HSDL - 9100 Surface-Mount Proximity Sensor Data Sheet Description Features The HSDL-9100 is an analog-output reflective sensor with an integrated high efficiency infrared emitter and photodiode housed in a small form factor SMD package. The optical proximity sensor is housed in a specially designed metal-shield to ensure excellent optical isolation resulting in low optical cross-talk. x Excellent optical isolation resulting in near zero optical cross-talk HSDL-9100 has an option for 2.7 or 2.4mm height parts with its small form SMD package and at a detection range from near zero to 60mm. It is specifically optimized for size, performance and ease of design in mobile constrained applications such as mobile phones and notebooks. HSDL-9100 has extremely low dark current and high signal to noise ratio (SNR) where high SNR is achieved with a pair of highly efficient infrared emitter and highly sensitive detector. x High efficiency emitter and high sensitivity photodiode for high signal-to-noise ratio x Low cost & lead-free miniature surface-mount package Height – 2.40 or 2.70 mm Width – 2.75 mm Length – 7.10 mm x Can be paired up with signal conditioning IC (APDS-9700) x Detect objects from near zero to 60mm x Low dark current x Guaranteed Temperature Performance -40°C to 85°C x Lead-free and RoHS Compliant Application Support Information The Application Engineering Group is available to assist you with the application design associated with HSDL-9100 Proximity Sensor. You can contact them through your local sales representatives for additional details. Applications x Mobile phones x Notebooks x Industrial Control x Printers, Photocopiers and Facsimile machines x Home Appliances x Vending Machines Order Information Part Number Description Packaging Type Package Quantity HSDL-9100-021 2.7mm Height Tape & Reel SMD 2500 HSDL-9100-024 2.4mm Height Tape & Reel SMD 2500 Block Layout Pins Configuration Table Photodiode LED 1 LED_A 4 DET_K 2 LED_K 3 DET_A Pin Symbol Description Notes 1 LED_A LED Anode 1 2 LED_K LED Cathode - 3 DET_A Photodiode Anode - 4 DET_K Photodiode Cathode - TOP VIEW Notes: Voltage to supply across the LED; VLED Figure 1. Block Layout of HSDL-9100 Absolute Maximum Ratings (Ta=25°C) Ratings Parameter Emitter Continuous Forward Current Coupled Total Power Dissipation (refer to Figure 1) Operating Temperature Storage Temperature Reflow Soldering Temperature Symbol Min. Max Units IDC - 100 mA PTOT TOP TSTG TSOL -40 -40 - 165 +85 +100 260 mW °C °C °C Electrical-Optical Characteristics (Ta=25°C) Ratings Parameter Symbol Test Condition Min Typ Max Units VF VR lp Dp IF = 100mA IR = 10PA IF = 20mA IF = 20mA 5 - 1.50 940 50 1.65 - V V nm nm Detector Dark Current Forward Voltage Reverse Breakdown Voltage IDark VF VBR VR = 10V, L** = 0 IF = 10mA , L=0 IR = 100uA, L = 0 0.5 - 2 - 10 1.3 35 nA V V Coupled Output Current Peak Output Distance Operating Cross Talk Current Rise Time (LED) Fall Time (LED) Rise Time (Photodiode) Fall Time (Photodiode) IO DO IFD TRL TFL TRD TFD Refer to Fig 2 Refer Note 1 Refer to Fig 3 RL = 50: RL = 50: RL = 5.1K: RL = 5.1K: - 10 5 50 50 6 6 200 - PA mm nA ns ns Ps Ps Emitter Forward Voltage Reverse Voltage Peak Wavelength Spectrum Width of Half Value ** L = 0 (zero light condition) Note: 1. ILed = 300mA Pulse, 5% Duty Cycle (Kodak 18% Reflectance Gray Card) 2 Output Current Test Condition (Ta=25°C) Dark Current Test Condition (Ta=25°C) LIGHT SEALED DARK BOX D KODAK GRAY CARD 18% REFLECTION PHOTODIODE LED PHOTODIODE LED IF IO IF IDARK Figure 2. Test Condition used are D = 5mm 18% Gray Card, ILED = 300mA Pulse, 5% Duty Cycle Figure 3. Test Condition used are ILED = 300mA Pulse, 5% Duty Cycle Response Time Test Condition (Ta=25°C) 5mm KODAK GRAY CARD 18% REFLECTION INPUT LED PHOTODIODE 90% IF IO R LED PULSE GENERATOR RL OUTPUT 10% SCOPE TR TF Figure 4. Response Time Test Condition Typical Radiation Profile for HSDL-9100 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angle (degree) 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 3 Normalized Responsivity HSDL-9100 Typical Photodiode Angular Responsivity Profile Normalized radiant intensity HSDL-9100 Typical LED Angular Emitting Profile Angle (degree) Typical Characteristics Power Dissipation Vs Temperature 200 90 180 80 160 70 140 60 120 Power (mW) Forward Current LED Forward Current Vs Temperature 100 50 40 100 80 30 60 20 40 10 20 0 0 0 10 20 30 40 50 60 70 80 0 90 10 20 30 Temperature (˚C) LED Forward Current Vs Forward Voltage @ Across Temperature 60 70 80 90 (Photodiode) Forward Current Vs Forward Voltage@Across Temp E-3 0.12 .0 20 25 -25 85 0.1 25 -25 85 1 -3 .0E 0 10 0.08 Forward Current (A) Forward Current (A) 40 50 Temperature (˚C) 0.06 0.04 -3 .0E 80 -3 .0E 60 -3 .0E 40 0.02 -3 .0E 20 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 +0 .0E 1.6 0 00 Forward Voltage (V) 0 Forward Current (A) Vs Temperature (degC) @Vcc=1V and 1.3V 0.1 +3 0.09 0.08 0.06 1V 0.05 1.3V 0.04 0.03 0.02 0.01 0 -40 -20 0 20 40 Temperature (˚C) 4 60 80 100 Response Time (us) Forward Current (A) 0.07 E 1.0 0 + .0 0E 0 90 E+ 0.0 80 E+0 0.0 70 E+0 0.0 60 E+0 0.0 50 E+0 0.0 40 E+0 0.0 30 E+0 0.0 20 E+0 0.0 10 E+0 0.1 0.0 00 0.2 0.4 0.6 0.8 1 Forward Voltage (V) 1.2 1.4 1.6 (Photodiode) Rise/Fall Time Vs Load Resistance@Room Temp, ILED=300mA Pulse (Rise (Fall) Mean (Fall) 1 10 100 Load Resistance (kohm) 1000 10000 Output Voltage vs Distance @ Room Temp and RL = 100K Ohm ILED = 100mA, 200mA and 300mA Pulse 1.0 E-6 (Photodiode) Dark Current Vdet = 3/6/9V vs Across Temperature 3 E+ 1.0 3V 300mA 200mA 100mA 6V 1.0 E-9 Dark Current (A) 10 10 0.0 .0E E-9 -9 Output Voltage (mV) 9V 0 E+ 0.0 10 90 +0 .0E 10 0 -40 -20 0 20 40 60 80 100 E+ 1.0 2 3 Temperature (˚C) 3mm 4mm 5mm 900 Output Voltage (mV) 800 10 20 30 40 50 60 80 100 120 300 400 450 Distance (mm) The diagram below illustrates the explanation of edge distance. Edge detection is labeled as D in the diagram below. Output Voltage Vs Edge Distance @ Room Temp and RL=100K Ohm ILED=300mA, D=3/4/5mm 1000 5 700 600 500 400 300 18% Reflection Gray Card 200 100 0 -10 -8 -6 -4 -2 0 Edge Distance (mm) 2 4 6 Distance = D(mm) LED Distance = -D(mm) PIN 5mm 5 HSDL-9100 Package Outlines 3.88 2.75 2.35 1.375 R0 R1 .9 0 Mounting Centre 2.48 3.55 Tx 0.10 Rx 0.10 0.8 2.7 6.9 0.05 0.05 7.10 0.625 2.35 3 1 4 Pin 1 - LED Anode Pin 2 - LED Cathode Pin 3 - Photodiode Anode Pin 4 - Photodiode Cathode 0.6 1.1 2.35 2 2 Photodiode direction mark Figure 5a. HSDL-9100-021 Package dimensions 3.88 2.75 2.35 1.375 R1 R0 .9 Mounting Centre 2.48 Rx 3.55 Tx 0.1 0.1 0.8 2.4 6.9 0.05 0.05 2.35 0.625 7.10 3 1 4 Photodiode direction mark Figure 5b. HSDL-9100-024 Package dimensions 6 2 0.6 1.1 2.35 2 Pin 1 - LED Anode Pin 2 - LED Cathode Pin 3 - Photodiode Anode Pin 4 - Photodiode Cathode 1.55±0.05 1.75 Rx Anode Tx Cathode 2±0.1 4±0.1 B 7.5 Rx Cathode Tx Anode 1.5 2.78±0.07 16 7.35±0.1 B-B Section 0.35 5˚ (MAX) HSDL-9100-021/024 Tape and Reel Dimensions 8±0.1 A A 2.95±0.1 B PROGRESSIVE DIRECTION UNIT: MM EMPTY PARTS MOUNTED LEADER (400 mm MIN.) (40 mm MIN.) EMPTY (40 mm MIN.) OPTION # "B" "C" QUANTITY 001 178 60 500 021 330 80 2500 UNIT: mm DETAIL A 2.0 ± 0.5 B C 16.4 +2 0 13.0 ± 0.5 R 1.0 LABEL 21 ± 0.8 DETAIL A 2.0 ± 0.5 Figure 6. Tape and Reel Dimensions 7 HSDL-9100 Moisture Proof Packaging Baking Conditions Chart All HSDL-9100 options are shipped in moisture proof package. Once opened, moisture absorption begins. Units in A Sealed Moisture-Proof Package This part is compliant to JEDEC Level 3. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package Temp Time In reels 60 °C t 48hours 100 °C t4hours 125 °C t 2 hours In bulk Package Is Opened (Unsealed) Environment less than 30 deg C, and less than 60% RH Baking should only be done once. Yes Recommended Storage Conditions Storage Temperature 10°C to 30°C Relative Humidity below 60% RH No Baking Is Necessary Yes Time from unsealing to soldering No After removal from the bag, the parts should be soldered within seven days if stored at the recommended storage conditions. No Perform Recommended Baking Conditions Figure 7. Baking conditions chart 8 Package Is Opened less Than 168 hours Recommended Reflow Profile MAX 260°C T - TEMPERATURE (°C) 255 R3 230 217 200 180 150 120 R2 R4 60 sec to 120 sec Above 217°C R5 R1 80 25 0 50 P1 HEAT UP Process Zone 100 150 P2 SOLDER PASTE DRY Symbol 200 P3 SOLDER REFLOW 'T 250 300 t-TIME (SECONDS) P4 COOL DOWN Maximum 'T/'time or Duration Heat Up P1, R1 25°C to 150°C 3°C/s Solder Paste Dry P2, R2 150°C to 200°C 100s to 180s Solder Reflow P3, R3 P3, R4 200°C to 260°C 260°C to 200°C 3°C/s -6°C/s Cool Down P4, R5 200°C to 25°C -6°C/s > 217°C 60s to 120s Time maintained above liquidus point , 217°C Peak Temperature Time within 5°C of actual Peak Temperature Time 25°C to Peak Temperature The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different 'T/'time temperature change rates or duration. The 'T/'time rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and component pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and component pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder. 260°C - > 255°C 20s to 40s 25°C to 260°C 8mins Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 260°C (500°F) for optimum results. The dwell time above the liquidus point of solder should be between 60 and 120 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and component pins to change dimensions evenly, putting minimal stresses on the component. It is recommended to perform reflow soldering no more than twice. 9 Appendix A: HSDL-9100 SMT Assembly Application Note Recommended Metal solder Stencil Aperture Table 1. Combinations of metal stencil aperture and metal stencil thickness 0.6 2.75 0.5 0.6 7.7 7.1 0.6 It is recommended that only a 0.152 mm (0.006 inch) or a 0.127 mm (0.005 inch) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. See Table 1 below the drawing for combinations of metal stencil aperture and metal stencil thickness that should be used. Aperture opening for shield pad is 3.05 mm x 1.1 mm as per land pattern. 0.525 Recommended land pattern 2.1 2.4 Solder / stencil opening for each pad is 2.4mm x0.6mm Figure 10. Land Pattern Stencil Aperture size (mm) thickness, t (mm) Length, l Width, w 0.152 1.60+/-0.05 0.55+/-0.05 0.127 1.92 0.55+/-0.05 Apertures as per Land Dimensions t l w Adjacent Land Keep out and Solder Mask Areas Adjacent land keep out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2mm.It is recommended that two fiducial crosses be placed at mid length of the pads for unit alignment. Also do take note that there should not be any electrical routing with the component placement compartment. Figure 11. Solder stencil aperture k Component placement j h Note: Wet/Liquid Photo-imaginable solder resist/mask is recommended Mounting Center Solder Mask Solder Pad, Mask and Metal Stencil l Metal stencil for solder paste printing Stencil Aperture Land Pattern Dim. mm h 4.15 l 11 k 5.5 j 3.5 Figure 12. Keep-out area Solder Mask PCBA Figure 9. Stencil and PCBA 10 Appendix B: General Application Guide for the HSDL-9100 Description Interface to the Recommended I/O chip The Proximity sensor has several possible applications for multimedia product, Automation, and Personal handled. The proximity sensor is basically made up of the emitter (infrared LED) and detector (photodiode). The block diagram of the sensor is shown in Figure 13. The emitter will emit IR light pulse. This light travels out in the field of view and will either hit an object or continue. No light will be reflected when no object is detected. On the other hand, the detector will detect the reflected IR light when it hits the object. The HSDL-9100 is general interface with the GPIO pin of the controller chipset. The LED_A, pin1 is connected to the PWM port alternatively the external timer circuitry can be used to drive the LED. The DET_K, pin 4 is interface to the signal conditioning before driving the GPIO port. Figure 14 shows the hardware reference design with HSDL-9100. Photodiode 3 4 Photodiode anode Photodiode cathode 2 1 LED anode LED cathode LED Figure 13. Proximity sensor block diagram (refer to Pins Configuration Table) Key Pad STN/TFT LCD Panel LCD Control Touch Panel Peripherial interface A/D IrDA interface Mobile Application chipset Memory Expansion Logic Bus Driver Memory I/F Baseband controller ROM Power Management IR Transceiver GPIO AC97 sound PCM Sound I2S Audio Input PWM Antenna FLASH *IR LED driver SDRAM Signal Conditional * The LED can be driven by the PWM output or the external timer circuitry. Figure 14. Mobile Application Platform 11 HSDL-9100 The next section discusses interfacing configuration with general processor including the recommended signal conditional circuitry. The DET_A pin of HSDL-9100 is connected to the filter circuit then to the comparator before interfacing with the GPIO pin. The filter circuit is implement to provide the ambient light filter. The PWM is pulse to drive the LED_K pin alternative the external timer 555 can also be replaced. The detector distance can be varies with the increase/decrease of the LED current supply. Interfacing circuitry with signal conditional circuitry VCC HSDL-9100 DETK DETA LEDA LEDK PWM VCC 220 Ω VCC 36 KΩ BC848 22 KΩ 220 pf 10 Ω BC846B 24 KΩ GND GND 1 MΩ VCC GND 47 kΩ GPIO 300 Ω controller chipset GND Signal conditioning circuitry Figure 15. HSDL9100 configuration with controller chipset 12 Appendix C: Recommended window and light guide for HSDL-9100 x Using opaque material of light pipes with two holes as light path. The structure need to be carefully designed to minimize the signal loss and crosstalk. (See option 3) Close to the window Material # Light Transmission Haze Refractive Index Lexan 141 88% 1% 1.586 Lexan 920A 85% 1% 1.586 Lexan 940A 85% 1% 1.586 Note: 920A and 940A are more flame retardant than 141. Recommended Dye: Violet #21051 (IR transmissant above 625 nm) For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes AV02-0779EN AV02-2259EN - November 26, 2009 Flat Window (Transmission rate >85%) Recommended Plastic Materials: Photodiode Photodiode Option 3 LED Flat Window (Transmission rate >85%) Recommended Window Material Almost any plastic material will work as a window material. Polycarbonate is recommended. The surface finish of the plastic should be smooth, without any texture. The thickness of the window material is recommended to be less than 0.5mm. An IR filter dye may be used in the window to make it look black to the eye but the total optical loss of the window should be 10% or less for best optical performance. Light loss should be measured at 875nm. The recommended plastic materials for use as a cosmetic window are available for General Electric Plastics. Option 2 Option 1 LED x Using separate pieces of light guide bonded together for emitter and photo sensor respectively. Insert a baffle in between the two light guides. (See option 4) Photodiode Photodiode x Using baffle in between emitter and detector will reduce the crosstalk caused by bottom surface. It is recommended to extend the baffle into the flat window as to reduce the crosstalk caused by top surface too. (See option 2) Flat Window (Transmission rate >85%) x Put the optical sensor close to the window material. (See option 1) LED Flat Window (Transmission rate >85%) LED Some constraints on the design and position of the window are required so that the cross talk from the emitter to the photodiode is minimized. Four recommendations of window design are suggested as below: Option 4