TI LM25115 Lm25115 secondary side post regulator controller Datasheet

LM25115
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SNVS418A – NOVEMBER 2005 – REVISED APRIL 2013
LM25115 Secondary Side Post Regulator Controller
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FEATURES
DESCRIPTION
•
•
The LM25115 controller contains all of the features
necessary to implement multiple output power
converters utilizing the Secondary Side Post
Regulation (SSPR) technique. The SSPR technique
develops a highly efficient and well regulated auxiliary
output from the secondary side switching waveform of
an isolated power converter. Regulation of the
auxiliary output voltage is achieved by leading edge
pulse width modulation (PWM) of the main channel
duty cycle. Leading edge modulation is compatible
with either current mode or voltage mode control of
the main output. The LM25115 drives external high
side and low side NMOS power switches configured
as a synchronous buck regulator. A current sense
amplifier provides overload protection and operates
over a wide common mode input range. Additional
features include a low dropout (LDO) bias regulator,
error amplifier, precision reference, adaptive dead
time control of the gate signals and thermal
shutdown.
1
2
•
•
•
•
•
•
•
•
•
•
•
Self-synchronization to Main Channel Output
Free-run Mode for Buck Regulation of DC
Input
Leading Edge Pulse Width Modulation
Voltage-mode Control with Current Injection
and Input Line Feed-forward
Operates from AC or DC Input up to 42V
Wide 4.5V to 30V Bias Supply Range
Wide 0.75V to 13.5V Output Range.
Top and Bottom Gate Drivers Sink 2.5A Peak
Adaptive Gate Driver Dead-time Control
Wide Bandwidth Error Amplifier (4MHz)
Programmable Soft-start
Thermal Shutdown Protection
TSSOP-16 or Thermally Enhanced WSON-16
Packages
Typical Application Circuit
Phase Signal
Main
Output
3.3V
FEEDBACK
INPUT
Main Converter
PWM Controller
+12V
VCC Sync
HO
SS
CO
COMP
LM25115
VBIAS
RAMP
HB
HS
RS
Auxiliary
Output
2.0V
LO
CS
VOUT
FB
PGND AGND
Figure 1. Simplified Multiple Output Power Converter Utilizing SSPR Technique
1
2
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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LM25115
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Connection Diagram
1
2
3
4
5
6
7
8
CS
VBIAS
VOUT
HB
AGND
HO
CO
HS
COMP
VCC
FB
LO
SS
PGND
RAMP
SYNC
16
15
14
13
12
11
10
9
Figure 2. 16-Lead TSSOP, WSON
See Package Numbers PW0016A and NHQ0016A
PIN DESCRIPTIONS
2
Pin
Name
Description
1
CS
Current Sense amplifier positive input
A low inductance current sense resistor is connected between CS
and VOUT. Current limiting occurs when the differential voltage
between CS and VOUT exceeds 45mV (typical).
Application Information
2
VOUT
Current sense amplifier negative input
Connected directly to the output voltage. The current sense
amplifier operates over a voltage range from 0V to 13.5V at the
VOUT pin.
3
AGND
Analog ground
Connect directly to the power ground pin (PGND).
4
CO
Current limit output
For normal current limit operation, connect the CO pin to the
COMP pin. Leave this pin open to disable the current limit function.
5
COMP
Compensation. Error amplifier output
COMP pin pull-up is provided by an internal 300uA current source.
6
FB
Feedback. Error amplifier inverting input
Connected to the regulated output through the feedback resistor
divider and compensation components. The non-inverting input of
the error amplifier is internally connected to the SS pin.
7
SS
Soft-start control
An external capacitor and the equivalent impedance of an internal
resistor divider connected to the bandgap voltage reference set the
soft-start time. The steady state operating voltage of the SS pin
equal to 0.75V (typical).
8
RAMP
PWM Ramp signal
An external capacitor connected to this pin sets the ramp slope for
the voltage mode PWM. The RAMP capacitor is charged with a
current that is proportional to current into the SYNC pin. The
capacitor is discharged at the end of every cycle by an internal
MOSFET.
9
SYNC
Synchronization input
A low impedance current input pin. The current into this pin sets the
RAMP capacitor charge current and the frequency of an internal
oscillator that provides a clock for the free-run (DC input) mode .
10
PGND
Power Ground
Connect directly to the analog ground pin (AGND).
11
LO
Low side gate driver output
Connect to the gate of the low side synchronous MOSFET through
a short, low inductance path.
12
VCC
Output of bias regulator
Nominal 7V output from the internal LDO bias regulator. Locally
decouple to PGND using a low ESR/ESL capacitor located as
close to controller as possible.
13
HS
High side MOSFET source connection
Connect to negative terminal of the bootstrap capacitor and the
source terminal of the high side MOSFET.
14
HO
High side gate driver output
Connect to the gate of high side MOSFET through a short, low
inductance path.
15
HB
High side gate driver bootstrap rail
Connect to the cathode of the bootstrap diode and the positive
terminal of the bootstrap capacitor. The bootstrap capacitor
supplies current to charge the high side MOSFET gate and should
be placed as close to controller as possible.
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PIN DESCRIPTIONS (continued)
Pin
Name
16
VBIAS
-
Description
Application Information
Supply Bias Input
Input to the LDO bias regulator and current sense amplifier that
powers internal blocks. Input range of VBIAS is 4.5V to 30V.
Exposed Pad Exposed Pad, underside of WSON package
(WSON
Package
Only)
Internally bonded to the die substrate. Connect to system ground
for low thermal impedance.
Block Diagram
VCC
VBIAS
7V LDO
REGULATOR
VCC
LOGIC
UVLO
7V
THERMAL
LIMIT
SYNC
HB
I SYNC
VCC
15 PA
2.5k
2.5k
CLK
VCC
R
Q
S
Q
+
-
2.3V
LEVEL
SHIFT
HO
DRIVER
HS
ISYNC x 3
RAMP
0.7V
BUFFER
CLK
CRMIX
100k
PWM
COMPARATOR
VCC
40k
VCC
LO
DRIVER
ERROR AMP
(Sink Only)
300 PA
FB
1V
0.75V
SS
ADAPTIVE
DEAD TIME
DELAY
75k
NEGATIVE
CURRENT
DETECTOR
PGND
120k
1.27V
AGND
175k
ENABLE
COMP
CS
VOUT
CURRENT SENSE AMP
Gain = 16
Vbias
CV
ILIMIT AMP
Gm = 16 mA/V
(Sink Only)
1.27V
2V
CO
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1) (2)
VBIAS to GND
–0.3V to 32V
VCC to GND
–0.3V to 9V
HS to GND
–1V to 45V
VOUT, CS to GND
– 0.3V to 15V
−0.3V to 7.0V
All other inputs to GND
Storage Temperature Range
–55°C to +150°C
Junction Temperature
+150°C
ESD Rating
HBM (3)
(1)
(2)
(3)
2 kV
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
The human body model is a 100 pF capacitor discharged through a 1.5kΩ resistor into each pin.
OPERATING RATINGS
VBIAS supply voltage
5V to 30V
VCC supply voltage
5V to 7.5V
HS voltage
0V to 42V
HB voltage
VCC + HS
Operating Junction Temperature
–40°C to +125°C
TYPICAL OPERATING CONDITIONS
Max
Units
Supply Voltage, VBIAS
Parameter
Min
4.5
30
V
Supply Voltage, VCC
4.5
7
V
Supply voltage bypass, CVBIAS
0.1
1
Reference bypass capacitor, CVCC
0.1
1
HB-HS bootstrap capacitor
Typ
µF
10
µF
0.047
µF
SYNC Current Range (VCC = 4.5V)
50
150
µA
RAMP Saw Tooth Amplitude
1
1.75
V
0.75
13.5
V
VOUT regulation voltage (VBIAS min = 3V + VOUT)
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, TJ = –40°C to +125°C, VBIAS = 12V, No Load on LO or HO.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
4
mA
VBIAS SUPPLY
Ibias
VBIAS Supply Current
FSYNC = 200kHz
VCC LOW DROPOUT BIAS REGULATOR
VccReg
VCC Regulation
VCC open circuit. Outputs not switching
VCC Current Limit
( (1))
VCC Under-voltage Lockout Voltage
Positive going VCC
VCC Under-voltage Hysteresis
(1)
4
6.65
7
7.15
40
4
0.2
0.25
V
mA
4.5
V
0.3
V
Device thermal limitations may limit usable range.
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ELECTRICAL CHARACTERISTICS (continued)
Unless otherwise specified, TJ = –40°C to +125°C, VBIAS = 12V, No Load on LO or HO.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
60
77
kΩ
SOFT-START
SS Source Impedance
43
SS Discharge Impedance
Ω
100
ERROR AMPLIFIER and FEEDBACK REFERENCE
VREF
GBW
Vio
FB Reference Voltage
Measured at FB pin
FB Input Bias Current
FB = 2V
0.737
0.75
0.763
V
0.2
0.5
µA
COMP Source Current
300
Open Loop Voltage Gain
60
dB
Gain Bandwidth Product
4
MHz
Input Offset Voltage
-7
0
µA
7
mV
COMP Offset
Threshold for VHO = high RAMP = CS =
VOUT = 0V
2
V
RAMP Offset
Threshold for VHO = high COMP = 1.5V,
CS = VOUT = 0V
1.1
V
CURRENT SENSE AMPLIFIER
Current Sense Amplifier Gain
16
V/V
Output DC Offset
1.27
V
Amplifier Bandwidth
500
kHz
ILIMIT Amp Transconductance
16
mA / V
Overall Transconductance
237
mA / V
CURRENT LIMIT
VCLneg
Positive Current Limit
VCL = VCS - VVOUT
VOUT = 6V and CO/COMP = 1.5V
37
45
53
mV
Positive Current Limit Foldback
VCL = VCS - VVOUT
VOUT = 0V and CO/COMP = 1.5V
31
38
45
mV
Negative Current Limit
VOUT = 6V
VCL = VCS - VVOUT to cause LO to
shutoff
-17
mV
2.5
kΩ
15
µA
RAMP GENERATOR
SYNC Input Impedance
SYNC Threshold
End of cycle detection threshold
Free Run Mode Peak Threshold
RAMP peak voltage with dc current
applied to SYNC.
Current Mirror Gain
Ratio of RAMP charge current to SYNC
input current.
Discharge Impedance
2.7
2.3
V
3.3
A/A
Ω
100
LOW SIDE GATE DRIVER
VOLL
LO Low-state Output Voltage
ILO = 100mA
0.2
0.5
V
VOHL
LO High-state Output Voltage
ILO = -100mA, VOHL = VCC -VLO
0.4
0.8
LO Rise Time
CLOAD = 1000pF
15
ns
V
LO Fall Time
CLOAD = 1000pF
12
ns
IOHL
Peak LO Source Current
VLO = 0V
2
A
IOLL
Peak LO Sink Current
VLO = 12V
2.5
A
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ELECTRICAL CHARACTERISTICS (continued)
Unless otherwise specified, TJ = –40°C to +125°C, VBIAS = 12V, No Load on LO or HO.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
V
HIGH SIDE GATE DRIVER
VOLH
HO Low-state Output Voltage
IHO = 100mA
0.2
0.5
VOHH
HO High-state Output Voltage
IHO = -100mA, VOHH = VHB –VHO
0.4
0.8
HO Rise Time
CLOAD = 1000pF
15
ns
V
HO High Side Fall Time
CLOAD = 1000pF
12
ns
IOHH
Peak HO Source Current
VHO = 0V
2
A
IOLH
Peak HO Sink Current
VHO = 12V
2.5
A
LO Fall to HO Rise Delay
CLOAD = 0
70
ns
HO Fall to LO Rise Delay
CLOAD = 0
50
ns
SYNC Fall to HO Fall Delay
CLOAD = 0
120
ns
SYNC Rise to LO Fall Delay
CLOAD = 0
50
ns
165
°C
25
°C
SWITCHING CHARACTERISITCS
THERMAL SHUTDOWN
TSD
Thermal Shutdown Temp.
150
Thermal Shutdown Hysteresis
THERMAL RESISTANCE
6
θJA
Junction to Ambient
PW Package
125
°C/W
θJA
Junction to Ambient
NHQ Package
32
°C/W
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TYPICAL PERFORMANCE CHARACTERISTICS
VCC Regulator Start-Up Characteristics, VCC
vs
VBIAS
VCC Load Regulation to Current Limit
8
16
VBIAS
7
12
6
10
5
VCC (V)
VCC (V)
14
VCC
8
4
6
3
4
2
2
1
0
0
0
2
4
6
8
10
12
14
0
16
5
10
15
20
25
30
35
40
45
ICC (mA)
VBIAS (V)
Figure 3.
Figure 4.
Current Value (CV)
vs
Current Limit (VCL)
Current Sense Amplifier Gain and Phase
vs
Frequency
2.5
25
VOUT = 6V
2
5
Gain
-10
20
Offset 1.27V
0.5
0
-20 -10
0
10
20
30
40
50
60
15
-25
10
-40
5
-55
0
-70
100
VCL (mV)
1K
10K
100K
PHASE (o)
1
GAIN (dB)
CV (V)
Phase
16 V/V
1.5
1M
FREQUENCY (Hz)
Figure 5.
Figure 6.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Current Error Amplifier Transconductance
Overall Current Amplifier Transconductance
400
400
350
350
VOUT = 6V
300
250
250
ICO (PA)
ICO (PA)
VOUT = 6V
300
200
16 mA/V
200
150
150
100
100
50
50
0
1.99
237 mA/V
0
1.995
2
2.01
2.005
2.015 2.02
30
35
40
45
50
VCL (mV)
CV (V)
Figure 7.
Figure 8.
Common Mode Output Voltage
vs
Positive Current Limit
Common Mode Output Voltage
vs
Negative Current Limit (Room Temp)
14
12
27oC
12
10
-40oC
8
125oC
8
VOUT (V)
VOUT (V)
10
6
6
4
4
2
2
0
0
10
20
30
40
50
VCL (mV)
-19
-18
-17
-16
-15
VCL (mV)
Figure 9.
8
0
-20
Figure 10.
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DETAILED OPERATING DESCRIPTION
The LM25115 controller contains all of the features necessary to implement multiple output power converters
utilizing the Secondary Side Post Regulation (SSPR) technique. The SSPR technique develops a highly efficient
and well regulated auxiliary output from the secondary side switching waveform of an isolated power converter.
Regulation of the auxiliary output voltage is achieved by leading edge pulse width modulation (PWM) of the main
channel duty cycle. Leading edge modulation is compatible with either current mode or voltage mode control of
the main output. The LM25115 drives external high side and low side NMOS power switches configured as a
synchronous buck regulator. A current sense amplifier provides overload protection and operates over a wide
common mode input range from 0V to 13.5V. Additional features include a low dropout (LDO) bias regulator,
error amplifier, precision reference, adaptive dead time control of the gate driver signals and thermal shutdown. A
programmable oscillator provides a PWM clock signal when the LM25115 is powered by a dc input (free-run
mode) instead of the phase signal of the main channel converter (SSPR mode).
Low Drop-out Bias Regulator (VCC)
The LM25115 contains an internal LDO regulator that operates over an input supply range from 4.5V to 30V. The
output of the regulator at the VCC pin is nominally regulated at 7V and is internally current limited to 40mA. VCC
is the main supply to the internal logic, PWM controller, and gate driver circuits. When power is applied to the
VBIAS pin, the regulator is enabled and sources current into an external capacitor connected to the VCC pin.
The recommended output capacitor range for the VCC regulator is 0.1uF to 100uF. When the voltage at the VCC
pin reaches the VCC under-voltage lockout threshold of 4.25V, the controller is enabled. The controller is
disabled if VCC falls below 4.0V (250mV hysteresis). In applications where an appropriate regulated dc bias
supply is available, the LM25115 controller can be powered directly through the VCC pin instead of the VBIAS
pin. In this configuration, it is recommended that the VCC and the VBIAS pins be connected together such that
the external bias voltage is applied to both pins. The allowable VCC range when biased from an external supply
is 4.5V to 7V.
Synchronization (SYNC) and Feed-forward (RAMP)
The pulsing “phase signal” from the main converter synchronizes the PWM ramp and gate drive outputs of the
LM25115. The phase signal is the square wave output from the transformer secondary winding before
rectification (Figure 1). A resistor connected from the phase signal to the low impedance SYNC pin produces a
square wave current (ISYNC) as shown in Figure 11. A current comparator at the SYNC input monitors ISYNC
relative to an internal 15µA reference. When ISYNC exceeds 15µA, the internal clock signal (CLK) is reset and the
capacitor connected to the RAMP begins to charge. The current source that charges the RAMP capacitor is
equal to 3 times the ISYNC current. The falling edge of the phase signal sets the CLK signal and discharges the
RAMP capacitor until the next rising edge of the phase signal. The RAMP capacitor is discharged to ground by a
low impedance (100Ω) n-channel MOSFET. The input impedance at SYNC pin is 2.5kΩ which is normally much
less than the external SYNC pin resistance.
Phase
Signal
R SYNC
SYNC
CLK
15 PA
Isync
2.5K
2.5k
Isync x 3
RAMP
BUFFER
C RAMP
CLK
Figure 11. Line Feed-forward Diagram
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The RAMP and SYNC functions illustrated in Figure 11 provide line voltage feed-forward to improve the
regulation of the auxiliary output when the input voltage of the main converter changes. Varying the input voltage
to the main converter produces proportional variations in amplitude of the phase signal. The main channel PWM
controller adjusts the pulse width of the phase signal to maintain constant volt*seconds and a regulated main
output as shown in Figure 12. The variation of the phase signal amplitude and duration are reflected in the slope
and duty cycle of the RAMP signal of the LM25115 (ISYNC α phase signal amplitude). As a result, the duty cycle
of the LM25115 is automatically adjusted to regulate the auxiliary output voltage with virtually no change in the
PWM threshold voltage. Transient line regulation is improved because the PWM duty cycle of the auxiliary
converter is immediately corrected, independent of the delays of the voltage regulation loop.
12V
Phase signal
6V
Main Output = 3.3V
RAMP pin
PWM Threshold
12V
6V
HS pin
Secondary Output = 2.5V
Figure 12. Line Feed-forward Waveforms
The recommended SYNC input current range is 50µA to 150µA. The SYNC pin resistor (RSYNC) should be
selected to set the SYNC current (ISYNC) to 150µA with the maximum phase signal amplitude, VPHASE(max). This
will ensure that ISYNC stays within the recommended range over a 3:1 change in phase signal amplitude. The
SYNC pin resistor is therefore:
RSYNC = (VPHASE(max) / 150µA) - 2.5kΩ
Once ISYNC has been established by selecting RSYNC, the RAMP signal amplitude may be programmed by
selecting the proper RAMP pin capacitor value. The recommended peak amplitude of the RAMP waveform is 1V
to 1.75V. The CRAMP capacitor is chosen to provide the desired RAMP amplitude with the nominal phase signal
voltage and pulse width.
CRAMP = (3 x ISYNC x TON ) / VRAMP
where
•
•
•
•
CRAMP = RAMP pin capacitance
ISYNC = SYNC pin current current
TON = corresponding phase signal pulse width
VRAMP = desired RAMP amplitude (1V to 1.75V)
For example,
Main channel output = 3.3V. Phase signal maximum amplitude = 12V. Phase signal frequency = 250kHz
• Set ISYNC = 150µA with phase signal at maximum amplitude (12V):
– ISYNC = 150µA = VPHASE(max) / (RSYNC + 2.5 kΩ) = 12V / (RSYNC + 2.5 kΩ)
– RSYNC = 12V/150µA - 2.5kΩ = 77.5kΩ
• TON = Main channel duty cycle / Phase frequency = (3.3V/12V) / 250kHz = 1.1µs
• Assume desired VRAMP = 1.5V
• CRAMP = (3 x ISYNC x TON ) / VRAMP = (3 x 150µA x 1.1µs) / 1.5V
• CRAMP = 330pF
10
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Error Amplifier and Soft-Start (FB, CO, & COMP, SS)
An internal wide bandwidth error amplifier is provided within the LM25115 for voltage feedback to the PWM
controller. The amplifier’s inverting input is connected to the FB pin. The output of the auxiliary converter is
regulated by connecting a voltage setting resistor divider between the output and the FB pin. Loop compensation
networks are connected between the FB pin and the error amplifier output (COMP). The amplifier’s non-inverting
input is internally connected to the SS pin. The SS pin is biased at 0.75V by a resistor divider connected to the
internal 1.27V bandgap reference. When the VCC voltage is below the UVLO threshold, the SS pin is discharged
to ground. When VCC rises and exceeds the positive going UVLO threshold (4.25V), the SS pin is released and
allowed to rise. If an external capacitor is connected to the SS pin, it will be charged by the internal resistor
divider to gradually increase the non-inverting input of the error amplifier to 0.75V. The equivalent impedance of
the SS resistor divider is nominally 60kΩ which determines the charging time constant of the SS capacitor.
During start-up, the output of the LM25115 converter will follow the exponential equation:
VOUT(t) = VOUT(final) x (1 - exp(-t/RSS x CSS))
where
•
•
•
Rss = internal resistance of SS pin (60kΩ)
Css = external Soft-Start capacitor
VOUT(final) = regulator output set point
The initial Δv / Δt of the output voltage is VOUT(final) / Rss x Css and VOUT will be within 1% of the final
regulation level after 4.6 time constants or when t = 4.6 x Rss x Css.
Pull-up current for the error amplifier output is provided by an internal 300µA current source. The PWM threshold
signal at the COMP pin can be controlled by either the open drain error amplifier or the open drain current
amplifier connected through the CO pin to COMP. Since the internal error amplifier is configured as an open
drain output it can be disabled by connecting FB to ground. The current sense amplifier and current limiting
function will be described in a later section.
Leading Edge Pulse Width Modulation
Unlike conventional voltage mode controllers, the LM25115 implements leading edge pulse width modulation. A
current source equal to 3 times the ISYNC current is used to charge the capacitor connected to the RAMP pin as
shown in Figure 13. The ramp signal and the output of the error amplifier (COMP) are combined through a
resistor network to produce a voltage ramp with variable dc offset (CRMIX in Figure 13). The high side MOSFET
which drives the HS pin is held in the off state at the beginning of the phase signal. When the voltage of CRMIX
exceeds the internal threshold voltage CV, the PWM comparator turns on the high side MOSFET. The HS pin
rises and the MOSFET delivers current from the main converter phase signal to the output of the auxiliary
regulator. The PWM cycle ends when the phase signal falls and power is no longer supplied to the drain of the
high side MOSFET.
Isync x 3
0.7V
RAMP
CLK
C RAMP
Phase or CLK
BUFFER
75K
RAMP
CRMIX
PWM
CV
40k
COMP
CV
100k
FB
SS
CRMIX
ERROR
AMP
0.75V
HS
Leading Edge
Modulation
Figure 13. Synchronization and Leading Edge Modulation
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Leading edge modulation of the auxiliary PWM controller is required if the main converter is implemented with
peak current mode control. If trailing edge modulation were used, the additional load on the transformer
secondary from the auxiliary channel would be drawn only during the first portion of the phase signal pulse.
Referring to Figure 14, the turn off the high side MOSFET of the auxiliary regulator would create a nonmonotonic negative step in the transformer current. This negative current step would produce instability in a peak
current mode controller. With leading edge modulation, the additional load presented by the auxiliary regulator on
the transformer secondary will be present during the latter portion of the phase signal. This positive step in the
phase signal current can be accommodated by a peak current mode controller without instability.
Main
PWM
Main
PWM
Auxilary
PWM
Trailing Edge
Modulation
Auxilary
PWM
Leading Edge
Modulation
Peak Current
Threshold
Peak Current
Threshold
Transformer
Current
Transformer
Current
Figure 14. Leading versus Trailing Edge Modulation
Voltage Mode Control with Current Injection
The LM25115 controller uniquely combines elements and benefits of current mode control in a voltage mode
PWM controller. The current sense amplifier shown in Figure 15 monitors the inductor current as it flows through
a sense resistor connected between CS and VOUT. The voltage gain of the sense amplifier is nominally equal to
16. The current sense output signal is shifted by 1.27V to produce the internal CV reference signal. The CV
signal is applied to the negative input of the PWM comparator and compared to CRMIX as illustrated in
Figure 13. Thus the PWM threshold of the voltage mode controller (CV) varies with the instantaneous inductor
current. Insure that the Vbias voltage is at least 3V above the regulated output voltage (VOUT).
Injecting a signal proportional to the instantaneous inductor current into a voltage mode controller improves the
control loop stability and bandwidth. This current injection eliminates the lead R-C lead network in the feedback
path that is normally required with voltage mode control (see Figure 16). Eliminating the lead network not only
simplifies the compensation, but also reduces sensitivity to output noise that could pass through the lead network
to the error amplifier.
The design of the voltage feedback path through the error amp begins with the selection of R1 and R2 in
Figure 16 to set the regulated output voltage. The steady state output voltage after soft-start is determined by the
following equation:
VOUT(final) = 0.75V x (1+R1/R2)
The parallel impedance of the R1, R2 resistor divider should be approximately 2kΩ (between 0.5kΩ and 5kΩ).
Lower resistance values may not be properly driven by the error amplifier output and higher feedback resistances
can introduce noise sensitivity. The next step in the design process is selection of R3, which sets the ac gain of
the error amplifier. The ac gain is given by the following equation and should be set to a value less than 30.
GAIN(ac) = R3/(R1|| R2) < 30
The capacitor C1 is connected in series with R3 to increase the dc gain of the voltage regulation loop and
improve output voltage accuracy. The corner frequency set by R3 x C1 should be less than 1/10th of the crossover frequency of the overall converter such that capacitor C1 does not add phase lag at the crossover
frequency. Capacitor C2 is added to reduce the noise in the voltage control loop. The value of C2 should be less
than 500pF and C2 may not be necessary with very careful PC board layout.
12
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PWM
Comparator
to PWM
Latch
CRMIX
CV
Negative Current
Comparator
Current
Sense Amp
CS
Low Side
Enable
1V
Vbias
Current
Limit Amp
1.27V
CO
VCL
2V
AV = 16
Gm = 15 mA/V
VOUT
Figure 15. Current Sensing and Limiting
VOUT
No Lead
Network
Required
R1
ERROR
AMP
FB
PWM
CV
40k
SS
100k
CSS
0.75V
60k
COMP
R3
C1
C2
R2
Figure 16. Voltage Sensing and Feedback
Current Limiting (CS, CO and VOUT)
Current limiting is implemented through the current sense amplifier as illustrated in Figure 15. The current sense
amplifier monitors the inductor current that flows through a sense resistor connected between CS and VOUT.
The voltage gain of the current sense amplifier is nominally equal to 16. The output of current sense amplifier is
level shifted by 1.27V to produce the internal CV reference signal. The CV signal drives a current limit amplifier
with nominal transconductance of 16mA/V. The current limit amplifier has an open drain (sink only) output stage
and its output pin, CO is typically connected to the COMP pin. During normal operation, the voltage error
amplifier controls the COMP pin voltage which adjusts the PWM duty cycle by varying the internal CRMIX level
(Figure 13). However, when the current sense input voltage VCL exceeds 45mV, the current limit amplifier pulls
down on COMP through the CO pin. Pulling COMP low reduces the CRMIX signal below the CV signal level.
When CRMIX does not exceed the CV signal, the PWM comparator inhibits output pulses until the CRMIX signal
increases to a normal operating level.
A current limit fold-back feature is provided by the LM25115 to reduce the peak output current delivered to a
shorted load. When the common mode input voltage to the current sense amplifier (CS and VOUT pins) falls
below 2V, the current limit threshold is reduced from the normal level. At common mode voltages > 2V, the
current limit threshold is nominally 45mV. When VOUT is reduced to 0V the current limit threshold drops to 36mV
to reduce stress on the inductor and power MOSFETs.
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Negative Current Limit
When inductor current flows from the regulator output through the low side MOSFET, the input to the current
sense comparator becomes negative. The intent of the negative current comparator is to protect the low-side
MOSFET from excessive currents. Negative current can lead to large negative voltage spikes on the output at
turn off which can damage circuitry powered by the output. The negative current comparator threshold is
sufficiently negative to allow inductor current to reverse at no load or light load conditions. It is not intended to
support discontinuous conduction mode with diode emulation by the low-side MOSFET. The negative current
comparator illustrated in Figure 15 monitors the CV signal and compares this signal to a fixed 1V threshold. This
corresponds to a negative VCL voltage between CS and VOUT of -17mV. The negative current limit comparator
turns off the low-side MOSFET for the remainder of the cycle when the VCL input falls below this threshold.
Gate Drivers Outputs (HO & LO)
The LM25115 provides two gate driver outputs, the floating high-side gate driver HO and the synchronous
rectifier low-side driver LO. The low-side driver is powered directly by the VCC regulator. The high-side gate
driver is powered from a bootstrap capacitor connected between HB and HS. An external diode connected
between VCC and HB charges the bootstrap capacitor when the HS is low. When the high-side MOSFET is
turned on, HB rises with HS to a peak voltage equal to VCC + VHS - VD where VD is the forward drop of the
external bootstrap diode. Both output drivers have adaptive dead-time control to avoid shoot through currents.
The adaptive dead-time control circuit monitors the state of each driver to ensure that the opposing MOSFET is
turned off before the other is turned on. The HB and VCC capacitors should be placed close to the pins of the
LM25115 to minimize voltage transients due to parasitic inductances and the high peak output currents of the
drivers. The recommended range of the HB capacitor is 0.047µF to 0.22µF.
Both drivers are controlled by the PWM logic signal from the PWM latch. When the phase signal is low, the
outputs are held in the reset state with the low-side MOSFET on and the high-side MOSFET off. When the phase
signal switches to the high state, the PWM latch reset signal is de-asserted. The high-side MOSFET remains off
until the PWM latch is set by the PWM comparator (CRMIX > CV as shown in Figure 13). When the PWM latch
is set, the LO driver turns off the low-side MOSFET and the HO driver turns on the high-side MOSFET. The highside pulse is terminated when the phase signal falls and the SYNC input comparator resets the PWM latch.
Free-Run Mode
The LM25115 can be operated as a conventional synchronous buck controller with a dc input supply instead of
the square wave phase signal. In the dc or free-run mode, the LM25115 PWM controller synchronizes to an
internal clock signal instead of the phase signal pulses. The clock frequency in the free-run mode is programmed
by the SYNC pin resistor and RAMP pin capacitor. Connecting a resistor between a dc bias supply and the
SYNC pin produces a current ISYNC which controls the charging current of the RAMP pin capacitor . The RAMP
capacitor is charged until its voltage reaches the free-run mode peak threshold of 2.25V. The RAMP capacitor is
then discharged for 300ns before beginning a new PWM cycle. The 300ns reset time of the RAMP pin sets the
minimum off time of the PWM controller in the free-run mode. The internal clock frequency in the free-run mode
is set by the synchronization current, ramp capacitor, free-run peak threshold, and 300ns deadtime.
FCLK ≊ 1 / ((CRAMP x 2.25V) / (ISYNC x 3) + 300ns)
Note that the VCC supply can be used as the dc bias to produce ISYNC. Note that the input voltage feedforward is
no longer functional in this operating mode, so the loop gain will vary as a function of Vin. The LM25115 controls
the buck power stage with leading edge pulse width modulaton to hold off the high-side driver until the necessary
volt*seconds is established for regulation. Other features described for the secondary side post regulator apply in
the free run mode operation. They include voltage mode control with current injection, positive and negative
current limit, programmable soft-start, adaptive delays for outputs, and thermal protection.
Thermal Protection
Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event the maximum junction
temperature limit is exceeded. When activated, typically at 165 degrees Celsius, the controller is forced into a low
power standby state with the output drivers and the bias regulator disabled. The device will restart when the
junction temperature falls below the thermal shutdown hysteresis, which is typically 25 degrees. The thermal
protection feature is provided to prevent catastrophic failures from accidental device overheating.
14
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Application Circuit
(Inputs from LM5025 Forward Active Clamp Converter, 36V to 78V)
Figure 17. LM25115 Secondary Side Post Regulator
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REVISION HISTORY
Changes from Original (March 2013) to Revision A
•
16
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 14
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PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM25115MT/NOPB
ACTIVE
TSSOP
PW
16
92
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L25115
MT
LM25115MTX/NOPB
ACTIVE
TSSOP
PW
16
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L25115
MT
LM25115SD/NOPB
LIFEBUY
WSON
NHQ
16
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L25115
LM25115SDX/NOPB
ACTIVE
WSON
NHQ
16
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L25115
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
16-Oct-2015
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Nov-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM25115MTX/NOPB
TSSOP
PW
16
2500
330.0
12.4
6.95
5.6
1.6
8.0
12.0
Q1
LM25115SD/NOPB
WSON
NHQ
16
1000
178.0
12.4
5.3
5.3
1.3
8.0
12.0
Q1
LM25115SDX/NOPB
WSON
NHQ
16
4500
330.0
12.4
5.3
5.3
1.3
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Nov-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM25115MTX/NOPB
LM25115SD/NOPB
TSSOP
PW
16
2500
367.0
367.0
35.0
WSON
NHQ
16
1000
210.0
185.0
35.0
LM25115SDX/NOPB
WSON
NHQ
16
4500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NHQ0016A
SDA16A (Rev A)
www.ti.com
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