SCHS314D − MAY 2002 − REVISED SEPTEMBER 2004 D 4.5-V to 5.5-V VCC Operation D Fanout (Over Temperature Range) D D D D − Standard Outputs . . . 10 LSTTL Loads − Bus-Driver Outputs . . . 15 LSTTL Loads Wide Operating Temperature Range of −55°C to 125°C Balanced Propagation Delays and Transition Times Significant Power Reduction Compared to LSTTL Logic ICs HCT Types − Direct LSTTL Input Logic Compatibility, VIL = 0.8 V (Max), VIH = 2 V (Min) − CMOS Input Compatibility, II ≤ 1 µA at VOL, VOH CD74HCT4514 . . . E PACKAGE CD74HCT4515 . . . E OR EN PACKAGE (TOP VIEW) LE A0 A1 Y7 Y6 Y5 Y4 Y3 Y1 Y2 Y0 GND 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC E A3 A2 Y10 Y11 Y8 Y9 Y14 Y15 Y12 Y13 description/ordering information The CD74HCT4514 and CD74HCT4515 are high-speed silicon-gate devices consisting of a 4-bit strobed latch and a 4-line to 16-line decoder. The selected output is enabled by a low on the enable (E) input. A high on E inhibits selection of any output. Demultiplexing is accomplished by using E as the data input and the select inputs (A0−A3) as addresses. E also serves as a chip select when these devices are cascaded. When the latch enable (LE) is high, the output follows changes in the inputs (see decode function table). When LE is low, the output is isolated from changes in the input and remains at the level (high for the ’4514, low for the ’4515) it had before the latch was enabled. ORDERING INFORMATION PACKAGE† TA PDIP − E Tube PDIP − EN Tube −55°C 125°C −55 C to 125 C ORDERABLE PART NUMBER TOP-SIDE MARKING CD74HCT4514E CD74HCT4514E CD74HCT4515E CD74HCT4515E CD74HCT4515EN CD74HCT4515EN † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !" # $%&" !# '%()$!" *!"&+ *%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"# #"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCHS314D − MAY 2002 − REVISED SEPTEMBER 2004 DECODE FUNCTION TABLE (LE = H) DECODER INPUTS E A1 A0 ADDRESSED OUTPUT CD74HCT4514 = H CD74HCT4515 = L A3 A2 L L L L L Y0 L L L L H Y1 L L L H L Y2 L L L H H Y3 L L H L L Y4 L L H L H Y5 L L H H L Y6 L L H H H Y7 L H L L L Y8 L H L L H Y9 L H L H L Y10 L H L H H Y11 L H H L L Y12 L H H L H Y13 L H H H L Y14 L H H H H Y15 H X X X X All outputs = L, CD74HCT4514 All outputs = H, CD74HCT4515 H = high, L = low, X = don’t care logic diagram (positive logic) CD74HCT4514 CD74HCT4515 A0 A1 A2 A3 LE 2 3 21 22 Latch 4-Line to 16-Line Decoder Y0 Y1 Y2 Y0 Y1 Y2 8 7 Y3 Y4 Y3 Y4 6 5 4 Y5 Y6 Y7 Y5 Y6 Y7 18 Y8 Y8 17 Y9 Y9 20 16 Y10 Y11 Y12 Y13 Y14 Y10 Y11 Y12 Y13 Y14 15 Y15 Y15 19 14 13 1 23 GND = 12 VCC = 24 E 2 11 9 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCHS314D − MAY 2002 − REVISED SEPTEMBER 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output drain current per output, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous output source or sink current per output, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W EN package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-3. recommended operating conditions (see Note 3) TA = 25°C TA = −55°C TO 125°C TA = −40°C TO 85°C MIN MAX MIN MAX MIN MAX 4.5 5.5 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO ∆t/∆v Output voltage 0 High-level input voltage 2 2 0.8 Input transition rise or fall rate VCC VCC 2 0.8 0 0 500 VCC VCC 0 0 500 UNIT V V 0.8 V VCC VCC V 500 ns V NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VOH VI = VIH or VIL IOH = −20 µA IOH = −4 mA 4.5 V VOL VI = VIH or VIL IOL = 20 µA IOL = 4 mA 4.5 V II ICC VI = VCC or 0 VI = VCC or 0, ∆ICC‡ One input at VCC − 2.1 V, IO = 0 Other inputs at 0 or VCC TA = 25°C TA = −55°C TO 125°C TA = −40°C TO 85°C MIN MIN MIN MAX MAX 4.4 4.4 4.4 3.98 3.7 3.84 UNIT MAX V 0.1 0.1 0.1 0.26 0.4 0.33 5.5 V ±0.1 ±1 ±1 µA 5.5 V 8 160 80 µA 360 490 450 µA 4.5 V to 5.5 V V Ci 10 10 10 pF ‡ Additional quiescent supply current per input pin, TTL inputs high, 1 unit load. For dual-supply systems, theoretical worst-case (VI = 2.4 V, VCC = 5.5 V) specification is 1.8 mA. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCHS314D − MAY 2002 − REVISED SEPTEMBER 2004 HCT INPUT LOADING TABLE INPUT UNIT LOAD A0−A3 0.15 LE 0.85 E 0.3 Unit load is ∆ICC limit specified in electrical characteristics table (e.g., 360 µA max at 25°C). timing requirements over recommended operating free-air temperature range, VCC = 4.5 V, CL = 15 pF (unless otherwise noted) (see Figure 1) TA = 25°C TA = −55°C TO 125°C TA = −40°C TO 85°C MIN MIN MIN MAX MAX UNIT MAX tw Pulse duration, LE high 30 45 38 ns tsu Setup time, data before LE↓ 20 30 25 ns th Hold time, data after LE↓ 5 5 5 ns switching characteristics over recommended operating free-air temperature range, VCC = 4.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE Y CL = 50 pF Y CL = 50 pF TA = 25°C TA = −55°C TO 125°C TA = −40°C TO 85°C MIN MIN MIN A0−A3 tpd LE E tt MAX MAX UNIT MAX 55 83 69 50 75 63 40 60 50 15 22 19 ns ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd 4 TYP Power dissipation capacitance 75 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT pF SCHS314D − MAY 2002 − REVISED SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION VCC Test Point From Output Under Test PARAMETER S1 ten 1 kΩ tdis CL (see Note A) S2 S1 S2 tPZH Open Closed tPZL Closed Open tPHZ Open Closed tPLZ Closed Open Open Open tpd or tt tw LOAD CIRCUIT 3V 1.3 V Input 1.3 V 0V VOLTAGE WAVEFORMS PULSE DURATION CLR Input 3V Reference Input 3V 1.3 V 1.3 V 0V 0V tsu trec Data 1.3 V Input 0.3 V 3V 1.3 V CLK th 2.7 V 2.7 V tr 0V VOLTAGE WAVEFORMS RECOVERY TIME 3V 1.3 V 0.3 V 0 V tf VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES 3V Input 1.3 V 1.3 V 0V tPLH In-Phase Output 1.3 V 10% 90% tPHL 90% 1.3 V 1.3 V 0V tPHL 90% tr Out-of-Phase Output 3V Output Control VOH 1.3 V 10% tf VOL tPLH 1.3 V 10% tf 1.3 V 10% 90% tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES ≈VCC 1.3 V Output Waveform 2 (see Note B) 10% VOL tPHZ tPZH VOH VOL tPLZ tPZL Output Waveform 1 (see Note B) 1.3 V 90% VOH ≈0 V VOLTAGE WAVEFORMS OUTPUT ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. D. For clock inputs, fmax is measured with the input duty cycle at 50%. E. The outputs are measured one at a time, with one input transition per measurement. F. tPLZ and tPHZ are the same as tdis. G. tPZL and tPZH are the same as ten. H. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD74HCT4514E ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT4514EE4 ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT4515E ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT4515EE4 ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT4515EN ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT4515ENE4 ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002 N (R–PDIP–T24) PLASTIC DUAL–IN–LINE 1.222 (31,04) MAX 24 13 0.360 (9,14) MAX 1 12 0.070 (1,78) MAX 0.200 (5,08) MAX 0.425 (10,80) MAX 0.020 (0,51) MIN Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0’–15’ 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) 0.010 (0,25) NOM 4040051–3/D 09/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS–010 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDI008 – OCTOBER 1994 N (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE 24 PIN SHOWN A 24 13 0.560 (14,22) 0.520 (13,21) 1 12 0.060 (1,52) TYP 0.200 (5,08) MAX 0.610 (15,49) 0.590 (14,99) 0.020 (0,51) MIN Seating Plane 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.125 (3,18) MIN 0.010 (0,25) M PINS ** 0°– 15° 0.010 (0,25) NOM 24 28 32 40 48 52 A MAX 1.270 (32,26) 1.450 (36,83) 1.650 (41,91) 2.090 (53,09) 2.450 (62,23) 2.650 (67,31) A MIN 1.230 (31,24) 1.410 (35,81) 1.610 (40,89) 2.040 (51,82) 2.390 (60,71) 2.590 (65,79) DIM 4040053 / B 04/95 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Falls within JEDEC MS-011 Falls within JEDEC MS-015 (32 pin only) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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