E2D0040-39-22 This version: Feb. 1999 MSM6597A-xxx Previous version: May. 1997 ¡ Semiconductor MSM6597A-xxx ¡ Semiconductor 3-Mbit Serial Voice ROM GENERAL DESCRIPTION The MSM6597A is a MSM6597 short TAT process version. The MSM6597A is a serial voice ROM with a 1,048,576-word ¥ 1-bit ¥ 3-bank configuration. The MSM6597A has a built-in internal address-generating circuit. A single, external clock input allows continuous, serial read operations. The internal addresses are automatically incremented by 1 by read operation. 1024 words in X direction and 1024 words in Y direction can be addressed by inputting external serial addresses. Banks are switched with CS1, CS2, and CS3. A read and playback device with predetermined messages can easily be configured by storing voice data into the MSM6597A and by combining it with one of Oki's recording and playback ICs and with one of Oki's serial registers. A serial register is required to drive the MSM6597A when used with the MSM6388 or MSM6588. (The MSM6597A does not operate without a serial register.) The major differences between the MSM6597A and MSM6597 are shown below. MSM6597A DC Characteristics VDD = 3.5 to 5.5 V, Ta = –40 to +85°C Parameter Current Consumption (1) Current Consumption (2) Symbol Condition Min. Typ. Max. Unit IDD tRDC = 2.5 ms — 9 20 mA — — 10 IDS Ta = –40 CS1 = CS2 = CS3 to +70°C = VDD – 0.2 V Ta = –40 to +85°C mA — — 50 MSM6597 DC Characteristics VDD = 3.5 to 5.5 V, Ta = –40 to +85C° Symbol Condition Min. Typ. Max. Unit Current Consumption (1) Parameter IDD tRDC = 2.5 ms — — 15 mA Current Consumption (2) IDS CS1 = CS2 = CS3 = VDD – 0.2 V — — 10 mA Typical values are at VDD = 5.0 V, Ta = 25°C For other detailes, refer to individual sections in this data sheet. FEATURES • Configuration • Serial access • Shorter-TAT processing • Power-supply voltage • Package options : 24-pin plastic SOP (SOP24-P-430-1.27-K) 30-pin plastic SSOP (SSOP30-P-56-0.65-K) : : 1,048,576 words ¥ 1 bit ¥ 3 banks Read cycle time of 2.5 ms : 5 V single supply (Product name : MSM6597A-xxxGS-K) (Product name : MSM6597A-xxxGS-AK) 1/9 ¡ Semiconductor MSM6597A-xxx BLOCK DIAGRAM 1 2 CK 10 Y-ADDRESS COUNTER Sin Y-ADDRESS REGISTER Memory Cell Matrix 393216 x 8 MULTIPLEXER VDD GND LD CK SADY SASY X-DECODER 10 10 Y-DECODER SASX X-ADDRESS REGISTER Sin X-ADDRESS COUNTER SADX 6 3 TEST TESTO1 TESTO2 MULTIPLEXER LD CK CK DOUT TAS RDCK CS1 CS2 CS3 CS CONTROLLER PIN CONFIGURATION (TOP VIEW) SADY 1 SASY 2 CS2 3 CS1 4 NC 5 NC 6 NC 7 NC 8 SADX 9 SASX 10 TAS 11 VDD 12 24 23 22 21 20 19 18 17 16 15 14 13 NC : No connection GND CS3 DOUT TESTO1 NC NC NC NC NC RDCK TESTO2 TEST SADY SASY CS2 NC CS1 NC NC NC NC NC NC SADX SASX TAS VDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 GND CS3 DOUT TESTO1 NC NC NC NC NC NC NC NC RDCK TESTO2 TEST 24-Pin Plastic SOP NC : No connection 30-Pin Plastic SSOP 2/9 ¡ Semiconductor MSM6597A-xxx PIN DESCRIPTIONS Pin SOP SSOP Description Symbol Type 12 15 VDD — Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this pin and the GND pin. 24 30 GND — Ground pin 9 12 SADX I (SERIAL ADDRESS) This pin inputs the starting X address of a read operation. Addressing in units of 1024 words is possible. The 1024-word address data can be input as 10-bit (AX0 - AX9) serial data via the SADX pin. 1 1 SADY I (SERIAL ADDRESS) This pin inputs the starting Y address of a read operation. Addressing in units of 1024 words is possible. The 1024-word address data can be input as 10-bit (AY0 - AY9) serial data via the SADY pin. 10 13 SASX I (SERIAL ADDRESS STROBE) This is the clock input pin which is used to store the serial address data of the X address into the device's internal register. 2 2 SASY I (SERIAL ADDRESS STROBE) This is the clock input pin which is used to store the serial address data of the Y address into the device's internal register. I (ADDRESS TRANSFER STROBE) This is the input pin for loading the serial address data into the internal address counter. The X and Y addresses are stored at the falling edge of TAS. I (READ CLOCK) This is the clock input pin for reading information out of the data register. Internal operation starts at the falling edge of RDCK. The information in the data register is output on the DOUT pin. The internal address counter is automatically incremented by 1 at the falling edge of RDCK. 11 15 TAS 14 18 RDCK 22 28 DOUT 4 5 CS1 3 3 CS2 23 29 CS3 13 16 TEST 21 27 TESTO1 14 17 TESTO2 O (DATA OUT) The data output pin is always kept in a high-impedance state when CS1, CS2, and CS3 are all kept "H" or when RDCK is kept "H". This pin reflects the "H" or "L" level data being read, and the current data is hold until RDCH is asserted High. I (CHIP SELECT) When either CS1, CS2, or CS3 is "L", bank 1, bank 2, or bank 3 is selected, respectively. Setting all three signals "H" disables all input and output pins. These pins enable parallel use of multiple serial voice ROMs by connecting the data output pins. I Pin for testing. Apply "L" level. O Pins for testing. Leave these pins open. ABSOLUTE MAXIMUM RATINGS Symbol Condition Rating Unit Power Supply Voltage Parameter VDD Ta = 25°C –0.3 to +7.0 V Input Voltage VIN Ta = 25°C –0.3 to VDD+0.3 V Storage Temperature TSTG — –55 to +150 °C 3/9 ¡ Semiconductor MSM6597A-xxx RECOMMENDED OPERATING CONDITIONS Symbol Condition Range Unit Power Supply Voltage Parameter VDD GND=0V 3.5 to 5.5 V Operating Temperature Top — –40 to +85 °C ELECTRICAL CHARACTERISTICS DC Characteristics VDD = 3.5 to 5.5 V, Ta = –40 to +85°C Symbol Condition Min. Typ. Max. Unit "H" Level Input Voltage Parameter VIH — 0.8xVDD — — V "L" Level Input Voltage VIL — — — 0.8 V "H" Level Output Voltage VOH IOH = –40 mA VDD–0.3 — — V "L" Level Output Voltage VOL IOL = 2 mA — — 0.45 V "H" Level Input Current IIH VIH = VDD — — 10 mA "L" Level Input Current IIL VIL = GND –10 — — mA Current Consumption (1) IDD tRDC = 2.5 ms mA Current Consumption (2) IDS CS1 = CS2 = CS3 = VDD – 0.2 V — 9 20 Ta = –40 to +70°C — — 10 Ta = –40 to +85°C — — 50 mA Typical values are at VDD = 5.0 V, Ta = 25°C AC Characteristics VDD = 3.5 to 5.5 V, Ta = –40 to +85°C Parameter CS, SAS Setup Time Symbol Min. Max. Unit tCSS 1000 — ns SASX, SASY Cycle Time tSSC 500 — ns SASX, SASY Precharge Time tSAP 250 — ns SASX, SASY Pulse Width tSAS 250 — ns Address Setup Time tAS 100 — ns Address Hold Time tAH 100 — ns TAS Setup Time tATS 500 — ns TAS, RDCK Setup Time tTRS 500 — ns TAS Pulse Width tTAS 250 — ns Read Cycle Time tRDC 2500 — ns Access Time tACC — 1500 ns Output Turn-off Delay Time tOFF 0 200 ns RDCK Precharge Time tRDP 1000 — ns RDCK Pulse Width tRD 1500 — ns 4/9 AX0 SADX (I) AX1 AX2 AX3 AX4 AX5 AX6 AX7 tAH tAS SASX (I) tSAS tCSS AY0 tAH AY1 AY2 AY3 tAS SASY (I) tSAS tCSS AX9 AY5 AY6 AY7 AY8 AY9 tATS tSSC tTAS 5/9 MSM6597A-xxx TAS (I) tSAP AY4 AX8 tATS tSAP tSSC SADY (I) ,, , , ,,,,, , CS3 (I) ¡ Semiconductor CS2 (I) TIMING DIAGRAMS Serial Address Input Timing CS1 (I) ¡ Semiconductor Read Access Timing , , TAS (I) tTAS tRDC tTRS RDCK (I) tRD tRDP tOFF DOUT (O) XnYm XnYm+1 XnYm+2 XnY1023 Xn+1Y0 Xn+1Y1 tACC MSM6597A-xxx 6/9 ¡ Semiconductor MSM6597A-xxx APPLICATION CIRCUIT MSM6588 Playback Storage Example MCUM TEST RSEL1 RSEL2 TEST TEST TEST TEST RESET MIN + MSM6588 RD WR CE AU/D TEST TEST TEST TEST TEST CS SADX SASX TAS RDCK GND DOUT SASY SADY 3-Mbit SERIAL VOICE ROM MSM6597A-xxx D3 D2 D1 D0 VDD VDD SAD SAS TAS RWCK WE DIN DOUT SAD SAS TAS RWCK WE DI/O MSM6389 MICROCONTROLLER DVDD DVDD' AVDD TEST CS1 CS2 CS3 GND CS1 CS2 CS3 CS4 MON XT XT 4.096 MHz MOUT LIN AVDD + + LOUT AMON FIN FOUT ADIN SG DGND DGND AOUT SPEAKER AMPLIFIER AGND AGND Note: When the MSM6597A is driven by the MSM6388 or MSM6588, a serial register is required. (The MSM6597A does not operate without it.) 7/9 ¡ Semiconductor MSM6597A-xxx PACKAGE DIMENSIONS (Unit : mm) SOP24-P-430-1.27-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 8/9 ¡ Semiconductor MSM6597A-xxx (Unit : mm) SSOP30-P-56-0.65-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.19 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 9/9 E2Y0002-29-11 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. Printed in Japan