KOA SPEER ELECTRONICS, INC. SS-194 R5 AHA 6/29/06 Power Chip Inductors Type LPC4045 CERTIFIED CERTIFIED 1. Scope This specification shall be applied to the LPC4045 manufactured by KOA Corporation. 2. Dimensions and Construction E D B Size F 4045 C A B Dimensions inches (mm) C D ø.157±.008 .169±.009 .177±.008 .118±.008 (ø4.0±0.2) (4.3±0.2) (4.5±0.2) (3.0±0.2) E F .138 (3.5) .039±.112 (1.0±0.3) A F Electrode Ceramic Magnet Substrate Wire Ferrite Core 3. Type Designation The type designation shall be the following form: New Type LPC 4045 A TED 101 K Type Size Termination Material Packaging Nominal Inductance Tolerance A: SnAg (Other termination styles available, contact factory for options) TED: 10" Embossed Plastic 1,000 pcs/reel 101: 100µH 221: 220µH 152: 1500µH K: ±10% M: ±20% 4045 PAGE 1 OF 4 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-194 R5 4. Standard Applications Part Designation Inductance (µH) LPC4045ATEDR68M LPC4045ATED1R0M LPC4045ATED1R5M LPC4045ATED2R2M LPC4045ATED3R3M LPC4045ATED4R7M LPC4045ATED6R8M LPC4045ATED100K LPC4045ATED150K LPC4045ATED220K LPC4045ATED330K LPC4045ATED470K LPC4045ATED680K LPC4045ATED101K LPC4045ATED151K LPC4045ATED221K LPC4045ATED331K LPC4045ATED471K LPC4045ATED681K 0.68 1.0 1.5 2.2 3.3 4.7 6.8 10 15 22 33 47 68 100 150 220 330 470 680 Inductance Tolerance Quality Factor Minimum (MHz) Self Resonant Frequency Minimum (MHz) 120.0 90.0 70.0 55.0 45.0 35.0 25.0 23.5 18.5 14.0 12.0 10.5 8.0 6.3 5.2 3.9 3.0 2.7 2.2 M: ±20% 20 K: ±10% 40 DC Resistance Maximum (Ω) 0.012 0.015 0.020 0.023 0.044 0.062 0.075 0.10 0.15 0.21 0.41 0.52 0.67 0.92 1.80 2.25 4.27 5.23 6.67 Allowable DC Current Maximum (Amps) 3.40 3.10 2.80 2.50 1.80 1.45 1.30 1.02 0.84 0.70 0.52 0.46 0.40 0.28 0.25 0.18 0.15 0.14 0.12 Measured Frequency (Hz) 1000 4.1 Rating No. 1 Item Nominal inductance range Specification 0.68 µH ~ 680 µH E-6 series Measuring Conditions: Normal testing is conducted at normal temperatures (5°C ~ 35°C) and at nominal humidity (45% ~ 85% R. H.). If there is concern, the test may be conducted at a temperature of 20 ± 2°C and at a relative humidity of 65 ± 5% R. H. 5. Environmental Characteristics No. 1 2 3 4 Item High temperature, leaving test Low temperature, leaving test Moisture leaving test Heat shock test Test Methods 85 ± 2°C 500 Hr -40 ± 2°C 500 Hr 40 ± 2°C 90 ~ 95% R. H. 500 Hr -40 ± 4°C/0.5 Hr 85 ± 2°C/0.5 Hr 85°C 0.5 Hr 100 cycles -40°C 1 dropped from height of 1 meter to top of board. 2 hours in each direction of X, Y, Z at a frequency range of 10 ~ 55 Hz with 1.5 mm amplitude. 5 6 Dropping test Vibration test 7 8 9 Operating temperature range Storage temperature range Resistance to soldering heat -30°C ~ +80°C -40°C ~ +85°C With the temperature of the solder at 260°C +5°C, 10 seconds, There shall be no abnormalities. 10 Resistance to solvent MIL-STD-202F Method 215 There shall be no abnormalities under the above conditions. Measurement: Inductance DC Superposed characteristics LCR Meter HP4284A Frequency: Inductance 1 MHz DC Superposed characteristics 10 KHz Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Q (Quality factor) Fax 814-362-8883 PAGE 2 OF 4 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-194 R5 6. Packaging 6.1 Taping The taping shall be embossed carrier tapes of 12 mm width and 8 mm pitches. The standard quantity per reel shall be 1,000 pieces. 6.2 Dimensions of Taping 12.0 ± 0.1 1.75 ± 0.1 8.0 ± 0.1 4.0 ± 0.1 4.6 ± 0.1 Ø1.5 ± 0.1 0.4 Ø13.0 ± 0.5 Ø21.0 ± 0.5 80.0 ± 2.0 4.75 ± 0.2 5.5 ± 0.1 Blank over 50 mm Products 1,000 pieces 4.15 ± 0.2 2.0 ± 0.3 Blank Tape leader over 50 mm 50 ~ 200 mm 13 ± 1.0 ø250 Feed Direction 6.5 Lot Number 6.3 Packaging Method A specially designed cardboard box is used for the external packaging and can hold a maximum of 20 reels. (Example) January 21, 2006 6.4 Markings The following information is provided on the reel. (1) Product name (2) Part number (3) Quality (4) Lot number (5) Manufacture origin 41 21 D K Year and Month of Manufacture Day of Manufacture Manufacture Plant Additional Number 41...2006.1 42...2006.2 43...2006.3 PAGE 3 OF 4 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. KOA SPEER ELECTRONICS, INC. SS-194 R5 7. General Information 7.1 Storage 7.4 Cleaning Chip inductors shall not be stored under high temperature and high humidity conditions. Especially, do not store taping where they are exposed to heat or direct sunlight. Otherwise, material may be deformed, causing problems during mounting. There is no problem using organic solvents. Since these chip inductors are a coil of ultra-thin wire, they are susceptible to vibration. If an ultrasonic cleaning unit is used, check for any possibility of problem generation before practical use, since such cleaning units differ considerably in vibration level and mode. Although the conditions vary depending on the printed board size, Ultrasonic cleaning is generally used in the conditions described in the following examples: Power: Within 20W/L Cleaning times: Within 5 minutes 7.2 Mounting Placement force should not be excessive. 7.3 Soldering Soldering should be done at 250°C for less than 6 seconds. When using a soldering iron, temperature shall not exceed 350°C and within 3 seconds. Soldering iron time shall be allowed only one time. After soldering, chip inductors shall not be stressed excessively. 7.5 Pattern Design A land pattern gap is recommended of 2.0 mm to 2.5 mm. When low or more chip inductors are closely mounted, they must be separated by means of solder resists to prevent excessive solder. 8. Soldering 9. Land Pattern Design 9.1 Pattern Design The time and temperature for reflow solder applications are as shown below. A land pattern gap is recommended of 2.0 mm to 2.5 mm. When low or more chip inductors are closely mounted, they must be separated by means of solder resists to prevent excessive solder. Temperature (°C) 8.1 Conditions for Reflow Soldering 230 200 (unit: mm) 160 Time Within 90 seconds Within 45 seconds Within 30 seconds 3.5 Clean solder film 300 ± 100 micron Within 6 seconds 1.8 1.5 1.8 PAGE 4 OF 4 Bolivar Drive ■ P.O. Box 547 ■ Bradford, PA 16701 ■ USA ■ 814-362-5536 ■ Fax 814-362-8883 ■ www.koaspeer.com Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.