Cirrus CS1600-FSZ Low-cost pfc controller for electronic ballast Datasheet

CS1600
Low-cost PFC Controller for Electronic Ballasts
Features & Description
Description
 Lowest PFC System Cost for Electronic Ballasts
CS1600 is a high-performance Variable Frequency Discontinuous Conduction Mode (VF - DCM), active Power Factor
Correction (PFC) controller, optimized to deliver the lowest PFC
system cost for electronic ballast applications.
 Variable Frequency Discontinuous Conduction Mode
 Improved Efficiency Due to Variable Switching Frequency
A variable ON time / variable frequency algorithm is used to
achieve near unity power factor. This algorithm spreads the EMI
frequency spectrum, which reduces the conducted EMI filtering
requirements. The feedback loop is closed through an integrated
compensation network within the IC, eliminating the need for
additional external components. Protection features such as
overvoltage, overcurrent, overpower, open- and short-circuit protection, overtemperature, and brownout help protect the device
during abnormal transient conditions.
 EMI Signature Reduction from Digital Noise Shaping
 Integrated Feedback Compensation
 Overvoltage Protection with Hysteresis
 Overpower Protection with Shutdown
 UVLO with Wide Hysteresis
 Thermal Shutdown with Hysteresis
Pin Assignments
NC
1
8
NC
STBY
2
7
VDD
IAC
3
6
GD
FB
4
5
GND
8-lead SOIC
D5
L1
R1a
BR1
RAC
R2a
CS1600
1
C1
AC
Mains
R1c
3
+12V
BR1
Advance Product Information
Cirrus Logic, Inc.
http://www.cirrus.com
RFB
BR1
R1b
BR1
D6
7
C2
8
R2b
NC
STBY
IAC
FB
VDD
NC
GD
GND
C3a Clink
2
R2c
4
C3b
6
R3
Q1
5
This document contains information for a product under development.
Cirrus Logic reserves the right to modify this product without notice.
Copyright  Cirrus Logic, Inc. 2010
(All Rights Reserved)
JUN ‘10
DS904A6
CS1600
1. PIN DESCRIPTIONS
NC
1
8
NC
STBY
2
7
VDD
IAC
3
6
GD
FB
4
5
GND
Table 1. Pin Descriptions
Pin Name
Pin #
I/O
Description
NC
1, 8
-
No Connect — Connect these pins to VDD to prevent any leakage path that could
arise from leaving them unterminated.
STBY
2
IN
Standby — This is an active-low pin. Shorting this pin to GND disables PFC switching. The input has a pull-up resistor and should be driven with an open-collector
device. Leave this pin unterminated when not in use.
IN
Rectified Line Voltage Sense — The IAC pin is used to sense the rectified line voltage. This signal, in conjunction with the signal on the FB pin, is used in the Power
Factor Correction (PFC) algorithm
A filter capacitor of up to 2.2 nF may be added between this pin and VDD to provide
noise immunity.
IAC
FB
4
IN
Feedback Voltage Sense — The FB pin is used to sense the output voltage of the
PFC stage. This signal, in conjunction with the signal on the IAC pin, is used in the
Power Factor Correction (PFC) algorithm.
A filter capacitor of up to 2.2 nF may be added between this pin and VDD to provide
noise immunity.
GND
5
–
Ground — GND is a common reference for all the functional blocks in this device.
GD
6
OUT
Gate Drive — GD is the output of the device with a source capability of 0.5 A and a
current sink capacity of 1 A.
VDD
2
3
7
IN
IC Supply Voltage — VDD is the input used to provide bias to the device. This pin
has an internal shunt to ground. An external bias needs to be applied for steadystate operation. A low-ESR ceramic decoupling capacitor at this pin is recommended
for reliable operation of this device.
DS904A6
CS1600
2. CHARACTERISTICS AND SPECIFICATIONS
2.1
Absolute Maximum Ratings
Pin
Symbol
Parameter
Value
Unit
Vz
V
7
VDD
IC Supply
2,3,4
VIN
Input Voltage
-0.5 to VDD
V
3,4
IIN
Input Current
50
mA
6
VGD
Gate Drive Voltage
-0.3 to VDD
V
6
IGD
Gate Drive Current
-1.0 / +0.5
A
1,2,3,4,5,6,8
ESD
Human Body Model
2000
V
1,2,3,4,5,6,8
ESD
Machine Model
200
V
1,2,3,4,5,6,8
ESD
Charged Device Model
500
V
-
PD
Total Power Dissipation at 50° C2
600
mW
-
TJ
Junction Temperature Operating Range
-40 to +125
ºC
-
TStg
Storage Temperature Range
-65 to +150
ºC
Voltage1
Notes: 1. The CS1600 has an internal shunt regulator that controls the nominal operating voltage on the VDD pin.
2.
2.2
Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power
dissipation at the rate of 50 mW / ºC for variation over temperature.
Electrical Characteristics
Recommended operating conditions (unless otherwise specified): TA = TJ = -40º to +125º C, VDD = 10 to 15 V, GND = 0 V.
Typical values are at TA = 25º C.
Parameter
Condition
Symbol
Min
Typ
Max
Unit
VDD Turn-on Threshold Voltage
VDD increasing
Vth(St)
8.4
8.8
9.3
V
VDD Turn-off Threshold Voltage
VDD decreasing
Vth(Stp)
7.1
7.4
7.9
V
VHys
-
1.3
-
V
IDD = 20 mA
VZ
17.0
17.9
18.5
V
Start-up Supply Current
VDD < Vth(St)
IST
-
68
80
μA
Standby Supply Current
STBY < 0.8V
ISB
-
80
112
μA
CL = 1nF, fsw = 70 kHz
IDD
-
1.7
1.9
mA
Maximum Operating Frequency3,4
Normal mode, VDD = 13 V
fSW(max)
62
66
70
kHz
Minimum Operating Frequency3,4
Normal mode, VDD = 13 V
fSW(min)
20
22
23
kHz
Minimum Duty Cycle
VDD = 13 V, STBY < 0.8 V
tDC_min
-
-
0
%
Maximum Duty Cycle3,4
VDD = 13 V
Dmax
64
66
68
%
Minimum On Time
VDD = 13 V
ton_min
0.45
0.5
0.55
μs
Output Source Resistance
IGD = 100 mA, VDD = 13 V
ROH
-
9
-
Ω
Output Sink Resistance
IGD = -200 mA, VDD = 13 V
ROL
-
6
-
Ω
CL = 1 nF, VDD = 13 V
tr
-
32
45
ns
VDD Supply Voltage
UVLO Hysteresis
Zener Voltage
Supply Current Section
Operating Supply Current
PFC Gate Drive Section
Rise Time
DS904A6
3
CS1600
Parameter
Condition
Fall Time
Symbol
Min
Typ
Max
Unit
CL = 1 nF, VDD = 13 V
tf
-
15
25
ns
Output Voltage Low
IGD = -200 mA,VDD = 13 V
VOL
-
0.9
1.3
v
Output Voltage High
IGD = 100 mA,VDD = 13 V
VOH
11.3
11.8
-
v
Feedback and Protection
Iref
127
130
133
μA
Overvoltage Protection Threshold
IOVP/Iref
105
107
110
%
Overvoltage Protection Current Hysteresis
IOVP(Hy)
-
4
-
%
Undervoltage Protection Threshold
IUVP/Iref
83
85
87
%
Undervoltage Protection Current Hysteresis
IUVP(Hy)
-
10
-
%
123
125
127
%
35
49
60
%
Reference Current
Overpower Protection Threshold 3,4
% of full load as defined by Eq. 3
Overpower Protection Recovery 3,4
Input Brownout Protection Threshold7
Vout = 460V, GDRV turns off
VBP(th)
82
86
90
Vrms
Input Brownout Recovery Threshold7
Vout = 460V, GDRV turns on
VBR
94
97
100
Vrms
Thermal Shutdown Threshold 3
TSD
130
143
155
ºC
Thermal Shutdown Hysteresis
TSD(Hy)
-
9
-
ºC
VDD – 0.8
-
0.8
-
V
Thermal Protection
STBY Input
Logic Threshold 5
2.3
Thermal Characteristics
Symbol
Parameter
Value
Unit
RθJA
Thermal Resistance (Junction to Ambient)6.
159
ºC / W
RθJC
Thermal Resistance (Junction to Case)6.
39
ºC / W
3.
4.
5.
6.
7.
4
Low
High
Specifications guaranteed by design & characterization.
Specifications measured as an instantaneous quantity NOT as a time-averaged quantity.
STBY is designed to be driven by an open-collector device. The input is internally pulled up with a 600 kΩ resistor.
The package thermal impedance is calculated in accordance with JESD 51.
For an output voltage, Vout, other than 460V, the threshold scales by a factor of Vout/460
DS904A6
CS1600
3. TYPICAL ELECTRICAL PERFORMANCE
3.5
13
CL = 1 nF
fSW = 70 kHz
TA = 25 °C
3
2.5
12
VDD (V)
IDD (mA)
11
2
10
1.5
Rising
9
1
Startup
Falling
8
0.5
UVLO
0
0
1
2
3
4
5
6
7
8
9
7
-50
10 11 12 13 14 15 16
VDD (V)
Figure 1. UVLO Characteristics
50
TEMP (o C)
100
150
Figure 2. Start-up & UVLO vs. Temperature
19
2
IDD = 20 mA
18.5
1.5
VZ (V)
UVLO Hysteresis (V)
0
1
0.5
18
17.5
0
17
-50
0
50
TEMP ( o C)
100
Figure 3. UVLO Hysteresis vs. Temperature
DS904A6
150
-50
0
50
100
150
TEMP ( oC)
Figure 4. VDD Zener Voltage vs. Temperature
5
CS1600
1.8
14
Operating
12
VDD = 13 V
CL = 1 nF
1.4
1.2
Source
10
Zout (Ohm)
Supply Current (mA)
1.6
fSW = 70 kHz
1.0
0.8
6
0.6
VDD = 13 V
Isource = 100 mA
Isink = 200 mA
Sink
4
0.4
0.2
2
Start-up
0
-50
Standby
Start-up
Standby
0
50
TEMP ( o C)
100
150
Figure 5. Supply Current (ISB, IST, IDD) vs. Temperature
6
8
0
-60
-40
-20
0
20
40
60
80
100
120
Gate Resistor (ROH, ROL) Temp (oC)
140
Figure 6. Gate Resistance (ROH, ROL) vs. Temperature
DS904A6
CS1600
4. INTRODUCTION
the frequency varies approximately 2:1 as shown in
Figure 7 below.
120
Switching Frequency (% of Max)
100
80
% of Max
CS1600 is a digitally controlled Power Factor Correction
(PFC) controller that operates in the Variable Frequency
Discontinuous Conduction Mode (VF - DCM). The CS1600
uses a proprietary digital algorithm to optimize control of the
power switch to deliver highly efficient performance for
electronic ballast applications. With this control scheme, the
total number of external components needed is minimized in
comparison to conventional control techniques, thus reducing
the overall system cost.
60
Line Voltage (% of Max)
40
Digital control is achieved by constantly monitoring two voltages
– the PFC output voltage (Vlink) at pin FB and the rectified AC line
voltage (Vrect) at pin IAC. This is done by measuring the currents
that flow into the respective pins. These currents are then fed to
the inputs of two analog-to-digital converters (ADCs) and are
compared against an internal target current, Iref.
The digital outputs of the two ADCs are then processed in a
control algorithm which determines the behavior of the
CS1600 during start-up, normal operation, and under fault
conditions such as brownout, overvoltage, overcurrent,
overpower, and over-temperature. Details of operation during
these conditions are discussed in later sections of this
document.
Some of the key features of the CS1600 are as follows:
• Discontinuous Conduction Mode with Continuously
Variable Switching Frequency
The PFC switching frequency is varied every switching
cycle. This allows for a spread spectrum which minimizes
the conducted EMI peaks at any given frequency, thereby
minimizing the size and cost of the EMI filter required at
the front-end.
During start-up, the control algorithm limits the maximum
ON time and adjusts the frequency to avoid inductor saturation and provides a near-trapezoidal envelope for the
input current during every half cycle. During normal operation, as the line voltage changes over half of a line cycle,
DS904A6
20
0
0
45
90
135
180
Rectified Line Voltage Phase (Deg.)
Figure 7. Switching Frequency vs. Phase Angle
Maximum power transfer occurs at the peak of the AC line
voltage, at which time, the frequency reaches its maximum value. Switching losses are minimized during periods of low power transfer by switching at lower
frequencies near the zero-crossing of the AC line.
This switching frequency profile helps reduce total BOM
cost through savings in the size of the boost inductor and
the EMI filter components, while at the same time, improving overall system efficiency.
• Integrated Feedback Control
No external feedback compensation components are required for the CS1600. The internal digital control engine
self-compensates the feedback error signal using an
adaptive control algorithm.
• Protection Features
The CS1600 provides various protection features such as
undervoltage, overcurrent, overpower, open and short
circuit protection and brownout. It also provides the user
with the option of using the STBY pin to disable switching
of the device.
7
CS1600
4.1
PFC Implementation
The PFC switching frequency profile over the line period has
been discussed in detail in Section 4. In addition, the digital
control algorithm tracks changes the AC input and operates in
different frequency bands at different line voltages as
illustrated in Figure 8 and Figure 9 below.
CRM mode near the peaks of the input line, in order to enable
maximum power delivery, as illustrated in Figure 10 below.
DCM
Quasi
CRM
DCM
Quasi
CRM
DCM
ILB
fSW
[kHz]
100
Burst Mode
Max fSW
70
Figure 10. DCM and quasi-CRM Operation with CS1600
4.1.1
Start-up Mode vs. Normal Mode
CS1600 operates in two discrete states:
35
Min fSW
5%
50%
Start-up mode:
100%
PO [W]
Figure 8. Switching Frequency vs. Output Power
Vin < 165 VAC
During this start-up phase of operation, the switching
frequency could be significantly lower than the normal
operating frequency, and the input current waveform is forced
into following a trapezoidal envelope in phase with the line
voltage, to maximize energy transfer. The ON time and the
switching frequency of the IC ensure that peak currents are
kept controlled to prevent saturation of the boost inductor
during this period.
fSW
[kHz]
Burst Mode
60
Max fSW
48
When the output voltage of the PFC stage, Vlink, is <90% of its
nominal value, the device operates in the start-up mode. It
continues operating in this mode till the nominal Vlink voltage
is reached. The start-up algorithm provides an ON time which
is varied in proportion to the sensed rectified voltage, while
changing the switching frequency to provide maximum power.
Normal mode:
5%
50%
100%
PO [W]
Figure 9. Switching Frequency vs. Output Power
Vin > 165 VAC
The CS1600 primarily operates in the DCM mode with a
properly sized inductor. However, it will move into a quasi-
Once Vlink reaches its nominal value, the chip operates in the
normal mode. Here, the frequency follows the profile shown in
Figure 7, and the ON time is varied to achieve PFC. Any drop
in Vlink to below its undervoltage threshold, as defined in
Section 2.2. Electrical Characteristics re-triggers the start-up
mode of operation. A simplified illustration of operation in
these two modes is shown below in Figure 11.
100%
90%
Normal Mode
Startup Mode
Min fSW
Startup Mode
24
Normal Mode
t [ms]
Figure 11. Start-up and Normal Modes
8
DS904A6
CS1600
4.1.2
Burst Mode
Iref = Target Reference current used for feedback
In addition to the start-up mode and normal mode of operation,
the controller enters the burst mode of operation when the
estimated output power (PO) is < 5% of its nominal value.
During this stage, the PFC driver is disabled intermittently over
a full line cycle period, as shown in Figure 12. The period of
time for which the PFC drive is disabled depends on the level
of loading present..
Vlink
RFB
IFB
VDD
7
RIFB
15k
PO
[W]
FB
5%
Burst Mode
Active
ADC
4
Figure 13. Output Feedback
Vlink
t [ms]
Vin
[V]
PFC
Disable
Vin
IFB
RFB
FET Vgs
VDD
7
RIFB
15k
t [ms]
FB
ADC
4
Figure 12. Burst Mode of Operation
4.2
Input Feedforward and Output
Regulation
Figure 14. Input Feedforward
The CS1600 continuously monitors the rectified AC line and
the PFC output voltage through sense resistors tied to the IAC
and the FB pins to monitor the voltages, scaled as currents.
The rectified AC line sense resistor RAC needs to be the same
size of the resistor RFB used for current feedback from the
PFC output voltage. These currents are effectively compared
against an internal reference current to provide adaptive PFC
control. The resistor values are calculated as follows:
V link – V DD
R FB = ----------------------------I ref
[Eq.1]
R AC = R FB
[Eq.2]
RFB = Feedback resistor used to sense the PFC output
voltage
RAC = Feedforward resistor used to sense the rectified line
voltage
VDD = IC Supply Voltage
DS904A6
Protection Features
4.3.1
Overvoltage Protection
If the PFC output voltage, Vlink, exceeds the overvoltage
threshold, as scaled by the current monitored by the sense
resistors, the CS1600 provides protection by disabling the
gate drive. A nominal hysteresis is provided to allow the
system to recover from the fault condition, before switching is
resumed.
4.3.2
Overcurrent Protection
The CS1600’s digital controller algorithm limits the ON
time of the Power MOSFET by the following equation:
where
Vlink= PFC Output Voltage
4.3
0.001126
T on ≤ ------------------------V rect
Where Ton is the max time that the power MOSFET is
turned on and Vrect is the rectified line voltage. In the
event of a sudden line surge or sporadic, high dv/dt line
voltages, this equation may not limit the ON time appropriately. For this type of line disturbance, additional protection mechanisms, such as fusible resistors, fast-blow
fuses, or other current-limiting devices, are recommended.
9
CS1600
4.3.3
Overpower Protection
The nominal output power is estimated internally by the
CS1600 from the following equation
2 V link – ( V in ( min ) × 2 )
Po = α × η × ( V in ( min ) ) × --------------------------------------------------------2 × f max × L B × V link
[Eq.3]
where
Po = rated output power of the system
η = efficiency of the boost converter = estimated as 100% by
the internal PFC algorithm
Vin(min) = minimum RMS line voltage for operation
Vlink = PFC output voltage
fmax = maximum switching frequency
LB = boost inductor used in the application
V link
V link –  -------------- × 90V × 2
V
400V
90V
link
α =  -------------- × -------------------- × --------------------------------------------------------------------400V V in ( min )
V link – V in ( min ) × 2
for the output voltage, drops to 49% of its nominal value.
Detection of brownout for a period of 56 ms disables the gate
drive. The device continues to monitor the input voltage while
in this condition. The CS1600 exits the brownout mode when
the input current scales up to, and stays above 56.4% of its
nominal value for a period of 56 ms.
To minimize false detects, the brownout detection circuit
increases the brownout detection time by a factor of 1.6 mS/V
for every volt differential between the minimum operating
voltage and the brownout threshold, following half of a line
cycle of exceeding the brownout threshold. The following
diagram illustrates the brownout sequence whereby the
CS1600 enters standby, and upon recovery from brownout,
enters normal operation..
TBrownout
Brownout
Thresholds
Upper
Lower
2
Start
Timer
Enter Standby
Start Timer
Operation estimated to be at power levels higher than that
calculated by Eq. 3 above is tracked by the IC as an
overpower condition. During this phase, the PFC output
voltage, Vlink, is reduced and will continue to decrease as the
power draw increases. When Vlink reaches its undervoltage
threshold, it goes into the start-up mode as explained in
section 4.1.1.
4.3.6
At this point, the overpower protection timer is activated. If this
condition continues to exist for 112 ms, the gate drive is
disabled for a period of about 3 seconds. This “hiccup” mode
of operation continues until the fault is removed.
4.4
If a value of the boost inductor other than that obtained from
Eq. 3 above is used, the total output power capability as well
as the thresholds for the different operating conditions will
scale accordingly.
4.3.4
Open/short circuit protection
56 ms
56 ms
Figure 15. Brownout
Over-temperature Protection
Over-temperature protection is activated and PFC switching is
disabled when the die temperature of the device exceeds
125°C. There is a hysteresis of about 30°C before resumption
of normal operation.
Standby (STBY) Function
The standby (STBY) pin may be used as a means to force the
CS1600 into a non-operating, low-power state. The STBY
input should be driven by an open-collector/open-drain
device. Internal to the pin, there is a pull-up resistor connected
to the VDD pin as shown in Figure 16. A filter capacitance of
about 1000 pF is recommended while this pin is being used.
CAP
The CS1600 protects the system in case the feedforward
resistor tied to the IAC pin or the feedback resistor tied to the
FB pin is open or shorted to ground.
A fault seen on the resistor going into the FB pin would imply
no current being fed into the pin, which would trigger the Vlink
undervoltage algorithm as described in Section 4.3.1.
A fault detected on the IAC pin would trigger the brownout
condition discussed in Section 4.3.5 below.
4.3.5
Brownout Protection
Brownout occurs when the current representing the rectified
input voltage, nominally 100% of the reference current used
10
Exit Standby
600 kΩ
STBY
CS1600
<1 nF
See Text
GND
Figure 16. STBY Pin Connection
DS904A6
CS1600
5. FLUORESCENT BALLAST APPLICATION EXAMPLE
The following section gives an example for a front-end PFC stage design for an electronic ballast application. The equations that
follow may be used as guidelines for any other requirements using the CS1600.
D5
L1
R1a
BR1
RAC
R2a
RFB
BR1
CS1600
R1b
1
R1c
C1
AC
Mains
3
+12V
BR1
D6
7
C2
BR1
8
R2b
NC
STBY
IAC
FB
VDD
NC
GD
GND
C3a Clink
2
R2c
4
C3b
6
R3
Q1
5
Figure 17. CS1600 Basic Application Circuit
5.1
Component Selection Guidelines
The following design example is for a wide-input-voltage
fluorescent ballast application using 2 T5 lamps in series for a
total nominal power of 108W.The target specifications for the
PFC portion of the design, assuming a 94% efficient second
stage, are as follows:
5.1.1
108 VAC
Vin(max)
305 VAC
Vlink
460 V
Po
115 W
η
95%
IAC and IFB Sense Resistors
The rectified line voltage, VAC, and the output voltage of the
PFC boost converter, Vlink, are scaled as currents by using
sense resistors, whose values are estimated based on the
equations below:
V link – V dd
[Eq.4]
R FB = ---------------------------I ref
R FB = 3.45MΩ
DS904A6
[Eq.5]
R AC = 3.45MΩ
where
Vin(min)
460 – 12
R FB = --------------------------–6
130 × 10
R AC = R FB
RFB = Feedback resistor used to reflect the PFC output
voltage
RAC = Feedforward resistor used to reflect the rectified line
voltage
Vlink= PFC Output Voltage
VDD = IC Supply Voltage
Iref = Target reference current used for feedback
1% or lower tolerance resistors are recommended to
maximize the tightly toleranced system behavior provided by
the unique digital controller in the CS1600. Resistors may be
separated into two or more series elements if voltage
breakdown and/or regulatory compliance is of concern.
5.1.2
PFC Input Filter Capacitor
For a typical 115 W PFC output stage required to power up a
108 W fluorescent ballast, an input filter capacitance of
0.33 μF is recommended. Capacitor tolerances and the value
of the EMI filter capacitor need to be considered when
selecting the value of the capacitor to be used in this
application.
11
CS1600
5.1.3
PFC Boost Inductor
5.1.4
PFC MOSFET
Equation 3 can be rewritten to calculate the PFC boost
Inductor, LB, as follows:
 V link

2 V link –  -------------- × 90V × 2
V
400V
90V
link


α = -------------- × -------------------- × --------------------------------------------------------------------- [Eq.6]
 400V V in ( min )
V link – V in ( min ) × 2
The peak voltage stress on the PFC MOSFET is a diode drop
above the output voltage. Accounting for leakage spikes, for
the 460 V output application, a 600 V FET is recommended.
V link
V link –  -------------- × 90V × 2
V


400V
90V
link
α =  -------------- × -------------------- × --------------------------------------------------------------------- = 0.937
 400V V in ( min )
V
V link – in ( min ) × 2
The scaling factor to determine the RMS current through the
MOSFET for a 108 V input is about 1.15, and the minimum
RMS current rating, IFET(rms), required for the FET is
calculated as follows:
PO
[Eq.9]
I FET ( rms ) = -------------------------------------------- × γ
V in ( min ) × 2 × η
2
2 V link – ( V in ( min ) × 2 )
L B = α × η × ( V in ( min ) ) × --------------------------------------------------------2 × f max × P O × V link
[Eq.6]
The FET should be able to handle the same peak current as
that seen through the inductor. This would amount to 3.96 A.
115
I LB ( rms ) = ----------------------------------------- × 1.15
108 × 2 × 0.95
2
( 460 – 108 × 2 ) L B = 0.937 × 0.95× 108 × --------------------------------------------------------------= 431μH
3
2 × 70 × 10 × 115 × 460
The RMS current rating for the inductor is estimated using an
scaling factor used to account for variations in the input
current shape across the AC line cycle, over and above the
nominally calculated value. The nominal value before using
the scaling factor is as follows:
PO
I LB ( rms ) = -------------------------------------------- × β
V in ( min ) × 2 × η
I LB ( rms ) = 0.91A
where
γ = FET scaling factor
5.1.5
PFC Diode
The PFC diode peak current is equal to the inductor peak
current:
I D ( pk ) = I LB ( pk )
[Eq.7]
I D ( pk ) = 3.17 A
115
I LB ( rms ) = ----------------------------------------- × 1.35
108 × 2 × 0.95
The PFC diode average current is calculated as follows:
PO
I D ( avg ) = ----------V link
I LB ( rms ) = 1.07A
where
β = inductor scaling factor
115
I D ( avg ) = ---------460
The peak inductor current, ILB(pk), may be estimated using the
following equation:
I D ( avg ) = 0.25 A
4 × PO
I LB ( pk ) = -------------------------------------------η × V in ( min ) × 2
[Eq.10]
5.1.6
[Eq.8]
[Eq.11]
PFC Output Capacitor
4 × 115
I LB ( pk ) = ----------------------------------------0.95 × 108 × 2
The output capacitor needs to be designed to meet the voltage
ripple and hold-up time requirements. In the case of a costsensitive ballast application, the hold-up requirement is not a
key requirement.
I LB ( pk ) = 3.17 A
To address the output ripple requirements, the following
equation may be used as a guide:
Inductor tolerances should be considered when estimating the
peak currents present in the application.
The internal control algorithm of the controller dictates that the
peak inductor current seen in the application could be as high
as a pre-defined threshold of 0.001984 times the inverse of
the inductor, which in this example amounts to 4.72 A. Care
needs to be taken to ensure that the saturation current rating
of the PFC boost inductor factors in this threshold used for the
protection schemes.
PO
C out = --------------------------------------------------------------------------------------2π × f line ( min ) × V link × ΔV link ( rip )
[Eq.12]
where
Cout = Output Capacitance value
Po = Output Power
fline(min) = Minimum Line Frequency
Vlink = PFC Output Voltage
ΔVlink = Peak-Peak Voltage Ripple on the PFC Output
For a 40 V ripple and minimum line frequency of 45 Hz, the
12
DS904A6
CS1600
output capacitance needed is calculated as:
115
C out = ------------------------------------------------- = 22.1μF
2π × 45 × 460 × 40
DS904A6
The voltage rating on the capacitor needs to account for the
operation of the device before it hits the overvoltage protection
threshold. This is typically 105% of nominal value, which is
483 V. With the ripple voltage factored in, 22 μF of
capacitance rated at 500 V would suffice for this application.
13
CS1600
5.2
Bill of Materials (for Application Example shown in Figure 17)
Designator
R1a
1.5 MΩ
R1b
1.5 MΩ
R1c
1.5 MΩ
R2a
1.5 MΩ
R2b
1.5 MΩ
R2c
1.5 MΩ
R3
24.9Ω
C1
0.47μF
C2
4.7μF
C3a
C3b
BR1
14
Value
Description/Part Number
23.5μF
2 47μF, 250V caps in series
4A, 600V
Bridge diode - GBU4J-BP
D5
1 A, 600
1N4005
D6
3A, 600V
MURS360
L1
360μH (max)
TBD (Premier Magnetics)
Q1
9A, 600V
FCP9N60N
CS1600
-
CS1600-FSZ
DS904A6
CS1600
5.3
Summary of Equations
Eq. #
Equation
1, 4
V link – V DD
R FB = ----------------------------I ref
2, 5
3, 6
7
8
9
10
R AC = R FB
2 V link – ( V in ( min ) × 2 )
P O = α × η × ( V in ( min ) ) × --------------------------------------------------------2 × f max × L B × V link
PO
I LB ( rms ) = -------------------------------------------- × β
V in ( min ) × 2 × η
4 × PO
I LB ( pk ) = -------------------------------------------η × V in ( min ) × 2
PO
I FET ( rms ) = -------------------------------------------- × γ
V in ( min ) × 2 × η
I D ( pk ) = I LB ( pk )
11
PO
I D ( avg ) = ----------V link
12
PO
C out = --------------------------------------------------------------------------------------2π × f line ( min ) × V link × ΔV link ( rip )
DS904A6
15
CS1600
6. PACKAGE DRAWING
8L SOIC (150 MIL BODY) PACKAGE DRAWING
E
H
1
b
c
D
SEATING
PLANE
∝
A
L
e
A1
INCHES
DIM
A
A1
B
C
D
E
e
H
L
∝
MIN
0.053
0.004
0.013
0.007
0.189
0.150
0.040
0.228
0.016
0°
MAX
0.069
0.010
0.020
0.010
0.197
0.157
0.060
0.244
0.050
8°
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.33
0.51
0.19
0.25
4.80
5.00
3.80
4.00
1.02
1.52
5.80
6.20
0.40
1.27
0°
8°
JEDEC # : MS-012
16
DS904A6
CS1600
7. ORDERING INFORMATION
Part #
Temperature Range
Package Description
CS1600-FSZ
-40 °C to +125 °C
8-lead SOIC, Lead (Pb) Free
8. ENVIRONMENTAL, MANUFACTURING, & HANDLING INFORMATION
Model Number
Peak Reflow Temp
MSL Ratinga
Max Floor Lifeb
CS1600-FSZ
260 °C
2
365 Days
a. MSL (Moisture Sensitivity Level) as specified by IPC/JEDEC J-STD-020.
b. Stored at 30 °C, 60% relative humidity.
DS904A6
17
CS1600
9. REVISION HISTORY
Revision
Date
Changes
A1
OCT 2009
Initial Advance Information release.
A2
MAR 2010
Revised feature list, product description and parametric table to reflect
the C0 version of silicon.
A3
MAR 2010
Revised to reflect the update in switching frequency and variation of
frequency over line.
A4
APR 2010
Revised parametric table and equations to reflect the C1 version of
silicon.
A5
MAY 2010
Updated with additional test bench data for EP level.
A6
JUN 2010
Added RθJA and RθJC in electrical specifications section.
Contacting Cirrus Logic Support
For all product questions and inquiries contact a Cirrus Logic Sales Representative.
To find one nearest you go to http://www.cirrus.com
IMPORTANT NOTICE
“Advance” product information describes products that are in development and subject to development changes.
Cirrus Logic, Inc. and its subsidiaries (“Cirrus”) believe that the information contained in this document is accurate and reliable. However, the information is subject
to change without notice and is provided “AS IS” without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant
information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale
supplied at the time of order acknowledgment, including those pertaining to warranty, indemnification, and limitation of liability. No responsibility is assumed by Cirrus
for the use of this information, including use of this information as the basis for manufacture or sale of any items, or for infringement of patents or other rights of third
parties. This document is the property of Cirrus and by furnishing this information, Cirrus grants no license, express or implied under any patents, mask work rights,
copyrights, trademarks, trade secrets or other intellectual property rights. Cirrus owns the copyrights associated with the information contained herein and gives consent for copies to be made of the information only for use within your organization with respect to Cirrus integrated circuits or other products of Cirrus. This consent
does not extend to other copying such as copying for general distribution, advertising or promotional purposes, or for creating any work for resale.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). CIRRUS PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE
IN PRODUCTS SURGICALLY IMPLANTED INTO THE BODY, AUTOMOTIVE SAFETY OR SECURITY DEVICES, LIFE SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF CIRRUS PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER'S RISK AND CIRRUS DISCLAIMS AND MAKES NO WARRANTY, EXPRESS, STATUTORY OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND
FITNESS FOR PARTICULAR PURPOSE, WITH REGARD TO ANY CIRRUS PRODUCT THAT IS USED IN SUCH A MANNER. IF THE CUSTOMER OR CUSTOMER'S CUSTOMER USES OR PERMITS THE USE OF CIRRUS PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY SUCH USE, TO FULLY
INDEMNIFY CIRRUS, ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM ANY AND ALL LIABILITY, INCLUDING ATTORNEYS' FEES AND COSTS, THAT MAY RESULT FROM OR ARISE IN CONNECTION WITH THESE USES.
Cirrus Logic, Cirrus, and the Cirrus Logic logo designs are trademarks of Cirrus Logic, Inc. All other brand and product names in this document may be trademarks
or service marks of their respective owners.
18
DS904A6
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