TI1 LM3503SQ-25NOPB Dual-display constant current led driver with analog brightness control Datasheet

LM3503
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SNVS329D – JULY 2005 – REVISED AUGUST 2006
LM3503 Dual-Display Constant Current LED Driver with Analog Brightness Control
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FEATURES
1
•
2
•
•
•
•
•
•
•
•
Drives up to 4, 6, 8 or 10 White LEDs for Dual
Display Backlighting
>80% Peak Efficiency
Output Voltage Protection Options: 16V, 25V,
35V & 44V
Input Under-Voltage Protection
Internal Soft Start Eliminates Inrush Current
1 MHz Constant Switching Frequency
Analog Brightness Control
Wide Input Voltage Range: 2.5V to 5.5V
Low Profile Packages: <1 mm Height
– 10 Bump DSBGA
– 16 Pin WQFN
APPLICATIONS
•
•
Dual Display Backlighting in Portable devices
Cellular Phones and PDAs
DESCRIPTION
The LM3503 is a white LED driver for lighting applications. For dual display backlighting applications, the
LM3503 provides a complete solution. The LM3503 contains two internal white LED current bypass FET (Field
Effect Transistor) switches. The white LED current can be adjusted with a DC voltage from a digital to analog
converter or RC filtered PWM (pulse-width-modulated) signal at the Cntrl pin.
With no external compensation, cycle-by-cycle current limit, output over-voltage protection, input under-voltage
protection, and dynamic white LED current control capability, the LM3503 offers superior performance over other
step-up white LED drivers.
Typical Application
L
22 PH
D
MAIN:
2 to 5
LEDs
Sw
CIN
+
VSUPPLY
4.7 PF
VOUT1
VIN
VOUT2
Cntrl
COUT
-
LM3503-44
En1
1 PF
Fb
En2
AGND
PGND
SUB:
2 to 5
LEDs
Logic
Voltage
Signal
Inputs
R1
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2006, Texas Instruments Incorporated
LM3503
SNVS329D – JULY 2005 – REVISED AUGUST 2006
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Connection Diagram
4
A2
A1
3
2
1
A3
B1
B3
C1
C3
D1
D3
5
16
6
15
7
14
8
13
9
10
11
12
D2
Figure 1. 10-Bump Thin DSBGA Package
(YPA0010) (Top View)
Figure 2. 16-Lead Thin WQFN Package
(RGH0016A) (Top View)
PIN DESCRIPTIONS
Bump #
Pin #
Name
A1
9
Cntrl
Description
B1
7
Fb
C1
6
VOUT2
Drain Connections of the NMOS and PMOS Field Effect Transistor (FET) Switches (Figure 3: N2 and
P1). Connect 100nF at VOUT2 node if VOUT2 is not used
D1
4
VOUT1
Over-Voltage Protection (OVP) and Source Connection of the PMOS FET Switch (Figure 3: P1)
D2
2 and 3
Sw
D3
15 and 16
Pgnd
Power Ground Connection
C3
14
Agnd
Analog Ground Connection
B3
13
VIN
Input Voltage Connection
A3
12
En2
NMOS FET Switch Control Connection
A2
10
En1
PMOS FET Switch Control Connection
1
NC
No Connection
5
NC
No Connection
8
NC
No Connection
11
NC
No Connection
DAP
DAP
White LED Current Control Connection
Feedback Voltage Connection
Drain Connection of the Power NMOS Switch (Figure 3: N1)
Die Attach Pad (DAP), to be soldered to the printed circuit board’s ground plane for enhanced
thermal dissipation.
Cntrl (Bump A1): White LED current control pin. Use this pin to control the feedback voltage with an external
DC voltage.
Fb (Bump B1):Output voltage feedback connection.
VOUT2 (Bump C1):Drain connections of the internal PMOS and NMOS FET switches (Figure 3: P1 and N2). It is
recommended to connect 100nF at VOUT2 if VOUT2 is not used for LM3503-35V & LM3503-44V versions.
VOUT1(Bump D1):
Source connection of the internal PMOS FET switch (Figure 3: P1) and OVP sensing node. The output capacitor
must be connected as close to the device as possible, between the VOUT1 pin and ground plane. Also connect
the Schottky diode as close as possible to the VOUT1 pin to minimize trace resistance and EMI radiation.
Sw (Bump D2):
Drain connection of the internal power NMOS FET switch (Figure 3: N1). Minimize the metal trace length and
maximize the metal trace width connected to this pin to reduce EMI radiation and trace resistance.
Pgnd (Bump D3): Power ground pin. Connect directly to the ground plane.
Agnd (Bump C3):Analog ground pin. Connect the analog ground pin directly to the Pgnd pin.
2
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VIN (Bump B3): Input voltage connection pin. The CIN capacitor should be as close to the device as possible,
between the VIN pin and ground plane.
En2 (Bump A3): Enable pin for the internal NMOS FET switch (Figure 3: N2) during device operation. When
VEn2 is ≥ 1.4V, the internal NMOS FET switch turns off and the SUB display is turned on. The En2 pin has an
internal pull down circuit, thus the internal NMOS FET switch is normally in the on state of operation with the
SUB display turned off. When VEn2 is ≤ 0.3V, the internal NMOS FET switch turns on and the SUB display is
turned off. If both VEn1 and VEn2 are ≤ 0.3V the LM3503 will shutdown. If VOUT2 is not used, En2 must be floating
or grounded and En1 used to enable the device.
En1 (Bump A2): Enable pin for the internal PMOS FET switch (Figure 3: P1) during device operation. When
VEn1 is ≤ 0.3V, the internal PMOS FET switch turns on and the MAIN display is turned off. When VEn1 is ≥ 1.4V,
the internal PMOS FET switch turns off and the MAIN display is turned on. If both VEn1 and VEn2 are ≤ 0.3V the
LM3503 will shutdown. The En1 pin has an internal pull down circuit, thus the internal PMOS FET switch is
normally in the on state of operation with the MAIN display turned off. If VOUT2 is not used, En2 must be grounded
and En1 use to enable the device.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
−0.3V to +5.5V
VIN Pin
Sw Pin
−0.3V to +48V
Fb Pin
−0.3V to +5.5V
Cntrl Pin
−0.3V to +5.5V
VOUT1Pin
−0.3V to +48V
VOUT2 Pin
−0.3V to VOUT1
En1
−0.3V to +5.5V
−0.3V to +5.5V
En2
Continuous Power Dissipation
Internally Limited
Maximum Junction Temperature (TJ-MAX)
+150°C
−65°C to +150°C
Storage Temperature Range
ESD Rating (3)
Human Body Model
2 kV
Machine Model
(1)
(2)
(3)
200V
Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical characteristic specifications do not
apply when operating the device outside of its rated operating conditions.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Operating Conditions (1) (2)
Junction Temperature (TJ) Range
−40°C to +125°C
Ambient Temperature (TA) Range
−40°C to +85°C
Supply Voltage, VIN Pin
2.5V to 5.5V
En1 and En2 Pins
0V to 5.5V
Cntrl Pin
0V to 3.5V
(1)
(2)
Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical characteristic specifications do not
apply when operating the device outside of its rated operating conditions.
All voltages are with respect to the potential at the GND pin.
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Thermal Properties (3)
Junction-to-Ambient Thermal Resistance (θJA)
DSBGA Package
65°C/W
WQFN Package
49°C/W
(3)
The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal
resistance, θJA, and the ambient temperature, TA. See Thermal Properties for the thermal resistance. The maximum allowable power
dissipation at any ambient temperature is calculated using: PD(MAX) = (TJ(MAX)–TA)/ θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature. For more information on this topic, please refer to Application Note 1187(An1187):
Leadless Leadframe Package (LLP) and Application Note 1112(AN1112) for DSBGA chip scale package.
Electrical Characteristics (1) (2)
Limits in standard typeface are for TJ = +25°C. Limits in bold typeface apply over the full operating junction temperature
range (−40°C ≤ TJ ≤ +125°C). Unless otherwise specified,VIN = 2.5V.
Symbol
Parameter
Conditions
VIN
Input Voltage
IQ
Non-Switching
Switching
Shutdown
Cntrl = 1.6V
Fb = 0V, Sw Is Floating
En1 = En2 = 0V
VFb
Feedback Voltage
Cntrl = 3.5V
ICL
NMOS Power Switch
Current Limit
16, Fb = 0V
25, Fb = 0V
35, Fb = 0V
44,FB = 0V
IFb
Feedback Pin Output
Bias Current
Fb = 0.25V, Cntrl = 1.6V
FS
Switching Frequency
RDS(ON)
NMOS Power Switch ON ISw = 500 mA (3)
Resistance
(Figure 3: N1)
RPDS(ON)
Min
IPMOS = 20 mA, En1 = 0V, En2 = 1.5V
NMOS ON Resistance
Of VOUT2/Fb Switch
(Figure 3: N2)
INMOS = 20 mA, En1 = 1.5V, En2 = 0V
DMAX
Maximum Duty Cycle
Fb = 0V
ISw
Sw Pin Leakage
Current (4)
Sw = 42V, En1 = En2 =0V
IVOUT1(OFF)
VOUT1 Pin Leakage
Current (4)
VOUT1 = 14V,
VOUT1 = 23V,
VOUT1 = 32V,
VOUT1 = 42V,
VOUT1 Pin Bias
Current (4)
VOUT1 = 14V,
VOUT1 = 23V,
VOUT1 = 32V,
VOUT1 = 42V,
IVOUT2
VOUT2Pin Leakage
Current (4)
Fb = En1 = En2 = 0V, VOUT2 = VOUT1 = 42V
UVP
Under-Voltage
Protection
On Threshold
Off Threshold
IVOUT1(ON)
(1)
(2)
(3)
(4)
4
Max
Units
5.5
V
0.5
1.9
0.1
1
3
3
mA
mA
µA
0.5
0.55
0.6
V
250
400
450
450
400
600
750
750
650
800
1050
1050
mA
64
500
nA
1
1.2
MHz
0.55
1.1
Ω
5
10
Ω
2.5
5
Ω
0.8
PMOS ON Resistance
Of VOUT1/VOUT2 Switch
(Figure 3: P1)
RNDS(ON)
Typ
2.5
90
95
%
0.01
5
µA
En1 = En2 = 0V (16)
En1 = En2 = 0V (25)
En1 = En2 = 0V (35)
En1 = En2 = 0V (44)
0.1
0.1
0.1
0.1
3
3
3
3
µA
En1 = En1 = 1.5V
En1 = En2 = 1.5V
En1 = En2 = 1.5V
En1 = En2 = 1.5V
40
50
50
85
80
100
100
140
µA
0.1
3
µA
2.4
2.3
2.5
(16)
(25)
(35)
(44)
2.2
V
All voltages are with respect to the potential at the GND pin.
Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the
most likely norm.
NMOS Power On Resistance measured at ISW= 250mA for sixteen voltage version.
Current flows into the pin.
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Electrical Characteristics(1)(2) (continued)
Limits in standard typeface are for TJ = +25°C. Limits in bold typeface apply over the full operating junction temperature
range (−40°C ≤ TJ ≤ +125°C). Unless otherwise specified,VIN = 2.5V.
Symbol
OVP
VEn1
Parameter
Over-Voltage
Protection (5)
Conditions
On Threshold (16)
Off Threshold (16)
On Threshold (25)
F Off Threshold (25)
On Threshold (35)
Off Threshold (35)
On Threshold (44)
Off Threshold (44)
Min
Typ
Max
Units
14.5
14.0
22.5
21.5
32.0
31.0
40.5
39.0
15.5
15
24
23
34
33
42
41
16.5
16.0
25.5
24.5
35.0
34.0
43.5
42.0
V
0.8
0.3
PMOS FET Switch and
Device Enabling
Threshold (Figure 3: P1)
Off Threshold
NMOS FET Switch and
Device Enabling
Threshold (Figure 3: N2)
Off Threshold
On Threshold
1.4
VCntrl
VCntrl Range
VIN = 3.6V
0.2
IEn1
En1 Pin Bias Current (6)
En1 = 2.5V
En1 = 0V
7
0.1
14
IEn2
En2 Pin Bias Current (6)
En2 = 2.5V
En2 = 0V
7
0.1
14
ICNTRL
Cntrl Pin Bias Current (6)
Cntrl = 2.5V
8
14
VEn2
(5)
(6)
On Threshold
1.4
V
0.8
0.8
0.3
V
0.8
3.5
V
µA
µA
µA
The on threshold indicates that the LM3503 is no longer switching or regulating LED current, while the off threshold indicates normal
operation.
Current flows into the pin.
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Block Diagram
13
VIN
Sw
2,3
Soft Start
Thermal Shutdown
OVP
Comparator
Current Limit
+
UVP
Reference
Light Load
Reference
Error
Amplifier
Fb
VOUT1
+
-
UVP
Comparator
4
OVP
Reference
+
-
Light Load
Comparator
Current Sense
PWM
Comparator
+
+
P1
N1
Driver Logic
VOUT2
N2
9
Cntrl
6
Oscillator
FET Logic
+
-
Duty Limit
Comparator
Duty Limit
Reference
7
14
15,16
10
AGND
PGND
En1 En2
Fb
12
Figure 3. Block Diagram
Detailed Description of Operation
The LM3503 utilizes an asynchronous current mode pulse-width-modulation (PWM) control scheme to regulate
the feedback voltage over specified load conditions. The DC/DC converter behaves as a controlled current
source for white LED applications. The operation can best be understood by referring to the block diagram in
Figure 3 for the following operational explanation. At the start of each cycle, the oscillator sets the driver logic
and turns on the internal NMOS power device, N1, conducting current through the inductor and reverse biasing
the external diode. The white LED current is supplied by the output capacitor when the internal NMOS power
device, N1, is turned on. The sum of the error amplifier’s output voltage and an internal voltage ramp are
compared with the sensed power NMOS, N1, switch voltage. Once these voltages are equal, the PWM
comparator will then reset the driver logic, thus turning off the internal NMOS power device, N1, and forward
biasing the external diode. The inductor current then flows through the diode to the white LED load and output
capacitor. The inductor current recharges the output capacitor and supplies the current for the white LED load.
The oscillator then sets the driver logic again repeating the process. The output voltage of the error amplifier
controls the current through the inductor. This voltage will increase for larger loads and decrease for smaller
loads limiting the peak current in the inductor and minimizing EMI radiation. The duty limit comparator is always
operational, it prevents the internal NMOS power switch, N1, from being on for more than one oscillator cycle
and conducting large amounts of current. The light load comparator allows the LM3503 to properly regulate
light/small white LED load currents, where regulation becomes difficult for the LM3503’s primary control loop.
Under light load conditions, the LM3503 will enter into a pulse skipping pulse-frequency-mode (PFM) of operation
where the operational frequency will vary with the load. As a result of PFM mode operation, the output voltage
ripple magnitude will significantly increase.
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The LM3503 has two control pins, En1 and En2, used for selecting which segment of a single white LED string
network is active for dual display applications. En1 controls the main display (MAIN) segment of the single string
white LED network between pins VOUT1 and VOUT2. En2 controls the sub display (SUB) segment of the single
string white LED network between the VOUT2 and Fb. If both VEn1 and VEn2 are ≤ 0.3V, the LM3503 will shutdown,
for further description of the En1 and En2 operation, see Figure 33. During shutdown the output capacitor
discharges through the string of white LEDs and feedback resistor to ground. The LED current can be
dynamically controlled by a DC voltage on the Cntrl pin. When VCntrl = 0V the white LED current may not be
equal to zero because of offsets within the LM3503 internal circuitry. To guarantee zero white LED current the
LM3503 must be in shutdown mode operation.
The LM3503 has dedicated protection circuitry active during normal operation to protect the integrated circuit (IC)
and external components. Soft start circuitry is present in the LM3503 to allow for slowly increasing the current
limit to its steady-state value to prevent undesired high inrush current during start up. Thermal shutdown circuitry
turns off the internal NMOS power device, N1, when the internal semiconductor junction temperature reaches
excessive levels. The LM3503 has a under-voltage protection (UVP) comparator that disables the internal NMOS
power device when battery voltages are too low, thus preventing an on state where the internal NMOS power
device conducts large amounts of current. The over-voltage protection (OVP) comparator prevents the output
voltage from increasing beyond the protection limit when the white LED string network is removed or if there is a
white LED failure. OVP allows for the use of low profile ceramic capacitors at the output. The current through the
internal NMOS power device, N1, is monitored to prevent peak inductor currents from damaging the IC. If during
a cycle (cycle=1/switching frequency) the peak inductor current exceeds the current limit for the LM3503, the
internal NMOS power device will be turned off for the remaining duration of that cycle.
En1
En2
Result (See Figure 1 and Figure 2)
0.3V
0.3V
[P1ÆOFF N2ÆOFF N1ÆOFF] or [MAINÆOFF SUBÆOFF N1ÆOFF]
1.4V
0.3V
[P1ÆOFF N2ÆON N1ÆSwitching] or [MAINÆON SUBÆOFF N1ÆSwitching]
0.3V
1.4V
[P1ÆON N2ÆOFF N1ÆSwitching] or [MAINÆOFF SUBÆON N1ÆSwitching]
1.4V
1.4V
[P1ÆOFF N2ÆOFF N1ÆSwitching] or [MAINÆON SUBÆON N1ÆSwitching]
Shutdown
X
Figure 4. Operational Characteristics Table
Typical Performance Characteristics
(See Typical Application Circuit :e L=DO1608C-223 and D=B150-13. Efficiency: η = POUT/ PIN = [(VOUT – VFb ) * IOUT] / [VIN *
IIN]. TA = +25°C, unless otherwise stated.)
Switching Frequency
vs
Temperature
0.600
1.03
0.580
1.02
-40oC
0.560
0.540
25oC
0.520
125oC
0.500
0.480
0.460
1.00
0.99
0.98
0.97
0.96
0.440
0.95
0.420
0.94
0.400
2.5
3.0
3.5
4.0
VIN = 2.5V
1.01
FREQUENCY (MHz)
NON-SWITCHING IQ (mA)
IQ (Non-Switching)
vs
VIN
4.5
5.0
5.5
INPUT VOLTAGE (V)
0.93
-40 -20 0 20 40 60 80 100 120
-30 -10 10 30 50 70 90 110 130
TEMPERATURE (oC)
Figure 5.
Figure 6.
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Typical Performance Characteristics (continued)
(See Typical Application Circuit :e L=DO1608C-223 and D=B150-13. Efficiency: η = POUT/ PIN = [(VOUT – VFb ) * IOUT] / [VIN *
IIN]. TA = +25°C, unless otherwise stated.)
IQ (Switching)
vs
VIN
IQ (Switching)
vs
Temperature
1.95
4.00
VIN = 2.5V
SWITCHING IQ (mA)
SWITCHING IQ (mA)
3.50
-40oC
3.00
125oC
25oC
2.50
1.90
1.85
1.80
2.00
1.50
2.5
3.0
3.5
4.0
4.5
5.0
1.75
-40 -20 0 20 40 60 80 100 120
-30 -10 10 30 50 70 90 110 130
5.5
INPUT VOLTAGE (V)
TEMPERATURE (oC)
Figure 7.
Figure 8.
10 LED Efficiency
vs
LED Current
8 LED Efficiency
vs
LED Current
90
90
VIN = 5.5V
VIN = 5.5V
80
80
EFFICIENCY (%)
EFFICIENCY (%)
70
60
VIN = 4.2V
50
VIN = 3.3V
40
VIN = 3V
30
70
VIN = 4.2V
60
VIN = 3V
50
VIN = 3.3V
40
30
20
VIN = 2.7V
VIN = 2.7V
10
20
0
2
4
6
8
10 12 14 16 18 20
0
2
4
LED CURRENT (mA)
6
8
10 12 14 16 18 20
LED CURRENT (mA)
Figure 9.
Figure 10.
6 LED Efficiency
vs
LED Current
4 LED Efficiency
vs
LED Current
100
90
VIN = 5.5V
VIN = 4.2V
VIN = 5.5V
90
80
EFFICIENCY (%)
EFFICIENCY (%)
80
70
VIN = 4.2V
60
VIN = 3.3V
50
VIN = 3V
40
VIN = 3.3V
60
VIN = 3V
50
40
VIN = 2.7V
30
VIN = 2.7V
30
20
10
20
0
2
4
6
8
0
10 12 14 16 18 20
2
4
6
8
10 12 14 16 18 20
LED CURRENT (mA)
LED CURRENT (mA)
Figure 11.
8
70
Figure 12.
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Typical Performance Characteristics (continued)
(See Typical Application Circuit :e L=DO1608C-223 and D=B150-13. Efficiency: η = POUT/ PIN = [(VOUT – VFb ) * IOUT] / [VIN *
IIN]. TA = +25°C, unless otherwise stated.)
Cntrl Pin Current
vs
Cntrl Pin Voltage
Maximum Duty Cycle
vs
Temperature
14
98
VIN = 2.5
MAX DUTY CYCLE (%)
CNTRL PIN CURRENT (PA)
12
10
-40oC
8
25oC
6
125oC
4
97
96
95
2
0
0.0
0.5
1.0
1.5
2.0
2.5
94
-40 -20 0 20 40 60 80 100 120
-30 -10 10 30 50 70 90 110 130
3.0
CNTRL PIN VOLTAGE (V)
TEMPERATURE (oC)
Figure 13.
Figure 14.
En1 Pin Current
vs
En1 Pin Voltage
En2 Pin Current
vs
En2 Pin Voltage
30
18
16
EN2 PIN CURRENT (PA)
EN1 PIN CURRENT (PA)
25
-40oC
20
15
25oC
10
125oC
14
-40oC
12
25oC
10
8
125oC
6
4
5
2
0
0.0
1.0
3.0
4.0
5.0
1.0
2.0
3.0
4.0
5.0
EN1 PIN VOLTAGE (V)
EN2 PIN VOLTAGE (V)
Figure 15.
Figure 16.
VOUT1 Pin Current
vs
VOUT1Pin Voltage
Power NMOS RDS(ON) (Figure 3: N1)
vs
VIN
1000
INMOS = 400 mA
140
POWER NMOS RDS(ON) (m:)
VOUT1 PIN BIAS CURRENT (PA)
160
2.0
0
0.0
120
-40oC
100
25oC
80
60
125oC
40
20
8
16
24
32
40
48
VOUT1 PIN VOLTAGE (V)
125oC
800
700
600
25oC
500
-40oC
400
300
2.5
0
0
900
3.0
3.5
4.0
4.5
5.0
5.5
INPUT VOLTAGE (V)
Figure 17.
Figure 18.
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Typical Performance Characteristics (continued)
(See Typical Application Circuit :e L=DO1608C-223 and D=B150-13. Efficiency: η = POUT/ PIN = [(VOUT – VFb ) * IOUT] / [VIN *
IIN]. TA = +25°C, unless otherwise stated.)
3.50
NMOS RDS(ON) (Figure 3: N2)
vs
VIN
PMOS RDS(ON) (Figure 3: P1)
vs
VIN
10
INMOS = 20 mA
IPMOS = 20 mA
PMOS SWITCH RDS(ON) (:)
NMOS SWITCH RDS(ON) (:)
3.00
125oC
2.50
2.00
25oC
1.50
o
-40 C
1.00
0.50
0.00
2.5
9
8
125oC
7
6
25oC
5
-40oC
4
3.0
3.5
4.0
4.5
5.0
3
2.0
5.5
12.0
0.28
Feedback Voltage
vs
Cntrl Pin Voltage
Current Limit (LM3503-16)
vs
Temperature
440
-16 CURRENT LIMIT (mA)
FEEDBACK VOLTAGE (V)
420
VIN = 5.5V
0.16
0.12
VIN = 2.7V
0.08
VIN = 2.5V
400
VIN = 5.5V
380
360
VIN = 7.0V
340
0.04
0.00
0.3
0.5
0.7
0.9
1.1
1.3
320
-40 -25 -10
1.5
20
35
50
65
Figure 22.
Current Limit (LM3503-16)
vs
VIN
Current Limit (LM3503-25)
vs
Temperature
620
600
-25 CURRENT LIMIT (mA)
440
T = 85oC
420
400
80
TEMPERATURE ( C)
Figure 21.
460
-16 CURRENT LIMIT (mA)
5
o
CNTRL VOLTAGE (V)
T = 25oC
380
360
T = -40oC
340
VIN = 2.5V
580
560
VIN = 5.5V
540
520
500
VIN = 7.0V
480
460
440
3.0
3.5
4.0
4.5
5.0
5.5
INPUT VOLTAGE (V)
420
-40 -25
-10
5
20
35
50
65
80
TEMPERATURE (oC)
Figure 23.
10
42.0
Figure 20.
0.20
320
2.5
32.0
Figure 19.
0.24
480
22.0
VOUT1 PIN VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 24.
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Typical Performance Characteristics (continued)
(See Typical Application Circuit :e L=DO1608C-223 and D=B150-13. Efficiency: η = POUT/ PIN = [(VOUT – VFb ) * IOUT] / [VIN *
IIN]. TA = +25°C, unless otherwise stated.)
Current Limit (LM3503-25)
vs
VIN
Current Limit (LM3503-35/44)
vs
Temperature
780
620
T = 85oC
770
-35/44 CURRENT LIMIT (mA)
-25 CURRENT LIMIT (mA)
600
580
T = 25oC
560
540
520
500
T = -40oC
480
VIN = 7.0V
760
750
740
730
720
VIN = 2.5V
710
460
700
440
2.5
690
-40 -25 -10
3.0
3.5
4.0
4.5
5.0
5.5
5
20
35
50
65
80
TEMPERATURE (oC)
INPUT VOLTAGE (V)
Figure 25.
Figure 26.
Current Limit (LM3503-35/44)
vs
VIN
Feedback Voltage (VCntrl = 0.8V)
vs
Temp
780
0.127
770
0.126
760
FEEDBACK VOLTAGE (V)
CURRENT LIMIT (mA)
CNTRL = 0.8V
85oC
750
740
25oC
-40oC
730
720
710
VIN = 5.5V
0.123
0.122
VIN = 2.7V
0.121
0.120
700
690
2.5
0.125
0.124
3.0
3.5
4.0
4.5
5.0
5.5
0.119
-40
-20
-30
INPUT VOLTAGE (V)
0
-10
20
10
40
30
60
50
80
70
TEMPERATURE (oC)
Figure 27.
Figure 28.
Feedback Voltage (VCntrl = 1.6V)
vs
Temp
VIN = 3.6V at 15mA & 4 Leds
0.257
CNTRL = 1.6V
FEEDBACK VOLTAGE (V)
0.256
0.255
VIN = 5.5V
0.254
0.253
0.252
0.251
VIN = 2.7V
0.250
0.249
-40
-20
-30
0
-10
20
10
40
30
60
50
80
70
TEMPERATURE (oC)
Figure 29.
Figure 30.
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Typical Performance Characteristics (continued)
(See Typical Application Circuit :e L=DO1608C-223 and D=B150-13. Efficiency: η = POUT/ PIN = [(VOUT – VFb ) * IOUT] / [VIN *
IIN]. TA = +25°C, unless otherwise stated.)
Dimming Duty Cycle vs LED Current
VIN=3.6V, 2LEDs on Main & Sub Display
VIN = 3.6V at 15mA & 2 Leds
40.00
LED CURRENT (mA)
35.00
30.00
50 kHz
25.00
10 kHz
20.00
1 kHz
500 Hz
15.00
10.00
200 Hz
5.00
0.00
10
20
30
40
50
60
70
80
90
DUTY CYCLE (%)
Figure 31.
12
Figure 32.
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APPLICATION INFORMATION
WHITE LED CURRENT SETTING
The white LED current is controlled by a DC voltage at the Cntrl pin.
The relationship between the Cntrl pin voltage and Fb pin voltage can be computed with the following:
VFB = (0.156) x (VCntrl)
•
•
VCntrl: Cntrl Pin Voltage. Voltage Range: 0.2V ≤ VCntrl ≤ 3.5V.
VFb: Feedback Pin Voltage.
(1)
LED CURRENT
The LED current is set using the following equation:
ILED =
VFb
R1
(2)
To determine the maximum output current capability of the device, it is best to estimate using equations on page
16 and the minimum peak current limit of the device (see electrical table). Note the current capability will be
higher with less LEDs in the application.
WHITE LED DIMMING
PWM Signal
Sw
VOUT1
VIN
X
R
Y
C
Cntrl
VOUT2
LM3503
En1
Fb
En2
AGND
PGND
R1
Figure 33. If VOUT2 is not used, En2 must be grounded
Aside from varying the DC voltage at the Cntrl pin, white LED dimming can be accomplished through the RC
filtering of a PWM signal. The PWM signal frequency should be at least a decade greater than the RC filter
bandwidth. WHITE LED DIMMING is how the LM3503 should be wired for PWM filtered white LED dimming
functionality. When using PWM dimming, it is recommended to add 1-2ms delay between the Cntrl signal and the
main Enable sginal (En1) to allow time for the output to discharge. This will prevent potential flickering especially
if the Sub display is compose of 2 LEDs or less.
The equations below are guidelines for choosing the correct RC filter values in relation to the PWM signal
frequency.
Equation:
FRC =
1
2xSxRxC
(3)
Equation:
FPWM > 10 x FRC
(4)
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FRC:
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RC Filter Bandwidth Cutoff Frequency.
FPWM: PWM Signal Frequency.
R:
Chosen Filter Resistor.
C:
Chosen Filter Capacitor.
For example, using the above equations to determine the proper RC values. Assume the following condition:VIN=
3.6V, C=0.01µF and FPWM = 500Hz, then FRC= 50Hz by relation to equation 2. By rearranging equation 1 to solve
for R; R = 318.5K ohms (standard value, R = 316K).
PWM Dimming Duty Cycle vs. LED Current
The results are based on the 2LEDs on Main display and 2LEDs on Sub display
Duty
200Hz
500Hz
1KHz
10KHz
50KHz
100kHz
(%)
R = 787k ohms
R =316k ohms
R = 158kohms
R=16.2k ohms
R=3.16k ohms
R=1.62k ohms
10
0.78mA
1.59mA
2.23mA
3.42mA
3.58mA
3.61mA
20
1.85mA
3.46mA
4.78mA
7.09mA
7.41mA
7.48mA
30
2.88mA
5.35mA
7.33mA
10.77mA
11.25mA
11.34mA
40
3.96mA
7.24mA
9.88mA
14.48mA
15.12mA
15.24mA
50
5.05mA
9.12mA
12.45mA
19.1mA
19.06mA
19.16mA
60
6.08mA
11.03mA
15.03mA
21.86mA
22.98mA
23.10mA
70
7.13mA
12.94mA
17.61mA
25.71mA
26.9mA
27.05mA
80
8.17mA
14.83mA
20.20mA
29.53mA
30.83mA
31.00mA
90
9.24mA
16.73mA
22.79mA
33.32mA
34.78mA
35.00mA
Inductor Current
tON = DTS
(Vin - Vout)/L
Vin/L
IL (avg)
'iL
Time
TS
Figure 34. Inductor Current Waveform
CONTINUOUS AND DISCONTINUOUS MODES OF OPERATION
Since the LM3503 is a constant frequency pulse-width-modulated step-up regulator, care must be taken to make
sure the maximum duty cycle specification is not violated. The duty cycle equation depends on which mode of
operation the LM3503 is in. The two operational modes of the LM3503 are continuous conduction mode (CCM)
and discontinuous conduction mode (DCM). Continuous conduction mode refers to the mode of operation where
during the switching cycle, the inductor current never goes to and stays at zero for any significant amount of time
during the switching cycle. Discontinuous conduction mode refers to the mode of operation where during the
switching cycle, the inductor current goes to and stays at zero for a significant amount of time during the
switching cycle. Figure 34 illustrates the threshold between CCM and DCM operation. In Figure 34 the inductor
current is right on the CCM/DCM operational threshold. Using this as a reference, a factor can be introduced to
calculate when a particular application is in CCM or DCM operation. R is a CCM/DCM factor we can use to
compute which mode of operation a particular application is in. If R is ≥ 1, then the application is operating in
CCM. Conversely, if R is < 1, the application is operating in DCM. The R factor inequalities are a result of the
components that make up the R factor. From Figure 34, the R factor is equal to the average inductor current,
IL(avg), divided by half the inductor ripple current, ΔiL. Using Figure 34, the following equation can be used to
compute R factor:
14
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R=
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2 * IL (avg)
'iL
IL (avg) =
'iL =
(5)
[IOUT]
[(1-D) * Eff]
(6)
[VIN * D]
[L * Fs]
(7)
2
[2 * IOUT * L * Fs * (VOUT) ]
R=
2
[(VIN) * Eff * (VOUT - VIN)]
VIN:
(8)
Input Voltage.
VOUT: Output Voltage.
Eff:
Efficiency of the LM3503.
Fs:
Switching Frequency.
IOUT: White LED Current/Load Current.
L:
Inductance Magnitude/Inductor Value.
D:
Duty Cycle for CCM operation.
ΔiL:
Inductor Ripple Current.
IL(avg): Average Inductor Current.
For CCM operation, the duty cycle can be computed with:
tON
D=
TS
(9)
[VOUT - VIN]
D=
D:
[VOUT]
(10)
Duty Cycle for CCM Operation.
VOUT: Output Voltage.
VIN : Input Voltage.
For DCM operation, the duty cycle can be computed with:
tON
D=
TS
(11)
[2 * IOUT * L * (VOUT - VIN) * Fs]
D=
D:
2
[(VIN) * Eff]
(12)
Duty Cycle for DCM Operation.
VOUT: Output Voltage.
VIN : Input Voltage.
IOUT: White LED Current/Load Current.
Fs:
Switching Frequency.
L:
Inductor Value/Inductance Magnitude.
INDUCTOR SELECTION
In order to maintain inductance, an inductor used with the LM3503 should have a saturation current rating larger
than the peak inductor current of the particular application. Inductors with low DCR values contribute decreased
power losses and increased efficiency. The peak inductor current can be computed for both modes of operation:
CCM and DCM.
The cycle-by-cycle peak inductor current for CCM operation can be computed with:
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IPeak
IPeak
| IL (avg) +
|
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'iL
(13)
2
[IOUT]
[(1 - D) * Eff]
+
[VIN * D]
[2 * L * Fs]
VIN:
Input Voltage.
Eff:
Efficiency of the LM3503.
Fs:
Switching Frequency.
(14)
IOUT: White LED Current/Load Current.
L:
Inductance Magnitude/Inductor Value.
D:
Duty Cycle for CCM Operation.
IPEAK: Peak Inductor Current.
ΔiL:
Inductor Ripple Current.
IL(avg): Average Inductor Current.
The cycle-by-cycle peak inductor current for DCM operation can be computed with:
IPeak
|
[VIN * D]
[L * Fs]
(15)
VIN:
Input Voltage.
Fs:
Switching Frequency.
L:
Inductance Magnitude/Inductor Value.
D:
Duty Cycle for DCM Operation.
IPEAK: Peak Inductor Current.
The minimum inductance magnitude/inductor value for the LM3503 can be calculated using the following, which
is only valid when the duty cycle is > 0.5:
[VIN * RDS(ON) * ((D/'¶) - 1)]
L>
[1.562 * Fs]
D:
Duty Cycle.
D’:
1-D.
(16)
RDS(ON): NMOS Power Switch ON Resistance.
Fs:
Switching Frequency.
VIN:
Input Voltage.
L:
Inductance Magnitude/Inductor Value.
This equation gives the value required to prevent subharmonic oscillations. The result of this equation and the
inductor ripple currents should be accounted for when choosing an inductor value.
Some recommended Inductor manufactures included but are not limited to:
Coilcraft
16
DO1608C-223
DT1608C-223
www.coilcraft.com
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CAPACITOR SELECTION
Multilayer ceramic capacitors are the best choice for use with the LM3503. Multilayer ceramic capacitors have
the lowest equivalent series resistance (ESR). Applied voltage or DC bias, temperature, dielectric material type
(X7R, X5R, Y5V, etc), and manufacturer component tolerance have an affect on the true or effective capacitance
of a ceramic capacitor. Be aware of how your application will affect a particular ceramic capacitor by analyzing
the aforementioned factors of your application. Before selecting a capacitor always consult the capacitor
manufacturer’s data curves to verify the effective or true capacitance of the capacitor in your application.
INPUT CAPACITOR SELECTION
The input capacitor serves as an energy reservoir for the inductor. In addition to acting as an energy reservoir for
the inductor the input capacitor is necessary for the reduction in input voltage ripple and noise experienced by
the LM3503. The reduction in input voltage ripple and noise helps ensure the LM3503’s proper operation, and
reduces the effect of the LM3503 on other devices sharing the same supply voltage. To ensure low input voltage
ripple, the input capacitor must have an extremely low ESR. As a result of the low input voltage ripple
requirement multilayer ceramic capacitors are the best choice. A minimum capacitance of 2.0 µF is required for
normal operation, so consult the capacitor manufacturer’s data curves to verify whether the minimum
capacitance requirement is going to be achieved for a particular application.
OUTPUT CAPACITOR SELECTION
The output capacitor serves as an energy reservoir for the white LED load when the internal power FET switch
(Figure 3: N1) is on or conducting current. The requirements for the output capacitor must include worst case
operation such as when the load opens up and the LM3503 operates in over-voltage protection (OVP) mode
operation. A minimum capacitance of 0.5 µF is required to ensure normal operation. Consult the capacitor
manufacturer’s data curves to verify whether the minimum capacitance requirement is going to be achieved for a
particular application.
Some recommended capacitor manufacturers included but are not limited to:
Taiyo-Yuden
GMK212BJ105MD (0805/35V)
www.t-yuden.com
muRata
GRM40-035X7R105K (0805/50V)
www.murata.com
TDK
C3216X7R1H105KT (1206/50V)
www.tdktca.com
C3216X7R1C475K (1206/16V)
AVX
08053D105MAT (0805/25V)
www.avxcorp.com
08056D475KAT (0805/6.3V)
1206ZD475MAT (1206/10V)
DIODE SELECTION
To maintain high efficiency it is recommended that the average current rating (IF or IO) of the selected diode
should be larger than the peak inductor current (ILpeak). At the minimum the average current rating of the diode
should be larger than the maximum LED current. To maintain diode integrity the peak repetitive forward current
(IFRM) must be greater than or equal to the peak inductor current (ILpeak). Diodes with low forward voltage ratings
(VF) and low junction capacitance magnitudes (CJ or CT or CD) are conducive to high efficiency. The chosen
diode must have a reverse breakdown voltage rating (VR and/or VRRM) that is larger than the output voltage
(VOUT). No matter what type of diode is chosen, Schottky or not, certain selection criteria must be followed:
1. VR and VRRM > VOUT
2. IF or IO ≥ ILOAD or IOUT
3. IFRM ≥ ILpeak
Some recommended diode manufacturers included but are not limited to:
Vishay
SS12(1A/20V)
www.vishay.com
SS14(1A/40V)
SS16(1A/60V)
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On Semiconductor
www.ti.com
MBRM120E (1A/20V)
www.onsemi.com
MBRS1540T3 (1.5A/40V)
MBR240LT (2A/40V)
Central Semiconductor
CMSH1-40M (1A/40V)
www.centralsemi.com
SHUTDOWN AND START-UP
On startup, the LM3503 contains special circuitry that limits the peak inductor current which prevents large
current spikes from loading the battery or power supply. The LM3503 is shutdown when both En1 and En2
signals are less than 0.3V. During shutdown the output voltage is a diode drop below the supply voltage. When
shutdown, the softstart is reset to prevent inrush current at the next startup.
THERMAL SHUTDOWN
The LM3503 stops regulating when the internal semiconductor junction temperature reaches approximately
140°C. The internal thermal shutdown has approximately 20°C of hysteresis which results in the LM3503 turning
back on when the internal semiconductor junction temperature reaches 120°C. When the thermal shutdown
temperature is reached, the softstart is reset to prevent inrush current when the die temperature cools.
UNDER VOLTAGE PROTECTION
The LM3503 contains protection circuitry to prevent operation for low input supply voltages. When Vin drops
below 2.3V, typically, the LM3503 will no longer regulate. In this mode, the output voltage will be one diode drop
below Vin and the softstart will be reset. When Vin increases above 2.4V, typically, the device will begin
regulating again.
OVER VOLTAGE PROTECTION
The LM3503 contains dedicated ciruitry for monitoring the output voltage. In the event that the LED network is
disconnected from the LM3503, the output voltage will increase and be limited to 15.5V(typ.) for the 16V version,
24V(typ.) for the 25V version, 34V(typ.) for 35V version and 42V(typ.) for the 44V version. (see electrical table for
more details). In the event that the network is reconnected regulation will resume at the appropriate output
voltage.
LAYOUT CONSIDERATIONS
All components, except for the white LEDs, must be placed as close as possible to the LM3503. The die attach
pad (DAP) must be soldered to the ground plane.
The input bypass capacitor CIN, as shown in the Typical Application Circuit, must be placed close to the IC and
connect between the VIN and Pgnd pins. This will reduce copper trace resistance which effects input voltage
ripple of the IC. For additional input voltage filtering, a 100 nF bypass capacitor can be placed in parallel with CIN
to shunt any high frequency noise to ground. The output capacitor, COUT, must be placed close to the IC and be
connected between the VOUT1 and Pgnd pins. Any copper trace connections for the COUT capacitor can increase
the series resistance, which directly effects output voltage ripple and efficiency. The current setting resistor, R1,
should be kept close to the Fb pin to minimize copper trace connections that can inject noise into the system.
The ground connection for the current setting resistor network should connect directly to the Pgnd pin. The Agnd
pin should be tied directly to the Pgnd pin. Trace connections made to the inductor should be minimized to
reduce power dissipation and increase overall efficiency while reducing EMI radiation. For more details regarding
layout guidelines for switching regulators, refer to Applications Note AN-1149.
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PACKAGE OPTION ADDENDUM
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9-Mar-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM3503ITL-16/NOPB
ACTIVE
DSBGA
YPA
10
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
SBHB
LM3503ITL-25/NOPB
ACTIVE
DSBGA
YPA
10
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
SBJB
LM3503ITL-35/NOPB
ACTIVE
DSBGA
YPA
10
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
SBKB
LM3503ITL-44/NOPB
ACTIVE
DSBGA
YPA
10
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
SDNB
LM3503ITLX-16/NOPB
ACTIVE
DSBGA
YPA
10
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
SBHB
LM3503ITLX-25/NOPB
ACTIVE
DSBGA
YPA
10
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
SBJB
LM3503ITLX-35/NOPB
ACTIVE
DSBGA
YPA
10
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
SBKB
LM3503ITLX-44/NOPB
ACTIVE
DSBGA
YPA
10
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
SDNB
LM3503SQ-16
ACTIVE
WQFN
RGH
16
1000
TBD
Call TI
Call TI
-40 to 85
L00045B
LM3503SQ-16/NOPB
ACTIVE
WQFN
RGH
16
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L00045B
LM3503SQ-25
ACTIVE
WQFN
RGH
16
1000
TBD
Call TI
Call TI
-40 to 85
L00046B
LM3503SQ-25/NOPB
ACTIVE
WQFN
RGH
16
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L00046B
LM3503SQ-35
ACTIVE
WQFN
RGH
16
1000
TBD
Call TI
Call TI
-40 to 85
L00047B
LM3503SQ-35/NOPB
ACTIVE
WQFN
RGH
16
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L00047B
LM3503SQ-44
ACTIVE
WQFN
RGH
16
1000
TBD
Call TI
Call TI
-40 to 85
L00053B
LM3503SQ-44/NOPB
ACTIVE
WQFN
RGH
16
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L00053B
LM3503SQX-16
ACTIVE
WQFN
RGH
16
4500
TBD
Call TI
Call TI
-40 to 85
L00045B
LM3503SQX-16/NOPB
ACTIVE
WQFN
RGH
16
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L00045B
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
9-Mar-2013
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM3503SQX-25
ACTIVE
WQFN
RGH
16
4500
TBD
Call TI
Call TI
-40 to 85
L00046B
LM3503SQX-25/NOPB
ACTIVE
WQFN
RGH
16
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L00046B
LM3503SQX-35
ACTIVE
WQFN
RGH
16
4500
TBD
Call TI
Call TI
-40 to 85
L00047B
LM3503SQX-35/NOPB
ACTIVE
WQFN
RGH
16
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L00047B
LM3503SQX-44
ACTIVE
WQFN
RGH
16
4500
TBD
Call TI
Call TI
-40 to 85
L00053B
LM3503SQX-44/NOPB
ACTIVE
WQFN
RGH
16
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
L00053B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Nov-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LM3503ITL-16/NOPB
DSBGA
YPA
10
250
178.0
8.4
LM3503ITL-25/NOPB
DSBGA
YPA
10
250
178.0
LM3503ITL-35/NOPB
DSBGA
YPA
10
250
178.0
LM3503ITL-44/NOPB
DSBGA
YPA
10
250
LM3503ITLX-16/NOPB
DSBGA
YPA
10
LM3503ITLX-25/NOPB
DSBGA
YPA
LM3503ITLX-35/NOPB
DSBGA
YPA
LM3503ITLX-44/NOPB
DSBGA
W
Pin1
(mm) Quadrant
2.03
2.21
0.76
4.0
8.0
Q1
8.4
2.03
2.21
0.76
4.0
8.0
Q1
8.4
2.03
2.21
0.76
4.0
8.0
Q1
178.0
8.4
2.03
2.21
0.76
4.0
8.0
Q1
3000
178.0
8.4
2.03
2.21
0.76
4.0
8.0
Q1
10
3000
178.0
8.4
2.03
2.21
0.76
4.0
8.0
Q1
10
3000
178.0
8.4
2.03
2.21
0.76
4.0
8.0
Q1
YPA
10
3000
178.0
8.4
2.03
2.21
0.76
4.0
8.0
Q1
LM3503SQ-16
WQFN
RGH
16
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM3503SQ-16/NOPB
WQFN
RGH
16
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM3503SQ-25
WQFN
RGH
16
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM3503SQ-25/NOPB
WQFN
RGH
16
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM3503SQ-35
WQFN
RGH
16
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM3503SQ-35/NOPB
WQFN
RGH
16
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM3503SQ-44
WQFN
RGH
16
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM3503SQ-44/NOPB
WQFN
RGH
16
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM3503SQX-16
WQFN
RGH
16
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM3503SQX-16/NOPB
WQFN
RGH
16
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Nov-2012
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM3503SQX-25
WQFN
RGH
16
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM3503SQX-25/NOPB
WQFN
RGH
16
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM3503SQX-35
WQFN
RGH
16
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM3503SQX-35/NOPB
WQFN
RGH
16
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM3503SQX-44
WQFN
RGH
16
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
LM3503SQX-44/NOPB
WQFN
RGH
16
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM3503ITL-16/NOPB
DSBGA
YPA
10
250
203.0
190.0
41.0
LM3503ITL-25/NOPB
DSBGA
YPA
10
250
203.0
190.0
41.0
LM3503ITL-35/NOPB
DSBGA
YPA
10
250
203.0
190.0
41.0
LM3503ITL-44/NOPB
DSBGA
YPA
10
250
203.0
190.0
41.0
LM3503ITLX-16/NOPB
DSBGA
YPA
10
3000
206.0
191.0
90.0
LM3503ITLX-25/NOPB
DSBGA
YPA
10
3000
206.0
191.0
90.0
LM3503ITLX-35/NOPB
DSBGA
YPA
10
3000
206.0
191.0
90.0
LM3503ITLX-44/NOPB
DSBGA
YPA
10
3000
206.0
191.0
90.0
LM3503SQ-16
WQFN
RGH
16
1000
203.0
190.0
41.0
LM3503SQ-16/NOPB
WQFN
RGH
16
1000
203.0
190.0
41.0
LM3503SQ-25
WQFN
RGH
16
1000
203.0
190.0
41.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Nov-2012
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM3503SQ-25/NOPB
WQFN
RGH
16
1000
203.0
190.0
41.0
LM3503SQ-35
WQFN
RGH
16
1000
203.0
190.0
41.0
LM3503SQ-35/NOPB
WQFN
RGH
16
1000
203.0
190.0
41.0
LM3503SQ-44
WQFN
RGH
16
1000
203.0
190.0
41.0
LM3503SQ-44/NOPB
WQFN
RGH
16
1000
203.0
190.0
41.0
LM3503SQX-16
WQFN
RGH
16
4500
349.0
337.0
45.0
LM3503SQX-16/NOPB
WQFN
RGH
16
4500
349.0
337.0
45.0
LM3503SQX-25
WQFN
RGH
16
4500
349.0
337.0
45.0
LM3503SQX-25/NOPB
WQFN
RGH
16
4500
349.0
337.0
45.0
LM3503SQX-35
WQFN
RGH
16
4500
349.0
337.0
45.0
LM3503SQX-35/NOPB
WQFN
RGH
16
4500
349.0
337.0
45.0
LM3503SQX-44
WQFN
RGH
16
4500
349.0
337.0
45.0
LM3503SQX-44/NOPB
WQFN
RGH
16
4500
349.0
337.0
45.0
Pack Materials-Page 3
MECHANICAL DATA
RGH0016A
SQA16A (Rev A)
www.ti.com
MECHANICAL DATA
YPA0010
0.600
±0.075
D
E
TLP10XXX (Rev D)
D: Max = 2.144 mm, Min =2.043 mm
E: Max = 1.966 mm, Min =1.865 mm
4215069/A
NOTES:
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
www.ti.com
12/12
IMPORTANT NOTICE
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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