MC100EPT26 1:2 Fanout Differential LVPECL to LVTTL Translator The MC100EPT26 is a 1:2 Fanout Differential LVPECL to LVTTL translator. Because LVPECL (Positive ECL) levels are used only +3.3V and ground are required. The small outline 8–lead SOIC package and the 1:2 fanout design of the EPT26 makes it ideal for applications which require the low skew duplication of a signal in a tightly packed PC board. The VBB output allows the EPT26 to be used in a single–ended input mode. In this mode the VBB output is tied to the D0 input for a non–inverting buffer or the D0 input for an inverting buffer. If used, the VBB pin should be bypassed to ground via a 0.01µF capacitator. • • • • • • • • • • • • • • http://onsemi.com MARKING DIAGRAMS* 8 SO–8 D SUFFIX CASE 751 8 1 HPT26 ALYW 1 8 1.4ns Typical Propagation Delay 275MHz Fmax (Clock bit stream, not pseudo–random) Differential LVPECL inputs Small Outline SOIC Package 24mA TTL outputs Flowthrough Pinouts ESD Protection: >2KV HBM, >100V MM Internal Input Resistors: Pulldown on D, Pulldown and Pullup on D Q Outputs will default LOW with inputs open or at VEE VBB Output New Differential Input Common Mode Range Moisture Sensitivity Level 1, Indefinite Time Out of Drypack. For Additional Information, See Application Note AND8003/D Flammability Rating: UL–94 code V–0 @ 1/8”, Oxygen Index 28 to 34 Transistor Count = 117 devices NC 1 8 TSSOP–8 DT SUFFIX CASE 948R 8 1 HR26 ALYW 1 A L Y W = Assembly Location = Wafer Lot = Year = Work Week *For additional information, see Application Note AND8002/D PIN DESCRIPTION FUNCTION PIN Q0, Q1 LVTTL Outputs D, D Differential LVPECL Input Pair VCC VBB Reference Voltage GND Ground Positive Supply VCC ORDERING INFORMATION D 2 7 Device Q0 LVTTL D VBB 3 4 6 LVPECL 5 Q1 Package Shipping MC100EPT26D SO–8 98 Units / Rail MC100EPT26DR2 SO–8 2500 / Reel MC100EPT26DT TSSOP–8 98 Units / Rail MC100EPT26DTR2 TSSOP–8 2500 / Reel GND Figure 1. 8–Lead Pinout (Top View) and Logic Diagram Semiconductor Components Industries, LLC, 2000 May, 2000 – Rev. 2 1 Publication Order Number: MC100EPT26/D MC100EPT26 MAXIMUM RATINGS* Value Unit VCC Symbol Power Supply (GND = 0V) Parameter 0 to 3.8 VDC VI Input Voltage (GND = 0V, VI not more positive than VCC) 0 to 3.8 VDC Iout Output Current 50 100 mA IBB VBB Sink/Source Current{ ± 0.5 mA TA Operating Temperature Range –40 to +85 °C Tstg Storage Temperature –65 to +150 °C θJA Thermal Resistance (Junction–to–Ambient) 190 130 °C/W θJC Thermal Resistance (Junction–to–Case) 41 to 44 ± 5% °C/W Tsol Solder Temperature (<2 to 3 Seconds: 245°C desired) 265 °C Continuous Surge Still Air 500lfpm * Maximum Ratings are those values beyond which damage to the device may occur. { Use for inputs of same package only. DC CHARACTERISTICS (VCC = 3.3V ± 0.3V; GND = 0V; TA = –40°C to 85°C) Symbol Characteristic Min Typ Max Unit ICCH Power Supply Current (Outputs set to HIGH) 10 20 18 mA ICCL Power Supply Current (Outputs set to LOW) 15 28 35 mA VIH Input HIGH Voltage (VCC = 3.3) (Note 1.) 2135 2420 mV VIL Input LOW Voltage (VCC = 3.3) (Note 1.) 1490 1825 mV IIH Input HIGH Current 150 µA IIL Input LOW Current 0.5 µA D D VOH Output HIGH Voltage (IOH = –3.0mA) (Note 2.) VOL Output LOW Voltage (IOL = 24mA) (Note 2.) IOS Output Short Circuit Current –150 2.4 VIHCMR Input HIGH Voltage Common Mode Range (Note 3.) V 0.5 V –50 –150 mA 2.0 3.3 V VBB Output Voltage Reference 2.0 V NOTE: 100EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained. 1. All values vary 1:1 with VCC. 2. All loading with 500 ohms to GND, CL = 20pF. 3. VIHCMR min varies 1:1 with GND, max varies 1:1 with VCC. AC CHARACTERISTICS (VCC = 3.3V ± 0.3V; GND = 0V) –40°C Symbol Characteristic Min Typ 25°C Max Min Typ 275 350 1.2 1.2 1.5 1.5 85°C Max Min Typ 275 350 1.3 1.2 1.7 1.5 Max Unit fmax Maximum Toggle Frequency (Note 4.) 275 350 tPLH, tPHL Propagation Delay to Output Differential (Note 5.) 1.2 1.2 1.5 1.5 tSK+ + tSK– – tSKPP Output–to–Output Skew++ Output–to–Output Skew– – Part–to–Part Skew (Note 6.) 60 25 500 60 25 500 60 25 500 ps tJITTER Cycle–to–Cycle Jitter TBD TBD TBD ps VPP Input Voltage Swing (Diff.) 150 800 1.8 1.8 1200 150 800 tr Output Rise/Fall Times tf 330 600 900 330 600 (0.8V – 2.0V) Q, Q 4. Fmax guaranteed for functionality only. VOL and VOH levels are guaranteed at DC only. 5. Reference (VCC = 3.3V ± 5%, GND = 0V) 6. Skews are measured between outputs under identical transitions. http://onsemi.com 2 1.8 1.8 MHz 2.2 1.8 1200 150 800 1200 900 330 650 900 ns mV ps MC100EPT26 PACKAGE DIMENSIONS SO–8 D SUFFIX PLASTIC SOIC PACKAGE CASE 751–06 ISSUE T D A 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETER. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. C 5 0.25 H E M B M 1 4 h B e X 45 _ q A C SEATING PLANE L 0.10 A1 B 0.25 M C B S A S DIM A A1 B C D E e H h L q http://onsemi.com 3 MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ MC100EPT26 PACKAGE DIMENSIONS TSSOP–8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R–02 ISSUE A 8x 0.15 (0.006) T U K REF 0.10 (0.004) S 2X L/2 8 1 PIN 1 IDENT S S V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–. S 5 0.25 (0.010) B –U– L 0.15 (0.006) T U T U M M 4 A –V– F DETAIL E C 0.10 (0.004) –T– SEATING PLANE D –W– G DETAIL E DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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