AVAGO ALMD-LB36-SV002 High brightness smt oval led lamps amber, red, green and blue Datasheet

ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36
High Brightness SMT Oval LED Lamps
Amber, Red, Green and Blue
Data Sheet
Description
Features
The Avago ALMD-Lx36 oval LED series has the same or
just slightly less luminous intensity than conventional
high brightness, through-hole LEDs.
• Well defined spatial radiation pattern
• High brightness material
• Available in Red, Amber, Green and Blue color:
– Red AlInGaP 626 nm
– Amber AlInGaP 590 nm
– Green InGaN 525 nm
– Blue InGaN 470 nm
The new oval LED lamps can be assembled using common
SMT assembly processes and are compatible with industrial reflow soldering processes.
The LEDs are made with an advanced optical grade epoxy
for superior performance in outdoor sign applications.
The surface mount Oval LEDs are specifically designed for
full color/video signs and indoor or outdoor passenger
information sign applications.
• JEDEC MSL 2A
• Compatible with reflow soldering process
• Tinted and diffused lens
For easy pick-and-place assembly, the LEDs are shipped
in EIA-compliant tape and reel. Every reel is shipped from
a single intensity and color bin– except the red color–for
better uniformity.
• Wide viewing angle: 40° x 100°
Package Dimensions
• Mono color signs
C
Applications
• Full color signs
C
4.20±0.20
A
A
4.20±0.20
Orientation
(Anode Mark)
4.75±0.50
A - Anode
C - Cathode
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.20 mm unless other specified.
5.20±0.50
3.40±0.50
2.50±0.20
1.4 (4X)
1.0
CAUTION: InGaN devices are Class 1C HBM ESD sensitive, AlInGaP devices are Class 1B ESD sensitive per JEDEC Standard.
Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
CAUTION: Customer is advised to keep the LED in the MBB when not in use as prolonged exposure to environment might cause the
silver plated leads to tarnish, which might cause difficulties in soldering.
Device Selection Guide
Part Number
Color and Dominant Wavelength
λd (nm) Typ
Luminous Intensity Iv (mcd) [1,2,5]
Min
Max
Viewing Angle
Typ - ° [4]
ALMD-LG36-WZ002
Red 626
1380
2900
40° x 100°
ALMD-LL36-WZ002
Amber 590
1380
2900
40° x 100°
ALMD-LM36-14002
Green 525
2900
6050
40° x 100°
ALMD-LB36-SV002
Blue 470
660
1380
40° x 100°
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each bin limit is ± 15%
Part Numbering System
ALMD – X X 3 6 – x x x xx
Packaging Option
02: tested 20mA, 13 inch carrier tape, 8mm pitch, 16mm carrier width
Color Bin Selection
0: Full Distribution
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle
36: Oval 40° x 100°
Color
B: Blue
G: Red
L: Amber
M: Green
Package
L: SMT Oval Lamps (AlInGaP/InGaN)
SMT Lamps
2
Absolute Maximum Rating, TJ = 25 °C
Parameter
Red and Amber
Blue and Green
Unit
50
30
mA
100 [2]
100 [3]
mA
114
mW
DC Forward Current [1]
Peak Forward Current
120
Power Dissipation
Reverse Voltage
5 (IR
= 100 μA) [4]
5 (IR
LED Junction Temperature
= 10 μA) [4]
V
110
°C
Operating Temperature Range
-40 to +85
°C
Storage Temperature Range
-40 to +100
°C
Notes:
1. Derate linearly as shown in Figure 4 and Figure 9.
2. Duty Factor 30%, frequency 1 kHz.
3. Duty Factor 10%, frequency 1 kHz.
4. Indicates product final testing; long-term reverse bias is not recommended.
Electrical / Optical Characteristics, TJ = 25 °C
Parameter
Symbol
Forward Voltage
Red
Amber
Green
Blue
VF
Reverse Voltage
Red & Amber
Green & Blue
VR
Dominant Wavelength [1]
Red
Amber
Green
Blue
λd
Peak Wavelength
Red
Amber
Green
Blue
Thermal Resistance
Luminous Efficacy [2]
Red
Amber
Green
Blue
Thermal coefficient of λd
Red
Amber
Green
Blue
Min.
Typ.
Max.
1.8
1.8
2.8
2.8
2.1
2.1
3.2
3.2
2.4
2.4
3.8
3.8
5
5
618.0
584.5
519.0
460.0
626.0
590.0
525.0
470.0
Units
Test Conditions
V
IF = 20 mA
V
IF = 100 µA
IF = 10 µA
IF = 20 mA
630.0
594.5
539.0
480.0
λPEAK
634
594
516
464
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
RθJ-PIN
130
°C/W
LED Junction-to-Pin
ηV
200
520
530
65
lm/W
Emitted Luminous Power/Emitted
Radiant Power
nm/°C
IF = 20 mA; +25 °C ≤ TJ ≤ +100 °C
0.059
0.103
0.028
0.024
Notes:
1. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is
the luminous efficacy in lumens/watt.
3
AlInGaP
100
RELATIVE INTENSITY
0.8
Amber
FORWARD CURRENT - mA
1
Red
0.6
0.4
0.2
0
500
550
600
WAVELENGTH - nm
40
20
0
0.5
1
1.5
2
FORWARD VOLTAGE - V
2.5
60
Amber
Red
0
20
40
60
FORWARD CURRENT - mA
80
100
50
40
30
20
10
0
0
20
40
60
TA - AMBIENT TEMPERATURE (°C)
80
Note: RθJ-A = 460 °C/W
RELATIVE DOMINANT WAVELENGTH
SHIFT(NORMALIZED AT 20mA) - nm
Figure 3. Relative Intensity vs Forward Current
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
Figure 4. Maximum Forward Current vs Ambient Temperature
Amber
Red
0
20
40
60
FORWARD CURRENT - mA
80
Figure 5. Relative Dominant Wavelength Shift vs Forward Current
4
3
Figure 2. Forward Current vs Forward Voltage
MAXIMUM FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
60
0
650
Figure 1. Relative Intensity vs Wavelength
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
80
100
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
100
BLUE
FORWARD CURRENT-mA
RELATIVE INTENSITY
InGaN
GREEN
430
480
530
WAVELENGTH - nm
580
630
Figure 6. Relative Intensity vs Wavelength
0
IFmax - MAXIMUM FORWARD
CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
2.5
Green
2.0
1.5
1.0
0.5
0
20
40
60
80
DC FORWARD CURRENT-mA
100
120
0
1
2
3
FORWARD VOLTAGE-V
4
5
40
60
80
TA - AMBIENT TEMPERATURE - °C
100
5
Green
Blue
0
-5
0
20
30
25
20
15
10
5
0
0
20
Figure 9. Maximum Forward Current vs Ambient Temperature
10
RELATIVE DOMINANT
WAVELENGTH SHIFT -nm
20
Figure 7. Forward Current vs Forward Voltage
Figure 8. Relative Intensity vs Forward Current
40
60
FORWARD CURRENT-mA
Figure 10. Dominant Wavelength Shift vs Forward Current
5
40
Blue
3.0
-10
60
35
3.5
0.0
80
80
100
1.0
0.8
0.8
NORMALIZED INTENSITY
NORMALIZED INTENSITY
1.0
0.6
0.4
0.2
0.0
Red
Green
-90
-60
Blue
Amber
-30
0
30
ANGULAR DISPLACEMENT-DEGREE
60
Blue
Green
FORWARD VOLTAGE SHIFT-V
NORMALZIED INTENSITY (PHOTO)
-90
-60
-30
0
30
ANGULAR DISPLACEMENT-DEGREE
60
90
0.3
Red
Amber
1
-40
-15
10
35
TJ - JUNCTION TEMPERATURE
60
Figure 12. Relative Intensity Shift vs Junction Temperature
6
Red
Green
Blue
Amber
0.2
Figure 11b. Radiation Pattern for Minor Axis
10
0.1
0.4
0.0
90
Figure 11a. Radiation Pattern for Major Axis
0.6
85
Red
Amber
0.2
Green
Blue
0.1
0
-0.1
-0.2
-0.3
-40
-15
10
35
TJ - JUNCTION TEMPERATURE
Figure 13. Forward Voltage Shift vs Junction Temperature
60
85
4.0
0.7
2.1
Note: Recommended stencil thickness
is 0.1524mm (6 mils) minimum and
above
5.2
Figure 14. Recommended Soldering Land Pattern
3.20
Nozzle Depth
4.00
Pick &
Place
Nozzle
LED Flange
4.00
5.00
Note:
1. Nozzle depth should be touching LED flange during pick and place.
2. Nozzle width should be able to fit into LED carrier tape
Figure 15. Recommended Pick and Place Nozzle Tip (Urethane PAD Tip)
20 SEC. MAX.
183°C
100-150°C
-6°C/SEC.
MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
60-150 SEC.
TIME
Figure 16. Recommended Leaded Reflow Soldering Profile
TEMPERATURE
TEMPERATURE
10 to 30 SEC.
240°C MAX.
3°C/SEC. MAX.
217°C
200°C
255 - 260 °C
3°C/SEC. MAX.
6°C/SEC. MAX.
150°C
3 °C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
TIME
Figure 17. Recommended Pb- Free Reflow Soldering Profile
Note: For detailed information on reflow soldering of Avago Surface Mount LED, refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
7
4.00±0.10 2.00±0.10
0.40±0.05
1.55±0.10
1.75±0.10
1.80±0.20
7.50±0.10
+0.30
5.20 −0.00
8.00±0.10
2.20±0.20
4.50±0.10
4.10±0.10
16.00±0.30
1.60±0.10
+0.30
5.90 −0.00
Figure 18. Carrier Tape Dimension
∅80.00 ± 0.50
0.2
0.4
0.6
0.8
13.00 ± 0.20
1.50 MIN
∅330.00 ± 2.00
LT-W16-HIPS
EIAJ.RRM.16.Dc
17.65 ± 0.20
Figure 19. Reel Dimension
Anode
Figure 20. Unit Orientation from reel
8
Intensity Bin Limit Table (1.2:1 Iv bin ratio)
Bin
VF Bin Table (V at 20 mA) for Red & Amber
Intensity (mcd) at 20 mA
Bin ID
Min
Max
Min
Max
VD
1.8
2.0
VA
2.0
2.2
VB
2.2
2.4
S
660
800
T
800
960
U
960
1150
V
1150
1380
W
1380
1660
X
1660
1990
Y
1990
2400
Z
2400
2900
1
2900
3500
2
3500
4200
3
4200
5040
4
5040
6050
Tolerance for each bin limit is ± 0.05V
Tolerance for each bin limit is ± 15%
Red Color Range
Min Dom
Max Dom
618.0
630.0
X min
Y Min
X max
Y max
0.6872
0.3126
0.6890
0.2943
0.6690
0.3149
0.7080
0.2920
Tolerance for each bin limit is ± 0.5nm
Amber Color Range
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
584.5
587.0
0.5420
0.4580
0.5530
0.4400
0.5370
0.4550
0.5570
0.4420
2
587.0
589.5
0.5570
0.4420
0.5670
0.4250
0.5530
0.4400
0.5720
0.4270
0.5720
0.4270
0.5820
0.4110
0.5670
0.4250
0.5870
0.4130
0.5870
0.4130
0.5950
0.3980
0.5820
0.4110
0.6000
0.3990
4
6
589.5
592.0
592.0
594.5
Tolerance for each bin limit is ± 0.5nm
9
Green Color Range
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
519.0
523.0
0.0667
0.8323
0.1450
0.7319
0.1200
0.7375
0.0979
0.8316
0.0979
0.8316
0.1711
0.7218
0.1450
0.7319
0.1305
0.8189
2
523.0
527.0
3
527.0
531.0
0.1305
0.8189
0.1967
0.7077
0.1711
0.7218
0.1625
0.8012
4
531.0
535.0
0.1625
0.8012
0.2210
0.6920
0.1967
0.7077
0.1929
0.7816
0.1929
0.7816
0.2445
0.6747
0.2210
0.6920
0.2233
0.7600
5
535.0
539.0
Tolerance for each bin limit is ± 0.5 nm
Blue Color Range
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
460.0
464.0
0.1440
0.0297
0.1766
0.0966
0.1818
0.0904
0.1374
0.0374
2
464.0
468.0
0.1374
0.0374
0.1699
0.1062
0.1766
0.0966
0.1291
0.0495
0.1291
0.0495
0.1616
0.1209
0.1699
0.1062
0.1187
0.0671
3
468.0
472.0
4
472.0
476.0
0.1187
0.0671
0.1517
0.1423
0.1616
0.1209
0.1063
0.0945
5
476.0
480.0
0.1063
0.0945
0.1397
0.1728
0.1517
0.1423
0.0913
0.1327
Tolerance for each bin limit is ± 0.5 nm
10
Moisture Sensitivity and Handling
The ALMD-Lx36 series oval package has a Moisture
Sensitive Level 2a rating per JEDEC J-STD-020. Refer to
Avago Application Note AN5305, Handling of Moisture
Sensitive Surface Mount Devices, for additional details
and a review of proper handling procedures.
A. Storage before use
• An unopened moisture barrier bag (MBB) can be
stored at < 40 °C/90% RH for 12 months. If the actual
shelf life has exceeded 12 months and the humidity
indicator card (HIC) indicates that baking is not
required then it is safe to reflow solder the LEDs per
the original MSL rating.
• It is recommended that the MBB not be opened
prior to assembly (e.g., for IQC).
B. Control after opening the MBB
• The humidity indicator card (HIC) shall be read
immediately upon opening of the MBB.
C. Control for unfinished tape and reel parts
• Unused LEDs must be stored in a sealed MBB with a
desiccant or desiccator at < 5% RH.
D. Control of assembled boards
• If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB needs
to be stored in a sealed MBB with desiccant or
desiccator at < 5% RH to ensure that all LEDs have
not exceeded their floor life of 672 hours
E. Baking is required if:
• The HIC indicator is not BROWN at 10% and is AZURE
at 5%
• The LEDs are exposed to a condition of > 30 ° C/60%
RH at any time.
• The LED floor life exceeded 672 hours.
The recommended baking condition is: 60 ± 5 °C for 20
hours.
• The LEDs must be kept at < 30 °C/60% RH at all
times, and all high temperature related processes
including soldering, curing or rework need to be
completed within 672 hours.
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for
sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved.
AV02-2377EN - February 26, 2013
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