LPC11Cx2/Cx4 32-bit ARM Cortex-M0 microcontroller; 16/32 kB flash, 8 kB SRAM; C_CAN Rev. 2 — 3 December 2010 Product data sheet 1. General description The LPC11Cx2/Cx4 are an ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11Cx2/Cx4 operate at CPU frequencies of up to 50 MHz. The peripheral complement of the LPC11Cx2/Cx4 includes 16/32 kB of flash memory, 8 kB of data memory, one C_CAN controller, one Fast-mode Plus I2C-bus interface, one RS-485/EIA-485 UART, two SPI interfaces with SSP features, four general purpose counter/timers, a 10-bit ADC, and up to 40 general purpose I/O pins. On-chip C_CAN drivers and flash In-System Programming tools via C_CAN are included. In addition, the LPC11C22 and LPC11C24 parts include an on-chip, high-speed CAN transceiver. 2. Features and benefits System: ARM Cortex-M0 processor, running at frequencies of up to 50 MHz. ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC). Serial Wire Debug. System tick timer. Memory: 32 kB (LPC11Cx4) or 16 kB (LPC11Cx2) on-chip flash program memory. 8 kB SRAM data memory. In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software. Flash ISP commands can be issued via UART or C_CAN. Digital peripherals: General Purpose I/O (GPIO) pins with configurable pull-up/pull-down resistors. 40 GPIO pins on the LPC11C12/C14 parts; 36 GPIO pins on the LPC11C22/C24 parts. GPIO pins can be used as edge and level sensitive interrupt sources. High-current output driver (20 mA) on one pin. High-current sink drivers (20 mA) on two I2C-bus pins in Fast-mode Plus. Four general purpose counter/timers with a total of four capture inputs and 13 (LPC11C12/C14) or 12 (LPC11C22/C24) match outputs. LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Programmable WatchDog Timer (WDT). Analog peripherals: 10-bit ADC with input multiplexing among 8 pins. Serial interfaces: UART with fractional baud rate generation, internal FIFO, and RS-485 support. Two SPI controllers with SSP features and with FIFO and multi-protocol capabilities. I2C-bus interface supporting full I2C-bus specification and Fast-mode Plus with a data rate of 1 Mbit/s with multiple address recognition and monitor mode. C_CAN controller. On-chip C_CAN and CANopen drivers included. On-chip, high-speed CAN transceiver (parts LPC11C22/C24 only). Clock generation: 12 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as a system clock. Crystal oscillator with an operating range of 1 MHz to 25 MHz. Programmable watchdog oscillator with a frequency range of 7.8 kHz to 1.8 MHz. PLL allows CPU operation up to the maximum CPU rate without the need for a high-frequency crystal. May be run from the system oscillator or the internal RC oscillator. Clock output function with divider that can reflect the system oscillator, IRC, CPU clock, or the Watchdog clock. Power control: Integrated PMU (Power Management Unit) to minimize power consumption during Sleep, Deep-sleep, and Deep power-down modes. Three reduced power modes: Sleep, Deep-sleep, and Deep power-down. Processor wake-up from Deep-sleep mode via a dedicated start logic using 13 of the GPIO pins. Power-On Reset (POR). Brownout detect with four separate thresholds for interrupt and forced reset. Unique device serial number for identification. Single 3.3 V power supply (1.8 V to 3.6 V). Available as 48-pin LQFP package. 3. Applications eMetering Elevator systems LPC11CX2_CX4 Product data sheet Industrial and sensor based networks White goods All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 2 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 4. Ordering information Table 1. Ordering information Type number Package Name Description Version LPC11C12FBD48/301 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7 7 sot313-2 1.4 mm LPC11C14FBD48/301 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7 7 sot313-2 1.4 mm LPC11C22FBD48/301 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7 7 sot313-2 1.4 mm LPC11C24FBD48/301 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7 7 sot313-2 1.4 mm 4.1 Ordering options Table 2. Ordering options Type number Flash Total UART SRAM RS-485 I2C/ SPI C_CAN C_CAN with GPIO Fast+ on-chip pins CAN transceiver ADC Package channels LPC11C12FBD48/301 16 kB 8 kB 1 1 2 1 no 40 8 LQFP48 LPC11C14FBD48/301 32 kB 8 kB 1 1 2 1 no 40 8 LQFP48 LPC11C22FBD48/301 16 kB 8 kB 1 1 2 1 yes 36 8 LQFP48 LPC11C24FBD48/301 32 kB 8 kB 1 1 2 1 yes 36 8 LQFP48 LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 3 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 5. Block diagram XTALIN XTALOUT RESET SWD LPC11Cx2/Cx4 IRC TEST/DEBUG INTERFACE CLOCK GENERATION, POWER CONTROL, SYSTEM FUNCTIONS POR ARM CORTEX-M0 system bus clocks and controls FLASH 16/32 kB slave HIGH-SPEED GPIO GPIO ports PIO0/1/2/3 CLKOUT SRAM 8 kB slave ROM slave slave AHB-LITE BUS slave AHB TO APB BRIDGE RXD TXD DTR, DSR, CTS, DCD, RI, RTS CT32B0_MAT[3:0] CT32B0_CAP0 CT32B1_MAT[3:0] CT32B1_CAP0 CT16B0_MAT[2:0] CT16B0_CAP0 CT16B1_MAT[1:0](1) CT16B1_CAP0 CAN_TXD CAN_RXD CANL, CANH STB VCC, VDD_CAN UART AD[7:0] 10-bit ADC SPI0 SCK0, SSEL0 MISO0, MOSI0 SPI1 SCK1, SSEL1 MISO1, MOSI1 32-bit COUNTER/TIMER 0 32-bit COUNTER/TIMER 1 SCL SDA I2C-BUS 16-bit COUNTER/TIMER 0 WDT 16-bit COUNTER/TIMER 1 IOCONFIG C_CAN (LPC11C12/C14) SYSTEM CONTROL C_CAN/ ON-CHIP TRANSCEIVER (LPC11C22/C24) PMU 002aaf265 (1) CT16B1_MAT0 not available on parts LPC11C22/C24. Fig 1. LPC11Cx2/Cx4 block diagram LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 4 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 6. Pinning information 37 PIO3_1/DSR 38 PIO2_3/RI/MOSI1 39 SWDIO/PIO1_3/AD4/CT32B1_MAT2 40 PIO1_4/AD5/CT32B1_MAT3/WAKEUP 41 VSS 42 PIO1_11/AD7 43 PIO3_2/DCD 44 VDD 45 PIO1_5/RTS/CT32B0_CAP0 46 PIO1_6/RXD/CT32B0_MAT0 47 PIO1_7/TXD/CT32B0_MAT1 48 PIO3_3/RI 6.1 Pinning PIO2_6 1 36 PIO3_0/DTR PIO2_0/DTR/SSEL1 2 35 R/PIO1_2/AD3/CT32B1_MAT1 RESET/PIO0_0 3 34 R/PIO1_1/AD2/CT32B1_MAT0 PIO0_1/CLKOUT/CT32B0_MAT2 4 33 R/PIO1_0/AD1/CT32B1_CAP0 VSS 5 XTALIN 6 XTALOUT 7 VDD 8 29 SWCLK/PIO0_10/SCK0/CT16B0_MAT2 PIO1_8/CT16B1_CAP0 9 28 PIO0_9/MOSI0/CT16B0_MAT1 PIO0_2/SSEL0/CT16B0_CAP0 10 27 PIO0_8/MISO0/CT16B0_MAT0 32 R/PIO0_11/AD0/CT32B0_MAT3 30 PIO1_10/AD6/CT16B1_MAT1 PIO2_9 24 PIO0_7/CTS 23 PIO0_6/SCK0 22 PIO2_5 21 CAN_TXD 20 CAN_RXD 19 PIO2_4 18 PIO1_9/CT16B1_MAT0 17 PIO0_5/SDA 16 25 PIO2_10 PIO0_4/SCL 15 26 PIO2_2/DCD/MISO1 PIO2_8 12 PIO0_3 14 PIO2_7 11 PIO2_1/DSR/SCK1 13 Fig 2. 31 PIO2_11/SCK0 LPC11C12FBD48/301 LPC11C14FBD48/301 002aaf266 Pin configuration (LPC11C12/C14) LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 5 of 61 LPC11Cx2/Cx4 NXP Semiconductors 37 PIO3_1/DSR 38 PIO2_3/RI/MOSI1 39 SWDIO/PIO1_3/AD4/CT32B1_MAT2 40 PIO1_4/AD5/CT32B1_MAT3/WAKEUP 41 VSS 42 PIO1_11/AD7 43 PIO3_2/DCD 44 VDD 45 PIO1_5/RTS/CT32B0_CAP0 46 PIO1_6/RXD/CT32B0_MAT0 47 PIO1_7/TXD/CT32B0_MAT1 48 PIO3_3/RI 32-bit ARM Cortex-M0 microcontroller PIO2_6 1 36 PIO3_0/DTR PIO2_0/DTR/SSEL1 2 35 R/PIO1_2/AD3/CT32B1_MAT1 RESET/PIO0_0 3 34 R/PIO1_1/AD2/CT32B1_MAT0 PIO0_1/CLKOUT/CT32B0_MAT2 4 33 R/PIO1_0/AD1/CT32B1_CAP0 VSS 5 32 R/PIO0_11/AD0/CT32B0_MAT3 XTALIN 6 XTALOUT 7 VDD 8 29 SWCLK/PIO0_10/SCK0/CT16B0_MAT2 PIO1_8/CT16B1_CAP0 9 28 PIO0_9/MOSI0/CT16B0_MAT1 PIO0_2/SSEL0/CT16B0_CAP0 10 27 PIO0_8/MISO0/CT16B0_MAT0 30 PIO1_10/AD6/CT16B1_MAT1 PIO0_7/CTS 24 PIO0_6/SCK0 23 STB 22 VCC 20 GND 21 CANH 19 CANL 18 VDD_CAN 17 PIO0_5/SDA 16 25 PIO2_10 PIO0_4/SCL 15 26 PIO2_2/DCD/MISO1 PIO2_8 12 PIO0_3 14 PIO2_7 11 PIO2_1/DSR/SCK1 13 Fig 3. 31 PIO2_11/SCK0 LPC11C22FBD48/301 LPC11C24FBD48/301 002aaf909 Pin configuration (LPC11C22/C24) LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 6 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 6.2 Pin description Table 3. LPC11C12/C14 pin description table Symbol Pin Start Type logic inputs Reset Description state [1] PIO0_0 to PIO0_11 RESET/PIO0_0 PIO0_1/CLKOUT/ CT32B0_MAT2 Port 0 — Port 0 is a 12-bit I/O port with individual direction and function controls for each bit. The operation of port 0 pins depends on the function selected through the IOCONFIG register block. 3[2] 4[3] yes yes I I; PU RESET — External reset input with 20 ns glitch filter. A LOW-going pulse as short as 50 ns on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. I/O - PIO0_0 — General purpose digital input/output pin with 10 ns glitch filter. I/O I; PU PIO0_1 — General purpose digital input/output pin. A LOW level on this pin during reset starts the flash ISP command handler via UART (if PIO0_3 is HIGH) or via C_CAN (if PIO0_3 is LOW). O - CLKOUT — Clockout pin. O - CT32B0_MAT2 — Match output 2 for 32-bit timer 0. I/O I; PU PIO0_2 — General purpose digital input/output pin. I/O - SSEL0 — Slave Select for SPI0. PIO0_2/SSEL0/ CT16B0_CAP0 10[3] I - CT16B0_CAP0 — Capture input 0 for 16-bit timer 0. PIO0_3 14[3] yes I/O I; PU PIO0_3 — General purpose digital input/output pin. This pin is monitored during reset: Together with a LOW level on pin PIO0_1, a LOW level starts the flash ISP command handler via C_CAN and a HIGH level starts the flash ISP command handler via UART. PIO0_4/SCL 15[4] yes I/O I; IA PIO0_4 — General purpose digital input/output pin (open-drain). I/O - SCL — I2C-bus, open-drain clock input/output. High-current sink only if I2C Fast-mode Plus is selected in the I/O configuration register. PIO0_5/SDA 16[4] yes yes PIO0_6/SCK0 22[3] yes PIO0_7/CTS 23[3] yes PIO0_8/MISO0/ CT16B0_MAT0 27[3] PIO0_9/MOSI0/ CT16B0_MAT1 28[3] SWCLK/PIO0_10/ SCK0/ CT16B0_MAT2 LPC11CX2_CX4 Product data sheet 29[3] yes yes yes I/O I; IA PIO0_5 — General purpose digital input/output pin (open-drain). I/O - SDA — I2C-bus, open-drain data input/output. High-current sink only if I2C Fast-mode Plus is selected in the I/O configuration register. I/O I; PU PIO0_6 — General purpose digital input/output pin. I/O - SCK0 — Serial clock for SPI0. I/O I; PU PIO0_7 — General purpose digital input/output pin (high-current output driver). I - CTS — Clear To Send input for UART. I/O I; PU PIO0_8 — General purpose digital input/output pin. I/O - MISO0 — Master In Slave Out for SPI0. O - CT16B0_MAT0 — Match output 0 for 16-bit timer 0. I/O I; PU PIO0_9 — General purpose digital input/output pin. I/O - MOSI0 — Master Out Slave In for SPI0. O - CT16B0_MAT1 — Match output 1 for 16-bit timer 0. I I; PU SWCLK — Serial wire clock. I/O - PIO0_10 — General purpose digital input/output pin. I/O - SCK0 — Serial clock for SPI0. O - CT16B0_MAT2 — Match output 2 for 16-bit timer 0. All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 7 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 3. LPC11C12/C14 pin description table Symbol R/PIO0_11/ AD0/ CT32B0_MAT3 Pin 32[5] Start Type logic inputs Reset Description state yes - I; PU R — Reserved. Configure for an alternate function in the IOCONFIG block. I/O - PIO0_11 — General purpose digital input/output pin. I - AD0 — A/D converter, input 0. O - CT32B0_MAT3 — Match output 3 for 32-bit timer 0. [1] PIO1_0 to PIO1_11 R/PIO1_0/AD1/ CT32B1_CAP0 R/PIO1_1/AD2/ CT32B1_MAT0 R/PIO1_2/AD3/ CT32B1_MAT1 SWDIO/PIO1_3/ AD4/ CT32B1_MAT2 PIO1_4/AD5/ CT32B1_MAT3/ WAKEUP Port 1 — Port 1 is a 12-bit I/O port with individual direction and function controls for each bit. The operation of port 1 pins depends on the function selected through the IOCONFIG register block. 33[5] 34[5] 35[5] 39[5] 40[5] PIO1_5/RTS/ CT32B0_CAP0 45[3] PIO1_6/RXD/ CT32B0_MAT0 46[3] LPC11CX2_CX4 Product data sheet yes no no no no no no - I; PU R — Reserved. Configure for an alternate function in the IOCONFIG block. I/O - PIO1_0 — General purpose digital input/output pin. I - AD1 — A/D converter, input 1. I - CT32B1_CAP0 — Capture input 0 for 32-bit timer 1. - I; PU R — Reserved. Configure for an alternate function in the IOCONFIG block. I/O - PIO1_1 — General purpose digital input/output pin. I - AD2 — A/D converter, input 2. O - CT32B1_MAT0 — Match output 0 for 32-bit timer 1. - I; PU R — Reserved. Configure for an alternate function in the IOCONFIG block. I/O - PIO1_2 — General purpose digital input/output pin. I - AD3 — A/D converter, input 3. O - CT32B1_MAT1 — Match output 1 for 32-bit timer 1. I/O I; PU SWDIO — Serial wire debug input/output. I/O - PIO1_3 — General purpose digital input/output pin. I - AD4 — A/D converter, input 4. O - CT32B1_MAT2 — Match output 2 for 32-bit timer 1. I/O I; PU PIO1_4 — General purpose digital input/output pin with 10 ns glitch filter. I - AD5 — A/D converter, input 5. O - CT32B1_MAT3 — Match output 3 for 32-bit timer 1. I - WAKEUP — Deep power-down mode wake-up pin with 20 ns glitch filter. This pin must be pulled HIGH externally to enter Deep power-down mode and pulled LOW to exit Deep power-down mode. A LOW-going pulse as short as 50 ns wakes up the part. I/O I; PU PIO1_5 — General purpose digital input/output pin. O - RTS — Request To Send output for UART. I - CT32B0_CAP0 — Capture input 0 for 32-bit timer 0. I/O I; PU PIO1_6 — General purpose digital input/output pin. I - RXD — Receiver input for UART. O - CT32B0_MAT0 — Match output 0 for 32-bit timer 0. All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 8 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 3. LPC11C12/C14 pin description table Symbol PIO1_7/TXD/ CT32B0_MAT1 Pin 47[3] PIO1_8/ CT16B1_CAP0 9[3] PIO1_9/ CT16B1_MAT0 17[3] PIO1_10/AD6/ CT16B1_MAT1 30[5] PIO1_11/AD7 42[5] Start Type logic inputs Reset Description state no I/O I; PU PIO1_7 — General purpose digital input/output pin. O - TXD — Transmitter output for UART. O - CT32B0_MAT1 — Match output 1 for 32-bit timer 0. I/O I; PU PIO1_8 — General purpose digital input/output pin. I - CT16B1_CAP0 — Capture input 0 for 16-bit timer 1. no no no no [1] I/O I; PU PIO1_9 — General purpose digital input/output pin. O - CT16B1_MAT0 — Match output 0 for 16-bit timer 1. I/O I; PU PIO1_10 — General purpose digital input/output pin. I - AD6 — A/D converter, input 6. O - CT16B1_MAT1 — Match output 1 for 16-bit timer 1. I/O I; PU PIO1_11 — General purpose digital input/output pin. I - AD7 — A/D converter, input 7. PIO2_0 to PIO2_11 PIO2_0/DTR/ SSEL1 Port 2 — Port 2 is a 12-bit I/O port with individual direction and function controls for each bit. The operation of port 2 pins depends on the function selected through the IOCONFIG register block. 2[3] PIO2_1/DSR/SCK1 13[3] PIO2_2/DCD/ MISO1 26[3] PIO2_3/RI/MOSI1 38[3] no no no no I/O I; PU PIO2_0 — General purpose digital input/output pin. I/O - DTR — Data Terminal Ready output for UART. I/O - SSEL1 — Slave Select for SPI1. I/O I; PU PIO2_1 — General purpose digital input/output pin. I - DSR — Data Set Ready input for UART. I/O - SCK1 — Serial clock for SPI1. I/O I; PU PIO2_2 — General purpose digital input/output pin. I - DCD — Data Carrier Detect input for UART. I/O - MISO1 — Master In Slave Out for SPI1. I/O I; PU PIO2_3 — General purpose digital input/output pin. I - RI — Ring Indicator input for UART. I/O - MOSI1 — Master Out Slave In for SPI1. PIO2_4 18[3] no I/O I; PU PIO2_4 — General purpose digital input/output pin. PIO2_5 21[3] no I/O I; PU PIO2_5 — General purpose digital input/output pin. PIO2_6 1[3] no I/O I; PU PIO2_6 — General purpose digital input/output pin. PIO2_7 11[3] no I/O I; PU PIO2_7 — General purpose digital input/output pin. PIO2_8 12[3] no I/O I; PU PIO2_8 — General purpose digital input/output pin. PIO2_9 24[3] no I/O I; PU PIO2_9 — General purpose digital input/output pin. PIO2_10 25[3] no I/O I; PU PIO2_10 — General purpose digital input/output pin. PIO2_11/SCK0 31[3] no I/O I; PU PIO2_11 — General purpose digital input/output pin. I/O - SCK0 — Serial clock for SPI0. PIO3_0 to PIO3_3 LPC11CX2_CX4 Product data sheet Port 3 — Port 3 is a 12-bit I/O port with individual direction and function controls for each bit. The operation of port 3 pins depends on the function selected through the IOCONFIG register block. Pins PIO3_4 to PIO3_11 are not available. All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 9 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 3. LPC11C12/C14 pin description table Symbol Pin Start Type logic inputs Reset Description state I; PU PIO3_0 — General purpose digital input/output pin. O - DTR — Data Terminal Ready output for UART. I/O I; PU PIO3_1 — General purpose digital input/output pin. I - DSR — Data Set Ready input for UART. I/O I; PU PIO3_2 — General purpose digital input/output pin. [1] PIO3_0/DTR 36[3] no PIO3_1/DSR 37[3] no PIO3_2/DCD 43[3] no PIO3_3/RI 48[3] no CAN_RXD 19[6] CAN_TXD 20[6] no O I; IA CAN_TXD — C_CAN transmit data output. VDD 8; 44 - I - Supply voltage to the internal regulator, the external rail, and the ADC. Also used as the ADC reference voltage. XTALIN 6[7] - I - Input to the oscillator circuit and internal clock generator circuits. Input voltage must not exceed 1.8 V. XTALOUT 7[7] - O - Output from the oscillator amplifier. VSS 5; 41 - I - Ground. I/O DCD — Data Carrier Detect input for UART. I no I/O I; PU PIO3_3 — General purpose digital input/output pin. I - RI — Ring Indicator input for UART. I I; IA CAN_RXD — C_CAN receive data input. [1] Pin state at reset for default function: I = Input; O = Output; PU = internal pull-up enabled; IA = inactive, no pull-up/down enabled. [2] See Figure 26 for reset pad configuration. RESET functionality is not available in Deep power-down mode. Use the WAKEUP pin to reset the chip and wake up from Deep power-down mode. An external pull-up resistor is required on this pin for the Deep power-down mode. [3] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis (see Figure 25). [4] I2C-bus pads compliant with the I2C-bus specification for I2C standard mode and I2C Fast-mode Plus. [5] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors, configurable hysteresis, and analog input. When configured as a ADC input, digital section of the pad is disabled and the pin is not 5 V tolerant (see Figure 25). [6] 5 V tolerant digital I/O pad without pull-up/pull-down resistors. [7] When the system oscillator is not used, connect XTALIN and XTALOUT as follows: XTALIN can be left floating or can be grounded (grounding is preferred to reduce susceptibility to noise). XTALOUT should be left floating. Table 4. LPC11C22/C24 pin description table Symbol Pin Start Type logic inputs Reset Description state [1] PIO0_0 to PIO0_11 RESET/PIO0_0 LPC11CX2_CX4 Product data sheet Port 0 — Port 0 is a 12-bit I/O port with individual direction and function controls for each bit. The operation of port 0 pins depends on the function selected through the IOCONFIG register block. 3[2] yes I I; PU RESET — External reset input with 20 ns glitch filter. A LOW-going pulse as short as 50 ns on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. I/O - PIO0_0 — General purpose digital input/output pin with 10 ns glitch filter. All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 10 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 4. LPC11C22/C24 pin description table Symbol PIO0_1/CLKOUT/ CT32B0_MAT2 Pin 4[3] PIO0_2/SSEL0/ CT16B0_CAP0 10[3] PIO0_3 14[3] PIO0_4/SCL 15[4] PIO0_5/SDA 16[4] PIO0_6/SCK0 23[3] PIO0_7/CTS 24[3] PIO0_8/MISO0/ CT16B0_MAT0 27[3] PIO0_9/MOSI0/ CT16B0_MAT1 28[3] SWCLK/PIO0_10/ SCK0/ CT16B0_MAT2 29[3] R/PIO0_11/ AD0/ CT32B0_MAT3 32[5] PIO1_0 to PIO1_11 LPC11CX2_CX4 Product data sheet Start Type logic inputs Reset Description state yes I/O I; PU PIO0_1 — General purpose digital input/output pin. A LOW level on this pin during reset starts the flash ISP command handler via UART (if PIO0_3 is HIGH) or via C_CAN (if PIO0_3 is LOW). O - CLKOUT — Clockout pin. O - CT32B0_MAT2 — Match output 2 for 32-bit timer 0. yes [1] I/O I; PU PIO0_2 — General purpose digital input/output pin. I/O - SSEL0 — Slave Select for SPI0. I - CT16B0_CAP0 — Capture input 0 for 16-bit timer 0. yes I/O I; PU PIO0_3 — General purpose digital input/output pin. This pin is monitored during reset: Together with a LOW level on pin PIO0_1, a LOW level starts the flash ISP command handler via C_CAN and a HIGH level starts the flash ISP command handler via UART. yes I/O I; IA PIO0_4 — General purpose digital input/output pin (open-drain). I/O - SCL — I2C-bus, open-drain clock input/output. High-current sink only if I2C Fast-mode Plus is selected in the I/O configuration register. I/O I; IA PIO0_5 — General purpose digital input/output pin (open-drain). I/O - SDA — I2C-bus, open-drain data input/output. High-current sink only if I2C Fast-mode Plus is selected in the I/O configuration register. I/O I; PU PIO0_6 — General purpose digital input/output pin. I/O - SCK0 — Serial clock for SPI0. I/O I; PU PIO0_7 — General purpose digital input/output pin (high-current output driver). I - CTS — Clear To Send input for UART. I/O I; PU PIO0_8 — General purpose digital input/output pin. I/O - MISO0 — Master In Slave Out for SPI0. O - CT16B0_MAT0 — Match output 0 for 16-bit timer 0. I/O I; PU PIO0_9 — General purpose digital input/output pin. I/O - MOSI0 — Master Out Slave In for SPI0. O - CT16B0_MAT1 — Match output 1 for 16-bit timer 0. yes yes yes yes yes yes yes I I; PU SWCLK — Serial wire clock. I/O - PIO0_10 — General purpose digital input/output pin. I/O - SCK0 — Serial clock for SPI0. O - CT16B0_MAT2 — Match output 2 for 16-bit timer 0. - I; PU R — Reserved. Configure for an alternate function in the IOCONFIG block. I/O - PIO0_11 — General purpose digital input/output pin. I - AD0 — A/D converter, input 0. O - CT32B0_MAT3 — Match output 3 for 32-bit timer 0. Port 1 — Port 1 is a 12-bit I/O port with individual direction and function controls for each bit. The operation of port 1 pins depends on the function selected through the IOCONFIG register block. All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 11 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 4. LPC11C22/C24 pin description table Symbol R/PIO1_0/AD1/ CT32B1_CAP0 R/PIO1_1/AD2/ CT32B1_MAT0 R/PIO1_2/AD3/ CT32B1_MAT1 SWDIO/PIO1_3/ AD4/ CT32B1_MAT2 PIO1_4/AD5/ CT32B1_MAT3/ WAKEUP Pin 33[5] 34[5] 35[5] 39[5] 40[5] Start Type logic inputs Reset Description state yes - I; PU R — Reserved. Configure for an alternate function in the IOCONFIG block. I/O - PIO1_0 — General purpose digital input/output pin. I - AD1 — A/D converter, input 1. I - CT32B1_CAP0 — Capture input 0 for 32-bit timer 1. - I; PU R — Reserved. Configure for an alternate function in the IOCONFIG block. I/O - PIO1_1 — General purpose digital input/output pin. I - AD2 — A/D converter, input 2. O - CT32B1_MAT0 — Match output 0 for 32-bit timer 1. - I; PU R — Reserved. Configure for an alternate function in the IOCONFIG block. I/O - PIO1_2 — General purpose digital input/output pin. I - AD3 — A/D converter, input 3. O - CT32B1_MAT1 — Match output 1 for 32-bit timer 1. I/O I; PU SWDIO — Serial wire debug input/output. I/O - PIO1_3 — General purpose digital input/output pin. I - AD4 — A/D converter, input 4. O - CT32B1_MAT2 — Match output 2 for 32-bit timer 1. I/O I; PU PIO1_4 — General purpose digital input/output pin with 10 ns glitch filter. I - AD5 — A/D converter, input 5. O - CT32B1_MAT3 — Match output 3 for 32-bit timer 1. I - WAKEUP — Deep power-down mode wake-up pin with 20 ns glitch filter. This pin must be pulled HIGH externally to enter Deep power-down mode and pulled LOW to exit Deep power-down mode. A LOW-going pulse as short as 50 ns wakes up the part. I/O I; PU PIO1_5 — General purpose digital input/output pin. O - RTS — Request To Send output for UART. no no no no PIO1_5/RTS/ CT32B0_CAP0 45[3] PIO1_6/RXD/ CT32B0_MAT0 46[3] PIO1_7/TXD/ CT32B0_MAT1 47[3] PIO1_8/ CT16B1_CAP0 9[3] no PIO1_10/AD6/ CT16B1_MAT1 30[5] no LPC11CX2_CX4 Product data sheet no no no [1] I - CT32B0_CAP0 — Capture input 0 for 32-bit timer 0. I/O I; PU PIO1_6 — General purpose digital input/output pin. I - RXD — Receiver input for UART. O - CT32B0_MAT0 — Match output 0 for 32-bit timer 0. I/O I; PU PIO1_7 — General purpose digital input/output pin. O - TXD — Transmitter output for UART. O - CT32B0_MAT1 — Match output 1 for 32-bit timer 0. I/O I; PU PIO1_8 — General purpose digital input/output pin. I - CT16B1_CAP0 — Capture input 0 for 16-bit timer 1. I/O I; PU PIO1_10 — General purpose digital input/output pin. I - AD6 — A/D converter, input 6. O - CT16B1_MAT1 — Match output 1 for 16-bit timer 1. All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 12 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 4. LPC11C22/C24 pin description table Symbol PIO1_11/AD7 Pin 42[5] Start Type logic inputs Reset Description state no I/O I; PU I - [1] PIO1_11 — General purpose digital input/output pin. AD7 — A/D converter, input 7. PIO2_0 to PIO2_11 Port 2 — Port 2 is a 12-bit I/O port with individual direction and function controls for each bit. The operation of port 2 pins depends on the function selected through the IOCONFIG register block. PIO2_0/DTR/ SSEL1 2[3] PIO2_1/DSR/SCK1 13[3] PIO2_2/DCD/ MISO1 26[3] PIO2_3/RI/MOSI1 38[3] no no no no I/O I; PU PIO2_0 — General purpose digital input/output pin. I/O - DTR — Data Terminal Ready output for UART. I/O - SSEL1 — Slave Select for SPI1. I/O I; PU PIO2_1 — General purpose digital input/output pin. I - DSR — Data Set Ready input for UART. I/O - SCK1 — Serial clock for SPI1. I/O I; PU PIO2_2 — General purpose digital input/output pin. I - DCD — Data Carrier Detect input for UART. I/O - MISO1 — Master In Slave Out for SPI1. I/O I; PU PIO2_3 — General purpose digital input/output pin. I - RI — Ring Indicator input for UART. I/O - MOSI1 — Master Out Slave In for SPI1. PIO2_6 1[3] no I/O I; PU PIO2_6 — General purpose digital input/output pin. PIO2_7 11[3] no I/O I; PU PIO2_7 — General purpose digital input/output pin. PIO2_8 12[3] no I/O I; PU PIO2_8 — General purpose digital input/output pin. PIO2_10 25[3] no I/O I; PU PIO2_10 — General purpose digital input/output pin. PIO2_11/SCK0 31[3] no I/O I; PU PIO2_11 — General purpose digital input/output pin. I/O - SCK0 — Serial clock for SPI0. PIO3_0 to PIO3_3 Port 3 — Port 3 is a 12-bit I/O port with individual direction and function controls for each bit. The operation of port 3 pins depends on the function selected through the IOCONFIG register block. Pins PIO3_4 to PIO3_11 are not available. PIO3_0/DTR 36[3] PIO3_1/DSR 37[3] PIO3_2/DCD 43[3] PIO3_3/RI 48[3] no no no I/O I; PU PIO3_0 — General purpose digital input/output pin. O - DTR — Data Terminal Ready output for UART. I/O I; PU PIO3_1 — General purpose digital input/output pin. I - DSR — Data Set Ready input for UART. I/O I; PU PIO3_2 — General purpose digital input/output pin. DCD — Data Carrier Detect input for UART. I no I/O I; PU PIO3_3 — General purpose digital input/output pin. I - RI — Ring Indicator input for UART. CANL 18 no I/O - LOW-level CAN bus line. CANH 19 no I/O - HIGH-level CAN bus line. STB 22 no I - Silent mode control input for CAN transceiver (LOW = Normal mode, HIGH = silent mode). VDD_CAN 17 - - - Supply voltage for I/O level of CAN transceiver. VCC 20 - - - Supply voltage for CAN transceiver. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 13 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 4. LPC11C22/C24 pin description table Symbol Pin Start Type logic inputs Reset Description state [1] GND 21 - - - Ground for CAN transceiver. VDD 8; 44 - I - Supply voltage to the internal regulator, the external rail, and the ADC. Also used as the ADC reference voltage. XTALIN 6[7] - I - Input to the oscillator circuit and internal clock generator circuits. Input voltage must not exceed 1.8 V. XTALOUT 7[7] - O - Output from the oscillator amplifier. VSS 5; 41 - I - Ground. [1] Pin state at reset for default function: I = Input; O = Output; PU = internal pull-up enabled; IA = inactive, no pull-up/down enabled. [2] See Figure 26 for reset pad configuration. RESET functionality is not available in Deep power-down mode. Use the WAKEUP pin to reset the chip and wake up from Deep power-down mode. An external pull-up resistor is required on this pin for the Deep power-down mode. [3] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis (see Figure 25). [4] I2C-bus pads compliant with the I2C-bus specification for I2C standard mode and I2C Fast-mode Plus. [5] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors, configurable hysteresis, and analog input. When configured as a ADC input, digital section of the pad is disabled and the pin is not 5 V tolerant (see Figure 25). [6] 5 V tolerant digital I/O pad without pull-up/pull-down resistors. [7] When the system oscillator is not used, connect XTALIN and XTALOUT as follows: XTALIN can be left floating or can be grounded (grounding is preferred to reduce susceptibility to noise). XTALOUT should be left floating. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 14 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 7. Functional description 7.1 ARM Cortex-M0 processor The ARM Cortex-M0 is a general purpose, 32-bit microprocessor, which offers high performance and very low power consumption. 7.2 On-chip flash program memory The LPC11Cx2/Cx4 contain 32 kB (LPC11C14/C24) or 16 kB (LPC11C12/C22) of on-chip flash program memory. 7.3 On-chip SRAM The LPC11Cx2/Cx4 contain a total of 8 kB on-chip static RAM data memory. 7.4 Memory map The LPC11Cx2/Cx4 incorporates several distinct memory regions, shown in the following figures. Figure 4 shows the overall map of the entire address space from the user program viewpoint following reset. The interrupt vector area supports address remapping. The AHB peripheral area is 2 megabyte in size, and is divided to allow for up to 128 peripherals. The APB peripheral area is 512 kB in size and is divided to allow for up to 32 peripherals. Each peripheral of either type is allocated 16 kilobytes of space. This allows simplifying the address decoding for each peripheral. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 15 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller AHB peripherals LPC11Cx2/Cx4 4 GB 0x5020 0000 0xFFFF FFFF reserved 0xE010 0000 private peripheral bus 16 - 127 reserved 0xE000 0000 0x5004 0000 reserved AHB peripherals 12-15 GPIO PIO3 0x5020 0000 8-11 GPIO PIO2 0x5000 0000 4-7 GPIO PIO1 0-3 GPIO PIO0 APB peripherals reserved 0x5003 0000 0x5002 0000 0x5001 0000 0x5000 0000 0x4008 0000 23 - 31 reserved 0x4005 C000 APB peripherals 1 GB 0x4008 0000 22 SPI1 0x4000 0000 21 reserved 20 C_CAN 19 reserved 18 system control 17 IOCONFIG 16 15 SPI0 flash controller 14 PMU 0x4005 4000 reserved 0x2000 0000 0.5 GB reserved 0x4004 C000 0x4004 8000 0x4004 4000 0x4004 0000 0x4003 C000 0x4003 8000 0x4002 8000 0x1FFF 0000 reserved 0x1000 2000 8 kB SRAM 0x4005 0000 10 - 13 reserved 0x1FFF 4000 16 kB boot ROM 0x4005 8000 0x1000 0000 reserved 9 reserved 8 reserved 0x4002 0000 7 ADC 0x4001 C000 6 32-bit counter/timer 1 0x4001 8000 5 32-bit counter/timer 0 0x4001 4000 4 16-bit counter/timer 1 0x4001 0000 3 16-bit counter/timer 0 0x4000 C000 2 UART 0x4000 8000 1 0 WDT 0x4000 4000 I2C-bus 0x4000 0000 0x4002 4000 0x0000 8000 32 kB on-chip flash (LPC11Cx4) 16 kB on-chip flash (LPC11Cx2) 0 GB 0x0000 4000 0x0000 00C0 active interrupt vectors 0x0000 0000 0x0000 0000 002aaf268 Fig 4. LPC11Cx2/Cx4 memory map 7.5 Nested Vectored Interrupt Controller (NVIC) The Nested Vectored Interrupt Controller (NVIC) is an integral part of the Cortex-M0. The tight coupling to the CPU allows for low interrupt latency and efficient processing of late arriving interrupts. 7.5.1 Features • Controls system exceptions and peripheral interrupts. • In the LPC11Cx2/Cx4, the NVIC supports 32 vectored interrupts including 13 inputs to the start logic from individual GPIO pins. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 16 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller • Four programmable interrupt priority levels, with hardware priority level masking. • Software interrupt generation. 7.5.2 Interrupt sources Each peripheral device has one interrupt line connected to the NVIC but may have several interrupt flags. Individual interrupt flags may also represent more than one interrupt source. Any GPIO pin (total of 40 pins (LPC11C12/C14) or 36 pins (LPC11C22/C24)) regardless of the selected function, can be programmed to generate an interrupt on a level, or rising edge or falling edge, or both. 7.6 IOCONFIG block The IOCONFIG block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on-chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined. 7.7 Fast general purpose parallel I/O Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Multiple outputs can be set or cleared in one write operation. LPC11Cx2/Cx4 use accelerated GPIO functions: • GPIO registers are a dedicated AHB peripheral so that the fastest possible I/O timing can be achieved. • Entire port value can be written in one instruction. Additionally, any GPIO pin (total of 40 pins (LPC11C12/C14) or 36 pins (LPC11C22/C24)) providing a digital function can be programmed to generate an interrupt on a level, a rising or falling edge, or both. 7.7.1 Features • Bit level port registers allow a single instruction to set or clear any number of bits in one write operation. • Direction control of individual bits. • All GPIO pins default to inputs with pull-ups enabled after reset except for the I2C-bus true open-drain pins PIO0_4 and PIO0_5. • Pull-up/pull-down resistor configuration can be programmed through the IOCONFIG block for each GPIO pin (except PIO0_4 and PIO0_5). 7.8 UART The LPC11Cx2/Cx4 contain one UART. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 17 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Support for RS-485/9-bit mode allows both software address detection and automatic address detection using 9-bit mode. The UART includes a fractional baud rate generator. Standard baud rates such as 115200 Bd can be achieved with any crystal frequency above 2 MHz. 7.8.1 Features • • • • • Maximum UART data bit rate of 3.125 Mbit/s. 16 Byte Receive and Transmit FIFOs. Register locations conform to 16C550 industry standard. Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. • FIFO control mechanism that enables software flow control implementation. • Support for RS-485/9-bit mode. • Support for modem control. 7.9 SPI serial I/O controller The LPC11Cx2/Cx4 contain two SPI controllers. Both SPI controllers support SSP features. The SPI controller is capable of operation on a SSP, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. The SPI supports full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. In practice, often only one of these data flows carries meaningful data. 7.9.1 Features • Maximum SPI speed of 25 Mbit/s (master) or 4.17 Mbit/s (slave) (in SSP mode) • Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National Semiconductor Microwire buses • • • • Synchronous serial communication Master or slave operation 8-frame FIFOs for both transmit and receive 4-bit to 16-bit frame 7.10 I2C-bus serial I/O controller The LPC11Cx2/Cx4 contain one I2C-bus controller. The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial CLock line (SCL) and a Serial DAta line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 18 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be controlled by more than one bus master connected to it. 7.10.1 Features • The I2C-interface is a standard I2C-bus compliant interface with open-drain pins. The I2C-bus interface also supports Fast-mode Plus with bit rates up to 1 Mbit/s. • • • • • Easy to configure as master, slave, or master/slave. Programmable clocks allow versatile rate control. Bidirectional data transfer between masters and slaves. Multi-master bus (no central master). Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. • Serial clock synchronization allows devices with different bit rates to communicate via one serial bus. • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. • The I2C-bus can be used for test and diagnostic purposes. • The I2C-bus controller supports multiple address recognition and a bus monitor mode. 7.11 C_CAN controller Controller Area Network (CAN) is the definition of a high performance communication protocol for serial data communication. The C_CAN controller is designed to provide a full implementation of the CAN protocol according to the CAN Specification Version 2.0B. The C_CAN controller allows to build powerful local networks with low-cost multiplex wiring by supporting distributed real-time control with a very high level of security. On-chip C_CAN drivers provide an API for initialization and communication using CAN and CANopen standards. 7.11.1 Features • • • • • • • Conforms to protocol version 2.0 parts A and B. Supports bit rate of up to 1 Mbit/s. Supports 32 Message Objects. Each Message Object has its own identifier mask. Provides programmable FIFO mode (concatenation of Message Objects). Provides maskable interrupts. Supports Disabled Automatic Retransmission (DAR) mode for time-triggered CAN applications. • Provides programmable loop-back mode for self-test operation. • The C_CAN API includes the following functions: – C_CAN set-up and initialization – C_CAN send and receive messages LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 19 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller – C_CAN status – CANopen object dictionary – CANopen SDO expedited communication – CANopen SDO segmented communication primitives – CANopen SDO fall-back handler • Flash ISP programming via C_CAN supported. 7.11.2 On-chip, high-speed CAN transceiver Remark: The on-chip CAN transceiver is available on parts LPC11C22/C24 only. Compared to the LPC11C12/C14, the LPC11C22/C24 supports fewer GPIO functions, and in addition, one counter/timer match function is removed to allow interfacing the CAN high-speed transceiver to the CAN bus. See Table 4 and Figure 1. 7.11.2.1 Features • • • • 7.11.2.2 Data rates of up to 1 Mbit/s Fully ISO 11898-2 compliant Undervoltage detection and thermal protection Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI) Normal mode A LOW level on pin STB selects Normal mode. In this mode, the transceiver is able to transmit and receive data via the bus lines CANH and CANL (see Figure 28). The differential receiver converts the analog data on the bus lines into digital data which are received by the CAN_RXD input of the C_CAN controller. 7.11.2.3 Silent mode A HIGH level on pin STB selects Silent mode. In Silent mode the transmitter is disabled, releasing the bus pins to recessive state. All other functions, including the receiver, continue to operate as in Normal mode. Silent mode can be used to prevent a faulty C_CAN controller from disrupting all network communications. 7.11.2.4 Undervoltage protection Should VCC or VDD_CAN drop below their respective undervoltage detection levels (Vuvd(VCC) and Vuvd (VDD_CAN); see Table 8), the transceiver will switch off and disengage from the bus (zero load) until VCC and VDD_CAN have recovered. 7.11.2.5 Thermal protection The output drivers are protected against overtemperature conditions. If the virtual junction temperature exceeds the shutdown junction temperature, Tj(sd) (see Table 8), the output drivers will be disabled until the virtual junction temperature falls below Tj(sd). 7.11.2.6 Time-out function A ‘TXD dominant time-out’ timer is started when the CAN_TXD signal of the C_CAN controller is set LOW. If the LOW state on the CAN_TXD signal persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus lines to recessive state. This function prevents a hardware and/or software application failure from driving the bus lines LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 20 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller to a permanent dominant state (blocking all network communications). The TXD dominant time-out timer is reset when the CAN_TXD signal is set HIGH. The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s. 7.12 10-bit ADC The LPC11Cx2/Cx4 contains one ADC. The ADC is a single 10-bit successive approximation ADC with eight channels. 7.12.1 Features • • • • • • • • 10-bit successive approximation ADC. Input multiplexing among 8 pins. Power-down mode. Measurement range 0 V to VDD. 10-bit conversion time 2.44 s. Burst conversion mode for single or multiple inputs. Optional conversion on transition of input pin or timer match signal. Individual result registers for each ADC channel to reduce interrupt overhead. 7.13 General purpose external event counter/timers The LPC11Cx2/Cx4 includes two 32-bit counter/timers and two 16-bit counter/timers. The counter/timer is designed to count cycles of the system derived clock. It can optionally generate interrupts or perform other actions at specified timer values, based on four match registers. Each counter/timer also includes one capture input to trap the timer value when an input signal transitions, optionally generating an interrupt. 7.13.1 Features • A 32-bit/16-bit timer/counter with a programmable 32-bit/16-bit prescaler. • Counter or timer operation. • One capture channel per timer, that can take a snapshot of the timer value when an input signal transitions. A capture event may also generate an interrupt. • Four match registers per timer that allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Up to four external outputs corresponding to match registers, with the following capabilities: – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 21 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 7.14 System tick timer The ARM Cortex-M0 includes a system tick timer (SYSTICK) that is intended to generate a dedicated SYSTICK exception at a fixed time interval (typically 10 ms). 7.15 Watchdog timer The purpose of the watchdog is to reset the microcontroller within a selectable time period. 7.15.1 Features • Internally resets chip if not periodically reloaded. • Debug mode. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • • • • Incorrect/Incomplete feed sequence causes reset/interrupt if enabled. Flag to indicate watchdog reset. Programmable 24-bit timer with internal prescaler. Selectable time period from (Tcy(WDCLK) 256 4) to (Tcy(WDCLK) 224 4) in multiples of Tcy(WDCLK) 4. • The Watchdog Clock (WDCLK) source can be selected from the Internal RC oscillator (IRC), the Watchdog oscillator, or the main clock. This gives a wide range of potential timing choices of Watchdog operation under different power reduction conditions. It also provides the ability to run the WDT from an entirely internal source that is not dependent on an external crystal and its associated components and wiring for increased reliability. 7.16 Clocking and power control 7.16.1 Crystal oscillators The LPC11Cx2/Cx4 include three independent oscillators. These are the system oscillator, the Internal RC oscillator (IRC), and the Watchdog oscillator. Each oscillator can be used for more than one purpose as required in a particular application. Following reset, the LPC11Cx2/Cx4 will operate from the Internal RC oscillator until switched by software. This allows systems to operate without any external crystal and the bootloader code to operate at a known frequency. See Figure 5 for an overview of the LPC11Cx2/Cx4 clock generation. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 22 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller SYSTEM CLOCK DIVIDER AHB clock 0 (system) system clock 18 AHB clocks 1 to 18 (memories and peripherals) SYSAHBCLKCTRL[1:18] (AHB clock enable) IRC oscillator SPI0 PERIPHERAL CLOCK DIVIDER SPI0 UART PERIPHERAL CLOCK DIVIDER UART SPI1 PERIPHERAL CLOCK DIVIDER SPI1 WDT CLOCK DIVIDER WDT main clock watchdog oscillator MAINCLKSEL (main clock select) IRC oscillator SYSTEM PLL system oscillator IRC oscillator SYSPLLCLKSEL (system PLL clock select) watchdog oscillator WDTUEN (WDT clock update enable) IRC oscillator system oscillator watchdog oscillator CLKOUTUEN (CLKOUT update enable) Fig 5. CLKOUT PIN CLOCK DIVIDER CLKOUT pin 002aae514 LPC11Cx2/Cx4 clock generation block diagram 7.16.1.1 Internal RC oscillator The IRC may be used as the clock source for the WDT, and/or as the clock that drives the PLL and subsequently the CPU. The nominal IRC frequency is 12 MHz. The IRC is trimmed to 1 % accuracy over the entire voltage and temperature range. Upon power-up or any chip reset, the LPC11Cx2/Cx4 use the IRC as the clock source. Software may later switch to one of the other available clock sources. 7.16.1.2 System oscillator The system oscillator can be used as the clock source for the CPU, with or without using the PLL. The system oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be boosted to a higher frequency, up to the maximum CPU operating frequency, by the system PLL. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 23 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 7.16.1.3 Watchdog oscillator The watchdog oscillator can be used as a clock source that directly drives the CPU, the watchdog timer, or the CLKOUT pin. The watchdog oscillator nominal frequency is programmable between 7.8 kHz and 1.7 MHz. The frequency spread over processing and temperature is 40 % (see Table 15). 7.16.2 System PLL The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO). The multiplier can be an integer value from 1 to 32. The CCO operates in the range of 156 MHz to 320 MHz, so there is an additional divider in the loop to keep the CCO within its frequency range while the PLL is providing the desired output frequency. The output divider may be set to divide by 2, 4, 8, or 16 to produce the output clock. The PLL output frequency must be lower than 100 MHz. Since the minimum output divider value is 2, it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and bypassed following a chip reset and may be enabled by software. The program must configure and activate the PLL, wait for the PLL to lock, and then connect to the PLL as a clock source. The PLL settling time is 100 s. 7.16.3 Clock output The LPC11Cx2/Cx4 features a clock output function that routes the IRC oscillator, the system oscillator, the watchdog oscillator, or the main clock to an output pin. 7.16.4 Wake-up process The LPC11Cx2/Cx4 begin operation at power-up and when awakened from Deep power-down mode by using the 12 MHz IRC oscillator as the clock source. This allows chip operation to resume quickly. If the system oscillator or the PLL is needed by the application, software will need to enable these features and wait for them to stabilize before they are used as a clock source. 7.16.5 Power control The LPC11Cx2/Cx4 support a variety of power control features. There are three special modes of processor power reduction: Sleep mode, Deep-sleep mode, and Deep power-down mode. The CPU clock rate may also be controlled as needed by changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value. This allows a trade-off of power versus processing speed based on application requirements. In addition, a register is provided for shutting down the clocks to individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all dynamic power use in any peripherals that are not required for the application. Selected peripherals have their own clock divider which provides even better power control. 7.16.5.1 Sleep mode When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep mode does not need any special sequence but re-enabling the clock to the ARM core. In Sleep mode, execution of instructions is suspended until either a reset or interrupt occurs. Peripheral functions continue operation during Sleep mode and may generate interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic power used by the processor itself, memory systems and related controllers, and internal buses. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 24 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 7.16.5.2 Deep-sleep mode In Deep-sleep mode, the chip is in Sleep mode, and in addition all analog blocks are shut down. As an exception, the user has the option to keep the watchdog oscillator and the BOD circuit running for self-timed wake-up and BOD protection. Deep-sleep mode allows for additional power savings. Up to 13 pins total, see Table 3, serve as external wake-up pins to a dedicated start logic to wake up the chip from Deep-sleep mode. Unless the watchdog oscillator is selected to run in Deep-sleep mode, the clock source should be switched to IRC before entering Deep-sleep mode, because the IRC can be switched on and off glitch-free. 7.16.5.3 Deep power-down mode In Deep power-down mode, power is shut off to the entire chip with the exception of the WAKEUP pin. The LPC11Cx2/Cx4 can wake up from Deep power-down mode via the WAKEUP pin. When entering Deep power-down mode, an external pull-up resistor is required on the WAKEUP pin to hold it HIGH. The RESET pin must also be held HIGH to prevent it from floating while in Deep power-down mode. 7.17 System control 7.17.1 Start logic The start logic connects external pins to corresponding interrupts in the NVIC. Each pin shown in Table 3 as input to the start logic has an individual interrupt in the NVIC interrupt vector table. The start logic pins can serve as external interrupt pins when the chip is running. In addition, an input signal on the start logic pins can wake up the chip from Deep-sleep mode when all clocks are shut down. The start logic must be configured in the system configuration block and in the NVIC before being used. 7.17.2 Reset Reset has four sources on the LPC11Cx2/Cx4: the RESET pin, the Watchdog reset, power-on reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt trigger input pin. Assertion of chip reset by any source, once the operating voltage attains a usable level, starts the IRC and initializes the flash controller. When the internal Reset is removed, the processor begins executing at address 0, which is initially the Reset vector mapped from the boot block. At that point, all of the processor and peripheral registers have been initialized to predetermined values. An external pull-up resistor is required on the RESET pin if Deep power-down mode is used. 7.17.3 Brownout detection The LPC11Cx2/Cx4 includes four levels for monitoring the voltage on the VDD pin. If this voltage falls below one of the four selected levels, the BOD asserts an interrupt signal to the NVIC. This signal can be enabled for interrupt in the Interrupt Enable Register in the LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 25 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller NVIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading a dedicated status register. Four additional threshold levels can be selected to cause a forced reset of the chip. 7.17.4 Code security (Code Read Protection - CRP) This feature of the LPC11Cx2/Cx4 allows user to enable different levels of security in the system so that access to the on-chip flash and use of the Serial Wire Debugger (SWD) and In-System Programming (ISP) can be restricted. When needed, CRP is invoked by programming a specific pattern into a dedicated flash location. IAP commands are not affected by the CRP. In addition, ISP entry via the PIO0_1 pin can be disabled without enabling CRP. For details see the LPC11Cx user manual. There are three levels of Code Read Protection: 1. CRP1 disables access to the chip via the SWD and allows partial flash update (excluding flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is required and flash field updates are needed but all sectors can not be erased. 2. CRP2 disables access to the chip via the SWD and only allows full flash erase and update using a reduced set of the ISP commands. 3. Running an application with level CRP3 selected fully disables any access to the chip via the SWD pins and the ISP. This mode effectively disables ISP override using PIO0_1 pin, too. It is up to the user’s application to provide (if needed) flash update mechanism using IAP calls or call reinvoke ISP command to enable flash update via the UART. CAUTION If level three Code Read Protection (CRP3) is selected, no future factory testing can be performed on the device. In addition to the three CRP levels, sampling of pin PIO0_1 for valid user code can be disabled. For details see the LPC11Cx user manual. 7.17.5 Bootloader The bootloader controls initial operation after reset and also provides the means to program the flash memory. This could be initial programming of a blank device, erasure and re-programming of a previously programmed device, or programming of the flash memory by the application program in a running system. The bootloader code is executed every time the part is reset or powered up. The loader can either execute the user application code or the ISP command handler via UART or C_CAN. A LOW level during reset applied to the PIO0_1 pin is considered as an external hardware request to start the ISP command handler. The state of PIO0_3 at reset determines whether the UART (PIO0_3 HIGH) or the C_CAN (PIO0_3 LOW) interface will be used. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 26 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller The C_CAN ISP command handler uses the CANopen protocol and data organization method. C_CAN ISP commands have the same functionality as UART ISP commands. 7.17.6 APB interface The APB peripherals are located on one APB bus. 7.17.7 AHBLite The AHBLite connects the CPU bus of the ARM Cortex-M0 to the flash memory, the main static RAM, and the Boot ROM. 7.17.8 External interrupt inputs All GPIO pins can be level or edge sensitive interrupt inputs. In addition, start logic inputs serve as external interrupts (see Section 7.17.1). 7.18 Emulation and debugging Debug functions are integrated into the ARM Cortex-M0. Serial wire debug with four breakpoints and two watchpoints is supported. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 27 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD supply voltage (core and external rail) on pins VDD 1.8 3.6 V VI input voltage 5 V tolerant I/O pins; only valid when the VDD supply voltage is present [2] 0.5 +5.5 V IDD supply current per supply pin [3] - 100 mA [3] - 100 mA - 100 mA ISS ground current per ground pin Ilatch I/O latch-up current (0.5VDD) < VI < (1.5VDD); Tj < 125 C Tstg storage temperature 65 +150 C Tj(max) maximum junction temperature - 150 C Ptot(pack) total power dissipation based on package heat transfer, not device power (per package) consumption - 1.5 W VESD electrostatic discharge human body model; voltage all pins except CAN on-chip transceiver pins CANL, CANH, STB, VDD_CAN, VCC, GND on LPC11C22/C24 [5] 6500 +6500 V pins CANH and CANL on LPC11C22/C24 [5] 8000 +8000 V pins STB, VDD_CAN, VCC, GND on LPC11C22/C24 [5] 4000 +4000 V [1] [4] The following applies to the limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. [2] Including voltage on outputs in 3-state mode. [3] The peak current is limited to 25 times the corresponding maximum current. [4] Dependent on package type. [5] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 28 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 9. Static characteristics Table 6. Static characteristics Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit VDD supply voltage (core and external rail) on pins VDD 1.8 3.3 3.6 V IDD supply current Active mode; code - 3 - mA - 9 - mA - 2 - mA - 6 - A - 220 - nA while(1){} executed from flash system clock = 12 MHz VDD = 3.3 V system clock = 50 MHz VDD = 3.3 V Sleep mode; system clock = 12 MHz [2][3][4] [5][6][7] [2][3][6] [5][7][8] [2][3][4] [5][6][7] VDD = 3.3 V Deep-sleep mode; VDD = 3.3 V Deep power-down mode; VDD = 3.3 V [2][3][5] [9] [2][10] Standard port pins, RESET IIL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled - 0.5 10 nA IIH HIGH-level input current VI = VDD; on-chip pull-down resistor disabled - 0.5 10 nA IOZ OFF-state output current VO = 0 V; VO = VDD; on-chip pull-up/down resistors disabled - 0.5 10 nA VI input voltage pin configured to provide a digital function 0 - 5.0 V 0 - VDD V [11][12] VO output voltage VIH HIGH-level input voltage 0.7VDD - - V VIL LOW-level input voltage - - 0.3VDD V Vhys hysteresis voltage - 0.4 - V VOH HIGH-level output voltage 2.0 V VDD 3.6 V; IOH = 4 mA VDD 0.4 - - V 1.8 V VDD < 2.0 V; IOH = 3 mA VDD 0.4 - - V 2.0 V VDD 3.6 V; IOL = 4 mA - - 0.4 V 1.8 V VDD < 2.0 V; IOL = 3 mA - - 0.4 V VOL LPC11CX2_CX4 Product data sheet LOW-level output voltage output active [13] All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 29 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 6. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit IOH HIGH-level output current VOH = VDD 0.4 V; 4 - - mA 3 - - mA 4 - - mA 2.0 V VDD 3.6 V 1.8 V VDD < 2.0 V IOL LOW-level output current VOL = 0.4 V 2.0 V VDD 3.6 V 1.8 V VDD < 2.0 V 3 - - mA - - 45 mA - - 50 mA IOHS HIGH-level short-circuit VOH = 0 V output current [14] IOLS LOW-level short-circuit output current VOL = VDD [14] Ipd pull-down current VI = 5 V 10 50 150 A Ipu pull-up current VI = 0 V; 15 50 85 A 10 50 85 A 0 0 0 A 2.0 V VDD 3.6 V 1.8 V VDD < 2.0 V VDD < VI < 5 V High-drive output pin (PIO0_7) IIL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled - 0.5 10 nA IIH HIGH-level input current VI = VDD; on-chip pull-down resistor disabled - 0.5 10 nA IOZ OFF-state output current VO = 0 V; VO = VDD; on-chip pull-up/down resistors disabled - 0.5 10 nA VI input voltage pin configured to provide a digital function 0 - 5.0 V 0 - VDD V [11][12] [13] VO output voltage VIH HIGH-level input voltage 0.7VDD - - V VIL LOW-level input voltage - - 0.3VDD V Vhys hysteresis voltage 0.4 - - V VOH HIGH-level output voltage 2.5 V VDD 3.6 V; IOH = 20 mA VDD 0.4 - - V 1.8 V VDD < 2.5 V; IOH = 12 mA VDD 0.4 - - V 2.0 V VDD 3.6 V; IOL = 4 mA - - 0.4 V 1.8 V VDD < 2.0 V; IOL = 3 mA - - 0.4 V VOH = VDD 0.4 V; 2.5 V VDD 3.6 V 20 - - mA 1.8 V VDD < 2.5 V 12 - - mA VOL IOH LPC11CX2_CX4 Product data sheet LOW-level output voltage HIGH-level output current output active All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 30 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 6. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit IOL LOW-level output current VOL = 0.4 V 4 - - mA 3 - - mA - - 50 mA 2.0 V VDD 3.6 V 1.8 V VDD < 2.0 V [14] IOLS LOW-level short-circuit output current VOL = VDD Ipd pull-down current VI = 5 V 10 50 150 A Ipu pull-up current VI = 0 V 15 50 85 A 2.0 V VDD 3.6 V 1.8 V VDD < 2.0 V VDD < VI < 5 V I2C-bus 10 50 85 A 0 0 0 A pins (PIO0_4 and PIO0_5) VIH HIGH-level input voltage 0.7VDD - - V VIL LOW-level input voltage - - 0.3VDD V Vhys hysteresis voltage - 0.05VDD - V 4 - - mA LOW-level output current IOL I2C-bus VOL = 0.4 V; pins configured as standard mode pins 2.0 V VDD 3.6 V LOW-level output current IOL 1.8 V VDD < 2.0 V 3 - - VOL = 0.4 V; I2C-bus pins configured as Fast-mode Plus pins 20 - - 16 - - - 2 4 A - 10 22 A mA 2.0 V VDD 3.6 V 1.8 V VDD < 2.0 V input leakage current ILI VI = VDD VI = 5 V [15] Oscillator pins Vi(xtal) crystal input voltage 0.5 1.8 1.95 V Vo(xtal) crystal output voltage 0.5 1.8 1.95 V [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] Tamb = 25 C. [3] IDD measurements were performed with all pins configured as GPIO outputs driven LOW and pull-up resistors disabled. [4] IRC enabled; system oscillator disabled; system PLL disabled. [5] Pin CAN_RXD pulled LOW externally. [6] BOD disabled. [7] All peripherals disabled in the SYSAHBCLKCTRL register. Peripheral clocks to UART and SPI0/1 disabled in system configuration block. [8] IRC disabled; system oscillator enabled; system PLL enabled. [9] All oscillators and analog blocks turned off in the PDSLEEPCFG register; PDSLEEPCFG = 0x0000 18FF. [10] WAKEUP pin pulled HIGH externally. [11] Including voltage on outputs in 3-state mode. [12] VDD supply voltage must be present. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 31 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller [13] 3-state outputs go into 3-state mode in Deep power-down mode. [14] Allowed as long as the current limit does not exceed the maximum current allowed by the device. [15] To VSS. 9.1 ADC characteristics Table 7. ADC static characteristics Tamb = 40 C to +85 C unless otherwise specified; ADC frequency 4.5 MHz, VDD = 2.5 V to 3.6 V. Symbol Parameter VIA analog input voltage Cia analog input capacitance Conditions Min Typ Max Unit 0 - VDD V pF - - 1 [1][2] ED differential linearity error - - 1 LSB EL(adj) integral non-linearity [3] - - 1.5 LSB EO offset error [4] - - 3.5 LSB gain error [5] - - 0.6 % [6] EG ET absolute error Rvsi voltage source interface resistance Ri input resistance [7][8] - - 4 LSB - - 40 k - - 2.5 M [1] The ADC is monotonic, there are no missing codes. [2] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 6. [3] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 6. [4] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 6. [5] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 6. [6] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 6. [7] Tamb = 25 C; maximum sampling frequency fs = 4.5 MHz and analog input capacitance Cia = 1 pF. [8] Input resistance Ri depends on the sampling frequency fs: Ri = 1 / (fs Cia). LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 32 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller offset error EO gain error EG 1023 1022 1021 1020 1019 1018 (2) 7 code out (1) 6 5 (5) 4 (4) 3 (3) 2 1 LSB (ideal) 1 0 1 2 3 4 5 6 7 1018 1019 1020 1021 1022 1023 1024 VIA (LSBideal) offset error EO 1 LSB = VDD − VSS 1024 002aaf426 (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve. Fig 6. ADC characteristics LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 33 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 9.2 CAN on-chip, high-speed transceiver characteristics Table 8. Static characteristics Tamb = 40 C to +85 C; VCC = 4.5 V to 5.5 V; RL = 60 ; unless otherwise specified; all voltages are defined with respect to ground; positive currents flow into the IC. Also see Figure 28. Symbol Parameter Conditions Min Typ Max Unit 4.5 - 5.5 V 0.1 1 2.5 mA Supply; pin VCC VCC supply voltage ICC supply current Silent mode Normal mode Vuvd(VCC) recessive 2.5 5 10 mA dominant; CAN_TXD = LOW 20 50 70 mA 3.5 - 4.5 V 2.8 - 5.5 V undervoltage detection voltage on pin VCC I/O level adapter supply; pin VDD_CAN VDD supply voltage on pin VDD_CAN IDD supply current on pin VDD_CAN; Normal and Silent modes recessive; CAN_TXD = HIGH 10 80 250 A dominant; CAN_TXD = LOW 50 350 500 A 1.3 - 2.7 V Vuvd(VDD_CAN) undervoltage detection voltage on pin VDD_CAN Mode control input; pin STB VIH HIGH-level input voltage 0.7VCC - VCC + 0.3 V VIL LOW-level input voltage 0.3 - 0.3VCC V IIH HIGH-level input current 1 4 10 A IIL LOW-level input current 1 0 +1 A 2.75 3.5 4.5 V Voltage on pin STB = 0 V Bus lines; pins CANH and CANL VO(dom) dominant output voltage CAN_TXD = LOW; t < tto(dom)TXD pin CANH 0.5 1.5 2.25 V Vdom(TX)sym transmitter dominant voltage Vdom(TX)sym = VCC VCANH VCANL symmetry pin CANL 400 0 +400 mV VO(dif)bus bus differential output voltage CAN_TXD = LOW; t < tto(dom)TXD 1.5 - 3 V CAN_TXD = HIGH; recessive; no load 50 - +50 mV VO(rec) recessive output voltage Normal and Silent modes; CAN_TXD = HIGH; no load 2 0.5VCC 3 V Vth(RX)dif differential receiver threshold voltage Normal and Silent modes Vcm(CAN)[1] = 12 V to +12 V 0.5 0.7 0.9 V Vhys(RX)dif differential receiver hysteresis voltage Normal and Silent modes Vcm(CAN) = 12 V to +12 V 50 120 400 mV IO(dom) dominant output current CAN_TXD = LOW; t < tto(dom)TXD; VCC = 5 V pin CANH; VCANH = 0 V 120 70 40 mA pin CANL; VCANL = 5 V/40 V 40 70 120 mA LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 34 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 8. Static characteristics …continued Tamb = 40 C to +85 C; VCC = 4.5 V to 5.5 V; RL = 60 ; unless otherwise specified; all voltages are defined with respect to ground; positive currents flow into the IC. Also see Figure 28. Symbol Parameter Conditions Min Typ Max Unit IO(rec) recessive output current Normal and Silent modes; CAN_TXD = HIGH; VCANH = VCANL = 27 V to +32 V 5 - +5 mA IL leakage current VCC = 0 V; VCANH = VCANL = 5 V 5 0 +5 A Ri input resistance 9 15 28 k Ri input resistance deviation 3 0 +3 % Ri(dif) differential input resistance 19 30 52 k Ci(cm) common-mode input capacitance - - 20 pF Ci(dif) differential input capacitance - - 10 pF - 190 - C between VCANH and VCANL Temperature protection Tj(sd) [1] shutdown junction temperature Vcm(CAN) is the common mode voltage of CANH and CANL. Table 9. Dynamic characteristics Tamb = 40 C to +85 C; VCC = 4.5 V to 5.5 V; RL = 60 unless specified otherwise. All voltages are defined with respect to ground. Positive currents flow into the IC. Symbol Parameter Conditions Min Typ Max Unit tto(dom)TXD TXD dominant time-out time CAN_TXD = LOW; Normal mode 0.3 1 12 ms LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 35 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 9.3 BOD static characteristics Table 10. BOD static characteristics[1] Tamb = 25 C. Symbol Parameter Conditions Vth threshold voltage interrupt level 0 Min Typ Max Unit assertion - 1.65 - V de-assertion - 1.80 - V assertion - 2.22 - V de-assertion - 2.35 - V assertion - 2.52 - V de-assertion - 2.66 - V assertion - 2.80 - V de-assertion - 2.90 - V interrupt level 1 interrupt level 2 interrupt level 3 reset level 0 assertion - 1.46 - V de-assertion - 1.63 - V assertion - 2.06 - V de-assertion - 2.15 - V assertion - 2.35 - V de-assertion - 2.43 - V assertion - 2.63 - V de-assertion - 2.71 - V reset level 1 reset level 2 reset level 3 [1] Interrupt levels are selected by writing the level value to the BOD control register BODCTRL, see LPC11Cx user manual. 9.4 Power consumption Power measurements in Active, Sleep, and Deep-sleep modes were performed under the following conditions (see LPC11Cx user manual): • Configure all pins as GPIO with pull-up resistor disabled in the IOCONFIG block. • Configure GPIO pins as outputs using the GPIOnDIR registers. • Write 0 to all GPIOnDATA registers to drive the outputs LOW. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 36 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 002aaf390 12 IDD (mA) 48 MHz(2) 8 36 MHz(2) 24 MHz(2) 4 12 MHz(1) 0 1.8 2.4 3.0 3.6 VDD (V) Conditions: Tamb = 25 C; active mode entered executing code while(1){} from flash; all peripherals disabled in the SYSAHBCLKCTRL register (SYSAHBCLKCTRL = 0x1F); all peripheral clocks disabled; internal pull-up resistors disabled; BOD disabled; pin CAN_RXD pulled LOW externally. (1) System oscillator and system PLL disabled; IRC enabled. (2) System oscillator and system PLL enabled; IRC disabled. Fig 7. Active mode: Typical supply current IDD versus supply voltage VDD for different system clock frequencies 002aaf391 12 IDD (mA) 48 MHz(2) 8 36 MHz(2) 24 MHz(2) 4 0 −40 12 MHz(1) −15 10 35 60 85 temperature (°C) Conditions: VDD = 3.3 V; active mode entered executing code while(1){} from flash; all peripherals disabled in the SYSAHBCLKCTRL register (SYSAHBCLKCTRL = 0x1F); all peripheral clocks disabled; internal pull-up resistors disabled; BOD disabled; pin CAN_RXD pulled LOW externally. (1) System oscillator and system PLL disabled; IRC enabled. (2) System oscillator and system PLL enabled; IRC disabled. Fig 8. LPC11CX2_CX4 Product data sheet Active mode: Typical supply current IDD versus temperature for different system clock frequencies All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 37 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 002aaf392 8 IDD (mA) 48 MHz(2) 6 36 MHz(2) 4 24 MHz(2) 12 MHz(1) 2 0 −40 −15 10 35 60 85 temperature (°C) Conditions: VDD = 3.3 V; sleep mode entered from flash; all peripherals disabled in the SYSAHBCLKCTRL register (SYSAHBCLKCTRL = 0x1F); all peripheral clocks disabled; internal pull-up resistors disabled; BOD disabled; pin CAN_RXD pulled LOW externally. (1) System oscillator and system PLL disabled; IRC enabled. (2) System oscillator and system PLL enabled; IRC disabled. Fig 9. Sleep mode: Typical supply current IDDversus temperature for different system clock frequencies 002aaf394 40 IDD (μA) 30 3.6 V 3.3 V 2.0 V 1.8 V 20 10 0 −40 −15 10 35 60 85 temperature (°C) Conditions: BOD disabled; all oscillators and analog blocks disabled in the PDSLEEPCFG register (PDSLEEPCFG = 0x0000 18FF); pin CAN_RXD pulled LOW externally. Fig 10. Deep-sleep mode: Typical supply current IDD versus temperature for different supply voltages VDD LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 38 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 002aaf457 0.8 IDD (μA) 0.6 VDD = 3.6 V 3.3 V 2.0 V 1.8 V 0.4 0.2 0 −40 −15 10 35 60 85 temperature (°C) Fig 11. Deep power-down mode: Typical supply current IDD versus temperature for different supply voltages VDD LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 39 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 9.5 Peripheral power consumption The supply current per peripheral is measured as the difference in supply current between the peripheral block enabled and the peripheral block disabled in the SYSAHBCLKCFG and PDRUNCFG (for analog blocks) registers. All other blocks are disabled in both registers and no code is executed. Measured on a typical sample at Tamb = 25 C. Unless noted otherwise, the system oscillator and PLL are running in both measurements. The supply currents are shown for system clock frequencies of 12 MHz and 48 MHz. Table 11. Power consumption for individual analog and digital blocks Peripheral LPC11CX2_CX4 Product data sheet Typical supply current in mA Notes n/a 12 MHz 48 MHz IRC 0.27 - - System oscillator running; PLL off; independent of main clock frequency. System oscillator at 12 MHz 0.22 - - IRC running; PLL off; independent of main clock frequency. Watchdog oscillator at 500 kHz/2 0.004 - - System oscillator running; PLL off; independent of main clock frequency. BOD 0.051 - - Independent of main clock frequency. Main PLL - 0.21 - ADC - 0.08 0.29 CLKOUT - 0.12 0.47 CT16B0 - 0.02 0.06 CT16B1 - 0.02 0.06 CT32B0 - 0.02 0.07 CT32B1 - 0.02 0.06 GPIO - 0.23 0.88 IOCONFIG - 0.03 0.10 I2C - 0.04 0.13 ROM - 0.04 0.15 SPI0 - 0.12 0.45 SPI1 - 0.12 0.45 UART - 0.22 0.82 WDT - 0.02 0.06 Main clock divided by 4 in the CLKOUTDIV register. GPIO pins configured as outputs and set to LOW. Direction and pin state are maintained if the GPIO is disabled in the SYSAHBCLKCFG register. Main clock selected as clock source for the WDT. All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 40 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 9.6 Electrical pin characteristics 002aae990 3.6 VOH (V) T = 85 °C 25 °C −40 °C 3.2 2.8 2.4 2 0 10 20 30 40 50 60 IOH (mA) Conditions: VDD = 3.3 V; on pin PIO0_7. Fig 12. High-drive output: Typical HIGH-level output voltage VOH versus HIGH-level output current IOH. 002aaf019 60 T = 85 °C 25 °C −40 °C IOL (mA) 40 20 0 0 0.2 0.4 0.6 VOL (V) Conditions: VDD = 3.3 V; on pins PIO0_4 and PIO0_5. Fig 13. I2C-bus pins (high current sink): Typical LOW-level output current IOL versus LOW-level output voltage VOL LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 41 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 002aae991 15 IOL (mA) T = 85 °C 25 °C −40 °C 10 5 0 0 0.2 0.4 0.6 VOL (V) Conditions: VDD = 3.3 V; standard port pins and PIO0_7. Fig 14. Typical LOW-level output current IOL versus LOW-level output voltage VOL 002aae992 3.6 VOH (V) T = 85 °C 25 °C −40 °C 3.2 2.8 2.4 2 0 8 16 24 IOH (mA) Conditions: VDD = 3.3 V; standard port pins. Fig 15. Typical HIGH-level output voltage VOH versus HIGH-level output source current IOH LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 42 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 002aae988 10 Ipu (μA) −10 −30 T = 85 °C 25 °C −40 °C −50 −70 0 1 2 3 4 5 VI (V) Conditions: VDD = 3.3 V; standard port pins. Fig 16. Typical pull-up current Ipu versus input voltage VI 002aae989 80 T = 85 °C 25 °C −40 °C Ipd (μA) 60 40 20 0 0 1 2 3 4 5 VI (V) Conditions: VDD = 3.3 V; standard port pins. Fig 17. Typical pull-down current Ipd versus input voltage VI LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 43 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 10. Dynamic characteristics 10.1 Flash memory Table 12. Flash characteristics Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min [1] Nendu endurance tret retention time ter erase time tprog programming time Typ Max Unit 10000 100000 - cycles powered 10 - - years unpowered 20 - - years sector or multiple consecutive sectors 95 100 105 ms 0.95 1 1.05 ms [2] [1] Number of program/erase cycles. [2] Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes. 10.2 External clock Table 13. Dynamic characteristic: external clock Tamb = 40 C to +85 C; VDD over specified ranges.[1] Min Typ[2] Max Unit oscillator frequency 1 - 25 MHz Tcy(clk) clock cycle time 40 - 1000 ns tCHCX clock HIGH time Tcy(clk) 0.4 - - ns tCLCX clock LOW time Tcy(clk) 0.4 - - ns tCLCH clock rise time - - 5 ns tCHCL clock fall time - - 5 ns Symbol Parameter fosc Conditions [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. tCHCL tCHCX tCLCH tCLCX Tcy(clk) 002aaa907 Fig 18. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV) LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 44 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 10.3 Internal oscillators Table 14. Dynamic characteristic: internal oscillators Tamb = 40 C to +85 C; 2.7 V VDD 3.6 V.[1] Symbol Parameter Conditions fosc(RC) internal RC oscillator frequency - Min Typ[2] Max Unit 11.88 12 12.12 MHz [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. 002aaf403 12.15 f (MHz) VDD = 3.6 V 3.3 V 3.0 V 2.7 V 2.4 V 2.0 V 12.05 11.95 11.85 −40 −15 10 35 60 85 temperature (°C) Conditions: Frequency values are typical values. 12 MHz 1 % accuracy is guaranteed for 2.7 V VDD 3.6 V and Tamb = 40 C to +85 C. Variations between parts may cause the IRC to fall outside the 12 MHz 1 % accuracy specification for voltages below 2.7 V. Fig 19. Internal RC oscillator frequency vs. temperature Table 15. Dynamic characteristics: Watchdog oscillator Min Typ[1] Max Unit internal oscillator DIVSEL = 0x1F, FREQSEL = 0x1 frequency in the WDTOSCCTRL register; [2][3] - 7.8 - kHz DIVSEL = 0x00, FREQSEL = 0xF in the WDTOSCCTRL register [2][3] - 1700 - kHz Symbol Parameter fosc(int) LPC11CX2_CX4 Product data sheet Conditions [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] The typical frequency spread over processing and temperature (Tamb = 40 C to +85 C) is 40 %. [3] See the LPC11Cx user manual. All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 45 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 10.4 I/O pins Table 16. Dynamic characteristic: I/O pins[1] Tamb = 40 C to +85 C; 3.0 V VDD 3.6 V. Symbol Parameter Conditions Min Typ Max Unit tr rise time pin configured as output 3.0 - 5.0 ns tf fall time pin configured as output 2.5 - 5.0 ns [1] Applies to standard port pins and RESET pin. 10.5 I2C-bus Table 17. Dynamic characteristic: I2C-bus pins[1] Tamb = 40 C to +85 C.[2] Symbol Parameter Conditions Min Max Unit fSCL SCL clock frequency Standard-mode 0 100 kHz Fast-mode 0 400 kHz Fast-mode Plus 0 1 MHz of both SDA and SCL signals - 300 ns 20 + 0.1 Cb 300 ns [4][5][6][7] fall time tf Standard-mode Fast-mode Fast-mode Plus tLOW tHIGH tHD;DAT tSU;DAT [1] LPC11CX2_CX4 Product data sheet LOW period of the SCL clock HIGH period of the SCL clock data hold time data set-up time [3][4][8] [9][10] - 120 ns Standard-mode 4.7 - s Fast-mode 1.3 - s Fast-mode Plus 0.5 - s Standard-mode 4.0 - s Fast-mode 0.6 - s Fast-mode Plus 0.26 - s Standard-mode 0 - s Fast-mode 0 - s Fast-mode Plus 0 - s Standard-mode 250 - ns Fast-mode 100 - ns Fast-mode Plus 50 - ns See the I2C-bus specification UM10204 for details. [2] Parameters are valid over operating temperature range unless otherwise specified. [3] tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission and the acknowledge. [4] A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL. [5] Cb = total capacitance of one bus line in pF. All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 46 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller [6] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at 250 ns. This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf. [7] In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, designers should allow for this when considering bus timing. [8] The maximum tHD;DAT could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than the maximum of tVD;DAT or tVD;ACK by a transition time (see UM10204). This maximum must only be met if the device does not stretch the LOW period (tLOW) of the SCL signal. If the clock stretches the SCL, the data must be valid by the set-up time before it releases the clock. [9] tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in transmission and the acknowledge. [10] A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but the requirement tSU;DAT = 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time. tf SDA tSU;DAT 70 % 30 % 70 % 30 % tHD;DAT tf 70 % 30 % SCL tVD;DAT tHIGH 70 % 30 % 70 % 30 % 70 % 30 % tLOW S 1 / fSCL 002aaf425 Fig 20. I2C-bus pins clock timing 10.6 SPI interfaces Table 18. Dynamic characteristics of SPI pins in SPI mode Symbol Parameter Conditions Min Typ Max Unit - - ns - - SPI master (in SPI mode) Tcy(clk) tDS when only receiving [1] 40 when only transmitting [1] 27.8 in SPI mode [2] 15 2.0 V VDD < 2.4 V [2] 20 1.8 V VDD < 2.0 V [2] 24 - - ns in SPI mode [2] 0 - - ns data output valid time in SPI mode [2] - - 10 ns data output hold time in SPI mode [2] 0 - - ns 20 - - ns clock cycle time data set-up time ns ns 2.4 V VDD 3.6 V tDH tv(Q) th(Q) data hold time ns SPI slave (in SPI mode) Tcy(PCLK) PCLK cycle time LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 47 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Table 18. Dynamic characteristics of SPI pins in SPI mode Symbol Parameter Conditions Min Typ Max Unit tDS data set-up time in SPI mode [3][4] 0 - - ns tDH data hold time in SPI mode [3][4] 3 Tcy(PCLK) + 4 - - ns data output valid time in SPI mode [3][4] - - 3 Tcy(PCLK) + 11 ns data output hold time in SPI mode [3][4] - - 2 Tcy(PCLK) + 5 ns tv(Q) th(Q) [1] Tcy(clk) = (SSPCLKDIV (1 + SCR) CPSDVSR) / fmain. The clock cycle time derived from the SPI bit rate Tcy(clk) is a function of the main clock frequency fmain, the SPI peripheral clock divider (SSPCLKDIV), the SPI SCR parameter (specified in the SSP0CR0 register), and the SPI CPSDVSR parameter (specified in the SPI clock prescale register). [2] Tamb = 40 C to 85 C. [3] Tcy(clk) = 12 Tcy(PCLK). [4] Tamb = 25 C; for normal voltage supply range: VDD = 3.3 V. Tcy(clk) tclk(H) tclk(L) SCK (CPOL = 0) SCK (CPOL = 1) tv(Q) th(Q) DATA VALID MOSI DATA VALID tDS DATA VALID MISO tDH DATA VALID tv(Q) MOSI DATA VALID th(Q) DATA VALID tDH tDS MISO DATA VALID CPHA = 1 CPHA = 0 DATA VALID 002aae829 Pin names SCK, MISO, and MOSI refer to pins for both SPI peripherals, SPI0 and SPI1. Fig 21. SPI master timing in SPI mode LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 48 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Tcy(clk) tclk(H) tclk(L) tDS tDH SCK (CPOL = 0) SCK (CPOL = 1) MOSI DATA VALID DATA VALID tv(Q) MISO th(Q) DATA VALID tDS MOSI DATA VALID tDH DATA VALID tv(Q) MISO DATA VALID CPHA = 1 DATA VALID th(Q) CPHA = 0 DATA VALID 002aae830 Pin names SCK, MISO, and MOSI refer to pins for both SPI peripherals, SPI0 and SPI1. Fig 22. SPI slave timing in SPI mode LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 49 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 11. Application information 11.1 ADC usage notes The following guidelines show how to increase the performance of the ADC in a noisy environment beyond the ADC specifications listed in Table 7: • The ADC input trace must be short and as close as possible to the LPC11Cx2/Cx4 chip. • The ADC input traces must be shielded from fast switching digital signals and noisy power supply lines. • Because the ADC and the digital core share the same power supply, the power supply line must be adequately filtered. • To improve the ADC performance in a very noisy environment, put the device in Sleep mode during the ADC conversion. 11.2 XTAL input The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a clock in slave mode, it is recommended that the input be coupled through a capacitor with Ci = 100 pF. To limit the input voltage to the specified range, choose an additional capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave mode, a minimum of 200 mV(RMS) is needed. LPC1xxx XTALIN Ci 100 pF Cg 002aae788 Fig 23. Slave mode operation of the on-chip oscillator In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF (Figure 23), with an amplitude between 200 mV(RMS) and 1000 mV(RMS). This corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V. The XTALOUT pin in this configuration can be left unconnected. External components and models used in oscillation mode are shown in Figure 24 and in Table 19 and Table 20. Since the feedback resistance is integrated on chip, only a crystal and the capacitances CX1 and CX2 need to be connected externally in case of fundamental mode oscillation (the fundamental frequency is represented by L, CL and RS). Capacitance CP in Figure 24 represents the parallel package capacitance and should not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal manufacturer (see Table 19). LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 50 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller LPC1xxx L XTALIN XTALOUT = CL CP XTAL RS CX2 CX1 002aaf424 Fig 24. Oscillator modes and models: oscillation mode of operation and external crystal model used for CX1/CX2 evaluation Table 19. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters) low frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 1 MHz - 5 MHz 10 pF < 300 18 pF, 18 pF 20 pF < 300 39 pF, 39 pF 5 MHz - 10 MHz 10 MHz - 15 MHz 15 MHz - 20 MHz Table 20. 30 pF < 300 57 pF, 57 pF 10 pF < 300 18 pF, 18 pF 20 pF < 200 39 pF, 39 pF 30 pF < 100 57 pF, 57 pF 10 pF < 160 18 pF, 18 pF 20 pF < 60 39 pF, 39 pF 10 pF < 80 18 pF, 18 pF Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters) high frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 15 MHz - 20 MHz 10 pF < 180 18 pF, 18 pF 20 pF < 100 39 pF, 39 pF 20 MHz - 25 MHz 10 pF < 160 18 pF, 18 pF 20 pF < 80 39 pF, 39 pF 11.3 XTAL Printed Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal usage have a common ground plane. The external components must also be connected to the ground plain. Loops must be made as small as possible in LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 51 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller order to keep the noise coupled in via the PCB as small as possible. Also parasitics should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller accordingly to the increase in parasitics of the PCB layout. 11.4 Standard I/O pad configuration Figure 25 shows the possible pin modes for standard I/O pins with analog input function: • • • • • Digital output driver Digital input: Pull-up enabled/disabled Digital input: Pull-down enabled/disabled Digital input: Repeater mode enabled/disabled Analog input VDD ESD output enable pin configured as digital output driver output PIN ESD VDD VSS weak pull-up pull-up enable pin configured as digital input weak pull-down repeater mode enable pull-down enable data input select analog input pin configured as analog input analog input 002aaf304 Fig 25. Standard I/O pad configuration LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 52 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 11.5 Reset pad configuration VDD VDD VDD Rpu reset ESD 20 ns RC GLITCH FILTER PIN ESD VSS 002aaf274 Fig 26. Reset pad configuration 11.6 C_CAN with external transceiver (LPC11C12/C14 only) BAT 3V 5V VIO VCC CANH CANH S TJF1051 TXD RXD CANL CANL GND LPC11C12/C14 PIOx_y CAN_TXD CAN_RXD 002aaf911 Fig 27. Connecting the C_CAN to an external transceiver (LPC11C12/C14) LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 53 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 11.7 C_CAN with on-chip, high-speed transceiver (LPC11C22/C24 only) VDD 3V 5V VDD_CAN VCC VDD LPC11C22/C24 CANH CAN_TXD CANH CAN HIGH-SPEED TRANSCEIVER CANL C_CAN CAN_RXD CANL STD GND 002aaf910 Fig 28. Connecting the CAN high-speed transceiver to the CAN bus (LPC11C22/C24) LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 54 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 12. Package outline LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 c y X 36 25 A 37 24 ZE e E HE A A2 (A 3) A1 w M θ bp pin 1 index Lp L 13 48 detail X 12 1 ZD e v M A w M bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 1.6 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.18 0.12 7.1 6.9 7.1 6.9 0.5 9.15 8.85 9.15 8.85 1 0.75 0.45 0.2 0.12 0.1 Z D (1) Z E (1) θ 0.95 0.55 7o o 0 0.95 0.55 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT313-2 136E05 MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-01-19 03-02-25 Fig 29. Package outline SOT313-2 (LQFP48) LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 55 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 13. Abbreviations Table 21. LPC11CX2_CX4 Product data sheet Abbreviations Acronym Description ADC Analog-to-Digital Converter AHB Advanced High-performance Bus APB Advanced Peripheral Bus API Application Programming Interface BOD BrownOut Detection CAN Controller Area Network GPIO General Purpose Input/Output PLL Phase-Locked Loop RC Resistor-Capacitor SDO Service Data Object SPI Serial Peripheral Interface SSI Serial Synchronous Interface SSP Synchronous Serial Port UART Universal Asynchronous Receiver/Transmitter All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 56 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 14. Revision history Table 22. Revision history Document ID Release date Data sheet status Change notice Supersedes LPC11CX2_CX4 v.2 20101203 Product data sheet - LPC11C12_C14 v.1 Modifications: LPC11C12_C14 v.1 LPC11CX2_CX4 Product data sheet • • • • Parts LPC11C22 and LPC11C24 added. • Application diagram for connecting the C_CAN to an external transceiver added (Section 11.6). • • • • • Application diagram for high-speed, on-chip CAN transceiver added (Section 11.7). Pin description for parts LPC11C22 and LPC11C24 added (Table 4). Static characteristics for CAN transceiver added (Table 8). Description of high-speed, on-chip CAN transceiver added (LPC11C22/C24). See Section 7.11.2. Typical value for parameter Nendu added in Table 12 “Flash characteristics”. Description of RESET and WAKEKUP pins updated in Table 3. PLL output frequency limited to < 100 MHz in Section 7.16.2 “System PLL”. Parameter Vhys for I2C bus pins: typical value corrected Vhys = 0.05VDD in Table 6. 20100921 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 - © NXP B.V. 2010. All rights reserved. 57 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 58 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 59 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 Functional description . . . . . . . . . . . . . . . . . . 15 7.1 ARM Cortex-M0 processor . . . . . . . . . . . . . . . 15 7.2 On-chip flash program memory . . . . . . . . . . . 15 7.3 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 15 7.4 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 15 7.5 Nested Vectored Interrupt Controller (NVIC) . 16 7.5.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 7.5.2 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 17 7.6 IOCONFIG block . . . . . . . . . . . . . . . . . . . . . . 17 7.7 Fast general purpose parallel I/O . . . . . . . . . . 17 7.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7.8 UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.9 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 18 7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7.10 I2C-bus serial I/O controller . . . . . . . . . . . . . . 18 7.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.11 C_CAN controller . . . . . . . . . . . . . . . . . . . . . . 19 7.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.11.2 On-chip, high-speed CAN transceiver . . . . . . 20 7.11.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7.11.2.2 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . 20 7.11.2.3 Silent mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7.11.2.4 Undervoltage protection . . . . . . . . . . . . . . . . . 20 7.11.2.5 Thermal protection . . . . . . . . . . . . . . . . . . . . . 20 7.11.2.6 Time-out function . . . . . . . . . . . . . . . . . . . . . . 20 7.12 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.13 General purpose external event counter/timers . . 21 7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.14 System tick timer . . . . . . . . . . . . . . . . . . . . . . 22 7.15 Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . 22 7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7.16 Clocking and power control . . . . . . . . . . . . . . 22 7.16.1 Crystal oscillators . . . . . . . . . . . . . . . . . . . . . . 22 7.16.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 23 7.16.1.2 System oscillator . . . . . . . . . . . . . . . . . . . . . . 23 7.16.1.3 Watchdog oscillator . . . . . . . . . . . . . . . . . . . . 24 7.16.2 System PLL . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.16.3 Clock output . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.16.4 Wake-up process . . . . . . . . . . . . . . . . . . . . . . 24 7.16.5 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.16.5.1 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.16.5.2 Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . . 25 7.16.5.3 Deep power-down mode . . . . . . . . . . . . . . . . 25 7.17 System control . . . . . . . . . . . . . . . . . . . . . . . . 25 7.17.1 Start logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.17.2 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.17.3 Brownout detection . . . . . . . . . . . . . . . . . . . . 25 7.17.4 Code security (Code Read Protection - CRP) 26 7.17.5 Bootloader . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.17.6 APB interface . . . . . . . . . . . . . . . . . . . . . . . . . 27 7.17.7 AHBLite . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 7.17.8 External interrupt inputs . . . . . . . . . . . . . . . . . 27 7.18 Emulation and debugging . . . . . . . . . . . . . . . 27 8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 28 9 Static characteristics . . . . . . . . . . . . . . . . . . . 29 9.1 ADC characteristics . . . . . . . . . . . . . . . . . . . . 32 9.2 CAN on-chip, high-speed transceiver characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34 9.3 BOD static characteristics . . . . . . . . . . . . . . . 36 9.4 Power consumption . . . . . . . . . . . . . . . . . . . 36 9.5 Peripheral power consumption . . . . . . . . . . . 40 9.6 Electrical pin characteristics. . . . . . . . . . . . . . 41 10 Dynamic characteristics. . . . . . . . . . . . . . . . . 44 10.1 Flash memory . . . . . . . . . . . . . . . . . . . . . . . . 44 10.2 External clock. . . . . . . . . . . . . . . . . . . . . . . . . 44 10.3 Internal oscillators . . . . . . . . . . . . . . . . . . . . . 45 10.4 I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 10.5 I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 10.6 SPI interfaces. . . . . . . . . . . . . . . . . . . . . . . . . 47 11 Application information . . . . . . . . . . . . . . . . . 50 11.1 ADC usage notes. . . . . . . . . . . . . . . . . . . . . . 50 11.2 XTAL input . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 11.3 XTAL Printed Circuit Board (PCB) layout guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 11.4 Standard I/O pad configuration . . . . . . . . . . . 52 11.5 Reset pad configuration . . . . . . . . . . . . . . . . . 53 11.6 C_CAN with external transceiver (LPC11C12/C14 only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 11.7 C_CAN with on-chip, high-speed transceiver (LPC11C22/C24 only) . . . . . . . . . . . . . . . . . . 54 12 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 55 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 56 continued >> LPC11CX2_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 December 2010 © NXP B.V. 2010. All rights reserved. 60 of 61 LPC11Cx2/Cx4 NXP Semiconductors 32-bit ARM Cortex-M0 microcontroller 14 15 15.1 15.2 15.3 15.4 16 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 58 58 58 58 59 59 60 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 3 December 2010 Document identifier: LPC11CX2_CX4