Material Content Data Sheet Sales Product Name BTS5008-1EKB MA# MA001109718 Package PG-DSO-14-47 Issued 29. August 2013 Weight* 151.05 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 4.820 3.19 0.017 0.01 0.069 0.05 458 1.383 0.92 9159 56.175 37.19 38.17 371902 381633 0.787 0.52 0.52 5210 5210 0.165 0.11 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.19 31912 31912 114 1093 7.593 5.03 74.775 49.50 54.64 495041 546403 2.472 1.64 1.64 16364 16364 1.470 0.97 0.97 9734 9734 0.231 0.15 1.090 0.72 50269 1530 0.87 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 7214 8744 1000000