Hynix H57V2582GTR-75C 256mb synchronous dram based on 8m x 4bank x8 i/o Datasheet

256Mb Synchronous DRAM based on 8M x 4Bank x8 I/O
256M (32Mx8bit) Hynix SDRAM
Memory
Memory Cell Array
- Organized as 4banks of 8,388,608 x 8
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for
use of circuits described. No patent licenses are implied.
Rev 1.0 / Aug. 2009
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
Document Title
256Mbit (32M x8) Synchronous DRAM
Revision History
Revision No.
History
Draft Date
0.1
Preliminary
Jun. 2009
1.0
Release
Aug. 2009
Rev 1.0 / Aug. 2009
Remark
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
DESCRIPTION
The Hynix H57V2582GTR Synchronous DRAM is 268,435,456bit CMOS Synchronous DRAM, ideally suited for the consumer memory applications which requires large memory density and high bandwidth. It is organized as 4banks of
8,388,608 x 8 I/O.
Synchronous DRAM is a type of DRAM which operates in synchronization with input clock. The Hynix Synchronous
DRAM latch each control signal at the rising edge of a basic input clock (CLK) and input/output data in synchronization
with the input clock (CLK). The address lines are multiplexed with the Data Input/ Output signals on a multiplexed x8
Input/ Output bus. All the commands are latched in synchronization with the rising edge of CLK.
The Synchronous DRAM provides for programmable read or write Burst length of Programmable burst lengths: 1, 2, 4,
8 locations or full page. An AUTO PRECHARGE function may be enabled to provide a self-timed row precharge that is
initiated at the end of the burst access. The Synchronous DRAM uses an internal pipelined architecture to achieve
high-speed operation. This architecture is compartible with the 2n rule of prefetch architectures, but it also allows the
column address to be changed on every clock cycle to achieve a high-speed, fully random access. Precharging one
bank while accessing one of the other three banks will hide the precharge cycles and provide seamless, high-speed,
randon-access operation.
Read and write accesses to the Hynix Synchronous DRAM are burst oriented;
accesses start at a selected location and continue for a programmed number of locations in a programmed sequence.
Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command.
The address bits registered coincident with the ACTIVE command are used to select the bank and the row to be
accessed. The address bits registered coincident with the READ or WRITE command are used to select the bank and
the starting column location for the burst access.
All inputs are LVTTL compatible. Devices will have a VDD and VDDQ supply of 3.3V (nominal).
Rev 1.0 / Aug. 2009
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
256Mb Synchronous DRAM(32M x 8) FEATURES
●
Standard SDRAM Protocol
●
Internal 4bank operation
●
Power Supply Voltage : VDD = 3.3V, VDDQ = 3.3V
●
All device pins are compatible with LVTTL interface
●
Low Voltage interface to reduce I/O power
●
8,192 Refresh cycles / 64ms
●
Programmable CAS latency of 2 or 3
●
Programmable Burst Length and Burst Type
- 1, 2, 4, 8 or full page for Sequential Burst
- 1, 2, 4 or 8 for Interleave Burst
●
0oC ~ 70oC Operation
●
Package Type : 54_Pin TSOPII
●
This product is in compliance with the directive pertaining of RoHS.
ORDERING INFORMATION
Part Number
Clock
Frequency
CAS
Latency
H57V2582GTR-60C
166MHz
3
H57V2582GTR-75C
133MHz
3
H57V2582GTR-60L
166MHz
3
H57V2582GTR-75L
133MHz
3
Power
Voltage
Organization
Interface
3.3V
4Banks x 8Mbits
x8
LVTTL
Normal
Low
Power
Note:
1. H57V2582GTR-XXC Series: Normal power & Commercial temp.
2. H57V2582GTR-XXL Series: Low Power & Commercial temp.
Rev 1.0 / Aug. 2009
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
54 TSOP II Pin ASSIGNMENTS
VDD
1
54
VSS
DQ0
2
53
DQ7
VDDQ
3
52
VSSQ
NC
4
51
NC
DQ1
5
50
DQ6
VSSQ
6
49
VDDQ
NC
7
48
NC
DQ2
8
47
DQ5
VDDQ
9
46
VSSQ
NC
10
45
NC
DQ3
11
44
DQ4
VSSQ
12
43
VDDQ
NC
13
42
NC
VDD
14
41
VSS
NC
15
40
NC
/WE
16
39
DQM
/CAS
17
38
CLK
/RAS
18
37
CKE
/CS
19
36
A12
BA0
20
35
A11
BA1
21
34
A9
A10/AP
22
33
A8
A0
23
32
A7
A1
24
31
A6
A2
25
30
A5
A3
26
29
A4
VDD
27
28
VSS
Rev 1.0 / Aug. 2009
54 Pin TSOPII
400mil x 875mil
0.8mm pin pitch
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
54_TSOPII Pin DESCRIPTIONS
SYMBOL
TYPE
DESCRIPTION
CLK
INPUT
Clock :
The system clock input. All other inputs are registered to the SDRAM on the rising edge
of CLK
CKE
INPUT
Clock Enable:
Controls internal clock signal and when deactivated, the SDRAM will be one of the states
among power down, suspend or self refresh
CS
INPUT
Chip Select:
Enables or disables all inputs except CLK, CKE and DQM
BA0, BA1
INPUT
Bank Address:
Selects bank to be activated during RAS activity
Selects bank to be read/written during CAS activity
A0 ~ A12
INPUT
Row Address: RA0 ~ RA12, Column Address: CA0 ~ CA9
Auto-precharge flag: A10
RAS, CAS, WE
INPUT
Command Inputs:
RAS, CAS and WE define the operation
Refer function truth table for details
DQM
I/O
Data Mask
DQ0 ~ DQ7
I/O
Data Input / Output:
Multiplexed data input / output pin
VDD / VSS
SUPPLY
Power supply for internal circuits and input buffers
VDDQ / VSSQ
SUPPLY
Power supply for output buffers
NC
-
Rev 1.0 / Aug. 2009
No connection : These pads should be left unconnected
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
FUNCTIONAL BLOCK DIAGRAM
8Mbit x 4banks x 8 I/O Synchronous DRAM
Self refresh
logic & timer
Internal Row
Counter
8M x8 Bank3
CLK
Column
Pre
Decoder
DQM
DQ0
I/O Buffer & Logic
Memory
Cell
Array
Sense AMP & I/O Gate
X Decoders
Column
Active
WE
8M x8 Bank0
X Decorders
Refresh
8M x8 Bank1
X Decorders
CAS
X Decorders
RAS
State Machine
CS
8M x8 Bank2
Row
Pre
Decoder
Row Active
CKE
DQ7
Y decoerders
Column Add
Counter
Bank Select
A0
BA1
Address
Register
Burst
Counter
Burst
Length
A12
Address Buffers
A1
Mode Register
CAS Latency
Data Out Control
Pipe Line
Control
BA0
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
ABSOLUTE MAXIMUM RATING
Parameter
Symbol
Rating
Ambient Temperature
TA
0 ~ 70
o
C
Storage Temperature
TSTG
-55 ~ 125
o
C
Voltage on Any Pin relative to VSS
VIN, VOUT
-1.0 ~ 4.6
V
Voltage on VDD supply relative to VSS
VDD, VDDQ
-1.0 ~ 4.6
V
Short Circuit Output Current
IOS
50
mA
Power Dissipation
PD
1
W
Unit
Note : Operation at above absolute maximum rating can adversely affect device reliability
DC OPERATING CONDITION
Parameter
Symbol
Min
Max
Unit
Note
VDD, VDDQ
3.0
3.6
V
1
Input High Voltage
VIH
2.0
VDDQ + 0.3
V
1, 2
Input Low Voltage
VIL
-0.3
0.8
V
1, 3
Power Supply Voltage
Note: 1. All voltages are referenced to VSS = 0V.
2. VIH(Max) is acceptable VDDQ + 2V for a pulse width with <= 3ns of duration.
3. VIL(min) is acceptable -2.0V for a pulse width with <= 3ns of duration.
AC OPERATING TEST CONDITION (TA= 0 to 70oC, VDD=3.3±0.3V / VSS=0V)
Parameter
Symbol
Value
Unit
VIH / VIL
2.4 / 0.4
V
Vtrip
1.4
V
Input Rise / Fall Time
tR / tF
1
ns
Output Timing Measurement Reference Level Voltage
Voutref
1.4
V
CL
50
pF
AC Input High / Low Level Voltage
Input Timing Measurement Reference Level Voltage
Output Load Capacitance for Access Time Measurement
Note
1
Note: 1. See Next Page
Rev 1.0 / Aug. 2009
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
VTT =
1.4V
VTT =
1.4V
RT = 50
Ohom
RT = 50
Ohom
Output
Output
Z0 = 50 Ohom
50pF
50pF
DC Output Load Circuit
AC Output Load Circuit
CAPACITANCE (f=1MHz)
Parameter
Input capacitance
Data input / output
capacitance
Pin
Symbol
Min
Max
Unit
CLK
CI1
2.0
4.0
pF
A0 ~ A12, BA0, BA1, CKE, CS, RAS, CAS, WE
CI2
2.0
4.0
pF
DQM
CI3
2.0
4.0
pF
DQ0 ~ DQ7
CI/O
3.5
6.5
pF
DC CHARACTERRISTICS I (TA= 0 to 70oC)
Parameter
Symbol
Min
Max
Unit
Note
Input Leakage Current
ILI
-1
1
uA
1
Output Leakage Current
ILO
-1
1
uA
2
Output High Voltage
VOH
2.4
-
V
IOH = -4mA
Output Low Voltage
VOL
-
0.4
V
IOL = +4mA
Note:
1. VIN = 0 to 3.6V, All other balls are not tested under VIN =0V
2. DOUT is disabled, VOUT=0 to 3.6
Rev 1.0 / Aug. 2009
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
DC CHARACTERISTICS II (TA= 0 to 70oC)
Parameter
Symbol
Speed
Test Condition
166
133
90
70
Unit
Note
mA
1
Operating Current
IDD1
Burst length=1, One bank active
tRC ≥ tRC(min), IOL=0mA
Precharge Standby
Current
in Power Down Mode
IDD2P
CKE ≤ VIL(max), tCK = 15ns
2
mA
IDD2PS
CKE ≤ VIL(max), tCK = ∞
2
mA
Precharge Standby
Current
in Non Power Down
Mode
IDD2N
CKE ≥ VIH(min), CS ≥ VIH(min), tCK = 15ns
Input signals are changed one time during
2clks.
All other pins ≥ VDD-0.2V or ≤ 0.2V
15
IDD2NS
CKE ≥ VIH(min), tCK = ∞
Input signals are stable.
8
Active Standby Current
in Power Down Mode
IDD3P
CKE ≤ VIL(max), tCK = 15ns
5
IDD3PS
CKE ≤ VIL(max), tCK = ∞
5
IDD3N
CKE ≥ VIH(min), CS ≥ VIH(min), tCK = 15ns
Input signals are changed one time during
2clks.
All other pins ≥ VDD-0.2V or ≤ 0.2V
28
IDD3NS
CKE ≥ VIH(min), tCK = ∞
Input signals are stable.
20
Burst Mode Operating
Current
IDD4
tCK ≥ tCK(min), IOL=0mA
All banks active
100
80
mA
1
Auto Refresh Current
IDD5
tRC ≥ tRC(min), All banks active
160
140
mA
2
Self Refresh Current
IDD6
CKE ≤ 0.2V
mA
3
Active Standby
Current in Non Power
Down Mode
mA
mA
mA
Normal
2
Low Power
1
Note: 1. IDD1 and IDD4 depend on output loading and cycle rates. Specified values are measured with the output open.
2. Min. of tRC (Refresh RAS cycle time) is shown at AC CHARACTERISTICS II
3. H57V2562GTR-XXC Series: Normal, H57V2562GTR-XXL Series: Low Power
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
AC CHARACTERISTICS I (AC operating conditions unless otherwise noted)
Parameter
Symbol
166
133
Min
Max
Min
Max
Unit
Note
CL = 3
tCK3
6.0
1000
7.5
1000
ns
CL = 2
tCK2
-
1000
10
1000
ns
Clock High Pulse Width
tCHW
2.5
-
2.5
-
ns
1
Clock Low Pulse Width
tCLW
2.5
-
2.5
-
ns
1
CL = 3
tAC3
-
5.4
-
5.4
ns
2
CL = 2
tAC2
-
-
-
6
ns
2
Data-out Hold Time
tOH
2.0
-
2.5
-
ns
Data-Input Setup Time
tDS
1.5
-
1.5
-
ns
1
Data-Input Hold Time
tDH
0.8
-
0.8
-
ns
1
Address Setup Time
tAS
1.5
-
1.5
-
ns
1
Address Hold Time
tAH
0.8
-
0.8
-
ns
1
CKE Setup Time
tCKS
1.5
-
1.5
-
ns
1
CKE Hold Time
tCKH
0.8
-
0.8
-
ns
1
Command Setup Time
tCS
1.5
-
1.5
-
ns
1
Command Hold Time
tCH
0.8
-
0.8
-
ns
1
CLK to Data Output in Low-Z Time
tOLZ
1.0
-
1.0
-
ns
CL = 3
tOHZ3
2.7
5.4
2.7
5.4
ns
CL = 2
tOHZ2
-
-
3
6
ns
System Clock Cycle Time
Access Time From Clock
CLK to Data Output in High-Z
Time
Note:
1. Assume tR / tF (input rise and fall time) is 1ns. If tR & tF > 1ns, then [(tR+tF)/2-1]ns should be added to the parameter.
2. Access time to be measured with input signals of 1V/ns edge rate, from 0.8V to 0.2V. If tR > 1ns, then (tR/2-0.5)ns should be added
to the parameter.
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
AC CHARACTERISTICS II
(AC operating conditions unless otherwise noted)
Parameter
Symbol
166
133
Min
Max
Min
Max
Unit
Operation
tRC
60
-
63
-
ns
Auto Refresh
tRRC
60
-
63
-
ns
RAS to CAS Delay
tRCD
15
-
15
-
ns
RAS Active Time
tRAS
42
100K
42
100K
ns
RAS Precharge Time
tRP
15
-
15
-
ns
RAS to RAS Bank Active Delay
tRRD
12
-
15
-
ns
CAS to CAS Delay
tCCD
1
-
1
-
CLK
Write Command to Data-In Delay
tWTL
0
-
0
-
CLK
Data-in to Precharge Command
tDPL
2
-
2
-
CLK
Data-In to Active Command
tDAL
DQM to Data-Out Hi-Z
tDQZ
2
-
2
-
CLK
DQM to Data-In Mask
tDQM
0
-
0
-
CLK
MRS to New Command
tMRD
2
-
2
-
CLK
CL = 3
tPROZ3
3
-
3
-
CLK
CL = 2
tPROZ2
-
-
2
-
CLK
Power Down Exit Time
tDPE
1
-
1
-
CLK
Self Refresh Exit Time
tSRE
1
-
1
-
CLK
Refresh Time
tREF
-
64
-
64
ms
RAS Cycle Time
Precharge to Data Output High-Z
Note
tDPL + tRP
1
Note: 1. A new command can be given tRC after self refresh exit.
Rev 1.0 / Aug. 2009
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
BASIC FUNCTIONAL DESCRIPTION
Mode Register
BA1
BA0
A12
A11
A10
A9
A8
A7
0
0
0
0
0
OP Code
0
0
A6
A5
A4
A3
CAS Latency
OP Code
BT
A2
A1
A0
Burst Length
Burst Type
A9
Write Mode
0
Burst Read and Burst Write
1
Burst Read and Single Write
CAS Latency
A3
Burst Type
0
Sequential
1
Interleave
Burst Length
A6
A5
A4
CAS Latency
0
0
0
Reserved
0
0
1
0
1
0
1
1
0
1
0
A2
A1
A0
Reserved
0
0
0
2
0
1
3
0
Reserved
1
Burst Length
A3 = 0
A3=1
0
1
1
0
1
2
2
0
1
0
4
4
0
1
1
8
8
Reserved
1
0
0
Reserved
Reserved
Reserved
1
1
0
Reserved
1
0
1
Reserved
1
1
1
Reserved
1
1
0
Reserved
Reserved
1
1
1
Full page
Reserved
Rev 1.0 / Aug. 2009
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
COMMAND TRUTH TABLE
Function
ADDR
A10
/AP
CKEn-1
CKEn
CS
RAS
CAS
WE
DQM
Mode Register Set
H
X
L
L
L
L
X
Op Code
No Operation
H
X
L
H
H
H
X
X
Device Deselect
H
X
H
X
X
X
X
X
Bank Active
H
X
L
L
H
H
X
Row Address
BA
V
Column
L
V
Read
H
X
L
H
L
H
Read with Autoprecharge
H
X
L
H
L
H
X
Column
H
V
Write
H
X
L
H
L
L
X
Column
L
V
Write with Autoprecharge
H
X
L
H
L
L
X
Column
H
V
Precharge All Banks
H
X
L
L
H
L
X
X
H
X
Precharge selected Bank
H
X
L
L
H
L
X
X
L
V
Burst stop
H
X
L
H
H
L
X
X
DQM
H
X
V
X
Auto Refresh
H
H
L
L
L
H
X
X
Burst-Read Single-Write
H
X
L
L
L
H
X
A9 Pin High
(Other Pins OP code)
Self Refresh Entry
H
L
X
X
X
X
X
X
X
X
X
X
X
X
Self Refresh Exit
L
H
Precharge Power Down
Entry
H
L
Precharge Power Down Exit
L
H
Clock Suspend Entry
H
L
Clock Suspend Exit
L
H
X
L
L
L
H
H
X
X
X
L
H
H
H
H
X
X
X
L
H
H
H
H
X
X
X
L
H
H
H
H
X
X
X
L
V
V
V
X
Note
1
Note : 1. Exiting Self Refresh occurs by asynchronously bringing CKE from low to high.
Rev 1.0 / Aug. 2009
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
CURRENT STATE TRUTH TABLE (Sheet 1 of 4)
Current
State
idle
Row
Active
Read
Command
CS RAS CAS WE
BA0/
BA1
L
L
L
L
L
L
L
H
X
L
L
H
L
L
L
H
L
H
L
Amax-A0
Notes
Mode Register Set
Set the Mode Register
X
Auto or Self Refresh
Start Auto or Self Refresh
BA
X
Precharge
No Operation
H
BA
Row Add.
Bank Activate
Activate the specified
bank and row
L
L
BA
Col Add.
A10
Write/WriteAP
ILLEGAL
4
H
L
H
BA
Col Add.
A10
Read/ReadAP
ILLEGAL
4
L
H
H
H
X
X
No Operation
No Operation
3
H
X
X
X
X
X
Device Deselect
No Operation or Power
Down
3
L
L
L
L
Mode Register Set
ILLEGAL
13
L
L
L
H
X
X
Auto or Self Refresh
ILLEGAL
13
L
L
H
L
BA
X
Precharge
Precharge
7
L
L
H
H
BA
Row Add.
Bank Activate
ILLEGAL
4
L
H
L
L
BA
Col Add.
A10
Write/WriteAP
Start Write : optional
AP(A10=H)
6
L
H
L
H
BA
Col Add.
A10
Read/ReadAP
Start Read : optional
AP(A10=H)
6
L
H
H
H
X
X
No Operation
No Operation
H
X
X
X
X
X
Device Deselect
No Operation
L
L
L
L
Mode Register Set
ILLEGAL
13
L
L
L
H
X
X
Auto or Self Refresh
ILLEGAL
13
L
L
H
L
BA
X
Precharge
Termination Burst: Start
the Precharge
L
L
H
H
BA
Row Add.
Bank Activate
ILLEGAL
L
H
L
L
BA
Col Add.
A10
Write/WriteAP
Termination Burst: Start
Write(optional AP)
8,9
L
H
L
H
BA
Col Add.
A10
Read/ReadAP
Termination Burst: Start
Read(optional AP)
8
L
H
H
H
X
X
No Operation
Continue the Burst
Rev 1.0 / Aug. 2009
OP CODE
Action
Description
OP CODE
OP CODE
5
4
15
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Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
CURRENT STATE TRUTH TABLE
Current
State
Read
Write
Read with
Auto
Precharge
Write with
Auto
Precharge
(Sheet 2 of 4)
Command
CS RAS CAS WE
BA0/
BA1
Amax-A0
X
X
H
X
X
X
L
L
L
L
L
L
L
H
X
L
L
H
L
L
L
H
L
H
L
Action
Description
Notes
Device Deselect
Continue the Burst
Mode Register Set
ILLEGAL
13
X
Auto or Self Refresh ILLEGAL
13
BA
X
Precharge
Termination Burst: Start
the Precharge
10
H
BA
Row Add.
Bank Activate
ILLEGAL
4
L
L
BA
Col Add.
A10
Write/WriteAP
Termination Burst: Start
Write(optional AP)
8
H
L
H
BA
Col Add.
A10
Read/ReadAP
Termination Burst: Start
Read(optional AP)
8,9
L
H
H
H
X
X
No Operation
Continue the Burst
H
X
X
X
X
X
Device Deselect
Continue the Burst
L
L
L
L
Mode Register Set
ILLEGAL
13
L
L
L
H
X
X
Auto or Self Refresh ILLEGAL
13
L
L
H
L
BA
X
Precharge
ILLEGAL
4,12
L
L
H
H
BA
Row Add.
Bank Activate
ILLEGAL
4,12
L
H
L
L
BA
Col Add. A10
Write/WriteAP
ILLEGAL
12
L
H
L
H
BA
Col Add. A10
Read/ReadAP
ILLEGAL
12
L
H
H
H
X
X
No Operation
Continue the Burst
H
X
X
X
X
X
Device Deselect
Continue the Burst
L
L
L
L
Mode Register Set
ILLEGAL
13
L
L
L
H
X
X
Auto or Self Refresh ILLEGAL
13
L
L
H
L
BA
X
Precharge
ILLEGAL
4,12
L
L
H
H
BA
Row Add.
Bank Activate
ILLEGAL
4,12
L
H
L
L
BA
Col Add. A10
Write/WriteAP
ILLEGAL
12
L
H
L
H
BA
Col Add. A10
Read/ReadAP
ILLEGAL
12
L
H
H
H
X
X
No Operation
Continue the Burst
H
X
X
X
X
X
Device Deselect
Continue the Burst
Rev 1.0 / Aug. 2009
OP CODE
OP CODE
OP CODE
16
111
Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
CURRENT STATE TRUTH TABLE
Current
State
Precharging
Row
Activating
Write
Recovering
(Sheet 3 of 4)
Command
CS RAS CAS WE
BA0/
BA1
L
L
L
L
L
L
L
H
X
L
L
H
L
L
L
H
L
H
L
Amax-A0
13
X
Auto or Self Refresh ILLEGAL
13
BA
X
Precharge
No Operation:
Bank(s) idle after tRP
H
BA
Row Add.
Bank Activate
ILLEGAL
4,12
L
L
BA
Col Add. A10
Write/WriteAP
ILLEGAL
4,12
H
L
H
BA
Col Add. A10
Read/ReadAP
ILLEGAL
4,12
L
H
H
H
X
X
No Operation
No Operation:
Bank(s) idle after tRP
H
X
X
X
X
X
Device Deselect
No Operation:
Bank(s) idle after tRP
L
L
L
L
Mode Register Set
ILLEGAL
13
L
L
L
H
X
X
Auto or Self Refresh ILLEGAL
13
L
L
H
L
BA
X
Precharge
ILLEGAL
4,12
L
L
H
H
BA
Row Add.
Bank Activate
ILLEGAL
4,11,1
2
L
H
L
L
BA
Col Add. A10
Write/WriteAP
ILLEGAL
4,12
L
H
L
H
BA
Col Add. A10
Read/ReadAP
ILLEGAL
4,12
L
H
H
H
X
X
No Operation
No Operation: Row
Active after tRCD
H
X
X
X
X
X
Device Deselect
No Operation: Row
Active after tRCD
L
L
L
L
Mode Register Set
ILLEGAL
13
L
L
L
H
X
X
Auto or Self Refresh ILLEGAL
13
L
L
H
L
BA
X
Precharge
ILLEGAL
4,13
L
L
H
H
BA
Row Add.
Bank Activate
ILLEGAL
4,12
L
H
L
L
BA
Col Add. A10
Write/WriteAP
Start Write:
Optional AP(A10=H)
L
H
L
H
BA
Col Add. A10
Read/ReadAP
Start Read: Optional
AP(A10=H)
L
H
H
H
X
X
No Operation
No Operation:
Row Active after tDPL
OP CODE
OP CODE
Mode Register Set
Notes
ILLEGAL
Rev 1.0 / Aug. 2009
OP CODE
Action
Description
9
17
111
Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
CURRENT STATE TRUTH TABLE
Current
State
Write
Recovering
Write
Recovering
with Auto
Precharge
Refreshing
Mode
Register
Accessing
(Sheet 4 of 4)
Command
CS RAS CAS WE
BA0/
BA1
Amax-A0
X
X
Action
Description
Notes
Device Deselect
No Operation:
Row Active after tDPL
Mode Register Set
ILLEGAL
13
X
Auto or Self Refresh ILLEGAL
13
BA
X
Precharge
ILLEGAL
4,13
H
BA
Row Add.
Bank Activate
ILLEGAL
4,12
L
L
BA
Col Add. A10
Write/WriteAP
ILLEGAL
4,12
H
L
H
BA
Col Add. A10
Read/ReadAP
ILLEGAL
4,9,12
L
H
H
H
X
X
No Operation
No Operation:
Precharge after tDPL
H
X
X
X
X
X
Device Deselect
No Operation:
Precharge after tDPL
L
L
L
L
Mode Register Set
ILLEGAL
13
L
L
L
H
X
X
Auto or Self Refresh ILLEGAL
13
L
L
H
L
BA
X
Precharge
ILLEGAL
13
L
L
H
H
BA
Row Add.
Bank Activate
ILLEGAL
13
L
H
L
L
BA
Col Add. A10
Write/WriteAP
ILLEGAL
13
L
H
L
H
BA
Col Add. A10
Read/ReadAP
ILLEGAL
13
L
H
H
H
X
X
No Operation
No Operation:
idle after tRC
H
X
X
X
X
X
Device Deselect
No Operation:
idle after tRC
L
L
L
L
Mode Register Set
ILLEGAL
13
L
L
L
H
X
X
Auto or Self Refresh ILLEGAL
13
L
L
H
L
BA
X
Precharge
ILLEGAL
13
L
L
H
H
BA
Row Add.
Bank Activate
ILLEGAL
13
L
H
L
L
BA
Col Add. A10
Write/WriteAP
ILLEGAL
13
L
H
L
H
BA
Col Add. A10
Read/ReadAP
ILLEGAL
13
L
H
H
H
X
X
No Operation
No Operation:
idle after 2 clock cycles
H
X
X
X
X
X
Device Deselect
No Operation:
idle after 2 clock cycles
H
X
X
X
L
L
L
L
L
L
L
H
X
L
L
H
L
L
L
H
L
H
L
Rev 1.0 / Aug. 2009
OP CODE
OP CODE
OP CODE
18
111
Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
Note :
1. H: Logic High, L: Logic Low, X: Don't care, BA: Bank Address, AP: Auto Precharge.
2. All entries assume that CKE was active during the preceding clock cycle.
3. If both banks are idle and CKE is inactive, then in power down cycle
4. Illegal to bank in specified states. Function may be legal in the bank indicated by Bank Address,
depending on the state of that bank.
5. If both banks are idle and CKE is inactive, then Self Refresh mode.
6. Illegal if tRCD is not satisfied.
7. Illegal if tRAS is not satisfied.
8. Must satisfy burst interrupt condition.
9. Must satisfy bus contention, bus turn around, and/or write recovery requirements.
10. Must mask preceding data which don't satisfy tDPL.
11. Illegal if tRRD is not satisfied
12. Illegal for single bank, but legal for other banks in multi-bank devices.
13. Illegal for all banks.
Rev 1.0 / Aug. 2009
19
111
Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
CKE Enable(CKE) Truth TABLE
(Sheet 2 of 1)
CKE
Command
Current
State
Self
Refresh
Previous Current
Cycle
Cycle
CS
RAS
CAS
WE
Notes
H
X
X
X
X
X
X
X
INVALID
1
L
H
H
X
X
X
X
X
Exit Self Refresh with
Device Deselect
2
L
H
L
H
H
H
X
X
Exit Self Refresh with
No Operation
2
L
H
L
H
H
L
X
X
ILLEGAL
2
L
H
L
H
L
X
X
X
ILLEGAL
2
L
H
L
L
X
X
X
X
ILLEGAL
2
L
L
X
X
X
X
X
X
Maintain Self Refresh
H
X
X
X
X
X
X
X
INVALID
1
L
H
H
X
X
X
X
X
L
H
H
H
X
X
Power Down mode exit,
all banks idle
2
L
X
X
X
X
X
L
X
X
X
ILLEGAL
2
X
X
L
X
X
X
X
Power
Down
L
All
Banks
Idle
Action
BA0,
ADDR
BA1
H
L
L
L
X
X
X
X
H
H
H
X
X
X
H
H
L
H
X
X
H
H
L
L
H
X
H
H
L
L
L
H
X
H
H
L
L
L
L
OP CODE
H
L
H
X
X
X
H
L
L
H
X
X
H
L
L
L
H
X
H
L
L
L
L
H
X
X
Entry Self Refresh
H
L
L
L
L
L
OP CODE
Mode Register Set
L
X
X
X
X
X
X
Power Down
Rev 1.0 / Aug. 2009
Maintain Power Down Mode
Refer to the idle State section
of the Current State
Truth Table
X
3
3
Auto Refresh
Mode Register Set
Refer to the idle State section
of the Current State
Truth Table
X
3
4
3
3
3
4
4
20
111
Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
CKE Enable(CKE) Truth TABLE
(Sheet 2 of 2)
CKE
Command
Current
State
Any State
other than
listed above
Previous Current
Cycle
Cycle
CS
RAS
CAS
WE
BA0,
ADDR
BA1
Action
H
H
X
X
X
X
X
X
Refer to operations of
the Current State
Truth Table
H
L
X
X
X
X
X
X
Begin Clock Suspend
next cycle
L
H
X
X
X
X
X
X
Exit Clock Suspend
next cycle
L
L
X
X
X
X
X
X
Maintain Clock Suspend
Notes
Note :
1. For the given current state CKE must be low in the previous cycle.
2. When CKE has a low to high transition, the clock and other inputs are re-enabled asynchronously. When exiting power down mode,
a NOP (or Device Deselect) command is required on the first positive edge of clock after CKE goes high.
3. The address inputs depend on the command that is issued.
4. The Precharge Power Down mode, the Self Refresh mode, and the Mode Register Set can only be entered
from the all banks idle state.
5. When CKE has a low to high transition, the clock and other inputs are re-enabled asynchronously.
When exiting deep power down mode, a NOP (or Device Deselect) command is required on the first positive edge of
clock after CKE goes high and is maintained for a minimum 200usec.
Rev 1.0 / Aug. 2009
21
111
Synchronous DRAM Memory 256Mbit
H57V2582GTR Series
CP
DIE
E
E1
C
28
27
B
54
1
e
PACKAGE INFORMATION
L1
D1
A2
A1
Symbol
millimeters
A
α L
inches
Min
Typ
Max
Min
A
0.991
-
1.194
0.0390
A1
0.050
0.100
0.150
0.0020
0.0039
0.0059
A2
0.950
1.000
1.050
0.0374
0.0394
0.0413
B
0.300
-
0.400
0.012
-
0.016
C
0.120
-
0.210
0.0047
-
0.0083
CP
0.10
Typ
Max
0.0470
0.0039
D1
22.149
22.22
22.327
0.8720
0.8748
0.8790
E
11.735
11.76
11.938
0.4620
0.4630
0.4700
E1
10.058
10.16
10.262
0.3950
0.4
0.4040
e
-
0.8
-
-
0.0315
-
L
0.406
-
0.597
0.0160
-
0.0235
L1
-
0.8
-
-
0.0315
-
alpha
Rev 1.0 / Aug. 2009
0 / 5 (min / max)
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