LM70 SPI/MICROWIRE 10-Bit plus Sign Digital Temperature Sensor General Description Features The LM70 is a temperature sensor, Delta-Sigma analog-todigital converter with an SPI and MICROWIRE compatible interface available in LLP and MSOP 8-pin packages. The host can query the LM70 at any time to read temperature. A shutdown mode decreases power consumption to less than 10 µA. This mode is useful in systems where low average power consumption is critical. n 0.25˚C temperature resolution. n Shutdown mode conserves power between temperature reading n SPI and MICROWIRE Bus interface n MSOP-8 and LLP-8 packages save space n UL Recognized Component The LM70 has 10-bit plus sign temperature resolution (0.25˚C per LSB) while operating over a temperature range of −55˚C to +150˚C. Key Specifications The LM70’s 2.65V to 5.5V supply voltage range, low supply current and simple SPI interface make it ideal for a wide range of applications. These include thermal management and protection applications in hard disk drives, printers, electronic test equipment, and office electronics. j Supply Current System Thermal Management Personal Computers Disk Drives Office Electronics Electronic Test Equipment 2.65V to 5.5V operating 260 µA (typ) 490 µA (max) j Temperature Accuracy Applications n n n n n j Supply Voltage shutdown 12 µA (typ) −40˚C to 85˚C ± 2˚C(max) −10˚C to 65˚C +1.5/−2˚C(max) −55˚C to 125˚C +3/−2˚C(max) −55˚C to 150˚C +3.5/−2˚C(max) Simplified Block Diagram 10122301 © 2006 National Semiconductor Corporation DS101223 www.national.com LM70 SPI/MICROWIRE™10-Bit plus Sign Digital Temperature Sensor February 2006 LM70 Connection Diagrams MSOP-8 LLP-8 10122302 TOP VIEW NS Package Number MUA08A 10122325 TOP VIEW NS Package Number LDA08A Ordering Information Package Marking Order Number NS Package Number Supply Voltage Transport Media LM70CILD-3 T33 LLP-8, LDA08A 2.65V to 3.6V 1000 Units in Tape and Reel LM70CILDX-3 T33 LLP-8, LDA08A 2.65V to 3.6V 4500 Units in Tape and Reel LM70CILD-5 T35 LLP-8, LDA08A 4.5V to 5.5V 1000 Units in Tape and Reel LM70CILDX-5 T35 LLP-8, LDA08A 4.5V to 5.5V 4500 Units in Tape and Reel LM70CIMM-3 T04C MSOP-8, MUA08A 2.65V to 3.6V 1000 Units in Tape and Reel LM70CIMMX-3 T04C MSOP-8, MUA08A 2.65V to 3.6V 3500 Units in Tape and Reel LM70CIMM-5 T03C MSOP-8, MUA08A 4.5V to 5.5V 1000 Units in Tape and Reel LM70CIMMX-5 T03C MSOP-8, MUA08A 4.5V to 5.5V 3500 Units in Tape and Reel Pin Descriptions Label SOP-8 Pin # LLP-8 Pin # Function SI/O 1 1 Input/Output - Serial bus bi-directional data line. Schmitt trigger input. From and to Controller SC 2 3 Clock - Serial bus clock Schmitt trigger input line. From Controller GND 4 7 Power Supply Ground Ground 5 5 Positive Supply Voltage Input DC Voltage from 2.65V to 5.5V. Bypass with a 0.1 µF ceramic capacitor. + V CS NC 7 3, 6, 8 www.national.com 8 2, 4, 6 Typical Connection Chip Select input. From Controller No Connect These pins are not connected to the LM70 die in any way. 2 LM70 Typical Application 10122303 FIGURE 1. COP Microcontroller Interface 3 www.national.com LM70 Absolute Maximum Ratings (Note 1) Supply Voltage ESD Susceptibility (Note 4) Human Body Model −0.3V to 6.0V Voltage at any Pin −0.3V to V + 0.3V Input Current at any Pin (Note 2) 3000V Machine Model + 300V 5 mA 20 mA Operating Ratings −65˚C to +150˚C Specified Temperature Range Package Input Current (Note 2) Storage Temperature Soldering Information, Lead Temperature MSOP-8 and LLP-8 Packages (Note 3) Vapor Phase (60 seconds) Infrared (15 seconds) TMIN to TMAX (Note 5) −55˚C to +150˚C Supply Voltage Range (+VS) +2.65V to +5.5V 215˚C 220˚C Temperature-to-Digital Converter Characteristics Unless otherwise noted, these specifications apply for V+ = 2.65V to 3.6V for the LM70-3 and V+ = 4.5V to 5.5V for the LM70-5 (Note 6). Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ=+25˚C, unless otherwise noted. LM70-5 Limits (Note 8) LM70-3 Limits (Note 8) TA = −10˚C to +65˚C +1.5/−2.0 +1.5/−2.0 ˚C (max) TA = −40˚C to +85˚C ± 2.0 ± 2.0 ˚C (max) TA = −55˚C to +125˚C +3.0/−2.0 +3.0/−2.0 ˚C (max) TA = −55˚C to +150˚C +3.5/−2.0 +3.5/−2.0 ˚C (max) Parameter Temperature Error (Note 6) Typical (Note 7) Conditions Resolution 11 0.25 Units (Limit) Bits ˚C Temperature Conversion Time (Note 9) 140 210 210 ms (max) Quiescent Current Serial Bus Inactive 260 490 490 µA (max) Serial Bus Active 260 µA Shutdown Mode 12 µA Logic Electrical Characteristics Digital DC Characteristics Unless otherwise noted, these specifications apply for V+ = 2.65V to 3.6V for the LM70-3 and V+ = 4.5V to 5.5V for the LM70-5. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ=+25˚C, unless otherwise noted. Symbol VIN(1) VIN(0) Parameter Conditions Typical (Note 7) Logical “1” Input Voltage Logical “0” Input Voltage Input Hysteresis Voltage Limits (Note 8) Units (Limit) V+ x 0.7 V (min) V+ + 0.3 V (max) −0.3 V (min) V+ x 0.3 V (max) V+ = 2.65V to 3.6V 0.8 0.27 V (min) V+ = 4.5V to 5.5V 0.8 0.35 V (min) 0.005 3.0 µA (max) −0.005 −3.0 µA (min) + IIN(1) Logical “1” Input Current VIN = V IIN(0) Logical “0” Input Current VIN = 0V CIN All Digital Inputs 20 pF VOH High Level Output Voltage IOH = −400 µA 2.4 V (min) VOL Low Level Output Voltage IOL = +2 mA 0.4 V (max) IO_TRI-STATE TRI-STATE Output Leakage Current VO = GND V O = V+ −1 +1 µA (min) µA (max) www.national.com 4 LM70 Logic Electrical Characteristics (Continued) Serial Bus Digital Switching Characteristics Unless otherwise noted, these specifications apply for V+ = 2.65V to 3.6V for the LM70-3 and V+ = 4.5V to 5.5V for the LM70-5, CL (load capacitance) on output lines = 100 pF unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25˚C, unless otherwise noted. Symbol Parameter Typical (Note 7) Conditions Limits (Note 8) Units (Limit) µs (min) (max) t1 SC (Clock) Period 0.16 DC t2 CS Low to SC (Clock) High Set-Up Time 100 ns (min) t3 CS Low to Data Out (SO) Delay 70 ns (max) t4 SC (Clock) Low to Data Out (SO) Delay 70 ns (max) t5 CS High to Data Out (SO) TRI-STATE 200 ns (min) t6 SC (Clock) High to Data In (SI) Hold Time 60 ns (min) t7 Data In (SI) Set-Up Time to SC (Clock) High 30 ns (min) Timing Diagrams 10122304 FIGURE 2. Data Output Timing Diagram 10122305 FIGURE 3. TRI-STATE Data Output Timing Diagram 10122306 FIGURE 4. Data Input Timing Diagram 5 www.national.com LM70 Electrical Characteristics Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. Note 2: When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > +VS) the current at that pin should be limited to 5 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four. Note 3: See the section titled “Surface Mount” found in a current National Semiconductor Linear Data Book for other methods of soldering surface mount devices. Note 4: Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin. Note 5: The life expectancy of the LM70 will be reduced when operating at elevated temperatures. LM70 θJA (thermal resistance, junction-to-ambient) when attached to a printed circuit board with 2 oz. foil is summarized in the table below: NS Package Number Thermal Resistance (θJA) LM70CILD LDA08A 51.3˚C/W LM70CIMM MUA08A 200˚C/W Device Number Note 6: Both part numbers of the LM70 will operate properly over the V+ supply voltage range of 2.65V to 5.5V. The temperature error for temperature ranges of −10˚C to +65˚C, −40˚C to +85˚C, −55˚C to +125˚C and −55˚C to +150˚C include error induced by power supply variation of ± 5% from the nominal value. Temperature error will increase by ± 0.3˚C for a power supply voltage (V+) variation of ± 10% from the nominal value. Note 7: Typicals are at TA = 25˚C and represent most likely parametric norm. Note 8: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level). Note 9: This specification is provided only to indicate how often temperature data is updated. The LM70 can be read at any time without regard to conversion state (and will yield last conversion result). A conversion in progress will not be interrupted. The output shift register will be updated at the completion of the read and a new conversion restarted. Note 10: For best accuracy, minimize output loading. Higher sink currents can affect sensor accuracy with internal heating. This can cause an error of 0.64˚C at full rated sink current and saturation voltage based on junction-to-ambient thermal resistance. www.national.com 6 LM70 Electrical Characteristics (Continued) 10122308 FIGURE 5. Temperature-to-Digital Transfer Function (Non-linear scale for clarity) TRI-STATE Test Circuit 10122307 FIGURE 6. 7 www.national.com LM70 Typical Performance Characteristics Average Power-On Reset Voltage vs Temperature Static Supply Current vs Temperature 10122323 10122321 Temperature Error 10122322 www.national.com 8 The LM70 temperature sensor incorporates a band-gap type temperature sensor and 10-bit plus sign ∆Σ ADC (DeltaSigma Analog-to-Digital Converter). Compatibility of the LM70’s three wire serial interface with SPI and MICROWIRE allows simple communications with common microcontrollers and processors. Shutdown mode can be used to optimize current drain for different applications. A manufacture’s ID register identifies the LM70 as National Semiconductor product. 1.1 POWER UP AND POWER DOWN The LM70 always powers up in a known state. The power up default condition is continuous conversion mode. Immediatly after power up the LM70 will output an erroneous code until the first temperature conversion has completed. When the supply voltage is less than about 1.6V (typical), the LM70 is considered powered down. As the supply voltage rises above the nominal 1.6V power up threshold, the internal registers are reset to the power up default state described above. 1.2 SERIAL BUS INTERFACE The LM70 operates as a slave and is compatible with SPI or MICROWIRE bus specifications. Data is clocked out on the falling edge of the serial clock (SC), while data is clocked in on the rising edge of SC. A complete transmit/receive communication will consist of 32 serial clocks. The first 16 clocks comprise the transmit phase of communication, while the second 16 clocks are the receive phase. When CS is high SI/O will be in TRISTATE ® . Communication should be initiated by taking chip select (CS) low. This should not be done when SC is changing from a low to high state. Once CS is low the serial I/O pin (SI/O) will transmit the first bit of data. The master can then read this bit with the rising edge of SC. The remainder of the data will be clocked out by the falling edge of SC. Once the 14 bits of data (one sign bit, ten temperature bits and 3 high bits) are transmitted the SI/O line will go into TRI-STATE. CS can be taken high at any time during the transmit phase. If CS is brought low in the middle of a conversion the LM70 will complete the conversion and the output shift register will be updated after CS is brought back high. The receive phase of a communication starts after 16 SC periods. CS can remain low for 32 SC cycles. The LM70 will read the data available on the SI/O line on the rising edge of the serial clock. Input data is to an 8-bit shift register. The part will detect the last eight bits shifted into the register. The receive phase can last up to 16 SC periods. All ones must be shifted in order to place the part into shutdown. A zero in any location will take the LM70 out of shutdown. The following codes only should be transmitted to the LM70: • 00 hex (normal operation) • 01 hex (normal operation) • 03 hex (normal operation) • • • • 1.3 TEMPERATURE DATA FORMAT Temperature data is represented by a 11-bit, two’s complement word with an LSB (Least Significant Bit) equal to 0.25˚C: Temperature Digital Output Binary Hex +150˚C 0100 1011 0001 1111 4B 1Fh +125˚C 0011 1110 1001 1111 3E 9Fh +25˚C 0000 1100 1001 1111 0B 9Fh +0.25˚C 0000 0000 0011 1111 00 3Fh 0˚C 0000 0000 0001 1111 00 1Fh −0.25˚C 1111 1111 1111 1111 FF FFh −25˚C 1111 0011 1001 1111 F3 9Fh −55˚C 1110 0100 1001 1111 E4 9Fh Note: The last two bits are TRI-STATE and depicted as one in the table. The first data byte is the most significant byte with most significant bit first, permitting only as much data as necessary to be read to determine temperature condition. For instance, if the first four bits of the temperature data indicate an overtemperature condition, the host processor could immediately take action to remedy the excessive temperatures. 1.4 SHUTDOWN MODE/MANUFACTURER’S ID Shutdown mode is enabled by writing XX FF to the LM70 as shown in Figure 7c and discussed in Section 1.2. The serial bus is still active when the LM70 is in shutdown. Current draw drops to less than 10 µA between serial communications. When in shutdown mode the LM70 always will output 1000 0001 0000 00XX. This is the manufacturer’s ID/Device ID information. The first 5-bits of the field (1000 0XXX) are reserved for manufacturer’s ID. 07 hex (normal operation) 0F hex (normal operation) 1F hex (normal operation) 3F hex(normal operation) 9 www.national.com LM70 • 7F hex(normal operation) • FF hex (Shutdown, transmit manufacturer’s ID) . any others may place the part into a Test Mode. Test Modes are used by National Semiconductor to thoroughly test the function of the LM70 during production testing. Only eight bits have been defined above since only the last eight transmitted, before CS is taken HIGH, are detected by the LM70 The following communication can be used to determine the Manufacturer’s/Device ID and then immediately place the part into continuous conversion mode. With CS continuously low: • Read 16 bits of temperature data • Write 16 bits of data commanding shutdown • Read 16 bits of Manufacture’s/Device ID data • Write 8 to 16 bits of data commanding Conversion Mode • Take CS HIGH. Note that 250 ms will have to pass for a conversion to complete before the LM70 actually transmits temperature data. 1.0 Functional Description LM70 1.0 Functional Description (Continued) 1.5 INTERNAL REGISTER STRUCTURE The LM70 has three registers, the temperature register, the configuration register and the manufacturer’s/device identification register. The temperature and manufacturer’s/device identification registers are read only. The configuration register is write only. 1.5.1 CONFIGURATION REGISTER (Selects shutdown or continuous conversion modes): (Write Only): D15 D14 D13 D12 D11 D10 D9 D8 X X X X X X X X D7 D6 D5 D4 D3 D2 D1 D0 Shutdown D0-D15 set to XX FF hex enables shutdown mode. D0-D15 set to XX 00 hex enables continuous conversion mode. Note: setting D0-D15 to any other values may place the LM70 into a manufacturer’s test mode, upon which the LM70 will stop responding as described. These test modes are to be used for National Semiconductor production testing only. See Section 1.2 Serial Bus Interface for a complete discussion. 1.5.2 TEMPERATURE REGISTER (Read Only): D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 MSB Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB 1 1 1 X X D0–D1: Undefined. TRI-STATE will be output on SI/0. D2–D4: Always set high. D5–D15: Temperature Data. One LSB = 0.25˚C. Two’s complement format. 1.5.3 MANUFACTURER’S/DEVICE ID REGISTER (Read Only): D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 0 0 0 0 1 0 0 0 0 0 0 X X D0–D1: Undefined. TRI-STATE will be output on SI/0. D2-D4: Always set LOW. www.national.com D5–D15: Manufacturer’s ID Data. This register is accessed whenever the LM70 is in shutdown mode. 10 LM70 2.0 Serial Bus Timing Diagrams 10122314 a) Reading Continuous Conversion - Single Eight-Bit Frame 10122315 b) Reading Continuous Conversion - Two Eight-Bit Frames 10122318 c) Writing Shutdown Control FIGURE 7. Timing Diagrams between the plastic package and the LM70 die. If the ambient air temperature is significantly different from the printed circuit board temperature, it will have a small effect on the measured temperature. In probe-type applications, the LM70 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM70 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to insure that moisture cannot corrode the LM70 or its connections. 3.0 Application Hints To get the expected results when measuring temperature with an integrated circuit temperature sensor like the LM70, it is important to understand that the sensor measures its own die temperature. For the LM70, the best thermal path between the die and the outside world is through the LM70’s pins. In the MSOP-8 package the ground pin is connected to the back side of the LM70 die and thus has the most effect on the die temperature. Although the other pins will also have some effect on the LM70die temperature and therefore should not be discounted. The LM70 will provide an accurate measurement of the temperature of the printed circuit board on which it is mounted, because the pins represent a good thermal path to the die. A less efficient thermal path exists 11 www.national.com LM70 4.0 Typical Applications 10122320 FIGURE 8. Temperature monitor using Intel 196 processor 10122319 FIGURE 9. LM70 digital input control using micro-controller’s general purpose I/O. www.national.com 12 LM70 Physical Dimensions inches (millimeters) unless otherwise noted 8-Lead Molded Mini Small Outline Package (MSOP) (JEDEC REGISTRATION NUMBER M0-187) Order Number LM70CIMM-3, LM70CIMMX-3, LM70CIMM-5 or LM70CIMMX-5 NS Package Number MUA08A 8-Lead Molded Leadless Leadframe Package Order Number LM70CILD-3, LM70CILDX-3, LM70CILD-5 or LM70CILDX-5 NS Package Number LDA08A 13 www.national.com LM70 SPI/MICROWIRE™10-Bit plus Sign Digital Temperature Sensor Notes National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. Leadfree products are RoHS compliant. National Semiconductor Americas Customer Support Center Email: [email protected] Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: [email protected] Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: [email protected] National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: [email protected] Tel: 81-3-5639-7560