MCR100 Series Preferred Device Sensitive Gate Silicon Controlled Rectifiers Reverse Blocking Thyristors PNPN devices designed for high volume, line-powered consumer applications such as relay and lamp drivers, small motor controls, gate drivers for larger thyristors, and sensing and detection circuits. Supplied in an inexpensive plastic TO-226AA package which is readily adaptable for use in automatic insertion equipment. • Sensitive Gate Allows Triggering by Microcontrollers and Other Logic Circuits • Blocking Voltage to 600 V • On−State Current Rating of 0.8 Amperes RMS at 80°C • High Surge Current Capability — 10 A • Minimum and Maximum Values of IGT, VGT and IH Specified for Ease of Design • Immunity to dV/dt — 20 V/sec Minimum at 110°C • Glass-Passivated Surface for Reliability and Uniformity • Device Marking: Device Type, e.g., MCR100−3, Date Code • Pb−Free Packages are Available* www.kersemi.com SCRs 0.8 A RMS 100 thru 600 V G A K MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Symbol Rating Voltage(Note 1) Value Unit Peak Repetitive Off−State (TJ = 40 to 110°C, Sine Wave, 50 to 60 Hz; Gate Open) MCR100−3 MCR100−4 MCR100−6 MCR100−8 VDRM, VRRM On-State RMS Current (TC = 80°C) 180° Conduction Angles IT(RMS) 0.8 A ITSM 10 A Peak Non-Repetitive Surge Current (1/2 Cycle, Sine Wave, 60 Hz, TJ = 25°C) Circuit Fusing Consideration (t = 8.3 ms) Forward Peak Gate Power (TA = 25°C, Pulse Width 1.0 s) Forward Average Gate Power (TA = 25°C, t = 8.3 ms) V 1 100 200 400 600 0.415 3 TO−92 (TO−226) CASE 029 STYLE 10 PIN ASSIGNMENT 1 I2t 2 Cathode A2s 2 Gate 3 Anode PGM 0.1 W PG(AV) 0.10 W ORDERING INFORMATION Forward Peak Gate Current (TA = 25°C, Pulse Width 1.0 s) IGM 1.0 A See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Reverse Peak Gate Voltage (TA = 25°C, Pulse Width 1.0 s) VGRM 5.0 V Preferred devices are recommended choices for future use and best overall value. Operating Junction Temperature Range @ Rate VRRM and VDRM TJ −40 to 110 °C Storage Temperature Range Tstg −40 to 150 °C *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. 1 MCR100 Series THERMAL CHARACTERISTICS Characteristic Symbol Max Unit RJC RJA 75 200 °C/W TL 260 °C Thermal Resistance − Junction−to−Case − Junction−to−Ambient Lead Solder Temperature (1/16″ from case, 10 secs max) ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Peak Repetitive Forward or Reverse Blocking Current(Note 2) TC = 25°C (VD = Rated VDRM and VRRM; RGK = 1 k) TC = 110°C IDRM, IRRM — — — — 10 100 A VTM — — 1.7 V OFF CHARACTERISTICS ON CHARACTERISTICS Peak Forward On−State Voltage* (ITM = 1.0 A Peak @ TA = 25°C) Gate Trigger Current (Continuous dc)(Note 3) (VAK = 7.0 Vdc, RL = 100 ) TC = 25°C IGT — 40 200 A Holding Current(2) (VAK = 7.0 Vdc, Initiating Current = 20 mA) TC = 25°C TC = −40°C IH — — 0.5 — 5.0 10 mA Latch Current (VAK = 7.0 V, Ig = 200 A) TC = 25°C TC = −40°C IL — — 0.6 — 10 15 mA Gate Trigger Voltage (Continuous dc)(Note 3) (VAK = 7.0 Vdc, RL = 100 ) TC = −40°C TC = 25°C VGT — — 0.62 — 0.8 1.2 V Critical Rate of Rise of Off−State Voltage (VD = Rated VDRM, Exponential Waveform, RGK = 1000 ,TJ = 110°C) dV/dt 20 35 — V/s Critical Rate of Rise of On−State Current (IPK = 20 A; Pw = 10 sec; diG/dt = 1 A/sec, Igt = 20 mA) di/dt — — 50 A/s DYNAMIC CHARACTERISTICS *Indicates Pulse Test: Pulse Width ≤ 1.0 ms, Duty Cycle ≤ 1%. 2. RGK = 1000 included in measurement. 3. Does not include RGK in measurement. Voltage Current Characteristic of SCR + Current Symbol Parameter VDRM Peak Repetitive Off State Forward Voltage IDRM Peak Forward Blocking Current VRRM Peak Repetitive Off State Reverse Voltage IRRM Peak Reverse Blocking Current VTM Peak on State Voltage IH Holding Current Anode + VTM on state IRRM at VRRM Reverse Blocking Region (off state) Reverse Avalanche Region Anode − www.kersemi.com 2 IH + Voltage IDRM at VDRM Forward Blocking Region (off state) MCR100 Series 90 0.9 GATE TRIGGER VOLTAGE (VOLTS) 1.0 GATE TRIGGER CURRENT ( A) 100 80 70 60 50 40 30 20 10 −40 −25 −10 5 20 35 50 65 80 TJ, JUNCTION TEMPERATURE (°C) 95 0.8 0.7 0.6 0.5 0.4 0.3 0.2 −40 −25 −10 5 20 35 50 65 80 TJ, JUNCTION TEMPERATURE (°C) 110 Figure 1. Typical Gate Trigger Current versus Junction Temperature LATCHING CURRENT ( A) HOLDING CURRENT ( A) 1000 100 10 −40 −25 −10 5 20 35 50 65 80 TJ, JUNCTION TEMPERATURE (°C) 95 100 10 −40 −25 −10 5 20 35 50 65 80 TJ, JUNCTION TEMPERATURE (°C) 110 120 110 100 90 DC 80 70 180° 60 50 30° 0 60° 90° 120° 0.1 0.2 0.3 0.4 IT(RMS), RMS ON-STATE CURRENT (AMPS) 95 110 Figure 4. Typical Latching Current versus Junction Temperature 0.5 I T, INSTANTANEOUS ON−STATE CURRENT (AMPS) Figure 3. Typical Holding Current versus Junction Temperature TC, MAXIMUM ALLOWABLE CASE TEMPERATURE ( °C) 110 Figure 2. Typical Gate Trigger Voltage versus Junction Temperature 1000 40 95 10 MAXIMUM @ TJ = 25°C MAXIMUM @ TJ = 110°C 1 0.1 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 VT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS) Figure 5. Typical RMS Current Derating Figure 6. Typical On−State Characteristics www.kersemi.com 3 MCR100 Series TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL H2A H2A H2B H2B H W2 H4 H5 T1 L1 H1 W1 W L F1 T2 F2 P2 D P2 P1 T P Figure 7. Device Positioning on Tape Specification Inches Symbol Item Millimeter Min Max Min Max 0.1496 0.1653 3.8 4.2 D Tape Feedhole Diameter D2 Component Lead Thickness Dimension 0.015 0.020 0.38 0.51 Component Lead Pitch 0.0945 0.110 2.4 2.8 F1, F2 H Bottom of Component to Seating Plane H1 Feedhole Location .059 .156 1.5 4.0 0.3346 0.3741 8.5 9.5 H2A Deflection Left or Right 0 0.039 0 1.0 H2B Deflection Front or Rear 0 0.051 0 1.0 H4 Feedhole to Bottom of Component 0.7086 0.768 18 19.5 H5 Feedhole to Seating Plane 0.610 0.649 15.5 16.5 L Defective Unit Clipped Dimension 0.3346 0.433 8.5 11 L1 Lead Wire Enclosure 0.09842 — 2.5 — P Feedhole Pitch 0.4921 0.5079 12.5 12.9 P1 Feedhole Center to Center Lead 0.2342 0.2658 5.95 6.75 First Lead Spacing Dimension 0.1397 0.1556 3.55 3.95 0.06 0.08 0.15 0.20 — 0.0567 — 1.44 P2 T Adhesive Tape Thickness T1 Overall Taped Package Thickness T2 Carrier Strip Thickness 0.014 0.027 0.35 0.65 W Carrier Strip Width 0.6889 0.7481 17.5 19 W1 Adhesive Tape Width 0.2165 0.2841 5.5 6.3 W2 Adhesive Tape Position .0059 0.01968 .15 0.5 NOTES: 1. Maximum alignment deviation between leads not to be greater than 0.2 mm. 2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm. 3. Component lead to tape adhesion must meet the pull test requirements. 4. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. 5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. 6. No more than 1 consecutive missing component is permitted. 7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component. 8. Splices will not interfere with the sprocket feed holes. www.kersemi.com 4 MCR100 Series ORDERING INFORMATION Device Shipping† Package Code MCR100−003 MCR100−004 MCR100−006 5000 Units / Bulk TO−92 ((TO−226)) MCR100−008 MCR100−3RL 2000 Units / Tape & Reel MCR100−3RLG TO−92 (TO−226) (Pb−Free) 2000 Units / Tubes MCR100−6RL TO−92 (TO−226) 2000 Units / Tape & Reel MCR100−6RLG TO−92 (TO−226) (Pb−Free) 2000 Units / Tubes MCR100−6RLRA 2000 Units / Tape & Reel MCR100−6RLRM MCR100−6ZL1 TO 92 (TO TO−92 (TO−226) 226) 2000 Units / Tape & Ammunition Box MCR100−8RL 2000 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.kersemi.com 5 MCR100 Series PACKAGE DIMENSIONS TO−92 (TO−226) CASE 029−11 ISSUE AL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. B R P L SEATING PLANE DIM A B C D G H J K L N P R V K D X X G J H V C SECTION X−X 1 N N INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 −−− 0.250 −−− 0.080 0.105 −−− 0.100 0.115 −−− 0.135 −−− STYLE 10: PIN 1. CATHODE 2. GATE 3. ANODE www.kersemi.com 6 MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 −−− 6.35 −−− 2.04 2.66 −−− 2.54 2.93 −−− 3.43 −−−