MC10186 Hex D Master-Slave Flip-Flop with Reset The MC10186 contains six high–speed, master slave type “D” flip–flops. Clocking is common to all six flip–flops. Data is entered into the master when the clock is low. Master to slave data transfer takes place on the positive–going Clock transition. Thus, outputs may change only on a positive–going Clock transition. A change in the information present at the data (D) input will not affect the output information any other time due to the master–slave construction of this device. A COMMON RESET IS INCLUDED IN THIS CIRCUIT. RESET ONLY FUNCTIONS WHEN CLOCK IS LOW. • PD = 460 mW typ/pkg (No Load) • ftoggle = 150 MHz (typ) • tr, tf = 2.0 ns typ (20%–80%) http://onsemi.com MARKING DIAGRAMS 16 CDIP–16 L SUFFIX CASE 620 MC10186L AWLYYWW 1 16 PDIP–16 P SUFFIX CASE 648 LOGIC DIAGRAM MC10186P AWLYYWW 1 5 D0 D1 2 3 6 D2 4 7 1 Q0 PLCC–20 FN SUFFIX CASE 775 Q1 A WL YY WW Q2 10186 AWLYYWW = Assembly Location = Wafer Lot = Year = Work Week DIP PIN ASSIGNMENT 13 Q3 D3 10 D4 RESET 1 16 VCC Q0 2 15 Q5 Q1 3 14 Q4 Q2 4 13 Q3 D0 5 12 D5 15 Q5 D1 6 11 D4 VCC = PIN 16 VEE = PIN 8 D2 7 10 D3 VEE 8 9 CLOCK 14 Q4 11 D5 12 CLOCK 9 RESET 1 CLOCKED TRUTH TABLE R C D Qn + 1 L L X Qn L H* L L L H* H H H L X L Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D). ORDERING INFORMATION Device *A clock H is a clock transition from a low to a high state. Semiconductor Components Industries, LLC, 2002 January, 2002 – Rev. 7 1 Package Shipping MC10186L CDIP–16 25 Units / Rail MC10186P PDIP–16 25 Units / Rail MC10186FN PLCC–20 46 Units / Rail Publication Order Number: MC10186/D MC10186 ELECTRICAL CHARACTERISTICS Test Limits Characteristic Symbol Pin Under Test Power Supply Drain Current IE 8 121 IinH 5 9 1 350 495 920 Input Current –30°C Min +25°C Max Min +85°C Typ Max Max Unit 88 110 121 mAdc 220 310 575 220 310 575 µAdc 0.5 Min µAdc IinL 5 0.5 Output Voltage Logic 1 VOH 2 15 –1.060 –1.060 –0.890 –0.890 –0.960 –0.960 –0.810 –0.810 –0.890 –0.890 0.3 –0.700 –0.700 Vdc Output Voltage Logic 0 VOL 2 15 –1.890 –1.890 –1.675 –1.675 –1.850 –1.850 –1.650 –1.650 –1.825 –1.825 –1.615 –1.615 Vdc Threshold Voltage Logic 1 VOHA 2 15 –1.080 –1.080 Threshold Voltage Logic 0 VOLA 2 15 t1+3– t1+4– t9+2+ t9+2– 3 4 2 2 1.6 1.6 1.6 1.6 4.6 4.6 4.6 4.6 1.6 1.6 1.6 1.6 2.5 2.5 3.5 3.5 4.5 4.5 4.5 4.5 1.6 1.6 1.6 1.6 5.0 5.0 5.0 5.0 –0.980 –0.980 –0.910 –0.910 –1.655 –1.655 –1.630 –1.630 Vdc –1.595 –1.595 Switching Times (50Ω Load) Propagation Delay Vdc ns Rise Time (20 to 80%) t2+ 2 1.0 4.1 1.1 1.8 4.0 1.1 4.4 Fall Time (20 to 80%) t2– 2 1.0 4.1 1.1 1.8 4.0 1.1 4.4 Setup Time tsetup 2 2.5 2.5 2.5 2.5 ns Hold Time thold 2 1.5 1.5 –1.5 1.5 ns Toggle Frequency (Max) ftog 2 125 125 150 125 MHz Output level to be measured after clock pulse. VIL VIH appears at clock input (Pin 9). http://onsemi.com 2 MC10186 ELECTRICAL CHARACTERISTICS (continued) TEST VOLTAGE VALUES (Volts) Characteristic Power Supply Drain Current Input Current @ Test Temperature VIHmax VILmin VIHAmin VILAmax VEE –30°C –0.890 –1.890 –1.205 –1.500 –5.2 +25°C –0.810 –1.850 –1.105 –1.475 –5.2 +85°C –0.700 –1.825 –1.035 –1.440 –5.2 Symbol Pin Under Test IE 8 IinH 5 9 1 IinL 5 VOH 2 15 Output Voltage Logic 0 VOL 2 15 Threshold Voltage Logic 1 VOHA 2 15 Threshold Voltage Logic 0 VOLA 2 15 Propagation Delay 3 4 2 2 VEE (VCC) Gnd 8 16 8 8 8 16 16 16 8 16 8 8 16 16 8 8 16 16 8 8 16 16 5 12 8 8 16 16 Pulse In Pulse Out –3.2 V +2.0 V 1, 9 1, 9 5, 9 5, 9 3 4 2 2 8 8 8 8 16 16 16 16 VIHAmin VILAmax 5 12 5 12 5 12 +1.11Vdc t1+3– t1+4– t9+2+ t9+2– VILmin 5 Logic 1 (50Ω Load) VIHmax 5 9 1 Output Voltage Switching Times TEST VOLTAGE APPLIED TO PINS LISTED BELOW +0.31V 6 7 Rise Time (20 to 80%) t2+ 2 5, 9 2 8 16 Fall Time (20 to 80%) t2– 2 5, 9 2 8 16 Setup Time tsetup 2 5, 9 2 8 16 Hold Time thold 2 5, 9 2 8 16 Toggle Frequency (Max) ftog 2 8 16 Output level to be measured after clock pulse. VIL VIH appears at clock input (Pin 9). Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the same manner. http://onsemi.com 3 MC10186 PACKAGE DIMENSIONS PLCC–20 FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) B Y BRK –N– M T L-M 0.007 (0.180) U M N S T L-M S G1 0.010 (0.250) S N S D –L– –M– Z W 20 D 1 X V S T L-M S N S VIEW D–D A 0.007 (0.180) M T L-M S N S R 0.007 (0.180) M T L-M S N S Z 0.007 (0.180) H M T L-M S N S K1 K C E F 0.004 (0.100) G J –T– VIEW S G1 0.010 (0.250) S T L-M S N S 0.007 (0.180) M T L-M S VIEW S SEATING PLANE NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 4 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --0.025 --0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --0.020 2 10 0.310 0.330 0.040 --- MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --0.64 --8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --0.50 2 10 7.88 8.38 1.02 --- N S MC10186 PACKAGE DIMENSIONS –A– 16 9 1 8 –B– CDIP–16 L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE T C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M S PDIP–16 P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R –A– 16 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M S T A M http://onsemi.com 5 INCHES MIN MAX 0.750 0.785 0.240 0.295 --0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0 15 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0 15 0.51 1.01 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0 10 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0 10 0.51 1.01 MC10186 Notes http://onsemi.com 6 MC10186 Notes http://onsemi.com 7 MC10186 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada Email: [email protected] JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: [email protected] ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800–282–9855 Toll Free USA/Canada http://onsemi.com 8 MC10186/D