MS5534A BAROMETER MODULE ♦ ♦ ♦ ♦ Integrated pressure sensor Pressure range 300-1100 mbar 15 Bit ADC 6 coefficients for a software compensation stored on-chip ♦ 3-wire serial interface ♦ 1 system clock line (32.768 kHz) ♦ Low voltage / low power DESCRIPTION The MS5534A is a SMD-hybrid device including a piezoresistive pressure sensor and an ADC-Interface IC. It provides a 16 Bit data word from a pressure- and temperature-dependent voltage. Additionally the module contains 6 readable coefficients for a highly accurate software calibration of the sensor. MS5534A is a lowpower, low-voltage device with automatic power down (ON/OFF) switching. A 3-wire interface is used for all communications with a microcontroller. Sensor packaging options are plastic or metal cap. FEATURES • • • • • • APPLICATIONS • • • • 15-Bit ADC resolution Supply voltage 2.2 V to 3.6 V Low Supply current -40°C to +60°C Small size No external components required Mobile altimeter/barometer systems Weather control systems Adventure or multi-mode watches GPS Receivers BLOCK DIAGRAM VDD MCLK Input MUX SENSOR +IN -IN Digital Interface ADC dig. Filter Sensor Interface IC DIN DOUT SCLK Memory (PROM) 64 bits SGND GND Fig.: 1 Block Diagram 5534 DA5534_022.doc ECN493 July 17th, 2002 1 PIN CONFIGURATION PEN 7 6 VDD 6 5 MCLK 5 4 DIN 4 3 DOUT 3 2 SCLK 2 1 GND 1 PV 8 Fig. 2: Pin configuration of MS5534 PIN DESCRIPTION Pin Name Pin Type Function VDD MCLK DIN DOUT SCLK GND PV PEN 6 5 4 3 2 1 8 7 P I I O I G N I Positive Supply Voltage Master Clock (32.768kHz) Data Input Data Output Serial Data Clock Ground Negative Programming Voltage Programming Enable Note: Pins 7 (PEN) and 8 (PV) are only used by the manufacturer for calibration purposes and should not be connected. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Min Max Unit V bar abs o C Supply Voltage Overpressure VDD P -0.3 4 4 Storage Temperature TStg -20 +70 Notes: 1. Storage and operation in an environment of dry and non-corrosive gases. DA5534_022.doc ECN493 July 17th, 2002 2 RECOMMENDED OPERATING CONDITIONS (T=25°C, VDD=3.0V unless noted otherwise) Parameter Supply Voltage Supply Current, average (1) during conversion (2) standby (no conversion) Current consumption into MCLK (3) Operating pressure range Symbol VDD Conditions Typ. 3.0 Max 3.6 Unit V 3.5 0.5 µA mA µA µA VDD = 3.0 V Iavg ISC Iss 5 1 MCLK=32768Hz p 300 Ta -10 Operating temperature range Conversion time Tconv External clock signal (4) MCLK 1100 +25 MCLK=32768Hz Duty cycle of MCLK Serial Data Clock Min. 2.2 SCLK +60 mbar abs. °C 35 ms 30000 32768 35000 Hz 40/60 50/50 60/40 % 500 kHz Notes: 1. Under the assumption of one conversion every second. Conversion means either a pressure or a temperature measurement started by a command to the serial interface of MS5534. 2. During conversion the sensor will be switched on and off in order to reduce power consumption; the total on time within a conversion is about 2ms. 3. This value can be reduced by switching off MCLK while MS5534 is in standby mode. 4. It is strongly recommended that a crystal oscillator be used because the device is sensitive to clock jitter. A square-wave form of the clock signal is a must. 5. Reliable operation requires protection of the pressure sensor from direct contact with light. 6. Power supply pins (VDD, GND) must be decoupled with a tantalum (47µF) capacitor placed close to the module. DA5534_022.doc ECN493 July 17th, 2002 3 ELECTRICAL CHARACTERISTICS Digital inputs (T=-40°C .. 60°C) Parameter Symbol Conditions Min Typ Max Unit Input High Voltage VIH VDD = 2.2…3.6V Input Low Voltage VIL VDD = 2.2…3.6 V 80% VDD 0% VDD 100% VDD 20% VDD V Signal Rise Time tR 200 ns Signal Fall Time tf 200 ns V Digital outputs (T=-40°C .. 60°C, VDD = 2.2V..3.6V) Parameter Symbol Conditions Min Output High Voltage VOH ISource = 0.6 mA Output Low Voltage VOL ISink = 0.6 mA 75% VDD 0% VDD Typ Max Unit 100% VDD 20% VDD V V Signal Rise Time tr 200 ns Signal Fall Time tf 200 ns AD-converter (T=25°C, VDD =3.0V) Parameter Symbol Conditions Resolution (1) Conversion Time Min Typ Max 15 MCLK=32768Hz Accuracy (2) 2 Unit Bit 35 ms 7 LSB Notes: 7. The ADC output range is from 5,000 counts to 37,000 counts, thus providing a 16-Bit output word. 8. Accuracy limited by the non-linearity of the ADC. DA5534_022.doc ECN493 July 17th, 2002 4 PRESSURE OUTPUT CHARACTERISTICS With the calibration data provided by the MS5534 system (stored in the interface IC) the following characteristics can be achieved: Parameter Resolution Absolute Pressure Accuracy Relative Pressure Accuracy Maximum Error over Temperature Long-term Stability Maximum Error over Supply Voltage Conditions Min p = 750 …1100mbar Ta = 25°C p = 750 …1100mbar Ta = 25°C Ta = -10…+60°C p = const. Max Unit mbar Note 1 -1.5 +1.5 mbar 2 -0.5 +0.5 mbar 3 -1 +1 mbar 4 -1 +6 mbar 5 mbar 6 12 month VDD = 2.2…3.6V Typ 0.1 -1 -1.5 0 +1.5 mbar/V Notes: 1. A stable pressure reading of the given resolution requires to take the average of 2 to 4 subsequent pressure values due to noise of the ADC. A better resolution can be obtained with more averaging. 2. Maximum error of pressure reading over the pressure range. 3. Maximum error of pressure reading over the pressure range after offset adjustment at one pressure point. 4. With the second-order temperature compensation as described in Section "Calculation of pressure using compensation coefficients C1 to C5". 5. With the first-order temperature compensation as described in Section "Calculation of pressure using compensation coefficients C1 to C5". 6. The long-term stability is measured with non-soldered devices TEMPERATURE OUTPUT CHARACTERISTICS This temperature information is not required for most applications, but it is necessary to allow for temperature compensation of the pressure output. The reference temperature is 20°C. Parameter Conditions Max Unit 0.005 0.015 °C at reference temperature -0.8 0.8 °C VDD = 2.2…3.6V -0.08 + 0.08 °C/V Resolution Accuracy Maximum Error over Supply Voltage Min Typ Notes: 1. Refer to the paragraph second-order temperature compensation in the section ‘FUNCTION’ DA5534_022.doc ECN493 July 17th, 2002 5 TYPICAL PERFORMANCE CURVES ADC-value vs Pressure (typical) 20000 19000 18000 ADC-value (LSB) 17000 16000 Temp. -10°C Temp.+25°C 15000 Temp.+60°C 14000 13000 12000 11000 1100 1000 900 800 700 600 500 400 300 10000 Pressure (m bar) ADC-value D2 vs Temperature (typical) 30000 29000 28000 ADC-value (LSB) 27000 26000 25000 24000 23000 22000 21000 20000 -10 0 10 20 30 40 50 60 Temperature (°C) DA5534_022.doc ECN493 July 17th, 2002 6 Absolute pressure accuracy after calibration (typical) 3.5 3 Linearity error (mbar) 2.5 -10°C (standard calculation) 2 -10°C (2nd order temperature compensation) +60°C 1.5 1 0.5 0 +25°C -0.5 -1 -1.5 300 400 500 600 700 800 900 1000 1100 Pressure (m bar) 4 4 3 3 2 2 1 1 0 0 -1 -1 -2 -2 -3 -4 -10 -3 Pressure Error (standard compensation) Pressure Error (mbar) Temperature Error (°C) Accuracy vs temperature (typical) Pressure Error (2nd order temperature compensation) Temperature Error (standard calculation) Temperature Error (w ith 2nd order calculation) -4 0 10 20 30 40 50 60 Temperature (°C) DA5534_022.doc ECN493 July 17th, 2002 7 Pressure error vs supply voltage (typical) 0.4 0.3 Pressure error (mbar) 0.2 0.1 0 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Press. 300mbar Press. 700mbar -0.1 Press. 1100mbar -0.2 -0.3 -0.4 Voltage (V) Temperature error (25°C) vs supply voltage (typical) 0.15 Temperature error (°C) 0.1 0.05 0 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 -0.05 -0.1 -0.15 Voltage (V) DA5534_022.doc ECN493 July 17th, 2002 8 FUNCTION General The MS5534 consists of a piezoresistive sensor and a sensor interface IC. The main function of the MS5534 is to convert the uncompensated analog output voltage from the piezoresistive pressure sensor to a 16-Bit digital value, as well as providing a 16-Bit digital value for the temperature of the sensor. • measured pressure (16-Bit) • measured temperature (16-Bit) “D1” “D2” As the output voltage of a pressure sensor is strongly dependent on temperature and process tolerances, it is necessary to compensate for these effects. This compensation procedure must be performed by software using an external microcontroller. Factory calibration Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients necessary to compensate for process variations and temperature variations are calculated and stored in the 64Bit PROM of each module. These 64-Bit (partitioned into four words of 16-Bit) must be read by the microcontroller software and used in the program converting D1 and D2 into compensated pressure and temperature values. Pressure and temperature measurement The sequence of reading pressure and temperature as well as of performing the software compensation is depicted in flow chart, Fig. 3 and Fig. 5. First the WORD1 to WORD4 have to be read through the serial interface. This can be done once after reset of the microcontroller that interfaces to the MS5534. Next the compensation coefficients C1 to C6 are extracted using Bit-wise logical- and shift-operations (refer to Fig. 4 for the Bit-pattern of word 1 to word 4). For the pressure measurement the microcontroller has to read the 16 Bit values for pressure (D1) and temperature (D2) via the serial interface in a loop (for instance every second). Then, the compensated pressure is calculated out of D1, D2 and C1 to C6 according to the algorithm in Fig. 3 (possibly using quadratic temperature compensation according to Fig. 5). All calculations can be performed with signed 16-Bit variables. Results of multiplications may be up to 32-Bit long (+sign). In the flow according to Fig. 3 each multiplication is followed by a division. This division can be performed by Bit-wise shifting (divisors are to the power of 2). It is ensured that the results of these divisions are less than 65536 (16-Bit). For the timing of signals to read out WORD1 to WORD4, D1, and D2 please refer to the paragraph “Serial Interface”. Measurement principle For both pressure and temperature measurement the same ADC is used (sigma delta converter): • for the pressure measurement, the differential output voltage from the pressure sensor is converted • for the temperature measurement, the sensor bridge resistor is sensed and converted During both measurements the sensor will only be switched on for a very short time in order to reduce power consumption. As both, the bridge bias and the reference voltage for the ADC are derived from VDD, the digital output data is independent of the supply voltage. The A/D converter has been optimized to work in the linear range (numeric values in range [5,000:37,000]). DA5534_022.doc ECN493 July 17th, 2002 9 Basic equations: System initialisation Start Example: Read calibration data (factory calibrated) from PROM of MS5534 Word1 = 50426 Word2 = 9504 Word3 = 48029 Word4 = 55028 Word1, Word2, Word3 and Word4 (4x16 Bit) Convert calibration data into coefficients: (see bit pattern of Word1-Word4) Pressure and temperature measurement C1: Pressure sensitivity C2: Pressure offset C3: Temperature coefficient of pressure sensitivity C4: Temperature coefficient of pressure offset C5: Reference Temperature C6: Temperature coefficient of the temperature (15 Bit) (12 Bit) (10 Bit) (10 Bit) (11 Bit) (6 Bit) SENST1 OFFT1 TCS TCO Tref TEMPSENS C1 = 25213 C2 = 1908 C3 = 859 C4 = 750 C5 = 148 C6 = 32 Read digital pressure value from MS5534A D1 (16 Bit) D1 = 17000 Read digital temperature value from MS5534A D2 (16 Bit) D2 = 22500 Calculate calibration temperature UT1=8*C5+20224 Calculate actual temperature Difference between actual temperature and reference temperature: dT = D2 - UT1 Actual temperature in °C: dT(D2) = D2 - Tref dT TEMP(D2)=20°+dT(D2)*TEMPSENS TEMP = 287 = 28.7 °C OFF(D2)=OFFT1+TCO*dT(D2) OFF SENS(D2)=SENST1+TCS*dT(D2) SENS = 50705 10 TEMP = (200 + dT*(C6+50)/2 )/10 = 1092 Calculate temperature compensated pressure Offset at actual temperature: OFF = C2*4 + ((C4-512)*dT)/212 Sensitivity at actual temperature: = 7695 SENS = C1 + (C3*dT)/210 + 24576 X = (SENS * (D1-7168))/214 - OFF X = 22732 P = 96037 = 960.37 mbar Temperature compensated pressure: P = X*100/25 + 250*100 (0.01mbar resolution) P = X*10/25 + 250*10 P(D1,D2)=D1*SENS(D2)-OFF(D2) (0.1mbar resolution) Display pressure and temperature value Fig. 3: Flow chart for pressure/temperature reading and software compensation. Notes: 1. Readings of D2 can be done less frequently, but the display will be less stable in this case 2. For a stable display of 0.1mbar resolution, it is recommended to display the average of 8 subsequent pressure values. DA5534_022.doc ECN493 July 17th, 2002 10 C1 (15 Bit) C5/I 1 Bit Word 1 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 C5/II (10 Bit) Word 2 DB9 DB8 DB7 DB6 DB5 DB4 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB5 DB4 DB9 DB8 DB7 DB6 DB5 DB4 DB0 DB10 DB3 DB2 DB1 DB0 DB7 DB6 DB1 DB0 C2/I (6 Bit) DB3 DB2 DB1 DB0 DB11 DB10 C3 (10 Bit) Word 4 DB1 C6 (6 Bit) C4 (10 Bit) Word 3 DB2 DB9 DB8 C2/II (6-Bit) DB3 DB2 DB1 DB0 DB5 DB4 DB3 DB2 Fig. 4: Arrangement (Bit-pattern) of calibration data in Word1 to Word4. Second-order temperature compensation In order to obtain full accuracy over the whole temperature range, it is recommended to compensate for the non-linearity of the output of the temperature sensor. This can be achieved by the second-order temperature calculation for D2<UT1, i.e. by replacing the block "Calculate actual temperature" in flow chart Fig. 3 by the following sequence: no D2≥UT1? yes Calculate actual temperature Calculate actual temperature Difference between the actual temperature and reference temperature: Difference between the actual temperature and reference temperature: 7 dT = D2 - UT1 7 dT = (D2 - UT1)- ((D2-UT1)/2 )((D2-UT1)/2 )/2 Actual temperature in °C 2 Actual temperature in °C 10 10 8 TEMP = (200 + dT*(C6+50)/2 +dT/2 )/10 TEMP = (200 + dT*(C6+50)/2 )/10 Fig. 5: Flow chart for calculating the temperature to the optimum accuracy. The value for dT thus obtained is then used for the calculation of the temperature compensated pressure as shown in Fig.3. DA5534_022.doc ECN493 July 17th, 2002 11 Serial interface The MS5534 communicates with microprocessors and other digital systems via a 3-wire synchronous serial interface as shown in Fig. 1. The SCLK (Serial Clock) signal initiates the communication and synchronizes the data transfer with each Bit being sampled by the MS5534 on the rising edge of SCLK and each Bit being sent by the MS5534 on the rising edge of SCLK. The data should thus be sampled by the microcontroller on the falling edge of SCLK and sent to the MS5534 with the falling edge of SCLK. The SCLK-signal is generated by the microprocessor’s system. The digital data provided by the MS5534 on the DOUT pin is either the conversion result or the software calibration data. In addition the signal DOUT (Data Out) is also used to indicate the conversion status (conversion-ready signal, see below). The selection of the output data is done by sending the corresponding instruction on the pin DIN (Data Input). Following is a list of possible output data instructions: • • • • • • • Conversion start for pressure measurement and ADC-data-out Conversion start for temperature measurement and ADC-data-out Calibration data read-out sequence for word 1 Calibration data read-out sequence for word 2 Calibration data read-out sequence for word 3 Calibration data read-out sequence for word 4 RESET sequence “D1” “D2” (Figure 6a) (Figure 6b) (Figure 6c) (Figure 6d) (Figure 6c) (Figure 6d) (Figure 6e) Every communication starts with an instruction sequence at pin DIN. Fig. 6 shows the timing diagrams for the MS5534. The device does not need a ‘Chip select’ signal. Instead there is a Start Sequence (3-Bit high) before each Setup Sequence and Stop Sequence (3-Bit low) after each Setup Sequence. The Setup Sequence consists in 4-Bit that select a reading of pressure, temperature or calibration data. In case of pressure- (D1) or temperature- (D2) reading the module acknowledges the start of a conversion by a low to high transition at pin DOUT during the last bit of the Stop Sequence. Two additional clocks at SCLK are required after the acknowledge signal. Then SCLK is to be held low by the microcontroller until a high to low transition on DOUT indicates the end of the conversion. This signal can be used to create an interrupt in the microcontroller. The microcontroller may now read out the 16-Bit word by giving another 17 clocks on the SLCK pin. It is possible to interrupt the data read-out sequence with a hold of the SCLK signal. It is important to always read out the last conversion result before starting a new conversion. Conversion start for pressure measurement and ADC-data-out "D1": end of conversion start of conversion conversion (33ms) ADC-data out MSB DB7 DB6 DB5 DB4 DB3 DB2 DB1 DIN DOUT SCLK The RESET-sequence is special as its unique pattern is recognized by the module in any state. By consequence it can be used to restart if synchronization between the microcontroller and the MS5534 has been lost. This sequence is 21-Bit long. The DOUT signal might change during that sequence (see Fig. 6e). It is thus recommended to send the RESET-Sequence before each Conversion Sequence to avoid hanging up the protocol permanently in case of electrical interference. ADC-data out LSB DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 sequence: START+P-measurement Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Start-bit Setup-bits Stop-bit Fig. 6a: D1 acquisition sequence DA5534_022.doc ECN493 July 17th, 2002 12 end of conversion conversion (33ms) start of conversion ADC-data out MSB DB7 DB6 DB5 DB4 DB3 DB2 DB1 DIN DOUT SCLK Conversion start for temperature measurement and ADC-data-out "D2": ADC-data out LSB DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 sequence: START+T-measurement Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Start-bit Setup-bits Stop-bit DIN DOUT SCLK Fig. 6b: D2 acquisition sequence Calibration data read out sequence for word 1/ word 3: coefficient-data out MSB DB7 DB6 DB5 DB4 DB3 DB2 DB1 coefficient-data out LSB DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 sequence: coefficient read + address Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Bit10 Bit11 Stop-bit Setup-bits Start-bit address word 1 address word 3 DIN DOUT SCLK Fig. 6c: W1, W3 reading sequence Calibration data read out sequence for word 2/ word 4: coefficient-data out MSB DB7 DB6 DB5 DB4 DB3 DB2 DB1 coefficient-data out LSB DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 sequence: coefficient read + address Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Bit10 Bit11 Setup-bits Start-bit Stop-bit address word 2 address word 4 DIN DOUT SCLK Fig. 6d: W2, W4 reading sequence RESET - sequence: sequence: RESET Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Bit10 Bit11Bit12 Bit13 Bit14 Bit15 Bit16 Bit17 Bit18 Bit19 Bit20 Fig. 6e: Reset sequence (21-Bit) DA5534_022.doc ECN493 July 17th, 2002 13 APPLICATION INFORMATION GENERAL The idea for this combination of a sensor with a direct adapted integrated circuit is to save other external components and to achieve very low power consumption. The main application field for this system includes portable devices with battery supply, but its high accuracy and resolution make it also suited for industrial and automotive applications. The possibility to compensate the sensor with a software allows the user to adapt it to his particular application. Communication between the MS5534A and the widely available microcontrollers is realized over an easy-to-use 3-wire serial interface. Customers may select which microcontroller system to be used, and there are no specific standard interface cells required, which may be of interest for specially designed 4 Bit-microcontroller applications. Storage of calibration data in the device will be done at module final test. Automatic test equipment is used to perform tests under pressure and temperature and to calculate individual coefficients for every sensor, which allows a highly accurate compensation. Further, because the calibration data is stored in the MS5534A, the user can save additional external memory in his microcontroller system (i.e. EEPROM). The MS5534A is mounted on a ceramic substrate. SnPb connection pads ensure the soldering of the substrate and automatic assembly. Standard surface mount techniques can be used (IR reflow soldering technique at temperatures not exceeding 225° C for 30 sec is recommended). A dot on the ceramic substrate marks pad 1. The silicon pressure transducer and the bonding wires are protected by a plastic cap on the standard version. MS5534AP is factory protected against humidity by a silicone gel. Version MS5534AM carries a metal protection cap filled with silicone gel for enhanced protection against humidity. The package outline of the module allows the use of a flexible PCB to connect it. This can be important for applications in watches and other special devices, and will also reduce mechanical stress on the device. For applications subjected to mechanical shock, it is recommended to enhance the mechanical reliability of the solder junctions by covering the rim or the corners of MS5534A's ceramic substrate with glue or glob top-like material. Particular care must be taken when connecting the device to power supply: A 47µF tantalum capacitor must be placed as close as possible of the MS5534's VDD pin. This capacitor will stabilize the power supply during data conversion and thus, provide the highest possible accuracy. DA5534_022.doc ECN493 July 17th, 2002 14 ALTIMETER SYSTEM USING MS5534A MS5534A is a circuit that can be used in connection with a microcontroller in mobile altimeter applications. It is designed for low-voltage systems with a supply voltage of 3V, particularly in battery applications. The MS5534A is optimised for low current consumption as the AD-converter clock (MCLK) can use the 32.768kHz frequency of a standard watch crystal, which is supplied in most portable watch systems. For applications in altimeter systems Intersema can deliver a simple formula to calculate the altitude, based on a linear interpolation, where the number of interpolation points influences the accuracy of the formula. VDD MCLK Input MUX SENSOR Digital Interface +IN ADC -IN DIN DOUT dig. Filter SCLK Memory (PROM) 64 bits Sensor Interface IC SGND GND Figure 7: Block diagram of MS5534A Advantages of MS5534: - easy layout (one side contact for flexible PCB) - better reliability - reduced test time - universal to use, less development time - high compensation accuracy because of individual sensor test - lower price as a solution with sensor, amplifier, AD-converter and external parts - easy-to-use 3 wire serial interface APPLICATION EXAMPLES 3V-Battery LCD-Display VDD XTAL1 32.768 kHz MS5534 VDD 47uF Tantal XTAL2 Keypad MCLK DIN DOUT SCLK GND 4/8bit-Microcontroller VSS EEPROM optional Figure 8: Demonstration of MS5534A in a mobile altimeter DA5534_022.doc ECN493 July 17th, 2002 15 DEVICE PACKAGE OUTLINES MS5534AP 1±0.28 9 + 0.15 -0 ∅=7 top view bottom view max. 6 1.2 2.1 0.8 1±0.28 0.8 max. 7 1.75 0.925 1.27 9 + 0.15 -0 R 0.15 ∅ 2.5 1.2 0.8 2.2 + 0.1 -0.05 1.5 max.1 0.635 ± 0.07 all measures in mm Fig. 9: Device package outlines of MS5534AP MS5534AM bottom view max. 6 0.8 2.1 max. 7 1.75 0.925 1.27 9 + 0.15 -0 R 0.15 0.8 1.2 1±0.28 1±0.28 top view 9 + 0.15 -0 ∅=7 ∅=5 1.2 0.8 1.5 max.1 0.635 ± 0.07 3.7 + 0.1 -0.05 all measures in mm Fig. 10: Device package outlines of MS5534AM DA5534_022.doc ECN493 July 17th, 2002 16 RECOMMENDED PAD LAYOUT Pad layout for bottom side of MS5534A soldered onto printed circuit board 11.50 1.00 1.30 1.325 0.85 2.80 1.325 1.50 0.05 1.50 0.05 1.00 5 1.27 each pad 1.00 4 7.30 1.27 each pad: 6 3 2 6.30 All measures in mm. 1.325 1.30 2.30 1 MS5534A 1.30 0.30 hole in board 0.70 1.00 Pad layout for top side of MS5534A soldered onto printed circuit board 11.50 2.40 2.90 1.90 1.70 2.40 3.10 2.20 each pad 3.675 1.00 2 1.27 1.00 1.27 each pad: 1 ∅7.30== 3 4 5 All measures in mm. 6 MS5534A ∅7.30mm hole in board with phase 45° x 0.15 DA5534_022.doc ECN493 July 17th, 2002 17 ASSEMBLY Soldering MS5534A 240 Temp. 225 +/- 5 °C (240 C max.) REFLOW 200 180 Time : 50 - 80 sec 160 120 PREHEAT Temp. 150 +/- 10 C Time 60 -120 sec. Temperature [C] 80 40 0 0 60 120 180 240 300 360 Time [Seconds] Figure 11: Recommended soldering profile Solder Paste The MS5534A is a ceramic device that requires special assembly considerations compared to the assembly of SMD leaded components. The connecting pads are made of AgPd (Silver Palladium) pads. Like for other ceramic devices the sensor must be soldered with Sn62Pb36Ag2 Solder paste. This solder paste contains 2% of silver which avoids silver migration from the AgPd pad into the solder paste. The melting point of this paste is slightly lower (179°C) than the the standard Sn63Pb37 solder paste. DO NOT USE SN63PB37 Solder Paste for soldering MS5534A ! Soldering Quality A good solder connection should look like shown on the photo to the below left forming a slight angle and filling the via almost to the top. DO ALWAYS SOLDER BY REFLOW using the recommended reflow profile. Soldering by hand will in most cases result in overheating of the device due to the good thermal conductivity of the ceramic. It is recommended to optimize the profile attaching a thermocouple to the sensor. Too low temperature will result in incomplete soldering resulting in a much less strong connection to the PCB as can be seen on the photo below right. For prototyping purposes cables can be soldered to the solder bumps on the backside of the sensor. The cable should be very thin to avoid lifting off the contact pad from the ceramic. Wire wrap cables will normally do a good job. Bad Solder Contact Good Solder Contact DA5534_022.doc ECN493 July 17th, 2002 18 Mechanical Stress It is recommended to avoid mechanical stress on the PCB on which the sensor is mounted. The thickness of the PCB should be not below 1.6mm. A thicker PCB is more stiff creating less stress on the soldering contacts. For applications where mechanical stress cannot be avoided (for example ultrasound welding of the case or thin PCB’s in watches) please fix the sensor with drops of low stress epoxy (for example Hysol FP-4401) at the corners of the sensor as shown below. Fixing with Globtop increases mechanical stability Mounting The MS5534A can be placed with automatic Pick&Place equipment using vacuum nozzles. It will not be damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. Special care has to be taken to not touch the protective gel of the sensor during the assembly. The MS5534A can be mounted with the cap down or the cap looking upwards. In both cases it is important to solder all contact pads. The Pins PEN and PV shall be left open or connected to Vdd. DO NOT CONNECT TO GND ! Solder at both sides to increase mechanical stability Placement Cap down (hole in PCB to fit cap) Placement Cap up (rectangular hole in PCB to fit Globtop) Sealing with O-Ring In products like outdoor watches the electronics must be protected against direct water or humidity. For those products the MS5534-AM provides the possibility to seal with an O-Ring. The protective cap of the MS5534-AM is made of special anticorrosive stainless steel with a polished surface. In addition to this the MS5534-AM is filled with silicone gel covering the sensor and the bonding wires. The O-Ring (or O-Rings) shall be placed at the outer diameter of the metal cap. This method avoids mechanical stress because the sensor can move in vertical direction. DA5534_022.doc ECN493 July 17th, 2002 19 Cleaning The MS5534A has been manufactured under cleanroom conditions. Each device has been inspected for the homogenity and the cleaningness of the silicone gel. It is therefore recommended to assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “No-Clean” shall be used. CLEANING MIGHT DAMAGE THE SENSOR. ESD Precautions The electrical contacts except programming pads are protected against ESD according to 2KV HBM (human body model). The programming pads are more sensitive due to the nature of the OTP programming cells that store the calibration coefficients. The breakdown voltage of PEN and PV is 800V typical. It is therefore essential to ground machines and personal properly during assembly and handling of the device. The MS5534A is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material. DA5534_022.doc ECN493 July 17th, 2002 20 ORDERING INFORMATION Product Code MS5534AP Product Barometer Module with plastic cap MS5534AM Barometer Module with metal cap Package SMD hybrid with solder paste, plastic protection cap SMD hybrid with solder paste, metal protection cap, silicon gel sensor protection Comments standard version Recommended for outdoor products FACTORY CONTACTS Intersema Sensoric SA Ch. Chapons-des-Prés 11 CH-2022 BEVAIX Tel. (032) 847 9550 Tel. Int. +41 32 847 9550 Telefax +41 32 847 9569 e-mail: [email protected] http://www.intersema.com SWITZERLAND LOCAL DISTRIBUTOR Germany: USA: AMSYS GmbH An der Fahrt 13 D-55124 Mainz Tel. Int. +49 6131 46 98 75 55 Telefax +49 6131 46 98 75 66 http://www.amsys.de Servoflo Cooperation 75 Allen Street Lexington, MA 02421 Tel. Int. +1 781 862 9572 Telefax +1 781 862 9244 http://www.servoflo.com NOTICE Intersema reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Intersema assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Intersema makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. DA5534_022.doc ECN493 July 17th, 2002 21