IDT IDT74FST163209PV 9-bit bus exchange switch Datasheet

IDT74FST163209
ADVANCE INFORMATION
9-BIT BUS EXCHANGE
SWITCH
Integrated Device Technology, Inc.
or source capability. Thus they generate little or no noise of
their own while providing a low resistance path for an external
driver. These devices connect input and output ports through
an n-channel FET. When the gate-to-source junction of this
FET is adequately forward-biased the device conducts and
the resistance between input and output ports is small. Without adequate bias on the gate-to-source junction of the FET,
the FET is turned off, therefore with no VCC applied, the device
has hot insertion capability.
The low on-resistance and simplicity of the connection
between input and output ports reduces the delay in this path
to close to zero.
The FST163209 provides four 9-bit TTL- compatible ports
that support 2 way bus exchange. The S0-2 pins control the
bus exchange and switch enable functions.
FEATURES:
• Bus switches provide zero delay paths
• Extended commercial range of –40°C to +85°C
• Low switch on-resistance:
FST163xxx – 4Ω
• TTL-compatible input and output levels
• ESD > 2000V per MIL-STD-883, Method 3015;
> 200V using machine model (C = 200pF, R = 0)
• Available in SSOP, TSSOP and TVSOP
DESCRIPTION:
The FST163209 belongs to IDT's family of Bus switches.
Bus switch devices perform the function of connecting or
isolating two ports without providing any inherent current sink
FUNCTIONAL BLOCK DIAGRAM
1 of 9 Channels
1A1
1B 1
1A2
1B 2
Flow Control
S0
S1
3510 drw 01
S2
PIN DESCRIPTION
Pin Names
A1, A2
B1, B2
S0-2
I/O
I/O
I
Description
Buses A1, A2, B1, B2
Control Pins for Mux and Switch
Enable Functions
3510 tbl 01
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
COMMERCIAL TEMPERATURE RANGE
SEPTEMBER 1996
1996 Integrated Device Technology, Inc.
DSC-3510/1
1
IDT74FST163209
9-BIT BUS EXCHANGE SWITCH
COMMERCIAL TEMPERATURE RANGE
ABSOLUTE MAXIMUM RATINGS(1)
PIN CONFIGURATION
Symbol
Description
VTERM(2) Terminal Voltage with Respect
to GND
TSTG
Storage Temperature
S0
1
48
S1
1 A1
2
47
S2
1 A2
3
46
1B1
GND
4
45
1B2
2 A1
5
44
2B1
2 A2
6
43
2B2
VCC
7
42
GND
3 A1
8
41
3B1
3 A2
9
40
3B2
GND
10
39
GND
CAPACITANCE(1)
4 A1
11
38
4B1
Symbol
4 A2
12
37
4B2
SO48-1
SO48-2
SO48-3
36
5B1
14
35
5B2
GND
15
34
GND
6 A1
16
33
6B1
6 A2
17
32
6B2
7 A1
18
31
7B1
7 A2
19
30
7B2
GND
20
29
GND
8 A1
21
28
8B1
8 A2
22
27
8B2
9 A1
23
26
9B1
9 A2
24
25
9B2
5 A1
13
5 A2
I OUT
Maximum Continuous Channel
Current
Max.
–0.5 to +7.0
Unit
V
–65 to +150
°C
128
mA
3510 tbl 02
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating condiitions for extended periods may affect reliability.
2. VCC, Control and Switch terminals.
Conditions(2) Typ. Unit
Parameter
CIN
Control Input Capacitance
CI/O
Switch Input/Output
Capacitance
4
pF
Switch Off
pF
3510 tbl 03
NOTES:
1. Capacitance is characterized but not tested
2. TA = 25°C, f = 1MHz, VIN = 0V, VOUT = 0V
FUNCTION TABLE
S2
L
S1
L
S0
L
A1
Z
A2
Z
Function
Disconnect
L
L
H
B1
Z
A1 to B1
L
H
L
B2
Z
A1 to B2
L
H
H
Z
B1
A2 to B1
H
L
L
Z
B2
A2 to B2
H
L
H
Z
Z
Disconnect
H
H
L
B1
B2
A1 to B1, A2 to B2
H
H
H
B2
B1
A1 to B2, A2 to B1
3510 tbl 04
SSOP/
TSSOP/TVSOP
TOP VIEW
3510 drw 02
2
IDT74FST163209
9-BIT BUS EXCHANGE SWITCH
COMMERCIAL TEMPERATURE RANGE
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified:
Commercial: TA = –40°C to +85°C, VCC = 5.0V ±10%
Symbol
VIH
Parameter
Input HIGH Voltage
Test Conditions(1)
Guaranteed Logic HIGH for Control Inputs
Min.
2.0
Typ.(2)
—
Max.
—
Unit
V
VIL
Input LOW Voltage
Guaranteed Logic LOW for Control Inputs
—
—
0.8
V
II H
Input HIGH Current
VCC = Max.
VI = VCC
—
—
±1
µA
II L
Input LOW Voltage
VI = GND
—
—
±1
IOZH
High Impedance Output Current
VO = VCC
—
—
±1
IOZL
(3-State Output pins)
VO = GND
—
—
±1
IOS
Short Circuit Current
VCC = Max., VO = GND(3)
—
300
—
mA
VIK
Clamp Diode Voltage
VCC = Min., IIN = –18mA
—
–0.7
–1.2
V
RON
Switch On Resistance(4)
VCC = Min. VIN = 0.0V
—
4
7
Ω
—
4
7
Ω
—
6
15
Ω
µA
VCC = Max.
µA
ION = 64mA
VCC = Min. VIN = 0.0V
ION = 30mA
VCC = Min. VIN = 2.4V
ION = 15mA
IOFF
Input/Output Power Off Leakage
VCC = 0V, VIN or VO ≤ 4.5V
—
—
±1
ICC
Quiescent Power Supply Current
VCC = Max., VIN = GND or VCC
—
0.1
3
NOTES:
1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at VCC = 5.0V, +25°C ambient.
3. Not more than one output should be tested at one time. Duration of the test should not exceed one second.
4. Measured by voltage drop between ports at indicated current through the switch.
3
µA
3510 tbl 05
IDT74FST163209
9-BIT BUS EXCHANGE SWITCH
COMMERCIAL TEMPERATURE RANGE
POWER SUPPLY CHARACTERISTICS
Symbol
∆ICC
ICCD
IC
Parameter
Quiescent Power Supply Current
TTL Inputs HIGH
Dynamic Power Supply
Current(4)
Total Power Supply Current (6)
Test Conditions(1)
VCC = Max.
VIN = 3.4V(3)
VCC = Max.
Outputs Open
Enable Pin Toggling
50% Duty Cycle
VCC = Max.
Outputs Open
3 Select Pins Toggling
(9 Switches Toggling)
fi = 10MHz
50% Duty Cycle
Min.
—
Typ.(2)
0.5
Max.
1.5
Unit
mA
VIN = VCC
VIN = GND
—
30
40
µA/
MHz/
Switch
VIN = VCC
VIN = GND
—
2.7
3.6
mA
VIN = 3.4
VIN = GND
—
3.5
5.9
NOTES:
1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at VCC = 5.0V, +25°C ambient.
3. Per TTL driven input (VIN = 3.4V). All other inputs at VCC or GND.
4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations.
5. Values for these conditions are examples of the ICC formula. These limits are guaranteed but not tested.
6. IC = IQUIESCENT + IINPUTS + IDYNAMIC
IC = ICC + ∆ICC DHNT + ICCD (fiN)
ICC = Quiescent Current
∆ICC = Power Supply Current for a TTL High Input (VIN = 3.4V)
DH = Duty Cycle for TTL Inputs High
NT = Number of TTL Inputs at DH
ICCD = Dynamic Current Caused by an Input Transition Pair (HLH or LHL)
fi = Input Frequency
N = Number of Switches Toggling at fi
All currents are in milliamps and all frequencies are in megahertz.
3510 tbl 06
SWITCHING CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified:
Commercial: TA = –40°C to +85°C, VCC = 5.0V ±10%
Symbol
tPLH
tPHL
tBX
tPZH
tPZL
tPHZ
tPLZ
|QCI|
Description
Data Propagation Delay
A to B, B to A(3,4)
Switch Multiplex Delay
S to A, B
Switch Turn on Delay
S to A, B
Switch Turn off Delay
S to A, B
Charge Injection, Typical(5,7)
|QDCI|
Charge Injection, Typical(6,7)
Condition(1)
CL = 50pF
RL = 500Ω
Min.(2)
—
Typ.
—
Max.
0.25
Unit
ns
1.5
—
6.5
ns
1.5
—
6.5
ns
1.5
—
7
ns
—
1.5
—
pC
—
0.5
—
3510 tbl 07
NOTES:
1. See test circuit and waveforms.
2. Minimum limits guaranteed but not tested.
3. This parameter is guaranteed by design but not tested.
4. The bus switch contributes no propagation delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant
for the switch alone is of the order of 2.5ns for 50pF load. Since this time is constant and much smaller than the rise/fall times of typical driving signals,
it adds very little propagation delay to the system. Propagation delay on the bus switch when used in a system is determined by the driving circuit on the
driving side of the switch and its interaction with the load on the driven side.
5. Measured at switch turn off, load = 50 pF in parallel with 10 MΩ scope probe, VIN = 0.0 volts.
6. Measured at switch turn off through bus multiplexer, (e.g.- A1 to B1 = >A1 to B2), load = 50 pF in parallel with 10 MΩ scope probe, VIN at A = 0.0 volts. Charge
injection is reduced because the injection from the turn off of the A to C switch is compensated by the turn on of the B to C switch.
7. Characterized parameter. Not 100% tested.
4
IDT74FST163209
9-BIT BUS EXCHANGE SWITCH
COMMERCIAL TEMPERATURE RANGE
TEST CIRCUITS AND WAVEFORMS
TEST CIRCUITS FOR ALL OUTPUTS
V CC
SWITCH POSITION
500Ω
Pulse
Generator
Switch
Open Drain
Disable Low
Closed
Enable Low
V OUT
VIN
Test
7.0V
Open
All Other Tests
D.U.T.
50pF
RT
3510 lnk 08
DEFINITIONS:
CL= Load capacitance: includes jig and probe capacitance.
RT = Termination resistance: should be equal to ZOUT of the Pulse
Generator.
500Ω
CL
3510 lnk 03
PULSE WIDTH
SET-UP, HOLD AND RELEASE TIMES
DATA
INPUT
TIMING
INPUT
ASYNCHRONOUS CONTROL
PRESET
CLEAR
ETC.
SYNCHRONOUS CONTROL
PRESET
CLEAR
CLOCK ENABLE
ETC.
tH
tSU
tREM
tSU
3V
1.5V
0V
3V
1.5V
0V
LOW-HIGH-LOW
PULSE
1.5V
tW
3V
1.5V
0V
HIGH-LOW-HIGH
PULSE
1.5V
3V
1.5V
0V
tH
3510 lnk 05
3510 lnk 04
PROPAGATION DELAY
ENABLE AND DISABLE TIMES
ENABLE
SAME PHASE
INPUT TRANSITION
tPLH
tPHL
OUTPUT
tPLH
OPPOSITE PHASE
INPUT TRANSITION
tPHL
3V
1.5V
0V
VOH
1.5V
VOL
DISABLE
3V
CONTROL
INPUT
tPLZ
tPZL
OUTPUT
NORMALLY
LOW
3V
1.5V
0V
SWITCH
CLOSED
3510 lnk 06
SWITCH
OPEN
3.5V
3.5V
1.5V
tPZH
OUTPUT
NORMALLY
HIGH
1.5V
0V
0.3V
VOL
tPHZ
0.3V
VOH
1.5V
0V
0V
3510 lnk 07
NOTES:
1. Diagram shown for input Control Enable-LOW and input Control DisableHIGH
2. Pulse Generator for All Pulses: Rate ≤ 1.0MHz; tF ≤ 2.5ns; tR ≤ 2.5ns
5
IDT74FST163209
9-BIT BUS EXCHANGE SWITCH
COMMERCIAL TEMPERATURE RANGE
ORDERING INFORMATION
IDT
XX
FST 16 XX
Temp. Range
Device Type
X
Package
PV
PA
PF
Shrink Small Outline Package (SO48-1)
Thin Shrink Small Outline Package (SO48-2)
Thin Very Small Outline Package (SO48-3)
163209
9-Bit Bus Exchange Switch
74
–40°C to +85°C
3510 drw 08
Integrated Device Technology, Inc. reserves the right to make changes to the specifications in this data sheet in order to improve design or performance and to supply the best possible product.
Integrated Device Technology, Inc.
2975 Stender Way, Santa Clara, CA 95054-3090
Telephone: (408) 727-6116
6
FAX 408-492-8674
Similar pages