MCP9700/01 Low-Power Linear Active Thermistor™ ICs Features Description • Tiny Analog Temperature Sensor • Available Packages: SC70-5 • Wide Temperature Measurement Range: - -40°C to +125°C • Accuracy: ±4°C (max.), 0°C to +70°C • Optimized for Analog-to-Digital Converters (ADCs): - MCP9700: 10.0 mV/°C (typ.) - MCP9701: 19.5 mV/°C (typ.) • Wide Operating Voltage Range: - MCP9700: VDD = 2.3V to 5.5V - MCP9701: VDD = 3.1V to 5.5V • Low Operating Current: 6 µA (typ.) • Optimized to Drive Large Capacitive Loads The MCP9700/01 Linear Active Thermistor™ Intergrated Circuit (IC) is an analog temperature sensor that converts temperature to analog voltage. It’s a low-cost, low-power sensor with an accuracy of ±4°C from 0°C to +70°C while consuming 6 µA (typ.) of operating current. Unlike resistive sensors (such as thermistors), the Linear Active Thermistor IC does not require an additional signal-conditioning circuit. Therefore, the biasing circuit development overhead for thermistor solutions can be avoided by implementing this low-cost device. The voltage output pin (VOUT) can be directly connected to the ADC input of a microcontroller. The MCP9700 and MCP9701 temperature coefficients are scaled to provide a 1 °C/bit resolution for an 8-bit ADC with a reference voltage of 2.5V and 5V, respectively. The MCP9700/01 provides a low-cost solution for applications that require measurement of a relative change of temperature. When measuring relative change in temperature from +25°C, an accuracy of ±1°C (typ.) can be realized from 0°C to +70°C. This accuracy can also be achieved by applying system calibration at +25°C. In addition, this family is immune to the effects of parasitic capacitance and can drive large capacitive loads. This provides Printed Circuit Board (PCB) layout design flexibility by enabling the device to be remotely located from the microcontroller. Adding some capacitance at the output also helps the output transient response by reducing overshoots or undershoots. However, capacitive load is not required for sensor output stability. Typical Applications • • • • • • Hard Disk Drives and Other PC Peripherals Entertainment Systems Home Appliance Office Equipment Battery Packs and Portable Equipment General Purpose Temperature Monitoring Package Type NC 1 GND 2 VOUT 3 MCP9700 MCP9701 SC70-5 5 NC 4 VDD Typical Application Circuit VDD 10 kΩ MCLR VSS © 2005 Microchip Technology Inc. MCP9700/01 VDD VDD VDD PICmicro® ANI MCU Cbypass 0.1 µF VOUT GND DS21942B-page 1 MCP9700/01 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † VDD:...................................................................... 6.0V †Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Storage temperature: ........................ -65°C to +150°C Ambient Temp. with Power Applied:.. -40°C to +125°C Junction Temperature (TJ):................................. 150°C ESD Protection On All Pins (HBM:MM):.... (4 kV:200V) Latch-Up Current at Each Pin: ...................... ±200 mA DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameter Sym Min Typ Max Unit Conditions Operating Voltage Range VDD VDD 2.3 3.1 — — 5.5 5.5 V V Operating Current IDD — 6 12 µA PSRR — 0.1 — °C/V TACY TACY TACY TACY — -4.0 -4.0 -4.0 ±1 — — — — +4.0 +6.0 +6.0 °C °C °C °C MCP9700 MCP9701 V0°C V0°C — — 500 400 — — mV mV MCP9700 MCP9701 TC1 TC1 — — 10.0 19.5 — — VONL — ±0.5 — °C Output Current IOUT — — 100 µA Output Impedance ZOUT — 20 — Ω IOUT = 100 µA, f = 500 Hz ΔVOUT/ ΔIOUT — 1 — Ω TA = 0°C to +70°C, IOUT = 100 µA 800 — µs Power Supply Power Supply Rejection Ratio MCP9700 MCP9701 Sensor Accuracy (Notes 1, 2) TA = +25°C TA = 0°C to +70°C TA = -40°C to +125°C TA = -10°C to +125°C Sensor Output Output Voltage: TA = 0°C TA = 0°C Temperature Coefficient Output Non-linearity Output Load Regulation Turn-on Time Typical Load Capacitance (Note 3) Thermal Response to 63% Note 1: 2: 3: 4: mV/°C MCP9700 mV/°C MCP9701 tON — CLOAD — — 1000 pF tRES — 1.3 — s TA = 0°C to +70°C (Note 2) 30°C (Air) to +125°C (Fluid Bath) (Note 4) The MCP9700 accuracy is tested with VDD = 3.3V, while the MCP9701 accuracy is tested with VDD = 5.0V. The MCP9700/01 is characterized using the first-order or linear equation, as shown in Equation 4-2. The MCP9700/01 family is characterized and production-tested with a capacitive load of 1000 pF. Thermal response with 1x1 inch, dual-sided copper clad. DS21942B-page 2 © 2005 Microchip Technology Inc. MCP9700/01 M TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load. MCP9701: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load. Parameters Sym Min Typ Max Units Conditions TA -40 — +125 °C MCP9700 (Note) TA -10 — +125 °C MCP9701 (Note) Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C θJA — 331 — °C/W Temperature Ranges Specified Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SC70 Note: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C). © 2005 Microchip Technology Inc. DS21942B-page 3 MCP9700/01 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V; MCP9701: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. Accuracy (°C) 4.0 MCP9701 VDD= 5.0V ' Accuracy Due to Load (°C) 6.0 Spec. Limits 2.0 0.0 -2.0 MCP9700 VDD= 3.3V -4.0 -50 -25 0 FIGURE 2-1: Temperature. 25 50 TA (°C) 75 100 0.1 0 MCP9700 VDD = 3.3V -0.1 ILOAD = 100 μA -0.2 -50 -25 0 25 50 TA (°C) 75 100 125 FIGURE 2-4: Changes in Accuracy vs. Ambient Temperature (Due to Load). Accuracy vs. Ambient 4.0 Load Regulation 'V/'I (:) MCP9701 VDD= 5.5V VDD= 3.1V MCP9700 VDD = 5.5V VDD = 2.3V 4.0 Accuracy (°C) MCP9701 VDD = 5.0V 125 6.0 2.0 0.0 -2.0 -4.0 MCP9700/01 VDD = 3.3V 3.0 IOUT = 50 μA IOUT = 100 μA IOUT = 200 μA 2.0 1.0 0.0 -50 -25 0 25 50 TA (°C) 75 100 125 -50 -25 0 25 50 TA (°C) 75 100 125 FIGURE 2-5: Load Regulation vs. Ambient Temperature. FIGURE 2-2: Accuracy vs. Ambient Temperature, with VDD. 12.0 1000 10.0 VDD = 5.0V IOUT = 100 μA TA = 26°C Output Impedance (:) MCP9701 8.0 IDD (µA) 0.2 6.0 MCP9700 4.0 2.0 0.0 -50 -25 FIGURE 2-3: Temperature. DS21942B-page 4 0 25 50 TA (°C) 75 100 Supply Current vs. 125 100 10 1 0.1 0.1 FIGURE 2-6: Frequency. 1 1 10 100 1K 10 100 1000 Frequency (Hz) 10K 100K 10000 100000 Output Impedance vs. © 2005 Microchip Technology Inc. MCP9700/01 Note: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V; MCP9701: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. 45% 35% MCP9701 VDD = 5.0V 108 samples 40% 35% Occurrences 25% 20% 15% 10% 30% 25% 20% 15% V0°C (mV) FIGURE 2-7: (MCP9700). Output Voltage at 0°C FIGURE 2-10: (MCP9701). FIGURE 2-8: Occurrences vs. Temperature Coefficient (MCP9700). 0.30 MCP9700 VDD= 2.3V to 5.5V Normalized PSRR (°C/V) Normalized PSRR (°C/V) 20.0 19.9 19.8 19.7 500 480 460 FIGURE 2-11: Occurrences vs. Temperature Coefficient (MCP9701). 0.20 0.15 0.10 440 V0°C (mV) TC1 (mV/°C) 0.25 420 300 10.5 10.4 10.3 10.2 10.1 10.0 9.9 0% 9.8 0% 9.7 5% 9.6 5% 400 10% 380 10% 15% 360 15% 20% 340 20% 25% 320 25% 9.5 MCP9701 VDD = 5.0V 108 samples 30% 30% 0.30 19.6 Output Voltage at 0°C 35% MCP9700 VDD = 3.3V 108 samples Occurrences Occurrences 35% 19.5 TC1 (mV/°C) 45% 40% 19.4 19.3 19.2 19.0 600 580 560 540 520 500 480 460 440 0% 420 5% 0% 19.1 10% 5% 400 Occurrences 30% MCP9700 VDD = 3.3V 108 samples MCP9700 VDD= 2.3V to 4.0V 0.05 0.00 0.25 MCP9701 VDD= 3.1V to 5.5V 0.20 0.15 0.10 MCP9701 VDD= 3.1V to 4.0V 0.05 0.00 -50 -25 0 25 50 TA (°C) 75 100 125 FIGURE 2-9: Power Supply Rejection Ration (PSRR) vs. Ambient Temperature. © 2005 Microchip Technology Inc. -50 -25 0 25 50 TA (°C) 75 100 125 FIGURE 2-12: Power Supply Rejection Ratio (PSRR) vs. Temperature. DS21942B-page 5 MCP9700/01 Note: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V; MCP9701: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. 1.6 3.0 TA = 26°C 1.4 2.5 1.0 VOUT (V) 0.8 0.6 0.4 2.0 1.5 1.0 0.5 0.2 0.0 0.0 -50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 2-13: Supply. Output Voltage vs. Power FIGURE 2-16: Temperature. 1.7 IDD 0.8 8 6 2.5 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 -2.5 0.2 -1.7 0 0.1 2 0.0 -0.8 -0.1 4 VOUT (V) 0.0 VOUT 25 50 75 100 125 Output Voltage vs. Ambient 30.0 IDD VDD_RAMP = 5V/ms TA = 26°C 18.0 2.0 6.0 1.5 -6.0 1.0 VOUT -18.0 0.5 -30.0 0.0 -42.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (ms) Time (ms) FIGURE 2-14: step VDD. 0 3.0 IDD (mA) VDD_STEP = 5V TA = 26°C 10 -25 TA (°C) 2.5 12 VOUT (V) MCP9700 MCP9701 IDD (µA) VOUT (V) 1.2 Output vs. Settling Time to FIGURE 2-17: Ramp VDD. Output vs. Settling Time to 130 Output (°C) 105 80 55 SC70-5 30°C (Air) to 125°C (Fluid bath) 1 in. x 1 in. copper clad 30 -2 0 FIGURE 2-15: DS21942B-page 6 2 4 6 8 10 Time (s) 12 14 16 18 Thermal Response. © 2005 Microchip Technology Inc. MCP9700/01 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in DC Electrical Characteristics. TABLE 3-1: PIN FUNCTION TABLE Pin No. Name 1 NC 2 GND Power Ground Pin 3 VOUT Output Voltage Pin 4 VDD Power Supply Input 5 NC No Connect 3.1 Function No Connect Power Ground Pin (GND) GND is the system ground pin. 3.2 Output Voltage Pin (VOUT) The sensor output can be measured at VOUT. The voltage range over the operating temperature range for the MCP9700 is 100 mV to 1.75V and for the MCP9701, 200 mV to 3V . 3.3 Power Supply Input (VDD) The operating voltage as specified in the DC Electrical Characteristics table is applied to VDD. © 2005 Microchip Technology Inc. DS21942B-page 7 MCP9700/01 APPLICATIONS INFORMATION The Linear Active Thermistor™ IC uses an internal diode to measure temperature. The diode electrical characteristics have a temperature coefficient that provides a change in voltage based on the relative ambient temperature from -40°C to 125°C. The change in voltage is scaled to a temperature coefficient of 10.0 mV/°C (typ.) for the MCP9700 and 19.5 mV/°C (typ.) for the MCP9701. The output voltage at 0°C is also scaled to 500 mV (typ.) and 400 mV (typ.) for the MCP9700 and MCP9701, respectively. This linear scale is described in the first-order transfer function shown in Equation 4-1. EQUATION 4-1: SENSOR TRANSFER FUNCTION For higher accuracy using a sensor compensation technique, refer to AN1001 “IC Temperature Sensor Accuracy Compensation with a PICmicro® Microcontroller” (DS01001). The application note shows that if the MCP9700 is compensated in addition to room temperature calibration, the sensor accuracy can be improved to ±0.5°C (typ.) accuracy over the operating temperature (Figure 4-2). 6.0 100 Samples 4.0 Accuracy (°C) 4.0 2.0 Spec. Limits 0.0 + V Average - V -2.0 V OUT = T C1 • T A + V 0°C -4.0 Where: -50 -25 VOUT = Sensor Output Voltage FIGURE 4-2: Sensor Accuracy. V0°C = Sensor Output Voltage at 0°C TC1 = Temperature Coefficient 50 75 100 125 MCP9700 Calibrated The compensation technique provides a linear temperature reading. A firmware look-up table can be generated to compensate for the sensor error. Improving Accuracy The MCP9700/01 accuracy can be improved by performing a system calibration at a specific temperature. For example, calibrating the system at +25°C ambient improves the measurement accuracy to a ±0.5°C (typ.) from 0°C to +70°C, as shown in Figure 4-1. Therefore, when measuring relative temperature change, this family measures temperature with higher accuracy. 3.0 2.0 Accuracy (°C) 25 Temperature (°C) TA = Ambient Temperature 4.1 0 1.0 4.2 Shutdown Using Microcontroller I/O Pin The MCP9700/01 low operating current of 6 µA (typ.) makes it ideal for battery-powered applications. However, for applications that require tighter current budget, this device can be powered using a microcontroller Input/Output (I/O) pin. The I/O pin can be toggled to shut down the device. In such applications, the microcontroller internal digital switching noise is emitted to the MCP9700/01 as power supply noise. This switching noise compromises measurement accuracy. Therefore, a decoupling capacitor and series resistor will be necessary to filter out the system noise. 0.0 4.3 -1.0 -2.0 VDD= 3.3V 10 Samples -3.0 -50 -25 FIGURE 4-1: vs. Temperature. 0 25 50 TA (°C) 75 100 125 Relative Accuracy to +25°C The change in accuracy from the calibration temperature is due to the output non-linearity from the first-order equation, as specified in Equation 4-2. The accuracy can be further improved by compensating for the output non-linearity. DS21942B-page 8 Layout Considerations The MCP9700/01 does not require any additional components to operate. However, it is recommended that a decoupling capacitor of 0.1 µF to 1 µF be used between the VDD and GND pins. In high-noise applications, connect the power supply voltage to the VDD pin using a 200Ω resistor with a 1 µF decoupling capacitor. A high-frequency ceramic capacitor is recommended. It is necessary for the capacitor to be located as close as possible to the VDD and GND pins in order to provide effective noise protection. In addition, avoid tracing digital lines in close proximity to the sensor. © 2005 Microchip Technology Inc. MCP9700/01 4.4 Thermal Considerations The MCP9700/01 measures temperature by monitoring the voltage of a diode located in the die. A low-impedance thermal path between the die and the PCB is provided by the pins. Therefore, the MCP9700/01 effectively monitors the temperature of the PCB. However, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator from the die. This limitation applies to plastic-packaged silicon temperature sensors. If the application requires measuring ambient air, the PCB needs to be designed with proper thermal conduction to the sensor pins. The MCP9700/01 is designed to source/sink 100 µA (max.). The power dissipation due to the output current is relatively insignificant. The effect of the output current can be described using Equation 5-1. EQUATION 4-2: EFFECT OF SELF-HEATING T J – T A = θ JA ( V DD I DD + ( V DD – V OUT ) I OUT ) Where: TJ = Junction Temperature TA = Ambient Temperature θJA = Package Thermal Resistance (331°C/W) VOUT = Sensor Output Voltage IOUT = Sensor Output Current IDD = Operating Current VDD = Operating Voltage At TA = +25°C (VOUT = 0.75V) and maximum specification of IDD = 12 µA, VDD = 5.5V and IOUT = +100 µA, the self-heating due to power dissipation (TJ – TA) is 0.179°C. © 2005 Microchip Technology Inc. DS21942B-page 9 MCP9700/01 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 5-Lead SC-70 (MCP9700) Example: Device XXN (Front) YWW (Back) Code MCP9700 AUN MCP9701 AVN AU2 (Front) 548 (Back) Note: Applies to 5-Lead SC-70. 5-Lead SC-70 (MCP9701) Example: Device XXNN Code MCP9700 AUNN MCP9701 AVNN AV25 Note: Applies to 5-Lead SC-70. Legend: XX...X Y YY WW NNN e3 * Note: DS21942B-page 10 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2005 Microchip Technology Inc. MCP9700/01 5-Lead Plastic Small Outline Transistor (LT) (SC-70) E E1 D p B n 1 Q1 A2 c A1 L Units Dimension Limits A MILLIMETERS* INCHES MIN NOM MAX MIN NOM MAX Pitch n p Overall Height A .031 .043 0.80 Molded Package Thickness A2 .031 .039 0.80 1.00 Standoff A1 .000 .004 0.00 0.10 Number of Pins 5 5 .026 (BSC) 0.65 (BSC) 1.10 Overall Width E .071 .094 1.80 2.40 Molded Package Width E1 .045 .053 1.15 1.35 Overall Length D .071 .087 1.80 2.20 Foot Length L .004 .012 0.10 0.30 Q1 .004 .016 0.10 0.40 Lead Thickness c .004 .007 0.10 0.18 Lead Width B .006 .012 0.15 0.30 Top of Molded Pkg to Lead Shoulder * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M JEITA (EIAJ) Standard: SC-70 Drawing No. C04-061 © 2005 Microchip Technology Inc. Revised 07-19-05 DS21942B-page 11 MCP9700/01 NOTES: DS21942B-page 12 © 2005 Microchip Technology Inc. MCP9700/01 APPENDIX A: REVISION HISTORY Revision B (October 2005) The following is the list of modifications: • Added Section 3.0 “Pin Descriptions” • Added the Linear Active Thermistor™ IC trademark • Removed the 2nd order temperature equation and the temperature coeficient histogram • Added a reference to AN1001 and corresponding verbiage • Added Figure 4-2 and corresponding verbiage Revision A (March 2005) • Original Release of this Document. © 2005 Microchip Technology Inc. DS21942B-page 13 MCP9700/01 NOTES: DS21942B-page 14 © 2005 Microchip Technology Inc. MCP9700/01 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device Device: – X /XX Temperature Range Package MCP9700T: Linear Active Thermistor™ IC, Tape and Reel, Pb free MCP9701T: Linear Active Thermistor™ IC, Tape and Reel, Pb free Temperature Range: E Package: Examples: a) MCP9700T-E/LT:Linear Active Thermistor™ IC, Tape and Reel, -40°C to +125°C, 5LD SC70 package. a) MCP9701T-E/LT:Linear Active Thermistor™ IC, Tape and Reel, -40°C to +125°C, 5LD SC70 package. = -40°C to +125°C LT = Plastic Small Outline Transistor, 5-lead © 2005 Microchip Technology Inc. DS21942B-page 15 MCP9700/01 NOTES: DS21942B-page 16 © 2005 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. 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Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. 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