HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6210-A Issued Date : 1998.02.01 Revised Date : 2000.09.15 Page No. : 1/4 H2N5087 PNP EPITAXIAL PLANAR TRANSISTOR Description This device was designed for low noise,high gain,general purpose amplifier applications for 1uA to 25mA collector current. Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ............................................................................... 625 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ....................................................................................... -50 V VCEO Collector to Emitter Voltage .................................................................................... -50 V VEBO Emitter to Base Voltage ............................................................................................ -3 V IC Collector Current ......................................................................................................... -50mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) VBE(on) *hFE1 *hFE2 *hFE3 fT Cob Min. -50 -50 -3 250 250 250 40 - Typ. - Max. -50 -50 -0.3 -0.85 800 4.0 Unit V V V nA nA V V MHz pF Test Conditions IC=-100uA IC=-1mA IE=-10uA VCB=-35V VEB=-3V IC=-10mA, IB=-1mA IC=-10mA, IB=-5V VCE=-5V, IC=-0.1mA VCE=-5V, IC=-1mA VCE=-5V, IC=-10mA IC=-0.5mA, VCE=-5V, f=100MHz VCB=-5V, f=1MHz *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% HSMC Product Specification HI-SINCERITY Spec. No. : HE6210-A Issued Date : 1998.02.01 Revised Date : 2000.09.15 Page No. : 2/4 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 1000 Saturation Voltage (m V) hFE 1000 hFE @ VCE=5V 100 VCE(sat) @ IC=10IB 10 100 0.1 1 10 1 100 10 C ollectorC urrent(m A) 100 C ollectorC urrent(m A) On Voltage & Collector Current Cutoff Frequency & Collector Current 1000 1000 O n Voltage (m V) C utoffFrequency (M Hz) VBE(on) @ VCE=5V 100 fT @ VCE=5V 100 10 0.1 1 10 0.1 100 1 C ollectorC urrent(m A) 10 100 C ollectorC urrent(m A) Capacitance & Reverse-Biased Voltage Safe Operation Area 10 10 C ollectorC urrent(A) Capacitance (pF) PT=1ms Cob PT=100ms 1 PT=1s 0.1 0.01 1 1 10 Reverse-Biased Voltage (V) 100 1 10 100 Forward B iased Voltage (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6210-A Issued Date : 1998.02.01 Revised Date : 2000.09.15 Page No. : 3/4 PD-Ta 700 Power Dissipation-PD(mW) 600 500 400 300 200 100 0 0 20 40 60 80 100 120 140 160 o Ambient Temperature-Ta( C) HSMC Product Specification HI-SINCERITY Spec. No. : HE6210-A Issued Date : 1998.02.01 Revised Date : 2000.09.15 Page No. : 4/4 MICROELECTRONICS CORP. TO-92 Dimension α2 A Marking : HSMC Logo B 1 2 Product Series Part Number 3 Date Code Rank α3 C Laser Mark HSMC Logo Product Series D Part Number H I G Ink Mark α1 Style : Pin 1.Emitter 2.Base 3.Collector E F 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification