CY7C1354A CY7C1356A 256K x 36/512K x 18 Pipelined SRAM with NoBL™ Architecture Features • Zero Bus Latency™, no dead cycles between Write and Read cycles • Fast clock speed: 200, 166, 133, 100 MHz • Fast access time: 3.2, 3.6, 4.2, 5.0 ns • Internally synchronized registered outputs eliminate the need to control OE • Single 3.3V –5% and +5% power supply VCC • Separate VCCQ for 3.3V or 2.5V I/O • Single WEN (Read/Write) control pin • Positive clock-edge triggered, address, data, and control signal registers for fully pipelined applications • Interleaved or linear four-word burst capability • Individual byte Write (BWa–BWd) control (may be tied LOW) • CEN pin to enable clock and suspend operations • Three chip enables for simple depth expansion • Automatic power-down feature available using ZZ mode or CE select • JTAG boundary scan • Low-profile 119-bump, 14-mm × 22-mm BGA (Ball Grid Array), and 100-pin TQFP packages Functional Description The CY7C1354A and CY7C1356A SRAMs are designed to eliminate dead cycles when transitioning from Read to Write or vice versa. These SRAMs are optimized for 100% bus utilization and achieve Zero Bus Latency (ZBL)/No Bus Latency (NoBL). They integrate 262,144 × 36 and 524,288 × 18 SRAM cells, respectively, with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. These employ high-speed, low-power CMOS designs using advanced triple-layer polysilicon, double-layer metal technology. Each memory cell consists of four transistors and two high-valued resistors. All synchronous inputs are gated by registers controlled by a positive-edge-triggered clock input (CLK). The synchronous inputs include all addresses, all data inputs, depth-expansion Chip Enables (CE, CE2, and CE3), Cycle Start Input (ADV/LD), Clock Enable (CEN), Byte Write Enables (BWa, BWb, BWc, and BWd), and Read-Write Control (WEN). BWc and BWd apply to CY7C1354A only. Address and control signals are applied to the SRAM during one clock cycle, and two cycles later, its associated data occurs, either Read or Write. A clock enable (CEN) pin allows operation of the CY7C1354A/CY7C1356A to be suspended as long as necessary. All synchronous inputs are ignored when (CEN) is HIGH and the internal device registers will hold their previous values. There are three chip enable pins (CE, CE2, CE3) that allow the user to deselect the device when desired. If any one of these three are not active when ADV/LD is LOW, no new memory operation can be initiated and any burst cycle in progress is stopped. However, any pending data transfers (Read or Write) will be completed. The data bus will be in high-impedance state two cycles after chip is deselected or a Write cycle is initiated. The CY7C1354A and CY7C1356A have an on-chip two-bit burst counter. In the burst mode, the CY7C1354A and CY7C1356A provide four cycles of data for a single address presented to the SRAM. The order of the burst sequence is defined by the MODE input pin. The MODE pin selects between linear and interleaved burst sequence. The ADV/LD signal is used to load a new external address (ADV/LD = LOW) or increment the internal burst counter (ADV/LD = HIGH) Output Enable (OE), Sleep Enable (ZZ) and burst sequence select (MODE) are the asynchronous signals. OE can be used to disable the outputs at any given time. ZZ may be tied to LOW if it is not used. Four pins are used to implement JTAG test capabilities. The JTAG circuitry is used to serially shift data to and from the device. JTAG inputs use LVTTL/LVCMOS levels to shift data during this testing mode of operation. Selection Guide 7C1354A-200 7C1354A-166 7C1356A-166 7C1354A-133 7C1356A-133 7C1356A-100 Unit 3.2 3.6 4.2 5.0 ns Commercial 560 480 410 350 mA Maximum CMOS Standby Current Commercial 30 30 30 30 mA Maximum Access Time Maximum Operating Current Cypress Semiconductor Corporation Document #: 38-05161Rev. *E • 3901 North First Street • San Jose, CA 95134 • 408-943-2600 Revised April 5, 2004 CY7C1354A CY7C1356A . Functional Block Diagram—256K × 36[1] 256K x 9 x 4 SRAM Array Address CKE# CEN ADV/LD ADV/LD# R/W# WEN Control BWa#, BWa,BWb# BWb, BWc#, BWc,BWd# BWd CE#, CE2 CE , CE CE,CE2#, 2 DI Input Registers 3 SA0, SA1, SA CEN DO ZZ MODE Control Logic A0, A1, A Sel Mux Output Registers CLK Output Buffers OE# OE DQa-DQd Functional Block Diagram—512K × 18[1] 1M x 9 x 2 SRAM Array Address CKE# CEN BWa,BWb# BWb BWa#, CE#, CE2 CE,CE2#, CE2, CE 3 SA0, SA1, CENSA A0, A1, A Control Input Registers DI WEN R/W# Input Registers ADV/LD ADV/LD# Control Logic Mux CLK OE# OE DO ZZ MODE Sel Output Registers Output Buffers DQa, DQb Note: 1. The Functional Block Diagram illustrates simplified device operation. See Truth Table, pin descriptions, and timing diagrams for detailed information. Document #: 38-05161Rev. *E Page 2 of 28 CY7C1354A CY7C1356A Pin Configurations (256K × 36) TDO TCK A A A A A A A MODE A A A A A1 A0 TMS TDI VSS VCC Document #: 38-05161Rev. *E 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 DQb DQb DQb VCCQ VSS DQb DQb DQb DQb VSS VDDQ DQb DQb VSS VCC VCC ZZ DQa DQa VCCQ VSS DQa DQa DQa DQa VSS VCCQ DQa DQa DQa NC NC NC VCCQ VSS NC NC DQb DQb VSS VCCQ DQb DQb VCC VCC VCC VSS DQb DQb VCCQ VSS DQb DQb DPb NC VSS VCCQ NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 CY7C1356A (512K × 18) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 A NC NC VCCQ VSS NC DQa DQa DQa VSS VCCQ DQa DQa VSS VCC VCC ZZ DQa DQa VCCQ VSS DQa DQa NC NC VSS VCCQ NC NC NC TDO TCK A A A A A A A CY7C1354A 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 DQc DQc VCC VCC VCC VSS DQd DQd VCCQ VSS DQd DQd DQd DQd VSS VDDQ DQd DQd DQd 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 VSS DQc DQc DQc DQc VSS VCCQ 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 MODE A A A A A1 A0 TMS TDI VSS VCC DQc DQc DQc VCCQ A A A A CE CE2 NC NC BWb BWa CE3 VCC VSS CLK WEN CEN OE ADV/LD NC A A A 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 A A CE CE2 BWd BWc BWb BWa CE3 VCC VSS CLK WEN CEN OE ADV/LD NC A 100-lead TQFP Packages Page 3 of 28 CY7C1354A CY7C1356A Pin Configurations (continued) 119-ball Bump BGA CY7C1354A (256K × 36)–7 × 17 BGA Table 1. 1 2 3 4 5 6 7 A VCCQ A A NC A A VCCQ B NC CE2 A ADV/LD A CE3 NC C NC A A VCC A A NC D DQc DQc VSS NC VSS DQb DQb E DQc DQc VSS CE VSS DQb DQb F VCCQ DQc VSS OE VSS DQb VCCQ G DQc DQc BWc A BWb DQb DQb H DQc DQc VSS WEN VSS DQb DQb J VCCQ VCC NC VCC NC VCC VCCQ K DQd DQd VSS CLK VSS DQa DQa L DQd DQd BWd NC BWa DQa DQa M VCCQ DQd VSS CEN VSS DQa VCCQ N DQd DQd VSS A1 VSS DQa DQa P DQd DQd VSS A0 VSS DQa DQa R NC A MODE VCC VSS A NC T NC NC A A A NC ZZ U VCCQ TMS TDI TCK TDO NC VCCQ 6 7 CY7C1356A (512K × 18)–7 × 17 BGA Table 1. 1 2 3 4 5 A VCCQ A A NC A A VCCQ B NC CE2 A ADV/LD A CE3 NC C NC A A VCC A A NC D DQb NC VSS NC VSS DQa NC E NC DQb VSS CE VSS NC DQa F VCCQ NC VSS OE VSS DQa VCCQ G NC DQb BWb A VSS NC DQa H DQb NC VSS WEN VSS DQa NC J VCCQ VCC NC VCC NC VCC VCCQ K NC DQb VSS CLK VSS NC DQa L DQb NC VSS NC BWa DQa NC M VCCQ DQb VSS CEN VSS NC VCCQ N DQb NC VSS A1 VSS DQa NC P NC DQb VSS A0 VSS NC DQa R NC A MODE VCC VCC A NC T NC A A NC A A ZZ U VCCQ TMS TDI TCK TDO NC VCCQ Document #: 38-05161Rev. *E Page 4 of 28 CY7C1354A CY7C1356A Pin Descriptions—256K × 36 256K × 36 TQFP Pins 256K × 36 PBGA Pins Pin Name 37, 36, 32, 33, 34, 35, 44, 45, 46, 47, 48, 49, 50, 81, 82, 83, 99, 100 4P 4N 2A, 3A, 5A, 6A, 3B, 5B, 2C, 3C, 5C, 6C, 4G, 2R, 6R, 3T, 4T, 5T A0, A1, A 93, 94, 95, 96 5L 5G 3G 3L BWa, InputSynchronous Byte Write Enables: Each nine-bit byte has its own BWb, Synchronous active LOW byte Write enable. On load Write cycles (when WEN and BWc, ADV/LD are sampled LOW), the appropriate byte Write signal (BWx) BWd must be valid. The byte Write signal must also be valid on each cycle of a burst Write. Byte Write signals are ignored when WEN is sampled HIGH. The appropriate byte(s) of data are written into the device two cycles later. BWa controls DQa pins; BWb controls DQb pins; BWc controls DQc pins; BWd controls DQd pins. BWx can all be tied LOW if always doing Writes to the entire 36-bit word. 87 4M CEN InputSynchronous Clock Enable Input: When CEN is sampled HIGH, all Synchronous other synchronous inputs, including clock are ignored and outputs remain unchanged. The effect of CEN sampled HIGH on the device outputs is as if the LOW-to-HIGH clock transition did not occur. For normal operation, CEN must be sampled LOW at rising edge of clock. 88 4H WEN InputRead Write: WEN signal is a synchronous input that identifies whether Synchronous the current loaded cycle and the subsequent burst cycles initiated by ADV/LD is a Read or Write operation. The data bus activity for the current cycle takes place two clock cycles later. 89 4K CLK InputClock: This is the clock input to CY7C1354A. Except for OE, ZZ and Synchronous MODE, all timing references for the device are made with respect to the rising edge of CLK. 98, 92 4E, 6B CE, CE3 InputSynchronous Active LOW Chip Enable: CE and CE3 are used with Synchronous CE2 to enable the CY7C1354A. CE or CE3 sampled HIGH or CE2 sampled LOW, along with ADV/LD LOW at the rising edge of clock, initiates a deselect cycle. The data bus will be High-Z two clock cycles after chip deselect is initiated. 97 2B CE2 InputSynchronous Active High Chip Enable: CE2 is used with CE and CE3 Synchronous to enable the chip. CE2 has inverted polarity but otherwise is identical to CE and CE3. 86 4F OE 85 4B ADV/ InputAdvance/Load: ADV/LD is a synchronous input that is used to load the LD Synchronous internal registers with new address and control signals when it is sampled LOW at the rising edge of clock with the chip is selected. When ADV/LD is sampled HIGH, then the internal burst counter is advanced for any burst that was in progress. The external addresses and WEN are ignored when ADV/LD is sampled HIGH. 31 3R MOD E 64 7T ZZ Document #: 38-05161Rev. *E Type Pin Description InputSynchronous Address Inputs: The address register is triggered by a Synchronous combination of the rising edge of CLK, ADV/LD LOW, CEN LOW and true chip enables. A0 and A1 are the two least significant bits (LSBs) of the address field and set the internal burst counter if burst cycle is initiated. Input InputStatic Asynchronous Output Enable: OE must be LOW to Read data. When OE is HIGH, the I/O pins are in high-impedance state. OE does not need to be actively controlled for Read and Write cycles. In normal operation, OE can be tied LOW. Burst Mode: When MODE is HIGH or NC, the interleaved burst sequence is selected. When MODE is LOW, the linear burst sequence is selected. MODE is a static DC input. InputSleep Enable: This active HIGH input puts the device in low power Asynchronous consumption standby mode. For normal operation, this input has to be either LOW or NC. Page 5 of 28 CY7C1354A CY7C1356A Pin Descriptions—256K × 36 (continued) 256K × 36 TQFP Pins 256K × 36 PBGA Pins Pin Name 51, 52, 53, 56-59, 62, 63 68, 69, 72-75, 78, 79, 80 1, 2, 3, 6-9, 12, 13 18, 19, 22-25, 28, 29, 30 (a) 6P, 7P, 7N, 6N, 6M, 6L, 7L, 6K, 7K, (b) 7H, 6H, 7G, 6G, 6F, 6E, 7E, 7D, 6D, (c) 2D, 1D, 1E, 2E, 2F, 1G, 2G, 1H, 2H, (d) 1K, 2K, 1L, 2L, 2M, 1N, 2N, 1P, 2P 38 39 43 42 Type Pin Description DQa DQb DQc DQd Input/ Output Data Inputs/Outputs: Both the data input path and data output path are registered and triggered by the rising edge of CLK. Byte “a” is DQa pins; Byte “b” is DQb pins; Byte “c” is DQc pins; Byte “d” is DQd pins. 2U 3U 4U TMS TDI TCK Input IEEE 1149.1 Test Inputs: LVTTL-level inputs. If Serial Boundary Scan (JTAG) is not used, these pins can be floating (i.e., No Connect) or be connected to VCC. 5U TDO Output IEEE 1149.1 Test Output: LVTTL-level output. If Serial Boundary Scan (JTAG) is not used, these pins can be floating (i.e., No Connect). 14, 15, 16, 41, 4C, 2J, 4J, 6J, 65, 66, 91 4R, 5R VCC Supply Power Supply: +3.3V –5% and +5%. 5, 10, 17, 21, 3D, 5D, 3E, 5E, 26, 40, 55, 60, 3F, 5F, 3H, 5H, 67, 71, 76, 90 3K, 5K, 3M, 5M, 3N, 5N, 3P, 5P VSS Ground Ground: GND. 4, 11, 20, 27, 1A, 7A, 1F, 7F, VCCQ 54, 61, 70, 77 1J, 7J, 1M, 7M, 1U, 7U 84 4A, 1B, 7B, 1C, 7C, 4D, 3J, 5J, 4L, 1R, 7R, 1T, 2T, 6T, 6U NC I/O Supply Output Buffer Supply: +3.3V –0.165V and +0.165V for 3.3V I/O. +2.5V –0.125V and +0.4V for 2.5V I/O. – No Connect: These signals are not internally connected. It can be left floating or be connected to VCC or to GND. Type Pin Description Pin Descriptions—512K × 18 512K × 18 TQFP Pins 512K × 18 PBGA Pins Pin Name 37, 36, 32, 33, 34, 35, 44, 45, 46, 47, 48, 49, 50, 80, 81, 82, 83, 99, 100 4P 4N 2A, 3A, 5A, 6A, 3B, 5B, 6B, 2C, 3C, 5C, 6C, 4G, 2R, 6R, 2T, 3T, 5T, 6T A0, A1, A 93, 94, 5L 3G InputSynchronous Byte Write Enables: Each nine-bit byte has its own BWa, BWb Synchronous active LOW byte Write enable. On load Write cycles (when WEN and ADV/LD are sampled LOW), the appropriate byte Write signal (BWx) must be valid. The byte Write signal must also be valid on each cycle of a burst Write. Byte Write signals are ignored when WEN is sampled HIGH. The appropriate byte(s) of data are written into the device two cycles later. BWa controls DQa pins; BWb controls DQb pins. BWx can all be tied LOW if always doing Write to the entire 18-bit word. 87 4M CEN Document #: 38-05161Rev. *E InputSynchronous Address Inputs: The address register is triggered by a Synchronous combination of the rising edge of CLK, ADV/LD LOW, CEN LOW, and true chip enables. A0 and A1 are the two least significant bits of the address field and set the internal burst counter if burst cycle is initiated. InputSynchronous Clock Enable Input: When CEN is sampled HIGH, all Synchronous other synchronous inputs, including clock are ignored and outputs remain unchanged. The effect of CEN sampled HIGH on the device outputs is as if the LOW-to-HIGH clock transition did not occur. For normal operation, CEN must be sampled LOW at rising edge of clock. Page 6 of 28 CY7C1354A CY7C1356A Pin Descriptions—512K × 18 (continued) 512K × 18 TQFP Pins 512K × 18 PBGA Pins Pin Name 88 4H WEN InputRead Write: WEN signal is a synchronous input that identifies whether Synchronous the current loaded cycle and the subsequent burst cycles initiated by ADV/LD is a Read or Write operation. The data bus activity for the current cycle takes place two clock cycles later. 89 4K CLK InputClock: This is the clock input to CY7C1356A. Except for OE, ZZ, and Synchronous MODE, all timing references for the device are made with respect to the rising edge of CLK. 98, 92 4E, 6B CE, CE3 InputSynchronous Active LOW Chip Enable: CE and CE3 are used with Synchronous CE2 to enable the CY7C1356A. CE or CE3 sampled HIGH or CE2 sampled LOW, along with ADV/LD LOW at the rising edge of clock, initiates a deselect cycle. The data bus will be High-Z two clock cycles after chip deselect is initiated. 97 2B CE2 InputSynchronous Active HIGH Chip Enable: CE2 is used with CE and CE3 Synchronous to enable the chip. CE2 has inverted polarity but otherwise is identical to CE and CE3. 86 4F OE 85 4B ADV InputAdvance/Load: ADV/LD is a synchronous input that is used to load the /LD Synchronous internal registers with new address and control signals when it is sampled LOW at the rising edge of clock with the chip is selected. When ADV/LD is sampled HIGH, then the internal burst counter is advanced for any burst that was in progress. The external addresses and WEN are ignored when ADV/LD is sampled HIGH. 31 3R MOD E 64 7T ZZ 58, 59, 62, 63, 68, 69, 72, 73, 74 8, 9, 12, 13, 18, 19, 22, 23, 24 (a) 6D, 7E, 6F, 7G, 6H, 7K, 6L, 6N, 7P (b) 1D, 2E, 2G, 1H, 2K, 1L, 2M, 1N, 2P DQa DQb Input/ Output Data Inputs/Outputs: Both the data input path and data output path are registered and triggered by the rising edge of CLK. Byte “a” is DQa pins; Byte “b” is DQb pins. 38 39 43 2U 3U 4U TMS TDI TCK Input IEEE 1149.1 Test Inputs: LVTTL-level inputs. If Serial Boundary Scan (JTAG) is not used, these pins can be floating (i.e., No Connect) or be connected to VCC. 42 5U TDO Output IEEE 1149.1 Test Inputs: LVTTL-level output. If Serial Boundary Scan (JTAG) is not used, these pins can be floating (i.e., No Connect). 14, 15, 16, 41, 4C, 2J, 4J, 6J, 65, 66, 91 4R, 5R VCC Supply Power Supply: +3.3V –5% and +5%. 5, 10, 17, 21, 3D, 5D, 3E, 5E, 26, 40, 55, 60, 3F, 5F, 5G, 3H, 67, 71, 76, 90 5H, 3K, 5K, 3L, 3M, 5M, 3N, 5N, 3P, 5P VSS Ground Ground: GND. 4, 11, 20, 27, 1A, 7A, 1F, 7F, VCCQ 54, 61, 70, 77 1J, 7J, 1M, 7M, 1U, 7U Document #: 38-05161Rev. *E Type Input InputStatic Pin Description Asynchronous Output Enable: OE must be LOW to Read data. When OE is HIGH, the I/O pins are in high-impedance state. OE does not need to be actively controlled for Read and write cycles. In normal operation, OE can be tied LOW. Burst Mode: When MODE is HIGH or NC, the interleaved burst sequence is selected. When MODE is LOW, the linear burst sequence is selected. MODE is a static DC input. InputSleep Enable: This active HIGH input puts the device in low power Asynchronou consumption standby mode. For normal operation, this input has to be s either LOW or NC. I/O Supply Output Buffer Supply: +3.3V –0.165V and +0.165V for 3.3V I/O. +2.5V –0.125V and +0.4V for 2.5V I/O. Page 7 of 28 CY7C1354A CY7C1356A Pin Descriptions—512K × 18 (continued) 512K × 18 TQFP Pins 512K × 18 PBGA Pins Pin Name Type Pin Description 1-3, 6, 7, 25, 28-30, 51-53, 56, 57, 75, 78, 79, 84, 95, 96 4A, 1B, 7B, 1C, 7C, 2D, 4D, 7D, 1E, 6E, 2F, 1G, 6G, 2H, 7H, 3J, 5J, 1K, 6K, 2L, 4L, 7L, 6M, 2N, 7N, 1P, 6P, 1R, 7R, 1T, 4T, 6U NC – No Connect: These signals are not internally connected. It can be left floating or be connected to VCC or to GND. Partial Truth Table for Read/Write[2] Function Read No Write WEN BWa BWb BWc[4] BWd[4] H X X X X L H H H H [3] Write Byte a (DQa) L L H H H Write Byte b (DQb)[3] L H L H H Write Byte c (DQc)[3] L H H L H [3] Write Byte d (DQd} L H H H L Write all bytes L L L L L Interleaved Burst Address Table (MODE = VCC or NC) Linear Burst Address Table (MODE = VSS) First Address (external) Second Address (internal) Third Address (internal) Fourth Address (internal)[5] First Address (external) Second Address (internal) Third Address (internal) Fourth Address (internal)[5] A...A00 A...A01 A...A10 A...A11 A...A00 A...A01 A...A10 A...A11 A...A01 A...A00 A...A11 A...A10 A...A01 A...A10 A...A11 A...A00 A...A10 A...A11 A...A00 A...A01 A...A10 A...A11 A...A00 A...A01 A...A11 A...A10 A...A01 A...A00 A...A11 A...A00 A...A01 A...A10 Notes: 2. L means logic LOW. H means logic HIGH. X means Don’t Care. 3. Multiple bytes may be selected during the same cycle. 4. BWc and BWd apply to 256K × 36 device only. 5. Upon completion of the Burst sequence, the counter wraps around to its initial state and continues counting. Document #: 38-05161Rev. *E Page 8 of 28 CY7C1354A CY7C1356A Sleep Mode The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the “sleep” mode. CEs must remain inactive for the duration of tZZREC after the ZZ input returns LOW. CEN needs to active before going into the ZZ mode and before you want to come back out of the ZZ mode. ZZ Mode Electrical Characteristics Parameter Description Test Conditions Min. Max. Unit IDDZZ Sleep mode standby current ZZ > VDD – 0.2V 10 mA tZZS Device operation to ZZ ZZ > VDD – 0.2V 2tCYC ns tZZREC ZZ recovery time ZZ < 0.2V 2tCYC ns Truth Table[9, 10, 11, 12, 13, 14, 15, 16, 17] Operation Deselect Cycle Continue Deselect/NOP[18] Read Cycle (Begin Burst) Read Cycle (Continue Burst)[18] Dummy Read (Begin Burst)[19] Dummy Read (Continue Burst)[18, 19] Write Cycle (Begin Burst) Write Cycle (Continue Burst)[18] Abort Write (Begin Burst)[19] Abort Write (Continue Burst)[18, 19] Ignore Clock Edge/NOP[20] Previous Cycle Address Used WEN ADV/LD CE CEN BWx DQ OE (2 cycles later) X X X L H L X X High-Z Deselect X X H X L X X High-Z X External H L L L X X Q Read Next X H X L X X Q X External H L L L X H High-Z Read Next X H X L X H High-Z X External L L L L L X D Write Next X H X L L X D X External L L L L H X High-Z Write Next X H X L H X High-Z X X X H X H X X – Notes: 6. This assumes that CEN, CE, CE2 and CE3 are all True. 7. All addresses, control and data-in are only required to meet set-up and hold time with respect to the rising edge of clock. Data out is valid after a clock-to-data delay from the rising edge of clock. 8. DQc and DQd apply to 256K × 36 device only. 9. L means logic LOW. H means logic HIGH. X means Don’t Care. High-Z means High Impedance. BWx = L means [BWa*BWb*BWc*BWd] = LOW. BWx = H means [BWa*BWb*BWc*BWd] = HIGH. BWc and BWd apply to 256K × 36 device only. 10. CE = H means CE and CE3 are LOW along with CE2 HIGH. CE = L means CE or CE3 are HIGH or CE2 is LOW. CE = X means CE, CE3, and CE2 are Don’t Care. 11. BWa enables Write to byte “a” (DQa pins). BWb enables Write to byte “b” (DQb pins). BWc enables Write to byte “c” (DQc pins). BWd enables Write to byte “d” (DQd pins). DQc, DQd, BWc, and BWd apply to 256K × 36 device only. 12. The device is not in Sleep Mode, i.e., the ZZ pin is LOW. 13. During Sleep Mode, the ZZ pin is HIGH and all the address pins and control pins are “Don’t Care.” The SNOOZE MODE can only be entered two cycles after the Write cycle, otherwise the Write cycle may not be completed. 14. All inputs, except OE, ZZ, and MODE pins, must meet set-up time and hold time specification against the clock (CLK) LOW-to-HIGH transition edge. 15. OE may be tied to LOW for all the operation. This device automatically turns off the output driver during Write cycle. 16. Device outputs are ensured to be in High-Z during device power-up. 17. This device contains a two-bit burst counter. The address counter is incremented for all Continue Burst cycles. Address wraps to the initial address every fourth burst cycle. 18. Continue Burst cycles, whether Read or Write, use the same control signals. The type of cycle performed, Read or Write, depends upon the WEN control signal at the Begin Burst cycle. A Continue Deselect cycle can only be entered if a DESELECT cycle is executed first. 19. Dummy Read and Abort Write cycles can be entered to set up subsequent Read or Write cycles or to increment the burst counter. 20. When an Ignore Clock Edge cycle enters, the output data (Q) will remain the same if the previous cycle is Read cycle or remain High-Z if the previous cycle is Write or DESELECT cycle. Document #: 38-05161Rev. *E Page 9 of 28 CY7C1354A CY7C1356A IEEE 1149.1 Serial Boundary Scan (JTAG) Overview This device incorporates a serial boundary scan access port (TAP). This port is designed to operate in a manner consistent with IEEE Standard 1149.1–1990 (commonly referred to as JTAG), but does not implement all of the functions required for IEEE 1149.1 compliance. Certain functions have been modified or eliminated because their implementation places extra delays in the critical speed path of the device. Nevertheless, the device supports the standard TAP controller architecture (the TAP controller is the state machine that controls the TAPs operation) and can be expected to function in a manner that does not conflict with the operation of devices with IEEE Standard 1149.1-compliant TAPs. The TAP operates using LVTTL/LVCMOS logic level signaling. Disabling the JTAG Feature It is possible to use this device without using the JTAG feature. To disable the TAP controller without interfering with normal operation of the device, TCK should be tied LOW (VSS) to prevent clocking the device. TDI and TMS are internally pulled up and may be unconnected. They may alternately be pulled up to VCC through a resistor. TDO should be left unconnected. Upon power-up the device will come up in a reset state which will not interfere with the operation of the device. Test Access Port TCK–Test Clock (INPUT) Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate from the falling edge of TCK. TMS–Test Mode Select (INPUT) The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP controller state machine. It is allowable to leave this pin unconnected if the TAP is not used. The pin is pulled up internally, resulting in a logic HIGH level. TDI–Test Data In (INPUT) The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers placed between TDI and TDO. The register placed between TDI and TDO is determined by the state of the TAP controller state machine and the instruction that is currently loaded in the TAP instruction register (refer to Figure 1, TAP Controller State Diagram). It is allowable to leave this pin unconnected if it is not used in an application. The pin is pulled up internally, resulting in a logic HIGH level. TDI is connected to the most significant bit (MSB) of any register (see Figure 2). TDO–Test Data Out (OUTPUT) The TDO output pin is used to serially clock data-out from the registers. The output that is active depending on the state of the TAP state machine (refer to Figure 1, TAP Controller State Diagram). Output changes in response to the falling edge of TCK. This is the output side of the serial registers placed between TDI and TDO. TDO is connected to the LSB of any register (see Figure 2). Document #: 38-05161Rev. *E Performing a TAP Reset The TAP circuitry does not have a reset pin (TRST, which is optional in the IEEE 1149.1 specification). A RESET can be performed for the TAP controller by forcing TMS HIGH (VCC) for five rising edges of TCK and pre-loads the instruction register with the IDCODE command. This type of reset does not affect the operation of the system logic. The reset affects test logic only. At power-up, the TAP is reset internally to ensure that TDO is in a High-Z state. TAP Registers Overview The various TAP registers are selected (one at a time) via the sequences of ones and zeros input to the TMS pin as the TCK is strobed. Each of the TAP registers is a serial shift register that captures serial input data on the rising edge of TCK and pushes serial data out on subsequent falling edge of TCK. When a register is selected, it is connected between the TDI and TDO pins. Instruction Register The instruction register holds the instructions that are executed by the TAP controller when it is moved into the run test/idle or the various data register states. The instructions are three bits long. The register can be loaded when it is placed between the TDI and TDO pins. The parallel outputs of the instruction register are automatically preloaded with the IDCODE instruction upon power-up or whenever the controller is placed in the test-logic reset state. When the TAP controller is in the Capture-IR state, the two least significant bits of the serial instruction register are loaded with a binary “01” pattern to allow for fault isolation of the board-level serial test data path. Bypass Register The bypass register is a single-bit register that can be placed between TDI and TDO. It allows serial test data to be passed through the device TAP to another device in the scan chain with minimum delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed. Boundary Scan Register The Boundary Scan register is connected to all the input and bidirectional I/O pins (not counting the TAP pins) on the device. This also includes a number of NC pins that are reserved for future needs. There are a total of 70 bits for x36 device and 51 bits for x18 device. The boundary scan register, under the control of the TAP controller, is loaded with the contents of the device I/O ring when the controller is in Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. The EXTEST, SAMPLE/ PRELOAD and SAMPLE-Z instructions can be used to capture the contents of the I/O ring. The Boundary Scan Order table describes the order in which the bits are connected. The first column defines the bit’s position in the boundary scan register. The MSB of the register is connected to TDI, and LSB is connected to TDO. The second column is the signal name and the third column is the bump number. The third column is the TQFP pin number and the fourth column is the BGA bump number. Page 10 of 28 CY7C1354A CY7C1356A Identification (ID) Register IDCODE The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in Capture-DR state with the IDCODE command loaded in the instruction register. The register is then placed between the TDI and TDO pins when the controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins. The code is loaded from a 32-bit on-chip ROM. It describes various attributes of the device as described in the Identification Register Definitions table. The IDCODE instruction causes a vendor-specific, 32-bit code to be loaded into the ID register when the controller is in Capture-DR mode and places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction loaded in the instruction upon power-up and at any time the TAP controller is placed in the test-logic reset state. TAP Controller Instruction Set Overview There are two classes of instructions defined in the IEEE Standard 1149.1-1990; the standard (public) instructions and device specific (private) instructions. Some public instructions are mandatory for IEEE 1149.1 compliance. Optional public instructions must be implemented in prescribed ways. Although the TAP controller in this device follows the IEEE 1149.1 conventions, it is not IEEE 1149.1-compliant because some of the mandatory instructions are not fully implemented. The TAP on this device may be used to monitor all input and I/O pads, but can not be used to load address, data, or control signals into the device or to preload the I/O buffers. In other words, the device will not perform IEEE 1149.1 EXTEST, INTEST, or the preload portion of the SAMPLE/PRELOAD command. When the TAP controller is placed in Capture-IR state, the two least significant bits of the instruction register are loaded with 01. When the controller is moved to the Shift-IR state the instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction sets for this device are listed in the following tables. EXTEST EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with all 0s. EXTEST is not implemented in this device. The TAP controller does recognize an all-0 instruction. When an EXTEST instruction is loaded into the instruction register, the device responds as if a SAMPLE/PRELOAD instruction has been loaded. There is one difference between two instructions. Unlike SAMPLE/PRELOAD instruction, EXTEST places the device outputs in a High-Z state. SAMPLE-Z If the High-Z instruction is loaded in the instruction register, all output pins are forced to a High-Z state and the boundary scan register is connected between TDI and TDO pins when the TAP controller is in a Shift-DR state. SAMPLE/PRELOAD SAMPLE/PRELOAD is an IEEE 1149.1-mandatory instruction. The PRELOAD portion of the command is not implemented in this device, so the device TAP controller is not fully IEEE 1149.1-compliant. When the SAMPLE/PRELOAD instruction is loaded in the instruction register and the TAP controller is in the Capture-DR state, a snap shot of the data in the device’s input and I/O buffers is loaded into the boundary scan register. Because the device system clock(s) are independent from the TAP clock (TCK), it is possible for the TAP to attempt to capture the input and I/O ring contents while the buffers are in transition (i.e., in a metastable state). Although allowing the TAP to sample metastable inputs will not harm the device, repeatable results can not be expected. To guarantee that the boundary scan register will capture the correct value of a signal, the device input signals must be stabilized long enough to meet the TAP controller’s capture set-up plus hold time (tCS plus tCH). The device clock input(s) need not be paused for any other TAP operation except capturing the input and I/O ring contents into the boundary scan register. Moving the controller to Shift-DR state then places the boundary scan register between the TDI and TDO pins. Because the PRELOAD portion of the command is not implemented in this device, moving the controller to the Update-DR state with the SAMPLE/PRELOAD instruction loaded in the instruction register has the same effect as the Pause-DR command. BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP controller is in the Shift-DR state, the bypass register is placed between TDI and TDO. This allows the board level scan path to be shortened to facilitate testing of other devices in the scan path. Reserved Do not use these instructions. They are reserved for future use. Document #: 38-05161Rev. *E Page 11 of 28 CY7C1354A CY7C1356A 1 TEST-LOGIC RESET 0 0 REUN-TEST/ IDLE 1 1 SELECT DR-SCAN 0 0 1 1 CAPTURE-DR CAPTURE-IR 0 0 0 SHIFT-DR 1 1 EXIT1-DR 1 EXIT1-IR 0 0 PAUSE-DR 0 0 PAUSE-IR 1 1 0 EXIT2-DR EXIT2-IR 1 1 UPDATE-DR 1 0 SHIFT-IR 1 0 1 SELECT IR-SCAN 0 UPDATE-IR 1 0 Figure 1. TAP Controller State Diagram[21] Note: 21. The “0”/”1” next to each state represents the value at TMS at the rising edge of TCK. Document #: 38-05161Rev. *E Page 12 of 28 CY7C1354A CY7C1356A 0 Bypass Register Selection Circuitry 2 TDI 1 0 1 0 1 0 Selection Circuitry TDO Instruction Register 31 30 29 . . 2 Identification Register x . . . . 2 Boundary Scan Register [22] TDI TAP Controller TDI Figure 2. TAP Controller Block Diagram TAP Electrical Characteristics (20°C < Tj < 110°C; VCC = 3.3V –0.2V and +0.3V unless otherwise noted) Min. Max. Unit VIH Parameter Input High (Logic 1) Voltage[23, 24] Description Test Conditions 2.0 VCC + 0.3 V VIl Input Low (Logic 0) Voltage[23, 24] –0.3 0.8 V ILI Input Leakage Current 0V < VIN < VCC –5.0 5.0 µA ILI TMS and TDI Input Leakage Current 0V < VIN < VCC –30 30 µA ILO Output Leakage Current Output disabled, 0V < VIN < VCCQ –5.0 5.0 µA VOLC LVCMOS Output Low Voltage[23, 25] IOLC = 100 µA 0.2 V VOHC [23, 25] LVCMOS Output High Voltage IOHC = 100 µA VOLT LVTTL Output Low Voltage[23] IOLT = 8.0 mA VOHT LVTTL Output High Voltage[23] IOHT = 8.0 mA VCC – 0.2 V 0.4 2.4 V V Notes: 22. X = 69 for the x36 configuration; X = 50 for the x18 configuration. 23. All voltage referenced to VSS (GND). 24. Overshoot: VIH(AC) < VCC + 1.5V for t < tKHKH/2; undershoot: VIL(AC) <–0.5V for t < tKHKH/2; power-up: VIH < 3.6V and VCC < 3.135V and VCCQ < 1.4V for t < 200 ms. During normal operation, VCCQ must not exceed VCC. Control input signals (such as WEN and ADV/LD) may not have pulse widths less than tKHKL (min.). 25. This parameter is sampled. Document #: 38-05161Rev. *E Page 13 of 28 CY7C1354A CY7C1356A TAP AC Switching Characteristics Over the Operating Range[26, 27] Parameter Description Min. Max. Unit Clock tTHTH Clock Cycle Time fTF Clock Frequency tTHTL Clock HIGH Time 8 ns tTLTH Clock LOW Time 8 ns tTLQX TCK LOW to TDO Unknown 0 tTLQV TCK LOW to TDO Valid tDVTH TDI Valid to TCK HIGH 5 ns tTHDX TCK HIGH to TDI Invalid 5 ns tMVTH TMS Set-up 5 ns tTDIS TDI Set-up 5 ns tCS Capture Set-up 5 ns tTHMX TMS Hold 5 ns tTDIH TDI Hold 5 ns tCH Capture Hold 5 ns 20 ns 50 MHz Output Times ns 10 ns Set-up Times Hold Times Notes: 26. tCS and tCH refer to the set-up and hold time requirements of latching data from the boundary scan register. 27. Test conditions are specified using the load in TAP AC test conditions. Document #: 38-05161Rev. *E Page 14 of 28 CY7C1354A CY7C1356A TAP Timing and Test Conditions 1.5V 50Ω ALL INPUT PULSES TDO 3.0V Z0 = 50Ω 1.5V CL = 20 pF VSS 1.5 ns 1.5 ns GND (a) t tTHTH THTL t TLTH TEST CLOCK (TCK) tMVTH tTHMX tDVTH tTHDX TEST MODE SELECT (TMS) TEST DATA IN (TDI) t TLQV tTLQX TEST DATA OUT (TDO) Identification Register Definitions Instruction Field 256K x 36 512K x 18 Revision Number(31:28) XXXX XXXX Reserved for revision number. Device Depth (27:23) 00110 00111 Defines depth of 256K or 512K words. Device Width (22:18) Reserved (17:12) Cypress Jedec ID Code (11:1) ID Register Presence Indicator (0) 00100 00011 XXXXXX XXXXXX 00011100100 00011100100 1 1 Description Defines width of x36 or x18 bits. Reserved for future use. Allows unique identification of DEVICE vendor. Indicates the presence of an ID register. Scan Register Sizes Register Name Bit Size (x36) Bit Size (x18) Instruction 3 3 Bypass 1 1 ID 32 32 Boundary Scan 70 51 Document #: 38-05161Rev. *E Page 15 of 28 CY7C1354A CY7C1356A Instruction Codes Code Description EXTEST Instruction 000 Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces all device outputs to High-Z state. This instruction is not IEEE 1149.1-compliant. IDCODE 001 Preloads ID register with vendor ID code and places it between TDI and TDO. This instruction does not affect device operations. SAMPLE-Z 010 Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces all device outputs to High-Z state. RESERVED 011 Do not use these instructions; they are reserved for future use. SAMPLE/PRELOAD 100 Captures I/O ring contents. Places the boundary scan register between TDI and TDO. This instruction does not affect device operations. This instruction does not implement IEEE 1149.1 PRELOAD function and is therefore not 1149.1-compliant. RESERVED 101 Do not use these instructions; they are reserved for future use. RESERVED 110 Do not use these instructions; they are reserved for future use. BYPASS 111 Places the bypass register between TDI and TDO. This instruction does not affect device operations. Boundary Scan Order (256K × 36) Boundary Scan Order (256K × 36) (continued) Bit# Signal Name TQFP Bump ID Bit# 1 A 44 2R 29 2 A 45 3T 30 3 A 46 4T 31 4 A 47 5T 32 5 A 48 6R 6 A 49 3B Signal Name TQFP Bump ID A 83 4G NC 84 4A ADV/LD 85 4B OE 86 4F 33 CEN 87 4M 34 WEN 88 4H 7 A 50 5B 35 CLK 89 4K 8 DQa 51 6P 36 CE3 92 6B 9 DQa 52 7N 37 BWa 93 5L 10 DQa 53 6M 38 BWb 94 5G 11 DQa 56 7L 39 BWc 95 3G 12 DQa 57 6K 40 BWd 96 3L 13 DQa 58 7P 41 CE2 97 2B 14 DQa 59 6N 42 CE 98 4E 15 DQa 62 6L 43 A 99 3A 16 DQa 63 7K 44 A 100 2A 17 ZZ 64 7T 45 DQc 1 2D 18 DQb 68 6H 46 DQc 2 1E 19 DQb 69 7G 47 DQc 3 2F 20 DQb 72 6F 48 DQc 6 1G 21 DQb 73 7E 49 DQc 7 2H 22 DQb 74 6D 50 DQc 8 1D 23 DQb 75 7H 51 DQc 9 2E 24 DQb 78 6G 52 DQc 12 2G 25 DQb 79 6E 53 DQc 13 1H 26 DQb 80 7D 54 NC 14 5R 27 A 81 6A 55 DQd 18 2K 28 A 82 5A 56 DQd 19 1L Document #: 38-05161Rev. *E Page 16 of 28 CY7C1354A CY7C1356A Boundary Scan Order (256K × 36) (continued) Boundary Scan Order (512K × 18) (continued) Bit# Signal Name TQFP Bump ID Bit# Signal Name TQFP Bump ID 57 DQd 22 2M 28 CE3 92 6B 58 DQd 23 1N 29 BWa 93 5L 59 DQd 24 2P 30 BWb 94 3G 60 DQd 25 1K 31 CE2 97 2B 61 DQd 28 2L 32 CE 98 4E 62 DQd 29 2N 33 A 99 3A 63 DQd 30 1P 34 A 100 2A 64 MODE 31 3R 35 DQb 8 1D 65 A 32 2C 36 DQb 9 2E 66 A 33 3C 37 DQb 12 2G 67 A 34 5C 38 DQb 13 1H 68 A 35 6C 39 NC 14 5R 69 A1 36 4N 40 DQb 18 2K 70 A0 37 4P 41 DQb 19 1L 42 DQb 22 2M 43 DQb 23 1N 44 DQb 24 2P 45 MODE 31 3R 46 A 32 2C 47 A 33 3C 48 A 34 5C 49 A 35 6C 50 A1 36 4N 51 A0 37 4P Boundary Scan Order (512K × 18) Bit# Signal Name TQFP Bump ID 1 A 44 2R 2 A 45 2T 3 A 46 3T 4 A 47 5T 5 A 48 6R 6 A 49 3B 7 A 50 5B 8 DQa 58 7P 9 DQa 59 6N 10 DQa 62 6L 11 DQa 63 7K 12 ZZ 64 7T 13 DQa 68 6H 14 DQa 69 7G 15 DQa 72 6F 16 DQa 73 7E 17 DQa 74 6D 18 A 80 6T 19 A 81 6A 20 A 82 5A 21 A 83 4G 22 NC 84 4A 23 ADV/LD 85 4B 24 OE 86 4F 25 CEN 87 4M 26 WEN 88 4H 27 CLK 89 4K Document #: 38-05161Rev. *E Page 17 of 28 CY7C1354A CY7C1356A Maximum Ratings Short Circuit Output Current ....................................... 50 mA (Above which the useful life may be impaired. For user guidelines, not tested.) Voltage on VCC Supply Relative to VSS ......... –0.5V to +4.6V VIN ...........................................................–0.5V to VCC+0.5V Storage Temperature (plastic) ...................... –55°C to +125° Junction Temperature ..................................................+125° Power Dissipation .........................................................2.0W Static Discharge Voltage.......................................... > 2001V (per MIL-STD-883, Method 3015) Latch-up Current.................................................... > 200 mA Operating Range Range Commercial Industrial Ambient Temperature[28] 0°C to +70°C –40°C to +85°C VCC[29,30] VCCQ[29,30] 3.3V ± 5% 2.5V-5%/ 3.3V+10% Electrical Characteristics Over the Operating Range Parameter VIHD Description Input High (Logic 1) Voltage[23, 31] VIH VIL Input Low (Logic 0) Voltage[23, 31] Min. Max. Unit All other Inputs Test Conditions 2.0 VCC + 0.3 V 3.3V I/O 2.0 V 2.5V I/O 1.7 V 3.3V I/O –0.3 0.8 V 2.5V I/O –0.3 0.7 V ILI Input Leakage Current 0V < VIN < VCC - 5 µA ILI MODE and ZZ Input Leakage Current[32] 0V < VIN < VCC - 30 µA ILO Output Leakage Current Output(s) disabled, 0V < VOUT < VCC - 5 µA VOH Output High Voltage[23] I0H = –5.0 mA for 3.3V I/O 2.4 I0H = –1.0 mA for 2.5V I/O 2.0 VOL Output Low Voltage[23] VCC Supply Voltage[23] V V I0L=8.0 mA for 3.3V I/O I0L = 1.0 mA for 2.5V I/O VCCQ I/O Supply Voltage[23] Parameter Description ICC Power Supply Current: Operating[33, 34, 35, 36] ISB1 ISB2 ISB3 ISB4 0.4 V 0.4 V I0H=1.0 mA 3.135 3.465 V 3.3V I/O 3.135 3.465 V 2.5V I/O 2.375 2.9 V Conditions Typ. Device selected; all inputs < VILor > 200 VIH; cycle time > tKC min.; VCC =Max.; outputs open, ADV/LD = X, f = fMAX2 Automatic CE Device deselected; Power-down all inputs < VIL or > VIH; VCC = Max.; CLK cycle time > tKC Min. Current—TTL Inputs 15 CMOS Standby[34, 35, 36] Device deselected; VCC = Max.; all inputs < VSS + 0.2 or > VCC – 0.2; all inputs static; CLK frequency = 0 20 TTL Standby[34, 35, 36] Device deselected; all inputs < VIL or > VIH; all inputs static; VCC = Max.; CLK frequency = 0 50 Clock Running[34, 35, 36] Device deselected; all inputs < VIL or > VIH; VCC = MAX; CLK cycle time > tKC Min. 200 MHz/ -5 560 166 MHz/ -6 480 133 MHz/ -7.5 410 100 MHz/ -10 350 Unit mA mA 30 30 30 30 mA 50 50 50 50 mA 230 200 190 170 mA Notes: 28. TA is the case temperature. 29. Please refer to waveform (d). 30. Power Supply ramp up should be monotonic. 31. Overshoot: VIH < +6.0V for t < tKC /2; undershoot: VIL < –2.0V for t < tKC /2. 32. MODE pin has an internal pull-up and ZZ pin has an internal pull-down. These two pins exhibit an input leakage current of ±50 µA. 33. ICC is given with no output current. ICC increases with greater output loading and faster cycle times. 34. “Device Deselected” means the device is in power-down mode as defined in the truth table. “Device Selected” means the device is active. 35. Typical values are measured at 3.3V, 25°C, and 20-ns cycle time. 36. At f = fMAX, inputs are cycling at the maximum frequency of Read cycles of 1/tCYC; f = 0 means no input lines are changing. Document #: 38-05161Rev. *E Page 18 of 28 CY7C1354A CY7C1356A Capacitance[25] Parameter Description Test Conditions CI Input Capacitance CI/O Input/Output Capacitance (DQ) TA = 25°C, f = 1 MHz, VCC = 3.3V Typ. Max. Unit 4 4 pF 7 6.5 pF Thermal Resistance Parameter Description ΘJA Thermal Resistance (Junction to Ambient) ΘJC Thermal Resistance (Junction to Case) Test Conditions TQFP Typ. Unit 25 °C/W 9 °C/W Still Air, soldered on a 4.25 x 1.125 inch, 4-layer PCB AC Test Loads and Waveforms t PU DQ 317Ω VCCQ Z0 = 50Ω 50Ω DQ 5 pF Vt = 1.5V (a) ALL INPUT PULSES VCCQ 351Ω 0V 10% 90% 10% 90% = 200us Vcctyp Vccmin For proper RESET bring Vcc down to 0V ≤ 1.0 ns ≤ 1.0 ns (c) (b) (d) Switching Characteristics Over the Operating Range[17] -5/ 200 MHz Parameter Description Min. Max. -6/ 166 MHz Min. Max. -7.5/ 133 MHz Min. Max. -10/ 100 MHz Min. Max. Unit Clock tKC Clock Cycle Time 5.0 6.0 7.5 10 ns tKH Clock HIGH Time 1.8 2.1 2.6 3.5 ns tKL Clock LOW Time 1.8 2.1 2.6 3.5 ns Output Times tKQ Clock to Output Valid tKQX Clock to Output Invalid 1.0 1.0 1.0 1.0 ns tKQLZ Clock to Output in Low-Z[25, 38, 39] 1.0 1.0 1.0 1.0 ns tKQHZ Clock to Output in High-Z[25, 38, 39] 1.0 tOEQ OE to Output Valid Low-Z[25, 38, 39] tOELZ OE to Output in tOEHZ OE to Output in High-Z[25, 38, 39] 3.2 3.0 3.6 1.0 3.2 0 3.0 4.2 1.0 3.6 0 3.5 3.0 5.0 1.0 4.2 0 3.5 3.0 ns 5.0 ns 0 3.5 ns ns 3.5 ns Set-up Times tS Address and Controls[40] 1.5 1.5 1.8 2.0 ns Data In 1.5 1.5 1.8 2.0 ns tH Address and Controls[40] 0.5 0.5 0.5 0.5 ns tHD Data In[40] 0.5 0.5 0.5 0.5 ns tSD [40] Hold Times Notes: 37. Test conditions as specified with the output loading as shown in (a) of AC Test Loads unless otherwise noted. 38. Output loading is specified with CL=5 pF as in (a) of AC Test Loads. 39. At any given temperature and voltage condition, tKQHZ is less than tKQLZ and tOEHZ is less than tOELZ. 40. This is a synchronous device. All synchronous inputs must meet specified set-up and hold time, except for “don’t care” as defined in the truth table. Document #: 38-05161Rev. *E Page 19 of 28 CY7C1354A CY7C1356A Switching Waveforms Read Timing[41, 42, 43, 44, 45] tKC tKH tKL CLK tS tH CKE# CEN tS tH R/W# WEN tS ADDRESS A1 tH A2 BWa, BWb, BWa#, BWb# BWc, BWd tS tH tS tH CE# CE ADV/LD# ADV/LD OE# OE tKQ tKQLZ DQ Q(A1) tKQX Q(A2) Pipeline Read Q(A2+1) (CKE#HIGH , eliminates current L-H clock edge) Q(A2+2) (Burst Wraps around to initial state) Q(A2+3) tKQHZ Q(A2) BURST PIPELINE READ Pipeline Read Notes: 41. Q(A1) represents the first output from the external address A1. Q(A2) represents the first output from the external address A2; Q(A2+1) represents the next output data in the burst sequence of the base address A2, etc., where address bits A0 and A1 are advancing for the four word burst in the sequence defined by the state of the MODE input. 42. CE3 timing transitions are identical to the CE signal. For example, when CE is LOW on this waveform, CE3 is LOW. CE2 timing transitions are identical but inverted to the CE signal. For example, when CE is LOW on this waveform, CE2 is HIGH. 43. Burst ends when new address and control are loaded into the SRAM by sampling ADV/LD LOW. 44. WEN is “Don’t Care” when the SRAM is bursting (ADV/LD sampled HIGH). The nature of the burst access (Read or Write) is fixed by the state of the WEN signal when new address and control are loaded into the SRAM. 45. BWc and BWd apply to 256K × 36 device only. Document #: 38-05161Rev. *E Page 20 of 28 CY7C1354A CY7C1356A Switching Waveforms (continued) Write Timing[42, 43, 44, 45, 46, 47] tKC tKH tKL CLK tS tH CKE# CEN tS tH R/W# WEN tS ADDRESS A1 BWa, BWb, BWa#, BWb# BWc, BWd BW(A1) tH A2 tS BW(A2) tH tS tH tS tH BW(A2+1) BW(A2+2) BW(A2+3) BW(A2) CE# CE ADV/LD# ADV/LD OE# OE tHD tSD DQ D(A1) Pipeline Write (CKE#HIGH , eliminates current L-H clock edge) D(A2) D(A2+1) (Burst Wraps around to initial state) D(A2+2) D(A2+3) D(A2) Burst Pipeline Write Pipeline Write Notes: 46. D(A1) represents the first input to the external address A1. D(A2) represents the first input to the external address A2; D(A2 + 1) represents the next input data in the burst sequence of the base address A2, etc., where address bits A0 and A1 are advancing for the four-word burst in the sequence defined by the state of the MODE input. 47. Individual Byte Write signals (BWx) must be valid on all Write and burst-Write cycles. A Write cycle is initiated when WEN signal is sampled LOW when ADV/LD is sampled LOW. The byte Write information comes in one cycle before the actual data is presented to the SRAM. Document #: 38-05161Rev. *E Page 21 of 28 CY7C1354A CY7C1356A Switching Waveforms (continued) Read/Write Timing[42, 45, 47, 48] tKC tKH tKL CLK tS tH CKE# CEN tS tH R/W# WEN tS ADDRESS BWa,BWb# BWb, BWa#, BWc, BWd A1 tH A2 tS BW(A2) A3 tH tS tH tS tH A4 A5 BW(A4) BW(A5) A6 A7 A8 A9 CE# CE ADV/LD# ADV/LD OE# OE tKQ DATA Out (Q) tKQHZ tKQLZ Q(A1) Read tKQX Q(A3) Q(A6) Read DATA In (D) Read D(A2) Write Q(A7) D(A4) D(A5) Write Note: 48. Q(A1) represents the first output from the external address A1. D(A2) represents the input data to the SRAM corresponding to address A2. Document #: 38-05161Rev. *E Page 22 of 28 CY7C1354A CY7C1356A Switching Waveforms (continued) CEN Timing[42, 45, 47, 48, 49] tKC tKH tKL CLK tS tH CKE# CEN tS tH tS tH R/W# WEN ADDRESS A1 BWa, BWb# BWb, BWa#, BWc, BWd A2 A3 tS tH tS tH tS tH A4 A5 CE# CE ADV/LD# ADV/LD OE# OE tKQ DATA Out (Q) Q(A1) tKQLZ DATA In (D) tKQHZ Q(A3) tKQX tSD tHD D(A2) Note: 49. CEN when sampled HIGH on the rising edge of clock will block that L-H transition of the clock from propagating into the SRAM. The part will behave as if the L-H clock transition did not occur. All internal registers in the SRAM will retain their previous states. Document #: 38-05161Rev. *E Page 23 of 28 CY7C1354A CY7C1356A Switching Waveforms (continued) CE Timing[42, 45, 47, 50, 51] tKC tKH tKL CLK tS tH CKE# CEN tS tH R/W# WEN tS ADDRESS A1 tH A2 A3 BWa, BWb, BWa#, BWb# BWc, BWd tS A4 tS tH tS tH A5 tH CE# CE ADV/LD# ADV/LD tOEQ OE# OE tKQHZ tOELZ DATA Out (Q) tKQLZ Q(A1) tKQ DATA In (D) tOEHZ Q(A2) Q(A4) tKQX tSD tHD D(A3) Notes: 50. Q(A1) represents the first output from the external address A1. D(A3) represents the input data to the SRAM corresponding to address A3, etc. 51. When either one of the Chip Enables (CE, CE2, or CE3) is sampled inactive at the rising clock edge, a chip deselect cycle is initiated. The data-bus High-Z one cycle after t Document #: 38-05161Rev. *E Page 24 of 28 CY7C1354A CY7C1356A Switching Waveforms (continued) ZZ Mode Timing [ 50, 51] CLK CE1 LOW CE2 HIGH CE3 ZZ tZZS IDD IDD(active) I/Os Three-state tZZREC IDDZZ Ordering Information Speed (MHz) 200 Ordering Code CY7C1354A-200AC[52] CY7C1354A-200BGC[52] 166 CY7C1354A-166AC[52] CY7C1354A-166BGC[52] CY7C1356A-166AC 133 100 CY7C1354A-133BGC[52] Package Type Operating Range A101 100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack Commercial BG119 A101 BG119 A101 BG119 119-ball BGA (14 x 22 x 2.4 mm) 100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack 119-ball BGA (14 x 22 x 2.4 mm) 100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack 119-ball BGA (14 x 22 x 2.4 mm) CY7C1356A-133AC A101 100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack CY7C1356A-100AC A101 100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack CY7C1356A-100BGC Speed (MHz) Package Name Ordering Code BG119 Package Name 119-ball BGA (14 x 22 x 2.4 mm) Package Type 166 CY7C1354A-166BGI[52] BG119 119-ball BGA (14 x 22 x 2.4 mm) 133 CY7C1354A-133BGI BG119 119-ball BGA (14 x 22 x 2.4 mm) CY7C1356A-133AI A101 Operating Range Industrial 100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack Shaded areas contain advance information. Please contact your local Cypress sales representative for availability of these parts. Notes: 50.Device must be deselected when entering ZZ mode. See Cycle Descriptions Table for all possible signal conditions to deselect the device. 51. I/Os are in three-state when exiting ZZ sleep mode 52. EOL (End of Life) Document #: 38-05161Rev. *E Page 25 of 28 CY7C1354A CY7C1356A Package Diagrams 100-lead Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) A101 51-85050-A Document #: 38-05161Rev. *E Page 26 of 28 CY7C1354A CY7C1356A Package Diagrams (continued) 119-Lead PBGA (14 x 22 x 2.4 mm) BG119 51-85115-*B No Bus Latency, NoBL, Zero Bus Latency, and ZBL are trademarks of Cypress Semiconductor Corporation. All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-05161Rev. *E Page 27 of 28 © Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. CY7C1354A CY7C1356A Document History Page Document Title: CY7C1354A/CY7C1356A 256K x 36/512K x 18 Pipelined SRAM with NoBL™ Architecture Document Number: 38-05161 REV. ECN No. Issue Date Orig. of Change Description of Change ** 3000 4/21/00 CXV New Data Sheet *A 114095 03/12/02 GLC Updated VIH, VIL, separate VIH and VIL for 3.3V and 2.5V I/O. *B 114095 05/30/02 GLC Added “I” temp Added automatic power down to features Added ZZ mode to characteristics Added ZZ mode timing waveform Changed nomenclature for ISB Updated latch-up current Added static discharge voltage *C 121473 11/14/02 DSG Updated package diagram 51-85115 (BG119) to rev. *B *D 123143 01/18/03 RBI Added power-up requirements to AC Test Loads and Waveforms and Operating Range *E 216628 03/24/04 VBL Deleted Galvantech info–Title and contents Updated ordering info to match devmaster Document #: 38-05161Rev. *E Page 28 of 28