NVMFS5C423NL Power MOSFET 40 V, 2.0 mW, 150 A, Single N−Channel Features • • • • • • Small Footprint (5x6 mm) for Compact Design Low RDS(on) to Minimize Conduction Losses Low QG and Capacitance to Minimize Driver Losses NVMFS5C423NLWF − Wettable Flank Option for Enhanced Optical Inspection AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant www.onsemi.com V(BR)DSS RDS(ON) MAX ID MAX 2.0 mW @ 10 V 40 V 150 A 3.0 mW @ 4.5 V MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Parameter Drain−to−Source Voltage Gate−to−Source Voltage Continuous Drain Current RqJC (Notes 1, 3) TC = 25°C Power Dissipation RqJC (Note 1) Continuous Drain Current RqJA (Notes 1, 2, 3) Steady State Pulsed Drain Current Value Unit VDSS 40 V VGS ±20 V ID 150 A TC = 100°C TC = 25°C 110 PD TC = 100°C TA = 25°C Power Dissipation RqJA (Notes 1 & 2) Symbol Steady State TA = 100°C TA = 25°C A 31 PD 1.8 900 A TJ, Tstg −55 to + 175 °C IS 81 A Single Pulse Drain−to−Source Avalanche Energy (IL(pk) = 14 A) EAS 280 mJ Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) TL 260 °C Source Current (Body Diode) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE MAXIMUM RATINGS Parameter N−CHANNEL MOSFET MARKING DIAGRAM W 3.7 IDM Operating Junction and Storage Temperature S (1,2,3) 22 TA = 100°C TA = 25°C, tp = 10 ms G (4) W 83 42 ID D (5,6) Symbol Value Unit Junction−to−Case − Steady State RqJC 1.8 °C/W Junction−to−Ambient − Steady State (Note 2) RqJA 41 1 DFN5 (SO−8FL) CASE 488AA STYLE 1 D S S S G D XXXXXX AYWZZ D D XXXXXX = 5C423L XXXXXX = (NVMFS5C423NL) or XXXXXX = 423LWF XXXXXX = (NVMFS5C423NLWF) A = Assembly Location Y = Year W = Work Week ZZ = Lot Traceability ORDERING INFORMATION See detailed ordering, marking and shipping information on page 5 of this data sheet. 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2. Surface−mounted on FR4 board using a 650 mm2, 2 oz. Cu pad. 3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. © Semiconductor Components Industries, LLC, 2015 June, 2015 − Rev. 0 1 Publication Order Number: NVMFS5C423NL/D NVMFS5C423NL ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter Symbol Test Condition Min Drain−to−Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 250 mA 40 Drain−to−Source Breakdown Voltage Temperature Coefficient V(BR)DSS/ TJ Typ Max Unit OFF CHARACTERISTICS Zero Gate Voltage Drain Current IDSS Gate−to−Source Leakage Current V 17 VGS = 0 V, VDS = 40 V mV/°C TJ = 25 °C 10 TJ = 125°C 250 IGSS VDS = 0 V, VGS = 20 V VGS(TH) VGS = VDS, ID = 250 mA mA 100 nA 2.0 V ON CHARACTERISTICS (Note 4) Gate Threshold Voltage Threshold Temperature Coefficient VGS(TH)/TJ Drain−to−Source On Resistance Forward Transconductance RDS(on) 1.2 −5.3 mV/°C VGS = 4.5 V ID = 50 A 2.4 3.0 VGS = 10 V ID = 50 A 1.6 2.0 gFS VDS =15 V, ID = 50 A 140 mW S CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance CISS Output Capacitance COSS Reverse Transfer Capacitance 3100 VGS = 0 V, f = 1 MHz, VDS = 20 V CRSS 1300 pF 60 Total Gate Charge QG(TOT) VGS = 4.5 V, VDS = 20 V; ID = 50 A 23 Total Gate Charge QG(TOT) VGS = 10 V, VDS = 20 V; ID = 50 A 50 Threshold Gate Charge QG(TH) 5.0 Gate−to−Source Charge QGS 9.8 Gate−to−Drain Charge QGD Plateau Voltage VGP 3.1 td(ON) 12 VGS = 4.5 V, VDS = 20 V; ID = 50 A nC nC 6.7 V SWITCHING CHARACTERISTICS (Note 5) Turn−On Delay Time Rise Time Turn−Off Delay Time Fall Time tr td(OFF) VGS = 4.5 V, VDS = 20 V, ID = 50 A, RG = 1.0 W tf 72 ns 28 8.4 DRAIN−SOURCE DIODE CHARACTERISTICS Forward Diode Voltage Reverse Recovery Time VSD TJ = 25°C 0.85 TJ = 125°C 0.73 tRR Charge Time ta Discharge Time tb Reverse Recovery Charge VGS = 0 V, IS = 50 A 1.2 V 41 VGS = 0 V, dIS/dt = 100 A/ms, IS = 50 A QRR 23 ns 23 40 nC Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: pulse width v 300 ms, duty cycle v 2%. 5. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2 NVMFS5C423NL TYPICAL CHARACTERISTICS 3.4 V 160 140 3.2 V 120 100 3.0 V 80 60 2.8 V 40 2.6 V 20 0 RDS(on), DRAIN−TO−SOURCE RESISTANCE (mW) 200 VDS = 3 V 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 140 120 100 80 TJ = 25°C 60 40 TJ = 125°C 0 1.5 2 TJ = −55°C 2.5 3 3.5 Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 VGS, GATE VOLTAGE (V) 4 5.0 TJ = 25°C 4.5 4.0 3.5 3.0 VGS = 4.5 V 2.5 2.0 VGS = 10 V 1.5 1.0 0.5 0 20 40 60 80 100 120 140 160 180 200 ID, DRAIN CURRENT (A) Figure 3. On−Resistance vs. Gate−to−Source Voltage Figure 4. On−Resistance vs. Drain Current and Gate Voltage 1.9 100,000 VGS = 10 V ID = 50 A IDSS, LEAKAGE (nA) RDS(on), NORMALIZED DRAIN−TO− SOURCE RESISTANCE 1 VGS, GATE−TO−SOURCE VOLTAGE (V) 4.5 1.7 0.5 VDS, DRAIN−TO−SOURCE VOLTAGE (V) TJ = 25°C ID = 50 A 2.0 160 0 5.0 0.0 180 20 RDS(on), DRAIN−TO−SOURCE RESISTANCE (mW) ID, DRAIN CURRENT (A) 180 220 3.6 V 10 V to 3.8 V 200 ID, DRAIN CURRENT (A) 220 1.5 1.3 1.1 TJ = 150°C 10,000 TJ = 125°C 1000 TJ = 85°C 100 0.9 0.7 −50 −25 0 25 50 75 100 125 150 175 10 5 10 15 20 25 30 35 TJ, JUNCTION TEMPERATURE (°C) VDS, DRAIN−TO−SOURCE VOLTAGE (V) Figure 5. On−Resistance Variation with Temperature Figure 6. Drain−to−Source Leakage Current vs. Voltage www.onsemi.com 3 40 NVMFS5C423NL 10000 VGS, GATE−TO−SOURCE VOLTAGE (V) 10 C, CAPACITANCE (pF) CISS COSS 1000 CRSS 100 10 VGS = 0 V TJ = 25°C f = 1 MHz 0 10 20 30 40 4 15 QGD QGS 2 0 10 VDS = 20 V TJ = 25°C ID = 50 A 0 4 12 16 20 24 28 8 5 0 32 36 40 44 48 Figure 7. Capacitance Variation Figure 8. Gate−to−Source and Drain−to−Source Voltage vs. Total Charge 100.0 IS, SOURCE CURRENT (A) 100 t, TIME (ns) 20 6 QG, TOTAL GATE CHARGE (nC) td(off) tf tr td(on) 10 VGS = 4.5 V VDD = 20 V ID = 50 A 1 10 TJ = 125°C TJ = 25°C 10.0 TJ = −55°C 1.0 100 0.3 0.4 0.5 0.6 0.7 0.8 0.9 RG, GATE RESISTANCE (W) VSD, SOURCE−TO−DRAIN VOLTAGE (V) Figure 9. Resistive Switching Time Variation vs. Gate Resistance Figure 10. Diode Forward Voltage vs. Current 1.0 100 1000 TC = 25°C VGS ≤ 10 V 0.01 ms IDS (A) IPEAK (A) 0.1 ms 100 1 ms dc 10 1 25 8 VDS, DRAIN−TO−SOURCE VOLTAGE (V) 1000 1 30 QT VDS, DRAIN−TO−SOURCE VOLTAGE (V) TYPICAL CHARACTERISTICS TJ(initial) = 25°C 10 TJ(initial) = 100°C 10 ms RDS(on) Limit Thermal Limit Package Limit 0.1 1 10 1 100 1E−04 1E−03 VDS (V) TIME IN AVALANCHE (s) Figure 11. Safe Operating Area Figure 12. IPEAK vs. Time in Avalanche www.onsemi.com 4 1E−02 NVMFS5C423NL TYPICAL CHARACTERISTICS 100 RqJA(t) (°C/W) 50% Duty Cycle 10 20% 10% 5% 1 2% 1% 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 PULSE TIME (sec) Figure 13. Thermal Characteristics DEVICE ORDERING INFORMATION Device Marking Package Shipping† NVMFS5C423NLT1G 5C423L DFN5 (Pb−Free) 1500 / Tape & Reel NVMFS5C423NLWFT1G 423LWF DFN5 (Pb−Free, Wettable Flanks) 1500 / Tape & Reel NVMFS5C423NLT3G 5C423L DFN5 (Pb−Free) 5000 / Tape & Reel NVMFS5C423NLWFT3G 423LWF DFN5 (Pb−Free, Wettable Flanks) 5000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5 NVMFS5C423NL PACKAGE DIMENSIONS DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE M 2X 0.20 C D 2 A B D1 2X 0.20 C 3 q E 2 2 c A1 4 TOP VIEW C A RECOMMENDED SOLDERING FOOTPRINT* 0.10 C SIDE VIEW 8X b C A B 0.05 c SEATING PLANE DETAIL A 0.10 C 0.10 DIM A A1 b c D D1 D2 E E1 E2 e G K L L1 M q 4X E1 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS. 2X DETAIL A 0.495 4.560 2X 1.530 STYLE 1: PIN 1. SOURCE 2. SOURCE 3. SOURCE 4. GATE 5. DRAIN e/2 e L 1 3.200 4 4.530 K PIN 5 (EXPOSED PAD) MILLIMETERS MIN NOM MAX 0.90 1.00 1.10 0.00 −−− 0.05 0.33 0.41 0.51 0.23 0.28 0.33 5.00 5.30 5.15 4.70 4.90 5.10 3.80 4.00 4.20 6.00 6.30 6.15 5.70 5.90 6.10 3.45 3.65 3.85 1.27 BSC 0.51 0.575 0.71 1.20 1.35 1.50 0.51 0.575 0.71 0.125 REF 3.00 3.40 3.80 0_ −−− 12 _ E2 L1 M 1.330 2X 0.905 1 0.965 G 4X D2 1.000 4X 0.750 BOTTOM VIEW 1.270 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. 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