Hynix HY5DU323222Q 32m(1mx32) ddr sdram Datasheet

HY5DU323222Q
32M(1Mx32) DDR SDRAM
HY5DU323222Q
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 0.5 / Jun. 2005
1
1HY5DU323222Q
Revision History
No.
History
Draft Date Remark
0.1
Preliminary Data Sheet Release
Jan. 2003
0.2
AC parameter change (tDRL, tCK_max, tAC etc.)
Jan. 2003
0.3
Insert AC Overshoot/ Undershoot Specification
Apr. 2003
0.4
200Mhz Speed bin insert
May. 2004
0.5
Editorial change (Page21) : DC Operating condition Insert Pin capacitance (Page28)
Jun. 2005
Rev. 0.5 / Jun. 2005
2
1HY5DU323222Q
DESCRIPTION
The Hynix HY5DU323222 is a 33,554,432-bit CMOS Double Data Rate(DDR) Synchronous DRAM, ideally suited for the
point-to-point applications which requires high bandwidth.
The Hynix 1Mx32 DDR SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the
clock. While all addresses and control inputs are latched on the rising edges of the CK (falling edges of the /CK), Data,
Data strobes and Write data masks inputs are sampled on both rising and falling edges of it. The data paths are internally pipelined and 2-bit prefetched to achieve very high bandwidth. All input and output voltage levels are compatible
with SSTL_2.
FEATURES
•
VDD, VDDQ = 2.5V ± 5%
•
All inputs and outputs are compatible with SSTL_2
interface
•
JEDEC standard 20mm x 14mm 100pin LQFP with
0.65mm pin pitch
•
Fully differential clock inputs (CK, /CK) operation
•
Double data rate interface
•
Source synchronous - data transaction aligned to
bidirectional data strobe (DQS)
•
•
Data outputs on DQS edges when read (edged DQ)
Data inputs on DQS centers when write (centered
DQ)
Data(DQ) and Write masks(DM) latched on the both
rising and falling edges of the data strobe
•
All addresses and control inputs except Data, Data
strobes and Data masks latched on the rising edges
of the clock
•
Write mask byte controls by DM (DM0 ~ DM3)
•
Programmable /CAS Latency 3 and 4 supported
•
Programmable Burst Length 2 / 4 / 8 with both
sequential and interleave mode
•
Internal 4 bank operations with single pulsed /RAS
•
tRAS Lock-Out function supported
•
Auto refresh and self refresh supported
•
4096 refresh cycles / 32ms
•
Half strength and Matched Impedance driver option
controlled by EMRS
ORDERING INFORMATION
Part No.
HY5DU323222Q-5
HY5DU323222Q-6
Rev. 0.5 / Jun. 2005
Power Supply
VDD/VDDQ = 2.5V
Clock
Frequency
Max Data Rate
200MHz
400Mbps/pin
166MHz
333Mbps/pin
interface
SSTL_2
Package
20mm x 14mm
100pin LQFP
3
1HY5DU323222Q
NC
NC
VDDQ
VSS
DQ31
DQ30
VSSQ
DQ29
88
87
86
85
84
82
81
83
NC
91
NC
NC
92
89
VSSQ
93
90
DQS
NC
94
VDD
VDDQ
96
97
95
DQ1
DQ0
98
DQ2
VSSQ
99
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
T O P V IE W
50
45
A9
49
44
NC
A6
43
NC
A7
42
NC
48
41
NC
A5
40
NC
47
39
NC
A4
38
NC
46
37
NC
VSS
36
34
A3
35
33
A2
NC
32
VDD
31
A1
20m m x 14m m
1 0 0 P in Q F P
0 .6 5 m m P itch
A0
DQ3
VDDQ
DQ4
DQ5
VSSQ
DQ6
DQ7
VDDQ
D Q 16
D Q 17
VSSQ
D Q 18
D Q 19
VDDQ
VDD
VSS
D Q 20
D Q 21
VSSQ
D Q 22
D Q 23
VDDQ
DM0
DM2
/W E
/C A S
/R A S
/C S
BA0
BA1
100
PIN CONFIGURATION
D Q 28
VDDQ
D Q 27
D Q 26
VSSQ
D Q 25
D Q 24
VDDQ
D Q 15
D Q 14
VSSQ
D Q 13
D Q 12
VDDQ
VSS
VDD
D Q 11
D Q 10
VSSQ
DQ9
DQ8
VDDQ
VREF
DM3
DM1
CLK
/C L K
CKE
DSF, M CL
A 8 /A P
ROW and COLUMN ADDRESS TABLE
Rev. 0.5 / Jun. 2005
Items
1Mx32
Organization
256K x 32 x 4banks
Row Address
A0 ~ A9
Column Address
A0 ~ A7
Bank Address
BA0, BA1
Auto Precharge Flag
A8
Refresh
4K
4
1HY5DU323222Q
PIN DESCRIPTION
PIN
TYPE
CK, /CK
Input
Clock: CK and /CK are differential clock inputs. All address and control input signals are
sampled on the crossing of the positive edge of CK and negative edge of /CK. Output
(read) data is referenced to the crossings of CK and /CK (both directions of crossing).
CKE
Input
Clock Enable: CKE HIGH activates, and CKE LOW deactivates internal clock signals, and
device input buffers and output drivers. Taking CKE LOW provides PRECHARGE POWER
DOWN and SELF REFRESH operation (all banks idle), or ACTIVE POWER DOWN (row
ACTIVE in any bank). CKE is synchronous for POWER DOWN entry and exit, and for SELF
REFRESH entry. CKE is asynchronous for SELF REFRESH exit, and for output disable. CKE
must be maintained high throughout READ and WRITE accesses. Input buffers, excluding
CK, /CK and CKE are disabled during POWER DOWN. Input buffers, excluding CKE are
disabled during SELF REFRESH. CKE is an SSTL_2 input, but will detect an LVCMOS LOW
level after Vdd is applied.
/CS
Input
Chip Select : Enables or disables all inputs except CK, /CK, CKE, DQS and DM. All commands are masked when CS is registered high. CS provides for external bank selection on
systems with multiple banks. CS is considered part of the command code.
BA0, BA1
Input
Bank Address Inputs: BA0 and BA1 define to which bank an ACTIVE, Read, Write or PRECHARGE command is being applied.
A0 ~ A9
Input
Address Inputs: Provide the row address for ACTIVE commands, and the column address
and AUTO PRECHARGE bit for READ/WRITE commands, to select one location out of the
memory array in the respective bank. A8 is sampled during a precharge command to
determine whether the PRECHARGE applies to one bank (A8 LOW) or all banks (A8
HIGH). If only one bank is to be precharged, the bank is selected by BA0, BA1. The
address inputs also provide the op code during a MODE REGISTER SET command. BA0
and BA1 define which mode register is loaded during the MODE REGISTER SET command
(MRS or EMRS).
/RAS, /CAS, /WE
Input
Command Inputs: /RAS, /CAS and /WE (along with /CS) define the command being
entered.
DM0 ~ DM3
Input
Input Data Mask: DM(0~3) is an input mask signal for write data. Input data is masked
when DM is sampled HIGH along with that input data during a WRITE access. DM is sampled on both edges of DQS. Although DM pins are input only, the DM loading matches the
DQ and DQS loading. DM0 corresponds to the data on DQ0-Q7; DM1 corresponds to the
data on DQ8-Q15; DM2 corresponds to the data on DQ16-Q23; DM3 corresponds to the
data on DQ24-Q31.
DQS
I/O
Data Strobe: Output with read data, input with write data. Edge aligned with read data,
centered in write data. Used to capture write data.
DQ0 ~ DQ31
I/O
Data input / output pin : Data Bus
VDD/VSS
Supply
Power supply for internal circuits and input buffers.
VDDQ/VSSQ
Supply
Power supply for output buffers for noise immunity.
VREF
Supply
Reference voltage for inputs for SSTL interface.
NC
NC
Rev. 0.5 / Jun. 2005
DESCRIPTION
No connection.
5
1HY5DU323222Q
FUNCTIONAL BLOCK DIAGRAM
4Banks x 256Kbit x 32 I/O Double Data Rate Synchronous DRAM
Input Buffer
32
Write Data Register
2-bit Prefetch Unit
64
256Kx32/Bank0
256 Kx32 /Bank2
64
256 Kx32 /Bank3
Mode
Register
32
Output Buffer
256 Kx32 /Bank1
Command
Decoder
2-bit Prefetch Unit
Bank
Control
Sense AMP
CLK
/CLK
CKE
/CS
/RAS
/CAS
/WE
DM
(0~3)
DS
DQ[0:31]
Row
Decoder
Column Decoder
A0 ~ A9
BA0, BA1
DQS
Address
Buffer
Column Address
Counter
Data Strobe
Transmitter
CLK_DLL
DS
CLK,
/CLK
Data Strobe
Receiver
DLL
Block
Mode
Register
Rev. 0.5 / Jun. 2005
6
1HY5DU323222Q
SIMPLIFIED COMMAND TRUTH TABLE
A8/
AP
Command
CKEn-1
CKEn
CS
RAS
CAS
WE
Extended Mode Register Set
H
X
L
L
L
L
OP code
1,2
Mode Register Set
H
X
L
L
L
L
OP code
1,2
H
X
H
X
X
X
L
H
H
H
X
1
H
X
L
L
H
H
H
X
L
H
L
H
CA
H
X
L
H
L
L
CA
H
X
L
L
H
L
X
Read Burst Stop
H
X
L
H
H
L
X
1
Auto Refresh
H
H
L
L
L
H
X
1
Entry
H
L
L
L
L
H
Exit
L
H
H
X
X
X
L
H
H
H
Entry
H
L
H
X
X
X
L
H
H
H
H
X
X
X
L
H
H
H
1
H
X
X
X
1
L
V
V
V
Device Deselect
No Operation
Bank Active
Read
Read with Autoprecharge
Write
Write with Autoprecharge
Precharge All Banks
Precharge selected Bank
Self Refresh
Precharge Power
Down Mode
Active Power
Down Mode
Exit
L
H
Entry
H
L
Exit
L
H
X
ADDR
RA
BA
V
L
H
L
H
V
V
Note
1
1
1,3
1
1,4
H
X
1,5
L
V
1
1
X
1
1
X
X
1
1
1
1
( H=Logic High Level, L=Logic Low Level, X=Don’t Care, V=Valid Data Input, OP Code=Operand Code, NOP=No Operation )
Note :
1. DM(0~3) states are Don’t Care. Refer to below Write Mask Truth Table.
2. OP Code(Operand Code) consists of A0~A9 and BA0~BA1 used for Mode Register setting during Extended MRS or MRS.
Before entering Mode Register Set mode, all banks must be in a precharge state and MRS command can be issued after tRP
period from Prechagre command.
3. If a Read with Autoprecharge command is detected by memory component in CK(n), then there will be no command presented
to activated bank until CK(n+BL/2+tRP).
4. If a Write with Autoprecharge command is detected by memory component in CK(n), then there will be no command presented
to activated bank until CK(n+BL/2+1+tDPL+tRP). Last Data-In to Prechage delay(tDPL) which is also called Write Recovery Time
(tWR) is needed to guarantee that the last data has been completely written.
5. If A8/AP is High when Precharge command being issued, BA0/BA1 are ignored and all banks are selected to be
precharged.
Rev. 0.5 / Jun. 2005
7
1HY5DU323222Q
WRITE MASK TRUTH TABLE
Function
A8/
AP
CKEn-1
CKEn
/CS, /RAS, /CAS, /WE
DM(0~3)
Data Write
H
X
X
L
X
1,2
Data-In Mask
H
X
X
H
X
1,2
ADDR
BA
Note
Note :
1. Write Mask command masks burst write data with reference to DQS(Data Strobes) and it is not related with read data.
2. DM0 corresponds to the data on DQ0-Q7; DM1 corresponds to the data on DQ8-Q15; DM2 corresponds to the data on DQ16-Q23;
DM3 corresponds to the data on DQ24-Q31.
Rev. 0.5 / Jun. 2005
8
1HY5DU323222Q
OPERATION COMMAND TRUTH TABLE - I
Current
State
IDLE
ROW
ACTIVE
READ
WRITE
/CS
/RAS
/CAS
/WE
Address
Command
Action
H
X
X
X
X
DSEL
NOP or power down3
L
H
H
H
X
NOP
NOP or power down3
L
H
H
L
X
BST
ILLEGAL4
L
H
L
H
BA, CA, AP
READ/READAP
ILLEGAL4
L
H
L
L
BA, CA, AP
WRITE/WRITEAP
ILLEGAL4
L
L
H
H
BA, RA
ACT
Row Activation
L
L
H
L
BA, AP
PRE/PALL
NOP
L
L
L
H
X
AREF/SREF
Auto Refresh or Self Refresh5
L
L
L
L
OPCODE
MRS
Mode Register Set
H
X
X
X
X
DSEL
NOP
L
H
H
H
X
NOP
NOP
L
H
H
L
X
BST
ILLEGAL4
L
H
L
H
BA, CA, AP
READ/READAP
Begin read : optional AP6
L
H
L
L
BA, CA, AP
WRITE/WRITEAP
Begin write : optional AP6
L
L
H
H
BA, RA
ACT
ILLEGAL4
L
L
H
L
BA, AP
PRE/PALL
Precharge7
L
L
L
H
X
AREF/SREF
ILLEGAL11
L
L
L
L
OPCODE
MRS
ILLEGAL11
H
X
X
X
X
DSEL
Continue burst to end
L
H
H
H
X
NOP
Continue burst to end
L
H
H
L
X
BST
Terminate burst
L
H
L
H
BA, CA, AP
READ/READAP
Term burst, new read:optional AP8
L
H
L
L
BA, CA, AP
WRITE/WRITEAP
ILLEGAL
L
L
H
H
BA, RA
ACT
ILLEGAL4
L
L
H
L
BA, AP
PRE/PALL
Term burst, precharge
L
L
L
H
X
AREF/SREF
ILLEGAL11
L
L
L
L
OPCODE
MRS
ILLEGAL11
H
X
X
X
X
DSEL
Continue burst to end
L
H
H
H
X
NOP
Continue burst to end
L
H
H
L
X
BST
ILLEGAL4
L
H
L
H
BA, CA, AP
READ/READAP
Term burst, new read:optional AP8
L
H
L
L
BA, CA, AP
WRITE/WRITEAP
Term burst, new write:optional AP
Rev. 0.5 / Jun. 2005
9
1HY5DU323222Q
OPERATION COMMAND TRUTH TABLE - II
Current
State
WRITE
READ
WITH
AUTOPRECHARGE
WRITE
AUTOPRECHARGE
PRECHARGE
/CS
/RAS
/CAS
/WE
Address
Command
Action
L
L
H
H
BA, RA
ACT
ILLEGAL4
L
L
H
L
BA, AP
PRE/PALL
Term burst, precharge
L
L
L
H
X
AREF/SREF
ILLEGAL11
L
L
L
L
OPCODE
MRS
ILLEGAL11
H
X
X
X
X
DSEL
Continue burst to end
L
H
H
H
X
NOP
Continue burst to end
L
H
H
L
X
BST
ILLEGAL
L
H
L
H
BA, CA, AP
READ/READAP
ILLEGAL10
L
H
L
L
BA, CA, AP
WRITE/WRITEAP
ILLEGAL10
L
L
H
H
BA, RA
ACT
ILLEGAL4,10
L
L
H
L
BA, AP
PRE/PALL
ILLEGAL4,10
L
L
L
H
X
AREF/SREF
ILLEGAL11
L
L
L
L
OPCODE
MRS
ILLEGAL11
H
X
X
X
X
DSEL
Continue burst to end
L
H
H
H
X
NOP
Continue burst to end
L
H
H
L
X
BST
ILLEGAL
L
H
L
H
BA, CA, AP
READ/READAP
ILLEGAL10
L
H
L
L
BA, CA, AP
WRITE/WRITEAP
ILLEGAL10
L
L
H
H
BA, RA
ACT
ILLEGAL4,10
L
L
H
L
BA, AP
PRE/PALL
ILLEGAL4,10
L
L
L
H
X
AREF/SREF
ILLEGAL11
L
L
L
L
OPCODE
MRS
ILLEGAL11
H
X
X
X
X
DSEL
NOP-Enter IDLE after tRP
L
H
H
H
X
NOP
NOP-Enter IDLE after tRP
L
H
H
L
X
BST
ILLEGAL4
L
H
L
H
BA, CA, AP
READ/READAP
ILLEGAL4,10
L
H
L
L
BA, CA, AP
WRITE/WRITEAP
ILLEGAL4,10
L
L
H
H
BA, RA
ACT
ILLEGAL4,10
L
L
H
L
BA, AP
PRE/PALL
NOP-Enter IDLE after tRP
L
L
L
H
X
AREF/SREF
ILLEGAL11
L
L
L
L
OPCODE
MRS
ILLEGAL11
Rev. 0.5 / Jun. 2005
10
1HY5DU323222Q
OPERATION COMMAND TRUTH TABLE - III
Current
State
ROW
ACTIVATING
WRITE
RECOVERING
WRITE
RECOVERING
WITH
AUTOPRECHARGE
REFRESHING
/CS
/RAS
/CAS
/WE
Address
Command
Action
H
X
X
X
X
DSEL
NOP - Enter ROW ACT after tRCD
L
H
H
H
X
NOP
NOP - Enter ROW ACT after tRCD
L
H
H
L
X
BST
ILLEGAL4
L
H
L
H
BA, CA, AP
READ/READAP
ILLEGAL4,10
L
H
L
L
BA, CA, AP
WRITE/WRITEAP
ILLEGAL4,10
L
L
H
H
BA, RA
ACT
ILLEGAL4,9,10
L
L
H
L
BA, AP
PRE/PALL
ILLEGAL4,10
L
L
L
H
X
AREF/SREF
ILLEGAL11
L
L
L
L
OPCODE
MRS
ILLEGAL11
H
X
X
X
X
DSEL
NOP - Enter ROW ACT after tWR
L
H
H
H
X
NOP
NOP - Enter ROW ACT after tWR
L
H
H
L
X
BST
ILLEGAL4
L
H
L
H
BA, CA, AP
READ/READAP
ILLEGAL
L
H
L
L
BA, CA, AP
WRITE/WRITEAP
ILLEGAL
L
L
H
H
BA, RA
ACT
ILLEGAL4,10
L
L
H
L
BA, AP
PRE/PALL
ILLEGAL4,11
L
L
L
H
X
AREF/SREF
ILLEGAL11
L
L
L
L
OPCODE
MRS
ILLEGAL11
H
X
X
X
X
DSEL
NOP - Enter precharge after tDPL
L
H
H
H
X
NOP
NOP - Enter precharge after tDPL
L
H
H
L
X
BST
ILLEGAL4
L
H
L
H
BA, CA, AP
READ/READAP
ILLEGAL4,8,10
L
H
L
L
BA, CA, AP
WRITE/WRITEAP
ILLEGAL4,10
L
L
H
H
BA, RA
ACT
ILLEGAL4,10
L
L
H
L
BA, AP
PRE/PALL
ILLEGAL4,11
L
L
L
H
X
AREF/SREF
ILLEGAL11
L
L
L
L
OPCODE
MRS
ILLEGAL11
H
X
X
X
X
DSEL
NOP - Enter IDLE after tRC
L
H
H
H
X
NOP
NOP - Enter IDLE after tRC
L
H
H
L
X
BST
ILLEGAL11
L
H
L
H
BA, CA, AP
READ/READAP
ILLEGAL11
Rev. 0.5 / Jun. 2005
11
1HY5DU323222Q
OPERATION COMMAND TRUTH TABLE - IV
Current
State
WRITE
MODE
REGISTER
ACCESSING
/CS
/RAS
/CAS
/WE
Address
Command
Action
L
H
L
L
BA, CA, AP
WRITE/WRITEAP
ILLEGAL11
L
L
H
H
BA, RA
ACT
ILLEGAL11
L
L
H
L
BA, AP
PRE/PALL
ILLEGAL11
L
L
L
H
X
AREF/SREF
ILLEGAL11
L
L
L
L
OPCODE
MRS
ILLEGAL11
H
X
X
X
X
DSEL
NOP - Enter IDLE after tMRD
L
H
H
H
X
NOP
NOP - Enter IDLE after tMRD
L
H
H
L
X
BST
ILLEGAL11
L
H
L
H
BA, CA, AP
READ/READAP
ILLEGAL11
L
H
L
L
BA, CA, AP
WRITE/WRITEAP
ILLEGAL11
L
L
H
H
BA, RA
ACT
ILLEGAL11
L
L
H
L
BA, AP
PRE/PALL
ILLEGAL11
L
L
L
H
X
AREF/SREF
ILLEGAL11
L
L
L
L
OPCODE
MRS
ILLEGAL11
Note :
1. H - Logic High Level, L - Logic Low Level, X - Don’t Care, V - Valid Data Input,
BA - Bank Address, AP - AutoPrecharge Address, CA - Column Address, RA - Row Address, NOP - NO Operation.
2. All entries assume that CKE was active(high level) during the preceding clock cycle.
3. If both banks are idle and CKE is inactive(low level), then in power down mode.
4. Illegal to bank in specified state. Function may be legal in the bank indicated by Bank Address(BA) depending on the state of
that bank.
5. If both banks are idle and CKE is inactive(low level), then self refresh mode.
6. Illegal if tRCD is not met.
7. Illegal if tRAS is not met.
8. Must satisfy bus contention, bus turn around, and/or write recovery requirements.
9. Illegal if tRRD is not met.
10. Illegal for single bank, but legal for other banks in multi-bank devices.
11. Illegal for all banks.
Rev. 0.5 / Jun. 2005
12
1HY5DU323222Q
CKE FUNCTION TRUTH TABLE
Current
State
SELF
REFRESH1
POWER
DOWN2
ALL BANKS
IDLE4
ANY STATE
OTHER
THAN
ABOVE
CKEn1
CKEn
/CS
/RAS
/CAS
/WE
/ADD
Action
H
X
X
X
X
X
X
INVALID
L
H
H
X
X
X
X
Exit self refresh, enter idle after tSREX
L
H
L
H
H
H
X
Exit self refresh, enter idle after tSREX
L
H
L
H
H
L
X
ILLEGAL
L
H
L
H
L
X
X
ILLEGAL
L
H
L
L
X
X
X
ILLEGAL
L
L
X
X
X
X
X
NOP, continue self refresh
H
X
X
X
X
X
X
INVALID
L
H
H
X
X
X
X
Exit power down, enter idle
L
H
L
H
H
H
X
Exit power down, enter idle
L
H
L
H
H
L
X
ILLEGAL
L
H
L
H
L
X
X
ILLEGAL
L
H
L
L
X
X
X
ILLEGAL
L
L
X
X
X
X
X
NOP, continue power down mode
H
H
X
X
X
X
X
See operation command truth table
H
L
L
L
L
H
X
Enter self refresh
H
L
H
X
X
X
X
Exit power down
H
L
L
H
H
H
X
Exit power down
H
L
L
H
H
L
X
ILLEGAL
H
L
L
H
L
X
X
ILLEGAL
H
L
L
L
H
X
X
ILLEGAL
H
L
L
L
L
L
X
ILLEGAL
L
L
X
X
X
X
X
NOP
H
H
X
X
X
X
X
See operation command truth table
H
L
X
X
X
X
X
ILLEGAL5
L
H
X
X
X
X
X
INVALID
L
L
X
X
X
X
X
INVALID
Note :
When CKE=L, all DQ and DQS must be in Hi-Z state.
1. CKE and /CS must be kept high for a minimum of 200 stable input clocks before issuing any command.
2. All command can be stored after 2 clocks from low to high transition of CKE.
3. Illegal if CK is suspended or stopped during the power down mode.
4. Self refresh can be entered only from the all banks idle state.
5. Disabling CK may cause malfunction of any bank which is in active state.
Rev. 0.5 / Jun. 2005
13
1HY5DU323222Q
SIMPLIFIED STATE DIAGRAM
MRS
MODE
REGISTER
SET
SREF
SELF
REFRESH
IDLE
SREX
PDEN
PDEX
AREF
ACT
POWER
DOWN
POWER
DOWN
AUTO
REFRESH
PDEN
BST
PDEX
BANK
ACTIVE
READ
WRITE
READ
WRITE
WRITEAP
WRITE
WITH
AUTOPRECHARGE
PRE(PALL)
READAP
READ
READAP
WITH
AUTOPRECHARGE WRITEAP
READ
WRITE
PRE(PALL)
PRE(PALL)
PRECHARGE
POWER-UP
Command Input
Automatic Sequence
POWER APPLIED
Rev. 0.5 / Jun. 2005
14
1HY5DU323222Q
POWER-UP SEQUENCE AND DEVICE INITIALIZATION
DDR SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than those
specified may result in undefined operation. Power must first be applied to VDD, then to VDDQ, and finally to VREF (and
to the system VTT). VTT must be applied after VDDQ to avoid device latch-up, which may cause permanent damage to
the device. VREF can be applied anytime after VDDQ, but is expected to be nominally coincident with VTT. Except for
CKE, inputs are not recognized as valid until after VREF is applied. CKE is an SSTL_2 input, but will detect an LVCMOS
LOW level after VDD is applied. Maintaining an LVCMOS LOW level on CKE during power-up is required to guarantee
that the DQ and DQS outputs will be in the High-Z state, where they will remain until driven in normal operation (by a
read access). After all power supply and reference voltages are stable, and the clock is stable, the DDR SDRAM
requires a 200us delay prior to applying an executable command.
Once the 200us delay has been satisfied, a DESELECT or NOP command should be applied, and CKE should be
brought HIGH. Following the NOP command, a PRECHARGE ALL command should be applied. Next a EXTENDED
MODE REGISTER SET command should be issued for the Extended Mode Register, to enable the DLL, then a MODE
REGISTER SET command should be issued for the Mode Register, to reset the DLL, and to program the operating
parameters. After the DLL reset, tXSRD(DLL locking time) should be satisfied for read command. After the Mode Register set command, a PRECHARGE ALL command should be applied, placing the device in the all banks idle state.
Once in the idle state, two AUTO REFRESH cycles must be performed. Additionally, a MODE REGISTER SET command
for the Mode Register with the reset DLL bit deactivated low (i.e. to program operating parameters without resetting
the DLL) must be performed. Following these cycles, the DDR SDRAM is ready for normal operation.
1.
Apply power - VDD, VDDQ, VTT, VREF in the following power up sequencing and attempt to maintain CKE at LVCMOS low state. (All the other input pins may be undefined.)
• VDD and VDDQ are driven from a single power converter output.
• VTT is limited to 1.44V (reflecting VDDQ(max)/2 + 50mV VREF variation + 40mV VTT variation.
• VREF tracks VDDQ/2.
• A minimum resistance of 42 Ohms (22 ohm series resistor + 22 ohm parallel resistor - 5% tolerance) limits the
input current from the VTT supply into any pin.
• If the above criteria cannot be met by the system design, then the following sequencing and voltage relationship must be adhered to during power up.
Votage description
Sequencing
Voltage relationship to avoid latch-up
VDDQ
After or with VDD
< VDD + 0.3V
VTT
After or with VDDQ
< VDDQ + 0.3V
VREF
After or with VDDQ
< VDDQ + 0.3V
2.
Start clock and maintain stable clock for a minimum of 200usec.
3.
After stable power and clock, apply NOP condition and take CKE high.
4.
Issue Extended Mode Register Set (EMRS) to enable DLL.
5.
Issue Mode Register Set (MRS) to reset DLL and set device to idle state with bit A8=High. (An additional 200
cycles(tXSRD) of clock are required for locking DLL)
6.
Issue Precharge commands for all banks of the device.
7.
Issue 2 or more Auto Refresh commands.
8.
Issue a Mode Register Set command to initialize the mode register with bit A8 = Low.
Rev. 0.5 / Jun. 2005
15
1HY5DU323222Q
Power-Up Sequence
VDD
VDDQ
tVTD
VTT
VREF
/CLK
CLK
tIS tIH
CKE
LVCMOS Low Level
CMD
NOP
PRE
EMRS
MRS
ADDR
CODE
A10
BA0, BA1
NOP
PRE
MRS
ACT
RD
CODE
CODE
CODE
CODE
CODE
CODE
CODE
CODE
CODE
CODE
CODE
CODE
CODE
CODE
Non-Read
Command
READ
AREF
DM
DQS
DQ'S
T=200usec
tRP
tMRD
tMRD
tRP
tRFC
tMRD
tXSRD*
Power UP
VDD and CK stable
Precharge All
EMRS Set
MRS Set
Reset DLL
(with A8=H)
Precharge All
2 or more
Auto Refresh
MRS Set
(with A8=L)
* 200 cycle(tXSRD) of CK are required (for DLL locking) before Read Command
Rev. 0.5 / Jun. 2005
16
1HY5DU323222Q
MODE REGISTER SET (MRS)
The mode register is used to store the various operating modes such as /CAS latency, addressing mode, burst length,
burst type, test mode, DLL reset. The mode register is program via MRS command. This command is issued by the low
signals of /RAS, /CAS, /CS, /WE and BA0. This command can be issued only when all banks are in idle state and CKE
must be high at least one cycle before the Mode Register Set Command can be issued. Two cycles are required to write
the data in mode register. During the the MRS cycle, any command cannot be issued. Once mode register field is
determined, the information will be held until resetted by another MRS command.
BA1
BA0
A9
A8
A7
0
0
RFU
DR
TM
BA0
A6
A5
A7
Test Mode
MRS
0
Normal
EMRS
1
Test
1
A8
DLL Reset
0
No
1
Yes
A6
A5
A4
CAS Latency
0
0
0
Reserved
0
0
1
Reserved
0
1
0
Reserved
0
1
1
3
1
0
0
4
1
0
1
Reserved
1
1
0
Reserved
1
1
1
Reserved
Rev. 0.5 / Jun. 2005
A3
CAS Latency
MRS Type
0
A4
A2
BT
A1
Burst Length
A3
Burst Type
0
Sequential
1
Interleave
A2
A1
A0
0
0
0
A0
Burst Length
Sequential
Interleave
0
Reserved
Reserved
0
1
2
2
0
1
0
4
4
0
1
1
8
8
1
0
0
Reserved
Reserved
1
0
1
Reserved
Reserved
1
1
0
Reserved
Reserved
1
1
1
Reserved
Reserved
17
1HY5DU323222Q
BURST DEFINITION
Burst Length
Starting Address (A2,A1,A0)
Sequential
Interleave
XX0
0, 1
0, 1
XX1
1, 0
1, 0
X00
0, 1, 2, 3
0, 1, 2, 3
X01
1, 2, 3, 0
1, 0, 3, 2
X10
2, 3, 0, 1
2, 3, 0, 1
X11
3, 0, 1, 2
3, 2, 1, 0
000
0, 1, 2, 3, 4, 5, 6, 7
0, 1, 2, 3, 4, 5, 6, 7
001
1, 2, 3, 4, 5, 6, 7, 0
1, 0, 3, 2, 5, 4, 7, 6
010
2, 3, 4, 5, 6, 7, 0, 1
2, 3, 0, 1, 6, 7, 4, 5
011
3, 4, 5, 6, 7, 0, 1, 2
3, 2, 1, 0, 7, 6, 5, 4
100
4, 5, 6, 7, 0, 1, 2, 3
4, 5, 6, 7, 0, 1, 2, 3
101
5, 6, 7, 0, 1, 2, 3, 4
5, 4, 7, 6, 1, 0, 3, 2
110
6, 7, 0, 1, 2, 3, 4, 5
6, 7, 4, 5, 2, 3, 0, 1
111
7, 0, 1, 2, 3, 4, 5, 6
7, 6, 5, 4, 3, 2, 1, 0
2
4
8
BURST LENGTH & TYPE
Read and write accesses to the DDR SDRAM are burst oriented, with the burst length being programmable. The burst
length determines the maximum number of column locations that can be accessed for a given Read or Write command. Burst lengths of 2, 4 or 8 locations are available for both the sequential and the interleaved burst types.
Reserved states should not be used, as unknown operation or incompatibility with future versions may result.
When a Read or Write command is issued, a block of columns equal to the burst length is effectively selected. All
accesses for that burst take place within this block, meaning that the burst wraps within the block if a boundary is
reached. The block is uniquely selected by A1-Ai when the burst length is set to two, by A2-Ai when the burst length is
set to four and by A3-Ai when the burst length is set to eight (where Ai is the most significant column address bit for a
given configuration). The remaining (least significant) address bit(s) is (are) used to select the starting location within
the block. The programmed burst length applies to both Read and Write bursts.
Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the
burst type and is selected via bit A3. The ordering of accesses within a burst is determined by the burst length, the
burst type and the starting column address, as shown in Burst Definitionon Table
CAS LATENCY
The Read latency or CAS latency is the delay in clock cycles between the registration of a Read command and the
Rev. 0.5 / Jun. 2005
18
1HY5DU323222Q
availability of the first burst of output data. The latency can be programmed 3 or 4 clocks.
If a Read command is registered at clock edge n and the latency is m clocks, the data is available nominally coincident
with clock edge n + m.
Reserved states should not be used as unknown operation or incompatibility with future versions may result.
DLL RESET
The DLL must be enabled for normal operation. DLL enable is required during power up initialization, and upon returning to normal operation after having disabled the DLL for the purpose of debug or evaluation. The DLL is automatically
disabled when entering self refresh operation and is automatically re-enabled upon exit of self refresh operation. Any
time the DLL is enabled, 200 clock cycles must occur to allow time for the internal clock to lock to the externally
applied clock before an any command can be issued.
OUTPUT DRIVER IMPEDANCE CONTROL
The HY5DU323222 supports both Half strength driver and Matched impedance driver, intended for lighter load and/or
point-to-point environments. Half strength driver is to define about 50% of Full drive strength which is specified to be
SSTL_2, Class II, and Matched impedance driver, about 30% of Full drive strength.
Rev. 0.5 / Jun. 2005
19
1HY5DU323222Q
EXTENDED MODE REGISTER SET (EMRS)
The Extended Mode Register controls functions beyond those controlled by the Mode Register; these additional functions include DLL enable/disable, output driver strength selection(optional). These functions are controlled via the bits
shown below. The Extended Mode Register is programmed via the Mode Register Set command ( BA0=1 and BA1=0)
and will retain the stored information until it is programmed again or the device loses power.
The Extended Mode Register must be loaded when all banks are idle and no bursts are in progress, and the controller
must wait the specified time before initiating any subsequent operation. Violating either of these requirements will
result in unspecified operation.
BA1
BA0
0
1
A9
A8
A7
A6
RFU*
BA0
MRS Type
0
MRS
1
EMRS
Rev. 0.5 / Jun. 2005
DS
A5
A4
A3
A2
RFU*
A1
A0
DS
DLL
A0
DLL enable
0
Enable
1
Disable
A6
A1
Output Driver Impedance Control
0
0
RFU*
0
1
Half
1
0
RFU*
1
1
Mached Impedance (Weak)
20
1HY5DU323222Q
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Unit
Ambient Temperature
TA
0 ~ 70
oC
Storage Temperature
TSTG
-55 ~ 125
o
VIN, VOUT
-0.5 ~ 3.6
V
V
Voltage on Any Pin relative to VSS
Voltage on VDD relative to VSS
Voltage on VDDQ relative to VSS
Output Short Circuit Current
Power Dissipation
Soldering Temperature ⋅ Time
C
VDD
-0.5 ~ 3.6
VDDQ
-0.5 ~ 3.6
V
IOS
50
mA
PD
1
TSOLDER
260 ⋅ 10
W
o
C ⋅ sec
Note : Operation at above absolute maximum rating can adversely affect device reliability
DC OPERATING CONDITIONS
Parameter
(TA=0 to 70oC, Voltage referenced to VSS = 0V)
Symbol
Min
Typ.
Max
Unit
Power Supply Voltage
VDD
2.375
2.5
2.625
V
Power Supply Voltage
VDDQ
2.375
2.5
2.625
V
VIH
VREF + 0.15
-
VDDQ + 0.3
V
Input High Voltage
Input Low Voltage
VIL
-0.3
-
VREF - 0.15
V
Termination Voltage
VTT
VREF - 0.04
VREF
VREF + 0.04
V
0.5*VDDQ
Reference Voltage
Note
1
2
VREF
0.49*VDDQ
0.51*VDDQ
V
Input Voltage Level, CK and CK inputs
VIN(DC)
-0.3
VDDQ+0.3
V
Input Differential Voltage, CK and CK
inputs
VID(DC)
0.36
VDDQ+0.6
V
4
V-I Matching: Pullup to Pulldown Current Ratio
VI(RATIO)
0.71
1.4
-
5
Input Leakage Current
ILI
-2
2
uA
6
Output Leakage Current
ILO
-5
5
uA
Output High Voltage
VOH
VTT + 0.76
-
V
IOL = -15.2mA
V
IOL =
+15.2mA
Output Low Voltage
VOL
-
VTT - 0.76
3
Note :
1. VDDQ must not exceed the level of VDD.
2. VIL (min) is acceptable -1.5V AC pulse width with ≤ 5ns of duration.
3. VREF is expected to be equal to 0.5*VDDQ of the transmitting device, and to track variations in the dc level of the same.
Peak to peak noise on VREF may not exceed ± 2% of the dc value.
4. VID is the magnitude of the difference between the input level on CK and the input level on /CK.
5. The ratio of the pullup current to the pulldown current is specified for the same temperature and voltage, over the
entire temper ature and voltage range, for device drain to source voltages from 0.25V to 1.0V. For a given output, it
represents the maximum difference between pullup and pulldown drivers due to process variation. The full variation
in the ratio of the maximum to minimum pullup and pulldown current will not exceed 1/7 for device drain to source
voltages from 0.1 to 1.0.
6. VIN=0 to VDD, All other pins are not tested under VIN =0V. 2. DOUT is disabled, VOUT=0 to VDD
Rev. 0.5 / Jun. 2005
21
1HY5DU323222Q
DC CHARACTERISTICS I
Parameter
(TA=0 to 70oC, Voltage referenced to VSS = 0V)
Symbol
Min.
Max
Unit
Note
Input Leakage Current
ILI
-2
2
uA
1
Output Leakage Current
ILO
-5
5
uA
2
Output High Voltage
VOH
VTT + 0.76
-
V
IOH = -15.2mA
Output Low Voltage
VOL
-
VTT - 0.76
V
IOL = +15.2mA
Note : 1. VIN = 0 to 3.6V, All other pins are not tested under VIN = 0V. 2. DOUT is disabled, VOUT = 0 to 2.7V
Rev. 0.5 / Jun. 2005
22
1HY5DU323222Q
DC CHARACTERISTICS II
(TA=0 to 70oC, Voltage referenced to VSS = 0V)
Speed
Parameter
Symbol
Test Condition
5
Unit
Note
1
6
Operating Current
IDD1
Burst length=2, One bank active
tRC ≥ tRC(min), IOL=0mA
210
mA
Precharge Standby Current
in Power Down Mode
IDD2P
CKE ≤ VIL(max), tCK = min
20
mA
Precharge Standby Current
in Non Power Down Mode
IDD2N
CKE ≥ VIH(min), /CS ≥ VIH(min),
tCK = min, Input signals are changed one
time during 2clks
80
mA
Active Standby Current
in Power Down Mode
IDD3P
CKE ≤ VIL(max), tCK = min
25
mA
Active Standby Current
in Non Power Down Mode
IDD3N
CKE ≥ VIH(min), /CS ≥ VIH(min),
tCK = min, Input signals are changed one
time during 2clks
200
mA
Burst Mode Operating
Current
IDD4
tCK ≥ tCK(min), IOL= 0mA
All banks active
350
mA
1
Auto Refresh Current
IDD5
tRC ≥ tRFC(min),
All banks active
270
mA
1,2
Self Refresh Current
IDD6
CKE ≤ 0.2V
3
mA
Note :
1. IDD1, IDD4 and IDD5 depend on output loading and cycle rates. Specified values are measured with the output open.
2. Min. of tRFC (Auto Refresh Row Cycle Time) is shown at AC CHARACTERISTICS.
Rev. 0.5 / Jun. 2005
23
1HY5DU323222Q
AC OPERATING CONDITIONS (TA=0 to 70oC, Voltage referenced to VSS = 0V)
Parameter
Symbol
Min
Max
Input High (Logic 1) Voltage, DQ, DQS and DM signals
VIH(AC)
VREF + 0.45
Input Low (Logic 0) Voltage, DQ, DQS and DM signals
VIL(AC)
Input Differential Voltage, CK and /CK inputs
VID(AC)
Input Crossing Point Voltage, CK and /CK inputs
VIX(AC)
Unit
Note
V
VREF - 0.45
V
0.7
VDDQ + 0.6
V
1
0.5*VDDQ-0.2
0.5*VDDQ+0.2
V
2
Note :
1. VID is the magnitude of the difference between the input level on CK and the input on CK.
2. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the DC level of the same.
AC OPERATING TEST CONDITIONS (TA=0 to 70oC, Voltage referenced to VSS = 0V)
Parameter
Value
Unit
Reference Voltage
VDDQ x 0.5
V
Termination Voltage
VDDQ x 0.5
V
AC Input High Level Voltage (VIH, min)
VREF + 0.45
V
AC Input Low Level Voltage (VIL, max)
VREF - 0.45
V
Input Timing Measurement Reference Level Voltage
VREF
V
Output Timing Measurement Reference Level Voltage
VTT
V
Input Signal maximum peak swing
1.5
V
Input minimum Signal Slew Rate
1
V/ns
Termination Resistor (RT)
50
Ω
Series Resistor (RS)
25
Ω
Output Load Capacitance for Access Time Measurement (CL)
30
pF
Rev. 0.5 / Jun. 2005
24
1HY5DU323222Q
AC Overshoot/Undershoot Specification for Address and Control Pins
This specification is intended for devices with no clamp protection and is guaranteed by design
Parameter
Specification
Maximum peak amplitude allowed for overshoot (See Figure 1):
1.5V
Maximum peak amplitude allowed for undershoot (See Figure 1):
1.5V
The area between the overshoot signal and VDD must be less than or equal to (See Figure 1):
4.5V - ns
The area between the undershoot signal and GND must be less than or equal to (See Figure 1):
4.5V - ns
+5
Max. amplitude=1.5V
Overshoot
+4
+3
VDD
Volts +2
(V) +1
Ground
0
-1
-2
Undershoot
Max. area=4.5V-ns
-3
0
1
2
3
4
5
6
Time(ns)
Figure 1: Address and Control AC Overshoot and Undershoot Definitio
Overshoot/Undershoot Specification for Data, Strobe, and Mask Pins
Parameter
Specification
Maximum peak amplitude allowed for overshoot (See Figure 2):
1.2V
Maximum peak amplitude allowed for undershoot (See Figure 2):
1.2V
The area between the overshoot signal and VDD must be less than or equal to (See Figure 2):
2.4V - ns
The area between the undershoot signal and GND must be less than or equal to (See Figure 2):
2.4V - ns
+5
Max. amplitude=1.2V
Overshoot
+4
+3
VDD
Volts +2
(V) +1
Ground
0
-1
-2
Undershoot
Max. area=2.4V-ns
-3
0
1
2
3
4
5
6
Time(ns)
Figure 2: DQ/DM/DQS AC Overshoot and Undershoot Definition
Rev. 0.5 / Jun. 2005
25
1HY5DU323222Q
AC CHARACTERISTICS (AC operating conditions unless otherwise noted)
Parameter
Symbol
5
6
Min
Max
Min
Max
Unit
Note
Row Cycle Time
tRC
60
-
66
-
ns
Auto Refresh Row Cycle Time
tRFC
70
-
72
-
ns
Row Active Time
tRAS
40
120K
45
120K
ns
Row Address to Column Address Delay for
Read
tRCDRD
4
-
4
-
CK
Row Address to Column Address Delay for
Write
tRCDWR
2
-
3
-
CK
Row Active to Row Active Delay
tRRD
2
-
2
-
CK
Column Address to Column Address Delay
tCCD
1
-
1
-
CK
Row Precharge Time
tRP
4
-
4
-
CK
Last Data-In to Precharge Delay Time
(Write Recovery Time : tWR)
tDPL
2
-
2
-
CK
Last Data-In to Read Command
tDRL
2
-
2
-
CK
Auto Precharge Write Recovery +
Precharge Time
tDAL
6
-
6
-
CK
tCK
5
10
6
10
ns
Clock High Level Width
tCH
0.45
0.55
0.45
0.55
CK
Clock Low Level Width
tCL
0.45
0.55
0.45
0.55
CK
Data-Out edge to Clock edge Skew
tAC
-0.9
0.9
-0.9
0.9
CK
DQS-Out edge to Clock edge Skew
tDQSCK
-0.7
0.7
-0.7
0.7
ns
DQS-Out edge to Data-Out edge Skew
tDQSQ
-
0.4
-
0.4
ns
Data-Out hold time from DQS
tQH
tHPmin
-tQHS
-
tHPmin
-tQHS
-
ns
1,6
Clock Half Period
tHP
tCH/L
min
-
tCH/L
min
-
ns
1,5
tQHS
-
0.75
-
0.75
ns
6
Input Setup Time
tIS
1.0
-
1.0
-
ns
2
Input Hold Time
tIH
1.0
-
1.0
-
ns
2
Write DQS High Level Width
tDQSH
0.4
0.6
0.4
0.6
ns
Write DQS Low Level Width
tDQSL
0.4
0.6
0.4
0.6
CK
Clock to First Rising edge of DQS-In
tDQSS
0.75
1.25
0.75
1.25
CK
System Clock Cycle Time
CL = 3.0
Data Hold Skew Factor
Rev. 0.5 / Jun. 2005
26
1HY5DU323222Q
Parameter
Symbol
5
6
Min
Max
Min
Max
Unit
Note
Data-In Setup Time to DQS-In (DQ & DM)
tDS
0.5
-
0.5
-
CK
3
Data-In Hold Time to DQS-In (DQ & DM)
tDH
0.5
-
0.5
-
ns
3
Read DQS Preamble Time
tRPRE
0.9
1.1
0.9
1.1
ns
Read DQS Postamble Time
tRPST
0.4
0.6
0.4
0.6
CK
Write DQS Preamble Setup Time
tWPRES
0
-
0
-
CK
Write DQS Preamble Hold Time
tWPREH
1.5
-
1.5
-
ns
Write DQS Postamble Time
tWPST
0.4
0.6
0.4
0.6
ns
Mode Register Set Delay
tMRD
2
-
2
-
CK
Exit Self Refresh to Any Execute Command
tXSC
200
-
200
-
CK
Average Periodic Refresh Interval
tREFI
-
7.8
-
7.8
CK
4
Note :
1. This calculation accounts for tDQSQ(max), the pulse width distortion of on-chip circuit and jitter.
2. Data sampled at the rising edges of the clock : A0~A9, BA0~BA1, CKE, /CS, /RAS, /CAS, /WE.
3. Data latched at both rising and falling edges of Data Strobes(DQS) : DQ, DM(0~3).
4. Minimum of 200 cycles of stable input clocks after Self Refresh Exit command, where CKE is held high, is required to complete
Self Refresh Exit and lock the internal DLL circuit of DDR SDRAM.
5. Min (tCL, tCH) refers to the smaller of the actual clock low time and the actual clock high time as provided to the device (i.e. this
value can be greater than the minimum specification limits for tCL and tCH).
6. tHP = minimum half clock period for any given cycle and is defined by clock high or clock low (tCH, tCL). tQHS consists of
tDQSQmax, the pulse width distortion of on-chip clock circuits, data pin to pin skew and output pattern effects, and p-channel to
n-channel variation of the output drivers.
7. DQS, DM and DQ input slew rate is specified to prevent double clocking of data and preserve setup and hold times.
Signal transitions through the DC region must be monotonic.
Rev. 0.5 / Jun. 2005
27
1HY5DU323222Q
CAPACITANCE (TA=25oC, f=1MHz )
Parameter
Pin
Symbol
Min
Max
Unit
Input Clock Capacitance
CK, /CK
CCK
1.7
2.7
pF
Input Capacitance
All other input-only pins
CIN
1.7
2.7
pF
Input / Output Capacitanc
DQ, DQS, DM
CIO
3.7
4.7
pF
Note :
1. VDD = min. to max., VDDQ = 2.3V to 2.7V, VODC = VDDQ/2, VOpeak-to-peak = 0.2V
2. Pins not under test are tied to GND.
3. These values are guaranteed by design and are tested on a sample basis only.
OUTPUT LOAD CIRCUIT
Rev. 0.5 / Jun. 2005
28
1HY5DU323222Q
PACKAGE INFORMATION
20mm x 14mm 100pin Low Quad Flat Package
22.10(0.870)
21.90(0.862)
Unit:mm(inch)
16.10(0.634)
15.90(0.626)
14.10(0.555)
13.90(0.547)
20.10(0.791)
19.90(0.783)
1.60(0.063)
1.45(0.057)
Detail A
Gauge Line
Base Plane
0.65 (0.026)TYP
All dimension in mm (inches). Notation is
Rev. 0.5 / Jun. 2005
Detail A
0.38(0.015)
0.22(0.009)
Seating Plane
0.080 (0.003)
0.15(0.006)
0.05(0.002)
0.20(0.008)
0.09(0.004)
0~7 Deg
0.75(0.029)
0.50(0.020)
0.66(0.026)
0.45(0.018)
1.00(0.0394)REF
MAX
or typical.
MIN
29