ON MC10EL52DG 5 v ecl differential data and clock d flipâ flop Datasheet

MC10EL52, MC100EL52
5 V ECL Differential Data
and Clock D Flip‐Flop
Description
The MC10EL/100EL52 is a differential data, differential clock D
flip-flop with reset. The device is functionally equivalent to the E452
device with higher performance capabilities. With propagation delays
and output transition times significantly faster than the E452, the
EL52 is ideally suited for those applications which require the ultimate
in AC performance.
Data enters the master portion of the flip-flop when the clock is
LOW and is transferred to the slave, and thus the outputs, upon a
positive transition of the clock. The differential clock inputs of the
EL52 allow the device to also be used as a negative edge triggered
device.
The EL52 employs input clamping circuitry so that under open input
conditions (pulled down to VEE) the outputs of the device will remain
stable.
The 100 Series contains temperature compensation.
• 365 ps Propagation Delay
• 2.0 GHz Toggle Frequency
• ESD Protection:
•
•
•
•
•
•
1
1
SOIC−8 NB
D SUFFIX
CASE 751−07
TSSOP−8
DT SUFFIX
CASE 948R−02
MARKING DIAGRAMS*
8
8
HEL52
ALYW
1
> 1 kV Human Body Model
> 100 V Machine Model
PECL Mode Operating Range: VCC = 4.2 V to 5.7 V
with VEE = 0 V
NECL Mode Operating Range: VCC = 0 V
with VEE = −4.2 V to −5.7 V
Internal Input Pulldown Resistors on D and CLK
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity:
♦ Level 1 for SOIC−8 NB
♦ Level 3 for TSSOP−8
♦ For Additional Information, see Application Note AND8003/D
Flammability Rating: UL 94 V−0 @ 0.125 in,
Oxygen: Index 28 to 34
Transistor Count = 48 Devices
These Devices are Pb-Free, Halogen Free and are RoHS Compliant
♦
HL52
ALYW
8
8
♦
•
8
8
1
Features
•
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KEL52
ALYW
1
1
SOIC−8 NB
KL52
ALYW
TSSOP−8
H = MC10
Y = Year
K = MC100
W = Work Week
A = Assembly Location = Pb-Free Package
L = Wafer Lot
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
Package
Shipping†
MC10EL52DG
Device
SOIC−8 NB
(Pb-Free)
98 Units/Tube
MC10EL52DR2G
SOIC−8 NB
(Pb-Free)
2500 Tape & Reel
MC10EL52DTG
TSSOP−8
(Pb-Free)
100 Units/Tube
MC100EL52DG
SOIC−8 NB
(Pb-Free)
48 Units/Tube
MC100EL52DR2G
SOIC−8 NB
(Pb-Free)
2500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
July, 2016 − Rev. 7
1
Publication Order Number:
MC10EL52/D
MC10EL52, MC100EL52
Table 1. TRUTH TABLE
D
D
1
8
D
2
7
VCC
Q
D*
CLK*
Q
L
H
Z
Z
L
H
Z = LOW to HIGH Transition
* Pin will default low when left open.
CLK
3
6
Table 2. PIN DESCRIPTION
Q
PIN
CLK
4
5
FUNCTION
D, D
CLK, CLK
Q, Q
VCC
VEE
VEE
Figure 1. Logic Diagram and Pinout Assignment
ECL Data Input
ECL Clock Input
ECL Data Output
Positive Supply
Negative Supply
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
6
−6
V
Iout
Output Current
Continuous
Surge
50
100
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction-to-Ambient)
0 lfpm
500 lfpm
SOIC−8 NB
SOIC−8 NB
190
130
°C/W
qJC
Thermal Resistance (Junction-to-Case)
Standard Board
SOIC−8 NB
41 to 44
°C/W
qJA
Thermal Resistance (Junction-to-Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
qJC
Thermal Resistance (Junction-to-Case)
Standard Board
TSSOP−8
41 to 44 ±5%
°C/W
Tsol
Wave Solder (Pb-Free)
< 2 to 3 sec @ 260°C
265
°C
VI ≤ VCC
VI ≥ VEE
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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MC10EL52, MC100EL52
Table 4. 10EL SERIES PECL DC CHARACTERISTICS (VCC = 5.0 V; VEE = 0 V (Note 1))
−40°C
Symbol
Characteristic
Min
25°C
Typ
Max
21
25
Min
85°C
Typ
Max
21
25
Min
Typ
Max
Unit
21
25
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 2)
3920
4010
4110
4020
4105
4190
4090
4185
4280
mV
VOL
Output LOW Voltage (Note 2)
3050
3200
3350
3050
3210
3370
3050
3227
3405
mV
VIH
Input HIGH Voltage (Single-Ended)
3770
4110
3870
4190
3940
4280
mV
VIL
Input LOW Voltage (Single-Ended)
3050
3500
3050
3520
3050
3555
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 3)
D
CLK
IIH
Input HIGH Current
IIL
Input LOW Current
V
3.4
2.5
4.6
4.4
3.4
2.5
4.6
4.4
150
0.5
3.4
2.5
4.6
4.4
150
0.5
150
0.3
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC.
VEE can vary +0.25 V / −0.5 V for +25°C and +85°C. or VEE can vary +0.06 V / −0.5 V for −40°C.
2. Outputs are terminated through a 50 ohm resistor to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input
signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin and 1 V.
Table 5. 10EL SERIES NECL DC CHARACTERISTICS (VCC = 0 V; VEE = −5.0 V (Note 1))
−40°C
Symbol
Characteristic
Min
Typ
25°C
Max
Min
Typ
85°C
Max
Min
Typ
Max
Unit
IEE
Power Supply Current
21
25
21
25
21
25
mA
VOH
Output HIGH Voltage (Note 2)
−1080
−990
−890
−980
−895
−810
−910
−815
−720
mV
VOL
Output LOW Voltage (Note 2)
−1950
−1800
−1650
−1950
−1790
−1630
−1950
−1773
−1595
mV
VIH
Input HIGH Voltage (Single-Ended)
−1230
−890
−1130
−810
−1060
−720
mV
VIL
Input LOW Voltage (Single-Ended)
−1950
−1500
−1950
−1480
−1950
−1445
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 3)
D
CLK
IIH
Input HIGH Current
IIL
Input LOW Current
V
−1.6
−2.5
−0.4
−0.6
−1.6
−2.5
150
0.5
−0.4
−0.6
−1.6
−2.5
150
0.5
−0.4
−0.6
150
0.3
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC.
VEE can vary +0.25 V / −0.5 V for +25°C and +85°C. or VEE can vary +0.06 V / −0.5 V for −40°C.
2. Outputs are terminated through a 50 ohm resistor to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input
signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin and 1 V.
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3
MC10EL52, MC100EL52
Table 6. 100EL SERIES PECL DC CHARACTERISTICS (VCC = 5.0 V; VEE = 0 V (Note 1))
−40°C
Symbol
Characteristic
Min
25°C
Typ
Max
21
25
Min
85°C
Typ
Max
21
25
Min
Typ
Max
Unit
24
29
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 2)
3915
3995
4120
3975
4045
4120
3975
4050
4120
mV
VOL
Output LOW Voltage (Note 2)
3170
3305
3445
3190
3295
3380
3190
3295
3380
mV
VIH
Input HIGH Voltage (Single-Ended)
3835
4120
3835
4120
3835
4120
mV
VIL
Input LOW Voltage (Single-Ended)
3190
3525
3190
3525
3190
3525
mV
2.6
2.5
4.6
4.2
2.6
2.5
4.6
4.2
2.6
2.5
4.6
4.2
VIHCMR
Input HIGH Voltage Common Mode Range
(Differential Configuration) (Note 3) D
CLK
IIH
Input HIGH Current
IIL
Input LOW Current
V
150
0.5
150
0.5
150
0.5
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V.
2. Outputs are terminated through a 50 ohm resistor to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input
signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin and 1 V.
Table 7. 100EL SERIES NECL DC CHARACTERISTICS (VCC = 0 V; VEE = −5.0 V (Note 1))
−40°C
Symbol
Characteristic
Min
25°C
Typ
Max
21
25
Min
85°C
Typ
Max
21
25
Min
Typ
Max
Unit
24
29
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 2)
−1085
−1005
−880
−1025
−955
−880
−1025
−955
−880
mV
VOL
Output LOW Voltage (Note 2)
−1830
−1695
−1555
−1810
−1705
−1620
−1810
−1705
−1620
mV
VIH
Input HIGH Voltage (Single-Ended)
−1165
−880
−1165
−880
−1165
−880
mV
VIL
Input LOW Voltage (Single-Ended)
−1810
−1475
−1810
−1475
−1810
−1475
mV
−2.4
−2.5
−0.4
−0.8
−2.4
−2.5
−0.4
−0.8
−2.4
−2.5
−0.4
−0.8
VIHCMR
Input HIGH Voltage Common Mode Range
(Differential Configuration) (Note 3) D
CLK
IIH
Input HIGH Current
IIL
Input LOW Current
V
150
0.5
150
0.5
150
0.5
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V.
2. Outputs are terminated through a 50 ohm resistor to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input
signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPPmin and 1 V.
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4
MC10EL52, MC100EL52
Table 8. AC CHARACTERISTICS (VCC = 5.0 V; VEE = 0 V or VCC = 0 V; VEE = −5.0 V (Note 1))
−40°C
Symbol
Characteristic
Min
Typ
25°C
Max
Min
Typ
2.2
2.8
275
365
85°C
Max
Min
Typ
2.2
2.8
320
410
Max
Unit
fmax
Maximum Toggle Frequency
1.8
2.5
tPLH
tPHL
Propagation Delay to Output
CLK
225
335
tS
Setup Time
125
0
125
0
125
0
ps
tH
Hold Time
150
50
150
50
150
50
ps
tPW
Minimum Pulse Width
400
VPP
Input Swing (Note 2)
150
tJITTER
Cycle-to-Cycle Jitter
tr
tf
Output Rise/Fall Times Q (20%−80%)
515
400
1000
150
350
100
TBD
100
465
225
GHz
510
400
1000
150
350
100
TBD
225
ps
ps
1000
TBD
225
mV
ps
350
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. 10 Series: VEE can vary +0.25 V / −0.5 V for +25°C and +85°C. or VEE can vary +0.06 V / −0.5 V for −40°C
100 Series: VEE can vary +0.8 V / −0.5 V.
2. VPP(min) is minimum input swing for which AC parameters guaranteed. The device has a DC gain of ≈40.
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MC10EL52, MC100EL52
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 3.0 V
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices)
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPS I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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6
MC10EL52, MC100EL52
PACKAGE DIMENSIONS
SOIC−8 NB
D SUFFIX
CASE 751−07
ISSUE AK
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0
8
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 8 0.010
0.020
0.228
0.244
MC10EL52, MC100EL52
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
CASE 948R−02
ISSUE A
8x
0.15 (0.006) T U
0.10 (0.004)
S
2X
L/2
L
8
5
1
PIN 1
IDENT
0.15 (0.006) T U
K REF
M
T U
V
S
0.25 (0.010)
B
−U−
4
M
A
−V−
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
S
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
−W−
G
DETAIL E
DIM
A
B
C
D
F
G
K
L
M
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.80
1.10
0.05
0.15
0.40
0.70
0.65 BSC
0.25
0.40
4.90 BSC
0
6
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.031
0.043
0.002
0.006
0.016
0.028
0.026 BSC
0.010
0.016
0.193 BSC
0
6
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