DISCRETE SEMICONDUCTORS DATA SHEET M3D319 BAP51-02 General purpose PIN diode Product specification Supersedes data of 1999 Jul 01 2000 Jul 06 Philips Semiconductors Product specification General purpose PIN diode BAP51-02 FEATURES PINNING • Low diode capacitance PIN • Low diode forward resistance. 1 2 APPLICATIONS • General RF applications. handbook, halfpage DESCRIPTION cathode anode 1 2 Top view General purpose PIN diode in a SOD523 ultra small SMD plastic package. DESCRIPTION MAM405 Marking code: K1. Fig.1 Simplified outline (SOD523) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VR continuous reverse voltage − 60 V IF continuous forward current − 50 mA Ptot total power dissipation − 715 mW Tstg storage temperature −65 +150 °C Tj junction temperature −65 +150 °C Ts = 90 °C ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VF forward voltage IF = 50 mA − 0.95 1.1 V VR reverse voltage IR = 10 µA 50 − − V IR reverse current VR = 50 V − − 100 nA Cd diode capacitance VR = 0; f = 1 MHz − 0.4 − pF VR = 1 V; f = 1 MHz − 0.3 0.55 pF rD diode forward resistance VR = 5 V; f = 1 MHz − 0.2 0.35 pF IF = 0.5 mA; f = 100 MHz; note 1 − 5.5 9 Ω IF = 1 mA; f = 100 MHz; note 1 − 3.6 6.5 Ω IF = 10 mA; f = 100 MHz; note 1 − 1.5 2.5 Ω Note 1. Guaranteed on AQL basis: inspection level S4, AQL 1.0. THERMAL CHARACTERISTICS SYMBOL Rth j-s 2000 Jul 06 PARAMETER thermal resistance from junction to soldering point 2 VALUE UNIT 85 K/W Philips Semiconductors Product specification General purpose PIN diode BAP51-02 GRAPHICAL DATA MGS323 MGS322 10 500 handbook, halfpage handbook, halfpage Cd (fF) rD (Ω) 400 5 300 200 2 100 1 10−1 0 1 4 0 10 I F (mA) 8 12 16 f = 100 MHz; Tj = 25 °C. f = 1 MHz; Tj = 25 °C. Fig.2 Fig.3 Forward resistance as a function of forward current; typical values. Diode capacitance as a function of reverse voltage; typical values. MGT264 MGT265 0 0 handbook, halfpage 2 handbook, halfpage 2 | s21| | s21| (dB) −0.5 (dB) −5 (1) (2) (3) −1 −10 −1.5 −15 −2 −20 −2.5 0.5 1 1.5 2 2.5 −25 0.5 3 f (GHz) (1) IF = 10 mA. (2) IF = 1 mA. 1.5 2 2.5 3 (3) IF = 0.5 mA. Diode zero biased and inserted in series with a 50 Ω stripline circuit. Tamb = 25 °C. Insertion loss (|s21|2) of the diode as a function of frequency; typical values. 2000 Jul 06 1 f (GHz) Diode inserted in series with a 50 Ω stripline circuit and biased via the analyzer Tee network. Tamb = 25 °C. Fig.4 20 VR (V) Fig.5 3 Isolation (|s21|2) of the diode as a function of frequency; typical values. Philips Semiconductors Product specification General purpose PIN diode BAP51-02 PACKAGE OUTLINE Plastic surface mounted package; 2 leads SOD523 A c v M A HE A D 1 E 0 0.5 1 mm scale 2 DIMENSIONS (mm are the original dimensions) bp (1) UNIT A bp c D E HE v mm 0.7 0.5 0.35 0.25 0.2 0.1 1.3 1.1 0.9 0.7 1.7 1.5 0.15 Note 1. The marking bar indicates the cathode. OUTLINE VERSION SOD523 2000 Jul 06 REFERENCES IEC JEDEC EIAJ SC-79 4 EUROPEAN PROJECTION ISSUE DATE 98-11-25 Philips Semiconductors Product specification General purpose PIN diode BAP51-02 DATA SHEET STATUS DATA SHEET STATUS PRODUCT STATUS DEFINITIONS (1) Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2000 Jul 06 Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. 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