NL17SZ32 Single 2−Input OR Gate The NL17SZ32 is a single 2−input OR Gate in two tiny footprint packages. The device performs much as LCX multi−gate products in speed and drive. They should be used wherever the need for higher speed and drive are needed. http://onsemi.com Features • • • • • • • • Tiny SOT−353 and SOT−553 Packages 2.4 ns TPD at 5.0 V (typ) Source/Sink 24 mA at 3.0 V Over−Voltage Tolerant Inputs Pin For Pin with NC7SZ32P5X, TC7SZ32FU and TC7SZ32AFE Chip Complexity: FETs = 20 Designed for 1.65 V to 5.5 V VCC Operation Pb−Free Packages are Available B 1 A 2 GND 3 5 5 5 L4 M G G 1 SOT−353/SC70−5/SC−88A DF SUFFIX CASE 419A 1 5 5 L4 M G G 1 SOT−553 XV5 SUFFIX CASE 463B VCC 4 MARKING DIAGRAMS 1 L4 = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) Y PIN ASSIGNMENT Figure 1. Pinout (Top View) A B w1 Y Figure 2. Logic Symbol Pin Function 1 A 2 B 3 GND 4 Y 5 VCC FUNCTION TABLE Output Input Y=A)B A B Y L L L L H H H L H H H H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2006 March, 2006 − Rev. 6 1 Publication Order Number: NL17SZ32/D NL17SZ32 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage *0.5 to )7.0 V VIN DC Input Voltage *0.5 to )7.0 V *0.5 to VCC )0.5 V VOUT Parameter DC Output Voltage IIK DC Input Diode Current *50 mA IOK DC Output Diode Current *50 mA IOUT DC Output Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA *65 to )150 °C 260 °C )150 °C SOT−353 (Note 1) SOT−553 350 496 °C/W SOT−353 SOT−553 186 135 mW TSTG Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL Moisture Sensitivity FR Flammability Rating ESD ESD Classification Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Class Z Class A N/A V Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC DC Supply Voltage 1.65 5.5 V VIN DC Input Voltage 0 5.5 V DC Output Voltage 0 VCC + 0.5 V *40 )85 °C 0 0 100 20 ns/V VOUT TA Operating Temperature Range tr, tf Input Rise and Fall Time VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V http://onsemi.com 2 NL17SZ32 DC ELECTRICAL CHARACTERISTICS TA = 255C VCC *405C v TA v 855C (V) Min High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 0.75 VCC 0.7 VCC VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VOH High−Level Output Voltage IOH = 100 mA 1.65 to 5.5 VCC − 0.1 VCC VCC − 0.1 VIN = VIL or VIH IOH = −3 mA 1.65 1.29 1.52 1.29 IOH = −8 mA 2.3 1.9 2.1 1.9 IOH = −12 mA 2.7 2.2 2.4 2.2 IOH = −16 mA 3.0 2.4 2.7 2.4 IOH = −24 mA 3.0 2.3 2.5 2.3 IOH = −32 mA 4.5 3.8 4.0 3.8 Low−Level Output Voltage IOL = 100 mA 1.65 to 5.5 VIN = VIH or VOH IOL = 3 mA 1.65 IOL = 8 mA 2.3 IOL = 12 mA IOL = 16 mA Symbol Parameter VIH VOL Condition Typ Max Min Max 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC Unit V 0.25 VCC 0.3 VCC V V 0.1 0.1 0.08 0.24 0.24 0.20 0.3 0.3 2.7 0.22 0.4 0.4 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 V IIN Input Leakage Current VIN = VCC or GND 0 to 5.5 $0.1 $1.0 mA ICC Quiescent Supply Current VIN = VCC or GND 5.5 1 10 mA AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns TA = 255C VCC Symbol tPLH tPHL Condition (V) RL = 1 MW, CL = 15 pF 1.65 2.0 5.5 12.0 2.0 12.7 RL = 1 MW, CL = 15 pF 1.8 2.0 4.6 10 2.0 10.5 RL = 1 MW, CL = 15 pF 2.5 $ 0.2 0.8 3.0 7 0.8 7.5 RL = 1 MW, CL = 15 pF 3.3 $ 0.3 0.5 2.6 4.7 0.5 5.0 1.5 3.0 5.2 1.5 5.5 0.5 2.2 4.1 0.5 4.4 0.8 2.4 4.5 0.8 4.8 Parameter Propagation Delay (Fi (Figure 3 and d 4)) *405C v TA v 855C Min RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF 5.0 $ 0.5 RL = 500 W, CL = 50 pF Typ Max Min Max Unit ns CAPACITIVE CHARACTERISTICS Symbol Typical Unit CIN Input Capacitance Parameter VCC = 5.5 V, VI = 0 V or VCC Condition u4 pF CPD Power Dissipation Capacitance (N (Note 5)) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 30 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL17SZ32 tf = 3 ns tf = 3 ns 90% INPUT A and B 50% VCC 90% 50% 10% 10% tPHL INPUT GND OUTPUT RL tPLH CL VOH OUTPUT Y 50% 50% A 1 MHz square input wave is recommended for propagation delay tests. VOL Figure 3. Switching Waveform Figure 4. Test Circuit ORDERING INFORMATION Device Order Number Package Type Tape and Reel Size† NL17SZ32DFT2 SC70−5/SC−88A/SOT−353 3000 / Tape & Reel NL17SZ32DFT2G SC70−5/SC−88A/SOT−353 (Pb−Free) 3000 / Tape & Reel NL17SZ32XV5T2 SOT−553* 4000 / Tape & Reel NL17SZ32XV5T2G SOT−553* 4000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *All Devices in Package SOT553 are Inherently Pb−Free. http://onsemi.com 4 NL17SZ32 PACKAGE DIMENSIONS SC−88A, SOT−353, SC−70 CASE 419A−02 ISSUE J A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL17SZ32 PACKAGE DIMENSIONS SOT−553 XV5 SUFFIX 5−LEAD PACKAGE CASE 463B−01 ISSUE B D −X− 5 A 4 1 e 2 E −Y− 3 b NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. L HE DIM A b c D E e L HE c 5 PL 0.08 (0.003) M X Y MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.70 1.20 1.30 0.50 BSC 0.10 0.20 0.30 1.50 1.60 1.70 MIN 0.50 0.17 0.08 1.50 1.10 STYLE 1: PIN 1. 2. 3. 4. 5. BASE 1 EMITTER 1/2 BASE 2 COLLECTOR 2 COLLECTOR 1 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.059 0.063 MIN 0.020 0.007 0.003 0.059 0.043 STYLE 2: PIN 1. 2. 3. 4. 5. MAX 0.024 0.011 0.007 0.067 0.051 0.012 0.067 CATHODE ANODE CATHODE CATHODE CATHODE SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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