OKI MSM6597A 3-mbit serial voice rom Datasheet

E2D0040-39-22
This version:
Feb. 1999
MSM6597A-xxx
Previous version: May. 1997
¡ Semiconductor
MSM6597A-xxx
¡ Semiconductor
3-Mbit Serial Voice ROM
GENERAL DESCRIPTION
The MSM6597A is a MSM6597 short TAT process version.
The MSM6597A is a serial voice ROM with a 1,048,576-word ¥ 1-bit ¥ 3-bank configuration.
The MSM6597A has a built-in internal address-generating circuit. A single, external clock input
allows continuous, serial read operations. The internal addresses are automatically incremented
by 1 by read operation. 1024 words in X direction and 1024 words in Y direction can be addressed
by inputting external serial addresses. Banks are switched with CS1, CS2, and CS3.
A read and playback device with predetermined messages can easily be configured by storing voice
data into the MSM6597A and by combining it with one of Oki's recording and playback ICs and with
one of Oki's serial registers.
A serial register is required to drive the MSM6597A when used with the MSM6388 or MSM6588. (The
MSM6597A does not operate without a serial register.)
The major differences between the MSM6597A and MSM6597 are shown below.
MSM6597A DC Characteristics
VDD = 3.5 to 5.5 V, Ta = –40 to +85°C
Parameter
Current Consumption (1)
Current Consumption (2)
Symbol
Condition
Min.
Typ.
Max.
Unit
IDD
tRDC = 2.5 ms
—
9
20
mA
—
—
10
IDS
Ta = –40
CS1 = CS2 = CS3 to +70°C
= VDD – 0.2 V
Ta = –40
to +85°C
mA
—
—
50
MSM6597 DC Characteristics
VDD = 3.5 to 5.5 V, Ta = –40 to +85C°
Symbol
Condition
Min.
Typ.
Max.
Unit
Current Consumption (1)
Parameter
IDD
tRDC = 2.5 ms
—
—
15
mA
Current Consumption (2)
IDS
CS1 = CS2 = CS3 = VDD – 0.2 V
—
—
10
mA
Typical values are at VDD = 5.0 V, Ta = 25°C
For other detailes, refer to individual sections in this data sheet.
FEATURES
• Configuration
• Serial access
• Shorter-TAT processing
• Power-supply voltage
• Package options :
24-pin plastic SOP (SOP24-P-430-1.27-K)
30-pin plastic SSOP (SSOP30-P-56-0.65-K)
:
:
1,048,576 words ¥ 1 bit ¥ 3 banks
Read cycle time of 2.5 ms
:
5 V single supply
(Product name : MSM6597A-xxxGS-K)
(Product name : MSM6597A-xxxGS-AK)
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¡ Semiconductor
MSM6597A-xxx
BLOCK DIAGRAM
1
2
CK
10
Y-ADDRESS
COUNTER
Sin
Y-ADDRESS
REGISTER
Memory Cell
Matrix
393216 x 8
MULTIPLEXER
VDD
GND
LD
CK
SADY
SASY
X-DECODER
10
10
Y-DECODER
SASX
X-ADDRESS
REGISTER
Sin
X-ADDRESS
COUNTER
SADX
6
3
TEST
TESTO1
TESTO2
MULTIPLEXER
LD
CK
CK
DOUT
TAS
RDCK
CS1
CS2
CS3
CS CONTROLLER
PIN CONFIGURATION (TOP VIEW)
SADY 1
SASY 2
CS2 3
CS1 4
NC 5
NC 6
NC 7
NC 8
SADX 9
SASX 10
TAS 11
VDD 12
24
23
22
21
20
19
18
17
16
15
14
13
NC : No connection
GND
CS3
DOUT
TESTO1
NC
NC
NC
NC
NC
RDCK
TESTO2
TEST
SADY
SASY
CS2
NC
CS1
NC
NC
NC
NC
NC
NC
SADX
SASX
TAS
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
GND
CS3
DOUT
TESTO1
NC
NC
NC
NC
NC
NC
NC
NC
RDCK
TESTO2
TEST
24-Pin Plastic SOP
NC : No connection
30-Pin Plastic SSOP
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¡ Semiconductor
MSM6597A-xxx
PIN DESCRIPTIONS
Pin
SOP SSOP
Description
Symbol Type
12
15
VDD
—
Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this pin and the
GND pin.
24
30
GND
—
Ground pin
9
12
SADX
I
(SERIAL ADDRESS) This pin inputs the starting X address of a read operation.
Addressing in units of 1024 words is possible. The 1024-word address data can be
input as 10-bit (AX0 - AX9) serial data via the SADX pin.
1
1
SADY
I
(SERIAL ADDRESS) This pin inputs the starting Y address of a read operation.
Addressing in units of 1024 words is possible. The 1024-word address data can be
input as 10-bit (AY0 - AY9) serial data via the SADY pin.
10
13
SASX
I
(SERIAL ADDRESS STROBE) This is the clock input pin which is used to store the
serial address data of the X address into the device's internal register.
2
2
SASY
I
(SERIAL ADDRESS STROBE) This is the clock input pin which is used to store the
serial address data of the Y address into the device's internal register.
I
(ADDRESS TRANSFER STROBE) This is the input pin for loading the serial address
data into the internal address counter.
The X and Y addresses are stored at the falling edge of TAS.
I
(READ CLOCK) This is the clock input pin for reading information out of the data
register. Internal operation starts at the falling edge of RDCK. The information in the
data register is output on the DOUT pin. The internal address counter is automatically
incremented by 1 at the falling edge of RDCK.
11
15
TAS
14
18
RDCK
22
28
DOUT
4
5
CS1
3
3
CS2
23
29
CS3
13
16
TEST
21
27
TESTO1
14
17
TESTO2
O
(DATA OUT) The data output pin is always kept in a high-impedance state when CS1,
CS2, and CS3 are all kept "H" or when RDCK is kept "H". This pin reflects the "H" or "L"
level data being read, and the current data is hold until RDCH is asserted High.
I
(CHIP SELECT) When either CS1, CS2, or CS3 is "L", bank 1, bank 2, or bank 3 is
selected, respectively. Setting all three signals "H" disables all input and output
pins. These pins enable parallel use of multiple serial voice ROMs by connecting the
data output pins.
I
Pin for testing. Apply "L" level.
O
Pins for testing. Leave these pins open.
ABSOLUTE MAXIMUM RATINGS
Symbol
Condition
Rating
Unit
Power Supply Voltage
Parameter
VDD
Ta = 25°C
–0.3 to +7.0
V
Input Voltage
VIN
Ta = 25°C
–0.3 to VDD+0.3
V
Storage Temperature
TSTG
—
–55 to +150
°C
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¡ Semiconductor
MSM6597A-xxx
RECOMMENDED OPERATING CONDITIONS
Symbol
Condition
Range
Unit
Power Supply Voltage
Parameter
VDD
GND=0V
3.5 to 5.5
V
Operating Temperature
Top
—
–40 to +85
°C
ELECTRICAL CHARACTERISTICS
DC Characteristics
VDD = 3.5 to 5.5 V, Ta = –40 to +85°C
Symbol
Condition
Min.
Typ.
Max.
Unit
"H" Level Input Voltage
Parameter
VIH
—
0.8xVDD
—
—
V
"L" Level Input Voltage
VIL
—
—
—
0.8
V
"H" Level Output Voltage
VOH
IOH = –40 mA
VDD–0.3
—
—
V
"L" Level Output Voltage
VOL
IOL = 2 mA
—
—
0.45
V
"H" Level Input Current
IIH
VIH = VDD
—
—
10
mA
"L" Level Input Current
IIL
VIL = GND
–10
—
—
mA
Current Consumption (1)
IDD
tRDC = 2.5 ms
mA
Current Consumption (2)
IDS
CS1 = CS2 = CS3
= VDD – 0.2 V
—
9
20
Ta = –40
to +70°C
—
—
10
Ta = –40
to +85°C
—
—
50
mA
Typical values are at VDD = 5.0 V, Ta = 25°C
AC Characteristics
VDD = 3.5 to 5.5 V, Ta = –40 to +85°C
Parameter
CS, SAS Setup Time
Symbol
Min.
Max.
Unit
tCSS
1000
—
ns
SASX, SASY Cycle Time
tSSC
500
—
ns
SASX, SASY Precharge Time
tSAP
250
—
ns
SASX, SASY Pulse Width
tSAS
250
—
ns
Address Setup Time
tAS
100
—
ns
Address Hold Time
tAH
100
—
ns
TAS Setup Time
tATS
500
—
ns
TAS, RDCK Setup Time
tTRS
500
—
ns
TAS Pulse Width
tTAS
250
—
ns
Read Cycle Time
tRDC
2500
—
ns
Access Time
tACC
—
1500
ns
Output Turn-off Delay Time
tOFF
0
200
ns
RDCK Precharge Time
tRDP
1000
—
ns
RDCK Pulse Width
tRD
1500
—
ns
4/9
AX0
SADX (I)
AX1
AX2
AX3
AX4
AX5
AX6
AX7
tAH
tAS
SASX (I)
tSAS
tCSS
AY0
tAH
AY1
AY2
AY3
tAS
SASY (I)
tSAS
tCSS
AX9
AY5
AY6
AY7
AY8
AY9
tATS
tSSC
tTAS
5/9
MSM6597A-xxx
TAS (I)
tSAP
AY4
AX8
tATS
tSAP
tSSC
SADY (I)
,,
,
,
,,,,,
,
CS3 (I)
¡ Semiconductor
CS2 (I)
TIMING DIAGRAMS
Serial Address Input Timing
CS1 (I)
¡ Semiconductor
Read Access Timing
, ,
TAS (I)
tTAS
tRDC
tTRS
RDCK (I)
tRD
tRDP
tOFF
DOUT (O)
XnYm
XnYm+1
XnYm+2
XnY1023
Xn+1Y0
Xn+1Y1
tACC
MSM6597A-xxx
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¡ Semiconductor
MSM6597A-xxx
APPLICATION CIRCUIT
MSM6588 Playback Storage Example
MCUM
TEST
RSEL1
RSEL2
TEST
TEST
TEST
TEST
RESET
MIN
+
MSM6588
RD
WR
CE
AU/D
TEST
TEST
TEST
TEST
TEST
CS
SADX
SASX
TAS
RDCK
GND
DOUT
SASY
SADY
3-Mbit SERIAL VOICE ROM
MSM6597A-xxx
D3
D2
D1
D0
VDD
VDD
SAD
SAS
TAS
RWCK
WE
DIN
DOUT
SAD
SAS
TAS
RWCK
WE
DI/O
MSM6389
MICROCONTROLLER
DVDD DVDD' AVDD
TEST
CS1 CS2 CS3 GND
CS1
CS2
CS3
CS4
MON
XT
XT
4.096 MHz
MOUT
LIN
AVDD
+
+
LOUT
AMON
FIN
FOUT
ADIN
SG
DGND
DGND
AOUT
SPEAKER AMPLIFIER
AGND
AGND
Note: When the MSM6597A is driven by the MSM6388 or MSM6588, a serial register is required.
(The MSM6597A does not operate without it.)
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¡ Semiconductor
MSM6597A-xxx
PACKAGE DIMENSIONS
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
8/9
¡ Semiconductor
MSM6597A-xxx
(Unit : mm)
SSOP30-P-56-0.65-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.19 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
9/9
E2Y0002-29-11
NOTICE
1.
The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or
unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party’s right which may result from the use thereof.
6.
The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.
7.
Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.
8.
No part of the contents cotained herein may be reprinted or reproduced without our prior
permission.
9.
MS-DOS is a registered trademark of Microsoft Corporation.
Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan
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