DS91C176, DS91D176 www.ti.com SNLS146L – MARCH 2006 – REVISED APRIL 2013 DS91D176/DS91C176 100 MHz Single Channel M-LVDS Transceivers Check for Samples: DS91C176, DS91D176 FEATURES DESCRIPTION • The DS91C176 and DS91D176 are 100 MHz single channel M-LVDS (Multipoint Low Voltage Differential Signaling) transceivers designed for applications that utilize multipoint networks (e.g. clock distribution in ATCA and uTCA based systems). M-LVDS is a new bus interface standard (TIA/EIA-899) optimized for multidrop networks. Controlled edge rates, tight input receiver thresholds and increased drive strength are sone of the key enhancements that make M-LVDS devices an ideal choice for distributing signals via multipoint networks. 1 2 • • • • • • • DC to 100+ MHz / 200+ Mbps Low Power, Low EMI Operation Optimal for ATCA, uTCA Clock Distribution Networks Meets or Exceeds TIA/EIA-899 M-LVDS Standard Wide Input Common Mode Voltage for Increased Noise Immunity DS91D176 has Type 1 Receiver Input DS91C176 has Type 2 Receiver with Fail-safe Industrial Temperature Range Space Saving SOIC-8 Package The DS91C176/DS91D176 are half-duplex transceivers that accept LVTTL/LVCMOS signals at the driver inputs and convert them to differential MLVDS signals. The receiver inputs accept low voltage differential signals (LVDS, B-LVDS, M-LVDS, LVPECL and CML) and convert them to 3V LVCMOS signals. The DS91D176 has a M-LVDS type 1 receiver input with no offset. The DS91C176 has an M-LVDS type 2 receiver which enable failsafe functionality. Typical Application in an ATCA Clock Distribution Network Slot Card N Slot Card N+1 MLVDS Transceivers MLVDS Transceivers 80: RT CLK1A (8 KHz) 80: RT 80: RT CLK1B (8 KHz) 80: RT 80: RT CLK2A (19.44 MHz) 80: RT 80: RT CLK2B (19.44 MHz) 80: RT 80: RT CLK3A (User Defined up to 100 MHz) 80: RT 80: RT CLK3B (User Defined up to 100 MHz) 80: RT ATCA Backplane Figure 1. System Diagram 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2013, Texas Instruments Incorporated DS91C176, DS91D176 SNLS146L – MARCH 2006 – REVISED APRIL 2013 www.ti.com Connection and Logic Diagram Top View Figure 2. SOIC Package See Package Number D0008A M-LVDS Receiver Types The EIA/TIA-899 M-LVDS standard specifies two different types of receiver input stages. A type 1 receiver has a conventional threshold that is centered at the midpoint of the input amplitude, VID/2. A type 2 receiver has a built in offset that is 100mV greater than VID/2. The type 2 receiver offset acts as a failsafe circuit where open or short circuits at the input will always result in the output stage being driven to a low logic state. xxxxxx xxx Type 1 High Type 2 2.4 V High 150 mV VID Low 50 mV 0V -50 mV Low -2.4 V Transition Region Figure 3. M-LVDS Receiver Input Thresholds These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS91C176 DS91D176 DS91C176, DS91D176 www.ti.com SNLS146L – MARCH 2006 – REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) −0.3V to +4V Supply Voltage, VCC Control Input Voltages −0.3V to (VCC + 0.3V) Driver Input Voltage −0.3V to (VCC + 0.3V) −1.8V to +4.1V Driver Output Voltages Receiver Input Voltages −1.8V to +4.1V Receiver Output Voltage −0.3V to (VCC + 0.3V) Maximum Package Power Dissipation at +25°C SOIC Package 833 mW Derate SOIC Package 6.67 mW/°C above +25°C Thermal Resistance (4-Layer, 2 oz. Cu, JEDEC) θJA 150°C/W θJC 63°C/W Maximum Junction Temperature 150°C −65°C to +150°C Storage Temperature Range Lead Temperature (Soldering, 4 seconds) 260°C ESD Ratings: (HBM 1.5kΩ, 100pF) ≥ 8 kV ≥ 250 V (EIAJ 0Ω, 200pF) ≥ 1000 V (CDM 0Ω, 0pF) (1) (2) “Absolute Maximum Ratings” are those beyond which the safety of the device cannot be verified. They are not meant to imply that the device should be operated at these limits. The tables of “Electrical Characteristics” provide conditions for actual device operation. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. Recommended Operating Conditions Min Typ Max Units Supply Voltage, VCC 3.0 3.3 3.6 V Voltage at Any Bus Terminal (Separate or Common-Mode) −1.4 +3.8 V 2.4 V LVTTL Input Voltage High VIH 2.0 VCC V LVTTL Input Voltage Low VIL 0 0.8 V +25 +85 °C Typ Max Units 650 mV Differential Input Voltage VID −40 Operating Free Air Temperature TA Electrical Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. Parameter Test Conditions (1) (2) (3) (4) Min M-LVDS Driver |VAB| Differential output voltage magnitude ΔVAB Change in differential output voltage magnitude between logic states VOS(SS) Steady-state common-mode output voltage |ΔVOS(SS)| Change in steady-state common-mode output voltage between logic states VOS(PP) Peak-to-peak common-mode output voltage VA(OC) Maximum steady-state open-circuit output voltage VB(OC) Maximum steady-state open-circuit output voltage (1) (2) (3) (4) RL = 50Ω, CL = 5pF See Figure 4 and Figure 6 RL = 50Ω, CL = 5pF See Figure 4 and Figure 5 (VOS(PP) @ 500KHz clock) 480 −50 0 +50 mV 0.3 1.8 2.1 V +50 mV 0 135 See Figure 7 mV 0 2.4 V 0 2.4 V All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. All typicals are given for VCC = 3.3V and TA = 25°C. The algebraic convention, in which the least positive (most negative) limit is designated as minimum, is used in this datasheet. CL includes fixture capacitance and CD includes probe capacitance. Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS91C176 DS91D176 Submit Documentation Feedback 3 DS91C176, DS91D176 SNLS146L – MARCH 2006 – REVISED APRIL 2013 www.ti.com Electrical Characteristics (continued) Over recommended operating supply and temperature ranges unless otherwise specified. (1) (2) (3) (4) Parameter Test Conditions VP(H) Voltage overshoot, low-to-high level output VP(L) Voltage overshoot, high-to-low level output Min RL = 50Ω, CL = 5pF,CD = 0.5pF See Figure 9 and Figure 10 (5) Typ Max Units 1.2VSS V −0.2V V SS -15 15 μA VIL = 0.8V -15 15 μA IIN = -18mA -1.5 See Figure 8 -43 43 mA IIH High-level input current (LVTTL inputs) VIH = 2.0V IIL Low-level input current (LVTTL inputs) VIKL Input Clamp Voltage (LVTTL inputs) IOS Differential short-circuit output current V M-LVDS Receiver VIT+ Positive-going differential input voltage threshold See FUNCTION TABLES VIT− Negative-going differential input voltage threshold See FUNCTION TABLES VOH High-level output voltage (LVTTL output) IOH = −8mA VOL Low-level output voltage (LVTTL output) IOL = 8mA IOZ TRI-STATE output current VO = 0V or 3.6V IOSR Short-circuit receiver output current (LVTTL output) VO = 0V Type 1 20 50 mV Type 2 94 150 mV Type 1 Type 2 −50 20 mV 50 94 mV 2.4 2.7 V 0.28 0.4 10 μA -48 -90 mA 32 µA +20 µA −10 V M-LVDS Bus (Input and Output) Pins IA Transceiver input/output current IB VA = 3.8V, VB = 1.2V Transceiver input/output current VA = 0V or 2.4V, VB = 1.2V −20 VA = −1.4V, VB = 1.2V −32 VB = 0V or 2.4V, VA = 1.2V −20 VB = −1.4V, VA = 1.2V −32 −4 IAB Transceiver input/output differential current (IA − IB) VA = VB, −1.4V ≤ V ≤ 3.8V IA(OFF) Transceiver input/output power-off current VA = 3.8V, VB = 1.2V, DE = VCC 0V ≤ VCC ≤ 1.5V IB(OFF) µA VB = 3.8V, VA = 1.2V Transceiver input/output power-off current VA = 0V or 2.4V, VB = 1.2V, DE = VCC 0V ≤ VCC ≤ 1.5V −20 VA = −1.4V, VB = 1.2V, DE =VCC 0V ≤ VCC ≤ 1.5V −32 VB = 3.8V, VA = 1.2V, DE = VCC 0V ≤ VCC ≤ 1.5V VB = −1.4V, VA = 1.2V, DE = VCC 0V ≤ VCC ≤ 1.5V −32 Transceiver input/output power-off differential current (IA(OFF) − IB(OFF)) VA = VB, −1.4V ≤ V ≤ 3.8V, DE = VCC 0V ≤ VCC ≤ 1.5V −4 CA Transceiver input/output capacitance VCC = OPEN CB Transceiver input/output capacitance CAB Transceiver input/output differential capacitance CA/B Transceiver input/output capacitance balance (CA/CB) 1.0 4 +20 µA +4 µA 32 µA +20 µA µA −20 (5) µA µA VB = 0V or 2.4V, VA = 1.2V, DE = VCC 0V ≤ VCC ≤ 1.5V IAB(OFF) 32 32 µA +20 µA µA +4 µA 9 pF 9 pF 5.7 pF Not production tested. Specified by a statistical analysis on a sample basis at the time of characterization. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS91C176 DS91D176 DS91C176, DS91D176 www.ti.com SNLS146L – MARCH 2006 – REVISED APRIL 2013 Electrical Characteristics (continued) Over recommended operating supply and temperature ranges unless otherwise specified. (1) (2) (3) (4) Parameter Test Conditions Min Typ Max Units SUPPLY CURRENT (VCC) ICCD Driver Supply Current RL = 50Ω, DE = VCC, RE = VCC 20 29.5 mA ICCZ TRI-STATE Supply Current DE = GND, RE = VCC 6 9.0 mA ICCR Receiver Supply Current DE = GND, RE = GND 14 18.5 mA Min Typ Max Units 1.3 3.4 5.0 ns 1.3 3.1 5.0 ns 300 420 ps Switching Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. Parameter (1) (2) Test Conditions DRIVER AC SPECIFICATION tPLH Differential Propagation Delay Low to High tPHL Differential Propagation Delay High to Low tSKD1 (tsk(p)) Pulse Skew |tPLHD − tPHLD| (3) (4) RL = 50Ω, CL = 5 pF, CD = 0.5 pF Figure 9 and Figure 10 (5) (5) tSKD3 Part-to-Part Skew tTLH (tr) Rise Time tTHL (tf) Fall Time tPZH Enable Time (Z to Active High) tPZL Enable Time (Z to Active Low ) tPLZ Disable Time (Active Low to Z) tPHZ Disable Time (Active High to Z) (4) (4) (4) tJIT Random Jitter, RJ fMAX Maximum Data Rate 1.3 ns 1.0 1.8 3.0 ns 1.0 1.8 3.0 ns 8 ns 8 ns 8 ns 8 ns 5.5 psrms RL = 50Ω, CL = 5 pF, CD = 0.5 pF See Figure 11 and Figure 12 100 MHz Clock Pattern (6) 2.5 200 Mbps RECEIVER AC SPECIFICATION tPLH Propagation Delay Low to High tPHL Propagation Delay High to Low tSKD1 (tsk(p)) Pulse Skew |tPLHD − tPHLD| tSKD3 Part-to-Part Skew (4) Rise Time Fall Time tPZH Enable Time (Z to Active High) tPZL Enable Time (Z to Active Low) tPLZ Disable Time (Active Low to Z) tPHZ Disable Time (Active High to Z) fMAX Maximum Data Rate (6) 4.7 7.5 ns 2.0 5.3 7.5 ns 0.6 1.7 ns 1.3 ns (5) (4) tTHL (tf) (4) (5) 2.0 (3) (4) tTLH (tr) (1) (2) (3) CL = 15 pF See Figure 13, Figure 14 and Figure 15 (4) 0.5 1.2 2.5 ns 0.5 1.2 2.5 ns 10 ns 10 ns 10 ns 10 ns RL = 500Ω, CL = 15 pF See Figure 16 and Figure 17 200 Mbps All typicals are given for VCC = 3.3V and TA = 25°C. CL includes fixture capacitance and CD includes probe capacitance. tSKD1, |tPLHD − tPHLD|, is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel. Not production tested. Specified by a statistical analysis on a sample basis at the time of characterization. tSKD3, Part-to-Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range. Stimulus and fixture Jitter has been subtracted. Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS91C176 DS91D176 Submit Documentation Feedback 5 DS91C176, DS91D176 SNLS146L – MARCH 2006 – REVISED APRIL 2013 www.ti.com Test Circuits and Waveforms Figure 4. Differential Driver Test Circuit A ~ 2.1V B ~ 1.5V 'VOS(SS) VOS VOS(PP) Figure 5. Differential Driver Waveforms Figure 6. Differential Driver Full Load Test Circuit Figure 7. Differential Driver DC Open Test Circuit 6 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS91C176 DS91D176 DS91C176, DS91D176 www.ti.com SNLS146L – MARCH 2006 – REVISED APRIL 2013 Figure 8. Differential Driver Short-Circuit Test Circuit Figure 9. Driver Propagation Delay and Transition Time Test Circuit Figure 10. Driver Propagation Delays and Transition Time Waveforms Figure 11. Driver TRI-STATE Delay Test Circuit Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS91C176 DS91D176 Submit Documentation Feedback 7 DS91C176, DS91D176 SNLS146L – MARCH 2006 – REVISED APRIL 2013 www.ti.com Figure 12. Driver TRI-STATE Delay Waveforms Figure 13. Receiver Propagation Delay and Transition Time Test Circuit Figure 14. Type 1 Receiver Propagation Delay and Transition Time Waveforms 8 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS91C176 DS91D176 DS91C176, DS91D176 www.ti.com SNLS146L – MARCH 2006 – REVISED APRIL 2013 Figure 15. Type 2 Receiver Propagation Delay and Transition Time Waveforms Figure 16. Receiver TRI-STATE Delay Test Circuit Figure 17. Receiver TRI-STATE Delay Waveforms FUNCTION TABLES Table 1. DS91D176/DS91C176 Transmitting (1) Inputs (1) Outputs RE DE D B A X 2.0V 2.0V L H X 2.0V 0.8V H L X 0.8V X Z Z X — Don't care condition Z — High impedance state Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS91C176 DS91D176 Submit Documentation Feedback 9 DS91C176, DS91D176 SNLS146L – MARCH 2006 – REVISED APRIL 2013 www.ti.com Table 2. DS91D176 Receiving (1) Inputs (1) Output RE DE A−B R 0.8V 0.8V ≥ +0.05V H 0.8V 0.8V ≤ −0.05V L 0.8V 0.8V 0V X 2.0V 0.8V X Z X — Don't care condition Z — High impedance state Table 3. DS91C176 Receiving (1) Inputs (1) Output RE DE A−B R 0.8V 0.8V ≥ +0.15V H 0.8V 0.8V ≤ +0.05V L 0.8V 0.8V 0V L 2.0V 0.8V X Z X — Don't care condition Z — High impedance state Table 4. DS91D176 Receiver Input Threshold Test Voltages (1) Resulting Differential Input Voltage Applied Voltages (1) Resulting Common-Mode Input Voltage Receiver Output VIA VIB VID VIC R 2.400V 0.000V 2.400V 1.200V H 0.000V 2.400V −2.400V 1.200V L 3.800V 3.750V 0.050V 3.775V H 3.750V 3.800V −0.050V 3.775V L −1.400V −1.350V −0.050V −1.375V H −1.350V −1.400V 0.050V −1.375V L H — High Level L — Low Level Output state assumes that the receiver is enabled (RE = L) Table 5. DS91C176 Receiver Input Threshold Test Voltages (1) Applied Voltages (1) 10 Resulting Differential Input Voltage Resulting Common-Mode Input Voltage Receiver Output VID VIC R H VIA VIB 2.400V 0.000V 2.400V 1.200V 0.000V 2.400V −2.400V 1.200V L 3.800V 3.650V 0.150V 3.725V H 3.800V 3.750V 0.050V 3.775V L −1.250V −1.400V 0.150V −1.325V H −1.350V −1.400V 0.050V −1.375V L H — High Level L — Low Level Output state assumes that the receiver is enabled (RE = L) Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS91C176 DS91D176 DS91C176, DS91D176 www.ti.com SNLS146L – MARCH 2006 – REVISED APRIL 2013 PIN DESCRIPTONS Pin No. Name Description 1 R 2 RE Receiver output pin Receiver enable pin: When RE is high, the receiver is disabled. When RE is low or open, the receiver is enabled. 3 DE Driver enable pin: When DE is low, the driver is disabled. When DE is high, the driver is enabled. 4 D 5 GND Driver input pin 6 A Non-inverting driver output pin/Non-inverting receiver input pin 7 B Inverting driver output pin/Inverting receiver input pin 8 VCC Ground pin Power supply pin, +3.3V ± 0.3V Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS91C176 DS91D176 Submit Documentation Feedback 11 DS91C176, DS91D176 SNLS146L – MARCH 2006 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics – DS91D176/DS91C176 Supply Current vs. Frequency Output VOD vs. Load Resistance Supply Current measured using a clock pattern with driver terminated VCC = 3.3V, TA = +25°C to 50ohms . VCC = 3.3V, TA = +25°C. Figure 18. 12 Submit Documentation Feedback Figure 19. Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS91C176 DS91D176 DS91C176, DS91D176 www.ti.com SNLS146L – MARCH 2006 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision K (April 2013) to Revision L • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 12 Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS91C176 DS91D176 Submit Documentation Feedback 13 PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) DS91C176TMA ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 DS91C 176MA DS91C176TMA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS91C 176MA DS91C176TMAX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 DS91C 176MA DS91C176TMAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS91C 176MA DS91D176TMA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS91D 176MA DS91D176TMAX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 DS91D 176MA DS91D176TMAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS91D 176MA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS91C176TMAX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS91C176TMAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS91D176TMAX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS91D176TMAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS91C176TMAX SOIC D 8 2500 349.0 337.0 45.0 DS91C176TMAX/NOPB SOIC D 8 2500 349.0 337.0 45.0 DS91D176TMAX SOIC D 8 2500 349.0 337.0 45.0 DS91D176TMAX/NOPB SOIC D 8 2500 349.0 337.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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