Register
The transient detection mechanism can be configured to raise an interrupt when the magnitude of the high pass filtered data
is greater than a user definable threshold. The TRANSIENT_CFG register is used to enable the transient interrupt generation
mechanism for each of the 3 axes (X, Y, Z) of acceleration.
0x2B TRANSIENT_ CFG Register (Read/Write)
Bit 7
—
Bit 6
—
Bit 5
—
Bit 4
—
Bit 3
ELE
Bit 2
ZTEFE
Bit 1
YTEFE
Bit 0
XTEFE
Table 38. TRANSIENT_ CFG Description
ELE
Transient event flag is latched into the TRANSIENT_SRC register. Reading of the TRANSIENT_SRC register clears the event
flag. Default value: 0
0: event flag latch disabled; 1: Event flag latch enabled
ZTEFE
Event flag enable on Z-axis. Default value: 0
0: Event detection disabled; 1: Event detection Enabled
YTEFE
Event flag enable on Y-axis. Default value: 0
0: Event detection disabled; 1: Event detection Enabled
XTEFE
Event flag enable on X-axis. Default value: 0
0: Event detection disabled; 1: Event detection Enabled
0x2C: TRANSIENT_SRC Transient Source Register
The transient source register is read to determine the source of an interrupt. When the ELE bit is set in Register0x2B the “EA”
event Active bit in the source register is latched. The other bits in the source register are not latched. The source register must
be read immediately following the interrupt to determine the axes the event occurred on.
0x2C TRANSIENT_SRC Register (Read Only)
Bit 7
—
Bit 6
—
Bit 5
—
Bit 4
—
Bit 3
EA
Bit 2
ZTRANSE
Bit 1
YTRANSE
Bit 0
XTRANSE
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Table 39. TRANSIENT_SRC Description
Event Active Flag. Default value: 0
0: No event flag asserted; 1: one or more event flag has been asserted.
EA
ZTRANSE
Z transient event. Default value: 0
0: No Z event detected, 1: Z event detected
YTRANSE
Y transient event. Default value: 0
0: No Y event detected, 1: Y event detected
XTRANSE
X transient event. Default value: 0
0: No X event detected, 1: X event detected
0x2D: TRANSIENT_THS Transient Threshold Register
The TRANSIENT_THS register sets the threshold limit for the high pass filtered acceleration. The value in the
TRANSIENT_THS register corresponds to a g value which is compared against the values of OUT_X_DELTA, OUT_Y_DELTA,
and OUT_Z_DELTA. If the acceleration exceeds the threshold limit an event flag is raised and an interrupt is generated if
interrupts are enabled.
0x2D TRANSIENT_THS Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
DBCNTM
THS6
THS5
THS4
THS3
THS2
THS1
THS0
Table 40. TRANSIENT_THS Description
DBCNTM
Debounce counter mode selection. Default value: 0 0: increments or decrements debounce; 1: increments or clears counter
THS[6:0]
Transient Threshold: default value: 000_0000
The minimum threshold resolution is dependent on the selected acceleration g range and the threshold register has a range
of 0 to 127.
Therefore:
• If the selected acceleration g range is 8g mode (FS = 11), the minimum threshold resolution is 0.063g/LSB. The maximum
is 8g.
• If the selected acceleration g range is 4g mode (FS = 10), the minimum threshold resolution is 0.0315g/LSB. The
maximum is 4g.
• If the selected acceleration g range is 2g mode (FS = 01), the minimum threshold resolution is 0.01575g/LSB. The
maximum is 2g.
• The DBCNTM bit behaves in the same manner described previously for the Motion/Freefall 1.
0x2E: TRANSIENT_COUNT Transient Debounce Register
The TRANSIENT_COUNT sets the minimum number of debounce counts continuously matching the condition where the
unsigned value of OUT_X_DELTA or OUT_Y_DELTA or OUT_Z_DELTA register is greater than the user specified value of
TRANSIENT_THS.
0x2E TRANSIENT_COUNT Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
D7
D6
D5
D4
D3
D2
D1
D0
Table 41. TRANSIENT_COUNT Description
D[7-0]
Count value. Default value: 0000_0000
The time step for the Transient detection debounce counter is set by the value of the system ODR.
Table 42. TRANSIENT_COUNT relationship with the ODR
Output Data Rate (Hz)
Step
Duration Range
400
2.5 ms
2.5 ms – 0.637s
200
5 ms
5 ms – 1.275s
100
10 ms
10 ms – 2.55s
50
20 ms
20 ms – 5.1s
12.5
80 ms
80 ms – 20.4s
1.56
640 ms
640 ms – 163s
An ODR of 100 Hz and a TRANSIENT_COUNT value of 15 would result in a debounce response time of 150 ms.
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6.6
Tap Detection Registers
For more details of how to configure the tap detection and sample code please refer to Freescale application note, AN3919.
The tap detection registers are referred to as “Pulse”.
0x2F: PULSE_CFG Pulse Configuration Register
This register configures the event flag for the tap detection for enabling/disabling the detection of a single and double pulse
on each of the axes.
0x2F PULSE_CFG Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
DPA
ELE
ZDPEFE
ZSPEFE
YDPEFE
YSPEFE
XDPEFE
XSPEFE
Table 43. PULSE_CFG Description
DPA
Double Pulse Abort.
0: Double Pulse detection is not aborted if the start of a pulse is detected during the time period specified by the PULSE_LTCY
register.
1: Setting the DPA bit momentarily suspends the double tap detection if the start of a pulse is detected during the time period
specified by the PULSE_LTCY register and the pulse ends before the end of the time period specified by the PULSE_LTCY
register.
ELE
Pulse event flags are latched into the PULSE_SRC register. Reading of the PULSE_SRC register clears the event flag.
Default value: 0
0: Event flag latch disabled; 1: Event flag latch enabled
ZDPEFE
Event flag enable on double pulse event on Z-axis. Default value: 0
0: Event detection disabled; 1: Event detection enabled
ZSPEFE
Event flag enable on single pulse event on Z-axis. Default value: 0
0: Event detection disabled; 1: Event detection enabled
YDPEFE
Event flag enable on double pulse event on Y-axis. Default value: 0
0: Event detection disabled; 1: Event detection enabled
YSPEFE
Event flag enable on single pulse event on Y-axis. Default value: 0
0: Event detection disabled; 1: Event detection enabled
XDPEFE
Event flag enable on double pulse event on X-axis. Default value: 0
0: Event detection disabled; 1: Event detection enabled
XSPEFE
Event flag enable on single pulse event on X-axis. Default value: 0
0: Event detection disabled; 1: Event detection enabled
0x30: PULSE_SRC Pulse Source Register
This register indicates a double or single pulse event has occurred. The corresponding axis and event must be enabled in
Register 0x2F for the event to be seen in the source register.
0x30 PULSE_SRC Register (Read Only)
Bit 7
—
Bit 6
EA
Bit 5
ZDPE
Bit 4
ZSPE
Bit 3
YDPE
Bit 2
YSPE
Bit 1
XDPE
Bit 0
XSPE
Table 44. TPULSE_SRC Description
EA
Event Active Flag. Default value: 0
0: no event flag has been asserted; 1: one or more events have been asserted
ZDPE
Double pulse on Z-axis event. Default value: 0
0: no event detected; 1: Double Z event detected
ZSPE
Single pulse on Z-axis event. Default value: 0
0: no event detected; 1: Single Z event detected
YDPE
Double pulse on Y-axis event. Default value: 0
0: no event detected; 1: Double Y event detected
YSPE
Single pulse on Y-axis event. Default value: 0
0: no event detected; 1: Single Y event detected
XDPE
Double pulse on X-axis event. Default value: 0
0: no event detected; 1: Double X event detected
XSPE
Single pulse on X-axis event. Default value: 0
0: no event detected; 1: Single X event detected
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0x31 - 0x33: PULSE_THSX, Y, Z Pulse Threshold for X, Y & Z Registers
The pulse threshold can be set separately for the X, Y and Z axes. The threshold values range from 0 to 31 counts with steps
of 0.258g/LSB at a fixed 8g acceleration range, thus the minimum resolution is always fixed at 0.258g/LSB irrespective of the
selected g range.
The PULSE_THSX, PULSE_THSY and PULSE_THSZ registers define the threshold which is used by the system to start the
pulse detection procedure. The threshold value is expressed over 5-bits as an unsigned number.
0x31 PULSE_THSX Register (Read/Write)
Bit 7
0
Bit 6
0
Bit 5
0
Bit 4
THSX4
Bit 3
THSX3
Bit 2
THSX2
Bit 1
THSX1
Bit 0
THSX0
Bit 2
THSY2
Bit 1
THSY1
Bit 0
THSY0
Table 45. PULSE_THSX Description
THSX4, THSX0
Pulse Threshold on X-axis. Default value: 0_0000
0x32 PULSE_THSY Register (Read/Write)
Bit 7
0
Bit 6
0
Bit 5
0
Bit 4
THSY4
Bit 3
THSY3
Table 46. PULSE_THSY Description
THSY4, THSY0
Pulse Threshold on Y-axis. Default value: 0_0000
0x33 PULSE_THSZ Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
THSZ4
THSZ3
THSZ2
THSZ1
THSZ0
Table 47. PULSE_THSZ Description
THSZ4, THSZ0
Pulse Threshold on Z-axis. Default value: 0_0000
0x34: PULSE_TMLT Pulse Time Window 1 Register
0x34 PULSE_TMLT Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Tmlt7
Tmlt6
Tmlt5
Tmlt4
Tmlt3
Tmlt2
Tmlt1
Tmlt0
The bits Tmlt7 through Tmlt0 define the maximum time interval that can elapse between the start of the acceleration on the
selected axis exceeding the specified threshold and the end when the acceleration on the selected axis must go below the
specified threshold to be considered a valid pulse.
The minimum time step for the pulse time limit is defined in Table 48. Maximum time for a given ODR is the minimum time step
at the given power mode multiplied by 255. The time steps available are dependent on whether the device is in Normal Power
mode or in Low Power mode. Notice in the table below that the time step is twice as long in Low Power mode.
Table 48. Time Step for PULSE Time Limit at ODR and Power Mode
Output Data Rate (Hz)
Step at Normal Mode
Step at Low Power Mode
400
0.625 ms
1.25 ms
200
1.25 ms
2.5 ms
100
2.5 ms
5.0 ms
50
5 ms
10 ms
12.5
5 ms
10 ms
1.56
5 ms
10 ms
Therefore an ODR setting of 400 Hz with normal power mode would result in a maximum pulse time limit of (0.625 ms * 255)
≥ 159 ms.
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0x35: PULSE_LTCY Pulse Latency Timer Register
0x35 PULSE_LTCY Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Ltcy7
Ltcy6
Ltcy5
Ltcy4
Ltcy3
Ltcy2
Ltcy1
Ltcy0
The bits Ltcy7 through Ltcy0 define the time interval that starts after the first pulse detection. During this time interval, all pulses
are ignored. Note: This timer must be set for single pulse and for double pulse.
The minimum time step for the pulse latency is defined in Table 49. The maximum time is the time step at the ODR and Power
Mode multiplied by 255. Notice that the time step is twice the duration if the device is operating in Low Power mode, as shown
below.
Table 49. Time Step for PULSE Latency at ODR and Power Mode
Output Data Rate (Hz)
Step at Normal Mode
Step at Low Power Mode
400
1.25 ms
2.5 ms
200
2.5 ms
5.0 ms
100
5.0 ms
20 ms
50
10 ms
20 ms
12.5
10 ms
20 ms
1.56
10 ms
20 ms
0x36: PULSE_WIND Second Pulse Time Window Register
0x36 PULSE_WIND Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Wind7
Wind6
Wind5
Wind4
Wind3
Wind2
Wind1
Wind0
The bits Wind7 through Wind0 define the maximum interval of time that can elapse after the end of the latency interval in which
the start of the second pulse event must be detected provided the device has been configured for double pulse detection. The
detected second pulse width must be shorter than the time limit constraints specified by the PULSE_TMLT register, but the end
of the double pulse need not finish within the time specified by the PULSE_WIND register.
The minimum time step for the pulse window is defined in Table 50. The maximum time is the time step at the ODR and Power
Mode multiplied by 255.
Table 50. Time Step for PULSE Detection Window at ODR and Power Mode
6.7
Output Data Rate (Hz)
Step at Normal Mode
Step at Low Power Mode
400
1.25 ms
2.5 ms
200
2.5 ms
5.0 ms
100
5.0 ms
20 ms
50
10 ms
20 ms
12.5
10 ms
20 ms
1.56
10 ms
20 ms
Auto-Sleep Registers
For additional information on how to configure the device for the Auto-Sleep/Wake feature, refer to AN3921.
0x37: ASLP_COUNT Auto-Sleep Inactivity Timer Register
The ASLP_COUNT register sets the minimum time period of inactivity required to change current ODR value from the value
specified in the DR[2:0] to ASLP_RATE (Reg 0x38) value provided the SLPE bit is set to a logic ‘1’ in the CTRL_REG2 register.
0x37 ASLP_COUNT Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
D7
D6
D5
D4
D3
D2
D1
D0
Table 51. ASLP_COUNT Description
D[7-0]
Duration value. Default value: 0000 0000
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38
D7-D0 defines the minimum duration time to change current ODR value from DR to ASLP_RATE. Time step and maximum
value depend on the ODR chosen (see Table 52).
Table 52. ASLP_COUNT Relationship with ODR
Output Data Rate (ODR)
Duration
Step
400
0 to 81s
320 ms
200
0 to 81s
320 ms
100
0 to 81s
320 ms
50
0 to 81s
320 ms
12.5
0 to 81s
320 ms
1.56
0 to 325.125s
640 ms
In order to wake the device, the desired function or functions must be enabled and set to “Wake From Sleep”. All enabled
functions will still function in sleep mode at the sleep ODR. Only the functions that have been selected for “Wake From Sleep”
will wake the device.
MMA8450Q has 6 functions that can be used to keep the sensor from falling asleep namely, Transient, Orientation, Tap,
Motion/FF1 and Motion/FF2 and the FIFO. One or more of these functions can be enabled. In order to wake the device, functions
are provided namely, Transient, Orientation, Tap, and the two Motion/Freefall. Note that the FIFO does not wake the device. The
Auto-Wake/Sleep interrupt does not affect the wake/sleep, nor does the data ready interrupt. The FIFO gate (bit 7) in Register
0x3A, when set, will hold the last data in the FIFO before transitioning to a different ODR. After the buffer is flushed, it will accept
new sample data at the current ODR. See Register 0x3A for the wake from sleep bits.
If the Auto-Sleep bit is disabled, then the device can only toggle between Standby and Wake Mode by writing to the FS0 and
FS1 bits in Register 0x38 Ctrl Reg1. If Auto-Sleep interrupt is enabled, transitioning from Active mode to Auto-Sleep mode and
vice versa generates an interrupt.
0x38: CTRL_REG1 System Control 1 Register
0x38 CTRL_REG1 Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ASLP_RATE1
ASLP_RATE0
0
DR2
DR1
DR0
FS1
FS0
Table 53. CTRL_REG1 Description
ASLP_RATE [1:0]
This register configures the Auto-Wake sample frequency when the device is in Sleep Mode.
See Table 54 for more information.
DR[2:0]
Data rate selection. Default value: 000
FS[1:0]
Full Scale selection. Default value: 00
(00: Standby mode; 01: active mode ±2g; 10: active mode ±4g; 11: active mode ±8g)
Table 54. Sleep Mode Poll Rate Description
ASLP_RATE1
ASLP_RATE0
Frequency (Hz)
0
0
50
0
1
25
1
0
12.5
1
1
1.56
It is important to note that when the device is in Auto-Sleep mode, the system ODR and the data rate for all the system
functional blocks are overwritten by the data rate set by the ASLP_RATE field in Register 0x38.
DR[2:0] bits select the output data rate (ODR) for acceleration samples. The default value is 000 for a data rate of 400 Hz.
Table 55. System Output Data Rate Selection
DR2
DR1
DR0
Output Data Rate (ODR)
Time Between Data Samples
0
0
0
400 Hz
2.5 ms
0
0
1
200 Hz
5 ms
MMA8450Q
39
Sensors
Freescale Semiconductor
Table 55. System Output Data Rate Selection
0
1
0
100 Hz
10 ms
0
1
1
50 Hz
20 ms
1
0
0
12.5 Hz
80 ms
1
0
1
1.563 Hz
640 ms
FS[1:0] bits select between standby mode and active mode. The default value is 00 for standby mode.
Table 56. Full Scale Selection
FS1
FS0
Mode
g Range
0
0
Standby
—
0
1
Active
±2g
1
0
Active
±4g
1
1
Active
±8g
0x39: CTRL_REG2 System Control 2 Register
0x39 CTRL_REG2 Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ST
BOOT
0
0
0
0
SLPE
MODS
Table 57. CTRL_REG2 Description
ST
BOOT
Self-Test Enable. Default value: 0
0: Self-Test disabled; 1: Self-Test enabled
Reboot device content (Software Reset). Default value: 0
0: device reboot disabled; 1: device reboot enabled.
SLPE(1)
Auto-Sleep enable. Default value: 0
0: Auto-Sleep is not enabled;
1: Auto-Sleep is enabled.
MODS
Low power mode / Normal mode selection. Default value: 0
0: normal mode; 1: low power mode.
1. When SLPE = 1, the transitioning between sleep mode and wake mode results in a FIFO flush and a reset of internal functional block counters. All functional block
status information are preserve except otherwise stated. See Table 58 for more information about the FIFO_GATE bit in CTRL_REG3 register.
ST bit activates the Self-Test function. When ST is set to one, an output change will occur to the device outputs (refer to Table 2
and Table 3) thus allowing host application to check the functionality of the entire signal chain.
BOOT bit is used to activate the software reset. The Boot mechanism can be enabled in STANDBY and ACTIVE mode.
When the Boot bit is enabled the Boot mechanism resets all functional block registers and loads the respective internal
registers with default NVM values.
The system will automatically transition to standby mode if not already in standby mode before the software reset (re-BOOT
process) can occur.
Note: The I2C communication system is reset to avoid accidental corrupted data access.
0x3A: CTRL_REG3 Interrupt Control Register
0x3A CTRL_REG3 Register (Read/Write)
Bit 7
Bit 6
Bit 5
FIFO_GATE
WAKE_TRANS
WAKE_LNDPRT
Bit 4
Bit 3
Bit 2
WAKE_PULSE WAKE_FF_MT_1 WAKE_FF_MT_2
Bit 1
Bit 0
IPOL
PP_OD
MMA8450Q
Sensors
Freescale Semiconductor
40
Table 58. CTRL_REG3 Description
0: FIFO gate is bypassed. FIFO is flushed upon the system mode transitioning from wake-to-sleep mode or from sleep-towake mode.
1: The FIFO input buffer is blocked when transitioning from “wake-to-sleep” mode or from “sleep-to-wake” mode until the
FIFO is flushed. Although the system transitions from “wake-to-sleep” or from “sleep-to-wake” the contents of the FIFO
buffer are preserved, new data samples are ignored until the FIFO is emptied by the host application.
If the FIFO_GATE bit is set to logic 1 and the FIFO buffer is not emptied before the arrival of the next sample, then the
FGERR bit in the SYS_MOD register (0x14) will be asserted. The FGERR bit remains asserted as long as the FIFO buffer
remains un-emptied.
Emptying the FIFO buffer clears the FGERR bit in the SYS_MOD register.
FIFO_GATE
WAKE_TRANS
WAKE_LNDPRT
WAKE_PULSE
0: Transient function is bypassed in sleep mode
1: Transient function interrupt can wake up system
0: Orientation function is bypassed in sleep mode
1: Orientation function interrupt can wake up system
0: Pulse function is bypassed in sleep mode
1: Pulse function interrupt can wake up system
WAKE_FF_MT_1
0: Freefall/Motion1 function is bypassed in sleep mode
1: Freefall/Motion1 function interrupt can wake up
WAKE_FF_MT_2
0: Freefall/Motion2 function is bypassed in sleep mode
1: Freefall/Motion2 function interrupt can wake up system
IPOL
Interrupt polarity active high, or active low. Default value 0.
0: active low; 1: active high
PP_OD
Push-pull/Open Drain selection on interrupt pad. Default value 0.
0: push-pull; 1: open drain
IPOL bit selects the polarity of the interrupt signal. When IPOL is ‘0’ any interrupt event will signalled with a logical 0.
PP_OD bit configures the interrupt pin to Push-Pull or in Open Drain mode. The open drain configuration can be used for
connecting multiple interrupt signals on the same interrupt line.
0x3C: CTRL_REG5 Register (Read/Write)
0x3C CTRL_REG5 Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
INT_EN_ASLP
INT_EN_FIFO
INT_EN_TRANS
INT_EN_LNDPRT
INT_EN_PULSE
INT_EN_FF_MT_1
INT_EN_FF_MT_2
INT_EN_DRDY
Table 59. interrupt Enable Register Description
Interrupt Enable
Description
INT_EN_ASLP
Interrupt Enable. Default value: 0
0: Auto-Sleep/Wake interrupt disabled; 1: Auto-Sleep/Wake interrupt enabled.
INT_EN_FIFO
Interrupt Enable. Default value: 0
0: FIFO interrupt disabled; 1: FIFO interrupt enabled.
INT_EN_TRANS
INT_EN_LNDPRT
Interrupt Enable. Default value: 0
0: Transient interrupt disabled; 1: Transient interrupt enabled.
Interrupt Enable. Default value: 0
0: Orientation (Landscape/Portrait) interrupt disabled.
1: Orientation (Landscape/Portrait) interrupt enabled.
INT_EN_PULSE
Interrupt Enable. Default value: 0
0: Pulse Detection interrupt disabled; 1: Pulse Detection interrupt enabled
INT_EN_FF_MT_1
Interrupt Enable. Default value: 0
0: Freefall/Motion1 interrupt disabled; 1: Freefall/Motion1 interrupt enabled
INT_EN_FF_MT_2
Interrupt Enable. Default value: 0
0: Freefall/Motion2 interrupt disabled; 1: Freefall/Motion2 interrupt enabled
INT_EN_DRDY
Interrupt Enable. Default value: 0
0: Data Ready interrupt disabled; 1: Data Ready interrupt enabled
MMA8450Q
41
Sensors
Freescale Semiconductor
The corresponding functional block interrupt enable bit allows the functional block to route its event detection flags to the
system’s interrupt controller. The interrupt controller routes the enabled functional block interrupt to the INT1 or INT2 pin.
0x3C: CTRL_REG5 Interrupt Configuration Register
0x3C CTRL_REG5 Register (Read/Write)
Bit 7
Bit 6
INT_CFG_ASLP
INT_CFG_FIFO
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
INT_CFG_TRANS INT_CFG_LNDPRT INT_CFG_PULSE INT_CFG_FF_MT_1INT_CFG_FF_MT_2 INT_CFG_DRDY
Table 60. Interrupt Configuration Register Description
Interrupt Configuration
INT_CFG_ASLP
INT_CFG_FIFO
INT_CFG_TRANS
INT_CFG_LNDPRT
INT_CFG_PULSE
INT_CFG_FF_MT_1
INT_CFG_FF_MT_2
INT_CFG_DRDY
Description
INT1/INT2 Configuration. Default value: 0
0: Interrupt is routed to INT2 pin; 1: Interrupt is routed to INT1 pin
INT1/INT2 Configuration. Default value: 0
0: Interrupt is routed to INT2 pin; 1: Interrupt is routed to INT1 pin
INT1/INT2 Configuration. Default value: 0
0: Interrupt is routed to INT2 pin; 1: Interrupt is routed to INT1 pin
INT1/INT2 Configuration. Default value: 0
0: Interrupt is routed to INT2 pin; 1: Interrupt is routed to INT1 pin
INT1/INT2 Configuration. Default value: 0
0: Interrupt is routed to INT2 pin; 1: Interrupt is routed to INT1 pin
INT1/INT2 Configuration. Default value: 0
0: Interrupt is routed to INT2 pin; 1: Interrupt is routed to INT1 pin
INT1/INT2 Configuration. Default value: 0
0: Interrupt is routed to INT2 pin; 1: Interrupt is routed to INT1 pin
INT1/INT2 Configuration. Default value: 0
0: Interrupt is routed to INT2 pin; 1: Interrupt is routed to INT1 pin
The system’s interrupt controller shown in Figure 10 uses the corresponding bit field in the CTRL_REG5 register to determine
the routing table for the INT1 and INT2 interrupt pins. If the bit value is logic ‘0’ the functional block’s interrupt is routed to INT2,
and if the bit value is logic ‘1’ then the interrupt is routed to INT1. One or more functions can assert an interrupt pin; therefore a
host application responding to an interrupt should read the INT_SOURCE (0x15) register to determine the appropriate sources
of the interrupt.
6.8
User Offset Correction Registers
For more information on how to calibrate the 0g Offset refer to AN3916 Offset Calibration Using the MMA8450Q. The 2’s
complement offset correction registers values are used to realign the zero g position of the X, Y, and Z-axis after device board
mount. The resolution of the offset registers is 3.906 mg per LSB. The 2’s complement 8-bit value would result in an offset
compensation range ±0.5g.
0x3D: OFF_X Offset Correction X Register
0x3D OFF_X Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
D7
D6
D5
D4
D3
D2
D1
D0
Table 61. OFF_X Description
D7-D0
X -axis offset trim LSB value. Default value: 0000_0000.
0x3E: OFF_Y Offset Correction Y Register
0x3E OFF_Y Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
D7
D6
D5
D4
D3
D2
D1
D0
Table 62. OFF_Y Description
D7-D0
Y-axis offset trim LSB value. Default value: 0000_0000.
0x3F: OFF_Z Offset Correction Z Register
0x3F OFF_Z Register (Read/Write)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
D7
D6
D5
D4
D3
D2
D1
D0
Table 63. OFF_Z Description
D7-D0
Z-axis offset trim LSB value. Default value: 0000_0000.
MMA8450Q
Sensors
Freescale Semiconductor
42
Appendix A
Table 64. MMA8450Q Register Map
Reg
Name
Definition
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
00
STATUS
Data Status R
ZYXOW
ZOW
YOW
XOW
ZYXDR
ZDR
YDR
XDR
01
OUT_X_MSB
8-bit X Data R
XD11
XD10
XD9
XD8
XD7
XD6
XD5
XD4
02
OUT_Y_MSB
8-bit Y Data R
YD11
YD10
YD9
YD8
YD7
YD6
YD5
YD4
03
OUT_Z_MSB
8-bit Z Data R
ZD11
ZD10
ZD9
ZD8
ZD7
ZD6
ZD5
ZD4
04
STATUS
Data Status R
ZYXOW
ZOW
YOW
XOW
ZYXDR
ZDR
YDR
XDR
05
OUT_X_LSB
12-bit X Data R
0
0
0
0
XD3
XD2
XD1
XD0
06
OUT_X_MSB
12-bit X Data R
XD11
XD10
XD9
XD8
XD7
XD6
XD5
XD4
07
OUT_Y_LSB
12-bit Y Data R
0
0
0
0
YD3
YD2
YD1
YD0
08
OUT_Y_MSB
12-bit Y Data R
YD11
YD10
YD9
YD8
YD7
YD6
YD5
YD4
09
OUT_Z_LSB
12-bit Z Data R
0
0
0
0
ZD3
ZD2
ZD1
ZD0
0A
OUT_Z_MSB
12-bit Z Data R
ZD11
ZD10
ZD9
ZD8
ZD7
ZD6
ZD5
ZD4
0B
STATUS
Data Status R
ZYXOW
ZOW
YOW
XOW
ZYXDR
ZDR
YDR
XDR
0C
OUT_X_DELTA
8-bit Transient X Data R
XD7
XD6
XD5
XD4
XD3
XD2
XD1
XD0
0D
OUT_Y_DELTA
8-bit Transient Y Data R
YD7
YD6
YD5
YD4
YD3
YD2
YD1
YD0
0E
OUT_Z_DELTA
8-bit Transient Z Data R
ZD7
ZD6
ZD5
ZD4
ZD3
ZD2
ZD1
ZD0
0F
WHO_AM_I
ID Register R
—
—
—
—
—
—
—
—
10
F_STATUS
FIFO Status R
F_OVF
F_WMRK_FLAG
F_CNT5
F_CNT4
F_CNT3
F_CNT2
F_CNT1
F_CNT0
11
F_8DATA
8-bit FIFO Data R
XD11
XD10
XD9
XD8
XD7
XD6
XD5
XD4
12
F_12DATA
12-bit FIFO Data R
0
0
0
0
XD3
XD2
XD1
XD0
13
F_SETUP
FIFO Setup R/W
F_MODE1
F_MODE0
F_WMRK5
F_WMRK4
F_WMRK3
F_WMRK2
F_WMRK1
F_WMRK0
14
SYSMOD
System Mode R
PERR
FGERR
0
0
0
0
SYSMOD1
SYSMOD0
15
INT_SOURCE
Interrupt Status R
SRC_ASLP
SRC_FIFO
SRC_TRANS
SRC_LNDPRT
SRC_PULSE
SRC_FF_MT_1
SRC_FF_MT_2
SRC_DRDY
16
XYZ_DATA_CFG
Data Config. R/W
FDE
0
0
0
—
ZDEFE
YDEFE
XDEFE
17
HP_FILTER_CUTOFF
HP Filter Setting R/W
0
0
0
0
0
0
SEL1
SEL0
18
PL_STATUS
PL Status R
NEWLP
LO
-
LAPO[2]
LAPO[1]
LAPO[0]
BAFRO[1]
BAFRO[0]
19
PL_PRE_STATUS
Previous PL Status R
-
LO
-
LAPO[2]
LAPO[1]
LAPO[0]
BAFRO[1]
BAFRO[0]
1A
PL_CFG
PL Configuration R/W
DBCNTM
PL_EN
-
-
-
GOFF[2]
GOFF[1]
GOFF[0]
1B
PL_COUNT
PL Debounce R/W
DBNCE[7]
DBNCE[6]
DBNCE[5]
DBNCE[4]
DBNCE[3]
DBNCE [2]
DBNCE [1]
DBNCE [0]
1C
PL_BF_ZCOMP
PL Back/Front and Z
Compensation R/W
BKFR[1]
BKFR[0]
-
-
-
ZLOCK[2]
ZLOCK[1]
ZLOCK[0]
1D
PL_P_L_THS_REG1
Portrait-to-Landscape
Threshold Setting 1 R/W
P_L_THS[7]
P_L_THS[6]
P_L_THS[5]
P_L_THS[4]
P_L_THS[3]
P_L_THS[2]
P_L_THS[1]
P_L_THS[0]
1E
PL_P_L_THS_REG2
Portrait-to-Landscape
Threshold Setting 2 R/W
P_L_THS[7]
P_L_THS[6]
P_L_THS[5]
P_L_THS[4]
P_L_THS[3]
P_L_THS[2]
P_L_THS[1]
P_L_THS[0]
1F
PL_P_L_THS_REG3
Portrait-to-Landscape
Threshold Setting 3 R/W
P_L_THS[7]
P_L_THS[6]
P_L_THS[5]
P_L_THS[4]
P_L_THS[3]
P_L_THS[2]
P_L_THS[1]
P_L_THS[0]
20
PL_L_P_THS_REG1
Landscape-to-Portrait
Threshold Setting 1 R/W
L_P_THS[7]
L_P_THS[6]
L_P_THS[5]
L_P_THS[4]
L_P_THS[3]
L_P_THS[2]
L_P_THS[1]
L_P_THS[0]
21
PL_L_P_THS_REG2
Landscape-to-Portrait
Threshold Setting21 R/W
L_P_THS[7]
L_P_THS[6]
L_P_THS[5]
L_P_THS[4]
L_P_THS[3]
L_P_THS[2]
L_P_THS[1]
L_P_THS[0]
22
PL_L_P_THS_REG3
Landscape-to-Portrait
Threshold Setting 3 R/W
L_P_THS[7]
L_P_THS[6]
L_P_THS[5]
L_P_THS[4]
L_P_THS[3]
L_P_THS[2]
L_P_THS[1]
L_P_THS[0]
23
FF_MT_CFG_1
FF/Motion Config.
1 R/W
ELE
OAE
ZHEFE
ZLEFE
YHEFE
YLEFE
XHEFE
XLEFE
24
FF_MT_SRC_1
FF/Motion Source 1 R
—
EA
ZHE
ZLE
YHE
YLE
XHE
XLE
25
FF_MT_THS_1
FF/Motion Threshold 1 R/W
DBCNTM
THS6
THS5
THS4
THS3
THS2
THS1
THS0
26
FF_MT_COUNT_1
FF/Motion Debounce 1 R/W
D7
D6
D5
D4
D3
D2
D1
D0
27
FF_MT_CFG_2
FF/Motion Config. 2 R/W
ELE
OAE
ZHEFE
ZLEFE
YHEFE
YLEFE
XHEFE
XLEFE
28
FF_MT_SRC_2
FF/Motion Source 2 R
—
EA
ZHE
ZLE
YHE
YLE
XHE
XLE
MMA8450Q
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Sensors
Freescale Semiconductor
Table 64. MMA8450Q Register Map
29
FF_MT_THS_2
FF/Motion Threshold 2 R/W
DBCNTM
THS6
THS5
THS4
THS3
THS2
THS1
THS0
2A
FF_MT_COUNT_2
FF/Motion Debounce 2 R/W
D7
D6
D5
D4
D3
D2
D1
D0
2B
TRANSIENT_CFG
Transient Config. R/W
—
—
—
—
ELE
ZTEFE
YTEFE
XTEFE
2C
TRANSIENT_SRC
Transient Source R
—
—
—
—
EA
ZTRANSE
YTRANSE
XTRANSE
2D
TRANSIENT_THS
Transient Threshold R/W
DBCNTM
THS6
THS5
THS4
THS3
THS2
THS1
THS0
2E
TRANSIENT_COUNT
Transient Debounce R/W
D7
D6
D5
D4
D3
D2
D1
D0
2F
PULSE_CFG
Pulse Config. R/W
DPA
ELE
ZDPEFE
ZSPEFE
YDPEFE
YSPEFE
XDPEFE
XSPEFE
30
PULSE_SRC
Pulse Source R
—
EA
ZDPE
ZSPE
YDPE
YSPE
XDPE
XSPE
31
PULSE_THSX
Pulse X Threshold R/W
0
0
0
THSX4
THSX3
THSX2
THSX1
THSX0
32
PULSE_THSY
Pulse Y Threshold R/W
0
0
0
THSY4
THSY3
THSY2
THSY1
THSY0
33
PULSE_THSZ
Pulse Z Threshold R/W
0
0
0
THSZ4
THSZ3
THSZ2
THSZ1
THSZ0
34
PULSE_TMLT
Pulse First Timer R/W
Tmlt7
Tmlt6
Tmlt5
Tmlt4
Tmlt3
Tmlt2
Tmlt1
Tmlt0
35
PULSE_LTCY
Pulse Latency R/W
Ltcy7
Ltcy6
Ltcy5
Ltcy4
Ltcy3
Ltcy2
Ltcy1
Ltcy0
36
PULSE_WIND
Pulse 2nd Window R/W
Wind7
Wind6
Wind5
Wind4
Wind3
Wind2
Wind1
Wind0
37
ASLP_COUNT
Auto-Sleep Counter R/W
D7
D6
D5
D4
D3
D2
D1
D0
38
CTRL_REG1
Control Reg 1 R/W
ASLP_RATE1
ASLP_RATE0
0
DR2
DR1
DR0
FS1
FS0
39
CTRL_REG2
Control Reg 2 R/W
ST
RST
0
0
0
0
SLPE
MODS
3A
CTRL_REG3
Control Reg3 R/W (Wake
Interrupts from Sleep)
FIFO_GATE
WAKE_TRANS
WAKE_LNDPRT
WAKE_PULSE
WAKE_FF_MT_1
WAKE_FF_MT_2
IPOL
PP_OD
3B
CTRL_REG4
Control Reg4 R/W (Interrupt
Enable Map)
INT_EN_ASLP
INT_EN_FIFO
INT_EN_TRANS
INT_EN_LNDPRT
INT_EN_PULSE
INT_EN_FF_MT_1
INT_EN_FF_MT_2
INT_EN_DRDY
3C
CTRL_REG5
Control reg5 R/W
(Interrupt Configuration)
INT_CFG_ASLP INT_CFG_FIFO INT_CFG_TRANS INT_CFG_LNDPRT
INT_CFG_PULSE
INT_CFG_FF_MT_1 INT_CFG_FF_MT_2 INT_CFG_DRDY
3D
OFF_X
X 8-bit offset
D7
D6
D5
D4
D3
D2
D1
D0
3E
OFF_Y
Y 8-bit offset
D7
D6
D5
D4
D3
D2
D1
D0
3F
OFF_Z
Z 8-bit offset
D7
D6
D5
D4
D3
D2
D1
D0
MMA8450Q
Sensors
Freescale Semiconductor
44
Table 65. Accelerometer Output Data
12-bit Data
Range ±2g
Range ±4g
Range ±8g
0111 1111 1111
1.999g
+3.998g
+7.996g
0111 1111 1110
1.998g
+3.996g
+7.992g
—
—
—
—
0000 0000 0001
0.001g
+0.002g
+0.004g
0000 0000 0000
0.000g
0.000g
0.000g
1111 1111 1111
-0.001g
-0.002g
-0.004g
—
—
—
—
1000 0000 0001
-1.999g
-3.998g
-7.996g
1000 0000 0000
-2.000g
-4.000g
-8.000g
8- bit Data
Range ±2g
Range ±4g
Range ±8g
0111 1111
1.984g
+3.968g
+7.936g
0111 1110
1.968g
+3.936g
+7.872g
—
—
—
—
0000 0001
+0.016g
+0.032g
+0.064g
0000 0000
0.000g
0.000g
0.000g
1111 1111
-0.016g
-0.032g
-0.064g
—
—
—
—
1000 0001
-1.984g
-3.968g
-7.936g
1000 0000
-2.000g
-4.000g
-8.000g
MMA8450Q
45
Sensors
Freescale Semiconductor
Appendix B
Figure 13. Distribution of Pre Board Mounted Devices Tested in Sockets (1 count = 3.9 mg)
MMA8450Q
Sensors
Freescale Semiconductor
46
Figure 14. Distribution of Post Board Mounted Devices (1 count = 3.9 mg)
MMA8450Q
47
Sensors
Freescale Semiconductor
Figure 15. 8g X-axis TCS
MMA8450Q
Sensors
Freescale Semiconductor
48
Figure 16. 8g Y-axis TCS
MMA8450Q
49
Sensors
Freescale Semiconductor
Figure 17. 8g Z-axis TCS
MMA8450Q
Sensors
Freescale Semiconductor
50
Figure 18. 8g X-axis TCO (mg/°C)
MMA8450Q
51
Sensors
Freescale Semiconductor
Figure 19. 8g Y-axis TCO (mg/°C)
MMA8450Q
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Freescale Semiconductor
52
Figure 20. 8g Z-axis TCO (mg/°C)
MMA8450Q
53
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 2077-01
ISSUE O
16-LEAD QFN
MMA8450Q
Sensors
Freescale Semiconductor
54
PACKAGE DIMENSIONS
CASE 2077-01
ISSUE O
16-LEAD Q
MMA8450Q
55
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 2077-01
ISSUE O
16-LEAD Q
MMA8450Q
Sensors
Freescale Semiconductor
56
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MMA8450Q
Rev. 2
03/2010