LIGITEK LRGB9853-T Axial type led lamp Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
AXIAL TYPE LED LAMPS
Pb
Lead-Free Parts
LRGB9853/T
DATA SHEET
DOC. NO :
QW0905-LRGB9853/T
REV.
: A
DATE
: 24 - Jan. - 2007
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/8
PART NO. LRGB9853/T
Package Dimensions
9.2
1.6
8.22
1.9
5.5MIN
3
0.25
0.6
1
2.6
2
2.42
4
3
R
2.6
1
G
2
B
4
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
100% 75% 50%
60°
25%
0
25% 50% 75% 100%
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PART NO. LRGB9853/T
Page 2/8
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
UR
DGM
DBK
Forward Current
IF
40
30
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
120
100
100
mA
Power Dissipation
PD
120
120
120
mW
Electrostatic Discharge
ESD
----
150
V
Reverse Current @5V
Ir
10
50
μA
Operating Temperature
Topr
-20 ~ +80
℃
Storage Temperature
Tstg
-30 ~ +100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
Forward
voltage
@5mA(V)
Luminous Viewing
intensity
angle
@5mA(mcd) 2θ 1/2
(deg)
Min. Typ. Max. Min. Typ.
Lens
660
----
20
1.5 ---- 2.0
80
125
130
InGaN/GaN Green Water Clear
518
525
36
---- 3.0 3.5
80
170
130
InGaN/GaN Blue
----
470
30
---- 3.0 3.5
32
60
130
GaAlAs
LRGB9853/T
Peak Dominant Spectral
wave halfwidth
wave
length △λnm
length
λPnm λDnm
Red
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ± 15% testing tolerance.
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PART NO. LRGB9853/T
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Typical Electro-Optical Characteristics Curve
UR CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1
01
2.5
2.0
1.5
1.0
0.5
0.0
2.0
1.0
3.0
4.0
5.0
1
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
1.2
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
Relative Intensity@20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
650
700
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
600
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
750
100
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PART NO. LRGB9853/T
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Typical Electro-Optical Characteristics Curve
DGM CHIP
Fig.2 Relative Intensity vs. Forward Current
Fig.1 Forward current vs. Forward Voltage
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
1.0
3.0
2.0
4.0
5.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
450
500
550
Wavelength (nm)
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
100
600
100
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PART NO. LRGB9853/T
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Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1
01
2.5
2.0
1.5
1.0
0.5
0.0
2.0
1.0
3.0
4.0
1
5.0
10
1.2
1.1
1.0
0.9
0.8
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
400
450
500
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
-20
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
550
100
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PART NO. LRGB9853/T
Page 6/8
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 280℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245± 5℃ within 5 sec
Preheat
120 ~ 150 ℃
120 ~ 180 sec
3. LEAD Reflow Solder
Temp.
(℃)
240
Rising
+5℃/sec
Cooling
-5℃/sec
Preheat
150
120
Time
5sec
60 ~ 120 sec
4. PB-Free Reflow Solder
1~5°C/sec
Preheat
180~200 ° C
1~5° C/sec
260°C MaX.
10sec.Max
Above 220 ° C
60 sec.Max.
120 sec.Max.
Note: 1.Wave solder and reflow soldering should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
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PART NO. LRGB9853/T
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Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH<60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%,
they should be treated at 60 ℃± 5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
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PART NO. LRGB9853/T
Page 8/8
Reliability Test:
Classification
Test Item
Test Condition
Reference
Standard
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.IR-Reflow In-Board, 2 Times
2.Ta=65 ℃±5 ℃
3.RH=90 %~95%
4.t=1000hrs ±2hrs
MIL-STD-202F:103B
JIS C 7021: B-11
Endurance
Test
1.IR-Reflow In-Board,2 times
2.Ta=105 ℃±5℃ &
-40 ℃±5℃
(10min) (10min)
3.total 10 cycles
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell Time= 10 ±1sec.
MIL-STD-202F: 210A
MIL-STD-750D: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=235 ℃±5℃
2.Immersion time 2 ±0.5sec
3.Immersion rate 25 ±2.5mm/sec
4.Immersion rate 25 ±2.5mm/sec
5.Coverage ≧ 95% of the dipped surface
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
JIS C 7021: A-2
1.105 ℃ ~ 25℃ ~ 55℃ ~ 25℃
30mins 5mins 30mins 5mins
2.10 Cyeles
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
Ramp-up rate(183 ℃ to Peak) +3 ℃ second max
Temp. maintain at 125( ±25)℃ 120 seconds max
Temp. maintain above 183 ℃ 60-150 seconds
Peak temperature range 235 ℃+5-0 ℃
Time within 5 ℃ of actual Peak Temperature(tp)
10-30 seconds
Ramp-down rate +6 ℃/second max
MIL-STD-750D:2031.2
J-STD-020
Thermal Shock Test
Environmental
Test
Temperature
Cycling
Solderability Test
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