SLS HC365 Hex 3-state noninverting buffer with common enable Datasheet

SL74HC365
Hex 3-State Noninverting Buffer
with Common Enables
High-Performance Silicon-Gate CMOS
The SL74HC365 is identical in pinout to the LS/ALS365. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LS/ALSTTL outputs.
This device is a high-speed hex buffer with 3-state outputs and two
common active-low Output Enables. When either of the enables is high,
the buffer outputs are placed into high-impedance states. The
SL74HC365 has noninverting outputs.
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1.0 µA
• High Noise Immunity Characteristic of CMOS Devices
ORDERING INFORMATION
SL74HC365N Plastic
SL74HC365D SOIC
TA = -55° to 125° C for all packages
PIN ASSIGNMENT
LOGIC DIAGRAM
FUNCTION TABLE
Inputs
PIN 16 =VCC
PIN 8 = GND
Output
Enable
1
Enable 2
A
Y
L
L
L
L
L
L
H
H
H
X
X
Z
X
H
X
Z
Z = high impedance
X = don’t care
SLS
System Logic
Semiconductor
SL74HC365
MAXIMUM RATINGS *
Symbol
Parameter
Value
Unit
-0.5 to +7.0
V
VCC
DC Supply Voltage (Referenced to GND)
VIN
DC Input Voltage (Referenced to GND)
-1.5 to VCC +1.5
V
DC Output Voltage (Referenced to GND)
-0.5 to VCC +0.5
V
DC Input Current, per Pin
±20
mA
DC Output Current, per Pin
±35
mA
ICC
DC Supply Current, VCC and GND Pins
±75
mA
PD
Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
750
500
mW
-65 to +150
°C
260
°C
VOUT
IIN
IOUT
Tstg
Storage Temperature
TL
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
*
Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
DC Supply Voltage (Referenced to GND)
VIN, VOUT
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, t f
Input Rise and Fall Time (Figure 1)
VCC =2.0 V
VCC =4.5 V
VCC =6.0 V
Min
Max
Unit
2.0
6.0
V
0
VCC
V
-55
+125
°C
0
0
0
1000
500
400
ns
This device contains protection circuitry to guard against damage due to high static voltages or electric
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range
GND≤(VIN or VOUT)≤VCC.
Unused inputs mu st always be tied to an appropriate logic voltage level (e.g., either GND or VCC).
Unused outputs must be left open.
SLS
System Logic
Semiconductor
SL74HC365
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
VCC
V
25 °C
to
-55°C
≤85
°C
≤125
°C
Unit
VOUT= VCC-0.1 V
IOUT≤ 20 µA
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
Maximum Low -Level
Input Voltage
VOUT=0.1 V
IOUT ≤ 20 µA
2.0
4.5
6.0
0.3
0.9
1.2
0.3
0.9
1.2
0.3
0.9
1.2
V
Minimum High-Level
Output Voltage
VIN=VIH
IOUT ≤ 20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
4.5
6.0
3.98
5.48
3.84
5.34
3.7
5.2
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
VIN= VIL
IOUT ≤ 6.0 mA
IOUT ≤ 7.8 mA
4.5
6.0
0.26
0.26
0.33
0.33
0.4
0.4
Symbol
Parameter
VIH
Minimum High-Level
Input Voltage
VIL
VOH
Test Conditions
VIN=VIH
IOUT ≤ 6.0 mA
IOUT ≤ 7.8 mA
VOL
Guaranteed Limit
Maximum Low-Level
Output Voltage
VIN= VIL
IOUT ≤ 20 µA
V
IIN
Maximum Input
Leakage Current
VIN=VCC or GND
6.0
±0.1
±1.0
±1.0
µA
IOZ
Maximum Three-State
Leakage Current
Output in High-Impedance
State
VIN= VIL or VIH
VOUT=VCC or GND
6.0
±0.5
±5.0
±10
µA
ICC
Maximum Quiescent
Supply Current
(per Package)
VIN=VCC or GND
IOUT=0µA
6.0
8.0
80
160
µA
SLS
System Logic
Semiconductor
SL74HC365
AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input t r=t f=6.0 ns)
VCC
Symbol
Parameter
Guaranteed Limit
V
25 °C to
-55°C
≤85°C
≤125°C
Unit
tPLH, t PHL
Maximum Propagation Delay, Input A to
Output Y (Figures 1 and 3)
2.0
4.5
6.0
120
24
20
150
30
26
180
36
31
ns
tPLZ, t PHZ
Maximum Propagation Delay ,Output Enable to
Output Y (Figures 2 and 4)
2.0
4.5
6.0
220
44
37
275
55
47
330
66
56
ns
tPZL, t PZH
Maximum Propagation Delay ,Output Enable to
Output Y (Figures 2 and 4)
2.0
4.5
6.0
220
44
37
275
55
47
330
66
56
ns
tTLH, t THL
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
2.0
4.5
6.0
60
12
10
75
15
13
90
18
15
ns
Maximum Input Capacitance
-
10
10
10
pF
Maximum Three-State Output Capacitance
(Output in High-Impedance State)
-
15
15
15
pF
CIN
COUT
Power Dissipation Capacitance (Per Buffer)
CPD
Used to determine the no-load dynamic power
consumption:
PD=CPDVCC2f+ICCVCC
Figure 1. Switching Waveforms
SLS
System Logic
Semiconductor
Typical @25°C,VCC=5.0 V
40
Figure 2. Switching Waveforms
pF
SL74HC365
Figure 3. Test Circuit
Figure 4. Test Circuit
EXPANDED LOGIC DIAGRAM
(1/6 of the Device)
SLS
System Logic
Semiconductor
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