201208 Chip Bead For EMI Suppression CIB/CIM10 Series (1608/ EIA 0603) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.6~0.8mm Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering Monolithic inorganic material construction for high reliability Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm DIMENSION Type 10 Dimension [mm] L W t d 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 DESCRIPTION Thickness Impedance DC Resistance Rated Current (mm) (Ω)±25%@100MHz (Ω) Max. (mA) Max. CIB10P100 0.8±0.15 10 0.05 1000 CIB10P220 0.8±0.15 22 0.05 1500 CIB10P260 0.8±0.15 26 0.08 1000 CIB10P300 0.8±0.15 30 0.08 1000 Part no. CIB10P330 0.8±0.15 33 0.08 1000 CIM10U800 0.8±0.15 80 0.10 600 CIM10U121 0.8±0.15 120 0.15 500 CIM10U221 0.8±0.15 220 0.25 400 CIM10U241 0.8±0.15 240 0.25 400 CIM10U301 0.8±0.15 300 0.30 400 CIM10U471 0.8±0.15 470 0.35 300 CIM10U601 0.8±0.15 600 0.38 500 CIM10U102 0.8±0.15 1000 0.50 400 CIM10U202 0.8±0.15 2000(at 70MHz) 1.20 200 CIB10J300 0.8±0.15 30 0.10 1000 CIM10J400 0.8±0.15 40 0.12 600 CIM10J470 0.8±0.15 47 0.12 600 CIM10J600 0.8±0.15 60 0.12 600 CIM10J750 0.8±0.15 75 0.15 550 CIM10J800 0.8±0.15 80 0.15 550 CIM10J121 0.8±0.15 120 0.20 500 CIM10J151 0.8±0.15 150 0.20 400 CIM10J221 0.8±0.15 220 0.30 400 CIM10J241 0.8±0.15 240 0.30 400 Ver 201208 Thickness Impedance DC Resistance Rated Current (mm) (Ω)±25%@100MHz (Ω) Max. (mA) Max. CIM10J301 0.8±0.15 300 0.35 400 CIM10J471 0.8±0.15 470 0.35 300 CIM10J601 0.8±0.15 600 0.45 300 CIM10J751 0.8±0.15 750 0.50 300 CIM10J102 0.8±0.15 1000 0.60 250 CIM10J152 0.8±0.15 1500 0.70 250 Part no. CIM10J252 0.8±0.15 2500 1.50 200 CIM10K152 0.8±0.15 1500 0.80 250 CIM10K202 0.8±0.15 2000 1.00 200 200 CIM10K252 0.8±0.15 2500 1.20 CIM10N700 0.8±0.15 70 0.30 500 CIM10N121 0.8±0.15 120 0.45 400 CIM10N241 0.8±0.15 240 0.60 300 CIM10F470 0.8±0.15 47 0.25 550 CIM10F600 0.8±0.15 60 0.25 550 CIM10F121 0.8±0.15 120 0.30 500 CIM10F331 0.8±0.15 330 0.58 400 CIM10F471 0.8±0.15 470 0.85 300 CHARACTERISTIC DATA Ver 201208 Ver 201208 Ver 201208 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (6) (7) M (2) 10 U (3) (4) 121 (5) N C (6) (7) Chip Beads (2) M: Multi-layer type B:Mono-layer type Dimension (4) Material Code Nominal impedance (121:120Ω, 202:2000Ω ) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Card Board Taping Quantity(pcs/reel) 4000 ■ NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.