Foshan MMBT2222A Silicon npn transistor in a sot-23 plastic package Datasheet

MMBT2222A
Rev.F Apr.-2017
描述
/
DATA SHEET
Descriptions
SOT-23 塑封封装 NPN 半导体三极管。Silicon NPN transistor in a SOT-23 Plastic Package.

特征
/ Features
集电极电流可达到 600mA。
Collector currents up to 600 mA.

用途
/
Applications
用于普通放大。
General purpose amplifier.

内部等效电路
引脚排列
/ Equivalent Circuit
/ Pinning
3
1
2
PIN 1:Base
放大及印章代码
hFE Range
PIN 2: Emitter
PIN 3:Collector
/ hFE Classifications & Marking
100~300
Marking
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H1P
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MMBT2222A
Rev.F Apr.-2017
极限参数
/
DATA SHEET
Absolute Maximum Ratings(Ta=25℃)
参数
Parameter
Collector to Base Voltage
符号
Symbol
VCBO
数值
Rating
75
单位
Unit
V
Collector to Emitter Voltage
VCEO
40
V
Emitter to Base Voltage
VEBO
6.0
V
Collector Current
IC
600
mA
Collector Power Dissipation
PC
350
mW
Junction Temperature
Tj
150
℃
Tstg
-55~150
℃
Storage Temperature Range
电性能参数
/ Electrical Characteristics(Ta=25℃)
参数
Parameter
Collector to Base Breakdown
Voltage
Collector to Emitter Breakdown
Voltage
Emitter to Base Breakdown
Voltage
Collector Cut-Off Current
符号
Symbol
测试条件
Test Conditions
最小值 典型值 最大值 单位
Min
Typ
Max
Unit
VCBO
IC=10μA
IE=0
75
V
VCEO
IC=10mA
IB=0
40
V
VEBO
IE=10μA
IC=0
6.0
V
ICBO
VCB=60V
IE=0
0.01
μA
Base Cut-Off Current
IEBO
VEB=5.0V
IC=0
0.1
μA
DC Current Gain
hFE(1)
VCE=10V
IC=150mA
VCE(sat) (1)
IC=150mA
IB=15mA
0.3
V
VCE(sat) (2)
IC=500mA
IB=50mA
1.0
V
VBE(sat) (1)
IC=150mA
IB=15 mA
1.2
V
VBE(sat) (2)
IC=500mA
IB=50mA
VCB=10V
f=1.0MHz
IE=0
IC=20mA
VCE=20V
f=100MHz
VCC=30V
VBE=-0.5V
IC=150mA
IB1=15mA
VCC=30V
IC=150mA
IB1=IB2=15mA
2.0
V
8.0
pF
Collector-Emitter Saturation
Voltage
Base-Emitter Saturation Voltage
Output Capacitance
Cob
Transition Frequency
fT
Turn–On Time
ton
Turn–Off Time
toff
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100
0.6
300
300
MHz
35
ns
285
ns
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MMBT2222A
Rev.F Apr.-2017
电参数曲线图
DATA SHEET
/ Electrical Characteristic Curve
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MMBT2222A
Rev.F Apr.-2017
外形尺寸图
DATA SHEET
/ Package Dimensions
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MMBT2222A
Rev.F Apr.-2017
印章说明
/
DATA SHEET
Marking Instructions
H1P
说明:
H: 
为公司代码
1P: 
为型号代码
Note:
H:
Company Code
1P:
Product Type Code
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MMBT2222A
Rev.F Apr.-2017
DATA SHEET
回流焊温度曲线图(无铅)
/
Temperature Profile for IR Reflow Soldering(Pb-Free)
说明:
Note:
1、预热温度 25~150℃,时间 60~90sec;
1.Preheating:25~150℃, Time:60~90sec.
2、峰值温度 245±5℃,时间持续为 5±0.5sec;
2.Peak Temp.:245±5℃, Duration:5±0.5sec.
3、焊接制程冷却速度为 2~10℃/sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件
/
Resistance to Soldering Heat Test Conditions
温度:260±5℃
包装规格
Time:10±1 sec
/ REEL
Package Type
封装形式
使用说明
Temp.:260±5℃
/ Packaging SPEC.
卷盘包装
SOT-23
时间:10±1 sec.
Units 包装数量
Dimension
包装尺寸
3
(unit:mm )
Units/Reel
只/卷盘
Reels/Inner Box
卷盘/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Reel
Inner Box 盒
Outer Box 箱
3,000
10
30,000
6
180000
7〞×8
180×120×180
390×385×205
/ Notices
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