ABS1~ABS10 Rev.C Feb.-2015 描述 / DATA SHEET Descriptions 0.8A 表面贴装玻璃钝化整流桥，薄型 ABS/LBF 封装。 0.8A Surface Mount Glass Passivated Bridge Rectifier，ABS/LBF thin package. 特征 / Features 玻璃钝化芯片，浪涌电流大，反向电压：100V~1000V 正向电流：0.8A，适用于表面贴装。无卤产品。 Glass Passivated Chip Junction, Reverse Voltage :100 to 1000V,Forward Current: 0.8A,High Surge Current Capability, Designed for Surface Mount Application. Halogen free product. 用途 / Applications 一般用途. General purpose. 内部等效电路 / Equivalent Circuit 引脚排列 / Pinning 印章代码 / Marking 见印章说明。See Marking Instructions. http://www.fsbrec.com 1/6 ABS1~ABS10 Rev.C Feb.-2015 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol 数值 Rating ABS1 ABS2 ABS4 ABS6 ABS8 ABS10 单位 Unit Maximum Repetitive Peak Reverse Voltage VRRM 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 70 140 280 420 560 700 V VDC 100 200 400 600 800 1000 V Maximum DC Blocking Voltage Average Rectified Output Current at Ta = 40 °C Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) Typical Junction Capacitance（Note1） Typical Thermal （Note2） Resistance Operating and Storage Temperature Range Note: Io 0.8 A IFSM 30 A Ci 13 pF RθJA 85 ℃/W RθJL 30 ℃/W Tj,Tstg -55~150 ℃ 1. Measured at 1MHz and applied reverse voltage of 4 V D.C. 2. Mounted on glass epoxy PC board with 4×( 5×5mm2）copper pad. 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter 符号 Symbol Forward Voltage per element VF Maximum DC Reverse Current at Maximum DC Blocking Voltage IR http://www.fsbrec.com 测试条件 Test Conditions 数值 Rating IF=0.4A 1.0 IF=0.8A 1.1 Ta=25℃ 5.0 Ta=100℃ 50 Ta=125℃ 100 单位 Unit V μA 2/6 ABS1~ABS10 Rev.C Feb.-2015 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 3/6 ABS1~ABS10 Rev.C Feb.-2015 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 ABS1~ABS10 Rev.C Feb.-2015 印章说明 / DATA SHEET Marking Instructions http://www.fsbrec.com 5/6 ABS1~ABS10 Rev.C Feb.-2015 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Time:10±1 sec / REEL Package Type 封装形式 使用说明 Temp.:260±5℃ / Packaging SPEC. 卷盘包装 ABS/LBF 时间：10±1 sec. Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 5000 2 10000 5 50000 13〞×15 336X336X40 345X345X235 / Notices http://www.fsbrec.com 6/6