ON MC10H123 Triple 4â 3â 3â input bus driver Datasheet

MC10H123
Triple 4‐3‐3‐Input Bus Driver
Description
The MC10H123 is a triple 4-3-3-Input Bus Driver.
The MC10H123 consists of three NOR gates designed for bus
driving applications on card or between cards. Output low logic levels
are specified with VOL = −2.1 Vdc so that the bus may be terminated to
−2.0 Vdc. The gate output, when low, appears as a high impedance to
the bus, because the output emitter-followers of the MC10H123 are
“turned-off.” This eliminates discontinuities in the characteristic
impedance of the bus.
The VOH level is specified when driving a 25 W load terminated to
−2.0 Vdc, the equivalent of a 50 W bus terminated at both ends.
Although 25 W is the lowest characteristic impedance that can be
driven by the MC10H123, higher impedance values may be used with
this part. A typical 50 W bus is shown in Figure 3.
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16
PDIP−16
P SUFFIX
CASE 648−08
Features
PLLC−20
FN SUFFIX
CASE 775−02
MARKING DIAGRAMS*
• Propagation Delay, 1.5 ns Typical
• Improved Noise Margin 150 mV
•
•
•
20 1
1
1 20
(Over Operating Voltage and Temperature Range)
Voltage Compensated
MECL 10K™ Compatible
These Devices are Pb-Free, Halogen Free and are RoHS Compliant
16
MC10H123P
AWLYYWWG
10H123G
AWLYYWW
1
PDIP−16
A
WL, L
YY, Y
WW, W
G
PLLC−20
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb-Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
Device
Package
Shipping†
MC10H123FNG
PLLC−20
(Pb-Free)
46 Units / Tube
MC10H123FNR2G
PLLC−20
(Pb-Free)
500 Tape & Reel
MC10H123PG
PDIP−16
(Pb-Free)
25 Units / Tube
†For information on tape and reel specifications, including part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
August, 2016 − Rev. 8
1
Publication Order Number:
MC10H123/D
MC10H123
4
5
3
6
7
VCC1
1
16
VCC2
BOUT
2
15
COUT
AOUT
3
14
CIN
AIN
4
13
CIN
AIN
5
12
CIN
AIN
6
11
BIN
AIN
7
10
BIN
VEE
8
9
BIN
9
10
2
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
11
12
13
15
14
Pin assignment is for Dual-in-Line Package.
Figure 1. LOGIC DIAGRAM
Figure 2. Dip Pin Assignment
Table 1. MAXIMUM RATINGS
Symbol
Characteristic
Rating
Unit
VEE
Power Supply (VCC = 0)
−8.0 to 0
Vdc
VI
Input Voltage (VCC = 0)
0 to VEE
Vdc
Iout
Output Current
Continuous
Surge
TA
Operating Temperature Range
Tstg
Storage Temperature Range
Plastic
Ceramic
mA
50
100
0 to +75
°C
°C
°C
−55 to +150
−55 to +165
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1)
0°
Symbol
IE
Characteristic
Min
25°
Max
Min
75°
Max
Min
Max
Unit
Power Supply Current
60
56
60
mA
IinH
Input Current High
495
310
310
mA
IinL
Input Current Low
VOH
High Output Voltage
VOL
VIH
VIL
0.5
0.5
−1.02
−0.84
Low Output Voltage
−2.1
High Input Voltage
−1.17
Low Input Voltage
−1.95
0.3
−0.98
−0.81
−0.92
−2.03
−2.1
−2.03
−0.84
−1.13
−0.81
−1.48
−1.95
−1.48
−1.95
mA
−0.735
Vdc
−2.1
−2.03
Vdc
−1.07
−0.735
Vdc
−1.45
Vdc
1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
Outputs are terminated through a 50 W resistor to −2.1 V.
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2
MC10H123
Table 3. AC CHARACTERISTICS
0°
Symbol
25°
75°
Min
Max
Min
Max
Min
Max
Unit
Propagation Delay
0.7
1.5
0.7
1.6
0.7
1.7
ns
tr
Rise Time
0.7
1.6
0.7
1.7
0.7
1.8
ns
tf
Fall Time
0.7
1.6
0.7
1.7
0.7
1.8
ns
tpd
Characteristic
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1/3 MC10H123
1/3 MC10H123
1/3 MC10H123
ZO = 50 W
50 W
−2.0
VDC
50 W
RECEIVERS (MECL GATES)
Figure 3. 50 W Bus Driver (25 W Load)
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3
−2.0
VDC
MC10H123
PACKAGE DIMENSIONS
20 LEAD PLLC
FN SUFFIX
CASE 775−02
ISSUE F
B
0.007 (0.180)
Y BRK
−N−
M
T L-M
0.007 (0.180)
U
M
N
S
T L-M
S
G1
0.010 (0.250)
S
N
S
D
−L−
−M−
Z
W
20
D
1
X
V
S
T L-M
S
N
S
VIEW D−D
A
0.007 (0.180)
M
T L-M
S
N
S
R
0.007 (0.180)
M
T L-M
S
N
S
Z
C
H
−T−
VIEW S
G1
0.010 (0.250) S T L-M
SEATING
PLANE
F
0.007 (0.180)
VIEW S
S
N
T L-M
S
N
S
K
0.004 (0.100)
J
M
K1
E
G
0.007 (0.180)
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
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4
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.021
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−−
0.020
2_
10 _
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.53
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2_
10 _
7.88
8.38
1.02
−−−
M
T L-M
S
N
S
MC10H123
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
CASE 648−08
ISSUE V
D
A
16
9
E
H
E1
1
NOTE 8
b2
8
c
B
TOP VIEW
END VIEW
WITH LEADS CONSTRAINED
NOTE 5
A2
A
e/2
NOTE 3
L
A1
C
D1
e
SEATING
PLANE
M
eB
END VIEW
16X b
SIDE VIEW
0.010
M
C A
M
B
M
NOTE 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
DIM
A
A1
A2
b
b2
C
D
D1
E
E1
e
eB
L
M
INCHES
MIN
MAX
−−−−
0.210
0.015
−−−−
0.115 0.195
0.014 0.022
0.060 TYP
0.008 0.014
0.735 0.775
0.005
−−−−
0.300 0.325
0.240 0.280
0.100 BSC
−−−−
0.430
0.115 0.150
−−−−
10 °
STYLE 1:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. CATHODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
15. ANODE
16. ANODE
MILLIMETERS
MIN
MAX
−−−
5.33
0.38
−−−
2.92
4.95
0.35
0.56
1.52 TYP
0.20
0.36
18.67 19.69
0.13
−−−
7.62
8.26
6.10
7.11
2.54 BSC
−−−
10.92
2.92
3.81
−−−
10 °
STYLE 2:
PIN 1. COMMON DRAIN
2. COMMON DRAIN
3. COMMON DRAIN
4. COMMON DRAIN
5. COMMON DRAIN
6. COMMON DRAIN
7. COMMON DRAIN
8. COMMON DRAIN
9. GATE
10. SOURCE
11. GATE
12. SOURCE
13. GATE
14. SOURCE
15. GATE
16. SOURCE
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