H CAT3200, CAT3200-5 EE GEN FR ALO Low Noise Regulated Charge Pump DC-DC Converter LE FEATURES A D F R E ETM ■ Constant high frequency (2MHz) operation ■ Thermal overload shutdown protection ■ 100mA output current ■ Low value external capacitors (1µF) ■ Regulated output voltage (5V fixed CAT3200-5, ■ Foldback current overload protection Adjustable CAT3200) ■ Shutdown current less than 1µA ■ Low quiescent current (1.7mA typ.) ■ CAT3200-5 in low profile (1mm thin) 6-lead ■ Input voltage operation down to 2.7V SOT23 package ■ CAT3200 in MSOP-8 package ■ Soft start, slew rate control APPLICATIONS ■ 3V to 5V boost conversion ■ Local 5V supply from lower rail ■ White LED driver ■ Battery backup systems ■ USB On-The-Go 5V supply ■ Handheld portable devices DESCRIPTION A shutdown control input allows the device to be placed in power-down mode, reducing the supply current to less than 1µA. The CAT3200 and CAT3200-5 are switched capacitor boost converters that deliver a low noise, regulated output voltage. The CAT3200-5 gives a fixed regulated 5V output. The CAT3200 has an adjustable output using external resistors. The constant frequency 2MHz charge pump allows small 1µF ceramic capacitors to be used. In the event of short circuit or overload conditions, the device is fully protected by both foldback current limiting and thermal overload detection. In addition, a soft start, slew rate control circuit limits inrush current during power-up. Maximum output loads of up to 100mA can be supported over a wide range of input supply voltages (2.7V to 4.5V) making the device ideal for batterypowered applications. The CAT3200-5 is available in a 6-lead, 1mm max thin SOT23 package. The CAT3200 is available in an 8-lead MSOP package. TYPICAL APPLICATION 5V Output CPOS IN CAT3200-5 + 3.3V ON OFF CNEG 5V OUT VIN VOUT 100mA - OUT VOUT 100mA CAT3200 + SHDN GND CPOS IN 3.3V - ON OFF R1 FB SHDN GND R2 ( R VOUT = 1.27 V 1+ 1 R2 © 2004 by Catalyst Semiconductor, Inc. ( CNEG VIN Adjustable Output Doc. No. 5002, Rev. E 1 CAT3200/3200-5 ORDERING INFORMATION Part Number Output Voltage Package Package Marking Quantity per Reel CAT3200ES6-5-TE7 5V 6-lead thin SOT23 BJ 3,000 CAT3200ES6-5-TE13 5V 6-lead thin SOT23 BJ 10,000 CAT3200EMS8-TE13 Adjustable 8-lead MSOP AATR 2,500 CAT3200TDI-TE7 5V 6-lead thin SOT23, Lead Free LN 3,000 CAT3200TDI-TE13 5V 6-lead thin SOT23, Lead Free LN 10,000 CAT3200ZI-TE13 Adjustable 8-lead MSOP, Lead Free ABDA 2,500 PIN DESCRIPTIONS Designation Description OUT Regulated output voltage. GND Ground reference for all voltages. SHDN Shutdown control logic input (Active LOW) CNEG Negative connection for the flying capacitor. IN Input power supply. CPOS Positive connection for the flying capacitor. FB Feedback to set the output voltage. PGND Power ground. SGND Signal ground. PIN CONFIGURATION 6-lead Thin SOT23 OUT 1 GND 2 SHDN 3 CAT3200-5 Doc. No. 5002, Rev. E 8-pin MSOP 6 CPOS 5 IN 4 CNEG CPOS 1 IN 2 8 OUT 7 FB CAT3200 CNEG 3 6 SHDN PGND 4 5 SGND 2 CAT3200/3200-5 ABSOLUTE MAXIMUM RATINGS Power Dissipation (8-MSOP) ............................. 0.5W VIN, VOUT, SHDN, CNEG, CPOS Voltage .. -0.6V to 6.0V VOUT Short Circuit Duration ......................... Indefinite RECOMMENDED OPERATING CONDITIONS Output Current ................................................ 200mA VIN ................................................................................... 2.7V to 4.5V ESD Protection (HBM) ..................................... 2000V Junction Temperature ...................................... 150°C Storage Temperature Range ............. -65°C to 160°C Lead Soldering Temperature (10 sec) ............. 300°C CIN, COUT, CFLY .......................................................................... 1µF ILOAD ................................................................................. 0 to 100mA Ambient Temperature Range ................... -40°C to 85°C Power Dissipation (SOT23-6) ............................ 0.3W ELECTRICAL SPECIFICATIONS Recommended operating conditions unless otherwise specified. CIN, COUT, CFLY are 1µF ceramic capacitors and VIN is set to 3.6V. Symbol Parameter Conditions Min Typ Max Units VOUT Regulated Output ILOAD ≤ 40mA, VIN ≥ 2.7 V ILOAD ≤ 100mA, VIN ≥ 3.1 V 4.8 5.0 5.2 V VLINE Line Regulation 3.1V ≤ VIN ≤ 4.5V, ILOAD = 50mA 6 mV VLOAD Load Regulation ILOAD = 10mA to 100mA, VIN = 3.6V 20 mV FOSC Switching Frequency 1.3 2.0 2.6 MHz VR Output Ripple Voltage ILOAD = 100mA CAT3200-5 Only 30 mVp-p η Efficiency ILOAD = 50mA, VIN = 3V, CAT3200-5 80 % IGND Ground Current ILOAD = 0mA, SHDN = VIN 1.6 ISHDN Shutdown Input Current ILOAD = 0mA, SHDN = 0V to VIN VFB FB Voltage CAT3200 Only 1.22 IFB FB Input Current CAT3200 Only -50 ROL Open-Loop ILOAD = 100mA, VIN = 3V (Note 1) 10 Ω ILOAD = 0mA, VIN = 3V 0.5 ms 1.27 4 mA 1 µA 1.32 V 50 nA Resistance TON VOUT Turn-on time (10% to 90%) VIHSHDN High Detect Shutdown Threshold VILSHDN Low Detect Shutdown Threshold IROUT 0.8 1.3 0.4 V V 30 µA Reverse Leakage into OUT pin VOUT = 5V, Shutdown mode (Note 2) 15 ISC Short-circuit Output VOUT = 0V 80 mA TSD Thermal Shutdown 160 °C THYST Thermal Hysteresis 20 °C Note 1: ROL = (2VIN - VOUT)/IOUT Note 2: In the event of a controlled shutdown, the output will be isolated from the input, but will remain connected to the internal resistor feedback network. This will cause a small level of reverse current to flow back into the device to ground. 3 Doc. No. 5002, Rev. E CAT3200/3200-5 TYPICAL PERFORMANCE CHARACTERISTICS (CAT3200-5) TAMB=25°C, CIN=COUT=CFLY=1µF, VIN=3.3V unless specified otherwise. Ground Current vs. Supply Voltage (No Load) 2.2 1.2 1.1 GROUND CURRENT [mA] SHUTDOWN THRESHOLD [V] . Shutdown Input Threshold vs. Supply Voltage 1.0 0.9 0.8 0.7 0.6 0.5 2.0 1.8 1.6 1.4 1.2 0.4 2.7 3.0 3.3 3.6 3.9 4.2 INPUT VOLTAGE [V] 2.7 4.5 Line Regulation 4.2 4.5 5.2 OUTPUT VOLTAGE [V] . OUTPUT VOLTAGE [V] . 3.3 3.6 3.9 INPUT VOLTAGE [V] Load Regulation 5.2 5.1 20mA Load 5.0 100mA Load 4.9 5.1 VIN = 3.2V 5.0 VIN = 3V 4.9 VIN = 2.7V 4.8 4.8 2.7 3.0 3.3 3.6 3.9 INPUT VOLTAGE [V] 4.2 0 4.5 Oscillator Frequency vs. Supply Voltage 50 100 LOAD CURRENT [mA] Efficiency 2.6 150 vs. Load Current 100 VIN= 2.7V 90 2.4 EFFICIENCY [%] OSCILLATOR FREQUENCY [MHz] 3.0 2.2 2.0 VIN= 3.2V 80 VIN= 3.7V 70 60 50 VIN= 4.5V 1.8 40 1.6 30 2.7 Doc. No. 5002, Rev. E 3.0 3.3 3.6 3.9 INPUT VOLTAGE [V] 4.2 4.5 1 10 LOAD CURRENT [mA] 4 100 CAT3200/3200-5 TYPICAL PERFORMANCE CHARACTERISTICS (CAT3200-5) TAMB=25°C, CIN=COUT=CFLY=1µF, VIN=3.3V unless specified otherwise. Soft Start Power Up (90mA Load, 3.3V Input) Load Step Response (3.3V Input) Short Circuit Current vs Supply Voltage Output Ripple (100mA Load, 3.3V Input) CURRENT LIMIT [mA] . 250 200 150 100 50 0 2.7 3.3 3.6 3.9 4.2 INPUT VOLTAGE [V] 4.5 Oscillator Frequency Change vs. Temperature 4 2 FREQUENCY CHANGE [%] . OUTPUT VOLTAGE CHANGE [%] . Output Voltage Change vs. Temperature 3.0 1 10mA Load 0 -1 -2 -40 -20 0 20 40 60 80 100 2 0 -2 -4 -40 TEMPERATURE [ C] 5 -20 0 20 40 60 TEMPERATURE [ C] 80 100 Doc. No. 5002, Rev. E CAT3200/3200-5 BLOCK DIAGRAM CNEG CPOS CNEG CPOS 2MHz Voltage Doubler IN 2VIN 2MHz Voltage Doubler IN 2VIN SHDN SHDN 1.25V + – EN 5V/100mA 1.25V OUT FB + – 5V 100k SGND EN 300k 100mA OUT GND PGND CAT3200 Adjustable Output CAT3200-5 5V Fixed Output PIN FUNCTIONS IN is the power supply. During normal operation the device draws a supply current which is almost constant. A very brief interval of non-conduction will occur at the switching frequency. The duration of the non-conduction interval is set by the internal non-overlapping “break-before-make” timing. IN should be bypassed with a 1µF to 4.7µF low ESR (Equivalent Series Resistance) ceramic capacitor. resistor network (400kΩ). The feedback network will result in a reverse current of 10µA to 20µA to flow back through the device to ground. Whenever the device is taken out of shutdown mode, the output voltage will experience a slew rate controlled power-up. Full operating voltage is typically achieved in less than 0.5 msec. For filtering, a low ESR ceramic bypass capacitor (1µF) in close proximity to the IN pin prevents noise from being injected back into the power supply. GND is the ground reference for all voltages on CAT32005 devices. SHDN is the logic control input (Active LOW) that places the device into shutdown mode. The internal logic is CMOS and the pin does not use an internal pull-down resistor. The SHDN pin should not be allowed to float. FB (CAT3200 Only) is the feedback input pin. An output divider should be connected from OUT to FB to program the output voltage. CPOS, CNEG are the positive and negative connections respectively for the charge pump flying capacitor. A low ESR ceramic capacitor (1µF) should be connected between these pins. During initial power-up it may be possible for the capacitor to experience a voltage reversal and for this reason, avoid using a polarized (tantalum or aluminum) flying capacitor. PGND (CAT3200 Only). Is the same as GND for the CAT3200-5 except for the internal reference connection to SGND. SGND (CAT3200 Only) Ground pin for the internal reference. The CNEG connection is switched to this pin during the normal charge pump operation. OUT is the regulated output voltage to power the load. During normal operation, the device will deliver a train of current pulses to the pin at a frequency of 2MHz. Adequate filtering on the pin can typically be achieved through the use a low ESR ceramic bypass capacitor (1µF to 4.7µF) in close proximity to the OUT pin. The ESR of the output capacitor will directly influence the output ripple voltage. When the shutdown mode is entered, the output is immediately isolated from the input supply, however, the output will remain connected to the internal feedback Doc. No. 5002, Rev. E 6 CAT3200/3200-5 DEVICE OPERATION Typical values for total voltage divider resistance can range from several kΩs up to 1MΩ. The CAT3200/CAT3200-5 use a switched capacitor charge pump to boost the voltage at IN to a regulated output voltage. Regulation is achieved by sensing the output voltage through an internal resistor divider (CAT3200-5) and modulating the charge pump output current based on the error signal. A 2-phase nonoverlapping clock activates the charge pump switches. The flying capacitor is charged from the IN voltage on the first phase of the clock. On the second phase of the clock it is stacked in series with the input voltage and connected to OUT. The charging and discharging the flying capacitor continues at a free running frequency of typically 2MHz. 1 3 CPOS CNEG 2 IN OUT VOUT 8 R1 FB 6 In shutdown mode all circuitry is turned off and the CAT3200/CAT3200-5 draw only leakage current from the VIN supply. OUT is disconnected from IN. The SHDN pin is a CMOS input with a threshold voltage of approximately 0.8V. The CAT3200/CAT3200-5 is in shutdown when a logic LOW is applied to the SHDN pin. The SHDN pin is a high impedance CMOS input. SHDN does not have an internal pull-down resistor and should not be allowed to float and. It must always be driven with a valid logic level. SHDN 7 PGND 4 SGND 5 1.27V ( ) 1 + R1 R2 COUT R2 Figure 1: Programming the Adjustable CAT3200 Short-Circuit and Thermal Protection The CAT3200 and CAT3200-5 have built-in short-circuit current limiting and over temperature protection. During overload conditions, output current is limited to approximately 225mA. At higher temperatures, or if the input voltage is high enough to cause excessive chip self heating, the thermal shutdown circuit shuts down the charge pump as the junction temperature exceeds approximately 160°C. Once the junction temperature drops back to approximately 140°C, the charge pump is enabled. The CAT3200and CAT3200-5 will cycle in and out of thermal shutdown indefinitely without latch-up or damage until a short-circuit on OUT is removed. Programming the CAT3200 Output Voltage (FB Pin) The CAT3200-5 version has an internal resistive divider to program the output voltage. The programmable CAT3200 may be set to an arbitrary voltage via an external resistive divider. Since it employs a voltage doubling charge pump, it is not possible to achieve output voltages greater than twice the available input voltage. Figure 1 shows the required voltage divider connection. The voltage divider ratio is given by the formula: R1 VOUT = −1 R2 1.27V 7 Doc. No. 5002, Rev. E CAT3200/3200-5 APPLICATION INFORMATION The overall junction to ambient thermal resistance (θJA) for device power dissipation (PD) consists primarily of two paths in series. The first path is the junction to the case (θJC) which is defined by the package style, and the second path is case to ambient (θCA) thermal resistance which is dependent on board layout. The final operating junction temperature for any set of conditions can be estimated by the following thermal equation: Ceramic Capacitors Ceramic capacitors of different dielectric materials lose their capacitance with higher temperature and voltage at different rates. For example, a capacitor made of X5R or X7R material will retain most of its capacitance from – 40°C to 85°C whereas a Z5U or Y5V style capacitor will lose considerable capacitance over that range. TJUNC = TAMB + PD (Θ JC ) + PD (Θ CA ) Z5U and Y5V capacitors may also have voltage coefficient causing them to lose 60% or more of their capacitance when the rated voltage is applied. When comparing different capacitors it is often useful consider the amount of achievable capacitance for a given case size rather than discussing the specified capacitance value. For example, over rated voltage and temperature conditions, a 1µF, 10V, Y5V ceramic capacitor in an 0603 case may not provide any more capacitance than a 0.22µF, 10V, X7R available in the same 0603 case. For many CAT3200/CAT3200-5 applications these capacitors can be considered roughly equivalent. = TAMB + PD (Θ JA ) The CAT3200 in SOT23 package, when mounted on printed circuit board with two square inches of copper allocated for “heat spreading”, will result with an overall θJA of less than 150°C/W. For a typical application operating from a 3.8V input supply, the maximum power dissipation is 260mW (100mA x 3V). This would result if a maximum junction temperature of : The capacitor manufacturer’s data sheet should be consulted to determine what value of capacitor is needed to ensure the desired capacitance at all temperatures and voltages. Below is a list of ceramic capacitor manufacturers and how to contact them: Capacitor Manufacturer Web Phone Murata www.murata.com 814.237.1431 AVX/Kemet www.avxcorp.com 843.448.9411 Vishay www.vishay.com Kemet www.kemet.com 408.986.0424 Taiyo Yuden www.t-yuden.com 408.573.4150 TJUNC = TAMB + PD (θJA) = 85°C + 0.26W (150°C/W) = 85°C + 39°C = 124°C The use of multi-layer board construction with power planes will further enhance the overall thermal performance. In the event of no dedicated copper area being used for heat spreading, a multi-layer board will typically provide the CAT3200 with an overall θJA of 200°C/W. This level of thermal conduction would allow up to 200mW be safely dissipated within the device. Thermal Management For higher input voltages and maximum output current there can be substantial power dissipation in the CAT3200/CAT3200-5. If the junction temperature increases to 160°C, the thermal shutdown circuitry will automatically turn off the output. A good thermal connection to the PC board is recommended to reduce the chip temperature. Connecting the GND pin (Pins 4/5 for CAT3200, Pin 2 for CAT3200-5) to a ground plane, and maintaining a solid ground plane under the device reduces the overall thermal resistance. Doc. No. 5002, Rev. E 8 CAT3200/3200-5 TYPICAL APPLICATIONS 3.3 V Supply to 5 V 4 5 USB Port to Regulated 5V Power Supply 6 IN OUT 4 1 5 6 IN OUT 1 3.3 V + 10% 3 SHDN 3 VOUT 5V + 4% 100mA CAT3200-5 SHDN VOUT 5V + 4% CAT3200-5 GND 2 GND 2 Lithium-Ion Battery to 5V White or Blue LED Driver 4 C5 6 C+ OUT IN 3V to 4.4V + Li-ion Battery Drive up to 5 LEDs 1 100Ω CAT3200-5 3 ON OFF Apply PWM Waveform for Adjustable Brightness Control SHDN SGND 100Ω 100Ω 100Ω 100Ω 2 VSHDN t White or Blue LED Driver with LED Current Control 1 C+ 2 3 C- IN 3V to 4.4V + Li-ion Battery OUT CAT3200 FB PGND ON OFF Apply PWM Waveform for Adjustable Brightness Control 6 SHDN VSHDN SGND Up to 6 LEDs 8 7 5 82Ω 4 82Ω 82Ω 82Ω 82Ω t 9 Doc. No. 5002, Rev. E CAT3200/3200-5 MECHANICAL PACKAGE DRAWINGS 3 6-LEAD THIN SOT-23 4 aaa C 2X D H e1 A B D 5 N/2 +1 N B VIEW A-A SEE VIEW C E/2 E1/2 3 R1 E1 4 E R GAUGE PLANE L2 aaa C D L SEATING C PLANE 2X (L1) 1 2 N/2 bbb C 2X N/2 TIPS e 5 B NX b ddd M VIEW C (b) WITH METAL b1 CA BD c c1 BASE METAL SECTION B - B b 5 8 7 A 5 e/2 X X=A &/or B A X X=A &/or B ODD LEAD SIDES TOP VIEW A2 ccc C NX A1 EVEN LEAD SIDES TOP VIEW SEATING C PLANE A All Dimensions are in Millimeters Min Nom Max A — — 1.00 aaa A1 0.01 0.05 0.10 bbb 0.25 1,2 A2 0.84 0.87 0.90 ccc 0.10 1,2 c 0.12 0.15 0.20 7 c1 0.08 0.13 0.16 7 Notes 0.15 1,2 Variations AA 6 AB BA 2.90BSC 3,4 Min Nom Max Min Nom Max Min Nom Max Notes E 2.80BSC 3,4 b 0.30 — 0.45 0.30 — 0.45 0.22 — 0.36 7,8 3,4 b1 0.31 0.35 0.39 0.31 0.35 0.39 0.22 0.26 0.30 L 5. 6. 7. 8. Tolerances of Form and Position D E1 4. Notes 1.60BSC 0.30 0.40 0.50 e 0.95BSC 0.95BSC 0.65BSC L1 0.60REF e1 1.90BSC 1.90BSC 1.95BSC L2 0.25BSC N 6 5 8 R 0.10 — — R1 0.10 — 0.25 Tolerances of Form and Position ddd 0.20 0.20 0.13 1,2 Notes: θ 0° 4° 8° 1. Dimensions and tolerancing per ASME Y14.5M - 1994 2. Dimension are in mm. θ1 4° 10° 12° 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15mm per side. D and E1 dimensions are determined at Datum H. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, the bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. D and E1 dimensions are determined at Datum H. Datums A & B to be determined at Datum H. Package varation "AB" is a 5 lead version of the 6 lead variation "AA" where lead #5 has been removed from the 6 lead "AA" variation. These dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition. The dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07mm. Doc. No. 5002, Rev. E 10 CAT3200/3200-5 MECHANICAL PACKAGE DRAWINGS 8-LEAD MSOP 0.38 0.28 0.0150 0.0110 0.1970 0.1890 5.00 4.80 S 0.0256 [0.65] BSC 3.10 2.90 0.1220 0.1142 0.0374 0.0295 0.0433 [1.10] MAX. 0.039 [0.10] MAX. S 0.0059 0.0020 0.15 0.05 0.95 0.75 S 0.0150 0.0110 0.38 0.28 WITH PLATING 0.0276 0.0157 0.70 0.40 0.1220 0.1142 3.10 2.90 0.0091 0.0051 0.23 0.13 0.0050 [0.127] 0˚ - 6˚ WITH PLATING BASE METAL 0.0118 [0.30] REF. SECTION A - A Notes: (1) All dimensions are in mm Angles in degrees. 2 Does not include Mold Flash, Protrusion or Gate Burrs. Mold Flash, Protrusions or Gate Burrs shall not exceed 0.15 mm. per side. 3 Does not include Interlead Flash orProtrusion. Interlead Flash or Protrusion shall not exceed 0.25 mm per side. 4 Does not include Dambar Protrusion, allowable Dambar Protrusion shall be 0.08 mm. (5) This part is compliant with JEDEC Specification MO-187 Variations AA. (6) Lead span/stand off height/coplanarity are considered as special characteristics. (S) (7) Controlling dimensions in inches. [mm] 11 Doc. No. 5002, Rev. E CAT3200/3200-5 REVISION HISTORY /Date Rev. Reason 6/17/2004 A Initial Release/ 9/3/2004 B Updated Ordering Information 9/23/2004 C Minor change 10/26/2004 D Removed TDFN package, minor changes 10/29/2004 E Added Green Packages Copyrights, Trademarks and Patents Trademarks and registered trademarks of Catalyst Semiconductor include each of the following: DPP ™ AE2 ™ Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products. For a complete list of patents issued to Catalyst Semiconductor contact the Company’s corporate office at 408.542.1000. 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Products with data sheets labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale. Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate typical semiconductor applications and may not be complete. Catalyst Semiconductor, Inc. Corporate Headquarters 1250 Borregas Avenue Sunnyvale, CA 94089 Phone: 408.542.1000 Fax: 408.542.1200 www.catalyst-semiconductor.com Doc. No. 5002, Rev. E Publication #: Revison: Issue date: 12 5002 E 10/29/04