Freescale MPC5643LF0MLQ1R Mpc5643l microcontroller data sheet Datasheet

Document Number: MPC5643L
Rev. 3, 10/2009
MPC5643L
MPC5643L Microcontroller
Data Sheet
• High-performance e200z4d dual core
– 32-bit Power Architecture™ Book E CPU
– Core frequency as high as 120 MHz
– Dual issue five-stage pipeline core
– Variable Length Encoding (VLE)
– Memory Management Unit (MMU)
– 4 KB instruction cache with error detection code
– Signal processing engine (SPE)
• Memory available
– 1 MB Flash memory with ECC
– Built-in RWW capabilities for EEPROM emulation
– As much as 128 KB on-chip RAM with ECC
• SIL3/ASILD innovative safety concept: LockStep mode
and Fail-safe protection
– Sphere of replication (SoR) for key components (such as
CPU core, DMA, crossbar switch)
– Fault collection and control unit (FCCU)
– Redundancy control and checker unit (RCCU) on
outputs of the SoR connected to FCCU
– Boot-time Built-In Self-Test for Memory (MBIST) and
Logic (LBIST) triggered by hardware
– Boot-time Built-In Self-Test for ADC and flash memory
triggered by software
– Replicated safety enhanced watchdog
– Replicated junction temperature sensor
– Non-maskable interrupt (NMI)
– 16-region memory protection unit (MPU)
– Clock monitoring units (CMU)
– Power management unit (PMU)
– Cyclic redundancy check (CRC) unit
• Decoupled Parallel mode for high performance use of
replicated cores
• Nexus Class 3+ interface
• Interrupts
– Replicated 16-priority controller
– Replicated 16-channel eDMA controller
LQFP 144
20 x 20 x 1.4 mm
• GPIOs individually programmable as input, output or
special function
• Three 6-channel general-purpose eTimer units
• Two FlexPWM units
– Four 16-bit channels per module
• Communications interfaces
– Two LINFlex channels
– Three DSPI channels with automatic chip select
generation
– Two FlexCAN interfaces (2.0B Active) with 32 message
objects
– FlexRay module (V2.1) with dual channel, up to 64
message objects and speed as fast as 10 Mbit/s
• Two 12-bit analog-to-digital converters (ADCs)
– 16 input channels
– Programmable cross triggering unit (CTU) to
synchronize ADCs conversion with timer and PWM
• Sine wave generator (D/A with low pass filter)
• On-chip CAN/UART/FlexRay Bootstrap loader
• Single 3.0 V to 3.6 V voltage supply
• Ambient temperature range –40 °C to 125 °C
• Junction temperature range –40 °C to 150 °C
This document contains information on a product under development. Freescale reserves the
right to change or discontinue this product without notice.
© Freescale Semiconductor, Inc., 2009. All rights reserved.
Preliminary—Subject to Change Without Notice
257 MAPBGA
14 x 14 x 1.4 mm
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Freescale Semiconductor
Data Sheet: Advance Information
1
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.1 Device comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
1.3 Feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
1.3.1 High-performance e200z4d core . . . . . . . . . . . . .7
1.3.2 Crossbar switch (XBAR) . . . . . . . . . . . . . . . . . . .8
1.3.3 Memory Protection Unit (MPU) . . . . . . . . . . . . . .8
1.3.4 Enhanced Direct Memory Access (eDMA) . . . . .8
1.3.5 On-chip flash memory with ECC . . . . . . . . . . . . .9
1.3.6 On-chip SRAM with ECC. . . . . . . . . . . . . . . . . . .9
1.3.7 Platform flash controller . . . . . . . . . . . . . . . . . . . .9
1.3.8 Platform Static RAM Controller (SRAMC) . . . . .10
1.3.9 Memory subsystem access time . . . . . . . . . . . .10
1.3.10 Error Correction Status Module (ECSM) . . . . . .11
1.3.11 Peripheral bridge (PBRIDGE/AIPS-Lite) . . . . . .11
1.3.12 Interrupt Controller (INTC). . . . . . . . . . . . . . . . .11
1.3.13 System clocks and clock generation . . . . . . . . .12
1.3.14 Frequency-Modulated Phase-Locked Loop (FMPLL)12
1.3.15 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . . .12
1.3.16 Internal Reference Clock (RC) oscillator . . . . . .13
1.3.17 Clock, reset, power, mode and test control module13
1.3.18 Periodic Interrupt Timer Module (PIT) . . . . . . . .13
1.3.19 System Timer Module (STM). . . . . . . . . . . . . . .13
1.3.20 Software Watchdog Timer (SWT) . . . . . . . . . . .13
1.3.21 Fault Collection and Control Unit (FCCU) . . . . .14
1.3.22 System Integration Unit Lite (SIUL) . . . . . . . . . .14
1.3.23 Non-Maskable Interrupt (NMI) . . . . . . . . . . . . . .14
1.3.24 Boot Assist Module (BAM). . . . . . . . . . . . . . . . .14
1.3.25 System Status and Configuration Module (SSCM) 15
1.3.26 FlexCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
1.3.27 FlexRay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
1.3.28 Serial communication interface module (LINFlex)16
1.3.29 Serial Peripheral Interface module (DSPI). . . . .17
1.3.30 FlexPWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
1.3.31 eTimer module. . . . . . . . . . . . . . . . . . . . . . . . . .18
1.3.32 Sine Wave Generator (SWG) . . . . . . . . . . . . . .18
1.3.33 Analog-to-Digital Converter module (ADC) . . . .19
1.3.34 Cross Triggering Unit (CTU) . . . . . . . . . . . . . . .19
1.3.35 Cyclic Redundancy Checker (CRC) Unit . . . . . .20
1.3.36 Redundancy Control and Checker Unit (RCCU)20
1.3.37 Junction temperature sensor . . . . . . . . . . . . . . .20
1.3.38 Nexus Port Controller (NPC) . . . . . . . . . . . . . . .20
2
3
4
5
6
1.3.39 IEEE 1149.1 JTAG Controller (JTAGC) . . . . . . 21
1.3.40 Voltage regulator / Power Management Unit (PMU)22
1.3.41 Built-In Self-Test (BIST) capability . . . . . . . . . . 22
Package pinouts and signal descriptions . . . . . . . . . . . . . . . 22
2.1 Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.2 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.2.1 Concatenated pins . . . . . . . . . . . . . . . . . . . . . . 25
2.2.2 Power supply and reference voltage pins. . . . . 38
2.2.3 System pins . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
2.2.4 Pin muxing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
3.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . 58
3.3 Recommended operating conditions . . . . . . . . . . . . . . 59
3.4 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 60
3.4.1 General notes for specifications at maximum
junction temperature. . . . . . . . . . . . . . . . . . . . . 61
3.5 Electromagnetic Interference (EMI) characteristics . . . 63
3.6 Electrostatic discharge (ESD) characteristics . . . . . . . 63
3.7 Static latch-up (LU) . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
3.8 Voltage regulator electrical characteristics . . . . . . . . . 64
3.9 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . 66
3.10 Temperature sensor electrical characteristics . . . . . . . 67
3.11 Main oscillator electrical characteristics . . . . . . . . . . . 68
3.12 FMPLL electrical characteristics . . . . . . . . . . . . . . . . . 69
3.13 16 MHz RC oscillator electrical characteristics . . . . . . 71
3.14 ADC electrical characteristics . . . . . . . . . . . . . . . . . . . 72
3.14.1 Input Impedance and ADC Accuracy . . . . . . . . 72
3.15 Flash memory electrical characteristics . . . . . . . . . . . 77
3.16 AC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
3.16.1 Pad AC specifications. . . . . . . . . . . . . . . . . . . . 78
3.17 AC timing characteristics . . . . . . . . . . . . . . . . . . . . . . . 79
3.17.1 RESET pin characteristics . . . . . . . . . . . . . . . . 79
3.17.2 IEEE 1149.1 interface timing . . . . . . . . . . . . . . 80
3.17.3 Nexus timing. . . . . . . . . . . . . . . . . . . . . . . . . . . 82
3.17.4 External interrupt timing (IRQ pin) . . . . . . . . . . 84
3.17.5 FlexCAN timing . . . . . . . . . . . . . . . . . . . . . . . . 85
3.17.6 DSPI timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Package characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
4.1 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . 92
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
MPC5643L Microcontroller Data Sheet, Rev. 3
2
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Table of Contents
1
Overview
This document provides electrical specifications, pin assignments, and package diagrams for the MPC5643L series of
microcontroller units (MCUs). For functional characteristics, refer to the MPC5643L Microcontroller Reference Manual. For
use of the MPC5643Lin a fail-safe system according to safety standard IEC 61508, refer to the MPC5643LSafety Application
Guide.
The MPC5643L series microcontrollers are system-on-chip devices that are built on Power ArchitectureTM technology and:
•
•
•
•
Are 100% user-mode compatible with the classic Power Architecture instruction set
Contain enhancements that improve the architecture’s fit in embedded applications
Include additional instruction support for digital signal processing (DSP)
Integrate technologies such as an enhanced time processor unit, enhanced queued analog-to-digital converter,
Controller Area Network, and an enhanced modular input-output system
This document describes the features of the family and options available within the family members, and highlights important
electrical and physical characteristics of the devices.
The MPC5643L family of 32-bit microcontrollers is the latest achievement in integrated automotive application controllers. It
belongs to an expanding range of automotive-focused products designed to address electrical hydraulic power steering (EHPS),
electric power steering (EPS) and airbag applications. The advanced and cost-efficient host processor core of the MPC5643L
automotive controller family complies with the Power Architecture embedded category, which is 100 percent user-mode
compatible with the original PowerPC user instruction set architecture (UISA). It operates at speeds as high as 120 MHz and
offers high performance processing optimized for low power consumption. It capitalizes on the available development
infrastructure of current Power Architecture devices and is supported with software drivers, operating systems and
configuration code to assist with users implementations.
1.1
Device comparison
Table 1. MPC5643L device summary
Feature
CPU
Type
MPC5643L
2 × e200z4
(in lock-step or decoupled operation)
Architecture
Harvard
Execution speed
0 – 120 MHz (+2% FM)
DMIPS intrinsic performance
> 240 MIPS
SIMD (DSP + FPU)
Yes
MMU
16 entry
Instruction set PPC
Yes
Instruction set VLE
Yes
Instruction cache
4 KB, EDC
MPU-16 regions
Yes, replicated module
Semaphore unit (SEMA4)
Buses
Core bus
AHB, 32-bit address, 64-bit data
Internal periphery bus
Crossbar
Yes
Master × slave ports
32-bit address, 32-bit data
Lock Step Mode: 4 × 3
Decoupled Parallel Mode: 6 × 3
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
3
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
Table 1. MPC5643L device summary (continued)
Feature
Memory
MPC5643L
Code/data flash
1 MB, ECC, RWW
Static RAM
Modules
128 KB, ECC
Interrupt controller
16 interrupt levels, replicated module
Periodic Interrupt Timer (PIT)
System timer module
Software watchdog timer
eDMA
1 × 4 channels
1 × 4 channels, replicated module
Yes, replicated module
16 channels, replicated module
FlexRay
1 × 64 message buffer, dual channel
FlexCAN
2 × 32 message buffer
LINFlex (UART and LIN)
2
Clock out
Yes
Fault control & collection unit (FCCU)
Yes
Cross triggering unit (CTU)
Yes
3 × 6 channels1
eTimer
2 Module 4 × (2 + 1) channels2
FlexPWM
ADC
2 × 12-bit ADC, 16 channels per ADC
(3 internal, 4 shared and 9 external)
Sine-wave generator
DSPI
32 point
3 × DSPI
as many as 8 chip selects
Cyclic redundancy checker (CRC) unit
Junction temperature sensor with analog
comparator
Yes
Yes, replicated module
≥ 16
Digital I/Os
Supply
Device power supply
Analog reference voltage
Clocking
3.3 V with integrated bypassable ballast
transistor
External ballast transistor not needed for bare
die
3.0 V – 3.6 V and 4.5 V – 5.5 V
Frequency-modulated phase-locked loop (FMPLL)
Internal RC oscillator
External crystal oscillator
Debug
Nexus
2
16 MHz
4 – 40 MHz
Level 3+
MPC5643L Microcontroller Data Sheet, Rev. 3
4
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
Table 1. MPC5643L device summary (continued)
Feature
Packages
Known Good Die (KGD)
LQFP
Temperature
MPC5643L
Yes
144 pins
MAPBGA
257 MAPBGA
Temperature range (junction)
–40 to 150 °C
Ambient temperature range using external ballast
transistor (LQFP)
–40 to 125 °C
Ambient temperature range using external ballast
transistor (BGA)
TBD
NOTES:
1
The third eTimer is available only in the BGA package.
2
The second FlexPWM module is available only in the BGA package.
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
5
1.2
Block diagram
Figure 1 shows a top-level block diagram of the MPC5643L device.
PMU
JTAG
Nexus
e200z4
SWT
ECSM
STM
INTC
SPE
VLE
VLE
ECSM
STM
INTC
MMU
FlexRay
I-CACHE
DMA
SWT
SPE
MMU
SEMA4
PMU
e200z4
SEMA4
I-CACHE
DMA
RC
Crossbar Switch
Crossbar Switch
Memory Protection Unit
Memory Protection Unit
ECC logic for SRAM
AIPS Bridge
TSENS
ECC logic for SRAM
AIPS Bridge
RC
RC
Flash memory
ECC bits + logic
SRAM
ECC bits
T-Sens
ADC
AIPS
BAM
CMU
CRC
CTU
DMA
DSPI
ECC
ECSM
FCCU
FlexCAN
FMPLL
INTC
IRCOSC
– Analog-to-Digital Converter
– AHB to IP Slave Bus bridge
– Boot Assist Module
– Clock Monitoring Unit
– Cyclic Redundancy Check unit
– Cross Triggering Unit
– Direct Memory Access controller
– Serial Peripherals Interface
– Error Correction Code
– Error Correction Status Module
– Fault Collection and Control Unit
– Controller Area Network controller
– Frequency Modulated Phase Locked Loop
– Interrupt Controller
– Internal RC Oscillator
JTAG
MC
PIT
PMU
RC
RTC
SEMA4
SIUL
SSCM
STM
SWG
SWT
TSENS
XOSC
PIT
FCCU
SWG
CRC
DSPI
DSPI
DSPI
LINFlex
LINFlex
FlexCAN
FlexCAN
eTimer
eTimer
eTimer
FlexPWM
FlexPWM
CMU
IRCOSC
ADC
CTU
FMPLL
WakeUp
CMU
Secondary PLL
SIUL
CMU
SSCM
XOSC
ADC
BAM
MC
RC
– Joint Test Action Group interface
– Mode Entry, Clock, Reset, & Power
– Periodic Interrupt Timer
– Power Management Unit
– Redundancy Checker
– Real Time Clock
– Semaphore Unit
– System Integration Unit Lite
– System Status and Configuration Module
– System Timer Module
– Sine Wave Generator
– Software Watchdog Timer
– Temperature Sensor
– Crystal Oscillator
Figure 1. MPC5643L block diagram
MPC5643L Microcontroller Data Sheet, Rev. 3
6
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
1.3
1.3.1
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
Feature details
High-performance e200z4d core
The e200z4d Power Architecture™ core provides the following features:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Two independent execution units, both supporting fixed-point and floating-point operations
Dual issue 32-bit Power Architecture™ (Book E) compliant
— Five-stage pipeline (IF, DEC, EX1, EX2, WB)
— In-order execution and instruction retirement
Full support for Power Architecture instruction set and Variable Length Encoding (VLE)
— Mix of classic 32-bit and 16-bit instruction allowed
— Optimization of code size possible
Thirty-two 64-bit general purpose registers (GPRs)
Harvard bus (32-bit address, 64-bit data)
— I-Bus interface capable of one outstanding transaction plus one piped with no wait-on-data return
— D-Bus interface capable of two transactions outstanding to fill AHB pipe
I-cache and I-cache controller
— 4 KB, 256-bit cache line (programmable for 2- or 4-way)
No data cache
16-entry MMU
8-entry branch table buffer
Branch look-ahead instruction buffer to accelerate branching
Dedicated branch address calculator
Three cycles worst case for missed branch
Load/store unit
— Fully pipelined
— Single-cycle load latency
— Big- and little-endian modes supported
— Misaligned access support
— Single stall cycle on load to use
Single-cycle throughput (two-cycle latency) integer 32 × 32 multiplication
4 – 14 cycles integer 32 × 32 division (average division on various benchmark of nine cycles)
Single precision floating-point unit
— 1 cycle throughput (2-cycle latency) floating-point 32 × 32 multiplication
— Target nine cycles (worst case acceptable is 12 cycles) throughput floating-point 32 × 32 division
— Special square root and min/max function implemented
Signal processing support: APU-SPE 1.1
— Support for vectorized mode: as many as two floating-point instructions per clock
Vectored interrupt support
Reservation instruction to support read-modify-write constructs
Extensive system development and tracing support via Nexus debug port
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
7
1.3.2
Crossbar switch (XBAR)
The XBAR multi-port crossbar switch supports simultaneous connections between four master ports and three slave ports. The
crossbar supports a 32-bit address bus width and a 64-bit data bus width.
The crossbar allows four concurrent transactions to occur from any master port to any slave port, although one of those transfers
must be an instruction fetch from internal flash memory. If a slave port is simultaneously requested by more than one master
port, arbitration logic selects the higher priority master and grants it ownership of the slave port. All other masters requesting
that slave port are stalled until the higher priority master completes its transactions.
The crossbar provides the following features:
•
•
•
•
Four masters and three slaves supported per each replicated crossbar
— Masters allocation for each crossbar: e200z4d core with two independent bus interface units (BIU) for I and D
access (two masters), one DMA, one FlexRay
— Slaves allocation for each crossbar: a redundant flash-memory controller with two slave ports to guarantee
maximum flexibility to handle Instruction and Data array, one redundant SRAM controller with one slave port
each and one redundant peripheral bus bridge
32-bit address bus and 64-bit data bus
Programmable arbitration priority
— Requesting masters can be treated with equal priority and are granted access to a slave port in round-robin method,
based upon the ID of the last master to be granted access or a priority order can be assigned by software at
application run time
Temporary dynamic priority elevation of masters
The XBAR is replicated for each processor.
1.3.3
Memory Protection Unit (MPU)
The Memory Protection Unit splits the physical memory into 16 different regions. Each master (DMA, FlexRay, CPU) can be
assigned different access rights to each region.
•
•
16-region MPU with concurrent checks against each master access
32-byte granularity for protected address region
The memory protection unit is replicated for each processor.
1.3.4
Enhanced Direct Memory Access (eDMA)
The enhanced direct memory access (eDMA) controller is a second-generation module capable of performing complex data
movements via 16 programmable channels, with minimal intervention from the host processor. The hardware microarchitecture
includes a DMA engine which performs source and destination address calculations, and the actual data movement operations,
along with an SRAM-based memory containing the transfer control descriptors (TCD) for the channels. This implementation
is used to minimize the overall block size.
The eDMA module provides the following features:
•
•
•
•
•
•
•
•
16 channels supporting 8-, 16-, and 32-bit value single or block transfers
Support variable sized queues and circular buffered queue
Source and destination address registers independently configured to post-increment or stay constant
Support major and minor loop offset
Support minor and major loop done signals
DMA task initiated either by hardware requestor or by software
Each DMA task can optionally generate an interrupt at completion and retirement of the task
Signal to indicate closure of last minor loop
MPC5643L Microcontroller Data Sheet, Rev. 3
8
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
•
Transfer control descriptors mapped inside the SRAM
The eDMA controller is replicated for each processor.
1.3.5
On-chip flash memory with ECC
This device includes programmable, non-volatile flash memory. The non-volatile memory (NVM) can be used for instruction
storage or data storage, or both. The flash memory module interfaces with the system bus through a dedicated flash memory
array controller. It supports a 64-bit data bus width at the system bus port, and a 128-bit read data interface to flash memory.
The module contains four 128-bit prefetch buffers. Prefetch buffer hits allow no-wait responses. Buffer misses incur a 3 wait
state response at 120 MHz.
The flash memory module provides the following features
•
•
•
•
•
•
•
•
1.3.6
1 MB of flash memory in unique multi-partitioned hard macro
Sectorization: 16 KB + 2 × 48 KB + 16 KB + 2 × 64 KB + 2 × 128 KB + 2 × 256 KB
EEPROM emulation (in software) within same module but on different partition
16 KB Test and 16 KB shadow sector for test, censorship device and user option bits
3 wait states at 120 MHz
Flash line 128-bit wide with 8-bit ECC on 64-bit word (total 144 bits)
Accessed via a 64-bit wide bus for write and a 128-bit wide array for read operations
1-bit error correction, 2-bit error detection
On-chip SRAM with ECC
The MPC5643L SRAM provides a general-purpose single port memory.
ECC handling is done on a 32-bit boundary for data and it is extended to the address to have the highest possible diagnostic
coverage including the array internal address decoder.
The SRAM module provides the following features:
•
•
•
1.3.7
System SRAM: 128 KB
ECC on 32-bit word (syndrome of 7 bits)
— ECC covers SRAM bus address
1-bit error correction, 2-bit error detection
Platform flash controller
The following list summarizes the key features of the flash controller:
•
•
•
•
•
Single AHB port interface supports a 64-bit data bus. All AHB aligned and unaligned reads within the 32-bit container
are supported. Only aligned word writes are supported.
Array interfaces support a 128-bit read data bus and a 64-bit write data bus for each bank.
Code flash (bank0) interface provides configurable read buffering and page prefetch support.
— Four page-read buffers (each 128 bits wide) and a prefetch controller support speculative reading and optimized
flash access.
Single-cycle read responses (zero AHB data-phase wait states) for hits in the buffers. The buffers implement a
least-recently-used replacement algorithm to maximize performance.
Data flash (bank1) interface includes a 128-bit register to temporarily hold a single flash page. This logic supports
single-cycle read responses (0 AHB data-phase wait states) for accesses that hit in the holding register.
— No prefetch support is provided for this bank.
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
9
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
•
Programmable response for read-while-write sequences including support for stall-while-write, optional stall
notification interrupt, optional flash operation abort, and optional abort notification interrupt.
Separate and independent configurable access timing (on a per bank basis) to support use across a wide range of
platforms and frequencies.
Support of address-based read access timing for emulation of other memory types.
Support for reporting of single- and multi-bit error events.
Typical operating configuration loaded into programming model by system reset.
•
•
•
•
The platform flash controller is replicated for each processor.
1.3.8
Platform Static RAM Controller (SRAMC)
The SRAMC module is the platform RAM array controller, with integrated error detection and correction.
The main features of the SRAMC provide connectivity for the following interfaces:
•
•
•
XBAR Slave Port (64-bit data path)
ECSM (ECC Error Reporting, error injection and configuration)
RAM array
The following functions are implemented:
•
•
•
ECC encoding (32-bit boundary for data and complete address bus)
ECC decoding (32-bit boundary and entire address)
Address translation from the AHB protocol on the XBAR to the RAM Array
The platform RAM controller is replicated for each processor.
1.3.9
Memory subsystem access time
Every memory access the CPU performs requires at least one system clock cycle for the data phase of the access. Slower
memories or peripherals may require additional data phase wait states. Additional data phase wait states may also occur if the
slave being accessed is not parked on the requesting master in the crossbar.
Table 2 shows the number of additional data phase wait states required for a range of memory accesses.
Table 2. Platform memory access time summary
AHB Transfer
Data Phase
Wait States
Description
TBD1
Flash prefetch buffer hit (page hit)
TBD
Flash prefetch buffer miss (at 120 MHz)
(based on 4-cycle random flash array access time)
e200z4d Data Read
TBD
RAM read
e200z4d Data Write
TBD
RAM 32-bit write
e200z4d Data Write
TBD
RAM 64-bit write (executed as 2 x 32-bit writes)
TBD
RAM 8-,16-bit write
(Read-modify-Write for ECC)
TBD
Flash prefetch buffer hit (page hit)
TBD
Flash prefetch buffer miss (includes 1-cycle of program flash
controller arbitration)
e200z4d Instruction Fetch
e200z4d Instruction Fetch
e200z4d Data Write
e200z4d Data Flash Read
e200z4d Data Flash Read
MPC5643L Microcontroller Data Sheet, Rev. 3
10
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
Table 2. Platform memory access time summary (continued)
AHB Transfer
Data Phase
Wait States
Description
e200z4d Peripheral Read
TBD
Peripheral Bridge read
e200z4d Peripheral Write
TBD
Peripheral Bridge write
NOTES:
1
To be determined
1.3.10
Error Correction Status Module (ECSM)
The ECSM on this device manages the ECC configuration and reporting for the platform memories (flash memory and SRAM).
It does not implement the actual ECC calculation. A detected error (double error for flash memory or SRAM) is also reported
to the FCCU. The following errors and indications are reported into the ECSM dedicated registers:
•
•
•
•
ECC error status and configuration for flash memory and SRAM
ECC error reporting for flash memory
ECC error reporting for SRAM
ECC error injection for RAM
1.3.11
Peripheral bridge (PBRIDGE/AIPS-Lite)
The peripheral bridge (referred to as PBRIDGE or AIPS-Lite throughout this document) implements the following features:
•
•
•
•
•
•
Duplicated periphery
Protocol translator bridge from AMBA to internal periphery interface (IPI)
Master access right per peripheral (per master: read access enable; write access enable)
Write buffering for peripherals
Checker applied on AIPS-Lite output toward periphery
Byte endianess swap capability
1.3.12
Interrupt Controller (INTC)
The INTC (interrupt controller) provides priority-based preemptive scheduling of interrupt requests, suitable for statically
scheduled hard real-time systems.
For high-priority interrupt requests, the time from the assertion of the interrupt request from the peripheral to when the processor
is executing the interrupt service routine (ISR) has been minimized. The INTC provides a unique vector for each interrupt
request source for quick determination of which ISR needs to be executed. It also provides an ample number of priorities so that
lower priority ISRs do not delay the execution of higher priority ISRs. To allow the appropriate priorities for each source of
interrupt request, the priority of each interrupt request is software configurable.
The INTC supports the priority ceiling protocol for coherent accesses. By providing a modifiable priority mask, the priority can
be raised temporarily so that all tasks which share the resource can not preempt each other.
The INTC provides the following features:
•
•
•
•
Duplicated periphery
Unique 9-bit vector per interrupt source
16 priority levels with fixed hardware arbitration within priority levels for each interrupt source
Priority elevation for shared resource
The INTC is replicated for each processor.
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
11
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
1.3.13
System clocks and clock generation
The following list summarizes the system clock and clock generation on this device:
•
•
•
•
•
•
•
•
Lock status continuously monitored by lock detect circuitry
Loss-of-clock (LOC) detection for reference and feedback clocks
On-chip loop filter (for improved electromagnetic interference performance and fewer external components required)
Programmable output clock divider of system clock (÷1, ÷2, ÷4, ÷8)
FlexPWM module and as many as three eTimer modules running on an auxiliary clock independent from system clock
(with max frequency 120 MHz)
On-chip crystal oscillator with automatic level control
Dedicated internal 16 MHz internal RC oscillator for rapid start-up
— Supports automated frequency trimming by hardware during device startup and by user application
Auxiliary clock domain for motor control periphery (FlexPWM, eTimer, CTU, ADC, and SWG)
1.3.14
Frequency-Modulated Phase-Locked Loop (FMPLL)
Two FMPLLs are available on each device.
Each FMPLL allows the user to generate high speed system clocks starting from a minimum reference of 4 MHz input clock.
Further, the FMPLL supports programmable frequency modulation of the system clock. The PLL multiplication factor, output
clock divider ratio are all software configurable. The FMPLLs have the following major features:
•
•
•
•
•
•
•
•
•
•
•
Input frequency: 4–40 MHz continuous range (limited by the crystal oscillator)
Voltage controlled oscillator (VCO) range: 256–512 MHz
Frequency modulation via software control to reduce and control emission peaks
— Modulation depth ±2% if centered or 0% to –4% if downshifted via software control register
— Modulation frequency: triangular modulation with 25 kHz nominal rate
Option to switch modulation on and off via software interface
Reduced frequency divider (RFD) for reduced frequency operation without re-lock
Three modes of operation
— Bypass mode
— Normal PLL mode with crystal reference (default)
— Normal PLL mode with external reference
Lock monitor circuitry with lock status
Loss-of-lock detection for reference and feedback clocks
Self-clocked mode (SCM) operation
On-chip loop filter
Auxiliary FMPLL
— Used for FlexRay due to precise symbol rate requirement by the protocol
— Used for motor control periphery and connected IP (A/D digital interface CTU) to allow independent frequencies
of operation for PWM and timers and jitter-free control
— Option to enable/disable modulation to avoid protocol violation on jitter and/or potential unadjusted error in
electric motor control loop
— Allows to run motor control periphery at different (precisely lower, equal or higher as required) frequency than
the system to ensure higher resolution
1.3.15
Main oscillator
The main oscillator provides these features:
MPC5643L Microcontroller Data Sheet, Rev. 3
12
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
•
•
•
•
Input frequency range 4–40 MHz
Crystal input mode
External reference clock (3.3 V) input mode
PLL reference
1.3.16
Internal Reference Clock (RC) oscillator
The architecture uses constant current charging of a capacitor. The voltage at the capacitor is compared to the stable bandgap
reference voltage. The RC oscillator is the device safe clock.
The RC oscillator provides these features:
•
•
•
•
Nominal frequency 16 MHz
±5% variation over voltage and temperature after process trim
Clock output of the RC oscillator serves as system clock source in case loss of lock or loss of clock is detected by the
PLL
RC oscillator is used as the default system clock during startup and can be used as back-up input source of PLL(s) in
case XOSC fails
1.3.17
Clock, reset, power, mode and test control module
The Clock, Reset, Power, Mode and Test control module has the following features:
•
•
•
•
Clock gating and clock distribution control
Halt, stop mode control
Flexible configurable System and auxiliary clock dividers
Various execution modes
— Reset, Idle, Test, Safe
— Various RUN modes with software selectable powered modules
— No stand-by mode implemented (no internal switchable power domains)
1.3.18
Periodic Interrupt Timer Module (PIT)
The PIT module implements the following features:
•
•
•
•
Four general purpose interrupt timers
32-bit counter resolution
32-bit counter for real time interrupt, clocked from main external oscillator
Can be used for software tick or DMA trigger operation
1.3.19
System Timer Module (STM)
The STM implements the following features:
•
•
Up-counter with four output compare registers
OS task protection and hardware tick implementation per AutoSar requirement
The STM is replicated for each processor.
1.3.20
Software Watchdog Timer (SWT)
This module implements the following features:
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
13
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
•
•
•
•
•
Fault tolerant output
Safe internal RC oscillator as reference clock
Windowed watchdog
Program flow control monitor with 16-bit pseudorandom key generation
Allows a high level of safety (SIL3 monitor)
The SWT module is replicated for each processor.
1.3.21
Fault Collection and Control Unit (FCCU)
The FCCU module has the following features:
•
•
•
•
Redundant collection of hardware checker results
Redundant collection of error information and latch of faults from critical modules on the device
Collection of self-test results
Configurable and graded fault control
— Internal reactions (no internal reaction, IRQ, Functional Reset, Destructive Reset, or Safe mode entered)
— External reaction (failure is reported to the external/surrounding system via configurable output pins)
1.3.22
System Integration Unit Lite (SIUL)
The SIUL controls MCU reset configuration, pad configuration, external interrupt, general purpose I/O (GPIO), internal
peripheral multiplexing, and the system reset operation. The reset configuration block contains the external pin boot
configuration logic. The pad configuration block controls the static electrical characteristics of I/O pins. The GPIO block
provides uniform and discrete input/output control of the I/O pins of the MCU.
The SIU provides the following features:
•
•
Centralized pad control on per pin basis
— Pin function selection
— Configurable weak pull-up/down
— Configurable slew rate control (slow/medium/fast)
— Hysteresis on GPIO pins
— Configurable automatic safe mode pad control
Input filtering for external interrupts
1.3.23
Non-Maskable Interrupt (NMI)
The non-maskable interrupt with de-glitching filter supports high priority core exceptions.
1.3.24
Boot Assist Module (BAM)
The BAM is a block of read-only memory with hard-coded content. The BAM program is executed only if serial booting mode
is selected via boot configuration pins.
The BAM provides the following features:
•
•
•
•
Enables booting via serial mode (FlexCAN or LINFlex-UART)
Supports programmable 64-bit password protection for serial boot mode
Supports serial bootloading of either classic PowerPC Book E code (default) or Freescale VLE code
Automatic switch to serial boot mode if internal flash memory is blank or invalid
MPC5643L Microcontroller Data Sheet, Rev. 3
14
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
1.3.25
System Status and Configuration Module (SSCM)
The SSCM on this device features the following:
•
•
•
•
•
System configuration and status
Debug port status and debug port enable
Multiple boot code starting locations out of reset through implementation of search for valid Reset Configuration Half
Word
Sets up the MMU to allow user boot code to execute as either classic PowerPC Book E code (default) or as Freescale
VLE code out of flash memory
Triggering of device self-tests during reset phase of device boot
1.3.26
FlexCAN
The FlexCAN module is a communication controller implementing the CAN protocol according to Bosch Specification version
2.0B. The CAN protocol was designed to be used primarily as a vehicle serial data bus, meeting the specific requirements of
this field: real-time processing, reliable operation in the EMI environment of a vehicle, cost-effectiveness and required
bandwidth.
The FlexCAN module provides the following features:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Full implementation of the CAN protocol specification, version 2.0B
— Standard data and remote frames
— Extended data and remote frames
— 0 to 8 bytes data length
— Programmable bit rate as fast as 1Mbit/s
32 message buffers of 0 to 8 bytes data length
Each message buffer configurable as receive or transmit buffer, all supporting standard and extended messages
Programmable loop-back mode supporting self-test operation
Three programmable mask registers
Programmable transmit-first scheme: lowest ID or lowest buffer number
Time stamp based on 16-bit free-running timer
Global network time, synchronized by a specific message
Maskable interrupts
Independent of the transmission medium (an external transceiver is assumed)
High immunity to EMI
Short latency time due to an arbitration scheme for high-priority messages
Transmit features
— Supports configuration of multiple mailboxes to form message queues of scalable depth
— Arbitration scheme according to message ID or message buffer number
— Internal arbitration to guarantee no inner or outer priority inversion
— Transmit abort procedure and notification
Receive features
— Individual programmable filters for each mailbox
— Eight mailboxes configurable as a 6-entry receive FIFO
— Eight programmable acceptance filters for receive FIFO
Programmable clock source
— System clock
— Direct oscillator clock to avoid PLL jitter
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
15
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
1.3.27
FlexRay
The FlexRay module provides the following features:
•
•
•
•
•
•
•
•
•
Full implementation of FlexRay Protocol Specification 2.1
64 configurable message buffers can be handled
Dual channel or single channel mode of operation, each as fast as 10 Mbit/s data rate
Message buffers configurable as transmit, receive, or receive FIFO
Message buffer size configurable
Message filtering for all message buffers based on Frame ID, cycle count, and message ID
Programmable acceptance filters for receive FIFO message buffers
Memory mapped message buffers (shared using the MPU)
ECC to cover lookup table and data SRAM
1.3.28
Serial communication interface module (LINFlex)
The LINFlex on this device features the following:
•
•
•
•
•
•
•
Supports LIN Master mode, LIN Slave mode and UART mode
LIN state machine compliant to LIN1.3, 2.0, and 2.1 specifications
Manages LIN frame transmission and reception without CPU intervention
LIN features
— Autonomous LIN frame handling
— Message buffer to store as many as 8 data bytes
— Supports messages as long as 64 bytes
— Detection and flagging of LIN errors (Sync field, delimiter, ID parity, bit framing, checksum and Time-out errors)
— Classic or extended checksum calculation
— Configurable break duration of up to 36-bit times
— Programmable baud rate prescalers (13-bit mantissa, 4-bit fractional)
— Diagnostic features (Loop back, LIN bus stuck dominant detection)
— Interrupt driven operation with 16 interrupt sources
LIN slave mode features
— Autonomous LIN header handling
— Autonomous LIN response handling
UART mode
— Full-duplex operation
— Standard non return-to-zero (NRZ) mark/space format
— Data buffers with 4-byte receive, 4-byte transmit
— Configurable word length (8-bit, 9-bit, or 16-bit words)
— Configurable parity scheme: none, odd, even, always 0
— Speed as fast as 2 Mbit/s
— Error detection and flagging (Parity, Noise and Framing errors)
— Interrupt driven operation with four interrupt sources
— Separate transmitter and receiver CPU interrupt sources
— 16-bit programmable baud-rate modulus counter and 16-bit fractional
— Two receiver wake-up methods
Support for DMA enabled transfers
MPC5643L Microcontroller Data Sheet, Rev. 3
16
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
1.3.29
Serial Peripheral Interface module (DSPI)
The serial peripheral interface (DSPI) block provides a synchronous serial interface for communication between the MPC5643L
and external devices.
A DSPI module provides these features:
•
•
•
•
•
•
•
•
•
•
•
•
•
Full duplex, synchronous transfers
Master or slave operation
Programmable master bit rates
Programmable clock polarity and phase
End-of-transmission interrupt flag
Programmable transfer baud rate
Programmable data frames from 4 to 16 bits
As many as eight chip select lines available, depending on package and pin multiplexing
Four clock and transfer attributes registers
Chip select strobe available as alternate function on one of the chip select pins for de-glitching
FIFOs for buffering as many as five transfers on the transmit and receive side
Queueing operation possible through use of the eDMA
General purpose I/O functionality on pins when not used for SPI
1.3.30
FlexPWM
The pulse width modulator module (FlexPWM) contains four PWM channels, each of which is configured to control a single
half-bridge power stage. Two modules are instantiated on the 257 MAPBGA device; on the 144 LQFP package, only one
module is present. Additionally, four fault input channels are provided per FlexPWM module.
This PWM is capable of controlling most motor types, including:
•
•
•
•
•
AC induction motors (ACIM)
Permanent Magnet AC motors (PMAC)
Brushless (BLDC) and brush DC motors (BDC)
Switched (SRM) and variable reluctance motors (VRM)
Stepper motors
A FlexPWM module implements the following features:
•
•
•
•
•
•
•
•
•
•
•
16 bits of resolution for center, edge aligned, and asymmetrical PWMs
Maximum operating frequency as high as 120 MHz
— Clock source not modulated and independent from system clock (generated via auxiliary PLL)
Fine granularity control for enhanced resolution of the PWM period
PWM outputs can operate as complementary pairs or independent channels
Ability to accept signed numbers for PWM generation
Independent control of both edges of each PWM output
Synchronization to external hardware or other PWM supported
Double buffered PWM registers
— Integral reload rates from 1 to 16
— Half cycle reload capability
Multiple ADC trigger events can be generated per PWM cycle via hardware
Fault inputs can be assigned to control multiple PWM outputs
Programmable filters for fault inputs
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
17
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
•
•
•
•
•
•
•
•
•
•
•
Independently programmable PWM output polarity
Independent top and bottom deadtime insertion
Each complementary pair can operate with its own PWM frequency and deadtime values
Individual software control for each PWM output
All outputs can be forced to a value simultaneously
PWMX pin can optionally output a third signal from each channel
Channels not used for PWM generation can be used for buffered output compare functions
Channels not used for PWM generation can be used for input capture functions
Enhanced dual edge capture functionality
Option to supply the source for each complementary PWM signal pair from any of the following:
— External digital pin
— Internal timer channel
— External ADC input, taking into account values set in ADC high and low limit registers
DMA support
1.3.31
eTimer module
The Leopard provides three eTimer modules on the 257 MAPBGA device, and two eTimer modules on the 144 LQFP package.
Six 16-bit general purpose up/down timer/counters per module are implemented with the following features:
•
•
•
•
•
•
•
•
•
•
•
Maximum clock frequency 120 MHz
Individual channel capability
— Input capture trigger
— Output compare
— Double buffer (to capture rising edge and falling edge)
— Separate prescaler for each counter
— Selectable clock source
— 0–100% pulse measurement
— Rotation direction flag (Quad decoder mode)
Maximum count rate
— Equals peripheral clock divided by 2 for external event counting
— Equals peripheral clock for internal clock counting
Cascadeable counters
Programmable count modulo
Quadrature decode capabilities
Counters can share available input pins
Count once or repeatedly
Preloadable counters
Pins available as GPIO when timer functionality not in use
DMA support
1.3.32
Sine Wave Generator (SWG)
A customized digital-to-analog converter is available to generate a sine wave based on 32 stored values for external devices (ex:
resolver).
•
•
Frequency range from 1 kHz to 50 kHz
Sine wave amplitude from 0.47 V to 2.26 V
MPC5643L Microcontroller Data Sheet, Rev. 3
18
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
1.3.33
Analog-to-Digital Converter module (ADC)
The ADC module features are as follows:
Analog part:
•
Two on-chip ADCs
— 12-bit resolution SAR architecture
— Same digital interface as in the MPC5604P family
— A/D Channels: Nine external, Three internal and Four shared with other A/D. Total 16
— One channel dedicated to each T-sensor to enable temperature reading during application
— Separated reference for each ADC
— Shared analog supply voltage for both ADCs
— One sample and hold unit per ADC
— Adjustable sampling and conversion time
Digital part:
•
•
•
•
•
Four analog watchdogs comparing ADC results against predefined levels (low, high, range) before results are stored
in the appropriate ADC result location
Two modes of operation: Motor Control Mode or Regular Mode
Regular mode features
— Register based interface with the CPU: one result register per channel
— ADC state machine managing three request flows: regular command, hardware injected command, software
injected command
— Selectable priority between software and hardware injected commands
— Four analog watchdogs comparing ADC results against predefined levels (low, high, range)
— DMA compatible interface
Motor control mode features
— Triggered mode only
— Four independent result queues (1 × 16 entries, 2 × 8 entries, 1 × 4 entries)
— Result alignment circuitry (left justified; right justified)
— 32-bit read mode allows to have channel ID on one of the 16-bit parts
— DMA compatible interfaces
Built-in self-test features triggered by software
1.3.34
Cross Triggering Unit (CTU)
The ADC cross triggering unit allows automatic generation of ADC conversion requests on user selected conditions without
CPU load during the PWM period and with minimized CPU load for dynamic configuration.
The CTU implements the following features:
•
•
•
•
•
•
•
•
Cross triggering between ADC, FlexPWM, eTimer, and external pins
Double buffered trigger generation unit with as many as eight independent triggers generated from external triggers
Maximum operating frequency less than or equal to 120 MHz
Trigger generation unit configurable in sequential mode or in triggered mode
Trigger delay unit to compensate the delay of external low pass filter
Double buffered global trigger unit allowing eTimer synchronization and/or ADC command generation
Double buffered ADC command list pointers to minimize ADC-trigger unit update
Double buffered ADC conversion command list with as many as 24 ADC commands
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
19
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
•
•
•
Each trigger capable of generating consecutive commands
ADC conversion command allows control of ADC channel from each ADC, single or synchronous sampling,
independent result queue selection
DMA support with safety features
1.3.35
Cyclic Redundancy Checker (CRC) Unit
The CRC module is a configurable multiple data flow unit to compute CRC signatures on data written to input register.
The CRC unit has the following features:
•
•
•
•
•
•
Three sets of registers to allow three concurrent contexts with possibly different CRC computations, each with a
selectable polynomial and seed
Computes 16- or 32-bit wide CRC on the fly (single-cycle computation) and stores result in internal register.
The following standard CRC polynomials are implemented:
— x16 + x12 + x5 + 1 [16-bit CRC-CCITT]
— x32 + x26 + x23 + x22 + x16 + x12 + x11 + x10 + x8 + x7 + x5 + x4 + x2 + x + 1
[32-bit CRC-ethernet(32)]
Key engine to be coupled with communication periphery where CRC application is added to allow implementation of
safe communication protocol
Offloads core from cycle-consuming CRC and helps checking configuration signature for safe start-up or periodic
procedures
CRC unit connected as peripheral bus on internal peripheral bus
DMA support
1.3.36
Redundancy Control and Checker Unit (RCCU)
The RCCU checks all outputs of the sphere of replication (addresses, data, control signals). It has the following features:
•
•
Duplicated module to guarantee highest possible diagnostic coverage (check of checker)
Multiple times replicated IPs are used as checkers on the SoR outputs
1.3.37
Junction temperature sensor
The junction temperature sensor is used by the ADC to measure the temperature of the silicon.
The key parameters of the junction temperature sensor include:
•
•
Nominal temperature range from –40 to 150 °C
Software temperature alarm via analog ADC comparator possible
1.3.38
Nexus Port Controller (NPC)
The NPC block provides real-time development support capabilities for this device in compliance with the IEEE-ISTO
5001-2008 standard. This development support is supplied for MCUs without requiring external address and data pins for
internal visibility.
The NPC block interfaces to the host processor and internal buses to provide development support as per the IEEE-ISTO
5001-2008 Class 3+, including selected features from Class 4 standard.
The development support provided includes program trace, data trace, watchpoint trace, ownership trace, run-time access to the
MCUs internal memory map and access to the Power Architecture internal registers during halt. The Nexus interface also
supports a JTAG only mode using only the JTAG pins. The following features are implemented:
•
Full and reduced port modes
MPC5643L Microcontroller Data Sheet, Rev. 3
20
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
•
MCKO (message clock out) pin
•
Four or 12 MDO (message data out) pins1
•
Two MSEO (message start/end out) pins
•
EVTO (event out) pin
•
— Auxiliary input port
EVTI (event in) pin
•
Five-pin JTAG port (JCOMP, TDI, TDO, TMS, and TCK)
•
— Supports JTAG mode
Host processor (e200) development support features
— Data trace via data write messaging (DWM) and data read messaging (DRM). This allows the development tool
to trace reads or writes, or both, to selected internal memory resources.
— Ownership trace via ownership trace messaging (OTM). OTM facilitates ownership trace by providing visibility
of which process ID or operating system task is activated. An ownership trace message is transmitted when a new
process/task is activated, allowing development tools to trace ownership flow.
— Program trace via branch trace messaging (BTM). Branch trace messaging displays program flow discontinuities
(direct branches, indirect branches, exceptions, etc.), allowing the development tool to interpolate what transpires
between the discontinuities. Thus, static code may be traced.
— Watchpoint messaging (WPM) via the auxiliary port
— Watchpoint trigger enable of program and/or data trace messaging
— Data tracing of instruction fetches via private opcodes
1.3.39
IEEE 1149.1 JTAG Controller (JTAGC)
The JTAGC block provides the means to test chip functionality and connectivity while remaining transparent to system logic
when not in test mode. All data input to and output from the JTAGC block is communicated in serial format. The JTAGC block
is compliant with the IEEE standard.
The JTAG controller provides the following features:
•
•
•
•
•
IEEE Test Access Port (TAP) interface with five pins:
— TDI
— TMS
— TCK
— TDO
— JCOMP
Selectable modes of operation include JTAGC/debug or normal system operation
5-bit instruction register that supports the following IEEE 1149.1-2001 defined instructions:
— BYPASS
— IDCODE
— EXTEST
— SAMPLE
— SAMPLE/PRELOAD
Three test data registers: a bypass register, a boundary scan register, and a device identification register. The size of
the boundary scan register is parameterized to support a variety of boundary scan chain lengths.
TAP controller state machine that controls the operation of the data registers, instruction register and associated
circuitry
1. Four MDO pins on 144 LQFP package, 12 MDO pins on 257 MAPBGA package.
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
21
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Overview
1.3.40
Voltage regulator / Power Management Unit (PMU)
The on-chip voltage regulator module provides the following features:
•
•
•
•
Single external rail required
Single high supply required: nominal 3.3 V both for packaged and Known Good Die option
— Packaged option requires external ballast transistor due to reduced dissipation capacity at high temperature but
can use embedded transistor if power dissipation is maintained within package dissipation capacity (lower
frequency of operation)
— Known Good Die option uses embedded ballast transistor as dissipation capacity is increased to reduce system
cost
All I/Os are at same voltage as external supply (3.3 V nominal)
Duplicated Low-Voltage Detectors (LVD) to guarantee proper operation at all stages (reset, configuration, normal
operation) and, to maximize safety coverage, one LVD can be tested while the other operates (on-line self-testing
feature)
1.3.41
Built-In Self-Test (BIST) capability
This device includes the following protection against latent faults:
•
•
•
•
Boot-time Memory Built-In Self-Test (MBIST)
Boot-time scan-based Logic Built-In Self-Test (LBIST)
Run-time ADC Built-In Self-Test (BIST)
Run-time Built-In Self Test of LVDs
2
Package pinouts and signal descriptions
2.1
Package pinouts
Figure 2 shows the MPC5643L in the 144 LQFP package. Figure 3 shows the MPC5643L in the 257 MAPBGA package.
MPC5643L Microcontroller Data Sheet, Rev. 3
22
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
NMI
A[6]
D[1]
F[4]
F[5]
VDD_HV_IO
VSS_HV_IO
F[6]
MDO0
A[7]
C[4]
A[8]
C[5]
A[5]
C[7]
VDD_HV_REG_0
VSS_LV_COR
VDD_LV_COR
F[7]
F[8]
VDD_HV_IO
VSS_HV_IO
F[9]
F[10]
F[11]
D[9]
VDD_HV_OSC
VSS_HV_OSC
XTAL
EXTAL
RESET
D[8]
D[5]
D[6]
VSS_LV_PLL0_PLL1
VDD_LV_PLL0_PLL1
Freescale Semiconductor
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
144 LQFP package
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
Preliminary—Subject to Change Without Notice
A[4]
VPP_TEST
F[12]
D[14]
G[3]
C[14]
G[2]
C[13]
G[4]
D[12]
G[6]
VDD_HV_FLA
VSS_HV_FLA
VDD_HV_REG_1
VSS_LV_COR
VDD_LV_COR
A[3]
VDD_HV_IO
VSS_HV_IO
B[4]
TCK
TMS
B[5]
G[5]
A[2]
G[7]
C[12]
G[8]
C[11]
G[9]
D[11]
G[10]
D[10]
G[11]
A[1]
A[0]
Figure 2. MPC5643L 144 LQFP pinout (top view)
MPC5643L Microcontroller Data Sheet, Rev. 3
A[15]
A[14]
C[6]
FCCU_F[1]
D[2]
F[3]
B[6]
VSS_LV_COR
A[13]
VDD_LV_COR
A[9]
F[0]
VSS_LV_COR
VDD_LV_COR
VDD_HV_REG_2
D[4]
D[3]
VSS_HV_IO
VDD_HV_IO
D[0]
C[15]
JCOMP
A[12]
E[15]
A[11]
E[14]
A[10]
E[13]
B[3]
F[14]
B[2]
F[15]
F[13]
C[10]
B[1]
B[0]
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
D[7]
FCCU_F[0]
VDD_LV_COR0_4
VSS_LV_COR0_4
C[1]
E[4]
B[7]
E[5]
C[2]
E[6]
B[8]
E[7]
E[2]
VDD_HV_ADR0
VSS_HV_ADR0
B[9]
B[10]
B[11]
B[12]
VDD_HV_ADR1
VSS_HV_ADR1
VDD_HV_ADV0_ADV1
VSS_HV_ADV0_ADV1
B[13]
E[9]
B[15]
E[10]
B[14]
E[11]
C[0]
E[12]
E[0]
BCTRL
VDD_LV_COR
VSS_LV_COR
VDD_HV_PMU
Package pinouts and signal descriptions
23
1
2
3
A
VSS
VSS
VDD_HV
B
VSS
VSS
B[6]
C
VDD_HV
NC
VSS
D
F[5]
F[4]
A[15]
4
5
6
7
8
9
10
11
12
13
14
15
16
17
H[0]
G[14]
D[3]
C[15]
VDD_HV
A[12]
H[10]
H[14]
A[10]
B[2]
C[10]
VSS
VSS
F[3]
A[9]
D[4]
D[0]
VSS
H[12]
E[15]
E[14]
B[3]
F[13]
B[0]
VDD_HV
VSS
FCCU_
F[1]
D[2]
A[13]
I[0]
JCOMP
H[11]
I[1]
F[14]
B[1]
VSS
A[4]
F[12]
C[6]
VSS
VDD_LV
VSS
A[11]
E[13]
F[15]
VDD_HV
VPP
NC
D[14]
G[3]
H[2]
A[14]
VDD_HV VDD_HV
F[0]
VDD_HV
E
MDO0
F[6]
D[1]
NMI
F
H[1]
G[12]
A[7]
A[8]
VDD_LV VDD_LV VDD_LV VDD_LV VDD_LV VDD_LV VDD_LV
G
H[3]
VDD_HV
C[5]
A[6]
VDD_LV
VSS
VSS
VSS
VSS
VSS
H
G[13]
VSS
C[4]
A[5]
VDD_LV
VSS
VSS
VSS
VSS
J
F[7]
G[15]
VDD_LV
VSS
VSS
VSS
K
F[9]
F[8]
NC
C[7]
VDD_LV
VSS
VSS
L
F[10]
F[11]
D[9]
NC
VDD_LV
VSS
VSS
D[8]
NC
VDD_LV VDD_LV VDD_LV VDD_LV VDD_LV VDD_LV VDD_LV
VSS
D[5]
VSS_LV_
VSS
RESET
D[6]
EXTAL
FCCU
_F[0]
VSS
D[7]
VSS
VDD_HV
NC
C[1]
VSS
VSS
NC
1
2
3
M
N
P
R
T
U
VDD_HV VDD_HV
XTAL
VDD_HV VDD_HV
_TEST
NC
C[14]
G[2]
I[3]
NC
C[13]
I[2]
G[4]
VDD_LV
D[12]
H[13]
H[9]
G[6]
VSS
VDD_LV
VSS
VSS
VSS
VDD_LV
VSS
VSS
VSS
VDD_LV
NC
VSS
VSS
VSS
VDD_LV
VDD_HV VDD_HV
VDD_LV VDD_HV
H[6]
VSS
H[15]
H[8]
H[7]
A[3]
NC
TCK
H[4]
B[4]
C[11]
B[5]
TMS
H[5]
NC
C[12]
A[2]
G[5]
PLL
VDD_LV_
PLL
VDD_LV
VSS
B[8]
NC
VSS
VDD_HV
B[14]
VDD_LV
VSS
VDD_HV
G[10]
G[8]
G[7]
B[7]
E[6]
VREFP_
B[10]
VREFP_
B[13]
B[15]
C[0]
BCTRL
A[1]
VSS
D[11]
G[9]
E[9]
E[10]
E[12]
E[0]
A[0]
D[10]
VDD_HV
VSS
HV_AD0
E[5]
E[7]
VREFN_
HV_AD1
B[11]
HV_AD0
VREFN_
HV_AD1
E[4]
C[2]
E[2]
B[9]
B[12]
VDD_HV
VSS
E[11]
NC
NC
VDD_HV
G[11]
VSS
VSS
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Figure 3. MPC5643L 257 MAPBGA pinout (top view)
Table 3 provides the concatenated pin names (pin muxing) for the pins shown in Figure 2, including the functional group for
the pin. Table 3 provides the concatenated ball names (pin muxing) for the pins shown in Figure 3, including the functional
group for the pin. For more information, see Table 7.
MPC5643L Microcontroller Data Sheet, Rev. 3
24
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
2.2
Pin descriptions
The following sections provide signal descriptions and related information about the functionality and configuration for this
device.
2.2.1
Concatenated pins
Table 3 provides the concatenated ball names (pin muxing) for the pins shown in Figure 2 and the balls shown in Figure 3,
including the functional group for the pin. This table provides a cross-reference for the two packages. Table 3 lists the
concatenated ball names (pin muxing) in alphanumeric order for the balls shown in Figure 3, including the functional group.
Table 3. Concatenated pin names
Pin
Ball
No.
No.
144
257
LQFP MAPBGA
Concatenated Pin Names
1
E4
NMI
2
G4
A[6] / siul_GPIO[6] / dspi1_SCK / siul_EIRQ[6]
3
E3
D[1] / siul_GPIO[49] / etimer1_ETC[2] / ctu0_EXT_TGR / flexray_CA_RX
4
D2
F[4] / siul_GPIO[84] / npc_wrapper_MDO[3]
5
D1
F[5] / siul_GPIO[85] / npc_wrapper_MDO[2]
6
VDD_HV1
7
VSS_HV2 VSS_HV_IO
VDD_HV_IO
8
E2
F[6] / siul_GPIO[86] / npc_wrapper_MDO[1]
9
E1
MDO0
10
F3
A[7] / siul_GPIO[7] / dspi1_SOUT / siul_EIRQ[7]
11
H3
C[4] / siul_GPIO[36] / dspi0_CS0 / flexpwm0_X[1] / sscm_DEBUG[4] / siul_EIRQ[22]
12
F4
A[8] / siul_GPIO[8] / dspi1_SIN / siul_EIRQ[8]
13
G3
C[5] / siul_GPIO[37] / dspi0_SCK / sscm_DEBUG[5] / flexpwm0_FAULT[3] / siul_EIRQ[23]
14
H4
A[5] / siul_GPIO[5] / dspi1_CS0 / etimer1_ETC[5] / dspi0_CS7 / siul_EIRQ[5]
15
K4
C[7] / siul_GPIO[39] / flexpwm0_A[1] / sscm_DEBUG[7] / dspi0_SIN
16
J3
VDD_HV_REG_0
17
3
VSS_LV
VSS_LV_COR
18
VDD_LV4
VDD_LV_COR
19
J1
F[7] / siul_GPIO[87] / npc_wrapper_MCKO
20
K2
F[8] / siul_GPIO[88] / npc_wrapper_MSEO[1]
21
VDD_HV3
VDD_HV_IO
22
4
VSS_HV
VSS_HV_IO
23
K1
F[9] / siul_GPIO[89] / npc_wrapper_MSEO[0]
24
L1
F[10] / siul_GPIO[90] / npc_wrapper_EVTO
25
L2
F[11] / siul_GPIO[91] / leo_sor0_EVTI
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
25
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Table 3. Concatenated pin names (continued)
Pin
Ball
No.
No.
144
257
LQFP MAPBGA
Concatenated Pin Names
26
L3
D[9] / siul_GPIO[57] / flexpwm0_X[0] / lin1_TXD
27
M1
VDD_HV_OSC
28
P1
VSS_HV_OSC
29
N1
XTAL5
30
R1
EXTAL5
31
P2
RESET
32
M3
D[8] / siul_GPIO[56] / dspi1_CS2 / etimer1_ETC[4] / dspi0_CS5 / flexpwm0_FAULT[3]
33
N3
D[5] / siul_GPIO[53] / dspi0_CS3 / flexpwm0_FAULT[2]
34
P3
D[6] / siul_GPIO[54] / dspi0_CS2 / flexpwm0_X[3] / flexpwm0_FAULT[1]
35
N4
VSS_LV_PLL0_PLL1
36
P4
VDD_LV_PLL0_PLL1
37
R4
D[7] / siul_GPIO[55] / dspi1_CS3 / dspi0_CS4
38
R2
FCCU_F[0]
39
VDD_LV1 VDD_LV_COR0_4
40
VSS_LV2 VSS_LV_COR0_4
41
T4
C[1] / siul_GPIO[33]
42
U4
E[4] / siul_GPIO[68]
43
R5
B[7] / siul_GPIO[23] / lin0_RXD
44
T5
E[5] / siul_GPIO[69]
45
U5
C[2] / siul_GPIO[34]
46
R6
E[6] / siul_GPIO[70]
47
P7
B[8] / siul_GPIO[24] / etimer0_ETC[5]
48
T6
E[7] / siul_GPIO[71]
49
U6
E[2] / siul_GPIO[66]
50
R7
VDD_HV_ADR0
51
T7
VSS_HV_ADR0
52
U7
B[9] / siul_GPIO[25]
53
R8
B[10] / siul_GPIO[26]
54
T8
B[11] / siul_GPIO[27]
55
U8
B[12] / siul_GPIO[28]
56
R9
VDD_HV_ADR1
57
T9
VSS_HV_ADR1
58
U9
VDD_HV_ADV
MPC5643L Microcontroller Data Sheet, Rev. 3
26
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Table 3. Concatenated pin names (continued)
Pin
Ball
No.
No.
144
257
LQFP MAPBGA
Concatenated Pin Names
59
U10
VSS_HV_ADV
60
R10
B[13] / siul_GPIO[29] / lin1_RXD
61
T10
E[9] / siul_GPIO[73]
62
R11
B[15] / siul_GPIO[31] / siul_EIRQ[20]
63
T11
E[10] / siul_GPIO[74]
64
P11
B[14] / siul_GPIO[30] / etimer0_ETC[4] / siul_EIRQ[19]
65
U11
E[11] / siul_GPIO[75]
66
R12
C[0] / siul_GPIO[32]
67
T12
E[12] / siul_GPIO[76]
68
T13
E[0] / siul_GPIO[64]
69
R13
70
BCTRL
1
VDD_LV_COR
2
VDD_LV
71
VSS_LV
VSS_LV_COR
72
U14
VDD_HV_PMU
73
T14
A[0] / siul_GPIO[0] / etimer0_ETC[0] / dspi2_SCK / siul_EIRQ[0]
74
R14
A[1] / siul_GPIO[1] / etimer0_ETC[1] / dspi2_SOUT / siul_EIRQ[1]
75
U15
G[11] / siul_GPIO[107] / flexray_DBG3 / flexpwm0_FAULT[3]
76
T15
D[10] / siul_GPIO[58] / flexpwm0_A[0] / etimer0_ETC[0]
77
P15
G[10] / siul_GPIO[106] / flexray_DBG2 / dspi2_CS3 / flexpwm0_FAULT[2]
78
R16
D[11] / siul_GPIO[59] / flexpwm0_B[0] / etimer0_ETC[1]
79
R17
G[9] / siul_GPIO[105] / flexray_DBG1 / dspi1_CS1 / flexpwm0_FAULT[1] / siul_EIRQ[29]
80
M14
C[11] / siul_GPIO[43] / etimer0_ETC[4] / dspi2_CS2
81
P16
G[8] / siul_GPIO[104] / flexray_DBG0 / dspi0_CS1 / flexpwm0_FAULT[0] / siul_EIRQ[21]
82
N15
C[12] / siul_GPIO[44] / etimer0_ETC[5] / dspi2_CS3
83
P17
G[7] / siul_GPIO[103] / flexpwm0_B[3]
84
N16
A[2] / siul_GPIO[2] / etimer0_ETC[2] / flexpwm0_A[3] / dspi2_SIN / mc_rgm_ABS[0] /
siul_EIRQ[2]
85
N17
G[5] / siul_GPIO[101] / flexpwm0_X[3] / dspi2_CS3
86
M15
B[5] / siul_GPIO[21] / jtagc_TDI
87
M16
TMS
88
L15
TCK
89
L17
B[4] / siul_GPIO[20] / jtagc_TDO
90
VSS_HV4 VSS_HV_IO
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
27
Table 3. Concatenated pin names (continued)
Pin
Ball
No.
No.
144
257
LQFP MAPBGA
91
92
Concatenated Pin Names
VDD_HV3 VDD_HV_IO
K17
A[3] / siul_GPIO[3] / etimer0_ETC[3] / dspi2_CS0 / flexpwm0_B[3] / mc_rgm_ABS[2] /
siul_EIRQ[3]
93
VDD_LV1 VDD_LV_COR
94
VSS_LV2 VSS_LV_COR
95
H15
VDD_HV_REG_1
96
J16
VSS_HV_FLA
97
H16
VDD_HV_FLA
98
G17
G[6] / siul_GPIO[102] / flexpwm0_A[3]
99
G14
D[12] / siul_GPIO[60] / flexpwm0_X[1] / lin1_RXD
100
F17
G[4] / siul_GPIO[100] / flexpwm0_B[2] / etimer0_ETC[5]
101
F15
C[13] / siul_GPIO[45] / etimer1_ETC[1] / ctu0_EXT_IN / flexpwm0_EXT_SYNC
102
E16
G[2] / siul_GPIO[98] / flexpwm0_X[2] / dspi1_CS1
103
E15
C[14] / siul_GPIO[46] / etimer1_ETC[2] / ctu0_EXT_TGR
104
D17
G[3] / siul_GPIO[99] / flexpwm0_A[2] / etimer0_ETC[4]
105
D16
D[14] / siul_GPIO[62] / flexpwm0_B[1] / etimer0_ETC[3]
106
C17
F[12] / siul_GPIO[92] / etimer1_ETC[3] / siul_EIRQ[30]
107
D15
VPP_TEST6
108
C16
A[4] / siul_GPIO[4] / etimer1_ETC[0] / dspi2_CS1 / etimer0_ETC[4] / mc_rgm_FAB / siul_EIRQ[4]
109
B15
B[0] / siul_GPIO[16] / can0_TXD / etimer1_ETC[2] / sscm_DEBUG[0] / siul_EIRQ[15]
110
C14
B[1] / siul_GPIO[17] / etimer1_ETC[3] / sscm_DEBUG[1] / can0_RXD / can1_RXD /
siul_EIRQ[16]
111
A15
C[10] / siul_GPIO[42] / dspi2_CS2 / flexpwm0_A[3] / flexpwm0_FAULT[1]
112
B14
F[13] / siul_GPIO[93] / etimer1_ETC[4] / siul_EIRQ[31]
113
D13
F[15] / siul_GPIO[95] / lin1_RXD
114
A14
B[2] / siul_GPIO[18] / lin0_TXD / sscm_DEBUG[2] / siul_EIRQ[17]
115
C13
F[14] / siul_GPIO[94] / lin1_TXD
116
B13
B[3] / siul_GPIO[19] / sscm_DEBUG[3] / lin0_RXD
117
D12
E[13] / siul_GPIO[77] / etimer0_ETC[5] / dspi2_CS3 / siul_EIRQ[25]
118
A13
A[10] / siul_GPIO[10] / dspi2_CS0 / flexpwm0_B[0] / flexpwm0_X[2] / siul_EIRQ[9]
119
B12
E[14] / siul_GPIO[78] / etimer1_ETC[5] / siul_EIRQ[26]
120
D11
A[11] / siul_GPIO[11] / dspi2_SCK / flexpwm0_A[0] / flexpwm0_A[2] / siul_EIRQ[10]
121
B11
E[15] / siul_GPIO[79] / dspi0_CS1 / siul_EIRQ[27]
MPC5643L Microcontroller Data Sheet, Rev. 3
28
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Table 3. Concatenated pin names (continued)
Pin
Ball
No.
No.
144
257
LQFP MAPBGA
Concatenated Pin Names
122
A10
A[12] / siul_GPIO[12] / dspi2_SOUT / flexpwm0_A[2] / flexpwm0_B[2] / siul_EIRQ[11]
123
C10
JCOMP
124
A8
C[15] / siul_GPIO[47] / flexray_CA_TR_EN / etimer1_ETC[0] / flexpwm0_A[1] / ctu0_EXT_IN /
flexpwm0_EXT_SYNC
125
B8
D[0] / siul_GPIO[48] / flexray_CA_TX / etimer1_ETC[1] / flexpwm0_B[1]
126
VDD_HV3
VDD_HV_IO
127
4
VSS_HV
VSS_HV_IO
128
A7
D[3] / siul_GPIO[51] / flexray_CB_TX / etimer1_ETC[4] / flexpwm0_A[3]
129
B7
D[4] / siul_GPIO[52] / flexray_CB_TR_EN / etimer1_ETC[5] / flexpwm0_B[3]
130
C7
VDD_HV_REG_2
131
VDD_LV1
132
VSS_LV2 VSS_LV_COR
133
D7
134
B6
135
VDD_LV
136
C6
137
VDD_LV_COR
F[0] / siul_GPIO[80] / flexpwm0_A[1] / etimer0_ETC[2] / siul_EIRQ[28]
A[9] / siul_GPIO[9] / dspi2_CS1 / flexpwm0_B[3] / flexpwm0_FAULT[0]
1
VDD_LV_COR
A[13] / siul_GPIO[13] / flexpwm0_B[2] / dspi2_SIN / flexpwm0_FAULT[0] / siul_EIRQ[12]
VSS_LV2 VSS_LV_COR
138
B3
B[6] / siul_GPIO[22] / mc_cgl_clk_out / dspi2_CS2 / siul_EIRQ[18]
139
B5
F[3] / siul_GPIO[83] / dspi0_CS6
140
C5
D[2] / siul_GPIO[50] / etimer1_ETC[3] / flexpwm0_X[3] / flexray_CB_RX
141
C4
FCCU_F[1]
142
D4
C[6] / siul_GPIO[38] / dspi0_SOUT / flexpwm0_B[1] / sscm_DEBUG[6] / siul_EIRQ[24]
143
B4
A[14] / siul_GPIO[14] / can1_TXD / etimer1_ETC[4] / siul_EIRQ[13]
144
D3
A[15] / siul_GPIO[15] / etimer1_ETC[5] / can1_RXD / can0_RXD / siul_EIRQ[14]
NOTES:
1 VDD_HV balls are tied together on the 257 MAPBGA substrate.
2 VSS_HV balls are tied together on the 257 MAPBGA substrate.
3
VSS_LV balls are tied together on the 257 MAPBGA substrate.
4 VDD_LV balls are tied together on the 257 MAPBGA substrate.
5 The XTAL and EXTAL pins have different functions from the pins with these names on the MPC5604P.
6
VPP_TEST should always be tied to ground (VSS) for normal operations.
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
29
Table 4. 257 MAPBGA concatenated ball names
Ball No.
Concatenated Pin Names
A1
VSS_HV_IO_RING
A2
VSS_HV_IO_RING
A3
VDD_HV_IO_RING
A4
H[2] / siul_GPIO[114] / npc_wrapper_MDO[5]
A5
H[0] / siul_GPIO[112] / npc_wrapper_MDO[7]
A6
G[14] / siul_GPIO[110] / npc_wrapper_MDO[9]
A7
D[3] / siul_GPIO[51] / flexray_CB_TX / etimer1_ETC[4] / flexpwm0_A[3]
A8
C[15] / siul_GPIO[47] / flexray_CA_TR_EN / etimer1_ETC[0] / flexpwm0_A[1] / ctu0_EXT_IN /
flexpwm0_EXT_SYNC
A9
VDD_HV_IO_RING
A10
A[12] / siul_GPIO[12] / dspi2_MOSI / flexpwm0_A[2] / flexpwm0_B[2] / siul_EIRQ[11]
A11
H[10] / siul_GPIO[122] / flexpwm1_X[2] / etimer2_ETC[2]
A12
H[14] / siul_GPIO[126] / flexpwm1_A[3] / etimer2_ETC[4]
A13
A[10] / siul_GPIO[10] / dspi2_CS0 / flexpwm0_B[0] / flexpwm0_X[2] / siul_EIRQ[9]
A14
B[2] / siul_GPIO[18] / lin0_TXD / sscm_DEBUG[2] / siul_EIRQ[17]
A15
C[10] / siul_GPIO[42] / dspi2_CS2 / flexpwm0_A[3] / flexpwm0_FAULT[1]
A16
VSS_HV_IO_RING
A17
VSS_HV_IO_RING
B1
VSS_HV_IO_RING
B2
VSS_HV_IO_RING
B3
B[6] / siul_GPIO[22] / mc_cgl_clk_out / dspi2_CS2 / siul_EIRQ[18]
B4
A[14] / siul_GPIO[14] / can1_TXD / etimer1_ETC[4] / siul_EIRQ[13]
B5
F[3] / siul_GPIO[83] / dspi0_CS6
B6
A[9] / siul_GPIO[9] / dspi2_CS1 / flexpwm0_B[3] / flexpwm0_FAULT[0]
B7
D[4] / siul_GPIO[52] / flexray_CB_TR_EN / etimer1_ETC[5] / flexpwm0_B[3]
B8
D[0] / siul_GPIO[48] / flexray_CA_TX / etimer1_ETC[1] / flexpwm0_B[1]
B9
VSS_HV_IO_RING
B10
H[12] / siul_GPIO[124] / flexpwm1_B[2]
B11
E[15] / siul_GPIO[79] / dspi0_CS1 / siul_EIRQ[27]
B12
E[14] / siul_GPIO[78] / etimer1_ETC[5] / siul_EIRQ[26]
B13
B[3] / siul_GPIO[19] / sscm_DEBUG[3] / lin0_RXD
B14
F[13] / siul_GPIO[93] / etimer1_ETC[4] / siul_EIRQ[31]
B15
B[0] / siul_GPIO[16] / can0_TXD / etimer1_ETC[2] / sscm_DEBUG[0] / siul_EIRQ[15]
B16
VDD_HV_IO_RING
B17
VSS_HV_IO_RING
MPC5643L Microcontroller Data Sheet, Rev. 3
30
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Table 4. 257 MAPBGA concatenated ball names (continued)
Ball No.
Concatenated Pin Names
C1
VDD_HV_IO_RING
C2
NC1
C3
VSS_HV_IO_RING
C4
FCCU_F[1]
C5
D[2] / siul_GPIO[50] / etimer1_ETC[3] / flexpwm0_X[3] / flexray_CB_RX
C6
A[13] / siul_GPIO[13] / flexpwm0_B[2] / dspi2_MISO / flexpwm0_FAULT[0] / siul_EIRQ[12]
C7
VDD_HV_REG_2
C8
VDD_HV_REG_2
C9
I[0] / siul_GPIO[128] / etimer2_ETC[0] / dspi0_CS4 / flexpwm1_FAULT[0]
C10
JCOMP
C11
H[11] / siul_GPIO[123] / flexpwm1_A[2]
C12
I[1] / siul_GPIO[129] / etimer2_ETC[1] / dspi0_CS5 / flexpwm1_FAULT[1]
C13
F[14] / siul_GPIO[94] / lin1_TXD
C14
B[1] / siul_GPIO[17] / etimer1_ETC[3] / sscm_DEBUG[1] / can0_RXD / can1_RXD / siul_EIRQ[16]
C15
VSS_HV_IO_RING
C16
A[4] / siul_GPIO[4] / etimer1_ETC[0] / dspi2_CS1 / etimer0_ETC[4] / mc_rgm_FAB / siul_EIRQ[4]
C17
F[12] / siul_GPIO[92] / etimer1_ETC[3] / siul_EIRQ[30]
D1
F[5] / siul_GPIO[85] / npc_wrapper_MDO[2]
D2
F[4] / siul_GPIO[84] / npc_wrapper_MDO[3]
D3
A[15] / siul_GPIO[15] / etimer1_ETC[5] / can1_RXD / can0_RXD / siul_EIRQ[14]
D4
C[6] / siul_GPIO[38] / dspi0_MOSI / flexpwm0_B[1] / sscm_DEBUG[6] / siul_EIRQ[24]
D5
VSS_LV_CORE_RING
D6
VDD_LV_CORE_RING
D7
F[0] / siul_GPIO[80] / flexpwm0_A[1] / etimer0_ETC[2] / siul_EIRQ[28]
D8
VDD_HV_IO_RING
D9
VSS_HV_IO_RING
D10
NC1
D11
A[11] / siul_GPIO[11] / dspi2_SCK / flexpwm0_A[0] / flexpwm0_A[2] / siul_EIRQ[10]
D12
E[13] / siul_GPIO[77] / etimer0_ETC[5] / dspi2_CS3 / siul_EIRQ[25]
D13
F[15] / siul_GPIO[95] / lin1_RXD
D14
VDD_HV_IO_RING
D15
VPP_TEST2
D16
D[14] / siul_GPIO[62] / flexpwm0_B[1] / etimer0_ETC[3]
D17
G[3] / siul_GPIO[99] / flexpwm0_A[2] / etimer0_ETC[4]
E1
MDO0
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
31
Table 4. 257 MAPBGA concatenated ball names (continued)
Ball No.
Concatenated Pin Names
E2
F[6] / siul_GPIO[86] / npc_wrapper_MDO[1]
E3
D[1] / siul_GPIO[49] / etimer1_ETC[2] / ctu0_EXT_TGR / flexray_CA_RX
E4
NMI
E5
NP3
E6
NP3
E7
NP3
E8
NP3
E9
NP3
E10
NP3
E11
NP3
E12
NP3
E13
NP3
E14
NC1
E15
C[14] / siul_GPIO[46] / etimer1_ETC[2] / ctu0_EXT_TGR
E16
G[2] / siul_GPIO[98] / flexpwm0_X[2] / dspi1_CS1
E17
I[3] / siul_GPIO[131] / etimer2_ETC[3] / dspi0_CS7 / ctu0_EXT_TGR / flexpwm1_FAULT[3]
F1
H[1] / siul_GPIO[113] / npc_wrapper_MDO[6]
F2
G[12] / siul_GPIO[108] / npc_wrapper_MDO[11]
F3
A[7] / siul_GPIO[7] / dspi1_MOSI / siul_EIRQ[7]
F4
A[8] / siul_GPIO[8] / dspi1_MISO / siul_EIRQ[8]
F5
NP3
F6
VDD_LV_CORE_RING
F7
VDD_LV_CORE_RING
F8
VDD_LV_CORE_RING
F9
VDD_LV_CORE_RING
F10
VDD_LV_CORE_RING
F11
VDD_LV_CORE_RING
F12
VDD_LV_CORE_RING
F13
NP3
F14
NC1
F15
C[13] / siul_GPIO[45] / etimer1_ETC[1] / ctu0_EXT_IN / flexpwm0_EXT_SYNC
F16
I[2] / siul_GPIO[130] / etimer2_ETC[2] / dspi0_CS6 / flexpwm1_FAULT[2]
F17
G[4] / siul_GPIO[100] / flexpwm0_B[2] / etimer0_ETC[5]
G1
H[3] / siul_GPIO[115] / npc_wrapper_MDO[4]
G2
VDD_HV_IO_RING
MPC5643L Microcontroller Data Sheet, Rev. 3
32
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Table 4. 257 MAPBGA concatenated ball names (continued)
Ball No.
Concatenated Pin Names
G3
C[5] / siul_GPIO[37] / dspi0_SCK / sscm_DEBUG[5] / flexpwm0_FAULT[3] / siul_EIRQ[23]
G4
A[6] / siul_GPIO[6] / dspi1_SCK / siul_EIRQ[6]
G5
NP3
G6
VDD_LV_CORE_RING
G7
VSS_LV_CORE_RING
G8
VSS_LV_CORE_RING
G9
VSS_LV_CORE_RING
G10
VSS_LV_CORE_RING
G11
VSS_LV_CORE_RING
G12
VDD_LV_CORE_RING
G13
NP3
G14
D[12] / siul_GPIO[60] / flexpwm0_X[1] / lin1_RXD
G15
H[13] / siul_GPIO[125] / flexpwm1_X[3] / etimer2_ETC[3]
G16
H[9] / siul_GPIO[121] / flexpwm1_B[1] / dspi0_CS7
G17
G[6] / siul_GPIO[102] / flexpwm0_A[3]
H1
G[13] / siul_GPIO[109] / npc_wrapper_MDO[10]
H2
VSS_HV_IO_RING
H3
C[4] / siul_GPIO[36] / dspi0_CS0 / flexpwm0_X[1] / sscm_DEBUG[4] / siul_EIRQ[22]
H4
A[5] / siul_GPIO[5] / dspi1_CS0 / etimer1_ETC[5] / dspi0_CS7 / siul_EIRQ[5]
H5
NP3
H6
VDD_LV
H7
VSS_LV
H8
VSS_LV
H9
VSS_LV
H10
VSS_LV
H11
VSS_LV
H12
VDD_LV
H13
NP3
H14
VSS_LV
H15
VDD_HV_REG_1
H16
VDD_HV_FLA0
H17
H[6] / siul_GPIO[118] / flexpwm1_B[0] / dspi0_CS5
J1
F[7] / siul_GPIO[87] / npc_wrapper_MCKO
J2
G[15] / siul_GPIO[111] / npc_wrapper_MDO[8]
J3
VDD_HV_REG_0
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
33
Table 4. 257 MAPBGA concatenated ball names (continued)
Ball No.
Concatenated Pin Names
J4
VDD_HV_REG_0
J5
NP3
J6
VDD_LV
J7
VSS_LV
J8
VSS_LV
J9
VSS_LV
J10
VSS_LV
J11
VSS_LV
J12
VDD_LV
J13
NP3
J14
VDD_LV
J15
VDD_HV_REG_1
J16
VSS_HV_FLA0
J17
H[15] / siul_GPIO[127] / flexpwm1_B[3] / etimer2_ETC[5]
K1
F[9] / siul_GPIO[89] / npc_wrapper_MSEO_B[0]
K2
F[8] / siul_GPIO[88] / npc_wrapper_MSEO_B[1]
K3
NC1
K4
C[7] / siul_GPIO[39] / flexpwm0_A[1] / sscm_DEBUG[7] / dspi0_MISO
K5
NP3
K6
VDD_LV
K7
VSS_LV
K8
VSS_LV
K9
VSS_LV
K10
VSS_LV
K11
VSS_LV
K12
VDD_LV
K13
NP3
K14
NC1
K15
H[8] / siul_GPIO[120] / flexpwm1_A[1] / dspi0_CS6
K16
H[7] / siul_GPIO[119] / flexpwm1_X[1] / etimer2_ETC[1]
K17
A[3] / siul_GPIO[3] / etimer0_ETC[3] / dspi2_CS0 / flexpwm0_B[3] / mc_rgm_ABS[2] / siul_EIRQ[3]
L1
F[10] / siul_GPIO[90] / npc_wrapper_EVTO_B
L2
F[11] / siul_GPIO[91] / leo_sor_proxy_EVTI_B
L3
D[9] / siul_GPIO[57] / flexpwm0_X[0] / lin1_TXD
L4
NC1
MPC5643L Microcontroller Data Sheet, Rev. 3
34
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Table 4. 257 MAPBGA concatenated ball names (continued)
Ball No.
Concatenated Pin Names
L5
NP3
L6
VDD_LV
L7
VSS_LV
L8
VSS_LV
L9
VSS_LV
L10
VSS_LV
L11
VSS_LV
L12
VDD_LV
L13
NP3
L14
NC1
L15
TCK
L16
H[4] / siul_GPIO[116] / flexpwm1_X[0] / etimer2_ETC[0]
L17
B[4] / siul_GPIO[20] / jtagc_TDO
M1
VDD_HV_OSC0
M2
VDD_HV_IO_RING
M3
D[8] / siul_GPIO[56] / dspi1_CS2 / etimer1_ETC[4] / dspi0_CS5 / flexpwm0_FAULT[3]
M4
NC1
M5
NP3
M6
VDD_LV
M7
VDD_LV
M8
VDD_LV
M9
VDD_LV
M10
VDD_LV
M11
VDD_LV
M12
VDD_LV
M13
NP3
M14
C[11] / siul_GPIO[43] / etimer0_ETC[4] / dspi2_CS2
M15
B[5] / siul_GPIO[21] / jtagc_TDI
M16
TMS
M17
H[5] / siul_GPIO[117] / flexpwm1_A[0] / dspi0_CS4
N1
XTAL
N2
VSS_HV_IO_RING
N3
D[5] / siul_GPIO[53] / dspi0_CS3 / flexpwm0_FAULT[2]
N4
VSS_LV_PLL0_PLL1
N5
NP3
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
35
Table 4. 257 MAPBGA concatenated ball names (continued)
Ball No.
Concatenated Pin Names
N6
NP3
N7
NP3
N8
NP3
N9
NP3
N10
NP3
N11
NP3
N12
NP3
N13
NP3
N14
NC1
N15
C[12] / siul_GPIO[44] / etimer0_ETC[5] / dspi2_CS3
N16
A[2] / siul_GPIO[2] / etimer0_ETC[2] / flexpwm0_A[3] / dspi2_MISO / mc_rgm_ABS[0] / siul_EIRQ[2]
N17
G[5] / siul_GPIO[101] / flexpwm0_X[3] / dspi2_CS3
P1
VSS_HV_OSC0
P2
RESET
P3
D[6] / siul_GPIO[54] / dspi0_CS2 / flexpwm0_X[3] / flexpwm0_FAULT[1]
P4
VDD_LV_PLL0_PLL1
P5
VDD_LV_CORE_RING
P6
VSS_LV_CORE_RING
P7
B[8] / siul_GPIO[24] / etimer0_ETC[5]
P8
NC1
P9
VSS_HV_IO_RING
P10
VDD_HV_IO_RING
P11
B[14] / siul_GPIO[30] / etimer0_ETC[4] / siul_EIRQ[19]
P12
VDD_LV_CORE_RING
P13
VSS_LV_CORE_RING
P14
VDD_HV_IO_RING
P15
G[10] / siul_GPIO[106] / flexray_DBG2 / dspi2_CS3 / flexpwm0_FAULT[2]
P16
G[8] / siul_GPIO[104] / flexray_DBG0 / dspi0_CS1 / flexpwm0_FAULT[0] / siul_EIRQ[21]
P17
G[7] / siul_GPIO[103] / flexpwm0_B[3]
R1
EXTAL
R2
FCCU_F[0]
R3
VSS_HV_IO_RING
R4
D[7] / siul_GPIO[55] / dspi1_CS3 / dspi0_CS4
R5
B[7] / siul_GPIO[23] / lin0_RXD
R6
E[6] / siul_GPIO[70]
MPC5643L Microcontroller Data Sheet, Rev. 3
36
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Table 4. 257 MAPBGA concatenated ball names (continued)
Ball No.
Concatenated Pin Names
R7
VDD_HV_ADR0
R8
B[10] / siul_GPIO[26]
R9
VDD_HV_ADR1
R10
B[13] / siul_GPIO[29] / lin1_RXD
R11
B[15] / siul_GPIO[31] / siul_EIRQ[20]
R12
C[0] / siul_GPIO[32]
R13
BCTRL
R14
A[1] / siul_GPIO[1] / etimer0_ETC[1] / dspi2_MOSI / siul_EIRQ[1]
R15
VSS_HV_IO_RING
R16
D[11] / siul_GPIO[59] / flexpwm0_B[0] / etimer0_ETC[1]
R17
G[9] / siul_GPIO[105] / flexray_DBG1 / dspi1_CS1 / flexpwm0_FAULT[1] / siul_EIRQ[29]
T1
VSS_HV_IO_RING
T2
VDD_HV_IO_RING
T3
NC1
T4
C[1] / siul_GPIO[33]
T5
E[5] / siul_GPIO[69]
T6
E[7] / siul_GPIO[71]
T7
VSS_HV_ADR0
T8
B[11] / siul_GPIO[27]
T9
VSS_HV_ADR1
T10
E[9] / siul_GPIO[73]
T11
E[10] / siul_GPIO[74]
T12
E[12] / siul_GPIO[76]
T13
E[0] / siul_GPIO[64]
T14
A[0] / siul_GPIO[0] / etimer0_ETC[0] / dspi2_SCK / siul_EIRQ[0]
T15
D[10] / siul_GPIO[58] / flexpwm0_A[0] / etimer0_ETC[0]
T16
VDD_HV_IO_RING
T17
VSS_HV_IO_RING
U1
VSS_HV_IO_RING
U2
VSS_HV_IO_RING
U3
NC1
U4
E[4] / siul_GPIO[68]
U5
C[2] / siul_GPIO[34]
U6
E[2] / siul_GPIO[66]
U7
B[9] / siul_GPIO[25]
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
37
Table 4. 257 MAPBGA concatenated ball names (continued)
Ball No.
Concatenated Pin Names
U8
B[12] / siul_GPIO[28]
U9
VDD_HV_ADV
U10
VSS_HV_ADV
U11
E[11] / siul_GPIO[75]
U12
NC1
U13
NC1
U14
VDD_HV_PMU
U15
G[11] / siul_GPIO[107] / flexray_DBG3 / flexpwm0_FAULT[3]
U16
VSS_HV_IO_RING
U17
VSS_HV_IO_RING
NOTES:
1 Not connected.
2 V
PP_TEST should always be tied to ground (VSS) for normal operations.
3 Ball not populated on substrate.
2.2.2
Power supply and reference voltage pins
Table 5 lists the power supply and reference voltage for this device.
Table 5. Supply pins
Supply
Symbol
Description
Package
257
144
MAPBGA
LQFP
VREG control and power supply pins
BCTRL
Voltage regulator external NPN Ballast base control pin
69
R13
VDD_LV_COR
Voltage regulator supply voltage
70
VDD_LV1
VSS_LV_COR
Core regulator ground
71
VSS_LV2
VDD_HV_PMU
Core regulator supply
72
U14
ADC0/ADC1 reference voltage and ADC supply
VDD_HV_ADR0
ADC0 high reference voltage
50
R7
VSS_HV_ADR0
ADC0 low reference voltage
51
T7
VDD_HV_ADR1
ADC1 high reference voltage
56
R9
VSS_HV_ADR1
ADC1 low reference voltage
57
T9
VDD_HV_ADV
ADC voltage supply for ADC0 and ADC1
58
U9
VSS_HV_ADV
ADC ground for ADC0 and ADC1
59
U10
6
VDD_HV3
Power Supply pins (3.3 V)
VDD_HV_IO
3.3 V Input/Output supply voltage
MPC5643L Microcontroller Data Sheet, Rev. 3
38
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Table 5. Supply pins (continued)
Supply
Symbol
VSS_HV_IO
Description
3.3 V Input/Output ground
VDD_HV_REG_0 VDD_HV_REG_0
Package
257
144
MAPBGA
LQFP
7
VSS_HV4
16
J3
VDD_HV_IO
3.3 V Input/Output supply voltage
21
VDD_HV3
VSS_HV_IO
3.3 V Input/Output ground
22
VSS_HV4
VDD_HV_OSC
Crystal oscillator amplifier supply voltage
27
M1
VSS_HV_OSC
Crystal oscillator amplifier ground
28
P1
VDD_HV_PMU
VDD_HV_PMU
72
U14
VSS_HV_IO
3.3 V Input/Output ground
90
VSS_HV4
VDD_HV_IO
3.3 V Input/Output supply voltage
91
VDD_HV3
95
H15
VDD_HV_REG_1 VDD_HV_REG_1
VSS_HV_FLA
VSS_HV_FLA
96
J16
VDD_HV_FLA
VDD_HV_FLA
97
H16
VPP_TEST5
VPP_TEST
107
D15
VDD_HV_IO
VDD_HV_IO
126
VDD_HV3
VSS_HV_IO
VSS_HV_IO
127
VSS_HV4
130
C7
VDD_HV_REG_2 VDD_HV_REG_2
Power Supply pins (1.2 V)
VSS_LV_COR
VSS_LV_COR
Decoupling pins for core logic. Decoupling capacitor must be connected between
these pins and the nearest VDD_LV_COR pin.
17
VSS_HV2
VDD_LV_COR
VDD_LV_COR
Decoupling pins for core logic. Decoupling capacitor must be connected between
these pins and the nearest VSS_LV_COR pin.
18
VDD_LV1
VSS 1V2
VSS_LV_PLL0_PLL1 /
1.2 V Decoupling pins for on-chip PLL modules. Decoupling capacitor must be
connected between this pin and VDD_LV_PLL.
35
N4
VDD 1V2
VDD_LV_PLL0_PLL1
Decoupling pins for on-chip PLL modules. Decoupling capacitor must be
connected between this pin and VSS_LV_PLL.
36
P4
VDD_LV_COR
VDD_LV_COR
Decoupling pins for core logic. Decoupling capacitor must be connected between
these pins and the nearest VSS_LV_COR pin.
39
VDD_LV1
VSS_LV_COR
VSS_LV_COR
Decoupling pins for core logic. Decoupling capacitor must be connected between
these pins and the nearest VDD_LV_COR pin.
40
VSS_LV2
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
39
Table 5. Supply pins (continued)
Supply
Symbol
Package
257
144
MAPBGA
LQFP
Description
VDD_LV_COR
VDD_LV_COR
Decoupling pins for core logic and Regulator feedback. Decoupling capacitor
must be connected between this pins and VSS_LV_REGCOR.
70
VDD_LV1
VSS_LV_COR
VSS_LV_REGCOR0
Decoupling pins for core logic and Regulator feedback. Decoupling capacitor
must be connected between this pins and VDD_LV_REGCOR.
71
VSS_LV2
VDD_LV_COR
VDD_LV_COR
Decoupling pins for core logic. Decoupling capacitor must be connected between
these pins and the nearest VSS_LV_COR pin.
93
VDD_LV1
VSS_LV_COR
VSS_LV_COR
/ 1.2 V Decoupling pins for core logic. Decoupling capacitor must be connected
between these pins and the nearest VDD_LV_COR pin.
94
VSS_LV2
VDD 1V2
VDD_LV_COR
Decoupling pins for core logic. Decoupling capacitor must be connected between
these pins and the nearest VDD_LV_COR pin.
131
VDD_LV1
VSS 1V2
VSS_LV_COR
Decoupling pins for core logic. Decoupling capacitor must be connected between
these pins and the nearest VDD_LV_COR pin.
132
VSS_LV2
VDD 1V2
VDD_LV_COR /
Decoupling pins for core logic. Decoupling capacitor must be connected between
these pins and the nearest VDD_LV_COR pin.
135
VDD_LV1
VSS 1V2
VSS_LV_COR /
Decoupling pins for core logic. Decoupling capacitor must be connected between
these pins and the nearest VDD_LV_COR pin.
137
VSS_LV2
NOTES:
1 VDD_LV balls are tied together on the 257 MAPBGA substrate.
2 VSS_LV balls are tied together on the 257 MAPBGA substrate.
3 VDD_HV balls are tied together on the 257 MAPBGA substrate.
4 VSS_HV balls are tied together on the 257 MAPBGA substrate.
5
VPP_TEST must always be tied to ground (VSS) for normal operations.
MPC5643L Microcontroller Data Sheet, Rev. 3
40
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
2.2.3
System pins
Table 6 and Table 7 contain information on pin functions for this device. The pins listed in Table 6 are single-function pins. The
pins shown in Table 7 are multi-function pins, programmable via their respective Pad Configuration Register (PCR) values.
Table 6. System pins
Package
Symbol
Description
Direction
144pin
257ball
Output only
9
E1
Non Maskable Interrupt
Input only
1
E4
Input for oscillator amplifier circuit and internal clock generator
Input only
29
N1
Output only
30
R1
Dedicated pins
MDO0
Nexus Message Data Output — line 0
NMI
XTALIN
XTALOUT
Oscillator amplifier output
TMS
JTAG state machine control
Input only
87
M16
TCK
JTAG clock
Input only
88
L15
JTAG compliance select
Input only
123
C10
31
P2
JCOMP
Reset pin
RESET
2.2.4
Bidirectional reset with Schmitt-Trigger characteristics and noise filter. This
Bidirectional
pin has medium drive strength.
Pin muxing
Table 7 defines the pin list and muxing for this device.
Each row of Table 7 shows all the possible configurations for each pin, via the alternate functions. The alternate functions are
shown in the Alternate Function column and are labeled ALT0, ALT1, ALT2, and ALT3. The default function assigned to each
pin after reset is indicated by ALT0.
Some pins have more than four alternate functions. These additional alternate functions are shown in the Other Functions
column. This column also contains information related to the External Interrupt capability and the boot configuration. Pins
marked as external interrupt capable can also be used to resume from STOP and HALT mode.
NOTE
Pins labeled “NC” are to be left unconnected. Any connection to an external circuit or
voltage may cause unpredictable device behavior or damage.
Pins labeled “Reserved” are to be tied to ground. Not doing so may cause unpredictable
device behavior.
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
41
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Functions
Port
Pin
PCR
Register
IBE =
Alternate
Function2,3
Peripheral5
04
Function
IBE = 1 (always inputs)
I/O
Direction
Peripheral
Functions
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
Port A (16-bit)
PCR[0]
PCR[1]
A[1]
MPC5643L Data Sheet, Rev. 3
Preliminary—Subject to Change Without Notice
A[0]
PCR[2]
A[2]
PCR[3]
A[3]
PCR[4]
A[4]
PCR[5]
A[5]
Freescale Semiconductor
PCR[6]
A[6]
PCR[7]
A[7]
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer0
DSPI2
—
GPIO[0]
ETC[0]
SCK
—
I/O
I/O
O
—
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer0
DSPI2
—
GPIO[1]
ETC[1]
MOSI
—
I/O
I/O
O
—
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer0
—
FlexPWM0
GPIO[2]
ETC[2]
—
A[3]
I/O
I/O
—
I/O
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer0
DSPI2
FlexPWM0
GPIO[3]
ETC[3]
CS0
B[3]
I/O
I/O
I/O
I/O
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer1
DSPI2
eTimer0
GPIO[4]
ETC[0]
CS1
ETC[4]
I/O
I/O
O
I/O
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI1
eTimer1
DSPI0
GPIO[5]
CS0
ETC[5]
CS7
I/O
I/O
I/O
O
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI1
—
—
GPIO[6]
SCK
—
—
I/O
I/O
—
—
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI1
—
—
GPIO[7]
SOUT
—
—
I/O
O
—
—
SIU Lite
T14
Ext. IRQ #0 (input)
S
M
73
R14
Ext. IRQ #1 (input)
Ext. IRQ #2 (input)
DSPI2 SIN (input)
Boot pin ABS[0] (input)
Weak pull down during reset
Ext. IRQ #3 (input)
Boot pin ABS[2] (input)
Weak pull down during reset
Ext. IRQ #4 (input)
Boot pin FAB (input)
Weak pull down during reset
S
M
74
N16
S
M
84
K17
S
M
92
C16
S
M
108
H4
Ext. IRQ #5 (input)
S
M
14
G4
Ext. IRQ #6 (input)
S
M
2
F3
Ext. IRQ #7 (input)
S
M
10
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
42
Table 7. Pin muxing
Freescale Semiconductor
Table 7. Pin muxing (continued)
Functions
Port
Pin
PCR
Register
PCR[8]
A[8]
PCR[9]
A[9]
MPC5643L Data Sheet, Rev. 3
A[10]
PCR[11]
A[11]
PCR[12]
A[12]
PCR[13]
A[13]
PCR[14]
A[14]
PCR[15]
A[15]
Alternate
Function2,3
Peripheral5
Function
IBE = 1 (always inputs)
I/O
Direction
Peripheral
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[8]
—
—
—
I/O
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI2
—
FlexPWM0
GPIO[9]
CS1
—
B[3]
I/O
O
—
I/O
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI2
FlexPWM0
FlexPWM0
GPIO[10]
CS0
B[0]
X[2]
I/O
I/O
I/O
I/O
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI2
FlexPWM0
FlexPWM0
GPIO[11]
SCK
A[0]
A[2]
I/O
I/O
I/O
I/O
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI2
FlexPWM0
FlexPWM0
GPIO[12]
SOUT
A[2]
B[2]
I/O
O
I/O
I/O
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
FlexPWM0
—
GPIO[13]
—
B[2]
—
I/O
—
I/O
—
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
CAN1
eTimer1
—
GPIO[14]
TXD
ETC[4]
—
I/O
O
I/O
—
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
eTimer1
—
GPIO[15]
—
ETC[5]
—
I/O
—
I/O
—
SIU Lite
Functions
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
SIU Lite
F4
Ext. IRQ #8 (input)
DSPI1 SIN (input)
S
M
12
B6
FlexPWM0 FAULT[0] (input)
S
M
134
A13
Ext. IRQ #9 (input)
S
M
118
D11
Ext. IRQ #10 (input)
S
M
120
A10
Ext. IRQ #11 (input)
Ext. IRQ #12 (input)
DSPI2 SIN (input)
FlexPWM0 FAULT[0] (input)
S
M
122
C6
S
M
136
B4
Ext. IRQ #13 (input)
Ext. IRQ #14 (input)
CAN1 RXD (input)
CAN0 RXD (input)
S
M
143
D3
S
M
144
43
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Preliminary—Subject to Change Without Notice
PCR[10]
IBE =
04
Functions
Port
Pin
PCR
Register
IBE =
Alternate
Function2,3
Peripheral5
04
Function
IBE = 1 (always inputs)
I/O
Direction
Peripheral
Functions
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
Port B (16-bit)
PCR[16]
PCR[17]
B[1]
MPC5643L Data Sheet, Rev. 3
Preliminary—Subject to Change Without Notice
B[0]
PCR[18]
B[2]
PCR[19]
B[3]
PCR[20]
6
B[4]
PCR[21]
B[5]
Freescale Semiconductor
PCR[22]
B[6]
PCR[23]
B[7]
ALT0
ALT1
ALT2
ALT3
SIU Lite
CAN0
eTimer1
SSCM
GPIO[16]
TXD
ETC[2]
DEBUG[0]
I/O
O
I/O
I/O
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
eTimer1
SSCM
GPIO[17]
—
ETC[3]
DEBUG[1]
I/O
—
I/O
I/O
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
LIN0
—
SSCM
GPIO[18]
TXD
—
DEBUG[2]
I/O
O
—
I/O
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
SSCM
GPIO[19]
—
—
DEBUG[3]
I/O
—
—
I/O
ALT0
ALT1
ALT2
ALT3
SIU Lite
JTAG
—
—
GPIO[20]
TDO
—
—
I/O
O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[21]
—
—
—
I/O
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
MC_CGM
DSPI2
—
GPIO[22]
CLKOUT
CS2
—
I/O
O
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[23]
—
—
—
I
—
—
—
B15
Ext. IRQ #15 (input)
Ext. IRQ #16 (input)
CAN0 RXD (input)
CAN1 RXD (input)
S
M
109
C14
S
M
110
A14
Ext. IRQ #17 (input)
S
M
114
B13
LIN0 RXD (input)
S
M
116
L17
—
S
F
89
M15
JTAG0 TDI (input)
S
M
86
SIU Lite
B3
Ext. IRQ #18 (input)
S
M
138
R5
LIN0 RXD (input)
ADC0 AN[0]
—
7
—
6
43
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
44
Table 7. Pin muxing (continued)
Freescale Semiconductor
Table 7. Pin muxing (continued)
Functions
Port
Pin
PCR
Register
PCR[24]
B[8]
PCR[25]
B[9]
MPC5643L Data Sheet, Rev. 3
B[10]
PCR[27]
B[11]
PCR[28]
B[12]
PCR[29]
B[13]
PCR[30]
B[14]
PCR[31]
B[15]
Alternate
Function2,3
Peripheral5
Function
IBE = 1 (always inputs)
I/O
Direction
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[24]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[25]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[26]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[27]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[28]
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
ALT0
ALT1
ALT2
ALT3
ALT0
ALT1
ALT2
ALT3
Peripheral
Functions
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
P7
eTimer0 ETC[5]
ADC0 AN[1] (input)
—6
—6
ADC0 – ADC1 AN[11] (input)
—6
—6
ADC0 – ADC1 AN[12] (input)
—6
—6
ADC0 – ADC1 AN[13] (input)
—6
—6
I
—
—
—
ADC0 – ADC1 AN[14] (input)
—6
—6
GPIO[29]
—
—
—
I
—
—
—
ADC1 AN[0] (input)
LIN1 RXD (input)
—6
—6
SIU Lite
—
—
—
GPIO[30]
—
—
—
I
—
—
—
Ext. IRQ #19 (input)
ADC1 AN[1] (input)
eTimer0 ETC[4]
—
6
—6
SIU Lite
—
—
—
GPIO[31]
—
—
—
I
—
—
—
Ext. IRQ #20 (input)
ADC1 AN[2]
—
6
—6
47
U7
52
R8
53
T8
54
U8
55
R10
60
P11
64
R11
62
45
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Preliminary—Subject to Change Without Notice
PCR[26]
IBE =
04
Functions
Port
Pin
PCR
Register
IBE =
Alternate
Function2,3
Peripheral5
04
Function
IBE = 1 (always inputs)
I/O
Direction
Peripheral
Functions
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
Port C (16-bit)
PCR[32]
PCR[33]
C[1]
MPC5643L Data Sheet, Rev. 3
Preliminary—Subject to Change Without Notice
C[0]
PCR[34]
C[2]
PCR[36]
C[4]
PCR[37]
C[5]
PCR[38]
C[6]
Freescale Semiconductor
PCR[39]
C[7]
PCR[42]
C[10]
R12
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[32]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[33]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[34]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI0
FlexPWM0
SSCM
GPIO[36]
CS0
X[1]
DEBUG[4]
I/O
I/O
I/O
I/O
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI0
—
SSCM
GPIO[37]
SCK
—
DEBUG[5]
I/O
I/O
—
I/O
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI0
FlexPWM0
SSCM
GPIO[38]
SOUT
B[1]
DEBUG[6]
I/O
O
I/O
I/O
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
FlexPWM0
SSCM
GPIO[39]
—
A[1]
DEBUG[7]
I/O
—
I/O
I/O
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI2
—
FlexPWM0
GPIO[42]
CS2
—
A[3]
I/O
O
—
I/O
ADC1 AN[3] (input)
—
6
—6
—
6
—6
—
6
—6
66
T4
ADC0 AN[2] (input)
41
U5
ADC0 AN[3] (input)
45
H3
Ext. IRQ #22 (input)
S
M
11
G3
Ext. IRQ #23 (input)
FlexPWM0 FAULT[3] (input)
S
M
13
D4
Ext. IRQ #24 (input)
S
M
142
K4
DSPI0 SIN (input)
S
M
15
A15
FlexPWM0 FAULT[1] (input)
S
M
111
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
46
Table 7. Pin muxing (continued)
Freescale Semiconductor
Table 7. Pin muxing (continued)
Functions
Port
Pin
PCR
Register
PCR[43]
C[11]
PCR[44]
C[12]
MPC5643L Data Sheet, Rev. 3
C[13]
PCR[46]
C[14]
PCR[47]
C[15]
Alternate
Function2,3
Peripheral5
Function
IBE = 1 (always inputs)
I/O
Direction
Peripheral
Functions
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer0
DSPI2
—
GPIO[43]
ETC[4]
CS2
—
I/O
I/O
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer0
DSPI2
—
GPIO[44]
ETC[5]
CS3
—
I/O
I/O
O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer1
—
—
GPIO[45]
ETC[1]
—
—
I/O
I/O
—
—
FlexPWM0 ext. sync (input)
CTU0 EXT_IN (input)
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer1
CTU0
—
GPIO[46]
ETC[2]
EXT TGR
—
I/O
I/O
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexRay0
eTimer1
FlexPWM0
GPIO[47]
CA_TR_ EN
ETC[0]
A[1]
I/O
O
I/O
I/O
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
M14
—
S
M
80
N15
S
M
82
F15
S
M
101
E15
—
FlexPWM0 ext. sync (input)
CTU0 EXT_IN (input)
S
M
103
A8
S
SYM
124
Port D (16-bit)
PCR[48]
D[0]
PCR[49]
D[1]
PCR[50]
D[2]
47
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexRay0
eTimer1
FlexPWM0
GPIO[48]
CA_TX
ETC[1]
B[1]
I/O
O
I/O
I/O
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
eTimer1
CTU0
GPIO[49]
—
ETC[2]
EXT_TRG
I/O
—
I/O
O
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
eTimer1
FlexPWM0
GPIO[50]
—
ETC[3]
X[3]
I/O
—
I/O
I/O
B8
—
S
SYM
125
E3
FlexRay0 CA_RX (input)
S
M
3
C5
FlexRay0 CB_RX (input)
S
M
140
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Preliminary—Subject to Change Without Notice
PCR[45]
IBE =
04
Functions
Port
Pin
PCR
Register
PCR[51]
D[3]
D[4]
MPC5643L Data Sheet, Rev. 3
Preliminary—Subject to Change Without Notice
PCR[52]
PCR[53]
D[5]
PCR[54]
D[6]
PCR[55]
D[7]
PCR[56]
D[8]
PCR[57]
Freescale Semiconductor
D[9]
PCR[58]
D[10]
IBE =
Alternate
Function2,3
Peripheral5
04
Function
IBE = 1 (always inputs)
I/O
Direction
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexRay0
eTimer1
FlexPWM0
GPIO[51]
CB_TX
ETC[4]
A[3]
I/O
O
I/O
I/O
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexRay0
eTimer1
FlexPWM0
GPIO[52]
CB_TR_EN
ETC[5]
B[3]
I/O
O
I/O
I/O
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI0
—
—
GPIO[53]
CS3
—
—
I/O
O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI0
—
FlexPWM0
GPIO[54]
CS2
—
X[3]
I/O
O
—
I/O
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI1
—
DSPI0
GPIO[55]
CS3
—
CS4
I/O
O
—
O
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI1
eTimer1
DSPI0
GPIO[56]
CS2
ETC[4]
CS5
I/O
O
I/O
O
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM0
LIN1
—
GPIO[57]
X[0]
TXD
—
I/O
I/O
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM0
—
—
GPIO[58]
A[0]
—
—
I/O
I/O
—
—
Peripheral
Functions
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
A7
—
S
SYM
128
B7
—
S
SYM
129
N3
FlexPWM0 FAULT[2] (input)
S
M
33
P3
FlexPWM0 FAULT[1] (input)
S
M
34
R4
SWG ANAOUT
S
M
37
M3
FlexPWM0 FAULT[3] (input)
S
M
32
L3
—
S
M
26
T15
eTimer0 ETC[0]
S
M
76
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
48
Table 7. Pin muxing (continued)
Freescale Semiconductor
Table 7. Pin muxing (continued)
Functions
Port
Pin
PCR
Register
PCR[59]
D[11]
PCR[60]
D[12]
MPC5643L Data Sheet, Rev. 3
D[14]
Alternate
Function2,3
Peripheral5
Function
IBE = 1 (always inputs)
I/O
Direction
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM0
—
—
GPIO[59]
B[0]
—
—
I/O
I/O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM0
—
—
GPIO[60]
X[1]
—
—
I/O
I/O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM0
—
—
GPIO[62]
B[1]
—
—
I/O
I/O
—
—
Peripheral
Functions
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
R16
eTimer0 ETC[1]
S
M
78
G14
LIN1 RXD (input)
S
M
99
D16
eTimer0 ETC[3]
S
M
105
Port E (16-bit)
PCR[64]
E[0]
PCR[66]
E[2]
PCR[68]
E[4]
PCR[69]
E[5]
PCR[70]
E[6]
49
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[64]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[66]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[68]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[69]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[70]
—
—
—
I
—
—
—
T13
ADC1 AN[5] (input)
—
6
—6
—
6
—6
—
6
—6
—
6
—6
—
6
6
68
U6
ADC0 AN[5] (input)
49
U4
ADC0 AN[7] (input)
42
T5
ADC0 AN[8] (input)
44
R6
ADC0 AN[4] (input)
—
46
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Preliminary—Subject to Change Without Notice
PCR[62]
IBE =
04
Functions
Port
Pin
PCR
Register
PCR[71]
E[7]
E[9]
MPC5643L Data Sheet, Rev. 3
Preliminary—Subject to Change Without Notice
PCR[73]
PCR[74]
E[10]
PCR[75]
E[11]
PCR[76]
E[12]
PCR[77]
E[13]
PCR[78]
Freescale Semiconductor
E[14]
PCR[79]
E[15]
IBE =
Alternate
Function2,3
Peripheral5
04
Function
IBE = 1 (always inputs)
I/O
Direction
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[71]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[73]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[74]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[75]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[76]
—
—
—
I
—
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer0
DSPI3
—
GPIO[77]
ETC[5]
CS3
—
I/O
I/O
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer1
—
—
GPIO[78]
ETC[5]
—
—
I/O
I/O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI0
—
—
GPIO[79]
CS1
—
—
I/O
O
—
—
Peripheral
Functions
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
T6
ADC0 AN[6] (input)
—
6
—6
—
6
—6
—
6
—6
—
6
—6
—
6
—6
48
T10
ADC1 AN[7] (input)
61
T11
—
ADC1 AN[8] (input)
63
U11
—
ADC1 AN[4] (input)
65
T12
—
ADC1 AN[6] (input)
67
D12
—
Ext. IRQ #25 (input)
S
M
117
B12
—
Ext. IRQ #26 (input)
S
M
119
B11
—
Ext. IRQ #27 (input)
S
M
121
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
50
Table 7. Pin muxing (continued)
Freescale Semiconductor
Table 7. Pin muxing (continued)
Functions
Port
Pin
PCR
Register
IBE =
Alternate
Function2,3
Peripheral5
04
Function
IBE = 1 (always inputs)
I/O
Direction
Peripheral
Functions
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
Port F (16-bit)
PCR[80]
F[0]
F[3]
MPC5643L Data Sheet, Rev. 3
PCR[84]
F[4]
PCR[85]
F[5]
PCR[86]
F[6]
PCR[87]
F[7]
PCR[88]
F[8]
PCR[89]
F[9]
51
SIU Lite
FlexPWM0
—
—
GPIO[80]
A[1]
—
—
I/O
I/O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
DSPI0
—
—
GPIO[83]
CS6
—
—
I/O
O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[84]
—
MDO[3]
—
I/O
—
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[85]
—
MDO[2]
—
I/O
—
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[86]
—
MDO[1]
—
I/O
—
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[87]
—
MCKO
—
I/O
—
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[88]
—
MSEO1
—
I/O
—
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[89]
—
MSEO0
—
I/O
—
O
—
SIU Lite
D7
Ext. IRQ #28 (input)
eTimer0 ETC[2]
S
M
133
B5
—
S
M
139
D2
—
—
S
F
4
D1
—
—
S
F
5
E2
—
—
S
F
8
J1
—
—
S
F
19
K2
—
—
S
F
20
K1
—
—
S
F
23
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Preliminary—Subject to Change Without Notice
PCR[83]
ALT0
ALT1
ALT2
ALT3
Functions
Port
Pin
PCR
Register
PCR[90]
F[10]
F[11]
MPC5643L Data Sheet, Rev. 3
Preliminary—Subject to Change Without Notice
PCR[91]
PCR[92]
F[12]
PCR[93]
F[13]
PCR[94]
F[14]
PCR[95]
F[15]
IBE =
Alternate
Function2,3
Peripheral5
04
Function
IBE = 1 (always inputs)
I/O
Direction
Peripheral
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[90]
—
EVTO
—
I/O
—
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[91]
—
NEX_EN
—
I/O
—
I
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer1
—
—
GPIO[92]
ETC[3]
—
—
I/O
I/O
—
—
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer1
—
—
GPIO[93]
ETC[4]
—
—
I/O
I/O
—
—
SIU Lite
ALT0
ALT1
ALT2
ALT3
SIU Lite
LIN1
—
—
GPIO[94]
TXD
—
—
I/O
O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
—
—
GPIO[95]
—
—
—
I/O
—
—
—
Functions
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
L1
—
—
S
F
24
L2
Nexus0 EVTI (input)
S
M
25
C17
Ext. IRQ #30 (input)
S
M
106
B14
Ext. IRQ #31 (input)
S
M
112
C13
—
—
S
M
115
D13
LIN1 RXD (input)
S
M
113
Port G (16-bit)
Freescale Semiconductor
PCR[96]
G[0]
PCR[97]
G[1]
ALT0
ALT1
ALT2
ALT3
SIU Lite
FCCU0
—
—
GPIO[96]
F[0]
—
—
I/O
I/O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FCCU0
—
—
GPIO[97]
F[1]
—
—
I/O
I/O
—
—
R2
Ext. IRQ #30 (input)
S
M
38
C4
Ext. IRQ #31 (input)
S
M
141
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
52
Table 7. Pin muxing (continued)
Freescale Semiconductor
Table 7. Pin muxing (continued)
Functions
Port
Pin
PCR
Register
PCR[98]
G[2]
PCR[99]
G[3]
MPC5643L Data Sheet, Rev. 3
G[4]
PCR[101]
G[5]
PCR[102]
G[6]
PCR[103]
G[7]
PCR[104]
G[8]
PCR[105]
G[9]
Alternate
Function2,3
Peripheral5
Function
IBE = 1 (always inputs)
I/O
Direction
Peripheral
Functions
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM0
DSPI1
—
GPIO[98]
X[2]
CS1
—
I/O
I/O
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM0
—
—
GPIO[99]
A[2]
—
—
I/O
I/O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM0
—
—
GPIO[100]
B[2]
—
—
I/O
I/O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM0
DSPI2
—
GPIO[101]
X[3]
CS2
—
I/O
I/O
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM0
—
—
GPIO[102]
A[3]
—
—
I/O
I/O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM0
—
—
GPIO[103]
B[3]
—
—
I/O
I/O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexRay
DSPI0
—
GPIO[104]
DBG0
CS1
—
I/O
O
O
—
Ext. IRQ #21 (input)
FlexPWM0 FAULT[0] (input)
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexRay
DSPI1
—
GPIO[105]
DBG1
CS1
—
I/O
O
O
—
Ext. IRQ #29 (input)
FlexPWM0 FAULT[1] (input)
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
E16
—
—
S
M
102
D17
—
eTimer ETC[4]
S
M
104
F17
eTimer ETC[5]
S
M
100
N17
—
—
S
M
85
G17
—
—
S
M
98
P17
—
—
S
M
83
P16
S
M
81
R17
S
M
79
53
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Preliminary—Subject to Change Without Notice
PCR[100]
IBE =
04
Functions
Port
Pin
PCR
Register
PCR[106]
G[10]
G[11]
MPC5643L Data Sheet, Rev. 3
Preliminary—Subject to Change Without Notice
PCR[107]
PCR[108]
G[12]
PCR[109]
G[13]
PCR[110]
G[14]
PCR[111]
G[15]
IBE =
Alternate
Function2,3
Peripheral5
04
Function
IBE = 1 (always inputs)
I/O
Direction
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexRay
DSPI2
—
GPIO[106]
DBG2
CS3
—
I/O
O
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexRay
—
—
GPIO[107]
DBG3
—
—
I/O
O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[108]
—
MDO[11]
—
I/O
—
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[109]
—
MDO[10]
—
I/O
—
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[110]
—
MDO[9]
—
I/O
—
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[111]
—
MDO[8]
—
I/O
—
O
—
Peripheral
Functions
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
P15
FlexPWM0 FAULT[2] (input)
S
M
77
U15
FlexPWM0 FAULT[3] (input)
S
M
75
F2
—
—
—
H1
—
—
—
A6
—
—
—
J2
—
—
—
Port H (16-bit)
Freescale Semiconductor
PCR[112]
H[0]
PCR[113]
H[1]
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[112]
—
MDO[7]
—
I/O
—
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[113]
—
MDO[6]
—
I/O
—
O
—
A5
—
—
—
F1
—
—
—
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
54
Table 7. Pin muxing (continued)
Freescale Semiconductor
Table 7. Pin muxing (continued)
Functions
Port
Pin
PCR
Register
PCR[114]
H[2]
PCR[115]
H[3]
MPC5643L Data Sheet, Rev. 3
H[4]
PCR[117]
H[5]
PCR[118]
H[6]
PCR[119]
H[7]
PCR[120]
H[8]
PCR[121]
H[9]
Alternate
Function2,3
Peripheral5
Function
IBE = 1 (always inputs)
I/O
Direction
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[114]
—
MDO[5]
—
I/O
—
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
—
Nexus0
—
GPIO[115]
—
MDO[4]
—
I/O
—
O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM1
eTimer2
—
GPIO[116]
X[0]
ETC[0]
—
I/O
I/O
I/O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM1
—
DSPI0
GPIO[117]
A[0]
—
CS4
I/O
I/O
—
O
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM1
—
DSPI0
GPIO[118]
B[0]
—
CS5
I/O
I/O
—
O
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM1
eTimer2
—
GPIO[119]
X[1]
ETC[1]
—
I/O
I/O
I/O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM1
—
DSPI0
GPIO[120]
A[1]
—
CS6
I/O
I/O
—
O
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM1
—
DSPI0
GPIO[121]
B[1]
—
CS7
I/O
I/O
—
O
Peripheral
Functions
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
A4
—
—
—
G1
—
—
—
L16
—
—
—
M17
—
—
—
H17
—
—
—
K16
—
—
—
K15
—
—
—
G16
—
—
—
55
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Preliminary—Subject to Change Without Notice
PCR[116]
IBE =
04
Functions
Port
Pin
PCR
Register
PCR[122]
H[10]
H[11]
MPC5643L Data Sheet, Rev. 3
Preliminary—Subject to Change Without Notice
PCR[123]
PCR[124]
H[12]
PCR[125]
H[13]
PCR[126]
H[14]
PCR[127]
H[15]
IBE =
Alternate
Function2,3
Peripheral5
04
Function
IBE = 1 (always inputs)
I/O
Direction
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM1
eTimer2
—
GPIO[122]
X[2]
ETC[2]
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM1
GPIO[123]
A[2]
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM1
GPIO[124]
B[2]
I/O
I/O
—
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM1
eTimer2
—
GPIO[125]
X[3]
ETC[3]
—
I/O
I/O
I/O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM1
eTimer2
—
GPIO[126]
A[3]
ETC[4]
—
I/O
I/O
I/O
—
ALT0
ALT1
ALT2
ALT3
SIU Lite
FlexPWM1
eTimer2
—
GPIO[127]
B[3]
ETC[5]
—
I/O
I/O
I/O
—
Peripheral
I/O
I/O
I/O
—
Functions
Pad
Speed1
Pin
SRC SRC 144- 257=0
=1
pin ball
A11
—
—
—
C11
I/O
I/O
—
—
—
B10
—
—
—
G15
—
—
—
A12
—
—
—
J17
—
—
—
Port I (4-bit)
Freescale Semiconductor
PCR[128]
I[0]
PCR[129]
I[1]
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer2
DSPI0
—
GPIO[128]
ETC[0]
CS4
—
I/O
I/O
O
—
FlexPWM1
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer2
DSPI0
—
GPIO[129]
ETC[1]
CS5
—
I/O
I/O
O
—
FlexPWM1
C9
Fault[0]
—
C12
Fault[1]
—
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
56
Table 7. Pin muxing (continued)
Freescale Semiconductor
Table 7. Pin muxing (continued)
Functions
Port
Pin
PCR
Register
PCR[130]
I[2]
PCR[131]
I[3]
IBE =
Alternate
Function2,3
Peripheral5
04
Function
IBE = 1 (always inputs)
I/O
Direction
Peripheral
MPC5643L Data Sheet, Rev. 3
SIU Lite
eTimer2
DSPI0
—
GPIO[130]
ETC[2]
CS6
—
I/O
I/O
O
—
FlexPWM1
ALT0
ALT1
ALT2
ALT3
SIU Lite
eTimer2
DSPI0
CTU0
GPIO[131]
ETC[3]
CS7
EXT. TGR
I/O
I/O
O
O
FlexPWM1
Pin
SRC SRC 144- 257=0
=1
pin ball
F16
Fault[2
—
Fault[3]
—
E17
NOTES:
1 Programmable via the SRC (Slew Rate Control) bit in the respective Pad Configuration Register. S = Slow, M = Medium, F = Fast, SYM = Symmetric
(FlexRay).
2 ALT0 is the primary (default) function for each port after reset.
3 Alternate functions are chosen by setting the values of the PCR[PA] bitfields inside the SIU module.
– PCR[PA] = 00 → ALT0
– PCR[PA] = 01 → ALT1
– PCR[PA] = 10 → ALT2
– PCR[PA] = 11→ ALT3
This bitfield selects the output and input/output functions. To use one of the input-only functions, the PCR[IBE] bit must be written to ‘1’, regardless of the value
of PCR[PA]. For this reason, the value corresponding to an input-only function is reported as “—”.
4 Alternate input functions are chosen by setting the values of the PCR[IBE] bit in the SIU module.
– PCR[IBE] = 0 → Input/out alternate functions (default)
– PCR[IBE] = 1 → Input-only alternate functions
To use one of the input-only functions, the PCR[IBE] bit must be written to ‘1’, regardless of the value of PCR[PA]. For this reason, the value corresponding to
an input-only function is reported as “—”.
5 Module included on the device.
6 The default function of this pin out of reset is ALT1 (TDO).
7 Input-only. Pad speed does not apply.
57
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Package pinouts and signal descriptions
Preliminary—Subject to Change Without Notice
ALT0
ALT1
ALT2
ALT3
Functions
Pad
Speed1
3
Electrical characteristics
3.1
Introduction
This section contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing
specifications for this device.
This device is designed to operate at 120 MHz. The electrical specifications are preliminary and are from previous designs,
design simulations, or initial evaluation. These specifications may not be fully tested or guaranteed at this early stage of the
product life cycle. Finalized specifications will be published after complete characterization and device qualifications have been
completed.
The “Symbol” column of the electrical parameter and timings tables contains an additional column containing “SR”, “P”, “C”,
“T”, or “D”.
•
•
3.2
“SR” identifies system requirements—conditions that must be provided to ensure normal device operation. An
example is the input voltage of a voltage regulator.
“P”, “C”, “T”, or “D” apply only to controller characteristics—specifications that define normal device operation.
They specify how each characteristic is guaranteed.
— P: parameter is guaranteed by production testing of each individual device.
— C: parameter is guaranteed by design characterization. Measurements are taken from a statistically relevant
sample size across process variations.
— T: parameter is guaranteed by design characterization on a small sample size from typical devices under typical
conditions unless otherwise noted. All values are shown in the typical (“typ”) column are within this category.
— D: parameters are derived mainly from simulations.
Absolute maximum ratings
Table 8. Absolute maximum ratings1
Symbol
Parameter
Conditions
Min
Max2
Unit
VDD_HV_REG
SR
3.3 V voltage regulator supply voltage
—
–0.3
4.03, 4
V
VSS_HV_REG
SR
3.3 V voltage regulator reference voltage
—
–0.1
0.1
V
V
VDD_HV_IOx
SR
3.3 V input/output supply voltage
—
–0.3
3.63, 4
VSS_HV_IOx
SR
Input/output ground voltage
—
–0.1
0.1
V
VDD_HV_FLA
SR
3.3 V flash supply voltage
—
–0.3
3.63, 4
V
VSS_HV_FLA
SR
Flash ground
—
–0.1
0.1
V
SR
3.3 V crystal oscillator amplifier supply
voltage
—
–0.3
4.03, 4
V
SR
3.3 V crystal oscillator amplifier reference
voltage
—
–0.1
0.1
V
VDD_HV_ADR05 SR
VDD_HV_ADR1
3.3 V / 5.0 V ADC0 high reference voltage
3.3 V / 5.0 V ADC1 high reference voltage
—
–0.3
6.0
V
VSS_HV_ADR0
VSS_HV_ADR1
SR
ADC0 ground and low reference voltage
ADC1 ground and low reference voltage
—
–0.1
0.1
V
VDD_HV_ADV
SR
3.3 V ADC supply voltage
—
–0.3
4.03, 4
V
VSS_HV_ADV
SR
3.3 V ADC supply ground
—
–0.1
0.1
V
VDD_HV_OSC
VSS_HV_OSC
MPC5643L Microcontroller Data Sheet, Rev. 3
58
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
Table 8. Absolute maximum ratings1 (continued)
Symbol
TVDD
Parameter
SR
Slope characteristics on all VDD during
power up
SR
Voltage on any pin with respect to ground
(VSS_HV_IOx)
VIN
IINJPAD
IINJSUM
TSTG
Max2
Conditions
Min
—
0.5
—
–0.3
6.0
–0.3
VDD + 0.36
Relative to VDD
Unit
3.0 × 106
V/µs
(3.0 V/sec)
V
SR
Injected input current on any pin during
overload condition
—
–10
10
mA
SR
Absolute sum of all injected input currents
during overload condition
—
–50
50
mA
SR
Storage temperature
—
–55
150
°C
NOTES:
1 Functional operating conditions are given in the DC electrical characteristics. Absolute maximum ratings are stress
ratings only, and functional operation at the maxima is not guaranteed. Stress beyond the listed maxima may affect
device reliability or cause permanent damage to the device.
2 Absolute maximum voltages are currently maximum burn-in voltages. Absolute maximum specifications for device
stress have not yet been determined.
3 5.3 V for 10 hours cumulative over lifetime of device, 3.3 V +10% for time remaining.
4 Voltage overshoots during a high-to-low or low-to-high transition must not exceed 10 seconds per instance.
5 V
DD_HV_ADR0 and VDD_HV_ADR1 cannot be operated be operated at different voltages, and need to be supplied by
the same voltage source.
6 Only when V
DD < 5.2 V.
3.3
Recommended operating conditions
Table 9. Recommended operating conditions (3.3 V)
Symbol
Parameter
Conditions
Min
Max1
Unit
VDD_HV_REG
SR 3.3 V voltage regulator supply voltage
—
3.0
3.6
V
VSS_HV_REG
SR 3.3 V voltage regulator reference voltage
—
0
0
V
VDD_HV_IOx
SR 3.3 V input/output supply voltage
—
3.0
3.6
V
VSS_HV_IOx
SR Input/output ground voltage
—
0
0
V
VDD_HV_FLA
SR 3.3 V flash supply voltage
—
3.0
3.6
V
VSS_HV_FLA
SR Flash ground
—
0
0
V
VDD_HV_OSC
SR 3.3 V crystal oscillator amplifier supply voltage
—
3.0
3.6
V
VSS_HV_OSC
SR 3.3 V crystal oscillator amplifier reference voltage
—
0
0
V
SR 3.3 V / 5.0 V ADC0 high reference voltage
3.3 V / 5.0 V ADC1 high reference voltage
—
4.5 to 5.5 or
3.0 to 3.3
V
VDD_HV_ADV
SR 3.3 V ADC supply voltage
—
3.0
3.6
V
VSS_HV_AD0
VSS_HV_AD1
SR ADC0 ground and low reference voltage
ADC1 ground and low reference voltage
—
0
0
V
VSS_HV_ADV
SR 3.3 V ADC supply ground
—
0
0
V
SR Internal supply voltage
—
—
—
V
VDD_HV_ADR02
VDD_HV_ADR1
VDD_LV_REGCOR3
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
59
Table 9. Recommended operating conditions (3.3 V) (continued)
Symbol
Parameter
VSS_LV_REGCOR4 SR Internal reference voltage
Conditions
Min
Max1
Unit
—
0
0
V
VDD_LV_CORx2
SR Internal supply voltage
—
—
—
V
VSS_LV_CORx3
SR Internal reference voltage
—
0
0
V
SR Internal supply voltage
—
—
—
V
SR Internal reference voltage
—
0
0
V
–40
125
°C
–40
150
°C
VDD_LV_PLL2
VSS_LV_PLL
3
SR Ambient temperature under bias
TA
TJ
fCPU
≤ 120 MHz
SR Junction temperature under bias
—
NOTES:
1
Full functionality cannot be guaranteed when voltage drops below 3.0 V. In particular, ADC electrical characteristics
and I/Os DC electrical specification may not be guaranteed.
2 V
DD_HV_ADR0 and VDD_HV_ADR1 cannot be operated be operated at different voltages, and need to be supplied by
the same voltage source.
3 Can be connected to emitter of external NPN. Low voltage supplies are not under user control. They are produced
by an on-chip voltage regulator.
4 For the device to function properly, the low voltage grounds (V
SS_LV_xxx) must be shorted to high voltage grounds
(VSS_HV_xxx) and the low voltage supply pins (VDD_LV_xxx) must be connected to the external ballast emitter, if one
is used.
3.4
Thermal characteristics
Table 10. Thermal characteristics for 144 LQFP package1
No.
Symbol
Parameter
Conditions
1
RθJA
D
Thermal resistance junction-to-ambient
natural convection2
Single layer board – 1s
2
RθJA
D
Thermal resistance junction-to-ambient
natural convection2
Four layer board – 2s2p
5
RθJB
D
Thermal resistance junction-to-board3
6
RθJC
D
Thermal resistance junction-to-case4
7
ΨJT
D
5
Junction-to-package-top natural convection
Value Unit
TBD °C/W
TBD °C/W
—
TBD °C/W
—
TBD °C/W
—
TBD °C/W
NOTES:
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
2
Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
4
Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
5
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
MPC5643L Microcontroller Data Sheet, Rev. 3
60
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
Table 11. Thermal characteristics for 257 MAPBGA package1
No.
Symbol
Parameter
Conditions
1
RθJA
D
Thermal resistance junction-to-ambient
natural convection2
Single layer board – 1s
2
RθJA
D
Thermal resistance junction-to-ambient
natural convection2
Four layer board – 2s2p
5
RθJB
D
Thermal resistance junction-to-board3
6
RθJC
D
Thermal resistance junction-to-case4
7
ΨJT
D
5
Junction-to-package-top natural convection
Value Unit
TBD °C/W
TBD °C/W
—
TBD °C/W
—
TBD °C/W
—
TBD °C/W
NOTES:
1
Thermal characteristics are targets based on simulation that are subject to change per device characterization.
2
Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
5
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
3.4.1
General notes for specifications at maximum junction temperature
An estimation of the chip junction temperature, TJ, can be obtained from Equation 1:
TJ = TA + (RθJA × PD)
Eqn. 1
where:
= ambient temperature for the package (oC)
TA
RθJA = junction to ambient thermal resistance (oC/W)
PD
= power dissipation in the package (W)
The junction to ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal
performance. Unfortunately, there are two values in common usage: the value determined on a single layer board and the value
obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which
value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a
single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
When a heat sink is used, the thermal resistance is expressed in Equation 2 as the sum of a junction to case thermal resistance
and a case to ambient thermal resistance:
RθJA = RθJC + RθCA
Eqn. 2
where:
RθJA = junction to ambient thermal resistance (°C/W)
RθJC = junction to case thermal resistance (°C/W)
RθCA = case to ambient thermal resistance (°C/W)
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
61
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to change the case to
ambient thermal resistance, RθCA. For instance, the user can change the size of the heat sink, the air flow around the device, the
interface material, the mounting arrangement on printed circuit board, or change the thermal dissipation on the printed circuit
board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the Thermal
Characterization Parameter (ΨJT) can be used to determine the junction temperature with a measurement of the temperature at
the top center of the package case using Equation 3:
TJ = TT + (ΨJT × PD)
Eqn. 3
where:
= thermocouple temperature on top of the package (°C)
TT
ΨJT = thermal characterization parameter (°C/W)
PD
= power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the
junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects
of the thermocouple wire.
3.4.1.1
References
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134 USA
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or
303-397-7956.
JEDEC specifications are available on the WEB at http://www.jedec.org.
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled
Applications,” Electronic Packaging and Production, pp. 53–58, March 1998.
3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance
and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp.
212–220.
MPC5643L Microcontroller Data Sheet, Rev. 3
62
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
3.5
Electromagnetic Interference (EMI) characteristics
Table 12. EMI testing specifications1
No.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
1
SR Scan range
—
0.15
—
1000
MHz
2
SR Operating frequency
—
—
—
120
MHz
—
—
1.2
—
V
—
—
3.3
—
V
—
—
TBD
dBµV
—
—
TBD
dBµV
—
—
TBD
dBµV
–40
—
125
°C
3
VDD_LV_REGCOR
LV operating voltages
VDD_LV_CORx
SR
VDD_LV_PLL
HV operating
voltages
4
VDD_HV_REG
VDD_HV_AD1
VDD_HV_AD0
VDD_HV_FL
VDD_HV_OSC
VDD_HV_IOx
5
VDD_HV_REG
VDD_HV_AD1
VDD_HV_AD0
VDD_HV_FL
VDD_HV_OSC
VDD_HV_IOx
6
VDD_HV_REG
VDD_HV_AD1
VDD_HV_AD0
VDD_HV_FL
VDD_HV_OSC
VDD_HV_IOx
7
VDD_HV_REG
VDD_HV_AD1
VDD_HV_AD0
VDD_HV_FL
VDD_HV_OSC
VDD_HV_IOx
SR
8
TA
SR
SR
Maximum amplitude
SR
Maximum amplitude
Device settings
chosen for worst-case
emissions from typical
use configuration2
No PLL frequency
modulation
SR
Maximum amplitude
Operating
temperature
± 2% PLL frequency
modulation
—
NOTES:
1
EMI testing and I/O port waveforms per SAE J1752/3 issued 1995-03 and IEC 61967-1, 2.
2
Design target only, subject to change after silicon characterization.
3.6
Electrostatic discharge (ESD) characteristics
Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according
to each pin combination. The sample size depends on the number of supply pins in the device (3 parts × (n + 1) supply pin).
This test conforms to the AEC-Q100-002/-003/-011 standard.
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
63
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
Table 13. ESD ratings1, 2
No.
Symbol
Parameter
Conditions
Class
Max value3
Unit
1
VESD(HBM)
SR
Electrostatic discharge
(Human Body Model)
TA = 25 °C
conforming to AEC-Q100-002
H1C
2000
V
2
VESD(MM)
SR
Electrostatic discharge
(Machine Model)
TA = 25 °C
conforming to AEC-Q100-003
M2
200
V
3
VESD(CDM)
Electrostatic discharge TA = 25 °C
SR (Charged Device Model) conforming to AEC-Q100-011
C3A
500
V
750 (corners)
NOTES:
1
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated
Circuits.
2
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification requirements. Complete DC parametric and functional testing shall be performed per applicable
device specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
3
Data based on characterization results, not tested in production.
3.7
Static latch-up (LU)
Two complementary static tests are required on six parts to assess the latch-up performance:
•
•
A supply overvoltage is applied to each power supply pin.
A current injection is applied to each input, output and configurable I/O pin.
These tests are compliant with the EIA/JESD 78 IC latch-up standard.
Table 14. Latch-up results
No.
1
3.8
Symbol
LU
Parameter
SR
Static latch-up class
Conditions
Class
TA = 125 °C conforming to JESD 78
II level A
Voltage regulator electrical characteristics
The voltage regulator is composed of the following blocks:
•
•
•
•
•
•
•
•
•
•
High power regulator HPREG1 (internal ballast to support core current)
High power regulator HPREG2 (external NPN to support core current)
Low voltage detector (LVD_MAIN_1) for 3.3 V supply to IO (VDDIO)
Low voltage detector (LVD_MAIN_2) for 3.3 V supply (VDDREG)
Low voltage detector (LVD_MAIN_3) for 3.3 V flash supply (VDDFLASH)
Low voltage detector (LVD_DIG_MAIN) for 1.2 V digital core supply (HPVDD)
Low voltage detector (LVD_DIG_BKUP) for the self-test of LVD_DIG_MAIN
High voltage detector (HVD_DIG_MAIN) for 1.2 V digital CORE supply (HPVDD)
High voltage detector (HVD_DIG_BKUP) for the self-test of HVD_DIG_MAIN.
Power on Reset (POR)
HPREG1 uses an internal ballast to support the core current. HPREG2 is used only when external NPN transistor is present on
board to supply core current. The MPC5643L always powers up using HPREG1 if an external NPN transistor is present. Then
the MPC5643L makes a transition from HPREG1 to HPREG2. This transition is dynamic. Once HPREG2 is fully operational,
the controller part of HPREG1 is switched off. The supported bipolar transistor is a BCP68 from ON Semiconductor.
MPC5643L Microcontroller Data Sheet, Rev. 3
64
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
Table 15. HPREG1, HPREG2, Main LVDs, Digital HVD, and Digital LVD electrical specifications
No.
Symbol
Parameter
External decoupling/
stability capacitor
Conditions
Min
Typ
Max
Units
Min, max values shall be granted
with respect to tolerance, voltage,
temperature, and aging variations.
12
—
40
µF
1
SR
2
SR
Combined ESR of
external capacitor
—
0.03
—
0.5
Ω
3
SR
Number of pins for
external decoupling/
stability capacitor
—
5
—
—
—
Ceramic capacitors, taking into
account tolerance, aging, voltage
and temperature variation
—
—
300
nF
Cload = 10 µF × 4
—
—
2.5
ms
4
CV1V2
5
tSU
SR
Total capacitance on
1.2 V pins
Start-up time after main
supply stabilization
6
Main high voltage
detectors upper threshold
—
—
—
2.9
V
7
Main high voltage
detectors lower threshold
—
2.6
—
—
V
8
Digital high voltage
detector upper threshold
Before a destructive reset
initialization phase completion
—
1.5
V
9
Digital high voltage
detector upper threshold
After a destructive reset
initialization phase completion
1.32
—
1.4
V
10
Digital high voltage
detector lower threshold
Before a destructive reset
initialization phase completion
1.330
—
1.4
V
11
Digital low voltage
detector lower threshold
—
1.080
—
1.110
V
12
POR rising/ falling supply
threshold voltage
—
1.6
—
2.6
V
Supply ramp time
—
0.5 × 106
—
3
V/s
13
SR
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
65
VDD
BCP68
BCRTL
V1V2 ring on board
Rb
Rs
Lb
ESR
Cv1v2
Cext
Cint
V1V2 pin
MPC5643L
Figure 4. BCP68 Board schematic example
NOTE
The combined ESR of the capacitors used on 1.2 V pins (V1V2 in the picture) shall be in
the range of 30 mΩ to 150 mΩ. The minimum value of the ESR is constrained by the
resonance caused by the external components, bonding inductance, and internal
decoupling. The minimum ESR is required to avoid the resonance and make the regulator
stable.
3.9
DC electrical characteristics
Table 16 gives the DC electrical characteristics at 3.3 V (3.0 V < VDD_HV_IOx < 3.6 V).
Table 16. DC electrical characteristics1
Symbol
Parameter
Conditions
Min
Max
Unit
VIL
D
Minimum low level input voltage
—
–0.12
—
V
VIL
P
Maximum level input voltage
—
—
0.35 VDD_HV_IOx
V
VIH
P
Minimum high level input voltage
—
0.65 VDD_HV_IOx
—
V
VIH
D
—
—
VDD_HV_IOx + 0.1
2
V
VHYS
T
Schmitt trigger hysteresis
—
0.1 VDD_HV_IOx
—
V
VOL_S
P
Slow, low level output voltage
IOL = 1.5 mA
—
0.5
V
Maximum high level input voltage
MPC5643L Microcontroller Data Sheet, Rev. 3
66
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
Table 16. DC electrical characteristics1 (continued)
Symbol
Parameter
Conditions
Min
Max
Unit
—
V
VOH_S
P
Slow, high level output voltage
IOH = –1.5 mA VDD_HV_IOx – 0.8
VOL_M
P
Medium, low level output voltage
IOL = 2 mA
—
0.5
V
VOH_M
P
Medium, high level output voltage
IOH = –2 mA
VDD_HV_IOx – 0.8
—
V
VOL_F
P
Fast, high level output voltage
IOL = 1.5 mA
—
0.5
V
VOH_F
P
Fast, high level output voltage
—
V
VOL_SYM
P
Symmetric, high level output voltage
0.5
V
VOH_SYM
P
Symmetric, high level output voltage
—
V
IINJ
P
DC injection current per pin
mA
IPU
P
IPD
P
IIL
P
IIL
VILR
IOH = –1.5 mA VDD_HV_IOx – 0.8
IOL = 1.5 mA
—
IOH = –1.5 mA VDD_HV_IOx – 0.8
—
–1
1
VIN = VIL
–130
—
VIN = VIH
—
–10
VIN = VIL
10
—
VIN = VIH
—
130
Input leakage current
(all bidirectional ports)
TJ = –40 to
+150 °C
—
1 μA
µA
P
Input leakage current
(all ADC input-only ports)
TJ = –40 to
+150 °C
—
0.5 μA
µA
P
RESET, low level input voltage
—
–0.12
0.35 VDD_HV_IOx
V
V
Equivalent pull-up current
Equivalent pull-down current
µA
µA
VIHR
P
RESET, high level input voltage
—
0.65 VDD_HV_IOx
VDD_HV_IOx+0.12
VHYSR
D
RESET, Schmitt trigger hysteresis
—
0.1 VDD_HV_IOx
—
V
VOLR
D
RESET, low level output voltage
IOL = 2 mA
—
0.5
V
—
D
VIN = VIL
10
IPD
VIN = VIH
—
130
RESET, equivalent pull-down current
µA
NOTES:
1 These specifications are design targets and subject to change per device characterization.
2 “SR” parameter values must not exceed the absolute maximum ratings shown in Table 8.
3.10
Temperature sensor electrical characteristics
Table 17. Temperature sensor electrical characteristics
Symbol
Parameter
Accuracy
—
TS
P
D
Minimum sampling period
Conditions
Min
Max
Unit
TJ = –40 °C to TA = 25 °C
–10
10
°C
TJ = TA to 125 °C
–7
7
°C
4
—
µs
—
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
67
3.11
Main oscillator electrical characteristics
The device provides an oscillator/resonator driver. Figure 5 describes a simple model of the internal oscillator driver and
provides an example of a connection for an oscillator or a resonator.
Figure 5. Crystal oscillator and resonator connection scheme
EXTAL
Crystal
CL
EXTAL
RP
XTAL
CL
DEVICE
VDD
I
EXTAL
Resonator
R
XTAL
DEVICE
XTAL
DEVICE
NOTE
XTAL/EXTAL must not be directly used to drive external circuits.
Figure 6. Main oscillator electrical characteristics
VDD
VDDMIN
VXTAL
1/fXOSCHS
VXOSCHS
90%
VXOSCHSOP
10%
TXOSCHSSU
valid internal clock
MPC5643L Microcontroller Data Sheet, Rev. 3
68
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
×
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
Table 18. Main oscillator electrical characteristics
Symbol
Typ
Max
4.0
—
40.0
VDD = 3.3 V ±10%
4.5
—
11
fOSC = 4, 8, 10, 12, 16 MHz
1.3
—
—
fOSC = 40 MHz
1.1
—
—
Oscillation operating
point
—
—
0.82
—
V
D Oscillator consumption
—
—
—
3.5
mA
fOSC = 4, 8, 10, 12 MHz,
OSCILLATOR_MARGIN = 0
—
—
6
fOSC = 16, 40 MHz,
OSCILLATOR_MARGIN = 1
—
—
2
0.65 × VDD
—
VDD + 0.4
V
–0.4
—
0.35 × VDD
V
Oscillator
transconductance
gmXOSCHS
VXOSCHS
P Oscillation amplitude
D
VXOSCHSOP
D
IXOSCHS
Oscillator start-up time
TXOSCHSSU
Unit
Min
SR Oscillator frequency
fXOSCHS
Value
Conditions1
Parameter
—
MHz
mA/V
V
T
ms
VIH
SR
Input high level CMOS
Schmitt Trigger
Oscillator bypass mode
VIL
SR
Input low level CMOS
Schmitt Trigger
Oscillator bypass mode
NOTES:
1 V
DD = 3.3 V ±10%, TJ = –40 to +150 °C, unless otherwise specified.
3.12
FMPLL electrical characteristics
Table 19. FMPLL electrical characteristics
Symbol
Parameter
Conditions
PLL reference frequency range1 Crystal reference
fREF_CRYSTAL
D
fREF_EXT
fPLL_IN
D
fFMPLLOUT D
fFREE
P
Min
Typ
Max
Unit
4
—
40
MHz
Phase detector input frequency
range (after pre-divider)
—
4
—
16
MHz
Clock frequency range in normal
mode
—
4
—
1202
MHz
20
—
150
MHz
Free running frequency
Measured using clock division
(typically ÷16)
fsys
D On-chip PLL frequency2
—
16
—
120
MHz
tCYC
D System clock period
—
—
—
1 / fsys
ns
fLORL
fLORH
Loss of reference frequency
D window3
Lower limit
1.6
—
3.7
Upper limit
24
—
56
fSCM
D Self-clocked mode frequency4,5
—
20
—
TBD
MHz
tLOCK
P
Stable oscillator (fPLLIN = 4 MHz),
stable VDD
—
—
200
µs
Lock time
MHz
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
69
Table 19. FMPLL electrical characteristics (continued)
Symbol
Parameter
tlpll
D PLL lock time 6, 7
tdc
D Duty cycle of reference
8,9,10,11
CLKOUT period jitter
CJITTER
Conditions
Min
Typ
Max
Unit
—
—
—
200
μs
—
40
—
60
%
Peak-to-peak (clock edge to clock
edge), fSYS maximum
TBD
—
TBD
%
fCLK
T
OUT
Long-term jitter (avg. over 2 ms
interval), fSYS maximum
ΔtPKJIT
T
ΔtLTJIT
T
fLCK
D
fUL
D
fCS
fDS
D
fMOD
–6
—
6
ns
—
—
±500
ps
—
—
±6
ns
—
–6
—
6
%
fsys
—
–18
—
18
%
fsys
Center spread
±0.25
—
±4.012
Down Spread
–0.5
—
-8.0
%
fsys
—
—
100
kHz
Single period jitter (peak to peak) PHI @ 16 MHz,
Input clock @ 4 MHz
Long term jitter
PHI @ 16 MHz,
Input clock @ 4 MHz
Frequency LOCK range
Frequency un-LOCK range
Modulation Depth
D Modulation frequency13
—
NOTES:
1 Considering operation with PLL not bypassed.
2 With FM, +2% maximum.
3 “Loss of Reference Frequency” window is the reference frequency range outside of which the PLL is in self clocked
mode.
4 Self clocked mode frequency is the frequency that the PLL operates at when the reference frequency falls outside
the fLOR window.
5 f
VCO self clock range is 20-150 MHz. fSCM represents fSYS after PLL output divider (ERFD) of 2 through 16 in
enhanced mode.
6 This value is determined by the crystal manufacturer and board design. For 4 MHz to 20 MHz crystals specified for
this PLL, load capacitors should not exceed these limits.
7
This specification applies to the period required for the PLL to relock after changing the MFD frequency control bits
in the synthesizer control register (SYNCR).
8
This value is determined by the crystal manufacturer and board design.
9 Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum
fSYS. Measurements are made with the device powered by filtered supplies and clocked by a stable external clock
signal. Noise injected into the PLL circuitry via VDDPLL and VSSPLL and variation in crystal oscillator frequency
increase the CJITTER percentage for a given interval.
10 Proper PC board layout procedures must be followed to achieve specifications.
11
Values are with frequency modulation disabled. If frequency modulation is enabled, jitter is the sum of CJITTER and
either fCS or fDS (depending on whether center spread or down spread modulation is enabled).
12
This value is true when operating at frequencies above 60 MHz, otherwise fCS is 2% (above 64 MHz).
13 Modulation depth is attenuated from depth setting when operating at modulation frequencies above 50kHz.
MPC5643L Microcontroller Data Sheet, Rev. 3
70
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
3.13
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
16 MHz RC oscillator electrical characteristics
Table 20. RC oscillator electrical characteristics
Symbol
fRC
Parameter
P RC oscillator frequency
Conditions
TJ = 25 °C
ΔRCMVAR
P
Fast internal RC oscillator variation with
respect to fRC.
ΔRCMTRIM
P
Post trim accuracy: The variation of the TJ = 25 °C
PTF1 from the 16 MHz clock
—
Min
Typ
Max
Unit
—
16
—
MHz
—
—
±5
%
—
—
±1
%
NOTES:
1 PTF = Post Trimming Frequency: The frequency of the output clock after trimming at typical supply voltage and
temperature.
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
71
3.14
ADC electrical characteristics
The device provides a 10-bit Successive Approximation Register (SAR) Analog-to-Digital Converter.
Offset Error OSE
Gain Error GE
1023
1022
1021
1020
1019
1 LSB ideal = VDD_ADC / 1024
1018
(2)
code out
7
(1)
6
(1) Example of an actual transfer curve
5
(5)
(2) The ideal transfer curve
(3) Differential non-linearity error (DNL)
4
(4) Integral non-linearity error (INL)
(4)
(5) Center of a step of the actual transfer curve
3
(3)
2
1
1 LSB (ideal)
0
1
2
3
4
5
6
7
1017 1018 1019 1020 1021 1022 1023
Vin(A) (LSBideal)
Offset Error OSE
Figure 21. ADC Characteristics and Error Definitions
3.14.1
Input Impedance and ADC Accuracy
To preserve the accuracy of the A/D converter, it is necessary that analog input pins have low AC impedance. Placing a capacitor
with good high frequency characteristics at the input pin of the device can be effective: the capacitor should be as large as
possible, ideally infinite. This capacitor contributes to attenuating the noise present on the input pin; further, it sources charge
during the sampling phase, when the analog signal source is a high-impedance source.
A real filter can typically be obtained by using a series resistance with a capacitor on the input pin (simple RC filter). The RC
filtering may be limited according to the value of source impedance of the transducer or circuit supplying the analog signal to
MPC5643L Microcontroller Data Sheet, Rev. 3
72
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
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from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Electrical characteristics
be measured. The filter at the input pins must be designed taking into account the dynamic characteristics of the input signal
(bandwidth) and the equivalent input impedance of the ADC itself.
In fact a current sink contributor is represented by the charge sharing effects with the sampling capacitance: CS being
substantially a switched capacitance, with a frequency equal to the conversion rate of the ADC, it can be seen as a resistive path
to ground. For instance, assuming a conversion rate of 1 MHz, with CS equal to 3 pF, a resistance of 330 kΩ is obtained
(REQ = 1 / (fC × CS), where fC represents the conversion rate at the considered channel). To minimize the error induced by the
voltage partitioning between this resistance (sampled voltage on CS) and the sum of RS + RF + RL + RSW + RAD, the external
circuit must be designed to respect the Equation 7:
R S + R F + R L + R SW + R AD
1
V A • --------------------------------------------------------------------------- < --- LSB
R EQ
2
Eqn. 7
Equation 7 generates a constraint for external network design, in particular on resistive path. Internal switch resistances (RSW
and RAD) can be neglected with respect to external resistances.
EXTERNAL CIRCUIT
INTERNAL CIRCUIT SCHEME
VDD
Source
RS
VA
Filter
RF
Current Limiter
RL
CF
Channel
Selection
Sampling
RSW1
RAD
CP1
CP2
RS Source Impedance
RF Filter Resistance
CF Filter Capacitance
Current Limiter Resistance
RL
RSW1 Channel Selection Switch Impedance
RAD Sampling Switch Impedance
CP Pin Capacitance (two contributions, CP1 and CP2)
CS Sampling Capacitance
Figure 22. Input Equivalent Circuit
A second aspect involving the capacitance network shall be considered. Assuming the three capacitances CF, CP1 and CP2 are
initially charged at the source voltage VA (refer to the equivalent circuit reported in Figure 22): A charge sharing phenomenon
is installed when the sampling phase is started (A/D switch close).
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
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Electrical characteristics
Voltage Transient on CS
VCS
VA
VA2
ΔV < 0.5 LSB
1
2
τ1 < (RSW + RAD) CS << TS
τ2 = RL (CS + CP1 + CP2)
VA1
TS
t
Figure 23. Transient Behavior during Sampling Phase
In particular two different transient periods can be distinguished:
•
A first and quick charge transfer from the internal capacitance CP1 and CP2 to the sampling capacitance CS occurs (CS
is supposed initially completely discharged): considering a worst case (since the time constant in reality would be
faster) in which CP2 is reported in parallel to CP1 (call CP = CP1 + CP2), the two capacitances CP and CS are in series,
and the time constant is
CP • CS
τ 1 = ( R SW + R AD ) • --------------------CP + CS
Eqn. 8
Equation 8 can again be simplified considering only CS as an additional worst condition. In reality,
the transient is faster, but the A/D converter circuitry has been designed to be robust also in the
very worst case: the sampling time TS is always much longer than the internal time constant:
τ 1 < ( R SW + R AD ) • C S « T S
Eqn. 9
The charge of CP1 and CP2 is redistributed also on CS, determining a new value of the voltage VA1
on the capacitance according to Equation 10:
V A1 • ( C S + C P1 + C P2 ) = V A • ( C P1 + C P2 )
•
Eqn. 10
A second charge transfer involves also CF (that is typically bigger than the on-chip capacitance) through the resistance
RL: again considering the worst case in which CP2 and CS were in parallel to CP1 (since the time constant in reality
would be faster), the time constant is:
τ 2 < R L • ( C S + C P1 + C P2 )
Eqn. 11
In this case, the time constant depends on the external circuit: in particular imposing that the
transient is completed well before the end of sampling time TS, a constraints on RL sizing is
obtained:
MPC5643L Microcontroller Data Sheet, Rev. 3
74
Preliminary—Subject to Change Without Notice
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Electrical characteristics
10 • τ 2 = 10 • R L • ( C S + C P1 + C P2 ) < TS
Eqn. 12
Of course, RL shall be sized also according to the current limitation constraints, in combination
with RS (source impedance) and RF (filter resistance). Being CF definitively bigger than CP1, CP2
and CS, then the final voltage VA2 (at the end of the charge transfer transient) will be much higher
than VA1. Equation 13 must be respected (charge balance assuming now CS already charged at
VA1):
VA2 • ( C S + C P1 + C P2 + C F ) = V A • C F + V A1 • ( C P1 + C P2 + C S )
Eqn. 13
The two transients above are not influenced by the voltage source that, due to the presence of the RFCF filter, is not able to
provide the extra charge to compensate the voltage drop on CS with respect to the ideal source VA; the time constant RFCF of
the filter is very high with respect to the sampling time (TS). The filter is typically designed to act as anti-aliasing.
Analog Source Bandwidth (VA)
TC ≤ 2 RFCF (Conversion Rate vs. Filter Pole)
fF = f0 (Anti-aliasing Filtering Condition)
Noise
2 f0 ≤ fC (Nyquist)
f0
f
Anti-Aliasing Filter (fF = RC Filter pole)
fF
f
Sampled Signal Spectrum (fC = conversion Rate)
f0
fC
f
Figure 24. Spectral Representation of Input Signal
Calling f0 the bandwidth of the source signal (and as a consequence the cut-off frequency of the anti-aliasing filter, fF),
according to the Nyquist theorem the conversion rate fC must be at least 2f0; it means that the constant time of the filter is greater
than or at least equal to twice the conversion period (TC). Again the conversion period TC is longer than the sampling time TS,
which is just a portion of it, even when fixed channel continuous conversion mode is selected (fastest conversion rate at a
specific channel): in conclusion it is evident that the time constant of the filter RFCF is definitively much higher than the
sampling time TS, so the charge level on CS cannot be modified by the analog signal source during the time in which the
sampling switch is closed.
The considerations above lead to impose new constraints on the external circuit, to reduce the accuracy error due to the voltage
drop on CS; from the two charge balance equations above, it is simple to derive Equation 14 between the ideal and real sampled
voltage on CS:
Eqn. 14
VA
C P1 + C P2 + C F
----------- = ------------------------------------------------------V A2
C P1 + C P2 + C F + C S
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
75
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Electrical characteristics
From this formula, in the worst case (when VA is maximum, that is for instance 5 V), assuming to accept a maximum error of
half a count, a constraint is evident on CF value:
Eqn. 15
C F > 2048 • C S
Table 25. ADC conversion characteristics (operating)
Symbol
fCK
fs
Min Typ Max Unit
ADC Clock frequency (depends on ADC
SR configuration)
(The duty cycle depends on AD_CK2 frequency)
—
3
—
SR Sampling frequency
—
—
— 1.00 MHz
Sample
time3
tADC_S D
tADC_C P Conversion
CS5
Conditions1
Parameter
time4
TBD
TBD
TBD
—
TBD
—
60 MHz
—
ns
— TBD µs
0.625 —
—
µs
D ADC input sampling capacitance
—
—
— 7.32 pF
CP1
5
D ADC input pin capacitance 1
—
—
— TBD pF
CP2
5
D ADC input pin capacitance 2
—
—
— TBD pF
VREF range = 4.5 to 5.5 V
—
—
0.6
kΩ
VREF range = 3.0 to 3.6 V
—
—
0.9
kΩ
—
—
—
825
Ω
RSW15 D
RAD5
Internal resistance of analog source
D Internal resistance of analog source
Input current injection
Current injection on one ADC
input, different from the
TBD
converted one. Remains
within TUE spec.
IINJ
T
INL
P Integral non linearity
—
–3
—
DNL
P Differential non linearity
—
–1.0
—
OFS
T Offset error
—
–4
—
4
LSB
GNE
T Gain error
—
—
±1
—
LSB
TUE
P Total unadjusted error without current injection
—
–6
—
6
LSB
TUE
T Total unadjusted error with current injection
—
TBD
— TBD mA
3
LSB
1.0 LSB
— TBD LSB
NOTES:
1 V
DD = 3.3 V, TJ = –40 to +150 °C, unless otherwise specified and analog input voltage from VAGND to VAREF.
2
AD_CK clock is always half of the ADC module input clock defined via the auxiliary clock divider for the ADC.
3 During the sample time the input capacitance CS can be charged/discharged by the external source. The internal
resistance of the analog source must allow the capacitance to reach its final voltage level within tADC_S. After the
end of the sample time tADC_S, changes of the analog input voltage have no effect on the conversion result. Values
for the sample clock tADC_S depend on programming.
4
This parameter does not include the sample time tADC_S, but only the time for determining the digital result and the
time to load the result register with the conversion result.
5 See Figure 22.
MPC5643L Microcontroller Data Sheet, Rev. 3
76
Preliminary—Subject to Change Without Notice
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Electrical characteristics
3.15
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Electrical characteristics
Flash memory electrical characteristics
Table 26. Flash program and erase electrical specifications
No.
Symbol
Parameter
TDWPROGRAM *5 Double word (64 bits) program time6
1
2
TPPROGRAM
3
*5 Page(128 bits) program time6
Factory Initial Lifetime
Unit
Avg2 Max3 Max4
—
39
—
—
500
µs
—
48
53
100
500
µs
5
—
TBD
TBD
500
5000
ms
5
—
TBD
TBD
750
5000
ms
5
T16KPPERASE * 16 KB block pre-program and erase time
T48KPPERASE * 48 KB block pre-program and erase time
4
Min Typ1
5
T64KPPERASE * 64 KB block pre-program and erase time
—
TBD
TBD
900
5000
ms
6
T128KPPERASE *5 128 KB block pre-program and erase time
—
TBD
TBD
1300
7500
ms
—
TBD
TBD
2600 15000
ms
5
T256KPPERASE * 256 KB block pre-program and erase time
7
NOTES:
1 Typical program and erase times assume nominal supply values and operation at T = 25 °C. These values are
J
characterized, but not tested.
2 Factory Average program and erase times represent the effective performance averaged over > 1024 pages or blocks,
and are provided for factory throughput estimation assuming < 100 program/erase cycles, nominal supply values and
operation at TJ = 25 °C. These values are characterized, but not tested.
3
Initial Max program and erase times provide guidance for time-out limits used in the factory and apply for < 100
program/erase cycles, nominal supply values and operation at TJ = 25 °C. These values are verified at production test.
4 Lifetime Max program and erase times apply across the voltage, temperature, and cycling range of product life. These
values are characterized, but not tested.
5
See Notes for individual specifications, as shown in column headings.
6 Actual hardware programming times. These do not include software overhead.
Table 27. Flash module life
Value
No.
Symbol
Parameter
Unit
Min
Typ
Max
—
—
cycles
1,000
100,0002
(TBD)
—
cycles
20
10
5
—
—
—
—
—
—
1
P/E
C
Number of program/erase cycles per block for 16 KB, 48 KB,
100,000
and 64 KB blocks over the operating temperature range1
2
P/E
C
Number of program/erase cycles per block for 128 KB and
256 KB blocks over the operating temperature range1.
3
Minimum data retention at 85 °C average ambient
temperature3
Blocks with 0–1,000 P/E cycles
Retention C
Blocks with 1,001–10,000 P/E cycles
Blocks with 10,001–100,000 P/E cycles
years
NOTES:
1 Operating temperature range is T from –40 °C to 150 °C.
J
Typical endurance is evaluated at 25 oC. Product qualification is performed to the minimum specification. For
additional information on the Freescale definition of Typical Endurance, please refer to Engineering Bulletin EB619,
Typical Endurance for Nonvolatile Memory.
2 Typical P/E cycles is 100,000 cycles for 128 KB and 256 KB blocks. For additional information on the Freescale
definition of Typical Endurance, please refer to Engineering Bulletin EB619, Typical Endurance for Nonvolatile
Memory.
3 Ambient temperature averaged over duration of application, not to exceed product operating temperature range.
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
77
3.16
AC specifications
3.16.1
Pad AC specifications
Table 28. Pad AC specifications (3.3 V, IPP_HVE = 0)1
No.
1
2
3
Tswitchon1
(ns)
Pad
Slow
Medium
Fast
Rise/Fall2
(ns)
Current slew3
(mA/ns)
Frequency
(MHz)
Load drive
(pF)
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
3
—
40
—
—
40
—
—
4
0.01
—
2
25
3
—
40
—
—
50
—
—
2
0.01
—
2
50
3
—
40
—
—
75
—
—
2
0.01
—
2
100
3
—
40
—
—
100
—
—
2
0.01
—
2
200
1
—
15
—
—
12
—
—
40
2.5
—
7
25
1
—
15
—
—
25
—
—
20
2.5
—
7
50
1
—
15
—
—
40
—
—
13
2.5
—
7
100
1
—
15
—
—
70
—
—
7
2.5
—
7
200
1
—
6
—
—
4
—
—
72
3
—
40
25
1
—
6
—
—
7
—
—
55
7
—
40
50
1
—
6
—
—
12
—
—
40
7
—
40
100
1
—
6
—
—
18
—
—
25
7
—
40
200
T
T
T
4
Symmetric
T
1
—
8
—
—
5
—
—
50
3
—
25
25
5
Pull Up/Down
(3.6 V max)
D
—
—
—
—
—
TBD
—
—
—
—
—
—
50
NOTES:
1 Propagation delay from V
DD_HV_IOx/2 of internal signal to Pchannel/Nchannel switch-on condition.
2 Slope at rising/falling edge.
3
Data based on characterization results, not tested in production.
MPC5643L Microcontroller Data Sheet, Rev. 3
78
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
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Electrical characteristics
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Electrical characteristics
VDDE/2
Pad
Data Input
Rising
Edge
Output
Delay
Falling
Edge
Output
Delay
VOH
Pad
Output
VOL
Figure 16. Pad output delay
3.17
3.17.1
AC timing characteristics
RESET pin characteristics
The MPC5643L implements a dedicated bidirectional RESET pin.
VDD
VDDMIN
nRSTIN
VIH
VIL
device reset forced by nRSTIN
device start-up phase
Figure 29. Start-up reset requirements
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
79
VRSTIN
hw_rst
VDD
‘1’
VIH
VIL
‘0’
filtered by
hysteresis
filtered by
lowpass filter
filtered by
lowpass filter
unknown reset
state
device under hardware reset
WFRST
WFRST
WNFRST
Figure 30. Noise filtering on reset signal
Table 31. RESET electrical characteristics
No.
1
Symbol
Ttr
Parameter
Conditions1
Min
Typ
Max
Output transition time output pin2
CL = 25pF
—
—
12
CL = 50pF
—
—
25
CL = 100pF
—
—
40
—
—
—
40
ns
—
500
—
—
ns
D
P nRSTIN input filtered pulse
2
WFRST
3
WNFRST P nRSTIN input not filtered pulse
Unit
ns
NOTES:
1 V
DD = 3.3 V ± 10%, TJ = –40 to +150 °C, unless otherwise specified
2 C includes device and package capacitance (C
L
PKG < 5 pF).
3.17.2
IEEE 1149.1 interface timing
Table 32. JTAG pin AC electrical characteristics
No.
Symbol
Parameter
Conditions
Min Max Unit
1
tJCYC
D TCK cycle time
—
100
—
ns
2
tJDC
D TCK clock pulse width (measured at VDDE/2)
—
40
60
ns
3
tTCKRISE
D TCK rise and fall times (40%–70%)
—
—
3
ns
4
tTMSS, tTDIS
D TMS, TDI data setup time
—
5
—
ns
5
tTMSH, tTDIH D TMS, TDI data hold time
—
25
—
ns
6
tTDOV
D TCK low to TDO data valid
—
—
20
ns
7
tTDOI
D TCK low to TDO data invalid
—
0
—
ns
MPC5643L Microcontroller Data Sheet, Rev. 3
80
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
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Electrical characteristics
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Electrical characteristics
Table 32. JTAG pin AC electrical characteristics (continued)
No.
Symbol
8
tTDOHZ
11
Parameter
Conditions
Min Max Unit
D TCK low to TDO high impedance
—
—
20
ns
tBSDV
D TCK falling edge to output valid
—
—
50
ns
12
tBSDVZ
D TCK falling edge to output valid out of high impedance
—
—
50
ns
13
tBSDHZ
D TCK falling edge to output high impedance
—
—
50
ns
14
tBSDST
D Boundary scan input valid to TCK rising edge
—
50
—
ns
15
tBSDHT
D TCK rising edge to boundary scan input invalid
—
50
—
ns
TCK
2
3
2
1
3
Figure 17. JTAG test clock input timing
TCK
4
5
TMS, TDI
6
7
8
TDO
Figure 18. JTAG test access port timing
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
81
TCK
11
13
Output
Signals
12
Output
Signals
14
15
Input
Signals
Figure 19. JTAG boundary scan timing
3.17.3
Nexus timing
Table 33. Nexus debug port timing1
No.
Symbol
Parameter
1
tMCYC
D MCKO Cycle Time
2
tMDC
D MCKO Duty Cycle
Conditions Min
Valid2
Max
Unit
—
15.6
—
ns
—
40
60
%
—
–0.1
3
tMDOV
4
tEVTIPW
D EVTI Pulse Width
—
4.0
5
tEVTOPW
D EVTO Pulse Width
—
1
—
40
—
ns
—
40
60
%
—
8
—
ns
5
—
ns
0
25
ns
D MCKO Low to MDO, MSEO, EVTO Data
Time3
6
tTCYC
D TCK Cycle
7
tTDC
D TCK Duty Cycle
8
tNTDIS, tNTMSS D TDI, TMS Data Setup Time
9
tNTDIH,
tNTMSH
10
tJOV
D
TDI, TMS Data Hold Time
D TCK Low to TDO Data Valid
0.25 tMCYC
—
tTCYC
tMCYC
MPC5643L Microcontroller Data Sheet, Rev. 3
82
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
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Electrical characteristics
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Electrical characteristics
NOTES:
1
JTAG specifications in this table apply when used for debug functionality. All Nexus timing relative to MCKO is
measured from 50% of MCKO and 50% of the respective signal.
2
MDO, MSEO, and EVTO data is held valid until next MCKO low cycle.
3
The system clock frequency needs to be three times faster than the TCK frequency.
1
2
MCKO
3
MDO
MSEO
EVTO
Output Data Valid
5
EVTI
4
Figure 20. Nexus output timing
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
83
6
7
TCK
8
9
TMS, TDI
10
TDO
Figure 21. Nexus TDI, TMS, TDO timing
3.17.4
External interrupt timing (IRQ pin)
Table 34. External interrupt timing
No.
Symbol
Parameter
Conditions
Min Max Unit
1
tIPWL
D IRQ pulse width low
—
3
—
tCYC
2
tIPWH
D IRQ pulse width high
—
3
—
tCYC
—
6
—
tCYC
3
tICYC
D IRQ edge to edge
time1
NOTES:
1 Applies when IRQ pins are configured for rising edge or falling edge events, but not both.
MPC5643L Microcontroller Data Sheet, Rev. 3
84
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
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Electrical characteristics
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Electrical characteristics
CLKOUT
IRQ
1
2
3
Figure 22. External interrupt timing
3.17.5
FlexCAN timing
Table 35. FlexCAN timing
No.
Symbol
Parameter
Conditions
Min
Max
Unit
1
tCANOV
CTNX output valid after CLKOUT rising edge (output
delay)
—
—
26.0
ns
2
tCANSU
CNRX input valid to CLKOUT rising edge (setup time)
—
—
9.8
ns
Min
Max
Unit
Master (MTFE = 0)
62
—
D
Slave (MTFE = 0)
62
—
D
Slave Receive Only Mode1
16
—
3.17.6
DSPI timing
Table 36. DSPI timing
No.
Symbol
D
1
tSCK
Parameter
DSPI cycle time
Conditions
ns
2
tCSC
D
PCS to SCK delay
—
16
—
ns
3
tASC
D
After SCK delay
—
16
—
ns
4
tSDC
D
SCK duty cycle
—
5
tA
D
Slave access time
SS active to SOUT valid
—
40
ns
6
tDIS
D
Slave SOUT disable time
SS inactive to SOUT High-Z or invalid
—
10
ns
0.4 × tSCK 0.6 × tSCK ns
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
85
Table 36. DSPI timing (continued)
No.
Symbol
Parameter
Conditions
Min
Max
Unit
7
tPCSC
D
PCSx to PCSS time
—
13
—
ns
8
tPASC
D
PCSS to PCSx time
—
13
—
ns
Master (MTFE = 0)
20
—
Slave
2
—
Master (MTFE = 1, CPHA = 0)
5
—
Master (MTFE = 1, CPHA = 1)
20
—
Master (MTFE = 0)
–5
—
Slave
4
—
Master (MTFE = 1, CPHA = 0)
11
—
Master (MTFE = 1, CPHA = 1)
–5
—
Master (MTFE = 0)
—
4
Slave
—
23
Master (MTFE = 1, CPHA = 0)
—
12
Master (MTFE = 1, CPHA = 1)
—
4
Master (MTFE = 0)
–2
—
Slave
6
—
Master (MTFE = 1, CPHA = 0)
6
—
Master (MTFE = 1, CPHA = 1)
–2
—
—
4
Data setup time for inputs
9
tSUI
ns
D
Data hold time for inputs
10
tHI
D
ns
Data valid (after SCK edge)
11
tSUO
D
ns
Data hold time for outputs
12
13
tHO
fmax
D
D
ns
Maximum DSPI speed
—
MH
z
NOTES:
1 Slave Receive Only Mode can operate at a maximum frequency of 60 MHz. Note that in this mode, the DSPI can
receive data on SIN, but no valid data is transmitted on SOUT.
MPC5643L Microcontroller Data Sheet, Rev. 3
86
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
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Electrical characteristics
2
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Electrical characteristics
3
PCSx
1
4
SCK Output
(CPOL=0)
4
SCK Output
(CPOL=1)
9
SIN
10
First Data
Last Data
Data
12
SOUT
First Data
11
Data
Last Data
Figure 23. DSPI classic SPI timing — master, CPHA = 0
PCSx
SCK Output
(CPOL=0)
10
SCK Output
(CPOL=1)
9
SIN
Data
First Data
12
SOUT
First Data
Last Data
11
Data
Last Data
Figure 24. DSPI classic SPI timing — master, CPHA = 1
MPC5643L Microcontroller Data Sheet, Rev. 3
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Electrical characteristics
3
2
SS
1
4
SCK Input
(CPOL=0)
4
SCK Input
(CPOL=1)
5
First Data
SOUT
9
6
Data
Last Data
Data
Last Data
10
First Data
SIN
11
12
Figure 25. DSPI classic SPI timing — slave, CPHA = 0
SS
SCK Input
(CPOL=0)
SCK Input
(CPOL=1)
11
5
12
SOUT
First Data
9
SIN
Data
Last Data
Data
Last Data
6
10
First Data
Figure 26. DSPI classic SPI timing — slave, CPHA = 1
MPC5643L Microcontroller Data Sheet, Rev. 3
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Electrical characteristics
3
PCSx
4
1
2
SCK Output
(CPOL=0)
4
SCK Output
(CPOL=1)
9
SIN
10
First Data
Last Data
Data
12
SOUT
11
First Data
Last Data
Data
Figure 27. DSPI modified transfer format timing — master, CPHA = 0
PCSx
SCK Output
(CPOL=0)
SCK Output
(CPOL=1)
10
9
SIN
First Data
Data
12
SOUT
First Data
Data
Last Data
11
Last Data
Figure 28. DSPI modified transfer format timing — master, CPHA = 1
MPC5643L Microcontroller Data Sheet, Rev. 3
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Preliminary—Subject to Change Without Notice
89
3
2
SS
1
SCK Input
(CPOL=0)
4
4
SCK Input
(CPOL=1)
First Data
SOUT
Data
6
Last Data
10
9
Data
First Data
SIN
12
11
5
Last Data
Figure 29. DSPI modified transfer format timing – slave, CPHA = 0
SS
SCK Input
(CPOL=0)
SCK Input
(CPOL=1)
11
5
12
First Data
SOUT
9
SIN
Data
Last Data
Data
Last Data
6
10
First Data
Figure 30. DSPI modified transfer format timing — slave, CPHA = 1
MPC5643L Microcontroller Data Sheet, Rev. 3
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Electrical characteristics
7
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
8
PCSS
PCSx
Figure 31. DSPI PCS strobe (PCSS) timing
MPC5643L Microcontroller Data Sheet, Rev. 3
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Electrical characteristics
91
4
Package characteristics
4.1
Package mechanical data
Figure 32. 144 LQFP package mechanical drawing (1 of 2)
MPC5643L Microcontroller Data Sheet, Rev. 3
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Package characteristics
Freescale Semiconductor
Figure 33. 144 LQFP package mechanical drawing (2 of 2)
MPC5643L Microcontroller Data Sheet, Rev. 3
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Package characteristics
93
Figure 34. 257 MAPBGA package mechanical drawing (1 of 2)
MPC5643L Microcontroller Data Sheet, Rev. 3
94
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Package characteristics
Freescale Semiconductor
Figure 35. 257 MAPBGA package mechanical drawing (2 of 2)
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
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Package characteristics
95
5
Ordering information
M PC 5643L F F0 M LQ 1
R
Qualification status
Core code (Power Architecture)
Device number
F = FlexRay
(blank) = No FlexRay
Fab and mask identifier
Temperature range
Package identifier
Operating frequency
Tape and reel status
Temperature range
Package identifier
Operating frequency
M = –40 °C to 125 °C
V = –40 °C to 105 °C
LQ = 144 LQFP
MM = 257 MAPBGA
1 = 120 MHz
8 = 80 MHz
Tape and reel status
R = Tape and reel
(blank) = Trays
Note: Not all options are available on all devices. Refer to Table 37.
Qualification status
P = Pre-qualification
M = Fully spec. qualified, general market flow
S = Fully spec. qualified, automotive flow
Table 37. Orderable part number summary
Part number1
Flash/SRAM
Package
Speed
(MHz)
Other features
PPC5643LFF0MLQ1
1 MB/128 KB
144 LQFP (Pb free)
120
FlexRay
–40–125 °C
PPC5643LFF0MMM1
1 MB/128 KB
257 MAPBGA (Pb free)
120
FlexRay
–40–125 °C
PPC5643LF0MLQ1
1 MB/128 KB
144 LQFP (Pb free)
120
No FlexRay
–40–125 °C
PPC5643LF0MMM1
1 MB/128 KB
257 MAPBGA (Pb free)
120
No FlexRay
–40–125 °C
PPC5643LFF0VLQ1
1 MB/128 KB
144 LQFP (Pb free)
120
FlexRay
–40–105 °C
PPC5643LFF0VMM1
1 MB/128 KB
257 MAPBGA (Pb free)
120
FlexRay
–40–105 °C
PPC5643LF0VLQ1
1 MB/128 KB
144 LQFP (Pb free)
120
No FlexRay
–40–105 °C
PPC5643LF0VMM1
1 MB/128 KB
257 MAPBGA (Pb free)
120
No FlexRay
–40–105 °C
PPC5643LFF0MLQ8
1 MB/128 KB
144 LQFP (Pb free)
80
FlexRay
–40–125 °C
PPC5643LFF0MMM8
1 MB/128 KB
257 MAPBGA (Pb free)
80
FlexRay
–40–125 °C
MPC5643L Microcontroller Data Sheet, Rev. 3
96
Preliminary—Subject to Change Without Notice
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Ordering information
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available
from Freescale for import or sale in the United States prior to September 2010: MPC5643L products in 257 MAPBGA packages
Document revision history
Table 37. Orderable part number summary (continued)
Part number1
Flash/SRAM
Package
Speed
(MHz)
Other features
PPC5643LF0MLQ8
1 MB/128 KB
144 LQFP (Pb free)
80
No FlexRay
–40–125 °C
PPC5643LF0MMM8
1 MB/128 KB
257 MAPBGA (Pb free)
80
No FlexRay
–40–125 °C
PPC5643LFF0VLQ8
1 MB/128 KB
144 LQFP (Pb free)
80
FlexRay
–40–105 °C
PPC5643LFF0VMM8
1 MB/128 KB
257 MAPBGA (Pb free)
80
FlexRay
–40–105 °C
PPC5643LF0VLQ8
1 MB/128 KB
144 LQFP (Pb free)
80
No FlexRay
–40–105 °C
PPC5643LF0VMM8
1 MB/128 KB
257 MAPBGA (Pb free)
80
No FlexRay
–40–105 °C
NOTES:
1 All packaged devices are PPC, rather than MPC or SPC, until product qualifications are complete.
The unpackaged device prefix is PCC, rather than SCC, until product qualification is complete.
Not all configurations are available in the PPC parts.
6
Document revision history
Table 38 summarizes revisions to this document.
Table 38. Revision history
Revision
Date
1
2 Mar 2009
Initial release.
2
5 May 2009
Updated, Advance Information.
—Revised SINAD/SNR specifications.
— Updated pinout and pin multiplexing information.
5 Oct 2009
Updated, Advance Information, Public release.
— Throughout this document, added information for 257 MAPBGA package.
— Updated Table 1, MPC5643L device summary.
— Updated Section 1.3, Feature Details.
— Updated pin-out and pin multiplexing tables.
— In Section 3, Electrical characteristics, added symbols for signal characterization
methods.
— In Table 8, updated maximum ratings.
— In Table 10 and Table 11, removed moving-air thermal characteristics.
— Updated Section 3.8, Voltage regulator electrical characteristics.
— Updated Section 3.14, ADC electrical characteristics.
— Updated Section 3.15, Flash memory electrical characteristics.
— Updated Section 3.17.1, RESET pin characteristics.
— Removed External interrupt timing (IRQ pin) timing specifications.
— Updated Section 3.17.6, DSPI timing.
— Updated Section 5, Ordering information.
3
Description of Changes
MPC5643L Microcontroller Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
97
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Document Number: MPC5643L
Rev. 3
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MPC5643L Microcontroller Data Sheet, Rev. 3
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